Packaging ring component

Abstract

This invention discloses a ring-shaped device for packaging, comprising a ceramic-based ring structure and a metal skin layer. The ceramic-based ring structure encloses a wafer-receiving region, and the ceramic-based ring structure has a continuous non-metallic phase and a solid metallic phase dispersed within the non-metallic phase. The non-metallic phase comprises silicon carbide, and the solid metallic phase comprises a high thermal conductivity metal material. The metal skin layer covers the ceramic-based ring structure, and the metal skin layer is formed of the high thermal conductivity metal material. Therefore, the ring-shaped device for packaging can have high rigidity, high thermal conductivity, high strength, and good thermal dimensional stability.

Claims

1. A ring-shaped device for packaging, comprising: A ceramic-based ring structure enclosing a wafer-receiving region, wherein the ceramic-based ring structure has a continuous non-metallic phase and a solid metallic phase dispersed in the non-metallic phase, the non-metallic phase comprising silicon carbide, and the solid metallic phase comprising a high thermal conductivity metal material. The device includes a metal skin layer covering the ceramic-based annular structure, wherein the metal skin layer is formed of the high thermal conductivity metal material; wherein the non-metallic phase is a ceramic-based porous carrier, and the high thermal conductivity metal material fills the pores of the ceramic-based porous carrier to form the solid metal phase; wherein the flexural strength of the annular device for packaging is greater than 400 MPa, the coefficient of thermal expansion of the annular device for packaging is 6~20×10-6 / K, and the thermal conductivity of the annular device for packaging is greater than 180 W / mK.

2. The ring-shaped device for packaging as described in claim 1, wherein, The porosity of the ceramic-based porous carrier is 20% to 70%.

3. The ring-shaped device for packaging as described in claim 2, wherein, The ceramic-based porous carrier is composed of small-diameter particles, medium-diameter particles and large-diameter particles, and the particle size ratio of the small-diameter particles, the medium-diameter particles and the large-diameter particles is 1:2-2.5:3-20.

4. The ring-shaped device for packaging as described in claim 3, wherein, The small-diameter particles have a diameter in the range of 0.1 μm to 5 μm, the medium-diameter particles have a diameter in the range of 2 μm to 10 μm, and the large-diameter particles have a diameter in the range of 10 μm to 100 μm.

5. The ring-shaped device for packaging as described in claim 3, wherein, Based on the total weight of the ceramic-based porous carrier, the weight ratio of the small-diameter particles, the medium-diameter particles, and the large-diameter particles is 1:3:

4.

6. The ring-shaped device for packaging as described in claim 3, wherein, More than 99% of the small-diameter particles, medium-diameter particles, and large-diameter particles are silicon carbide particles.

7. The ring-shaped device for packaging as described in claim 3, wherein, Less than 30% of the small-diameter particles, medium-diameter particles, and large-diameter particles are silicon carbide particles.

8. The ring-shaped device for packaging as described in claim 1, wherein, The thickness of the metal skin layer is greater than 5 μm.

9. The ring-shaped device for packaging as described in claim 8, wherein, The metal skin layer covers an outer surface of the ceramic-based annular structure, and the metal skin layer and the ceramic-based annular structure satisfy the following relationship: 2A / T is less than or equal to 50%; A represents the coverage thickness of the metal skin layer on the outer surface; T represents the sum of the thickness of the metal skin layer and the thickness of the ceramic-based annular structure.

10. The ring-shaped device for packaging as described in claim 1, wherein, The non-metallic phase of the ceramic-based ring structure comprises at least one of single-crystal silicon, diamond, diamond-like material, boron nitride, and graphene.

11. The ring-shaped device for packaging as described in claim 1, wherein, The high thermal conductivity metal material is aluminum, copper, silver, or their alloys.

12. The ring-shaped device for packaging as described in claim 1, wherein, The thermal conductivity of the ring-shaped device used for packaging is 250~350 W / mK.

Images