Lower electrode feeding device and semiconductor processing equipment

Abstract

This application provides a lower electrode feeding device and a semiconductor processing apparatus. The device includes an RF feeding assembly, one end of which is electrically connected to an RF source, and the other end of which is electrically connected to a chuck assembly. The RF feeding assembly includes at least two RF feeding tubes and at least one RF adapter tube. Each pair of adjacent RF feeding tubes is provided with a first mating portion, and the RF adapter tube is provided with two second mating portions. The two second mating portions respectively mate with the first mating portions of the two adjacent RF feeding tubes, so that the RF adapter tube is detachably connected to the two adjacent RF feeding tubes and electrically conductive.

Description

Lower Electrode Feeding Device and Semiconductor Processing Equipment This application relates to the field of semiconductor manufacturing. Specifically, it relates to a lower electrode feeding device and a semiconductor processing equipment. A plasma etcher can be used for the etching process, such as removing the redundant materials required by the pre-designed requirements on a semiconductor wafer, generating grooves with corresponding process requirements, and providing a basis for subsequent processes. The process chamber of the plasma etcher is in a vacuum state. Before the etching process, the wafer to be processed is placed on the chuck assembly. During the etching process, the process gas is transported to the process chamber through the gas inlet device at the top of the chamber, and by applying a radio frequency power to the upper electrode (such as a radio frequency coil) arranged at the top of the chamber, the process gas is ionized to form plasma. And the chuck assembly is loaded with radio frequency power through the lower electrode feeding device to attract the plasma to move towards the wafer on the chuck assembly, thereby completing the etching process of the wafer. In addition, an electrostatic adsorption electrode and a heating element are also arranged in the above-mentioned chuck assembly. In this case, the lower electrode feeding device can also be used to feed direct current into the electrostatic adsorption electrode to be able to adsorb and fix the wafer, and the lower electrode feeding device can also be used to feed alternating current into the heating element to heat the wafer. However, the existing lower electrode feeding device has problems such as being difficult to disassemble and assemble, and poor consistency in machine assembly, resulting in low installation and maintenance efficiency. This application aims to solve at least one of the technical problems existing in the prior art, and proposes a lower electrode feeding device and a semiconductor processing equipment, which can solve the problems of difficult disassembly and assembly and poor consistency in machine assembly in the prior art, thereby improving the installation and maintenance efficiency. To achieve the purpose of this application, a lower electrode feeding device is provided, which is applied to semiconductor process equipment and includes a radio frequency feeding component. One end of the radio frequency feeding component is used for electrically connecting with a radio frequency source, and the other end is used for electrically connecting with a chuck assembly; the radio frequency feeding component includes at least two radio frequency feeding tubes and at least one radio frequency adapter tube; wherein, a first matching part is arranged between every two adjacent radio frequency feeding tubes, and the radio frequency adapter tube is provided with two second matching parts, and the two second matching parts are respectively matched with the first matching parts of the two adjacent radio frequency feeding tubes, so that the radio frequency adapter tube is detachably connected with the two adjacent radio frequency feeding tubes respectively and is electrically connected. In some embodiments, the detachable connection is a plug connection. One of the first matching part and the second matching part is a first ring part, and the other of the first matching part and the second matching part is a second ring part, and the first ring part is sleeved on the outer periphery of the second ring part. In some embodiments, a conductive elastic member is further arranged in a surrounding manner between the inner peripheral surface of the first ring part and the outer peripheral surface of the second ring part. In some embodiments, every two adjacent ones of the RF feeding tubes are straight tubes, and the axes thereof form a first included angle; the RF adapter tube is a bent tube, and its axis is bent to form the first included angle; one end of every two adjacent ones of the RF feeding tubes is provided with the first ring portion, and two of the second ring portions are respectively provided at two ends of the RF adapter tube. In some embodiments, the inner diameter of the RF feeding tube is smaller than the inner diameter of the first ring portion, and the outer diameter of the RF adapter tube is larger than the outer diameter of the second ring portion; and, the inner diameter of the RF feeding tube is equal to the inner diameter of the RF adapter tube, and the outer diameter of the RF feeding tube is equal to the outer diameter of the RF adapter tube. In some embodiments, a first arc transition portion is formed at the first included angle on the outer peripheral surface of the RF adapter tube. In some embodiments, the RF adapter tube includes two semi-circular split bodies, and the two semi-circular split bodies are butted against each other to form the bent tube. In some embodiments, the lower electrode feeding device further includes: a shielding assembly, sleeved on the outer periphery of the RF feeding assembly, for shielding the radiation generated by the RF, and a gap is formed between the inner periphery of the shielding assembly and the outer periphery of the RF feeding assembly. In some embodiments, the lower electrode feeding device further includes: an insulating dielectric member, disposed in the gap, for keeping a preset first withstand voltage safety distance between the shielding assembly and the RF feeding assembly. In some embodiments, the insulating dielectric member includes an insulating sleeve sleeved on the outer periphery of the RF feeding assembly; the shielding assembly is sleeved on the outer periphery of the insulating sleeve; or, the insulating dielectric member includes an insulating dielectric material filled in the gap. In some embodiments, the lower electrode feeding device further includes: an electrical feeding assembly, and the electrical feeding assembly passes through a hollow space jointly formed by the inner peripheral surfaces of all the RF feeding tubes and the RF adapter tubes, for feeding direct current and / or alternating current into the chuck assembly. In some embodiments, the electrical feeding assembly includes at least two electrical feeding members and at least one electrical adapter member, the number of the electrical feeding members is the same as the number of the RF feeding tubes, and each of the electrical feeding members is correspondingly disposed at the position where each of the RF feeding tubes is located; the number of the electrical adapter members is the same as the number of the RF adapter tubes, and each of the electrical adapter members is correspondingly disposed at the position where each of the RF adapter tubes is located; every two adjacent ones of the electrical feeding members are detachably connected through one of the electrical adapter members and are electrically conductive. In some embodiments, the electrical adapter includes a first sub-adapter, a second sub-adapter, a plurality of first adapter wires, and a plurality of second adapter wires. Among them, both the first sub-adapter and the second sub-adapter are made of insulating materials, are columnar, and their axes form a second included angle, and the second included angle is the same as the included angle between the axes of every two adjacent radio frequency feeding tubes; the first sub-adapter has a first mating surface, the second sub-adapter has a second mating surface, the first mating surface is in contact with the second mating surface, and both of them form a third included angle and a fourth included angle with the axes of the first sub-adapter and the second sub-adapter respectively, and the sum of the third included angle and the fourth included angle is equal to the second included angle; a plurality of the first adapter wires are arranged along the axis of the first sub-adapter and pass through the first sub-adapter, and the plurality of first adapter wires are spaced apart from each other; a plurality of the second adapter wires are arranged along the axis of the second sub-adapter and pass through the second sub-adapter, and the plurality of second adapter wires are spaced apart from each other; one end of each of the second adapter wires and one end of each of the first adapter wires are respectively located on the first mating surface and the second mating surface, and are in electrical contact or connected as a whole in a one-to-one correspondence. In some embodiments, one of the first mating surface and the second mating surface is provided with a first positioning convex portion; the other of the first mating surface and the second mating surface is provided with a first positioning concave portion; the first positioning convex portion and the first positioning concave portion are matched with each other. In some embodiments, the number of the first positioning convex portions is the same as the number of one of the first adapter wires and the second adapter wires, and each of the first positioning convex portions is arc-shaped and surrounds one of the first adapter wires and the second adapter wires in a one-to-one correspondence; each of the first positioning concave portions is arc-shaped and surrounds the other of the first adapter wires and the second adapter wires in a one-to-one correspondence. In some embodiments, both the first sub-adapter and the second sub-adapter have docking surfaces; each two adjacent electrical feeding members each include an insulating cylinder and a plurality of feeding wires. Among them, the first end surface of the insulating cylinder is in contact with the docking surface of the first sub-adapter or the second sub-adapter; a plurality of the feeding wires are arranged along the axis of the insulating cylinder and pass through the insulating cylinder, and the plurality of feeding wires are spaced apart from each other; one end of each of the feeding wires and the other end of each of the first adapter wires or the second adapter wires are respectively located on the first end surface and the docking surface, and are in electrical contact in a one-to-one correspondence. In some embodiments, one of the docking surface and the first end surface is provided with a second positioning convex portion; the other of the docking surface and the first end surface is provided with a second positioning concave portion; the second positioning convex portion and the second positioning concave portion are matched with each other. In some embodiments, the number of the second positioning protrusions is the same as the number of the feeding wires; each of the second positioning protrusions is annular and correspondingly surrounds each of the feeding wires; each of the second positioning recesses is annular and correspondingly surrounds the first adapter wire or the second adapter wire; or, each of the second positioning protrusions is annular and correspondingly surrounds each of the first adapter wires or the second adapter wires; each of the second positioning recesses is annular and correspondingly surrounds each of the feeding wires. In some embodiments, connection recesses are provided at the other ends of each of the first adapter wires and each of the second adapter wires; connection protrusions are provided at one ends of each of the feeding wires, the connection protrusions are matched with the connection recesses and are in electrical contact; or, connection protrusions are provided at the other ends of each of the first adapter wires and each of the second adapter wires; connection recesses are provided at one ends of each of the feeding wires, the connection protrusions are matched with the connection recesses and are in electrical contact. In some embodiments, the connection protrusion includes a conductive extension portion extending from the first end face or the butt joint face, and a conductive elastic portion detachably sleeved on the conductive extension portion, the conductive extension portion and the conductive elastic portion are both located in the connection recess, and the conductive elastic portion is in a compressed state. In some embodiments, counterbores are provided at positions corresponding to the locations of each of the feeding wires on the second end face of the insulating cylinder, and the other ends of each of the feeding wires are located in the counterbores. As another technical solution, the present application further provides a semiconductor processing device, including a process chamber and a chuck assembly disposed in the process chamber, and further including the above-mentioned lower electrode feeding device provided by the present application. In some embodiments, the chuck assembly includes a chuck body for carrying a wafer, an interface plate disposed below the chuck body, and an annular insulating member connected between the chuck body and the interface plate, an inner space is formed by the lower surface of the chuck body, the upper surface of the interface plate and the inner peripheral surface of the annular insulating member; in the RF feeding assembly, one end of the RF feeding tube closest to the chuck assembly extends into the inner space and is electrically connected to the chuck body. In some embodiments, a circuit board assembly is further disposed at the bottom of the chuck body and within the internal space; the RF feeding assembly further includes: an RF feeding disk, which is disposed within the internal space, at the bottom of the circuit board assembly, and an annular connection portion is provided at the outer peripheral edge of the RF feeding disk, the annular connection portion is disposed around the outer periphery of the circuit board assembly at intervals and is connected to the chuck body; the RF feeding disk is provided with a central hole, and one end of the RF feeding tube closest to the chuck assembly is connected to the inner peripheral edge of the RF feeding disk and is electrically connected. In some embodiments, the lower electrode feeding device further includes an electrical feeding assembly, and the electrical feeding assembly passes through a hollow space jointly formed by the inner peripheral surfaces of all the RF feeding tubes and the RF adapter tubes; the electrical feeding assembly passes through the central hole and is electrically connected to the circuit board assembly, and is used to feed direct current and / or alternating current into the chuck body through the circuit board assembly. In some embodiments, a preset second withstand voltage safety distance is provided between the lower surface of the RF feeding disk and the upper surface of the interface disk. The present application has the following beneficial effects: The lower electrode feeding device provided by the present application adopts a split-type RF feeding assembly, that is, at least two RF feeding tubes and at least one RF adapter tube, and by using the first mating portions provided between every two adjacent RF feeding tubes to cooperate with the two second mating portions provided on the RF adapter tube respectively, the RF adapter tube can be detachably connected to the adjacent two RF feeding tubes respectively and is electrically connected. This detachable connection method can facilitate the disassembly and assembly of the RF feeding tubes, thereby improving the installation and maintenance efficiency, and this split assembly method can better ensure the assembly consistency of each machine tool, thereby improving the process consistency. On this basis, since the split-type RF feeding assembly is easier to disassemble and assemble, a solid medium can be selected to be disposed in the gap formed between the inner periphery of the shielding assembly and the outer periphery of the RF feeding assembly, and there is no problem that the solid medium is not easy to disassemble. Compared with the prior art in which an air medium has to be used due to the difficulty of disassembling and assembling the lower electrode feeding device, using a solid medium can design different first withstand voltage safety distances, so as to meet different requirements for the space where the lower electrode is located. For example, by using a solid medium with a dielectric constant greater than that of the air medium, the first withstand voltage safety distance can be reduced, thereby reducing the occupied space of the lower electrode feeding device, and thus there can be more space for optimizing other lower electrode components. The semiconductor processing equipment provided by this application, by adopting the above-mentioned lower electrode feeding device provided by this application, can not only disassemble and assemble the RF feeding tube more conveniently, thereby improving the installation and maintenance efficiency, but also this split assembly method can better ensure the assembly consistency of each machine tool, thereby improving the process consistency. Moreover, a solid medium can be selected without the problem of difficult disassembly and assembly of the solid medium, thereby reducing the occupied space of the lower electrode feeding device, and thus having more space for optimizing other lower electrode components. To enable those skilled in the art to better understand the technical solutions of this application, the lower electrode feeding device and semiconductor processing equipment provided by this application will be described in detail below with reference to the accompanying drawings. FIG. 1 is a cross-sectional view of a lower electrode feeding device in the related art. As shown in FIG. 1, the lower electrode feeding device includes an integrated RF connection column, which is divided into a straight section 021, a bent section 022, and a connection section 023. Among them, the RF current provided by the RF power supply sequentially passes through the straight section 021, the bent section 022, and the connection section 023, extends from the outside of the chamber to the inside of the chamber, and is fed into the center position of the chuck body 01 in the chuck assembly. And, as shown in FIGS. 1 and 2, taking the straight section 021 of the RF connection column as an example, a hollow space is provided therein, and a plurality of wires 03 spaced from each other are passed through the hollow space, and a plurality of insulating fixing members 04 are spaced in the hollow space for fixing the positions of the plurality of wires 03 in the hollow space. In addition, glue is poured into the hollow space to form an insulating filling material 05. Among the plurality of wires 03, two DC wires 031 are used to feed DC power into the electrostatic adsorption electrode in the chuck assembly; every two of the remaining wires 032 are used to feed AC power into the heating element of one of the heating zones in the chuck assembly. It should be noted that only one wire 03 and a part of the insulating fixing members 04 are schematically shown in FIG. 1. As shown in FIG. 1, the lower electrode feeding device further includes a shielding sleeve, which includes a straight section shielding sleeve 061 and a bent section shielding sleeve 062, which are respectively sleeved on the straight section 021 and the bent section 022 of the RF connection column for shielding the radiation generated by the RF connection column. And, there is a gap 063 between the straight section shielding sleeve 061 and the bent section shielding sleeve 062 and the straight section 021 and the bent section 022 of the RF connection column respectively, and a plurality of insulating connectors 07 are provided in the gap 063 for fixing the RF connection column to prevent the straight section 021 and the bent section 022 of the RF connection column from contacting the straight section shielding sleeve 061 and the bent section shielding sleeve 062. The inventors of the present application have found through research that the integrated structure of the RF connection posts in the above lower electrode feeding device causes problems with the disassembly and assembly of the RF connection posts, resulting in low installation and maintenance efficiency, and poor consistency in machine assembly. Moreover, due to the difficulty of disassembling and assembling the RF connection posts in the related art, if a solid medium is used in the above interval 063, there will be problems with disassembly and assembly, and air medium has to be used. The dielectric constant of the air medium is 1, which leads to a large required withstand voltage safety distance between the straight section shielding sleeve 061 and the bent section shielding sleeve 062 and the straight section 021 and the bent section 022 of the RF connection post respectively, resulting in a large occupied space of the lower electrode feeding device, and thus bringing great difficulty to optimizing other lower electrode components. To solve the problems of difficult disassembly and assembly of the above lower electrode feeding device and poor consistency in machine assembly, please refer to FIGS. 3 and 4 together. An embodiment of the present application provides a lower electrode feeding device, which is applied to semiconductor processing equipment. It includes an RF feeding component 3. One end of the RF feeding component 3 is located outside the processing chamber 1 of the semiconductor processing equipment and is used for electrically connecting with an RF source (not shown in the figure). The other end of the RF feeding component 3 is located inside the processing chamber 1 and is used for electrically connecting with the chuck component 2. The RF feeding component 3 is used to feed the RF current provided by the RF source into the chuck component 2. The above RF source includes, for example, an RF power supply and a matcher. The RF power supply provides RF current to the RF feeding component 3 through the matcher, and the RF feeding component 3 transports and feeds it into the chuck component 2. For example, one end of the RF feeding component 3 is located outside the side wall 11 of the processing chamber 1 and is electrically connected to the RF source, and the other end of the RF feeding component 3 is electrically connected to the bottom of the chuck component 2. The above RF feeding component 3 includes at least two RF feeding tubes and at least one RF adapter tube 33. Each adjacent two RF feeding tubes are detachably connected through an RF adapter tube 33 and are electrically connected. Specifically, as shown in FIGS. 4 to 6, each adjacent two RF feeding tubes (for example, the first RF feeding tube 31 and the second RF feeding tube 32) are provided with a first mating portion 321. The RF adapter tube 33 is provided with two second mating portions 331. The two second mating portions 331 are respectively matched with the first mating portions 321 of the adjacent two RF feeding tubes, so that the RF adapter tube 33 is detachably connected to the adjacent two RF feeding tubes (for example, the first RF feeding tube 31 and the second RF feeding tube 32) and is electrically connected. In practical applications, the matching manner between the first mating portion 321 and the second mating portion 331 may include plugging, clamping, mortise and tenon connection, etc., to realize the detachable connection between the RF feeding tube and the RF adapter tube 33 and the electrical connection. For example, there are two RF feed-in tubes, namely a first RF feed-in tube 31 and a second RF feed-in tube 32, both of which are straight tubes, and their axes form a first angle, which is, for example, 90°; the RF adapter tube 33 is a bent tube, and its axis is bent to form the above-mentioned first angle. In this case, the axis of the first RF feed-in tube 31 is horizontally arranged, and the axis of the second RF feed-in tube 32 is vertically arranged. The first RF feed-in tube 31 penetrates through the side wall 11 of the process chamber 1, and one end is electrically connected to the RF source, and the other end is connected to one end of the RF adapter tube 33 and is electrically conductive; one end of the second RF feed-in tube 32 is connected to the other end of the RF adapter tube 33 and is electrically conductive, and the other end of the second RF feed-in tube 32 is electrically connected to the bottom of the chuck assembly 2. It should be noted that in practical applications, the above-mentioned first angle can also be any other angle, and the angles at which the first RF feed-in tube 31 and the second RF feed-in tube 32 are inclined relative to the horizontal plane can also be any angles. In some embodiments of the present application, the detachable connection between the RF feed-in tube and the RF adapter tube 33 is a plug connection. As shown in FIGS. 4 to 6, one of the above-mentioned first mating portion 321 and second mating portion 331 is a first ring portion, and the other of the first mating portion 321 and second mating portion 331 is a second ring portion. The first ring portion is sleeved on the outer periphery of the second ring portion, that is, the two are nested with each other. Furthermore, in some embodiments of the present application, as shown in FIG. 4, a conductive elastic member 9 is further disposed around between the inner peripheral surface of the first ring portion and the outer peripheral surface of the second ring portion, which is used to enhance the tightness of the cooperation between the first ring portion and the second ring portion and the reliability of RF conduction. The above-mentioned conductive elastic member 9 is, for example, a strip-shaped flexible conductive member. The flexible conductive member is wound around the outer periphery of the second ring portion, and the inner diameter of the inner peripheral surface of the first ring portion is the same as or substantially the same as or has a small gap with the outer diameter of the outer peripheral surface of the second ring portion, so that when the first ring portion is installed, the flexible conductive member can be clamped between the first ring portion and the second ring portion, thereby further enhancing the tightness of the cooperation between the first ring portion and the second ring portion and the reliability of RF conduction. Taking the case where there are two RF feed-in tubes and their axes form a first angle, which is, for example, 90°, and the RF adapter tube 33 is a bent tube as an example, first ring portions are provided at one ends of both the first RF feed-in tube 31 and the second RF feed-in tube 32, and two second ring portions are respectively provided at both ends of the RF adapter tube 33. In some embodiments of the present application, the inner diameter of the RF feed-in tube is smaller than the inner diameter of the first ring portion, and the outer diameter of the RF adapter tube 33 is larger than the outer diameter of the second ring portion; and, the inner diameter of the RF feed-in tube is equal to the inner diameter of the RF adapter tube 33, and the outer diameter of the RF feed-in tube is equal to the outer diameter of the RF adapter tube 33. In this way, the outer diameter of the RF feed-in assembly 3 can be equal everywhere, and the inner diameter can be equal everywhere, so that it is more convenient to install other lower electrode components inside and outside the RF feed-in assembly 3. In some embodiments of the present application, in order to reduce the electric field strength near the first angle on the outer peripheral surface of the RF adapter tube 33 and avoid the risk of RF arcing, as shown in FIGS. 5 and 6, a first arc transition portion 332 is formed on the outer peripheral surface of the RF adapter tube 33 at the first angle. The specific structure of the first arc transition portion 332 is not limited to the structure shown in FIG. 6. In practical applications, the first arc transition portion 332 can also adopt any other structure as long as it can achieve the arc transition at the first angle of the outer peripheral surface of the RF adapter tube 33. In some embodiments of the present application, as shown in FIGS. 5 and 6, the RF adapter tube 33 includes two semi-circular split bodies, and the two semi-circular split bodies are butt-jointed to form a bent tube. The structures of the two semi-circular split bodies can be the same, for example. After butt-jointing, the bent tube is a complete ring in the circumferential direction. When the electric feeding component 6 (which will be described in detail later) is installed inside the RF adapter assembly, by adopting the split-type RF adapter tube 33, the convenience of disassembly and assembly can be further improved. In some embodiments, the two semi-circular split bodies can be detachably connected by means such as plugging, clamping, tenon-mortise connection, etc. In some embodiments of the present application, the lower electrode feeding device further includes a shielding component 5, which is sleeved on the outer periphery of the RF feeding component 3 and is used to shield the radiation generated by the RF. The shielding component 5 can be made of a metal material, for example. Taking two RF feeding tubes as an example, the shielding component 5 is sleeved on the outer peripheries of the first RF feeding tube 31, the second RF feeding tube 32, and the RF adapter tube 33. In some embodiments, the shielding component 5 has a straight tube section coaxially arranged with the first RF feeding tube 31 and the second RF feeding tube 32 respectively, and a bent tube section coaxially arranged with the RF adapter tube 33. In some embodiments of the present application, the shielding component 5 can be an integral structure or a split structure, and is fixedly connected by means such as welding. One end of the shielding component 5 penetrates through the side wall 11 of the process chamber 1, and the other end is located at the bottom of the chuck assembly 2 and is fixedly connected to the bottom of the interface plate 23 of the chuck assembly 2, for example. A gap is formed between the inner circumference of the shielding component 5 and the outer circumference of the RF feeding component 3, and the medium in this gap can be air. However, the dielectric constant of air is 1, which results in a relatively large withstand voltage safety distance required between the inner circumference of the shielding component 5 and the outer circumference of the RF feeding component 3, thus causing a relatively large occupied space for the lower electrode feeding device. To solve this problem, in some embodiments of the present application, the lower electrode feeding device further includes an insulating dielectric member 4, which is disposed in this gap and is used to maintain a preset first withstand voltage safety distance between the shielding component 5 and the RF feeding component 3, that is, the radial thickness of the insulating dielectric member 4. In some embodiments, the above-mentioned insulating dielectric member 4 includes an insulating sleeve sleeved on the outer circumference of the RF feeding component 3; the shielding component 5 is sleeved on the outer circumference of the insulating sleeve; alternatively, the insulating dielectric member 4 includes an insulating dielectric material filled in the gap. The above-mentioned insulating sleeve or the insulating dielectric material filled in the gap can make the medium in the gap formed between the inner circumference of the shielding component 5 and the outer circumference of the RF feeding component 3 a solid medium. Compared with using air as the medium in the prior art, an insulating dielectric member 4 with a corresponding dielectric constant can be selected according to specific needs to design different first withstand voltage safety distances, so as to meet different requirements for the space where the lower electrode is located. For example, by using a dielectric constant greater than that of the air medium, such as the dielectric constant of the insulating dielectric member 4 being greater than 1, the first withstand voltage safety distance can be reduced, thereby reducing the occupied space of the lower electrode feeding device, and further having more space for optimizing other lower electrode components. Materials of the insulating dielectric member 4 with a dielectric constant greater than 1 include resins such as polytetrafluoroethylene (PTFE). Since the medium in the gap formed between the inner circumference of the shielding component 5 and the outer circumference of the RF feeding component 3 is a solid medium, it will cause the RF feeding component 3 with a bent tubular RF adapter tube 33 to be not easily disassembled and assembled, thus bringing difficulties to the maintenance of the RF feeding component 3. To solve this problem, on the basis of using the insulating dielectric member 4, a split-type RF feeding component 3 is used in combination, that is, each adjacent two RF feeding tubes (such as the first RF feeding tube 31 and the second RF feeding tube 32) are detachably connected through an RF adapter tube 33 and are electrically conductive, and the RF feeding tubes can be more conveniently disassembled and assembled. Taking two RF feeding tubes as an example, the segmented disassembly and assembly of the RF feeding tubes can be achieved by respectively taking out or putting in the first RF feeding tube 31 and the second RF feeding tube 32, thereby improving the installation and maintenance efficiency, and this split assembly method can better ensure the assembly consistency of each machine platform, and further improve the process consistency. The following calculation formula for characteristic impedance is: Wherein, is the characteristic impedance, is the dielectric constant, is the outer diameter of the RF adapter tube 33, is the inner diameter of the shielding component 5. The calculation formula for the input power of the RF feeding component 3 is: ; where P is the input power; U is the voltage value between the shielding component 5 and the RF feeding component 3; is the characteristic impedance. Taking the case where in the RF feeding component 3, the RF feeding tube, the RF adapter tube 33, and the shielding component 5 are all tubular, and when using an air medium with a dielectric constant of 1, that is, the medium in the gap formed between the inner circumference of the shielding component 5 and the outer circumference of the RF feeding component 3 is an air medium, if the outer diameter are all 20 mm, the characteristic impedance is 50 Ω, and P is 8 KW, then according to the calculation formula for the input power of the RF feeding component 3, the voltage value U between the shielding component 5 and the RF feeding component 3 can be calculated to be 633 V. In this case, if the withstand voltage value is required to be 8 KV, according to engineering experience, the breakdown voltage of the air medium is 150 V / mm, then according to the above calculation formula for the characteristic impedance, the radial distance between the inner circumference of the shielding component 5 and the outer circumference of the RF feeding component 3 can be calculated to be greater than or equal to 53 mm, which can meet the requirement of the withstand voltage safety distance. In this case, it is required that the inner diameter b of the shielding component 5 be greater than 126 mm, which results in a relatively large occupied space for the lower electrode feeding device, thus bringing great difficulty to optimizing other lower electrode components. In contrast, when using a resin medium such as polytetrafluoroethylene with a dielectric constant greater than 1 (dielectric constant is 1.9), if the outer diameter are all 20 mm and the first withstand voltage safety distance is 5 mm, then it is required that the inner diameter b of the shielding component 5 be greater than 30 mm to meet the requirement of the withstand voltage safety distance. For example, a shielding component 5 with an inner diameter of 48 mm, a wall thickness of 4 mm, and an outer diameter of 56 mm can be used. Compared with the above case of using an air medium with a dielectric constant of 1, the outer diameter of the shielding component 5 is greatly reduced, which can effectively reduce the occupied space of the lower electrode feeding device, and thus there can be more space for optimizing other lower electrode components. In some embodiments of the present application, as shown in FIGS. 3 and 4, the lower electrode feeding device further includes an electrical feeding component 6. The electrical feeding component 6 is disposed through a hollow space jointly formed by the inner peripheral surfaces of all the RF feeding tubes (such as the first RF feeding tube 31 and the second RF feeding tube 32) and the RF adapter tube 33. The electrical feeding component 6 can reach the chuck assembly 2 through this internal space. In some embodiments, the electrical feeding component 6 is coaxially disposed with all the RF feeding tubes and the RF adapter tube 33. Specifically, one end of the electrical feeding component 6 is located outside the process chamber 1 of the semiconductor processing equipment, for example, outside the side wall 11 of the process chamber 1, and is electrically connected to a DC power source and / or an AC power source (not shown in the figure). The other end of the electrical feeding component 6 is electrically connected to the chuck assembly 2, and is used to feed DC power and / or AC power into the chuck assembly 2. The electrical feeding component 6 can be used to feed DC power into an electrostatic adsorption electrode (not shown in the figure) in the chuck assembly 2 to achieve adsorption and fixation of the wafer; and / or, the electrical feeding component 6 can be used to feed AC power into a heating element (not shown in the figure) in the chuck assembly 2 to achieve heating of the wafer by the heating element. In some embodiments of the present application, in order to improve the disassembly and assembly convenience of the electrical feed-in component 6 and improve the maintenance efficiency, as shown in FIGS. 3 and 4, the electrical feed-in component 6 includes at least two electrical feed-in parts and at least one electrical adapter 63. The number of electrical feed-in parts is the same as the number of RF feed-in tubes, and each electrical feed-in part is correspondingly arranged at the position where each RF feed-in tube is located; the number of electrical adapters 63 is the same as the number of RF adapter tubes 33, and each electrical adapter 63 is correspondingly arranged at the position where each RF adapter tube 33 is located; every two adjacent electrical feed-in parts are detachably connected through an electrical adapter 63 and are electrically connected. By detachably connecting the electrical feed-in parts and the electrical adapter 63, the electrical feed-in parts can be disassembled and assembled more conveniently, and the assembly consistency of each machine can be better ensured, thereby improving the process consistency. Taking two electrical feed-in parts as an example, as shown in FIG. 4, the two electrical feed-in parts are respectively a first electrical feed-in part 61 and a second electrical feed-in part 62. Both are columnar, and their axes form a second included angle, which is the same as the above-mentioned first included angle; the electrical adapter 63 is bent columnar, and its axis is bent to form the above-mentioned second included angle. In this case, the axis of the first electrical feed-in part 61 is horizontally arranged, and the axis of the second electrical feed-in part 62 is vertically arranged. The first electrical feed-in part 61 is inserted into the first RF feed-in tube 31, and one end is electrically connected to a DC power supply and / or an AC power supply, and the other end is detachably connected to one end of the electrical adapter 63 and is electrically connected; the second electrical feed-in part 62 is inserted into the second RF feed-in tube 32, and one end of the second electrical feed-in part 62 is detachably connected to the other end of the electrical adapter 63 and is electrically connected; the other end of the second electrical feed-in part 62 is electrically connected to the chuck assembly 2. The segmented disassembly and assembly of the electrical feed-in parts can be realized by respectively taking out or putting in the first electrical feed-in part 61 and the second electrical feed-in part 62, so that the installation and maintenance efficiency can be improved, and this split assembly method can better ensure the assembly consistency of each machine, thereby improving the process consistency. In addition, by combining the use of a split RF feed-in component 3, the RF feed-in tube and the electrical feed-in part can be separately assembled to form an independent feed-in part split structure, and the RF adapter tube 33 and the RF adapter tube 33 can be separately assembled to form an independent adapter part split structure, and then the feed-in part split structure and the adapter part split structure are assembled into a whole, so that the assembly consistency of each split structure can be maintained, thereby improving the overall assembly consistency of the machine and improving the chamber identity. In some embodiments of the present application, as shown in FIGS. 4, 7 to 9, the above-mentioned electrical adapter 63 includes a first sub-adapter 631, a second sub-adapter 632, a plurality of first adapter wires 661 and a plurality of second adapter wires 662. Among them, both the first sub-adapter 631 and the second sub-adapter 632 are made of insulating materials such as resin, and are columnar, and the axes form the above-mentioned second angle; the first sub-adapter 631 has a first mating surface 634, and the second sub-adapter 632 has a second mating surface 635. The first mating surface 634 is in contact with the second mating surface 635, and both form a third angle and a fourth angle with the axes of the first sub-adapter 631 and the second sub-adapter 632 respectively. The sum of the third angle and the fourth angle is equal to the above-mentioned second angle. For example, both the third angle and the fourth angle are 45°. Of course, the embodiments of the present application are not limited to this. In practical applications, the third angle and the fourth angle may not be equal, as long as the sum of the two is equal to the above-mentioned second angle. Taking the first sub-adapter 631 being horizontally arranged and the second sub-adapter 632 being vertically arranged as an example, both the first mating surface 634 and the second mating surface 635 are inclined 45° relative to the horizontal plane. A plurality of first adapter wires 661 are disposed through the first sub-adapter 631 along the axis of the first sub-adapter 631, and the plurality of first adapter wires 661 are spaced apart from each other; among the plurality of first adapter wires 661, two wires are DC wires for transmitting direct current, for example, disposed at a central position close to the axis of the first sub-adapter 631; every two of the remaining wires are AC wires for transmitting alternating current, for example, disposed around the two DC wires in a surrounding manner. A plurality of second adapter wires 662 are disposed through the second sub-adapter 632 along the axis of the second sub-adapter 632, and the plurality of second adapter wires 662 are spaced apart from each other; one end of each second adapter wire 662 and one end of each first adapter wire 661 are respectively located on the first mating surface 634 and the second mating surface 635, and are in electrical contact or connected as a whole in a one-to-one correspondence. Corresponding to the plurality of first adapter wires 661 one by one, two wires among the plurality of second adapter wires 662 are DC wires for transmitting direct current, for example, disposed at a central position close to the axis of the second sub-adapter 632; every two of the remaining wires are AC wires for transmitting alternating current, for example, disposed around the two DC wires in a surrounding manner. The plurality of first adapter wires 661 and the plurality of second adapter wires 662 are all copper wires, and their diameters are, for example, 2-3 mm, and they have relatively high rigidity. These adapter wires have different lengths due to being distributed at different positions on the mating surfaces of the sub-adapters. Taking the example that one end of each second adapter wire 662 is connected as a whole with one end of each first adapter wire 661 in a one-to-one correspondence, during assembly, first, the integrated second adapter wires 662 and first adapter wires 661 are installed in corresponding installation holes in the second sub-adapter 632. At this time, as shown in FIG. 9, the first adapter wires 661 extend out of the second sub-adapter 632 from the second mating surface 635, and then the first sub-adapter 631 is moved along the direction of each first adapter wire 661 towards the second sub-adapter 632, so that each first adapter wire 661 passes through the corresponding installation hole in the first sub-adapter 631 until the first mating surface 634 is in contact with the second mating surface 635. In some embodiments, in order to improve the fitting tightness between the first mating surface 634 and the second mating surface 635, a colloid (not shown in the figure) is provided on at least one of the first mating surface 634 and the second mating surface 635. The material of the colloid is, for example, the same as the materials of the first sub-adapter 631 and the second sub-adapter 632, for example, both are resins, so as to enable the first sub-adapter 631 and the second sub-adapter 632 to be approximately continuous at the mating surface and avoid generating gaps. In some embodiments of the present application, in order to achieve the positioning of the first mating surface 634 and the second mating surface 635 and ensure that one end of each second adapter wire 662 is in electrical contact with one end of each first adapter wire 661 in a one-to-one correspondence, as shown in FIGS. 8 and 9, one of the first mating surface 634 and the second mating surface 635 is provided with a first positioning convex portion 635a; the other of the first mating surface 634 and the second mating surface 635 is provided with a first positioning concave portion 634a; the first positioning convex portion 635a and the first positioning concave portion 634a are matched with each other. Further, in some embodiments, in order to improve the withstand voltage performance of the adapter wires at the insertion part and ensure the isolation between the adapter wires, as shown in FIG. 9, the number of the first positioning convex portions 635a is the same as the number of one of the first adapter wires 661 and the second adapter wires 662, and each first positioning convex portion 635a is in an arc shape and surrounds one of the first adapter wires 661 and the second adapter wires 662 in a one-to-one correspondence; each first positioning concave portion 634a is in an arc shape and surrounds the other of the first adapter wires 661 and the second adapter wires 662 in a one-to-one correspondence. Specifically, the first positioning convex portion 635a is, for example, a semi-circular ring-shaped protrusion, and the shape of the first positioning concave portion 634a is adapted to the shape of the first positioning convex portion 635a. In some embodiments of the present application, both the first sub-adapter 631 and the second sub-adapter 632 have a docking surface 633; as shown in FIG. 4, each adjacent two power feeding members (for example, the first power feeding member 61 and the second power feeding member 62) each include an insulating column and a plurality of feeding wires 64. Among them, the insulating column is made of an insulating material such as resin, as shown in FIGS. 4 and 10, the first end surface 621 of the insulating column is attached to the docking surface 633 of the first sub-adapter 631 or the second sub-adapter 632; the plurality of feeding wires 64 are arranged in the insulating column along the axis of the insulating column, and the plurality of feeding wires 64 are spaced apart from each other; one end of each feeding wire 64 and the other end of each first adapter wire 661 or second adapter wire 662 are respectively located on the first end surface 621 and the docking surface 633, and are in electrical contact in a one-to-one correspondence. Corresponding to the plurality of first adapter wires 661 or second adapter wires 662 in a one-to-one correspondence, two of the plurality of feeding wires 64 are DC wires for transmitting direct current, for example, arranged at a central position close to the axis of the insulating column; every two of the remaining wires are AC wires for transmitting alternating current, for example, arranged around the two DC wires. Taking two electrical feed-in components as an example, the docking surface 633 of the first sub-adapter 631 is attached to the first end surface 621 of the insulating cylinder of the first electrical feed-in component 61, and the docking surface 633 of the second sub-adapter 632 is attached to the first end surface 621 of the insulating cylinder of the second electrical feed-in component 62. Each first transfer wire 661 in the first sub-adapter 631 is in electrical contact with each feed-in wire 64 of the first electrical feed-in component 61 in a one-to-one correspondence; each second transfer wire 662 in the second sub-adapter 632 is in electrical contact with each feed-in wire 64 of the second electrical feed-in component 62 in a one-to-one correspondence. In some embodiments of the present application, in order to achieve the positioning of the insulating cylinder with the first sub-adapter 631 and the second sub-adapter 632, as shown in FIGS. 4 and 10, one of the docking surface 633 and the first end surface 621 is provided with a second positioning protrusion 621a; the other of the docking surface 633 and the first end surface 621 is provided with a second positioning recess 631a; the second positioning protrusion 621a cooperates with the second positioning recess 631a. There can be various specific structures of the second positioning protrusion 621a and the second positioning recess 631a. For example, as shown in FIG. 10, the number of the second positioning protrusions 621a is the same as the number of the feed-in wires 64; and each second positioning protrusion 621a is annular and surrounds each feed-in wire 64 in a one-to-one correspondence; each second positioning recess 631a is annular and surrounds the first transfer wire 661 or the second transfer wire 662 in a one-to-one correspondence. By using the annular second positioning protrusion 621a to cooperate with the second positioning recess 631a, the corresponding feed-in wires 64 can be made non-exposed, and the multiple feed-in wires 64 can be completely isolated from each other through the annular second positioning protrusion 621a. In addition, the annular second positioning protrusion 621a can also increase the creepage distance of the corresponding feed-in wire 64, thereby enhancing the stability of the overall cooperation and the safety of each feed-in wire 64, and ultimately improving the overall withstand voltage performance. Of course, the embodiments of the present application are not limited to this. In practical applications, each second positioning protrusion 621a can also be annular and surround each first transfer wire 661 or the second transfer wire 662 in a one-to-one correspondence; each second positioning recess 631a is annular and surrounds each feed-in wire 64 in a one-to-one correspondence. In addition, in some embodiments, the height of the second positioning protrusion 621a is, for example, 2 mm - 3 mm. In some embodiments, in order to facilitate the insertion of the second positioning protrusion 621a into the second positioning recess 631a, the second positioning protrusion 621a is, for example, a frustum of a cone, and the second positioning recess 631a is, for example, a frustum-shaped hole adapted to the shape of the frustum of a cone. In some embodiments of the present application, as shown in FIG. 8, at the other ends of each of the first adapter wires 661 and each of the second adapter wires 662 (i.e., the ends away from the first mating surface 634 and the second mating surface 635), connection recesses 661a are provided; at one end of each of the feeding wires 64, connection protrusions are provided, and the connection protrusions are engaged with the connection recesses 661a and are in electrical contact. In this way, the mutual insertion of the feeding wires 64 and the first adapter wires 661 or the second adapter wires 662 can be realized, thereby improving the withstand voltage performance of the feeding wires 64 and the first adapter wires 661 or the second adapter wires 662 at the insertion part. Of course, the embodiments of the present application are not limited thereto. In practical applications, connection protrusions may also be provided at the other ends of each of the first adapter wires 661 and each of the second adapter wires 662; at one end of each of the feeding wires 64, connection recesses 661a are provided, the connection protrusions are engaged with the connection recesses 661a and are in electrical contact. Additionally, in some embodiments, the depth of the connection recess 661a is 5 mm - 15 mm, for example, 10 mm. In some embodiments of the present application, as shown in FIG. 10, the above-mentioned connection protrusion includes a conductive extension part 641 extending from the first end face 621 or the docking face 633, and a conductive elastic part 67 detachably sleeved on the conductive extension part 641. The conductive extension part 641 and the conductive elastic part 67 are both located in the connection recess 661a, and the conductive elastic part 67 is in a compressed state. By means of the elastic force generated by the conductive elastic part 67 expanding radially outwards, the contact area and tightness between the conductive extension part 641 and the connection recess 661a can be improved, thereby ensuring the cooperation and electrical contact stability between the two. The structure of the above-mentioned conductive elastic part 67 can be various. For example, the conductive elastic part 67 is a cylindrical structure with a slit on its outer periphery. The outer diameter of the cylindrical structure decreases along its axial direction and from its middle position towards both ends. During installation, the conductive elastic part 67 can be expanded through the slit. When the conductive elastic part 67 is not subjected to an external force, it can recover to a cylindrical structure under its own elastic force, thereby being able to cover the outer periphery of the conductive extension part 641. Additionally, the maximum outer diameter of the cylindrical structure is greater than the inner diameter of the above-mentioned connection recess 661a, so that the conductive elastic part 67 entering the connection recess 661a is in a compressed state, thereby generating an elastic force expanding radially outwards. In some embodiments of the present application, as shown in FIG. 11, at positions corresponding to the locations of each of the feeding wires 64 on the second end face 622 (away from the above-mentioned first end face 621) of the insulating cylinder, counterbores 623 are provided, and the other ends of each of the feeding wires 64 are located in the counterbores 623. In this way, the elastic terminals for voltage input and output of a DC power supply or an AC power supply can be embedded in the counterbores 623 and are electrically connected to the feeding wires 64 in the counterbores 623, thereby playing a role in protecting the wire connection position. In summary, the lower electrode feeding device provided by the embodiments of the present application adopts a split-type RF feeding component, that is, at least two RF feeding tubes and at least one RF adapter tube. By using the first mating parts provided on every two adjacent RF feeding tubes to respectively cooperate with the two second mating parts provided on the RF adapter tube, the RF adapter tube can be detachably connected to the two adjacent RF feeding tubes and conduct electricity. This detachable connection method can facilitate the disassembly and assembly of the RF feeding tubes, thereby improving the installation and maintenance efficiency. On this basis, since the split-type RF feeding component is easier to disassemble and assemble, a solid medium can be selected to be disposed in the gap formed between the inner periphery of the shielding component and the outer periphery of the RF feeding component, and there is no problem that the solid medium is not easy to disassemble. Compared with the prior art in which an air medium has to be used due to the difficulty of disassembling and assembling the lower electrode feeding device, using a solid medium can design different first withstand voltage safety distances, thereby meeting different requirements for the space where the lower electrode is located. For example, by using a solid medium with a dielectric constant greater than that of the air medium, the first withstand voltage safety distance can be reduced, thereby reducing the occupied space of the lower electrode feeding device, and further having more space for optimizing other lower electrode components. As another technical solution, as shown in FIG. 3, an embodiment of the present application further provides a semiconductor processing apparatus, including a process chamber 1, a chuck assembly 2 disposed in the process chamber 1, and the above-mentioned lower electrode feeding device provided by the embodiments of the present application. In some embodiments of the present application, as shown in FIG. 3, the chuck assembly 2 includes a chuck body 21 for carrying a wafer, an interface plate 23 disposed below the chuck body 21, and an annular insulating member 22 connected between the chuck body 21 and the interface plate 23. The lower surface of the chuck body 21, the upper surface of the interface plate 23, and the inner peripheral surface of the annular insulating member 22 form an internal space 25. In the RF feeding component 3, one end of the RF feeding tube closest to the chuck assembly 2 (such as the second RF feeding tube 32 mentioned above) extends into the internal space 25 and is electrically connected to the chuck body 21. Further, in some embodiments, a circuit board assembly 24 is further disposed at the bottom of the chuck body 21 and located in the internal space 25. The circuit board assembly 24 is used to transfer each feeding wire 64 in the feeding component 6 to the corresponding feeding end in the chuck body 21 through its own circuit, so as to feed direct current into the electrostatic adsorption electrode in the chuck body 21 to realize the adsorption and fixation of the wafer; and / or feed alternating current into the heating element in the chuck body 21 to realize the heating of the wafer by the heating element. In some embodiments of the present application, in order to feed the radio frequency current from the edge of the chuck body 21, as shown in FIGS. 3 and 4, the radio frequency feeding assembly 3 further includes: a radio frequency feeding disk 37, which is disposed in the internal space 25, and is located at the bottom of the circuit board assembly 24. An annular connection portion 371 is provided on the outer peripheral edge of the radio frequency feeding disk 37. The annular connection portion 371 is disposed around the outer periphery of the circuit board assembly 24 at intervals and is connected to the chuck body 21. In some embodiments of the present application, the radio frequency feeding disk 37 is provided with a central hole. One end of the radio frequency feeding tube (such as the second radio frequency feeding tube 32) closest to the chuck assembly 2 is connected to the inner peripheral edge (i.e., the hole wall of the central hole) of the radio frequency feeding disk 37 and is electrically conductive. The electrical feeding assembly 6 (such as the second electrical feeding member 62) sequentially passes through the interface disk 23 and the central hole of the radio frequency feeding disk 37 and is electrically connected to the circuit board assembly 24, for feeding direct current and / or alternating current into the chuck body 21 through the circuit board assembly 24. In some embodiments, in order to ensure electrical insulation between the radio frequency feeding tube (such as the second radio frequency feeding tube 32) closest to the chuck assembly 2 and the interface disk 23, a part of the insulating dielectric member 4 penetrates through the central hole of the interface disk 23 to electrically isolate the hole wall of the central hole from the radio frequency feeding tube (such as the second radio frequency feeding tube 32) closest to the chuck assembly 2. In some embodiments of the present application, a preset second withstand voltage safety distance is provided between the lower surface of the radio frequency feeding disk 37 and the upper surface of the interface disk 23. The second withstand voltage safety distance is, for example, 30 mm - 60 mm to ensure that there is sufficient radio frequency safety distance between the radio frequency feeding disk 37 and the interface disk 23. On this basis, on the premise that the height of the chuck body 21 remains unchanged, the height of the interface disk 23 needs to be adjusted to achieve the setting of the above-mentioned second withstand voltage safety distance. Specifically, the interface disk 23 is supported by an annular base 7, and the annular base 7 is supported by a base 8. On the premise that the height of the base 8 remains unchanged, the above-mentioned second withstand voltage safety distance can be set by designing the vertical distance between the lower surface of the interface disk 23 and the upper surface of the base 8. In some embodiments, the vertical distance is 60 mm - 120 mm. The semiconductor processing equipment provided by the embodiments of the present application, by adopting the above-mentioned lower electrode feeding device provided by the embodiments of the present application, can not only more conveniently disassemble and assemble the radio frequency feeding tube, thereby improving the installation and maintenance efficiency, but also this split assembly method can better ensure the assembly consistency of each machine tool, thereby improving the process consistency. Moreover, a solid medium can be selected without the problem of difficult disassembly and assembly of the solid medium, thereby reducing the occupied space of the lower electrode feeding device, so that there is more space for optimizing other lower electrode components. It is understandable that the above embodiments are merely exemplary embodiments adopted to illustrate the principle of the present application. However, the present application is not limited thereto. For those of ordinary skill in the art, various modifications and improvements can be made without departing from the spirit and essence of the present application, and these modifications and improvements are also regarded as the protection scope of the present application. 01: Chuck body 03: Conductor 04: Insulating fixing member 05: Insulating filling material 07: Insulating connector 021: Straight section 022: Bent section 023: Connecting section 031: DC conductor 032: Conductor 061: Straight section shielding sleeve 062: Bent section shielding sleeve 063: Spacing 1: Process chamber 2: Chuck assembly 3: RF feeding assembly 4: Insulating dielectric member 5: Shielding assembly 6: Electrical feeding assembly 7: Annular base 8: Base 9: Conductive elastic member 11: Side wall 21: Chuck body 22: Annular insulating member 23: Interface plate 24: Circuit board assembly 25: Internal space 31: First RF feeding tube 32: Second RF feeding tube 33: RF adapter tube 37: RF feeding plate 61: First electrical feeding member 62: Second electrical feeding member 63: Electrical adapter 64: Feeding conductor 67: Conductive elastic part 321: First mating part 331: Second mating part 332: First arc transition part 371: Annular connecting part 621: First end face 621a: Second positioning convex part 622: Second end face 623: Counterbore 631: First sub-adapter 631a: Second positioning concave part 632: Second sub-adapter 633: Docking face 634: First mating face 634a: First positioning concave part 635: Second mating face 635a: First positioning convex part 641: Conductive extension part 661: First adapter conductor 661a: Connecting concave part 662: Second adapter conductor In the drawings: FIG. 1 is a cross-sectional view of a lower electrode feeding device in the related art; FIG. 2 is a radial cross-sectional view of the straight section of the RF connection post; FIG. 3 is a cross-sectional view of the lower electrode feeding device and the process chamber provided by the embodiment of the present application; FIG. 4 is a cross-sectional view of the lower electrode feeding device provided by the embodiment of the present application; FIG. 5 is an inner surface cross-sectional view of the semi-circular split of the RF adapter tube adopted by the embodiment of the present application; FIG. 6 is a three-dimensional view of one side of the outer surface of the semi-circular split of the RF adapter tube adopted by the embodiment of the present application; FIG. 7 is a three-dimensional view of one side of the inner surface of the semi-circular split of the RF adapter tube adopted by the embodiment of the present application, and an electrical adapter is installed; FIG. 8 is a cross-sectional view of the electrical adapter adopted by the embodiment of the present application; FIG. 9 is a cross-sectional view of the second sub-adapter adopted by the embodiment of the present application; FIG. 10 is a partial three-dimensional view of one side of the first end face of the electrical feeding member adopted by the embodiment of the present application; FIG. 11 is a partial three-dimensional view of one side of the second end face of the electrical feeding member adopted by the embodiment of the present application. 1: Process chamber 2: Chuck assembly 3: RF feeding assembly 4: Insulating dielectric part 5: Shielding assembly 6: Electrical feeding assembly 7: Annular base 8: Base 11: Side wall 21: Chuck body 22: Annular insulating part 23: Interface plate 24: Circuit board assembly 25: Internal space 31: First RF feeding tube 32: Second RF feeding tube 33: RF adapter 37: RF feeding plate 61: First electrical feeding part 62: Second electrical feeding part 63: Electrical adapter

Claims

1. A lower electrode feeding device, applied in a semiconductor manufacturing process equipment, wherein, The device includes an RF feed component, one end of which is electrically connected to an RF source and the other end of which is electrically connected to a chuck assembly. The RF feed component includes at least two RF feed tubes and at least one RF adapter tube. Each pair of adjacent RF feed tubes is provided with a first mating part, and the RF adapter tube is provided with two second mating parts. The two second mating parts respectively mate with the first mating parts of the two adjacent RF feed tubes, so that the RF adapter tube is detachably connected to the two adjacent RF feed tubes and electrically conductive.

2. The lower electrode feeding device as described in claim 1, wherein, The detachable connection is a plug-in connection, one of the first mating part and the second mating part is a first ring part, and the other of the first mating part and the second mating part is a second ring part, and the first ring part is sleeved on the outer periphery of the second ring part.

3. The lower electrode feeding device as described in claim 2, wherein, A conductive elastic element is also arranged around the inner circumferential surface of the first ring and the outer circumferential surface of the second ring.

4. The lower electrode feeding device as described in claim 2, wherein, Each pair of adjacent RF feed tubes is a straight tube, and their axes form a first angle; the RF adapter tube is a bent tube, and its axis is bent to form the first angle; each pair of adjacent RF feed tubes has a first ring at one end, and the RF adapter tube has two second rings at each end.

5. The lower electrode feeding device as described in claim 2, wherein, The inner diameter of the RF feed tube is smaller than the inner diameter of the first ring, and the outer diameter of the RF adapter tube is larger than the outer diameter of the second ring; furthermore, the inner diameter of the RF feed tube is equal to the inner diameter of the RF adapter tube, and the outer diameter of the RF feed tube is equal to the outer diameter of the RF adapter tube.

6. The lower electrode feeding device as described in claim 4, wherein, The outer periphery of the RF adapter has a first arc transition section formed at the first included angle.

7. The lower electrode feeding device as described in claim 4, wherein, The RF adapter tube comprises two semi-annular sections that are joined together to form the bent tube.

8. The lower electrode feeding device as claimed in claim 1, wherein, The lower electrode feed device further includes: a shielding component, which is sleeved on the outer periphery of the radio frequency feed component to shield the radiation generated by radio frequency, and a gap is formed between the inner periphery of the shielding component and the outer periphery of the radio frequency feed component.

9. The lower electrode feeding device as described in claim 8, wherein, The lower electrode feed device further includes: an insulating dielectric element disposed in the gap for maintaining a preset first withstand voltage safety distance between the shielding component and the radio frequency feed component.

10. The lower electrode feeding device as described in claim 9, wherein, The insulating dielectric element includes an insulating sleeve disposed around the periphery of the RF feed assembly; the shielding assembly is disposed around the periphery of the insulating sleeve; or, the insulating dielectric element includes an insulating dielectric material filling the gap.

11. The lower electrode feeding device as described in any one of claims 1-10, wherein, The lower electrode feed device further includes an electrical feed component, which is disposed in a hollow space formed by the inner circumferential surfaces of all the radio frequency feed tubes and the radio frequency adapter tube, for feeding DC and / or AC power into the chuck assembly.

12. The lower electrode feeding device as claimed in claim 11, wherein, The electrical feed assembly includes at least two electrical feed elements and at least one electrical adapter. The number of electrical feed elements is the same as the number of RF feed tubes, and each electrical feed element is disposed in a corresponding position to each RF feed tube. The number of electrical adapters is the same as the number of RF adapter tubes, and each electrical adapter is disposed in a corresponding position to each RF adapter tube. Each pair of adjacent electrical feed elements is detachably connected through an electrical adapter and is electrically conductive.

13. The lower electrode feeding device as described in claim 12, wherein, The electrical adapter includes a first sub-adapter, a second sub-adapter, multiple first adapter wires, and multiple second adapter wires. Both the first and second sub-adapters are made of insulating material, are columnar, and their axes form a second included angle, which coincides with the included angle between the axes of any two adjacent RF feed tubes. The first sub-adapter has a first mating surface, and the second sub-adapter has a second mating surface. The first and second mating surfaces are in contact with each other, and both form a third and a fourth included angle with the axes of the first and second sub-adapters, respectively. The sum of the third and fourth included angles is equal to the second included angle. Multiple first adapter wires pass through the first sub-adapter along its axis, and are spaced apart from each other. Multiple second adapter wires are inserted into the second sub-adapter along the axis of the second sub-adapter, and the multiple second adapter wires are spaced apart from each other; one end of each second adapter wire and one end of each first adapter wire are respectively located on the first mating surface and the second mating surface, and are electrically in contact or connected as one unit in a one-to-one correspondence.

14. The lower electrode feeding device as described in claim 13, wherein, One of the first mating surface and the second mating surface is provided with a first positioning protrusion; the other of the first mating surface and the second mating surface is provided with a first positioning recess; the first positioning protrusion and the first positioning recess are mated.

15. The lower electrode feeding device as claimed in claim 14, wherein, The number of the first positioning protrusions is the same as the number of one of the first adapter wires and the second adapter wires, and each of the first positioning protrusions is arc-shaped and correspondingly surrounds one of the first adapter wires and the second adapter wires; each of the first positioning recesses is arc-shaped and correspondingly surrounds the other of the first adapter wires and the second adapter wires.

16. The lower electrode feeding device as described in claim 14, wherein, Both the first sub-adapter and the second sub-adapter have a mating surface; each pair of adjacent electrical feeders includes an insulating column and multiple feeder wires, wherein a first end face of the insulating column is in contact with the mating surface of the first sub-adapter or the second sub-adapter; multiple feeder wires pass through the insulating column along its axis, and are spaced apart from each other; one end of each feeder wire and the other end of each first or second adapter wire are respectively located on the first end face and the mating surface, and are in electrical contact with each other.

17. The lower electrode feeding device as claimed in claim 16, wherein, One of the mating surface and the first end face is provided with a second positioning protrusion; the other of the mating surface and the first end face is provided with a second positioning recess; the second positioning protrusion and the second positioning recess cooperate with each other.

18. The lower electrode feeding device as claimed in claim 17, wherein, The number of the second positioning protrusions is the same as the number of the feed wires; each of the second positioning protrusions is annular and corresponds to surround each of the feed wires; each of the second positioning recesses is annular and corresponds to surround the first or second adapter wire; or, each of the second positioning protrusions is annular and corresponds to surround the first or second adapter wire; each of the second positioning recesses is annular and corresponds to surround the feed wires.

19. The lower electrode feeding device as claimed in claim 16, wherein, Each of the first and second adapter wires has a connecting recess at its other end; each of the feed wires has a connecting protrusion at one end, which engages with the connecting recess and makes electrical contact; or, each of the first and second adapter wires has a connecting protrusion at its other end; each of the feed wires has a connecting recess at one end, which engages with the connecting recess and makes electrical contact.

20. The lower electrode feeding device as claimed in claim 19, wherein, The connecting protrusion includes a conductive extension extending from the first end face or the mating surface, and a conductive elastic portion detachably fitted onto the conductive extension. Both the conductive extension and the conductive elastic portion are located in the connecting recess, and the conductive elastic portion is in a compressed state.

21. The lower electrode feeding device as claimed in claim 16, wherein, A countersunk hole is provided at the location of each feed wire on the second end face of the insulating column, and the other end of each feed wire is located in the countersunk hole.

22. A semiconductor processing apparatus, comprising a process chamber and a chuck assembly disposed within the process chamber, wherein, It also includes the lower electrode feeding device described in any one of claims 1 to 21.

23. The semiconductor processing apparatus as claimed in claim 22, wherein, The chuck assembly includes a chuck body for carrying a wafer and an interface disk disposed below the chuck body, as well as an annular insulating member connecting the chuck body and the interface disk. The lower surface of the chuck body, the upper surface of the interface disk, and the inner circumferential surface of the annular insulating member form an internal space. In the RF feed assembly, the end of the RF feed tube closest to the chuck assembly extends into the internal space and is electrically connected to the chuck body.

24. The semiconductor processing apparatus as claimed in claim 23, wherein, The chuck body has a circuit board assembly located at its bottom and within its internal space. The RF feed assembly further includes an RF feed disk located within the internal space and at the bottom of the circuit board assembly. The RF feed disk has an annular connecting portion on its outer periphery, which is spaced around the outer periphery of the circuit board assembly and connected to the chuck body. The RF feed disk has a central hole, and the end of the RF feed tube closest to the chuck assembly is connected to the inner periphery of the RF feed disk and is electrically conductive.

25. The semiconductor processing apparatus as claimed in claim 24, wherein, The lower electrode feed device also includes an electrical feed component, which passes through a hollow space formed by the inner circumferential surfaces of all the RF feed tubes and the RF adapter tubes; the electrical feed component passes through the central hole and is electrically connected to the circuit board assembly, for feeding DC and / or AC power into the chuck body through the circuit board assembly.

26. The semiconductor processing apparatus as claimed in claim 24, wherein, A preset second withstand voltage safety distance is provided between the lower surface of the RF feed disk and the upper surface of the interface disk.

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