Inkjet chip structure

Abstract

This invention proposes an inkjet chip structure comprising a first surface, a second surface, an ink supply port, and a plurality of nozzles. The ink supply port includes a first aperture portion and a second aperture portion. The second aperture portion extends from the bottom surface of the first aperture portion through to the second surface and includes at least one connecting rib. The first aperture portion has a depth of 20 μm or more. At least one connecting rib is disposed between two sidewalls of the second aperture portion, separating the second aperture portion to form two or more through holes. The larger volume of the first aperture portion allows for the containment of more ink, providing sufficient ink storage.

Claims

1. An inkjet chip structure, the inkjet chip comprising: a first surface; a second surface; an ink supply port recessed in the inkjet chip, extending longitudinally from the first surface to the second surface, comprising: a first hole recessed from the first surface toward the second surface, and having a first hole depth, wherein the first hole depth is 20 μm or more; and a second hole recessed from the bottom surface of the first hole through to the second surface, and having a second hole depth, wherein the second hole depth is 30 μm or more, wherein at least one connecting rib extends laterally between two sidewalls of the second hole, the at least one connecting rib connecting the two sidewalls on both sides of the second hole and separating the second hole to form a plurality of through holes, the through holes being located on the second surface, and the through holes occupying more than 2.5% of the area of ​​the second surface; and a plurality of nozzles located on one side of the ink supply port and communicating with the ink supply port.

2. The inkjet wafer structure as described in claim 1, wherein the spacing between adjacent through holes on the second surface of the inkjet wafer is 30 μm or more.

3. The inkjet wafer structure as described in claim 1, wherein the vertical distance between two longitudinally adjacent nozzles is between 80 μm and 90 μm.

4. The inkjet wafer structure as described in claim 1, wherein the vertical distance between the two longitudinally adjacent nozzles is between 40 μm and 45 μm.

5. The inkjet wafer structure as claimed in claim 1, wherein the plurality of nozzles are arranged longitudinally at a distance between 24,000 μm and 26,000 μm.

6. The inkjet chip structure as described in claim 1, wherein the total number of the plurality of nozzles is 300 or more.

7. The inkjet chip structure as described in claim 1, wherein the total number of the plurality of nozzles is 600 or more.

8. The inkjet chip structure as described in claim 1, wherein the lateral distance between the ink supply holes is 80 μm or more.

9. The inkjet wafer structure as claimed in claim 1, wherein the inkjet wafer comprises: a wafer substrate; a heating resistor layer for heating ink; a conductive layer for supplying energy to the heating resistor layer for heating the ink; a protective layer; a barrier layer; an orifice plate, wherein the wafer substrate, the heating resistor layer, the conductive layer, the protective layer, the barrier layer, and the orifice plate form a stacked structure; and an ink chamber formed between the protective layer, the barrier layer, and the orifice plate, wherein the plurality of orifices are formed through the orifice plate at the top of the ink chamber.

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