Substrate processing apparatus and substrate processing method

Abstract

The objective of this invention is to provide a technique that reduces the impact of pin-based position control on substrate processing. In a substrate processing apparatus 100, a plurality of position control pins 13 disposed on a base plate 11 include stationary pins 13a and sliding pins 13b. When positioned in the control position P2, the stationary pin 13a abuts against the periphery 93 of a substrate 9, controlling the substrate 9 to a predetermined position Q above the base plate 11, and controlling rotation without relative rotation with respect to the base plate 11. The sliding pin 13b, when positioned in the control position P2, is disposed at a position facing the periphery 93 of the substrate 9 at the predetermined position Q, with a gap G between them, controlling the substrate 9 to rotate relative to the base plate 11, and controlling its position by radial displacement from the predetermined position Q within an allowable range.

Description

Technical Field

[0001] This invention application relates to a substrate processing apparatus and a substrate processing method. Prior Technology

[0002] When manufacturing semiconductor devices, various processes are performed on the substrate. For example, a substrate processing apparatus is known in which the substrate is held in a posture (horizontal posture) with its thickness direction along the vertical direction, rotated about an axis extending vertically through the center of its main surface, and a processing liquid is supplied to the substrate to process the substrate (for example, Patent Documents 1-3).

[0003] [Previous Technical Documents] [Patent Literature] [Patent Document 1] Japanese Patent Application Publication No. 2002-93891 [Patent Document 2] Japanese Patent Application Publication No. 2024-64549 [Patent Document 3] Japanese Patent Application Publication No. 2017-147408 Summary of the Invention

[0004] [The problem the invention aims to solve] When a substrate is held in a horizontal position and rotated, a rotary clamp is used, for example. As an example, the rotary clamp is configured with a plurality of pins (clamping pins) for holding the substrate on the upper surface of a flat base plate. The plurality of clamping pins abut against the periphery of the substrate, which is horizontally positioned above the base plate. The substrate is positioned such that it remains unchanged in the radial and vertical directions and is rotated such that it does not rotate relative to the base plate. By rotating the base plate in this state, the base plate and the substrate held by the clamping pins rotate as a single unit. If a processing liquid is supplied to the main surface of the rotating substrate, the processing liquid spreads to the entire main surface, and the entire main surface is processed by the processing liquid.

[0005] Furthermore, based on the processing conditions, the aim is to treat the peripheral portion of the substrate with the processing liquid supplied to the main surface of the substrate. However, the portion of the substrate's peripheral portion where the clamping pins abut is less susceptible to processing liquid supply compared to other areas. Therefore, this portion is more difficult to process than other areas, raising concerns about the uniformity of processing across the entire circumferential periphery.

[0006] Furthermore, based on the processing conditions, efforts are made to minimize the width (circumference width) of the processing fluid supplied to one main surface of the substrate that meanders into the other main surface. Moreover, in the portion of the substrate's periphery where the clamping pins abut, the processing fluid supplied to one main surface can easily be transmitted through the clamping pins and other means, meandering into the other main surface. Therefore, the meandering of the processing fluid is concentrated in this portion, potentially leading to a peak value in the meander width (or even an increase in the maximum value of the meander width).

[0007] This invention application was made in view of such problems, and its purpose is to provide a technique that can reduce the impact of pin-pair processing for positioning substrates.

[0008] [Technical means to solve the problem] The substrate processing apparatus of the first state includes: a base plate; a plurality of position regulating pins disposed on the base plate for regulating the position of a substrate horizontally positioned above the base plate; a pin driving mechanism for moving each of the plurality of position regulating pins between a regulating position in which the position regulating pins regulate the substrate and a deregulating position in which the position regulating pins do not regulate the substrate; a rotation mechanism for rotating the base plate about a rotation axis extending vertically; a processing liquid supply unit for supplying processing liquid to the substrate; and a control unit for controlling the pin driving mechanism, the rotation mechanism, and the processing liquid supply unit. The plurality of position control pins include a stationary pin and a sliding pin; the stationary pin, when disposed in the aforementioned control position, abuts against the periphery of the aforementioned substrate, thereby controlling the position of the aforementioned substrate at a predetermined position above the aforementioned base plate, and controlling rotation in a manner that does not rotate relative to the aforementioned base plate; the sliding pin, when disposed in the aforementioned control position, is disposed at a position that is gapped relative to the aforementioned periphery of the aforementioned substrate disposed in the aforementioned predetermined position and faces it, thereby controlling the position of the aforementioned substrate to rotate relative to the aforementioned base plate, and controlling the position of the aforementioned substrate to move from the aforementioned predetermined position within an allowable range in the radial direction of the aforementioned substrate.

[0009] The second state is the same as the substrate processing apparatus of the first state, wherein the control unit controls the pin drive mechanism to switch between a stationary state in which the stationary pin positions the substrate and a sliding state in which the sliding pin positions the substrate. In the sliding state, the control unit controls the processing liquid supply unit to supply the processing liquid to the substrate.

[0010] The third state is the same substrate processing device as the second state, wherein the aforementioned control unit controls the aforementioned rotation mechanism in the aforementioned sliding regulation state, so that the rotation speed of the aforementioned base plate changes.

[0011] The fourth state is a substrate processing device like the second or third state, wherein the aforementioned control unit controls the aforementioned processing liquid supply unit in the aforementioned sliding regulation state, so that the processing liquid supplied to the aforementioned substrate applies external force to the aforementioned substrate, causing the rotation speed of the aforementioned substrate to change.

[0012] The fifth state is a substrate processing apparatus like any of the second to fourth states, which includes a gas supply unit that supplies gas to the aforementioned substrate; and the aforementioned control unit controls the aforementioned gas supply unit in the aforementioned sliding regulation state so that the gas supplied to the aforementioned substrate applies an external force to the aforementioned substrate, causing the rotational speed of the aforementioned substrate to change.

[0013] The sixth state is a substrate processing device like any of the first to fifth states, wherein the aforementioned sliding pin includes a regulating surface, which, when the aforementioned sliding pin is disposed in the aforementioned regulating position, provides the aforementioned gap and faces the aforementioned peripheral portion of the aforementioned substrate disposed in the aforementioned regulating position; and the aforementioned regulating surface includes a side surface facing the aforementioned peripheral portion from the side.

[0014] The seventh state is a substrate processing device like the sixth state, wherein the aforementioned regulating surface includes an upper surface facing the aforementioned peripheral portion from an obliquely upward position.

[0015] The eighth state sample is a substrate processing device like the sixth or seventh state sample, wherein the aforementioned regulating surface includes a lower surface facing the aforementioned peripheral portion from the oblique lower side.

[0016] The substrate processing method for the 9th state includes: a static regulation state forming process, which forms a static regulation state in which a static pin disposed on a base plate abuts against the periphery of a substrate horizontally disposed above the base plate, thereby regulating the substrate to a predetermined position above the base plate and rotating it in a manner that does not rotate relative to the base plate; an acceleration process, which, in the static regulation state, increases the rotational speed of the base plate to a predetermined liquid processing speed; a sliding regulation state forming process, which, after the acceleration process, forms a sliding regulation state in which a sliding pin disposed on the base plate is positioned opposite to the periphery of the substrate disposed at the predetermined position with a gap, thereby allowing the substrate to rotate relative to the base plate and rotating it from the predetermined position in a manner that does not exceed an allowable range in the radial direction of the substrate; and a processing liquid supply process, which, in the sliding regulation state, supplies processing liquid to the substrate.

[0017] [Effects of the Invention] According to the substrate processing apparatus of the first state, the substrate, with its position controlled by the sliding pin, can rotate relative to the base plate at or near its normal position (a position whose displacement from the normal position does not exceed the allowable range). When the substrate rotates relative to the base plate, the sliding pin provided on the base plate moves circumferentially relative to the periphery of the substrate, and the position of the sliding pin facing the periphery of the substrate (pin-facing position) gradually changes circumferentially. Therefore, the impact of the sliding pin on the processing is reduced.

[0018] In the substrate processing apparatus of the second state, processing fluid is supplied to the substrate in a sliding state. In this state, the substrate can rotate relative to the base plate, and as it rotates relative to the base plate, the pin-facing position gradually changes circumferentially. As the pin-facing position gradually changes circumferentially, the supply of processing fluid throughout the circumferential region of the substrate is less prone to deviation, and the entire circumferential region of the periphery is processed uniformly. Furthermore, as the pin-facing position gradually changes circumferentially, the processing fluid's meandering penetration is not concentrated at a specific position in the circumferential region of the substrate's periphery, thus minimizing the occurrence of peak values ​​in the meandering penetration width. In other words, the maximum value of the meandering penetration width can be suppressed to a smaller extent.

[0019] In the substrate processing apparatus of the third state, in the sliding control state, the rotation mechanism changes the rotational speed of the base plate. In the sliding control state, even if the rotational speed of the base plate changes, the rotational speed of the substrate will not change accordingly. Therefore, by changing the rotational speed of the base plate, a difference in rotational speed is generated between the substrate and the base plate, allowing the substrate to rotate relative to the base plate.

[0020] In the substrate processing apparatus of the fourth state, under sliding control, the rotational speed of the substrate changes by applying an external force from the processing fluid. This allows a difference in rotational speed to be generated between the substrate and the base plate, and even causes the substrate to rotate relative to the base plate.

[0021] In the substrate processing apparatus of the fifth state, under sliding control, the rotational speed of the substrate changes by an external force supplied by the gas. This allows a difference in rotational speed to be generated between the substrate and the base plate, and even causes the substrate to rotate relative to the base plate.

[0022] According to the sliding pin of the substrate processing device of the sixth state, when it is configured in the regulated position, the position can be regulated in a radial manner so that the substrate does not exceed the allowable range equivalent to the gap from the regular position.

[0023] According to the sliding pin of the substrate processing device in the seventh state, when it is configured in the specified position, the position can be specified in the upward direction so that the substrate does not exceed the allowable range equivalent to the gap from the normal position.

[0024] According to the sliding pin of the substrate processing device in the eighth state, when it is positioned in the regulating position, the position can be regulated in the downward direction by displacing the substrate from the regular position within an allowable range equivalent to the gap. Simple Explanation of the Diagram

[0025] Figure 1 is a side sectional view showing the configuration of the substrate processing apparatus in an embodiment. Figure 2 is a schematic top view showing the upper surface of the base plate. Figure 3 is a top view of the stationary pin. Figure 4 is a side view schematically showing the movement of the stationary pin between the released position and the controlled position. Figure 5 is a top view of the sliding pin. Figure 6 is a side view schematically showing the movement of the sliding pin between the release position and the control position. Figure 7 is a schematic top view showing the static regulation state. Figure 8 is a top view schematically showing the sliding regulation state. Figure 9 shows the lower surface of the base plate, indicating that the first open magnet and the second open magnet are positioned separately. Figure 10 shows the lower surface of the base plate, illustrating the state in which the first open magnet and the second open magnet are positioned close to each other. Figure 11 shows the lower surface of the base plate, with the first open magnet positioned in an approaching position and the second open magnet positioned in a separated position. Figure 12 is a block diagram showing the structure of the control unit. Figure 13 is a flowchart showing the processing performed by the substrate processing apparatus. Figure 14 is a flowchart illustrating the processing performed by the substrate processing apparatus. Figure 15 is a side view schematically showing the movement of the sliding pin between the release position and the regulation position in the first variation example. Figure 16 is a side view schematically showing the movement of the sliding pin between the release position and the regulation position in the second variation. Figure 17 is a top view schematically showing the upper surface of the base plate with the position control pin of the third variation. Figure 18 is a side view schematically showing the movement of the position control pin in the third variation example between the released position, the stationary control position, and the sliding control position. Figure 19 is a schematic top view showing the static regulation state. Figure 20 is a schematic top view showing the sliding regulation state. Implementation

[0026] The following description refers to the accompanying drawings and describes the embodiments. Furthermore, the constituent elements described in these embodiments are ultimately illustrative only and are not intended to limit the scope of this disclosure to their specific meaning. In the drawings, for ease of understanding, the dimensions or numbers of various parts may be exaggerated or simplified as needed.

[0027] Expressions indicating relative or absolute positional relationships (e.g., "in a direction," "along a direction," "parallel," "orthogonal," "center," "concentric," "coaxial," etc.) generally indicate not only a strict positional relationship but also a state of relative displacement in terms of angle or distance within tolerance or to achieve the same level of functionality. Similarly, expressions indicating equality (e.g., "same," "equal," "homogeneous," etc.) generally indicate not only a state of strict quantitative equality but also a state of difference in tolerance or to achieve the same level of functionality. Furthermore, expressions indicating shape (e.g., "circle," "rectangular shape," "cylindrical shape," etc.) generally indicate not only a strict geometric representation of the shape but also a shape within a range to achieve the same level of effect, such as having concavity, convexity, or chamfers. Furthermore, each expression of the constituent elements, such as "including," "providing," "possessing," "comprises," or "having," is not an exclusive expression excluding the existence of other constituent elements. Also, the expression "at least one of A, B, and C" includes "only A," "only B," "only C," "any two of A, B, and C," and "all of A, B, and C."

[0028] <1. Composition of the substrate processing apparatus> The configuration of the substrate processing apparatus 100 in the embodiment will be described with reference to Figures 1 and 2. Figure 1 is a side sectional view showing the configuration of the substrate processing apparatus 100. Figure 2 is a top view showing the upper surface 111 of the base plate 11.

[0029] The substrate processing apparatus 100 is a so-called monolithic processing apparatus that processes the substrate 9 one piece at a time. The substrate 9, which is the object of processing, is, for example, a circular plate. The substrate processing apparatus 100 includes, for example, a rotary clamp 1, a processing liquid supply unit 2, a gas supply unit 3, and a control unit 4. The rotary clamp 1 and the processing liquid nozzle 21 of the processing liquid supply unit 2 (described later) are housed in a chamber that forms a generally sealed space inside (illustration omitted).

[0030] (Rotating clamp 1) The rotating fixture 1 positions the substrate 9 in a horizontal orientation and rotates it. The term "horizontal orientation" here means an orientation in which the thickness direction of the substrate 9 is along the vertical direction, one main surface of the substrate 9 faces downward, and the other main surface faces upward. The rotating fixture 1 includes, for example, a base plate 11, a plurality of support pins 12, a plurality of position-regulating pins 13, and a rotating mechanism 14.

[0031] The base plate 11 is a circular plate-shaped component, arranged in a posture where the thickness direction is along the vertical direction. A plurality of support pins 12 and a plurality of position control pins 13 are provided on the base plate 11.

[0032] A plurality of support pins 12 abut against the substrate 9 from below, supporting the substrate 9 horizontally above the base plate 11. A lifting mechanism (not shown) connects to the plurality of support pins 12, allowing them to move up and down (in the vertical direction) between the upper and lower positions. The lifting mechanism raises and lowers each support pin 12, thereby raising and lowering the substrate 9 supported by the support pins 12. That is, here, the plurality of support pins 12 not only function as support pins for supporting the substrate 9, but also as top pins for raising and lowering the substrate 9.

[0033] A plurality of position-regulating pins 13 abut from or approach the substrate 9, which is horizontally positioned above the base plate 11, thereby regulating the position of the substrate 9. The specific configuration of the position-regulating pins 13 will be described later.

[0034] The rotation mechanism 14 rotates the base plate 11 about an axis extending vertically (rotation axis) J1. For example, the axis extending vertically through the center of the upper surface 111 of the base plate 11 is defined as the rotation axis J1. As will be explained later, the center (or a position sufficiently close to the center) of the substrate 9, which is positioned by the position regulating pin 13, when viewed from above coincides with the rotation axis J1. That is, the rotation axis J1 passes through the center (or a position sufficiently close to the center) of the substrate 9, which is positioned by the position regulating pin 13. Specifically, the rotation mechanism 14 comprises, for example, a shaft 141 and a motor 142. The shaft 141 is coaxially arranged with the rotation axis J1 and connected at its upper end to the lower surface 112 of the base plate 11. The motor 142 drives the shaft 141 to rotate about this axis. Because the shaft 141 is driven by the motor 142 to rotate, the base plate 11 rotates about the rotation axis J1. The motor 142 operates according to instructions from the control unit 4. The rotational speed of the base plate 11 and the position (angle) of the rotational direction when the base plate 11 stops rotating are controlled by the control unit 4.

[0035] (Processing fluid supply unit 2) The processing liquid supply unit 2 supplies processing liquid to the substrate 9 (specifically, the substrate 9 which is horizontally positioned above the base plate 11 and whose position is regulated by the position regulating pin 13). The processing liquid supply unit 2 includes, for example, a processing liquid nozzle 21 and a processing liquid supply source 22.

[0036] The processing fluid nozzle 21 is a nozzle that sprays out the processing fluid and is supported by a nozzle arm 211. A nozzle moving mechanism (not shown) is connected to the nozzle arm 211. The nozzle arm 211 is driven by the nozzle moving mechanism to move the processing fluid nozzle 21 between a spraying position and a standby position. Here, the "spraying position" is the position where the processing fluid nozzle 21 overlaps with the substrate 9 when viewed from above (for example, the position facing the center of the upper surface 92 of the substrate 9). The "standby position" is the position where the processing fluid nozzle 21 does not overlap with the substrate 9 when viewed from above and is separated from it.

[0037] The treatment fluid supply source 22 is a supply source that supplies treatment fluid to the treatment fluid nozzle 21. Specifically, the treatment fluid supply source 22 includes, for example, a drug supply source 22a that supplies a first treatment fluid to the treatment fluid nozzle 21, and a rinsing fluid supply source 22b that supplies a second treatment fluid to the treatment fluid nozzle 21. The drug fluid may be, for example, hydrofluoric acid (HF), ozone-containing hydrofluoric acid solution, dilute hydrofluoric acid (DHF), buffered hydrofluoric acid (BHF), or SCl (a liquid containing NH4OH and H2O2), but is not limited to these. Similarly, the rinsing fluid may be, for example, deionized water (DIW) or isopropanol (IPA), but is not limited to these.

[0038] The liquid supply source 22a is connected to the processing liquid nozzle 21 via a pipe 223a that intersects the liquid valve 221a and the flow adjustment unit 222a. Therefore, when the processing liquid nozzle 21 is in the spray position and the liquid valve 221a is opened, liquid is sprayed from the processing liquid nozzle 21 onto the substrate 9 (here, the upper surface 92 of the substrate 9). Similarly, the rinsing liquid supply source 22b is connected to the processing liquid nozzle 21 via a pipe 223b that intersects the rinsing liquid valve 221b and the flow adjustment unit 222b. Therefore, when the processing liquid nozzle 21 is in the spray position and the rinsing liquid valve 221b is opened, rinsing liquid is sprayed from the processing liquid nozzle 21 onto the substrate 9 (here, the upper surface 92 of the substrate 9). Each valve 221a, 221b and each flow adjustment unit 222a, 222b operates according to the instructions from the control unit 4. The timing and amount of the treatment liquid are controlled by the control unit 4.

[0039] (Gas Supply Department 3) The gas supply unit 3 supplies gas to the substrate 9 (specifically, the substrate 9, which is horizontally positioned above the base plate 11 and whose position is regulated by the position regulating pin 13). Specifically, the gas supply unit 3 supplies gas to the space (lower space) U between the lower surface 91 of the substrate 9 and the upper surface 111 of the base plate 11. The gas supply unit 3 includes, for example, a gas supply pipe 31 and a gas supply source 32.

[0040] The gas supply pipe 31 is a conduit for gas flow, which passes through the interior of the shaft 141. For example, a through-hole 113 extending through the thickness of the base plate 11 is provided at the center of the base plate 11. The gas supply pipe 31 extends from the upper end of the shaft 141 into the through-hole 113, with its upper end positioned within the through-hole 113. A circular plate 115 is provided facing the opening at the upper end of the gas supply pipe 31 positioned within the through-hole 113. Specifically, for example, a circular recess 114, which surrounds the through-hole 113 when viewed from above, is provided on the upper surface 111 of the base plate 11, and the circular plate 115 is provided within the recess 114. The circular plate 115 is supported horizontally, for example, by a plurality of legs (not shown) erected on the bottom surface of the recess 114, at a position separate from the bottom surface of the recess 114.

[0041] Gas supply source 32 is a supply source that supplies the prescribed gas to gas supply pipe 31. The gas supplied from gas supply source 32 may be, for example, an inert gas (nitrogen, argon, helium), or clean air with low humidity, but is not limited to these. Furthermore, the gas supplied from gas supply source 32 may be a high-pressure gas, a compressed gas, etc.

[0042] The gas supply source 32 is connected to the gas supply pipe 31 via a pipe 323 through which a gas valve 321 and a flow adjustment unit 322 are inserted. Therefore, when the gas valve 321 is opened, gas is ejected from the opening at the upper end of the gas supply pipe 31. The ejected gas collides with the circular plate 115, expands radially, and is ejected into the lower space U through the gap between the circular plate 115 and the recess 114. Thus, in the lower space U, viewed from above, a gas flow is formed that expands radially (outward) along the axis of rotation J1. The gas valve 321 and the flow adjustment unit 322 are operated according to instructions from the control unit 4, and the timing and amount of gas ejection are controlled by the control unit 4.

[0043] (Control Unit 4) The control unit 4 controls the various components of the substrate processing apparatus 100 (rotary clamp (substrate holding unit) 1, processing liquid supply unit 2, and gas supply unit 3). The control unit 4 is, for example, a general computer with circuitry. As an example, as shown in FIG12, the control unit 4 is configured with the following components: a CPU (Central Processing Unit) 41, which is a central arithmetic unit responsible for data processing; a ROM (Read Only Memory) 42, which stores basic programs; a RAM (Random Access Memory) 43, which is used as the working area for the CPU 41 to perform specified processing (data processing); a memory device 44, which is composed of non-volatile memory devices such as flash memory and hard disk drives; and bus cables 45 that connect these components to each other. The memory device 44 stores a program P that specifies the processing to be executed by the control unit 4. By executing the program P by the CPU 41, the control unit 4 can execute the processing specified by the program P. However, some or all of the processing performed by the control unit 4 can be executed by dedicated hardware such as logic circuits. Furthermore, program P can be stored on a recording medium, or program P can be installed on the control unit 4 using that recording medium.

[0044] <2. Position Regulation Pin> <2-1. Composition of Position Control Pins> The position control pin 13 provided on the base plate 11 will be described. Furthermore, in the following description, the portion surrounding the main surface of the substrate 9 that is ring-shaped in plan view and is not parallel to the flat surfaces extending from each main surface is referred to as the "peripheral portion 93" of the substrate 9. Also, the surface of the peripheral portion 93 of the substrate 9 that faces radially outward from the substrate 9 (typically a surface orthogonal to the main surface) is referred to as the "peripheral end face 930". Furthermore, the portion of the peripheral portion 93 of the substrate 9 that connects to the lower side of the peripheral end face 930 is referred to as the "lower peripheral surface 931", and the portion that connects to the upper side of the peripheral end face 930 is referred to as the "upper peripheral surface 932". That is, the lower surface 931 of the peripheral portion is the portion located between the end face 930 of the peripheral portion and the lower surface (main surface facing downward) 91 of the substrate 9, and the upper surface 932 of the peripheral portion is the portion located between the end face 930 of the peripheral portion and the upper surface (main surface facing upward) 92 of the substrate 9. As an example, when the diameter of the substrate 9 is 300 mm, the peripheral portion 93 is an annular region approximately 0.5 mm away from the end face 930 of the peripheral portion. Furthermore, the peripheral portion 93 is, as an example, curved into an arc shape, but is not limited to such a shape.

[0045] As shown in Figure 2, a plurality of position control pins 13 (six in the example) are provided on the upper surface 111 of the base plate 11. The plurality of position control pins 13 are arranged at equal intervals along the circumference of a reference circle C defined on the upper surface 111. However, the "reference circle C" is an imaginary circle centered on the rotation axis J1, with a radius approximately the same as the radius of the substrate 9. That is, the circumference of the reference circle C, viewed from above, is defined to overlap with the peripheral end face 930 of the substrate 9, which is located at a position (hereinafter referred to as "normal position Q") coinciding with the rotation axis J1. Furthermore, a plurality of support pins 12 are also provided on the circumference of the reference circle C. That is, the plurality of support pins 12 are arranged at equal intervals along the circumference of the reference circle C. Here, the same number of position control pins 13 and support pins 12 are successively set, and the position control pins 13 and support pins 12 are arranged alternately and at equal intervals along the circumference of the reference circle C.

[0046] The plurality of position control pins 13 disposed on the base plate 11 include stationary pins 13a and sliding pins 13b. As an example, here, every other position control pin 13 along the circumferential direction of the reference circle C (i.e., three position control pins 13 that form a 120-degree angle with each other when viewed from the rotation axis J1) is a stationary pin 13a, and the remaining three position control pins 13 are sliding pins 13b.

[0047] (i) Stationary pin 13a The stationary pin 13a will be described with reference to Figures 3 and 4. Figure 3 is a top view of the stationary pin 13a. Figure 4 is a side view schematically showing the movement of the stationary pin 13a between the release position P1 and the regulation position P2.

[0048] The stationary pin 13a includes: a generally cylindrical base portion 61a and a protrusion 62a that protrudes upward from the upper end face of the base portion 61a.

[0049] The base portion 61a is disposed within a cylindrical hole 116 provided on the upper surface 111 of the base plate 11. Specifically, a plurality of holes 116 are provided on the upper surface 111 of the base plate 11, arranged at equal intervals along the circumference of a reference circle C, and the base portion 61a of each stationary pin 13a is disposed within each hole 116. A bearing 1161 (Fig. 1) is provided in the hole 116, supporting the base portion 61a in a manner that allows it to rotate about an axis (pin rotation axis) J2 passing through its center and extending vertically. Furthermore, a locking member (not shown) may be provided in the hole 116 to limit the rotation range of the base portion 61a to a predetermined angular range. Also, the upper surface of the base portion 61a is preferably disposed at the same height as the upper surface 111 of the base plate 11, or slightly above the upper surface 111. According to this configuration, when processing with the processing liquid is performed, the processing liquid will not accumulate on the upper surface of the substrate 61a.

[0050] The protrusion 62a is positioned offset from the pivot axis J2 (eccentric position). On the side of the protrusion 62a, a regulating surface (stationary regulating surface) 620a is provided on the portion of this side facing the pivot axis J1. Specifically, the stationary regulating surface 620a includes, for example, an upper surface 621a, a curved surface 622a connected to the lower part of the upper surface 621a, and a lower surface 623a connected to the lower part of the curved surface 622a. The upper surface 621a is a flat surface region that slopes upwards towards the pivot axis J1 (i.e., the normal direction faces obliquely downwards). The curved surface 622a is, for example, a curved surface with a curvature similar to that of the periphery 93 of the substrate 9. The lower surface 623a is a flat surface region that slopes downwards towards the pivot axis J1 (i.e., the normal direction faces obliquely upwards). The tilt angle of the lower surface 623a is, for example, the same as the tilt angle of the upper surface 621a.

[0051] The stationary pin 13a is driven by the pin drive mechanism 600 (described later) and rotates about the pin rotation axis J2. As a result, the stationary regulating surface 620a moves in a direction that approaches and separates from the circumference of the reference circle C (or even the peripheral portion 93 of the substrate 9 located in the normal position Q). That is, the stationary pin 13a moves between a position (release position) P1 where the stationary regulating surface 620a is relatively far from the peripheral portion 93 of the substrate 9, and a position (regulating position) P2 where the stationary regulating surface 620a is relatively close to the peripheral portion 93 of the substrate 9.

[0052] With the stationary pin 13a in the released position P1, the stationary regulating surface 620a is fully separated from the periphery 93 of the substrate 9 in the normal position Q when viewed from above and the side (the two-point chain line in Figure 3 and the upper section in Figure 4).

[0053] With the stationary pin 13a positioned in the regulating position P2, the stationary regulating surface 620a, viewed from above, extends parallel to the tangent of the peripheral portion 93 of the substrate 9 located in the regulating position Q, and abuts against the peripheral portion 93 when viewed from the side (solid line in Figure 3 and lower section of Figure 4). Specifically, the upper surface 621a faces and abuts against the upper surface 932 of the peripheral portion, the curved surface 622a faces and abuts against the end face 930 of the peripheral portion, and the lower surface 623a faces and abuts against the lower surface 931 of the peripheral portion. With the stationary pin 13a positioned in the regulating position P2, the stationary regulating surface 620a can be pushed relative to the peripheral portion 93 of the substrate 9.

[0054] (ii) Sliding pin 13b The sliding pin 13b will be described with reference to Figures 5 and 6. Figure 5 is a top view of the sliding pin 13b. Figure 6 is a side view schematically showing the movement of the sliding pin 13b between the release position P1 and the control position P2.

[0055] The sliding pin 13b, like the stationary pin 13a, has a generally cylindrical base portion 61b and a protrusion 62b that protrudes upward from the upper end of the base portion 61b.

[0056] The base portion 61b, like the base portion 61a of the stationary pin 13a, is disposed in a cylindrical hole 116 provided on the upper surface 111 of the base plate 11. As described above, a bearing 1161 (Fig. 1) is provided in the hole 116, and the base portion 61b is supported in such a way that it can rotate about a pin rotation axis J2 that passes through the center and extends vertically.

[0057] The protrusion 62b, like the protrusion 62a of the stationary pin 13a, is positioned offset from the pin's rotation axis J2. On the side of the protrusion 62b, a regulating surface (sliding regulating surface) 620b is provided on the portion of this side facing the rotation axis J1. Specifically, the sliding regulating surface 620b includes, for example, an upper surface 621b and a side surface 622b connected to the lower part of the upper surface 621b. The upper surface 621b is a flat surface region that slopes upwards towards the rotation axis J1 (i.e., the normal direction points diagonally downwards). The slope angle of the upper surface 621b is, for example, the same as the slope angle of the upper surface 621a of the stationary regulating surface 620a. The side surface 622b is a flat surface region extending vertically (i.e., the normal direction extends in the horizontal plane). The upper surface 621b and the side surface 622b can be connected via, for example, a curved surface 623b. In this case, the curved surface 623b is, for example, a curved surface that is curved with the same curvature as the periphery 93 of the substrate 9.

[0058] The sliding pin 13b, like the stationary pin 13a, is driven by the pin drive mechanism 600 (described later) and rotates about the pin rotation axis J2. As a result, the sliding regulating surface 620b moves in a direction that approaches and separates from the circumference of the reference circle C (and consequently, the peripheral portion 93 of the substrate 9 located in the normal position Q). That is, by rotating about the pin rotation axis J2, the sliding pin 13b moves between a position (release position) P1 where the sliding regulating surface 620b is relatively far from the peripheral portion 93 of the substrate 9, and a position (regulating position) P2 where the sliding regulating surface 620b is relatively close to the peripheral portion 93 of the substrate 9.

[0059] With the sliding pin 13b in the released position P1, the sliding guide surface 620b, viewed from above and the side, is fully separated from the periphery 93 of the substrate 9 in the normal position Q (the two-point chain line in Figure 5 and the upper section in Figure 6).

[0060] With the sliding pin 13b positioned in the regulating position P2, the sliding regulating surface 620b, viewed from above, extends parallel to the tangent of the peripheral portion 93 of the substrate 9 located in the regulating position Q. Viewed from the side, it has a gap G relative to the peripheral portion 93 and is nearly face-to-face (i.e., non-contact face-to-face) (solid line in FIG5 and lower section of FIG6). Specifically, the side surface 622b has a gap G between itself and the peripheral end face 930, and faces the peripheral end face 930 from the side. The upper surface 621b has a gap G between itself and the upper surface 932 of the peripheral portion, and faces the upper surface 932 of the peripheral portion from an obliquely upward direction. The size of the gap G (the separation distance between the sliding regulating surface 620b and the peripheral portion 93 in the facing direction) is preferably a value that is sufficiently small relative to the diameter of the substrate 9. As an example, the size of the gap G is preferably about 0.1 mm.

[0061] <2-2. Position Regulation Status> The position regulating pin 13 does not regulate the position of the substrate 9 when it is in the released position P1, and regulates the position of the substrate 9 when it is in the regulating position P2. The state in which the position regulating pin 13 regulates the position of the substrate 9 will be described with reference to Figures 7 and 8. Figure 7 is a schematic top view showing the state M1 in which the stationary pin 13a regulates the position of the substrate 9. Figure 8 is a schematic top view showing the state M2 in which the sliding pin 13b regulates the position of the substrate 9. Furthermore, for ease of explanation, the protrusions 62a and 62b of the position regulating pin 13 are shown in cross-section in Figures 7 and 8.

[0062] (i) Static regulation state M1 By positioning each stationary pin 13a on the base plate 11 at the regulation position P2, a state (hereinafter referred to as "stationary regulation state") M1 is formed in which each stationary pin 13a regulates the position of the substrate 9 (Figure 7). However, since the position regulation performed by the stationary pin 13a is more stringent than the position regulation performed by the sliding pin 13b, the position regulation performed by the stationary pin 13a is not hindered by the position regulation performed by the sliding pin 13b. Therefore, in the stationary regulation state M1, the sliding pin 13b can be positioned at either the release position P1 or the regulation position P2. In this embodiment, in the stationary regulation state M1, the sliding pin 13b is positioned at the regulation position P2. The stationary regulation state M1 is released by positioning both the stationary pin 13a and the sliding pin 13b at the release position P1.

[0063] In the static regulation state M1, the substrate 9 is positioned at a designated position (normal position) Q above the base plate 11, and is rotated in a manner that does not rotate relative to the base plate 11.

[0064] That is, in the stationary regulation state M1, the stationary regulation surfaces 620a of each stationary pin 13a abut against different positions along the circumferential direction of the peripheral portion 93 of the substrate 9. Specifically, the upper surface 621a abuts against the upper surface 932 of the peripheral portion, the curved surface 622a abuts against the end face 930 of the peripheral portion, and the lower surface 623a abuts against the lower surface 931 of the peripheral portion. In this way, the substrate 9 is position-regulated in a manner that does not automatically change position in the radial and vertical directions. Here, since the plurality of stationary pins 13a are arranged on the circumference of the reference circle C centered on the rotation axis J1, the prescribed position of the substrate 9, which is position-regulated by the plurality of stationary pins 13a, is such that the center of the substrate 9 coincides with the rotation axis J1 (i.e., the normal position Q). Furthermore, the substrate 9 is rotated by the frictional force borne by the stationary regulating surface 620a that abuts against the peripheral portion 93 (which is pushed as needed), so as not to be displaced relative to each stationary pin 13a (or even the base plate 11) about the rotation axis J1 in the direction of rotation (that is, not to be rotated relative to the base plate 11).

[0065] (ii) Sliding gauge state M2 By positioning the sliding pins 13b on the base plate 11 at the control position P2, a state (hereinafter referred to as "sliding control state") M2 is formed in which the sliding pins 13b control the position of the substrate 9 (Figure 8). However, since the position control performed by the sliding pins 13b is looser than the position control performed by the stationary pins 13a, the position control performed by the sliding pins 13b is hindered by the position control performed by the stationary pins 13a. Therefore, in the sliding control state M2, the stationary pins 13a are positioned at the release position P1. The sliding control state M2 is released by both the stationary pins 13a and the sliding pins 13b being positioned at the release position P1.

[0066] In the sliding regulation state M2, the substrate 9 is allowed to rotate relative to the base plate 11 (not subject to rotation regulation) and is position-regulated in such a way that it does not move beyond the allowable range in the radial and upward directions from the normal position Q.

[0067] That is, in the sliding regulation state M2, at different positions along the circumferential direction on the periphery 93 of the substrate 9 positioned in the normal position Q, the sliding regulation surfaces 620b of each sliding pin 13b are provided with a gap G and are nearly facing each other (i.e., non-contact facing). Therefore, for example, when the substrate 9 is radially displaced from the normal position Q, during the stage when the displacement amount reaches the size of the gap G, the sliding regulation surface 620b of at least one sliding pin 13b in the displacement direction abuts against the periphery 93 (typically, the side 622b abuts against the periphery end face 930), and the substrate 9 cannot be excessively displaced. That is, the substrate 9 is position-regulated in such a way that the radial displacement does not exceed the allowable range (the allowable range equivalent to the gap G) from the normal position Q. Furthermore, for example, when the substrate 9 is displaced upward from its normal position Q, during the stage when the displacement reaches the size of the gap G, at least one sliding pin 13b's sliding regulating surface 620b abuts against the peripheral portion 93 (typically, the upper surface 621b abuts against the upper surface 932 of the peripheral portion), preventing the substrate 9 from excessively displacing. That is, the substrate 9 is positioned in a manner that does not exceed the allowable range (the allowable range equivalent to the gap G) in the upward direction, in addition to the radial direction. Furthermore, in the sliding regulating state M2, even if the substrate 9 is displaced in the direction of rotation about the rotation axis J1 at the normal position Q, the gap G between the sliding regulating surface 620b of each sliding pin 13b and the peripheral portion 93 of the substrate 9 is maintained. Therefore, the substrate 9 at the normal position Q is not hindered by each sliding pin 13b and can be displaced in the direction of rotation about the rotation axis J1. That is, the substrate 9 is allowed to rotate relative to the base plate 11 at the normal position Q. Furthermore, as described above, when the substrate 9 is displaced from its normal position Q, a portion of the sliding guide surface 620b of the sliding pin 13b sometimes abuts against the peripheral portion 93 of the substrate 9. In this state, when the substrate 9 is displaced in the rotational direction around the rotation axis J1, the substrate 9 experiences a slight frictional force from the sliding guide surface 620b abutting against the peripheral portion 93. However, in this case, a frictional force as large as that regulating the displacement of the substrate 9 in the rotational direction (that is, a frictional force as large as that regulating rotation without the substrate 9 rotating relative to the base plate 11) will not act on the substrate 9. That is, even when the substrate 9 is displaced to near the normal position Q (a position where the displacement from the normal position Q does not exceed the allowable range equivalent to the gap G), it is allowed to rotate relative to the base plate 11.

[0068] <2-3. Pin Drive Mechanism> A pin drive mechanism 600 is connected to the position control pin 13, causing it to rotate about the pin's rotation axis J2. The position control pin 13 is rotated by the pin drive mechanism 600, and the position control pin 13 moves between the release position P1 and the control position P2. An example of the configuration of the pin drive mechanism 600 will be specifically described with reference to Figures 1, 9, 10, and 11. Figures 9, 10, and 11 schematically show the lower surface 112 of the base plate 11. Furthermore, in Figures 9, 10, and 11, cross-sectional lines are provided on the N-pole side of the magnet. Also, each rotating magnet 601a, 601b, each closed magnet 602a, 602b, and each open magnet 603a, 603b are actually housed in a dedicated retaining member, but the retaining member is omitted from the illustration.

[0069] (Rotate magnets 601a and 601b) The pin drive mechanism 600 includes a plurality of first rotating magnets 601a and a plurality of second rotating magnets 601b. Each of the plurality of first rotating magnets 601a is mounted on a stationary pin 13a on the lower surface 112 side of the base plate 11. Each of the plurality of second rotating magnets 601b is mounted on a sliding pin 13b on the lower surface 112 side of the base plate 11. Both the first rotating magnets 601a and the second rotating magnets 601b are, for example, permanent magnets, and the orientation of their magnetic poles (magnetization direction) is, for example, perpendicular to the rotation axis J1 and the pin rotation axis J2.

[0070] (Enclosed magnets 602a, 602b) The pin drive mechanism 600 further includes a plurality of first closed magnets 602a and a plurality of second closed magnets 602b. Each of the plurality of first closed magnets 602a is fixed in the lower surface 112 of the base plate 11 near the first rotating magnet 601a. ​​Each of the plurality of second closed magnets 602b is fixed in the lower surface 112 of the base plate 11 near the second rotating magnet 601b. Both the first closed magnets 602a and the second closed magnets 602b are, for example, permanent magnets, and the orientation of their magnetic poles is, for example, perpendicular to the rotation axis J1 and the pin rotation axis J2, and radially inclined relative to a circle centered on the rotation axis J1. However, the orientation of the magnetic poles of the first closed magnets 602a and the orientation of the magnetic poles of the second closed magnets 602b are opposite to each other radially relative to the circle centered on the rotation axis J1. For example, if the first enclosed magnet 602a is configured with the S pole facing the side of the rotation axis J1, the second enclosed magnet 602b is configured with the N pole facing the side of the rotation axis J1.

[0071] (Open magnets 603a, 603b) The pin drive mechanism 600 further includes a plurality of first open magnets 603a and a plurality of second open magnets 603b. The first open magnets 603a and second open magnets 603b are both independently disposed below the base plate 11 (Fig. 1). The first open magnets 603a and second open magnets 603b are arc-shaped in plan view and are arranged on the circumference of a circle centered on the rotation axis J1 (a circle with a smaller diameter than the reference circle C) below the base plate 11. However, the first open magnets 603a and second open magnets 603b are provided with a certain gap along the circumferential direction and are arranged alternately. When the base plate 11 is stopped rotating at a predetermined rotation stop position, each first open magnet 603a is positioned near the first rotating magnet 601a in plan view, and each second open magnet 603b is positioned near the second rotating magnet 601b in plan view. Both the first open magnet 603a and the second open magnet 603b are, for example, permanent magnets, with their magnetic poles oriented radially along a circle centered on the rotation axis J1. However, the orientation of the magnetic poles of the first open magnet 603a and the second open magnet 603b is opposite to each other. Furthermore, radially along the circle centered on the rotation axis J1, the orientation of the magnetic poles of the first open magnet 603a is opposite to the orientation of the magnetic poles of the first closed magnet 602a, and the orientation of the magnetic poles of the second open magnet 603b is opposite to the orientation of the magnetic poles of the second closed magnet 602b. For example, in the case where the S pole of the first closed magnet 602a is arranged on the side of the rotation axis J1 and the N pole of the second closed magnet 602b is arranged on the side of the rotation axis J1, the first open magnet 603a is configured with the orientation of the magnetic pole as if the N pole were arranged on the side of the rotation axis J1, and the second open magnet 603b is configured with the orientation of the magnetic pole as if the S pole were arranged on the side of the rotation axis J1.

[0072] (Magnetic lifting mechanism 604a, 604b) The pin drive mechanism 600 further includes: a first magnet lifting mechanism 604a for lifting (moving in the vertical direction) a plurality of first open magnets 603a, and a second magnet lifting mechanism 604b for lifting (moving) a plurality of second open magnets 603b (FIG. 1). Both the first magnet lifting mechanism 604a and the second magnet lifting mechanism 604b are disposed below the base plate 11.

[0073] Specifically, the first magnet lifting mechanism 604a includes, for example, a piston rod 6041a and a cylinder 6042a for advancing and retracting it. A first open magnet 603a is mounted at the front end of the piston rod 6041a. However, a plurality of first open magnets 603a are interconnected by an annular member (not shown). When the piston rod 6041a descends due to the drive of the cylinder 6042a, the plurality of first open magnets 603a are positioned at a position sufficiently separated from the lower surface 112 of the base plate 11 (separated position) (solid line in Figure 1). At this time, the first open magnets 603a do not exert a magnetic influence on the first rotating magnet 601a. ​​On the other hand, when the piston rod 6041a rises due to the drive of the cylinder 6042a, the plurality of first open magnets 603a are positioned close to the lower surface 112 of the base plate 11 (closed position) (two-point chain line in Figure 1). At this time, the first open magnet 603a exerts a magnetic influence on the first rotating magnet 601a.

[0074] Specifically, the second magnet lifting mechanism 604b includes, for example, a piston rod 6041b and a cylinder 6042b for advancing and retracting it. A second open magnet 603b is mounted at the front end of the piston rod 6041b. However, the plurality of second open magnets 603b are interconnected by an annular member (not shown). When the piston rod 6041b descends due to the drive of the cylinder 6042b, the plurality of second open magnets 603b are positioned at a position sufficiently separated from the lower surface 112 of the base plate 11 (separated position) (two-point chain line in Figure 1). At this time, the second open magnets 603b do not exert a magnetic influence on the second rotating magnet 601b. On the other hand, when the piston rod 6041b rises due to the drive of the cylinder 6042b, the plurality of second open magnets 603b are positioned close to the lower surface 112 of the base plate 11 (close position) (solid line in Figure 1). At this time, the second open magnet 603b exerts a magnetic influence on the second rotating magnet 601b.

[0075] (The driving state of stationary pin 13a) With a plurality of first open magnets 603a positioned close to each other, each first open magnet 603a is located near a first rotating magnet 601a, and the first open magnets 603a exert a magnetic influence on the first rotating magnet 601a (Figs. 10 and 11). At this time, the magnetic attraction between the first rotating magnet 601a and the first open magnet 603a is greater than the magnetic attraction between the first rotating magnet 601a and the first closed magnet 602a. Therefore, the first rotating magnet 601a adopts a first posture (e.g., the S pole is positioned opposite to the rotation axis J1, and the N pole is positioned on the side of the rotation axis J1) by the magnetic attraction between it and the first open magnet 603a (in the example shown in the figures, the orientation of the magnetic poles of the first rotating magnet 601a is radially inclined relative to the circle centered on the rotation axis J1). The position (angular position centered on the pin rotation axis J2) of the stationary pin 13a (that is, the stationary pin 13a installed on the first rotating magnet 601a) in the first posture state becomes the released position P1. That is, with the plurality of first open magnets 603a arranged in the near position, each of the plurality of stationary pins 13a is arranged in the released position P1.

[0076] On the other hand, with the plurality of first open magnets 603a arranged in a separated position, each first open magnet 603a is arranged in a position sufficiently separated from the first rotating magnet 601a (Fig. 9). At this time, the magnetic attraction between the first rotating magnet 601a and the first closed magnet 602a is greater than the magnetic attraction between the first rotating magnet 601a and the first open magnet 603a. Therefore, the first rotating magnet 601a becomes a second posture different from the first posture by means of the magnetic attraction between it and the first closed magnet 602a (for example, the N pole is arranged on the opposite side of the rotation axis J1 and the S pole is arranged on the side of the rotation axis J1) (in the example of the figure, the orientation of the magnetic poles of the first rotating magnet 601a is inclined radially relative to the circle centered on the rotation axis J1). The position of the stationary pin 13a (i.e., the stationary pin 13a installed on the first rotating magnet 601a) in the second posture (the angular position centered on the pin rotation axis J2) becomes the regulating position P2. That is, with the plurality of first open magnets 603a arranged in the separated positions, each of the plurality of stationary pins 13a is arranged in the regulating position P2.

[0077] Thus, when the plurality of first open magnets 603a are driven by the first magnet lifting mechanism 604a to move from the separated position to the approaching position, the plurality of stationary pins 13a simultaneously move from the regulating position P2 to the releasing position P1. On the other hand, when the plurality of first open magnets 603a are driven by the first magnet lifting mechanism 604a to move from the approaching position to the separated position, the plurality of stationary pins 13a simultaneously move from the releasing position P1 to the regulating position P2. Furthermore, when the base plate 11 rotates about the rotation axis J1, the first rotating magnet 601a and the first closed magnet 602a rotate together with the base plate 11, while the first open magnet 603a does not rotate. With a plurality of first open magnets 603a positioned in a near-proximity position and the base plate 11 rotating at a speed of a certain degree or higher (e.g., a liquid treatment speed f1 or higher, as described later), each first open magnet 603a positioned in the near-proximity position exerts a substantial magnetic attraction on each first rotating magnet 601a regardless of the position (angular position) of the first rotating magnet 601a. ​​Therefore, each stationary pin 13a is maintained in the released position P1.

[0078] (The driving state of sliding pin 13b) With a plurality of second open magnets 603b positioned close to each other, each second open magnet 603b is located near a second rotating magnet 601b, and the second open magnets 603b exert a magnetic influence on the second rotating magnet 601b (Fig. 10). At this time, the magnetic attraction between the second rotating magnet 601b and the second open magnet 603b is greater than the magnetic attraction between the second rotating magnet 601b and the second closed magnet 602b. Therefore, the second rotating magnet 601b adopts a first posture (e.g., an posture in which the N pole is positioned opposite to the rotation axis J1 and the S pole is positioned on the side of the rotation axis J1) by means of the magnetic attraction between it and the second open magnet 603b (in the example shown in the figure, the orientation of the magnetic poles of the second rotating magnet 601b is radially inclined relative to the circle centered on the rotation axis J1). The position (angular position centered on the pin rotation axis J2) of the sliding pin 13b (that is, the sliding pin 13b installed on the second rotating magnet 601b) in the first posture state becomes the released position P1. That is, with the plurality of second open magnets 603b arranged in the near position, each of the plurality of sliding pins 13b is arranged in the released position P1.

[0079] On the other hand, with the plurality of second open magnets 603b arranged in a separated position, each second open magnet 603b is arranged in a position sufficiently separated from the second rotating magnet 601b (Figs. 9 and 11). At this time, the magnetic attraction between the second rotating magnet 601b and the second closed magnet 602b is greater than the magnetic attraction between the second rotating magnet 601b and the second open magnet 603b. Therefore, the second rotating magnet 601b becomes a second posture different from the first posture due to the magnetic attraction between it and the second closed magnet 602b (for example, the S pole is arranged on the opposite side of the rotation axis J1, and the N pole is arranged on the side of the rotation axis J1) (in the example in the figure, the orientation of the magnetic poles of the second rotating magnet 601b is inclined radially relative to the circle centered on the rotation axis J1). The position (angular position centered on the pin rotation axis J2) of the sliding pin 13b (that is, the sliding pin 13b installed on the second rotating magnet 601b) in the second posture state becomes the regulation position P2. That is, with the plurality of second open magnets 603b arranged in the separated position, each of the plurality of sliding pins 13b is arranged in the regulation position P2.

[0080] Thus, when the plurality of second open magnets 603b are driven by the second magnet lifting mechanism 604b to move from the separated position to the approaching position, the plurality of sliding pins 13b simultaneously move from the controlled position P2 to the released position P1. When the plurality of second open magnets 603b are driven by the second magnet lifting mechanism 604b to move from the approaching position to the separated position, the plurality of sliding pins 13b simultaneously move from the released position P1 to the controlled position P2. Furthermore, as described above, when the plurality of second open magnets 603b are positioned in the approaching position and the base plate 11 rotates at a certain speed, each sliding pin 13b is maintained in the released position P1.

[0081] <3. Processing Flow> The processing flow performed by the substrate processing apparatus 100 will be described with reference to Figures 12, 13, and 14. Figure 12 is a block diagram showing the configuration of the control unit 4. Figure 13 is a diagram showing the processing flow performed by the substrate processing apparatus 100. Figure 14 is a diagram illustrating the processing flow performed by the substrate processing apparatus 100.

[0082] The processing performed by the substrate processing apparatus 100 is carried out by the control unit 4 controlling various components of the substrate processing apparatus 100 (rotation mechanism 14, liquid valve 221a, flow adjustment unit 222a, rinsing liquid valve 221b, flow adjustment unit 222b, gas valve 321, flow adjustment unit 322, pin drive mechanism 600, etc.). Furthermore, the series of processes described below is usually repeated. That is, after a series of processes on one substrate 9 is completed, the same series of processes is then performed on another new substrate 9.

[0083] Step S1 First, the substrate 9, which will be processed, is moved into the substrate processing apparatus 100. Specifically, first, an external conveying mechanism inserts the handle holding the substrate 9 into the cavity of the substrate processing apparatus 100 and positions it above the base plate 11. Here, for example, a pattern of a device (a device in the manufacturing process) is formed on one main surface of the substrate 9, and the other main surface without a pattern is processed in the substrate processing apparatus 100. In this case, the substrate 9 held by the handle is positioned such that the main surface with the pattern faces downward (becoming the lower surface 91) and the main surface without a pattern faces upward (becoming the upper surface 92).

[0084] Step S2 Next, the hand is lowered. When the hand holding the substrate 9 is positioned above the base plate 11, each support pin 12 is positioned in the upper position, and each stationary pin 13a and each sliding pin 13b is positioned in the released position P1. Therefore, when the hand is lowered, the periphery 93 of the substrate 9 is supported from below by each support pin 12. In this way, the substrate 9 is transferred from the hand to each support pin 12. Afterward, the conveying mechanism retracts the hand from above the base plate 11 and exits from the chamber of the substrate processing apparatus 100. When the hand retracts from above the base plate 11, each support pin 12 is lowered and positioned in the lower position.

[0085] Step S3 Subsequently, the pin drive mechanism 600 moves each stationary pin 13a and each sliding pin 13b together from the release position P1 to the regulation position P2. When each stationary pin 13a begins to move (rotate) towards the regulation position P2, firstly, the lower surface 623a of the stationary regulation surface 620a abuts against the lower peripheral surface 931 of the substrate 9 supported by each support pin 12. Then, as each stationary pin 13a moves forward, the substrate 9 is guided along the lower surface 623a and moves upward (lifted) while maintaining a horizontal posture, separating from each support pin 12. Then, with each stationary pin 13a positioned in the regulation position P2, a stationary regulation state M1 (Fig. 7) is formed in which each stationary pin 13a regulates the position of the substrate 9. As described above, in the stationary regulation state M1, each sliding pin 13b can be positioned in either the release position P1 or the regulation position P2, but here it is positioned in the regulation position P2.

[0086] Step S4 Subsequently, the gas supply unit 3 begins to supply gas to the lower space U. Specifically, the gas valve 321 is opened. Hereby, gas supplied from the gas supply source 32 is ejected from the gas supply pipe 31 at a predetermined flow rate adjusted by the flow rate adjustment unit 322. The gas supply rate is, for example, 200 L / min or more. The gas supply unit 3 continues to supply gas during the processing of the substrate 9.

[0087] Step S5 Then, the base plate 11 begins to rotate. That is, the rotation mechanism 14 causes the base plate 11 to rotate around the rotation axis J1, increasing the rotational speed to a predetermined liquid processing speed f1. In the stationary control state M1, the substrate 9 is rotated in a manner that does not rotate relative to the base plate 11. That is, in the stationary control state M1, the substrate 9 and the base plate 11 rotate as a unit (at the same rotational speed). Therefore, when the rotation of the base plate 11 begins and its rotational speed increases to the liquid processing speed f1, the substrate 9 also begins to rotate together with the base plate 11, increasing its rotational speed to the liquid processing speed f1. The liquid processing speed f1 is, for example, 150~1800 rpm.

[0088] Step S6 When the rotational speed of the base plate 11 reaches the liquid processing speed f1, the rotation mechanism 14 maintains the rotational speed of the base plate 11 at the liquid processing speed f1. In this state, the pin drive mechanism 600, while maintaining each sliding pin 13b in the regulating position P2, moves each stationary pin 13a from the regulating position P2 to the release position P1. This forms a sliding regulating state M2 (Fig. 8) where each sliding pin 13b regulates the position of the substrate 9. That is, it switches from the stationary regulating state M1 to the sliding regulating state M2.

[0089] In the sliding control state M2, the substrate 9 is allowed to rotate relative to the base plate 11. That is, when switching from the stationary control state M1 to the sliding control state M2, the substrate 9 can rotate relative to the base plate 11. However, here, the rotational speed of the base plate 11 is maintained at a constant before and after the transition. Furthermore, due to inertia, the substrate 9 continues to rotate at approximately the same rotational speed before and after the transition (the rotational speed hardly changes). Therefore, after switching to the sliding control state M2, the substrate 9 and the base plate 11 also continue to rotate relative to each other at approximately the same rotational speed (that is, the substrate 9 hardly rotates relative to the base plate 11). Furthermore, in the sliding control state M2, the substrate 9 can displace from the normal position Q within an allowable range (an allowable range equivalent to the gap G). However, when the substrate 9 rotates at a sufficient rotational speed, the possibility that the substrate 9 will hardly displace radially (remaining stationary at the normal position Q) is high due to the centrifugal force acting on the substrate 9. Furthermore, since the pressure of the gas supplied to the downward space U acts on the substrate 9, the substrate 9 is highly likely to hardly shift in the vertical direction (remaining stationary in the normal position Q).

[0090] Step S7 Subsequently, the processing liquid supply unit 2 begins to supply the first processing liquid. Specifically, the processing liquid nozzle 21 is positioned at the spray position and the liquid valve 221a is opened. Thus, the liquid supplied from the liquid supply source 22a is sprayed from the processing liquid nozzle 21, and the liquid is supplied to the upper surface 92 of the substrate 9. The liquid supplied to the upper surface 92 of the substrate 9 expands outwards due to the centrifugal force generated by the rotation of the substrate 9, and the entire upper surface 92 is treated with the liquid. That is, the substrate 9 is treated with the liquid.

[0091] Step S8 Subsequently, the rotating mechanism 14 changes the rotational speed of the base plate 11 from the liquid processing speed f1 to a sliding speed f2 greater than its speed. As described above, in the sliding control state M2, the substrate 9 can rotate relative to the base plate 11. Therefore, even if the rotational speed of the base plate 11 changes, the rotational speed of the substrate 9 will not change accordingly. That is, here, while maintaining the rotational speed of the substrate 9 at the liquid processing speed f1, only the rotational speed of the base plate 11 changes to the sliding speed f2. This generates a speed difference Δf between the substrate 9 and the base plate 11, causing the substrate 9 to rotate relative to the base plate 11. The difference between the sliding speed f2 and the liquid processing speed f1 (the amount of speed change) Δf is preferably 50 rpm or more. Furthermore, the amount of speed change Δf is preferably about 5% of the liquid processing speed f1. For example, when the liquid processing speed f1 is 1000 rpm, the amount of change Δf is preferably about 50 rpm.

[0092] During this stage, the substrate 9 (the substrate 9 undergoing chemical treatment) is rotated relative to the base plate 11. As the substrate 9 rotates relative to the base plate 11, the sliding pin 13b disposed on the base plate 11 moves circumferentially relative to the periphery 93 of the substrate 9. That is, the position of the sliding pin 13b facing the periphery 93 of the substrate 9 (the pin-facing position) gradually changes circumferentially. The pin-facing position is less likely to receive chemical treatment than other positions. Therefore, if a specific position in the circumferential direction of the periphery 93 of the substrate 9 is always the pin-facing position, the amount of chemical treatment (and even the rate of chemical treatment progress) may differ between that position and other positions. Here, because the pin-facing position gradually changes circumferentially during chemical treatment, the amount of chemical treatment is less likely to deviate throughout the circumferential direction of the periphery 93 of the substrate 9, and the entire periphery 93 is treated uniformly throughout the circumferential direction. Furthermore, at the pin-opposing position, the liquid supplied to one main surface of the substrate 9 (here, the upper surface 92) easily flows through the sliding pins 13b and other means to meander into the other main surface (here, the lower surface 91). Therefore, when a specific position in the circumferential direction of the peripheral portion 93 of the substrate 9 is always the pin-opposing position, the meandering flow of the liquid is concentrated at that position, resulting in a peak value of the meandering flow width. Here, since the pin-opposing position gradually changes circumferentially during liquid treatment, the meandering flow of the liquid is not concentrated at a specific position in the circumferential direction of the peripheral portion 93 of the substrate 9. Therefore, a peak value of the meandering flow width is less likely to occur. That is, the maximum value of the meandering flow width can be suppressed to a smaller extent. Furthermore, here, each sliding pin 13b is positioned opposite to the peripheral portion 93 of the substrate 9 positioned at the normal position Q, with a gap G provided. Therefore, when the substrate 9 is in the correct position Q or near it, and the substrate 9 is rotating relative to the base plate 11, and each sliding pin 13b is moving relative to the peripheral portion 93 of the substrate 9 in the circumferential direction, the peripheral portion 93 is not easily damaged by mutual friction with the sliding pin 13b.

[0093] Step S9 After a predetermined time has elapsed since the start of supplying the first processing solution, the processing solution supply unit 2 stops supplying the solution and begins supplying the second processing solution, the rinsing solution. Specifically, with the processing solution nozzle 21 in the spray position, the solution valve 221a is closed and the rinsing solution valve 221b is opened. Thus, the solution supplied from the solution supply source 22a is switched to the rinsing solution supplied from the rinsing solution supply source 22b, and the rinsing solution is sprayed from the processing solution nozzle 21 towards the upper surface 92 of the substrate 9. The rinsing solution supplied to the upper surface 92 of the substrate 9 expands outwards due to the centrifugal force generated by the rotation of the substrate 9. In this way, the solution on the upper surface 92 of the substrate 9 is replaced by the rinsing solution and rinsed away. That is, a rinsing process is performed on the substrate 9.

[0094] Step S10 After a predetermined time has elapsed since the start of supplying the rinsing fluid, which serves as the second processing fluid, for example, when the concentration of the solution on the upper surface 92 of the substrate 9 has sufficiently decreased, the rotating mechanism 14 changes the rotation speed of the base plate 11 in such a way that the rotation speed of the base plate 11 is consistent with (or sufficiently close to) the rotation speed of the substrate 9 at that time. For example, when the rotation speed of the substrate 9 at that time is the liquid processing speed f1, the rotating mechanism 14 changes the rotation speed of the base plate 11 from the sliding speed f2 to the liquid processing speed f1.

[0095] Step S11 Subsequently, while maintaining the pin drive mechanism 600 in the state where each sliding pin 13b is positioned in the regulating position P2, each stationary pin 13a is moved from the release position P1 to the regulating position P2. This forms a stationary regulating state M1 (Fig. 7) where each stationary pin 13a regulates the position of the substrate 9. That is, the sliding regulating state M2 switches to the stationary regulating state M1. When the sliding regulating state M2 switches to the stationary regulating state M1, the substrate 9 begins to rotate integrally with the base plate 11 in the normal position Q.

[0096] Step S12 Afterwards, the treatment fluid supply unit 2 stops supplying the rinsing fluid. Specifically, the rinsing fluid valve 221b is closed. As a result, the rinsing fluid is stopped from being sprayed from the treatment fluid nozzle 21.

[0097] Step S13 Subsequently, the rotating mechanism 14 increases the rotational speed of the base plate 11 to a drying speed f3 that is sufficiently greater than the liquid treatment speed f1. Since the substrate 9 and the base plate 11 rotate as a single unit in the stationary control state M1, when the rotational speed of the base plate 11 increases to the drying speed f, the rotational speed of the substrate 9 also increases to the drying speed f3 along with the base plate 11. The drying speed f3 is, for example, 1000~2500 rpm.

[0098] Step S14 When the rotational speed of the base plate 11 reaches the drying speed f3, the rotation mechanism 14 maintains the rotational speed of the base plate 11 at the drying speed f3. Since the substrate 9 and the base plate 11 rotate as a unit in the stationary control state M1, the rotational speed of the substrate 9 is also maintained at the drying speed f3 while the rotational speed of the base plate 11 is maintained at the drying speed f3. In this state, a larger centrifugal force acts on the liquid adhering to the substrate 9, throwing the liquid away from the substrate 9 and gradually drying the substrate 9 (rotary drying process).

[0099] Step S15 When the liquid adhering to the substrate 9 is sufficiently shaken off, the rotation of the base plate 11 stops. That is, the rotation mechanism 14 causes the rotational speed of the base plate 11 to decrease from the drying speed f3 to zero. Since the substrate 9 and the base plate 11 rotate as a unit in the static regulation state M1, when the rotational speed of the base plate 11 decreases from the drying speed f3 to zero, the rotational speed of the substrate 9 also decreases from the drying speed f3 to zero along with the base plate 11.

[0100] Step S16 Subsequently, the gas supply unit 3 stops supplying gas to the lower space U. Specifically, the gas valve 321 is closed.

[0101] Step S17 Subsequently, the pin drive mechanism 600 moves each stationary pin 13a and each sliding pin 13b together from the regulating position P2 to the releasing position P1. As each stationary pin 13a moves, the substrate 9 is guided along the lower surface 623a of the stationary regulating surface 620a and moves downward while maintaining a horizontal posture. With each stationary pin 13a positioned in the releasing position P1, the substrate 9 is supported from below by each support pin 12. Afterward, each support pin 12 rises and is positioned in the upper position.

[0102] Step S18 Then, the substrate 9 is removed from the substrate processing apparatus 100. Specifically, an external conveying mechanism inserts a hand into the cavity of the substrate processing apparatus 100, placing it between the lower surface 91 of the substrate 9 supported by each support pin 12 and the base plate 11, and then raises it further. In this way, the substrate 9 is transferred from each support pin 12 to the hand. Afterward, the conveying mechanism withdraws the hand holding the substrate 9 from the cavity of the substrate processing apparatus 100.

[0103] <4. Effects> The substrate processing apparatus 100 of the above embodiment includes: a base plate 11, a plurality of position regulating pins 13, a pin drive mechanism 600, a rotation mechanism 14, a processing liquid supply unit 2, and a control unit 4. The position regulating pins 13 are disposed on the base plate 11 and position a substrate 9 arranged horizontally above the base plate 11. The pin drive mechanism 600 moves each of the plurality of position regulating pins 13 between a regulating position P2 where the position regulating pin 13 positions the substrate 9 and a releasing position P1 where the position regulating pin 13 does not position the substrate 9. The rotation mechanism 14 rotates the base plate 11 about a vertically extending rotation axis J1. The processing liquid supply unit 2 supplies processing liquid to the substrate 9. The control unit 4 controls the pin drive mechanism 600, the rotation mechanism 14, and the processing liquid supply unit 2. Furthermore, the plurality of position regulating pins 13 includes a stationary pin 13a and a sliding pin 13b. When stationary pin 13a is positioned in the regulating position P2, it abuts against the periphery 93 of substrate 9, regulating the substrate 9 to a predetermined position Q above base plate 11, and regulating its rotation in a manner that does not involve relative rotation with respect to base plate 11. When sliding pin 13b is positioned in the regulating position P2, it is positioned opposite to the periphery 93 of substrate 9 in the predetermined position Q, with a gap G between them, regulating the substrate 9 to allow relative rotation with respect to base plate 11, and regulating its position in a manner that allows the substrate 9 to shift from the predetermined position Q within an allowable radial range.

[0104] According to this configuration, the substrate 9, with its position regulated by the sliding pin 13b, can rotate relative to the base plate 11 at or near the normal position Q (a position whose displacement from the normal position Q does not exceed the allowable range). When the substrate 9 rotates relative to the base plate 11, the sliding pin 13b disposed on the base plate 11 moves circumferentially relative to the peripheral portion 93 of the substrate 9, and the position of the sliding pin 13b facing the peripheral portion 93 of the substrate 9 (pin-facing position) gradually changes circumferentially. Therefore, the impact of the sliding pin 13b on the processing is reduced.

[0105] Furthermore, in the above-described embodiment, the control unit 4 controls the pin drive mechanism 600 to switch between a stationary positioning state M1, where the stationary pin 13a positions the substrate 9, and a sliding positioning state M2, where the sliding pin 13b positions the substrate 9. In the sliding positioning state M2, the control unit 4 controls the processing fluid supply unit 2 to supply processing fluid to the substrate 9. In the sliding positioning state M2, the substrate 9 can rotate relative to the base plate 11. As the substrate 9 rotates relative to the base plate 11, the pin-facing position gradually changes circumferentially. As the pin-facing position gradually changes circumferentially, the amount of processing fluid supplied to the entire circumferential portion 93 of the substrate 9 is less likely to deviate, and the entire circumferential portion 93 is uniformly processed. Furthermore, as the pin-facing position gradually changes circumferentially, the processing fluid's meandering flow is not concentrated at a specific position in the circumferential direction of the substrate 9's periphery 93, thus minimizing the occurrence of peaks in the meandering flow width. In other words, the maximum value of the detour width can be suppressed to a smaller value.

[0106] Furthermore, in the above embodiment, the control unit 4 controls the rotation mechanism 14 in the sliding control state M2, causing the rotational speed of the base plate 11 to change. In the sliding control state M2, even if the rotational speed of the base plate 11 changes, the rotational speed of the substrate 9 will not change accordingly. Therefore, by changing the rotational speed of the base plate 11, a difference in rotational speed can be generated between the substrate 9 and the base plate 11, causing the substrate 9 to rotate relative to the base plate 11.

[0107] Furthermore, in the above embodiment, the sliding pin 13b has a sliding regulating surface 620b. When the sliding pin 13b is positioned in the regulating position P2, this sliding regulating surface 620b faces the peripheral portion 93 of the substrate 9 positioned in the normal position Q, with a gap G between them. The sliding regulating surface 620b has a side surface 622b facing the peripheral portion 93 from the side and an upper surface 621b facing the peripheral portion 93 from the upper oblique direction. Therefore, when the sliding pin 13b is positioned in the regulating position P2, the substrate 9 can be positioned and regulated in the radial and upward directions without exceeding the allowable range corresponding to the gap G from the normal position Q. In addition, the sliding regulating surface 620b of the sliding pin 13b does not have a surface facing the peripheral portion 93 from the lower oblique direction. Therefore, when the sliding pin 13b is positioned in the regulating position P2, the substrate 9 is allowed to move downward from the normal position Q (without position regulation). However, as in the embodiment described above, when gas is supplied to the downward space U, the pressure of the gas acts on the substrate 9, effectively suppressing the substrate 9 from its normal position Q in the downward direction. Because the sliding guide surface 620b does not have a surface facing the peripheral portion 93 from the oblique downward direction, the following advantage is obtained: when the sliding pin 13b moves relative to the peripheral portion 93 of the substrate 9 in the circumferential direction, the peripheral portion 93 is less likely to be damaged by mutual friction.

[0108] Furthermore, in the above-described embodiment, with the sliding pin 13b positioned in the regulating position P2, the separation distance (the size of the gap G) between the sliding regulating surface 620b and the periphery 93 of the substrate 9 in the normal position Q in the opposing direction is set to approximately 0.1 mm. The larger the gap G, the less likely the substrate 9 is to be damaged by friction with the sliding pin 13b. Conversely, the larger the gap G, the greater the allowable displacement (fluctuation range) of the substrate 9 from the normal position Q. If the allowable displacement is large, the impact generated when the substrate 9 displaces from the normal position Q and contacts the sliding pin 13b is more likely to increase (resulting in, for example, a knocking sound). Also, when the substrate 9 is processed at a position where it has significantly displaced from the normal position, the uniformity of the processing across the entire main surface of the substrate 9 may not be guaranteed. By setting the size of the gap G to a value that is sufficiently small for the diameter of the substrate 9 (preferably around 0.1 mm), such unfavorable layers can be effectively avoided.

[0109] Furthermore, the substrate processing method of the above-described embodiment includes: a step of forming a static calibration state M1 (static calibration state forming step: step S3), wherein the static calibration state M1 is formed by the stationary pin 13a of the base plate 11 abutting against the periphery 93 of the substrate 9, which is horizontally positioned above the base plate 11, thereby calibrating the substrate 9 to a predetermined position Q above the base plate 11, and calibrating the substrate 9 in a manner that does not rotate relative to the base plate 11; and a step of increasing the rotational speed of the base plate 11 to a predetermined liquid processing speed f1 under the static calibration state M1 (acceleration). Process: Step S5); The following process (sliding regulation state formation process: Step S6) forms a sliding regulation state M2 after the acceleration process. In this sliding regulation state M2, the sliding pin 13b, provided on the base plate 11, is positioned opposite to the peripheral portion 93 of the substrate 9, which is positioned at the normal position Q, with a gap G between the pin and the substrate 9. This allows the substrate 9 to rotate relative to the base plate 11 and regulate its position by displacing it from the normal position Q within an allowable range. The process also includes a process of supplying processing fluid to the substrate 9 in the sliding regulation state M2 (processing fluid supply process: Step S7). This configuration reduces the impact of the sliding pin 13b on the processing.

[0110] <5. Examples of Variation> The configuration and operation of the substrate processing apparatus 100 in the above embodiment can be modified appropriately. In the following description, elements that are the same as those described in the above embodiment are marked with the same symbols, and their descriptions are omitted.

[0111] <5-1. Example of the first variation> The sliding pin 13c of the first variation will be described with reference to Figure 15. Figure 15 is a side view schematically showing the movement of the sliding pin 13c between the release position P1 and the control position P2.

[0112] (Composition of sliding pin 13c) The basic structure of the sliding pin 13c is the same as that of the stationary pin 13a in the above embodiment. That is, the sliding pin 13c has: a generally cylindrical base portion 61c, and a protrusion 62c that protrudes upward from the upper end surface of the base portion 61c. The sliding guide surface 620c provided on the protrusion 62c has: an upper surface 621c, a curved surface 622c connected to the lower part of the upper surface 621c, and a lower surface 623c connected to the lower part of the curved surface 622c. The upper surface 621c is a flat surface area that slopes upward toward the direction close to the rotation axis J1. The curved surface 622c is, for example, a curved surface that is curved with the same curvature as the periphery 93 of the substrate 9. The lower surface 623c is a flat surface area that slopes downward toward the direction close to the rotation axis J1.

[0113] The sliding pin 13c is driven by the pin drive mechanism 600, rotating around the pin rotation axis J2, and moves between the release position P1 and the regulation position P2. When the sliding pin 13c is in the release position P1, the sliding regulation surface 620c is fully separated from the peripheral portion 93 of the substrate 9 in the regulation position Q when viewed from above and from the side (upper section of FIG. 15). When the sliding pin 13c is in the regulation position P2, the sliding regulation surface 620c extends parallel to the tangent of the peripheral portion 93 of the substrate 9 in the regulation position Q when viewed from above, and when viewed from the side, it is close to the peripheral portion 93 with a gap G (lower section of FIG. 15). Specifically, the upper surface 621c has a gap G between itself and the upper surface 932 of the peripheral portion, and faces the upper surface 932 of the peripheral portion from an obliquely upward direction; the curved surface 622c has a gap G between itself and the end face 930 of the peripheral portion, and faces the end face 930 of the peripheral portion from the side; and the lower surface 623c has a gap G between itself and the lower surface 931 of the peripheral portion, and faces the lower surface 931 of the peripheral portion from an obliquely downward direction.

[0114] (Sliding gauge state M2) By positioning each sliding pin 13c on the base plate 11 at the regulating position P2, a sliding regulating state M2 is formed in which the sliding pin 13c regulates the position of the substrate 9. In this variation, similar to the embodiment described above, in the sliding regulating state M2, the substrate 9 is allowed to rotate relative to the base plate 11 and is positioned in a manner that does not exceed the allowable range in the radial and upward directions from the normal position Q. Furthermore, in this variation, in the sliding regulating state M2, the substrate 9 is positioned in a manner that does not exceed the allowable range in the downward direction from the normal position Q. That is, when the substrate 9 is displaced downward from the normal position Q, during the stage when the displacement reaches the size of the gap G, at least one sliding pin 13c's sliding regulating surface 620c abuts against the peripheral portion 93 (typically, the lower surface 623c abuts against the lower surface 931 of the peripheral portion), preventing the substrate 9 from excessively displacing.

[0115] (Effect) In this variation, the sliding pin 13c has a sliding regulating surface 620c comprising: a curved surface (side surface) 622c facing the peripheral portion 93 from the side, an upper surface 621c facing the peripheral portion 93 from the upper oblique direction, and a lower surface 623c facing the peripheral portion 93 from the lower oblique direction. Therefore, when the sliding pin 13c is positioned in the regulating position P2, its position can be regulated in the radial and vertical directions, such that the substrate 9 does not exceed the allowable range equivalent to the gap G from the normal position Q. Furthermore, in this variation, the stationary pin 13a and the sliding pin 13b can be formed as common components. For example, by forming all the position control pins 13 on the base plate 11 with common parts, and specifying that the rotation angle of a portion of the position control pins 13 (the rotation angle of the position control pin 13 when it moves from the release position P1 to the control position P2) is smaller than the rotation angle of the remaining position control pins 13, the portion of position control pins 13 can function as sliding pins 13c, and the remaining position control pins 13 can function as stationary pins 13a. With this configuration, the number of parts can be reduced.

[0116] <5-2. Second Variation Example> The second variation of the sliding pin 13d will be described with reference to Figure 16. Figure 16 is a side view schematically showing the movement of the sliding pin 13d between the release position P1 and the control position P2.

[0117] (Composition of sliding pin 13d) The basic structure of the sliding pin 13d is the same as that of the sliding pin 13b described above. That is, the sliding pin 13d has: a generally cylindrical base portion 61d, and a protrusion 62d that protrudes upward from the upper end surface of the base portion 61d. However, the shape of the protrusion 62d of the sliding pin 13d differs from that of the sliding pin 13b described above. That is, the sliding guide surface 620d on which the protrusion 62d is disposed has a surface area, namely a side surface 621d, that extends vertically (that is, the normal direction extends in the horizontal plane), and does not have a surface area that tilts towards the direction of rotation axis J1 as it faces upward or downward. As an example, the protrusion 62d is polygonal prism-shaped. In this case, the sliding guide surface 620d has a straight or broken side surface 621d when viewed from above. As another example, the protrusion 62d is cylindrical. In this case, the sliding regulating surface 620d has an arc-shaped side surface 621d when viewed from above.

[0118] The sliding pin 13d is driven by the pin drive mechanism 600, rotating around the pin rotation axis J2, and moves between the release position P1 and the regulation position P2. When the sliding pin 13d is in the release position P1, the sliding regulation surface 620d is fully separated from the peripheral portion 93 of the substrate 9 in the regulation position Q when viewed from above and the side (upper section of FIG. 16). When the sliding pin 13d is in the regulation position P2, the sliding regulation surface 620d, when viewed from above and the side, has a gap G provided with respect to the peripheral portion 93 of the substrate 9 in the regulation position Q and is nearly facing it (lower section of FIG. 16). Specifically, the side surface 621d has a gap G between it and the peripheral end face 930, and faces the peripheral end face 930 from the side.

[0119] (Sliding gauge state M2) By positioning each sliding pin 13d on the base plate 11 at the regulating position P2, a sliding regulating state M2 is formed in which the sliding pin 13d regulates the position of the substrate 9. In this variation, similar to the embodiment described above, the substrate 9 is allowed to rotate relative to the base plate 11 in the sliding regulating state M2. Furthermore, the substrate 9 is regulated in a manner that the radial displacement does not exceed the allowable range from the normal position Q. That is, when the substrate 9 is radially displaced from the normal position Q, during the stage when the displacement reaches the size of the gap G, at least one sliding regulating surface 620d of the sliding pin 13d abuts against the peripheral portion 93 (typically, the side surface 621d abuts against the peripheral end face 930), and the substrate 9 cannot be excessively displaced.

[0120] (Effect) In this variation, the sliding guide surface 620d of the sliding pin 13d has a side surface 621d facing the peripheral portion 93 from the side. Therefore, when the sliding pin 13d is positioned in the guide position P2, the position can be guided in such a way that the substrate 9 does not exceed the allowable range corresponding to the gap G in the radial direction from the normal position Q. Furthermore, the sliding guide surface 620d of the sliding pin 13d does not have a surface facing the peripheral portion 93 from the lower or upper side. Therefore, when the sliding pin 13d is positioned in the guide position P2, the substrate 9 is allowed to move from the normal position Q in the vertical direction. However, as in the embodiment described above, when gas is supplied to the downward space U, the pressure of the gas acting on the substrate 9 sufficiently suppresses the substrate 9 from moving from the normal position Q in the downward direction, and by appropriately adjusting the gas flow rate (and even the pressure exerted by the gas on the substrate 9), the substrate 9 is also sufficiently suppressed from moving from the normal position Q in the upward direction. By the fact that the sliding guide surface 620d does not have a surface facing the peripheral portion 93 from the lower or upper side, the following advantages are obtained: when the sliding pin 13d moves relative to the peripheral portion 93 of the substrate 9 in the circumferential direction, the peripheral portion 93 is particularly less susceptible to damage caused by mutual friction.

[0121] <5-3. Example of Variation 3> (The composition of position regulation pin 15) The configuration of the position control pin 15 in the third variation will be described with reference to Figures 17 and 18. Figure 17 is a top view schematically showing the upper surface 111 of the base plate 11 on which the position control pin 15 is disposed. Figure 18 is a side view schematically showing the position control pin 15 moving between the release position P1, the stationary control position P21, and the sliding control position P22.

[0122] A plurality of position control pins 15 are provided on the upper surface 111 of the base plate 11 (three in the example shown in the figure). The plurality of position control pins 15 are arranged at equal intervals along the circumference of a reference circle C defined on the upper surface 111.

[0123] The basic structure of the position regulating pin 15 is the same as that of the stationary pin 13a in the above-described embodiment. That is, the position regulating pin 15 has: a generally cylindrical base portion 71, and a protrusion 72 that protrudes upward from the upper end surface of the base portion 71. The regulating surface 720 provided on the protrusion 72 has: an upper surface 721, a curved surface 722 connected to the lower part of the upper surface 721, and a lower surface 723 connected to the lower part of the curved surface 722. The upper surface 721 is a flat surface area that slopes upward toward the direction close to the rotation axis J1. The curved surface 722 is, for example, a curved surface that is curved with the same curvature as the periphery 93 of the substrate 9. The lower surface 723 is a flat surface area that slopes downward toward the direction close to the rotation axis J1.

[0124] At least one of the plurality of position control pins 15 disposed on the base plate 11 is driven by the pin drive mechanism 600 and moves between the release position P1 and the first control position (stationary control position) P21 and the second control position (sliding control position) P22 by rotating about the pin rotation axis J2.

[0125] With the position control pin 15 in the released position P1, the control surface 720 is fully separated from the periphery 93 of the substrate 9 in the normal position Q when viewed from above and the side (upper part of Fig. 18).

[0126] With the position control pin 15 positioned in the stationary control position P21, the control surface 720 extends parallel to the tangent of the peripheral portion 93 of the substrate 9 located in the normal position Q when viewed from above, and abuts against the peripheral portion 93 when viewed from the side (middle section of FIG. 18). Specifically, the upper surface 721 faces and abuts against the upper surface 932 of the peripheral portion, the curved surface 722 faces and abuts against the end face 930 of the peripheral portion, and the lower surface 723 faces and abuts against the lower surface 931 of the peripheral portion. With the position control pin 15 positioned in the stationary control position P21, the control surface 720 can be pushed relative to the peripheral portion 93 of the substrate 9.

[0127] With the position control pin 15 positioned in the sliding control position P22, the control surface 720, when viewed from above, extends parallel to the tangent of the peripheral portion 93 of the substrate 9 located in the normal position Q. When viewed from the side, a gap G is provided for the peripheral portion 93 and they are nearly facing each other (lower section of FIG18). Specifically, the upper surface 721 has a gap G between itself and the upper surface 932 of the peripheral portion, and faces the upper surface 932 of the peripheral portion from an obliquely upward direction. The curved surface 722 has a gap G between itself and the end face 930 of the peripheral portion, and faces the end face 930 of the peripheral portion from the side. The lower surface 723 has a gap G between itself and the lower surface 931 of the peripheral portion, and faces the lower surface 931 of the peripheral portion from an obliquely downward direction.

[0128] (Location regulation status) The position regulating pin 15 does not regulate the position of the substrate 9 when it is in the released position P1, but regulates the position of the substrate 9 when it is in the stationary regulating position P21 or the sliding regulating position P22. The state in which the position regulating pin 15 regulates the position of the substrate 9 will be described with reference to Figures 19 and 20. Figure 19 is a schematic top view showing the stationary regulating state M1. Figure 20 is a schematic top view showing the sliding regulating state M2. Furthermore, for ease of explanation, the protrusion 72 of the position regulating pin 15 is shown in cross-section in Figures 19 and 20.

[0129] (i) Static regulation state M1 The position regulating pin 15 functions as a stationary pin by being positioned at the stationary regulating position P21. That is, by positioning each position regulating pin 15 at the stationary regulating position P21, a stationary regulating state M1 (Fig. 19) is formed in which the stationary pin regulates the position of the substrate 9.

[0130] In this variation, similar to the above embodiment, in the static regulation state M1, the substrate 9 is positioned at the normal position Q and is rotated in a manner that does not rotate relative to the base plate 11.

[0131] That is, in the static regulation state M1, the regulation surfaces 720 of each position regulation pin 15 abut against different positions along the circumferential direction of the peripheral portion 93 of the substrate 9. In this way, the substrate 9 is position-regulated in a manner that does not shift from the normal position Q in the radial and vertical directions. Furthermore, the substrate 9 is rotated by the frictional force borne by the regulation surfaces 720 abutting against the peripheral portion 93 (which are pushed as needed), so as not to shift relative to each position regulation pin 15 (or even the base plate 11) about the rotation axis J1 in the rotational direction (i.e., not to rotate relative to the base plate 11).

[0132] (ii) Sliding gauge state M2 The position control pin 15 functions as a sliding pin by being positioned at the sliding control position P22. That is, by positioning the position control pin 15 at the sliding control position P22, a sliding control state M2 is formed where the sliding pin controls the position of the substrate 9 (Fig. 20). However, when forming the sliding control state M2, it is not necessary to position all the position control pins 15 provided on the base plate 11 at the sliding control position P22. For example, when a plurality of position control pins 15 are arranged at equal intervals along the circumference of the reference circle C, the sliding control state M2 can be formed by positioning at least one-third or more of the adjacent position control pins 15 (one in the example shown) at the sliding control position P22, and the remaining position control pins 15 at the stationary control position P21. Needless to say, the sliding control state M2 can be formed by positioning all the position control pins 15 provided on the base plate 11 at the sliding control position P22.

[0133] In this variation, similar to the first variation, in the sliding regulation state M2, the substrate 9 is allowed to rotate relative to the base plate 11 and is position-regulated in such a way that it does not move beyond the allowable range in the radial and vertical directions from the normal position Q.

[0134] For ease of explanation, it is assumed that the substrate 9 is slightly displaced radially from its normal position Q (for example, by about half the displacement of the gap G), and the regulating surfaces 720 of all the position regulating pins 15 are separated from the peripheral portion 93 of the substrate 9. This position of the substrate 9 in this state is called the "eccentric normal position Qt", and the gap between the peripheral portion 93 of the substrate 9 and each regulating surface 720 in this state is called the "eccentric gap Gt". That is, in the sliding regulating state M2, at each position along the circumferential direction of the peripheral portion 93 of the substrate 9 located in the eccentric normal position Qt, the regulating surfaces 720 of each position regulating pin 15 are provided with an eccentric gap Gt and are nearly facing each other. Therefore, for example, when the substrate 9 is displaced radially or vertically from the eccentric normal position Qt, during the stage when the displacement reaches the size of the eccentric gap Gt, the regulating surface 720 of at least one position regulating pin 15 located in the displacement direction abuts against the peripheral portion 93, and the substrate 9 cannot be excessively displaced. That is, the substrate 9 is position-regulated in a manner that does not exceed the allowable range (the allowable range equivalent to the eccentric gap Gt) in the radial and vertical directions. That is, it is position-regulated in a manner that does not exceed the allowable range from the normal position Q. Furthermore, in the sliding regulating state M2, the substrate 9 located at the eccentric normal position Qt is not obstructed by the position regulating pins 15 and can be displaced in the rotation direction about the rotation axis J1. That is, the substrate 9 is allowed to rotate relative to the base plate 11 at the eccentric normal position Qt (i.e., near the normal position Q). Furthermore, when the substrate 9 shifts from the eccentric normal position Qt, a portion of the regulating surface 720 of the position regulating pin 15 abuts against the peripheral portion 93 of the substrate 9, and the substrate 9, shifting about the rotation axis J1 in the rotation direction, sometimes experiences a slight frictional force. However, in this case, a frictional force as large as that regulating the shift in the rotation direction of the substrate 9 will not act on the substrate 9. That is, the substrate 9 is allowed to rotate relative to the base plate 11 in the vicinity of the eccentric normal position Qt (i.e., in the normal position Q and its vicinity).

[0135] (Effect) In this variation, at least a portion of the position control pins 15 are configured to be located not only in the release position P1 and the stationary control position P21, but also in the sliding control position P22. This allows at least a portion of the position control pins 15 to function as both stationary pins and sliding pins. According to this configuration, compared to separately providing position control pins that function as stationary pins and position control pins that function as sliding pins, the total number of position control pins 15 provided on the base plate 11 can be reduced.

[0136] <5-4. Fourth Variation Example> In the above-described embodiment, the control unit 4 controls the rotation mechanism 14 in the sliding control state M2 to change the rotational speed of the base plate 11, thereby causing the substrate 9 to rotate relative to the base plate 11. However, the state in which the substrate 9 rotates relative to the base plate 11 is not limited to this.

[0137] For example, the control unit 4 can control the processing liquid supply unit 2 in the sliding control state M2 to apply an external force to the substrate 9 by supplying the processing liquid to the substrate 9, thereby changing the rotational speed of the substrate 9. The magnitude and direction of the external force applied by the processing liquid to the substrate 9 are specified by the spray position, spray direction, spray flow rate, viscosity, etc. of the processing liquid. That is, by adjusting at least one of the spray position, spray direction, spray flow rate, viscosity, etc. of the processing liquid, the magnitude and direction of the external force applied by the processing liquid supplied to the substrate 9 by the processing liquid supply unit 2 to the substrate 9 (and even the direction and amount of change in the rotational speed of the substrate 9) can be set to the desired value. For example, by adjusting the spray position of the processing liquid in a manner that applies an external force in the opposite direction to the rotational direction of the substrate 9 (resistance to the rotation of the substrate 9), the rotational speed of the substrate 9 can be reduced. Furthermore, for example, by adjusting the spray position of the processing liquid in a way that imparts an external force (a driving force that promotes the rotation of the substrate 9) along the rotation direction of the substrate 9, the rotational speed of the substrate 9 can be increased.

[0138] Furthermore, for example, the control unit 4 can control the gas supply unit 3 in the sliding control state M2 to apply an external force to the substrate 9 by supplying gas to the substrate 9, thereby changing the rotational speed of the substrate 9. The magnitude and direction of the external force applied by the gas to the substrate 9 are specified by the gas ejection position, ejection direction, ejection flow rate, temperature, etc. That is, by adjusting at least one of the gas ejection position, ejection direction, ejection flow rate, temperature, etc., the magnitude and direction of the external force applied by the gas supplied by the gas supply unit 3 to the substrate 9 (and even the direction and amount of change in the rotational speed of the substrate 9) can be set to the desired value. For example, by adjusting the gas ejection position in a manner that applies an external force (resistance to the rotation of the substrate 9) in the direction opposite to the rotational direction of the substrate 9, the rotational speed of the substrate 9 can be reduced. Furthermore, for example, by adjusting the gas ejection position in a manner that applies an external force (propulsive force to promote the rotation of the substrate 9) in a direction along the rotational direction of the substrate 9, the rotational speed of the substrate 9 can be increased.

[0139] According to these variations, in the sliding control state M2, the rotational speed of the substrate 9 changes by an external force applied by the processing liquid or gas. This allows a difference in rotational speed to be generated between the substrate 9 and the base plate 11, and even causes the substrate 9 to rotate relative to the base plate 11.

[0140] <5-5. Other variations> In the above-described embodiment, the control unit 4 controls the rotation mechanism 14 in the sliding control state M2 to increase the rotational speed of the base plate 11 (i.e., the self-liquid processing speed f1 changes to be greater than its sliding speed f2), thereby causing the substrate 9 to rotate relative to the base plate 11. However, the control unit 4 controls the rotation mechanism 14 in the sliding control state M2 to decrease the rotational speed of the base plate 11 (i.e., the self-liquid processing speed f1 changes to be less than its sliding speed), thereby causing the substrate 9 to rotate relative to the base plate 11. For example, when the rotational speed of the substrate 9 is reduced by applying an external force to the substrate 9 through the processing liquid and / or gas supplied to it, it is preferable to increase the rotational speed of the base plate 11. Conversely, when the rotational speed of the substrate 9 is increased by the external force, it is preferable to decrease the rotational speed of the base plate 11. Furthermore, when the rotational speed of the substrate 9 changes sufficiently by the external force, the rotational speed of the base plate 11 may remain unchanged.

[0141] In the above-described embodiment, the timing of starting the drug supply process (step S7) (i.e., the timing of starting the drug treatment) occurs after the switch from the static regulation state M1 to the sliding regulation state M2 (step S6), but it can occur simultaneously with or before the switch. That is, at least a portion of the drug treatment can be performed in the static regulation state M1.

[0142] In the above-described embodiment, the timing of the process of starting to supply the liquid medicine (step S7) can be before the process of changing the rotation speed of the base plate 11 to the sliding rotation speed f2 (step S8), but it can be performed simultaneously with the process or after the process is completed. That is, the liquid medicine treatment can begin after the substrate 9 begins to rotate relative to the base plate 11.

[0143] In the above embodiment, the timing of the process of changing the rotation speed of the base plate 11 in a manner consistent with the rotation speed of the substrate 9, and switching the self-sliding regulation state M2 to the stationary regulation state M1 (steps S10 to S11) (that is, the timing of the end of the state in which the substrate 9 rotates relative to the base plate 11) occurs before the process of stopping the supply of rinsing liquid (step S12), but it can be performed simultaneously or after the process. However, as in the above embodiment, it is preferable to continue the state in which the substrate 9 rotates relative to the base plate 11 until the concentration of the liquid on the upper surface 92 of the substrate 9 is sufficiently reduced (that is, until the rinsing process has progressed to a certain extent). During the period until the rinsing process has progressed to a certain extent, the liquid is rinsed evenly and sufficiently throughout the circumferential region of the periphery 93 of the substrate 9 by gradually changing the pin-facing position along the circumferential direction. Furthermore, since the rinsing liquid containing the medicine does not concentrate and meander into a specific circumferential position of the periphery 93 of the substrate 9, the maximum value of the meandering width can be suppressed to a smaller value.

[0144] In the above-described embodiments, the number of position regulating pins 13 is not limited to 6, but can be any number. Furthermore, the number of stationary pins 13a and sliding pins 13b is not limited to 3, but can be any number. Also, when the stationary pin 13a is positioned in the regulating position P2, and the stationary regulating surface 620a is pushed relative to the peripheral portion 93, the pushing force (clamping force) can be appropriately specified. However, when the stationary pin 13a is positioned in the regulating position P2, the stationary regulating surface 620a may not be pushed relative to the peripheral portion 93. That is, the pushing force may be zero.

[0145] The configuration of the pin drive mechanism 600 in the above-described embodiment can be appropriately modified. For example, the pin drive mechanism 600 may be configured to position the position regulating pin 13 in the regulating position P2 by means of the magnetic rebound force between the rotating magnets 601a, 601b and the closed magnets 602a, 602b. Alternatively, for example, the position regulating pin 13 may be configured to position the released position P1 by means of the magnetic rebound force between the rotating magnets 601a, 601b and the open magnets 603a, 603b. Furthermore, the first magnet lifting mechanism 604a and the second magnet lifting mechanism 604b may use cylinders, but they may also use motors. Also, the pin drive mechanism 600 may not necessarily switch the position of the position regulating pin 13 by changing the positional relationship of the magnets. For example, the pin drive mechanism 600 can transmit the driving force of the motor directly or via a ball screw mechanism, rack and pinion mechanism, linkage mechanism, etc., to the position control pins 13 and switch their positions.

[0146] In the above-described embodiments, the medicine as the first treatment liquid and the rinsing liquid as the second treatment liquid may not necessarily be sprayed from the same treatment liquid nozzle 21. The medicine nozzle that sprays the medicine and the rinsing liquid nozzle that sprays the rinsing liquid may be set separately.

[0147] The processing performed by the substrate processing apparatus 100 in the above-described embodiment can be, for example, a process to remove contaminants, particles, oxide films, etc., attached to the main surface of the substrate 9 (cleaning process), or an etching process. Furthermore, the substrate 9, which is the object of processing in the substrate processing apparatus 100, can be a semiconductor substrate, a photomask glass substrate, a liquid crystal display glass substrate, a plasma display glass substrate, an FED (Field Emission Display) substrate, an optical disc substrate, a magnetic disk substrate, or an optical disk substrate, etc. Also, the shape of the substrate 9, which is the object of processing, can be a circular plate or other shapes (e.g., a rectangular plate).

[0148] As described above, the substrate processing apparatus and substrate processing method have been explained in detail. However, the above description is illustrative of all embodiments, and the substrate processing apparatus and substrate processing method are not limited thereto. Numerous variations not illustrated should be understood as those conceivable without departing from the scope of this disclosure. The various embodiments and variations described above can be appropriately combined or omitted as long as they do not contradict each other.

[0149] 1: Rotary clamp (substrate holding part) 2: Processing fluid supply department 3: Gas Supply Department 4: Control Department 9:Substrate 11: Base plate 12: Support sales 13: Position Regulation Pin 13a: Stationary pin 13b, 13c, 13d: Sliding pin 14: Rotating mechanism 15: Position Regulation Pin 21: Processing fluid nozzle 22: Processing fluid supply source 22a: Drug supply source 22b: Fluid supply source 31: Gas supply pipe 32: Gas supply source 41: CPU 42:ROM 43: RAM 44: Memory device 45: Busbar 61a, 61b, 61c, 61d: Base portion 62a, 62b, 62c, 62d: Protrusions 71: Base part 72: Protrusion 91: Lower surface (the main face facing downwards) 92: Top surface (the main face facing upwards) 93: Peripheral Section 100: Substrate processing apparatus 111: Upper surface 112: Lower surface 113: Through-pass 114: concave part 115: Round plate 116: Hole 141: Axis 142: Motor 211: Nozzle Arm 221a: Liquid valve (valve) 221b: Flushing fluid valve (valve) 222a, 222b: Flow regulation section 223a, 223b, 323:Piping 321: Gas valve 322: Flow Adjustment Department 600: Pin Drive Mechanism 601a: Rotating magnet / First rotating magnet 601b: Rotating magnet / Second rotating magnet 602a: Enclosed magnet / First enclosed magnet 602b: Enclosed magnet / Second enclosed magnet 603a: Open magnet / First open magnet 603b: Open magnet / Second open magnet 604a: Magnet lifting mechanism / First magnet lifting mechanism 604b: Magnet lifting mechanism / Second magnet lifting mechanism 620a: Static Regulating Surface (Regulating Surface) 620b, 620c, 620d: Sliding gauge surfaces 621a: Upper surface 621b, 621c, 621d: Side view 622a: Curved surface 622b, 622c: Top surface 623a: Lower surface 623b: Curved surface 623c: Lower surface 720: Regulatory aspect 721: Upper surface 722: Curved Surface 723: Lower surface 930: Peripheral end face 931: Peripheral lower surface 932: Upper surface of the periphery 1161: Bearing 6041a, 6041b: Piston rod 6042a, 6042b: Cylinders C: Reference circle f1: Liquid treatment speed f2: Sliding speed f3: Drying speed G: Gap Gt: Eccentric clearance J1: Axis (Axis of Rotation) J2: Shaft (pin rotation axis) M1: Static regulation state / state M2: Sliding gauge state / state P: Program P1: Release Position (Position) P2: Regulatory Location (Position) P21: Stationary regulatory position (first regulatory position) P22: Sliding regulation position (second regulation position) Q: Official location (location) Qt: Off-center regular position S1~S18: Steps U: Space (Lower Space) Δf: Difference (change in rotational speed)

Claims

1. A substrate processing apparatus comprising: a base plate; a plurality of position regulating pins disposed on the base plate for regulating the position of a substrate horizontally positioned above the base plate; a pin driving mechanism for moving each of the plurality of position regulating pins between a regulating position in which the position regulating pins regulate the substrate and a releasing position in which the position regulating pins do not regulate the substrate; a rotation mechanism for rotating the base plate about a vertically extending rotation axis; a processing liquid supply unit for supplying processing liquid to the substrate; and a control unit for controlling the pin driving mechanism, the rotation mechanism, and the processing liquid supply unit; wherein the plurality of position regulating pins includes a stationary pin and a sliding pin; wherein the stationary pin, when disposed in the regulating position, abuts against the periphery of the substrate, regulating the substrate to a predetermined position above the base plate, and performing rotation regulation in a manner that does not rotate relative to the base plate; When the aforementioned sliding pin is configured in the aforementioned regulated position, it is positioned opposite to the aforementioned peripheral portion of the substrate configured in the aforementioned regular position, with a gap provided between them. This allows the aforementioned substrate to rotate relative to the aforementioned base plate and is position-regulated in such a way that the radial displacement of the aforementioned substrate from the aforementioned regular position does not exceed the allowable range.

2. The substrate processing apparatus of claim 1, wherein the aforementioned control unit controls the aforementioned pin drive mechanism to switch between a stationary state in which the aforementioned stationary pin positions the aforementioned substrate and a sliding state in which the aforementioned sliding pin positions the aforementioned substrate, and controls the aforementioned processing liquid supply unit in the aforementioned sliding state to supply the aforementioned processing liquid to the aforementioned substrate.

3. The substrate processing apparatus of claim 2, wherein the aforementioned control unit controls the aforementioned rotation mechanism in the aforementioned sliding regulation state to change the rotation speed of the aforementioned base plate.

4. The substrate processing apparatus of claim 2 or 3, wherein the aforementioned control unit controls the aforementioned processing liquid supply unit in the aforementioned sliding regulation state so that the processing liquid supplied to the aforementioned substrate imparts an external force to the aforementioned substrate, thereby causing the rotational speed of the aforementioned substrate to change.

5. The substrate processing apparatus of claim 2 or 3, comprising: a gas supply unit that supplies gas to the aforementioned substrate; and the aforementioned control unit controlling the aforementioned gas supply unit in the aforementioned sliding regulation state so that the gas supplied to the aforementioned substrate imparts an external force to the aforementioned substrate, thereby causing the rotational speed of the aforementioned substrate to change.

6. The substrate processing apparatus of any one of claims 1 to 3, wherein the aforementioned sliding pin comprises: a regulating surface, which, when the aforementioned sliding pin is disposed in the aforementioned regulating position, provides the aforementioned gap and faces the aforementioned peripheral portion of the aforementioned substrate disposed in the aforementioned regulating position; and the aforementioned regulating surface comprises a side surface facing the aforementioned peripheral portion from the side.

7. The substrate processing apparatus of claim 6, wherein the aforementioned regulating surface includes an upper surface facing the aforementioned peripheral portion from an obliquely upward position.

8. The substrate processing apparatus of claim 7, wherein the aforementioned regulating surface includes a lower surface facing the aforementioned peripheral portion from the obliquely lower side.

9. A substrate processing method, comprising: a static calibration state forming step, wherein a static calibration state is formed by a stationary pin disposed on a base plate abutting against the periphery of a substrate horizontally disposed above the base plate, thereby calibrating the substrate to a predetermined position above the base plate and performing rotation calibration in a manner that does not rotate relative to the base plate; and an acceleration step, wherein in the static calibration state, the rotational speed of the base plate is increased to a predetermined liquid processing speed. The sliding regulation state formation process forms a sliding regulation state after the aforementioned acceleration process. This sliding regulation state involves positioning the sliding pin provided on the aforementioned base plate in a position that is gapped and facing the aforementioned peripheral portion of the substrate positioned in the aforementioned normal position. This allows the substrate to rotate relative to the aforementioned base plate and to position itself in such a way that the substrate's radial displacement from the aforementioned normal position does not exceed an allowable range. The processing liquid supply process involves supplying processing liquid to the aforementioned substrate during the aforementioned sliding regulation state.

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