Resin composition, molded articles and display devices

Abstract

The objective of this invention is to provide an additive that improves the peelability of polyamide resins during molding. The solution is an additive for polyamide resins comprising a compound represented by the following formula (1). (In formula (1), R1 and R2 are alkyl groups with 4 to 22 carbon atoms or alkenyl groups with 4 to 22 carbon atoms, L1, L2, and L3 are alkyl groups with 2 to 6 carbon atoms, and X is a substituent; m is an integer from 1 to 10, and n is an integer from 0 to 10, satisfying 1 ≤ m + n ≤ 10; when m is 2 or more, the multiple L1s can be the same or different; when n is 2 or more, the multiple Xs and L2s can be the same or different.)

Description

Technical Field

[0001] This invention relates to additives for polyamide resins, resin compositions containing the additives, optical films, and display devices. Prior Technology

[0002] Due to its excellent transparency and thin film mechanical properties, polyamide resin (nylon resin) is used as a protective film for polarized sunglasses and other products. Regarding the forming methods of films made of polyamide resin, there are "melt extrusion" which involves heating and melting the resin to form the film, and "solvent casting" which involves dissolving the resin in a solvent, casting the film, and distilling off the solvent to obtain the film.

[0003] In melt extrusion, there are methods such as roll-to-roll film forming. This involves extruding molten resin from an extruder while simultaneously winding it up with rollers and controlling the thickness. In solvent casting, for example, a casting solution is cast onto a metal strip such as SUS314, and after distilling off the solvent, the film is peeled off from the strip and subjected to thermal stretching steps to obtain a film.

[0004] In solvent casting, the ability to separate the resin film from the metal strip is crucial for the productivity of thin films. This is because if the resin can be separated from the strip at an early stage after the solvent has been partially distilled off, productivity can be improved. Polyamide resins, due to the numerous amide bonds in their molecular backbone, tend to adhere readily to glass or metal substrates. Consequently, their substrate peelability tends to be worse compared to other resins. This is an undesirable issue that needs improvement from the perspective of film productivity.

[0005] Regarding the aforementioned issues, Patent Document 1 describes a strategy for improving the poor peelability of films from metal strips, specifically for cellulose resins. Furthermore, Patent Documents 2 and 3 describe the addition of small amounts of diamide compounds to polyamide resins to improve formability. However, the results were insufficient, and further improvements are needed. [Previous Technical Documents] [Patent Literature]

[0006] [Patent Document 1] Japanese Patent Application Publication No. 2012-247531 [Patent Document 2] Japanese Patent Application Publication No. 2002-173598 [Patent Document 3] Japanese Patent Application Publication No. 2001-234063 Summary of the Invention

[0007] [The problem the invention aims to solve]

[0008] The purpose of this invention is to provide an additive that can improve the peelability of polyamide resin during molding. [Methods used to solve problems]

[0009] As a result of the inventors’ dedicated research in order to solve the above-mentioned problems, they discovered that by adding the compound represented by formula (1) described below to polyamide resin, the peelability of polyamide resin can be improved, and thus the present invention is completed.

[0010] That is, the present invention relates to an additive for polyamide resin, which comprises a compound represented by the following formula (1). (In formula (1), R1 and R2 are alkyl groups with 4 to 22 carbon atoms or alkenyl groups with 4 to 22 carbon atoms, L1, L2, and L3 are alkyl groups with 2 to 6 carbon atoms, and X is a substituent. m is an integer from 1 to 10, and n is an integer from 0 to 10, satisfying 1 ≤ m + n ≤ 10; when m is 2 or more, the multiple L1s can be the same or different; when n is 2 or more, the multiple Xs and L2s can be the same or different.)

[0011] Furthermore, the present invention relates to a resin composition comprising the above-mentioned polyamide resin additive and polyamide resin. Furthermore, the present invention relates to molded articles made from the above-mentioned resin composition. Furthermore, the present invention relates to a display device having the above-described molded article. [Effects of the Invention]

[0012] According to the present invention, an additive that improves the peelability of polyamide resin during molding can be provided. Furthermore, according to the present invention, a resin composition comprising the additive, a molded article, and a display device can be provided. Simple Explanation of the Diagram

[0013] none. Implementation

[0014] [The form in which the invention is carried out]

[0015] Additives for polyamide resins An additive for polyamide resin according to one embodiment of the present invention comprises a compound represented by the following formula (1). (In formula (1), R1 and R2 are alkyl groups with 4 to 22 carbon atoms or alkenyl groups with 4 to 22 carbon atoms, L1, L2, and L3 are alkyl groups with 2 to 6 carbon atoms, X is a substituent; m is an integer from 1 to 10, n is an integer from 0 to 10, satisfying 1 ≤ m + n ≤ 10; when m is 2 or more, the multiple L1s can be the same or different; when n is 2 or more, the multiple Xs and L2s can be the same or different.)

[0016] The compound represented by formula (1) has a secondary amine structure (-NH-) and amide groups with medium to long chain hydrocarbons (R1 and R2) at the end. It is speculated that in this compound, the interaction between the secondary amine structure and the substrate surface (glass: hydroxyl, metal plate: metal atom) is mainly achieved through the interaction between the compound and the substrate surface, and the compound segregates near the substrate interface, with the sliding property enhanced by the amide groups R1 and R2.

[0017] In the above formula (1), R1 and R2 are alkyl groups with 4 to 22 carbon atoms or alkenyl groups with 4 to 22 carbon atoms, respectively. Examples of alkyl groups include straight-chain hydrocarbon groups such as butyl, pentyl, hexyl, heptyl, octyl, nonyl, decyl, undecyl, dodecyl, pentadecyl, and octadecyl. These straight-chain hydrocarbon groups may have alkyl groups such as methyl, ethyl, propyl, and butyl as substituents. That is, they may be branched hydrocarbon groups.

[0018] Alkenyl groups are represented by CnH2n-1- (where n is an integer from 4 to 22) and are groups having a carbon-carbon double bond. Similar to alkyl groups, alkyl groups such as methyl, ethyl, propyl, and butyl can be used as substituents. Specifically, they are groups derived from unsaturated fatty acids derived from the raw materials described later.

[0019] In one embodiment, R1 and R2 are alkyl groups having 6 to 18 carbon atoms, or alkenyl groups having 6 to 18 carbon atoms, respectively.

[0020] L1, L2, and L3 are alkyl groups having 2 to 6 carbon atoms. Examples include ethyl, n-propyl, n-butyl, and n-hexyl. These alkyl groups may have substituents such as alkyl groups without impairing the effects of the present invention. L1, L2, and L3 are preferably ethyl or n-propyl, with ethyl being particularly preferred.

[0021] m is an integer from 1 to 10, and n is an integer from 0 to 10. Ideally, m should be an integer from 1 to 5. Ideally, n should be an integer from 0 to 5. m and n satisfy 1 ≤ m + n ≤ 10.

[0022] X is a substituent (not a hydrogen atom) and is not limited as long as it does not impair the effect of the present invention. Examples of substituents include alkyl groups such as methyl, ethyl, propyl, and butyl; aryl groups such as phenyl; cyclic hydrocarbon groups such as cyclohexyl; and amide groups of various carboxylic acids.

[0023] The method of synthesizing the compound represented by formula (1) is not particularly limited. For example, it can be synthesized by reacting an amine compound having one or more secondary amino groups (-NH-) with a monocarboxylic acid having a total carbon number of 5 or more, followed by dehydration.

[0024] Examples of amine compounds having one or more secondary amino groups (-NH-) include diethyltriamine, triethyltetraamine, tetraethylpentamine, pentaethylhexamine, and dipropyltriamine. For monocarboxylic acids with a total carbon number of 5 or more, examples include saturated fatty acids such as valeric acid, hexanoic acid, heptanoic acid, octanoic acid, decanoic acid, dodecanoic acid, tetradecanoic acid, hexadecanoic acid, and octadecanoic acid; and unsaturated fatty acids such as myristoleic acid, palmitoleic acid, sapienic acid, oleic acid, transoleic acid, tartrate, codoleic acid, eicosenoic acid, sinapic acid, and icosenoic acid.

[0025] In formula (1), some or all of the secondary amino group (-NH-) can form a salt structure with, for example, a carboxylic acid. In the method of manufacturing the compound represented by formula (1) described later, there are cases where the compound represented by formula (1) also includes a salt structure formed by a secondary amino group (-NH-) and a carboxylic acid, but the effect of the present invention is not impaired.

[0026] The compound represented by formula (1) (amidoamine compound) can be manufactured, for example, by feeding an amine compound constituting each residue of the amidoamine compound together with a monocarboxylic acid and causing such a reaction. In this manufacturing method, the reaction of the raw materials can be carried out by reacting them at 100-200°C for 2-15 hours in the presence of an amination catalyst, if necessary. Examples of amination catalysts include, for instance, trimethyl borate.

[0027] The acid value of the compound represented by formula (1) is, for example, less than 20 mg KOH / g, preferably less than 15 mg KOH / g, and more preferably less than 10 mg KOH / g. The lower limit of the acid value is not particularly limited, for example, 0 mg KOH / g. The acid value described above was determined by the method described in the examples.

[0028] The polyamide resin additive of this embodiment can be used as a release agent because it can improve the peelability of polyamide resin during molding.

[0029] [Resin Composition] One embodiment of the present invention comprises a resin composition including the polyamide resin additive and the polyamide resin described above. Regarding polyamide resins, well-known polyamide resins can be used. For example, ring-opening polymers of amides, polycondensates of diamines and diacids, polycondensates of ω-amino acids, etc. These polyamide resins can be used individually or in combination of two or more.

[0030] Polyamide resins can be crystalline or amorphous. Amorphous polyamide resins are preferred due to their ease of imparting transparency and surface gloss. Amorphous polyamide resins can be obtained by polycondensation of at least one diamine with at least one dicarboxylic acid. Examples of diamines include bis(4-aminocyclohexyl)methane, bis(3-methyl-4-aminocyclohexyl)methane, 2,2-bis(3-methyl-4-aminocyclohexyl)propane, p-aminodicyclohexylmethane, isophorone diamine diamine, and 2,6-bis(aminomethyl)norbornene. Among these, bis(3-methyl-4-aminocyclohexyl)methane is preferred. Two or more diamines may be used in combination as needed.

[0031] Examples of dicarboxylic acids include p-phthalic acid, isophthalic acid, 1,10-decanoic acid, 1,12-dodecanedicarboxylic acid, 1,14-tetradecanedicarboxylic acid, and 1,18-octadecanedicarboxylic acid. Among these, 1,14-tetradecanedicarboxylic acid is preferred. Two or more dicarboxylic acids may be used in combination as needed.

[0032] Amorphous polyamide resins are available commercially. Examples of petroleum-based amorphous polyamide resins include Rilsan Clear G110, Rilsan Clear G170, Rilsan Clear G350 (and above, manufactured by Arkema), Grilamid TR-55, Grilamid TR-60, and Grilamid TR-90 (and above, manufactured by EMS-Chemie). Examples of plant-based amorphous polyamide resins include Rilsan (registered trademark), Clear G830, and Rnew (manufactured by Arkema).

[0033] In one embodiment, the content of the additive for the polyamide resin is 0.5 to 5 parts by weight relative to 100 parts by weight of the polyamide resin. Within this range, the effect of the additive for the polyamide resin is easily demonstrated. Preferably, the content of the additive for the polyamide resin is 1 to 4 parts by weight relative to 100 parts by weight of the polyamide resin.

[0034] The resin composition of this embodiment may include the above-mentioned polyamide resin additive and polyamide resin, or may further include other components (any resin component and any additive).

[0035] Examples of resin components include polyolefins such as polyethylene and polypropylene; thermoplastic resins such as polyamide, polyphenylene sulfide resin, polyetheretherketone resin, polyurethane, polyphenylene ether, polyimide, polyetherimide, and polyacetal; and thermosetting resins such as phenolic resin, melamine resin, silicone resin, and epoxy resin. A single resin component may be included, or two or more may be included.

[0036] Regarding any additives, examples include inorganic fillers, pigments such as iron oxide; lubricants such as stearic acid, icosanoic acid, zinc stearate, calcium stearate, magnesium stearate, and ethylene-bis-stearamide; softeners and plasticizers such as paraffin-based processing oils, cycloalkanes-based processing oils, aromatic processing oils, paraffin, organic polysiloxanes, and mineral oils; antioxidants such as hindered phenolic antioxidants, phosphorus-based heat stabilizers, lactone-based heat stabilizers, and vitamin E-based heat stabilizers; light stabilizers such as hindered amine-based light stabilizers and benzoate-based light stabilizers; and ultraviolet absorbers such as diphenyl ketones and triphenyl ketones. It is a UV absorber, such as a benzotriazole UV absorber; a flame retardant; an antistatic agent; a reinforcing agent for organic fibers, glass fibers, carbon fibers, metal whiskers, etc.; a colorant, other additives, or mixtures thereof.

[0037] A molded article can be obtained by mixing, kneading, and molding the resin composition using known methods. Furthermore, the resin composition of this embodiment also includes the state of the mixture before molding.

[0038] [Molded product] One embodiment of the present invention is a molded article made from the resin composition of the present invention described above. Examples of molded articles include, for instance, optical thin films (phase retardation films such as polarizing plate protective films, quarter-wave plates, half-wave plates, viewing angle control films, and liquid crystal optical compensation films; display front panels; light reflection prevention components; base films for touch panel sensors, etc.), polarizers, frames for eyeglasses or sunglasses, and transparent casings for tablet terminals or smartphones. Furthermore, in the fields of optical communication systems, optical switching systems, and optical measurement systems, it can also be used in waveguides, lenses, optical fibers, optical fiber substrates, coating materials, LED lenses, and lens covers.

[0039] Optical films are particularly suitable. Optical films are, for example, produced by using the resin composition of the present invention to manufacture an unstretched film by methods such as extrusion molding or casting molding, and then obtained by stretching the unstretched film. Regarding the manufacturing methods of unstretched films, one example is solution casting (solvent casting). The solution casting method will be described in detail below. Unstretched thin films obtained by solution casting exhibit substantial optical isotropy. Thin films exhibiting optical isotropy are, for example, optical materials that can be used in liquid crystal displays, and are particularly useful as protective films for polarizing plates. Furthermore, thin films obtained by the aforementioned method have excellent surface smoothness, with minimal surface irregularities.

[0040] The solution casting method includes, for example, a first step of dissolving the resin composition of the present invention in a solvent and casting the resulting resin solution (casting solution) onto a metal support; a second step of distilling off the solvent contained in the cast resin solution and drying it to form a thin film; and a third step of peeling the thin film formed on the metal support from the metal support and then heating and drying it. The solvents mentioned above are not particularly limited, but examples include methanol, methylene chloride, and chloroform.

[0041] The concentration of polyamide resin in the resin solution is preferably 10-50% by mass, more preferably 15-35% by mass.

[0042] Regarding the metal support used in step 1, examples include ring-shaped or drum-shaped metal supports, such as stainless steel with a mirror-finished surface.

[0043] When casting the resin solution onto the metal support, it is preferable to use a resin solution that has been filtered to prevent foreign matter from entering the resulting film.

[0044] The drying method in step 2 is not particularly limited. For example, blowing air at a temperature range of 30 to 50°C onto the top and / or bottom of the metal support can evaporate 50 to 80% by mass of the organic solvent contained in the cast resin solution, thereby forming a thin film on the metal support.

[0045] Next, the third step involves peeling the film formed in the second step off the metal support and then heating and drying it at a higher temperature than that in the second step. Regarding the heating and drying method, a method that gradually increases the temperature in stages at 100-160°C is preferred because it provides good dimensional stability. By heating and drying at high temperatures, the organic solvent remaining in the film after the second step can be almost completely removed.

[0046] Furthermore, in steps 1 through 3, the solvent can also be recycled and reused.

[0047] The optical film of this embodiment can be obtained by stretching the unstretched film. Specifically, the optical film can be obtained by longitudinal uniaxial stretching in the direction of mechanical flow or transverse uniaxial stretching in a direction orthogonal to the direction of mechanical flow. Furthermore, the optical film of this embodiment can also be obtained by free-end uniaxial stretching. Free-end uniaxial stretching refers to longitudinal stretching in a state where there are no components such as conveyor rollers, support plates, or support belts supporting or contacting the film between a pair of stretching rollers, and the film can freely contract and expand in the width direction. Furthermore, by using a successive biaxial stretching method that combines roll stretching and tenter frame stretching, a simultaneous biaxial stretching method that combines tenter frame stretching, or a biaxial stretching method that combines tubular stretching, the obtained unstretched film can be biaxially stretched, thereby obtaining the optical film of this embodiment.

[0048] The elongation ratio during the stretching is preferably 0.1% to 1000% in at least one direction, more preferably 0.2% to 600%, and even more preferably 0.3% to 300%. By setting the elongation ratio within this range, a stretched optical film with advantages in terms of birefringence, heat resistance, and strength can be produced.

[0049] The thickness of the optical thin film in this embodiment is preferably in the range of 20~120μm, more preferably in the range of 25~100μm, and even more preferably in the range of 25~80μm.

[0050] The molded body of this embodiment can be used as an optical material in display devices such as liquid crystal displays, plasma displays, organic EL displays, field emission displays, and rear projection televisions. It is suitable for use as optical films in display devices such as polarizer protective films, quarter-wave plates, half-wave plates, viewing angle control films, liquid crystal optical compensation films, display front panels, light reflection prevention components, and base films for touch panel sensors. [Example]

[0051] The present invention will be further described in detail below with specific examples. [Synthesis of Additives] Example 1 Additive A having the following structure was synthesized.

[0052] In a 0.3 L four-necked flask, 36 g of diethyltriamine (manufactured by Kanto Chemical) was added, and the temperature was raised to 100 °C. Then, 207 g of oleic acid (manufactured by Kanto Chemical) was added, and the temperature was raised to 170 °C, allowing the reaction to proceed for 5 hours. After sufficient dehydration, a reduced pressure reaction was carried out for 1 hour at 45 Torr. The temperature was then lowered to 95 °C, and 20 g of water was added with stirring for 1 hour. Afterward, the pressure was reduced to 45 Torr at 95 °C to remove excess water. After pressure removal, the mixture was removed from the flask, yielding additive A as a yellow solid. Additive A has an acid value of 7.3 and an amine value of 83. The methods for determining the acid value and amine value are shown below.

[0053] Methods for determining acid value It was determined by means of JIS K0070-1992.

[0054] Methods for determining amine value (1) Weigh 1 ± 0.3 milliequivalents of the sample and place it in an Erlenmeyer flask. Add 20 mL of methyl ethyl ketone (MEK) to dissolve it. (2) Add 5 mL of acetic acid and 2 or 3 drops of crystal violet acetic acid solution. (3) While stirring with a magnetic stirrer, titrate with a 0.1 mol / L perchloric acid-acetic acid solution. (4) The endpoint is defined as the point where the color changes from blue-purple to blue and remains so for 1 minute. A blank test is also performed simultaneously. Calculate the amine value using the following formula. Amine value (mgKOH / g) = 56.10 × [(Va-Vb) / W] × 0.1 × [F20 / {1 + 0.0011(t-20)}] W: Sample volume (g) Va: The titration volume (mL) of 0.1 mol / L HClO₄ required for this experiment. Vb: Titration volume (mL) of 0.1 mol / L HClO₄ required for the blank test. F20: 0.1 mol / L HClO at 20℃ (refer to the value recorded on the reagent label). t: The temperature of the HClO4 solution during titration (°C).

[0055] Example 2 Except that 29g of triethylenetetramine (manufactured by Kanto Chemical) was used instead of diethylenetriamine, and 124g of oleic acid (manufactured by Kanto Chemical) was fed, additive B, which was a yellow solid, was obtained by proceeding in the same manner as in Example 1. The acid value of additive B was 8.3, and the amine value was 160.

[0056] Example 3 Except that 38g of tetraethylpentamine (manufactured by Kanto Chemical) was used instead of diethyltriamine, and 124g of oleic acid (manufactured by Kanto Chemical) was fed, additive C, which was a yellow solid, was obtained by proceeding in the same manner as in Example 1. The acid value of additive C was 7.7, and the amine value was 192.

[0057] Comparative Example 1 In a 0.3L four-necked flask, 12g of ethylenediamine (manufactured by Kanto Chemical) was added, and the temperature was raised to 100°C. Then, 116g of oleic acid (manufactured by Kanto Chemical) was added, and the temperature was raised to 170°C, where the reaction was carried out for 5 hours. After thorough dehydration, the temperature was reduced to 45 Torr, and the reaction was carried out for another hour. Then, the temperature was lowered to 95°C, 15g of water was added, and the mixture was stirred for 1 hour. The temperature was maintained at 95°C while the temperature was reduced to 45 Torr to remove excess water. After decompression, the mixture was removed from the flask, yielding additive D as a yellow solid. Additive D has an acid value of 6.5 and an amine value of 15.

[0058] [Thin Film Production] Example 4 A casting solution (Nylon resin solution) was obtained by adding 1 part by mass of additive A, 492 parts by mass of dichloromethane, and 74 parts by mass of methanol to 100 parts by mass of Nylon resin (manufactured by EMS-Chemie Japan Co., Ltd., Grilamid TR-90). The casting solution was poured onto a glass plate and a stainless steel (SUS314) substrate, and dried in an oven at 30°C for 20 minutes to remove the solvent, thereby producing a thin film. The thickness of the thin film was approximately 60 μm.

[0059] Examples 5-8, Comparative Examples 2 and 3 As shown in Table 1, the film was made in the same manner as in Example 4, except that the additives and their amounts were changed.

[0060] [evaluate] Peelability and surface free energy were measured for the films prepared in the examples and comparative examples. (1) Peelability As described above, the film was dried in an oven at 30°C for 20 minutes to remove the solvent, thereby producing a thin film. After 20 minutes of drying, the film was removed from the oven along with the substrate, and the film was immediately peeled off the substrate. The peelability from the glass substrate and the SUS314 substrate was evaluated based on the following peelability evaluation criteria.

[0061] • Peelability from glass substrate 5. The film will peel off naturally without any force. 4. Can be easily peeled off with minimal force, without film deformation. 3: Peeling requires force, but there is almost no film deformation. 2: During the peeling process, there are sections that cannot be peeled off without applying force, resulting in slight deformation of the film. 1: If no force is applied that causes the film to deform, it cannot be peeled off.

[0062] Peelability from stainless steel substrate (SUS316) 5. The film will peel off naturally without any force. 4. Can be easily peeled off with minimal force, without film deformation. 3: Peeling requires force, but there is almost no film deformation. 2: Peeling requires strong force; no film breaks but deformation occurs. 1: Cannot be peeled (requires force strong enough to break the film)

[0063] (2) Surface free energy The surface free energy was measured on the substrate side and the opposite side of the peeled film. The contact angles of water, diiodomethane, and n-dodecane were measured, and the surface free energy was calculated using the Zisman method. The contact angles were measured using a contact angle measuring device (MODEL CA-W150, manufactured by Kyowa Interface Science Co., Ltd.).

[0064] (3) Transparency A 40mm square test piece was prepared, and the haze was measured using a haze meter (NDH-5000, manufactured by Nippon Denshoku Kogyo Co., Ltd.). (4) Optical properties A 40mm square test piece was prepared and conditioned for 1 hour in a simple constant temperature and humidity chamber at 23°C and 55% humidity. The in-plane delay (Re) and the thickness direction delay (Rth) were measured using a phase difference measuring device (KOBRA-WR, manufactured by Oji Measurement Equipment Co., Ltd.).

[0065] [Table 1] Example 4 Example 5 Example 6 Example 7 Example 8 Comparative Example 2 Comparative Example 3 Blending composition [Quantity] Nylon resin 100 100 100 100 100 100 100 Additive A (Example 1) 1 Additive B (Example 2) 1 Additive C (Example 3) 1 2 3 Additive D (Comparative Example 1) 1 Peelability Peelability from glass substrate 5 5 5 5 5 3 4 Peelability from SUS substrate 2 3 3 3 4 1 1 physical properties Transparency Haze [-] 0.4 0.3 0.4 0.4 0.5 0.3 0.4 Optical properties Re[nm] 2 3 2 1 1 3 1 Rth[nm] 50 53 51 49 51 54 56 Surface free energy [mJ / m 2] air surface 55.8 - 61.9 60.5 57.1 53.8 59.3 substrate surface 60.8 - 56.1 52.2 40.6 46.6 48.7

[0066] Table 1 confirms that the film with the additive in the doped example exhibits superior peelability compared to the comparative example, and its optical properties, such as haze, are comparable to those of Comparative Example 2 without the additive. Furthermore, regarding the surface free energy of the film on the substrate side, the surface free energy of the film with the additive in the doped example shows a significant change compared to the blank film without the additive, suggesting additive segregation on the substrate side. It is believed that this additive segregation on the substrate side improves peelability from the substrate.

[0067] none

Claims

1. A resin composition comprising a polyamide resin additive and a polyamide resin, wherein the polyamide resin additive comprises a compound represented by the following formula (1), (in formula (1), R1 and R2 are alkyl groups having 4 to 22 carbon atoms or alkenyl groups having 4 to 22 carbon atoms, L1, L2, and L3 are alkyl groups having 2 to 6 carbon atoms, X is a substituent selected from the group consisting of methyl, ethyl, propyl, butyl, phenyl, and cyclohexyl; m is an integer from 1 to 10, n is an integer from 0 to 10, satisfying 1 ≤ m + n ≤ 10; when m is 2 or more, the plurality of L1s may be the same or different; when n is 2 or more, the plurality of Xs and L2s may be the same or different).

2. The resin composition of claim 1, wherein R1 and R2 are alkyl groups having 6 to 18 carbon atoms or alkenyl groups having 6 to 18 carbon atoms, respectively.

3. The resin composition as requested in item 1 or 2, wherein m is an integer from 1 to 5.

4. The resin composition of claim 1 or 2, wherein the polyamide resin is used as a release agent by an additive.

5. The resin composition of claim 3, wherein the polyamide resin uses an additive as a release agent.

6. The resin composition of claim 1 or 2, wherein the content of additives in the polyamide resin is 0.5 to 5 parts by weight relative to 100 parts by weight of the polyamide resin.

7. The resin composition of claim 1 or 2, wherein the polyamide resin is an amorphous polyamide resin.

8. A molded article made of a resin composition as claimed in any one of claims 1 to 7.

9. A display device comprising a molded article as claimed in claim 8.