Thermal interface material assemblies for sliding surfaces, and heat sinks and devices utilizing the same

Abstract

This invention discloses a thermal interface solution for sliding surfaces. In an exemplary embodiment, a thermal interface material assembly includes a substrate having opposing first and second surfaces. A friction-reducing layer runs along the first surface of the substrate. A thermal interface material runs along the second surface of the substrate, such that the substrate is positioned between the friction-reducing layer and the thermal interface material. The friction-reducing layer is configured to slide in contact with the first surface of the first component when the thermal interface material assembly runs along the second surface of the second component, and when the first and second surfaces are slidably movable relative to each other.

Description

Technical Field

[0001] The present disclosure generally relates to thermal interface solutions for sliding surfaces. Background Art

[0002] This section provides background information related to the present disclosure, which is not necessarily prior art.

[0003] Electrical components such as semiconductors, integrated circuit packages, transistors, etc. typically have a pre-designed temperature at which they operate optimally. Ideally, the pre-designed temperature is close to the temperature of the surrounding air. However, the operation of electrical components generates heat. If the heat is not removed, the electrical components may operate at a temperature significantly higher than their normal or desired operating temperature. Such a high temperature may adversely affect the operating characteristics of the electrical components and the operation of related devices.

[0004] To avoid or at least reduce the adverse operating characteristics resulting from self-heating, heat should be removed, for example, by conducting heat from the operating electrical components to a heat sink. The heat sink can then be cooled by conventional convection and / or radiation techniques. During conduction, heat can be transferred from the operating electrical components to the heat sink through direct surface contact between the electrical components and the heat sink and / or through contact between the electrical components and the heat sink surface via an intermediate medium or a thermal interface material (TIM). Thermal interface materials can be used to fill the gaps between heat transfer surfaces in order to improve the heat transfer efficiency compared to filling the gaps with air, which is a relatively poor heat conductor. Summary of the Invention

[0005] This section provides a general overview of the present disclosure, rather than a full disclosure of its entire scope or all of its features.

[0006] Exemplary embodiments of thermal interface solutions for sliding surfaces are disclosed herein. In an exemplary embodiment, the thermal interface material assembly includes a substrate having opposing first and second surfaces. A friction-reducing layer is along the first surface of the substrate. A thermal interface material is along the second surface of the substrate such that the substrate is located between the friction-reducing layer and the thermal interface material. The friction-reducing layer is configured to slide in contact with the first surface of the first component when the thermal interface material assembly is along the second surface of the second component and when the first and second surfaces are slidably movable relative to each other.

[0007] Other application areas will become apparent from the description provided herein. The description in the invention content and the specific examples are for illustrative purposes only and are not intended to limit the scope of the present disclosure. Brief Description of the Drawings

[0008] The drawings described herein are for illustrative purposes only of the selected embodiments and not all possible embodiments, and are not intended to limit the scope of the present disclosure.

[0009] [FIG. 1] is a cross-sectional view of a substrate (e.g., a polyimide (PI) or other polymer substrate, a metal substrate, etc.) of an exemplary embodiment of a thermal solution or a thermal interface material assembly including an anti-friction coating (e.g., an anti-friction coating such as polytetrafluoroethylene (PTFE) and / or molybdenum disulfide (MoS₂), etc.) along a first side of the substrate.

[0010] [FIG. 2] is a cross-sectional view of an exemplary embodiment of a thermal solution or a thermal interface material assembly, wherein a thermal interface material (TIM) (e.g., a thermal phase change material (PCM), etc.) and a pressure-sensitive adhesive (PSA) are along an opposite second side of the substrate shown in FIG. 1.

[0011] [FIG. 3] shows an exemplary embodiment of a thermal interface material assembly applied to a base or platform of an exemplary heat sink.

[0012] [FIG. 4], [FIG. 5] and [FIG. 6] show examples of heat sinks including a base or platform on which the thermal interface material assembly shown in FIG. 2 can be applied.

[0013] [FIG. 7] shows the heat sink shown in FIGS. 4, 5 and 6 positioned along the top of a cage of a small form-factor pluggable (SFP) fiber optic transceiver.

[0014] [FIG. 8] shows the heat sink shown in FIG. 7 and the SFP cage, and further shows a connector plug within a cavity defined by the cage of the SFP transceiver.

[0015] [FIG. 9] shows the heat sink shown in FIGS. 4, 5 and 6, and also shows first and second adhesive material strips (e.g., pressure-sensitive adhesives, etc.) along opposite first and second edge portions of the heat sink base. A thermal interface material (e.g., a thermal phase change material (PCM), etc.) is along the heat sink base, within a channel or region typically defined between the first and second adhesive material strips.

[0016] In several views of the accompanying drawings, corresponding reference numerals denote corresponding parts. Embodiment

[0017] Exemplary embodiments will now be described in more detail with reference to the accompanying drawings.

[0018] As the power of an optical transceiver increases with an increase in data transmission rate, a more effective heat transfer solution is needed to avoid a higher failure rate / poor reliability of the optical box module. Thus, a low thermal resistance interface between the optical transceiver and the heat sink is important for reducing the core temperature of the module, and this interface should be able to withstand various sliding movements, such as for server box maintenance purposes, etc. For example, the optical module may be slidably inserted into and withdrawn from the housing from time to time. However, conventional thermal interface materials may not have sufficient abrasion resistance to avoid damage during repeated insertion and withdrawal of the optical module. In such a case, the thermal performance of the conventional thermal interface material may be negatively affected due to damage caused by repeated insertion of the optical module into and withdrawal from the housing.

[0019] Exemplary embodiments of a thermal interface solution for a sliding surface are disclosed herein. In an exemplary embodiment, the thermal interface material assembly includes a substrate (e.g., a polymer substrate, a polyimide film, a metal substrate, etc.) having opposite first and second surfaces. An anti-friction layer is along the first surface of the substrate. The anti-friction layer may include polytetrafluoroethylene (PTFE), molybdenum disulfide (MoS₂), graphite, polyethylene, polypropylene, aluminum oxide, boron nitride, calcium fluoride, tungsten carbide, and / or aluminum. For example, the anti-friction layer may include an anti-friction coating of polytetrafluoroethylene (PTFE), molybdenum disulfide (MoS₂), graphite, polyethylene, polypropylene, aluminum oxide, boron nitride, calcium fluoride, tungsten carbide, and / or aluminum along the first surface of the substrate. A thermal interface material (e.g., a thermal phase change material (PCM), etc.) is along the second surface of the substrate such that the substrate is located between the anti-friction layer and the thermal interface material. The anti-friction layer is configured to slide in contact with the first surface of the first component when the thermal interface material assembly is adhered to (e.g., via a pressure-sensitive adhesive (PSA), etc.) the second surface of a second component (e.g., a heat sink, a connector plug, etc.) and when the first surface of the first component (e.g., the housing of the transceiver, the housing, etc.) is slidably movable relative to the second surface.

[0020] Referring now to the drawings, FIG. 1 shows an exemplary embodiment of a substrate 102, which includes an anti-friction layer 106 along a first or upper side of the substrate 102. The substrate 102 may include a polyimide (PI) substrate, other polymer substrates, metal substrates, or other substrates disclosed herein, etc. In an exemplary embodiment, the substrate 102 may include a polyimide film. The thermal conductivity of the polyimide film may be from about 0.1 watt per meter per Kelvin (W / m·K) to about 2 W / m·K, and the thickness may be from about 3 micrometers (μm) to about 50 micrometers. For example, the substrate 102 may include a non-metallized thermally conductive dielectric polyimide film (such as KAPTON 150MT+ polyimide film, etc.) with a thermal conductivity of about 0.8 W / m·K and a thickness of about 38 micrometers. As another example, the substrate 102 may include a polyimide film without any fillers, having a thermal conductivity of about 0.15 W / m·K and a thickness from about 3 micrometers to about 50 micrometers. As another example, the substrate 102 may include a polyimide film without any fillers and a thickness of about 7 micrometers (such as KAPTON 30EN polyimide film, etc.). Table 1 below lists the properties of exemplary substrates that may include KAPTON EN polyimide films and may be included in the thermal interface material assembly 100. Table 1 Property Unit Direction 20EN 30EN 50EN 100EN 200EN Test method Thickness μm - 5.0 7.5 12.5 25 50 JIS K 7130 Tensile strength MPa MD 335 350 355 375 345 JIS K 7161 TD 335 360 380 375 365 Elongation at break % MD 55 60 65 55 70 JIS K 7161 TD 55 55 60 55 55 Modulus GPa MD 5.0 5.3 5.3 5.3 5.3 JIS K 7161 TD 5.0 5.5 57 5.3 5.8 Thermal shrinkage rate [200°C] % MD 0.01 0.01 0.01 0.01 0.01 JIS K 7133 TD 0.01 0.01 0.01 0.01 0.01 Tear strength - initial N / 2cm J MD 51 75 135 235 475 JIS C 2151 TD 55 75 130 225 455 CTE 50 - 200 °C) ppm / °C MD 16 16 16 15 17 JIS K 7197 TD 16 14 14 15 13 MIT Number of cycles MD >20,000 >20,000 >20,000 >20,000 5000 JIS - P - 8115 TD >20,000 >20,000 >20,000 >20,000 5000 Surface roughness (Ra) μm - 0.02 - 0.07 0.02 ~ 0.07 0.02 ~ 0.07 0.02 ~ 0.07 0.02 ~ 0.07 JIS B 0601 Water absorption rate % - 1.9 1.6 1.6 1.6 1.7 JIS K 7209 Breakdown voltage kV / mm - 400 400 400 380 375 JIS C 2151 Flammability UL-94 - VTM-0 VTM-0 VTM-0 V-0 V-0 UL test method

[0021] The antifriction layer 106 may include polytetrafluoroethylene (PTFE), molybdenum disulfide (MoS₂), graphite, polyethylene, polypropylene, aluminum oxide, boron nitride, calcium fluoride, tungsten carbide, and / or aluminum. For example, the antifriction layer 106 may include an antifriction coating of polytetrafluoroethylene (PTFE), molybdenum disulfide (MoS₂), graphite, polyethylene, polypropylene, aluminum oxide, boron nitride, calcium fluoride, tungsten carbide, and / or aluminum along the first surface of the substrate. The antifriction layer 106 preferably has a relatively low coefficient of friction. The antifriction layer 106 is preferably configured to have a lower coefficient of friction than the substrate 102. Accordingly, the antifriction layer 106 may be configured to reduce the frictional resistance that would otherwise occur between the substrate 102 and the sliding surface. For example, based on ASTM G133, the antifriction layer 106 may have a coefficient of friction less than 0.25, with the following test conditions: tip radius 6.35 millimeters (mm), normal force 0.98 Newton (N), stroke length 20 millimeters, oscillation frequency 0.5 Hertz (Hz), sinusoidal velocity distribution, and test duration 16 minutes 40 seconds.

[0022] In addition, by way of example, the anti-friction layer may include anti-friction coatings such as polytetrafluoroethylene (PTFE) and / or molybdenum disulfide (MoS₂) (e.g., MOLYKOTE D-96 or D-6600 anti-friction coatings, etc.), which are applied along the first surface of the substrate (e.g., via spraying, dip spinning, brushing, coating, etc.) such that the coating thickness is from about 1 micron to about 30 microns, for example, coating thicknesses of 2 microns, 3 microns, 4 microns, 5 microns, 10 microns, 15 microns, 20 microns, 25 microns, 30 microns, etc.

[0023] Figure 2 shows an exemplary embodiment of the thermal solution or thermal interface material assembly 100. As shown, the thermal interface material (TIM) 110 (e.g., a thermal phase change material (PCM), etc.) and the pressure-sensitive adhesive (PSA) 114 are along the opposite second side of the substrate 102. The pressure-sensitive adhesive 114 can be used to adhere the thermal interface material assembly 100 to another component, such as a heat sink in direct contact with a heat source, etc. As shown in Figure 3, the pressure-sensitive adhesive 114 can be used to attach the thermal interface material assembly 100 to the base or platform 108 of the heat sink 104.

[0024] A variety of thermal interface materials can be used for the thermal interface material 110 shown in Figure 2, such as thermal gap fillers, thermal phase change materials, thermally conductive EMI absorbers or hybrid thermal / EMI absorbers, thermal putties, thermal pads, thermal greases, and other thermal interface materials disclosed herein, etc. In an exemplary embodiment, the thermal interface material 110 includes a thermal phase change material having a thermal conductivity of at least 3 W / m·K. For example, the thermal interface material 110 can include a thermal phase change material having a thermal conductivity of about 7.5 W / m·K. The thermal interface material can be naturally sticky and / or self-adhesive to another surface of the component.

[0025] The pressure-sensitive adhesive 114 may include first and second pressure-sensitive adhesive layers or pressure-sensitive adhesive coatings along opposite first and second sides of a polymer film (e.g., a polyethylene terephthalate film, a thermoplastic polymer film, an organic heat sink film, a flame-retardant meta-aramid film, other aramid films, etc.). For example, the pressure-sensitive adhesive 114 can include first and second pressure-sensitive adhesive layers or pressure-sensitive adhesive coatings along opposite first and second sides of a polyethylene terephthalate film. In the latter example, the polyethylene terephthalate film can have a thickness of about 50 microns, and the pressure-sensitive adhesive can have a thickness of about 25 microns along each side of the polyethylene terephthalate film.

[0026] As another example, the pressure-sensitive adhesive 114 may include an organic heat sink, which includes a polymer film coated with a thermally conductive pressure-sensitive adhesive. The organic heat sink may be configured to have a relatively high in-plane thermal conductivity (e.g., an in-plane thermal conductivity of about 50 W / m·K or the like), which is higher than the through-plane thermal conductivity (e.g., about 0.2 W / m·K or the like), and have a high resistivity (e.g., greater than 1015 watt per centimeter (W·cm) or the like). The pressure-sensitive adhesive 114 may include a pressure-sensitive adhesive having a thickness of about 80 microns to about 200 microns, such as 100 microns, 125 microns, 140 microns, 150 microns, 160 microns, etc.

[0027] Figures 4, 5, and 6 illustrate examples of a heat sink 104 (broadly, a heat removal / dissipation structure) including a base or platform 108 (broadly, a part). The base 108 projects outward from the surface of the first side 112 of the heat sink 104. A plurality of heat fins 116 project outward from the second side 120 of the heat sink 104 opposite the first side 112.

[0028] Merely as a further example, Figures 7 and 8 illustrate exemplary embodiments in which the thermal interface material assembly 100 (Figure 2) is used with a small form-factor pluggable (SFP) fiber optic transceiver 144 (broadly, a device or component). As shown in Figure 8, the heat sink 104 is positioned along the top of the SFP housing 148 (broadly, a housing), where the base 108 faces downward relative to the top of the SFP housing 148. The heat sink 104 may be connected to the SFP housing 148 by one or more spring clips, screws, other mechanical fasteners, etc.

[0029] As shown in Figure 8, when a portion 152 of the SFP connector plug 156 is slidably inserted into a cavity 162 defined by or within the SFP housing 148, the thermal interface material assembly 100 along the base 108 is in thermal contact with the portion 152 of the SFP connector plug 156 (broadly, a connector).

[0030] In addition, when the SFP connector plug 156 is slidably inserted into the cavity 162 of the SFP housing 148 and slidably pulled out of the cavity 162 of the SFP housing 148, the anti-friction layer 106 (Figure 2) of the thermal interface material assembly 100 slides in contact with the portion 152 of the SFP connector plug 156. The base 102 (Figure 2) of the thermal interface material assembly 100 may define a wear-resistant layer on the thermal interface material 110 and the pressure-sensitive adhesive 114 such that the wear-resistant layer is located between the portion 152 of the SFP connector plug 156 and the thermal interface material 110 and the pressure-sensitive adhesive 114.

[0031] When the SFP connector plug 156 is slidably inserted into or withdrawn from the cavity 162 through the opening, the anti-friction layer 106 intervenes between the portion 152 of the SFP connector plug 156 and the heat sink 104 along the substrate 102. Thus, the anti-friction layer 106 along the substrate 102 prevents direct contact (e.g., direct sliding friction, etc.) between the thermal interface material 110 and the portion 152 of the SFP connector plug 156. This in turn helps to avoid a reduction in the thermal performance of the thermal interface material 110 due to wear of the thermal interface material 110. When the SFP connector plug 156 is slidably inserted into the cavity 162, the anti-friction layer 106 along the substrate 102 can be in thermal contact (e.g., direct physical contact, etc.) with the portion 152 of the SFP connector plug 156. The thermal contact between the anti-friction layer 106 and the portion 152 of the SFP connector plug 156 can reduce the thermal transfer resistance along the interface between them. With the reduced thermal transfer resistance, the heat generated by the optical module or transceiver 144 can be improved and / or well transferred.

[0032] As an example, the pressure-sensitive adhesive (PSA) 114 can be disposed around the outer peripheral edge of the thermal interface material 110 along the edge portion of the thermal interface material 110 such that the pressure-sensitive adhesive 114 is located between the substrate 102 and the heat sink base 108 and adheres the substrate 102 to the heat sink base 108. The pressure-sensitive adhesive 114 can be configured to provide a reinforcement along the edge portion of the thermal interface material 110, and the edge portion is parallel to and / or perpendicular to the direction in which the SFP connector plug 156 is slidably inserted into the cavity 162 of the SFP housing 148 and slidably removed from the cavity 162 of the SFP housing 148. When the portion 152 of the SFP connector plug 156 is slidably inserted into or removed from the cavity 162 of the SFP housing 148, the reinforcement along the edge portion of the thermal interface material 110 can absorb the compressive force and help to confine the thermal interface material 110 within a channel or area that is generally defined between portions (e.g., strips, etc.) of the pressure-sensitive adhesive material 114, thereby helping to maintain the integrity of the thermal interface material 110 and suppressing the migration of the thermal interface material 110.

[0033] In an exemplary embodiment, the thermal interface material 110, the anti-friction layer 106, and the PSA 114 are not slidable relative to each other. Instead, the positions of the thermal interface material 110, the anti-friction layer 106, and the PSA 114 relative to each other are maintained.

[0034] Continuing with the example shown in FIG. 8, when the connector plug 156 is within the housing 148, the thermal interface material assembly 100 can generally be located between the heat sink 104 and the connector plug 156. The thermal interface material assembly 100 and the heat sink 104 can jointly define or establish at least a portion of a thermally conductive heat path from the connector plug 156 to the heat sink fins 116 of the heat sink 104. Heat can be transferred along such a thermally conductive heat path from the connector plug 156 to the thermal interface material assembly 100, from the thermal interface material assembly 100 to the heat sink 104, and from the heat sink fins 116 to another heat removal / dissipation structure (e.g., a vapor chamber, etc.) and / or to the environment. The heat transfer can reduce the temperature of the housing 148 and the connector 156, thereby helping to keep the temperature of the housing 148 and the connector 156 below a specified threshold, etc. The thermal interface material 110 and the heat sink 104 can include any suitable materials, configurations, etc. suitable for reducing the temperature of the housing 148 and the connector 156. For example, the materials and configurations can be selected such that the thermal interface material 110 and the heat sink 104 can dissipate heat at a rate sufficient to keep the temperature of the housing 148 and the connector 156 below a specific threshold temperature at which the operation of the connector 156 would be impaired. The transfer of heat to the thermal interface material 110 can reduce the heat transferred from the connector 156 to another component (e.g., the printed circuit board (PCB) of the SFP transceiver 144), thereby reducing the heat that can be further dissipated from the PCB to more heat-sensitive components.

[0035] The pressure-sensitive adhesive 114 of the thermal interface material assembly 100 (FIG. 2) can include first and second adhesive material strips 124, 128 as shown in FIG. 9. The first and second adhesive material strips 124, 128 can be applied along (e.g., completely and continuously along without any gaps, etc.) opposite first and second edges 132, 136 (FIG. 4) of the heat sink base 108. The first and second adhesive material strips 124, 128 can be configured to provide reinforcement along the edge portions of the thermal interface material 110, which helps to confine the thermal interface material 110 within the area defined by the first and second reinforcement / adhesive material strips 124, 128, thereby inhibiting migration of the thermal interface material 110.

[0036] As an example, the first and second bonding material strips 124, 128 may include polyethylene terephthalate or polyimide films that include pressure-sensitive adhesives along opposite first and second sides of the film. Alternatively, other materials may be used for the bonding materials 124, 128, such as materials that are harder, less compliant, more durable, and / or less prone to wear than the thermal interface material 110. Additionally, other exemplary embodiments may include bonding material strips in a discontinuous pattern (e.g., spaced-apart strip portions with gaps therebetween, etc.) along less than the entire length of the base edge and / or along the base edge and / or along other edges of the base, etc. For example, another exemplary embodiment may include four bonding material strips along each of the four edges of a rectangular base. Additionally, other exemplary embodiments may include heat sinks having non-rectangular bases and / or bonding material strips that are not all made of the same material.

[0037] As shown in FIG. 9, the thermal interface material 110 may be applied along the heat sink base 108 within a channel or region that is generally defined between the first and second reinforcement / bonding material strips 124, 128. The substrate 102 may be disposed on the thermal interface material 110 such that when a portion 152 of the SFP connector plug 156 is slidably inserted into a cavity 162 defined by or within the SFP housing 148, the anti-friction layer 106 (FIG. 1) is exposed to slidably contact the portion 152 of the SFP connector plug 156 (broadly, the connector). The first and second reinforcement / bonding material strips 124, 128 are located between the substrate 102 and the heat sink base 108 and adhere to the substrate 102 and the heat sink base 108.

[0038] The thermal interface material assemblies disclosed herein (e.g., 100 (FIG. 2), etc.) may be used with a wide range of devices and components. Accordingly, aspects of the present disclosure are not limited to use only with heat sinks, as the thermal interface material assemblies disclosed herein may be used with other heat removal / dissipation structures and / or components, such as heat removal / dissipation structures that are part of the housing or the housing itself, heat pipes, vapor chambers, heat spreaders, cold plates, etc. The thermal interface material assemblies disclosed herein may be used with connector plugs, slidable portions of tablet computers or other modular portable devices, and housings of transceivers such as small form-factor pluggable (SFP) transceivers, SFP+ transceivers, quad small form-factor pluggable (QSFP) transceivers, QSFP+ transceivers, XFP transceivers, etc.

[0039] As background art, a Small Form-factor Pluggable (SFP) optical fiber transceiver is a compact and hot-pluggable transceiver that can be used in telecommunications, data communication applications, etc. The SFP transceiver can interface a network device motherboard (e.g., for switches, routers, media converters, etc.) to optical fiber or copper network cables. The SFP transceiver can support communication standards including SONET, Gigabit Ethernet, Fibre Channel, etc. As used herein, Small Form-factor Pluggable (SFP) can also include other small form-factor pluggable devices such as SFP+, Quad Small Form-factor Pluggable (QSFP), QSFP+, etc., or devices used with reference to these components.

[0040] Traditional SFP transceiver components can include a pluggable module or a connector plug and socket assembly, and the socket assembly is mounted on a Printed Circuit Board (PCB). The pluggable module can be configured to be inserted into a front opening and cavity defined by a shroud of the socket assembly. The pluggable module can include a housing having a portion that remains in contact with a heat sink (e.g., under medium pressure, etc.) after the pluggable module is inserted into the shroud. The pluggable module can then be removed from the shroud of the socket assembly. The connector plug or the pluggable module can undergo multiple insertions into the shroud (e.g., a QSFP shroud, etc.) and removals from the shroud. And the insertion / removal process can be performed at elevated temperatures, such as when the contact temperature is above 75 degrees Celsius (°C), etc.

[0041] The shroud (e.g., shroud 148 in FIG. 7, etc.) can be any suitable shroud capable of accommodating an SFP connector. The shroud can have dimensions corresponding to the SFP connector such that an SFP cable connector plug can be inserted into the shroud. The shroud can accommodate the cable connector plug via any suitable releasable engagement, including but not limited to a friction fit, a snap fit, etc. The shroud can include an interface for transmitting and / or receiving signals via the SFP connector, such as an optical cable interface, an electrical cable interface, etc. The interface can enable communication from the cable connector to a motherboard of a mounting cage, a Printed Circuit Board (PCB), a network card, etc.

[0042] The shroud (e.g., shroud 148 in FIG. 7, etc.) can include any suitable material, including metal, etc. For example, the shroud can include a material suitable for shielding noise generated by data transmission through the cable connector plug (e.g., electromagnetic interference (EMI) shielding, etc.). As an alternative embodiment, it can include other devices, such as other transceivers (e.g., SFP+ transceiver, XFP transceiver, QSFP transceiver, QSFP+ transceiver, etc.), devices having a housing or shroud configured to be used with other connectors other than the SFP cable connector, etc. Thus, aspects of the present disclosure should not be limited to SFP transceivers and SFP cable connectors.

[0043] A wide range of thermal interface materials can be used for the thermal interface material 110, such as thermal gap fillers, thermal phase change materials, thermally conductive EMI absorbers or hybrid thermal / EMI absorbers, thermal putties, thermal pads, thermal greases, etc. For example, the thermal interface material 110 preferably has a low effective thermal resistance (e.g., less than 2 °C / W, less than 0.2 °C / W, about 0.2 °C / W to about 2 °C / W, etc.). In an exemplary embodiment, the thermal interface material 110 has a higher thermal conductivity than each of the substrate 102, the anti-friction coating 106, and the reinforcement / adhesive material 114. The thermal interface material 110 can be softer, more compliant, less durable, and / or more prone to wear than the substrate 102 and the reinforcement / adhesive material 114. However, as disclosed herein, the thermal interface material assembly can provide good enough durability and wear resistance for the thermal interface material, thereby allowing the thermal interface material to withstand and / or endure sliding operations (e.g., repeated insertion of a connector plug into and / or removal from the transceiver housing, sliding installation of components, etc.) including at elevated temperatures (e.g., above 75 °C, etc.).

[0044] In some embodiments, the thermal interface material may include silicone elastomers. The silicone elastomers can be filled with suitable thermally conductive materials, including ceramics, boron nitride, etc. In some embodiments, the thermal interface material may include: graphite sheets; metal foils; multilayer structures, such as multilayer structures of metal and plastic, multilayer structures of metal and graphite, or multilayer structures of metal, graphite, and plastic.

[0045] The thermal interface material may include elastomers and / or ceramic particles, metal particles, ferrite EMI / RFI absorbing particles, metal or glass fiber meshes in a substrate such as rubber, gel, or wax. The thermal interface material may include compliant or conformable silicone pads, non-silicone-based materials (e.g., non-silicone-based gap filling materials, thermoplastics and / or thermosetting polymers, elastomeric materials, etc.), wire mesh materials, polyurethane foams or gels, thermally conductive additives, etc. The thermal interface material can be configured to have sufficient conformability, compliance, and / or flexibility (e.g., without having to undergo phase change or reflow, etc.) to adjust tolerances or gaps by deflecting at low temperatures (e.g., room temperature of 20 °C to 25 °C, etc.) when in contact (e.g., pressed against, etc.) with mating surfaces (including non-flat, curved, or uneven mating surfaces) and / or to allow the thermal interface material to closely conform (e.g., in a relatively tight matching and encapsulating manner) to the mating surfaces. By way of example only, the thermal interface material can be substantially solid at room temperature of 20 °C to 25 °C and begins to soften (although not freely flowing) above 50 °C.

[0046] The thermal interface material may include a soft thermal interface material formed of an elastomer and at least one thermally conductive metal, boron nitride, and / or ceramic filler, such that the soft thermal interface material is conformable even without undergoing a phase change or reflow. In some exemplary embodiments, the thermal interface material may include a ceramic-filled silicone elastomer, a boron nitride-filled silicone elastomer, or a thermal phase change material that is generally a non-reinforced film.

[0047] Exemplary embodiments may include one or more thermal interface materials having a high thermal conductivity (e.g., 1 W / m·K (watts per meter per kelvin), 1.1 W / m·K, 1.2 W / m·K, 2.8 W / m·K, 3 W / m·K, 3.1 W / m·K, 3.8 W / m·K, 4 W / m·K, 4.7 W / m·K, 5 W / m·K, 5.4 W / m·K, 6 W / m·K, 7.5 W / m·K, etc.), depending on the specific materials used to manufacture the thermal interface material and the loading percentage of the thermally conductive filler (if any). These thermal conductivities are merely examples, as other embodiments may include thermal interface materials having other values and ranges of thermal conductivity greater than 7.5 W / m·K, less than 1 W / m·K, or between 1 W / m·K and 7.5 W / m·K. Accordingly, aspects of the present disclosure should not be limited to use with any particular thermal interface material, as exemplary embodiments may include a wide range of thermal interface materials.

[0048] The exemplary embodiments disclosed herein may provide or include one or more (but not necessarily any or all) of the following advantageous effects or features. For example, the thermal interface solutions disclosed herein may reduce the thermal resistance between the module and the heat sink and provide a temperature reduction for higher power transceivers, while also being able to withstand hundreds of cycles (e.g., more than 500 cycles, etc.) of plugging and unplugging. The thermal solutions disclosed herein may reduce the operating temperature of the optical module, may be durable, and may have excellent adhesion properties and excellent surface wetting for low contact impedance. The thermal performance of the thermal solutions disclosed herein (e.g., thermal interface material assembly 100 (FIG. 2), etc.) has been measured, and it has shown an unexpected synergistic effect: a performance improvement of at least a 5°C temperature reduction at approximately 20 watts, and the ability to withstand 500 plugging and unplugging cycles. Accordingly, compared to conventional thermal interface materials, the exemplary thermal interface solutions disclosed herein may provide a higher temperature gain, better mechanical properties, and / or cost efficiency / synergy.

[0049] Table 2 below includes the thermal performance measurement results of two exemplary thermal interface material assemblies (TIMAs) having a friction-reducing layer along the polymer layer. For comparison purposes, Table 2 also includes the thermal performance measurement results of a thermal interface material assembly (TIMA) without a friction-reducing layer. Table 2 also includes the thermal performance material of a test case (air control) that does not include any thermal interface material assembly (TIMA) between the surfaces. Table 2 shows that the two exemplary thermal interface material assemblies have a synergistic effect in terms of thermal performance (e.g., improvement in temperature reduction of at least 5 °C at about 20 watts) and the ability to withstand 500 mating and unmating cycles.

[0050] For the thermal interface material assembly (TIMA) without a friction-reducing layer, the TIMA includes a 38-micron-thick thermally conductive polyimide film (e.g., KAPTON 150MT+ polyimide film, etc.) and a pressure-sensitive adhesive.

[0051] For the first exemplary thermal interface material assembly (TIMA) having a friction-reducing layer, the TIMA includes a 3-micron-thick friction-reducing coating (e.g., MOLYKOTE D-96 friction-reducing coating, etc.) on a 7-micron-thick polyimide film without filler (e.g., KAPTON 30EN polyimide film, etc.). The TIMA also includes a pressure-sensitive adhesive.

[0052] For the second exemplary thermal interface material assembly (TIMA) having a friction-reducing layer, the TIMA includes a 3-micron-thick friction-reducing coating (e.g., MOLYKOTE D-96 friction-reducing coating, etc.) on a 38-micron-thick thermally conductive polyimide film (e.g., KAPTON 150MT+ polyimide film, etc.). The TIMA also includes a pressure-sensitive adhesive.

[0053] In Table 2 below, ΔT (Core-Rm) is the difference between the core temperature of the test case and room temperature. ΔT (TIMA-air control) is the temperature gain of the thermal interface material assembly (TIMA) relative to the air control test. Table 2 Test Case Average °C, 20W ΔT (Core-Rm) Stdev Repeat # ΔT (TIMA-air control) Air Control (without any TIMA) 52.9 1.4 21 0 TIMA (without anti-friction layer) 49.2 1.0 10 -3.8 First exemplary TIMA with anti-friction layer 47.6 0.6 6 -5.4 Second exemplary TIMA with anti-friction layer 47.7 0.4 5 -5.3

[0054] Table 2 shows that, compared with the test case without any TIM components, the TIM component without any anti-friction layer between the surfaces only provides a temperature reduction of -3.8 degrees Celsius. By comparison, Table 2 shows that, compared with the test case without any TIM components, the TIM components with anti-friction layers provide significantly higher temperature reductions of -5.4 degrees Celsius and -5.3 degrees Celsius. Also, compared with the TIM components without any anti-friction layer, the TIM components with anti-friction layers further provide an improvement in temperature reduction of 1.5 and 1.6 degrees Celsius. Therefore, the thermal interface material component including an anti-friction layer (e.g., 100 shown in FIG. 2, etc.) can greatly improve performance, reliability, and stability.

[0055] The exemplary embodiments disclosed herein may provide or include one or more (but not necessarily any or all) of the following advantageous effects or features. By placing (e.g., bonding, etc.) the thermal interface material component along or on the surface of the optical module (broadly, the second component), the anti-friction layer of the thermal interface material component faces the inner surface of the cavity of the housing (broadly, the first component). When the optical module is slidably inserted or slidably pulled out through the opening of the cavity, the anti-friction layer can thus contact (e.g., frictional contact, slidable contact, etc.) the inner surface of the cavity instead of causing the surface of the optical module to contact the inner surface of the cavity. This avoids direct contact and direct friction between the optical module and the inner surface of the housing cavity. This also reduces the wear of the thermal interface material, which would otherwise reduce the heat transfer ability of the thermal interface material. When the optical module is inserted into the cavity of the housing, the anti-friction layer can be along the inner surface of the cavity (e.g., in direct thermal contact with the inner surface of the cavity, etc.), which can help reduce the heat resistance along the interface and transfer the heat generated by the optical module to the inner surface, thereby providing good thermal performance.

[0056] Accordingly, exemplary embodiments of a thermal interface solution for a sliding surface are disclosed. In an exemplary embodiment, the thermal interface material assembly includes a substrate having opposing first and second surfaces. A friction reducing layer is along the first surface of the substrate. A thermal interface material is along the second surface of the substrate such that the substrate is located between the friction reducing layer and the thermal interface material. The friction reducing layer is configured to slide in contact with the first surface of the first component when the thermal interface material assembly is along the second surface of the second component and when the first and second surfaces are slidably movable relative to each other.

[0057] In an exemplary embodiment, the friction reducing layer includes polytetrafluoroethylene (PTFE), molybdenum disulfide (MoS₂), graphite, polyethylene, polypropylene, aluminum oxide, boron nitride, calcium fluoride, tungsten carbide, and / or aluminum. In such an exemplary embodiment, the friction reducing layer may include a friction reducing coating of polytetrafluoroethylene (PTFE), molybdenum disulfide (MoS₂), graphite, polyethylene, polypropylene, aluminum oxide, boron nitride, calcium fluoride, tungsten carbide, and / or aluminum along the first surface of the substrate. The friction reducing layer is configured to have a lower coefficient of friction than the substrate. For example, the friction reducing layer may be configured to have a coefficient of friction less than 0.25.

[0058] In an exemplary embodiment, the friction reducing layer includes polytetrafluoroethylene and / or molybdenum disulfide. For example, the friction reducing layer may include a friction reducing coating of polytetrafluoroethylene and / or molybdenum disulfide along the first surface of the substrate. The friction reducing layer is configured to have a lower coefficient of friction than the substrate. For example, the friction reducing layer may be configured to have a coefficient of friction less than 0.25.

[0059] In an exemplary embodiment, the substrate includes a polymer substrate or a metal substrate. For example, the substrate may include a dielectric polyimide substrate.

[0060] In an exemplary embodiment, the substrate includes a dielectric polyimide film. The friction reducing layer includes a friction reducing coating along the first surface of the substrate. The friction reducing coating includes polytetrafluoroethylene and / or molybdenum disulfide. The friction coefficient of the friction reducing layer is less than 0.25 and less than the friction coefficient of the dielectric polyimide film. The thermal interface material includes a thermal phase change material having a thermal conductivity of at least 3 watts per meter per kelvin. The thermal interface material assembly further includes a pressure sensitive adhesive that adheres the thermal interface material assembly to the second surface of the second component.

[0061] In an exemplary embodiment, the thermal interface material includes a thermal phase change material having a thermal conductivity of at least 3 watts per meter per kelvin.

[0062] In an exemplary embodiment, the thermal interface material assembly is adhered to a second surface of a second component. A pressure-sensitive adhesive may be used to adhere the thermal interface material assembly to the second surface of the second component. The pressure-sensitive adhesive may include a first pressure-sensitive adhesive layer and a second pressure-sensitive adhesive layer along opposite first and second sides of a polymer film (e.g., polyethylene terephthalate film, etc.).

[0063] In an exemplary embodiment, the thermal interface material may include an edge portion defining an outer perimeter. The pressure-sensitive adhesive may be disposed along the edge portion of the thermal interface material around the outer perimeter of the thermal interface material such that the pressure-sensitive adhesive is between the second surface of the substrate and the second surface of the second component and adheres the second surface of the substrate to the second surface of the second component. When the thermal interface material assembly is located between the first and second surfaces of the corresponding first and second components, the pressure-sensitive adhesive may provide or define a reinforcement along the edge portion of the thermal interface material, the edge portion being parallel and / or perpendicular to the direction in which the second surface of the second component is slidable relative to the first surface of the first component. The pressure-sensitive adhesive may provide or define a reinforcement along the edge portion of the thermal interface material, which helps to confine the thermal interface material within the area defined by the reinforcement, thereby inhibiting migration of the thermal interface material.

[0064] In an exemplary embodiment, the substrate defines a wear-resistant layer on the thermal interface material.

[0065] In an exemplary embodiment, the thermal interface material naturally adheres and / or self-adheres to the second surface of the second component.

[0066] In an exemplary embodiment, the substrate is adhered to the second surface of the second component such that the substrate is disposed on the thermal interface material, whereby the adhesion of the substrate to the second surface of the second component maintains the positioning of the thermal interface material relative to the second surface of the second component.

[0067] In an exemplary embodiment, the substrate includes a polyimide film. For example, the substrate may include a polyimide film having a thermal conductivity of 0.1 to 2 watts per meter per kelvin and a thickness of 3 to 130 micrometers.

[0068] In an exemplary embodiment, the thermal interface material is configured to have a thermal conductivity of at least 7.5 watts per meter per kelvin.

[0069] In an exemplary embodiment, the second component includes a heat sink that includes a second surface along which the thermal interface material assembly is disposed.

[0070] In an exemplary embodiment, the thermal interface material is configured to provide a temperature reduction of at least 5 °C at 20 watts and withstand at least 500 mating cycles with performance improvement.

[0071] In an exemplary embodiment, the anti-friction layer includes a lubricant applied along a first surface of the substrate. The lubricant preferably includes a dry lubricant, which is constructed to slide along contact with the first surface of the first component without leaving residue from the dry lubricant along the first surface of the first component.

[0072] In an exemplary embodiment, the heat sink includes a thermal interface material assembly.

[0073] In an exemplary embodiment, the heat sink includes a protrusion protruding outward from a surface of a first side of the heat sink and one or more heat fins protruding outward from a second side of the heat sink opposite the first side. The thermal interface material assembly is along the protrusion of the heat sink.

[0074] In an exemplary embodiment, the device includes a heat sink and a housing adapted to slidably receive a connector. When the connector is slidably received in the housing or removed from the housing, the anti-friction layer of the thermal interface material assembly slidably contacts a portion of the connector. When the connector is slidably received in the housing, the thermal interface material assembly is located between the connector and the heat sink, whereby the thermal interface material assembly defines at least a portion of a heat conduction path between the connector and the heat sink.

[0075] In an exemplary embodiment, the device is a small form-factor pluggable transceiver. The connector is a small form-factor cable connector. The housing is a small form-factor housing adapted to receive the small form-factor cable connector.

[0076] In an exemplary embodiment, the device includes a housing having a cavity, the housing including an opening and an inner surface within the cavity. The device further includes a component having a surface corresponding to the inner surface within the cavity of the housing. The component is configured to be slidably inserted into the cavity through the opening and slidably removed from the cavity. The thermal interface material assembly is along the surface of the component. The thermal interface material assembly is configured such that when the component is within the cavity, the anti-friction layer of the thermal interface material assembly faces the inner surface within the cavity of the housing. When the component is slidably inserted into or removed from the cavity through the opening, the anti-friction layer contacts the inner surface within the cavity of the housing.

[0077] In an exemplary embodiment, one or more heat fins protrude outward from a wall of the housing.

[0078] In an exemplary embodiment, the component includes a connector. The housing includes a cover that includes a cavity configured to receive the connector.

[0079] In an exemplary embodiment, the device is a small form-factor pluggable transceiver. The component includes a small form-factor cable connector. The housing is a small form-factor cover that includes a cavity configured to accommodate the small form-factor cable connector.

[0080] In an exemplary embodiment, the device is a photoelectric conversion device. The component is an optical module that includes a surface corresponding to an inner surface within the housing cavity. The thermal interface material assembly is along the surface of the optical module.

[0081] Exemplary embodiments are provided so that this disclosure will be thorough and will fully convey the scope to those skilled in the art. Numerous specific details are set forth, such as examples of specific components, devices, and methods, to provide a thorough understanding of the embodiments of this disclosure. It will be apparent to those skilled in the art that specific details are not required and that the exemplary embodiments may be embodied in many different forms and that no content should be construed as limiting the scope of this disclosure. In some exemplary embodiments, well-known processes, well-known device structures, and well-known technologies are not described in detail. Additionally, the advantages and improvements that can be achieved with one or more of the exemplary embodiments of the present invention are provided for illustrative purposes only and do not limit the scope of this disclosure (because the exemplary embodiments disclosed herein may provide all or none of the above advantages and improvements and still fall within the scope of this disclosure).

[0082] The specific dimensions, specific materials, and / or specific shapes disclosed herein are exemplary in nature and do not limit the scope of the disclosure. The disclosure of specific values and ranges of specific values for a given parameter herein is not an exhaustive disclosure of the other values and ranges of values that may be used in one or more of the examples disclosed herein. Moreover, it is contemplated that any two specific values for a specific parameter recited herein can define the endpoints of a range of values that may be suitable for the given parameter (i.e., the disclosure of a first value and a second value for a given parameter can be interpreted as disclosing that any value between the first value and the second value may also be employed for the given parameter). For example, if parameter X is illustrated herein as having a value A and is also illustrated as having a value Z, it is contemplated that parameter X can have a range of values from approximately A to approximately Z. Similarly, the disclosure of two or more ranges of values for a parameter (whether such ranges are nested, overlapping, or distinct) is contemplated to include all possible combinations of ranges of values that can be bounded by the endpoints of the disclosed ranges. For example, if parameter X is illustrated herein as having values within the ranges 1-10 or 2-9 or 3-8, it is also contemplated that parameter X can have other ranges of values including 1-9, 1-8, 1-3, 1-2, 2-10, 2-8, 2-3, 3-10, and 3-9.

[0083] The terms used herein are for the purpose of describing particular example embodiments only and are not intended to be limiting. As used herein, the singular forms "a", "an" may be intended to also include the plural forms, unless the context clearly indicates otherwise. The terms "comprising" and "having" are inclusive and thus specify the presence of the recited features, integers, steps, operations, elements, and / or components, but do not preclude the presence or addition of one or more other features, integers, steps, operations, elements, components, and / or groups thereof. The method steps, processes, and operations described herein are not to be construed as necessarily requiring their performance in the particular order discussed or illustrated, unless specifically identified as an order of performance. It is also to be understood that additional or alternative steps may be employed.

[0084] When an element or layer is referred to as being "on", "engaged to", "connected to", or "coupled to" another element or layer, the element or layer can be directly on, engaged, connected, or coupled to the other element or layer, or intervening elements or layers may be present. In contrast, when an element is referred to as being "directly on", "directly engaged to", "directly connected to", or "directly coupled to" another element or layer, no intervening elements or layers may be present. Other words used to describe the relationship between elements should be interpreted in the same manner (e.g., "between" versus "directly between", "adjacent" versus "directly adjacent", etc.). As used herein, the term "and / or" includes any and all combinations of one or more of the associated listed items.

[0085] The term "about" when applied to a value indicates that the calculation or measurement admits a slight imprecision in the value (close to the exact value; approximate or reasonably close to the value; nearly). If for some reason the imprecision provided by "about" is not otherwise understood in the art in that ordinary sense, then "approximately" as used herein indicates at least the variation that may be caused by ordinary measurement methods or the use of such parameters. For example, the terms "substantially", "about", and "roughly" may be used herein to mean within manufacturing tolerances.

[0086] Although the terms first, second, third, etc. may be used herein to describe various elements, components, regions, layers, and / or parts, these elements, components, regions, layers, and / or parts should not be limited by these terms. These terms may only be used to distinguish one element, component, region, layer, or part from another region, layer, or part. Terms such as "first", "second", and other numerical terms as used herein do not imply an order unless the context clearly indicates otherwise. Thus, a first element, component, region, layer, or part may be referred to as a second element, component, region, layer, or part without departing from the teachings of the exemplary embodiments.

[0087] Spatially relative terms (such as "inner", "outer", "beneath", "below", "lower", "above", "upper", etc.) may be used herein for convenience in describing the relationship of one element or feature to another element or feature as illustrated in the figures. Spatially relative terms are intended to encompass different orientations of the device in use or operation in addition to the orientation depicted in the figures. For example, if the device in the figures is turned over, an element described as "beneath" or "below" another element or feature will be oriented "above" the other element or feature. Thus, the exemplary term "below" can encompass both an above and below orientation. The device may be otherwise oriented (rotated 90 degrees or at other orientations), and thus the spatially relative descriptors used herein are to be interpreted accordingly.

[0088] The foregoing description of the embodiments has been provided for purposes of illustration and description. It is not intended to be exhaustive or to limit the disclosure. The individual elements, aspects, or features of a particular embodiment are generally not limited to that particular embodiment, but rather are interchangeable where appropriate and can be used in a selected embodiment (even if not specifically shown or described for that embodiment). The same also can be varied in many ways. Such variations are not to be regarded as a departure from the disclosure, and all such modifications are intended to be included within the scope of the disclosure.

[0089] 100: Thermal interface material assembly 102: Substrate 104: Heat sink 106: Anti-friction layer 108: Base / platform 110: Thermal interface material 112: First side 114: Pressure-sensitive adhesive 116: Heat sink fin 120: Second side 124: First bonding material strip 128: Second bonding material strip 132: First edge 136: Second edge 144: Pluggable (SFP) fiber optic transceiver 148: SFP cover 152: Portion 156: SFP connector plug 162: Cavity

Claims

1. A thermal interface material component, comprising: A substrate having a first surface and a second surface that are opposite to each other; A friction-reducing layer along the first surface of the substrate; A thermal interface material along the second surface of the substrate, such that the substrate is located between the friction-reducing layer and the thermal interface material, wherein the thermal interface material has a higher thermal conductivity than either the substrate or the friction-reducing layer, wherein the friction-reducing layer is configured such that when the thermal interface material assembly is along the second surface of the second component, and when the first surface of the first component and the second surface of the second component are slidably moved relative to each other, the friction-reducing layer contacts and slides along the first surface of the first component, and wherein the substrate defines a wear-resistant layer on the thermal interface material to enhance durability during repeated sliding operations.

2. The thermal interface material assembly as described in claim 1, wherein, The friction-reducing layer is configured to have a friction coefficient of less than 0.

25.

3. The thermal interface material assembly as described in claim 1, wherein, When positioned between a pluggable transceiver housing and a connector plug housed within it, the thermal interface material assembly provides a temperature reduction of at least 5°C at 20 watts relative to a construction without the thermal interface material assembly, and withstands at least 500 insertion / removal cycles without detachment or material transfer.

4. The thermal interface material assembly as described in claim 1, wherein, The friction-reducing layer comprises polytetrafluoroethylene (PTEF) and / or molybdenum disulfide as a dry lubricant coating, having a thickness ranging from 1 micrometer to 30 micrometers and a coefficient of friction of less than 0.

25.

5. The thermal interface material assembly as described in claim 1, wherein, The friction-reducing layer contains polytetrafluoroethylene and / or molybdenum disulfide.

6. The thermal interface material assembly as described in claim 1, wherein, The friction-reducing layer comprises polytetrafluoroethylene (PTEF) and / or molybdenum disulfide as a dry lubricant coating, having a thickness ranging from 1 micrometer to 30 micrometers and a coefficient of friction of less than 0.25; the friction-reducing layer is configured to not transfer visible residual material to the first component after at least 500 sliding insertion / removal cycles at a temperature of 75°C or above; and when disposed between a pluggable transceiver housing and a connector plug housed within the pluggable transceiver housing, the thermal interface material assembly provides a temperature reduction of at least 5°C at 20 watts relative to a construction without the thermal interface material assembly, and withstands at least 500 insertion / removal cycles without detachment or material transfer.

7. The thermal interface material assembly as described in claim 1, wherein, The friction-reducing layer comprises polytetrafluoroethylene and / or molybdenum disulfide; and the friction-reducing layer is configured to have a coefficient of friction of less than 0.25, which is lower than the coefficient of friction of the substrate.

8. The thermal interface material assembly as described in claim 1, wherein, The substrate may be a polymer substrate or a metal substrate.

9. The thermal interface material assembly as described in claim 1, wherein, The substrate comprises a nonmetallized dielectric polyimide film having a surface roughness Ra of 0.02 micrometers to 0.07 micrometers.

10. The thermal interface material assembly as claimed in claim 1, wherein, The substrate includes a dielectric polyimide film; the friction-reducing layer includes a friction-reducing coating along the first surface of the substrate, the friction-reducing coating comprising polytetrafluoroethylene and / or molybdenum disulfide, the friction coefficient of the friction-reducing layer being less than 0.25 and less than the friction coefficient of the dielectric polyimide film; the thermal interface material includes a thermal phase change material with a thermal conductivity of at least 3 watts per meter per gram ervin; and the thermal interface material assembly further includes a pressure-sensitive adhesive that adheres the thermal interface material assembly to the second surface of the second component, the pressure-sensitive adhesive being disposed along an edge portion of the thermal interface material and defining channels to laterally restrict the thermal interface material between the edge portions and to inhibit migration during sliding.

11. The thermal interface material assembly as described in claim 1, wherein, The thermal interface material comprises a thermal phase change material with a thermal conductivity of at least 3 watts per meter per gram of ervin.

12. The thermal interface material assembly as described in claim 1, wherein, After 500 sliding insertion / removal cycles at a temperature of 75°C or above, the thermal interface material assembly exhibits no visible residual agent transfer from the anti-friction layer and shows a temperature reduction of at least 5°C at 20 watts compared to a construction without the thermal interface material assembly.

13. The thermal interface material assembly as claimed in claim 1, further comprising a pressure-sensitive adhesive that adheres the thermal interface material assembly to the second surface of the second component.

14. The thermal interface material assembly as described in claim 13, wherein, The pressure-sensitive adhesive includes a first pressure-sensitive adhesive layer and a second pressure-sensitive adhesive layer along opposite first and second sides of the polymer film.

15. The thermal interface material assembly as described in claim 13, wherein, The pressure-sensitive adhesive includes a first pressure-sensitive adhesive layer and a second pressure-sensitive adhesive layer along opposite first and second sides of the polyethylene terephthalate film.

16. The thermal interface material assembly as described in claim 13, wherein, The thermal interface material includes an edge portion defining an outer periphery; and the pressure-sensitive adhesive is disposed around the outer periphery of the thermal interface material along the edge portion of the thermal interface material, such that the pressure-sensitive adhesive is between the second surface of the substrate and the second surface of the second component and adheres the second surface of the substrate to the second surface of the second component.

17. The thermal interface material assembly as described in claim 16, wherein, When the thermal interface material assembly is located between the first surface of the first component and the second surface of the second component, the pressure-sensitive adhesive provides a reinforcement along the edge portion of the thermal interface material, the edge portion being parallel and / or perpendicular to the direction in which the second surface of the second component is slidable relative to the first surface of the first component.

18. The thermal interface material assembly as described in claim 16, wherein, The pressure-sensitive adhesive provides a reinforcement along the edge portion of the thermal interface material, which helps to confine the thermal interface material within the area defined by the reinforcement, thereby inhibiting the migration of the thermal interface material.

19. The thermal interface material assembly as claimed in claim 1, wherein, The thermal interface material naturally becomes sticky and / or self-adheres to the second surface of the second component.

20. The thermal interface material assembly as claimed in claim 1, wherein, The substrate is adhered to the second surface of the second component such that the substrate is disposed on the thermal interface material, thereby the adhesion of the substrate to the second surface of the second component maintains the positioning of the thermal interface material relative to the second surface of the second component.

21. The thermal interface material assembly as claimed in claim 1, wherein, The substrate comprises a polyimide film having a thermal conductivity of 0.1 to 2 watts per meter per gram von and a thickness of 3 to 130 micrometers.

22. The thermal interface material assembly as claimed in claim 1, wherein, The thermal interface material is configured to have a thermal conductivity of at least 7.5 watts per meter per gram von.

23. The thermal interface material assembly as described in claim 1, wherein, The second component includes a heat sink, which includes the second surface, and the thermal interface material assembly is disposed along the second surface.

24. The thermal interface material assembly as claimed in claim 1, wherein the friction-reducing layer comprises a lubricant applied along the first surface of the substrate.

25. The thermal interface material assembly of claim 24, wherein the lubricant comprises a dry lubricant configured to slide along the contact with the first surface of the first component, and after 500 slide-in / slide-out cycles at a temperature of 75°C or above, no residue is left from the dry lubricant along the first surface of the first component.

26. A heat sink comprising a thermal interface material assembly as described in any one of claims 1 to 25, wherein, The heat sink includes: a protrusion extending outward from a surface on a first side of the heat sink, and one or more heat sink fins extending outward from a second side of the heat sink opposite to the first side; and the thermal interface material assembly extends along the protrusion of the heat sink.

27. An apparatus for improving the heat transfer efficiency of a sliding surface, comprising the heat sink of claim 26 and a housing adapted to slidably accommodate a connector, wherein, When the connector is slidably housed within or removed from the housing, the anti-friction layer slidably contacts a portion of the connector, and when the connector is slidably housed within the housing, the thermal interface material assembly is located between the connector and the heat sink, thereby defining at least a portion of the thermally conductive path between the connector and the heat sink.

28. The apparatus as claimed in claim 27, wherein, The device is a small pluggable transceiver; the connector is a small pluggable cable connector; and the housing is a small pluggable cover suitable for accommodating the small pluggable cable connector.

29. An apparatus for improving the heat transfer efficiency of a sliding surface, comprising: A housing having a cavity, the housing including an opening and an inner surface within the cavity; A component having a surface corresponding to the inner surface within the cavity of the housing, the component being configured to be slidably inserted into and slidably removed from the cavity through the opening; and a thermal interface material assembly along the surface of the component as described in any one of claims 1 to 25, the thermal interface material assembly being configured such that when the component is within the cavity, the friction-reducing layer faces the inner surface within the cavity of the housing, whereby the friction-reducing layer contacts the inner surface within the cavity of the housing when the component is slidably inserted into or removed from the cavity through the opening.

30. The apparatus of claim 29, wherein the apparatus further includes one or more heat sinks projecting outward from the wall of the housing, and / or the component includes a connector, and the housing includes a cover that includes a cavity configured to receive the connector.

31. The apparatus as claimed in claim 29, wherein: The device is a small pluggable transceiver; the component includes a small pluggable cable connector; and the housing is a small pluggable cover that includes a cavity configured to accommodate the small pluggable cable connector.

32. The apparatus as claimed in claim 29, wherein: The device is a photoelectric conversion device; the component is an optical module, which includes a surface corresponding to the inner surface within the cavity of the housing; and the thermal interface material assembly runs along the surface of the optical module.

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