Package structure and manufacturing method thereof

Abstract

A packaging structure and its manufacturing method are provided. The packaging structure includes a metal core substrate, a sensor, and a cover. The sensor is disposed on the metal core substrate. The cover is disposed on the metal core substrate, wherein the cover and the metal core substrate are sealed to form a vacuum chamber, and the sensor is located in the vacuum chamber. The cover includes a filter portion, the orthographic projection of the filter portion on the metal core substrate overlapping the orthographic projection of the sensor on the metal core substrate.

Claims

1. A packaging structure, comprising: metal core substrate; The sensor is disposed on the metal core substrate; The sensor is located in the vacuum chamber and a cover is disposed on the metal core substrate. The cover is sealed with the metal core substrate to form a vacuum chamber. The cover includes a filter portion, the orthographic projection of the filter portion on the metal core substrate overlaps with the orthographic projection of the sensor on the metal core substrate. The support portion is connected between the metal core substrate and the filter portion, so that the filter portion is suspended above the sensor. The support portion and the filter portion are integrally formed, and the material of the support portion and the material of the filter portion are the same and both are filter materials.

2. The packaging structure as claimed in claim 1, wherein the cover portion is embedded in the metal core substrate.

3. The packaging structure as described in claim 1, wherein the metal core substrate comprises: A core substrate having a first surface and a second surface opposite to the first surface, wherein the material of the core substrate includes metal; a first dielectric layer disposed on the first surface of the core substrate; and a first conductive layer disposed on the first dielectric layer, wherein the sensor is electrically connected to a portion of the first conductive layer.

4. The packaging structure as claimed in claim 3, wherein a portion of the cover extends through the first dielectric layer and is electrically connected to the core substrate.

5. The packaging structure as described in claim 3, wherein the first conductive layer comprises: An annular conductive portion corresponds to the periphery of the cover and is connected to the cover.

6. The packaging structure as described in claim 3, wherein the metal core substrate further comprises: A second dielectric layer is disposed on the second surface of the core substrate; And a second conductive layer, disposed on the second dielectric layer.

7. The packaging structure as claimed in claim 6, wherein the metal core substrate further comprises: A through-hole is disposed in the core substrate and electrically connected to the first conductive layer and the second conductive layer.

8. A method for manufacturing a packaging structure, comprising: The sensor is attached to the metal core substrate; And in a vacuum environment, the cover is bonded to the metal core substrate to form a vacuum chamber between the cover and the metal core substrate, wherein the sensor is located in the vacuum chamber, wherein the method of forming the cover includes: providing an optical filter substrate; A portion of the optical filter substrate is removed from the surface of the optical filter substrate to form a groove in the optical filter substrate, and the remaining optical filter substrate is formed as a cover, wherein the cover includes a filter portion and a support portion, the orthographic projection of the filter portion on the metal core substrate overlaps with the orthographic projection of the sensor on the metal core substrate, and the support portion is connected between the metal core substrate and the filter portion so that the filter portion is suspended above the sensor.

9. A method for manufacturing a package structure as claimed in claim 8, wherein the metal core substrate comprises: A core substrate having a first surface and a second surface opposite to the first surface, wherein the material of the core substrate includes metal; a first dielectric layer disposed on the first surface of the core substrate; and a first conductive layer disposed on the first dielectric layer, wherein the sensor is electrically connected to a portion of the first conductive layer.

10. A method of manufacturing a package structure as claimed in claim 9, wherein, prior to bonding the cover to the metal core substrate, a portion of a first dielectric layer is removed to form a groove that exposes the core substrate, wherein the cover is disposed in the groove and bonded to the core substrate by a conductive adhesive layer.

11. A method of manufacturing a packaging structure as claimed in claim 9, wherein the first conductive layer includes an annular conductive portion, and the cover is disposed on the annular conductive portion and bonded to the annular conductive portion by a conductive adhesive layer.

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