Antenna device and vehicle antenna device

Abstract

An antenna device includes a circuit substrate, a plurality of beamforming chips, and a plurality of radio frequency (RF) front-end chips. The circuit substrate includes a substrate, a plurality of antenna electrodes, a thin-film circuit structure, and a redistribution structure. The antenna electrodes are arrayed in an antenna array region on the substrate. The thin-film circuit structure is located on the substrate. The redistribution structure is located on the thin-film circuit structure. The beamforming chips are arrayed in the antenna array region on the substrate and bonded to the redistribution structure. The RF front-end chips are arrayed in the antenna array region on the substrate and bonded to the redistribution structure. The RF front-end chips are signal-connected to the antenna electrodes and electrically connected to the beamforming chips.

Claims

1. An antenna device, comprising: A circuit board includes: a substrate; a plurality of antenna electrodes arrayed in an antenna array region on the substrate; a thin-film circuit structure located on the substrate; and a redistribution structure located on the thin-film circuit structure; a plurality of beamforming chips arrayed in the antenna array region on the substrate and bonded to the redistribution structure; and a plurality of radio frequency (RF) front-end chips arrayed in the antenna array region on the substrate and bonded to the redistribution structure, wherein the RF front-end chips are respectively signal-connected to the antenna electrodes, and the RF front-end chips are electrically connected to the beamforming chips, wherein each beamforming chip is electrically connected to a corresponding plurality of the RF front-end chips.

2. The antenna device as claimed in claim 1, wherein the beamforming wafers are electrically connected to a plurality of digital signal lines in the thin-film circuit structure, each of the digital signal lines having a thickness of less than 1 micrometer, and the radio frequency front-end wafers are electrically connected to the beamforming wafers through a plurality of radio frequency signal lines in the redistribution structure, wherein each of the radio frequency signal lines has a thickness greater than each of the digital signal lines.

3. The antenna device as claimed in claim 2, wherein each of the digital signal lines has a width of 3 micrometers to 10 micrometers.

4. The antenna device as described in claim 2, further comprising: An assembly circuit board is electrically connected to beamforming chips via digital signal lines.

5. The antenna device as claimed in claim 1, wherein the thin-film circuit structure includes a plurality of first digital signal control circuits electrically connected to the beamforming wafers, respectively.

6. The antenna device as claimed in claim 1, wherein the thin-film circuit structure includes a plurality of second digital signal control circuits electrically connected to the radio frequency front-end chips, respectively.

7. The antenna device as claimed in claim 1, further comprising: Multiple buffer circuit chips are arrayed in the antenna array region on the substrate and coupled to the redistribution structure, wherein at least one of the beamforming chips is electrically connected to at least one of the buffer circuit chips.

8. The antenna device as claimed in claim 1, wherein the thin-film circuit structure includes a plurality of buffer circuits, wherein the beamforming wafers are electrically connected to the buffer circuits.

9. The antenna device as claimed in claim 8, further comprising: An assembly circuit board is electrically connected to the beamforming wafers, wherein the number of buffer circuits electrically connected to the beamforming wafer closest to the assembly circuit board is equal to the number of buffer circuits electrically connected to the beamforming wafer furthest from the assembly circuit board.

10. The antenna device as claimed in claim 1, wherein each beamforming chip includes a plurality of digital-to-analog converters and a plurality of analog-to-digital converters.

11. The antenna apparatus of claim 10, wherein each beamforming chip includes a plurality of first filters, a plurality of first mixers, a plurality of first amplifiers, a plurality of second filters, a plurality of second mixers, and a plurality of second amplifiers, wherein the digital-to-analog converters, the first filters, the first mixers, and the first amplifiers constitute a plurality of first sub-circuits, each first sub-circuit including a corresponding one of the digital-to-analog converters, a corresponding one of the first filters, a corresponding one of the first mixers, and a corresponding one of the first amplifiers, and the analog-to-digital converters, the second filters, the second mixers, and the second amplifiers constitute a plurality of second sub-circuits, each second sub-circuit including a corresponding one of the analog-to-digital converters, a corresponding one of the second filters, a corresponding one of the second mixers, and a corresponding one of the second amplifiers.

12. The antenna device as claimed in claim 11, wherein each of the beamforming wafers comprises: A plurality of first switching elements and a plurality of second switching elements are provided, wherein each of the first switching elements is electrically connected to a corresponding one of the first sub-circuits, a corresponding one of the second sub-circuits, and a corresponding one of the second switching elements, wherein a plurality of circuit channels each include a corresponding one of the first switching elements, a corresponding one of the first sub-circuits, a corresponding one of the second sub-circuits, and a corresponding one of the second switching elements, and each of the first switching elements is configured to switch between a corresponding one of the digital-to-analog converters and a corresponding one of the analog-to-digital converters, and each of the second switching elements is configured to switch between a corresponding one of the first amplifiers and a corresponding one of the second amplifiers.

13. The antenna device of claim 12, wherein each beamforming chip includes a first variable gain amplifier and a phase adjuster module, wherein the first variable gain amplifier and the phase adjuster module are electrically connected to the circuit channels, and each circuit channel is electrically connected to at least one of the corresponding RF front-end chips.

14. The antenna device as claimed in claim 13, wherein each beamforming chip includes a first sequential peripheral interface circuit electrically connected to the first variable gain amplifier and the phase adjuster module.

15. The antenna device as claimed in claim 1, wherein each of the radio frequency front-end chips includes a second variable gain amplifier and a phase adjuster module.

16. The antenna device as claimed in claim 15, wherein the second variable gain amplifier and phase adjuster module comprises: A third sub-circuit includes a first phase adjuster, a first gain adjuster, and a third amplifier; a fourth sub-circuit includes a second phase adjuster, a second gain adjuster, and a fourth amplifier; a third switching element electrically connected to the third sub-circuit and the fourth sub-circuit and configured to switch between the first phase adjuster and the second phase adjuster; and a fourth switching element electrically connected to the third sub-circuit and the fourth sub-circuit and configured to switch between the third amplifier and the fourth amplifier.

17. The antenna device as claimed in claim 15, wherein each of the radio frequency front-end chips includes a second sequential peripheral interface circuit electrically connected to the second variable gain amplifier and the phase adjuster module.

18. A vehicle antenna device, comprising: A circuit board includes: a substrate; a plurality of antenna electrodes arrayed in an antenna array region on the substrate; a thin-film circuit structure located on the substrate; and a redistribution structure located on the thin-film circuit structure; a plurality of beamforming chips arrayed in the antenna array region on the substrate and bonded to the redistribution structure; and a plurality of radio frequency (RF) front-end chips arrayed in the antenna array region on the substrate and bonded to the redistribution structure, wherein the RF front-end chips are respectively signal-connected to the antenna electrodes, and the RF front-end chips are electrically connected to the beamforming chips, wherein each beamforming chip is electrically connected to a corresponding plurality of the RF front-end chips.

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