Resin composition, laminate and printed circuit board
TWI940473BActive Publication Date: 2026-09-21ITEQ CORP
Patent Information
- Application Number
- TW115123662
- Authority / Receiving Office
- TW · TW
- Patent Type
- Patents
- Current Assignee / Owner
- Filing Date
- 2026-06-16
- Publication Date
- 2026-09-21
- Estimated Expiration
- 2046-06-15
Abstract
The present invention provides a resin composition, a laminate, and a printed circuit board; wherein the total weight of the resin composition is 100 parts by weight, the resin composition comprises: 10 to 30 parts by weight of unsaturated polyphenylene ether resin; 65 to 75 parts by weight of low molecular weight olefin resin; and 5 to 15 parts by weight of organosilicon-modified benzocyclobutene resin; wherein the organosilicon-modified benzocyclobutene resin has the structure shown in formula (1): (Formula 1), wherein n is 1 or 2; the resin composition of the present invention provides excellent dielectric properties and significantly improves the heat resistance, damp heat resistance, and peel strength to copper foil of the material.
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Citation Information
Patent Citations
Resin composition for high-frequency high-speed copper-clad plate and application thereof
CN111647247A
Resin composition, metal foil-clad laminated board and application of metal foil-clad laminated board
CN121293749A
Resin composition and article made therefrom
TW202519593A