Silicon pad design

Abstract

This disclosure relates to a semiconductor device comprising: a pixel region including a plurality of active pixels, a gasket seal defining the pixel region, and at least one conductive element for electrical connection. The conductive element includes a plurality of conductive sub-elements.

Description

[Technical Field]

[0001] This disclosure relates to a silicon pad and its design. More broadly, this disclosure relates to a semiconductor device and its pad. More specifically, this disclosure relates to a display device and a liquid crystal on silicon spatial light modulator. This disclosure also relates to a conductive or electrical connection element for a semiconductor device. More specifically, this disclosure relates to a reference voltage pad for a silicon device. [Previous Technology]

[0002] The light scattered from an object contains both amplitude and phase information. This amplitude and phase information can be captured on, for example, a photosensitive plate using well-known interferometry techniques to form a holographic record or "hologram" containing interference fringes. The hologram can be reconstructed by illuminating it with appropriate light to form a two-dimensional or three-dimensional holographic reconstruction or replay image representing the original object.

[0003] Computer-generated holograms can numerically simulate interference processes. Computer-generated holograms can be calculated using techniques based on mathematical transformations such as Fresnel or Fourier transforms. These types of holograms can be called Fresnel / Fourier transform holograms or simply Fresnel / Fourier holograms. Fourier holograms can be viewed as a Fourier domain / plane representation of an object or a frequency domain / plane representation of an object. Computer-generated holograms can also be calculated using techniques such as coherent ray tracing or point cloud methods.

[0004] The hologram generated by the computer can be encoded on a spatial light modulator configured to modulate the amplitude and / or phase of the incident light. The light modulation can be achieved using, for example, an electrically addressable liquid crystal, an optically addressable liquid crystal, or a micromirror.

[0005] Spatial light modulators typically comprise a plurality of individually addressable pixels, which may also be referred to as cells or elements. The light modulation scheme can be binary, multi-level, or continuous. Alternatively, the device can be continuous (i.e., without pixels), and therefore the light modulation across the device can be continuous. Spatial light modulators can be reflective, meaning the modulated light is output in a reflected manner. Spatial light modulators can also be transmissive, meaning the modulated light is output in a transmissive manner.

[0006] A holographic projector can be provided using the system described herein. Such projectors can be applied to, for example, head-up displays (HUDs) and head-mounted displays (HMDs), including near-eye devices.

[0007] This disclosure relates to the design of silicon pads, particularly for liquid crystal on silicon (LCOS) devices. Pads in LCOS processes are typically subject to design rules primarily designed to control grain flatness, which limits the materials, structure, stacking, size, and density of these pads. These pads are typically designed for specific applications: wire bonding, anisotropic conductive film (ACF) bonding, and use with conductive materials for internal reference voltage (VCOM) crossing. Specific examples of this disclosure relate to the latter use case. These constraints can be limiting when non-standard designs are required, such as to accommodate new processes or open process windows. For example, this can be a problem when developing internal crossing processes with silver flakes suspended in epoxy resin. This typically limits the need for exceptionally large pads, for example, to accommodate highly viscous materials. A single large expansion of the metal violates foundry design rules and often also violates design office metal density rules. [Summary of the Invention]

[0008] The state of this disclosure is defined in the claims of the accompanying independent patent application.

[0009] Generally, a display device and a method of assembling the display device are provided. The display device includes a spatial light modulator, such as a liquid crystal on silicon spatial light modulator, and a substrate. The spatial light modulator is mounted on a first main surface of the substrate by means of an attachment material. The properties of the attachment material are selected to optimize the optical performance of the display device over a wide range of environmental conditions, such as temperatures relevant to automotive applications. Specifically, the attachment material may be selected to have a selected combination of values ​​of thermal properties: (i) coefficient of thermal expansion and (ii) thermal conductivity.

[0010] The display device according to this disclosure is applicable to image generating units or projectors, such as holographic projectors. For example, the display device can be used in systems—such as head-up displays (HUDs)—configured to display images to a viewer without requiring the user to move away from their usual or desired viewing angle. The display device is particularly suitable for HUD systems included in vehicles.

[0011] In the context of an image generating unit or projector, a spatial light modulator is encoded with an image or a hologram of an image and illuminated with light. Therefore, the spatial light modulator modulates the amplitude and / or phase of the incident light according to the image or hologram and outputs spatially modulated light. In the specific examples described herein, the spatial light modulator is a phase modulator. In some applications, spatial light modulators are used in relatively stable environments, for example, in static configurations maintained at stable temperature and humidity. However, in some applications, spatial light modulators can be used in less stable environments (e.g., in portable configurations), where the spatial light modulator can experience substantial changes in temperature, humidity, movement, and similar environmental changes. A specific example of such an environment is the interior of a vehicle or automobile, where extreme temperature variations may occur.

[0012] In summary, this document discloses a plurality of small metallization pads configured on a larger matrix, each metallization pad being surrounded by a non-conductive material. More specifically, a first aspect of this disclosure is a semiconductor device comprising: a pixel region including a plurality of active pixels, a gasket seal defining the pixel region, and at least one conductive element for electrical connection. The conductive element comprises a plurality of conductive sub-elements.

[0013] The at least one conductive element is also referred to herein as a "pad". The pad may be a conductive metallized feature designed to achieve electrical contact for transmitting signals, potentials or currents. In some specific examples, the pad is used to control the potential of ITO electrodes on glass.

[0014] This document discloses a solution to the problem of reducing pad size, for example when the pad contains a highly viscous material, such as an epoxy or resin containing metal flakes. The disclosed solution involves placing an array of smaller pads that conform to all design rules but together correspond to a virtual larger pad. The metal density is more easily controlled by adding or removing metal as needed to match the average density. In an important specific instance, a non-conductive (floating) material region exists around the pad array to act as a buffer and avoid the risk of short circuits in adjacent metals. The solution disclosed herein provides at least the following advantages: — Larger pads are possible; — Lower metal density in the pad regions (easier to balance density across grains); — Bypassing pad design rules; and — Allowing the use of pads by processes utilizing more viscous metal epoxy resins.

[0015] In the first set of specific examples, the pads follow pixel size rules, for example, as small as 1 micrometer, with gaps of 0.1 micrometers between them. In the second set of specific examples, the pads need to follow so-called "pad" rules, in which case these pads have imposed larger dimensions, for example, as low as tens of micrometers wide with gaps of similar size.

[0016] The conductive electronic elements in a plurality of conductive electronic elements may be spatially separated from each other.

[0017] Each conductive electronic element can be square or rectangular.

[0018] The size and / or shape of the conductive electronic components may be the same as each other.

[0019] At least two of the plurality of conductive electronic elements may have different sizes and / or shapes from each other.

[0020] A plurality of conductive electronic elements can form a regular array, such as a square or rectangular array.

[0021] A plurality of conductive electronic elements can form an irregular array.

[0022] Each of the plurality of conductive electronic elements may contain a metal.

[0023] A plurality of conductive electronic elements may be surrounded by a non-conductive material.

[0024] A plurality of conductive electronic elements may be configured such that conductive material is distributed thereon to form a connecting pad.

[0025] The conductive material may contain metal flakes, such as silver or nickel flakes, suspended in the epoxy resin.

[0026] The conductive element may be placed outside the gasket seal, that is, placed on the other side of the pixel array of the gasket seal.

[0027] The conductive element can be placed inside the gasket seal.

[0028] The conductive material can be placed inside the gasket seal.

[0029] The conductive material can be partially or completely formed into the gasket seal.

[0030] A semiconductor device may include a cell array. Cells in a first group of cells may correspond to pixels in a plurality of active pixels. Cells in a second group of cells may correspond to isolated ("dummy") pixels. Cells in a third group of cells may correspond to conductive elements. The second group of cells may be electrically isolated from all other cells.

[0031] Cells in the first group of cells (corresponding to active pixels) may, for example, be electrically connected to a common electrode on the bottom surface. The common electrode may be reflective.

[0032] The gasket seal may be conductive and applied to the third group of cells (corresponding to the conductive element).

[0033] A subset of isolated ("dummy") pixels may be placed between the gasket seal and the pixel area.

[0034] Active pixels in the pixel area can be filled with liquid crystal.

[0035] The conductive element may be electrically isolated and / or spatially separated from the pixel area.

[0036] The gasket seal can be electrically isolated from the pixel area.

[0037] The term "hologram" refers to a record containing amplitude information or phase information about an object, or a combination thereof. The term "holographic reconstruction" refers to an optical reconstruction of an object formed by irradiating a hologram. The system disclosed herein is described as a "holographic projector" because the holographic reconstruction is a real image and is spatially separated from the hologram. The term "replay field" refers to the 2D area within which the holographic reconstruction is formed and fully focused. If the hologram is displayed on a spatial light modulator containing pixels, the replay field will be repeated in the form of a plurality of diffraction orders, each of which is a copy of the zero-order replay field. The zero-order replay field usually corresponds to the better or main replay field because it is the brightest replay field. Unless otherwise explicitly stated, the term "replay field" should be considered to refer to the zero-order replay field. The term "replay plane" refers to a plane in space containing all replay fields. The terms "image," "replay image," and "image area" refer to the region of the replay field illuminated by light from a holographic reconstruction. In some specific instances, an "image" may comprise discrete points of light, which may be referred to as "image points" or simply "image pixels" for convenience.

[0038] The terms "encoding," "writing," or "addressing" are used to describe a procedure for providing a plurality of control values ​​to a plurality of pixels of an SLM, each determining the modulation level of the individual pixel. The pixels of the SLM may be described as being configured to "display" an optical modulation distribution in response to receiving the plurality of control values. Therefore, the SLM may be referred to as "displaying" a hologram, and the hologram may be considered as an array of optical modulation values ​​or levels.

[0039] It has been found that holographic reconstructions of acceptable quality can be formed from "holograms" containing only phase information related to the Fourier transform of the original object. Such holographic records can be called phase-only holograms. Specific examples are related to phase-only holograms, but this disclosure is equally applicable to pure amplitude holography.

[0040] This disclosure also applies to forming a holographic reconstruction using amplitude and phase information associated with the Fourier transform of the original object. In some specific instances, this is achieved by using a complex modulation of a so-called fully complex hologram containing both amplitude and phase information associated with the original object. Such a hologram can be called a fully complex hologram because the values ​​(grayscales) assigned to each pixel in the hologram have amplitude and phase components. The values ​​(grayscales) assigned to each pixel can be represented as a complex number having both amplitude and phase components. In some specific instances, a fully complex hologram is calculated by computer.

[0041] The term "phase delay" can be abbreviated as the phase value, phase component, phase information, or simply phase of a pixel in a computer-generated hologram or a spatial light modulator. That is, any phase value described is actually a number representing the amount of phase delay provided by that pixel (e.g., in the range of 0 to 2π). For example, a pixel of a spatial light modulator described as having a phase value of π / 2 will delay the phase of the received light by π / 2 radians. In some specific instances, each pixel of a spatial light modulator is operable in one of a plurality of possible modulation values ​​(e.g., phase delay values). The term "grayscale" can be used to refer to a plurality of available modulation levels. For example, the term "grayscale" can be used for convenience to refer to a plurality of available phase levels in a single phase modulator, even if different phase levels do not provide different gray levels. The term "grayscale" can also be used for convenience to refer to a plurality of available plurality of modulation levels in a plurality of modulators.

[0042] A hologram therefore comprises an array of grayscale values, i.e., an array of light modulation values, such as phase retardation values ​​or complex modulation values. A hologram is also considered a diffraction pattern because it is a pattern that causes diffraction when displayed on a spatial light modulator and illuminated with light having a wavelength comparable to, but typically smaller than, the pixel pitch of the spatial light modulator. Reference is made herein to combining holograms with other diffraction patterns, such as diffraction patterns acting as lenses or gratings. For example, a diffraction pattern acting as a grating can be combined with a hologram to translate the playback field on the playback plane, or a diffraction pattern acting as a lens can be combined with a hologram to focus the hologram reconstruction onto the playback plane in the near field.

[0043] Although different specific instances and groups of specific instances may be disclosed individually in the following embodiments, any feature of any specific instance or group of specific instances may be combined with any other feature or combination of features of any specific instance or group of specific instances. That is, all possible combinations and permutations of the features disclosed in this disclosure are contemplated.

Implementation Method

[0045] This invention is not limited to the specific examples described below but extends to the full scope of the appended claims. That is, the invention may be embodied in various forms and should not be construed as limited to the specific examples described for illustrative purposes.

[0046] Unless otherwise specified, the singular form of a term may include the plural form.

[0047] A structure described as being formed on or below an upper or lower portion of another structure or on or below another structure shall be interpreted to include cases in which these structures are in contact with each other, and in addition, cases in which a third structure is disposed therebetween.

[0048] In describing temporal relationships—for example, when the temporal order of events is described as “after,” “following,” “next,” “before,” or similar—unless otherwise specified, this disclosure shall be considered to include both consecutive and discontinuous events. For example, unless terms such as “just,” “immediately after,” or “directly” are used, this specification shall be considered to include discontinuous events.

[0049] Although the terms “first,” “second,” etc., may be used herein to describe various elements, such elements shall not be limited by such terms. These terms are used only to distinguish one element from another. For example, without departing from the scope of the appended claims, a first element may be referred to as a second element, and similarly, a second element may be referred to as a first element.

[0050] Features of different specific instances may be partially or wholly coupled or combined with each other, and may interoperate with each other in different ways. Some specific instances may be implemented independently of each other, or may be implemented together in a co-dependent relationship. Optical configuration

[0051] Figure 1 illustrates a specific example in which a computer-generated hologram is encoded on a single spatial light modulator. The computer-generated hologram is a Fourier transform of the object used for reconstruction. Therefore, the hologram can be referred to as a Fourier domain, frequency domain, or spectral domain representation of the object. In this specific example, the spatial light modulator is a reflective liquid crystal on silicon (LCOS) device. The hologram is encoded on the spatial light modulator and the holographic reconstruction is formed on a playback field, such as a light-receiving surface like a screen or diffuser.

[0052] A light source 110 (e.g., a laser or laser diode) is positioned to illuminate the SLM 140 via a collimating lens 111. The collimating lens causes a generally planar wavefront of light to be incident on the SLM. In Figure 1, the direction of the wavefront is offset (e.g., two or three degrees away from a plane that is truly orthogonal to the penetrable layer). However, in other specific embodiments, the generally planar wavefront is provided with normal incidence and a beam splitter is configured to separate the input optical path from the output optical path. In the specific embodiment shown in Figure 1, this configuration causes light from the light source to be reflected from the mirrored rear surface of the SLM and interact with the optical modulation layer to form an outgoing wavefront 112. The outgoing wavefront 112 is applied to optics including a Fourier transform lens 120, the focal point of which is located at the screen 125. More specifically, the Fourier transform lens 120 receives the modulated light beam from the SLM 140 and performs a frequency-space transformation to produce a holographic reconstruction at the screen 125.

[0053] It is worth noting that in this type of holography, each pixel of the hologram contributes to the entire reconstruction. There is no one-to-one correlation between a specific point (or image pixel) on the playback field and a specific light modulation element (or hologram pixel). In other words, the modulated light from the outgoing light modulation layer traverses the playback field distribution.

[0054] In these specific examples, the position of the holographic reconstruction in space is determined by the refractive (focusing) power of the Fourier transform lens. In the specific example shown in Figure 1, the Fourier transform lens is a solid lens. That is, the Fourier transform lens is an optical Fourier transform lens and performs the Fourier transform optically. Any lens can act as a Fourier transform lens, but the lens's performance will limit the accuracy of the Fourier transform it performs. Those skilled in the art understand how to use lenses to perform optical Fourier transforms. Holographic Calculation

[0055] In some specific instances, the computer-generated hologram is a Fourier transform hologram, or simply a Fourier hologram or a Fourier-based hologram, in which the image is reconstructed in the far field by utilizing the Fourier transform properties of a positive lens. The Fourier hologram is calculated by Fourier transforming the desired light field in the playback plane back to the lens plane. The Fourier transform can be used to calculate the computer-generated Fourier hologram.

[0056] Algorithms such as the Gersberg-Shaxton algorithm can be used to compute Fourier transform holograms. Furthermore, the Gersberg-Shaxton algorithm can be used to compute holograms in the Fourier domain (i.e., Fourier transform holograms) based solely on amplitude information (such as photographs) in the spatial domain. Phase information related to the object is effectively "extracted" from the amplitude-only information in the spatial domain. In some specific instances, the Gersberg-Shaxton algorithm or its variants are used to compute computer-generated holograms based solely on amplitude information.

[0057] The Gersberg-Shaxton algorithm considers the case where the intensity cross-sections (IA(x, y) and IB(x, y)) of the beams in planes A and B are known, and IA(x, y) and IB(x, y) are correlated by a single Fourier transform. Given the intensity cross-sections, approximate values ​​ΨA(x, y) and ΨB(x, y) of the phase distributions in planes A and B are found, respectively. The Gersberg-Shaxton algorithm finds a solution to this problem by following an iterative process. More specifically, the Gersberg-Shaxton algorithm iteratively applies spatial and spectral constraints while repeatedly transferring data sets (amplitude and phase) representing IA(x, y) and IB(x, y) between the spatial and Fourier (spectral or frequency) domains. A corresponding computer-generated hologram in the spectral domain is obtained through at least one iteration of the algorithm. The algorithm is convergent and configured to produce a hologram representing the input image. Holograms can be amplitude-only holograms, phase-only holograms, or all complex holograms.

[0058] In some specific instances, an algorithm based on the Gersberg-Shaxton algorithm described in, for example, British Patents 2,498,170 or 2,501,112, which are hereby incorporated by reference in their entirety, is used to compute a phase-only hologram. However, by way of example only, the specific instances disclosed herein describe the computation of a phase-only hologram. In these specific instances, the Gersberg-Shaxton algorithm extracts the phase information ψ[u, v] of the Fourier transform of a dataset that produces known amplitude information T[x, y], where the amplitude information T[x, y] represents the target image (e.g., a photograph). Since magnitude and phase are inherently combined in the Fourier transform, the transformed magnitude and phase contain applicable information about the accuracy of the computed dataset. Therefore, the algorithm can be used iteratively with feedback on both amplitude and phase information. However, in these specific instances, only the phase information Ψ[u, v] is used as the hologram to form a hologram representing the target image at the image plane. A hologram is a set of phase values ​​(e.g., a 2D array).

[0059] In other specific examples, the algorithm based on the Gersberg-Shaxton algorithm is used to compute the all-complex hologram. The all-complex hologram is a hologram with magnitude components and phase components. The hologram is a dataset (e.g., a 2D array) containing an array of complex data values, where each complex data value contains magnitude components and phase components.

[0060] In some specific instances, the algorithm processes complex data, and the Fourier transform is a complex Fourier transform. Complex data can be viewed as containing (i) real and imaginary components or (ii) magnitude and phase components. In some specific instances, the two components of complex data are processed in different ways at different stages of the algorithm.

[0061] Figure 2A illustrates the first iteration of an algorithm for calculating a phase-only hologram according to some specific examples. The input to the algorithm is an input image 210 containing a 2D array of pixel or data values, where each pixel or data value is a magnitude or amplitude value. That is, each pixel or data value of the input image 210 does not have a phase component. The input image 210 can therefore be considered as a magnitude-only, amplitude-only, or intensity-only distribution. Examples of such input images 210 are time-series photographs containing frames or a video frame. The first iteration of the algorithm begins at data formation step 202A, which involves assigning random phase values ​​to each pixel of the input image using a random phase distribution (or random phase seed) 230 to form an initial complex data set, where each data element of the set contains both magnitude and phase. The initial complex data set may be referred to as the input image in the spatial domain.

[0062] The first processing block 250 receives the initial complex data set and performs a complex Fourier transform to form a complex data set with Fourier transform. The second processing block 253 receives the complex data set with Fourier transform and outputs a hologram 280A. In some specific instances, the hologram 280A is a phase-only hologram. In these specific instances, the second processing block 253 quantizes each phase value and sets each amplitude value to one in order to form the hologram 280A. Each phase value is quantized according to the phase level that can be represented on the pixels of the spatial light modulator used to "display" the phase-only hologram. For example, if each pixel of the spatial light modulator provides 256 different phase levels, then each phase value of the hologram is quantized into one of the 256 possible phase levels. The hologram 280A is a phase-only Fourier hologram representing the input image. In other specific instances, hologram 280A is a fully complex hologram, comprising an array of complex data values ​​(each including amplitude and phase components) derived from the received complex dataset of Fourier transforms. In some specific instances, the second processing block 253 restricts each composite data value to one of a plurality of permissible complex modulation levels to form hologram 280A. The restriction step may include setting each complex data value to the closest permissible complex modulation level in the complex plane. Hologram 280A may be referred to as the input image in the spectral, Fourier, or frequency domains. In some specific instances, the algorithm stops at this point.

[0063] However, in other specific instances, the algorithm continues, as indicated by the dashed arrows in Figure 2A. In other words, following the steps indicated by the dashed arrows in Figure 2A is optional (i.e., not necessary for all specific instances).

[0064] The third processing block 256 receives the modified complex data set from the second processing block 253 and performs an inverse Fourier transform to form an inverse Fourier transform complex data set. The inverse Fourier transform complex data set can be said to represent the input image in the spatial domain.

[0065] The fourth processing block 259 receives the complex data set after inverse Fourier transform and extracts the magnitude value distribution 211A and the phase value distribution 213A. If necessary, the fourth processing block 259 evaluates the magnitude value distribution 211A. Specifically, the fourth processing block 259 can compare the magnitude value distribution 211A of the complex data set after inverse Fourier transform with the input image 510, which itself is, of course, a magnitude value distribution. If the difference between the magnitude value distribution 211A and the input image 210 is sufficiently small, the fourth processing block 259 can determine that the hologram 280A is acceptable. That is, if the difference between the magnitude value distribution 211A and the input image 210 is sufficiently small, the fourth processing block 259 can determine that the hologram 280A is a sufficiently accurate representation of the input image 210. In some specific instances, the phase value distribution 213A of the complex data set after inverse Fourier transform is ignored for comparison purposes. It should be understood that any number of different methods can be used to compare the value distribution 211A with the input image 210, and this disclosure is not limited to any particular method. In some specific instances, the mean squared error is calculated, and if the mean squared error is less than a threshold value, the whole image 280A is considered acceptable. If the fourth processing block 259 determines that the whole image 280A is unacceptable, another iteration of the algorithm can be performed. However, this comparison step is not necessary, and in other specific instances, the number of iterations of the algorithm performed is predetermined, preset, or user-defined.

[0066] Figure 2B illustrates the second iteration of the algorithm and any other iterations of the algorithm. The phase value distribution 213A of the previous iteration is fed back via the processing block of the algorithm. The magnitude value distribution 211A is rejected to facilitate the magnitude value distribution of the input image 210. In the first iteration, the data formation step 202A forms a first complex data set by combining the magnitude value distribution of the input image 210 with the random phase distribution 230. However, in the second and subsequent iterations, the data formation step 202B includes forming a complex data set by combining (i) the phase value distribution 213A from the previous iteration of the algorithm with (ii) the magnitude value distribution of the input image 210.

[0067] The complex dataset formed by the data formation step 202B of FIG2B is then processed in the same manner as described with reference to FIG2A to form the second iterative hologram 280B. Therefore, the explanation of the process is not repeated here. The algorithm may stop when the second iterative hologram 280B has been computed. However, any number of other iterations of the algorithm may be performed. It should be understood that the third processing block 256 is only required if a fourth processing block 259 is needed or another iteration is needed. The output hologram 280B generally improves with each iteration. However, in practice, it is usually reached where the positive benefits of not observing measurable improvement or performing another iteration outweigh the negative effects of the additional processing time. Therefore, the algorithm is described as iterative and convergent.

[0068] Figure 2C illustrates a specific example of the substitution in the second and subsequent iterations. The processing block of the algorithm feeds back the phase value distribution 213A of the previous iteration. The magnitude value distribution 211A is rejected to facilitate the substitution of the magnitude value distribution. In this specific example of substitution, the substitution distribution of the magnitude values ​​is derived from the distribution of the magnitude values ​​211 of the previous iteration. Specifically, the processing block 258 subtracts the magnitude value distribution of the input image 210 from the magnitude value distribution 211 of the previous iteration, proportionally adjusts the difference by a gain factor α, and subtracts the proportionally adjusted difference from the input image 210. This is mathematically represented by the following equation, where the subscripts and numbers indicate the number of iterations: Where: F' is the inverse Fourier transform; F is the forward Fourier transform; R[x, y] is the complex data set output by the third processing block 256; T[x, y] is the input or target image; is the phase component; Ψ is the phase-only hologram 280B; η is the new magnitude distribution 211B; and α is the gain factor. The gain factor α can be fixed or variable. In some specific instances, the gain factor α is determined based on the size and rate of the incoming target image data. In some specific instances, the gain factor α depends on the number of iterations. In some specific instances, the gain factor α varies only with the number of iterations.

[0069] The specific example in Figure 2C is identical to the specific examples in Figures 2A and 2B in all other respects. It can be said that only the phase hologram Ψ(u, v) contains the phase distribution in the frequency domain or Fourier domain.

[0070] In some specific examples, a spatial light modulator is used to perform the Fourier transform. Specifically, holographic data is combined with second data that provides optical power. That is, the data written to the spatial light modulator includes holographic data representing an object and lens data representing a lens. When displayed on the spatial light modulator and illuminated by light, the lens data simulates a physical lens, that is, it directs light to the focal point in the same way as the corresponding physical optics. Therefore, the lens data provides optical or focusing capabilities. In these specific examples, the physical Fourier transform lens 120 of FIG1 can be omitted. How to calculate the data representing the lens is known. The data representing the lens can be called a soft lens. For example, a phase-only lens can be formed by calculating the phase delay caused by the refractive index and the varying optical path length at each point of the lens. For example, the optical path length at the center of a convex lens is greater than the optical path length at the edge of the lens. An amplitude-only lens can be formed by a Fresnel zone plate. In the field of computer-generated holography, it is known how to combine lens data with a hologram to perform a Fourier transform of the hologram without the need for a physical Fourier lens. In some specific examples, lens data is combined with the hologram using simple addition, such as simple vector addition. In some specific examples, a physical lens is used in combination with a soft lens to perform the Fourier transform. Alternatively, in other specific examples, the Fourier transform lens is omitted entirely, allowing the holographic reconstruction to occur in the far field. In other specific examples, the hologram can be combined with grating data in the same manner, data configured to perform the functions of the grating (such as image steering). Similarly, how to compute such data is known in the art. For example, a phase-only grating can be formed by modeling the phase delay caused by points on the surface of a grating. An amplitude-only grating can be simply superimposed with an amplitude-only hologram to provide angular steering for the holographic reconstruction. The second data that provides lensing and / or steering may be referred to as light processing function or light processing pattern, to distinguish it from the holographic data, which may be referred to as image forming function or image forming pattern.

[0071] In some specific instances, the Fourier transform is performed jointly by a physical Fourier transform lens and a soft lens. That is, some of the optical power that enables the Fourier transform is provided by the soft lens, while the remaining portion of the optical power that enables the Fourier transform is provided by one or more physical optical components.

[0072] In some specific embodiments, a real-time engine is provided, configured to receive image data and calculate holograms in real time using an algorithm. In some specific embodiments, the image data is video containing a sequence of image frames. In other specific embodiments, the hologram is pre-calculated, stored in computer memory, and recalled as needed for display on the SLM. That is, in some specific embodiments, a library of predetermined holograms is provided.

[0073] This is merely an example; the specific example pertains to Fourier holography and the Gersberg-Shaxton type algorithm. This disclosure is equally applicable to Fresnel holography and Fresnel holograms that can be computed using similar methods. This disclosure is also applicable to holograms computed using other techniques such as point cloud-based methods. Optical modulation

[0074] Spatial light modulators can be used to display diffraction patterns, including computer-generated holograms. If the hologram is a phase-only hologram, a phase-modulating spatial light modulator is required. If the hologram is a fully complex hologram, a phase-modulating and amplitude-modulating spatial light modulator can be used, or a first phase-modulating spatial light modulator and a second amplitude-modulating spatial light modulator can be used.

[0075] In some specific examples, the light modulation element (i.e., pixel) of the spatial light modulator is a cell containing liquid crystal. That is, in some specific examples, the spatial light modulator is a liquid crystal device, wherein the optically active component is liquid crystal. Each liquid crystal cell is configured to selectively provide a plurality of light modulation levels. That is, each liquid crystal cell is configured at any given time to operate at one light modulation level selected from a plurality of possible light modulation levels. Each liquid crystal cell can be dynamically reconfigured to a light modulation level different from the plurality of light modulation levels. In some specific examples, the spatial light modulator is a reflective liquid crystal on silicon (LCOS) spatial light modulator, but this disclosure is not limited to this type of spatial light modulator.

[0076] LCOS devices provide a dense array of light-modulating elements or pixels within a small aperture (e.g., a few centimeters wide). Pixels are typically about 10 micrometers or smaller, producing a diffraction angle of a few degrees, meaning the optical system can be compact. The small aperture of LCOS SLMs is easier to properly illuminate compared to the larger apertures of other liquid crystal devices. LCOS devices are typically reflective, meaning the circuitry driving the pixels of the LCOS SLM can be embedded under the reflective surface. This results in a high aperture ratio. In other words, the pixels are densely packed, meaning there is very little dead space between these pixels. This is advantageous because it reduces optical noise in the playback field. LCOS SLMs use silicon substrates, which have the advantage of optically flat pixels. This is particularly important for phase modulation devices.

[0077] The following description of a suitable LCOS SLM is based on FIG3 as an example only. An LCOS device is formed using a single-crystal silicon substrate 302. The LCOS device has a 2D array of square planar aluminum electrodes 301 spaced apart by gaps 301a disposed on the upper surface of the substrate. Each of the electrodes 301 can be addressed via a circuit system 302a embedded in the substrate 302. Each of the electrodes forms a separate planar mirror. An alignment layer 303 is disposed on the array of electrodes, and a liquid crystal layer 304 is disposed on the alignment layer 303. A second alignment layer 305 is disposed on a planar transparent layer 306, such as glass. A single transparent electrode 307, such as ITO, is disposed between the transparent layer 306 and the second alignment layer 305.

[0078] Each of the square electrodes 301, together with the transparent electrode 307 and the covering area of ​​the liquid crystal material, defines a controllable phase modulation element 308, often referred to as a pixel. Considering the space between the pixels 301a, the effective pixel area, or fill factor, is the percentage of the total number of optically active pixels. By controlling the voltage applied to each electrode 301 relative to the transparent electrode 307, the properties of the liquid crystal material of each phase modulation element can be varied, thereby providing a variable delay for light incident upon it. This effect provides only phase modulation to the wavefront, i.e., no amplitude effect occurs.

[0079] The described LCOS SLM outputs spatially modulated light in a reflective manner. Reflective LCOS SLMs have the advantage of having the signal lines, gate lines, and transistors below the mirror surface, resulting in a high fill factor (typically greater than 90%) and high resolution. Another advantage of using a reflective LCOS spatial light modulator is that the liquid crystal layer can be half the thickness required when using a transmissive device. This greatly improves the switching speed of the liquid crystal (a key advantage for projecting moving video images). However, the teachings of this disclosure can also be implemented using a transmissive LCOS SLM.

[0080] Spatial light modulators (such as the LCOS SLM described with respect to Figure 3) comprise wafers or dies that can be packaged into display devices. In some specific instances, the display devices are provided as part of a HUD system for automobiles. The display devices can be manufactured separately as independent components and then assembled into a HUD system for a specific application. Figure 4 shows a schematic top view of such a display device 400, and Figure 5 shows a cross-section along line XX of Figure 4.

[0081] The display device 400 includes a substrate 402 in the form of a ceramic or alumina carrier and a spatial light modulator 404 mounted on the substrate 402. In this example, the spatial light modulator 404 is an SLM LCOS having a silicon substrate as described with respect to FIG3. However, those skilled in the art will understand that other spatial light modulators can replace the LCOS SLM of FIG3 in the display device. In addition, other types of carrier substrates or boards can be used depending on the application requirements.

[0082] A connector 406 is provided for connection to a spatial light modulator 404. In this example, the connector 406 is a flexible printed cable, but can alternatively be a planar bend connector or a flexible printed circuit board. Specifically, an electrical connection 418 (illustrated as a wire connection) extends between a contact pad 414 in the electrical connection area 412 of the spatial light modulator and a corresponding contact pad 416 in the electrical connection area 416 of the connector 406. The connector 406 is disposed on a substrate 402 to connect the spatial light modulator 404 to at least one other part of the HUD system, such as a controller or display driver (not shown).

[0083] The spatial light modulator 404 includes a first main surface 420 comprising a light modulation area 410 (also referred to as a display area or display panel) and an electrical connection area 412; and a second main surface 422 opposite to the first main surface 420. The second main surface 422 of the spatial light modulator 404 is attached to the first main surface of the substrate 402, thereby exposing the display area 410 for illumination. In one example, during use of the display device 404, the spatial light modulator 404 receives a hologram generated by a computer from a controller via a connector 406 to encode the pixel array of the spatial light modulator 400 in the display area 410. The pixel array of the spatial light modulator 400 is then illuminated with light from a light source (such as coherent light from a laser or laser diode), such that light is incident on the spatial light modulator. The light is then modulated according to the hologram and output as spatially modulated light.

[0084] Although not shown in Figures 4 and 5, substrate 402 may include, for example, a heat exchange portion or surface (not shown) extending from a second main surface of substrate 402. The heat exchange portion of substrate 402 may include metal heat dissipation components (e.g., aluminum fins) configured to conduct heat to and from spatial light modulator 404 in order to maintain the spatial light modulator at an optimal operating temperature.

[0085] As shown in FIG. 5, an attachment material 430 is disposed between the second main surface 422 of the spatial light modulator 404 and the first main surface of the substrate 402 to securely mount the spatial light modulator 404 onto the substrate 402. Specifically, the attachment material 430 may comprise an adhesive paste (e.g., thermal paste) or an adhesive film (e.g., a thermoplastic film), such as so-called "die-mounting tape". Many attachment materials are known for mounting electronic components such as chips and dies to the surface of a carrier substrate, including pressure-sensitive adhesives and other types of bonding materials.

[0086] Figure 6A shows a plan view of a semiconductor device including an active pixel region 601, a glass edge 605, an external pad array 607, a gasket seal 604, a first pad 610A, and a second pad 210B. The term "pad" is used herein to refer to a conductive (e.g., metallized) feature that enables electrical contacts to transmit signals, potentials, or currents. In some specific instances, pads are used to control the potential of electrodes on glass (e.g., transparent electrodes, such as ITO electrodes). "Pad" is also referred to herein as a conductive element acting on an electrical connection.

[0087] More specifically, FIG. 6A shows a cross-section of a semiconductor device. The cross-section includes an active pixel array 601 surrounded by a gasket seal 604. The gasket seal defines the active pixel array 601. The active pixel array 601 may include a plurality of pixels, such as liquid crystal pixels familiar to those skilled in the art in the art of semiconductor devices. A small gap may exist between the outer boundary of the active pixel array 601 and the inner edge of the gasket seal 604. The gasket seal 604 may be relatively thin relative to the maximum size of the active pixel array 601. The active pixel array 601 and the gasket seal 604 may be formed on glass having a glass edge 605. An outer gasket array 607 is disposed on the other side of the glass edge 605 onto the active pixel array 601 and the gasket seal 604. The cross-section includes two "gaskets". The first pad 610A is positioned adjacent to the first corner of the active pixel array 601 furthest from the glass edge 605, and the second pad 610B is positioned adjacent to the second corner of the active pixel array 601 furthest from the glass edge 605. Figure 6B shows a cross-section of a conventional pad 660 that is recessed relative to the surrounding top surface 650. In other words, the surrounding top surface 650 is raised above the conventional pad 660.

[0088] Conventionally, the pad follows the casting design rules for these features—a single-metal feature, a reinforcing metal layer with through-holes to a depth of silicon, and a highest inner layer with an open area above to allow access. The pad is conventionally located at corners or along edges, and is always outside the washer.

[0089] Figure 7 illustrates a first specific example of this disclosure. Figure 7 corresponds to Figure 6A, except for the structure of the pads. Figure 7 shows a plan view of a semiconductor device including an active pixel region 701, a glass edge 705, an external pad array 707, and a gasket seal 704—according to Figure 6. Figure 7 further shows a first pad 710A and a second pad 710B. In this specific example, by way of example only, the first pad 710A includes a plurality of conductive elements, such as a first conductive element 712A, a second conductive element 712B, and a third conductive element 712C in an array of nine conductive elements.

[0090] Each of the first pad 710A and the second pad 710B comprises a plurality of discrete structural features. That is, each conductive element (i.e., pad) comprises a plurality of conductive sub-elements. Each conductive element may be described as "structured" to reflect that it is not a continuous homogeneous element. A first specific example of Figure 7 shows that the first pad 710A comprises a plurality of features arranged in an array. In this specific example, the first pad 701A comprises nine sub-elements arranged in a 3×3 array. However, each pad may comprise any number of sub-elements arranged in an array of any size or shape. The array may be regular or irregular. The features of pad 710A are smaller than pad 710A itself. The features may comprise metal. The features may be said to form a group. In this specific example, pad 710A is located outside the gasket seal 704. That is, the features are located on the side of the gasket seal 704 opposite to the active pixel array 701. Conductive material is distributed over region 714 of the second pad 710B. The conductive material may comprise a suspension of metal flakes, such as silver or nickel flakes. The metal flakes may be suspended in an epoxy resin. Region 714 may be radially symmetrical, such as circular. Region 714 may substantially cover the corresponding pad. That is, region 714 may at least partially cover or encapsulate all sub-elements of the pad. The array of sub-elements and the conductive material disposed thereon may form a connecting pad, such as an electrical connection pad.

[0091] A conductive material is applied to the top surface metal of the pad and spans the gap between it and the glass ITO electrode. In some specific embodiments, the semiconductor device further includes a liquid crystal alignment layer (e.g., polyimide), and the conductive material further pierces the liquid crystal alignment material. Some specific embodiments provide a larger pad with a metal density matching the surrounding area. Some specific embodiments divide the metal to reduce the pad size.

[0092] Figure 8 illustrates a second specific embodiment of this disclosure. Figure 8 corresponds to Figure 7, except that the first pad 810A and the second pad 810B are disposed inside the gasket seal 804. Figure 8 shows a plan view of a semiconductor device including an active pixel region 801, a glass edge 805, an outer pad array 807, the first pad 810A, and the second pad 810B—according to the first specific embodiment. Figure 8 further shows an extended gasket seal 804 surrounding the first pad 810A and the second pad 810B. In this specific embodiment, by way of example only, the first pad 810A includes a plurality of conductive elements, such as the first conductive element 812A, the second conductive element 812B, and the third conductive element 812C in an array of nine conductive elements. The first pad 810A and the second pad 810B may include any configuration of conductive elements as described with respect to Figure 7. According to the first specific embodiment, a suspended conductive material (e.g., a silver or nickel sheet) is disposed on region 814 of the second pad 810B.

[0093] In a variation, the gasket is conductive and applied over the pad to avoid the need for separate distribution (of conductive material) at the pad. In some specific instances, the gasket has a non-uniform height. For example, in some specific instances, a reflective electrode (e.g., a mirror) lies beneath the active pixel array 701, and the pad has a depth deeper than the mirror, such that the gasket has a non-uniform height at its bonding pad.

[0094] Figure 9 illustrates a third specific example, in which the conductive electronic elements are indistinguishable from the active pixels (represented by diagonal lines) and a plurality of dummy pixels (represented by horizontal lines) disposed within the active pixel region 901. A first pad 910A and a second pad are disposed within a gasket seal 904. Figure 9 shows a plan view of a semiconductor device comprising an active pixel region 901 and an outer pad array 907, a first pad 910A, and a second pad, according to another specific example. Figure 9 further shows an extended gasket seal 904 surrounding the first pad 910A and the second pad. The gasket seal 904 is demarcated by an outer gasket boundary 904a and an inner gasket boundary 904b. The first pad 910A and the second pad each comprise a 3×3 array of nine sub-elements (each represented by dotted line filling). A row of dummy pixels is disposed in the gap between the active pixel region 901 and the inner gasket boundary 904b. The first pad 910A and the second pad may contain any configuration of conductive electronic elements as described with respect to Figures 7 and 8. According to other specific examples, a suspended conductive material (e.g., a silver or nickel sheet) is dispensed onto region 914 of the second pad. The pad may be referred to as an invisible pad to reflect its invisibility during periodic inspections. Different components of the semiconductor device are assigned to groups of indistinguishable molecular elements or pixels. Each virtual pixel is electrically disconnected from any other pixel, allowing for imprecise dispensing of conductive material. The pad may be located inside or outside the gasket seal. According to a second specific example, the gasket may be conductive and applied above the pad to avoid the need for separate dispensing at the pad location.

[0095] In some specific instances, the conductive region does not have a surface passivation layer because the passivation layer may contain an insulator.

[0096] The semiconductor device may be a display device or a spatial light modulator, such as a liquid crystal on silicon spatial light modulator, but this disclosure is not limited to such devices and alternatively extends to any semiconductor device including at least one (connection) pad. The active pixels of this disclosure may be light-modulated pixels of a display device. Active pixels may be individually addressable in a manner familiar to those skilled in the art of displays. Active pixels may be phase-modulated or amplitude and phase-modulated. An active pixel array may include a common electrode and individual electrode arrays sandwiching liquid crystal. In the example where the semiconductor device is a display device, pixels may be configured to display a hologram of an image or a hologram suitable for displaying an image. Additional Features

[0097] Specific examples involve electrically started LCOS spatial light modulators (by way of example only). The teachings of this disclosure can also be applied to any spatial light modulator capable of displaying a computer-generated hologram according to this disclosure, such as any electrically started SLM, optically started SLM, digital micromirror device, or microelectromechanical device.

[0098] In some specific examples, the light source is a laser, such as a laser diode. In some specific examples, the detector is a photodetector, such as a photodiode. In some specific examples, the light-receiving surface is a diffuser surface or a screen, such as a diffuser. The holographic projection system disclosed herein can be used to provide an improved head-up display (HUD) or head-mounted display. In some specific examples, a vehicle is provided that includes a holographic projection system installed in the vehicle to provide a HUD. The vehicle can be a motor vehicle, such as an automobile, truck, van, freight car, locomotive, train, airplane, ship, or vessel.

[0099] The quality of holographic reconstruction can be affected by the so-called zero-order problem, which is a result of the diffraction properties of using a pixelated spatial light modulator. This zero-order light can be considered as "noise" and includes, for example, specular reflections and other unwanted light from the SLM.

[0100] In the example of a Fourier hologram, this "noise" is focused at the focal point of the Fourier lens, thus producing a bright spot at the center of the holographic reconstruction. It would be simple to block zero-order light; however, this would mean replacing the bright spot with a dark spot. Some specific examples include angle-selective filters to remove only the collimated rays of the zeroth order. Specific examples also include the method for managing the zeroth order described in European Patent 2,030,072, which is hereby incorporated by reference in its entirety.

[0101] In some specific instances, the size of the hologram (the number of pixels in each direction) is equal to the size of the spatial light modulator, such that the hologram fills the spatial light modulator. That is, the hologram uses all the pixels of the spatial light modulator. In other specific instances, the hologram is smaller than the spatial light modulator. More specifically, the number of pixels in the hologram is less than the number of light-modulated pixels available on the spatial light modulator. In some of these other specific instances, portions of the hologram (i.e., consecutive subsets of the pixels in the hologram) are repeated in unused pixels. This technique can be called "tiling," in which the surface area of ​​the spatial light modulator is divided into several "tiling blocks," each of which represents at least one subset of the hologram. Therefore, each tiling block has a smaller size than the spatial light modulator. In some specific instances, the "tiling" technique is implemented to improve image quality. Specifically, some implementations employ tiling techniques to minimize the size of image pixels while maximizing the amount of signal content entering holographic reconstruction. In some implementations, the holographic pattern written to the spatial light modulator comprises at least one entire tile (i.e., the complete hologram) and at least a small subset of tile (i.e., a continuous subset of pixels in the hologram).

[0102] In a specific instance, only the main replay field is used, and the system contains physical blocks, such as baffles, which are configured to restrict the propagation of higher-order replay fields through the system.

[0103] In specific instances, the hologram reconstruction is in color. In some specific instances, a method called Spatial Separated Color (SSC) is used to provide a color hologram reconstruction. In other specific instances, a method called Frame Sequential Color (FSC) is used.

[0104] The SSC method uses three spatially separated optically modulated pixel arrays for three monochrome holograms. The advantage of the SSC method is that the images can be extremely bright because all three hologram reconstructions can be formed simultaneously. However, due to spatial limitations, placing the three spatially separated optically modulated pixel arrays on a common SLM results in suboptimal quality for each monochrome image because only a subset of the optically modulated pixels is available for each color. Therefore, relatively low-resolution color images are provided.

[0105] The FSC method can use all pixels of a common spatial light modulator to sequentially display three monochrome holograms. The monochrome reconstruction cycles fast enough (e.g., red, green, blue, red, green, blue, etc.) that a human viewer can perceive a multicolor image from the integration of the three monochrome images. An advantage of FSC is that it uses the entire SLM for each color. This means that the quality of the three resulting color images is optimal because all pixels of the SLM are used for each of these color images. However, a disadvantage of the FSC method is that the brightness of the composite color image is lower than that using the SSC method (approximately three times), because each monochrome illumination event may only occur for one-third of the frame time. This disadvantage could potentially be addressed by overdriving the laser or by using a more powerful laser, but this requires more power, leading to higher costs and an increased system size.

[0106] The example describes illuminating an SLM with visible light; however, those skilled in the art will understand that the light source and SLM can also be used to guide infrared or ultraviolet light, as disclosed herein. For example, those skilled in the art will know techniques for converting infrared and ultraviolet light into visible light for the purpose of providing information to a user. For example, this disclosure extends to the use of phosphors and / or quantum dot technologies for this purpose.

[0107] Some specific examples are described only as examples of 2D holographic reconstructions. In other specific examples, the holographic reconstruction is a 3D holographic reconstruction. That is, in some specific examples, the holograms generated by each computer form a 3D holographic reconstruction.

[0108] The methods and processes described herein can be implemented on a computer-readable medium. The term "computer-readable medium" includes media configured to temporarily or permanently store data, such as random-access memory (RAM), read-only memory (ROM), buffered memory, flash memory, and cache memory. The term "computer-readable medium" should also be considered as including any medium or combination of media capable of storing instructions for machine execution, such that when executed by one or more processors, the instructions cause the machine to perform, wholly or partially, any or more of the methods described herein.

[0109] The term "computer-readable media" also covers cloud-based storage systems. The term "computer-readable media" includes, but is not limited to, one or more tangible and non-transitory data repositories (e.g., data volumes) in the form of examples of solid-state memory chips, optical discs, magnetic disks, or any suitable combination thereof. In some specific examples, instructions for execution may be conveyed by a carrier medium. Examples of such carrier media include transient media (e.g., propagation signals conveying instructions).

[0110] As will be apparent to those skilled in the art, various modifications and variations can be made without departing from the scope of the appended patent application. This disclosure covers all modifications and variations within the scope of the appended patent application and its equivalents. [Simplified Explanation of the Diagram]

[0044] The following figures are shown as examples only to illustrate specific instances: [Figure 1] is a schematic diagram of a reflective SLM that produces a holographic reconstruction on a screen; [Figure 2A] illustrates the first iteration of an example Gerchberg-Saxton type algorithm; [Figure 2B] illustrates the second and subsequent iterations of an example Gerchberg-Saxton type algorithm; [Figure 2C] illustrates the alternative second and subsequent iterations of an example Gerchberg-Saxton type algorithm; [Figure 3] is a schematic diagram of a reflective LCOS SLM; [Figure 4] is a schematic plan view of a display device including a spatial light modulator mounted on a substrate; [Figure 5] shows a schematic cross-section along line XX of Figure 4; [Figure 6A] shows a conventional configuration of the pads of a semiconductor device; [Figure 6B] shows a cross-section of a recessed pad; [Figure 7] represents a first specific instance; [Figure 8] represents a second specific instance; and [Figure 9] represents a third specific instance. The same element symbols will be used throughout the diagram to refer to the same or similar parts.

Claims

1. A semiconductor device comprising: a pixel region including a plurality of pixels, a gasket seal defining the pixel region, and a conductive element for electrical connection, wherein the conductive element includes a plurality of conductive sub-elements, wherein the plurality of conductive sub-elements are surrounded by a non-conductive material.

2. The semiconductor device of claim 1, wherein the conductive electronic elements are spatially separated from each other.

3. The semiconductor device as claimed in claim 1 or 2, wherein each conductive electronic element is square or rectangular.

4. A semiconductor device as claimed in claim 1 or 2, wherein the size and / or shape of the conductive electronic elements are the same as each other.

5. A semiconductor device as claimed in claim 1 or 2, wherein two conductive electronic elements have different sizes and / or shapes.

6. The semiconductor device of claim 1 or 2, wherein the plurality of conductive electronic elements form a regular array, such as a square or rectangular array.

7. The semiconductor device of claim 1 or 2, wherein the plurality of conductive electronic elements form an irregular array.

8. The semiconductor device of claim 1 or 2, wherein each of the plurality of conductive electronic elements comprises a metal.

9. The semiconductor device of claim 1 or 2, wherein the plurality of conductive electronic elements are configured such that conductive material is disposed thereon.

10. The semiconductor device of claim 9, wherein the conductive material comprises a metal sheet, such as a silver or nickel sheet, suspended in an epoxy resin.

11. The semiconductor device of claim 1 or 2, wherein the conductive element is disposed outside the gasket seal.

12. The semiconductor device of claim 1 or 2, wherein the conductive element is disposed within the gasket seal.

13. The semiconductor device of claim 12, wherein when the plurality of conductive electronic elements are configured such that a conductive material is disposed thereon, wherein the conductive material is disposed within the gasket seal.

14. The semiconductor device of claim 12, wherein when the plurality of conductive electronic elements are configured such that a conductive material is disposed thereon, wherein the conductive material partially or completely forms the gasket seal.

15. The semiconductor device of claim 1 or 2, wherein the semiconductor device comprises a cell array, wherein a first group of cells corresponds to the plurality of pixels, a second group of cells corresponds to isolated pixels, and a third group of cells corresponds to the conductive element, wherein the cells in the second group are electrically isolated from all other cells.

16. The semiconductor device of claim 15, wherein the cells in the first set of cells are electrically connected to a common electrode, wherein the common electrode is reflective, if necessary.

17. The semiconductor device of claim 15, wherein the gasket seal is conductive and applied over the third set of cells.

18. The semiconductor device of claim 15, wherein a subset of isolated pixels is disposed between the gasket seal and the pixel region.

19. The semiconductor device of claim 1 or 2, wherein the pixels of the pixel region may be filled with liquid crystal.

20. The semiconductor device of claim 1 or 2, wherein the conductive element is electrically isolated and / or spatially separated from the pixel region.

21. The semiconductor device of claim 1 or 2, wherein the gasket seal is electrically isolated from the pixel region.

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