Thermosetting resin composition, resin sheet, metal foil with resin, metal-clad laminate, and printed wiring board

TWI940698BActive Publication Date: 2026-10-01PANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO LTD
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Patent Information

Application Number
TW111139437
Authority / Receiving Office
TW · TW
Patent Type
Patents
Current Assignee / Owner
Priority Date
2021-10-25
Filing Date
2022-10-18
Publication Date
2026-10-01
Estimated Expiration
2042-10-17

AI Technical Summary

Technical Problem

Existing thermosetting resin compositions with polyphenylene ether skeletons face challenges in achieving reduced elastic modulus and improved flexibility while maintaining heat resistance, as elastomers used to enhance flexibility often compromise homogeneity and heat resistance due to low compatibility with maleimide compounds.

Method used

A thermosetting resin composition comprising a maleimide compound with multiple maleimide groups, a compound with an ethylenically unsaturated bond and a polyphenylene ether skeleton, and an inorganic filler, specifically incorporating a butadiene residue, to enhance flexibility and reduce elastic modulus without deteriorating heat resistance.

Benefits of technology

The composition achieves a significant reduction in elastic modulus, improved flexibility, and maintains heat resistance, resulting in enhanced high-frequency characteristics and adhesion properties for metal-clad laminates and printed wiring boards.

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Abstract

This disclosure provides a thermosetting resin composition that can reduce the elastic modulus of the cured material and improve its flexibility, without easily deteriorating the heat resistance of the cured material. The thermosetting resin composition of this invention comprises: a maleimide compound (A) having at least two maleimide groups in one molecule; a compound (B) having a terminal substituent containing an ethylene unsaturated bond and having a polyphenylene ether backbone; and an inorganic filler (C). Compound (B) contains compound (B1), which has a structural unit derived from butadiene.
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Citation Information

Patent Citations

  • Resin composition, cured product of resin composition, resin sheet, printed wiring board, and semiconductor device

    JP2021028368A