Electronic device

TWI939759BActive Publication Date: 2026-09-21INNOLUX CORP
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Patent Information

Application Number
TW113121178
Authority / Receiving Office
TW · TW
Patent Type
Patents
Current Assignee / Owner
Filing Date
2024-06-07
Publication Date
2026-09-21
Estimated Expiration
2044-06-06

AI Technical Summary

Technical Problem

Traditional connection structures in electronic devices are prone to cracking or delamination due to differences in thermal expansion coefficients between materials and low adhesion, leading to structural instability.

Method used

An electronic device with a connection structure featuring a first pad electrically connected to a conductive pad, a second pad, and a polymer surrounding both, where the first pad has inclined edges and arcuate edges to disperse stress and improve adhesion, reducing the risk of cracking and delamination.

Benefits of technology

The solution enhances adhesion and reduces stress concentration, minimizing the risk of structural failure in electronic devices by dispersing thermal stress and improving the connection integrity.

✦ Generated by Eureka AI based on patent content.

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Abstract

An electronic device includes an electronic unit and a connection structure disposed on the electronic unit. The electronic unit includes electronic components and conductive pads electrically connected to the electronic components. The connection structure includes a first pad electrically connected to the conductive pads, a second pad electrically connected to the first pads, and a first polymer surrounding the first pads and the second pads. The first pad includes a first portion, a second portion, and a third portion, wherein the first portion contacts the conductive pads, the second portion connects to the first portion, the third portion connects to the second portion and extends outward relative to the first portion, a portion of the first polymer is disposed between the third portion and the conductive pads, and in a cross-sectional view, the third portion has a first edge proximate to the conductive pads, at least a portion of the first edge being inclined toward the conductive pads.
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Citation Information

Patent Citations

  • Semiconductor package and semiconductor package module

    CN101964334B

  • Display panel and manufacturing method thereof

    CN116190540A

  • Semiconductor device and method for manufacturing the same and electronic apparatus

    JP2012104752A