Optical member, sensor module, and manufacturing method of optical member

Abstract

This invention provides an optical component, a sensor module, and a method for manufacturing the optical component, which provides sufficient shielding for incident light from an oblique direction and exhibits sufficient crack resistance when mounted on mobile devices. The invention is a plate-shaped optical component with a specified thickness. In the cross-section of the optical component, adjacent to each other in a direction orthogonal to the thickness direction are a light-transmitting portion comprising a resin material that allows light to pass through, and a light-blocking portion that blocks the light. The thickness of the light-blocking portion is in the range of 60% to 120% of the thickness of the light-transmitting portion.

Description

Optical components, sensor modules, and manufacturing methods of optical components This invention relates to an optical component, a sensor module using the optical component, and a method for manufacturing the optical component. More specifically, it relates to an optical component having a light-transmitting portion and a light-blocking portion in a direction orthogonal to the plate thickness direction, a sensor module using the optical component, and a method for manufacturing the optical component. In recent years, camera modules in mobile devices such as smartphones have been advancing towards higher functionality and image quality, with a strong demand for camera images that minimize ghosting and other artifacts even under various conditions. On the other hand, to further enhance the added value of mobile devices, attempts are being made to incorporate sensors with functions such as motion capture or distance recognition (spatial recognition), personal authentication, and health checks, utilizing near-infrared light. However, the light used for sensing sometimes enters solid-state cameras or other sensors, causing image quality issues such as ghosting or malfunctions of other sensors. This problem is particularly pronounced when sensors or light sources are physically adjacent, and a component is desired that can efficiently block incident light from oblique directions that causes image quality issues or malfunctions. Conventionally, optical components with light-shielding portions on their surfaces have been reported as components capable of partially blocking incident light, such as those shown in Patent Documents 1 and 2. Furthermore, a component with a light-shielding portion formed in the thickness direction has also been reported, as shown in Patent Document 3. [Prior Art Documents] [Patent Documents] [Patent Document 1] Japanese Patent Application Publication No. 2002-268120 [Patent Document 2] International Publication No. 2013-061990 [Patent Document 3] Japanese Patent Application Publication No. 2013-011818 [Problem to be solved by the invention] However, in the inventions shown in Patent Documents 1 and 2, since the light-shielding part is only located on the surface of the component, as shown in FIG16, the light-shielding part 104 does not have sufficient shielding function for light 108 from the inclined direction, and sometimes it will be incident on the sensor 106. Furthermore, in the invention shown in Patent Document 3, both the light-transmitting part and the light-blocking part are made of glass, which can sometimes cause breakage due to falling or other reasons. The present invention aims to provide an optical component and a method for manufacturing the optical component, wherein the optical component has sufficient shielding effect on incident light from an oblique direction and sufficient resistance to breakage when mounted on mobile devices, etc. Furthermore, the present invention provides a sensor module that, by incorporating the optical component, exhibits excellent reliability without image quality defects or malfunctions even when multiple sensors or light sources are physically adjacent. [Technical Means for Solving the Problem] In order to solve the aforementioned problem, the inventors conducted research and found that the aforementioned problem can be solved by the optical component, sensor module and manufacturing method of the optical component described below, thereby completing the present invention. That is, the optical component of the present invention is a plate-shaped optical component with a specified thickness. In the cross section of the optical component, a light-transmitting portion comprising a resin material that allows light to pass through and a light-blocking portion that blocks the light are adjacent to each other in a direction orthogonal to the plate thickness direction. The thickness of the light-blocking portion is in the range of 60% to 120% of the thickness of the light-transmitting portion. Thus, by setting the thickness of the light-blocking portion to within the range of 60% to 120% of the thickness of the light-transmitting portion, unwanted incident light can be sufficiently blocked when light is incident on the optical component from an oblique direction. Furthermore, by including the light-transmitting portion in a resin material, sufficient crack resistance can be ensured, for example, when mounting optical components in mobile devices. Furthermore, in the optical component of the present invention, the light-blocking portion extends through the light-transmitting portion. Therefore, when light is incident from an oblique direction, unwanted incident light can be blocked neither excessively nor insufficiently. Furthermore, in the optical component of the present invention, the end portion of the light-blocking part in the thickness direction protrudes from at least one of the surface and back surface of the light-transmitting part. Thus, even if the light-blocking part protrudes from the light-transmitting part, unwanted incident light from the oblique direction can be reliably blocked. Furthermore, in the optical component of the present invention, the end portion of the light-shielding part in the thickness direction is buried in at least one of the surface and back surface of the light-transmitting part. Thus, even if the light-shielding part is buried in the light-transmitting part, unwanted incident light from the oblique direction can be reliably blocked. Furthermore, in the optical component of the present invention, in the plate thickness direction, one end of the light-blocking portion protrudes from the surface or back of the light-transmitting portion, while the other end is buried in the surface or back of the light-transmitting portion. Thus, even if the light-blocking portion protrudes from and is buried in the light-transmitting portion, unwanted incident light from the oblique direction can be reliably blocked. Furthermore, in the optical component of the present invention, when the optical density (OD value) of the light-shielding portion is measured from the thickness direction of the plate, the maximum value of the optical density (OD) in the region of wavelength 350 nm to 1200 nm is... M It is 2.0 or higher. Therefore, unwanted incident light can be effectively blocked. Furthermore, in the optical component of the present invention, the light-shielding portion comprises a resin material. Similar to the light-transmitting portion, the light-shielding portion also comprises a resin material, thereby ensuring sufficient crack resistance when the optical component is mounted in, for example, a mobile device. Furthermore, in the optical component of the present invention, the thickness of the optical component is in the range of 30 μm to 500 μm. If such an optical component is used in sensor modules, etc., the sensor modules, etc., can be made smaller and lighter. Furthermore, in the optical component of the present invention, when the spectral transmittance of the light-transmitting portion is measured from the plate thickness direction, the average value of the spectral transmittance in the wavelength range of 450 nm to 570 nm is 70% or more. Therefore, the transmittance of light from the plate thickness direction becomes sufficient. Furthermore, in the optical component of the present invention, the light-transmitting portion includes a compound that has maximum absorption in the wavelength range of 650 nm to 1100 nm. This allows for efficient blocking of light in a specific wavelength range. Furthermore, in the optical component of the present invention, when the optical density (OD value) is measured from the thickness direction of the plate, the maximum value of the optical density (OD) of the light-shielding portion in the wavelength range of 350 nm to 1200 nm is... M The light density OD of the light-transmitting portion at the wavelength where the light density of the light-blocking portion is the maximum. T The difference is greater than 2.0. Therefore, unwanted incident light can be effectively blocked. Furthermore, the sensor module of the present invention includes the optical component described in the present invention. Thus, a sensor module is provided that, by having the optical component of the present invention, exhibits excellent reliability without image quality defects or malfunctions even when multiple sensors or light sources are physically adjacent. Furthermore, the sensor module of the present invention includes a sensor for sensing the light, and the sensor is disposed in contact with or close to the light-transmitting portion in the plate thickness direction. Thus, the sensor module of the present invention is effective when the sensor is disposed in contact with or close to the light-transmitting portion. Furthermore, in the sensor module of the present invention, a plurality of sensors are positioned with respect to the light-shielding portion in a direction orthogonal to the plate thickness direction. Thus, by arranging the sensors with respect to the light-shielding portion, unwanted incident light from the tilting direction can be effectively blocked. The manufacturing method of the optical component of the present invention is a method for manufacturing a plate-shaped optical component having a specified thickness. The optical component, in its cross-section, comprises, adjacent to each other in a direction orthogonal to the plate thickness direction, a light-transmitting portion containing a resin material that allows light to pass through, and a light-blocking portion that blocks the light. The thickness of the light-blocking portion is in the range of 60% to 120% of the thickness of the light-transmitting portion. The manufacturing method of the optical component includes: a shielding portion forming step, using a compound with a maximum absorption wavelength of 350 nm or more to form the optical component consisting only of the light-blocking portion; and an irradiation step, forming the light-transmitting portion by irradiating a portion of the optical component consisting only of the light-blocking portion with laser light. Thus, by first manufacturing an optical component consisting only of the light-blocking portion, and then irradiating it with laser light, an optical component having both a shielding portion and a light-transmitting portion formed using the manufacturing method for forming the light-transmitting portion can be manufactured with fewer steps. Furthermore, in the manufacturing method of the optical component of the present invention, when the optical density (OD value) is measured from the thickness direction of the plate, the maximum value of the optical density OD of the light-shielding portion in the wavelength range of 350 nm to 1200 nm is... M The light density OD of the light-transmitting portion at the wavelength where the light density of the light-blocking portion is the maximum. T The difference is 2.0 or more. Therefore, the transmittance of light from the plate thickness direction becomes sufficient. [Effects of the Invention] This invention provides an optical component and a method for manufacturing the optical component. The optical component provides sufficient shielding against incident light from an oblique direction and exhibits sufficient resistance to breakage when mounted on mobile devices. Furthermore, it provides a sensor module that, by incorporating the optical component, exhibits excellent reliability, preventing image quality defects or malfunctions even when multiple sensors or light sources are physically adjacent. Next, the invention, namely the optical component and sensor module according to embodiments of the present invention, will be described with reference to the accompanying drawings. Furthermore, in embodiments of the present invention, "transmission" refers to a transmittance of at least 50%, more preferably at least 60%, and even more preferably at least 70% in the wavelength or wavelength region of the object; "shielding" refers to a transmittance of at least less than 10%, more preferably less than 5%, and even more preferably less than 1% in the wavelength or wavelength region of the object. Additionally, "light" refers to all light unless otherwise specified. Figure 1A is a view of the sensor module according to an embodiment of the present invention from above, and Figure 1B is a cross-sectional view of the sensor module. Here, "above" refers to the direction on the side where light is incident in the thickness direction of the optical component. As shown in Figures 1A and 1B, the sensor module 2 includes a plate-shaped optical component 4 with a specified thickness and a light-sensing sensor 6. When viewed from above (hereinafter referred to as top view), the optical component 4 has a cuboid shape and includes a light-transmitting portion 4a as the main component and a light-blocking portion 4b as the secondary component. Furthermore, the light-transmitting portion 4a has a roughly square or roughly rectangular shape when viewed from above, and is surrounded by the light-blocking portion 4b. Additionally, the light-blocking portion 4b is arranged around the light-transmitting portion 4a and at the center of the shorter side of the light-transmitting portion 4a, penetrating the light-transmitting portion 4a. Moreover, in the cross-section of the optical component 4, the light-transmitting portion 4a and the light-blocking portion 4b are adjacent to each other in a direction orthogonal to the plate thickness direction. Furthermore, in this embodiment, when viewed from above, the area ratio of the light-blocking portion 4b to the light-transmitting portion 4a is approximately 1 / 0.005 to 1 / 200, the width ratio of the light-blocking portion 4b in the long side direction to the width ratio of the light-transmitting portion 4a is approximately 1 / 0.005 to 1 / 200, and the width ratio of the light-blocking portion 4b in the short side direction to the width ratio of the light-transmitting portion 4a is approximately 1 / 0.005 to 1 / 200. In addition, the thickness of the light-transmitting part 4a and the light-blocking part 4b is approximately equal. The light-transmitting part 4a contains resin material, and the light-blocking part 4b contains resin material, glass material, or metal material. On the other hand, the sensor 6 is an element that senses incident light that has passed through the light-transmitting portion 4a. In this embodiment, the sensor 6 includes a sensor 6a and a sensor 6b. The sensors 6a and 6b are respectively disposed directly below the light-transmitting portion 4a, and are disposed close to the light-transmitting portion 4a so that a gap of 0 μm to 1000 μm is created between them and the light-transmitting portion 4a in the thickness direction. In addition, the sensors 6a and 6b are disposed at intervals of 0 μm to 5000 μm, separated by the position of the light-blocking portion 4b. Furthermore, the edge of the optical component 4 is disposed in a manner that does not overlap with at least the entire width of the light-blocking portion 4b when viewed from above. Furthermore, when sensor module 2 is applied to devices such as pulse sensors, proximity sensors, and blood concentration sensors, it is possible, similar to sensors 6a and 6b, for multiple light sources to be physically adjacent to each other. According to the optical component 4 of the described embodiment, a light-blocking portion 4b is arranged through the light-transmitting portion 4a, as shown in FIG1B. When the light 8 is incident from an oblique direction, unwanted light 8 can be sufficiently blocked. In addition, by forming the light-transmitting portion 4a with a resin material, sufficient crack resistance can be achieved, for example, when the sensor module 2 is mounted in a mobile device. Furthermore, according to the embodiment of the sensor module 2, by including the optical component 4, even if multiple sensors 6 or light sources are adjacent, there will be no poor image quality or malfunction. Furthermore, in the described embodiment, the following situation is illustrated: the thickness of the light-transmitting portion 4a and the light-blocking portion 4b is approximately equal, and the light-blocking portion 4b is disposed through the light-transmitting portion 4a in cross-section. However, the arrangement of the light-blocking portion 4b is not necessarily limited to the example described above. For example, as shown in FIG2A, in cross-section, the light-blocking portion 4b may protrude toward the surface (above) of the light-transmitting portion 4a, and as shown in FIG2B, the light-blocking portion 4b may also protrude toward the back (below) of the light-transmitting portion 4a. In addition, as shown in Figure 2C, in the cross section, the light blocking part 4b can be buried on the back (below) of the light transmitting part 4a, and as shown in Figure 2D, the light blocking part 4b can also be buried on the surface (above) of the light transmitting part 4a. Furthermore, as shown in FIG2E, in the cross section, the light-blocking part 4b can protrude above the surface of the light-transmitting part 4a and be buried below the back side, as shown in FIG2F, the light-blocking part 4b can be buried above the surface of the light-transmitting part 4a and protrude below the back side. In the modified examples shown in Figures 2A to 2F, similar to the case in Figure 1B where the light-blocking part 4b is arranged in the light-transmitting part 4a, unwanted light can be sufficiently blocked when light is incident from an oblique direction. Furthermore, in the various configurations shown in Figures 2A to 2F, the thickness of the light-blocking portion 4b only needs to be within the range of 60% to 120% of the thickness of the light-transmitting portion 4a. Furthermore, the light-blocking portion 4b may also include multiple light-blocking parts. For example, as shown in FIG3A, the light-blocking portion 4b may include a light-blocking part 4b1 located on the surface side of the light-transmitting portion 4a and a light-blocking part 4b2 located on the back side of the light-transmitting portion 4a. Moreover, a gap is formed between the light-blocking part 4b1 and the light-blocking part 4b2, and the light-blocking part 4b1 and the light-blocking part 4b2 may also be discontinuous in the plate thickness direction. In addition, as shown in Figure 3B, the light-blocking portion 4b1 and the light-blocking portion 4b2 can also be offset in a direction orthogonal to the plate thickness direction. In the case described above, if the combined thickness of the light-blocking portion 4b1 and the light-blocking portion 4b2 forming a light-blocking portion 4b in the cross section is within the range of 60% to 120% of the thickness of the light-transmitting portion 4a, then even when light is incident from an oblique direction, unwanted incident light can be sufficiently blocked. Furthermore, in the aforementioned embodiment, the sensor 6 may also abut against the light-transmitting portion 4a. Additionally, the optical component 4 may have a layer comprising a thin transparent sheet on the surface or back side of the light-transmitting portion 4a. Furthermore, in the embodiments and their variations, the shape (planar shape) of the optical component 4 when viewed from above is not limited to the shape shown in FIG1A. For example, as shown in FIG4A, the optical component 4 is circular when viewed from above, and may include a light-transmitting portion 4a and a light-blocking portion 4b having an outer diameter smaller than that of the light-transmitting portion 4a and having a predetermined width. Additionally, as shown in FIG4B, the optical component 4 may have a generally square shape in which the portion surrounded by the light-blocking portion 4b in the shape shown in FIG1A is a unit element. In this case, as shown in FIG4C, the light-blocking portion 4b may be further present in a cross shape inside the outer frame formed by the light-blocking portion 4b. Furthermore, even when the optical component 4 is roughly rectangular in shape when viewed from above, as shown in Figures 4D to 4F, various variations are considered in the arrangement of the light-blocking portion 4b. Specifically, as shown in Figure 4D, the light-blocking portion 4b can be arranged to extend along the short side direction. As shown in Figure 4E, the light-blocking portion 4b forms the outer frame of the light-transmitting portion 4a, and in a portion, it surrounds the light-transmitting portion 4a in a circular shape. In addition, as shown in Figure 4F, besides the basic shape shown in Figure 1A, the light-blocking portion 4b can be further arranged to extend along both the long and short sides of the optical component 4. [Structure and manufacturing method of optical components] As long as the effect of the present invention is not compromised, the optical component 4 of the present invention can be a single layer or multiple layers. The thickness of the optical component 4 can be appropriately selected according to the desired application and is not particularly limited. However, regardless of the portion constituting the light transmission portion 4a or the portion constituting the light blocking portion 4b, the total thickness of the front and back of the optical component 4 in the plate thickness direction is preferably 30 μm to 500 μm, more preferably 40 μm to 480 μm, and even more preferably 50 μm to 450 μm. If the thickness of the optical component 4 is within this range, the sensor module including the optical component 4 can be made thinner and lighter, making it suitable for various applications. In particular, when used in sensor units such as sensor modules, it is preferable to achieve a lower back area and lighter weight for the sensor unit. <Light Transmitting Part> As for the resin material constituting the light transmitting part 4a, there are no particular limitations as long as it does not impair the effect of the present invention. For example, in order to ensure thermal stability or formability on the film, a resin with a glass transition temperature (Tg) of preferably 110°C to 380°C, more preferably 110°C to 370°C, and even more preferably 120°C to 360°C can be used. As the resin material constituting the light-transmitting portion 4a, when forming a resin support with a thickness of 0.1 mm including the resin material, a resin with a total light transmittance (Japanese Industrial Standards (JIS) K7375) of 75% or more, more preferably 78% or more, and even more preferably 80% or more can be used. If a resin with a total light transmittance within this range is used, the resulting light-transmitting portion 4a exhibits good transparency. Furthermore, the light-transmitting part 4a may also have the properties of a near-infrared ray-cut filter (NIR-Cut Filter) that transmits visible light and blocks near-infrared light, while the light-blocking part 4b may not transmit visible light, or may not transmit any light. Alternatively, the light-transmitting part 4a may also have the properties of an infrared ray-pass filter (IR-Pass Filter) that blocks visible light and transmits near-infrared light. In addition, the light-transmitting part 4a may also have the property of transmitting visible light and blocking near-ultraviolet light, and the light-blocking part 4b may also have the property of transmitting visible light and blocking near-ultraviolet and near-infrared light but transmitting infrared light above 1000 nm. As the resin material constituting the light-transmitting part 4a, when a solvent-soluble resin is used, the weight average molecular weight (Mw) of the resin, as determined by gel permeation chromatography (GPC), is typically 15,000 to 350,000, preferably 30,000 to 250,000, and the number average molecular weight (Mn) is typically 10,000 to 150,000, preferably 20,000 to 100,000. Examples of resin materials constituting the light-transmitting portion 4a include: cyclic (poly)olefin resins, aromatic polyether resins, polyimide resins, fluorene polycarbonate resins, fluorene polyester resins, polycarbonate resins, polyamide (aromatic polyamide) resins, phenolic resins, polyaryl ester resins, polyurethane resins, poly(ethylene) ether resins, polyurethane resins, poly(p-phenylene) resins, polyamide-imide resins, polyethylene naphthalate resins, fluorinated aromatic polymer resins, (modified) acrylic resins, epoxy resins, allyl ester curing resins, sesquisiloxane UV-curing resins, acrylic UV-curing resins and vinyl UV-curing resins, silicone rubber, silicone resins, organosilicon alkyl compound condensates, and metal alkoxide resins. Specific examples of these resins include the resin described in International Publication No. 2019 / 168090. Regarding the light-transmitting portion 4a, when the spectral transmittance is measured from the plate thickness direction, the average value of the spectral transmittance in the region of wavelength 450 nm to 570 nm is preferably 70% or more, more preferably 75% or more, and even more preferably 80% or more, and particularly preferably 85% to 100%. The light-transmitting portion 4a may contain a compound (hereinafter also referred to as "compound (Z)") that has the maximum absorption in the wavelength range of 650 nm to 1100 nm. The compound (Z) is not particularly limited as long as it has maximum absorption in the wavelength region of 650 nm to 1100 nm. It is preferably a solvent-soluble compound, more preferably at least one selected from the group consisting of squaric acid endomonium salt compounds, phthalocyanine compounds, anthocyanin compounds, naphthalene phthalocyanine compounds, pyrrolopyrrole compounds, ketoneonium compounds, hexa-porphyrin compounds, polymethimide compounds (excluding squaric acid endomonium salt compounds, anthocyanin compounds and ketoneonium compounds), metal dithiolate compounds and boron-dipyrromethene (BODIPY) compounds. It is particularly preferably at least one selected from the group consisting of squaric acid endomonium salt compounds, anthocyanin compounds, ketoneonium compounds, phthalocyanine compounds, naphthalene phthalocyanine compounds and pyrrolopyrrole compounds. By using this compound (Z), efficient light cutoff characteristics near the maximum absorption wavelength and a steep spectral shape can be achieved simultaneously. Compound (Z) can be synthesized using methods generally known, such as those described in Japanese Patent Application Publication No. 1-228960, Japanese Patent Application Publication No. 2001-40234, Japanese Patent No. 3094037, and Japanese Patent No. 3196383. Regarding the content of compound (Z), when the light-transmitting portion 4a is, for example, a resin substrate containing compound (Z), the content is preferably 0.01 to 2.0 parts by weight, more preferably 0.02 to 1.5 parts by weight, and even more preferably 0.03 to 1.0 parts by weight, relative to 100 parts by weight of resin. Furthermore, when the light-transmitting portion 4a is an outer coating (hereinafter also referred to as "resin layer (Z)") containing a curable resin or the like, laminated on a resin support or the like as a substrate, the content is preferably 0.1 to 5.0 parts by weight, more preferably 0.2 to 4.0 parts by weight, and even more preferably 0.3 to 3.0 parts by weight, relative to 100 parts by weight of resin forming the resin layer (Z). When the content of compound (Z) is within this range, good near-infrared absorption characteristics can be achieved. 《Other Ingredients》 Without impairing the effects of the present invention, the light-transmitting portion 4a may further contain additives such as antioxidants, ultraviolet absorbers, fluorescent matting agents, and adhesion promoters. Furthermore, when the light-transmitting portion 4a is manufactured by casting as described later, it can be easily manufactured by adding leveling agents or defoamers. The aforementioned other ingredients may be used individually or in combination of two or more. Examples of antioxidants include 2,6-di-tert-butyl-4-methylphenol, 2,2'-dioxy-3,3'-di-tert-butyl-5,5'-dimethyldiphenylmethane, and tetra[methylene-3-(3,5-di-tert-butyl-4-hydroxyphenyl)propionate]methane. Examples of ultraviolet absorbers include azomethylalkali compounds, indole compounds, benzotriazole compounds, triazine compounds, anthracene compounds, cyanoacrylate compounds, and compounds described in Japanese Patent Application Publication No. 2019-014707. Among these, azomethylalkali compounds, indole compounds, benzotriazole compounds, and cyanoacrylate compounds are particularly preferred from the viewpoint of absorption wavelength and compound stability. By including an ultraviolet absorber, an optical component 4 with low dependence on incident angle in the near-ultraviolet wavelength region can be easily obtained. When this optical component 4 is used in a sensor module, the obtained image quality becomes better. In the case where the light-transmitting part 4a is a single-layer resin substrate, the resin substrate can be formed, for example, by melt molding or casting. Furthermore, an antireflective agent, hardening agent, and / or antistatic agent can be applied after the resin substrate is formed, thereby laminating an outer coating layer. When the light-transmitting part 4a is a multilayer structure formed by stacking a resin layer (z) containing a curable resin or the like containing compound (Z) on a resin support as a base, for example, a resin solution containing compound (Z) can be melt-formed or cast on a resin support as a base. Preferably, a substrate with a resin layer (z) formed on a resin support as a base can be manufactured by applying the resin solution using spin coating, slot coating, inkjet coating or other methods, drying and removing the solvent, and then further irradiating or heating as needed. (Melting) Specifically, melt forming methods include: a method of melt forming granules obtained by melt mixing a resin with a desired compound (Z); a method of melt forming a resin composition containing a resin and a desired compound (Z); or a method of melt forming granules obtained by removing the solvent from a resin composition containing a resin, a solvent, and a desired compound (Z). Examples of melt forming methods include injection molding, melt extrusion molding, and blow molding. (Casting) As casting, it can also be manufactured by the following methods: casting a resin composition containing resin and solvent, and a compound (Z) as desired, onto a suitable support and removing the solvent; or casting a curing composition containing photocurable resin and / or thermocurable resin, and a compound (Z) as desired, onto a suitable support and removing the solvent, and then curing it by appropriate methods such as ultraviolet irradiation or heating. When the light-transmitting portion 4a is a structure comprising a resin substrate containing compound (Z), the light-transmitting portion 4a can be obtained by peeling off the coating from the molding support after casting. Alternatively, when the light-transmitting portion 4a is a structure formed by laminating a resin layer (z) containing a curable resin or the like, comprising compound (Z), onto a support such as a resin support serving as a base, the light-transmitting portion 4a can be obtained without peeling off the coating after casting. Furthermore, the optical component 4 can be used as a light-shielding part 4b, and formed into a structure containing a resin substrate containing a light absorber, or into a structure in which a resin layer containing a hardening resin containing a light absorber is laminated on a support or the like (z), and a light-transmitting part 4a is obtained by irradiating a part of the optical component 4 with laser light or the like. The light-transmitting part 4a may also be fitted with functional films such as dielectric multilayer films, anti-reflective films, hard coating films, and antistatic films using known methods as needed. <Light-shielding section> The light-shielding section 4b is not particularly limited as long as it can block light, and may contain materials such as resin, glass, or metal, but is preferably made of resin. Since the light-shielding section 4b contains the same resin material as the light-transmitting section 4a, sufficient crack resistance can be ensured when mounting optical components, for example, in mobile devices. The resin material constituting the light-shielding portion 4b can be, for example, the same material listed in the light-transmitting portion 4a. More preferably, it is the same resin as the resin used in the light-transmitting portion 4a or a resin having the same functional groups. As an additive contained in the resin material, it may contain light absorbers, and, to the extent that it does not impair the effects of the present invention, other additives such as antioxidants, ultraviolet absorbers, fluorescent matting agents, and bonding agents, which are listed as other components in the light-transmitting part 4a. The light-blocking part 4b preferably contains a light absorber. As a light absorber, there are no particular limitations as long as it has the function of blocking wavelengths from 350 nm to 1100 nm. Examples include: carbon black, graphene, graphene oxide, graphene quantum dots, single-layer or multi-layer carbon nanotubes, fullerenes, dyes or pigments with color index names or numbers, squaric acid inneronium salts, phthalocyanine compounds, anthocyanin compounds, naphthalene phthalocyanine compounds, pyrrolopyrrole compounds, ketoneonium compounds, hexa-porphyrin compounds, polymethimide compounds (excluding squaric acid inneronium salts, anthocyanin compounds, and ketoneonium compounds), metal dithiolate compounds and ring-expanded BODIPY (boron dipyrrole methylene) compounds, metals and their powders, metal oxides and their powders, metal complexes, quantum dots, semiconductor powders, etc. Alternatively, the light absorber can be the same as compound (Z). Regarding the light-shielding part 4b, when measuring the optical density (OD value) along the plate thickness direction, the maximum optical density OD in the region with wavelengths from 350 nm to 1200 nm is... M Preferably, it is 2.0 or higher, more preferably 2.3 or higher, and even more preferably 2.5 or higher. The maximum optical density OD through the light-blocking portion 4b... M This range can effectively block unwanted incident light. Furthermore, when measuring the optical density (OD value) along the thickness direction, the maximum optical density OD of the light-shielding portion 4b in the wavelength range of 350 nm to 1200 nm was... M The optical density of the light-transmitting part 4a at the wavelength with the optical density of the light-blocking part 4b is the same as the optical density OD of the light-transmitting part 4a at the wavelength with the maximum optical density. TThe difference is preferably 2.0 or more, more preferably 3 or more, further preferably 4 or more, and most preferably 5 or more. This allows for sufficient blocking of unwanted incident light. The method of forming the light-shielding part 4b is not particularly limited as long as it does not impair the effect of the present invention. Examples include: embedding molding, casting molding, screen printing, inkjet coating, dispenser coating, laser coating, solution coating, coating with thermoplastic resin, slit coating with resin solution, stretching using capillary phenomenon, pressing processing, ultraviolet (UV) curing formation, thermosetting formation, embossing, three-dimensional (3D) printer, laser engraving, injection molding, cutting with an ink-coated blade, vapor deposition, sputtering, plating, etc. As a method for forming the light-blocking portion 4b by embedding molding, for example, a method is to place a pre-manufactured light-transmitting portion 4a in a mold of a desired shape and to perform injection molding on the resin material used to form the light-blocking portion 4b. In this way, by integrally forming the light-blocking portion 4b and the light-transmitting portion 4a, an optical component 4 having the light-transmitting portion 4a and the light-blocking portion 4b can be obtained. [Applications of the Optical Component] The optical component 4 of the present invention can preferably be used, for example, in sensor modules 2 mounted in: smartphone cameras, digital camcorders, wearable device cameras, personal computer (PC) cameras, surveillance cameras, automotive cameras, night vision cameras, motion capture systems, laser distance meters, virtual try-on devices, license plate recognition devices, televisions, car navigation systems, portable information terminals, personal computers, video game consoles, portable game consoles, iris authentication systems, fingerprint authentication systems, vein authentication systems, digital music players, vegetation sensors, pulse oximeters, sleep monitors, wireless headphones, etc. [Examples] The present invention will now be described in more detail based on embodiments, but the invention is not limited to these embodiments in any way. Furthermore, unless otherwise specified, "parts" refers to "parts by weight". Additionally, the methods for determining the various physical properties and the methods for evaluating the physical properties are as follows. <Spectrophotometric Transmittance> The transmittance and optical density (OD value) of the optical components in each wavelength region were measured using a spectrophotometer (U-4150) manufactured by Hitachi High-Technologies (S., Ltd.). <Sensing Performance Evaluation ①> The sensing performance of an optical component 4 mounted on multiple adjacent sensors was evaluated using the following method. A solid-state imaging element 16a for visual image capture and an ambient light sensor element 16b were fabricated using a known method and mounted adjacently on a substrate device as shown in FIG. 5. Then, the optical component 4 fabricated in the embodiment (or comparative example) was placed directly above the sensor element group 16 to fabricate a sensor device having multiple sensor elements. A halogen lamp light source (Luminar Ace LA-150TX manufactured by Hayashi Tokei Kogyo Co., Ltd.) and a light emitting diode (LED) light source (LA-HDF108AA manufactured by R-TEC Co., Ltd.) were configured in a darkroom, and the fabricated sensor device was used to capture images and evaluate the performance of each sensor. Levels that are completely problem-free and acceptable are marked as "○", levels that show some ghosting or noise but are practically acceptable are marked as "△", and levels that produce ghosting or noise and are unacceptable are marked as "×". <Sensing Performance Evaluation ②> The light source was set to an 850 nm light source (HLK-3AAA-1W-IR850 manufactured by HOLKIN), and the same evaluation as in Sensing Performance Evaluation ① was performed. <Sensing Performance Evaluation ③> The light source was set to a 940 nm light source (HLK-3AAA-1W-IR940 manufactured by HOLKIN). Otherwise, the same evaluation as in Sensing Performance Evaluation ① was performed. <Sensing Performance Evaluation ④> The light source was set to a 730 nm light source (HLK-3AAA-1W-IR730 manufactured by HOLKIN), and the same evaluation as in Sensing Performance Evaluation ① was performed. <Sensing Performance Evaluation ⑤> The light source was set to an 890 nm light source ("FL1CR123-XRE-AMBER" manufactured by HOLKIN Corporation [IR-LED equipped: around 890 nm]), and the same evaluation as in Sensing Evaluation ① was performed. <Fragility Evaluation> The manufactured sensor device was dropped from a height of 1.5 m, and the damage to the optical components was evaluated. A level where no damage was observed was marked as "○", a level where partial cracking or damage was observed but not a practical problem was marked as "△", and a level where cracking or damage occurred and was unacceptable was marked as "×". Furthermore, for the embodiments and comparative examples described below, please refer to the tables shown in Figures 11 to 14. [Example 1] In Example 1, an optical component 4 having a light-transmitting portion 4a and a light-blocking portion 4b in a direction orthogonal to the plate thickness direction (horizontal direction) is manufactured by an embedding molding method. First, to form the light-transmitting portion 4a, a molded article (hereinafter referred to as "molded article 10") with a length of 7 mm, a width of 7 mm, and a thickness of 500 μm was made using the cyclic olefin transparent resin "ARTON F3500" (manufactured by JSR Corporation). (See Figures 1A and 1B). When making the molded article 10, an injection molding machine "FANUC S-2000i 100B" (manufactured by FANUC Corporation) and an injection molding die 18 (Figure 6A) were used. The molding conditions were set as follows: injection temperature 330°C, injection speed 180 mm / sec, and die temperature 130°C. Next, the molded part 10 is designated as the light-transmitting part 4a. Using an insert molding method as shown in Figures 7A and 7B, an optical component 4 with a length of 10 mm, a width of 20 mm, and a thickness of 300 μm, having both the light-transmitting part 4a and the light-blocking part 4b, is manufactured horizontally. As shown in Figure 6B, after opening the insert mold 20, the molded part 10 is installed in the insert mold 20. The insert part is fixed by vacuum adsorption, and the mold is closed. Then, injection molding is performed using "ARTON FBX80" resin (manufactured by JSR Corporation), which has visible light blocking function, under the same molding conditions as the molded part 10 (light-transmitting part 4a). The obtained molded part is then subjected to gate cutting to obtain the target optical component 4. The obtained optical component 4 was subjected to spectroscopic evaluation. The results showed that, in the wavelength range of 450 nm to 570 nm, the average transmittance of the light-transmitting portion 4a, measured from the vertical direction (thickness direction, hereinafter the same) of the optical component 4 (hereinafter referred to as the average transmittance from 450 nm to 570 nm), was 92%. In the wavelength range of 800 nm to 1100 nm, the maximum transmittance of the light-transmitting portion 4a, measured from the vertical direction of the optical component 4 (hereinafter referred to as the maximum transmittance from 800 nm to 1100 nm), was 92%. In the wavelength range of 350 nm to 1200 nm, the maximum optical density OD of the light-blocking portion 4b, measured from the vertical direction of the optical component 4, was... M The maximum optical density wavelength of the light-blocking portion 4b is 650 nm, and the optical density OD of the light-transmitting portion 4a at that wavelength is 3.1. T It is 0.1. OD M With OD T The difference is 3.0. The sensing performance ① of the device using the optical component 4 was evaluated. The result that each sensor had no ghosting or noise was good and was evaluated as sensing performance "○". The optical component 4 was subjected to a fracture resistance evaluation. No fractures or defects were observed, and the result was considered good, with a fracture resistance rating of "○". The results are shown in Figure 11. [Example 2] In Example 1, when forming the light-transmitting part 4a, 0.01 parts by weight of the compound represented by the following formula (1) (i-Pr represents isopropyl) (with a maximum absorption wavelength of 711 nm in dichloromethane) was added as compound (Z) relative to 100 parts by weight of the cyclic olefin transparent resin "ARTON F3500". Otherwise, the optical component was made in the same order as in Example 1. [Formula 1] The obtained optical component 4 was subjected to spectroscopic evaluation. The results showed an average transmittance of 88% from 450 nm to 570 nm, and a maximum transmittance of 92% from 800 nm to 1100 nm. In addition, the OD... M OD T and OD M With OD T The differences are shown in Figure 11. Similar to Example 1, the sensing performance① and fracture resistance of the device using the optical component were evaluated. The results are shown in Figure 11. [Example 3] A glass visual absorption filter U340 (manufactured by HOYA) with a thickness of 300 μm was drilled using a laser processing apparatus (manufactured by Xihua Industry (stock)). As shown in Figure 8, a substrate 24 with dimensions of 10 mm in length and 20 mm in width and two holes 22 was obtained. After the substrate 24 of the optical component is placed on a glass substrate coated with a release agent, the thermosetting transparent resin composition (1) described later is filled into the hole 22 portion of the substrate 24 of the optical component. After heating at 230°C for 20 minutes, the component with the transparent resin filling the hole 22 portion is peeled off from the glass substrate to obtain the target optical component (the thickness of the light transmission portion is 250 μm). <Thermosetting Transparent Resin Composition (1)> Tris(2,3-epoxypropyl)isocyanurate (TEPIC-S: manufactured by Nissan Chemical Co., Ltd.) 35.0 wt% Solid monomeric fluorinated epoxy resin (jER-7760: manufactured by Mitsubishi Chemical Co., Ltd.) 12.9 wt% Methylhexahydrophthalic anhydride (Rikacid MH: manufactured by Shin Nippon Rika Co., Ltd.) 52.1 wt% Phosphorus-based curing catalyst; Tetrabutylphosphonium o,o-diethyl dithiophosphate (Hishicolin PX-4ET: manufactured by Nippon Chemical Industry Co., Ltd.) 0.3 wt% The obtained optical components were evaluated spectroscopically. The results showed that the average transmittance from 450 nm to 570 nm and the maximum transmittance from 800 nm to 1100 nm were both 91%. In addition, the OD... M OD T and OD M With OD T The differences are shown in Figure 11. Similar to Example 1, the sensing performance① and fracture resistance of the device using the optical component were evaluated. The results are shown in Figure 11. [Example 4] To form the light-transmitting part 4a, resin solution A was prepared by dissolving the cyclic olefinic transparent resin ARTON F3500 (manufactured by JSR Corporation) in dichloromethane (manufactured by Fujifilm and Koden Pharmaceutical Co., Ltd.). Resin solution A was coated on a glass petri dish, left to stand at room temperature for 1 day, then peeled off, dried at 70°C for 1 hour, and then dried at 140°C for 1 hour, thereby producing a molded product B with a length of 7 mm, a width of 7 mm, and a thickness of 100 μm. The obtained molded part B was processed using a cutting machine (Disco, DFD6340) to form a grid-like hole with a width of 500 μm and a depth of 90 μm. The grid spacing was set to 5 mm in both directions. After the molded article B with the prepared hole is placed on the glass substrate, the hole portion is filled with the thermosetting light-shielding resin composition (1) described later. The sample is heated at 130°C for 1 hour to obtain the optical component 4' with the shape of FIG. 9A and FIG. 9B. <Thermosetting Light-Shielding Resin Composition (1)> Thermosetting light-shielding resin (SA2410HB: manufactured by Dexerials (stock)) 70% Isophorone (manufactured by Fujifilm and Koden Pharmaceuticals (stock)) 30% The thickness of the thinnest part of the light-shielding portion of the obtained optical component was measured using a laser microscope (VK-X250, manufactured by Keyence). The result showed that the light-shielding portion 4b has a thickness of 65% (i.e., 65 μm) of the light-transmitting portion 4a. The obtained optical component 4' was evaluated spectroscopically. The results showed that the average transmittance from 450 nm to 570 nm and the maximum transmittance from 800 nm to 1100 nm were both 91%. In addition, the OD... M OD T and OD M With OD T The differences are shown in Figure 11. Similar to Example 1, the sensing performance ① and fracture resistance of the device using the optical component 4' were evaluated. The results are shown in Figure 11. [Example 5] In Example 5, after forming a hole in the vertical direction by cutting method in the same way as in Example 4, carbon black is filled into the hole portion, thereby producing an optical component 4'' with a light shielding portion 4b (see Figures 10A and 10B). Similar to Example 4, a grid-like pattern of holes, 500 μm wide and 90 μm deep, was formed on the molded article B (100 μm thick) using a cutting machine (manufactured by Disco, DFD6340). The grid spacing was set to 5 mm in both directions. After the molded article B with the formed holes was placed on a glass substrate, carbon black powder (manufactured by Asahi Carbon Co., Ltd., Asahi #120) was filled into the hole portion to form a light-shielding part 4b. The thickness of the thinnest part of the light-shielding part 4b was measured using a laser microscope (VK-X250, manufactured by Keyence Co., Ltd.), and the result showed that the light-shielding part 4b had a thickness of 110% (i.e., 110 μm) of the light-transmitting part 4a. On the molded article B with the light-shielding part 4b, the active energy line curing resin composition 25 "BeamSet" (manufactured by Arakawa Chemical Co., Ltd.) was coated with a rod coater at a cured film thickness of 0.01 mm. Then, it was dried at 80°C for 3 minutes using an inert oven ("Inert Oven DN410I" manufactured by Yamato Science Co., Ltd.). Subsequently, using a UV conveyor belt (manufactured by Eye Graphics, Inc.), and an eye UV curing device, model US2-X040 560 Hz, at a metal halide lamp illuminance of 270 mW / cm², [the process was carried out]. 2 and cumulative light intensity of 500 mJ / cm 2 Under the condition of irradiation with ultraviolet light, the composition 25 is hardened to obtain the optical component 4'' of the shape shown in Figures 10A and 10B. The obtained optical component 4'' was subjected to spectroscopic evaluation. The results showed that the average transmittance from 450 nm to 570 nm and the maximum transmittance from 800 nm to 1100 nm were both 91%. In addition, the OD... M OD T and OD M With OD T The differences are shown in Figure 11. Similar to Example 1, the sensing performance ① and fracture resistance of the device using the optical component 4'' were evaluated. The results are shown in Figure 11. [Example 6] A substrate 24 with dimensions of 10 mm in length and 20 mm in width, consisting of an optical component, was obtained by using a laser processing apparatus (manufactured by Xihua Industrial Co., Ltd.) to process holes in a 150 μm thick stainless steel (SUS) 304, as shown in Figure 8 (the same figure as in Example 3 is used for ease of explanation). After the substrate 24 of the optical component was placed on a glass substrate coated with a release agent, the thermosetting transparent resin composition (1) was filled into the hole 22 portion of the substrate 24. After heating at 230°C for 20 minutes, the component with the transparent resin-filled hole 22 portion was peeled off from the glass substrate to obtain the target optical component. The thickness of the thinnest part of the light-transmitting portion 4a was measured using a laser microscope (VK-X250, manufactured by Keyence, Inc.), and the result showed that the thickness was about 85% of that of the light-blocking portion 4b (i.e., about 128 μm). The obtained optical components were evaluated spectroscopically. The results showed that the average transmittance from 450 nm to 570 nm and the maximum transmittance from 800 nm to 1100 nm were both 90%. In addition, the OD... M OD T and OD M With OD T The differences are shown in Figure 12. Similar to Example 1, the sensing performance① and fracture resistance of the device using the optical component were evaluated. The results are shown in Figure 12. [Example 7] To form the light-transmitting portion 4a, a resin solution B was prepared by dissolving the cyclic olefinic transparent resin ARTON F3500 (manufactured by JSR Corporation) and IRA945T (manufactured by Exciton Inc.) as compound (Z) in dichloromethane (manufactured by Fujifilm and Koden Pharmaceutical Co., Ltd.). The resin solution B was coated onto a glass petri dish, allowed to stand at room temperature for 1 day, then peeled off, dried at 70°C for 1 hour, and then dried at 140°C for 1 hour, thereby producing a molded article C with dimensions of 7 mm in length, 7 mm in width, and 100 μm in thickness. The obtained molded article C was then processed using a laser processing apparatus (manufactured by Seika Sangyo Co., Ltd.) to form a grid-like hole with a width of 500 μm and a depth of 90 μm. The grid spacing was set to 5 mm in both length and width (see Figures 9A and 9B). After the molded article C with the prepared hole is placed on the glass substrate, the thermosetting light-shielding resin composition (1) is filled into the hole portion. The optical component 4' with the shape of FIG9A and FIG9B is obtained by heating at 130°C for 1 hour. The thickness of the thinnest part of the light-shielding portion 4b of the obtained optical component was measured using a laser microscope (VK-X250, manufactured by Keyence). The result showed that the light-shielding portion 4b has a thickness of 60% (i.e., 60 μm) of the light-transmitting portion 4a. The obtained optical components were evaluated spectroscopically. The results showed an average transmittance of 80% in the 450 nm–570 nm range and a maximum transmittance of 91% in the 800 nm–1100 nm range. In addition, the OD... M OD T and OD M With OD T The differences are shown in Figure 12. Similar to Example 1, the sensing performance① and fracture resistance of the device using the optical component were evaluated. The results are shown in Figure 12. [Example 8] Similar to Example 6, a laser processing apparatus (manufactured by Xihua Industrial Co., Ltd.) was used to perform hole processing on SUS304 with a thickness of 150 μm, and as shown in Figure 8 (the same figure as in Example 3 is used for ease of explanation), a substrate 24 of an optical component with dimensions of 10 mm in length and 20 mm in width and two holes 22 was obtained. After the substrate 24 of the optical component is placed on a glass substrate coated with a release agent, the thermosetting transparent resin composition (2) described later is filled into the hole 22 portion of the substrate 24 of the optical component. After heating at 120°C for 30 minutes, the component with the transparent resin filling the hole 22 portion is peeled off from the glass substrate to obtain the target optical component. The obtained optical components were evaluated spectroscopically. The results showed that the average transmittance from 450 nm to 570 nm and the maximum transmittance from 800 nm to 1100 nm were both 90%. In addition, the OD... M OD T and OD M With OD T The difference is shown in Figure 12. In addition, the thickness of the thinnest part of the light-transmitting part was measured using a laser microscope (VK-X250, manufactured by Keyence Co., Ltd.), and the result showed that the thickness was about 85% of that of the light-blocking part (i.e., about 128 μm). <Thermosetting Transparent Resin Composition (2)> HFGV3 RX01 Y1315 (manufactured by Seiko Advance Co., Ltd.), A curing agent (manufactured by Seiko Advance Co., Ltd.), CARE 182 (manufactured by Seiko Advance Co., Ltd.), and T-980 (manufactured by Seiko Advance Co., Ltd.) are mixed in a ratio of 100:10:2:5. Similar to Example 1, the sensing performance① and fracture resistance of the device using the optical component were evaluated. The results are shown in Figure 12. [Example 9] To form the light-shielding part 4b, 0.25 parts by mass of a compound represented by the following formula (2) as a light absorber (let's call it "polymethyl 1"; the maximum absorption wavelength in dichloromethane is 845 nm (see Figures 15A and 15B)) was added relative to 100 parts by mass of the cyclic olefin transparent resin "ARTON G7810" (resin (A) polymer 1, see Figures 15A and 15B), and then 334 parts by mass of dichloromethane was added as a solvent (see Figures 15A and 15B) to prepare a solution. The obtained solution was cast onto a smooth glass plate, dried at 20°C for 8 hours, and then peeled off from the glass plate. The peeled coating was further dried at 100°C under reduced pressure for 8 hours to form an optical component 4 with a thickness of 101 μm, a length of 7 mm, and a width of 7 mm. That is, an optical component 4 consisting only of the light-shielding part 4b was formed (shielding part formation process). [Equation 2] Next, for the fabricated optical component 4, a laser beam with a wavelength of 355 nm, a pulse width of 15 ns, and a repetition frequency of 80 kHz, generated by a UV5W-355 light source manufactured by AOC Corporation, is used to form a spot diameter of 30 μm using optical components such as lenses. The laser beam is then irradiated onto a 6 mm square area at a scanning speed of 2400 mm / s (laser method 1), thereby forming a light transmission portion 4a to obtain the optical component 4 (irradiation process). Furthermore, the film thickness of the light transmission portion 4a before laser irradiation is 100 μm. The obtained optical component 4 was subjected to spectroscopic evaluation. The results showed an average transmittance of 87% from 450 nm to 570 nm, and a maximum transmittance of 92% from 800 nm to 1100 nm. In addition, the OD... M OD T Figure 12 shows the film thickness after laser irradiation of the light-transmitting portion 4a and the light-blocking portion 4b. Furthermore, the maximum optical density OD of the light-transmitting portion 4a in the wavelength range of 720 nm to 1200 nm is... M The light density OD of the light-transmitting portion at the wavelength with the highest light density of the light-blocking portion 4b T The difference is 2.0. Similar to Example 1, the sensing performance ② and fracture resistance of the device using the optical component were evaluated. The results are shown in Figure 12. Thus, an optical component 4 consisting only of a light-shielding part 4b is first manufactured. By irradiating laser light, an optical component with a shielding part and a light-transmitting part can be manufactured using a manufacturing method that forms a light-transmitting part 4a with fewer steps. [Example 10] In the process of forming the shielding part, the light absorber is made using the following formula (3) (let's call it "polymethyl 2"; Ad represents adamantyl, Ph represents phenyl). Otherwise, the conditions are the same as those in Example 9 shown in FIG12. A femtosecond laser processing apparatus manufactured by Hikvision Co., Ltd. is used to irradiate a 6 mm square area with a 500 femtosecond pulse 343 nm UV laser (spot diameter 8 μm) at a repetition frequency of 50 kHz and a scanning speed of 335 mm / s (laser method 2). The light transmission part 4a is formed thereby to obtain the optical component 4 (irradiation process). The obtained optical component 4 was subjected to spectroscopic evaluation. The results showed an average transmittance of 87% from 450 nm to 570 nm, and a maximum transmittance of 92% from 800 nm to 1100 nm. In addition, the OD... M OD T OD M With OD T Figure 12 shows the difference (wavelength region 720 nm to 1200 nm), the film thickness after laser irradiation of the light-transmitting part 4a and the light-blocking part 4b. Similar to Example 1, the sensing performance ② and fracture resistance of the device using the optical component were evaluated. The results are shown in Figure 12. [Formula 3] [Example 11] In the process of forming the shielding part, the light absorber is made using the following formula (4) (let's call it "polymethyl 3"). Otherwise, the same conditions as in Example 9 shown in FIG12 are applied. A femtosecond laser processing apparatus manufactured by Hikvision Co., Ltd. is used to irradiate a 6 mm square area with a 500 femtosecond pulse 515 nm UV laser (spot diameter 12 μm) at a repetition frequency of 50 kHz and a scanning speed of 500 mm / s (laser method 3). This forms the light transmission part 4a and obtains the optical component 4 (irradiation process). The obtained optical component 4 was subjected to spectroscopic evaluation. The results showed an average transmittance of 87% from 450 nm to 570 nm, and a maximum transmittance of 92% from 800 nm to 1100 nm. In addition, the OD... M OD T OD M With OD T Figure 13 shows the difference (wavelength region 720 nm to 1200 nm), the film thickness after laser irradiation of the light-transmitting part 4a and the light-blocking part 4b. Similar to Example 1, the sensing performance ③ and fracture resistance of the device using the optical component were evaluated. The results are shown in Figure 13. [Formula 4] [Example 12] In the process of forming the shielding part, the light absorber is set to the following formula (5) (set to "polymethyl 4"). Otherwise, the same conditions as in Example 9 shown in FIG12 are set, and the laser processing is set to laser method 1. The light transmission part 4a is formed thereby to obtain the optical component 4 (irradiation process). The obtained optical component 4 was subjected to spectroscopic evaluation. The results showed that, in the wavelength region of 450 nm to 570 nm, the average transmittance of the light-transmitting portion 4a, measured perpendicularly to the optical component, was 87%, and in the wavelength region of 800 nm to 1100 nm, the maximum transmittance of the light-transmitting portion 4a, measured perpendicularly to the optical component 4, was 92%. Furthermore, OD... M OD T OD M With OD T The difference (wavelength region 720 nm to 1200 nm), the wavelength with the highest light density in the light-transmitting part 4a and the light-blocking part 4b, and the film thickness after laser irradiation of the light-transmitting part 4a are shown in Figure 13. Similar to Example 1, the sensing performance ③ and fracture resistance of the device using the optical component were evaluated. The results are shown in Figure 13. [Formula 5] [Example 13] In the process of forming the shielding part, the light absorber is made to use the following formula (6) (let's call it "polymethyl 5"; Ad represents adamantyl alkyl). Otherwise, the same conditions as in Example 9 shown in FIG13 are used. Laser processing is performed using laser method 2, thereby forming the light transmission part 4a to obtain the optical component 4 (irradiation process). The obtained optical component 4 was subjected to spectroscopic evaluation. The results showed that, in the wavelength region of 450 nm to 570 nm, the average transmittance of the light-transmitting portion 4a, measured perpendicularly to the optical component, was 87%, and in the wavelength region of 800 nm to 1100 nm, the maximum transmittance of the light-transmitting portion 4a, measured perpendicularly to the optical component 4, was 92%. Furthermore, OD... M OD T OD M With OD T Figure 13 shows the difference (wavelength region 720 nm to 1200 nm), the film thickness after laser irradiation of the light-transmitting part 4a and the light-blocking part 4b. Similar to Example 1, the sensing performance ④ and fracture resistance of the device using the optical component were evaluated. The results are shown in Figure 13. [Formula 6] [Example 14] In the process of forming the shielding part, the light absorber is set to the following formula (7) (set to "squaric acid inneron salt 1"). Otherwise, the same conditions as in Example 9 shown in FIG12 are set. As a laser processing, laser method 3 is used to form the light transmission part 4a and obtain the optical component 4 (irradiation process). The obtained optical component 4 was subjected to spectroscopic evaluation. The results showed that, in the wavelength region of 450 nm to 570 nm, the average transmittance of the light-transmitting portion 4a, measured perpendicularly to the optical component, was 86%, and in the wavelength region of 800 nm to 1100 nm, the maximum transmittance of the light-transmitting portion 4a, measured perpendicularly to the optical component 4, was 92%. In addition, OD... M OD T OD M With OD T Figure 13 shows the difference (wavelength region 720 nm to 1200 nm), the film thickness after laser irradiation of the light-transmitting part 4a and the light-blocking part 4b. Similar to Example 1, the sensing performance ⑤ and fracture resistance of the device using the optical component were evaluated. The results are shown in Figure 13. [Formula 7] [Example 15] In the process of forming the shielding part, the light absorber was made using the following formula (8) (denoted as "cyanine 1"). Otherwise, the conditions were the same as those in Example 9 shown in FIG12, but laser processing was used. A UV conveyor belt UV curing device "US2-X040560Hz" manufactured by Eye Graphics was used for nitrogen atmosphere curing at a metal halide lamp illuminance of 270 mW / cm². 2 Cumulative light intensity 3000 mJ / cm 2 The light is transmitted through a light-transmitting part 4a by three exposures using a 6 mm square empty SUS fixture, thereby obtaining the optical component 4 (irradiation process). The obtained optical component 4 was subjected to spectroscopic evaluation. The results showed that, in the wavelength region of 450 nm to 570 nm, the average transmittance of the light-transmitting portion 4a, measured perpendicularly to the optical component, was 77%, and in the wavelength region of 800 nm to 1100 nm, the maximum transmittance of the light-transmitting portion 4a, measured perpendicularly to the optical component 4, was 92%. Furthermore, OD... M OD T OD M With OD T Figure 13 shows the difference (wavelength region 720 nm to 1200 nm), the film thickness after laser irradiation of the light-transmitting part 4a and the light-blocking part 4b. Similar to Example 1, the sensing performance ③ and fracture resistance of the device using the optical component were evaluated. The results are shown in Figure 13. [Formula 8] [Comparative Example 1] In Comparative Example 1, an optical component having light-shielding portions on a transparent resin substrate was manufactured. Using a two-component photocurable ink set including light-shielding ink composition 1 and light-shielding ink composition 2, a light-shielding film 26 (10 μm thick) was patterned on a glass substrate "OA-10G (thickness 300 μm)" (manufactured by Nippon Electric Glass Co., Ltd.) cut to a size of 40 mm in length and 40 mm in width, as shown in Figures 15A and 15B, thus producing an optical component 30 having two light-transmitting portions 28 in the plane when viewed from above. At this time, the two ink compositions were mixed on the substrate to form the pattern. Furthermore, ink composition 1 and ink composition 2 are as described below. <Ink Composition 1> Color Index (CI) Pigment Black 7 (pigment): 3.0 wt% Polyoxyalkylene adduct polyalkyleneamine (dispersant, Discol N-518 manufactured by Daiichi Kogyo Pharmaceutical Co., Ltd.): 1.0 wt% N-Vinylmethylamine (manufactured by Arakawa Chemical Co., Ltd.): 25.0 wt% Ethylene glycol monoallyl ether (manufactured by Nippon Emulsifier Co., Ltd.): 49.6 wt% Hyperbranched polymer (STAR-501 manufactured by Osaka Organic Chemical Co., Ltd.): 12.0 wt% BYK-UV3570 (manufactured by BYK-Chemie Japan Co., Ltd., polyester-modified silicone surfactant): 0.2 wt% Irgacure 819 (manufactured by BASF Japan Co., Ltd.): 6.4 wt% Irgacure 369 (manufactured by BASF Japan): 1.6 wt% Darocur EDB (manufactured by BASF Japan): 1.0 wt% Irgastab UV-10 (manufactured by BASF Japan): 0.2 wt% <Ink Composition 2> CI Pigment Black 7 (pigment): 9.0 wt% Polyoxyalkylene adduct polyalkylene amine (dispersant, Discol N-518 manufactured by Daiichi Kogyo Pharmaceutical Co., Ltd.): 3.0 wt% N-Vinylmethylamine (manufactured by Arakawa Chemical Co., Ltd.): 25.0 wt% AG (manufactured by Nippon Emulsifier Co., Ltd.): 47.6 wt% Hyperbranched polymer (manufactured by Osaka Organic Chemical Co., Ltd.): 10.0 wt% BYK-UV3570 (manufactured by BYK-Chemie Japan Co., Ltd., polyester-modified silicone surfactant): 0.2 wt% Irgacure 819 (manufactured by BASF Japan Co., Ltd.): 6.4 wt% Irgacure 369 (manufactured by BASF Japan Co., Ltd.): 1.6 wt% Darocur EDB (manufactured by BASF Japan): 1.0 wt% Irgastab UV-10 (manufactured by BASF Japan): 0.2 wt% After the pattern is formed, the light-blocking ink composition is hardened by ultraviolet irradiation. As the ultraviolet irradiation device, three types of LEDs were combined: a NICHIAi-LED "NCCU033" with a peak wavelength of 365 nm, a NICHIA "NCCU001" with a peak wavelength of 380 nm (both manufactured by Nichia Chemical Industry Co., Ltd.), and an SDN-5N3CUV-A with a peak wavelength of 395 nm (manufactured by Sander Co., Ltd.). Irradiation intensities at wavelengths of 365 nm, 380 nm, and 395 nm at a distance of 5 mm from the irradiation device were 20 mW / cm². 2 20 mW / cm 2 20 mW / cm 2 And the total is 60 mW / cm 2 It was manufactured using this method. The cumulative ultraviolet radiation dose was set to 10800 mJ / cm². 2 . The obtained optical component 30 was subjected to spectroscopic evaluation. The results showed that the average transmittance from 450 nm to 570 nm and the maximum transmittance from 800 nm to 1100 nm were both 91%. In addition, the OD... M OD T and OD M With OD T The differences are shown in Figure 13. The sensing performance① and fracture resistance of the device were evaluated using the same method as in Example 1. The results are shown in Figure 13. [Comparative Example 2] Under the same conditions as Example 9 described in FIG12, the laser processing was performed using the laser method described in paragraph

[0170] of Japanese Patent Application Publication No. 2022-43999. As a result, as shown in FIG13, the film irradiation portion was cut off and removed by the laser light, making it impossible to perform evaluations such as spectrophotometry. [Industrial Applicability] The optical components of this invention are preferably used in: smartphone cameras, digital video cameras, wearable device cameras, PC cameras, surveillance cameras, automotive cameras, night vision cameras, motion capture, laser distance meters, virtual try-on devices, license plate recognition devices, televisions, car navigation systems, portable information terminals, personal computers, video game consoles, portable game consoles, fingerprint authentication systems, digital music players, etc. 2: Sensor module 4, 4', 4", 30: Optical component 4a: Light transmission part 4b: Light blocking part 4b1, 4b2: Light blocking part 6, 6a, 6b: Sensor 8: Light 10: Molded article 16: Sensor element group 16a: Solid-state camera element for visual image capture 16b: Ambient light sensor element 18: Injection mold 20: Embedded mold 22: Hole 24: Substrate 25: Active energy line curing resin composition 26: Light blocking film 28: Light transmission part 104: Light blocking part 106: Sensor 108: Light Figures 1A and 1B are conceptual diagrams and cross-sectional views of the sensor module of the embodiment viewed from above. Figures 2A to 2F are diagrams showing variations in the arrangement of the light-shielding members in the thickness direction of the optical component of the embodiment. Figures 3A and 3B are diagrams showing cases where the light-shielding members in the optical component of the embodiment are discontinuous in the thickness direction and cases where the light-shielding members are offset in a direction orthogonal to the thickness direction. Figures 4A to 4F are diagrams showing variations in the optical component of the embodiment. Figure 5 is a diagram showing the installation of the optical component of the embodiment in a group of sensor elements. Figures 6A and 6B are diagrams showing the mold used to manufacture the molded article of the optical component of the embodiment. Figures 7A and 7B are diagrams showing the optical component of Embodiment 1. Figure 8 is a diagram showing the optical component of Embodiment 3. Figures 9A and 9B are diagrams showing the optical component of Embodiment 4. Figures 10A and 10B are diagrams showing the optical component of Embodiment 5. Figure 11 is a table showing experimental data of Embodiments 1 to 5. Figure 12 is a table showing the experimental data of Examples 6 to 10. Figure 13 is a table showing the experimental data of Examples 11 to 15, Comparative Examples 1 and 2. Figure 14 is a table showing the experimental data of Examples 9 to 15, and Comparative Example 2. Figures 15A and 15B are diagrams showing the optical components of Comparative Example 1. Figure 16 is a diagram showing a conventional sensor module. 2: Sensor Module 4: Optical components 4a: Light transmission part 4b: Light-shielding section

Claims

1. An optical component, which is a plate-shaped optical component having a specified thickness, comprising, in a cross section of the optical component, light-transmitting portions comprising a resin material that allows light to pass through, and light-blocking portions that block the light, adjacent to each other in a direction orthogonal to the thickness direction of the plate, wherein the thickness of the light-blocking portions is in the range of 60% to 120% of the thickness of the light-transmitting portions, and the end of the light-blocking portions in the thickness direction protrudes from at least one of the surface and back surface of the light-transmitting portions.

2. The optical component as claimed in claim 1, wherein, The light-blocking part passes through the light-transmitting part.

3. The optical component as claimed in claim 1, wherein, The end of the light-shielding portion in the thickness direction is embedded in at least one of the surface and back surface of the light-transmitting portion.

4. The optical component as claimed in claim 1, wherein, When the optical density of the light-blocking portion is measured from the thickness direction of the plate, the maximum optical density in the region of wavelength 350 nm to 1200 nm is 2.0 or higher.

5. The optical component as claimed in claim 1, wherein, The light-shielding part comprises a resin material.

6. The optical component as claimed in claim 1, wherein, The thickness of the optical component is in the range of 30 μm to 500 μm.

7. The optical component as claimed in claim 1, wherein, When the spectral transmittance of the light-transmitting portion is measured from the thickness direction of the plate, the average value of the spectral transmittance in the wavelength range of 450 nm to 570 nm is 70% or more.

8. The optical component as claimed in claim 1, wherein, The light-transmitting portion contains a compound that has maximum absorption in the wavelength range of 650 nm to 1100 nm.

9. The optical component as claimed in claim 1, wherein, When the optical density is measured from the thickness direction of the plate, the difference between the maximum optical density of the light-blocking portion in the wavelength region of 350 nm to 1200 nm and the optical density of the light-transmitting portion at the wavelength where the optical density of the light-blocking portion is the maximum is 2.0 or more.

10. A sensor module comprising the optical component as described in any one of claims 1 to 9.

11. The sensor module of claim 10, comprising a sensor for sensing the light, wherein the sensor is disposed in contact with or close to the light-transmitting portion in the plate thickness direction.

12. The sensor module as claimed in claim 11, wherein, In a direction orthogonal to the plate thickness direction, a plurality of the sensors are positioned across the light shield.

13. A method for manufacturing an optical component, comprising manufacturing a plate-shaped optical component having a predetermined thickness, wherein the optical component, in its cross-section, includes, adjacent to each other in a direction orthogonal to the thickness direction, a light-transmitting portion comprising a resin material that allows light to pass through, and a light-blocking portion that blocks the light, wherein the thickness of the light-blocking portion is in the range of 60% to 120% of the thickness of the light-transmitting portion, and the method for manufacturing the optical component includes: The shielding part forming process uses a compound with a maximum absorption wavelength of 350 nm to 1100 nm to form the optical component consisting only of the light shielding part; and the irradiation process forms the light transmission part by irradiating a portion of the optical component consisting only of the light shielding part with laser light.

14. A method for manufacturing an optical component as described in claim 13, wherein, When the optical density is measured from the thickness direction of the plate, the difference between the maximum optical density of the light-blocking portion in the wavelength region of 350 nm to 1200 nm and the optical density of the light-transmitting portion at the wavelength where the optical density of the light-blocking portion is the maximum is 2.0 or more.

15. An optical component, which is a plate-shaped optical component having a specified thickness, comprising, in a cross section of the optical component, light-transmitting portions comprising a resin material that allows light to pass through, and light-blocking portions that block the light, adjacent to each other in a direction orthogonal to the thickness direction of the plate, wherein the thickness of the light-blocking portions is in the range of 60% to 120% of the thickness of the light-transmitting portions, and when the optical density of the light-blocking portions is measured from the thickness direction of the plate, the maximum value of the optical density in the region of wavelength 350 nm to 1200 nm is 2.0 or more.

16. An optical component, which is a plate-shaped optical component having a predetermined thickness, comprising, in a cross-section of the optical component, light-transmitting portions comprising a resin material that allows light to pass through, and light-blocking portions that block the light, adjacent to each other in a direction orthogonal to the thickness direction of the plate, wherein the thickness of the light-blocking portions is in the range of 60% to 120% of the thickness of the light-transmitting portions, and when the optical density is measured from the thickness direction of the plate, the difference between the maximum optical density of the light-blocking portions in the wavelength region of 350 nm to 1200 nm and the optical density of the light-transmitting portions at the wavelength where the optical density of the light-blocking portions is the maximum is 2.0 or more.

Images