Vertical probe, probe head, and manufacturing method of vertical probe

Abstract

A vertical probe includes opposite first and third sides and opposite second and fourth sides. The third and fourth sides extend planarly from the body to the tip. The first and second sides include first and second upper planar regions located on the body, and first and second transition regions located on the tip, as well as first and second lower planar regions that are closer to the third and fourth sides than the first and second upper planar regions. The first and second transition regions gradually extend from the first and second upper planar regions to the first and second lower planar regions, respectively, closer to the third and fourth sides. The first transition region and the first lower planar region are laser-processed. The vertical probe of the present invention can contact tiny conductive contacts, has good current resistance, structural strength, service life and processing accuracy, and when applied to a probe tip, the tip can avoid breakage and positional displacement due to vertical movement.

Description

Technical Field

[0001] The present invention relates to a probe head of a probe card and the probe thereof, in particular to a vertical probe, a probe head having the vertical probe, and a method for manufacturing the vertical probe. Prior Art

[0002] A commonly used vertical probe is a slender, cylindrical probe with a square or rectangular cross-section. These probes are manufactured using micro-electromechanical (MEMS) processing or by cutting sheets of metal, allowing them to be tailored to the desired width and thickness. With the trend toward miniaturization of electronic components, the width and thickness of these vertical probes must be reduced accordingly to contact tiny conductive contacts on the object under test (including but not limited to those with microbumps).

[0003] However, reducing the width and thickness of the probe significantly increases its resistance and reduces its structural strength. The higher the probe's resistance, the lower its current carrying capacity. A probe with too low a current carrying capacity is prone to burning out when current is applied. Furthermore, a probe with too low structural strength is prone to wear, bending, or even breaking due to the stresses of point measurement, shortening its lifespan and requiring frequent replacement. Therefore, ensuring that the probe has sufficient current carrying capacity while meeting the requirements of contacting tiny conductive contacts and extending its lifespan is a crucial technical challenge. Summary of the Invention

[0004] The present invention proposes a vertical probe with reduced width and thickness only at its tip, enabling the tip to contact tiny conductive contacts. The remaining sections have relatively larger widths and thicknesses, ensuring the probe has good current resistance and structural strength. This vertical probe comprises a body and a tip. The tip includes a contact portion that is smaller in width and thickness than the body, and a tapered portion between the body and the contact portion. The tip width can be reduced by micro-electromechanical (MEMS) processing or laser cutting of a substrate, while the tip thickness can be reduced by machining or etching in a MEMS process.

[0005] However, when the vertical probe is installed on a probe base, the vertical probe is first inserted into the upper and lower guide holes of the lower guide plate unit on the probe base. Then, the upper and lower guide plate units are first horizontally displaced relative to each other and then fixed to each other to form the probe base. At this time, due to the horizontal offset of the upper and lower guide holes, the body of the vertical probe is elastically bent and deformed. For example, if the lower guide plate unit is displaced to the left relative to the upper guide plate unit, the body of the vertical probe will bend to the left from top to bottom. In this case, the right side of the vertical probe will abut against the inner surface of the lower guide hole, and the abutment point will be located near the tapered portion of the needle tip of the body. When the contact portion of the needle tip contacts the object to be measured and is subjected to an upward reaction force, the needle tip will elastically retract slightly into the lower guide hole. Therefore, if the right side of a vertical probe has a difference between the tapered portion of the tip and the portion on the body, rather than being coplanar, this portion has poor structural strength. Furthermore, as the tip moves up and down, the right side does not completely contact the inner surface of the lower guide hole in a flat manner. In other words, there is a step difference where the right side contacts the inner surface of the lower guide hole as the tip moves up and down. This can easily cause the probe to break and the contact portion of the tip to shift, misaligning with the conductive contacts of the object under test. Furthermore, reducing the tip thickness through machining or etching in a micro-electromechanical (MEMS) process can easily result in unsatisfactory tolerances, resulting in low probe card production yields.

[0006] In view of the above-mentioned deficiencies, the main purpose of the present invention is to provide a vertical probe, a probe head and a method for manufacturing a vertical probe, so that the vertical probe can have good current resistance, structural strength and service life while meeting the requirements of contacting tiny conductive contacts, and can achieve good processing accuracy. Moreover, when the vertical probe is used in the probe head, the needle tip is not easily broken due to up and down movement when contacting the object to be tested, and the needle tip position is not easily deviated and can be aligned with the conductive contacts of the object to be tested.

[0007] To achieve the above-mentioned objectives, the present invention provides a vertical probe comprising a main body extending in an elongated shape along a longitudinal axis, and a needle tip connected to the main body and extending from the main body along the longitudinal axis. The vertical probe comprises a first side surface, a second side surface, a third side surface facing in an opposite direction from the first side surface, and a fourth side surface facing in an opposite direction from the second side surface. The third side surface and the fourth side surface both extend planarly from the main body to the needle tip. The first side surface comprises a first upper planar region located on the main body, a first transition region and a first lower planar region located on the needle tip. The first transition region is located between the first upper planar region and the first lower planar region. A first upper boundary line is defined between the first transition region and the first upper planar region, and a first lower boundary line is defined between the first transition region and the first lower planar region. The first lower planar region is closer to the third side surface than the first upper planar region. The first transition region extends from the first upper boundary line to the first lower boundary line, gradually approaching the third side surface. The second side surface includes a second upper planar region located on the main body, a second transition region located on the needle tip, and a second lower planar region. The second transition region is located between the second upper planar region and the second lower planar region. A second upper boundary line is defined between the second transition region and the second upper planar region, and a second lower boundary line is defined between the second transition region and the second lower planar region. The second lower planar region is closer to the fourth side surface than the second upper planar region. The second transition region gradually extends from the second upper boundary line to the second lower boundary line as it approaches the fourth side surface. The first transition region and the first lower planar region on the first side surface are formed by laser processing.

[0008] Thus, the tip of the vertical probe of the present invention is designed to be non-coplanar with the main body only on the first and second side surfaces. That is, a first transition zone and a first lower flat zone are designed on the first side surface to reduce the tip thickness, while a third side surface located opposite the first side is coplanar with the main body and the tip portion. Similarly, a second transition zone and a second lower flat zone are designed on the second side surface to reduce the tip width, while a fourth side surface located opposite the second side is coplanar with the main body and the tip portion. In this way, the portion of the tip containing the first and second transition zones forms a tip tapered portion, while the portion containing the first and second lower flat zones forms a tip contact portion. The tip tapered portion can be gradually reduced to the desired thickness and width, ensuring that the thickness and width of the tip contact portion meet the requirements for contacting tiny conductive contacts, while the main body still maintains a relatively large width and thickness, resulting in the vertical probe having excellent current resistance, structural strength, and service life. Furthermore, when the vertical probe is mounted on the probe base and within the upper and lower guide holes of the lower guide plate unit, and the upper and lower guide plate units are horizontally displaced relative to each other, causing the vertical probe body to elastically bend and deform, the vertical probe can abut against the inner surface of the lower guide hole with its planar third and / or fourth side surfaces. This ensures that there is no height difference between the third and fourth side surfaces and the probe tip, resulting in relatively high structural strength. Even if the probe tip moves up and down and retracts into the lower guide hole when contacting the object under test, the probe tip is not susceptible to breakage, and displacement of the probe tip from aligning with the conductive contacts of the object under test is also avoided. Furthermore, the first side surface of the vertical probe is laser-processed to form a first transition region and a first lower flat region, ensuring excellent dimensional accuracy of the probe tip. Furthermore, the second transition region and second lower flat region of the second side surface can also be laser-processed to further improve the dimensional accuracy of the probe tip. This ensures that the tolerances of the vertical probe meet requirements, thereby improving the manufacturing yield of the probe card.

[0009] Preferably, the needle tip has a contact end farthest from the body, the distance between the first lower boundary line and the contact end in the longitudinal axis is defined as a first height, and the distance between the second lower boundary line and the contact end in the longitudinal axis is defined as a second height, and the first height and the second height are substantially not equal.

[0010] When the probe tip contacts the object being measured, stress is concentrated in the first and second transition zones and the first and second lower plane zones, making these areas more susceptible to breakage. The present invention improves the stress concentration problem by designing the first and second lower intersection lines at different heights, i.e., by making the heights of the first and second lower plane zones unequal. This makes the vertical probe less likely to break.

[0011] Preferably, the needle tip has a contact end farthest from the body, the distance between the first upper intersection line and the contact end in the longitudinal axis is defined as a third height, the distance between the second upper intersection line and the contact end in the longitudinal axis is defined as a fourth height, and the third height and the fourth height are substantially unequal.

[0012] By designing the first upper boundary line and the second upper boundary line at different heights, and thus making the total height of the first lower planar region and the first transition region unequal to the total height of the second lower planar region and the second transition region, stress concentration can be alleviated, making the vertical probe less likely to break. The present invention also allows the first and second lower boundary lines to be located at different heights, and the first and second upper boundary lines to be located at different heights, further alleviating stress concentration and making the vertical probe less likely to break.

[0013] Preferably, the distance between the second upper boundary line and the second lower boundary line is greater than the distance between the first upper boundary line and the first lower boundary line.

[0014] Thus, the length of the second transition zone is greater than that of the first transition zone, thus distributing stress more effectively than the first transition zone. When the upper and lower guide plate units of the probe base are relatively displaced along only one transverse axis, or when the upper and lower guide plate units are relatively displaced along both transverse axes but with different amounts of displacement, the vertical probe will experience greater stress along the transverse axis with the greater relative displacement. Therefore, the longer second transition zone can be positioned toward the transverse axis with the greater relative displacement to achieve better stress dissipation. The lengths of the first and second transition zones of the vertical probe can even be designed based on the predetermined relative displacement of the upper and lower guide plate units along the two transverse axes, further alleviating stress concentration and making the vertical probe less susceptible to fracture.

[0015] Preferably, the width of each of the first side surface, the second side surface, the third side surface and the fourth side surface of the main body is between 30 micrometers and 100 micrometers.

[0016] Thus, before the thickness and width of the vertical probe tip are reduced (i.e., before the first and second transition zones and the first and second lower planar regions are formed), the width of a single side surface is 30µm to 100µm. Such dimensions are suitable for reducing the thickness and width of the vertical probe tip by processing the first and second transition zones and the first and second lower planar regions.

[0017] Preferably, the needle tip includes a needle tip tapered portion and a needle tip contact portion, the needle tip tapered portion includes a first transition zone and a second transition zone, the needle tip contact portion includes a first lower plane zone and a second lower plane zone, the cross section of the needle tip contact portion is square, and the cross section of the body is square.

[0018] In this way, the reduction in the width and thickness of the vertical probe tip is equal, which can avoid a large stress concentration in one of the transverse axes.

[0019] Preferably, the needle tip includes a needle tip tapered portion and a needle tip contact portion, the needle tip tapered portion includes a first transition zone and a second transition zone, the needle tip contact portion includes a first lower plane zone and a second lower plane zone, the second upper plane zone and the second lower plane zone of the second side surface are perpendicular to a first transverse axis, the first upper plane zone and the first lower plane zone of the first side surface are perpendicular to a second transverse axis, and the distance between the first upper plane zone and the first lower plane zone of the first side surface in the second transverse axis is greater than the distance between the second upper plane zone and the second lower plane zone of the second side surface in the first transverse axis.

[0020] Thus, the cross section of the body is rectangular with the short side on the first side and the long side on the second side. The reduction in the needle tip on the first side is greater than the reduction in the second side. Therefore, the stress concentration of the needle tip on the second side is smaller, and the second side can be oriented toward the transverse axis where the relative displacement of the upper and lower guide plate units is larger, making the vertical probe less likely to break. Moreover, the short side of the cross section of the body is parallel to the transverse axis where the relative displacement is larger, which can produce a better elastic deformation effect.

[0021] To achieve the above objectives, the present invention provides a probe head comprising an upper guide plate unit, a lower guide plate unit, and a vertical probe as described above. The upper guide plate unit includes an upper guide hole, and the lower guide plate unit includes an upper surface, a lower surface, and a lower guide hole extending through the upper and lower surfaces. The upper surface of the lower guide plate unit faces the upper guide plate unit. The vertical probe body includes an upper mounting portion and a lower mounting portion, which are respectively inserted through the upper and lower guide holes. The vertical probe tip is located below the lower surface of the lower guide plate unit.

[0022] Thus, the vertical probe in the probe head provided by the present invention, with the aforementioned structural features, can meet the requirements of contacting tiny conductive contacts while also having excellent current resistance, structural strength, and service life, and can achieve good processing accuracy. Furthermore, the lower mounting portion of the vertical probe can abut against the inner surface of the lower guide hole with its planar third and / or fourth side surfaces. This makes the probe tip less likely to break due to vertical movement and prevents the probe tip from shifting and misaligning with the conductive contacts of the object being tested.

[0023] Preferably, the probe head can define a first transverse axis and a second transverse axis perpendicular to each other, and the upper guide hole and the lower guide hole are staggered along the first transverse axis so that the fourth side of the vertical probe abuts against an inner surface of the lower guide hole.

[0024] Thus, when the upper and lower guide plate units are relatively displaced along the first transverse axis, causing the upper and lower guide holes to be offset from each other along the first transverse axis, the vertical probe rests against the inner surface of the lower guide hole with its flat fourth side surface. Thus, even if the needle tip moves up and down and retracts into the lower guide hole when contacting the object being tested, the needle tip is not easily broken, and the needle tip is prevented from being misaligned and misaligned with the conductive contact of the object being tested.

[0025] More preferably, the upper guide hole and the lower guide hole are also staggered along the second transverse axis, so that the third side surface of the vertical probe abuts against the other inner surface of the lower guide hole.

[0026] Thus, when the upper and lower guide plate units are relatively displaced along the first and second transverse axes, causing the upper and lower guide holes to be offset from each other along the first and second transverse axes, the vertical probe rests against the inner surface of the lower guide hole with its planar third and fourth side surfaces. Thus, even if the needle tip moves up and down and retracts into the lower guide hole when contacting the object being tested, the needle tip is not easily broken, and the needle tip is prevented from being misaligned and misaligned with the conductive contact of the object being tested.

[0027] More preferably, the distance between the upper guide hole and the lower guide hole staggered along the first transverse axis is greater than the distance between the upper guide hole and the lower guide hole staggered along the second transverse axis.

[0028] As a result, the relative displacement of the upper and lower guide plate units in the first transverse axis is large, resulting in a large offset distance between the upper and lower guide holes in the first transverse axis, which will cause the body of the vertical probe to undergo elastic bending deformation mainly along the first transverse axis. The first and second transition zones of the vertical probe can be designed accordingly, for example, by making the length of the second transition zone greater than that of the first transition zone, thereby further improving the stress concentration problem and making the vertical probe less likely to break.

[0029] Preferably, the probe head further includes another vertical probe, the other vertical probe including a body extending in an elongated shape along a longitudinal axis, and a needle tip connected to the body and extending from the body along the longitudinal axis, the other vertical probe including a first side surface, a second side surface, a third side surface facing in an opposite direction to the first side surface, and a fourth side surface facing in an opposite direction to the second side surface, the first side surface, the second side surface, the third side surface and the fourth side surface all extending from the body to the needle tip in a planar shape, the body of the other vertical probe including an upper mounting portion and a lower mounting portion, the upper mounting portion and the lower mounting portion of the other vertical probe are respectively inserted through another upper guide hole of the upper guide plate unit and another lower guide hole of the lower guide plate unit, and the needle tip of the other vertical probe is located below the lower surface of the lower guide plate unit.

[0030] In other words, the tip thickness and width of the second vertical probe (hereinafter referred to as the second vertical probe) remain unchanged, remaining the same as the main body. Compared to the vertical probe with a reduced tip thickness and width (hereinafter referred to as the first vertical probe), the second vertical probe's tip has a larger contact area. This makes the probe head suitable for testing objects with microbumps. The second vertical probe's tip can simultaneously contact multiple microbumps used to transmit power or ground signals, while the first vertical probe's tip contacts a single microbump used to transmit a test signal. This ensures that, even though the tips of the first and second vertical probes are unequal in size, the main bodies remain the same, making it easier to control the deformation of the main bodies of the first and second vertical probes, resulting in consistent probe testing performance. Furthermore, the wear of the first and second vertical probes can be consistent. Furthermore, since the micro-bumps of the object under test are typically arranged in a matrix, the thickness and width of the first vertical probe tip are reduced in such a way that, under the premise that the tip of the first vertical probe corresponds exactly to a single micro-bump, the bodies of the first and second vertical probes remain aligned with each other. Consequently, the lower guide holes through which the first and second vertical probes pass can also be aligned with each other. This eliminates the need to design different lower guide hole arrangements for the first and second vertical probes. This simplifies the design of the lower guide holes and avoids damage to the lower guide plate unit due to a complex arrangement design or even inconsistent spacing of the lower guide holes.

[0031] Preferably, the probe head can define a first transverse axial direction and a second transverse axial direction perpendicular to each other, and the upper guide hole and the lower guide hole are staggered along the first transverse axial direction so that the fourth side surfaces of the vertical probe and the other vertical probe abut against an inner surface of the lower guide hole, wherein the upper guide hole and the lower guide hole are also staggered along the second transverse axial direction so that the third side surfaces of the vertical probe and the other vertical probe abut against the other inner surface of the lower guide hole, and the distance between the upper guide hole and the lower guide hole along the first transverse axial direction is greater than the distance between the upper guide hole and the lower guide hole along the second transverse axial direction.

[0032] Thus, when the upper and lower guide holes are offset along both the first and second transverse axes, the vertical probe's planar third and fourth side surfaces rest against the inner surface of the lower guide hole. This prevents the probe tip from breaking even if it moves up and down and retracts into the lower guide hole when contacting the object under test. Furthermore, the probe tip's position shifts, preventing it from misaligning with the conductive contacts of the object under test. Furthermore, the large offset between the upper and lower guide holes along the first transverse axis causes the vertical probe's body to undergo elastic bending deformation primarily along the first transverse axis. The vertical probe's first and second transition zones can be designed accordingly, for example, by making the second transition zone longer than the first, thereby further alleviating stress concentration and making the vertical probe less susceptible to breakage.

[0033] To achieve the above-mentioned objectives, the present invention provides a method for manufacturing a vertical probe as described above, characterized in that a first transition region is formed by laser processing (e.g., laser ablation) between a first position and a second position on a top surface of a substrate made of a conductive material; and a first lower plane region is formed by laser processing between the second position and a third position on the top surface of the substrate.

[0034] Thus, the first side surface of the vertical probe is formed into a first transition area and a first lower plane area through laser processing, which can ensure good dimensional accuracy of the needle tip, make the tolerance of the vertical probe meet the requirements, and thus improve the production yield of the probe card.

[0035] Preferably, the aforementioned method for manufacturing a vertical probe is further characterized in that the second transition region and the second lower planar region of the second side surface are formed by laser processing the substrate (e.g., laser cutting). This improves the dimensional accuracy of the probe tip and further enhances the production yield of the probe card.

[0036] In one embodiment of the present invention, the steps of the method for manufacturing a vertical probe include: Providing a substrate, the substrate being a plate, the substrate having the top surface and a bottom surface facing in the opposite direction to the top surface; Performing laser processing on the top surface of the substrate between a first position and a second position to form a transition surface, such that the transition surface gradually extends from the first position to the second position approaching the bottom surface; Performing laser processing between the second position and the third position on the top surface of the substrate by laser processing to form a processing plane; and A cutting process is performed to cut the substrate into at least one vertical probe, so that the first upper plane region of the first side surface of the vertical probe is derived from the portion of the top surface of the substrate that has not been laser processed, the first transition region is derived from the transition surface of the substrate, the first lower plane region is derived from the processed plane of the substrate, and the second side surface and the fourth side surface are generated by the cutting process.

[0037] Thus, the vertical probe provided by the present invention can be manufactured by laser processing (e.g., laser ablation) and cutting a plate. Laser processing on the top surface of the plate creates a transition surface and a processing plane, thereby reducing the thickness of the subsequently cut vertical probe tip. The bottom surface of the plate remains flat, forming the third side of the vertical probe. This manufacturing method not only produces a vertical probe with the aforementioned properties, but also allows the same plate to be cut into multiple probes after laser processing, making the manufacturing process convenient and rapid.

[0038] Preferably, the cutting process is performed by a laser processing method (such as laser cutting), which can make the dimensional accuracy of the vertical probe better and further improve the production yield of the probe card.

[0039] Preferably, the cutting process generates a longitudinal distance between the second upper intersection line of the second side surface and the third location that is substantially different from the longitudinal distance between the first location and the third location; or, the cutting process generates a longitudinal distance between the second lower intersection line of the second side surface and the third location that is substantially different from the longitudinal distance between the second location and the third location. This allows the second upper intersection line of the second side surface to be non-aligned with the first upper intersection line of the first side surface, or the second lower intersection line of the second side surface to be non-aligned with the first lower intersection line of the first side surface, thereby alleviating stress concentration issues in the first and second transition zones and the first and second lower planar zones, making the vertical probe less susceptible to breakage.

[0040] In another embodiment of the present invention, the steps of the method for manufacturing a vertical probe include: Providing a substrate, wherein the substrate is an elongated needle body and includes a second side of a vertical probe; and A first transition region is formed by laser processing between a first position and a second position on the top surface of the substrate, and a first lower plane region is formed by laser processing between a second position and a third position on the top surface of the substrate, so that the top surface of the substrate becomes the first side surface of the vertical probe.

[0041] Thus, the vertical probe provided by the aforementioned present invention can be manufactured by laser processing an elongated needle body. The needle body can be formed by microelectromechanical processing or other methods. This process can form the required side profile of the vertical probe, so that the needle body can include a second upper planar region, a second transition region, and a second lower surface region on the second side of the vertical probe. The top and bottom surfaces of the needle body can be planar. The aforementioned manufacturing method reduces the tip thickness by forming the first transition region and the first lower planar region on the top surface of the needle body. The bottom surface, located opposite the top surface, can remain planar, forming the third side of the vertical probe. This manufacturing method can also produce a vertical probe having the aforementioned functions.

[0042] Preferably, the distance between the first position and the third position in the longitudinal axis is substantially not equal to the distance between the second upper boundary line of the second side surface and the third position in the longitudinal axis; or, the distance between the second position and the third position in the longitudinal axis is substantially not equal to the distance between the second lower boundary line of the second side surface and the third position in the longitudinal axis.

[0043] Thus, the top surface of the probe body is laser-processed to form a first transition zone whose starting position is different from the starting position of the second transition zone on the second side surface, thereby preventing the boundaries between the first and second transition zones and the first and second upper planar zones from being aligned. Alternatively, the ending position of the first transition zone is different from the ending position of the second transition zone on the second side surface, thereby preventing the boundaries between the first and second transition zones and the first and second lower planar zones from being aligned. This alleviates stress concentration issues in the first and second transition zones and the first and second lower planar zones, making the vertical probe less susceptible to breakage. The present invention also allows for the boundaries between the first and second transition zones and the first and second upper planar zones to be non-aligned, and simultaneously, the boundaries between the first and second transition zones and the first and second lower planar zones to be non-aligned, further alleviating stress concentration issues and preventing the vertical probe from breaking.

[0044] The detailed structure, features, assembly, and use of the vertical probe, probe head, and vertical probe manufacturing method provided by the present invention will be described in the detailed description of the embodiments that follow. However, those skilled in the art will understand that the detailed description and the specific embodiments listed in the embodiments are intended only to illustrate the present invention and are not intended to limit the scope of the present invention. Simple diagram description

[0045] FIG1 is a schematic cross-sectional view of a probe head provided by a first preferred embodiment of the present invention. FIG2 is a schematic plan view of a vertical probe provided by the first preferred embodiment of the present invention. FIG3 is a cross-sectional view of the probe head provided by the first preferred embodiment of the present invention along the section line 3 - 3 in FIG1 . FIG4 is a perspective schematic diagram of a vertical probe provided by the first preferred embodiment of the present invention. FIG. 5 is a flow chart of a method for manufacturing a vertical probe provided by the first preferred embodiment of the present invention. 6 to 8 are three-dimensional schematic diagrams showing the manufacturing process of the vertical probe provided by the first preferred embodiment of the present invention. FIG9 is similar to FIG3 , but shows that the cross section of the body of the vertical probe is rectangular. FIG10 is a plan view of a vertical probe provided by a second preferred embodiment of the present invention. FIG. 11 is similar to FIG. 8 , but shows the cutting process of the vertical probe provided by the second preferred embodiment of the present invention. FIG. 12 is a flow chart of another method for manufacturing a vertical probe provided by the present invention. FIG13 is a schematic perspective view of the manufacturing method shown in FIG12. FIG14 is a schematic cross-sectional view of a probe head provided in a third preferred embodiment of the present invention. FIG. 15 is a schematic diagram of two vertical probe contact micro-bumps of a probe head provided by the third preferred embodiment of the present invention. Implementation Method

[0046] The applicant would like to first clarify that in the embodiments and drawings described below, identical reference numbers represent identical or similar components or structural features. It should be noted that the components and structures in the drawings are drawn for illustrative purposes only and are not drawn to actual scale or quantity. Furthermore, features from different embodiments may be interchangeably applied, if practically possible. Furthermore, when a component is referred to as being disposed on another component, this means that the component is directly disposed on the other component, or indirectly disposed on the other component, i.e., one or more other components are disposed between the two components. When a component is referred to as being "directly" disposed on another component, this means that no other components are disposed between the two components.

[0047] Please refer to FIG. 1 . A probe head 10 provided in a first preferred embodiment of the present invention includes an upper guide plate unit 20 , a lower guide plate unit 30 , and a vertical probe 40 (the number of which is not limited).

[0048] In this embodiment, the upper and lower guide plate units 20 and 30 each comprise a single plate. However, the upper and / or lower guide plate units 20 and 30 may also be composed of multiple stacked plates. The edges of the upper and lower guide plate units 20 and 30 may have protruding structures, allowing them to be directly connected to each other. Alternatively, a hollow center guide plate (not shown) may be connected between the upper and lower guide plate units 20 and 30. The upper guide plate unit 20 comprises an upper surface 21, a lower surface 22, and an upper guide hole 23 (in any number) extending through the upper and lower surfaces 21 and 22. The lower guide plate unit 30 comprises an upper surface 31, a lower surface 32, and a lower guide hole 33 (in any number) extending through the upper and lower surfaces 31 and 32.

[0049] During the assembly process of the probe head 10, the upper and lower guide plate units 20 and 30 are initially positioned relative to each other but not yet fixed to each other. The upper surface 31 of the lower guide plate unit 30 faces the lower surface 22 of the upper guide plate unit 20, and the upper guide hole 23 and the lower guide hole 33 are coaxially aligned. As shown in FIG2 , the vertical probe 40 is initially linear and passes from top to bottom through the coaxially aligned upper and lower guide holes 23 and 33. Subsequently, the upper and lower guide plate units 20 and 30 move relative to each other along a first transverse axis (the Y axis), causing the upper and lower guide holes 23 and 33 to shift relative to each other along the Y axis, thereby causing the vertical probe 40 to assume the curved shape shown in FIG1 . The upper and lower guide plate units 20 and 30 may also move relative to each other along a second transverse axis (the X axis), causing the upper and lower guide holes 23 and 33 to shift relative to each other along the X axis. In this embodiment, the offset distance between the upper guide hole 23 and the lower guide hole 33 along the Y-axis is greater than the offset distance between the upper guide hole 23 and the lower guide hole 33 along the X-axis, causing the vertical probe 40 to bend primarily along the Y-axis. The upper and lower guide plate units 20 and 30 are then fixed to each other, maintaining the curved shape of the vertical probe 40 within the probe head 10 as shown in FIG1 .

[0050] As shown in Figure 2 , the vertical probe 40 includes a body 41 extending in an elongated shape along a longitudinal axis (the Z-axis), a needle tail 42 integrally connected to the body 41 and extending upward from the body 41 along the Z-axis, and a needle tip 43 integrally connected to the body 41 and extending downward from the body 41 along the Z-axis. As shown in Figure 1 , the portion connecting the body 41 and the needle tail 42 is an upper mounting portion 411 that passes through the upper guide hole 23 . The portion connecting the body 41 and the needle tip 43 is a lower mounting portion 412 that passes through the lower guide hole 33 . The lower mounting portion 412 further partially protrudes from the lower surface 32 of the lower guide plate unit 30 , positioning the needle tip 43 below the lower surface 32 of the lower guide plate unit 30 .

[0051] Referring to Figures 2 to 4 , vertical probe 40 includes a first side 44, a second side 45, a third side 46 facing in the opposite direction from first side 44, and a fourth side 47 facing in the opposite direction from second side 45. Both third side 46 and fourth side 47 extend planarly from body 41 to tip 43. More specifically, the portion of third side 46 located on body 41 and the portion of third side 46 located on tip 43 are coplanar and parallel to the Y-axis and the Z-axis, i.e., the YZ plane. The portion of fourth side 47 located on body 41 and the portion of fourth side 47 located on tip 43 are coplanar and parallel to the X-axis and the Z-axis, i.e., the XZ plane. Specifically, the third side 46 and the fourth side 47 are not coplanar with every portion of the body 41 and the needle tip 43. Instead, only the portion where the body 41 and the needle tip 43 connect is coplanar. Therefore, both the third side 46 and the fourth side 47 extend planarly from the body 41 to the needle tip 43. Regarding this portion, referring to FIG. 1 , this portion connecting the body 41 and the needle tip 43 can generally be the lower mounting portion 412 of the body 41, or the portion of the lower mounting portion 412 of the body 41 that partially protrudes from the lower surface 32 of the lower guide plate unit 30. In contrast, the first side 44 and the second side 45 do not extend completely planarly from the body 41 to the needle tip 43, as described below.

[0052] The first side surface 44 includes a first upper planar region 441 located on the body 41, a first transition region 442 located on the needle tip 43, and a first lower planar region 443. The first transition region 442 is located between the first upper planar region 441 and the first lower planar region 443. The first upper planar region 441 and the first lower planar region 443 are perpendicular to the X-axis, and the first transition region 442 is inclined relative to the first upper planar region 441 and the first lower planar region 443. A first upper boundary line 444 is defined between the first transition region 442 and the first upper planar region 441, and a first lower boundary line 445 is defined between the first transition region 442 and the first lower planar region 443. The first lower planar region 443 is closer to the third side surface 46 than the first upper planar region 441. The first transition region 442 extends from the first upper boundary line 444 to the first lower boundary line 445, gradually approaching the third side surface 46. In other words, if the distance between the first side surface 44 and the third side surface 46 on the X-axis is defined as the thickness, the thickness of the main body 41 is greater than the thickness of the needle tip 43, and the thickness of the needle tip 43 gradually decreases within the first transition region 442 and maintains a uniform thickness within the first lower plane region 443.

[0053] The second side surface 45 includes a second upper planar region 451 located on the body 41, a second transition region 452 located on the needle tip 43, and a second lower planar region 453. The second transition region 452 is located between the second upper planar region 451 and the second lower planar region 453. The second upper planar region 451 and the second lower planar region 453 are perpendicular to the Y-axis, and the second transition region 452 is inclined relative to the second upper planar region 451 and the second lower planar region 453. A second upper boundary line 454 is defined between the second transition region 452 and the second upper planar region 451, and a second lower boundary line 455 is defined between the second transition region 452 and the second lower planar region 453. The second lower planar region 453 is closer to the fourth side surface 47 than the second upper planar region 451. The second transition region 452 extends from the second upper boundary line 454 to the second lower boundary line 455, gradually approaching the fourth side surface 47. In other words, if the distance between the second side surface 45 and the fourth side surface 47 on the Y-axis is defined as the width, the width of the body 41 is greater than the width of the needle tip 43, and the needle tip 43 gradually decreases in width within the second transition region 452 and maintains a uniform width within the second lower plane region 453.

[0054] Thus, the portion of the needle tip 43 comprising the first and second transition regions 442 and 452 constitutes a needle tip tapered portion 431, while the portion comprising the first and second lower planar regions 443 and 453 constitutes a needle tip contact portion 432. The needle tip tapered portion 431 is located between the body 41 and the needle tip contact portion 432, and its cross-sectional area gradually decreases from the body 41 toward the needle tip contact portion 432. The end of the needle tip contact portion 432 is a contact end 433, which is the point of the needle tip 43 farthest from the body 41. The contact end 433 is used to contact a conductive contact (not shown) on a test object. The needle tip tapered portion 431 can be gradually reduced to the desired thickness and width, ensuring that the thickness and width of the needle tip contact portion 432 meet the requirements for contacting tiny conductive contacts, while the body 41 still maintains a relatively large width and thickness. This ensures that the vertical probe 40 has excellent current resistance, structural strength, and service life. In this embodiment, the first and second transition regions 442 and 452 are respectively an inclined plane. However, the first and second transition regions 442 and 452 are not limited to inclined planes, as long as the thickness and width can be gradually reduced, for example, they can be in a stepped shape.

[0055] 5 to 8 , the manufacturing method of the vertical probe 40 includes the following steps S11 to S14 .

[0056] Step S11 provides a substrate 50A (as shown in FIG6 ). Substrate 50A is a plate made of a conductive material. Substrate 50A has a top surface 51 and a bottom surface 52 facing in the opposite direction of top surface 51. For example, alloy plate or electroplated plate can be used, and a long piece of material can be used. For example, the plate can be formed by micro-electromechanical forming or metal hot rolling.

[0057] Step S12 involves laser processing (e.g., laser ablation) between a first position P1 and a second position P2 on the top surface 51 of the substrate 50A to form a transition surface 511. The transition surface 511 gradually extends from the first position P1 to the second position P2, gradually approaching the bottom surface 52. The transition surface 511 is not limited to an inclined plane, as long as it allows the substrate 50A to gradually decrease in thickness. For example, it can be in a stepped shape.

[0058] Step S13 involves performing laser processing between the second position P2 and a third position P3 on the top surface 51 of the substrate 50A using the aforementioned laser processing method to form a processed surface 512. In other words, after completing step S12, step S13 is performed using the same laser processing method to form the processed surface 512. Therefore, the starting position for forming the processed surface 512 is the ending position (i.e., the second position P2) for forming the transition surface 511, and the ending position (i.e., the third position P3) for forming the processed surface 512 is located at an end surface 53 of the substrate 50A. The laser processing method (e.g., laser ablation) described in steps S12 and S13 involves directly striking the substrate 50A with a laser, ablating the substrate 50A with the laser energy, thereby thinning the substrate 50A.

[0059] Step S14 involves performing a cutting process to cut substrate 50A into at least one vertical probe 40. For example, vertical probe 40 as shown in FIG. 2 is cut along two cutting paths 54 and 55 shown in FIG. 8 . This process results in a first upper planar region 441 of first side surface 44 of vertical probe 40 originating from the portion of top surface 51 of substrate 50A that has not been laser processed (i.e., plane 513 shown in FIG. 7 and FIG. 8 ), a first transition region 442 originating from transition surface 511 of substrate 50A, and a first lower planar region 443 originating from processed plane 512 of substrate 50A. Furthermore, second side surface 45 and fourth side surface 47 are generated by the cutting process. More specifically, cutting paths 54 and 55 shown in FIG. 8 form fourth side surface 47 and second side surface 45 of vertical probe 40, respectively. Cutting path 55 has two turning points 551 and 552, thereby forming second upper planar region 451, second transition region 452, and second lower planar region 453 of second side surface 45. The cutting process can be performed by a laser processing method, such as laser cutting.

[0060] Because the needle tip 43 of the vertical probe 40 of the present invention is designed to be non-coplanar with the body 41 only on the first and second sides 44, 45, while the needle tip 43 is coplanar with the body 41 on the third and fourth sides 46, 47, the vertical probe 40 can be mounted on the lower guide plate unit 30, as shown in Figures 1 and 3, with the second side 45 facing the direction in which the lower guide hole 33 is offset relative to the upper guide hole 23 along the first transverse axis (i.e., the negative Y-axis direction), such that the fourth side 47 abuts an inner surface 331 of the lower guide hole 33 facing the negative Y-axis direction. If the upper and lower guide holes 23 are also offset along the second transverse axis, the first side 44 faces the direction in which the lower guide hole 33 is offset relative to the upper guide hole 23 along the second transverse axis (i.e., the positive X-axis direction), such that the third side 46 abuts another inner surface 332 of the lower guide hole 33 facing the positive X-axis direction.

[0061] Thus, the vertical probe 40 rests against the inner surface 332 and / or inner surface 331 of the lower guide hole 33 with its planar third side surface 46 and / or fourth side surface 47. There is no height difference between the third side surface 46 and the fourth side surface 47 and the probe tip 43, resulting in relatively good structural strength. Therefore, when the contact end 433 of the probe tip 43 contacts the conductive contact of the object under test, even if the probe tip 43 moves up and down and retracts into the lower guide hole 33, the probe tip 43 is not easily broken. Furthermore, the probe tip 43 is prevented from shifting in position, which could cause the contact end 433 to lose alignment with the conductive contact of the object under test. Furthermore, the first side surface 44 of the vertical probe 40 is formed by laser processing to form a first transition region 442 and a first lower flat region 443, which can ensure that the dimensional accuracy of the needle tip 43 is good. The second side surface 45 of the second transition region 452 and the second lower flat region 453 are also formed by laser processing, making the dimensional accuracy of the needle tip 43 even better. In this way, the tolerance of the vertical probe 40 can meet the requirements, thereby improving the production yield of the probe card.

[0062] It is worth mentioning that the probe head 10 in this embodiment includes upper and lower guide plate units 20 and 30 for the vertical probe 40 to pass through, but the probe head 10 may also not include the upper guide plate unit 20. As long as the vertical probe 40 is passed through the lower guide hole 33 of the lower guide plate unit 30 and the third side surface 46 and / or the fourth side surface 47 are abutted against the inner surface 332 and / or the inner surface 331 of the lower guide hole 33, the vertical probe 40 of the present invention can be exerted.

[0063] Preferably, as shown in FIG3 , the width W1 of the first and third sides 44, 46 of the vertical probe 40 within the body 41 is between 30 and 100 microns, and the width W2 of the second and fourth sides 45, 47 within the body 41 is also between 30 and 100 microns. In other words, during the aforementioned manufacturing process, the thickness of the substrate 50A (equivalent to the width W2) shown in FIG6 is between 30 and 100 microns, and the maximum distance along the Y-axis between the two cutting paths 54, 55 (equivalent to the width W1) shown in FIG8 is also between 30 and 100 microns. These dimensions are suitable for reducing the thickness and width of the probe tip by machining the first and second transition regions 442, 452 and the first and second lower planar regions 443, 453.

[0064] In this embodiment, the cross-section of the main body 41 is square, i.e., widths W1 and W2 shown in FIG3 are equal. The cross-section of the needle tip contact portion 432 is also square, i.e., widths W3 and W4 are equal. In this way, the reduction in the width of the vertical probe 40 (i.e., the difference between W1 and W3) and the reduction in the thickness of the needle tip (i.e., the difference between W2 and W4) are equal, thereby avoiding a large stress concentration in one of the transverse axes. However, as shown in FIG9 , the cross-section of the body 41 may also be rectangular, while the cross-section of the needle tip contact portion 432 is still square, and the short sides of the cross-section of the body 41 are on the first and third side surfaces 44 and 46, while the long sides are on the second and fourth side surfaces 45 and 47. Therefore, the reduction amount of the needle tip 43 on the first side surface 44 is greater than the reduction amount on the second side surface 45, that is, the distance D1 between the first upper plane area 441 and the first lower plane area 443 of the first side surface 44 on the X-axis is greater than the distance D2 between the second upper plane area 451 and the second lower plane area 453 of the second side surface 45 on the Y-axis. In other words, the cross-sectional area of ​​the needle tip 43 is reduced to a greater extent on the first side 44 and to a lesser extent on the second side 45. This results in less stress concentration on the second side 45 of the needle tip 43. Consequently, orienting the second side 45 toward the transverse axis (i.e., the Y-axis), where the relative displacement of the upper and lower guide plate units 20 and 30 is greater, makes the vertical probe 40 less susceptible to breakage. Furthermore, the short side of the cross section of the body 41 is parallel to this transverse axis (i.e., the Y-axis), which exhibits greater relative displacement, resulting in better elastic deformation. Furthermore, the body 41 may further include at least one slit (not shown) extending through the first side 44 and the third side 46 to further enhance elastic deformation. In the present invention, the cross-sectional shape of the needle tip contact portion 432 is square, and the cross-sectional shape of the body 41 is square or rectangular. These square or rectangular shapes are not limited to perfect squares or rectangles, but also encompass those where the four corners of the square or rectangle are not perfectly right angles due to machining errors or chamfers.

[0065] Referring to Figures 2 and 4 , the present invention defines the distance between the first lower boundary line 445 and the contact end 433 on the Z-axis as a first height H1, and the distance between the second lower boundary line 455 and the contact end 433 on the Z-axis as a second height H2. In the first preferred embodiment, the first height H1 is greater than the second height H2. When the probe tip 43 contacts the object being measured, stress is concentrated in the first and second transition regions 442 and 452 and the first and second lower planar regions 443 and 453, making these areas more susceptible to fracture. Designing the first and second lower boundary lines 445 and 455 at different heights, or even making the first and second lower planar regions 443 and 453 unequal in height, can alleviate the stress concentration issue and make the vertical probe 40 less susceptible to fracture. Alternatively, the second height H2 can be greater than the first height H1. As long as the first and second heights H1 and H2 are unequal, the aforementioned effect can be achieved. In order to achieve this structural feature, in the manufacturing method of the vertical probe 40, the cutting process shown in Figure 8 generates a distance D3 between the position of the second lower boundary line 455 (i.e., the turning position 552 of the cutting path 55) and the third position P3 on the Z axis, which is not equal to the distance D4 between the second position P2 and the third position P3 on the Z axis.

[0066] The aforementioned effect can also be achieved by designing the first and second upper intersection lines 444 and 454 at different heights. For example, FIG. 10 shows a vertical probe provided by a second preferred embodiment of the present invention, wherein the distance between the first upper intersection line 444 and the contact end 433 on the Z axis is defined as a third height H3, and the distance between the second upper intersection line 454 (i.e., the turning point of the second side surface 45 between the second upper planar region 451 and the second transition region 452) and the contact end 433 on the Z axis is defined as a fourth height H4. By making the fourth height H4 greater than the third height H3, or making the third height H3 greater than the fourth height H4, even if the total height of the first lower planar region 443 and the first transition region 442 is unequal to the total height of the second lower planar region 453 and the second transition region 452, the stress concentration problem can be alleviated, making the vertical probe less likely to break. To achieve this structural feature, the cutting process in the vertical probe manufacturing method is shown in Figure 11. This cutting process results in a Z-axis distance D5 between the second upper boundary 454 (i.e., turning point 551 of the cutting path 55) and the third position P3 that is different from the Z-axis distance D6 between the first position P1 and the third position P3. The present invention also allows the first and second lower boundary lines 445 and 455 to be located at different heights, and the first and second upper boundary lines 444 and 454 to be located at different heights. This further reduces stress concentration issues and makes the vertical probe less susceptible to fracture.

[0067] In the first and second preferred embodiments described above, the distance D7 between the second upper boundary line 454 and the second lower boundary line 455 is greater than the distance D8 between the first upper boundary line 444 and the first lower boundary line 445, as shown in FIG. 4 . That is, the length of the second transition region 452 is greater than the length of the first transition region 442. This allows the second transition region 452 to have a better stress dispersion effect than the first transition region 442. When the upper and lower guide plate units 20 and 30 are relatively displaced only along the Y-axis, or when the relative displacement of the upper and lower guide plate units 20 and 30 along the Y-axis is greater than the relative displacement along the X-axis, the vertical probe 40 will be subjected to greater stress on the Y-axis where the relative displacement is greater. The second transition region 452 faces the Y-axis and is relatively long, which can effectively disperse the relatively large stress on the vertical probe 40 along the Y-axis. The aforementioned distances D7 and D8 can even be designed based on the predetermined relative displacement of the upper and lower guide plate units 20 and 30 along the X-axis and Y-axis, thereby further improving the stress concentration problem and making the vertical probe less likely to break.

[0068] 12 to 13 , the vertical probe 40 of the present invention can also be manufactured by another manufacturing method, which includes the following steps S21 to S23 .

[0069] Step S21 provides a substrate 50B (as shown in FIG13 ). Substrate 50B is an elongated probe formed from a conductive material. Substrate 50B has a top surface 51, a bottom surface 52 facing in the opposite direction from top surface 51, and two side surfaces 56 and 57 facing in opposite directions. For example, the probe can be formed using a microelectromechanical (MEMS) process. Typically, multiple probes are formed simultaneously on a substrate (not shown) and subsequently processed simultaneously to produce multiple vertical probes. FIG13 schematically illustrates only one probe. At this point, the desired side profile of the vertical probe 40 is formed. Therefore, the sides 56 and 57 of the probe body 50B are the fourth side 47 and second side 45 of the vertical probe 40, respectively (as shown in FIG. 4 ). In other words, the probe body 50B provided in step S21 already includes the second upper planar region 451, second transition region 452, second lower surface region 453, second upper boundary line 454, and second lower boundary line 455 of the second side 45 of the vertical probe 40. The maximum width and thickness of the substrate 50B provided in step S21 are equivalent to the width and thickness of the body 41 of the final vertical probe 40, namely, W1 and W2 shown in FIG. 3 .

[0070] In other embodiments, the needle body can be formed by laser processing (such as laser cutting). Usually, multiple needle bodies are formed simultaneously on a substrate (not shown) to form the side profile required for the vertical probe 40. Therefore, the sides 56 and 57 of the needle body 50B are the fourth side surface 47 and the second side surface 45 of the vertical probe 40, respectively (as shown in Figure 4).

[0071] In step S22 , a laser treatment is performed between a first position P1 and a second position P2 on the top surface 51 of the substrate 50B by laser treatment (eg, laser ablation) to form a first transition region 442 of the vertical probe 40 (as shown in FIG. 4 ).

[0072] In step S23 , laser processing is performed between the second position P2 and a third position P3 on the top surface 51 of the substrate 50B by the laser processing method to form a first lower plane region 443 of the vertical probe 40 (as shown in FIG. 4 ).

[0073] In other words, after step S22, step S23 is performed using the same laser processing method, so that the top surface 51 of the substrate 50B becomes the first side surface 44 of the vertical probe 40. The starting position for forming the first lower planar region 443 is the ending position (i.e., the second position P2) for forming the first transition region 442, and the ending position (i.e., the third position P3) for forming the first lower planar region 443 is located at one end 58 of the substrate 50B.

[0074] In this manufacturing method, the distance D9 between the first position P1 and the third position P3 on the Z axis can be different from the distance D10 between the second upper boundary 454 and the third position P3 on the Z axis. This causes the first and second upper boundary lines 444 and 454 of the vertical probe 40 to be misaligned. Specifically, as shown in FIG10 , the third height H3 and the fourth height H4 are unequal. This alleviates stress concentration and makes the vertical probe 40 less likely to break. Alternatively, the distance D11 between the second position P2 and the third position P3 on the Z axis can be different from the distance D12 between the second lower boundary 455 and the third position P3 on the Z axis. This causes the first and second lower boundary lines 445 and 455 of the vertical probe 40 to be misaligned. Specifically, as shown in FIG2 , the first height H1 and the second height H2 are unequal. This alleviates stress concentration and makes the vertical probe 40 less likely to break.

[0075] Referring to FIG. 14 , a third preferred embodiment of the present invention provides a probe head similar to that provided by the first preferred embodiment, except that the probe head of this embodiment includes two vertical probes 40 and 40 ′. The vertical probe 40 can adopt any of the aforementioned configurations, and its tip 43 is reduced on the first side surface 44 and the second side surface 45. Compared to the vertical probe 40, the vertical probe 40 ′ differs only in that its tip 43 lacks the first and second transition regions 442 and 452 and the first and second lower planar regions 443 and 453. That is, the first to fourth side surfaces 44-47 of the vertical probe 40 ′ all extend planarly from the body 41 to the tip 43. Therefore, the tip 43 of the vertical probe 40 ′ is not reduced in thickness or width and is equal to the body 41. The contact end 433 of the tip 43 of the vertical probe 40 ′ has a larger area than the contact end 433 of the tip 43 of the vertical probe 40 ′.

[0076] Thus, the probe head of the embodiment shown in FIG14 is suitable for use in testing objects with microbumps. For example, FIG15 schematically illustrates nine microbumps 61 and 62. The microbumps can be arranged in a matrix, and the microbumps used to transmit power signals or ground signals can be clustered in groups of three or four. In the embodiment of FIG15 , all microbumps 61 are used to transmit power signals or all are used to transmit ground signals, while the microbumps 62 used to transmit test signals are arranged in a non-clustered manner. FIG15 also schematically illustrates the contact ends 433 and body 41 of two vertical probes 40 and 40', as well as the lower guide holes 33 formed through the vertical probes 40 and 40'. The contact end 433 of the vertical probe 40' can be used to contact four microbumps 61 simultaneously, while the contact end 433 of the vertical probe 40 is used to contact a single microbump 62.

[0077] In this way, even if the sizes of the needle tips 43 of the vertical probes 40 and 40' are not equal, the sizes of the main bodies 41 are still roughly equal. Therefore, it is easy to control the deformation of the main bodies 41 of the vertical probes 40 and 40' to be consistent, thereby producing roughly consistent needle testing performance, and the wear of the vertical probes 40 and 40' can also be roughly consistent.

[0078] It is worth noting that in the embodiment of FIG. 15 , the contact end 433 of the vertical probe 40 is configured to simultaneously contact four microbumps 61. However, this is not a limitation. The contact end 433 of the vertical probe 40 can be configured to simultaneously contact a plurality of microbumps 61, such as three, nine, or other numbers. However, the contact end 433 of the tip 43 of the vertical probe 40 only corresponds to a single microbump.

[0079] Those skilled in the art will appreciate that the thickness and width of the tip 43 of the vertical probe 40 can be appropriately reduced in a suitable manner and proportion so that the contact end 433 of the tip 43 of the vertical probe 40 precisely corresponds to a single microbump 62. After the thickness and width of the tip 43 of the vertical probe 40 are reduced, the bodies 41 of the vertical probes 40 and 40' can remain aligned with each other. Consequently, the lower guide holes 33 through which the vertical probes 40 and 40' pass can also be aligned with each other. This eliminates the need to design different arrangements of the lower guide holes 33 for each of the vertical probes 40 and 40'. This simplifies the design of the lower guide holes 33 and avoids damage to the lower guide plate unit 30 caused by a complex arrangement or inconsistent spacing of the lower guide holes 33.

[0080] An example of how vertical probes 40 and 40' are mounted on upper guide holes 23 and lower guide holes 33 is provided. Referring to Figures 14 and 15 , and in conjunction with Figures 1 and 4 , vertical probes 40 and 40' can be mounted on lower guide plate unit 30 such that second side surface 45 faces the direction offset from lower guide hole 33 relative to upper guide hole 23 along the first transverse axis (i.e., the negative Y-axis direction), such that fourth side surface 47 abuts an inner surface 331 of lower guide hole 33 facing the negative Y-axis direction. If upper guide hole 23 and lower guide hole 33 are also offset along the second transverse axis, first side surface 44 faces the direction offset from lower guide hole 33 relative to upper guide hole 23 along the second transverse axis (i.e., the positive X-axis direction), such that third side surface 46 abuts another inner surface 332 of lower guide hole 33 facing the positive X-axis direction.

[0081] Finally, it must be reiterated that the constituent elements disclosed in the aforementioned embodiments of the present invention are merely illustrative and are not intended to limit the scope of the present invention. Replacements or modifications of other equivalent elements should also be covered by the scope of the patent application of this case.

[0082] 10: Probe head 20: Upper guide plate unit 21: Upper surface 22: Lower surface 23: Upper guide hole 30: Lower guide plate unit 31: Upper surface 32: Lower surface 33: Lower guide hole 331,332: Inner surface 40,40': Vertical probe 41:Ontology 411: Upper mounting portion 412: Lower mounting portion 42: Needle Tail 43: Needle Tip 431: needle tip tapered portion 432: needle tip contact portion 433: Contact end 44: First side 441: First upper plane area 442: First Transition Zone 443: First lower plane area 444: First upper boundary line 445: The first intersection line 45: Second side 451: Second upper plane area 452: Second Transition Zone 453: Second lower plane area 454: The second upper boundary line 455: The second intersection line 46: The third side 47: The fourth side 50A, 50B: base material 51: Top 511: Transition surface 512: Processing plane 513: plane 52: Bottom 53: End surface 54,55: cutting path 551,552: turning point 56,57: Side 58: End 61,62: Microbumps D1,D2,D3,D4,D5,D6,D7,D8,D9,D10,D11,D12: distance H1: First Height H2: Second height H3: The third height H4: The fourth height P1: First position P2: Second position P3: Third position S11, S12, S13, S14, S21, S22, S23: Steps W1, W2, W3, W4: width

Claims

1. A vertical probe comprising: a body extending elongated along a longitudinal axis; and a tip connected to the body and extending from the body along the longitudinal axis; wherein, The vertical probe includes a first side surface, a second side surface, a third side surface facing the opposite direction to the first side surface, and a fourth side surface facing the opposite direction to the second side surface. The third side surface and the fourth side surface are both planar and extend from the body to the tip. The first side surface includes a first upper plane area located on the body, a first transition area and a first lower plane area located on the tip. The first transition area is located between the first upper plane area and the first lower plane area. There is a first upper boundary line between the first transition area and the first upper plane area, and there is a first lower boundary line between the first transition area and the first lower plane area. The first lower plane area is closer to the third side surface than the first upper plane area. The first transition area gradually extends from the first upper boundary line to the first lower boundary line, getting closer to the third side surface. The second side includes a second upper plane region located on the body, a second transition region located on the needle tip, and a second lower plane region. The second transition region is located between the second upper plane region and the second lower plane region. There is a second upper boundary line between the second transition region and the second upper plane region, and a second lower boundary line between the second transition region and the second lower plane region. The second lower plane region is closer to the fourth side than the second upper plane region. The second transition region gradually extends from the second upper boundary line to the second lower boundary line, approaching the fourth side. The first transition region and the first lower plane region of the first side are achieved by a laser processing method.

2. The vertical probe as described in claim 1, wherein the tip has a contact end furthest from the body, the distance between the first lower boundary line and the contact end in the longitudinal axis is defined as a first height, the distance between the second lower boundary line and the contact end in the longitudinal axis is defined as a second height, and the first height and the second height are substantially unequal.

3. The vertical probe as described in claim 1, wherein the tip has a contact end furthest from the body, the distance between the first upper boundary line and the contact end in the longitudinal axis is defined as a third height, the distance between the second upper boundary line and the contact end in the longitudinal axis is defined as a fourth height, and the third height and the fourth height are substantially unequal.

4. The vertical probe as described in claim 1, wherein the distance between the second upper boundary line and the second lower boundary line is greater than the distance between the first upper boundary line and the first lower boundary line.

5. The vertical probe as described in claim 1, wherein each of the first side, the second side, the third side, and the fourth side has a width between 30 micrometers and 100 micrometers in the body.

6. The vertical probe as described in claim 1, wherein the probe tip includes a probe tip tapering portion and a probe tip contact portion, the probe tip tapering portion includes the first transition region and the second transition region, the probe tip contact portion includes the first lower plane region and the second lower plane region, the probe tip contact portion has a square cross-section, and the body has a square cross-section.

7. The vertical probe as described in claim 1, wherein the probe tip includes a probe tip tapering portion and a probe tip contact portion, the probe tip tapering portion includes the first transition region and the second transition region, the probe tip contact portion includes the first lower plane region and the second lower plane region, the second upper plane region and the second lower plane region of the second side are perpendicular to a first transverse axis, the first upper plane region and the first lower plane region of the first side are perpendicular to a second transverse axis, and the distance between the first upper plane region and the first lower plane region of the first side on the second transverse axis is greater than the distance between the second upper plane region and the second lower plane region of the second side on the first transverse axis.

8. A probe head comprising: an upper guide plate unit including an upper guide hole; a lower guide plate unit including an upper surface, a lower surface, and a lower guide hole penetrating the upper surface and the lower surface, the upper surface facing the upper guide plate unit; and a vertical probe as described in any one of claims 1 to 7, the body of the vertical probe including an upper mounting portion and a lower mounting portion, the upper mounting portion and the lower mounting portion respectively passing through the upper guide hole and the lower guide hole, the tip of the vertical probe being located below the lower surface of the lower guide plate unit.

9. The probe head as claimed in claim 8, wherein the probe head defines a first transverse axis and a second transverse axis that are perpendicular to each other, and the upper guide hole and the lower guide hole are offset from each other along the first transverse axis such that the fourth side of the vertical probe abuts against an inner surface of the lower guide hole.

10. The probe head as claimed in claim 9, wherein the upper guide hole and the lower guide hole are also offset from each other along the second transverse axis, such that the third side of the vertical probe abuts against the other inner surface of the lower guide hole.

11. The probe head as claimed in claim 10, wherein the upper guide hole and the lower guide hole are offset from each other by a distance along the first transverse axis greater than the distance along the second transverse axis.

12. The probe head as claimed in claim 8, wherein the probe head further comprises another vertical probe, the other vertical probe comprising a body extending in an elongated shape along a longitudinal axis, and a tip connected to the body and extending from the body along the longitudinal axis, the other vertical probe comprising a first side surface, a second side surface, a third side surface facing in the opposite direction to the first side surface, and a fourth side surface facing in the opposite direction to the second side surface, the first side surface, the second side surface, the third side surface and the fourth side surface of the other vertical probe all extending planarly from the body of the other vertical probe to the tip of the other vertical probe, the body of the other vertical probe comprising an upper mounting portion and a lower mounting portion, the upper mounting portion and the lower mounting portion of the other vertical probe respectively passing through another upper guide hole of the upper guide plate unit and another lower guide hole of the lower guide plate unit, and the tip of the other vertical probe being located below the lower surface of the lower guide plate unit.

13. The probe head as claimed in claim 12, wherein the probe head defines a first transverse axis and a second transverse axis that are perpendicular to each other, the upper guide hole and the lower guide hole are offset from each other along the first transverse axis such that the fourth side surface of the vertical probe and the other vertical probe abuts against an inner surface of the lower guide hole, wherein the upper guide hole and the lower guide hole are also offset from each other along the second transverse axis such that the third side surface of the vertical probe and the other vertical probe abuts against another inner surface of the lower guide hole, and the distance by which the upper guide hole and the lower guide hole are offset from each other along the first transverse axis is greater than the distance by which the upper guide hole and the lower guide hole are offset from each other along the second transverse axis.

14. A method for manufacturing a vertical probe, used to manufacture the vertical probe as described in claim 1; the method is characterized in that: the first transition region is formed by laser processing between a first position and a second position on the top surface of a substrate made of a conductive material by the laser processing method; the first lower plane region is formed by laser processing between the second position and a third position on the top surface of the substrate by the laser processing method.

15. A method for manufacturing a vertical probe as claimed in claim 14, wherein the method is further characterized in that: the second transition region and the second lower plane region of the second side are formed by laser processing the substrate using a laser processing method.

16. A method of manufacturing a vertical probe as claimed in claim 14, wherein the method comprises the steps of: providing a substrate, the substrate being a plate having a top surface and a bottom surface facing in the opposite direction to the top surface; performing laser processing on the top surface of the substrate between a first position and a second position to form a transition surface, such that the transition surface gradually extends from the first position to the second position closer to the bottom surface; performing laser processing on the top surface of the substrate between a second position and a third position to form a processing plane; and performing a cutting process to cut the substrate into at least one vertical probe, such that a first upper plane region of a first side of the vertical probe originates from an un-laser-processed portion of the top surface of the substrate, the first transition region originates from the transition surface of the substrate, the first lower plane region originates from the processing plane of the substrate, and the second and fourth side surfaces are generated by the cutting process.

17. A method for manufacturing a vertical probe as described in claim 16, wherein the cutting process is performed by a laser process.

18. A method for manufacturing a vertical probe as claimed in claim 16, wherein the cutting process produces a distance in the longitudinal axis between the position of the second upper boundary line of the second side and the third position, which is substantially not equal to the distance in the longitudinal axis between the first position and the third position, or wherein the cutting process produces a distance in the longitudinal axis between the position of the second lower boundary line of the second side and the third position, which is substantially not equal to the distance in the longitudinal axis between the second position and the third position.

19. A method of manufacturing a vertical probe as claimed in claim 14, wherein the method comprises the steps of: providing a substrate, the substrate being an elongated needle body and including a second side surface of the vertical probe; and forming a first transition region by laser processing between a first position and a second position on the top surface of the substrate, and forming a first lower plane region by laser processing between a second position and a third position on the top surface of the substrate, such that the top surface of the substrate becomes the first side surface of the vertical probe.

20. A method for manufacturing a vertical probe as claimed in claim 19, wherein the distance between the first position and the third position in the longitudinal axis is substantially not equal to the distance between the second upper boundary line of the second side and the third position in the longitudinal axis, or wherein the distance between the second position and the third position in the longitudinal axis is substantially not equal to the distance between the second lower boundary line of the second side and the third position in the longitudinal axis.

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