High temperature liquid supply system, semiconductor manufacturing device, and high temperature liquid supply method

Abstract

This application provides a high-temperature liquid supply system, a semiconductor manufacturing apparatus, and a high-temperature liquid supply method. The high-temperature liquid supply system includes a tank, an external circulation pipeline, a nozzle, and a first valve. The tank is used to store a liquid having a predetermined temperature range. The external circulation pipeline is connected to the tank to transport the liquid. The first valve is disposed on the external circulation pipeline and is used to regulate the liquid flow to a small flow rate, and to deliver a small flow rate of liquid to the nozzle, with the remaining liquid returning to the tank via a return flow.

Claims

1. A high-temperature liquid supply system, comprising: A tank for storing and maintaining a liquid having a predetermined temperature range; an external circulation pipeline connected to the tank to form an external circulation loop for transporting the liquid, wherein the external circulation pipeline includes: a main path, one end of which is connected to an outlet of the tank; a first branch path, one end of which is connected to an inlet of the tank; and a second branch path, one end of which, together with the other end of the main path and the other end of the first branch path, is connected to a node; a nozzle connected to the other end of the second branch path for spraying the liquid having the predetermined temperature range onto a wafer surface; and a first valve disposed on the second branch path for adjusting the liquid to a small flow rate and delivering a small flow rate of the liquid to the nozzle, wherein the remaining liquid flows back to the tank via the first branch path, and wherein the first valve is a needle valve.

2. The high-temperature liquid supply system of claim 1, wherein the high-temperature liquid supply system further includes a second valve disposed on the main path for controlling the total flow rate of the liquid delivered from the tank to the external circulation pipeline.

3. The high-temperature liquid supply system of claim 1, wherein the high-temperature liquid supply system further includes a third valve disposed on the first diversion path for controlling the flow rate of the liquid returning to the tank.

4. The high-temperature liquid supply system of claim 1, wherein the high-temperature liquid supply system further includes an internal circulation pipeline connected to the tank and forming an internal circulation loop.

5. The high-temperature liquid supply system of claim 4, wherein the high-temperature liquid supply system further comprises: a first switching valve disposed on the main path of the external circulation pipeline for selectively opening or closing the external circulation loop; and a second switching valve disposed on the internal circulation pipeline for selectively opening or closing the internal circulation loop.

6. The high-temperature liquid supply system of claim 1, wherein the high-temperature liquid supply system further includes a temperature sensor disposed on the tank and / or the nozzle for measuring the temperature of the liquid in the tank and / or the nozzle.

7. A semiconductor manufacturing apparatus, comprising: A wafer holder, rotatable about an axis, is configured to hold a wafer; A tank for storing and maintaining a liquid having a predetermined temperature range; an external circulation pipeline connected to the tank to form an external circulation loop for transporting the liquid, wherein the external circulation pipeline includes: a main path, one end of which is connected to an outlet of the tank; a first branch path, one end of which is connected to an inlet of the tank; and a second branch path, one end of which, together with the other end of the main path and the other end of the first branch path, is connected to a node; a nozzle connected to the other end of the second branch path and correspondingly disposed with respect to the wafer holding portion, for spraying the liquid having the predetermined temperature range onto the wafer surface; and a first valve disposed on the second branch path for adjusting the liquid to a small flow rate and delivering a small flow rate of the liquid to the nozzle, wherein the remaining liquid flows back to the tank via the first branch path, and wherein the first valve is a needle valve.

8. The semiconductor manufacturing apparatus of claim 7, wherein the semiconductor manufacturing apparatus further includes a second valve disposed on the main path for controlling the total flow rate of the liquid delivered from the tank to the external circulation pipeline.

9. The semiconductor manufacturing apparatus of claim 7, wherein the semiconductor manufacturing apparatus further includes a third valve disposed on the first diversion path for controlling the flow rate of the liquid returning to the tank.

10. The semiconductor manufacturing apparatus of claim 7, wherein the semiconductor manufacturing apparatus further includes an internal circulation pipeline connected to the tank and forming an internal circulation loop.

11. The semiconductor manufacturing apparatus of claim 10, wherein the semiconductor manufacturing apparatus further comprises: a first switching valve disposed on the main path of the external circulation pipeline for selectively opening or closing the external circulation loop; and a second switching valve disposed on the internal circulation pipeline for selectively opening or closing the internal circulation loop.

12. The semiconductor manufacturing apparatus of claim 7, wherein the semiconductor manufacturing apparatus further includes a temperature sensor disposed on the tank and / or the nozzle for measuring the temperature of the liquid in the tank and / or the nozzle.

13. A method for supplying a high-temperature liquid, applicable to a high-temperature liquid supply system, wherein the high-temperature liquid supply system includes a tank, an external circulation pipeline, a first valve, and a nozzle, the tank being used to store and maintain a liquid having a predetermined temperature range, the external circulation pipeline being connected to the tank to form an external circulation loop, the first valve and the nozzle being disposed on the external circulation pipeline, and wherein the high-temperature liquid supply method includes: Control the tank to output the liquid to the external circulation pipeline; The liquid is regulated to a low flow rate by the first valve and the low flow rate of the liquid is delivered to the nozzle, wherein the first valve is a needle valve; the nozzle is controlled to spray the liquid with a low flow rate and the predetermined temperature range onto the wafer surface; and the remaining liquid is controlled to flow back to the tank through the external circulation pipeline.

14. The high-temperature liquid supply method of claim 13, wherein the high-temperature liquid supply system further includes a second valve disposed on the external circulation pipeline, and the method further includes: controlling the total flow rate of the liquid delivered from the tank to the external circulation pipeline by means of the second valve.

15. The high-temperature liquid supply method of claim 13, wherein the high-temperature liquid supply system further includes a third valve disposed on the external circulation pipeline, and the method further includes: controlling the flow rate of the liquid returning to the tank by means of the third valve.

16. The high-temperature liquid supply method of claim 13, wherein the high-temperature liquid supply system further includes an internal circulation pipeline connected to the tank, and the method further includes: controlling the tank to output the liquid to the internal circulation pipeline to form an internal circulation loop.

17. The high-temperature liquid supply method of claim 16, wherein the high-temperature liquid supply system further comprises a first switching valve and a second switching valve, the first switching valve being disposed on the external circulation pipeline and the second switching valve being disposed on the internal circulation pipeline, and the method further comprises: when the first switching valve is open, closing the second switching valve to open the external circulation loop; and when the second switching valve is open, closing the first switching valve to open the internal circulation loop.

18. The high-temperature liquid supply method of claim 13, wherein the high-temperature liquid supply system further includes a temperature sensor disposed on the tank and / or the nozzle, and the method further includes: controlling the temperature sensor to measure the temperature of the liquid in the tank and / or the nozzle.

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