Shockproof device

Abstract

This invention relates to a shock-absorbing device for a rotary semiconductor device storage structure. The rotary semiconductor device storage structure includes a storage tower, which is composed of a cage and a plurality of storage baskets erected around the cage. The storage baskets have a plurality of flat storage positions. The shock-absorbing device has a pressing module and a shock-absorbing trigger module that can actuate the pressing module. The pressing module has a guide post slidably mounted between adjacent storage baskets, and the guide post has a plurality of flaps corresponding to the flat storage positions of the storage baskets on both sides. This allows the flaps to move synchronously between a restricted position and a released position relative to the upper surface of the semiconductor devices. In this way, when the seismic intensity is detected to exceed a set value, the semiconductor devices on the storage tower can be quickly restricted and protected to prevent them from being dislodged by vibration.

Description

[Technical Field]

[0001] This invention pertains to a shockproof technology for storage devices, specifically a shockproof mechanism for a chip storage tower. When an earthquake intensity exceeds a set value, the mechanism can quickly restrict and protect the semiconductor components on the chip storage tower to prevent them from being dislodged by vibration, while also increasing the storage capacity of the semiconductor components. [Previous Technology]

[0002] Note: With the advancement and improvement of network and communication technologies, coupled with the development of smartphones, electric vehicles, IoT, and AI technologies, people have gained a richer and more convenient life. These technological products are mainly made of semiconductor components manufactured through semiconductor processes, including but not limited to photomasks and wafers. According to current semiconductor component manufacturing technology, the circuit pattern of a semiconductor component is transferred from the photomask to the surface of the wafer through a photolithography process. As the line diameter of the circuit pattern of the aforementioned semiconductor components has evolved from the early micrometer level to the nanometer level, in order to cope with the contamination of semiconductor components caused by particles in the environment and harmful gases released during the manufacturing process, contamination countermeasures in storage, transportation, and manufacturing processes have become more stringent.

[0003] In semiconductor manufacturing plants, the current practice to maintain cleanliness during the manufacturing process is mainly through the design of cleanrooms. However, due to the large size of cleanrooms and the mutual interference of airflow between different devices, the cleanliness of the environment can still be easily affected. Therefore, the storage and transportation of semiconductor components outside the manufacturing process requires the use of a separate component container with an independent clean environment. Taking photomasks as an example, due to the aforementioned miniaturization of semiconductor components, when photomasks are contaminated, it can cause distortion or deformation of the circuit patterns on the wafer surface. To maintain the cleanliness of photomasks during storage or transportation outside the manufacturing process, they are usually stored in a SEMI standard photomask transport box (Reticle SMIF). Within the Pod (RSP), to reduce the adhesion of harmful contaminants such as particles, chemicals, or free gas molecules from the environment to the photomask surface, thus minimizing defects, the photomask transport boxes containing the photomasks are then stored in a large storage cabinet (Stocker). Currently, the storage cabinet's storage positions are arranged in a matrix on one side of the surface, and a linear robotic arm capable of moving left, right, up, and down is used to pick up and place photomask transport boxes in different storage positions. This increases the robotic arm's travel distance, thus increasing the time spent picking up and placing photomask transport boxes and reducing its operational efficiency. Furthermore, this... This approach also significantly increases the storage space of each photomask transport box. At the same time, the operating space and load-bearing capacity of the robotic arm used to transport the photomask transport boxes also need to be increased. In order to maintain the cleanliness of the internal environment of each photomask transport box, an inflation plate connected to an inflation system is usually designed on each storage position of the storage cabinet to fill the photomask transport box with clean gas. This invisibly complicates the structure of the storage cabinet, increases its manufacturing and maintenance costs, and also increases the volume of the storage cabinet. With the same volume, a smaller volume will directly reduce the storage capacity of the semiconductor components in the storage cabinet.

[0004] Furthermore, as mentioned above, since the circuit pattern line diameter of semiconductor devices has developed to the nanometer level, the importance and value of related semiconductor devices have been continuously increasing. Taking the aforementioned photomask as an example, the value of a single piece may be as high as millions, and when it is damaged, it may affect the efficiency of the manufacturing process. Therefore, the protection level for such semiconductor devices has been continuously improved. In recent years, earthquakes have occurred frequently, so there is a need to provide good shockproof design for such storage devices to protect such semiconductor devices when an earthquake occurs. Therefore, how to solve the aforementioned problems is what this invention aims to explore and solve.

[0005] In view of the above-mentioned shortcomings and drawbacks, the inventor believes that it is necessary to make corrections. Therefore, based on years of experience in related technologies and product design and manufacturing, and adhering to the concept of excellent design, the inventor has studied and improved the above-mentioned shortcomings. After continuous efforts in trial production, the inventor has finally successfully developed a shock-proof mechanism for storage towers, thereby overcoming the troubles and inconveniences caused by the poor shock-proof design of existing storage cabinets. [Summary of the Invention]

[0006] Therefore, the main objective of the present invention is to provide a shock-proof mechanism for a semiconductor storage tower, which can provide opposing fins above the semiconductor elements in each storage position, and can simultaneously actuate the fins to restrict the semiconductor elements in the opposing storage position when a set vibration intensity is detected, so as to prevent them from falling out due to vibration, thereby greatly improving the safety of semiconductor elements during storage.

[0007] Furthermore, a second major objective of the present invention is to provide a shock-absorbing mechanism for a storage tower, which can be easily installed and maintained by utilizing the modular design of the storage location and the shock-absorbing mechanism, thereby greatly improving its practicality.

[0008] Based on this, the present invention mainly achieves the aforementioned objectives and performance through the following technical means; for storing a plurality of semiconductor components, the anti-vibration mechanism of the semiconductor storage tower includes at least:

[0009] A semiconductor storage tower is composed of a cage and a plurality of storage baskets, the storage baskets being vertically locked around the cage and having a plurality of horizontally placed storage positions arranged vertically and at equal intervals for selective horizontal placement of semiconductor devices.

[0010] A shock-absorbing device, which is installed around the cage, and the shock-absorbing device includes at least:

[0011] A tablet compression module is provided with a guide post between adjacent tablet storage baskets around the cage body. The guide posts are slidably disposed between the top and bottom ends of the cage body. Furthermore, the guide posts are provided with a plurality of winglets corresponding to the flat storage positions of the tablet storage baskets on both sides, and one end of the winglets can extend into the upper surface of the semiconductor elements located on the relatively flat storage positions.

[0012] A shock-absorbing actuation module that can selectively actuate the guide posts of the pressing module, so that the blades can move synchronously between a restricted position and a released position relative to the upper surface of the semiconductor elements;

[0013] This allows the shock-absorbing module to actuate the guide post of the pressing module to move the blades downward to restrict the semiconductor elements from being ejected from the flat storage position, and the shock-absorbing module can actuate the guide post of the pressing module to move the blades upward to release the semiconductor elements from the flat storage position.

[0014] Thus, through the aforementioned technical means, the anti-vibration mechanism of the storage tower of the present invention can utilize the anti-vibration device provided on the storage tower. When the seismic intensity exceeds the set value, the anti-vibration trigger module can synchronously drive the relative guide column to move downward, so that the blades can relatively restrict the semiconductor components, thereby preventing the semiconductor components from falling out of the storage tower during an earthquake. This effectively improves the safety of the semiconductor components during storage, and makes them easy to install and maintain, greatly enhancing their practicality and increasing their added value and economic benefits.

[0015] Furthermore, the present invention utilizes the following technical means to further achieve the aforementioned objectives and effects; such as:

[0016] Preferably, the cage has at least a bottom frame, a top frame and a plurality of basket plates disposed between the outer contours of the bottom frame and the top frame, and the bottom and top frames have a plurality of guide seats with equal angles and distances, so that the guide pillars of the pressing module can be slidably disposed between the guide seats opposite to the bottom and top frames.

[0017] Preferably, the tablet storage basket group is composed of a plurality of tablet storage boxes arranged vertically and locked to the corresponding basket plates. The tablet storage boxes are composed of a box back plate and two box side plates respectively disposed on both sides of the box back plate. The tablet storage boxes are provided with a plurality of equidistant tablet storage plates in layers between the box back plate and the two box side plates to form the flat storage positions. The guide posts are provided with a plurality of wing groups corresponding to the tablet storage boxes of the two side tablet storage basket groups. The wing groups have a sleeve that can be locked to the guide post. The wing groups are formed on both sides of the periphery of the sleeve.

[0018] Preferably, the ends of the blades of the blade assembly are provided with limiting protrusions corresponding to the semiconductor elements to reduce the area of ​​contact with the semiconductor elements.

[0019] Preferably, the limiting protrusions can be selected from materials such as PEEK or PEI.

[0020] Preferably, the cage of the storage tower is a cylindrical structure, and the storage tower can be rotated by a driving device.

[0021] Preferably, the shock-absorbing trigger module of the shock-absorbing device is provided with a plurality of equal-angled driving elements around the storage tower. The driving elements are fixed on a fixed base, and the driving elements have actuating rods that can extend and retract relative to the fixed base. The actuating rods of the driving elements are collectively arranged to form a pressure ring around the periphery of the cage. The shock-absorbing trigger module is provided with a connecting plate at the bottom ends of at least two adjacent guide columns. The outer edges of the connecting plates are respectively formed with at least one convex pressure plate that overlaps with the pressure ring. When the actuating rods of the driving elements drive the pressure rings, the pressure rings can drive the connecting plates through the elastic pressure members, so that the connecting plates can synchronously drive the relative guide columns to move.

[0022] Preferably, the shockproof trigger module has 6 sets of driving elements and a plurality of linkage plates of equal length. The linkage plates can be locked with three guide posts at equal angles to drive the guide posts respectively, so as to reduce the occurrence of jamming.

[0023] Preferably, an elastic pressure member is provided between the convex pressure plate of the linkage plate and the pressure ring at the relative position, so that the pressure ring can press the linkage plate through the elastic pressure member.

[0024] Preferably, the connecting plates are provided with an upper buffer and a lower buffer on the guide post respectively above and below, so as to reduce the impact force of the blades of the blade group on the semiconductor elements.

[0025] In order to enable your review committee to further understand the structure, features and other objects of the present invention, the following are preferred embodiments of the present invention, which are described in detail below with reference to the drawings, so as to enable those skilled in the art to carry out the invention.

Implementation Method

[0038] This invention relates to a shock-absorbing mechanism for a film storage tower. In the accompanying drawings illustrating specific embodiments and components of this shock-absorbing mechanism for a film storage tower, all references to front and back, left and right, top and bottom, upper and lower parts, and horizontal and vertical directions are for convenience of description only and are not intended to limit the invention, nor to restrict the components to any position or spatial orientation. The dimensions specified in the drawings and specification may be varied according to the design and requirements of specific embodiments of this invention without departing from the scope of the patent application, and are therefore not limited to this structure in the patent application.

[0039] Please refer to Figures 1 and 2. The anti-vibration mechanism of the chip storage tower (100) of the present invention is composed of a chip storage tower (100) and can be applied to a storage chamber (800) for storing a plurality of semiconductor components (900). The semiconductor component (900) can be a photomask die. The storage chamber (800) has a storage space (801) inside. The top and bottom of the storage space (801) are respectively provided with an upper mounting seat (802) and a lower mounting seat (803). The chip storage tower (100) is located between the upper mounting seat (802) and the lower mounting seat (803), so that the chip storage tower (100) can be rotated by a driving device (500). The chip storage tower (100) is composed of a cage (10), a plurality of longitudinally arranged chip storage baskets (30) and an anti-vibration device (50).

[0040] As shown in Figures 2 and 3, the cage (10) is composed of at least a bottom frame (11), a top frame (12), and a plurality of basket plates (15) disposed between the outer contours of the bottom frame (11) and the top frame (12). The bottom frame (11) can be pivotally mounted on the lower mounting base (803), and the bottom frame (11) has a plurality of equidistant mounting portions (110) [as shown in Figure 3] for mounting the aforementioned basket plates (15). The top frame (12) has a bearing seat (122) supported by a plurality of radial ribs (121), and the bearing seat (122) forms a stepped shaft hole (123) for the upper mounting seat (802) to pivot. The top frame (12) also has a plurality of mounting portions (120) corresponding to the mounting portion (110) of the bottom frame (11), for the basket plates (15) to be longitudinally locked between the corresponding mounting portions (110, 120) of the bottom and top frames (11, 12). Furthermore, according to certain embodiments, the basket plates (15) can be segmented structures, wherein the cage body (10) is provided with at least one middle section ring frame (16) between the bottom frame (11) and the top frame (12), and the upper and lower edges of the middle section ring frames (16) are respectively provided with a plurality of locking parts (161, 162) corresponding to the mounting parts (110, 120) of the bottom and top frames (11, 12), so that the aforementioned segmented basket plates (15) can be respectively locked between the mounting part (110) of the bottom frame (11) and the lower locking part (161) of the middle section ring frame (16), and the upper locking part (162) of the middle section ring frame (16) and the mounting part (120) of the top frame (12), thereby improving the structural strength of the cage body (10) and the basket plates (15), and the basket plates (15) are provided with a plurality of first airflow slots (18). Furthermore, the outer surface of the basket plate (15) can be locked with the aforementioned storage basket group (30), and the bottom frame (11) is pivotally mounted on the lower mounting base (803). A gear sleeve (22) is locked around the bottom frame (11) of the cage body (10). When the aforementioned drive device (500) engages and drives the gear sleeve (22) of the bottom frame (11) of the cage body (10), it can synchronously drive the cage body (10) to rotate in place relative to the upper and lower mounting bases (802, 803) of the storage compartment (800).

[0041] As shown in Figure 2, the storage baskets (30) are mounted on the basket plate (15) of the cage (10), and the storage baskets (30) have a plurality of horizontally placed storage positions arranged equidistantly at the top and bottom. Each storage basket (30) is composed of a plurality of storage boxes (31) arranged vertically and locked to the opposite basket plate (15). As shown in Figures 4 and 5, the storage boxes (31) consist of a box back plate (32) and two box side plates (33) respectively located on both sides of the box back plate (32). The box back plate (32) has a plurality of second airflow slots (320), and the box side plates (33) on both sides are respectively shaped The storage box (31) has a plurality of through holes (330) for the aforementioned shock-absorbing device (50) to extend into the interior from the outside of the two sides. The storage box (31) has a plurality of vertically arranged and equidistant storage plates (35) fixed in layers between the back plate (32) and the two side plates (33) to form the flat storage positions. The storage plates (35) have a back support plate (351) and two side support plates (352) on each side. The middle section of each side support plate (352) is bent into a bridge section (353) to improve the strength of the two sides of the storage plate (35). The side support plates on both sides of each storage plate (35) are also provided. (352) A limiting member (36) is provided at both ends of the overpass section (353). The limiting member (36) has at least one supporting protrusion (361) that can support the bottom surface of the aforementioned semiconductor element (900). The outer edge of the limiting member (36) has at least one side baffle (362) for the side of the aforementioned semiconductor element (900) to abut against, so as to limit the left and right position of the semiconductor element (900) [as shown in Figure 7]. The ends of the limiting member (36) each have a stop block (365) for the front and rear rear edges of the aforementioned semiconductor element (900) to abut against, so as to limit the front and rear of the semiconductor element (900). The positions (as shown in Figure 6) and the inner surfaces of the side baffles (362) and the blocks (365) respectively form a guiding slope (363, 366) (as shown in Figures 4 and 5), so that the semiconductor elements (900) can be guided when placed, so that the semiconductor elements (900) can be supported by the support protrusions (361) of the limiting members (36), so that the semiconductor elements (900) can be stably placed on any of the chip carriers (35) of the chip cassettes (31), wherein the limiting members (36) can be selected from materials such as PEEK or PEI to reduce wear and have electrical conductivity;

[0042] Furthermore, as shown in Figures 3, 8, and 9, the shock-absorbing device (50) is located between the mounting base (803) below the cabin (800) and the cage (10). The shock-absorbing device (50) includes a pressing module (51) that can selectively restrict the semiconductor elements (900) on the chip storage basket assembly (30) and a shock-absorbing trigger module (60) that can actuate the pressing module (51). The tablet compression module (51) has a corresponding guide seat (52, 53) between the adjacent mounting portions (110, 120) of the bottom and top frames (11, 12) of the cage (10), and the bottom and top frames (11, 12) are each slidably provided with a guide post (54) between the corresponding guide seats (52, 53), so that the aforementioned shock-absorbing trigger module (60) can move the guide post (54) up and down partially. In some embodiments, when the cage (10) has a middle ring frame (16), the middle ring frame (16) is provided with a plurality of middle guide seats (163) corresponding to the corresponding guide seats (52, 53) [as shown in Figure 3], so that the guide post (54) can slide through. Furthermore, the guide post (54) is provided with at least one wing assembly (55) corresponding to the two side chip storage baskets (30), as shown in Figures 4 and 5. The present invention is based on a plurality of wing assemblies (55) corresponding to the two side chip storage baskets (30) and their corresponding chip storage cartridges (31). The wing assembly (55) has a sleeve (56) that can be locked to the guide post (54). The sleeve (56) has a plurality of wings (57) on both sides of its periphery that can extend into the chip storage cartridge (31). The ends of the wings (57) are positioned above the edges of the semiconductor elements (900) on the chip carrier (35) (as shown in Figure 7). Furthermore, each of the wings (57) Each end has a limiting bump (58) corresponding to a semiconductor element (900), such that when the wing assembly (55) is driven by the guide post (54), the wing (57) of the wing assembly (55) can move relative to the upper surface of the semiconductor element (900) between a release position (as shown in Figure 11) and a limiting position (as shown in Figure 12). The limiting position can prevent the semiconductor element (900) from being removed from the wafer carrier (35), while the release position allows the semiconductor element (900) to be removed from the wafer carrier (35). The wing assembly (55) or the limiting bump (58) can be selected from materials such as PEEK or PEI.

[0043] The shock-absorbing module (60) can simultaneously actuate the guide posts (54) of the tablet pressing module (51) to actuate the wing groups (55) of the tablet pressing module (51) on each guide post (54) to move downward, so that the wing groups (55) can restrict the semiconductor elements (900) in the relative tablet storage box (31) of the tablet storage basket group (30), so that the wing (57) of the wing group (55) can restrict the semiconductor elements (900) on the relative tablet storage carrier plate (35). According to certain embodiments, as shown in Figures 9, 10, and 11, the shock-absorbing trigger module (60) is provided with a plurality of equal-angled drive elements (61) on the bottom surface of the cabin (800) or the lower mounting base (803) relative to the periphery of the cage (10). The present invention uses six sets of drive elements (61) as the main embodiment. These drive elements (61) are fixed on a fixed base (63), and each drive element (61) has an actuating rod (62) that can extend and retract relative to the fixed base (63). Furthermore, the operation of these drive elements (61)... The moving rods (62) are arranged together to form a pressure ring (64) surrounding the periphery of the cage (10). The shock-absorbing trigger module (60) is provided with a connecting plate (65) spanning the bottom end of at least two adjacent guide posts (54). The present invention is mainly implemented with a connecting plate (65) locked for every three guide posts (54), so that it has six sets of connecting plates (65) to drive the guide posts (54) respectively, so as to reduce the occurrence of jamming. The outer edge of each connecting plate (65) is formed with at least one convex pressure plate (64) that overlaps with the pressure ring (64). 50), and an elastic clamping member (66) is provided between the convex pressure plates (650) and the pressure ring (64) at their relative positions, so that when the actuating rod (62) of the driving element (61) retracts and drives the pressure ring (64), the pressure ring (64) can press down on the connecting plate (65) through the elastic clamping member (66), and the connecting plate (65) can simultaneously drive the opposite guide post (54) to move downward, thereby actuating the blade assembly (55) of the aforementioned pressure plate module (51) through the moving guide post (54) to move towards The downward displacement allows the blades (57) of the blade assembly (55) to restrict the opposing semiconductor element (900) [as shown in Figure 12]. Furthermore, the connecting plate (65) has an upper buffer (671) and a lower buffer (672) respectively between each guide post (54) and the upper bottom frame (11) guide seat (531) and the lower gear sleeve (22) [as shown in Figures 11 and 12] to reduce the impact force of the blades (57) of the blade assembly (55) on the semiconductor element (900).

[0044] This constitutes a shock-resistant mechanism for a storage tower (100) that can increase storage capacity and has shock-resistant function.

[0045] Through the aforementioned structural design, as shown in Figures 1 and 2, in operation, when a robotic arm (not shown) is needed to place or grasp a semiconductor device (900) on the storage tower (100), the motor element (510) of the drive device (500) is activated to engage with the gear sleeve (22) at the bottom of the cage (10) of the storage tower (100), so that the cage (10) of the storage tower (100) can be driven by the motor element (510) of the drive device (500), thereby enabling the storage tower (100) to move. The cage (10) can rotate coaxially between the upper and lower mounting bases (802, 803) of the compartment (800), so that the designated storage basket group (30) on the cage (10) where the aforementioned semiconductor element (900) is placed can rotate to the position corresponding to the robotic arm, so that the robotic arm can move up and down to the height of the storage carrier plate (35) of the storage box (31) containing the aforementioned semiconductor element (900) in the storage basket group (30), so as to place or grab the semiconductor element (900) relative to the storage carrier plate (35).

[0046] Taking the placement of semiconductor elements (900) on the storage positions of the chip carriers (35) of the chip cassettes (31) as an example, as shown in Figures 4, 6 and 7, when the semiconductor elements (900) are placed from top to bottom on the chip carriers (35) of the opposite chip cassettes (31), the side baffles (362) of the upper limit members (36) of the chip carriers (35) and the guiding slopes (363, 366) of the baffles (365) can be used to effectively guide the placement position of the semiconductor elements (900) and allow the lower surface of the semiconductor elements (900) to be supported by the support protrusions (361) of the upper limit members (36), so that the semiconductor elements (900) can be stably placed in the opposite chip carriers (35);

[0047] Furthermore, during the storage of the semiconductor components (900) in the storage tower (100), if the intensity of the earthquake exceeds the set value, as shown in Figures 2, 9, 10, 11 and 12, the shock-absorbing device (50) can activate the drive element (61) of the pressing module (51) to drive the pressure ring (64) downward through the actuating rod (62), so that the pressure ring (64) can simultaneously press against the elastic pressure member (66) on the convex pressure plate (650) of the connecting plate (65), so that the connecting plate (65) can simultaneously drive the corresponding guide post (54) to slide downward. When the guide post (54) moves downward, the guide post (54) can simultaneously actuate the wing assembly (55) locked on it to move downward. Since the wing assembly (55) has a plurality of equidistant winglets (57) on both sides respectively. Furthermore, the blades (57) can be positioned above the semiconductor elements (900) on the opposite storage plate (35) of the storage cassette (31), so that the blades (57) of the blade group (55) can restrict the opposite semiconductor elements (900) [as shown in Figure 12]. Moreover, since the upper buffer (671) and the lower buffer (672) are respectively provided above and below the connecting plate (65) [as shown in Figures 11 and 12], the impact force of the blades (57) of the blade group (55) relative to the semiconductor elements (900) can be reduced. When the seismic intensity exceeds the set value, the anti-vibration device (50) can activate the pressing module (51) to actuate the anti-vibration trigger module (60) to restrict the semiconductor elements (900) to prevent the semiconductor elements (900) from falling out of the storage tower (100).

[0048] As described above, the shockproof mechanism of the storage tower (100) of the present invention utilizes the fact that the storage tower (100) can be rotated in place by the drive device (500), so that the storage basket group (30) on the cage (10) of the storage tower (100) can correspond to the robotic arm, so that the robotic arm can move up and down to grab the semiconductor element (900) of the storage box (31) on the storage basket group (30) relative to the storage carrier plate (35). This not only simplifies the structure, but also makes it convenient to place and grab the semiconductor element (900), and further greatly increases the storage capacity of the storage tower (100).

[0049] Furthermore, since the storage tower (100) of the present invention is provided with an anti-vibration device (50), when the earthquake intensity exceeds the set value, the anti-vibration trigger module (60) can synchronously drive the relative guide column (54) to move downward, so that the wing (57) of the wing group (55) on the guide column (54) can relatively restrict the semiconductor element (900) on the storage carrier plate (35), so as to prevent the semiconductor element (900) from falling out of the storage tower (100) when an earthquake occurs, effectively improving the safety of the semiconductor element (900) during the storage process.

[0050] In addition, the tablet storage box (31) of the tablet storage basket assembly (30) and the wing assembly (55) of the tablet pressing module (51) of the shockproof device (50) are modularly designed, making them easy to install and maintain, and greatly improving their practicality.

[0051] The above embodiments are only preferred embodiments of the present invention and should not be used to limit the scope of protection of the present invention. Any modifications or refinements made to the main design concept and spirit of the present invention that are not substantial in nature, but solve the same technical problem as the present invention, should be included within the scope of protection of the present invention.

[0052] In summary, it can be understood that the present invention is an invention with excellent creativity. In addition to effectively solving the problems faced by the conventional inventors, it also greatly improves the efficiency. Moreover, no similar or identical product inventions or public uses have been found in the same technical field. At the same time, it has the effect of improving efficiency. Therefore, the present invention has met the requirements of "novelty" and "inventiveness" for invention patents, and an invention patent application is filed in accordance with the law. [Simplified Explanation of the Diagram]

[0026] Figure 1: A schematic diagram of the structure of the anti-vibration mechanism of the storage tower of the present invention applied to a storage compartment.

[0027] Figure 2: A three-dimensional schematic diagram of the anti-vibration mechanism of the storage tower of the present invention, for illustrating its appearance and relative relationships.

[0028] Figure 3: A schematic diagram of most of the anti-vibration mechanism of the storage tower of the present invention.

[0029] Figure 4: A partial view of the storage basket group and the pressing module in the anti-vibration mechanism of the storage tower of the present invention.

[0030] Figure 5: A partial exploded view of the storage basket group and the pressing module in the anti-vibration mechanism of the storage tower of the present invention.

[0031] Figure 6: A side view sectional view of the storage basket group in the anti-vibration mechanism of the storage tower of the present invention.

[0032] Figure 7: A schematic cross-sectional view of the storage basket group in the shockproof mechanism of the storage tower of the present invention.

[0033] Figure 8: A schematic diagram of the appearance of the anti-vibration device in the anti-vibration mechanism of the storage tower of the present invention.

[0034] Figure 9: A partial external view of the shockproof device in the rotating semiconductor element storage structure of the present invention.

[0035] Figure 10: A partially enlarged schematic diagram of the shock-absorbing device in the shock-absorbing mechanism of the storage tower of the present invention.

[0036] Figure 11: This is a schematic diagram of the anti-vibration device in the anti-vibration mechanism of the storage tower of the present invention before its operation, to illustrate the pre-operation state of its anti-vibration trigger module and its relative relationship.

[0037] Figure 12: This is a schematic diagram of the shock-absorbing device after its operation in the anti-vibration mechanism of the tablet storage tower of the present invention, to illustrate the state of the tablet pressing module after its operation and its relative relationship.

Claims

1. A shock-absorbing device for a rotary semiconductor device storage structure, the rotary semiconductor device storage structure being used to store a plurality of exposed semiconductor devices, the rotary semiconductor device storage structure comprising a storage tower having a cage and a plurality of storage baskets, the storage baskets being vertically locked around the cage, and the storage baskets having a plurality of horizontally arranged, equidistant storage positions for selectively placing the semiconductor devices horizontally, the shock-absorbing device being disposed around the cage and comprising: A tablet compression module has a plurality of guide posts disposed on at least one side of each tablet storage basket group. The guide posts are slidably disposed between the top and bottom ends of the cage. The guide posts are provided with a plurality of flaps corresponding to the flat storage positions of the tablet storage basket groups on both sides, and one end of the flaps can extend into the upper surface of the semiconductor elements located on the relatively flat storage positions. A shock-absorbing trigger module can selectively actuate the guide posts so that the flaps can move synchronously between a restricted position and a released position relative to the upper surface of the semiconductor elements. This allows the shock-absorbing trigger module to actuate the guide posts to drive the flaps to move downward to restrict the semiconductor elements from being ejected from the flat storage positions, and the shock-absorbing trigger module can actuate the guide posts to drive the flaps to move upward to release the semiconductor elements from the flat storage positions.

2. The shockproof device according to claim 1, wherein the cage has at least a bottom frame, a top frame and a plurality of basket plates disposed between the outer contours of the bottom frame and the top frame, and the bottom and top frames have a plurality of equidistant guide seats, such that the guide posts of the pressing module can be slidably disposed between the guide seats opposite to each other on the bottom and top frames.

3. The shockproof device according to claim 2, wherein the tablet storage basket group is composed of a plurality of tablet storage boxes arranged vertically and locked to the corresponding basket plates, the tablet storage boxes are composed of a box back plate and two box side plates respectively disposed on both sides of the box back plate, and the tablet storage boxes are provided with a plurality of equidistant tablet storage plates in layers between the box back plate and the two side box side plates to form the flat storage positions, and the guide posts are provided with a plurality of wing groups corresponding to the tablet storage boxes of the two side tablet storage basket groups, and the wing groups have a sleeve that can be locked to the guide post, and the wing is formed on both sides of the periphery of the sleeve.

4. The shock-absorbing device according to claim 3, wherein the ends of the blades of the blade assembly are provided with limiting protrusions corresponding to the semiconductor elements to reduce the area of ​​contact with the semiconductor elements.

5. The shock-absorbing device as described in claim 4, wherein the limiting protrusions may be selected from PEEK or PEI materials.

6. The shock-absorbing device according to any one of claims 1 to 5, wherein the cage of the storage tower is a cylindrical structure and the storage tower can be rotated by a driving device.

7. The shock-absorbing device according to claim 6, wherein the shock-absorbing trigger module is provided with a plurality of equiangular driving elements around the storage tower, the driving elements are fixed on a fixed base, and the driving elements have actuating rods that can extend and retract relative to the fixed base. The actuating rods of the driving elements are arranged together to form a pressure ring surrounding the periphery of the cage. Furthermore, the shock-absorbing trigger module is provided with a connecting plate spanning the bottom ends of at least two adjacent guide columns, and the outer edges of the connecting plates are respectively formed with at least one convex pressure plate that overlaps with the pressure ring, so that when the actuating rods of the driving elements drive the pressure rings, the connecting plates can synchronously drive the relative guide columns to move.

8. The shock-absorbing device according to claim 7, wherein the shock-absorbing trigger module has 6 sets of driving elements and the shock-absorbing trigger module has a plurality of linkage plates of equal length, wherein the linkage plates can lock three of the guide posts at equal angles to drive the guide posts respectively, so as to reduce the occurrence of jamming.

9. The shock-absorbing device according to claim 8, wherein an elastic clamping member is provided between the convex pressure plate of the linkage plate and the pressure ring at the opposite position, so that the pressure ring can press the linkage plate through the elastic clamping member.

10. The shock-absorbing device according to claim 8, wherein the connecting plates are provided with an upper buffer and a lower buffer respectively above and below the guide post.

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