Sensor package structure

Abstract

This invention discloses a sensor packaging structure comprising a substrate, a sensing chip mounted and electrically coupled to the substrate, a plurality of stress-absorbing pillars formed on the sensing chip, an annular wall formed on the substrate, a light-transmitting layer disposed on the plurality of stress-absorbing pillars and the annular wall, and a package formed on the substrate. The sensing chip has a sensing region defining multiple diagonals. Two stress-absorbing pillars are disposed on each diagonal, located on opposite sides of the sensing region. The annular wall surrounds the plurality of stress-absorbing pillars and the sensing chip at intervals. The light-transmitting layer and the annular wall are embedded within the package and together with the substrate form a closed space.

Claims

1. A sensor packaging structure, comprising: One substrate; A sensing chip is mounted on the substrate and electrically coupled to each other, and the top surface of the sensing chip has a sensing area and a support area surrounding the sensing area; wherein the sensing area is a polygon with multiple edges and defined with multiple intersecting diagonals; a plurality of stress-absorbing pillars are disposed at intervals in the support area, and two stress-absorbing pillars are disposed on each diagonal, respectively located on opposite sides of the sensing area; an annular wall is disposed on the substrate and at intervals surrounding the outer side of the plurality of stress-absorbing pillars and the sensing chip, and the top edge of the annular wall is coplanar with the top edge of the plurality of stress-absorbing pillars; A light-transmitting layer having an inner surface and an outer surface located on opposite sides, wherein the inner surface of the light-transmitting layer is disposed on the annular wall and the plurality of stress-absorbing columns; wherein the inner surface of the light-transmitting layer, the annular wall, and the substrate together surround and form a closed space; and an encapsulation body formed on the substrate, wherein the annular wall and the light-transmitting layer are embedded within the encapsulation body, and at least a portion of the outer surface of the light-transmitting layer is exposed outside the encapsulation body.

2. The sensor packaging structure as described in claim 1, wherein, The substrate includes a plurality of bonding pads, the sensing chip includes a plurality of connecting pads located in the carrier region, and the sensor package structure includes a plurality of metal wires, with each metal wire having its two ends connected to a bonding pad and a connecting pad, respectively; wherein, a portion of each metal wire is embedded within the annular enclosure.

3. The sensor packaging structure as described in claim 1, wherein, No stress-absorbing columns are provided at any of the portions of the bearing area between any of the edges of the sensing area and the annular wall.

4. The sensor packaging structure as described in claim 1, wherein, Each of the stress-absorbing columns can absorb the stress generated by the thermal expansion and contraction of the air in the enclosed space and can allow separation relative to the light-transmitting layer.

5. A sensor packaging structure, comprising: One substrate; A sensing chip is mounted on the substrate and electrically coupled to each other, and the top surface of the sensing chip has a sensing area and a support area surrounding the sensing area; wherein the sensing area is a polygon with multiple edges and defines multiple intersecting diagonals; a plurality of stress-absorbing pillars are disposed at intervals in the support area and respectively adjacent to the plurality of edges of the sensing area, and no stress-absorbing pillars are disposed on each of the diagonals; an annular wall is disposed on the substrate and at intervals surrounding the outer side of the plurality of stress-absorbing pillars and the sensing chip, and the top edge of the annular wall is coplanar with the top edge of the plurality of stress-absorbing pillars; A light-transmitting layer having an inner surface and an outer surface located on opposite sides, wherein the inner surface of the light-transmitting layer is disposed on the annular wall and the plurality of stress-absorbing columns; wherein the inner surface of the light-transmitting layer, the annular wall, and the substrate together surround and form a closed space; and an encapsulation body formed on the substrate, wherein the annular wall and the light-transmitting layer are embedded within the encapsulation body, and at least a portion of the outer surface of the light-transmitting layer is exposed outside the encapsulation body.

6. The sensor packaging structure as described in claim 5, wherein, Each of the stress-absorbing pillars does not protrude beyond the adjacent edge of the sensing area.

7. The sensor packaging structure as described in claim 5, wherein, Each stress-absorbing column projects an orthographically toward the sensing area, forming a projection area that covers at least 80% of the adjacent edge.

8. The sensor packaging structure as described in claim 5, wherein, Each of the stress-absorbing columns is a strip-shaped structure parallel to the adjacent edges.

9. The sensor packaging structure as described in claim 5, wherein, Each of the stress-absorbing columns can absorb the stress generated by the thermal expansion and contraction of the air in the enclosed space and can allow separation relative to the light-transmitting layer.

10. A sensor packaging structure, comprising: One substrate; A sensing chip is mounted on the substrate and electrically coupled to each other, and the top surface of the sensing chip has a sensing area and a support area surrounding the sensing area; wherein the sensing area is a polygon with multiple edges; at least one stress absorber is disposed in the support area and adjacent to at least one edge of the sensing area; an annular wall is disposed on the substrate and spaced around the outside of at least one stress absorber and the sensing chip, and the top edge of the annular wall is coplanar with the top edge of at least one stress absorber; a light-transmitting layer has an inner surface and an outer surface located on opposite sides, and the inner surface of the light-transmitting layer is disposed on the annular wall and at least one stress absorber; wherein the inner surface of the light-transmitting layer, the annular wall, and the substrate together surround to form a closed space; and a package is formed on the substrate, and the annular wall and the light-transmitting layer are embedded within the package, while at least a portion of the outer surface of the light-transmitting layer is exposed outside the package.

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