Common substrate and shadow ring lift apparatus

Abstract

Embodiments of a lifting device for use in a substrate processing chamber are provided herein. In some embodiments, a lifting device includes: a plurality of first lifting pin assemblies configured to raise or lower a substrate having a given diameter when the substrate is disposed thereon, wherein each of the first lifting pin assemblies includes a first lifting pin disposed on a first bellows assembly; a plurality of second lifting pin assemblies arranged in a circle having a diameter greater than the given diameter and configured to raise or lower an annular chamber component, wherein each of the second lifting pin assemblies includes a second lifting pin disposed on a second bellows assembly; an actuator; and a lifting assembly coupled to the actuator and configured to raise or lower each of the first and second lifting pin assemblies by movement of the actuator.

Description

[Technical Field]

[0001] The embodiments of this disclosure are generally related to substrate processing equipment, and more specifically, to lifting mechanisms for use in substrate processing equipment. [Previous Technology]

[0002] A substrate processing system typically includes a processing chamber for performing desired processing, such as etching or deposition, on one or more substrates disposed therein. Radio frequency (RF) power is typically used in etching processes (e.g., to create contacts or deep trenches requiring very high aspect ratio holes) to lay the infrastructure for electrical pathways. RF power can be used for plasma generation and / or to generate a bias voltage on the substrate being processed to attract ions from a bulk plasma. A base for supporting the substrate is disposed within the processing chamber and may include an electrostatic chuck or a vacuum chuck to hold the substrate. The processing chamber may include a shadow ring disposed around the substrate to protect the edges of the substrate being processed or to control plasma within the processing volume of the processing chamber.

[0003] The substrate is typically conveyed into the processing chamber via a transfer blade that transports the substrate through an opening in the chamber wall. The processing chamber may typically include a substrate lifting assembly for lifting the substrate off or lowering it onto the base. The substrate lifting assembly typically includes one or more actuators coupled to one or more substrate lifting pins. The processing chamber may include a shadow ring lifting assembly for raising or lowering the shadow ring within the processing volume. However, separate lifting mechanisms for the substrate and shadow ring may become expensive and clutter the volume below the base.

[0004] Therefore, the inventors have provided an improved lifting mechanism for the substrate and shadow ring disposed in the processing chamber. [Summary of the Invention]

[0005] Embodiments of a lifting device for use in a substrate processing chamber are provided herein. In some embodiments, a lifting device includes: a plurality of first lifting pin assemblies configured to raise or lower a substrate having a given diameter when the substrate is disposed thereon, wherein each of the first lifting pin assemblies includes a first lifting pin disposed on a first bellows assembly; a plurality of second lifting pin assemblies arranged in a circle having a diameter greater than the given diameter and configured to raise or lower an annular chamber component, wherein each of the second lifting pin assemblies includes a second lifting pin disposed on a second bellows assembly; an actuator; and a lifting assembly coupled to the actuator and configured to raise or lower each of the first and second lifting pin assemblies by movement of the actuator.

[0006] In some embodiments, a substrate support for use in a substrate processing chamber includes: a base plate; a dielectric plate coupled to the base plate and having a support surface for supporting the substrate and having one or more clamping electrodes disposed therein; and a lifting device including: a plurality of first lifting pin assemblies having a plurality of first lifting pins extending through the base plate and the dielectric plate to raise or lower the substrate when it is disposed thereon; a plurality of second lifting pin assemblies having a plurality of second lifting pins extending through the base plate and configured to raise or lower an annular chamber member disposed above the substrate; an actuator; and a lifting assembly coupled to the actuator and configured to raise or lower each of the first and second lifting pin assemblies by movement of the actuator.

[0007] In some embodiments, a processing chamber for processing a substrate includes: a chamber body defining an internal volume therein; a substrate support disposed in the internal volume of the chamber body, wherein the substrate support includes: a base for supporting the substrate; and a lifting device including: a plurality of first lifting pin assemblies having a plurality of first lifting pins extending through the base and configured to raise or lower the substrate; a plurality of second lifting pin assemblies having a plurality of second lifting pins extending through the base radially outward of the plurality of first lifting pins; an actuator; and a lifting assembly coupled to the actuator and configured to raise or lower each of the first and second lifting pin assemblies by movement of the actuator; and a shadow ring disposed on the plurality of second lifting pins.

[0008] Other and further embodiments of this disclosure are described below.

Implementation Method

[0019] Embodiments of a lifting device for use in a processing chamber are provided herein. The lifting device of the present invention generally includes raising or lowering a plurality of first lifting pin assemblies using a common actuator to raise or lower a substrate when it is disposed thereon, and raising or lowering a plurality of second lifting pin assemblies to raise or lower an annular ring when it is disposed thereon. The annular ring may be a shaded ring, an edge ring, or the like, configured to rest on or above the substrate during operation of the processing chamber. The lifting device is configured to raise the annular ring before raising the substrate via the various configurations disclosed herein. By using a common actuator, the lifting device is advantageously more cost-effective, simpler, and occupies less space in the processing chamber.

[0020] Figure 1A depicts a schematic side view of a processing chamber or chamber 100 in a first position according to at least some embodiments of this disclosure. Figure 1B depicts a schematic side view of a chamber 100 in a second position according to at least some embodiments of this disclosure. In some embodiments, chamber 100 is an etching processing chamber. However, other types of processing chambers configured for different processes may also be used or modified for use with embodiments of the substrate support described herein. Chamber 100 is typically a vacuum chamber adapted to maintain subatmospheric pressure within the internal volume 120 during substrate processing. Chamber 100 includes a chamber body 106 covered by a cover 104 that surrounds a processing volume 119 located in the upper portion of the internal volume 120.

[0021] A substrate support 124 is disposed within the internal volume 120 to support and hold a substrate 122, such as a semiconductor wafer, for example, or other such substrates that can be electrostatically held. The chamber body 106 includes a transfer slot 144 to facilitate the transfer of the substrate 122 or other chamber components (such as a shadow ring 134) in and out of the internal volume 120. The shadow ring 134 is configured to be disposed on or slightly elevated above the substrate 122 during processing to protect the edges of the substrate 122 or control plasma near the edges of the substrate 122. In some embodiments, a transfer robot (not shown) is configured to transfer the substrate 122. The transfer robot may also advantageously be configured to transfer the shadow ring 134 in and out of the internal volume 120 for replacement.

[0022] The chamber 100 may also include one or more shielding elements (such as a processing shield 105) to surround various chamber components to prevent unwanted reactions between these components and the ionized processing material or plasma. In some embodiments, the processing shield 105 includes a transfer slot 185 corresponding to a transfer slot 144 in the chamber body 106. In some embodiments, the processing shield 105 rests on or is otherwise coupled to the chamber body 106. The chamber body 106 and the cover 104 may be made of a metal such as aluminum. The chamber body 106 may be grounded via coupling to ground 115.

[0023] The substrate support 124 may typically include a base 150 coupled to the chamber body 106 (described in more detail below with reference to Figure 2). In some embodiments, as shown in Figure 1A, the base 150 is fixedly coupled to the chamber body 106. In some embodiments, the base 150 may be movably coupled to the chamber body 106 via a base lifting assembly configured to raise or lower the base 150 within the internal volume 120. The base 150 includes a dielectric plate 152 disposed on a base assembly 136. The dielectric plate 152 includes a support surface for supporting the substrate 122. The dielectric plate 152 includes one or more clamping electrodes 154 configured to electrostatically clamp the substrate 122 onto the dielectric plate 152. The base 150 may be coupled to the chamber body 106 via a base plate 132. In some embodiments, the base plate 132, together with the chamber body 106, defines a lower volume 145 of the chamber 100. In some embodiments, the lower volume 145 may be at atmospheric pressure during use.

[0024] One or more suppliers 128 are coupled to the substrate support 124 in any suitable manner via the lower volume 145. For example, one or more suppliers 128 may extend through the sidewall of the chamber body 106, the bottom plate of the chamber body 106, or a combination of the sidewall or bottom plate of the chamber body 106. In some embodiments, one or more suppliers 128 include a clamping power supplier 140 coupled to one or more clamping electrodes 154. In some embodiments, one or more suppliers 128 include a back-side gas supplier 141 to provide back-side gas to the upper surface of the base 150 (i.e., the support surface of the dielectric plate 152). The back-side gas supplier 141 is disposed outside the chamber body 106 and supplies heat transfer gas to the base 150. The back-side gas may consist substantially of helium, nitrogen, argon, or the like. In some embodiments, one or more suppliers 128 include a bias power supplier 117 configured to provide bias power to the base 150. In some embodiments, the bias power supply 117 is coupled to the base via a bias RF matching network 116. The bias power supply 117 may include an AC, DC, or RF bias power supply. In some embodiments, the bias power supply 117 may include one or more RF bias power sources.

[0025] The substrate support 124 includes a lifting device 126 for raising or lowering a plurality of components disposed above the substrate support 124. The plurality of components includes the substrate 122 and other annular chamber components. The lifting device 126 typically includes an actuator 130 coupled to a plurality of first lifting pin assemblies 138 and a plurality of second lifting pin assemblies 148 to advantageously use a single actuator to lift both the substrate 122 and the shadow ring 134. In some embodiments, the actuator 130 is a pneumatic actuator. However, in other embodiments, the actuator 130 may be a hydraulic actuator, a servo actuator, or any other suitable type of actuator for use in the chamber 100. In some embodiments, the actuator 130 is a linear actuator.

[0026] A plurality of first lift pin assemblies 138 are configured to raise or lower a substrate 122 having a given diameter when the substrate is disposed on the plurality of first lift pin assemblies 138. Each of the first lift pin assemblies 138 includes a first lift pin 162 disposed on or coupled to a first bellows assembly 164, the first bellows assembly 164 being configured to provide a flexible seal that allows vertical movement of the first lift pin 162 while preventing vacuum loss within the chamber 100. The first lift pin 162 may selectively extend beyond the upper surface of the base 150 to raise the substrate 122, or retract into the base 150 to lower the substrate 122 to the upper surface of the base 150.

[0027] A plurality of second lift pin assemblies 148 are configured to support, raise, or lower an annular chamber component, such as a shadow ring 134, disposed above the substrate support 124. Each of the second lift pin assemblies 148 includes a second lift pin 166 disposed on or coupled to a second bellows assembly 168, the second bellows assembly 168 being configured to provide a flexible seal that allows vertical movement of the second lift pin 166 while preventing vacuum loss within the chamber 100. In some embodiments, the plurality of second lift pin assemblies 148 are arranged in a circle having a diameter greater than a given diameter. The lift assembly 146 (discussed in more detail below with respect to Figures 3-6) is coupled to an actuator 130 and configured to raise or lower each of the first lift pin assembly 138 and the second lift pin assembly 148 by movement of the actuator 130. The second lifting pin 166 selectively extends beyond the upper surface of the base 150 to raise the shadow ring 134, or retracts into the base 150 to lower the shadow ring 134. The base 150 includes a through-hole to receive the first lifting pin 162 and the second lifting pin 166.

[0028] In a first position or processing position, the substrate 122 is disposed on the base 150. In the first position, as depicted in Figure 1A, a shadow ring 134 is disposed above the substrate 122 in the processing position. Alternatively, in the processing position, the shadow ring 134 may be lowered to rest on the outer edge of the substrate 122 instead of on the second lift pins 166. In either case, in some embodiments, a plurality of second lift pins 166 are configured to extend vertically beyond a plurality of first lift pins 162 above the dielectric plate 152, such that the shadow ring 134 may be lifted before the substrate 122 is lifted, to control the vertical spacing of the shadow ring 134 relative to the substrate 122. In such embodiments, a gap 112 exists between the first lift pins 162 and the upper surface of the dielectric plate 152 when the second lift pins 166 are retracted into the base 150. That is, in some embodiments, the first lift pins 162 are recessed into the base 150 by the distance of the gap 112. In some embodiments, when the first lifting pin 162 is fully retracted, the gap 112 has a distance of about 10 mm to about 30 mm.

[0029] In the second position or transfer position, as shown in Figure 1B, the first lifting pin 162 is raised above the base 150 and aligned with the transfer slot 144 in the chamber body 106 after being placed in the internal volume 120 or before being removed from the internal volume 121 by, for example, a robot transfer blade (not shown) via the transfer slot 144. In some embodiments, the second lifting pin 166 also extends vertically higher than the first lifting pin 162, such that the shadow ring 134 does not interfere with the robot transfer blade when the substrate 122 is transferred in and out of the internal volume 120. In some embodiments, the vertical distance between the top of the first lifting pin 162 and the top of the second lifting pin 166 corresponds to the distance of the gap 112.

[0030] Chamber 100 is coupled to and in fluid communication with a vacuum system 114, which includes a throttle valve (not shown) and a vacuum pump (not shown) for venting chamber 100. The pressure inside chamber 100 can be regulated by adjusting the throttle valve and / or the vacuum pump. Chamber 100 is also coupled to and in fluid communication with a process gas supplier 118, which supplies one or more process gases to chamber 100 to process the substrate disposed therein. In some embodiments, RF energy is supplied to the processing volume 199 by an RF plasma power supplier 170, which may have a frequency of about 400 kHz to more than 40 MHz. In some embodiments, the RF plasma power supplier 170 is coupled to chamber 100 via an RF matching network (not shown).

[0031] In operation, for example, plasma 102 may be generated in processing volume 119 to perform one or more processes. Plasma 102 may be created by coupling power from a plasma power supply (e.g., RF plasma power supply 170) to a processing gas via one or more electrodes near or within internal volume 120 to ignite the processing gas and generate plasma 102. Bias power may be supplied from a bias power supply (e.g., bias power supply 117) to substrate 150 to attract ions from plasma 102 to substrate 122.

[0032] Figure 2 depicts a schematic side view of a portion of a lifting device 126 according to at least some embodiments of this disclosure. The portion depicted in Figure 2 shows an extension of a plurality of first lifting pin assemblies 138 through a base 150 to support a substrate 122, and an extension of a plurality of second lifting pin assemblies 148 through the base 150 to support a shadow ring 134. In some embodiments, the lifting assembly 146 includes a first lifter 210 coupled to the plurality of first lifting pin assemblies 138 and the plurality of second lifting pin assemblies 148. The first lifter 210 may be a single rigid structure such that the lifting assembly 146 vertically displaces the plurality of first lifting pin assemblies 138 and the plurality of second lifting pin assemblies 148 by a first distance vertical displacement.

[0033] In some embodiments, the substrate support 124 may include a pad 216 disposed around the base 150. In some embodiments, the pad 216 and one or more of the base plate 132 are grounded during use. In some embodiments, the base assembly 136 of the base 150 includes an insulating plate 202 disposed on the base plate 132 to electrically insulate the base plate 132 from the cooling plate 220. In some embodiments, the base assembly 136 includes a cooling plate 220 disposed on the insulating plate 202 and configured to allow coolant to circulate through the cooling plate 220. In some embodiments, a dielectric plate 152 is disposed on the cooling plate 220.

[0034] In some embodiments, the substrate support 124 includes an edge ring 206 disposed around the dielectric plate 152 to extend the processing environment radially to the outside of the substrate 122, thereby improving etching uniformity across the substrate 122. In some embodiments, a second edge ring 204 is disposed around the cooling plate 220. In some embodiments, the second edge ring 204 is disposed around the cooling plate 220 and the insulating plate 202. In some embodiments, the edge ring 206 is disposed on the second edge ring 204. In some embodiments, the second edge ring 204 is made of a ceramic material, such as quartz or alumina (Al2O3)).

[0035] In some embodiments, a third edge ring 208 is disposed between edge ring 206 and base plate 132. The third edge ring 208 may be disposed around insulating plate 202 and made of a different material than insulating plate 226 to protect the outer wall of insulating plate 226 from unintentional plasma discharge. For example, the third edge ring 208 may be made of a ceramic material such as alumina (Al2O3). In some embodiments, a first lifting pin 162 extends through one or more of dielectric plate 152 and base plate 132, insulating plate 202, or cooling plate 220 to support substrate 122. In some embodiments, a second lifting pin 166 extends through one or more of base plate 132, third edge ring 208, second edge ring 204, or edge ring 206 to support shadow ring 134.

[0036] Each of the plurality of first lifting pin assemblies 138 includes a first lifting pin 162 disposed on or coupled to the first bellows assembly 164. In some embodiments, the first bellows assembly 164 includes a bellows 230 disposed between a first upper flange 232 and a first lower flange 234. In some embodiments, the first lower flange 234 is coupled to a first lifter 210. In some embodiments, a portion of each of the first lifting pin assemblies 138 (e.g., the lower portion of the first lifting pin 162 and the upper portion of the first bellows assembly 164) extends through a first mounting assembly 238 coupled to a base plate 132 of a substrate support 124. In some embodiments, the first mounting assembly 238 includes a hollow tube configured to slidably engage the first upper flange 232.

[0037] Each of the first lifting pins 162 may be coupled to or disposed on the first upper flange 232 such that vertical movement of the first upper flange 232 translates into a corresponding vertical movement of each of the first lifting pins 162. In some embodiments, one or more first sleeves 256 (only one is shown in the insulating plate 202 of Figure 2) may be disposed around the first lifting pin 162 in the base 150 to guide the first lifting pin 162 when the bellows 230 is actuated or retracted. For example, one or more first sleeves 256 may extend through the insulating plate 202, the cooling plate 220, and the dielectric plate 152.

[0038] Each of the plurality of second lift pin assemblies 148 includes a second lift pin 166 disposed on or coupled to the second bellows assembly 168. In some embodiments, the second bellows assembly 168 includes a bellows 240 disposed between a second upper flange 242 and a second lower flange 244. In some embodiments, a portion of each of the plurality of second lift pin assemblies 148 extends through a second mounting assembly 248 coupled to a base plate 132 of a substrate support 124. In some embodiments, the second mounting assembly 248 is similar to the first mounting assembly 238.

[0039] In some embodiments, as shown in Figure 2, the second mounting assembly 248 includes an upper support 252 coupled to a base plate 132 and a lower support 254 connected to the upper support 252. A second lower flange 244 may be clamped between the upper support 252 and the lower support 254, for example, via fasteners extending from the upper support 252 into the lower support 254 or from the lower support 254 into the upper support 252. In some embodiments, the second bellows assembly 168 includes a lifting rod 246 extending through the second mounting assembly 248 and the second lower flange 244. The lifting rod 246 may be coupled at its upper end to the second upper flange 242 and at its opposite lower end to the first lifter 210.

[0040] Each of the second lift pins 166 may be coupled to or disposed on the second upper flange 242 such that vertical movement of the second upper flange 242 translates into a corresponding vertical movement of each of the second lift pins 166. In some embodiments, one or more second bushings (not shown) may be disposed around the second lift pins 166 to guide the second lift pins 168 when the bellows 240 is actuated or retracted. For example, one or more second bushings may extend through one or more of the base plate 132, edge ring 206, second edge ring 204, or third edge ring 208.

[0041] Figure 3 depicts a bottom isometric view of a lifting device 126 according to at least some embodiments of this disclosure. In some embodiments, a lifting assembly 146 of the lifting device 126 includes a first lifter 210 having a base 302 and a plurality of branches 306 extending from the base 302. In some embodiments, the base 302 is asymmetrically disposed below a base 150. The plurality of branches 306 are coupled to a plurality of first lifting pin assemblies 138 and a plurality of second lifting pin assemblies 148. In some embodiments, the plurality of first lifting pin assemblies 138 comprises three such assemblies. In some embodiments, the plurality of second lifting pin assemblies 148 comprises three such assemblies. In some embodiments, all or some of the plurality of first lifting pin assemblies 138 and the plurality of second lifting pin assemblies 148 may have a linear guide 340 coupled to a corresponding one of a first bellows assembly 164 and a second bellows assembly 168 to guide linear vertical movement.

[0042] In some embodiments, one or more of the plurality of branches 306 include a fork 310. In some embodiments, a first fork 312 of the fork 310 is coupled to one of the first lifting pin assemblies 138, and a second fork 316 of the fork 310 is coupled to one of the plurality of second lifting pin assemblies 148. In some embodiments, the second fork 316 includes one or more bends. In some embodiments, one of the plurality of first lifting pin assemblies 138 is coupled to the base 302 of the first lifter 210. For example, in some embodiments, the plurality of branches 306 includes two branches each coupled to one of the plurality of first lifting pin assemblies 138 and one of the plurality of second lifting pin assemblies 148, and a third branch of the plurality of branches 306 coupled to a third of the plurality of second lifting pin assemblies 148 but not coupled to one of the plurality of first lifting pin assemblies 138.

[0043] Figure 4 depicts a bottom isometric view of a lifting device 126 according to at least some embodiments of this disclosure. The lifting device 126 of Figure 4 may be similar to the lifting device 126 of Figure 3, except that the plurality of branches 306 of the first lifter 210 in Figure 4 do not include the fork 310 of Figure 3. Instead, in some embodiments, one or more of the plurality of branches 306 include a first portion 410 and a second portion 420, the first portion 410 extending from the base 302 to one of the plurality of first lifting pin assemblies 138, and the second portion 420 extending from one of the plurality of first lifting pin assemblies 138 to one of the plurality of second lifting pin assemblies 148. In some embodiments, the first portion 410 does not extend parallel to the second portion 420 along a horizontal plate. In some embodiments, the first portion 410 extends from the base 302 along a horizontal plane at a first angle, and the second portion 420 extends from the base 302 along a horizontal plate at a second angle. In some embodiments, the second angle is greater than the first angle. In some embodiments, the lifting device 126 may include a common linear guide 440 that interfaces with the base 302 and a plurality of first lifting pin assemblies 138, and the plurality of second lifting pin assemblies 148 may not interface with any additional linear guide (such as the linear guide 340 shown in Figure 3).

[0044] Figure 5 depicts a cross-sectional view of a portion of a lifting device 126 according to at least some embodiments of this disclosure. In some embodiments, one of a plurality of first lifting pin assemblies 138 is disposed above a base 302 of a first lifter 210. In some embodiments, an actuator 130 includes a cavity 514 therein and a shaft 516 configured for movement within the cavity 514. For example, in use, an air source 502 may provide air pressure to a head 518 of the shaft 516, thereby forcing the shaft 516 upward. In some embodiments, the base 302 includes an opening 512 therethrough to facilitate coupling the shaft 516 of the actuator 130 to a first bellows assembly 164 in any suitable manner. In such an arrangement, vertical movement of the shaft 516 can be translated into vertical movement of one of the first lifting pins 162 disposed on or coupled to the first bellows assembly 164.

[0045] In some embodiments, the first bellows assembly 164 may include a rod 504 having an upper flange 510 and a lower flange 528. The lower flange 528 may be coupled to the shaft 516 of the actuator 130, for example, via a fastener 542. The upper flange 510 may be disposed within the first mounting assembly 238 and configured to move vertically therein to move the first lifting pin 162. Thus, in some embodiments, one of the first lifting pins 162 may be aligned with the shaft 516 of the actuator 130.

[0046] In some embodiments, the linear guide bracket 520 is coupled to the actuator 130. The linear guide bracket 520 may include slots or protrusions configured to engage with corresponding features of the base 302 of the first lifter 210 to facilitate linear vertical movement of the first lifter 210 and advantageously facilitate all linear vertical movement of the plurality of first lift pin assemblies 138 and the plurality of second lift pin assemblies 148 by extension.

[0047] Figure 6 depicts an isometric side view of a portion of a lifting device 126 according to at least some embodiments of this disclosure. In some embodiments, a lifting assembly 146 of the lifting device 126 includes a first lifter 210 and a second lifter 610. In some embodiments, the first lifter 210 is coupled to an actuator 130 and each of a plurality of second lift pin assemblies 148. In some embodiments, the second lifter 610 is coupled to each of a plurality of first lift pin assemblies 138. In some embodiments, the second lifter 610 is disposed above the first lifter 210 such that a gap 618 exists between the first lifter 210 and the second lifter 610 when the first lifter 210 is in a lower position, and the first lifter 210 is configured to raise the second lifter 610 when the first lifter 210 moves to an upper position. In some embodiments, the gap 618 is similar in distance to the gap 112. The dual lifter configuration of Figure 6 (e.g., first lifter 210 and second lifter 610) advantageously allows the second lifter 166 to be raised by a distance of gap 618 before the first lifter 162 is raised. Therefore, the gap 112 between the first lifter 162 and the upper surface of the base 150 can be advantageously minimized to reduce the risk of arcing, while allowing the shadow ring 134 to be raised above the substrate 122 during use.

[0048] The second lifter 610 typically includes a base 608 and one or more branches 606 extending from the base 608. In some embodiments, one of a plurality of first lift pin assemblies 138 is coupled to the base 608 and extends through an opening 632 in the base 608, and two other first lift pin assemblies are coupled at corresponding ends of two corresponding branches of the one or more branches 606. In some embodiments, the upper surface 622 of the one or more branches 606 of the second lifter 610 tapers downward and outward from the base 608. In some embodiments, the lower surface of the second lifter 610 is substantially flat. In some embodiments, the upper surface 616 of the first lifter 210 is substantially flat to advantageously provide a good contact surface with the substantially flat lower surface of the second lifter 610. In some embodiments, the one or more branches 606 may include one or more bends.

[0049] Figure 7 depicts an isometric cross-sectional view of a connection interface 700 between a lifter (e.g., a first lifter 210, a second lifter 610) and a lift pin assembly (e.g., a first lift pin assembly 138, a second lift pin assembly 148) according to at least some embodiments of this disclosure. For example, in some embodiments, the second lift pin assembly 148 is coupled to an end 710 of one of a plurality of branches 306 via a fastener 708. The fastener 708 may extend through the end 710 and into an opening 718 in the lift rod 246 of the second lift pin assembly 148. In some embodiments, the end 710 includes a slot 706 for receiving the fastener 708. A spacer 712 may be provided between the lower surface of the end 710 and the head of the fastener 708. In some embodiments, the fastener 708 includes a channel 724 to prevent air from being trapped in the opening 718. In some embodiments, the spacer 712 may be a stepped spacer, which includes a tubular portion 722 extending through the slot 706 around the fastener.

[0050] In some embodiments, a washer 726 may be disposed between the lower surfaces of the fastener 708 and the end 710, for example, between the spacer 712 and the head 728 of the fastener 708, to advantageously increase the rigidity of the connection interface 700 to minimize vibration between the end 710 and the second lift pin assembly 148. In some embodiments, the washer 726 is configured to bias the head 728 of the fastener 708 against the end 710 when the fastener is tightened, thereby increasing the rigidity of the connection between them. The washer 726 may be a simple flat washer, a spring washer, a spring, or the like. For example, the washer 726 may be a tapered spring washer or a disc spring washer. In some embodiments, a washer 714 is disposed between the upper surfaces of the lift rod 246 and the end 710 to increase the rigidity of the connection interface 700 and protect the lift rod 246 during tightening.

[0051] Although the foregoing relates to embodiments of this disclosure, other and further embodiments of this disclosure may be designed without departing from its basic scope. [Simplified Explanation of the Diagram]

[0009] The embodiments of this disclosure, which are briefly summarized above and discussed in more detail below, can be understood by referring to the illustrative embodiments of this disclosure depicted in the accompanying drawings. However, the accompanying drawings only show typical embodiments of this disclosure and should therefore not be considered as limiting the scope, as other equivalent embodiments are permitted in this disclosure.

[0010] Figure 1A depicts a schematic side view of a processing chamber in a first position according to at least some embodiments of this disclosure.

[0011] Figure 1B depicts a schematic side view of a processing chamber in a second position according to at least some embodiments of this disclosure.

[0012] Figure 2 depicts a schematic side view of a portion of a lifting device according to at least some embodiments of this disclosure.

[0013] Figure 3 depicts a bottom isometric view of a lifting device according to at least some embodiments of this disclosure.

[0014] Figure 4 depicts a bottom isometric view of a lifting device according to at least some embodiments of this disclosure.

[0015] Figure 5 depicts a cross-sectional view of a portion of a lifting device according to at least some embodiments of this disclosure.

[0016] Figure 6 depicts an isometric view of a portion of a lifting device according to at least some embodiments of this disclosure.

[0017] Figure 7 depicts an isometric cross-sectional view of the connection interface between the lifter and the lift pin assembly according to at least some embodiments of this disclosure.

[0018] For ease of understanding, the same element symbols are used to represent common elements in the drawings where possible. The drawings are not drawn to scale and may be simplified for clarity. Elements and features of one embodiment may be advantageously incorporated into other embodiments without further description. [Biomaterial Storage]

[0053] Domestic storage information (please note in order of storage institution, date, and number): None. International storage information (please note in order of storage country, institution, date, and number): None.

Claims

1. A lifting device for use in a substrate processing chamber, comprising: a plurality of first lifting pin assemblies configured to raise or lower a substrate having a given diameter when a substrate is disposed thereon, wherein each of the first lifting pin assemblies includes a first lifting pin disposed on a first bellows assembly; a plurality of second lifting pin assemblies arranged in a circle having a diameter greater than the given diameter and configured to raise or lower an annular chamber member, wherein each of the second lifting pin assemblies includes a second lifting pin disposed on a second bellows assembly; an actuator; and a lifting assembly coupled to the actuator and configured to raise or lower each of the first lifting pin assemblies and the second lifting pin assemblies by movement of the actuator.

2. The lifting device as claimed in claim 1, wherein the lifting assembly includes a first lifter coupled to the first lifting pin assemblies and the second lifting pin assemblies.

3. The lifting device as claimed in claim 2, wherein the first lifter includes a base having an opening, and a shaft of the actuator extends into the opening of the base.

4. The lifting device as claimed in claim 2, wherein the first lifter includes a base and a plurality of branches extending from the base to the first lifting pin assemblies and the second lifting pin assemblies.

5. The lifting device as claimed in claim 4, wherein one or more of the plurality of branches includes a fork member, wherein a first fork finger of the fork member is coupled to one of the first lifting pin assemblies, and wherein a second fork finger of the fork member is coupled to one of the second lifting pin assemblies.

6. The lifting device as claimed in claim 4, wherein one or more of the plurality of branches extend from the base to one of the plurality of first lifting pin assemblies and to one of the plurality of second lifting pin assemblies.

7. The lifting device as claimed in claim 4, wherein one of the plurality of first lifting pin assemblies is coupled to the base of the first lifter.

8. The lifting device as claimed in any one of claims 2-7, wherein the lifting assembly includes a second lifter disposed above the first lifter and coupled to each of the first lifting pin assemblies, wherein when the lifting assembly is in a lower position, there is a gap between the first lifter and the second lifter, and wherein the first lifter is configured to raise the second lifter when the first lifter moves to an upper position.

9. The lifting device as claimed in any one of claims 1-7, further comprising a linear guide bracket coupled to the actuator, wherein the lifting assembly is configured to engage with the linear guide bracket to facilitate linear vertical movement of the lifting assembly.

10. A substrate support for use in a substrate processing chamber, comprising: a base plate; a dielectric plate coupled to the base plate and having a support surface for supporting a substrate and having one or more clamping electrodes disposed therein; and a lifting device comprising: a plurality of first lifting pin assemblies having a plurality of first lifting pins extending through the base plate and the dielectric plate to raise or lower the substrate when the substrate is disposed thereon; a plurality of second lifting pin assemblies having a plurality of second lifting pins extending through the base plate and configured to raise or lower an annular chamber member disposed above the substrate; an actuator; and a lifting assembly coupled to the actuator and configured to raise or lower each of the first lifting pin assemblies and the second lifting pin assemblies by movement of the actuator.

11. The substrate support as claimed in claim 10, wherein the lifting assembly includes a first lifter, wherein the first lifter includes a base and a plurality of branches extending from the base, wherein each branch is coupled to one of the second lifting pin assemblies.

12. The substrate support as claimed in claim 11, wherein the plurality of branches includes two branches each coupled to one of the first lift pin assemblies and one of the second lift pin assemblies, and a third branch coupled to a third of the plurality of second lift pin assemblies.

13. The substrate support as claimed in claim 11, wherein the lifting assembly includes a second lifter disposed above the first lifter and having a second base disposed around the actuator and a plurality of second branches coupled to the plurality of first lifting pin assemblies, wherein a gap exists between the first lifter and the second lifter when the first lifter is in a position, and wherein the first lifter is configured to raise the second lifter when the first lifter moves to an upper position.

14. The substrate support as described in any one of claims 10-13, wherein the plurality of second lift pins are configured to extend above the dielectric plate beyond the plurality of first lift pins.

15. The substrate support as described in any one of claims 10-13 further includes a cooling plate disposed between the dielectric plate and the base plate.

16. A processing chamber for processing a substrate, comprising: a chamber body defining an internal volume therein; a substrate support disposed in the internal volume of the chamber body, wherein the substrate support includes: a base for supporting the substrate; and a lifting device including: a plurality of first lifting pin assemblies having a plurality of first lifting pins extending through the base and configured to raise or lower a substrate; a plurality of second lifting pin assemblies having a plurality of second lifting pins extending radially outward of the plurality of first lifting pins through the base; an actuator; and a lifting assembly coupled to the actuator and configured to raise or lower each of the first lifting pin assemblies and the second lifting pin assemblies by movement of the actuator; and a shadow ring disposed on the plurality of second lifting pins.

17. The processing chamber as claimed in claim 16, wherein the plurality of second lifting pins are configured to support the shadow ring above a support surface of the base.

18. The processing chamber as claimed in claim 16, wherein the lifting assembly includes a first lifter having a base and a plurality of branches extending from the base to the plurality of first lifting pin assemblies and the plurality of second lifting pin assemblies.

19. The processing chamber as claimed in claim 16, wherein the lifting assembly includes a first lifter coupled to the plurality of second lift pin assemblies and a second lifter coupled to the plurality of first lift pin assemblies.

20. The processing chamber as described in any one of claims 16-19, wherein the actuator is a pneumatic actuator.

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