Metrology system and metrology method

Abstract

A metrology system can receive design data of a layout including a manufactured example of a structure in a sample. The system can further receive detection signals from a metrology tool associated with a plurality of manufactured examples including the structure within a field of view. The system can further generate design-aided composite data of the structure by combining detection signals from one or more common features of the structure associated with the manufactured examples of the structure within the field of view using the design data. The system can further generate one or more metrological measurements of the structure based on the design-aided composite data.

Description

Technical Field

[0001] This invention is generally related to semiconductor metrology, and more specifically, to the metrology of manufactured features using design-aided averaging. Prior Technology

[0002] Various metrological steps are routinely performed to monitor the state of a semiconductor manufacturing process. For example, it is typically desirable to monitor the properties of the manufactured structure, such as (but not limited to) size (e.g., critical dimension (CD)), the location of the structure (e.g., registration or placement errors), or the location of certain portions of the structure (e.g., edge placement errors associated with the placement of one or more edges). These measurements can then be compared to design specifications. However, a central challenge of these monitoring measurements is balancing measurement quality with measurement speed and / or the negative impacts of measurement. For example, optical metrology techniques typically offer relatively high processing power but lack the measurement resolution of alternative techniques. As another example, particle-based metrology techniques (e.g., scanning electron microscopy (SEM) or similar) offer relatively high resolution but are susceptible to relatively low processing power and can further damage the sample during a measurement. Therefore, there is a need to develop systems and methods to address these shortcomings. Summary of the Invention

[0003] According to one or more illustrative embodiments of the present invention, a metrology system is disclosed. In one illustrative embodiment, the system includes a controller that can be coupled to a scanning metrology tool. In another illustrative embodiment, the controller receives design data of a layout of a manufactured example including a structure of the same type. In another illustrative embodiment, the controller receives detection signals from the metrology tool associated with a plurality of manufactured examples including the structure within a field of view. In another illustrative embodiment, the controller generates design-aided composite data of the structure by combining detection signals from one or more common features of the structure associated with the manufactured examples of the structure within the field of view using the design data. In another illustrative embodiment, the controller generates one or more metrological measurements of the structure based on the design-aided composite data.

[0004] According to one or more illustrative embodiments of the present invention, a metrology system is disclosed. In one illustrative embodiment, the system includes a scanning metrology tool for scanning an illumination spot along a scanning pattern relative to a sample, wherein the scanning pattern includes a layout of a plurality of manufactured examples of a structure on the sample. In another illustrative embodiment, the system includes a controller. In another illustrative embodiment, the controller receives design data of the layout of the manufactured examples of the structure on the sample. In another illustrative embodiment, the controller receives detection signals from the metrology tool associated within a field of view of a plurality of manufactured examples of the structure. In another illustrative embodiment, the controller generates design-aided composite data of the structure by combining detection signals from one or more common features of the structure associated with the manufactured examples of the structure within the field of view using the design data. In another illustrative embodiment, the controller generates one or more metrological measurements of the structure based on the design-aided composite data.

[0005] According to one or more illustrative embodiments of the present invention, a metrology method is disclosed. In one illustrative embodiment, the method includes receiving design data of a layout of a manufactured example including a structure of the same type. In another illustrative embodiment, the method includes generating detection signals from a metrology tool associated within a field of view of a plurality of manufactured examples including the structure. In another illustrative embodiment, the method includes generating design-aided composite data of the structure by combining detection signals from one or more common features of the structure associated with the manufactured examples of the structure within the field of view using the design data. In yet another illustrative embodiment, the method includes generating one or more metrological measurements of the structure based on the design-aided composite data.

[0006] It should be understood that the foregoing overview and the following detailed description are merely illustrative and not intended to limit the invention as claimed. The accompanying drawings, which are incorporated in and form part of this specification, illustrate embodiments of the invention and, together with the overview, serve to explain the principles of the invention. Simple Explanation of the Diagram

[0007] Those skilled in this art can better understand the many advantages of this invention by referring to the accompanying drawings. Figure 1A is a conceptual view of a metrology system that provides design-aided composite data according to one or more embodiments of the present invention. Figure 1B is a conceptual view of one of the particle-based scanning metrology tools according to one or more embodiments of the present invention. Figure 1C is a conceptual view of one of the imaging metrology tools according to one or more embodiments of the present invention. Figure 2 is a conceptual diagram of a conventional image-based averaging technique for measurement according to one or more embodiments of the present invention. Figure 3 is a flowchart illustrating one of the steps performed in a method for measuring design-aided composite data according to one or more embodiments of the present invention. Figure 4A is a conceptual diagram illustrating the generation of design-aided composite data for a repeating example of a line structure according to one or more embodiments of the present invention. Figure 4B is a conceptual diagram of a full-scan pattern for generating a sparse array of design-aided composite data, forming a line structure 404, across a large FOV, according to one or more embodiments of the present invention. Figure 4C is a conceptual diagram of one of the design-aided composite materials for multiple structural types according to one or more embodiments of the present invention. Implementation

[0008] Cross-reference to related applications

[0009] This application claims the right of U.S. Provisional Application No. 63 / 252,621, filed October 6, 2021, entitled LFOV Tracing for Critical Dimension, Registration, and Overlay Metrology, pursuant to 35 USC § 119(e), the entire contents of which are incorporated herein by reference.

[0010] Detailed reference will now be made to the disclosed subject matter illustrated in the accompanying drawings. The invention has been particularly shown and described with respect to certain embodiments and specific features thereof. The embodiments set forth herein are to be regarded as illustrative rather than restrictive. It will be readily understood by those skilled in the art that various changes and modifications in form and detail can be made without departing from the spirit and scope of the invention.

[0011] The embodiments of the present invention relate to a system and method for measurement based on design-aided composite data.

[0012] This paper envisions that certain types of metrological measurements can mitigate various sources of random noise associated with a manufacturing process, such as (but not limited to) line edge roughness (LER) or line width roughness (LWR). Common examples include (but are not limited to) dimensional measurements (e.g., critical dimension (CD) measurements), measurements of the position of the manufactured structure (e.g., pattern placement measurements, registration measurements, or the like), overlay measurements (e.g., the relative positions of features on one or more layers manufactured using different exposures), or measurements of the position of certain features (e.g., edge placement measurements). Techniques for mitigating this random noise typically involve averaging measurements at different locations on the structure (e.g., structure-based averaging). However, such structure-based techniques can similarly suffer from low measurement processing power and / or sample degradation during a measurement. Therefore, users typically must generate a small number of measurements of the structure to provide reasonable processing power or generate the required number of measurements of the structure with low processing power. In all cases, the user must take further steps to limit energy deposition on the sample during a measurement (e.g., an exposure dose associated with an incident energy per region on the sample), which can negatively impact measurement sensitivity or sacrifice some samples during the measurement.

[0013] Embodiments of this invention relate to design-aided metrology, in which detection signals associated with multiple instances of a manufactured structure are combined into a single dataset (referred to herein as design-aided composite data). For example, design-aided composite data can be generated by using design data containing layout information of instances of a structure of interest across a sample, to combine data points associated with common locations on multiple instances of a structure of interest (e.g., through averaging or any suitable statistical technique). As an illustration, common features of a linear structure may include (but are not limited to) a left edge, a center portion, and a right edge. In other words, a metrology tool can generate detection signals associated with multiple (or many) instances of a structure within a field of view (FOV). Design data associated with expected layout information (e.g., the location and / or orientation of instances of the structure across a sample) can then be used to identify and combine data points corresponding to a common feature on each instance of the structure within the FOV. This design-aided composite data may include any statistical combination of data from various instances of the structure, such as (but not limited to) averages, medians, or similar values. This design can then be used to assist in the generation of various measurements of the structure from composite materials.

[0014] Design-aided composite data can be generated for any type of sample known in this art that has a repeating example of a structure of interest. For example, metrology using design-aided composite data can be generated for a semiconductor sample at any stage of a manufacturing process. Furthermore, the structure of interest may correspond to a device structure and / or a dedicated metrology structure (e.g., alignment target, overlay target, or similar). By another example, metrology using design-aided composite data can be generated on a photomask (e.g., photoresist) used to fabricate a repeating structure on a semiconductor sample at various steps in the manufacturing process.

[0015] This document envisions that metrology based on design-aided composite data can be implemented using any type of metrology tool known in this art. In some embodiments, a scanning metrology tool is used to generate the design-aided composite data. In this case, the detection signal can be associated with a scanning pattern of an illumination beam within the field of view (FOV), wherein the scanning pattern is selected to span various instances of the structure of interest at common locations to provide numerous measurements of common locations that can be combined into the design-aided composite data. In some embodiments, an image-based metrology tool is used to generate the design-aided composite data. In this case, the detection signal can be generated by illuminating at least the field of view with an illumination beam and capturing an associated image.

[0016] Furthermore, the metrology tool can utilize any type of illumination beam known in this technology, including (but not limited to) photon beams (e.g., light beams) or particle beams (e.g., electron beams, ion beams, neutral particle beams, or the like).

[0017] As revealed in this paper, design-aided composite data can offer numerous benefits. For example, design-aided composite data from numerous instances of a structure of interest across a sample can typically provide substantially more sample points (or other statistical combinations) for averaging than could be achieved using conventional structure-based averaging techniques, resulting in a high signal-to-noise ratio (SNR) and sensitive measurement. As an illustration, conventional structure-based averaging can be limited by an averaging direction and / or the length of a structure of interest on an imaging field of view, while design-aided composite data can be formed from any number of instances of the structure.

[0018] Furthermore, the use of design-aided composite data provides substantial flexibility in selecting the field of view (FOV) for measurements, further improving performance. As an illustration within the background of a scanning metrology tool, metrology using design-aided composite data eliminates the need to generate high-resolution images of any particular structure of interest. In fact, a low-noise signal is generated by combining data from multiple measurements of the structure. In this way, metrology using design-aided composite data can be analogized to phase-locked loop (PLL) measurements, which utilize signal periodicity to provide sensitive measurements. However, it should be understood that this analogy is merely illustrative and not limiting. For example, metrology using design-aided composite data does not require any type of periodic signal, but instead utilizes design information to correlate data associated with common characteristics of a structure to provide sensitive, low-noise measurements.

[0019] In some cases, providing a single scan pattern across all instances of the structure is sufficient. Therefore, the scan pattern can be expanded over a required FOV that is substantially larger than typical structure-based averaging techniques. For example, the FOV can be increased by extending the length of each trace and / or increasing the spacing between traces. In this way, increasing the FOV increases the number of instances of the structure within the FOV and thus increases the SNR of the design-aided composite data. As another illustration in the background of an imaging metrology tool, the FOV can be similarly expanded to increase the number of instances of the structure within the FOV and thus increase the SNR of the design-aided composite data. In some cases, the FOV can be asymmetrically expanded to provide a relatively high resolution along a measurement axis while allowing for a relatively low resolution in an orthogonal direction, since resolution in this direction is not necessarily required.

[0020] This paper further envisions that increasing the FOV of a measurement could provide the benefit of reducing the exposure dose (e.g., incident energy per region) on the sample during a measurement and thus limiting or mitigating potential damage to the sample from the measurement. For example, the sample (such as, but not limited to, a photomask) may have a particularly low damage threshold, which could limit the exposure dose used for measurement. In some cases, using a large FOV measurement with design-aided composite data can allow the use of a relatively higher intensity illumination beam while maintaining an exposure dose below a damage threshold for the sample or any structure on it.

[0021] This paper further envisions that the accuracy or sensitivity of one of the design-aid composite data can be influenced by the ability to accurately correlate detection signals with common features on multiple instances of the structure of interest. In some embodiments, various alignment marks may be present in the design data and also fabricated on the sample to facilitate accurate correlation between the detection signal and a position on the sample (e.g., referred to as the design data). For example, measurements of alignment marks on a sample with a precisely determined design position located at or near a FOV of a metrology tool can facilitate accurate correlation between the detection signal and the position on the sample, and therefore the design data. In some embodiments, the position of a translation stage (e.g., for aligning the sample with the FOV of the metrology tool) can be closely tracked (e.g., using one or more interferometers). In this way, a higher accuracy can be provided for the correlation between the detection signal and the position on the sample, and therefore the design data, than that provided by the translation stage itself. For example, U.S. Patent 10,185,800, issued January 22, 2019, generally describes close position tracking of a trace during scan metrology and the use of design data as a reference for measurement; the entire contents of that patent are incorporated herein by reference. In some embodiments, design data may be used both to generate design-aided composite data as disclosed herein and as a reference for metrology using precise tracking of a scan trace as disclosed in U.S. Patent 10,185,800.

[0022] Referring now to Figures 1A to 4C, a system and method for measuring design-aided composite data are described according to one or more embodiments of the present invention.

[0023] Figure 1A is a conceptual view of a measurement system 100 that provides design-aided composite data according to one or more embodiments of the present invention.

[0024] In some embodiments, the metrology system 100 includes a metrology tool 102 comprising an illumination source for illuminating one of the samples 104 using an illumination beam 106 from one of the illumination sources 108, and at least one detector 110 for generating a detection signal associated with a measured field of view (FOV) in response to the illumination beam 106. In some embodiments, the metrology tool 102 further includes at least one translation stage 112 for fixing and / or positioning the sample 104 relative to the metrology tool 102. For example, the stage 112 may include (but is not limited to) one or more linear actuators, one or more rotary actuators, or one or more tilt / tilt actuators for translating or otherwise positioning one or more of the samples 104 relative to the illumination beam 106.

[0025] Referring now to Figures 1B and 1C, various forms of the measuring tool 102 are described in more detail according to one or more embodiments of the present invention. The measuring tool 102 may include any type of measuring tool known in the art.

[0026] In some embodiments, the metrology tool 102 is a scanning metrology tool that generates detection signals by scanning the illumination beam 106 around and the field of view (FOV) with a scanning pattern and for various points along the scanning pattern. In this configuration, the resolution of a metrological measurement (e.g., a detection signal) may be associated with the scanning speed and / or a sampling rate during a scan. For example, the metrology tool 102 may include a scanner for scanning the illumination beam 106 around and the FOV, wherein the scanner may further include any combination of elements adapted to scan the illumination beam 106 relative to the sample 104, scan the sample 104 relative to the illumination beam 106, or the like, to provide an element for a scan path. For example, the scanner may include one or more translation stages for translating or otherwise positioning the sample 104 relative to the illumination beam 106, such as (but not limited to) one or more linear actuators, one or more rotary actuators, or one or more tilt / flip actuators. By another example, the scanner may include one or more beam deflection elements for deflecting one or more of the illumination beams 106 along any desired path, such as (but not limited to) particle deflectors, translation mirrors, rotatable mirrors (e.g., galvanometers), or deformable components.

[0027] In some embodiments, metrology tool 102 is an imaging metrology tool that generates a detection signal by illuminating the entire field of view (FOV) with illumination beam 106 and capturing an image of one of the FOVs with detector 110. In this case, resolution may be associated with imaging optics used to generate an image of the sample on detector 110.

[0028] The metering tool 102 may further provide any type of illumination beam 106 known in this art, including (but not limited to) a photon beam (e.g., a light beam) or a particle beam (e.g., an electron beam, an ion beam, a neutral particle beam, or the like).

[0029] Furthermore, the metrology tool 102 can be configured as a single tool or a combination of tools. In this way, the metrology tool 102 can selectively provide different operating modes (e.g., scanning operation or imaging operation) and / or different illumination beams (e.g., light beam or particle beam).

[0030] Figure 1B is a conceptual view of a particle-based measuring tool 102 according to one or more embodiments of the present invention.

[0031] In some embodiments, the metering tool 102 includes a particle illumination source 108 (e.g., an electron beam source, an ion beam source, a neutron beam source, or the like) for generating a particle-based illumination beam 106 (e.g., an electron beam, a particle beam, or the like). The particle illumination source 108 may include any particle source known in the art suitable for generating a particle-based illumination beam 106. For example, the particle illumination source 108 may include (but is not limited to) an electron gun or an ion gun. In some embodiments, the particle illumination source 108 is configured to provide a particle beam with a tunable energy. For example, a particle illumination source 108 including an electron source may (but is not limited to) provide an accelerating voltage in the range of 0.1 kV to 30 kV. As another example, a particle illumination source 108 including an ion source may (but does not need to) provide an ion beam with an energy in the range of 1 keV to 50 keV.

[0032] In some embodiments, the metrology tool 102 includes one or more particle focusing elements 114. For example, the one or more particle focusing elements 114 may include (but are not limited to) a single particle focusing element or one or more particle focusing elements forming a composite system. In some embodiments, the one or more particle focusing elements 114 include a particle objective configured to guide the illumination beam 106 to a sample 104 that can be positioned on the stage 112. Furthermore, the metrology tool 102 may include any type of electronic lens known in the art, including (but not limited to) electrostatic, magnetic, single-potential, or dual-potential lenses.

[0033] The metrology tool 102 may include any number or type of detectors 110 suitable for characterizing the sample 104 in response to the illumination beam 106 during a scan. In some embodiments, the metrology tool 102 includes an electron collector (e.g., a secondary electron collector, a backscattered electron detector, or the like). In some embodiments, the metrology tool 102 includes a photon detector (e.g., a photodetector, an X-ray detector, a scintillation element coupled to a photomultiplier tube (PMT) detector, or the like) for detecting electrons and / or photons from the sample 104.

[0034] In some embodiments, although not shown, the metrology tool 102 includes one or more light-collecting lenses for capturing emissions from sample 104 and directing them to a detector 110. For example, an objective lens may operate as a light-collecting lens to collect emissions from sample 104. Additionally, one or more light-collecting elements (e.g., one or more additional lenses, a beam deflector, or the like) may direct the emissions to a detector 110.

[0035] It should be understood that the description of one of the metrological tools 102 depicted in FIG1B and the related descriptions above are provided for illustrative purposes only and should not be construed as limiting. For example, metrological tool 102 may include a multi-beam and / or multi-column system suitable for simultaneously interrogating one sample 104. In some embodiments, metrological tool 102 may include components (e.g., one or more electrodes) configured to apply one or more voltages to one or more locations of one or more components of sample 104. In this respect, metrological tool 102 may generate voltage contrast imaging data.

[0036] Additionally, in some embodiments, the metrology tool 102 is a light-based metrology tool in which the illumination beam 106 is one of a light beams. For example, the metrology tool 102 may include a scanning near-field optical microscope (SNOM) or a near-field scanning optical microscope (NSOM), wherein the illumination beam 106 is formed using a tip having one of the primary wavelength apertures. By another example, the metrology tool 102 may include one or more focusing elements, such as (but not limited to) lenses or mirrors for focusing light to a desired spot size.

[0037] Figure 1C is a conceptual view of an imaging measurement tool 102 according to one or more embodiments of the present invention.

[0038] In one embodiment, the metrology tool 102 includes a photonic illumination source 108 (e.g., a light source) configured to generate an illumination beam 106. The illumination source 108 may comprise any type of illumination source suitable for providing at least one illumination beam 106. Illumination from the illumination source 108 may comprise one or more electromagnetic radiations of selected wavelengths, including (but not limited to) gamma rays, X-rays, ultraviolet (UV) wavelengths, visible light wavelengths, infrared (IR) wavelengths, microwaves, or radio waves. In one embodiment, the illumination source 108 is a laser source. For example, the illumination source 108 may include (but is not limited to) one or more narrowband laser sources, a broadband laser source, a supercontinuum laser source, a white light laser source, or the like. In this respect, the illumination source 108 may provide an illumination beam 106 with high coherence (e.g., high spatial coherence and / or temporal coherence). In another embodiment, the illumination source 108 includes a laser continuous plasma (LSP) source. For example, illumination source 108 may include (but is not limited to) one or more elements suitable for housing an LSP lamp, an LSP bulb, or an LSP chamber that can emit broadband illumination when excited into a plasma state by a laser source. In another embodiment, illumination source 108 includes a lamp source. For example, illumination source 108 may include (but is not limited to) an arc lamp, a discharge lamp, an electrodeless lamp, or the like. In this respect, illumination source 108 may provide an illumination beam 106 having low coherence (e.g., low spatial coherence and / or temporal coherence).

[0039] In another embodiment, the metrology tool 102 guides the illumination beam 106 to the sample 104 via an illumination path 116. The illumination path 116 may include one or more optical components suitable for modifying and / or adjusting the illumination beam 106 and guiding it to the sample 104. In one embodiment, the illumination path 116 includes one or more illumination subsystem lenses 118 (e.g., for collimating the illumination beam 106, for relay pupils and / or field planes, or the like). In another embodiment, the illumination path 116 includes illumination subsystem control optics 120 for shaping or otherwise controlling one or more of the illumination beam 106. For example, the illumination subsystem control optics 120 may include (but is not limited to) one or more field stops, one or more pupil stops, one or more polarizers, one or more filters, one or more beam splitters, one or more diffusers, one or more homogenizers, one or more apodizers, one or more beam shapers, or one or more mirrors (e.g., static mirrors, translation mirrors, scanning mirrors, or the like).

[0040] In another embodiment, the metrology tool 102 includes an objective lens 122 for focusing the illumination beam 106 onto the sample 104. In another embodiment, the sample 104 is placed on a stage 112 configured to position the sample 104 relative to the illumination beam 106.

[0041] In another embodiment, the metrology tool 102 includes at least one detector 110 for capturing light or other illumination (e.g., collection light 124) emitted from the sample 104 through an imaging path 126. The imaging path 126 may include one or more optical elements suitable for modifying and / or adjusting the collection light 124 from the sample 104. In one embodiment, the imaging path 126 includes one or more imaging subsystem lenses 128 (e.g., for collimating the illumination beam 106, for relaying the pupil and / or the field plane, or the like), which may include (but do not necessarily include) an objective lens 122. In another embodiment, the imaging path 126 includes one or more imaging subsystem control optics 130 for shaping or otherwise controlling one or more of the collection light 124. For example, the imaging subsystem control optics 130 may include (but is not limited to) one or more field stops, one or more pupil stops, one or more polarizers, one or more filters, one or more beam splitters, one or more diffusers, one or more homogenizers, one or more apodizers, one or more beam shapers, or one or more mirrors (e.g., static mirrors, translation mirrors, scanning mirrors, or the like).

[0042] A detector 110 can be positioned at any selected location within the imaging path 126. In one embodiment, the metrology tool 102 is included at a field plane (e.g., a plane conjugate to sample 104) to generate a field plane image of sample 104, which is a detector 110. In another embodiment, the metrology tool 102 is included at a pupil plane (e.g., a diffraction plane) to generate a pupil plane image, which is a detector 110. In this respect, the pupil image may correspond to an angular distribution of light from sample 104.

[0043] The illumination path 116 and imaging path 126 of the metrology tool 102 can be adapted to a wide range of configuration orientations for illuminating the sample 104 with the illumination beam 106 and collecting light emitted from the sample 104 in response to the incident illumination beam 106. For example, as illustrated in FIG1C, the metrology tool 102 may include a beam splitter 132 oriented such that a common objective lens 122 can simultaneously guide the illumination beam 106 to the sample 104 and collect light from the sample 104 (e.g., collect light 124). By another example, the illumination path 116 and imaging path 126 may contain non-overlapping optical paths.

[0044] Referring again to FIG1A, in some embodiments, the measuring tool 102 includes a controller 134 coupled to one of the measuring tool 102 or any of its components. In this way, the controller 134 can receive data from the measuring tool 102 and / or provide control signals to the measuring tool 102 to guide the measuring tool 102 to perform an action.

[0045] The controller 134 may include one or more processors 136 configured to execute program instructions held on a memory 138 (e.g., a memory medium). In this respect, the controller 134 (e.g., via one or more processors 136) may execute any of the various program steps described throughout the invention. As a non-limiting illustration, the controller 134 may provide a scan path to the metrology tool 102, guide the metrology tool 102 to generate measurements, receive detection data from the metrology tool 102, generate device-aided composite data associated with one or more structures of interest, or generate metrology data for one or more structures based on the device-aided composite data.

[0046] One or more processors 136 of a controller 134 may comprise any processor or processing element known in the art. For the purposes of this invention, the terms "processor" or "processing element" may be broadly defined to encompass any device having one or more processing or logic elements (e.g., one or more microprocessor devices, one or more application-specific integrated circuit (ASIC) devices, one or more field-programmable gate arrays (FPGAs), or one or more digital signal processors (DSPs)). In this sense, one or more processors 136 may comprise any device configured to execute algorithms and / or instructions (e.g., program instructions stored in memory). In some embodiments, one or more processors 136 may embody a desktop computer, host computer system, workstation, video computer, parallel processor, network-connected computer, or any other computer system configured to execute a program (configured to operate or in conjunction with the metering system 100), as described throughout the invention.

[0047] Memory 138 may comprise any storage medium known in the art suitable for storing program instructions executable by one or more associated processors 136. For example, memory 138 may comprise a non-transitory memory medium. By another example, memory 138 may comprise (but is not limited to) a read-only memory (ROM), a random access memory (RAM), a magnetic or optical memory device (e.g., a magnetic disk), a magnetic tape, a solid-state drive, and the like. It should be further noted that memory 138 may be housed together with one or more processors 136 in a common controller housing. In some embodiments, memory 138 may be remotely located relative to the physical location of one or more processors 136 and controller 134. For example, one or more processors 136 of controller 134 may access a remote memory (e.g., a server) accessible via a network (e.g., the Internet, an intranet, and the like).

[0048] The controller 134 or any of its components (e.g., processor 136, memory 138, or the like) may be housed within a common housing or multiple housings. In this way, any controller or combination of controllers may be separately packaged as a module suitable for integration into the metering tool 102. Furthermore, various configurations of the controller 134 may be provided as a dedicated component or integrated into other components of the metering tool 102.

[0049] Therefore, the above description should not be interpreted as limiting one embodiment of the present invention but merely as an illustration. In fact, the controller 134 illustrated in FIG1A may generally refer to a single controller or multiple controllers, such that the various program steps described throughout the present invention can be executed on a single controller.

[0050] In some embodiments, a user interface 140 is communicatively coupled to a controller 134. In some embodiments, the user interface 140 may include (but is not limited to) one or more desktop computers, laptops, tablets, and the like. In some embodiments, the user interface 140 includes a display for displaying data from the measuring instrument 102 to a user. The display of the user interface 140 may include any display known in the art. For example, the display may include (but is not limited to) a liquid crystal display (LCD), an organic light-emitting diode (OLED) based display, or a CRT display. Those skilled in the art will recognize that any display device capable of being integrated with a user interface 140 is suitable for embodiments of the present invention. In some embodiments, a user may respond to data input selections and / or commands displayed to the user via a user input device of the user interface 140.

[0051] Referring now to Figures 2 through 4C, various noise reduction techniques in metrology are described in more detail according to one or more embodiments of the present invention.

[0052] This paper envisions that the manufactured features on a sample 104 can exhibit random variations associated with fluctuations and variations during various manufacturing steps and / or the materials used during manufacturing. As an illustration, line edge roughness (LER) can be associated with variations along one edge of a manufactured structure. As another illustration, line width roughness (LWR) can be associated with variations in the width of a structure.

[0053] In some metrology applications, such random variations can be considered noise that reduces the signal-to-noise ratio, measurement sensitivity, and / or measurement accuracy. Common, but not limiting, examples include measurements of the shape, orientation, or position of manufactured structures, such as (but not limited to) critical dimension (CD) measurements, position (e.g., registration) measurements, or overlay measurements.

[0054] Figure 2 is a conceptual diagram of a conventional structure-based averaging technique for scanning metrology according to one or more embodiments of the present invention. Specifically, Figure 2 illustrates multiple measurements at different locations of an averaging line structure 202.

[0055] As illustrated in Figure 2, a typical scan metrology procedure may involve generating a high-resolution image 204 of samples 104 containing at least one instance of a structure of interest (here, three instances of a line structure 202) using a dense array of linear traces 206 spanning a field of view (FOV). In this way, multiple traces 206 generate data associated with a specific line structure 202 at different locations. For example, illustration 208 illustrates a conceptual depiction of one of the detection signals (e.g., five columns of image 204) associated with five traces 206 at different locations along a line structure 202 having a region of interest 210. In this illustration 208, each pixel 212 represents a measurement along a trace 206, and the variation in the value of pixel 212 along the trace 206 corresponds to random noise.

[0056] In this typical structure-based averaging technique, random noise can be reduced by averaging the data along a direction orthogonal to trace 206 (here, perpendicular to direction 214). Illustration 216 shows a conceptual plot of this structure-averaged data 218.

[0057] However, it should be envisioned in this paper that the structure-based averaging technique illustrated in Figure 2 can be subject to various limitations. For example, the number of data points available for averaging is limited by the number of traces 206 on any particular example of a structure of interest, which in turn can be limited by the size, shape, or geometry of the structure. Although Figure 2 illustrates the linear structure of the FOV of the image 204, the structure of interest can typically have any shape, size, or orientation. Therefore, in practice, the number of data points available for averaging can be subject to far more limitations. By another example, the number of traces 206 (and therefore the number of data points available for averaging) can not be arbitrarily increased. In fact, the density of traces 206 and therefore the number of data points available for averaging can be limited by the damage threshold of the sample 104 or the structure thereon. As an illustration, a photomask (e.g., a photoresist) can have a relatively low damage threshold that can severely limit the effectiveness of image-based averaging techniques. As a further example, generating such high-resolution images can often be time-consuming, which can limit the size of the field of view and the overall measurement processing capabilities.

[0058] While Figure 2 illustrates a specific case of scan-based metrology, this paper further envisions that structure-based averaging using imaging-based metrology could suffer from similar limitations. For example, acquiring an image of one of the samples 104 at sufficient resolution to provide structure-based averaging could limit the field of view (FOV), which could in turn limit metrological processing capabilities and increase the likelihood of causing damage to the sample 104 during a measurement.

[0059] Referring now to Figures 3 through 4C, metrology using design-aided composite data is described in more detail according to one or more embodiments of the present invention. Figure 3 is a flowchart illustrating one of the steps performed in a method 300 for metrology using design-aided composite data according to one or more embodiments of the present invention. Applicants should note that the embodiments and implementation techniques previously described in the background of metrology tool 102 should be interpreted as extended to method 300. However, it should be further noted that method 300 is not limited to the architecture of metrology system 100.

[0060] This paper envisions that semiconductor manufacturing typically involves fabricating multiple (and sometimes many) repeating instances of structures across various material layers on a wafer, where the repeating instances of structures are intended to be identical. For example, a semiconductor device may contain many repeating instances of functional structures, such as (but not limited to) transistors, memory devices, or the like. Furthermore, these functional structures themselves may contain repeating instances of various substructures.

[0061] This paper further envisions utilizing the presence of repeating instances of the structure of interest to provide sensitive, high-processing-capability metrology. Specifically, this can be based on design data combinations containing the expected locations and / or orientations of various instances across 104 samples of the structure, correlated with common features (e.g., location) of multiple instances of a structure of interest. As previously described herein, this data may be referred to as design-aided composite data. In this way, the number of data points that can be combined (e.g., by averaging or any other statistical combination) is limited only by the number of instances of interest that generate detection signals. Furthermore, it is not necessary to generate a high-resolution image of any particular structure. In fact, in some scan-based applications, a single trace of each instance across a structure is sufficient. Thus, the FOV and therefore the exposure dose can be substantially reduced, enabling metrology with relatively high intensity without causing damage and / or relatively high metrological processing capability.

[0062] In some embodiments, method 300 includes a step 302 of receiving design data for a layout of various manufactured examples of a structure on a sample 104. The sample 104 described herein in the background of method 300 and / or metrology system 100 may be broadly included in any stage of manufacturing of a semiconductor device, including a repeating example of various manufactured structures, a photomask (e.g., a photoresist) including a repeating example of a photomask structure used in the manufacturing process, or any other material including one or more repeating examples of the structure of interest.

[0063] Design data may include any type of data from any source that provides information about the intended layout of one of the structures of interest on sample 104 (including, but not limited to, the location of the structure, a shape of the structure, or an orientation of the structure at each location). For example, design data may include schematic diagrams of sample 104 used to guide the manufacturing of the various layers (e.g., GDS data or the like), metrological measurements of sample 104 taken in the current or any previous procedural steps, or a combination thereof.

[0064] In some embodiments, method 300 includes step 304 whereby a measuring tool 102 associated with one of a plurality of manufactured examples of the self-contained structure generates a detection signal within the field of view of the field of view.

[0065] The metrology tool 102 may include any type of metrology tool suitable for generating detection signals for a plurality of examples of a structure of interest. In some embodiments, step 304 of generating a detection signal includes (e.g., using metrology tool 102 or the like) scanning an illumination beam 106 along a scanning pattern relative to one of the sample 104, wherein the scanning pattern spans at least one common feature on a plurality of manufactured examples of the structure on the sample 104. The scanning pattern may include traces of any type or design suitable for intersecting at least one common feature of the examples of the structure to be measured. For example, the scanning pattern may include one or more parallel linear scanning traces, but not necessarily parallel ones. By another example, the scanning pattern may include one or more curved scanning traces. In some embodiments, step 304 of generating a detection signal includes illuminating at least one field of view and capturing an image based on the illumination using an illumination beam 106.

[0066] In some embodiments, method 300 includes a step 306 of generating design-aided composite data for the structure by combining detection signals from common features of the structure from a plurality of manufactured examples of the structure using design data. For example, the design data may be used to correlate the detection signals generated in step 304 with a specific location on sample 104, and thus a specific feature on sample 104. Step 306 of generating design-aided composite data may then include correlating and / or combining data points associated with common features of the structure of interest across a plurality of examples of the structure. The design-aided composite data may then include any statistical combination of detection signals from common features of the structure, such as (but not limited to) average values. Furthermore, a common feature across a plurality of examples of a structure may include any feature of the structure, such as (but not limited to) an edge or a center location.

[0067] In some embodiments, method 300 includes step 308 of generating one or more metrological measurements of the structure based on design-aided composite data. It is envisioned herein that generating design-aided composite data based on a statistically combined (e.g., averaged or similar) combination of signals from multiple instances of the structure can effectively mitigate or otherwise suppress random noise associated with the manufacturing process, which may be beneficial in certain applications. In a general sense, any type of metrological measurement can be generated based on design-aided composite data. For example, design-aided composite data can be used to measure the size and / or shape of a structure (e.g., CD metrology or similar). By another example, design-aided composite data can be used for positional measurements of a structure, such as (but not limited to) pattern placement error (PPE) measurements. By another example, design-aided composite data can be used for overlay measurements associated with the relative positions of structures manufactured in different exposures on the same or different sample layers. By another example, design-aided composite data can be used for edge measurements of certain features of a structure, such as (but not limited to) pattern placement error measurements. For example, design-aided composite data can be generated for examples of both a first structure of interest and a second structure of interest on a sample 104. In this way, various examples of the first and second structures of interest can form a set of targets. Therefore, a set of measurements can be associated with relative position measurements (and, if applicable, anchor measurements) of the first and second structures of interest.

[0068] Referring now to Figures 4A to 4C, the generation of design-aided composite data is described in more detail according to one or more embodiments of the present invention. Specifically, Figures 4A and 4B illustrate design-aided composite data 402 for generating a linear structure 404 (e.g., for measuring a structure of interest), while Figure 4C illustrates design-aided composite data 402 for generating multiple structure types within a field of view (FOV). It should be noted herein that although Figures 4A to 4C illustrate a specific example of design-aided composite data 402 generated using a measurement tool 102, it should be understood that Figures 4A to 4C are provided for illustrative purposes only and should not be construed as limiting. In fact, design-aided composite data 402 can be generated based on data from any type of measurement tool 102 (including (but not limited to) an image-based measurement tool 102).

[0069] Figure 4A is a conceptual diagram of design aid composite data 402 for generating repeating examples of a line structure 404 according to one or more embodiments of the present invention. Illustration 406 shows a portion of a scan pattern 408 (e.g., a linear trace 410) of five examples of the line structure 404 and a plurality of examples of the cross-line structure 404.

[0070] According to one or more embodiments of the present invention, illustration 412 is a schematic diagram of a detection signal generated by a scanning metrology tool 102 (e.g., via steps 304 and 306 of method 300) along a portion of the scanning pattern 408 shown in FIG. 4A. For example, the detection signal includes a series of pixels 414 associated with a sampling rate of the scanning metrology tool 102. As previously described herein, the metrology tool 102 may utilize any type of illumination beam 106 known in the art, such as a particle beam (e.g., an electron beam, an ion beam, a neutral particle beam, or the like) or a beam of any wavelength.

[0071] Illustration 416 is an illustrative plot of design-aided composite data 402 generated using detection signals and design data associated with the layout of line structure 404. For example, design-aided composite data 402 can be generated (e.g., in step 308 of method 300) by using design data to correlate specific pixels 414 of detection signals associated with common features of line structure 404.

[0072] As an illustration, pixels 414a-1, 414a-2, ..., 414a-5 can be associated with the left edge 418 (e.g., a first common feature) of one of the line structures 404, while pixels 414b-1, 414b-2, ..., 414b-5 can be associated with the right edge 420 (e.g., a second common feature) of one of the line structures 404. Similarly, pixels 414c-1, 414c-2, ..., 414c-5 can be associated with the central portion 422 (e.g., a third common feature) of one of the line structures 404. The related pixels 414 can then be combined into design-aided composite data 402 using any statistical combination (such as, but not limited to, averaging the related pixels 414). In this way, various sources of random noise, such as, but not limited to, LER or LWR, can be mitigated or otherwise suppressed. The design-aided composite data 402 can then be used as the basis for any number or type of measurement of the line structure of interest 404. For example, the design-aided composite data 402 illustrated in illustration 416 can be used for measurement, such as (but not limited to) a position of the left edge 418, a position of the right edge 420, a width of the line structure 404 (e.g., a CD measurement), or a lateral position along the direction of the linear trace.

[0073] As illustrated in Figure 4A, design-aided composite data 402 can be generated without producing a conventional high-resolution image of any particular instance of a structure of interest (e.g., line structure 404 in Figure 4A). In fact, design-aided composite data 402 is established by measuring common features on many different instances of the structure of interest. It is envisioned here that metrology based on design-aided composite data 402, as disclosed herein, can advantageously provide high sensitivity and high processing power while limiting damage to sample 104 during the measurement procedure. Specifically, the generation of design-aided composite data 402 enables substantial flexibility for customizing scan pattern 408 for a specific application or sample layout. For example, scan pattern 408 may contain one or more traces 410 of arbitrary length or curvature. By another example, scan pattern 408 may contain a sparse distribution of traces 410. Furthermore, a scan pattern 408 can be designed to limit the exposure dose on sample 104. For example, the scan pattern 408 can be designed to limit the exposure dose to a level below the damage threshold of the sample 104 or any structure thereon.

[0074] Figure 4B is a conceptual illustration of a full-scan pattern 408 for generating a design-aided composite data 402 across a large FOV 424, forming a sparse array of line structures 404. As illustrated in Figure 4B, generating the design-aided composite data 402 allows the scan pattern 408 to be customized to span a number of examples across a structure of interest (here, a line structure 404) across a wide FOV 424, which can further advantageously provide a relatively low exposure dose on the sample 104. As an illustration, the total available signal associated with the scan pattern 408 in Figure 4B (e.g., the total number of sample points generated along the scan pattern 408) can be the same as the conventional image-based averaging used in Figure 2; however, due to the larger spacing 426 between the traces 410 and the longer length of the traces 410, the area of ​​the FOV 424 in Figure 4B can be 2,500 times larger than that in Figure 2. Therefore, in this non-limiting example, the exposure dose using design-aided composite data 402 can be reduced by a factor of 2,500. Furthermore, the number of data points that can be used for averaging using design-aided composite data 402 is substantially greater than the number of data points that can be used with conventional image-based averaging techniques, which can result in a correspondingly higher signal-to-noise ratio and thus higher measurement sensitivity. Specifically, design-aided composite data 402 can be generated based on data from any trace 410 in the scan pattern 408, and is not limited to data from a single trace 410 illustrated in FIG. 4A.

[0075] Referring again generally to Figures 3 through 4B, it should be understood that Figures 3 through 4B and the associated descriptions are provided for illustrative purposes only and should not be interpreted as restrictive. For example, although Figures 4A and 4B depict measurements of a linear structure 404 periodically distributed on sample 104, it is not necessary for a structure of interest to be periodically distributed on sample 104. In fact, the structure of interest can be distributed across the sample in any pattern. Furthermore, design-aided composite data 402 can be generated for multiple types of structures captured within a given FOV.

[0076] Figure 4C is a conceptual diagram of design-aid composite data 402 for multiple structural types according to one or more embodiments of the present invention. Specifically, Figure 4C illustrates two traces 410 of a scan pattern 408 spanning multiple examples of a first structural type 428 and multiple examples of a second structural type 430. Furthermore, as previously described, it may be that the various examples of any structural type are aperiodic. However, a first set of design-aid composite data 402 can still be generated based on the extracted examples of the first structural type 428, and a second set of design-aid composite data 402 can be generated based on the extracted examples of the second structural type 430 in any trace 410.

[0077] Furthermore, it should be understood that although the traces 410 in Figures 4A to 4C are depicted as linear, this is again merely illustrative and not limiting. In fact, a scan pattern 408 may have any pattern and may contain any number or combination of linear or curved traces 410.

[0078] The objects described herein sometimes illustrate different components contained within or connected to other components. It should be understood that the architectures depicted are merely illustrative, and many other architectures can in fact be implemented to achieve the same functionality. In a conceptual sense, any configuration of components used to achieve the same functionality is effectively "associated" to achieve the desired functionality. Therefore, any two components combined herein to achieve a particular functionality can be considered "associated" with each other to achieve the desired functionality, regardless of the architecture or intermediate components. Similarly, any two such associated components can also be considered "connected" or "coupled" to each other to achieve the desired functionality, and any two components that can be suchly associated can also be considered "coupled" to each other to achieve the desired functionality. Specific examples of couplerability include, but are not limited to, physically interactive and / or physically interactive components and / or wirelessly interactive and / or logically interactive components.

[0079] It is believed that the invention and many of its accompanying advantages will be understood from the foregoing description, and it will be appreciated that various changes can be made to the form, construction, and configuration of the components without departing from the disclosed subject matter or sacrificing all its important advantages. The forms described are merely illustrative, and such changes are intended to be covered and included in the claims below. Furthermore, it should be understood that the invention is defined by the appended claims.

[0080] 100: Metering System 102: Measuring tools 104: Sample 106: Illumination beam 108: Illumination source / Particle illumination source / Photon illumination source 110: Detector 112: Translation platform 114: Particle focusing element 116: Lighting Path 118: Illumination Subsystem Lens 120: Illumination subsystem control optics 122: Objective lens 124: Collecting Light 126: Imaging Path 128: Imaging Subsystem Lens 130: Imaging subsystem control optics 132: Beam splitter 134: Controller 136: Processor 138: Memory 140: User Interface 202: Linear Structure 204: High-resolution image 206: Linear trace 208: Illustration 210: Area of ​​Interest 212: pixels 214: Vertical direction 216: Illustration 218: Structurally Averaged Data 300: Method 302: Steps 304: Steps 306: Steps 308: Steps 402: Design Auxiliary Composite Materials 404: Linear Structure 406: Illustration 408: Scanned Pattern 410: Linear trace 412: Illustration 414a-1 to 414a-5: pixels 414b-1 to 414b-5: pixels 414c-1 to 414c-5: pixels 416: Illustration 418: Left edge 420: Right edge 422: Central Part 424: Wide Field of View (FOV) 426: Spacing 428: First structural type 430: Second structural type

Claims

1. A measurement system comprising: A controller, configured to communicatively couple to a metrology tool, the controller including one or more processors configured to execute program instructions, the program instructions causing the one or more processors to: receive design data of a layout of a manufactured example including a structure of the same type; receive detection signals from the metrology tool associated with a field of view including a plurality of the manufactured examples of the structure; generate design-aided composite data of the structure by combining detection signals from one or more common features of the structure associated with the plurality of manufactured examples of the structure within the field of view using the design data; and generate one or more metrological measurements of the structure based on the design-aided composite data.

2. The measurement system of claim 1, wherein the combination of detection signals using design data from one or more common features of the structure associated with the plurality of manufactured examples of the structure within the field of view includes: The design data is used to average the detection signals from the one or more common features of the structure associated with the plurality of instances of the structure within the field of view.

3. The metering system as described in claim 1, wherein the metering instrument includes: A scanning measurement tool that generates detection data by scanning an illumination beam across a field of view with a scanning pattern.

4. The metering system as described in claim 3, wherein the scan pattern includes: Multiple traces.

5. The measurement system of claim 4, wherein at least one of the plurality of traces is linear.

6. The metering system of claim 4, wherein at least one of the plurality of traces is curved.

7. The metering system as described in claim 1, wherein the metering instrument includes: An imaging metrology tool in which the detection data is generated by imaging the sample using the field of view.

8. The measurement system of claim 1, wherein at least one of the one or more measurements of the structure includes: One of the critical dimensions (CD) of this structure is measured.

9. The measurement system of claim 1, wherein at least one of the one or more measurements of the structure includes: One of the structures is the position measurement.

10. The measurement system of claim 1, wherein at least one of the one or more measurements of the structure includes: The position measurement of at least one of the common features of the structure.

11. The metering system of claim 10, wherein at least one of the one or more common features of the structure includes: One of the edges of this structure.

12. The metrology system of claim 1, wherein the structure is a first structure, wherein the field of view further includes a plurality of manufactured examples of a second structure on the sample, wherein the first structure and the second structure form a stacked target, wherein the program instructions are further configured to cause the one or more processors to: receive design data including a layout of one of the plurality of manufactured examples of the second structure on the sample; generate design-aided composite data of the second structure by combining detection signals from one or more common features of the second structure associated with the plurality of manufactured examples of the second structure within the field of view using the design data; and generate a stacked measurement of the stacked target associated with position measurements of the first and second structures based on the design-aided composite data of the first and second structures.

13. The metering system of claim 1, wherein at least one of the one or more common features of the structure includes: One of the edges of this structure.

14. The metering system of claim 1, wherein at least one of the one or more common features of the structure includes: One of the central parts of this structure.

15. The metering system of claim 1, wherein the metering instrument includes a particle beam illumination source.

16. The metering system of claim 15, wherein the particle beam illumination source comprises: One electron beam source.

17. The metering system of claim 15, wherein the particle beam illumination source comprises: At least one of an ion beam source or a neutral particle beam source.

18. The metering system of claim 1, wherein the metering instrument includes a photon illumination source.

19. The metrology system of claim 1, wherein the field of view is selected to provide an exposure dose on the sample that is below one of the damage thresholds of the sample.

20. A measurement system comprising: A measuring tool; A controller communicatively coupled to a metrology tool, the controller including one or more processors configured to execute program instructions, the program instructions causing the one or more processors to: receive design data of a layout of a plurality of manufactured examples including a structure of the same type; receive detection signals from a metrology tool associated within a field of view of the plurality of manufactured examples including the structure; generate design-aided composite data of the structure by combining detection signals from one or more common features of the structure associated with the plurality of manufactured examples of the structure within the field of view using the design data; and generate one or more metrological measurements of the structure based on the design-aided composite data.

21. The metering system of claim 20, wherein the metering instrument includes a particle beam illumination source.

22. The metering system of claim 21, wherein the particle beam illumination source comprises: One electron beam source.

23. The metering system of claim 21, wherein the particle beam illumination source comprises: At least one of an ion beam source or a neutral particle beam source.

24. The metering system of claim 20, wherein the metering instrument includes a photon illumination source.

25. The metrology system of claim 20, wherein the combination of detection signals using design data from one or more common features of the structure associated with the plurality of manufactured examples of the structure within the field of view includes: The design data is used to average the detection signals from the one or more common features of the structure associated with the plurality of instances of the structure within the field of view.

26. The metering system of claim 20, wherein the metering instrument comprises: A scanning measurement tool that generates detection data by scanning an illumination beam across the field of view with a scanning pattern.

27. The metering system of claim 26, wherein the scan pattern includes: Multiple traces.

28. The metering system of claim 27, wherein at least one of the plurality of traces is linear.

29. The metering system of claim 27, wherein at least one of the plurality of traces is curved.

30. The metering system of claim 20, wherein the metering instrument comprises: An imaging metrology tool in which the detection data is generated by imaging the sample using the field of view.

31. The measurement system of claim 20, wherein at least one of the one or more measurements of the structure includes: One of the critical dimensions (CD) of this structure is measured.

32. The measurement system of claim 20, wherein at least one of the one or more measurements of the structure includes: One of the structures is the position measurement.

33. The measurement system of claim 20, wherein at least one of the one or more measurements of the structure includes: The position measurement of at least one of the common features of the structure.

34. The measurement system of claim 33, wherein at least one of the one or more common features of the structure includes: One of the edges of this structure.

35. The metrology system of claim 20, wherein the structure is a first structure, wherein the field of view further includes a plurality of manufactured examples of a second structure on the sample, wherein the first structure and the second structure form a stacked target, wherein the program instructions are further configured to cause the one or more processors to: receive design data including a layout of one of the plurality of manufactured examples of the second structure on the sample; generate design-aided composite data of the second structure by combining detection signals from one or more common features of the second structure associated with the plurality of manufactured examples of the second structure within the field of view using the design data; and generate a stacked measurement of the stacked target associated with position measurements of the first and second structures based on the design-aided composite data of the first and second structures.

36. The metering system of claim 20, wherein at least one of the one or more common features of the structure includes: One of the edges of this structure.

37. The metering system of claim 20, wherein at least one of the one or more common features of the structure includes: One of the central parts of this structure.

38. A measurement method, comprising: Receive design data for a layout of a manufactured example containing a structure of the same type; generate detection signals from a measuring tool associated with a field of view containing the structure of the same type; generate design-aided composite data for the structure by combining the detection signals from one or more common features of the structure associated with the structure of the same type within the field of view using the design data; and generate one or more measuring measurements for the structure based on the design-aided composite data.

39. The measurement method of claim 38, wherein using the design data to combine detection signals from one or more common features of the structure associated with the plurality of manufactured examples of the structure within the field of view includes: The design data is used to average the detection signals from the one or more common features of the structure associated with the plurality of instances of the structure within the field of view.

40. The measurement method of claim 38, wherein at least one of the one or more measurements of the structure includes: The measurement of a critical dimension (CD) of the structure, a position measurement of the structure, or a position measurement of at least one of the one or more common features of the structure.

41. The measurement method of claim 38, wherein at least one of the one or more common features of the structure includes: At least one of the edges of the structure or the central portion of the structure.

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