Microelectronic circuit testing pack, tester apparatus and method of testing a microelectronic circuit held by a substrate

Abstract

A microelectronic circuit test package, a tester apparatus, and a method for testing microelectronic circuits held by a substrate are disclosed. The tester apparatus is described. Various components contribute to the function of the tester apparatus to facilitate the movement of a vacuum-containing wafer package without human supervision. These functions include a latching system to keep the wafer package intact and a pressure sensing system to detect and relay pressure within the wafer package.

Description

Technical Field

[0001] The invention relates to a tester device for testing a microelectronic circuit.

[0002] [CROSS-REFERENCE TO RELATED APPLICATIONS] This application claims priority to U.S. Provisional Patent Application No. 63 / 088,635 filed on October 7, 2020, the entire text of which is incorporated into this application for reference. Prior Art

[0003] Microelectronic circuits are typically fabricated in and on semiconductor wafers. The wafers are then "singulated" or "diced" into individual die. The die are typically mounted to a supporting substrate to provide rigidity to the die and to enable electronic communication with the integrated circuits or microelectronic circuits of the die. Final packaging may include encapsulating the die, and the resulting package may then be shipped to customers.

[0004] Before being shipped to customers, the die or package needs to be tested. Ideally, the die should be tested at an early stage to identify defects that occur during early stage manufacturing. Wafer level testing can be achieved by providing a handler and a contactor having contacts, and then using the handler to move the wafer so that the contacts on the wafer make contact with the contacts on the contactor. Power and electronic signals can then be provided to and from the microelectronic circuits formed in the wafer via the contactor.

[0005] According to various embodiments, a wafer includes a substrate (eg, a silicon substrate or a printed circuit board) and one or more components fabricated in or mounted to the substrate.

[0006] Alternatively, the wafer may be positioned in a portable wafer package having an electrical interface and a thermal chuck. While the temperature of the wafer is thermally controlled by heating or cooling the thermal chuck, power and signals may be provided to and from the wafer through the electrical interface.

[0007] After the wafer is singulated, the individual dies may again need to be tested, and after the dies are mounted to the support substrate, the dies may again need to be tested. Summary of the invention

[0008] The present invention provides a microelectronic circuit test kit, the microelectronic circuit test kit comprising: a portable support structure, comprising the first component and the second component for holding a substrate between the first component and the second component, the substrate carrying a microelectronic circuit and having a plurality of terminals connected to the microelectronic circuit; a plurality of contacts located on the second component, the contacts matching the terminals for contacting the terminals; a pressure differential cavity seal located between the first component and the second component, the pressure differential cavity seal forming a closed pressure differential cavity together with the surface of the first component and the surface of the second component; a decompression passage formed to pass through one of the first component and the second component, the decompression passage having an inlet opening at the pressure differential cavity and an outlet opening outside the pressure differential cavity; a decompression valve connected to the decompression passage, the opening of the decompression valve allowing air to leave the pressure differential cavity so that the first component and the second component are relatively close to each other. The portable support structure is provided with a first interface and a second interface that are located on the portable support structure and connected to the contact to connect to the second interface located on the fixed structure when the portable support structure is removably held by the fixed structure; and a latch system including a first latch assembly, the first latch assembly may include: a first part that engages with the first component; a second part that engages with the second component; a connecting part having opposite ends respectively fixed to the first component and the second component to form a locking configuration; and an engaging mechanism connected to the locking configuration and operable to move the locking configuration between a locked position and an unlocked position, in which the locking configuration maintains the first component and the second component locked in a closed position, and in which the locking configuration allows the first component and the second component to move from a closed relationship to a spaced relationship.

[0009] The microelectronic circuit testing package may include: the engagement mechanism moves the second component between the locked position and the unlocked position.

[0010] The microelectronic circuit testing package may include: the second component rotates between the locked position and the unlocked position.

[0011] The microelectronic circuit test package may include: the engagement mechanism includes a surface forming a base located on the first component, the base contacts a surface on a jaw of a tool, the jaw of the tool is capable of rotating to rotate the first component, and the first component rotates the second component via the connecting component to move between the locked position and the unlocked position.

[0012] The microelectronic circuit test package may include: the surface on the first component forming the base is an exterior surface of the first component.

[0013] The microelectronic circuit test package may include: the first component having a tool pin opening located in the first component for aligning the pins of the tool with the first component.

[0014] The microelectronic circuit test package may include: the second component has a body and at least a first wing extending from the body, wherein when moving into a first locked position, the first wing moves over a shoulder of the first component, and when moving from the first locked position toward the unlocked position, the first wing moves away from the shoulder.

[0015] The microelectronic circuit test package may include: the second component has a second tab extending from the body, wherein when moving into the second locked position, the second tab moves over a shoulder of the first component, and when moving from the second locked position toward the unlocked position, the second tab moves away from the shoulder.

[0016] The microelectronic circuit test package may include: the latch system may further include a tuning block, the tuning block is installed in a fixed position relative to the first component, the tuning block has a flush surface, when the first wing is located on the shoulder, the second wing is located on the flush surface, and the second component can be adjusted relative to the first component to adjust the gap between the flush surface and the second wing.

[0017] The microelectronic circuit test package may include: the latch system may further include a locking nut having threads that engage with the pattern on the connecting component to adjust the second component in a rotational manner relative to the connecting component.

[0018] The microelectronic circuit test package may include: the latch system may further include a gasket, which is located between the tuning block and the first component and is used to adjust the distance between the flush surface and the first component.

[0019] The microelectronic circuit test package may include: the latch system may further include a locking mechanism, the locking mechanism having a locking surface, the locking surface locking into a first locking recess to prevent the second component from moving out of the locked position and locking into a second locking recess to prevent the second component from moving out of the unlocked position.

[0020] The microelectronic circuit test package may include: the first locking recess and the second locking recess are located on the locking configuration.

[0021] The microelectronic circuit test package may include: the first locking recess and the second locking recess are located on the second component.

[0022] The microelectronic circuit test package may include: the first component includes a backing plate and a signal distribution board, wherein a portion of the signal distribution board is located between the backing plate and the second component, the signal distribution board has an opening, and the connecting component is inserted through the opening, the opening has a first dimension on an axis toward the center point of the signal distribution board, the first dimension is larger than a second dimension transverse to the axis, the connecting component has a first portion smaller than the first dimension in the direction of the axis so that the signal distribution board and the backing plate can thermally expand relative to each other, and the size of the first portion is designed to be slidably adapted within the second dimension of the opening to prevent the signal distribution board from moving relative to the backing plate in a direction transverse to the axis.

[0023] The microelectronic circuit test package may include: the connecting component has a second portion, the second portion has a first thickness and a second thickness transverse to the first thickness, the first thickness can be adapted through the opening in the direction of the axis during the insertion and is larger than the second dimension of the opening, and the second thickness can be adapted through the second dimension of the opening during the insertion.

[0024] The microelectronic circuit test package may include: the latch system may further include a second latch assembly, wherein each corresponding latch assembly may include: a first part, engaged with the first component; a second part, engaged with the second component; a connecting part, having opposite ends fixed to the first component and the second component respectively to form a locking configuration; and a coupling mechanism, connected to the locking configuration and capable of operating to move the locking configuration between a locked position and an unlocked position, in which the locking configuration maintains the first component and the second component locked in the closed position, and in the unlocked position, the locking configuration allows the first component and the second component to move from the closed relationship to the spaced relationship.

[0025] The microelectronic circuit test package may include: the first latch assembly and the second latch assembly have corresponding second components located on different sides of the second component.

[0026] The microelectronic circuit test package may include: the pressure differential cavity seal surrounds the contact and the terminal.

[0027] The microelectronic circuit test package may include the pressure differential cavity seal being secured to the first component when the first component is spaced apart from the second component.

[0028] The microelectronic circuit test package may include: the pressure differential cavity seal is a lip seal.

[0029] The microelectronic circuit test package may include: the pressure reducing valve is a pressure reducing check valve, a vacuum release passage is formed through the component having the pressure reducing check valve, the vacuum release passage has an inlet opening at the pressure differential cavity and an outlet opening outside the pressure differential cavity, the microelectronic circuit test package further includes a second valve, the second valve is a vacuum release valve connected to the vacuum release passage, the opening of the vacuum release valve allows air to enter the pressure differential cavity, and the closing of the vacuum release valve prevents air from escaping from the pressure differential cavity.

[0030] The microelectronic circuit test package may include: the substrate is a wafer having a plurality of microelectronic circuits.

[0031] The microelectronic circuit test package may include: the contact members are pins, each pin has a spring, and when the corresponding contact member is pressed down by a corresponding one of the terminals, the spring is pressed down against its spring force.

[0032] The present invention also provides a tester device, the tester device comprising: a portable support structure, comprising the first component and the second component for holding a substrate between the first component and the second component, the substrate carrying a microelectronic circuit and having a plurality of terminals connected to the microelectronic circuit; a plurality of contacts located on the second component, the contacts matching the terminals for contacting the terminals; a pressure differential cavity seal located between the first component and the second component, the pressure differential cavity seal forming a closed pressure differential cavity together with the surface of the first component and the surface of the second component; a pressure relief valve a pressure relief valve connected to the pressure relief passage, the opening of the pressure relief valve allowing air to leave the pressure differential cavity so that the first component and the second component move relative to each other to ensure proper contact between the contact and the terminal, and the closing of the pressure relief valve preventing air from entering the pressure differential cavity; a first interface located on the portable support structure and connected to the contact; a latch system including a first latch assembly, which may include a first component, a second component, a connecting component and a coupling mechanism, the first component engaging with the first component, the second component engaging with the second component, the connecting component having opposite ends respectively fixed to the first component and the second component to form a locking configuration, the coupling mechanism connected to the locking configuration and operable to move the locking configuration between a locked position and an unlocked position, in which the locking configuration maintains the first component and the second component locked in a closed position, and in which the locking configuration allows the first component and the second component to move from a closed relationship to an unlocked position. The portable supporting structure comprises a first interface and a second interface. The first interface and the second interface are connected to each other by the electrical tester and the first interface. The first interface and the second interface are connected to each other by the electrical tester and the first interface. The portable supporting structure comprises a first interface and a second interface. The first interface and the second interface are connected to each other by the electrical tester and the first interface. The portable supporting structure comprises a first interface and a second interface. The first interface and the second interface are connected to each other by the electrical tester and the first interface. The first interface and the second interface are connected to each other by the electrical tester and the first interface. The first interface and the second interface are connected to each other by the electrical tester and the first interface.

[0033] The tester device may include: the engagement mechanism enables the second component to move between the locked position and the unlocked position.

[0034] The tester device may include: the second component rotates between the locked position and the unlocked position.

[0035] The tester device may include: the coupling mechanism includes a surface forming a base located on the first component, the base contacts a surface on a clamp of the tool, the clamp of the tool is capable of rotating to rotate the first component, and the first component rotates the second component via the connecting component to move between the locked position and the unlocked position.

[0036] The tester device may include: the surface located on the first component forming the base is an external surface of the first component.

[0037] The tester device may include: the first component having a tool pin opening located in the first component for aligning the pins of the tool with the first component.

[0038] The tester device may include: the second component has a body and at least a first wing extending from the body, wherein when moving to a first locking position, the first wing moves over a shoulder of the first component, and when moving from the first locking position toward the unlocking position, the first wing leaves the shoulder.

[0039] The tester device may include: the second component has a second wing extending from the body, wherein when moving to the second locked position, the second wing moves over the shoulder of the first component, and when moving from the second locked position toward the unlocked position, the second wing leaves the shoulder.

[0040] The tester device may include: the latch system may further include a tuning block, which is installed in a fixed position relative to the first component, and the tuning block has a flush surface. When the first wing is located above the shoulder, the second wing is located above the flush surface, and the second component can be adjusted relative to the first component to adjust the gap between the flush surface and the second wing.

[0041] The tester device may include: the latch system may further include a locking nut having threads that engage with the pattern on the connecting component to adjust the second component in a rotational manner relative to the connecting component.

[0042] The tester device may include: the latch system may further include a gasket, which is located between the tuning block and the first component and is used to adjust the distance between the flush surface and the first component.

[0043] The tester device may include: the latch system may further include a locking mechanism, the locking mechanism having a locking surface, the locking surface locking into a first locking recess to prevent the second component from moving out of the locked position and locking into a second locking recess to prevent the second component from moving out of the unlocked position.

[0044] The tester device may include: the first locking recess and the second locking recess are located on the locking configuration.

[0045] The tester device may include: the first locking recess and the second locking recess are located on the second component.

[0046] The tester device may include: the first component includes a backing plate and a signal distribution plate, wherein a portion of the signal distribution plate is located between the backing plate and the second component, the signal distribution plate has an opening, the connecting component is inserted through the opening, the opening has a first dimension on an axis toward the center point of the signal distribution plate, the first dimension is larger than a second dimension transverse to the axis, the connecting component has a first portion smaller than the first dimension in the direction of the axis so that the signal distribution plate and the backing plate can thermally expand relative to each other, and the size of the first portion is designed to be slidably adapted within the second dimension of the opening to prevent the signal distribution plate from moving relative to the backing plate in a direction transverse to the axis.

[0047] The tester device may include: the connecting part has a second part, the second part has a first thickness and a second thickness transverse to the first thickness, the first thickness can be adapted through the opening in the direction of the axis during the insertion and is larger than the second dimension of the opening, and the second thickness can be adapted through the second dimension of the opening during the insertion.

[0048] The tester device may include: the latch system may further include a second latch assembly, wherein each corresponding latch assembly may have: a first part, engaged with the first component; a second part, engaged with the second component; a connecting part, having opposite ends fixed to the first part and the second part, respectively, to form a locking configuration; and a coupling mechanism, connected to the locking configuration and capable of operating to move the locking configuration between a locked position and an unlocked position, in which the locking configuration maintains the first component and the second component locked in the closed position, and in the unlocked position the locking configuration allows the first component and the second component to move from the closed relationship to the spaced relationship.

[0049] The tester device may include: the first latch assembly and the second latch assembly have corresponding second parts located on different sides of the second component.

[0050] The tester device may include: the pressure differential cavity seal surrounds the contact and the terminal.

[0051] The tester device may include: the pressure differential cavity seal is fixed to the first component when the first component is spaced apart from the second component.

[0052] The tester device may include: the pressure differential cavity seal is a lip seal.

[0053] The tester device may include: the pressure reducing valve is a pressure reducing check valve, a vacuum release passage is formed through the component having the pressure reducing check valve, the vacuum release passage has an inlet opening at the pressure differential cavity and an outlet opening outside the pressure differential cavity, the tester device further includes a second valve, the second valve is a vacuum release valve connected to the vacuum release passage, the opening of the vacuum release valve allows air to enter the pressure differential cavity, and the closing of the vacuum release valve prevents air from escaping from the pressure differential cavity.

[0054] The tester device may include: the fixed structure includes a thermal chuck, and the second component of the portable support structure includes a thin chuck, and the thin chuck contacts the thermal chuck to enable heat to be transferred between the portable support structure and the thermal chuck.

[0055] The tester device may include: the substrate is a wafer having a plurality of microelectronic circuits.

[0056] The tester device may include: the contact members are pins, each pin has a spring, and when the corresponding contact member is pressed down by a corresponding one of the terminals, the spring is pressed down against its spring force.

[0057] The present invention further provides a method for testing a microelectronic circuit held by a substrate, the method comprising: holding the substrate between a first component and a second component of a portable supporting structure, the second component having a contact piece that abuts against the substrate and is connected to a terminal of the microelectronic circuit, wherein a decompression passage is formed through one of the first component and the second component, the decompression passage having an inlet opening at a pressure differential cavity and an outlet opening outside the pressure differential cavity; positioning a pressure differential cavity seal between the first component and the second component to form a closed cavity by the surface of the first component, the surface of the second component and the pressure differential cavity seal; opening a decompression valve to allow air to leave the pressure differential cavity and reduce the pressure in the pressure differential cavity so that the first component and the second component move relative to each other to ensure proper contact between the contact piece and the terminal; closing the decompression valve , preventing air from entering the pressure differential cavity; operating the latch system engagement mechanism to move the locking configuration between a locked position and an unlocked position, wherein the locking configuration maintains the first component and the second component locked in a closed position, and wherein the locking configuration allows the first component and the second component to move from a closed relationship to a spaced relationship in the unlocked position, wherein the locking configuration may include a first component, a second component, and a connecting component, wherein the first component engages with the first component, and the second component engages with the second component, and the connecting component has opposite ends respectively fixed to the first component and the second component; receiving the portable support structure by the fixed structure, wherein the first interface on the portable support structure is connected to the second interface on the fixed structure; and transmitting signals between the electrical tester and the microelectronic circuit via the terminals, the contacts, and the first interface and the second interface to test the microelectronic circuit.

[0058] The method may include: the engagement mechanism moving the second component between the locked position and the unlocked position.

[0059] The method may include rotating the second component between the locked position and the unlocked position.

[0060] The method may include: the engagement mechanism includes a surface forming a base on the first component, the base contacts a surface on a jaw of a tool, the jaw of the tool is rotatable to rotate the first component, and the first component rotates the second component via the connecting component to move between the locked position and the unlocked position.

[0061] The method may include: the surface on the first component forming the base is an exterior surface of the first component.

[0062] The method may include the first component having a tool pin opening located in the first component for aligning a pin of the tool with the first component.

[0063] The method may include: the second component has a body and at least a first wing extending from the body, wherein when moving into a first locked position, the first wing moves over a shoulder of the first component, and when moving from the first locked position toward the unlocked position, the first wing moves away from the shoulder.

[0064] The method may include: the second component has a second tab extending from the body, wherein when moving into a second locked position, the second tab moves over a shoulder of the first component, and when moving from the second locked position toward the unlocked position, the second tab moves away from the shoulder.

[0065] The method may include: the latch system may further include a tuning block, the tuning block is installed in a fixed position relative to the first component, the tuning block has a flush surface, when the first wing is located above the shoulder, the second wing is located above the flush surface, and the second component can be adjusted relative to the first component to adjust the gap between the flush surface and the second wing.

[0066] The method may include: the latch system may further include a locking nut having threads that engage with a pattern on the connecting component to rotationally adjust the second component relative to the connecting component.

[0067] The method may include: the latching system may further include: positioning a gasket between the tuning block and the first component to adjust the distance between the flush surface and the first component.

[0068] The method may include: the latch system may further include a locking mechanism, the locking mechanism having a locking surface, the locking surface locking into a first locking recess to prevent the second component from moving out of the locked position and locking into a second locking recess to prevent the second component from moving out of the unlocked position.

[0069] The method may include: the first locking recess and the second locking recess are located on the locking configuration.

[0070] The method may include: the first locking recess and the second locking recess are located on the second component.

[0071] The method may include: the first component includes a backing plate and a signal distribution plate, wherein a portion of the signal distribution plate is located between the backing plate and the second component, the signal distribution plate has an opening, the connecting component is inserted through the opening, the opening has a first dimension on an axis toward a center point of the signal distribution plate, the first dimension is larger than a second dimension transverse to the axis, the connecting component has a first portion smaller than the first dimension in the direction of the axis so that the signal distribution plate and the backing plate can thermally expand relative to each other, and the size of the first portion is designed to be slidably adapted within the second dimension of the opening to prevent the signal distribution plate from moving relative to the backing plate in a direction transverse to the axis.

[0072] The method may include: the connecting component has a second portion, the second portion has a first thickness and a second thickness transverse to the first thickness, the first thickness can be adapted through the opening in the direction of the axis during the insertion and is larger than the second dimension of the opening, and the second thickness can be adapted through the second dimension of the opening during the insertion.

[0073] The method may include: the latch system may include a second latch assembly, each corresponding latch assembly having: a first part, engaged with the first component; a second part, engaged with the second component; a connecting part, having opposite ends fixed to the first part and the second part, respectively, to form a locking configuration; and an engaging mechanism, connected to the locking configuration and capable of operating to move the locking configuration between a locked position and an unlocked position, in which the locking configuration maintains the first component and the second component locked in the closed position, and in the unlocked position the locking configuration allows the first component and the second component to move from the closed relationship to the spaced relationship.

[0074] The method may include: the first latch assembly and the second latch assembly have corresponding second components located on different sides of the second component.

[0075] The method may include: the pressure differential cavity seal surrounds the contact and the terminal.

[0076] The method may include securing the pressure differential cavity seal to the first component when the first component is spaced apart from the second component.

[0077] The method may include: the pressure differential cavity seal is created as a lip seal.

[0078] The method may include: the pressure reducing valve is a pressure reducing check valve, a vacuum release passage is formed through the component having the pressure reducing check valve, the vacuum release passage has an inlet opening at the pressure differential cavity and an outlet opening outside the pressure differential cavity, the method further includes opening a second valve to allow air to enter the pressure differential cavity, the second valve is a vacuum release valve connected to the vacuum release passage.

[0079] The method may include: the fixed structure includes a thermal chuck, and the second component of the portable support structure includes a thin chuck.

[0080] The method may include: the substrate is a wafer having a plurality of microelectronic circuits.

[0081] The method may include: the contact members are pins, each pin has a spring, and when the corresponding contact member is pressed down by a corresponding one of the terminals, the spring is pressed down against its spring force.

[0082] The present invention also provides a microelectronic circuit test kit, the microelectronic circuit test kit comprising: a portable support structure, comprising the first component and the second component for holding a substrate between the first component and the second component, the substrate carrying a microelectronic circuit and having a plurality of terminals connected to the microelectronic circuit; a plurality of contacts located on the second component, the contacts matching the terminals for contacting the terminals; a pressure differential cavity seal located between the first component and the second component, the pressure differential cavity seal forming a closed pressure differential cavity together with the surface of the first component and the surface of the second component; a decompression passage formed to pass through one of the first component and the second component, the decompression passage having an inlet at the pressure differential cavity The portable support structure includes a pressure relief passage and a pressure relief passage having an outlet opening outside the pressure differential cavity; a pressure relief valve connected to the pressure relief passage, the opening of the pressure relief valve allowing air to leave the pressure differential cavity so that the first component and the second component move relative to each other to ensure proper contact between the contact and the terminal, and the closing of the pressure relief valve preventing air from entering the pressure differential cavity; a first interface located on the portable support structure and connected to the contact to connect to a second interface located on the fixed structure when the portable support structure is detachably held by the fixed structure; a pressure sensor positioned to detect pressure in the pressure differential cavity; and an electrical pressure sensor interface connected to the pressure sensor to transmit the pressure using an electronic tester.

[0083] The microelectronic circuit test package may include: the pressure sensor is positioned away from the pressure differential cavity, and a pressure sensing path connects the pressure differential cavity and the pressure sensor.

[0084] The microelectronic circuit testing package may include: the reduced pressure passage is formed in the first component.

[0085] The microelectronic circuit test package may include: the first component includes a backing plate and a signal distribution board, wherein a portion of the signal distribution board is located between the backing plate and the second component, and the pressure sensing path is formed in the backing plate.

[0086] The microelectronic circuit test package may include: the pressure sensing path is formed to pass through the signal distribution board.

[0087] The microelectronic circuit testing package may include: the pressure sensor is fixed to the portable support structure.

[0088] The microelectronic circuit test package may include the pressure differential cavity seal being secured to the first component when the first component is spaced apart from the second component.

[0089] The microelectronic circuit test package may include: the pressure differential cavity seal is a lip seal.

[0090] The microelectronic circuit test package may include: the pressure reducing valve is a pressure reducing check valve, a vacuum release passage is formed through the component having the pressure reducing check valve, the vacuum release passage has an inlet opening at the pressure differential cavity and an outlet opening outside the pressure differential cavity, the microelectronic circuit test package further includes a second valve, the second valve is a vacuum release valve connected to the vacuum release passage, the opening of the vacuum release valve allows air to enter the pressure differential cavity, and the closing of the vacuum release valve prevents air from escaping from the pressure differential cavity.

[0091] The microelectronic circuit test package may include: the substrate is a wafer having a plurality of microelectronic circuits.

[0092] The microelectronic circuit test package may include: the contact members are pins, each pin has a spring, and when the corresponding contact member is pressed down by a corresponding one of the terminals, the spring is pressed down against its spring force.

[0093] The present invention further provides a tester device, the tester device comprising: a portable support structure, comprising the first component and the second component for holding a substrate between the first component and the second component, the substrate carrying a microelectronic circuit and having a plurality of terminals connected to the microelectronic circuit; a plurality of contacts located on the second component, the contacts matching the terminals for contacting the terminals; a pressure differential cavity seal located between the first component and the second component, the pressure differential cavity seal forming a closed pressure differential cavity together with the surface of the first component and the surface of the second component; a decompression passage formed to pass through one of the first component and the second component, the decompression passage having an inlet opening at the pressure differential cavity and an outlet opening outside the pressure differential cavity; a decompression valve connected to the decompression passage, the opening of the decompression valve allowing air to leave the pressure differential cavity so that the first component and the second component move relative to each other to ensuring proper contact between the contact and the terminal, and the closure of the pressure relief valve prevents air from entering the pressure differential cavity; a first interface located on the portable support structure and connected to the contact; a fixed structure, the portable support structure can be received by the fixed structure for holding, and can be removed from the fixed structure; a second interface located on the fixed structure, when the portable support structure is held by the fixed structure, the second interface is connected to the first interface, and when the portable support structure is removed from the fixed structure, the second interface is disconnected from the first interface; an electrical tester connected to the terminal via the second interface, the first interface and the contact, so that a signal is transmitted between the electrical tester and the microelectronic circuit to test the microelectronic circuit; a pressure sensor, positioned to detect the pressure in the pressure differential cavity; and a pressure monitoring system including an electrical pressure sensor interface connected to the pressure sensor to transmit the pressure using an electronic tester.

[0094] The tester device may include: the pressure sensor is positioned away from the pressure differential cavity, and a pressure sensing passage connects the pressure differential cavity and the pressure sensor.

[0095] The tester device may include: the pressure relief passage is formed in the first component.

[0096] The tester device may include: the first component includes a backing plate and a signal distribution board, wherein a portion of the signal distribution board is located between the backing plate and the second component, and the pressure sensing path is formed in the backing plate.

[0097] The tester device may include: the pressure sensing path is formed to pass through the signal distribution board.

[0098] The tester device may include: the pressure sensor is fixed to the portable support structure.

[0099] The tester device may include: the pressure monitoring system may include an electrical pressure connector interface, the electrical pressure connector interface is located on the fixed structure, and the electrical pressure sensor interface contacts the electrical pressure connector interface in a releasable manner to transmit the pressure using the electronic tester.

[0100] The tester device may include: the electrical pressure sensor interface includes at least a first contact piece, and the pressure monitoring system includes at least a first terminal, wherein when the portable support structure is received by the fixed structure, the first contact piece engages with the first terminal, and when the portable support structure is detached from the fixed structure, the first contact piece disconnects from the first terminal.

[0101] The tester device may include: the electrical pressure sensor interface is located in a printed circuit board having a substrate and the first contact is formed on the substrate.

[0102] The tester device may include: the electrical pressure sensor interface includes at least a second contact piece, and the pressure monitoring system includes at least a second terminal, wherein when the portable support structure is received by the fixed structure, the second contact piece engages with the second terminal, and when the portable support structure is detached from the fixed structure, the second contact piece disconnects from the second terminal.

[0103] The tester device may include: the pressure differential cavity seal surrounds the contact and the terminal.

[0104] The tester device may include: the pressure differential cavity seal is fixed to the first component when the first component is spaced apart from the second component.

[0105] The tester device may include: the pressure differential cavity seal is a lip seal.

[0106] The tester device may include: the pressure reducing valve is a pressure reducing check valve, a vacuum release passage is formed through the component having the pressure reducing check valve, the vacuum release passage has an inlet opening at the pressure differential cavity and an outlet opening outside the pressure differential cavity, the tester device further includes a second valve, the second valve is a vacuum release valve connected to the vacuum release passage, the opening of the vacuum release valve allows air to enter the pressure differential cavity, and the closing of the vacuum release valve prevents air from escaping from the pressure differential cavity.

[0107] The tester device may include: the fixed structure includes a thermal chuck, and the second component of the portable support structure includes a thin chuck, and the thin chuck contacts the thermal chuck to enable heat to be transferred between the portable support structure and the thermal chuck.

[0108] The tester device may include: the substrate is a wafer having a plurality of microelectronic circuits.

[0109] The tester device may include: the contact members are pins, each pin has a spring, and when the corresponding contact member is pressed down by a corresponding one of the terminals, the spring is pressed down against its spring force.

[0110] The present invention also provides a method for testing a microelectronic circuit held by a substrate, the method comprising: holding the substrate between a first component and a second component of a portable support structure, the second component having a contact piece that abuts against the substrate and is connected to a terminal of the microelectronic circuit, wherein a decompression passage is formed through one of the first component and the second component, the decompression passage having an inlet opening at a pressure differential cavity and an outlet opening outside the pressure differential cavity; positioning a pressure differential cavity seal between the first component and the second component to form a closed cavity by the surface of the first component, the surface of the second component and the pressure differential cavity seal; opening the decompression valve to allow air to flow into the pressure differential cavity; and The invention relates to a pressure monitoring system comprising: a first component and a second component that are capable of leaving the pressure differential cavity and reducing the pressure in the pressure differential cavity so that the first component and the second component move relative to each other to ensure proper contact between the contact piece and the terminal; a pressure reducing valve that is closed to prevent air from entering the pressure differential cavity; a fixed structure that receives the portable supporting structure, wherein a first interface on the portable supporting structure is connected to a second interface on the fixed structure; a signal is transmitted between an electrical tester and the microelectronic circuit via the terminal, the contact piece, and the first interface and the second interface to test the microelectronic circuit; the pressure in the pressure differential cavity of the pressure monitoring system is detected; and the pressure is transmitted using an electronic tester.

[0111] The method may include: the pressure sensor is positioned away from the pressure differential cavity, and a pressure sensing passage connects the pressure differential cavity and the pressure sensor.

[0112] The method may include: the reduced pressure passage is formed in the first component.

[0113] The method may include: the first component includes a backing plate and a signal distribution plate, wherein a portion of the signal distribution plate is located between the backing plate and the second component, and the pressure sensing path is formed in the backing plate.

[0114] The method may include: the pressure sensing path is formed to pass through the signal distribution board.

[0115] The method may include: the pressure sensor is secured to the portable support structure.

[0116] The method may include: the pressure monitoring system may include an electrical pressure connector interface, the electrical pressure connector interface is located on the fixed structure, and the electrical pressure sensor interface contacts the electrical pressure connector interface in a releasable manner to transmit the pressure using the electronic tester.

[0117] The method may include: the electrical pressure sensor interface includes at least a first contact, and the pressure monitoring system includes at least a first terminal, wherein when the portable support structure is received by the fixed structure, the first contact engages with the first terminal, and when the portable support structure is detached from the fixed structure, the first contact disconnects from the first terminal.

[0118] The method may include: the electrical pressure sensor interface is located in a printed circuit board having a substrate and the first contact is formed on the substrate.

[0119] The method may include: the electrical pressure sensor interface includes at least a second contact, and the pressure monitoring system includes at least a second terminal, wherein when the portable support structure is received by the fixed structure, the second contact engages with the second terminal, and when the portable support structure is detached from the fixed structure, the second contact disconnects from the second terminal.

[0120] The method may include: the pressure differential cavity seal surrounds the contact and the terminal.

[0121] The method may include securing the pressure differential cavity seal to the first component when the first component is spaced apart from the second component.

[0122] The method may include: the pressure differential cavity seal is created as a lip seal.

[0123] The method may include: the pressure reducing valve is a pressure reducing check valve, a vacuum release passage is formed through the component having the pressure reducing check valve, the vacuum release passage has an inlet opening at the pressure differential cavity and an outlet opening outside the pressure differential cavity, the method further includes opening a second valve to allow air to enter the pressure differential cavity, the second valve is a vacuum release valve connected to the vacuum release passage.

[0124] The method may include: the fixed structure includes a thermal chuck, and the second component of the portable support structure includes a thin chuck.

[0125] The method may include: the substrate is a wafer having a plurality of microelectronic circuits.

[0126] The method may include: the contact members are pins, each pin has a spring, and when the corresponding contact member is pressed down by a corresponding one of the terminals, the spring is pressed down against its spring force. Simple diagram description

[0127] The present invention will be further described by way of example with reference to the accompanying drawings, in which: 1 is a cross-sectional side view of a tester device having a socket assembly according to one embodiment of the present invention. 2 is a cross-sectional side view of the tester apparatus taken along line 2 - 2 of FIG. 1 . 3 is a cross-sectional side view of the tester apparatus taken along line 3 - 3 of FIG. 1 . 4 is a cross-sectional side view of the tester apparatus taken along line 4 - 4 of FIGS. 2 and 3 . 5A, 5B and 5C are perspective views of a tester apparatus showing the insertion or removal of a portable wafer package into or from an oven defined by a frame. FIG. 6 is a timing diagram showing how one wafer package may be inserted and used to test the electronic components of the wafer and then another wafer package may be inserted. 7 is a perspective view of the tester device showing the insertion or removal of a socket assembly. 8A and 8B are cross-sectional side views showing the use of a standoff in the configuration of the wafer package described with respect to FIGS. 1-7. 9A, 9B and 10 are side views showing an apparatus for inserting and removing a portable wafer package into and from an oven. FIG. 11 is a perspective view of the first wafer package as viewed from above. FIG. 12 is a perspective view of the first wafer package as viewed from below. FIG. 13 is a cross-section of the first wafer package along line 13 - 13 in FIGS. 11 and 12 . FIG. 14 is a cross-section of the first wafer package along line 14 - 14 in FIG. 13 . FIG. 15 is a cross-section of the first wafer package along line 15 - 15 in FIG. 12 . FIG. 16 is a view in the direction of arrow A in FIG. 15 , with its components disassembled. FIG. 17 is a cross-section along line 17 - 17 in FIG. 15 . Figures 18a(i) and 18a(ii) are views in the direction of arrows A and B in Figure 15, wherein the latch mechanism is in an unlocked configuration. Figures 18b(i) and 18b(ii) are views similar to Figures 18a(i) and 18a(ii) with the latch mechanism in the locked position. 19 is a perspective view showing how shims are used to set the height of the tabs of the latch mechanism. 20 is a perspective view of components of a pressure monitoring system. 21 is a perspective view of additional components of the pressure monitoring system. 22a and 22b are perspective and side views of components of a pressure monitoring system prior to engagement. 23a and 23b are views of components of a pressure monitoring system similar to Figs. 22a and 22b after engagement. Implementation

[0128] FIG. 1 of the accompanying drawings shows a tester device 10 according to an embodiment of the present invention, the tester device 10 comprising: (i) a fixed structure including a tester 12, a frame 14, a power bus 16, a first slot assembly 18A and a second slot assembly 18B, a tester cable 20, a power cable 22, a cold liquid supply line 24A, a cold liquid return line 24B, a control liquid supply line 24C, a control liquid return line 24D, and a vacuum line 24E; (ii) a portable configuration including a first wafer package 28A and a second wafer package 28B; and (iii) a first wafer 30A and a second wafer 30B. The first wafer package 28A and the second wafer package 28B are described herein as "wafer packages" and the use of the first wafer package 28A and the second wafer package 28B is described as test wafers. It should be understood that the first wafer package 28A and the second wafer package 28B may be generally used to test microelectronic circuits and may alternatively be categorized as a "first microelectronic circuit testing package 28A and a second microelectronic circuit testing package 28B."

[0129] The socket assembly 18A includes a socket assembly body 32, a heat chuck 34, a temperature detector 36, a temperature modification element in the form of a heating resistor 38, a first socket assembly interface 40 and multiple second socket assembly interfaces, wherein the multiple second socket assembly interfaces include a control interface 44, a power interface 46, and a cold liquid supply interface 48A, a cold liquid return interface 48B, a control liquid supply interface 48C, a control liquid return interface 48D and a vacuum interface 48E.

[0130] The first socket assembly interface 40 is located within and mounted to the socket assembly body 32. A second interface in the form of a control interface 44, a power interface 46, and interfaces 48A-48E are mounted in the left wall of the socket assembly body 32.

[0131] The slot assembly 18A can be inserted into the frame 14 from left to right, and can be removed from the frame 14 from right to left. The tester cable 20, the power cable 22, and the pipes 24A to 24E are manually connected to the control interface 44, the power interface 46, and the interfaces 48A to 48E, respectively. Before removing the slot assembly 18A from the frame 14, the tester cable 20, the power cable 22, and the pipes 24A to 24E are manually disconnected from the control interface 44, the power interface 46, and the interfaces 48A to 48E, respectively.

[0132] The socket assembly 18A includes a motherboard 60 with test electronics, a plurality of channel module boards 62 with test electronics, a flexible connector 64, and a connector board 66. The control interface 44 and the power interface 46 are connected to the motherboard 60, and the thermal controller 50 is mounted to the motherboard 60. The channel module board 62 is electrically connected to the motherboard 60. The flexible connector 64 connects the channel module board 62 to the connector board 66. Control functions are provided via electrical conductors connecting the control interface 44 to the motherboard 60. Power is provided to the motherboard 60 via the power interface 46. Both power and control are provided from the motherboard 60 to the channel module board 62 via conductors. The flexible connector 64 provides conductors connecting the channel module board 62 to the connector board 66. The connector board 66 includes conductors connecting the flexible connector 64 to the first socket assembly interface 40. Therefore, the first socket assembly interface 40 is connected to the control interface 44 and the power interface 46 via various conductors, so that power and control can be provided to the first socket assembly interface 40 via the control interface 44 and the power interface 46 .

[0133] The second slot assembly 18B includes similar components to the first slot assembly 18A, and the same reference numbers indicate the same components. The second slot assembly 18B is inserted into the frame 14, and the control interface 44, the power interface 46, and the interfaces 48A to 48E of the second slot assembly 18B are respectively manually connected to a set of separate connection components, and the set of separate connection components includes a separate tester cable 20, a separate power cable 22, and separate conduits 24A to 24E.

[0134] Wafer package 28A includes a wafer package body formed by a thin chuck 72 and a backing plate 74. A plurality of microelectronic components are formed in wafer 30A. Wafer 30A is inserted into the wafer package body between thin chuck 72 and backing plate 74. Wafer package contacts 76 make contact with corresponding contacts (not shown) on wafer 30A. Wafer package 28A further includes a wafer package interface 78 located on backing plate 74. Conductors in backing plate 74 connect wafer package interface 78 to wafer package contacts 76.

[0135] Wafer package 28A has a lip seal 77 (also referred to herein as a "pressure differential cavity seal") connected between backing sheet 74 and thin chuck 72. A vacuum is applied to the area defined by lip seal 77, backing sheet 74, and thin chuck 72. The vacuum holds wafer package 28A together and ensures proper contact between wafer package contacts 76 and contacts on wafer 30A.

[0136] The temperature detector 36 is located in the thermal chuck 34 and is therefore close enough to the wafer 30A to detect a temperature of the wafer 30A that is no more than five degrees Celsius different from the wafer 30A, and preferably no more than one or two degrees Celsius different from the wafer 30A.

[0137] The socket assembly 18A further has a door 82 connected to the socket assembly body 32 by a hinge 84. When the door 82 is rotated to an open position, the wafer package 28A can be inserted into the socket assembly body 32 through the door opening 86. Then, the wafer package 28A is lowered onto the thermal chuck 34 and the door 82 is closed. The thermal chuck 34 is mounted to the socket assembly body 32. The thermal chuck 34 is then essentially a holder for the wafers with a test station.

[0138] The socket assembly 18A further has a thermal interface cavity seal 88 located between the thermal chuck 34 and the thin chuck 72. A vacuum is applied to the area defined by the thermal interface cavity seal 88, the thermal chuck 34, and the thin chuck 72 via the vacuum interface 48E and the vacuum line 90. Thereby, a good thermal connection is provided between the thermal chuck 34 and the thin chuck 72. When heat is generated by the heating resistor 38, the heat is conducted through the thermal chuck 34 and the thin chuck 72 to the wafer 30A. When the thermal chuck 34 is at a lower temperature than the wafer 30A, the heat is conducted in the opposite direction.

[0139] The wafer package interface 78 is coupled to the first socket assembly interface 40. Power and signals are provided to the wafer 30A via the first socket assembly interface 40, the wafer package interface 78, and the wafer package contacts 76. The performance of the components in the wafer 30A is measured via the wafer package contacts 76, the wafer package interface 78, and the first socket assembly interface 40.

[0140] The door 82 of the slot assembly 18B is shown in a closed position. The front seal 100 is mounted on the upper surface of the slot assembly 18A and seals against the lower surface of the slot assembly 18B. The front seal 102 is mounted to the upper surface of the slot assembly 18B and seals against the lower surface of the frame 14. A continuous sealed front wall 104 is provided by the doors 82 of the slot assemblies 18A and 18B and the front seals 100 and 102.

[0141] The socket assembly 18A further includes a thermal controller 50. The temperature detector 36 is connected to the thermal controller 50 via a temperature feedback line 52. Power is provided to the heating resistor 38 via the power interface 46 and the power line 54, so that the heating resistor 38 is heated. Then, the heating resistor 38 heats the thermal chuck 34 and the wafer 30A on the thermal chuck 34. The heating resistor 38 is controlled by the thermal controller 50 based on the temperature detected by the temperature detector 36.

[0142] A thermal fluid passage 224 is formed in the thermal chuck 34. The thermal fluid passage 224 contains a thermal fluid. The thermal fluid is preferably a liquid rather than a gas because liquids are incompressible and heat will convect more quickly into or out of the liquid. Different thermal fluids are used for different applications, with oil being used for the highest temperature applications.

[0143] A control liquid supply line 226 and a control liquid return line 228 connect opposite ends of the hot fluid passage 224 to a cold liquid supply interface 48C and a cold liquid return interface 48D, respectively. The heating resistor 38 acts as a heater, which is installed in a position to heat the hot chuck 34 to heat the hot fluid. By recirculating the hot fluid through the hot fluid passage 224, the hot chuck 222 provides a more uniform heat distribution to the hot chuck 34 and ultimately to the wafer 30A. The temperature of the fluid can also be controlled to add heat to the hot chuck 34 or to cool the hot chuck 34.

[0144] The tester device 10 further includes a cooling system 240, a temperature control system 242, and a vacuum pump 244. The two cold liquid supply lines 24A connected to the first slot assembly 18A and the second slot assembly 18B are also connected to the cooling system 240 via a manifold (not shown). An additional manifold connects the cold liquid return line 24B to the cooling system 240, connects the control liquid supply line 24C to the temperature control system 242, connects the control liquid return line 24D to the temperature control system 242, and connects the vacuum line 24E to the vacuum pump 244. Each slot assembly 18A or 18B has a respective cold plate 246, and the cold plate 246 has a respective fluid passage 248. The cooling system 240 circulates fluid through the fluid passage 248 to cool the cold plate 246. The cold plate 246 then keeps the channel module plate 62 cool. The temperature control system 242 circulates fluid through the thermal fluid passage 224 to control the temperature of the thermal chuck 34 and transfer heat away from or into the wafers 30A and 30B. The vacuum pump 244 provides air at vacuum pressure to the vacuum line 90 .

[0145] The socket assembly 18A includes a divider seal 108 mounted to the upper surface of the socket assembly body 32 above the interior wall 106 of the socket assembly body 32. The divider seal 108 seals against the lower surface of the socket assembly 18B. The socket assembly 18B has a divider seal 110 mounted to the upper surface of the socket assembly body 32 of the socket assembly 18B. The divider seal 108 seals against the lower surface of the frame 14. A continuous sealed divider wall 112 is provided by the interior wall 106 of the socket assemblies 18A and 18B and the divider seals 108 and 110.

[0146] FIG2 shows the tester device 10 along 2-2 in FIG1. ​​The frame 14 defines a first closed-loop air path 120. The air inlet opening and the air outlet opening (not shown) can be opened to change the first closed-loop air path 120 into an open air path, where air at room temperature passes through the frame 14 without being recirculated. The closed-loop path is particularly useful in a clean room environment because it causes less particulate material to be released into the air.

[0147] The tester device 10 further comprises a first fan 122 , a first fan motor 124 and a temperature modifying element in the form of a water cooler 126 .

[0148] The first fan 122 and the first fan motor 124 are mounted in the upper portion of the first closed-loop air path 120. The water cooler 126 is mounted to the frame 14 within the upper portion of the first closed-loop air path 120.

[0149] Wafer packages 28A and 28B are positioned together with socket assemblies 18A and 18B and are located within the lower half of the first closed-loop air path 120 .

[0150] In use, current is provided to the first fan motor 124. The first fan motor 124 rotates the first fan 122. The first fan 122 recirculates air through the first closed-loop air path 120 in a clockwise direction.

[0151] The water cooler 126 then cools the air in the first closed loop air path 120. The air then flows through the wafer package 28A or 28B via the socket assemblies 18A and 18B. The wafer package 28A or 28B is then cooled by the air by convection.

[0152] FIG3 shows the tester device 10 along 3-3 in FIG1 . The frame 14 defines a second closed-loop air path 150. The tester device 10 further includes a second fan 152, a second fan motor 154, and a temperature modifying element in the form of a water cooler 156. As in FIG2 , no electric heater or damper is provided. The air inlet opening and the air outlet opening (not shown) can be opened to change the second closed-loop air path 150 into an open air path, wherein air at room temperature passes through the frame 14 without being recirculated.

[0153] The closed loop path is particularly useful in a clean room environment because it causes less particulate material to be released into the air. The second fan 152 and the second fan motor 154 are located in the upper portion of the second closed loop air path 150. The water cooler 156 is located slightly downstream of the second fan 152 within the second closed loop air path 150. The motherboard 60 and the channel module board 62 that form part of the socket assemblies 18A and 18B are located in the lower half of the second closed loop air path 150.

[0154] In use, current is provided to the second fan motor 154 to rotate the second fan 152. The second fan 152 then recirculates air in a clockwise direction through the second closed loop air path 150. The air is cooled by the water cooler 156. The cooled air then passes through the motherboard 60 and the channel module board 62 so that heat is transferred from the motherboard 60 and the channel module board 62 to the air by convection.

[0155] 2 is kept separate from the air in the second closed-loop air path 150 in FIG3 by the continuous sealed partition wall 112 shown in FIG1. ​​The continuous sealed front wall 104 shown in FIG1 prevents air from escaping from the first closed-loop air path 120.

[0156] As shown in FIGS. 2 and 3 , the same cooling system 240 used in FIG. 1 is also used to cool the water cooler 126. As shown in FIG. 4 , a plenum 160 separates the first closed-loop air path 120 from the second closed-loop air path 150 in all areas except the area provided by the continuous sealed partition wall 112. The frame 14 has a left wall 162 and a right wall 164 that further define the closed-loop air paths 120 and 150.

[0157] 5A, 5B and 5C illustrate how wafer packages 30C, 30D, and 30E may be inserted or removed at any time when all other wafer packages are being used to test components of a wafer and may be in various temperature ramping states. FIG. 6 illustrates the concept in more detail. At time T1, a first wafer package is inserted into frame 14 while a second wafer package is outside frame 14. At T1, heating of the first wafer package is initiated. Between T1 and T2, the temperature of the first wafer package rises from room temperature (i.e., approximately 22 degrees Celsius) to a test temperature of 50 degrees Celsius to 150 degrees Celsius above room temperature at T2. At T2, power is applied to the first wafer package and components in the first wafer package are tested. At T3, a second wafer package is inserted into frame 14 and heating of the second wafer package is initiated. At T4, testing of the first wafer package is terminated. At T4, cooling of the first wafer package is also initiated. At T5, the second wafer package reaches the test temperature, and power is supplied to the second wafer package, and the wafers in the second wafer package are tested. At T6, the second wafer package reaches a temperature close to room temperature and is removed from the frame 14. Then, the third wafer package can be inserted to replace the first wafer package. At T7, the test of the second wafer package is terminated and the cooling of the second wafer package is started. At T8, the second wafer package has cooled to room temperature or close to room temperature and is removed from the frame 14.

[0158] Different tests may be performed at different temperatures. For example, a wafer package may be inserted and a test may be run at room temperature. Another test may be performed during a temperature ramp up. Yet another test may be performed at an elevated temperature. Yet another test may be performed during a temperature ramp down. Two of these tests may be a single test that is run from one temperature stage to the next.

[0159] As shown in Fig. 7, one socket assembly 18A can be removed from or inserted into the frame 14. As described with reference to Fig. 6, the socket assembly 18A can be inserted or removed while other socket assemblies in the frame 14 are used to test components of a wafer.

[0160] As shown in FIG. 8A , a signal distribution board 500 , a contactor 502 , a plurality of pins 504 , a contactor hold-down ring 506 , a fastener 508 and a post 510 are further shown.

[0161] The signal distribution board 500 is mainly made of an insulating material, and a circuit (not shown) is formed in the signal distribution board 500. A contact 512 is formed on the lower side 514 of the signal distribution board 500. A threaded opening 516 is formed into the lower side 514.

[0162] The contactor 502 has a plurality of pin openings 518, post openings 520, and fastener openings 522 formed through the contactor 502 from an upper side 524 to a lower side 526. Each of the pin openings 518 has a first section 528 and a second section 530. When viewed in a plan view, both the first section 528 and the second section 530 are circular. The first section 528 has a larger diameter than the second section 530. The larger diameter of the first section 528 compared to the diameter of the second section 530 makes the first section 528 wider than the second section 530 when viewed in the cross-sectional side view shown in FIG. 8A .

[0163] The column opening 520 has a first section 534 and a second section 536. When viewed in plan, the first section 534 and the second section 536 are both circular. The diameter of the first section 534 is greater than the diameter of the second section 536. Since the diameter of the first section 534 is greater than the diameter of the second section 536, the first section 534 is wider than the second section 536 when viewed in the cross-sectional side view shown in FIG. 8A. The first section 534 and the second section 536 have vertical sidewalls. A horizontal landing 538 connects the vertical sidewalls of the first section 534 and the vertical sidewalls of the second section 536.

[0164] Each pin 504 includes a conductive holder portion 542, a coil spring 544, and a first end piece 546 and a second end piece 548. The first end piece 546 has a first inner portion 550 and a first tip 552. The second end piece 548 has a second inner portion 554 and a second tip 556. The coil spring 544 and the first inner portion 550 and the second inner portion 554 are held in the holder portion 542, wherein the coil spring 544 is located between the first inner portion 550 and the second inner portion 554. The first tip 552 and the second tip 556 protrude out of the upper end and the lower end of the holder portion 542, respectively.

[0165] The upper surface of the first tip 552 forms a terminal 560. The lower end of the second tip 556 forms a contact 562. The coil spring 544 and the first end member 546 and the second end member 548 are made of metal and thus of a conductive material. The coil spring 544 and the first end member 546 and the second end member 548 form a conductor capable of conducting current between the terminal 560 and the contact 562.

[0166] The corresponding pins are inserted into the corresponding pin openings 518 through the upper side 524. The second tip 556 is slightly smaller than the second section 530, so that the second tip 556 passes through the second section 530 and protrudes from the lower side 526. The retainer portion 542 is slightly narrower than the first section 528 but wider than the second section 530 to prevent the pins 504 from falling out of the lower side 526. When the pins 504 are fully inserted into the pin openings 518, and before the contactor 502 is mounted to the signal distribution board 500, the first tip 552 still protrudes above the upper side 524 of the contactor 502.

[0167] Post 510 has a base 564, a force transfer portion 566, and a force delivery portion 568. Post 510 is made from a single piece of metal or other material selected for its strength and brittleness compared to the ceramic material of contactor 502.

[0168] The column 510 is inserted into the column opening 520 through the upper side 524. The support 564 and the force transmission portion 566 are slightly narrower than the second section 536. The force delivery portion 568 is slightly narrower than the first section 534, but wider than the second section 536. The lower surface 570 of the force delivery portion 568 abuts against the platform 538. The column 510 is thereby prevented from falling out of the lower side 526.

[0169] The post 510 has a surface 572 that is in a plane parallel to and below the surface of the underside 526 when the post 510 is fully inserted as shown in FIG8A . The surface 574 of the force delivery portion 568 is in the same plane as the upper side 524 when the post 510 is fully inserted.

[0170] The signal distribution board 500 is positioned on top of the contactor 502. Each of the contacts 512 makes contact with a corresponding one of the terminals 560. Since the terminals 560 are in a plane above the plane of the upper side 524, the lower side 514 is initially spaced apart from the upper side 524.

[0171] The fastener 508 has a threaded shaft 578 and a head 580. The contactor clamping ring 506 has a ring opening 582. The contactor clamping ring 506 is located on the lower surface 584 of the contactor 502. The threaded shaft 578 is inserted from the bottom through the ring opening 582 and then through the fastener opening 522. The head 580 contacts the lower surface of the contactor clamping ring 506. The head 580 is then rotated so that the threads on the threaded shaft 578 are screwed into the threads on the threaded opening 516. The screwing action moves the signal distribution board 500 closer to the contactor 502 and the contactor clamping ring 506. The lower side 514 eventually contacts the upper side 524. The contact 512 moves the first end member 546 downward into the pin opening 518 until the terminal 560 is in the same plane as the upper side 524. The coil spring 544 is compressed and thus slightly deformed so that the first end member 546 can move relatively toward the second end member 548.

[0172] The section of the underside 514 stops against a surface 574 that forms part of the post 510. Since the post 510 is in close proximity to the signal distribution board 500, the post 510 is in a position to transmit force to the signal distribution board 500 via the surface 572.

[0173] The first wafer 32A has a plurality of electronic components formed therein. Each electronic component has a plurality of terminals 588 at the upper surface 590 of the first wafer 32A. When the backing plate 74 and the first wafer 32A are brought together, the first wafer 32A and the backing plate 74 are aligned to ensure that each of the terminals 588 makes contact with a corresponding one of the contacts 562.

[0174] When the pressure below the lower surface 592 of the thin chuck 72 and the upper surface 594 of the signal distribution plate 500 is maintained at atmospheric pressure, a vacuum pressure is generated in the area between the upper surface 590 and the underside 526. The pressure differential generates equal and opposite forces F1 and F2 on the signal distribution plate 500 and the thin chuck 72.

[0175] As shown in FIG. 8B , forces F1 and F2 cause the backing plate 74 to move relatively toward the first wafer 32A and the thin chuck 72. The coil springs 544 are compressed more, allowing the second end member 548 to move into the pin opening 518. Each coil spring 544 is deformed against its spring force (e.g., F3). However, force F1 is still greater than the sum of all forces F3 added together. The upper surface 590 eventually rests against the surface 572 of the support 564. Since the post 510 is close to the signal distribution board 500, the support 564 prevents the upper surface 590 from moving closer to and contacting the lower side 526 of the contactor 502. The first wafer 32A transmits force F4 to the support 564. The force transmitting portion 566 transmits force F4 through the second section 536 of the post opening 520. The force delivery portion 568 receives the force F4 from the force transfer portion 566 and delivers the force F4 to the signal distribution board 500 via the surface 574 .

[0176] Therefore, it can be seen that the force F4 is not borne by the contactor 502, thereby preventing stress that may damage the fragile ceramic material of the contactor 502. Instead, the force F4 is directly transmitted from the electronic component in the form of the first wafer 32A to the signal distribution board 500 via the pillar 510.

[0177] In the embodiment described in FIGS. 8A and 8B , the contactor 502 is used as a support plate having a post opening 520 therein. The signal distribution plate 500 is used as a backing structure, which is located on a first side of the support plate and includes at least one circuit board having a contact 512. The pin 504 is used as a conductor having a contact 562 to make contact with a terminal 588 on an electronic component located on a second side of the support plate opposite to the first side of the support plate. The retainer portion 542 is used as a portion of the conductor held by the support plate. The conductor further has a terminal 560 connected to the contact 512 on the signal distribution plate 500. A spring in the form of a coil spring 544 is provided. The thin chuck 72 is used as a force generating element on the side of the electronic component in the form of the first wafer 32A opposite to the support plate. The force generating element and the support plate can be moved relative to each other to move the electronic component closer to the support plate and deform the spring. The post 510 has: a support 564 having a surface 572 in a plane spaced apart from the plane of the surface of the support plate to prevent the electronic component from moving closer to the support plate; a force transfer portion 566 extending from the support 564 at least partially through the post opening 520; and a force delivery portion 568 extending from the force transfer portion 566, the force delivery portion 568 being held by a backing structure.

[0178] FIG9A shows a portion of the tester device 10 for inserting and removing wafer packages into each slot assembly (e.g., into the slot assembly 18A). The components of the tester device 10 shown in FIG9A are components of a fixed structure, including a frame 300, a portion of the first slot assembly 18A, a first slot assembly interface 40, a holding structure 302, a horizontal transport device 304, a vertical transport device 306, a push bar blade 308, and a locking mechanism 310.

[0179] The frame 300 includes a first frame 312 and a second frame 314 spaced apart from each other. The horizontal transport device 304 is a slide rail installed between the first frame 312 and the second frame 314. The holding structure 302 is installed to slide along the horizontal transport device 304. The opposite ends of the push rod sheet 308 are installed to the first frame 312 and the second frame 314 respectively.

[0180] The locking mechanism 310 includes a connection lever 316, a control lever 318, and a pressure lever 320. The control lever 318 is mounted to the first frame 312 by a pivot connection 322. The vertical transport device 306 is a rigid beam. A connection 324 connects the center point of the vertical transport device 306 and the center point of the push rod piece 308 to each other. The pressure lever 320 has a first link 326 rotatably connected to the control lever 318 and a second link 328 rotatably connected to the end of the vertical transport device 306. In the unlocked configuration shown in FIG. 9A, a line 330 connects the pivot connection 322 and the second link 328, and the first link 326 is located on the left side of the line 330.

[0181] In use, the first wafer package 28A is positioned on the holding structure 302. Then, the first wafer package 28A is moved from left to right into the first slot assembly 18A together with the holding structure 302. The placement and movement of the first wafer package 28A can be performed manually or can be performed using a robot.

[0182] The holding structure 302 slides along the horizontal transport device 304. The connecting lever 316 connects the end of the control lever 318 to the holding structure 302. When the holding structure 302 moves in the horizontal direction along the horizontal transport device 304, the connecting lever 316 rotates the control lever 318 around the pivot connection 322 in a counterclockwise direction.

[0183] The first link 326 rotates in a counterclockwise direction with the control lever 318. The pressure lever 320 converts the movement of the first link 326 into a downward movement of the second link 328. Initially, the downward movement is slight, but when the first wafer package 28A is fully inserted into the first socket assembly 18A, the vertical movement becomes more significant and the vertical transport device 306 engages the first wafer package 28A with the first socket assembly 18A. Thus, the horizontal transport device 304 is operable to horizontally move the first wafer package 28A from a first position into the first socket assembly 18A to a second position, and the vertical transport device 306 is operable to move the first wafer package 28A and the first socket assembly 18A relative to each other in a first vertical direction, thereby engaging the socket assembly interface 40 with the wafer package interface on the first wafer package 28A.

[0184] In FIG. 9A , the control lever 318 is shown in an unlocked position, wherein the first link 326 is located on a first side of the line 330 connecting the pivot connection 322 and the second link 328. The control lever 318 rotates from the unlocked position shown in FIG. 9A through a compressed position in which the vertical transport device 306 deforms the push rod piece 308 by bending the push rod piece 308 against its spring force via the connection 324, and the first link 326 is in line with the pivot connection 322 and the second link 328. The control lever 318 continues to rotate from the compressed position to the locked position shown in FIG. 9B and FIG. 10 . In the locked position, the first link 326 is located on the right side of the line 330, and therefore on a second side of the line 330 opposite the first side. Since the first link 326 has passed the line 330 and the push rod piece 308 has been deformed against its spring force, the first wafer package 28A is locked in place against the socket assembly interface 40.

[0185] The system can be unlocked by moving the holding structure 302 from right to left. The control lever 318 is rotated in a clockwise direction, and the first link 326 is moved from right to left through the line 330. The vertical transport 306 is moved in an upward direction (i.e., a second vertical direction opposite to the first vertical direction) to release the first wafer package 28A from the socket assembly interface 40. Further movement of the holding structure 302 along the horizontal transport 304 will remove the first wafer package.

[0186] 11 and 12 show additional components of the first wafer package 28A, including a pressure relief check valve 600, a vacuum release check valve 602, components of a latching system including a first latch assembly 604A, a second latch assembly 604B, a third latch assembly 604C, and a fourth latch assembly 604D, and an electrical pressure sensor interface 606 forming part of a pressure monitoring system.

[0187] FIG. 13 is a cross section along 13-13 in FIG. 11 and FIG. 12. A decompression passage 608 is formed in the backing sheet 74. The decompression passage 608 has an outlet opening 610 and an intermediate position 612 located in the same plane. The outlet opening 610 is connected to the decompression check valve 600. The intermediate position 612 is closer to the center point of the backing sheet 74 than the outlet opening 610. The decompression passage 608 is formed by first drilling four passages into the backing sheet 74 and then closing one end of three of the passages, so that the resulting decompression passage 608 is completely isolated from the atmospheric pressure outside the backing sheet 74.

[0188] FIG. 14 is a cross section along 14-14 in FIG. 13. The pressure relief passage 608 continues downward from the middle position 612 through the backing plate 74 and through the signal distribution plate 500. The pressure relief passage 608 has an inlet opening 624 that communicates with the pressure differential cavity 622. The lip seal 77 is located in the groove of the thin chuck 72. The pressure differential cavity 622 is formed by the thin chuck 72, the contactor 502, the contactor clamping ring 506, the signal distribution plate 500 and the lip seal 77. The thin chuck 72 forms the lower side of the pressure differential cavity 622, the contactor 502, the contactor clamping ring 506 and the signal distribution plate 500 form the upper side of the pressure differential cavity 622, and the lip seal 77 forms a connection between the upper side and the lower side of the pressure differential cavity 622. The lip seal 77 is completely circular and completely surrounds the contactor 502 and the wafer between the contactor 502 and the thin chuck 72 .

[0189] 14 forms a portable support structure 626. The portable support structure 626 has a first component 628 including the signal distribution board 500 and the backing sheet 74 and a second component 630 including the thin chuck 72.

[0190] In use, the first assembly 628 is spaced apart from the second assembly 630. The wafer is then placed on the thin chuck 72. The first assembly 628 is then positioned on the second assembly 630. The upper periphery of the lip seal 77 makes contact with the signal distribution board 500. The wafer is thus held in the portable support structure 626.

[0191] Referring now to FIG. 13 and FIG. 14 in combination, a pump is connected to the pressure reducing check valve 600. The pressure reducing check valve 600 is then opened. The pressure reducing passage 608 may be at atmospheric pressure at the beginning and the pump subsequently reduces the pressure in the pressure reducing passage 608. The pressure differential cavity 622 is exposed to a pressure lower than atmospheric pressure. The outer surface of the first wafer package 28A is still exposed to atmospheric pressure. As a pressure differential is generated between the pressure differential cavity 622 and the outer surface of the first wafer package 28A, the spring in the contactor 502 is compressed as described with reference to FIG. 8B. The lip seal 77 is made of a resilient elastic material, which causes the lip seal 77 to be compressed against its spring force. As the lip seal 77 is compressed against its spring force, an improved seal is generated between the lip seal 77 and the signal distribution board 500, so that the pressure in the pressure differential cavity 622 can be maintained. The pressure reducing check valve 600 is then closed, thereby isolating the pressure reducing passage 608 from the external atmospheric pressure. The pump can then be disconnected from the pressure reducing check valve 600.

[0192] The first wafer package 28A with the wafers loaded therein can now be moved within the production environment without being connected to a pump or tester. If the wafers need to be removed later, positive pressure can be applied to the vacuum release check valve 602 shown in Figures 11 and 12. The vacuum release check valve 602 is spring-loaded and requires a predetermined amount of pressure to be applied before it opens. Air can then flow through the vacuum release passage in the backing plate 74 to the pressure differential cavity 622 and the pressure differential cavity 622 is brought to atmospheric pressure. The first assembly 628 and the second assembly 630 can then be separated from each other and the wafers can be removed. When a new wafer is loaded into the first wafer package 28A and when it is necessary to reduce the pressure within the pressure differential cavity 622 using the pressure reducing check valve 600, the vacuum release check valve 602 is then closed.

[0193] 15 is a cross section taken along line 15 - 15 in FIG 12 . The first latch assembly 604A includes a first component 640 , a second component 642 , a connecting component 644 , an engagement mechanism 646 , a tuning block 648 , a locking nut 650 , a spacer 652A, a washer 652B, and a locking mechanism 654 .

[0194] The first member 640 and the connecting member 644 are machined from one part and are thus fixed to each other. The first member 640 has a length 660 and a width 662. In the cross section, only half of the width 662 is shown. The length 660 is greater than the width 662. The length 660 is also greater than the diameter of the connecting member 644. A tool pin opening 664 is formed in the first member 640.

[0195] The second member 642 has a body 666 and a first wing 668A and a second wing 668B extending from the body 666. The second member 642 has a length 670 including the wings 668A and 668B and a width 672. Only half of the width 672 is shown in cross section. Since the first wing 668A and the second wing 668B form part of the length 670 and not part of the width 672, the length 670 is much greater than the width 672. The body 666 further has an opening 674 through which the connecting member 644 can be inserted.

[0196] The connecting member 644 includes a first portion 678 and a second portion 680. The second portion 680 is formed with external threads.

[0197] The engagement mechanism 646 is formed by opposing surfaces that define the width 662 of the first component 640. The opposing surfaces forming the engagement mechanism 646 are parallel to each other to facilitate engagement of parallel surfaces on the jaws of a tool capable of subsequently rotating the first component 640.

[0198] The tuning block 648 is mounted in a fixed position relative to the spacer 652A. The thin chuck 72 includes a metal portion 682 and a guard 684. The guard 684 forms a shoulder 686 on the thin chuck 72. The shim 652B is located between the spacer 652A and the signal distribution board 500. Only a single shim 652B is shown. Additional shims are typically inserted on top of each other until the flush surface 690 of the tuning block 648 and the shoulder 686 are at the same vertical elevation.

[0199] The locking mechanism 654 includes a retainer body 694, a spherical ball 696, and a spring 698. The body 666 of the second component 642 forms a part of the locking mechanism 654 because the body 666 has a first locking recess 700A formed therein.

[0200] The retainer body 694 has an outer surface with screw-in threads 702 thereon. The retainer body 694 further has an end with a slot 704 formed therein that can receive a tool (e.g., a screwdriver). A spring 698 is located within the retainer body 694. A spherical ball 696 is located within the mouth of the retainer body 694. The mouth of the retainer body 694 has a slightly reduced size to prevent the spherical ball 696 from falling out of the retainer body 694. The outer surface of the spherical ball 696 forms a locking surface 706. The screw-in threads 702 engage with complementary screw-in threads in the tuning block 648. A tool, such as a screwdriver, is inserted into the slot 704 and then rotated to adjust the distance that the locking surface 706 is spaced from the tuning block 648.

[0201] The intermediate protection member 708 is inserted into the complementary groove on the upper surface of the backing plate 74. Openings 710, 712 and 714 are made in the intermediate protection member 708, the backing plate 74 and the signal distribution board 500, respectively. The second portion 680 of the connecting member 644 is inserted from above through the openings 710, 712 and 714. The length 660 of the first member 640 is greater than the length of any one of the openings 710, 712 and 714 in the same direction, which prevents the first member 640 from entering the openings 710, 712 and 714. The lower surface of the first member 640 rests on the upper surface formed in the intermediate protection member 708. The first portion 678 of the connecting member 644 is then positioned in the openings 710, 712 and 714, and the second portion 680 of the connecting member 644 is positioned below the openings 710, 712 and 714. Then, the spring loaded washer 720, the spacer 652B and the spacer 652A are positioned from below on the connecting member 644. Then the second member 642 is positioned from below on the connecting member 644. The opening 674 forms a sliding fit with the outer diameter of the thread on the second portion 680 of the connecting member 644.

[0202] As the second member 642 slides upward over the connecting member 644, the first locking recess 700A also contacts the locking surface 706. The spherical ball 696 moves a small distance from right to left against the spring force of the spring 698. The locking nut 650 then engages the protruding end of the second portion 680. The rotation of the locking nut 650 causes the body 666 of the second member 642 to be tightened against the spring force of the washer 720. A feeler gauge or other instrument may be used to determine the gap between the second wing 668B and the flush surface 690. The locking nut 650 may be rotated until an acceptable gap is formed between the second wing 668B and the flush surface 690. The gap will generally be the same as the desired gap between the first wing 668A and the shoulder 686. Thus, a locking arrangement is formed by the first member 640, the second member 642, and the connecting member 644.

[0203] As the locking nut 650 rotates, the first locking recess 700A moves upward. The first locking recess 700A is an elongated slot. Therefore, when the second component 642 continues to move upward as the locking nut 650 continues to rotate, the locking surface 706 and the first locking recess 700A can slide on each other.

[0204] As shown in the figure, when assembling the first latch assembly 604A, the thin chuck 72 is held in place. In addition, a negative pressure exists within the pressure differential cavity 622. By placing the first wafer package 28A in a compressed state, it is possible to measure whether the first wing 668A and the second wing 668B are equally spaced from the shoulder 686 and the flush surface 690. The first latch assembly 604A can also be assembled without the thin chuck 72 being held in place by simply measuring the spacing between the second wing 668B and the flush surface 690, assuming that the flush surface 690 has been set at the correct height using one or more shims (such as shim 652B).

[0205] FIG. 16 is a view in the direction A of FIG. 15 , but only shows the connecting member 644 and the signal distribution board 500 .

[0206] The opening 712 has a first dimension 724 on an axis 726 toward the center point of the signal distribution plate 500, and the first dimension 724 is greater than a second dimension 728 transverse to the axis 726. The first portion 678 of the connecting member 644 is smaller than the first dimension 724 in the direction of the axis 726 to allow the signal distribution plate 500 and the backing plate 74 (see FIG. 15) to thermally expand relative to each other. The first portion 678 is sized to fit within the second dimension 728 in a slidable manner to prevent the signal distribution plate 500 from moving relative to the backing plate 74 in a direction transverse to the axis 726.

[0207] The second portion 680 of the connecting member 644 has a first thickness 730 and a second thickness 732. The first thickness 730 can fit through the opening 712 in the direction of the axis 726 and is larger than the second dimension 728 of the opening 712. The second thickness 732 is transverse to the first thickness 730 and can fit through the second dimension 728 of the opening 712. Since the second dimension 728 is relatively large, it allows threads to be formed on the second dimension 728 and still be relatively strong. The entire second portion 680 is located below the opening 712, which allows the connecting member 644 to rotate about its longitudinal axis without the second portion 680 being stuck on the relatively narrow opening 712. The first portion 678 has a circular cross-section with a diameter no larger than the second dimension 728, which allows the first portion 678 to rotate freely within the relatively narrow second dimension 728 of the opening 712.

[0208] Additional openings 734 are formed in the signal distribution board 500 for further anchoring of one or more gaskets. The openings 734 are similarly proportioned to the openings 712, with a longer dimension on an axis 736 toward the center point of the signal distribution board 500. When used in a manufacturing environment, the anchors passing through the openings 734 do not have to be rotated, and the size of the openings 734 is only used to allow thermal expansion of the signal distribution board 500 relative to the backing sheet 74.

[0209] Fig. 17 is a cross section taken along 17-17 in Fig. 15. Anchor 740 is inserted through opening 734 in Fig. 16 to secure spacer 652A and gasket 652B to backing sheet 74. Anchor 740 includes a bolt and a nut, with the head of the bolt on one side and the nut on the opposite side.

[0210] The body 666 has a circular outer surface 742 in which a first locking recess 700A, a second locking recess 700B, a third locking recess 700C, and a fourth locking recess 700D are formed. The locking surface 706 of the spherical ball 696 is located in the first locking recess 700A, which prevents the body 666 from rotating. The opening 674 in the body 666 is keyed to accept the shape of the second part 680 so that if the body 666 remains fixed, the second part 680 cannot rotate.

[0211] A small amount of torque is required to rotate the body 666 and move the spherical ball 696 away from the first locking recess 700A. If the body 666 rotates clockwise, the locking surface 706 rests on the circular outer surface 742 between the first locking recess 700A and the second locking recess 700B. When the body 666 rotates, the second portion 680 rotates with the body 666 by the same angle. When the body 666 is rotated close at 90 degrees, the locking surface 706 locks into the second locking recess 700B. The second locking recess 700B then blocks the rotation of the body 666 and the second portion 680. The first locking recess 700A, the second locking recess 700B, the third locking recess 700C, and the fourth locking recess 700D slightly lock the body 666 at four different rotation angles including 0 degrees, 90 degrees, 180 degrees, and 270 degrees.

[0212] FIG. 18a(i) and FIG. 18a(ii) are views in the direction of arrows A and B in FIG. 15, but with the locking arrangement rotated into the unlocked position. An operator can compare the orientation of the first component 640 to the datum 750 on the upper surface of the thin chuck 72, which in FIG. 18a(ii) shows that the first latch assembly 604A is unlocked. The shoulder 686 is not obstructed from below by the first wing 668A or the second wing 668B. The wings 668A and 668B are held in the position shown in FIG. 18a(i) by the latch mechanism 654 shown in FIG. 15 and FIG. 17. The pressure within the first wafer package 28A can be reduced, and the thin chuck 72 can be removed to insert or replace a wafer. After the wafer has been replaced, the pressure within the first wafer package 28A is reduced again to hold the first wafer package 28A together.

[0213] When the first wafer package 28A is fully assembled, it may be necessary to provide further failsafe so that electrical contact with the wafers can be maintained even if the negative pressure in the first wafer package 28A cannot be maintained due to a system failure. The operator may use a tool (not shown) having a clip and a pin. The pin is inserted into the tool pin opening 664. The tool pin opening 664 is tapered so that the closer the tool is aligned with the first component 640, the further the pin is inserted into the tool pin opening 664. The operator then engages the opposing parallel surfaces of the tool's clip with the opposing parallel surfaces formed by the engagement mechanism 646. Once the tool is engaged with the engagement mechanism 646, the operator rotates the tool and the tool rotates the first component 640. The connecting component 644 and the second component 642 rotate with the first component 640 together with their first wing 668A and second wing 668B. 17, the locking surface 706 leaves the fourth locking recess 700D and slides on the circular outer surface 742. The locking surface 706 is then locked into the first locking recess 700A.

[0214] 18b(i) and 18b(ii) show the first latch assembly after the first and second components 640, 642 have been rotated 90 degrees by an angle 752. The operator can see that the orientation of the first component 640 matches the locked position shown in reference 750. The first tab 668A is now located above the shoulder 686, which prevents the thin chuck 72 from moving in a vertical downward direction away from the rest of the wafer package 28A. The second tab 668B is located above the tuning block 648. By rotating the first component 640 90 degrees clockwise or counterclockwise, the first tab 668A can be disengaged from the shoulder 686. Either tab 668A or 668B can be used to lock the thin chuck 72 in place.

[0215] FIG. 19 shows how the height of the flush surface 690 of the tuning block 648 can be adjusted using one or more shims 652B-652F. The tuning block 648 should ideally be located at the same height as the shoulder 686. Since the tuning block 648 is mounted to the spacer 652A, the tuning block 648 moves up and down with the spacer 652A as more of the shims 652B-652F are inserted. If the flush surface 690 is lower than the shoulder 686, more shims can be inserted to raise the flush surface 690, or if the flush surface 690 is higher than the height of the shoulder 686, the shims can be removed.

[0216] The engagement mechanism 646 is conveniently located directly on the first component 640. In another configuration, the engagement mechanism may be formed directly on the second component 642 or directly on the connecting component 644.

[0217] In another embodiment, the engagement mechanism may be a separate mechanism relative to the first component 640 and the second component 642 and the connecting component 644. For example, a worm gear may be formed on the connecting component 644, and the engagement mechanism may be a separate rotatable mechanism that rotates the worm gear.

[0218] The engagement mechanism may also be located between the first member 640 and the connecting member 644. For example, the first flap 668A may pivot downward away from the shoulder 686 and return toward the shoulder 686 by a cam system located between the first member 640 and the connecting member 644. Alternatively, such a cam system used as an engagement mechanism may be located between the connecting member 644 and the second member 642. Alternatively, the connecting member 644 may be made in two parts, and the engagement mechanism may connect the two parts and adjust the spacing between the two parts, and then the spacing adjustment may cause the flap to pivot.

[0219] The first latch assembly 604A mainly uses incompressible and inflexible materials. In alternative embodiments, strips or other flexible materials may be used with the same or similar purposes in mind.

[0220] Alternatively, instead of having the engagement mechanism 646 on an exterior surface of the first component 640, the engagement mechanism may be located on an interior surface of any component.

[0221] 12, the first latch assembly 604A, the second latch assembly 604B, the third latch assembly 604C, and the fourth latch assembly 604D are identical except for their respective positions and orientations. The first latch assembly 604A and the third latch assembly 604C are located on opposite sides of the thin chuck 72, and the second latch assembly 604B and the fourth latch assembly 604D are located on opposite sides of the thin chuck 72. Since the latch assemblies 604A-604D are located on more than just one side of the thin chuck 72 (i.e., the latch assemblies 604A-604D cover more than 180 degrees around the perimeter of the thin chuck 72), the latch assemblies 604A-604D can collectively hold all sides of the thin chuck 72 in place around its entire perimeter.

[0222] The latching system provided by the first latch assembly 604A, the second latch assembly 604B, the third latch assembly 604C, and the fourth latch assembly 604D helps facilitate movement of the first wafer package 28A in a manufacturing environment without requiring human supervision. Without the latching system, human supervision may be required to determine when the negative pressure in the first wafer package 28A fails and the wafer package 28A is spaced apart. The latching system provides a structural fail-safe to prevent the first wafer package 28A from being spaced apart even if the first wafer package 28A draws air from the outside.

[0223] Figures 20, 21, 22a and 22b show additional components of the pressure monitoring system, which include a pressure sensing passage 760 (Figure 21), a pressure sensor 762 (Figures 22a and 22b), the electrical pressure sensor interface 606 mentioned with reference to Figure 11 (Figures 20, 21, 22a and 22b), an electrical pressure connector interface 764, a mounting bracket 766, a ribbon cable 768 having a first connector 770 and a second connector 772 at its opposite ends (Figures 20, 22a and 22b), a connector block 774 and a stiffener plate 776 (Figure 20).

[0224] The pressure sensing passage 760 is formed in the backing sheet 74 in a manner similar to the pressure reducing passage 608 described with reference to FIG13. The pressure sensing passage 760 has a first end located within the pressure differential cavity 622, as shown in FIG14. The pressure sensing passage 760 has a second end opposite the first end, the second end being proximate to the outer edge of the backing sheet 74.

[0225] The electrical pressure sensor interface 606 is in the form of a printed circuit board having a substrate 780 and a plurality of contacts, including a first contact 782A, a second contact 782B, and a third contact 782C formed on the substrate 780 .

[0226] The pressure sensor 762 is mounted to the substrate 780 on the side of the substrate 780 opposite the first contact 782A, the second contact 782B and the third contact 782C. The pressure sensor 762 is electrically connected to the first contact 782A, the second contact 782B and the third contact 782C via the substrate 780. The pressure sensor 762 is capable of sensing the pressure of a gas (in this case, air) and converting the pressure into an electrical signal, wherein the magnitude of the pressure is indicated by the magnitude of the signal or another variable. Pressure can be conveniently detected using a diaphragm, which displaces a known distance when the pressure increases or decreases. Other pressure sensors are also within the scope of the present invention, such as pressure sensors using piezoelectric crystals or pressure sensors using strain gauges. In the case of a moving diaphragm, the movement can be converted into a voltage, such as by moving an inductive coil and then the magnitude of the voltage indicates the displacement and therefore the pressure. The pressure sensor may be, for example, the MLX90809 sold by Melexis (www.melexis.com). The electrical pressure sensor interface 606 is mounted to the backing sheet 74 using fasteners 784. The diaphragm of the pressure sensor 762 is then exposed to air at the second end of the pressure sensing passage 760. The pressure sensor 762 can thus sense the pressure within the pressure differential cavity 622.

[0227] The electrical pressure connector interface 764 has a plate 790 and a plurality of terminals, including a first terminal 792A to a sixth terminal 792F fixed to the plate 790. The plate 790 is mounted to the mounting bracket 766 by means of fasteners 794. The stiffening plate 776 is fixed between the two push rods 308. The mounting bracket 766 is fixed to the stiffening plate 776 using fasteners 796. The slot assembly 32 together with the push rods 308 and the stiffening plate 776 form part of a fixed structure, and thus the electrical pressure connector interface 764 is mounted to the fixed structure.

[0228] The connector block 774 is mounted to the socket assembly body 32. The connectors 770 and 772 are respectively connected to the electrical pressure connector interface 764 and the connector block 774. The first terminal 792A to the sixth terminal 792F are connected to the pressure sensing board of the electronic tester via the first connector 770, the ribbon cable 768 and the second connector 772.

[0229] 23a and 23b illustrate the engagement of the electrical pressure sensor interface 606 with the electrical pressure connector interface 764 when the first wafer package 28A is inserted into the socket assembly. The first contact 782A, the second contact 782B, and the third contact 782C first contact the first terminal 792A, the second terminal 792B, and the third terminal 792C, respectively. Further movement of the electrical pressure sensor interface 606 causes the first contact 782A, the second contact 782B, and the third contact 782C to engage the fourth terminal 792D, the fifth terminal 792E, and the sixth terminal 792F, respectively. Thus, the first contact 782A contacts both the first terminal 792A and the fourth terminal 792D. Similarly, each of the contacts 782B and 782C contacts two of the terminals 792B, 792C, 792E, and 792F.

[0230] The terminals 792A to 792F can be resiliently depressed relative to the plate 790 to ensure proper contact with the contacts 782A to 782C. The ribbon cable 768 enables a small amount of movement of the stiffening plate 776 relative to the socket assembly 32 when the first wafer package 28A is inserted.

[0231] As the wafer is tested, the pressure within the pressure differential cavity 622 can be monitored throughout the process. If the wafer fails the test, the tester can be programmed to determine whether the test may be the result of a negative pressure failure within the pressure differential cavity 622.

[0232] Although certain exemplary embodiments have been described and shown in the drawings, it should be understood that these embodiments are merely illustrative and non-limiting and that the invention is not limited to the specific construction and arrangements shown and described since modifications may be conceived by one of ordinary skill in the art.

[0233] 2-2, 3-3, 4-4, 13-13, 15-15, 17-17, 330: line 10: Tester device 12: Tester 14: Framework 16: Power bus 18A: First slot assembly / slot assembly 18B: Second slot assembly / slot assembly 20: Tester cable 22: Power cables 24A: Cold liquid supply line / pipeline 24B: Cold liquid return line / pipeline 24C: Control liquid supply line / pipeline 24D: Control liquid return line / pipeline 24E: Vacuum lines / pipes 28A: First wafer package / wafer package / first microelectronic circuit test package 28B: Second wafer package / wafer package / second microelectronic circuit test package 30A: First Wafer / Wafer 30B: Second Wafer / Wafer 30C, 30D, 30E: Wafer 32: Total cost of slot 32A: First Wafer 34, 222: Hot chuck 36: Temperature detector 38: Heating resistor 40: First slot assembly interface / slot assembly interface 44: Control Interface 46: Power Interface 48A: Cold liquid supply interface / interface 48B: Cold liquid return interface / interface 48C: Control liquid supply interface / cold liquid supply interface / interface 48D: Control liquid return interface / cold liquid return interface / interface 48E: Vacuum interface / interface 50: Heat controller 52: Temperature feedback circuit 54: Power lines 60: Motherboard 62: Channel module board 64: Flexible connector 66: Connecting plate 72: Thin chuck 74: Backing plate 76: Wafer package contact 77: Lip seal 78: Wafer package interface 82: Door 84: Hinge 86: Door opening 88: Thermal interface cavity seal 90: Vacuum pipeline 100, 102: front seal 104: Continuous sealed front wall 106: Inner wall 108, 110: Separation seal 112: Continuous sealed partition wall 120: First closed-loop air path / closed-loop air path 122:First Fan 124: First fan motor 126, 156: Water cooler 150: Second closed-loop air path / closed-loop air path 152: Second Fan 154: Second fan motor 160: Gas collecting chamber 162:Left wall 164: Right Wall 224: Thermal Fluid Path 226: Control liquid supply line 228: Control liquid return line 240: Cooling system 242: Temperature Control System 244: Vacuum Pump 246: Cold Plate 248: Fluid Path 300:Frame 302: Holding structure 304: Horizontal transport device 306: Vertical transport device 308: Push rod 310: Locking mechanism 312: The first seat 314: Second Stand 316: Connecting lever 318: Control Lever 320: Pressure lever 322: Pivot connector 324: Connector 326: First connecting rod 328: Second connecting rod 500:Signal distribution board 502: Contactor 504: Pin 506: Contactor clamping ring 508, 784, 794, 796: Fasteners 510: column 512, 562: Contact 514, 526: lower side 516: Threaded opening 518: Pin opening 520: Column opening 522: Fastener opening 524: Upper side 528, 534: first section 530, 536: Second section 538:Horizontal platform / platform 542: Conductive holder part / holder part 544: Coil spring 546: first end member 548: Second end member 550: First internal part 552: First Tip 554: Second inner part 556: Second tip 560, 588: terminal 564:Support 566: Force transmission part 568: force delivery part 570, 584, 592: lower surface 572, 574: Surface 578:Threaded shaft 580:Head 582: Ring opening 590, 594: upper surface 600: Pressure reducing check valve 602: Vacuum release check valve 604A:First latch assembly / latch assembly 604B: Second latch assembly / latch assembly 604C: Third latch assembly / latch assembly 604D: Fourth latch assembly / latch assembly 606: Electrical pressure sensor interface 608: Decompression channel 612: Middle position 622: Pressure differential cavity 624, 674, 710, 712, 714, 734: Open 626: Portable support structure 628: First Component 630: Second component 640: First component 642: Second component 644: Connecting parts 646:Joint mechanism 648: Tuning Block 650: Lock nut 652A: Spacer 652B, 652C, 652D, 652E, 652F: Gasket 654: Locking mechanism 660, 670: Length 662, 672: Width 664: Tool pin opening 666:Ontology 668A: First wing / wing 668B: Second wing / wing 678: Part 1 680: Part 2 682:Metal Part 684: Protective parts 686: Shoulder 690:Flush surface 694: Retainer body 696: Spherical Ball 698: Spring 700A: first locking recess 700B: Second locking recess 700C: Third locking recess 700D: Fourth locking recess 702: Screw into thread 704: Slot 706: Lock surface 708: Intermediate protection component 720: Washer 724: First Size 726, 736: Axis 728: Second size 730: first thickness 732: Second thickness 740: Anchor 742: Circular outer surface 750: Benchmark 752: Angle 760: Pressure sensing channel 762: Pressure sensor 764: Electrical pressure connector interface 766:Mounting bracket 768: Ribbon Cable 770: First connecting piece / connecting piece 772: Second connecting piece / connecting piece 774:Connector block 776: Stiffening Plate 780:Substrate 782A: First contact / contact 782B: Second contact / contact 782C: Third contact / contact 790: Board 792A: First terminal / terminal 792B: Second terminal / terminal 792C: Third terminal / terminal 792D: Fourth terminal / terminal 792E: Fifth terminal / terminal 792F: Sixth terminal / terminal F1, F2, F3, F4: Force T1, T2, T3, T4, T5, T6, T7, T8: time

Claims

1. A microelectronic circuit test kit, comprising: A portable support structure includes a first component and a second component for holding a substrate between a first component and a second component, the substrate carrying microelectronic circuitry and having a plurality of terminals connected to the microelectronic circuitry; a plurality of contacts located on the first component, the contacts mating with the terminals for contacting the terminals; and a pressure differential cavity seal located between the first component and the second component, the pressure differential cavity seal forming a closed pressure differential cavity together with the surfaces of the first component and the second component. A first passage, formed to pass through one of the first component and the second component, the first passage having a first opening at the pressure differential cavity and a second opening outside the pressure differential cavity; a valve, connected to the first passage, the valve opening allowing gas to flow through the first passage, the valve closing preventing gas from flowing through the first passage; a first interface, located on the portable support structure and connected to the contact, for connecting to a second interface located on the fixed structure when the portable support structure is detachably secured by the fixed structure. And a fixing system, including a first fixing component, the first fixing component comprising: a first part engaging with the first component; a second part engaging with the second component; and a connecting part having opposite ends respectively fixed to the first part and the second part to form a locking configuration.

2. The microelectronic circuit test kit as claimed in claim 1, wherein the first fixing component comprises: An engagement mechanism is connected to the locking configuration and operable to move the locking configuration between a locked position and an unlocked position, wherein in the locked position the locking configuration holds the first component and the second component locked in a closed position, and in the unlocked position the locking configuration allows the first component and the second component to move from a closed relationship to an open relationship.

3. The microelectronic circuit test kit as claimed in claim 2, wherein the engagement mechanism moves the second component between the locked position and the unlocked position.

4. The microelectronic circuit test kit as claimed in claim 3, wherein the second component rotates between the locked position and the unlocked position.

5. The microelectronic circuit test kit as claimed in claim 4, wherein the second component rotates about an axis perpendicular to the substrate between the locked position and the unlocked position.

6. The microelectronic circuit test kit as claimed in claim 4, wherein the engagement mechanism includes a base-forming surface on the first component, the base contacting a surface on a tool clip, the tool clip being rotatable to rotate the first component, and the first component rotating the second component via the connecting member to move between the locked position and the unlocked position.

7. The microelectronic circuit test kit as claimed in claim 6, wherein the surface forming the base on the first component is the outer surface of the first component.

8. The microelectronic circuit test kit as claimed in claim 7, wherein the first component has a tool pin opening located in the first component for aligning the tool pins with the first component.

9. The microelectronic circuit test kit of claim 4, wherein the second component has a body and at least a first wing extending from the body, wherein when moved to a first locked position, the first wing moves over a shoulder of the second component, and when moved from the first locked position toward the unlocked position, the first wing leaves the shoulder.

10. The microelectronic circuit test kit of claim 9, wherein the second component has a second flap extending from the body, wherein when moved to a second locked position, the second flap moves over the shoulder of the second component, and when moved from the second locked position toward the unlocked position, the second flap leaves the shoulder.

11. The microelectronic circuit test kit as claimed in claim 10, wherein the fixing system further comprises: A tuning block is mounted in a fixed position relative to the second component. The tuning block has a flush surface. When the first wing is located above the shoulder, the second wing is located above the flush surface. The second component can be adjusted relative to the first component to adjust the gap between the flush surface and the second wing.

12. The microelectronic circuit test kit as claimed in claim 1, wherein the fixing system further comprises: A locking nut having threads that engage with the pattern on the connecting member to adjust the second member in a rotatable manner relative to the connecting member.

13. The microelectronic circuit test kit as claimed in claim 11, wherein the fixing system further comprises: A shim, located between the tuning block and the first component, is used to adjust the distance between the flush surface and the first component.

14. The microelectronic circuit test kit as claimed in claim 11, wherein the fixing system further comprises: A locking mechanism having a locking surface that locks into a first locking recess to prevent the second component from moving out of the locked position and locks into a second locking recess to prevent the second component from moving out of the unlocked position.

15. The microelectronic circuit test kit as claimed in claim 14, wherein the first latch recess and the second latch recess are located on the locking configuration.

16. The microelectronic circuit test kit as claimed in claim 15, wherein the first latch recess and the second latch recess are located on the second component.

17. The microelectronic circuit test kit of claim 4, wherein the second component includes a backing plate and a signal distribution board, wherein a portion of the signal distribution board is located between the backing plate and the first component, the signal distribution board having an opening through which the connecting member is inserted, the opening having a first dimension in an axis toward a center point of the signal distribution board, the first dimension being larger than a second dimension transverse to the axis, the connecting member having a first portion smaller than the first dimension in the direction of the axis such that the signal distribution board and the backing plate can thermally expand relative to each other, and the first portion being sized to slidably fit within the second dimension of the opening to prevent the signal distribution board from moving relative to the backing plate in a direction transverse to the axis.

18. The microelectronic circuit test kit of claim 17, wherein the connecting member has a second portion having a first thickness and a second thickness transverse to the first thickness, the first thickness being adaptable to pass through the opening in the direction of the axis during insertion and being larger than a second dimension of the opening, the second thickness being adaptable to pass through the second dimension of the opening during insertion.

19. The microelectronic circuit test kit as claimed in claim 1, wherein the fixing system comprises: The second fixing assembly, wherein each corresponding fixing assembly has: a first component that engages with the first assembly; The second component engages with the second assembly; And a connecting component having opposite ends respectively fixed to the first component and the second component to form a locking configuration.

20. The microelectronic circuit test kit as claimed in claim 19, wherein the second fixing component comprises: An engagement mechanism is connected to the locking configuration and operable to move the locking configuration between a locked position and an unlocked position, wherein in the locked position the locking configuration holds the first component and the second component locked in a closed position, and in the unlocked position the locking configuration allows the first component and the second component to move from a closed relationship to an open relationship.

21. The microelectronic circuit test kit as claimed in claim 19, wherein the first fixing component and the second fixing component have corresponding second parts located on different sides of the second component.

22. The microelectronic circuit test kit as claimed in claim 1, wherein the pressure differential cavity seal surrounds the contact and the terminal.

23. The microelectronic circuit test kit as claimed in claim 1, wherein the pressure differential cavity seal is secured to the second component when the first component is spaced apart from the second component.

24. The microelectronic circuit test kit as claimed in claim 1, wherein the pressure differential cavity seal is a lip seal.

25. The microelectronic circuit test kit as claimed in claim 1, wherein the first passage is a pressure-reducing passage, the first opening is an inlet opening, the second opening is an outlet opening, the valve is a pressure-reducing valve, the gas is air capable of being discharged from the pressure differential cavity such that the first component and the second component move relative to each other to ensure proper contact between the contact and the terminal, and the closure of the pressure-reducing valve prevents air from entering the pressure differential cavity.

26. The microelectronic circuit test kit as claimed in claim 25, wherein the pressure reducing valve is a pressure reducing check valve, a vacuum release passage is formed through the assembly having the pressure reducing check valve, the vacuum release passage having an inlet opening at the pressure differential cavity and an outlet opening outside the pressure differential cavity, further comprising: The second valve is a vacuum release valve connected to the vacuum release passage. The opening of the vacuum release valve allows air to enter the pressure differential cavity, and the closing of the vacuum release valve prevents air from escaping from the pressure differential cavity.

27. The microelectronic circuit test kit as claimed in claim 1, wherein the substrate is a wafer having a plurality of microelectronic circuits.

28. The microelectronic circuit test kit as claimed in claim 1, wherein the contacts are pins, each of the pins having a spring that is pressed against its spring force when a corresponding contact of the contacts is pressed down by a corresponding terminal.

29. A testing apparatus, comprising: A portable support structure includes a first component and a second component for holding a substrate between a first component and a second component, the substrate carrying microelectronic circuitry and having a plurality of terminals connected to the microelectronic circuitry; a plurality of contacts located on the first component, the contacts mating with the terminals for contacting the terminals; and a pressure differential cavity seal located between the first component and the second component, the pressure differential cavity seal forming a closed pressure differential cavity together with the surfaces of the first component and the second component. A first passage is formed to pass through one of the first component and the second component, the first passage having: a first opening at the pressure differential cavity; and a second opening outside the pressure differential cavity; a valve connected to the first passage, the valve opening allowing gas to flow through the first passage, and the valve closing preventing air from flowing through the first passage; a first interface located on the portable support structure and connected to the contact member to connect to a second interface located on the fixing structure when the portable support structure is detachably secured by the fixing structure; a fixing system including a first fixing assembly, the first fixing assembly including: a first component engaging with the first component; a second component engaging with the second component; and a connecting component having opposite ends respectively fixed to the first component and the second component to form a locking configuration; a fixing structure from which the portable support structure can be received and secured and removed from the fixing structure; A second interface, located on the fixed structure, is connected to the first interface when the portable support structure is fixed by the fixed structure, and is disconnected from the first interface when the portable support structure is removed from the fixed structure; and an electrical tester is connected to the terminal through the second interface, the first interface, and the contact, so that a signal is transmitted between the electrical tester and the microelectronic circuit to test the microelectronic circuit.

30. A method for testing a microelectronic circuit held by a substrate, comprising: The substrate is held between a first component and a second component of a portable support structure. The first component has a contact that contacts a terminal of the substrate, the terminal being connected to the microelectronic circuit. A first passage is formed through one of the first and second components, the first passage having a first opening at a pressure differential cavity and a second opening outside the pressure differential cavity. A pressure differential cavity seal is positioned between the first and second components to form a closed pressure differential cavity by the surfaces of the first and second components and the pressure differential cavity seal. A valve is opened to allow gas to flow through the first passage. The valve is closed to prevent gas from flowing through the first passage; a locking configuration is moved from an unlocked position to a locked position, wherein in the unlocked position the locking configuration allows the first component and the second component to move from a closed relationship to a spaced relationship, and in the locked position the locking configuration maintains the first component and the second component locked in the closed position, wherein the locking configuration includes: a first component engaging with the first component; a second component engaging with the second component; and a connecting component having opposite ends respectively fixed to the first component and the second component; a fixed structure receiving the portable support structure, a first interface on the portable support structure being connected to a second interface on the fixed structure; and transmitting signals between an electrical tester and the microelectronic circuit via the terminals, the contacts, and the first and second interfaces to test the microelectronic circuit; Remove the portable support structure from the fixed structure; and move the locking configuration from the locked position to the unlocked position, wherein in the locked position the locking configuration keeps the first component and the second component locked in the closed position, and in the unlocked position the locking configuration allows the first component and the second component to move from the closed relationship to the spaced relationship.

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