Perovskite solar cell module encapsulation method

TWI940322BActive Publication Date: 2026-09-21TAIWAN PEROVSKITE SOLAR CORP
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Patent Information

Application Number
TW114137021
Authority / Receiving Office
TW · TW
Patent Type
Patents
Current Assignee / Owner
Filing Date
2025-09-25
Publication Date
2026-09-21
Estimated Expiration
2045-09-24

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  • Figure TWG2TB001912439_001
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  • Figure TWG2TB001912439_003
    Figure TWG2TB001912439_003
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Abstract

This invention discloses a method for encapsulating a perovskite solar cell module. Before laminating the solar cell module, a pressure clamp is used to apply pressure to the adhesive between the solar cell substrate and the encapsulation element, causing the adhesive to adhere to the solar cell substrate and the encapsulation element. The pressure clamp eliminates air bubbles between the adhesive and the solar cell substrate and improves the yield of perovskite solar cell module encapsulation.
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Claims

1. A method for encapsulating a perovskite solar cell module, comprising the following steps: (A) preparing a solar cell substrate; (B) forming a lamination film on the solar cell substrate; (C) Using an adhesive to form a frame on the edge of the solar cell substrate; (D) Covering the solar cell substrate with an encapsulation element; (E) Placing a pressure clamp on the encapsulation element; (F) Applying pressure to the encapsulation element, the adhesive, and the solar cell substrate with the pressure clamp; (G) laminating the encapsulation element, the adhesive, the laminate and the solar cell substrate; wherein the frame surrounds the laminate; wherein the adhesive adheres to the surface of the solar cell substrate.

2. The perovskite solar cell module packaging method as described in claim 1, wherein the solar cell substrate comprises: a substrate; a first electrode layer disposed on the substrate; a first transport layer disposed on the first electrode layer; a photoelectric conversion layer disposed on the first transport layer; a second transport layer disposed on the photoelectric conversion layer; and a second electrode layer disposed on the second transport layer.

3. The perovskite solar cell module packaging method as described in claim 2, wherein the substrate is a flexible substrate or a glass substrate.

4. The perovskite solar cell module encapsulation method as described in claim 2, wherein the photoelectric conversion layer is a perovskite photoelectric conversion layer.

5. The perovskite solar cell module encapsulation method as described in claim 1, wherein the laminate material is a thermoplastic polyolefin.

6. The perovskite solar cell module encapsulation method as described in claim 1, wherein the adhesive is a thermally fluid material.

7. The perovskite solar cell module encapsulation method as described in claim 6, wherein the thermally flowable material comprises butyl rubber, thermoplastic elastomer (TPE), or ethylene vinyl acetate copolymer (EVA).

8. The perovskite solar cell module packaging method as described in claim 1, wherein the width of the frame is between 300 mm and 210 mm.

9. The perovskite solar cell module encapsulation method as described in claim 1, wherein the encapsulation element comprises encapsulation glass or encapsulation film.

10. The perovskite solar cell module packaging method as described in claim 1, wherein the pressure clamp is in the shape of a four-sided ring.

Citation Information

Patent Citations

  • A membrane photovoltaic module package structure and method

    CN109216486A

  • Perovskite solar cell packaging structure and packaging method

    CN116454150A

  • Photovoltaic device and packaging method thereof

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  • Packaging structure of photovoltaic device and preparation method of packaging structure

    CN117059684A

  • Flexible solar cell module for near space environment and preparation method thereof

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