Diffusion bonding method, chamber component for processing chamber, and processing chamber

TWI940756BActive Publication Date: 2026-10-01APPLIED MATERIALS INC
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Patent Information

Application Number
TW112102954
Authority / Receiving Office
TW · TW
Patent Type
Patents
Current Assignee / Owner
Priority Date
2023-01-20
Filing Date
2023-01-30
Publication Date
2026-10-01
Estimated Expiration
2043-01-29

AI Technical Summary

Technical Problem

Conventional methods are inadequate for manufacturing pure metal components with complex geometries and are susceptible to contamination, especially in harsh environments, as they often require materials that may leach into the substrate, affecting performance.

Method used

A method involving diffusion bonding of pure metal bodies using a bonding layer with a different chemical composition to create a concentration gradient, facilitating atomic exchange and forming a seamless bond without contaminating materials.

Benefits of technology

Enables the production of pure metal components with complex geometries resistant to contamination, suitable for harsh environments, ensuring consistent performance and avoiding material leaching.

✦ Generated by Eureka AI based on patent content.

Smart Images

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Patent Text Reader

Abstract

A method includes coating a bonding layer having a first chemical composition onto a first surface of a first metal body. The metal body has a second chemical composition. The method further includes positioning a second metal body having the second chemical composition against the first metal body such that the bonding layer is between the first surface of the first metal body and a second surface of the second metal body. The metal body resists diffusion bonding. The bonding layer promotes diffusion bonding of the metal bodies. The method further includes heating the first metal body and the second metal body. The method further includes applying pressure to press the second metal body against the first metal body. The method further includes initiating diffusion bonding between the metal bodies in response to heating and applying pressure for a duration.
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Citation Information

Patent Citations

  • A method for precision bonding of aluminum thin film and dissimilar metal thin film

    CN109175658B

  • Atomic diffusion bonding method and bonding structure

    JP2021186837A

  • Method for bonding work pieces made of stainless steel, nickel or nickel alloys, using a bonding layer consisting of nickel-phosphorous, method for producing a micro-structured component using such method; micro-structured component obtained by such method

    US20090202858A1

  • Method for coating and bonding substrates

    US20150224755A1

  • Showerhead assembly

    US20210238746A1