Camera module and electronic device using the same

Abstract

A camera module and an electronic device using the same are disclosed. The camera module includes a circuit board, an image signal processing unit, a first camera unit, a second camera unit, two traces, and a first ground layer. The circuit board has a through space and an edge plate. The edge plate is located beside the through space. The image signal processing unit is disposed on the circuit board. The first camera unit is disposed in the through space. The first camera unit is located between the image signal processing unit and the second camera unit. The traces connect the image signal processing unit and the second camera unit and are located within the edge plate. The first ground layer covers one outer side of the edge plate. The outer side is located outside the circuit board.

Claims

1. A camera module, comprising: A circuit board having a through space and an edge plate located beside the through space; an image signal processing unit disposed on the circuit board; a first camera unit disposed in the through space; a second camera unit located between the image signal processing unit and the second camera unit; two traces connected to the image signal processing unit and the second camera unit and located within the edge plate; and a first ground layer covering one outer side of the edge plate, the outer side being located outside the circuit board.

2. The camera module as described in claim 1, further comprising: A second grounding layer covers one of the first surfaces of the edge plate; And a third grounding layer covering one of the second surfaces of the edge plate, the outer side of which connects the first surface and the second surface.

3. The camera module as described in claim 2, wherein the first ground layer is connected to the second ground layer and the third ground layer.

4. The camera module as described in claim 2, further comprising: A fourth grounding layer covers one of the inner sides of the edge plate, which is located within the through space.

5. The camera module as described in claim 4, wherein the fourth ground layer is connected to the second ground layer and the third ground layer.

6. The camera module as described in claim 1, wherein each of the traces is used to transmit a Mobile Industry Processor Interface (MIPI) signal.

7. The camera module as described in claim 1, wherein the first ground layer only covers the travel range of the trace.

8. The camera module as described in claim 1, wherein the traces are electrically isolated from the first ground plane.

9. The camera module as claimed in claim 1, wherein one inner surface of the first ground layer is in complete contact with at least one insulating material.

10. An electronic device comprising: One monitor; A bezel that covers the edge of the display; The device also includes a camera module disposed within the frame, comprising: a circuit board having a through space and an edge plate located beside the through space; an image signal processing unit disposed on the circuit board; a first camera unit disposed in the through space; a second camera unit located between the image signal processing unit and the second camera unit; two traces connecting the image signal processing unit and the second camera unit and located within the edge plate; and a first ground layer covering one outer side of the edge plate located outside the circuit board.

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