Carrier with rotation prevention feature

Abstract

The carrier includes a carrier body, fingers attached to the carrier body, and an anti-rotation element attached to the carrier body. The fingers are configured to support a processing kit ring. The anti-rotation element is configured to be disposed adjacent to a flat inner surface of the processing kit ring to prevent the processing kit ring from rotating.

Description

Carrier with anti-rotation feature Embodiments of the present disclosure relate to apparatus and methods for transferring contents, and particularly to carriers for transferring contents, such as process kit rings in substrate processing systems. In substrate processing and other electronics processing, systems including robotic arms are often used to transport substrates between chambers. The following is a simplified summary of the disclosure, intended to provide a basic understanding of some aspects of the disclosure. This summary is not an extensive overview of the disclosure. It is not intended to identify key or critical elements of the disclosure, nor is it intended to delineate any scope of specific implementations of the disclosure or any scope of the claims. Its sole purpose is to present some concepts of the disclosure in a simplified form as a prelude to the more detailed description that will be presented later. In aspects of the present disclosure, a carrier includes a carrier body, a finger attached to the carrier body, and an anti-rotation element attached to the carrier body. The finger is configured to support a process kit ring. The anti-rotation element is configured to be positioned adjacent to a flat inner surface of the process kit ring to prevent the process kit ring from rotating. In another aspect of the present disclosure, the anti-rotation element is a carrier. The anti-rotation element includes an attachment portion defining an opening. The attachment portion is configured to receive a corresponding fastener through each opening to attach the attachment portion to a carrier body of the carrier. The anti-rotation element further includes one or more protrusions extending from the attachment portion. The one or more protrusions are configured to be positioned adjacent to a flat inner surface of a process kit ring disposed on the carrier to prevent the process kit ring from rotating. In another aspect of the present disclosure, the carrier includes a finger configured to support a process kit ring. The carrier further includes an anti-rotation element configured to prevent the process kit ring from rotating. The anti-rotation element includes a first protrusion configured to be positioned adjacent to a first portion of the curved inner surface of the process kit ring on a first side of the flat inner surface of the process kit ring. The anti-rotation element further includes a second protrusion configured to be positioned adjacent to a second portion of the curved inner surface of the process kit ring on a second side of the flat inner surface. Described herein are techniques related to carriers that include anti-rotation features (eg, semiconductor process kit carriers having features that prevent rotation during transport). Manufacturing systems are used to manufacture products. For example, substrate processing systems are used to process and manufacture finished substrates. Robots are used to move objects to, from, and within the substrate processing system. Objects include substrates, process kit rings, and the like. Objects must be correctly positioned (e.g., correctly aligned) within the substrate processing system. For example, the process kit ring is positioned in a specific orientation within the processing chamber. In conventional systems, objects may become incorrectly positioned (e.g., rotated, misaligned) during transport to, from, and / or within the substrate processing system. Devices (e.g., aligner devices and local center finder (LCF) devices) are used to attempt to correct the position (e.g., rotation, alignment) of the objects. These devices can only correct a threshold amount of mispositioning. Traditionally, the amount of incorrect positioning (e.g., incorrect rotation, misalignment) of an object (e.g., as a result of transportation) may exceed the threshold amount of correction that these devices can perform. Incorrectly positioned objects result in non-uniform substrate processing, damaged parts, opening of substrate processing systems and associated re-processing, reduced throughput, reduced substrate quality, increased user time, increased energy usage, and the like. The devices, systems, and methods disclosed herein provide a carrier that includes an anti-rotation feature. The carrier includes a carrier body, fingers attached to the carrier body, and a rotation-blocking element attached to the carrier body. The fingers are configured to support a process kit ring (e.g., a lower surface of the process kit ring is disposed on an upper surface of the fingers). An anti-rotation element (e.g., an anti-rotation feature) is configured to be disposed adjacent to a flat inner surface of the process kit ring to prevent the process kit ring from rotating. The apparatus, system and method disclosed herein have advantages over conventional solutions. The carrier of the present disclosure prevents the object placed on the carrier from rotating. This allows for more accurate positioning of the object compared to conventional solutions. This results in increased uniformity of substrate processing, less damage to components, less opening of the substrate processing system and less re-commissioning of the process, increased throughput, improved substrate quality, reduced user time, reduced energy usage, etc. The carrier of the present disclosure Although portions of this description relate to process kit rings, the description can be applied to different types of contents (e.g., to different types of chamber components, such as edge rings, showerheads, masks, mask handlers, half-rings, etc., other than process kit rings). Although portions of this description relate to substrate processing systems, the description can be applied to other types of systems. FIG1 illustrates a processing system 100 (e.g., a substrate processing system, a semiconductor manufacturing system, etc.) according to certain embodiments. Processing system 100 includes a factory interface 101 and loadports 128 (e.g., loadports 128A-D). In some embodiments, loadports 128A-D are directly mounted (e.g., sealed) to factory interface 101. Enclosure systems 130 (e.g., cassettes, front-opening pods (FOUPs), process kit enclosure systems, etc.) are configured to removably couple (e.g., dock) to loadports 128A-D. Referring to FIG1 , enclosure system 130A is coupled to loadport 128A, enclosure system 130B is coupled to loadport 128B, enclosure system 130C is coupled to loadport 128C, and enclosure system 130D is coupled to loadport 128D. In some embodiments, one or more enclosure systems 130 are coupled to loadports 128 to transfer wafers and / or other substrates into and out of processing system 100. Each enclosure system 130 seals a corresponding load port 128. In some embodiments, a first enclosure system 130A is docked to a load port 128A (e.g., to replace a used process kit ring). Once one or more of these operations are performed, the first enclosure system 130A is then detached from the load port 128A, and a second enclosure system 130 (e.g., a FOUP containing wafers) is then docked to the same load port 128A. In some embodiments, a carrier (e.g., including an anti-rotation element attached to the carrier body) is used to transfer contents between the enclosure systems 130 and other portions of the processing system 100. In some embodiments, loadport 128 includes a front interface forming a vertical opening (or a substantially vertical opening). Loadport 128 also includes a horizontal surface for supporting a housing system 130 (e.g., a cassette, a process kit housing system). Each housing system 130 (e.g., a wafer FOUP, a process kit housing system) has a front interface forming a vertical opening. The front interface of housing system 130 is sized to engage (e.g., seal) with the front interface of loadport 128 (e.g., the vertical opening of housing system 130 is approximately the same size as the vertical opening of loadport 128). Housing system 130 is placed on the horizontal surface of loadport 128, and the vertical opening of housing system 130 is aligned with the vertical opening of loadport 128. The front interface of housing system 130 interconnects (e.g., clamps, secures, or seals) with the front interface of loadport 128. The bottom plate (e.g., base plate) of the enclosure system 130 has features (e.g., loading features such as recesses or sockets that engage with loadport kinematic pin features, loadport features for pin clearance, and / or docking tray latch gripping features of the enclosure system) that engage with the horizontal surface of the loadport 128. The same loadport 128 is used for different types of enclosure systems 130 (e.g., process kit enclosure systems, cassettes containing wafers). In some embodiments, a housing system 130 (e.g., a process kit housing system) includes one or more contents 110 (e.g., one or more of a process kit ring, an empty process kit ring carrier, a process kit ring disposed on a process kit ring carrier, a placement verification wafer, components of the processing system 100, etc.). In some examples, the housing system 130 is coupled to the factory interface 101 (e.g., via a load port 128) to enable automated transfer of a process kit ring on a process kit ring carrier to the processing system 100 for replacement of a used process kit ring. In some embodiments, the processing system 100 also includes first vacuum ports 103a, 103b coupling the factory interface 101 to respective degas chambers 104a, 104b. Second vacuum ports 105a, 105b are coupled to the respective degas chambers 104a, 104b and positioned between the degas chambers 104a, 104b and the transfer chamber 106 to facilitate transfer of wafers and contents 110 (e.g., process kit rings) to the transfer chamber 106. In some embodiments, the processing system 100 includes and / or utilizes one or more degas chambers 104 and a corresponding number of vacuum ports 103, 105 (e.g., the processing system 100 includes a single degas chamber 104, a single first vacuum port 103, and a single second vacuum port 105). The transfer chamber 106 includes a plurality of process chambers 107 disposed therearound and coupled thereto (e.g., four process chambers 107, six process chambers 107, etc.). The processing chamber 107 is coupled to the transfer chamber 106 through respective ports 108, such as slit valves. In some embodiments, the factory interface 101 is at a higher pressure (e.g., atmospheric pressure), while the transfer chamber 106 is at a lower pressure (e.g., vacuum). Each degassing chamber 104 (e.g., load lock, pressure chamber) has a first door (e.g., first vacuum port 103) that seals the degassing chamber 104 from the factory interface 101 and a second door (e.g., second vacuum port 105) that seals the degassing chamber 104 from the transfer chamber 106. When the first door is opened and the second door is closed, the contents are transferred from the factory interface 101 to the degassing chamber 104. The first door closes, the pressure in the degassing chamber 104 is reduced to match that of the transfer chamber 106, and the second door opens to transfer the contents out of the degassing chamber 104. A local center finding (LCF) device is used to align the contents of the transfer chamber 106 (eg, before entering the processing chamber 107 or after leaving the processing chamber 107). In some embodiments, the processing chamber 107 includes one or more of an etch chamber, a deposition chamber (including atomic layer deposition, chemical vapor deposition, physical vapor deposition, or plasma-enhanced versions thereof), an annealing chamber, and the like. The factory interface 101 includes a factory interface robot 111. The factory interface robot 111 includes a robotic arm, such as a Selective Compliance Assembly Robot Arm (SCARA) robot. Examples of SCARA robots include a 2-link SCARA robot, a 3-link SCARA robot, a 4-link SCARA robot, etc. The factory interface robot 111 includes an end effector on the end of the robotic arm. The end effector is configured to pick up and handle specific objects, such as wafers. Alternatively or additionally, the end effector is configured to handle objects such as carriers and / or process kit rings (edge ​​rings). The robotic arm has one or more links or members (e.g., a wrist member, an upper arm member, a forearm member, etc.) that are configured to be moved to move the end effector in different directions to different positions. The factory interface robot 111 is configured to transfer objects between the enclosure system 130 (e.g., cassettes, FOUPs) and the degassing chambers 104a, 104b (or load ports). While conventional systems are associated with opening (e.g., disassembly, seal breaching, contamination) of a processing system (e.g., factory interface, transfer chamber, process chamber) to exchange different types of contents, the processing system 100 is configured to facilitate the transfer and exchange of contents without requiring an operator to open (e.g., disassemble, seal breaching, contamination) the processing system 100. Thus, in some embodiments, a sealed environment, including the interior of the enclosure system 130 and the interior of the factory interface 101, is maintained during the exchange of contents (e.g., via a carrier including anti-rotation elements). Transfer chamber 106 includes a transfer chamber robot 112. Transfer chamber robot 112 includes a robotic arm with an end effector at the end of the robotic arm. The end effector is configured to handle a specific object, such as a wafer. In some embodiments, transfer chamber robot 112 is a SCARA robot, but in some embodiments has fewer linkages and / or fewer degrees of freedom than factory interface robot 111. Controller 109 controls various aspects of processing system 100. Controller 109 is and / or includes a computing device such as a personal computer, a server computer, a programmable logic controller (PLC), a microcontroller, etc. Controller 109 includes one or more processing devices, which in some embodiments are general-purpose processing devices, such as microprocessors, central processing units, etc. More specifically, in some embodiments, the processing devices are complex instruction set computing (CISC) microprocessors, reduced instruction set computing (RISC) microprocessors, very long instruction word (VLIW) microprocessors, or processors implementing other instruction sets or a combination of instruction sets. In some embodiments, the processing devices are one or more special-purpose processing devices, such as application-specific integrated circuits (ASICs), field-programmable gate arrays (FPGAs), digital signal processors (DSPs), network processors, etc. In some embodiments, controller 109 includes data storage devices (e.g., one or more disk drives and / or solid-state drives), main memory, static memory, network interfaces, and / or other components. In some embodiments, controller 109 executes instructions to perform any one or more of the methods or processes described herein. The instructions may be stored on a computer-readable storage medium, which may include one or more of main memory, static memory, secondary storage, and / or a processing device (during execution of the instructions). In some embodiments, the controller 109 receives signals from and sends controls to the factory interface robot 111 and the wafer transfer chamber robot 112. FIG1 schematically illustrates the transfer of contents 110 (e.g., a carrier supporting a process kit ring) into a processing chamber 107. According to one aspect of the present disclosure, contents 110 are removed from a housing system 130 via a factory interface robot 111 located in the factory interface 101. The factory interface robot 111 transfers contents 110 to a corresponding degassing chamber 104a, 104b via one of the first vacuum ports 103a, 103b. A transfer chamber robot 112 located in the transfer chamber 106 removes contents 110 from one of the degassing chambers 104a, 104b via a second vacuum port 105a or 105b. The transfer chamber robot 112 moves contents 110 into the transfer chamber 106, where they are transferred to the processing chamber 107 via the corresponding port 108. Although not shown in FIG. 1 for clarity, the transfer of the contents 110 includes transfer of a process kit ring disposed on a process kit ring carrier, transfer of an empty process kit ring carrier, transfer of a placed verification wafer, and the like. FIG1 illustrates one example of transporting contents 110; however, other examples are contemplated. In some examples, it is contemplated that the housing system 130 is coupled to the transfer chamber 106 (e.g., via a load port mounted to the transfer chamber 106). The contents 110 are loaded from the transfer chamber 106 into the processing chamber 107 by a transfer chamber robot 112. Additionally, in some embodiments, the contents 110 are loaded into a substrate support pedestal (SSP). In some embodiments, an additional SSP is positioned in communication with the factory interface 101 opposite the illustrated SSP. Processed contents 110 (e.g., spent process kit rings) are removed from the processing system 100 in a manner reverse to any of the methods described herein. When multiple housing systems 130 or a combination of housing systems 130 and SSPs are utilized, in some embodiments, one SSP or housing system 130 will be used for unprocessed contents 110 (e.g., new processing kit rings) while another SSP or housing system 130 will be used to receive processed contents 110 (e.g., used processing kit rings). The processing system 100 includes chambers, such as a factory interface 101 (e.g., an equipment front end module (EFEM)), and adjacent chambers (e.g., a load port 128, an enclosure system 130, an SSP, a degas chamber 104 such as a load lock, etc.) adjacent to the factory interface 101. One or more chambers are sealed (e.g., each chamber is sealed). The adjacent chambers are sealed to the factory interface 101. In some embodiments, an inert gas (e.g., one or more of nitrogen, argon, neon, helium, krypton, or xenon) is provided to one or more chambers (e.g., the factory interface 101 and / or the adjacent chambers) to provide one or more inert environments. In some examples, the factory interface 101 is an inert EFEM that maintains an inert environment (e.g., an inert EFEM mini-environment) within the factory interface 101, eliminating the need for users to enter the factory interface 101 (e.g., the processing system 100 is configured such that there is no manual access to the factory interface 101). In some embodiments, a gas flow (e.g., an inert gas, nitrogen) is provided to one or more chambers (e.g., factory interface 101) of processing system 100. In some embodiments, the gas flow is greater than leakage through the one or more chambers to maintain a positive pressure within the one or more chambers. In some embodiments, the inert gas within factory interface 101 is recirculated. In some embodiments, a portion of the inert gas is exhausted. In some embodiments, the gas flow of non-recirculated gas entering factory interface 101 is greater than the exhaust gas flow and gas leakage to maintain a positive pressure of the inert gas within factory interface 101. In some embodiments, factory interface 101 is coupled to one or more valves and / or pumps to provide gas flow into and out of factory interface 101. A processing device (e.g., controller 109) controls the gas flow into and out of factory interface 101. In some embodiments, the processing device receives sensor data from one or more sensors (e.g., an oxygen sensor, a humidity sensor, a motion sensor, a door actuation sensor, a temperature sensor, a pressure sensor, etc.) and determines a flow rate of the inert gas flowing into and / or out of the factory interface 101 based on the sensor data. The enclosure system 130 allows for the transfer and replacement of different types of contents 110 (e.g., via a carrier including anti-rotation elements) without opening the sealed environment within the factory interface 101 and adjacent chambers. The enclosure system 130 seals to the load port 128 in response to docking on the load port 128. The enclosure system 130 provides purge port access so that the interior of the enclosure system 130 can be purged before opening the enclosure system 130 to minimize disruption to the inert environment within the factory interface 101. Figures 2A-C illustrate views of a carrier 200 according to certain embodiments. Figure 2A illustrates the carrier 200 supporting a process kit ring 250 according to certain embodiments. Figure 2B illustrates the carrier 200 without the process kit ring 250 according to certain embodiments. Figure 2C illustrates the carrier 200 without the fingers 220 and without the anti-rotation element 230. The carrier 200 includes a carrier body 210 (e.g., a substantially rigid body), fingers 220, an anti-rotation element 230, and fasteners 240 (e.g., screws, bolts, rivets, etc.). The fingers 220 are attached to the carrier body 210 (e.g., each finger is fastened via a fastener 240). The fingers 220 are configured to support a process kit ring 250. In some embodiments, the carrier 200 includes at least three fingers 220. In some embodiments, the carrier 200 includes three fingers 220. Each finger 220 can form a lip, and the lower surface of the process kit ring 250 can be disposed on the lip. In some embodiments, the fingers 220 are configured to align the process kit ring 250 horizontally relative to the carrier body 210. The anti-rotation element 230 is attached (e.g., fastened via fasteners 240) to the carrier body 210. The anti-rotation element 230 is configured to be positioned adjacent to the flat inner surface 252 of the process kit ring 250 to prevent the process kit ring 250 from rotating. In some embodiments, the anti-rotation element 230 comprises thermoplastic. In some embodiments, the anti-rotation element 230 comprises polybenzimidazole (PBI) fibers. The carrier body 210 may have an opening 212 (e.g., a window, a slot, etc.). In some embodiments, the opening 212 is used by tool automation (e.g., an aligner device, an LCF device) to see through the carrier 200 (e.g., to view objects on the other side of the carrier 200) to ensure placement accuracy. In some embodiments, the opening 212 is used to reduce the mass of the carrier 200 (e.g., the carrier body 210). Reducing the mass of the carrier 200, allowing observation through the carrier body 210, allowing optical passage of light or objects through the carrier body 210, etc. The process kit ring 250 can be circular in shape (eg, a ring) having a substantially flat upper surface, a substantially flat lower surface, a curved outer surface, a curved inner surface, and a flat inner surface 252. The flat inner surface 252 can be used to position the process kit ring 250. 2C , the carrier body 210 can define an opening 216 configured to receive a fastener 240. In some embodiments, the opening 216 is threaded to removably receive the fastener 240. In some embodiments, the fastener 240 is threaded to be secured to the threaded opening 216. In some embodiments, the fastener 240 is threaded to be secured to the threaded fingers 220 and / or anti-rotation element 230. In some embodiments, each fastener 240 includes a first portion and a second portion (e.g., a bolt and a nut, etc.) that are configured to be secured to each other to secure the fingers 220 and / or anti-rotation element 230 to the carrier body 210. Fingers 220 and / or anti-rotation elements 230 are configured to be removably attached to carrier body 210 via fasteners 240 and openings 216. In some embodiments, each finger 220 and / or anti-rotation element 230 forms an opening, and fasteners 240 are configured to removably attach fingers 220 and / or anti-rotation elements 230 to carrier body 210 by being inserted through the openings of the fingers 220 and / or anti-rotation elements 230 and the openings 216 of the carrier body 210. In some embodiments, different sets of fingers 220 are used for different types of contents. In some examples, the different types of contents include new contents and used contents (e.g., a first set of fingers 220 affixed to a carrier body 210 for transferring used contents, and a second set of fingers 220 affixed to the same carrier body 210 for transferring new contents). In some examples, the different types of contents include contents of different sizes and / or shapes (e.g., a first set of fingers 220 affixed to a carrier body 210 for transferring contents of a first size and / or shape, and a second set of fingers 220 affixed to the same carrier body 210 for transferring contents of a different size and / or shape). In some examples, the different types of contents include one or more of the following: a process kit ring, a chamber component of a substrate processing system, a used chamber component of a substrate processing system, a showerhead, a component having a substantially circular perimeter (e.g., an inner perimeter, an outer perimeter), etc. In some embodiments, different groups of fingers 220 are used for different conditions. In some embodiments, each finger 220 in the first group of fingers 220 includes a first material configured for a first condition, and each finger in the second group of fingers includes a second material configured for a second condition different from the first condition. In some examples, the material of the fingers 220 includes one or more of the following: polyethylene terephthalate (PET), a ceramic material, polytetrafluoroethylene (PTFE) (e.g., Teflon™), ultra-high molecular weight (UHMW) polyethylene, an absorptive material, a non-absorbent material, a coated material, a deformable material, an electrostatic dissipative material, etc. In some embodiments, the fingers 220 have a specific conductivity (e.g., less than perfect conductivity, a conductive path that allows dissipation at a controlled rate, prevents high arcing, a static dissipative material from about 10 5 Ohms to about 10 9 In some examples, the different conditions include one or more of the following: etching conditions, cleaning conditions, electrostatic conditions, specific processes (e.g., substrate fabrication processes, atomic layer deposition, chemical vapor deposition, physical vapor deposition, plasma-enhanced versions thereof, etc.), specific chemicals (e.g., fluorine, acid, base, etc.), specific temperature ranges (e.g., high temperature), specific pressure ranges (e.g., high pressure), atmospheric pressure, vacuum pressure, etc.). In some embodiments, carrier 200 is a custom mechanical adapter that allows for automated handling of process kit rings, moved through tools designed for wafer processing. Fingers 220 allow carrier 200 to be maintained and replaced with different finger material types as needed for a specific process kit ring. Carrier 200 with replaceable fingers 220 enables current process kit rings and allows for future compatibility with process kit rings of various sizes and material types. In some embodiments, different rigid bodies 210 are used for different contents and / or different conditions. In some embodiments, each carrier body 210 is made of a different type of material. In some examples, the carrier body 210 is made of one or more of the following: carbon fiber, aluminum, cast aluminum plate (e.g., MIC-6®), hard anodized aluminum, ceramic material, titanium, etc. In some embodiments, the carrier body 210 is made of the same or similar material as the robot blade (e.g., end effector). In some embodiments, the carrier 200 does not have any gluing elements (e.g., no adhesive). In some embodiments, the carrier 200 does not have any shrink-fit elements. In some embodiments, all features of the carrier 200 are mechanically bonded (e.g., via fasteners 240) or machined into the carrier body 210. In some embodiments, the carrier 200 has pads (e.g., mushroom pads, perfluoroelastomer pads, Kalrez® 8475 friction pads, Kalrez® mushroom pads, calibration mushrooms, pads integral to the carrier body 210) for non-slip interfaces (e.g., automation interfaces) with atmospheric robotic end effectors (e.g., the factory interface robot 111 of FIG. 1 ) and vacuum robotic end effectors (e.g., the transfer chamber robot 112 of FIG. 1 ). In some embodiments, the pads are used to provide a non-slip connection with one or more of an LCF device, an aligner device, and the like. In some embodiments, the carrier 200 has pads (e.g., aluminum pads, pads integral to the carrier body 210) for positioning the carrier 200 within a housing system (e.g., the housing system 130 of FIG. 1 , a FOUP) and a load lock (e.g., the degassing chamber 104 of FIG. 1 ). In some embodiments, the carrier body 210 has a substantially flat (e.g., substantially planar) lower surface. In some embodiments, the lower surface of the carrier body 210 is substantially flat, except for pads on the lower surface of the carrier body 210. In some embodiments, the carrier 200 (e.g., the carrier body 210) does not have kinematic positioning features (e.g., no kinematic positioning features on the lower surface of the carrier body 210). In some embodiments, the carrier body 210, the anti-rotation element 230, and / or the fingers 220 have one or more coatings. In some examples, the fingers 220 and / or the anti-rotation element 230 have coatings configured to transport contents under specific conditions (e.g., suitable for certain chemicals and / or treatments). In some embodiments, the fingers 220 and / or the anti-rotation element 230 have one or more coatings that provide one or more coefficients of friction to allow contents to align on the fingers. In some examples, the sidewalls of each finger 220 have a lower coefficient of friction than the first upper surface of each finger, allowing contents to slide down the sidewalls and rest on the first upper surface. In some examples, the upper portion of the sidewall of each finger 220 has a lower coefficient of friction than the lower portion of the sidewall of each finger 220 to allow contents to slide down the upper portion of each sidewall and decelerate at the lower portion of each sidewall. In some embodiments, the profile of carrier body 210 differs from that shown in Figures 2A-2C. In some embodiments, the size, shape, number, etc. of openings 212 and / or openings 216 differ from those shown in Figures 2A-2C. In some embodiments, different fasteners 240 have one or more of different sizes, different shapes, different materials, etc. In some embodiments, the material of fasteners 240 includes one or more of aluminum, ceramic, stainless steel, electro-polished (EP) stainless steel, etc. In some embodiments, the fingers 220 have a lip that downwardly supports the contents. In some embodiments, the fingers 220 are positioned around the carrier body 210 to support contents with a circular perimeter, such as a treatment kit ring, a spray head, etc. In some embodiments, the fingers 220 are replaceable to support contents with varying perimeters. In some embodiments, the fingers 220 are attached to the carrier body 210 via slots that allow the position of the fingers 220 to be adjusted (e.g., radially from the center portion of the carrier body 210) to support contents with varying perimeters. In some embodiments, as the fingers 220 wear over time, the position of the fingers 220 can be adjusted (e.g., radially from the center region 280 of the carrier body 210) to continue supporting contents with the same perimeter. In some embodiments, once the fingers 220 are worn and no longer support contents with the same perimeter, they are replaced with new fingers 220. The carrier 200 includes one or more lower surfaces (eg, pads) configured to engage an end effector of a robotic arm. The carrier 200 (eg, carrier body 210) includes one or more lower surfaces (eg, solid planar center region 214) configured to engage a vacuum chuck. In some embodiments, carrier body 210 forms a protrusion (e.g., a boss) around each opening 216. In some embodiments, the boss is a protruding feature of carrier body 210. In some embodiments, the protrusion is used to position fingers 220 on carrier body 210. In some embodiments, fingers 220 have recesses that mate with the protrusion. In some embodiments, the protrusion allows fingers 220 to be attached to carrier body 210 in the correct orientation. In some embodiments, the size and shape of the carrier 200 is designed to provide one or more gaps between the process kit ring 250 and one or more portions of the perimeter of the carrier 200. In some embodiments, an aligner device and / or an LCF device utilize the one or more gaps to align the carrier 200 and / or the process kit ring 250. In some examples, the one or more gaps enable a light beam to detect a flat inner surface 252 or other registration features of the process kit ring 250. In some embodiments, lift pins utilize the one or more gaps to lift the process kit ring 250 off the carrier 200 (e.g., within a processing chamber). In some embodiments, the perimeter of the carrier 200 is configured to engage a shelf of a housing system (e.g., a FOUP) of a substrate processing system. In some embodiments, carrier 200 is a semiconductor process kit carrier to prevent rotation during transport. Carrier 200 may include features (e.g., anti-rotation elements 230) to prevent rotation (e.g., rotation of the process kit ring) during transport. Carrier 200 including anti-rotation elements 230 may prevent process kit ring 250 from rotating relative to carrier 200 within a FOUP during transport through the facility. Anti-rotation elements 230 may secure process kit ring 250 during transport. Alignment of the process kit ring 250 within the process chamber is crucial for proper operation of the process chamber. An aligner device can be used to correct for minor alignment errors (e.g., within a few degrees) of the process kit ring 250 on the carrier 200. The process kit ring 250 can be tightly aligned on the carrier 200 relative to the robot end effector and the handover station, allowing the aligner device to correct for small rotational misalignments between the process kit ring 250 and the carrier 200. The protrusions (eg, two fingers) of the anti-rotation element 230 may contact the inner diameter of the process kit ring 250 on a flat inner surface (eg, a flat alignment feature) of the process kit ring 250. The protrusions (eg, two fingers) may prevent the process kit ring 250 from rotating. The anti-rotation element 230 can help align the process kit ring with the carrier and can prevent the process kit ring from rotating relative to the carrier 200 during transport. The alignment of the process kit ring with the carrier can be less than or equal to plus or minus 2.5 degrees. The alignment of the process kit ring with the process chamber can be less than or equal to approximately plus or minus 0.6 degrees. The anti-rotation element 230 may be referred to as a rotation stop (eg, made of PBI). In some embodiments, the carrier body 210 is made of aluminum and the anti-rotation element 230 is made of PBI. The flat inner surface 252 of the process kit ring 250 may resemble features (eg, notches, flats, etc.) of a substrate (eg, a silicon wafer, notches of a substrate), an electrostatic chuck (eg, flats of an electrostatic chuck), etc. for alignment of components and contents. 3A-3C illustrate views of an anti-rotation element 330 (eg, anti-rotation element 230 of FIG. 2A-2B ), according to some embodiments. In some embodiments, the anti-rotation element includes a first protrusion and a second protrusion. The first protrusion can be configured to be positioned proximate to a first portion of the curved inner surface of the process kit ring 350 (e.g., the process kit ring 250 of FIG. 2A , the contents 110 of FIG. 1 ) on a first side of the flat inner surface 252. The second protrusion can be configured to be positioned proximate to a second portion of the curved inner surface of the process kit ring 250 on a second side of the flat inner surface 252. In some embodiments, the anti-rotation element 330 includes an outer surface configured to be positioned proximate to the curved inner surface of the process kit ring 350 and a lower surface configured to be positioned below the process kit ring 350 to block light between the curved inner and outer surfaces of the process kit ring 350. In some embodiments, anti-rotation element 330 includes a lower surface forming a recess configured to engage with a protrusion on an upper surface of carrier body 310 (eg, carrier body 210 of Figures 2A-2C). In some embodiments, one or more protrusions are formed on the upper surface of the carrier body 310 . The protrusions are disposed adjacent to corresponding outer surfaces of the anti-rotation element 330 to prevent the anti-rotation element 330 from rotating relative to the carrier body 310 . In some embodiments, the anti-rotation element 330 maintains alignment between one or more of the process kit ring 350 and the carrier 300 (e.g., the carrier 200 of Figures 2A-2C) to within approximately plus or minus 2.5 degrees, or the process kit ring 350 and the processing chamber to within approximately plus or minus 0.6 degrees. In some embodiments, the anti-rotation element 330 is configured to be positioned proximate to the planar inner surface of the process kit ring 350 without blocking the planar inner surface 352 . In some embodiments, the anti-rotation element 330 includes an attachment portion 334 forming an opening, wherein the attachment portion 334 is configured to receive a corresponding fastener 340 (e.g., the fastener 240 of Figures 2A-2B) through each of the plurality of openings to attach the attachment portion 334 to the carrier body 310 of the carrier 300. The anti-rotation element 330 may include one or more protrusions 332 extending from the attachment portion 334, wherein the one or more protrusions 332 are configured to be disposed proximate to a flat inner surface of a process kit ring 350 disposed on the carrier 300 to prevent the process kit ring 350 from rotating. In some embodiments, the carrier 300 includes fingers configured to support the process kit ring 350. The carrier 300 may further include an anti-rotation element 330 configured to prevent the process kit ring 350 from rotating. The anti-rotation element 330 may include a first protrusion and a second protrusion. The first protrusion may be configured to be positioned on a first side of the flat inner surface of the process kit ring 350 adjacent to a first portion of the curved inner surface of the process kit ring 350. The second protrusion may be configured to be positioned on a second side of the flat inner surface adjacent to a second portion of the curved inner surface of the process kit ring 350. In some embodiments, at least one of the anti-rotation elements 330 or the fingers is integrally formed with the carrier body 310 of the carrier 300 . The carrier 300 can allow the flat inner surface 352 to be visible (e.g., for scanning for alignment). The carrier 300 can limit the rotation of the process kit ring 350 to approximately plus or minus one degree. A protrusion on the upper surface of the carrier body 310 (e.g., a side surface) can prevent rotation of the anti-rotation element 330. A portion of the anti-rotation element 330 can be configured to be positioned below the process kit ring 350 to block light (e.g., without contacting the light blocking features of the process kit ring 350, blocking light at the aligner device and / or LCF device). The carrier 300 can align the process kit ring 350 and the carrier 300 by plus or minus one degree (e.g., from the center axis of the carrier 300). The process kit ring 350 and the carrier 300 can be aligned on the same axis (e.g., through the center of the anti-rotation element 330). The aligner device can rotate the process kit ring 350 and the carrier 300 by approximately plus or minus 2.5 degrees along the same axis. In some embodiments, the process kit ring 350 does not contact the anti-rotation element 330 (eg, there is space between the inner surface of the process kit ring and the outer surface of the anti-rotation element 330 , and there is space between the lower surface of the process kit ring 350 and the upper surface of the anti-rotation element 330 ). As shown in FIG. 3C , the distal end of the anti-rotation element 330 can have an inclined outer surface that is inclined toward the upper surface on which the treatment kit ring 350 is disposed. 4A-4B illustrate views of a carrier 400 (e.g., one or more of the carrier 200 of FIG. 2A-2C , the carrier 300 of FIG. 3A-3C , etc.) supporting a process kit ring 450 (e.g., one or more of the process kit ring 250 of FIG. 2A , the process kit ring 350 of FIG. 3B , etc.) according to certain embodiments. The carrier 400 may have an anti-rotation element 430 comprising multiple portions (e.g., a first anti-rotation element 430 disposed on a first side of a planar inner surface 452 and a second anti-rotation element 430 disposed on a second side of the planar inner surface 452). The carrier 400 may allow the flat inner surface 452 on the process kit ring 450 to be visible (eg, for scanning for alignment). FIG5 illustrates a carrier 500 (e.g., one or more of the carrier 200 of FIG2A-2C , the carrier 300 of FIG3A-3C , the carrier 400 of FIG4A-4B , etc.) supporting a process kit ring 550 (e.g., one or more of the process kit ring 250 of FIG2A , the process kit ring 350 of FIG3B , the process kit ring 450 of FIG4A-4B , etc.) in accordance with certain embodiments. The carrier 500 may include an anti-rotation element 530 disposed against a flat inner surface 552. The carrier 500 may be basic and easy to manufacture. The foregoing description sets forth many specific details, such as examples of specific systems, elements, methods, etc., in order to provide a good understanding of many embodiments of the present disclosure. However, it will be apparent to those having ordinary skill in the art that at least some embodiments of the present disclosure can be practiced without these specific details. In other cases, well-known elements or methods are not described in detail, or are presented in a simple diagrammatic format to avoid unnecessarily confusing the present disclosure. Therefore, the specific details set forth are merely exemplary. Specific embodiments may differ from these example details and are still contemplated to be within the scope of the present disclosure. Throughout this specification, references to "one embodiment" or "an embodiment" mean that a particular feature, structure, or characteristic described in connection with the embodiment is included in at least one embodiment. Thus, the appearances of the phrases "in one embodiment" or "in an embodiment" in various places throughout this specification are not necessarily all referring to the same embodiment. Furthermore, the term "or" is intended to be inclusive, not exclusive. When the terms "about" or "approximately" are used herein, this is intended to indicate that the stated nominal value is accurate to within ±10%. Although the operations of the methods herein are shown and described in a particular order, the order of operations of each method may be changed so that certain operations are performed in a reverse order, so that certain operations are performed at least partially, and simultaneously with other operations. In another embodiment, instructions or sub-operations of different operations are performed in an intermittent and / or alternating manner. As used herein, the terms "over," "under," "between," "disposed over," and "overlying" refer to the relative position of one material layer or element with respect to other layers or elements. For example, a layer disposed over, above, or under another layer can be directly in contact with the other layer or can have one or more intervening layers. Additionally, a layer disposed between two layers can be directly in contact with both layers or can have one or more intervening layers. Similarly, unless expressly stated otherwise, a feature disposed between two features can be directly in contact with the adjacent feature or can have one or more intervening layers. It should be understood that the above description is intended to be illustrative and not limiting. Many other embodiments will be apparent to those skilled in the art upon reading and understanding the above description. Accordingly, the scope of the present disclosure should be determined by reference to the appended claims and the full scope of equivalents to which such claims are entitled. 100: Processing System 101: Factory Interface 103: Vacuum Port 103a: Vacuum Port 103b: Vacuum Port 104: Degassing Chamber 104a: Degassing Chamber 104b: Degassing Chamber 105: Vacuum Port 105a: Vacuum Port 105b: Vacuum Port 106: Transfer Chamber 107: Processing Chamber 108: Port 109: Controller 110: Contents 111: Factory Interface Robot 112: Transfer Chamber Robot 128: Loading Port 128A: Loading Port 128B: Loading Port 128C: Loading Port 128D: Loading Port 130: Housing System 130A: Housing System 1 30B: Housing system 130C: Housing system 130D: Housing system 200: Carrier 210: Carrier body 212: Opening 214: Central region 216: Opening 220: Finger 230: Anti-rotation element 240: Fastener 250: Processing kit ring 252: Inner surface 300: Carrier 310: Carrier body 330: Anti-rotation element 332: Protrusion 334: Attachment portion 340: Fastener 350: Processing kit ring 352: Inner surface 400: Carrier 430: Anti-rotation element 450: Processing kit ring 452: Inner surface 500: Carrier 530: Anti-rotation element 552: Inner surface The present disclosure is illustrated by way of example and not limitation. In the accompanying drawings, like reference numerals indicate similar elements. It should be noted that different references to "one" or "an" embodiment in this disclosure are not necessarily to the same embodiment, and such references mean at least one. FIG1 illustrates a processing system according to some embodiments. 2A-2C illustrate views of a carrier according to certain embodiments. 3A-3C illustrate views of an anti-rotation element according to some embodiments. 4A-4B illustrate views of a carrier supporting a process kit ring, according to certain embodiments. 5 illustrates a carrier supporting a process kit ring, according to some embodiments. Domestic deposit information (please note in the order of deposit organization, date, and number) None Foreign deposit information (please note in the order of deposit country, organization, date, and number) None 200:Carrier 210: Carrier body 212: Open 214: Central Area 220: Finger 230: Anti-rotation element 240: Fasteners 250: Handling kit ring 252: Inner surface

Claims

1. A carrier, comprising: One carrier body; A plurality of fingers are attached to the carrier body, wherein the plurality of fingers are configured to support a processing kit ring; And an anti-rotation element, comprising: an attachment portion fixed to the carrier body; A first protrusion extends beyond a periphery of the carrier body and is adjacent to a first side of a flat inner surface of the processing kit ring; and a second protrusion extends beyond the periphery of the carrier body and is adjacent to a second side of the flat inner surface of the processing kit ring, wherein the anti-rotation element is configured to be disposed adjacent to the flat inner surface of the processing kit ring to prevent the processing kit ring from rotating.

2. The carrier as described in claim 1, wherein: The first protrusion is configured to be located on the first side of the flat inner surface adjacent to a first portion of a curved inner surface of the processing kit ring; The second protrusion is configured to be disposed on the second side of the flat inner surface adjacent to a second portion of the curved inner surface of the processing kit ring.

3. The carrier as described in claim 1, wherein, The anti-rotation element includes: an outer surface configured to be disposed adjacent to a curved inner surface of the processing kit ring; and a lower surface configured to be disposed below the processing kit ring to block light between the curved inner surface and the outer surface.

4. The carrier as described in claim 1, wherein, The anti-rotation element includes a lower surface forming a recess that is configured to engage with a protrusion on an upper surface of the carrier body.

5. The carrier as described in claim 1, wherein, One or more protrusions are formed on an upper surface of the carrier body, and the one or more protrusions are disposed adjacent to a corresponding outer surface of the anti-rotation element to prevent the anti-rotation element from rotating relative to the carrier body.

6. The carrier as claimed in claim 1, wherein the anti-rotation element maintains alignment between one or more of the following: the processing kit ring and the carrier are within about ±2.5 degrees; or the processing kit ring and a processing chamber are within about ±0.6 degrees.

7. The carrier as described in claim 1, wherein, The plurality of fingers are configured to align the processing kit ring horizontally relative to the carrier body.

8. The carrier as described in claim 1, wherein, The anti-rotation element comprises a thermoplastic material.

9. The carrier as described in claim 1, wherein, The anti-rotation element comprises polybenzimidazole (PBI) fibers.

10. The carrier as claimed in claim 1, wherein the anti-rotation element is configured to be disposed adjacent to the flat inner surface of the processing kit ring without obstructing the flat inner surface.

11. An anti-rotation element for a carrier, the anti-rotation element comprising: An attachment portion forms a plurality of openings, wherein the attachment portion is configured to receive a corresponding fastener via each of the plurality of openings to attach the attachment portion to a carrier body of the carrier. A plurality of protrusions extending from the attachment portion, the plurality of protrusions including: a first protrusion configured to extend beyond a periphery of the carrier body and adjacent to a first side of a flat inner surface of a processing kit ring; and a second protrusion extending beyond the periphery of the carrier body and adjacent to a second side of the flat inner surface of the processing kit ring, wherein the plurality of protrusions are configured adjacent to the flat inner surface of the processing kit ring disposed on the carrier to prevent the processing kit ring from rotating.

12. The anti-rotation element as described in claim 11, wherein: The first protrusion is configured to be located on the first side of the flat inner surface adjacent to a first portion of a curved inner surface of the processing kit ring; The second protrusion is configured to be disposed on the second side of the flat inner surface adjacent to a second portion of the curved inner surface of the processing kit ring.

13. The anti-rotation element as described in claim 11, wherein, Each of the plurality of protrusions includes: an outer surface configured to be disposed adjacent to a curved inner surface of the processing kit ring; and a lower surface configured to be disposed below the processing kit ring to block light between the curved inner surface and the outer surface.

14. The anti-rotation element as described in claim 11, wherein, The anti-rotation element includes a lower surface forming a recess that is configured to engage with a protrusion on an upper surface of the carrier body.

15. The anti-rotation element as claimed in claim 11, wherein the anti-rotation element maintains alignment between one or more of the following: the processing kit ring and the carrier are within about ±2.5 degrees; or the processing kit ring and a processing chamber are within about ±0.6 degrees.

16. The anti-rotation element as described in claim 11, wherein, The anti-rotation element comprises a thermoplastic material.

17. The anti-rotation element as described in claim 11, wherein, The anti-rotation element comprises polybenzimidazole (PBI) fibers.

18. The anti-rotation element as claimed in claim 11, wherein the anti-rotation element is configured to be disposed adjacent to the flat inner surface of the processing kit ring without obstructing the flat inner surface.

19. A carrier, comprising: A plurality of fingers are configured to support a processing kit ring; And an anti-rotation element configured to prevent the processing kit ring from rotating, the anti-rotation element comprising: a first protrusion extending beyond a periphery of a carrier body of the carrier and configured to be disposed on a first side of a flat inner surface of the processing kit ring adjacent to a first portion of a curved inner surface of the processing kit ring; A second protrusion extends beyond the periphery of the carrier body and is configured to be disposed on a second side of the flat inner surface adjacent to a second portion of the curved inner surface of the processing kit ring.

20. The carrier as claimed in claim 19, wherein the anti-rotation element or at least one of the plurality of fingers is integrally formed with the carrier body of the carrier.

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