Substrate adsorption component, elastic sealing assembly, top ring, and substrate processing apparatus

Abstract

By means of the present invention, the substrate can be reliably adsorbed regardless of the flatness of the adsorption surface of the substrate. The substrate adsorption member 330 of the present invention includes: a porous member 334 having a substrate adsorption surface 334a for adsorbing the substrate WF and a pressure reducing portion 334b ​​communicating with a pressure reducing means; a shielding member 332 having a first shielding member 332-1 and a frame-shaped second shielding member 332-2, the first shielding member 332-1 shielding the surface 334c of the porous member 334 opposite to the substrate adsorption surface 334a, and the second shielding member 332-2 shielding at least a portion of the side surface 334d of the porous member 334; and a frame-shaped elastic sealing member 336, which is mounted on the second shielding member 332-2 in a manner that surrounds the porous member 334 and has a contact surface 336a that contacts the substrate WF.

Description

[Technical Field]

[0001] This case relates to a substrate adsorption component, an elastic sealing assembly, a top ring, and a substrate processing apparatus. [Previous Technology]

[0002] In the manufacture of semiconductor devices, chemical mechanical polishing (CMP) equipment is used to planarize the surface of the substrate. The substrates used in the manufacture of semiconductor devices are mostly circular. Furthermore, not limited to semiconductor devices, the requirements for flatness are also increased when planarizing the surfaces of quadrilateral substrates such as copper laminate substrates (CCL), printed circuit boards (PCBs), photomask substrates, and display panels. Furthermore, the requirements for planarizing the surfaces of packaging substrates such as PCBs containing electronic components are also increased.

[0003] A substrate processing apparatus, such as a chemical mechanical polishing (CMP) apparatus, includes a top ring for holding the substrate. For example, as described in Patent Document 1, the top ring includes a rotating shaft, a flange connected to the rotating shaft, a porous adsorption plate fitted with an opening formed at the center of the bottom surface of the flange, and a shielding plate attached to the upper surface of the adsorption plate. The top ring is configured such that the substrate is adsorbed through the micropores of the adsorption plate by vacuum suction, and the substrate is pressed onto the polishing pad by applying pressure to the shielding plate. [Prior Art Documents] [Patent Documents]

[0004] [Patent Document 1] Japanese Patent No. 3668529 [Summary of the Invention]

[0005] [The problem that the invention is intended to solve]

[0006] The top ring of the conventional technology described in Patent Document 1 still has room for improvement in terms of "being able to reliably adsorb the substrate regardless of the flatness of the adsorbed surface of the substrate".

[0007] That is, in the case of a conventional top ring, when the adsorption surface of the substrate is flat, the substrate can be adsorbed onto the adsorption plate by vacuum attraction. In contrast, when the adsorption surface is uneven, such as when there is a depression on the outer periphery of the adsorption surface of the substrate, air leakage occurs due to the gap created by the depression, resulting in a weaker adsorption force, and as a result, the substrate may not be able to be adsorbed onto the adsorption plate.

[0008] Therefore, one of the objectives of this invention is to reliably adsorb the substrate regardless of the flatness of the adsorption surface. [Technical Means for Solving the Problem]

[0009] According to one embodiment, a substrate adsorption member is disclosed, comprising: a porous member having a substrate adsorption surface for adsorbing a plate and a pressure reducing portion communicating with a pressure reducing means; a shielding member having a first shielding member and a frame-shaped second shielding member, the first shielding member shielding the surface of the porous member opposite to the substrate adsorption surface, and the second shielding member shielding at least a portion of one side surface of the porous member; and a frame-shaped elastic sealing member mounted on the second shielding member and surrounding the porous member, having a contact surface that contacts the substrate.

Implementation Method

[0011] Embodiments of the substrate adsorption member, elastic sealing assembly, top ring, and substrate processing apparatus of the present invention will be described below with reference to the accompanying drawings. In the accompanying drawings, the same or similar elements are given the same or similar reference numerals, and in the description of each embodiment, repeated descriptions of the same or similar elements are sometimes omitted. Furthermore, the features shown in each embodiment can also be applied to other embodiments, provided they do not contradict each other.

[0012] Figure 1 is a top view showing the overall configuration of a substrate processing apparatus 1000 according to one embodiment. The substrate processing apparatus 1000 shown in Figure 1 includes a loading unit 100, a transport unit 200, a polishing unit 300, a drying unit 500, and an unloading unit 600. In the illustrated embodiment, the transport unit 200 has two transport units 200A and 200B, and the polishing unit 300 has two polishing units 300A and 300B. In one embodiment, each of these units can be formed independently. By forming these units independently, the number of units can be arbitrarily combined to easily form substrate processing apparatuses 1000 with different configurations. Furthermore, the substrate processing apparatus 1000 includes a control device 900, and each component of the substrate processing apparatus 1000 is controlled by the control device 900. In one embodiment, the control device 900 can be a general-purpose computer equipped with input / output devices, a calculation device, a memory device, etc. <Loading Unit>

[0013] The loading unit 100 is a unit used to import the substrate WF before it undergoes grinding and cleaning into the substrate processing apparatus 1000. In one embodiment, the loading unit 100 is configured according to the mechanical device interface specification (IPC-SMEMA-9851) of the Surface Mount Equipment Manufacturers Association (SMEMA).

[0014] In the embodiment shown in the figure, the transport mechanism of the loading unit 100 has a plurality of transport rollers 202 and a plurality of rollers 204 on which the transport rollers 202 are mounted. In the embodiment shown in FIG1, three transport rollers 202 are mounted on each roller 204. The substrate WF is disposed on the transport rollers 202 and is transported by rotating the transport rollers 202. The mounting position of the transport rollers 202 on the rollers 204 can be arbitrary as long as it is a position that can stably transport the substrate WF. However, since the transport rollers 202 are in contact with the substrate WF, they should be arranged in such a way that there is no problem in contacting the transport rollers 202 even if they come into contact with the substrate WF to be processed. In one embodiment, the transport rollers 202 of the loading unit 100 may be made of a conductive polymer. In one embodiment, the transport rollers 202 are electrically grounded through the rollers 204. This is to prevent the substrate WF from becoming charged and being damaged. Furthermore, in one embodiment, the loading unit 100 is equipped with an ionizer (not shown in the figure) to prevent the substrate WF from becoming charged. <Transportation Unit>

[0015] The substrate processing apparatus 1000 shown in FIG1 includes two transport units 200A and 200B. The two transport units 200A and 200B may have the same configuration, so they will be referred to as transport unit 200 below.

[0016] The conveying unit 200 shown in the figure includes a plurality of conveying rollers 202 for conveying a substrate WF. By rotating the conveying rollers 202, the substrate WF on the conveying rollers 202 can be conveyed in a predetermined direction. The conveying rollers 202 of the conveying unit 200 can be formed of a conductive polymer or a non-conductive polymer. The conveying rollers 202 are driven by a motor not shown in the figure. The substrate WF is conveyed by the conveying rollers 202 to the substrate receiving position.

[0017] In one embodiment, the transport unit 200 includes a cleaning nozzle 284. The cleaning nozzle 284 is connected to a cleaning fluid supply source (not shown in the figure). The cleaning nozzle 284 is configured to supply cleaning fluid to the substrate WF transported by the transport roller 202. <Polishing Unit>

[0018] Figure 2 is a perspective view schematically showing the configuration of a polishing unit 300 in one embodiment. The substrate processing apparatus 1000 shown in Figure 1 includes two polishing units 300A and 300B. The two polishing units 300A and 300B may have the same configuration, so they will be referred to as polishing unit 300 below for explanation.

[0019] As shown in FIG. 2, the polishing unit 300 includes: a polishing platform 350; a top ring 302, and a polishing head that holds the substrate, which is the object to be polished, and presses it onto the polishing surface of the polishing platform 350. The polishing platform 350 is connected to a polishing platform rotary motor (not shown) disposed below it via a platform shaft 351, and can rotate around the platform shaft 351. A polishing pad 352 is attached to the upper surface of the polishing platform 350, and the surface 352a of the polishing pad 352 constitutes the polishing surface of the substrate. In one embodiment, the polishing pad 352 may also be attached with a layer that facilitates peeling from the polishing platform 350. Such a layer may be, for example, a polysiloxane layer or a fluoropolymer resin layer, and may also use, for example, those described in Japanese Patent Application Publication No. 2014-176950.

[0020] A polishing slurry supply nozzle 354 is disposed above the polishing platform 350, thereby supplying polishing slurry to the polishing pad 352 on the polishing platform 350. Furthermore, as shown in FIG2, the polishing platform 350 and platform shaft 351 are provided with a passage 353 for supplying polishing slurry. The passage 353 communicates with an opening 355 on the surface of the polishing platform 350. A through hole 357 is formed on the polishing pad 352 at a position corresponding to the opening 355 of the polishing platform 350, allowing polishing slurry to be supplied from the opening 355 of the polishing platform 350 and the through hole 357 of the polishing pad 352 to the surface of the polishing pad 352 through the passage 353. Additionally, the opening 355 of the polishing platform 350 and the through hole 357 of the polishing pad 352 may be one or multiple. Furthermore, the positions of the opening 355 of the grinding platform 350 and the through hole 357 of the grinding pad 352 are arbitrary, but in one embodiment they are arranged near the center of the grinding platform 350.

[0021] Although not shown in Figure 2, in one embodiment, the grinding unit 300 includes a sprayer 358 for spraying liquid or a mixture of liquid and gas toward the grinding pad 352 (see Figure 1). The liquid sprayed from the sprayer 358 is, for example, pure water, and the gas is, for example, nitrogen.

[0022] The top ring 302 is connected to the top ring shaft 18, which moves up and down relative to the swing arm 360 via a vertical movement mechanism 319. This vertical movement of the top ring shaft 18 allows the top ring 302 to move up and down relative to the swing arm 360 and be positioned. The top ring shaft 18 is driven to rotate by a top ring rotary motor (not shown in the figure). This rotation of the top ring shaft 18 allows the top ring 302 to rotate around the top ring shaft 18 as a center.

[0023] The top ring 302 has a bottom surface that can hold a quadrilateral substrate. The swing arm 360 is configured to rotate around the pivot 362. The top ring 302 can move between the substrate receiving position of the transport unit 200 and the top of the polishing platform 350 by rotating the swing arm 360. By lowering the top ring shaft 18, the top ring 302 can be lowered to press the substrate onto the surface (polishing surface) 352a of the polishing pad 352. At this time, the top ring 302 and the polishing platform 350 are rotated respectively, and polishing liquid is supplied to the polishing pad 352 from the polishing liquid supply nozzle 354 provided above the polishing platform 350 and / or the opening 355 provided on the polishing platform 350. In this way, the substrate WF can be pressed against the polishing surface 352a of the polishing pad 352 to polish the surface of the substrate. In the polishing of the substrate WF, the top ring 302 can also be used to fix or swing the arm 360 by passing the center of the polishing pad 352 (in a way that covers the through hole 357 of the polishing pad 352).

[0024] The up-and-down moving mechanism 319, which moves the top ring shaft 18 and the top ring 302 up and down, includes: a bridging part 28, which rotatably supports the top ring shaft 18 via a bearing 321; a ball screw 32, which is mounted on the bridging part 28; a support platform 29, which is supported by a support column 130; and an AC servo motor 38, which is mounted on the support platform 29. The support platform 29, which supports the servo motor 38, is fixed to the swing arm 360 via the support column 130.

[0025] The ball screw 32 includes a screw shaft 32a connected to the servo motor 38 and a nut 32b screwed into the screw shaft 32a. The top ring shaft 18 and the bridging portion 28 are integrated and move up and down. Therefore, if the servo motor 38 is driven, the bridging portion 28 moves up and down through the ball screw 32, thereby causing the top ring shaft 18 and the top ring 302 to move up and down.

[0026] One embodiment of the grinding unit 300 includes a dressing unit 356 that dresses the grinding surface 352a of the grinding pad 352. This dressing unit 356 includes: a dresser 50, which slides in contact with the grinding surface 352a; a dresser shaft 51 connected to the dresser 50; a cylinder 53 disposed at the upper end of the dresser shaft 51; and a swing arm 55 that rotatably supports the dresser shaft 51. The lower part of the dresser 50 is composed of a dressing member 50a, the bottom surface of which is coated with needle-shaped diamond particles. The cylinder 53 is mounted on a support platform 57 supported by pillars 56, which are fixed to the swing arm 55.

[0027] The swing arm 55 is driven by a motor not shown in the figure, and is configured to rotate around the support shaft 58. The dresser shaft 51 is driven by a motor not shown in the figure to rotate, and the dresser 50 rotates around the dresser shaft 51 by the rotation of the dresser shaft 51. The cylinder 53 moves the dresser 50 up and down through the dresser shaft 51, and presses the dresser 50 against the grinding surface 352a of the grinding pad 352 with a predetermined pressing force.

[0028] The dressing of the grinding surface 352a of the grinding pad 352 is performed in the following manner. The dressing device 50 is pressed against the grinding surface 352a by the cylinder 53, and at the same time, pure water is supplied to the grinding surface 352a from a pure water supply nozzle (not shown in the figure). In this state, the dressing device 50 rotates around the dressing device shaft 51, causing the bottom surface (diamond particle) of the dressing member 50a to slide against the grinding surface 352a. In this way, the grinding surface 352a is dressed by grinding the grinding pad 352 with the dressing device 50. <Drying Unit>

[0029] The drying unit 500 is an apparatus for drying the substrate WF. In the substrate processing apparatus 1000 shown in FIG. 1, the drying unit 500 dries the substrate WF that has been cleaned by the cleaning section of the transport unit 200 after grinding by the grinding unit 300. As shown in FIG. 1, the drying unit 500 is disposed downstream of the transport unit 200. The drying unit 500 has a nozzle 530, which is used to spray gas toward the substrate WF being transported on the transport roller 202. The gas can be, for example, compressed air or nitrogen. By blowing away water droplets on the transported substrate WF by the drying unit 500, the substrate WF can be dried. <Unloading Unit>

[0030] The unloading unit 600 is used to transport the substrate WF after grinding and cleaning to the outside of the substrate processing apparatus 1000. In the substrate processing apparatus 1000 shown in FIG1, the unloading unit 600 receives the substrate after drying by the drying unit 500. As shown in FIG1, the unloading unit 600 is disposed downstream of the drying unit 500. In one embodiment, the unloading unit 600 is configured according to the mechanical device interface specification (IPC-SMEMA-9851) of the Surface Mount Equipment Manufacturers Association (SMEMA). <Top Ring>

[0031] Next, a top ring 302 in an embodiment of the grinding unit 300 will be described. Figure 3A is a schematic cross-sectional view of a top ring of an embodiment. Figure 3B is a schematic top view of a top ring of an embodiment. As shown in Figures 3A and 3B, the top ring 302 includes a top ring shaft (rotation shaft) 18 and a base member 301 connected to the top ring shaft 18. The base member 301 specifically includes: a flange 303 connected to the top ring shaft 18; a plate-shaped spacer 305 disposed in a rectangular recess formed in the center of the bottom surface of the flange 303; and a plate-shaped carrier 306 disposed at the lower part of the flange 303 and the spacer 305.

[0032] Furthermore, the top ring 302 includes a substrate adsorption member 330 for adsorbing the back side of the substrate WF, which is in a state where the surface being polished is facing downwards. The substrate adsorption member 330 is mounted on the bottom surface of the carrier 306. The substrate adsorption member 330 includes a porous member 334. The porous member 334 can be any member that can be vacuum-adsorbed by using a vacuum source 31 to create a vacuum. Examples include resin porous materials formed by forming a large number of fine pores in resins such as PE (polyethylene), PP (polypropylene), PTFE (polytetrafluoroethylene), or PVC (polyvinyl chloride). In this embodiment, the porous member 334 is formed in the shape of a plate, having a substrate adsorption surface 334a for adsorbing the substrate WF and a vacuum reduction portion 334b ​​communicating with the vacuum source 31.

[0033] Furthermore, the substrate adsorption member 330 includes a shielding member 332. The shielding member 332 can be any airtight member capable of shielding gas flow, such as a soft resin plate made of PE (polyethylene), PP (polypropylene), PTFE (polytetrafluoroethylene), or PVC (polyvinyl chloride). In this embodiment, the shielding member 332 has: a plate-shaped first shielding member 332-1 that shields the surface 334c of the porous member 334 opposite to the substrate adsorption surface 334a; and a second shielding member 332-2 disposed at the periphery of the bottom surface of the first shielding member 332-1. In this embodiment, the second shielding member 332-2 is a frame-shaped member that shields a portion of the side surface 334d of the porous member 334, but is not limited thereto; it can also be a frame-shaped member that completely shields the side surface 334d of the porous member 334. The first shielding member 332-1 and the second shielding member 332-2 may be integrally formed. The first shielding member 332-1 has an attraction hole 335 formed therein, which is connected to the porous member 334. The pressure-reducing part 334b ​​is disposed at a position corresponding to the attraction hole 335 on the surface 334c of the porous member 334 opposite to the substrate adsorption surface 334a.

[0034] In this embodiment, it is required that when the substrate WF is adsorbed and held on the top ring 302 of the porous member 334, the substrate WF can be reliably adsorbed regardless of the flatness of the adsorbed surface. That is, if the adsorbed surface of the substrate WF is flat, the substrate WF can be easily adsorbed onto the porous member 334 by vacuum suction. However, if the adsorbed surface is uneven, such as a recess in the outer periphery of the adsorbed surface of the substrate WF, air leakage will occur from the gap created by the recess, the adsorption force will weaken, and as a result, the substrate WF may not be able to be adsorbed onto the porous member 334.

[0035] Therefore, as shown in Figures 3A and 3B, the substrate adsorption member 330 of this embodiment includes a frame-shaped elastic sealing member 336, which is mounted on the bottom surface of the second shielding member 332-2 in a manner that surrounds the porous member 334. The elastic sealing member 336 can be mounted on the bottom surface of the second shielding member 332-2 by any means, such as double-sided tape. The elastic sealing member 336 can be any member that is elastic and can shield airflow. For example, the elastic sealing member 336 can be a soft member that is chemically resistant, has good elasticity, and has a leather-like surface. That is, a typical soft member has numerous pores on its surface that allow gas to pass through, and is therefore insufficient as a sealing member. Therefore, as an example of the elastic sealing member 336, an extruded foam material can be used. In this way, the surface of the elastic sealing member 336 becomes a leather-like surface, which can shield airflow and has good elasticity. Furthermore, the elastic sealing member 336 has a contact surface 336a that contacts the substrate WF when adsorbing it. The contact surface 336a protrudes from the substrate adsorption surface 334a of the porous member 334 in the state not in contact with the substrate WF, as shown in FIG. 3A. The preferred material for the elastic sealing member 336 is polysiloxane sponge, and polysiloxane rubber is also preferred. Alternatively, soft NORSEAL made of polyvinyl chloride can also be used.

[0036] Figure 4 is a schematic cross-sectional view of a top ring and a substrate in one embodiment. Figure 4 shows the state in which the top ring of the substrate is held in the grinding position on the grinding platform 350 by the receiving means (not shown) at the aforementioned substrate receiving position (not shown). As shown in Figure 4, when the substrate adsorption member 330 adsorbs the substrate WF, the substrate WF contacts the contact surface 336a of the elastic sealing member 336. Here, because the elastic sealing member 336 has good extensibility, it is pressed and contracted by the substrate WF when adsorbing the substrate WF, thereby sealing the surrounding environment of the top ring 302 with the porous member 334. In addition, if the adsorption of the substrate WF is released and the substrate WF leaves, the elastic sealing member 336 returns to its original shape.

[0037] According to this embodiment, as shown in FIG4, even if a portion of the outer periphery of the adsorbed surface of the substrate WF is recessed to form a step WFa, the presence of the elastic sealing member 336 prevents air leakage from the gap created by the step WFa. Therefore, according to this embodiment, regardless of the flatness of the adsorbed surface of the substrate WF, the substrate WF can be reliably adsorbed onto the substrate adsorption member 330.

[0038] Furthermore, according to this embodiment, when the porous member 334 is evacuated by the decompression means (vacuum source) 31, air leakage from the gap generated by the step WFa can be prevented, thus efficiently forming a negative pressure on the substrate adsorption surface 334a. This reliably adsorbs the substrate WF onto the substrate adsorption member 330, eliminating the need for a retainer member around the substrate WF and preventing the substrate WF from flying out (slipping out) during polishing. Especially in recent years, with the thinning of substrate WF, there is a concern that the substrate WF may slip out during polishing when a retainer member is provided. Furthermore, if the substrate WF is angular, there is a concern that the corner of the substrate WF may come into contact with the retainer member during polishing, potentially causing damage to the substrate WF or the top ring. In contrast, according to this embodiment, the substrate WF can be vacuum-adsorbed by the substrate adsorption member 330 and pressed onto the polishing pad 352, thus preventing the substrate WF from slipping out during polishing and preventing the substrate WF or the top ring from breaking during polishing.

[0039] Furthermore, Figure 4 illustrates an example where a portion of the outer periphery of the adsorbed surface of the substrate WF is recessed, but this is not the only example. According to this embodiment, even when the adsorbed surface of the substrate WF is flat, the substrate WF can still be reliably adsorbed onto the substrate adsorption member 330. That is, in this embodiment, the substrate adsorption surface 334a of the porous member 334 formed by the second shielding member 332-2 is more prominent than the mounting surface 332-2a of the elastic sealing member 336 of the second shielding member 332-2. In other words, the mounting surface 332-2a of the elastic sealing member 336 of the second shielding member 332-2 is more recessed than the substrate adsorption surface 334a of the porous member 334. The elastic sealing member 336 is configured to surround the side of the porous member 334 that protrudes beyond the mounting surface 332-2a of the second shielding member 332-2. Therefore, when the substrate WF is flat and adsorbed, the contact surface 336a of the elastic sealing member 336, which is pressed and contracted by the substrate WF, and the substrate adsorption surface 334a of the porous member 334 become the same plane, so the substrate WF can be reliably adsorbed onto the substrate adsorption member 330.

[0040] Furthermore, in this embodiment, when an elastic sealing member 336 is used that contacts the substrate WF, there is a concern that even if the substrate WF is released from its adsorption, it may not detach from the elastic sealing member 336. In this regard, because the surface of the elastic sealing member 336 becomes a skin-like surface, it becomes easier to release the substrate WF when it is released from its adsorption. In addition, to prevent the contact surface 336a of the elastic sealing member 336 from naturally adhering and fixing to the substrate WF (avoiding blooming), a fluoropolymer coating, such as a coating using TEFLON (registered trademark) made of polytetrafluoroethylene, can be performed. Furthermore, the contact surface 336a of the elastic sealing member 336 can also be coated by impregnation.

[0041] Furthermore, according to this embodiment, by providing the elastic sealing member 336, the surrounding environment of the top ring 302 and the porous member 334 can be sealed. Therefore, it is possible to prevent the polishing slurry from flowing into the substrate adsorption surface 334a of the porous member 334. As a result, it is possible to prevent the abrasive particles contained in the polishing slurry from clogging the pores of the porous member 334, thereby preventing a decrease in the adsorption performance of the substrate adsorption member 330 and an adverse effect on the lifespan of the substrate adsorption member 330.

[0042] Furthermore, the top ring 302 of this embodiment has means for responding to abrasive particles entering the pores of the porous member 334. Figure 5 is a schematic cross-sectional view of the top ring of one embodiment. As shown in Figure 5, the top ring 302 has an abrasive cleaning member 33. The abrasive cleaning member 33 is configured such that, through a flow path 333 formed on the substrate member 301 and the shielding member 332, a fluid such as air or pure water is supplied to the surface 334c of the porous member 334 opposite to the substrate adsorption surface 334a. By supplying fluid to the surface 334c of the porous member 334 opposite to the substrate adsorption surface 334a, the abrasive particles SL blocking the pores of the porous member 334 can be flushed away. The cleaning step of this porous component 334 can also be performed after the grinding step, simultaneously with the step of "releasing the substrate WF from the top ring 302 by means of a receiving means (not shown) at the substrate receiving position (not shown) to release the substrate WF from the top ring 302".

[0043] Next, a modified example of the top ring 302 will be described. FIG6 is a cross-sectional view showing a portion of the top ring of one embodiment enlarged and schematically displayed. The configuration other than the substrate adsorption member 330 is the same as that of the embodiments in FIG3 to FIG5, so the description is omitted. As shown in FIG6, the elastic sealing member 336 may be configured to include a first elastic sealing member 336-1 and a second elastic sealing member 336-2. The first elastic sealing member 336-1 surrounds the side of the porous member 334 that protrudes further than the mounting surface 332-2a of the second shielding member 332-2. The second elastic sealing member 336-2 is disposed outside the first elastic sealing member 336-1 at a distance.

[0044] The first elastic sealing member 336-1 can be any member capable of shielding airflow, and it has a contact surface 336-1a that contacts the substrate WF. The second elastic sealing member 336-2 can be any member capable of shielding the flow of polishing fluid, and it has a contact surface 336-2a that contacts the substrate WF. According to this embodiment, a more reliable seal can be achieved to prevent polishing fluid and gas from flowing into the porous member 334. As a result, air leakage can be prevented relative to the porous member 334, and abrasive particles can be prevented from clogging the pores of the porous member 334, so the substrate WF can be reliably adsorbed onto the substrate adsorption member 330.

[0045] Next, another variation of the top ring 302 will be described. FIG7 is an enlarged and schematic cross-sectional view of a portion of the top ring of one embodiment. As shown in FIG7, the shielding member 332 further includes a frame-shaped third shielding member 332-3, which is disposed on the lower outer periphery of the second shielding member 332-2. The third shielding member 332-3 is disposed on the outside of the elastic sealing member 336 with a gap. The third shielding member 332-3 forms a gap 338 between the bottom surface of the third shielding member 332-3 and the substrate WF. Furthermore, the first shielding member 332-1 and the second shielding member 332-2 have a fluid passage 332a, which is used to discharge fluid to the space 337 between the elastic sealing member 336 and the third shielding member 332-3. The top ring 302 has a fluid supply member 34, which is configured to supply fluid (e.g., air) to the space 337 through the fluid passage 332a.

[0046] Fluid supplied from the fluid supply member 34 to the space 337 through the fluid passage 332a is ejected to the outside from the gap 338 between the bottom surface of the third shielding member 332-3 and the substrate WF. This prevents air and polishing fluid from flowing into the porous member 334 from the outside of the top ring 302. As a result, air leakage can be prevented from occurring in the porous member 334, and abrasive particles can be prevented from clogging the pores of the porous member 334, so the substrate WF can be reliably adsorbed onto the substrate adsorption member 330.

[0047] Next, the resilient sealing assembly of this embodiment will be described. In the above embodiment, an example is shown where the resilient sealing member 336 is mounted to the second shielding member 332-2 using double-sided adhesive or similar means; however, this is not the only limitation, and the resilient sealing assembly can also be mounted to the second shielding member 332-2. Figure 8 is a perspective view schematically showing the configuration of the resilient sealing assembly of one embodiment. Figure 9 is a perspective view schematically showing the configuration of the substrate adsorption member including the resilient sealing assembly of one embodiment.

[0048] Figures 8 and 9 are perspective views of the resilient sealing assembly and the substrate adsorption member viewed from the rear. As shown in Figures 8 and 9, the resilient sealing assembly 331 includes a frame-shaped fixing bracket 339. The fixing bracket 339 is a rigid member configured to surround the porous member 334 and be mounted on the second shielding member 332-2. Specifically, the fixing bracket 339 is composed of a rectangular frame 339a and a plurality of (12 in this embodiment) protrusions 339b. The frame 339a surrounds the side surface 334d of the porous member 334, and the plurality of protrusions 339b protrude outward from the frame 339a. Screw holes 339c are formed on the protrusions 339b for mounting the resilient sealing assembly 331 to the second shielding member 332-2 by bolts B. Furthermore, the resilient sealing assembly 331 includes an resilient sealing member 336 mounted on the fixing bracket 339. The resilient sealing member 336 has the same configuration as described in the above embodiments, therefore detailed description is omitted. The resilient sealing member 336 is installed in the mounting bracket 339 on the surface 339d opposite to the fixing surface of the second shielding member 332-2 by any means such as adhesive or double-sided tape. In the embodiment of FIG9, the bottom surface of the second shielding member 332-2 has a groove 332-2b, the shape of which corresponds to the resilient sealing assembly 331 (mounting bracket 339), and a mounting surface 332-2a is formed on the bottom surface of the groove 332-2b. The resilient sealing assembly 331 is embedded in the groove 332-2b and fixed to the second shielding member 332-2 by bolt B.

[0049] According to this embodiment, for example, when the elastic sealing member 336 reaches its service life due to wear, the elastic sealing member 336, as a consumable part, can be easily replaced. That is, as in the above embodiment, when the elastic sealing member 336 is directly installed on the second shielding member 332-2 using double-sided tape or the like, the elastic sealing member 336 is elastic and flexible, making it difficult to position and install. Especially at the site where the substrate processing apparatus 1000 is installed, in most cases, there are no installation jigs or the like prepared, and there are no operators with installation skills, so replacing the elastic sealing member 336 is not easy. In contrast, according to this embodiment, for example, in a manufacturing plant of the elastic sealing assembly 331, the elastic sealing assembly 331 is manufactured using a special jig or by an operator with installation skills, and then delivered to the installation site of the substrate processing apparatus 1000. In the elastic sealing assembly 331, the elastic sealing member 336 is already mounted on the rigid mounting bracket 339. Therefore, at the installation site of the substrate processing apparatus 1000, a general operator can easily install the elastic sealing assembly 331 onto the second shielding member 332-2 by means of bolts.

[0050] Furthermore, although this embodiment illustrates an example of fixing the elastic sealing assembly 331 to the second shielding member 332-2 using bolts, the fixing method is arbitrary. For example, magnets may be embedded in the frame 339a and the second shielding member 332-2 respectively, and the frame 339a and the second shielding member 332-2 may be fixed by magnetic force. In this case, the protrusion 339b may not be provided.

[0051] Next, another embodiment of the top ring will be described. Figure 10 is a schematic cross-sectional view of one embodiment of the top ring. As shown in Figure 10, the top ring 1302 includes a base member 1301 connected to the top ring shaft (rotation shaft) 1018. Specifically, the base member 1301 includes: a flange 1303 connected to the top ring shaft 1018; an upper guide member 1305 disposed at the lower part of the flange 1303; and a lower guide member 1306 disposed at the lower part of the upper guide member 1305. The upper guide member 1305 has a planar dimension smaller than that of the flange 1303 and protrudes downward from the bottom surface of the flange 1303. The lower guide member 1306 is disposed at the periphery of the bottom surface of the upper guide member 1305 to form a frame shape. In addition, the planar dimensions of the upper guide member 1305 or flange 1303 refer to the dimensions of the upper guide member 1305 or flange 1303 when viewed from above (along the direction of the top ring axis 1018).

[0052] Furthermore, the top ring 1302 includes a substrate adsorption member 1330 for adsorbing the back side of the substrate WF, which is in a state where the surface to be polished is facing down. The substrate adsorption member 1330 is disposed below the base member 1301. The substrate adsorption member 1330 includes a porous member 1334. The porous member 1334 is made of the same material as the porous member 334 of the above embodiment. The porous member 1334 has a substrate adsorption surface 1334a for adsorbing the substrate WF and a decompression portion 1334b communicating with the decompression means (vacuum source) 1031.

[0053] Furthermore, the substrate adsorption member 1330 includes a shielding member 1332. The shielding member 1332 is made of the same material as the shielding member 332 of the above embodiment. The shielding member 1332 has a plate-shaped first shielding member 1332-1 and a second shielding member 1332-2. The first shielding member 1332-1 shields the surface 1334c of the porous member 1334 opposite to the substrate adsorption surface 1334a. The second shielding member 1332-2 is provided at the periphery of the bottom surface of the first shielding member 1332-1. The shielding member 1332 is configured to shield a portion of the surface 1334c and the side surface 1334d of the porous member 1334 opposite to the substrate adsorption surface 1334a. The shielding member 1332 includes an attraction hole 1337 that is configured to communicate with the porous member 1334. The pressure-reducing part 1334b is located at the position where the suction hole 1337 is formed. In this embodiment, the suction hole 1337 is formed on the shielding member 1332 in a manner that communicates with the side surface 1334d of the porous member 1334, and the pressure-reducing part 1334b is located on the side surface 1334d. One end of the suction hole 1337 is connected to the side surface 1334d of the porous member 1334, and the other end is connected to the pressure-reducing means 1031 through the suction path 1312.

[0054] In this embodiment, the pressure-reducing portion 1334b is provided on the side surface 1334d of the porous member 1334, thus making the polishing profile of the substrate WF uniform. That is, where the pressure-reducing portion 1334b is provided, a vacuum is drawn by the pressure-reducing means 1031, thus creating a local negative pressure. Here, when the pressure-reducing portion 1334b is provided on the surface 1334c of the porous member 1334 opposite to the substrate adsorption surface 1334a, a local negative pressure is created at that location, making it difficult for pressure to be applied to the substrate WF compared to other locations, resulting in concerns that the polishing profile may become uneven. In contrast, in this embodiment, because the pressure-reducing portion 1334b is provided on the side surface 1334d of the porous member 1334, a local negative pressure is less likely to occur on the surface 1334c of the porous member 1334 opposite to the substrate adsorption surface 1334a, thus making the polishing profile of the substrate WF uniform.

[0055] As shown in FIG10, the substrate adsorption member 1330 includes a frame member 1344, which is disposed around the shielding member 1332 in a manner that surrounds at least a portion of the base member 1301 (specifically the upper guide member 1305 and the lower guide member 1306). The frame member 1344 includes a lower frame member 1343 that is frame-shaped on the periphery of the upper surface of the shielding member 1332 and a frame-shaped upper frame member 1342 disposed on the lower frame member 1343. The lower frame member 1343 and the shielding member 1332 are connected by a sealing material 1341. In addition, in this embodiment, the sealing material 1341 is formed as a thin film covering the upper surface of the substrate adsorption member 1330, but it is not limited to this, and may also be a frame-shaped material having only a periphery for sealing the lower frame member 1343 and the shielding member 1332.

[0056] The upper frame member 1342 includes a frame member protrusion 1342a that protrudes in the direction of the base member 1301 (specifically, the upper guide member 1305). Furthermore, the upper guide member 1305 includes a guide member protrusion 1305a that protrudes in the direction of the upper frame member 1342 at a different height position than the frame member protrusion 1342a. The frame member protrusion 1342a and the guide member protrusion 1305a overlap each other in a predetermined area when the top ring 1302 is viewed from above. Therefore, the contact between the frame member protrusion 1342a and the guide member protrusion 1305a can restrict the movement of the substrate adsorption member 1330 in the height direction.

[0057] The substrate adsorption member 1330 includes an elastic member 1340, which connects at least a portion of the substrate member 1301 surrounded by the frame member 1344 to the frame member 1344. Specifically, the elastic member 1340 is a frame-shaped plate member having: an inner end 1340a, sandwiched between the upper guide member 1305 and the lower guide member 1306; and an outer end 1340b, sandwiched between the lower frame member 1343 and the upper frame member 1342. The elastic member 1340 may be formed of rubber materials such as polysiloxane, EPDM (ethylene propylene diene rubber), and FKM (fluororubber), but is not limited thereto.

[0058] As shown in FIG. 10, the top ring 1302 includes an elastic membrane 1320, which forms a plurality of pressure chambers for pressurizing the substrate WF between the base member 1301 and the substrate adsorption member 1330. Specifically, the elastic membrane 1320 includes a film-shaped sealing material 1341 and multiple elastic membranes 1320-1, 1320-2, and 1320-3 of different areas that are laminated together. A pressure chamber for pressurizing the substrate WF as a whole is formed between the base member 1301 and the sealing material 1341. This pressure chamber is connected to the pressure adjustment unit 1030 through the pressure path 1313-4. Furthermore, the elastic membranes 1320-1, 1320-2, and 1320-3 each include a central portion that contacts the upper surface of the shielding member 1332 and ends that extend from the central portion and are fixed at different positions to the bottom surface of the upper guide member 1305. Multiple concentric pressure chambers for pressurizing the substrate WF are formed between the substrate member 1301 and the multiple elastic membranes 1320-1, 1320-2, and 1320-3 using multiple elastic membranes 1320-1, 1320-2, and 1320-3. The multiple pressure chambers are connected to the pressure adjustment unit 1030 through pressure paths 1313-1, 1313-2, and 1313-3, respectively. The pressure adjustment unit 1030 has a pressure adjustment function to adjust the pressure of the pressure fluid supplied to each pressure chamber. That is, the pressure adjustment unit 1030 can adjust the pressure of the pressure chamber used to pressurize the substrate WF as a whole by adjusting the pressure of the pressure fluid supplied to the pressure path 1313-4, and can adjust the pressure of the multiple concentric pressure chambers by adjusting the pressure of the pressure fluid supplied to the pressure paths 1313-1, 1313-2, and 1313-3. Thus, by forming multiple pressure chambers, the pressing pressure of the substrate WF on the polishing pad 352 can be controlled individually for each area by the substrate adsorption member 1330. According to this embodiment, the porous member 1334 is made to have a negative pressure by the decompression means 1031, thereby adsorbing the substrate WF onto the substrate adsorption surface 1334a, and the pressure chamber is pressurized by the pressure adjustment unit 1030, thereby pressing the substrate WF onto the polishing pad 352 by the substrate adsorption member 1330.

[0059] Furthermore, as shown in FIG10, the top ring 1302 further includes a strap 1345, which connects the outer side of the portion (specifically the flange 1303) not surrounded by the frame member 1344 of the base member 1301 to the outer side of the frame member 1344. The strap 1345 is installed from the outer side of the flange 1303 to the outer side of the upper frame member 1342. The strap 1345 allows displacement of the substrate adsorption member 1330 relative to the base member 1301 and prevents polishing fluid or the like from penetrating into the space between the substrate adsorption member 1330 and the base member 1301. Furthermore, as shown in FIG10, the top ring 1302 has an elastic sealing member 1336 that is the same as the elastic sealing member 336 in the above embodiment. The elastic sealing member 1336 can also be installed on the second shielding member 1332-2 by double-sided adhesive or the like, or it can be installed on the second shielding member 1332-2 in the form of the above-described elastic sealing assembly 331.

[0060] According to this embodiment, even if the polishing platform 1350, to which the top ring 1302 or polishing pad 352 is attached, tilts due to manufacturing tolerances of the components constituting the substrate processing apparatus 1000, the substrate WF can still be pressed evenly onto the polishing pad 352. That is, according to this embodiment, the substrate adsorption member 1330 is not fixed to the base member 1301, but is held by the elastic member 1340. Therefore, even if the top ring 1302 or polishing platform 1350 tilts and the substrate WF partially contacts the polishing pad 352, the elasticity of the elastic member 1340 can cause the substrate adsorption member 1330 to adhere to the polishing surface of the polishing pad 352, resulting in the substrate WF contacting the polishing pad 352 in parallel. Therefore, according to this embodiment, the substrate WF can be pressed evenly onto the polishing pad 352.

[0061] Furthermore, according to this embodiment, a miniaturized top ring can be achieved. That is, when the substrate adsorption member is supported on the base member by an elastic member, it is conceivable to, for example, provide an opening in the center of the bottom surface of the base member, provide the substrate adsorption member in the opening, and connect the frame-shaped member forming the periphery of the opening to the substrate adsorption member by an elastic member. However, in such a configuration, if an adsorption path for vacuum adsorption is to be formed around the frame-shaped member of the top ring from the porous member, the planar dimension of the top ring will become larger due to the space limitation of the frame-shaped member, which raises concerns about hindering the miniaturization of the top ring.

[0062] In contrast, in the top ring 1302 of this embodiment, the substrate adsorption member 1330 includes a frame member 1344 that surrounds at least a portion of the base member 1301, and the frame member 1344 is connected to the base member 1301 by an elastic member 1340. Therefore, as in this embodiment, since the pressure-reducing portion 1334b is provided on the side 1334d of the porous member 1334, even if the attraction path 1312 is arranged around the outer periphery of the top ring 1302, it is not necessary to increase the planar dimension of the frame member 1344. As a result, the top ring 1302 can be manufactured in a small size. In addition, the planar dimension of the top ring 1302 or the frame member 1344 is the dimension of the top ring 1302 or the frame member 1344 when viewed from above (viewed along the direction of the top ring axis 1018).

[0063] Next, a modified example of the top ring will be described. Figure 11 is a schematic cross-sectional view showing a top ring of one embodiment. Figure 12 is an enlarged cross-sectional view showing a portion of the top ring of one embodiment. Figure 13 is an enlarged perspective view showing a portion of the resilient sealing member of one embodiment. In the top ring 2302 of this embodiment, the components other than the resilient sealing member 2336 are the same as those of the top ring 302 of the embodiments of Figures 3 to 5, therefore, the description of the same components is omitted.

[0064] As shown in FIG11, the substrate adsorption member 330 has an elastic sealing member 2336 arranged to surround the porous member 334. In this embodiment, the elastic sealing member 2336 is composed of a sealing lip member with a slightly U-shaped cross-section. Specifically, as shown in FIG12, the elastic sealing member 2336 has a base 2336-1, a lip 2336-2, and a connecting portion 2336-3.

[0065] The base 2336-1 is a frame-shaped member, which is mounted on the mounting surface 332-2a of the second shielding member 332-2 by any means such as adhesive or double-sided tape. The lip 2336-2 is a frame-shaped member, which is disposed below the base 2336-1 with a gap between it and the base 2336-1. The connecting part (connecting wall) 2336-3 is a frame-shaped member that connects the end of the base 2336-1 and the end of the lip 2336-2. The elastic sealing member 2336 is integrally formed from the base 2336-1, the lip 2336-2 and the connecting part 2336-3, and is a rectangular frame-shaped member corresponding to the quadrilateral substrate WF. Only a part of the elastic sealing member 2336 is shown in Figure 13, but the elastic sealing member 2336 has four straight sides SI and four curved corners CO that connect the sides SI. The elastic sealing member 2336 is a rectangular frame formed by connecting each side SI and each corner CO, without gaps that cause air leakage, thus ensuring sealing performance.

[0066] As shown in FIG12, the elastic sealing member 2336 is disposed around the porous member 334 with an opening facing outward. In other words, the connecting portion (connecting wall) 2336-3 connects the end of the base 2336-1 on the porous member 334 side to the end of the lip 2336-2 on the porous member 334 side. Therefore, the lip 2336-2 extends outward from the lower end of the connecting portion 2336-3. More specifically, in the state where the substrate WF is not adsorbed onto the porous member 334 (left side of FIG12), the lip 2336-2 extends obliquely downward from the lower end of the connecting portion 2336-3. The elastic sealing member 2336, as in the above embodiment, can be formed of a component that is elastic and can block airflow, such as polysiloxane sponge or polysiloxane rubber. Furthermore, the resilient sealing member 2336 may be a soft member that is chemically resistant, has good elasticity, and has a leather-like surface.

[0067] The bottom surface of the lip 2336-2 forms a contact surface 2336a that contacts the substrate WF. That is, when the substrate WF is adsorbed onto the porous member 334 (right side of FIG12), the substrate WF contacts the contact surface 2336a of the lip 2336-2, pushing the lip 2336-2 up. The elastic sealing member 2336 is an elastic member, and because the substrate WF is adsorbed, the outer side of the elastic sealing member 2336 becomes positive pressure, so the lip 2336-2 pushes the substrate WF. In this way, the lip 2336-2 and the substrate WF are sealed. In addition, to avoid natural adhesion and fixation with the substrate WF (avoiding blooming), the contact surface 2336a of the elastic sealing member 2336 can also be coated with fluoropolymer, such as TEFLON (registered trademark) coating made of polytetrafluoroethylene. Furthermore, the contact surface 2336a of the elastic sealing member 2336 can also be coated by impregnation.

[0068] According to this embodiment, as shown on the right side of FIG12, even if a portion of the outer periphery of the adsorbed surface of the substrate WF is recessed to form a step WFa, the presence of the elastic sealing member 2336 prevents air leakage from the gap created by the step WFa. Therefore, according to this embodiment, the substrate WF can be reliably adsorbed onto the substrate adsorption member 330 regardless of the flatness of the adsorbed surface of the substrate WF.

[0069] Furthermore, according to this embodiment, damage to the substrate WF caused by the rebound force of the elastic sealing member can be suppressed. That is, when adsorbing and holding a fragile and easily broken substrate (e.g., a thin glass substrate), there is a concern that the substrate may break due to the rebound force of the elastic sealing member in a contracted state. In contrast, the elastic sealing member 2336 in this embodiment is composed of a sealing lip member with a slightly U-shaped cross-section, which reduces the rebound force on the substrate and ensures sealing. As a result, according to this embodiment, damage to the substrate WF caused by the rebound force of the elastic sealing member can be suppressed, and the substrate WF can be reliably adsorbed onto the substrate adsorption member 330. In addition, the elastic sealing member 2336 can also be used instead of the elastic sealing member 1336 in the top ring 1302 shown in FIG. 10.

[0070] Next, another variation of the top ring 2302 will be described. FIG. 14 is an enlarged cross-sectional view showing a portion of the top ring of one embodiment. FIG. 15 is an enlarged cross-sectional view showing a portion of the top ring of one embodiment. FIG. 16 is an enlarged perspective view showing a portion of the substrate adsorption member of one embodiment. The top ring of this embodiment has a protrusion formed on the second shielding member. Otherwise, it is the same as the top ring 2302 of the embodiments of FIG. 11 to FIG. 13, so the description of the same structure is omitted.

[0071] As shown in Figures 14 to 16, the second shielding member 332-2 has a frame-shaped protrusion 332-4 that surrounds the elastic sealing member 2336. The protrusion 332-4 protrudes downward from the bottom surface of the second shielding member 332-2. The protrusion 332-4 has a substrate pressing surface 332-4a, which forms the same plane as the substrate adsorption surface 334a of the porous member 334.

[0072] In this embodiment, by forming a protrusion 332-4 with a substrate pressing surface 332-4a on the second shielding member 332-2, cracking of the outermost peripheral portion of the substrate can be suppressed. That is, without the substrate pressing surface 332-4a, when the top ring holding the substrate WF presses the substrate WF against the polishing pad 352, the outermost peripheral portion of the substrate WF (the portion further outward than the portion in contact with the elastic sealing member 2336) may warp upward due to the rebound force from the polishing pad 352 and crack. In contrast, in this embodiment, the substrate pressing surface 332-4a is formed on the protrusion 332-4 on the outer side of the elastic sealing member 2336, thus flattening the upward warping of the outermost peripheral portion of the substrate WF. As a result, according to this embodiment, cracking of the outermost peripheral portion of the substrate can be suppressed.

[0073] Furthermore, the protrusion 332-4 is formed in a shape that protrudes inward from the bottom surface of the second shielding member 332-2 toward the inward side (in the direction of the elastic sealing member 2336). As a result, the second shielding member 332-2 has a groove 332-4b formed by the protrusion 332-4 and the mounting surface 332-2a. The groove 332-4b is a groove for inserting the elastic sealing member 2336. By inserting the thick-walled portion on the outer side of the base 2336-1 into the groove 332-4b, the elastic sealing member 2336 is fixed by inserting the entire circumference of the second shielding member 332-2.

[0074] According to this embodiment, when the elastic sealing member 2336 reaches its service life due to wear, the elastic sealing member 2336, as a consumable part, can be easily replaced. That is, a groove 332-4b is formed on the second shielding member 332-2 for embedding the elastic sealing member 2336, so that in a site where the substrate processing apparatus 1000 is provided, a general operator can easily install the elastic sealing member 2336 onto the second shielding member 332-2.

[0075] Several embodiments of the present invention have been described above, but these embodiments are provided for easy understanding of the present invention and do not limit the present invention. The present invention can be modified and improved without departing from its spirit, and the present invention naturally includes its equivalents. Furthermore, within the scope of solving at least a portion of the above-mentioned problems or achieving at least a portion of the effects, the constituent elements described in the patent claims and specification can be arbitrarily combined or omitted.

[0076] In this case, as one embodiment, a substrate adsorption member is disclosed, comprising: a porous member having a substrate adsorption surface for adsorbing a substrate and a pressure reducing portion communicating with a pressure reducing means; a shielding member having a first shielding member and a frame-shaped second shielding member, the first shielding member shielding the side of the porous member opposite to the substrate adsorption surface, and the second shielding member shielding at least a portion of the side surface of the porous member; and a frame-shaped elastic sealing member installed on the second shielding member in such a way as to surround the porous member, having a contact surface that contacts the substrate.

[0077] Furthermore, in this case, as one embodiment, a substrate adsorption member is disclosed, wherein the aforementioned second shielding member is configured such that the substrate adsorption surface of the aforementioned porous member is more prominent than the mounting surface of the aforementioned elastic sealing member of the aforementioned second shielding member, and the aforementioned elastic sealing member is configured to surround the side of the aforementioned porous member that is more prominent than the mounting surface of the aforementioned second shielding member.

[0078] Furthermore, in this case, as one embodiment, a substrate adsorption member is disclosed, wherein the aforementioned elastic sealing member includes: a first elastic sealing member that surrounds the side of the aforementioned porous member that protrudes more than the aforementioned mounting surface of the aforementioned second shielding member; and a second elastic sealing member that is disposed at a distance from the outside of the aforementioned first elastic sealing member.

[0079] Furthermore, in this case, as one embodiment, a substrate adsorption member is disclosed, wherein the aforementioned shielding member further includes a frame-shaped third shielding member disposed at the lower part of the aforementioned second shielding member and arranged at a distance from the outside of the aforementioned elastic sealing member. The aforementioned first shielding member and the aforementioned second shielding member have fluid passages for discharging fluid into the space between the aforementioned elastic sealing member and the aforementioned third shielding member.

[0080] Furthermore, in this case, as one embodiment, a substrate adsorption member is disclosed, wherein the aforementioned elastic sealing member includes: a base, which is mounted on the aforementioned mounting surface of the aforementioned second shielding member; a lip, which is disposed below the aforementioned base with a gap; and a connecting portion, which connects the aforementioned base and the aforementioned lip; and the aforementioned contact surface is formed on the bottom surface of the aforementioned lip.

[0081] Furthermore, in this case, as one embodiment, a substrate adsorption member is disclosed, wherein the aforementioned second shielding member has a frame-shaped protrusion that surrounds the aforementioned elastic sealing member, the aforementioned protrusion having a substrate pressing surface that forms the same plane as the aforementioned substrate adsorption surface of the aforementioned porous member.

[0082] Furthermore, in this case, as one embodiment, a substrate adsorption member is disclosed, wherein the aforementioned second shielding member has a groove formed by the aforementioned protrusion and the aforementioned mounting surface for embedding the aforementioned elastic sealing member, and the aforementioned elastic sealing member is mounted on the aforementioned second shielding member by embedding the aforementioned base into the aforementioned groove.

[0083] Furthermore, in this case, as one embodiment, a substrate adsorption member is disclosed, wherein the aforementioned elastic sealing member is formed into a rectangular frame with four straight sides.

[0084] Furthermore, in this case, as one embodiment, an elastic sealing assembly is disclosed, which is installed on a substrate adsorption member. The substrate adsorption member includes: a porous member having a substrate adsorption surface for adsorbing the substrate and a pressure reducing portion communicating with a pressure reducing means; a shielding member having a first shielding member and a frame-shaped second shielding member, the first shielding member shielding the surface of the aforementioned porous member opposite to the aforementioned substrate adsorption surface, and the second shielding member shielding at least a portion of the side surface of the aforementioned porous member; the elastic sealing assembly includes: a frame-shaped fixing frame installed on the aforementioned second shielding member in such a way as to surround the aforementioned porous member; and a frame-shaped elastic sealing member installed on the surface of the aforementioned fixing frame opposite to the fixing surface of the aforementioned second shielding member, having a contact surface that contacts the aforementioned substrate.

[0085] Furthermore, in this case, as one embodiment, a top ring is disclosed, which is a top ring for holding a substrate, comprising a rotating shaft, a base member connected to the aforementioned rotating shaft, a substrate adsorption member mounted on the aforementioned base member, or a substrate adsorption member on which the aforementioned elastic sealing assembly is mounted.

[0086] Furthermore, in this case, as one embodiment, a top ring is disclosed, which further includes an abrasive cleaning member, configured to supply fluid to the surface of the porous member opposite to the adsorption surface of the substrate through a flow path formed on the aforementioned substrate member and the aforementioned shielding member.

[0087] Furthermore, in this case, as one embodiment, a substrate processing apparatus is disclosed, comprising: a polishing platform on which a polishing pad having a polishing surface is attached; a top ring of any of the above, configured to hold the substrate and press it against the polishing surface; and a polishing liquid supply nozzle configured to supply polishing liquid to the polishing pad. [Simplified Explanation of the Diagram]

[0010] Figure 1 is a top view showing the overall structure of a substrate processing apparatus according to an embodiment. Figure 2 is a perspective view showing the structure of a polishing unit according to an embodiment. Figure 3A is a cross-sectional view showing the top ring according to an embodiment. Figure 3B is a top view showing the top ring according to an embodiment. Figure 4 is a cross-sectional view showing the top ring and substrate according to an embodiment. Figure 5 is a cross-sectional view showing the top ring according to an embodiment. Figure 6 is a cross-sectional view showing a portion of the top ring according to an embodiment, enlarged and shown in a schematic. Figure 7 is a cross-sectional view showing a portion of the top ring according to an embodiment, enlarged and shown in a schematic. Figure 8 is a perspective view showing the structure of an elastic sealing assembly according to an embodiment. Figure 9 is a perspective view showing the structure of a substrate adsorption member including the elastic sealing assembly according to an embodiment. Figure 10 is a cross-sectional view showing the top ring according to an embodiment. Figure 11 is a cross-sectional view showing the top ring according to an embodiment. Figure 12 is an enlarged cross-sectional view showing a portion of the top ring of one embodiment. Figure 13 is an enlarged perspective view showing a portion of the elastic sealing member of one embodiment. Figure 14 is an enlarged cross-sectional view showing a portion of the top ring of one embodiment. Figure 15 is an enlarged cross-sectional view showing a portion of the top ring of one embodiment. Figure 16 is an enlarged perspective view showing a portion of the substrate adsorption member of one embodiment.

Claims

1. A substrate adsorption member, comprising: a porous member having a substrate adsorption surface for adsorbing a substrate and a pressure reduction portion communicating with a pressure reduction means; a shielding member having a first shielding member and a frame-shaped second shielding member, the first shielding member shielding a surface of the porous member opposite to the substrate adsorption surface, and the second shielding member shielding at least a portion of a side surface of the porous member; and a frame-shaped elastic sealing member mounted on the second shielding member to surround the porous member, having a contact surface that contacts the substrate; wherein the second shielding member is configured such that the substrate adsorption surface of the porous member is more prominent than the mounting surface of the elastic sealing member of the second shielding member, and the elastic sealing member is configured to surround a side surface of the porous member that is more prominent than the mounting surface of the second shielding member.

2. The substrate adsorption member of claim 1, wherein the aforementioned elastic sealing member comprises: a first elastic sealing member that surrounds the side of the aforementioned porous member that protrudes further than the aforementioned mounting surface of the aforementioned second shielding member; and a second elastic sealing member disposed at a distance from the outside of the aforementioned first elastic sealing member.

3. The substrate adsorption member of claim 1, wherein the aforementioned shielding member further includes a frame-shaped third shielding member disposed at the lower part of the aforementioned second shielding member and disposed at a distance from the outside of the aforementioned elastic sealing member, wherein the aforementioned first shielding member and the aforementioned second shielding member have fluid passages for discharging fluid into the space between the aforementioned elastic sealing member and the aforementioned third shielding member.

4. The substrate adsorption member of claim 1, wherein the aforementioned elastic sealing member comprises: a base, mounted on the aforementioned mounting surface of the aforementioned second shielding member; a lip, disposed below the aforementioned base with a gap; and a connecting portion, connecting the aforementioned base and the aforementioned lip; wherein the aforementioned contact surface is formed on the bottom surface of the aforementioned lip.

5. The substrate adsorption member of claim 4, wherein the aforementioned second shielding member has a frame-shaped protrusion that surrounds the aforementioned elastic sealing member, the aforementioned protrusion having a substrate pressing surface that forms the same plane as the aforementioned substrate adsorption surface of the aforementioned porous member.

6. The substrate adsorption member of claim 5, wherein the second shielding member has a groove formed by the protrusion and the mounting surface for embedding the elastic sealing member, and the elastic sealing member is mounted on the second shielding member by the base being embedded in the groove.

7. The substrate adsorption member of any one of claims 1 to 6, wherein the aforementioned elastic sealing member is formed into a rectangular frame shape having four straight sides.

8. An elastic sealing assembly mounted on a substrate adsorption member, the substrate adsorption member comprising: a porous member having a substrate adsorption surface for adsorbing a substrate and a pressure reducing portion communicating with a pressure reducing means; a shielding member having a first shielding member and a frame-shaped second shielding member, the first shielding member shielding the surface of the porous member opposite to the substrate adsorption surface, and the second shielding member shielding at least a portion of the side surface of the porous member; the elastic sealing assembly comprising: a frame-shaped fixing frame mounted on the second shielding member in a manner that surrounds the porous member; and a frame-shaped elastic sealing member mounted on the surface of the fixing frame opposite to the fixing surface of the second shielding member, having a contact surface that contacts the substrate.

9. A top ring for holding a substrate, comprising: a rotating shaft; a base member connected to the rotating shaft; and a substrate adsorption member of any one of claims 1 to 7 mounted on the base member, or a substrate adsorption member mounted with an elastic sealing assembly of claim 8.

10. The top ring of claim 9 further includes an abrasive cleaning member configured to supply fluid to the surface of the porous member opposite to the adsorption surface of the substrate through a flow path formed on the aforementioned substrate member and the aforementioned shielding member.

11. A substrate processing apparatus comprising: a polishing platform on which a polishing pad having a polishing surface is attached; a top ring, as claimed in claim 9 or 10, configured to hold the substrate and press it against the polishing surface; and a polishing slurry supply nozzle configured to supply polishing slurry to the polishing pad.

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