Apparatus for environmental control of dies and substrates for hybrid bonding
TWI939660BActive Publication Date: 2026-09-21APPLIED MATERIALS INC
Patent Information
- Application Number
- TW112106276
- Authority / Receiving Office
- TW · TW
- Patent Type
- Patents
- Current Assignee / Owner
- Priority Date
- 2022-03-11
- Filing Date
- 2023-02-21
- Publication Date
- 2026-09-21
- Estimated Expiration
- 2043-02-20
Smart Images
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Abstract
A device for extending the dwell time of substrates with hybrid bonding activated by preserving plasma. In some embodiments, the device may include an environmentally controlled space, a support for holding a die or substrate, a gas accelerator for recirculating one or more gases laterally across the support, a filter, a humidifier device fluidly connected to the environmentally controlled space, wherein the humidifier device is capable of having a controllable humidity level within the environmentally controlled space, a pressurization device fluidly connected to the humidifier device at an output and fluidly connected to at least one gas supplier at an input, a relative humidity (RH) sensor positioned within the environmentally controlled space, and an environmental controller communicating at least with the humidifier device and the RH sensor, wherein the environmental controller is configured to maintain an RH level of approximately 80% to approximately 95%.
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Citation Information
Patent Citations
Method of joining metal contact surfaces while dissolving a sacrificial layer applied to one of the contact surfaces on at least one of the contact surfaces
JP2016524335A
Substrate bonding apparatus and substrate bonding method
JP2018201022A
Thermocompression bonding using plasma gas
US10297567B2
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US20200135520A1