Resin composition and optical thin film

Abstract

A resin composition having a storage elastic modulus of 3 GPa at 25°C at 10000 Hz and a storage elastic modulus of less than 1 GPa at 25°C at 1 Hz.

Description

Resin composition and optical thin film This invention relates to resin compositions and optical thin films. In recent years, the development of technology that makes electronic circuits and other components included in optical components bendable has progressed, and bendable image display devices have emerged. In bendable image display devices, there are cases where glass substrates are used due to their excellent properties. In order to give the glass substrate flexibility and impact resistance, there are known techniques for combining a specified glass substrate with a specified resin layer (see Patent Document 1). Patent Document 1: International Patent Publication No. 2019 / 066078 (corresponding publication: U.S. Patent Application Publication No. 2020 / 247092) However, traditional stacks combining resin layers and glass substrates have insufficient impact resistance. Therefore, there is a need for resin compositions that can be used as materials for resin layers constituting stacks with excellent impact resistance, and optical films containing such resin layers. The inventors have devoted themselves to researching solutions to the aforementioned problems. As a result, they discovered that resin compositions with storage elastic modulus at 25°C and storage elastic modulus at 1 Hz within specified ranges can solve the aforementioned problems, thus completing this invention. That is, the present invention provides the following content. [1] A resin composition having a storage elastic modulus of 3 GPa or more at 25°C at 10000 Hz and a storage elastic modulus of 1 GPa or less at 25°C at 1 Hz. [2] The resin composition as described in [1] contains filler. [3] An optical thin film comprising a resin layer made of the resin composition described in [1] or [2]. [4] The optical film as described in [3], wherein the aforementioned resin layer is hygroscopic. [5] The optical thin film as described in [3] or [4] further comprises a glass substrate. According to the present invention, a resin composition that can be used as a material for a resin layer constituting a stack with excellent impact resistance and an optical film comprising such a resin layer can be provided. The following embodiments and examples are disclosed to illustrate the present invention in detail. However, the present invention is not limited to the embodiments and examples disclosed below, and can be implemented in any way without departing from the scope of the present invention and its equivalents. The constituent elements of the embodiments disclosed below can be appropriately combined. In the following description, "long strip" film refers to a film having a length of 5 times or more relative to its width, preferably 10 times or more. Specifically, it refers to a film of a length that can be rolled up for storage or transport. There is no particular upper limit to the length of the film; for example, it can be defined as less than 100,000 times its width. In the following description, the term "(meth)acrylic acid" includes "acrylic acid", "methacrylic acid", and combinations thereof. In the following description, the term "composition" includes both "a substance composed of multiple components" and "a substance composed of a single component". [1. Resin composition] According to one embodiment of the present invention, the storage elastic modulus of the resin composition at 25°C at 10000 Hz is 3 GPa or more, and the storage elastic modulus at 25°C at 1 Hz is 1 GPa. The resin composition of this embodiment, by having this storage modulus of elasticity, can be made into a resin layer material constituting a stack with excellent impact resistance. Furthermore, an optical thin film with excellent impact resistance comprising a resin layer made of the resin composition can be obtained. [1.1. Measurement conditions for stored elastic modulus and plotting the principal curve] The storage modulus of elasticity at 10000 Hz and 1 Hz of the resin composition can be determined by using temperature characteristic data of the storage modulus of elasticity at various frequencies measured by a dynamic viscoelasticity measuring device. A master curve at a reference temperature is then plotted, and the values ​​at 10000 Hz and 1 Hz are obtained from the auto-curve readings. The master curve is plotted by converting the temperature dependence data of the storage modulus of elasticity into frequency dependence data using the Williams-Landel-Ferry (WLF) rule. The reference temperature is set at 25°C. The measurement conditions for dynamic viscoelasticity measurement are as follows: A rectangular specimen with a thickness of 50 μm, a width of 8 mm, and a length of 40 mm, formed from a resin composition, is used. The heating rate is set to 4 °C / min. The strain is set to 0.05%. The measurement temperature range is set to −100 °C to 150 °C. The measurement frequencies are set to 1 Hz, 5 Hz, and 10 Hz. A dynamic viscoelasticity measurement device, such as the DMA850 manufactured by TA Instruments, can be used as the measuring apparatus. The storage modulus of elasticity of the resin composition related to this embodiment at 10000 Hz and 25°C is generally 3 GPa or higher, preferably 4 GPa or higher, more preferably 5 GPa or higher, and the higher the value, but it can also be 20 GPa or lower, or 10 GPa or lower. Furthermore, the storage elastic modulus of the resin composition of this embodiment at 25°C at 1 Hz is generally 1 GPa, preferably 0.70 GPa or less, more preferably 0.60 GPa or less, more preferably 0.3 GPa or less, and preferably 0.0001 GPa or more, more preferably 0.0005 GPa or more, and more preferably 0.001 GPa or more. The storage modulus of elasticity of resin components at 25°C with a 1 Hz frequency is typically low, below 1 GPa. Therefore, when a resin layer made of resin components is bent approximately once per second, it is prone to elastic deformation and exhibits a soft layer structure. The storage elastic modulus of resin composition at 10,000 Hz and 25°C is typically 3 GPa, which is quite large. Therefore, when a resin layer made of resin composition is bent about 10,000 times per second, or about once per 1 / 10,000 second, the resin layer does not easily deform elastically and exhibits a hard layer. Thus, at low bending speeds, the resin composition exhibits a soft material, while at high bending speeds, such as when subjected to impact and bent rapidly, it exhibits a hard material. Therefore, the resin layer made from the resin composition of this embodiment has excellent bending properties and impact resistance. The storage modulus of elasticity of a resin composition can be adjusted by changing the types and proportions of the components contained in the resin composition. For example, by incorporating fillers into the resin composition, the storage modulus of elasticity at 25°C at 1 Hz and the storage modulus of elasticity at 25°C at 10000 Hz both tend to increase by a certain ratio. Furthermore, by including the petroleum resin described later in the resin composition, the storage elastic modulus at 25°C at 1 Hz can be kept from changing significantly or decreasing, while the storage elastic modulus at 25°C at 10000 Hz can be increased only. Furthermore, by increasing the weight ratio of petroleum resin to filler in the resin composition (petroleum resin / filler), the storage elastic modulus at 25°C at 1 Hz can be kept low, while the storage elastic modulus at 25°C at 10000 Hz can be increased. [1.2. Composition of the resin] The resin composition can be any as long as it meets the aforementioned storage modulus of elasticity. Thermoplastic resin compositions are preferred. Thermoplastic resin compositions typically contain polymers and any other components as required. Examples of polymers that may be included in resin compositions include: polymers of vinyl aromatic compounds such as polystyrene or their hydrogenated forms; polymers of diene compounds such as polybutadiene and polyisoprene or their hydrogenated forms; polyolefins such as polyethylene and polypropylene; polyarylene sulfides such as polyphenylene sulfide; polyvinyl alcohol; polycarbonate; polyarylene ester; polyether ether; polyether ether; polyarylene ether; polyarylene ether; polyvinyl ether ether; polyvinyl ether ether; polyvinyl ether ether; polyvinyl chloride; acrylic polymers such as polyacrylonitrile and polymethyl methacrylate; multi-component copolymers of these polymers; and polymers having a structure in which silicon atoms are introduced into these polymers. Further examples of polymers included in resin compositions include: ethylene-propylene copolymers and other ethylene-α-olefin copolymers; ethylene-α-olefin-polyene copolymers; copolymers of ethylene and unsaturated carboxylic acid esters such as ethylene-methyl methacrylate and ethylene-butyl acrylate; copolymers of ethylene and fatty acid vinyl esters such as ethylene-vinyl acetate; polymers of alkyl acrylates such as ethyl acrylate, butyl acrylate, hexyl acrylate, 2-ethylhexyl acrylate, and lauryl acrylate; diene copolymers such as polybutadiene, polyisoprene, acrylonitrile-butadiene copolymers, butadiene-isoprene copolymers, butadiene-(meth)acrylate alkyl ester copolymers, butadiene-(meth)acrylate alkyl ester-acrylonitrile copolymers, butadiene-(meth)acrylate alkyl ester-acrylonitrile copolymers, butadiene-(meth)acrylate alkyl ester-acrylonitrile-styrene copolymers; butene-isoprene copolymers; and styrene-butadiene copolymers. Random copolymers, styrene-isoprene random copolymers, styrene-butadiene block copolymers, styrene-butadiene-styrene block copolymers, styrene-isoprene block copolymers, styrene-isoprene-styrene block copolymers, and other aromatic ethylene compound-conjugated diene copolymers; hydrogenated styrene-butadiene random copolymers, hydrogenated styrene-isoprene random copolymers, hydrogenated styrene-butadiene block copolymers, hydrogenated styrene-butadiene-styrene block copolymers, hydrogenated styrene-isoprene block copolymers, hydrogenated styrene-isoprene-styrene block copolymers, and other hydrogenated aromatic ethylene compound-conjugated diene copolymers; low-crystallinity polybutadiene; styrene-grafted ethylene-propylene elastomers; thermoplastic polyester elastomers; and ethylene-based ionic polymers; polymers having a structure containing silicon atoms incorporated into these polymers. The polymer can be a single polymer or a copolymer. Furthermore, the resin composition can contain only one polymer or a combination of two or more polymers. Among them, the polymers included in the resin composition are preferably aromatic ethylene compound-conjugated diene copolymers, hydrogenated aromatic ethylene compound-conjugated diene copolymers, and polymers having a structure in which silicon atoms are introduced into such polymers. As an aromatic ethylene compound-conjugated diene copolymer, an aromatic ethylene compound-conjugated diene block copolymer is preferred. The aromatic ethylene compound-conjugated diene block copolymer is preferably selected from styrene-butadiene block copolymer, styrene-butadiene-styrene block copolymer, styrene-isoprene block copolymer, styrene-isoprene-styrene block copolymer, and mixtures thereof. Hydrogenated aromatic ethylene-conjugated diene copolymers represent hydrides of aromatic ethylene-conjugated diene copolymers. That is, hydrogenated aromatic ethylene-conjugated diene copolymers have a structure obtained by hydrogenating some or all of the carbon-carbon unsaturated bonds or carbon-carbon bonds of the aromatic rings in the main chain and side chains of the aromatic ethylene-conjugated diene copolymer. However, the copolymer and hydride are not limited by their manufacturing methods. The hydrogenation rate of hydrogenated aromatic ethylene compounds-conjugated diene copolymers is typically above 90%, preferably above 97%, and even better above 99%. A higher hydrogenation rate optimizes the resin's heat resistance and lightfastness. Therefore, the hydrogenation rate of the hydride can be determined based on... 1 The result is obtained through H-NMR measurement. The hydrogenation rate of carbon-carbon unsaturated bonds in the main chain and side chains of hydrogenated aromatic ethylene compound-conjugated diene copolymers is preferably above 95%, and above 99% is even better. By increasing the hydrogenation rate of carbon-carbon unsaturated bonds in the main chain and side chains of hydrogenated aromatic ethylene compound-conjugated diene copolymers, the lightfastness and oxidation resistance of the resin composition can be further improved. Furthermore, the hydrogenation rate of the carbon-carbon unsaturated bonds in the aromatic ring of the hydrogenated aromatic ethylene compound-conjugated diene copolymer is preferably above 90%, more preferably above 93%, and even more preferably above 95%. Since increasing the hydrogenation rate of the carbon-carbon unsaturated bonds in the aromatic ring increases the glass transition temperature of the hydride, the heat resistance of the resin composition can be effectively improved. Moreover, the photoelastic coefficient of the resin composition can be reduced, thereby decreasing the delay in the development of the resin layer. As a hydrogenated aromatic ethylene compound-conjugated diene copolymer, a hydrogenated aromatic ethylene compound-conjugated diene block copolymer is preferred. The hydrogenated aromatic ethylene compound-conjugated diene block copolymer is preferably selected from hydrogenated styrene-butadiene block copolymer, hydrogenated styrene-butadiene-styrene block copolymer, hydrogenated styrene-isoprene block copolymer, hydrogenated styrene-isoprene-styrene block copolymer, and mixtures thereof. More specific examples include those described in Japanese Patent Publication No. H2-133406, Japanese Patent Publication No. H2-305814, Japanese Patent Publication No. H3-72512, Japanese Patent Publication No. H3-74409, and International Patent Publication No. 2015 / 099079. As a hydrogenated aromatic ethylene compound-conjugated diene block copolymer, it is preferred to have a structure formed by hydrogenating both the unsaturated bond and the aromatic ring derived from the conjugated diene. The preferred block configuration of hydrogenated aromatic ethylene compound-conjugated diene block copolymers is a triblock copolymer in which blocks [B] of the conjugated diene polymer hydride are bonded to both ends of blocks [A] of the aromatic ethylene polymer hydride; or a pentablock copolymer in which polymer blocks [B] are bonded to both ends of polymer blocks [A], and polymer blocks [A] are further bonded to the other ends of each of the two polymer blocks [B]. In particular, triblock copolymers of [A]-[B]-[A] are preferred because they are easy to manufacture and their properties can be made within a favorable range. In hydrogenated aromatic ethylene compound-conjugated diene block copolymers, the weight ratio (wA / wB) of the total polymer block [A] to the total polymer block [B] to the total polymer block [B] to the total polymer block copolymer (wB) is typically 20 / 80 or more, preferably 30 / 70 or more, and typically 60 / 40 or less, preferably 55 / 45 or less. When the aforementioned ratio wA / wB is above the lower limit of the aforementioned range, the heat resistance of the resin composition can be improved. Furthermore, when it is below the upper limit, the flexibility of the resin composition can be improved. Moreover, when the ratio wA / wB is within the aforementioned range, damage caused by bending of the optical film can be suppressed particularly effectively. (Including resin compositions containing polymers with silicon atom groups) In one embodiment, the resin composition preferably comprises a polymer having a group containing silicon atoms. In the following description, "a group containing silicon atoms" is sometimes appropriately referred to as "Si-containing group". Furthermore, polymers having a group containing silicon atoms are sometimes appropriately referred to as "Si polymers". The resin composition may also include a combination of Si polymers and organosilicon compounds. Si-containing groups are typically polar groups. Therefore, due to the polarity of the Si-containing groups, Si polymers exhibit high affinity for glass. Consequently, resin layers composed of Si polymer-containing resin compositions can have high adhesion to glass substrates. Furthermore, this resin layer can improve the bending resistance of optical thin films. As a silicon-containing compound, alkoxysilicon groups are preferred. Alkoxysilicon groups can react with hydroxyl groups, which are commonly found on the surface of glass substrates, to form bonds. Therefore, the bonding strength between the glass substrate and the resin layer can be effectively improved through the aforementioned bonding. Examples of alkoxysilyl groups include: trialkoxysilyl, alkyldialkoxysilyl, aryldialkoxysilyl, etc. The number of carbon atoms in the trialkoxysilyl group is preferably 3 to 9. Examples of trialkoxysilyl groups include trimethoxysilyl and triethoxysilyl. The number of carbon atoms in the alkyldialkoxysilyl group is preferably 3 to 20. Examples of alkyldialkoxysilyl groups include methyldimethoxysilyl, methyldiethoxysilyl, ethyldimethoxysilyl, ethyldiethoxysilyl, propyldimethoxysilyl, and propyldiethoxysilyl. The number of carbon atoms in the aryldialkoxysilyl group is preferably 8 to 16. Examples of aryldialkoxysilyl groups include phenyldimethoxysilyl and phenyldiethoxysilyl. From the perspective of effectively improving the bonding strength between the glass substrate and the resin layer, trimethoxysilyl is preferred. The silicon group can be one type or two or more types. Si polymers can have a structure with Si-containing groups introduced into the polymer before the Si-containing groups are introduced. Polymers before the Si-containing groups are introduced typically do not contain Si-containing groups. In the following description, to distinguish between polymers before the Si-containing groups are introduced and Si polymers, they are sometimes referred to as "pre-reaction polymers". For example, a Si polymer having alkoxysilicon groups as Si-containing groups can have a structure with alkoxysilicon groups introduced into the pre-reaction polymer. Si polymers can also be graft polymers containing Si groups. Examples of graft polymers containing Si groups include graft polymers comprising "structural units containing Si groups." A structural unit containing a Si group represents a unit having a structure obtained by polymerizing a monomer containing a Si group. Graft polymers comprising "structural units containing Si groups" can be polymers having a structure obtained by graft polymerization of a pre-reaction polymer with a monomer containing a Si group. However, the aforementioned graft polymers are not limited by their manufacturing method. As a pre-reaction polymer, any polymer can be used. For example, the aforementioned polymers listed as examples of polymers included in the resin composition can be used. One pre-reaction polymer can be used alone, or two or more can be used in combination. Among these, the polymer selected as the pre-reaction polymer is preferably a polymer selected from aromatic ethylene compound-conjugated diene copolymers, hydrogenated aromatic ethylene compound-conjugated diene copolymers, and combinations thereof. Accordingly, the Si polymer is preferably a polymer selected from aromatic ethylene compound-conjugated diene copolymers, hydrogenated aromatic ethylene compound-conjugated diene copolymers, and combinations thereof that has a Si-containing structure, and is more preferably a hydrogenated aromatic ethylene compound-conjugated diene copolymer that has a Si-containing structure. That is, the Si polymer is preferably a modified form of a polymer selected from aromatic ethylene compound-conjugated diene copolymer, hydrogenated aromatic ethylene compound-conjugated diene copolymer and combinations thereof, which is made from a compound containing silicon atoms, and is more preferably a modified form of a hydrogenated aromatic ethylene compound-conjugated diene copolymer made from a compound containing silicon atoms. Therefore, the modified body resulting from the compound containing silicon atoms has the structure obtained by modification with the compound containing silicon atoms, and the modified body is not limited by its manufacturing method. As a good example of introducing Si-containing aromatic ethylene compound-conjugated diene copolymer and hydrogenated aromatic ethylene compound-conjugated diene copolymer, examples similar to those of obtaining aromatic ethylene compound-conjugated diene copolymer and hydrogenated aromatic ethylene compound-conjugated diene copolymer contained in resin composition can be given. By reacting the aforementioned pre-reaction polymer with a compound containing a Si group, a Si-containing group can be introduced into the pre-reaction polymer to obtain a Si polymer. For example, a Si-containing graft polymer can be obtained by reacting the pre-reaction polymer with a monomer containing a Si group. Examples of Si-containing compounds that can be used as monomers include: vinyltrimethoxysilane, vinyltriethoxysilane, allyltrimethoxysilane, allyltriethoxysilane, dimethoxymethylvinylsilane, diethoxymethylvinylsilane, p-styryltrimethoxysilane, p-styryltriethoxysilane, 3-methacryloxypropyltrimethoxysilane, 3-methacryloxypropylmethyldimethoxysilane, 3-methacryloxypropyltriethoxysilane, 3-methacryloxypropylmethyldiethoxysilane, 3-methacryloxypropylmethyldiethoxysilane, 3-propenyloxypropyltrimethoxysilane, 3-propenyloxypropyltriethoxysilane, and 2-norphene-5-yltrimethoxysilane, etc., which are vinyl unsaturated silane compounds with alkoxysilane groups. Compounds containing Si groups can be used alone or in combination of two or more. When introducing alkoxysilicon groups, the amount of alkoxysilicon groups introduced relative to 100 parts by weight of the polymer before the reaction is typically 0.1 parts by weight or more, preferably 0.2 parts by weight or more, more preferably 0.3 parts by weight or more, and typically 10 parts by weight or less, preferably 5 parts by weight or less, more preferably 3 parts by weight or less. When the amount of alkoxysilicon groups introduced is within the aforementioned range, high bonding strength can be maintained because the degree of crosslinking between alkoxysilicon groups decomposed due to moisture can be suppressed from becoming excessively high. As an example of a method for introducing alkoxysilicon groups, the one described in International Patent Publication No. 2015 / 099079 can be cited. Furthermore, the amount of Si groups can be utilized... 1 H-NMR spectroscopy measurement. When measuring the amount of Si groups, if the amount of Si groups is low, the number of cumulative measurements needs to be increased. As described above, the introduction of alkoxysilyl groups into the polymer before the reaction is called silane modification. During silane modification, the alkoxysilyl groups can be directly bonded to the polymer before the reaction; for example, they can also be bonded through intervening divalent organic groups such as alkyl groups. Hereinafter, the polymer obtained by silane modification of the polymer before the reaction will sometimes be referred to as a "silane-modified polymer." As a silane-modified polymer, polymers selected from one or more of the following are preferred: silane-modified products of hydrogenated styrene-butadiene block copolymers, silane-modified products of hydrogenated styrene-butadiene-styrene block copolymers, silane-modified products of hydrogenated styrene-isoprene block copolymers, and silane-modified products of hydrogenated styrene-isoprene-styrene block copolymers. The weight-average molecular weight (Mw) of the Si polymer is preferably 20,000, more preferably 30,000 or higher, especially 35,000 or higher, and preferably below 200,000, more preferably below 100,000, and especially preferably below 70,000. Furthermore, the molecular weight distribution (Mw / Mn) of the Si polymer is preferably below 4, more preferably below 3, especially preferably below 2, and preferably above 1. Here, Mn represents the number average molecular weight. When the weight-average molecular weight (Mw) and molecular weight distribution (Mw / Mn) of the Si polymer are within the aforementioned ranges, the mechanical strength and heat resistance of the resin composition can be improved. The weight-average molecular weight of the polymer is measured using gel permeation chromatography (GPC) with tetrahydrofuran as the solvent, converted to polystyrene. There are no additional limitations on the glass transition temperature (Tg) of Si polymers, but it is preferred to be above 40°C, better above 70°C, and below 200°C, with 180°C being more desirable and 160°C being even better. The glass transition temperature can be measured by the peak of the loss tangent tanδ (loss modulus / storage modulus) using a dynamic viscoelasticity measuring device. The amount of Si polymer contained in the resin composition is preferably 15% by weight or more, more preferably 20% by weight or more, and generally less than 100% by weight, more preferably 80% by weight or less, more preferably 60% by weight or less, and especially preferably less than 50% by weight, relative to 100% by weight of the resin composition. (Resin composition containing organosilicone compounds) In another embodiment, the resin composition preferably contains an organosilicone compound. Organosilicon compounds have a high affinity for glass. Therefore, resin layers made from resin compositions containing organosilicon compounds can exhibit high adhesion to glass substrates. Furthermore, this resin layer can improve the bending resistance of optical films. Resin compositions containing organosilicon compounds typically combine a polymer with the organosilicon compound. Examples of polymers include acrylic polymers, carbamate polymers, polyester polymers, rubber polymers, and epoxy polymers. Furthermore, for example, the Si polymers mentioned above, or their unreacted polymers, can be used. A single polymer can be used, or two or more can be used in combination. There are no particular limitations on the weight average molecular weight (Mw) of the polymer contained in the resin composition containing organosilicone compounds, but it is preferable that the weight average molecular weight (Mw) of the polymer is within the same range as that of the Si polymer. Furthermore, it is preferable that the molecular weight distribution (Mw / Mn) of the polymer contained in the resin composition containing organosilicone compounds is within the same range as that of the Si polymer. Moreover, it is preferable that the glass transition temperature of the polymer contained in the resin composition containing organosilicone compounds is within the same range as that of the Si polymer. The amount of polymer contained in a resin composition containing organosilicon compounds is preferably within the same range as the amount of Si polymer contained in a resin composition containing Si polymers. Organosilicon compounds are composed of organic groups combined with silicon atoms. The organic groups of organosilicon compounds exhibit high affinity for organic components such as polymers contained in resin compositions. Furthermore, the silicon atoms of organosilicon compounds exhibit high affinity for glass substrates. Therefore, resin layers containing organosilicon compounds have high adhesion to glass substrates. Silicone coupling agents are preferred as organosilicone compounds. Silicone coupling agents are particularly effective in improving the bonding strength between the glass substrate and the resin layer. Examples of silicone coupling agents include: vinyltrimethoxysilane, vinyltriethoxysilane, 2-(3,4-epoxycyclohexyl)ethyltrimethoxysilane, 3-epoxypropoxypropylmethyldimethoxysilane, 3-epoxypropoxypropyltrimethoxysilane, 3-epoxypropoxypropylmethyldiethoxysilane, 3-epoxypropoxypropyltriethoxysilane, p-styryltrimethoxysilane, 3-methacryloxypropylmethyldimethoxysilane, 3-methacryloxypropyltrimethoxysilane, 3-methacryloxypropylmethyldiethoxysilane, 3-methacryloxypropyltriethoxysilane, 3-propenyloxypropyltriethoxysilane, 3-propenyloxypropyltriethoxysilane. N-(2-aminoethyl)-3-aminopropylmethyldimethoxysilane, N-(2-aminoethyl)-3-aminopropyltrimethoxysilane, N-(2-aminoethyl)-3-aminopropyltriethoxysilane, 3-aminopropyltrimethoxysilane, 3-aminopropyltriethoxysilane, 3-triethoxysilyl-N-(1,3-dimethylbutylene)propylamine, N-phenyl-3-aminopropyltrimethoxysilane, 3-ureapropyltriethoxysilane, 3-mercaptopropylmethyldimethoxysilane, 3-mercaptopropyltrimethoxysilane, tetrasulfide bis(triethoxysilylpropyl) and 3-isocyanate propyltriethoxysilane. Organosilicon compounds can be used alone or in combination of two or more. The amount of organosilicone compound relative to 100 parts by weight of polymer is preferably 0.01 parts by weight or more, preferably 0.03 parts by weight or more, especially 0.05 parts by weight or more, preferably 10 parts by weight or less, preferably 5 parts by weight or less, and especially preferably 3 parts by weight or less. (Any ingredient) The resin composition may also include any combination of components in the aforementioned polymer. Any component may be used alone or in any ratio of two or more. The resin composition may also include, for example, hydrogenated C9 petroleum resin as an optional component. Hydrogenated C9 petroleum resin is a resin obtained by hydrogenating C9 petroleum resin, which is obtained by cationic polymerization of the C9 fraction obtained from light oil cracking. The C9 fraction generally contains hydrocarbons with nine carbon atoms, including, for example, styrene, vinyltoluene, α-methylstyrene, indene, etc. Because the polymers contained in hydrogenated C9-based petroleum resins have a cyclic backbone, polymer movement is restricted by their steric hindrance, thus materials containing hydrogenated C9-based petroleum resins tend to become rigid. Hydrogenated C9-based petroleum resins are not limited by their manufacturing methods. By including hydrogenated C9-based petroleum resin, the hardness of the resin composition can be increased without changing its color. Therefore, by appropriately including hydrogenated C9-based petroleum resin in the resin composition, the storage modulus of elasticity of the resin composition can be adjusted to the desired range. Examples of commercially available products containing hydrogenated C9 series petroleum resins include ARKON P90, P100, P115, P135, and P140 manufactured by Arakawa Chemical Industry Co., Ltd. The amount of hydrogenated C9-based petroleum resin in the resin composition is preferably 5% by weight or more, more preferably 10% by weight or more, more preferably 12% by weight or more, and preferably 50% by weight or less, more preferably 45% by weight or less, more preferably 40% by weight or less, less than 15% by weight or less, and more preferably 14% by weight or less. By including hydrogenated C9-based petroleum resin in the resin composition at the aforementioned proportions, especially in resin compositions containing Si polymers, the storage modulus of elasticity of the resin composition can be easily adjusted to the desired range. Resin compositions may also contain fillers. By including fillers in addition to polymers, the hardness of resin compositions can be increased, and the storage modulus of elasticity of resin compositions can be easily adjusted to the desired range. Fillers included in resin compositions can be either inorganic or organic substances, or a combination of inorganic and organic substances. However, from the perspective of improving the hardness of the resin composition, inorganic substances are preferred. Examples of inorganic fillers include: zeolite, magnesium oxide, aluminum oxide, talc, hydrotalcite, titanium oxide, and calcium oxide. The packing material is typically in granular form. The average particle size of the packing material is preferably ≥0.01 μm, more preferably ≥0.02 μm, even better ≥0.05 μm, and preferably ≤1 μm, more preferably ≤0.5 μm, and even better ≤0.3 μm. Here, the average particle size of the filler is the volume average particle size measured by laser diffraction. The average particle size of the filler can be measured using the "LA-960V series" laser diffraction / scattering particle size distribution measuring device manufactured by Horiba Corporation. By ensuring that the average particle size of the filler is within the aforementioned range, the filler will be properly dispersed in the resin composition, and the storage elastic modulus of the resin composition can be easily adjusted to the desired range. The amount of filler in the resin composition is preferably 20% by weight or more, more preferably 30% by weight or more, more preferably 40% by weight or more, more preferably 50% by weight or more, more preferably 55% by weight or more, and preferably 80% by weight or less, more preferably 75% by weight or less, and more preferably 70% by weight or less. By including the filler in the resin composition in the aforementioned proportions, the storage modulus of elasticity of the resin composition can be easily adjusted to the desired range. When the resin composition includes petroleum resin and filler, the weight ratio of petroleum resin to filler in the resin composition (petroleum resin / filler) is preferably 0.05 or more, more preferably 0.1 or more, more preferably 0.20 or more, and preferably 0.4 or less, more preferably 0.29 or less, and more preferably 0.25 or less. Hygroscopic substances can also be used as fillers. By including hygroscopic fillers in the resin composition, a layer formed from the resin composition can be made into a hygroscopic layer. Examples of hygroscopic fillers include: hydrotalcite, zeolite, magnesium oxide, calcium oxide, etc. Resin compositions, for example, may also include dispersants as optional components that facilitate the dispersion of fillers. By making the fillers less prone to aggregation through dispersants, the transparency of the resin composition can be improved. Examples of dispersants include: the "ARON (registered trademark)" and "JURYMER (registered trademark)" series from Toa Synthetic Co., Ltd., the "AQUALIC (registered trademark)" series from Nippon Shokubai Co., Ltd., the "FLOWLEN (registered trademark)" series from Kyoeisha Chemical Co., Ltd., the "DISPARLON (registered trademark)" series from Kusumoto Kasei Co., Ltd., the "Sokalan (registered trademark)" series and "EFKA" series from BASF Co., Ltd., the "DISPERBYK (registered trademark)" series and "Anti-Terra" series from BYK-Chemie Co., Ltd., the "SOLSPERSE (registered trademark)" series from Lubrizol Japan Co., Ltd., and the "AJISPER" series from Ajinomoto Fine-Techno Co., Ltd., among other commercially available dispersants. The amount of dispersant in the resin composition is preferably 0.1% by weight or more, more preferably 0.5% by weight or more, more preferably 1% by weight or more, and preferably 8% by weight or less, more preferably 6% by weight or less, and more preferably 5% by weight or less. The resin composition may, for example, include antioxidants as an optional component. Examples of antioxidants include phosphorus-based antioxidants, phenolic antioxidants, and sulfur-based antioxidants, with phosphorus-based antioxidants that produce less coloring being preferred. Examples of phosphorus-based antioxidants include: triphenyl phosphite, diphenyl phosphite isodecanyl ester, phenyl phosphite diisodecyl ester, nonylphenyl phosphite, dinonylphenyl phosphite, 2,4-di(tributyl)phenyl phosphite, 10-[3,5-di(tributyl)-4-hydroxybenzyl]-9,10-dihydro-9-oxo-10-phosphophyllene-10-oxide, and other monophosphite compounds; 4,4′-butylenebis[3-methyl-6-tributylphenyl phosphite di(tetracene)] Compounds such as 4,4′-isopropylidene bis[phenyl phosphite dialkyl (C12-C15)] ester; 6-[3-(3-tertiary butyl-4-hydroxy-5-methylphenyl)propoxy]-2,4,8,10-tetra(tertiary butyl)diphenyl[d,f][1.3.2]phosphodioxanone, 6-{3-[3,5-bis(tertiary butyl)-4-hydroxyphenyl]propoxy}-2,4,8,10-tetra(tertiary butyl)diphenyl[d,f][1.3.2]phosphodioxanone, etc. Furthermore, antioxidants can be used alone or in combination of two or more. The amount of antioxidant relative to 100 parts by weight of the polymer contained in the resin composition is preferably 0.01 parts by weight or more, more preferably 0.05 parts by weight or more, more preferably 0.1 parts by weight or more, and preferably 1 part by weight or less, more preferably 0.5 parts by weight or less, and more preferably 0.3 parts by weight or less. Other components that may be included in the resin composition include, for example, light stabilizers, ultraviolet absorbers, lubricants, and the aforementioned organosilicone compounds. The resin composition is preferably substantially free of solvent. The weight percentage of solvent in the resin composition is preferably 0.5% by weight or less, preferably 0.1% by weight or less, preferably 0.01% by weight or less, and is generally 0% by weight or more, but may also be 0% by weight. [1.3. Uses of Resin Compositions] The aforementioned resin composition yields a resin layer with excellent bending resistance and impact resistance. This resin layer, possessing excellent bending resistance and impact resistance, can be appropriately used as a component of parts where bending resistance and impact resistance are essential. For example, combining an optical film comprising a resin layer made from the aforementioned resin composition with a cover glass of a bendable image display device improves the bending resistance and impact resistance of the cover glass. Furthermore, an optical film comprising a resin layer made from the aforementioned resin composition and a glass substrate can be appropriately used as an alternative to the cover glass of an image display device. [2. Optical thin films] [2.1. Resin layer] An optical thin film according to one embodiment of the present invention comprises a resin layer and any other layers as required. The resin layer is made of the aforementioned resin composition. Preferably, the resin layer consists only of the aforementioned resin composition. Because the resin layer is formed from the aforementioned resin composition having a specified storage modulus of elasticity, it exhibits excellent bending resistance and impact resistance. In one embodiment, the resin layer preferably contains only "a resin composition comprising the aforementioned Si polymer". Furthermore, in another embodiment, the resin layer preferably contains only "a resin composition containing organosilicon compounds". The resin layer can have a multilayer structure or a single-layer structure, but a single-layer structure is preferred. The thickness of the resin layer is preferably 3 μm or more, preferably 5 μm or more, even more preferably 10 μm or more, even more preferably 20 μm or more, even more preferably 25 μm or more, even more preferably 40 μm or more, and preferably less than 1000 μm, even more preferably 500 μm, even more preferably 200 μm, and even more preferably 100 μm. By ensuring the resin layer thickness falls within the aforementioned range, optical thin films with superior impact resistance can be produced. The resin layer is preferably hygroscopic. This allows for the suitable use of optical films containing resin layers as sealing films for electronic components such as organic electroluminescent elements. The hygroscopicity of the resin layer is evaluated by the following hygroscopicity test. First, the weight of the glass substrate is measured. A resin layer is formed on this glass substrate to create a stacked sample of the glass substrate and resin layer. Then, the stacked sample is placed in a nitrogen atmosphere at 100°C for 1 hour, and its weight is measured and defined as the initial weight W0. Next, the stacked sample is placed in a constant temperature and humidity bath at 25°C and 50% RH for 1 hour. After this period, the weight of the stacked sample is measured and defined as the post-test weight W1. The glass substrate is considered to have no weight change before and after the test. The weight change rate ΔW (%) of the resin layer before and after the hygroscopicity test is calculated using the following formula. The larger the weight change rate ΔW, the greater the hygroscopicity of the resin layer. Formula: ΔW (%) = (W1 − W0) / (W0 − weight of glass substrate) × 100 The weight change rate ΔW is preferably above 3%, better above 4%, even better above 5%, preferably below 25%, better below 20%, and even better below 15%. [2.2. Glass substrate] In addition to the aforementioned resin layer, the optical thin film may also include a glass substrate, and it is preferred that it includes a glass substrate. In one embodiment, it is preferable that the main surface of the resin layer is in direct contact with the main surface of the glass substrate. Furthermore, in another embodiment, an adhesive layer or any other layer may be present between the resin layer and the glass substrate. The thickness of the glass substrate is preferably below 100 μm, preferably below 80 μm, and preferably below 70 μm. Even with such a thin glass substrate, the optical thin film exhibits excellent impact resistance. The thickness of the glass substrate is preferably 25 μm or more, preferably 30 μm or more, and even more preferably 35 μm or more. By ensuring that the thickness of the glass substrate is above the aforementioned lower limit, the optical thin film can possess excellent impact resistance. Examples of glass used to form glass substrates are not particularly limited, but can include: soda glass, borosilicate glass, alkali-free glass, etc. It can also be used for cleaning, surface treatment, and chemical strengthening treatment of glass substrates by immersing glass films in chemical agents. When an optical thin film comprises a resin layer and a glass substrate, the ratio of the resin layer thickness to the glass substrate thickness (resin layer thickness / glass substrate thickness) is preferably 0.2 or more, more preferably 0.3 or more, more preferably 0.5 or more, and preferably 5 or less, more preferably 3 or less, and more preferably 2 or less. This allows the optical thin film to possess superior bending resistance and impact resistance. In cases where the optical film comprises a resin layer and a glass substrate, the optical film, for example, can be appropriately used as an alternative to the cover glass of a bendable image display device. In particular, by placing the optical film in the image display device with the glass substrate as the visible side, the bending resistance and impact resistance of the optical film can be effectively utilized. [2.3. Any layer contained in an optical thin film] In addition to the aforementioned resin layer, the optical thin film may include any layer other than the glass substrate. Examples of arbitrary layers include: high elastic modulus layer, adhesive layer, color filter layer, black matrix layer, transparent electrode layer, metal mesh layer, etc. The high elastic modulus layer is a resin-formed layer with a storage elastic modulus exceeding 1 GPa at 25°C for both 1 Hz and 10000 Hz. For example, it comprises layers of polymers such as polyethylene terephthalate, polyimide, cyclic olefin polymers (COP), and acrylic polymers to satisfy the aforementioned storage elastic modulus. Optical films, for example, may have a stacked structure of glass substrate / resin layer / high elastic modulus layer, or a stacked structure of glass substrate / high elastic modulus layer / resin layer. The thickness of the high elastic modulus layer is preferably above 2 μm, better above 5 μm, even better above 15 μm, preferably below 150 μm, better below 100 μm, and even better below 75 μm. Impact resistance can be further improved by using a high-elasticity modulus layer. When the optical thin film further comprises a high elastic modulus layer in addition to the aforementioned resin layer, the ratio of the resin layer thickness to the high elastic modulus layer thickness (resin layer thickness / high elastic modulus layer thickness) is preferably 0.2 or more, more preferably 0.3 or more, more preferably 0.5 or more, and preferably 10 or less, more preferably 5 or less, and more preferably 3 or less. This allows the optical thin film to possess superior impact resistance. [2.4. Physical properties of optical thin films, etc.] The thickness of the optical film is not particularly limited, but it is preferable to have a thickness that allows it to be rolled up when it is in the form of a long strip, for example, 3 μm to 300 μm. Optical films can be in the form of strips or cut into sheets. The haze of optical thin films is preferably below 3%, less than 2%, and even better below 1%, with lower being preferable. It is typically above 0%, and can also be above 0.1%. This low haze makes optical thin films suitable for use as components in image display devices. Haze can be measured using turbidity meters. The optical film exhibits excellent impact resistance. The impact resistance of the optical film is evaluated by the following drop height test. (1) The optical film is placed on a glass substrate with a 5 cm angle to prepare a test piece containing the glass substrate. (This step is omitted if the optical film contains a glass substrate.) (2) The test piece containing the glass substrate with a 5 cm angle (or, if the optical film contains a glass substrate, a test piece cut to a 5 cm angle) is attached to a polyethylene terephthalate (PET) substrate. An adhesive film is used for attachment. Attachment is performed with the glass substrate of the test piece exposed on the surface. (3) The test piece attached to the PET substrate is placed on a metal plate with the exposed glass substrate facing upwards. Next, a 5 g ballpoint pen with a 0.7 mm diameter tip is dropped onto the test piece with the tip facing downwards. The height of the test piece from the tip is gradually increased by 1 cm until the glass substrate breaks. The height from the highest test piece (which will not cause damage to the glass substrate) to the pen tip is defined as the pen drop test height (cm). The ideal pen drop height for optical thin films is 8 cm or more, with 10 cm being the best. [2.5. Applications of Optical Thin Films] The aforementioned optical thin film, for example, can be appropriately used as a component in image display devices such as liquid crystal display devices and organic electroluminescent display devices. Therefore, this disclosure provides an image display device comprising the aforementioned optical thin film. [2.6. Manufacturing method of optical thin film] Optical thin films can be manufactured by any method. The method for forming the resin layer contained in the optical thin film is not particularly limited, and examples include: extrusion molding, solution casting, and coating. Among these methods, coating is preferred because it allows for the formation of thin resin layers and easy dispersion of fillers. For example, the aforementioned resin composition is dissolved or dispersed in a solvent to prepare a liquid resin layer forming solution. This solution is then coated onto a substrate, and the coating is dried as needed, thereby forming a resin layer on the substrate. In this specification, the term "solvent" includes a dispersing medium, and the term "solution" includes a dispersion. The stack of substrate and resin layer can also be used directly as an optical film. Alternatively, any layer can be further attached to the stack of substrate and resin layer to manufacture an optical film comprising a substrate, a resin layer, and that arbitrary layer. The substrate can also be peeled off from the stack of substrate and resin layer, using only the resin layer as an optical film. Alternatively, the resin layer can be transferred from the stack of substrate and resin layer to another arbitrary layer, and then the substrate can be peeled off, thereby manufacturing an optical film comprising that arbitrary layer and the resin layer. It is appropriate to use the aforementioned glass substrate as the substrate on which the resin layer is formed. When using a glass substrate as the substrate, it is preferable to use the stack of the glass substrate and the resin layer directly as the optical thin film. When manufacturing optical films by bonding a formed resin layer to any layer, a suitable adhesive or adhesive layer may be used. Example The following embodiments are disclosed to specifically illustrate the present invention. However, the present invention is not limited to the embodiments disclosed below, and may be implemented in any way without departing from the scope of the present invention and its equivalents. In the following description, "%" and "parts" represent quantities by weight unless otherwise noted. Furthermore, the operations described below are performed at room temperature (20℃±15℃) and normal pressure (1 atm) unless otherwise noted. [Evaluation Method] (Methods for measuring the molecular weight of polymers) Unless otherwise noted, the weight-average molecular weight (Mw), number-average molecular weight (Mn), and molecular weight distribution (Mw / Mn) of the polymer are measured by gel permeation chromatography (GPC) with tetrahydrofuran as the solvent, converted to polystyrene values. (Method for measuring the hydrogenation rate of hydrides) The hydrogenation rate of hydrides is achieved by utilizing 1 It is determined by H-NMR measurement. (Measurement of the volume average particle size of the packing material) Using a resin layer forming solution containing filler as a sample, the volume average particle size of the filler was measured by using a laser diffraction / scattering particle size distribution measuring device "LA-960V series" manufactured by Horiba Corporation according to the laser diffraction method. (Thickness of the layer) The thickness of the layer was measured using a thickness gauge manufactured by Mitutoyo. (Glass transfer temperature) Unless otherwise noted, the glass transition temperature (Tg) of polymers shall be measured in accordance with the following procedure. Using a dynamic viscoelasticity measuring device (TA Instruments "DMA850"), the storage modulus, loss modulus, and tanδ (loss modulus / storage modulus) were measured under the conditions of a heating rate of 4°C / min, a strain of 0.05%, and a frequency of 1 Hz. The temperature at which the maximum value of tanδ was read (tanδ peak temperature) was defined as the glass transition temperature Tg. (Measurement of storage elastic modulus) A 38 μm thick polyethylene terephthalate film (Mitsubishi Chemical Corporation "MRV38", hereinafter also referred to as release PET film) was prepared with a release treatment applied to its surface. A resin layer forming solution was coated onto the release PET film to a thickness of 50 μm after drying, and then dried using a heating plate at 110°C to form a sample film on the release PET film. Peel off the self-release PET film from the obtained sample film and cut a test piece with a width of 8 mm and a length of 40 mm from the sample film. For the cut specimens, the measurement temperature range of −100℃ to 150℃ was defined. A dynamic viscoelasticity measuring device (TA Instruments "DMA850") was used to measure the stored elastic modulus under the following conditions: heating rate 4℃ / min, strain 0.05%, and frequencies of 1 Hz, 5 Hz, and 10 Hz. The measurement results were used to generate a master curve at a reference temperature of 25℃ using the software provided with the device, and the stored elastic modulus at 1 Hz and 10000 Hz was read. (Pen drop height test) A pen drop height test was conducted on the obtained optical thin film. Test pieces were prepared by attaching the 5 cm angle optical films obtained in each embodiment and comparative example to a 75 μm thick polyethylene terephthalate (PET) substrate using a 25 μm thick adhesive film (Nitto Denko Corporation "CS9681US"). The glass substrate with the optical film attached was exposed on the surface. The test piece was placed on a metal plate with the exposed glass substrate facing upwards. Next, a 5g ballpoint pen with a 0.7mm diameter tip was dropped onto the test piece, tip down. The height of the test piece from the pen tip was gradually increased by 1 cm until the glass substrate broke. The highest point from the pen tip where the glass substrate did not break was defined as the drop test height (cm). A higher drop test height indicates better impact resistance of the optical film. (Hygroscopicity test) An optical film with a 5 cm angle (a stack of resin layers formed on a glass substrate) obtained by forming a resin layer on a glass substrate using the operations of each embodiment and comparative example, was placed in a nitrogen atmosphere at 100°C for 1 hour. The weight of the optical film was then measured and defined as the weight W0 before the test. Subsequently, the optical film was placed in a constant temperature and humidity bath at 25°C and 50% Rh for 1 hour. After placement, the weight of the optical film was measured and defined as the weight W1 after the test. The glass substrate was considered to have no weight change before and after the test, and the weight increase of the optical film before and after the test (W1−W0) was defined as the weight increase of the resin layer (W1−W0). The weight change rate ΔW (%) of the resin layer before and after the hygroscopicity test was calculated using the following formula. Formula: ΔW (%) = (W1 − W0) / (W0 − weight of glass substrate) × 100 [Manufacturing Example 1: Manufacturing of a polymer (a) having polar groups containing silicon atoms] (Preparation of hydrogenated block copolymers) Using styrene as an aromatic ethylene compound and isoprene as a chain-like conjugated diene compound, a hydrogenated block copolymer (hydrogenated block copolymer) having a triblock structure with polymer blocks [A] bonded to both ends of polymer block [B] is manufactured by the following procedure. In a reactor equipped with a stirring device and fully purged with nitrogen, 256 parts of dehydrated cyclohexane, 25.0 parts of dehydrated styrene, and 0.615 parts of di-n-butyl ether were added. While stirring at 60°C, 1.35 parts of n-butyllithium (15% cyclohexane solution) were added to initiate polymerization. The reaction was then carried out at 60°C with stirring for 60 minutes. The polymerization conversion rate at this point was 99.5% (polymerization conversion rate was measured by gas chromatography. The same applies below). Next, 50.0 parts of dehydrated isoprene were added, and the mixture was stirred continuously at the same temperature for 30 minutes. The polymerization conversion rate at this point was 99%. Then, 25.0 parts of dehydrated styrene were added, and the mixture was stirred at the same temperature for 60 minutes. At this point, the polymerization conversion rate was almost 100%. Subsequently, 0.5 parts of isopropanol were added to the reaction solution to stop the reaction, resulting in a solution (i) containing the block copolymer. The block copolymer in the obtained solution (i) has a weight average molecular weight (Mw) of 44,900 and a molecular weight distribution (Mw / Mn) of 1.03. Next, solution (i) was transferred to a pressure reactor equipped with a stirrer. 4.0 parts of a silica-alumina supported nickel catalyst (E22U, 60% nickel content; manufactured by Nichih Chemical Co., Ltd.) and 350 parts of dehydrated cyclohexane were added to solution (i) as hydrogenation catalysts and mixed. The reactor interior was purged with hydrogen, and the solution was further stirred while hydrogen was supplied. The hydrogenation reaction was carried out for 6 hours at a temperature of 170°C and a pressure of 4.5 MPa to hydrogenate the block copolymer, thereby obtaining a solution (iii) containing hydride (ii) of the block copolymer. The weight-average molecular weight (Mw) of hydride (ii) in solution (iii) was 45,100, and the molecular weight distribution (Mw / Mn) was 1.04. After the hydrogenation reaction is completed, solution (iii) is filtered to remove the hydrogenation catalyst. Then, 1.0 part of a xylene solution containing 0.1 parts of 6-[3-(3-tert-butyl-4-hydroxy-5-methylphenyl)propoxy]-2,4,8,10-tetra(tert-butyl)diphenyl[d,f][1.3.2]phosphine dioxane (manufactured by Sumitomo Chemical Co., Ltd., "SUMILIZER (registered trademark) GP". Hereinafter referred to as "antioxidant A") is added to the filtered solution (iii) to dissolve it, thus obtaining solution (iv). Subsequently, solution (iv) was filtered using a Zeta Plus (registered trademark) 30H filter (manufactured by CUNO, pore size 0.5 μm to 1 μm), and then further filtered sequentially using another metal fiber filter (pore size 0.4 μm, manufactured by NICHIDAI) to remove minute solid components. Cyclohexane, xylene, and other volatile components acting as solvents were removed from the filtered solution (iv) using a cylindrical concentrator (trade name "KONTRO", manufactured by Hitachi, Ltd.) at a temperature of 260°C and a pressure below 0.001 MPa. Then, the solid components were molten and extruded into strands using a mold directly connected to the aforementioned concentrator, cooled, and cut using a granulator to obtain 85 parts of granules (v) containing hydrides of block copolymers and antioxidant A. The weight average molecular weight (Mw) of the hydrides of the block copolymers (hydrogenated block copolymers) in the obtained granules (v) was 45,000, and the molecular weight distribution (Mw / Mn) was 1.08. Furthermore, the hydrogenation rate is 99.9%. (Preparation of silane-modified hydrogenated block copolymers) For 100 parts of granules (v), 2.0 parts of vinyltrimethoxysilane and 0.2 parts of di(tributyl) peroxide were added to obtain a mixture. This mixture was kneaded using a biaxial extruder at a barrel temperature of 210°C and a residence time of 80-90 seconds. The kneaded mixture was extruded and cut by a granulator to obtain granules (vi) as silane-modified products of hydrogenated block copolymers of polymer (a) containing polar groups containing silicon atoms. Film-shaped specimens were prepared from these granules (vi), and the glass transition temperature Tg was evaluated using the tanδ peak of a dynamic viscoelasticity measuring device, which yielded a result of 124°C. [Example 1] (1-1. Preparation of solution for resin layer formation) A solution for forming a resin layer was prepared by mixing 26 parts of polymer (a) manufactured in Example 1, 13 parts of hydrogenated C9 petroleum resin "ARKON P140" (manufactured by Arakawa Chemical Industry Co., Ltd.), 57 parts of hydrotalcite as filler, 4 parts of "SOLSPERSE3000" (manufactured by Lubrizol Japan Co., Ltd.) as dispersant for the filler, and 200 parts of ethylcyclohexane. The volume average particle size of the filler measured from this solution was 125 nm. Furthermore, using the aforementioned method, a specimen formed from the resin composition was prepared from this solution for measuring the storage elastic modulus, and the storage elastic modulus of the resin composition was measured to obtain the master curve at a reference temperature of 25°C. The storage elastic modulus of the resin composition at 25°C was 0.6 GPa at 1 Hz and 5.0 GPa at 10000 Hz. The weight ratios of the components in the resin composition forming the resin layer (the composition from which the solvent is removed by the resin layer formation solution) are as follows: Polymer (a) 26% by weight, Filler 57% by weight, Petroleum resin 13% by weight, Dispersant 4% by weight, and the weight ratio of petroleum resin to filler (petroleum resin / filler) is 0.23. (1-2. Manufacturing of optical thin films) Next, a resin layer forming solution was applied to a glass substrate with a thickness of 50 μm and a 5 cm angle, after measuring its weight, to achieve a dried film thickness of 50 μm. The substrate was then dried on a heating plate at 110°C. This yielded a stack with a 5 cm angle, serving as an optical thin film. This stack has a layer structure of (glass substrate) / (resin layer). Two stacks of optical thin films were fabricated; one stack was used for a pen drop height test, and the remaining stack was used for a moisture absorption test. (1-3. Pen drop height test) Using the obtained stack as an optical thin film, a pen drop height test was conducted using the aforementioned method. The results showed no damage up to a height of 10 cm, but damage occurred at a height of 11 cm. (1-4. Hygroscopicity test) The obtained stack as an optical film was used to evaluate the hygroscopicity of the resin layer using the aforementioned method. The result showed that the weight gain of the optical film (W1−W0) (i.e., the weight gain of the resin layer (W1−W0)) was 4 mg. The weight change rate ΔW (%) of the resin layer before and after the hygroscopicity test was 5.2%. [Example 2] (2-1. Preparation of solution for resin layer formation) A solution for forming a resin layer was prepared by mixing 23 parts of polymer (a) manufactured in Example 1, 13 parts of hydrogenated C9 petroleum resin "ARKON P90" (manufactured by Arakawa Chemical Industry Co., Ltd.), 60 parts of hydrotalcite as filler, 4 parts of SOLSPERSE3000 (manufactured by Lubrizol Japan Co., Ltd.) as dispersant for the filler, and 200 parts of ethylcyclohexane. The volume average particle size of the filler, measured from the solution volume, was 125 nm. Furthermore, using the aforementioned method, a specimen formed from the resin composition was prepared from this solution for measuring the storage elastic modulus, and the storage elastic modulus of the resin composition was measured to obtain the master curve at a reference temperature of 25°C. The storage elastic modulus of the resin composition at 25°C was 0.2 GPa at 1 Hz and 4.3 GPa at 10000 Hz. The weight ratios of the components in the resin composition forming the resin layer (the composition from which the solvent is removed by the resin layer formation solution) are as follows: Polymer (a) 23% by weight, Filler 60% by weight, Petroleum resin 13% by weight, Dispersant 4% by weight, and the weight ratio of petroleum resin to filler (petroleum resin / filler) is 0.22. (2-2. Fabrication of optical thin films) Using the obtained resin layer forming solution, and following the procedure in Example 1 (1-2. Manufacturing of optical films), a stacked body as an optical film was obtained. This stacked body has a layer structure of (glass substrate) / (resin layer). Two stacked bodies as optical films were made, one of which was used for a pen drop height test, and the remaining one was used for a moisture absorption test. (2-3. Pen drop height test) Using the obtained stack as an optical thin film, a pen drop height test was conducted using the aforementioned method. The results showed no damage up to a height of 10 cm, but damage occurred at a height of 11 cm. (2-4. Hygroscopicity test) The obtained stack as an optical film was used to evaluate the hygroscopicity of the resin layer using the aforementioned method. The result showed that the weight gain of the optical film (W1−W0) (i.e., the weight gain of the resin layer (W1−W0)) was 4 mg. The weight change rate ΔW (%) of the resin layer before and after the hygroscopicity test was 5.5%. [Comparative Example 1] (C1-1. Preparation of solution for resin layer formation) A solution for forming a resin layer is prepared by mixing 32 parts of polymer (a) manufactured in Manufacturing Example 1 and 68 parts of ethylcyclohexane. Furthermore, using the aforementioned method, a specimen formed from the resin composition was prepared from this solution for measuring the storage elastic modulus, and the storage elastic modulus of the resin composition was measured to obtain the master curve at a reference temperature of 25°C. The storage elastic modulus of the resin composition at 25°C was 0.4 GPa at 1 Hz and 1.3 GPa at 10000 Hz. The polymer (a) in the resin composition (composed from the solution for forming the resin layer) that forms the resin layer has a weight ratio of 100 by weight. (C1-2. Fabrication of optical thin films) Using the obtained resin layer forming solution, and following the procedure in Example 1 (1-2. Manufacturing of optical films), a stacked body as an optical film was obtained. This stacked body has a layer structure of (glass substrate) / (resin layer). Two stacked bodies as optical films were made, one of which was used for a pen drop height test, and the remaining one was used for a moisture absorption test. (C1-3. Pen Drop Height Test) Using the obtained stack as an optical thin film, a pen drop height test was conducted using the aforementioned method. The results showed no damage up to a height of 6 cm, but damage occurred at a height of 7 cm. (C1-4. Hygroscopicity test) The obtained stack of optical films was used to evaluate the hygroscopicity of the resin layer using the aforementioned method. As a result, the weight increase of the optical film (W1−W0) (i.e., the weight increase of the resin layer (W1−W0)) was less than 0.1 mg, and the weight of the optical film did not change before and after the hygroscopicity test. [Comparative Example 2] (C2-1. Preparation of solution for resin layer formation) A resin layer forming solution is prepared by mixing 24.5 parts of polymer (a) manufactured in Manufacturing Example 1, 10.5 parts of polybutene and 65 parts of ethylcyclohexane. Furthermore, using the aforementioned method, a specimen formed from the resin composition was prepared from this solution for measuring the storage elastic modulus, and the storage elastic modulus of the resin composition was measured to obtain the master curve at a reference temperature of 25°C. The storage elastic modulus of the resin composition at 25°C was 0.09 GPa at 1 Hz and 1.3 GPa at 10000 Hz. The weight proportions of each component in the resin composition forming the resin layer (the composition from which the solvent is removed by the solution used for resin layer formation) are as follows: Polymer (a) 70.0 wt% Polybutene 30.0 wt% (C2-2. Fabrication of optical thin films) Using the obtained resin layer forming solution, and following the procedure in Example 1 (1-2. Manufacturing of optical films), a stacked body as an optical film was obtained. This stacked body has a layer structure of (glass substrate) / (resin layer). Two stacked bodies as optical films were made, one of which was used for a pen drop height test, and the remaining one was used for a moisture absorption test. (C2-3. Pen drop height test) Using the obtained stack as an optical thin film, a pen drop height test was conducted using the aforementioned method. The results showed no damage up to a height of 4 cm, but damage occurred at a height of 5 cm. (C2-4. Hygroscopicity test) The obtained stack of optical films was used to evaluate the hygroscopicity of the resin layer using the aforementioned method. As a result, the weight increase of the optical film (W1−W0) (i.e., the weight increase of the resin layer (W1−W0)) was less than 0.1 mg, and the weight of the optical film did not change before and after the hygroscopicity test. [result] The results of the above embodiments show that the optical film with a resin layer formed by a resin composition having a storage elastic modulus of 3 GPa or more at 25°C at 10000 Hz and a storage elastic modulus of 1 GPa or less at 25°C at 1 Hz and a glass substrate has a pen drop height test result of 10 cm or more, which is considered high. The optical film has excellent impact resistance, and it can be further concluded that the resin layer of the optical film has excellent impact resistance. On the other hand, it can be seen that the pen drop height test results of the optical films related to Comparative Examples 1 and 2, which have a resin layer formed by a resin composition with a storage elastic modulus of less than 3 GPa at 25°C and a glass substrate, are low, with the resin layer formed by the resin composition at 10000 Hz. Compared with the examples, the optical films and the resin layer of the optical films have poorer impact resistance. Furthermore, it is known that the weight increase (W1−W0) of the optical film of the resin layer in Examples 1 and 2 (that is, the weight increase (W1−W0) of the resin layer) is 4 mg, and it has hygroscopic properties. none none none.

Claims

1. A resin composition having a storage modulus of elasticity of 3 GPa or more at 25°C at 10000 Hz and a storage modulus of elasticity of 1 GPa or less at 25°C at 1 Hz, wherein the resin composition comprises: a hydrogenated block copolymer or a hydrogenated block copolymer containing silicon atoms, a filler, and a petroleum resin.

2. The resin composition as claimed in claim 1, wherein the weight ratio of the aforementioned petroleum resin to the aforementioned filler (petroleum resin / filler) is 0.05 or more and 0.4 or less.

3. The resin composition as described in claim 1 or 2 further comprises a dispersant.

4. An optical thin film comprising a resin layer made of any one of the resin compositions described in claims 1 to 3.

5. The optical film as claimed in claim 4, wherein the aforementioned resin layer is hygroscopic.

6. The optical thin film as described in claim 4 or 5, further comprising a glass substrate.