Electronic assembly structure and method of manufacturing the same

Abstract

This invention provides an electronic component structure and its manufacturing method. The electronic component structure includes a first metal layer; microchannels disposed in the first metal layer; a power module disposed on the first metal layer; a thermally conductive insulating material covering the power module; a second metal layer disposed on the power module; a conductive metal pillar penetrating one side of the thermally conductive insulating material of the power module; a composite thermally conductive layer disposed on the second metal layer; and a plurality of thermally conductive vias respectively disposed on the outer side of the first metal layer. Thus, the electronic component structure can have multi-directional heat conduction paths, thereby improving overall heat dissipation efficiency and enabling the power module to have better performance and a longer service life.

Claims

1. An electronic component structure, comprising: A first metal layer; A microchannel is disposed in the first metal layer, wherein the microchannel has a cavity and a fluid fills the cavity; a power module is disposed on the first metal layer; a thermally conductive insulating material covers the power module; a second metal layer is disposed on the power module; a conductive metal pillar penetrates the thermally conductive insulating material on one side of the power module, wherein the conductive metal pillar connects the first metal layer and the second metal layer; a composite thermally conductive layer is disposed on the second metal layer; and a plurality of thermally conductive through holes are respectively disposed on the outside of the first metal layer, wherein the plurality of thermally conductive through holes substantially connect the first metal layer, a portion of the thermally conductive insulating material, and the composite thermally conductive layer.

2. The electronic component structure as described in claim 1 further includes: a plurality of fluid disturbance structures disposed on a plurality of sidewalls of the cavity.

3. The electronic component structure as described in claim 1, wherein the composite thermally conductive layer comprises: a thermally conductive layer; a third metal layer disposed on the thermally conductive layer; and a conductive layer disposed on the third metal layer.

4. The electronic component structure as described in claim 1 further includes: At least one embedded element is disposed on the outside of the plurality of heat-conducting through holes; And at least one embedded line, respectively disposed on the at least one embedded element.

5. The electronic component structure as described in claim 4 further includes: Multiple insulating materials are used to cover the at least one embedded element.

6. The electronic component structure as described in claim 1 further includes: A heat dissipation fin system is disposed below the first metal layer; A thermally conductive interface material is disposed between the first metal layer and the heat dissipation fin system.

7. A method for fabricating an electronic component structure, comprising: A single-layer metal-clad substrate is provided, wherein the single-layer metal-clad substrate includes an upper metal plate and a substrate, and the upper metal plate is located on the substrate; The upper metal plate undergoes a processing step to obtain a first metal layer and a microchannel, wherein the microchannel is located in the first metal layer; a power module is disposed on the first metal layer; a thermally conductive insulating material is filled around the power module; a grooving step is performed on the thermally conductive insulating material to form a first groove on the power module and a second groove in the thermally conductive insulating material on one side of the power module; a second metal layer is disposed in the first groove; a conductive metal pillar is disposed in the second groove, wherein the conductive metal pillar connects the first metal layer and the second metal layer; a composite thermally conductive layer is disposed on the second metal layer; and a plurality of thermally conductive through holes are disposed on the outside of the first metal layer, wherein the plurality of thermally conductive through holes substantially connect the first metal layer, a portion of the thermally conductive insulating material, and the composite thermally conductive layer.

8. A method for manufacturing an electronic component structure as described in claim 7, wherein the manufacturing steps include: A receiving groove is formed in the upper metal plate; a thermally conductive coating is applied to the receiving groove; A fluid is filled into the thermally conductive coating within the receiving tank; the receiving tank is capped to obtain the microchannel; and a metal cover is disposed on the microchannel and a portion of the upper metal plate to obtain the first metal layer.

9. A method for manufacturing an electronic component structure as described in claim 8, further comprising, after applying the thermally conductive coating and before filling the fluid: Multiple fluid disturbance structures are provided on multiple sidewalls of the receiving groove.

10. The method for manufacturing the electronic component structure as described in claim 7 further includes: At least one embedded element is disposed on the outside of the plurality of heat-conducting through holes; And at least one embedded line is provided on the at least one embedded element.

11. The method for manufacturing the electronic component structure as described in claim 10 further includes: Multiple insulating materials are filled around the at least one embedded element.

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