resin composition

Abstract

The objective of this invention is to provide a resin composition that can suppress unevenness in the cured product after lamination. The solution of this invention is a resin composition comprising (A) a compound containing repeating units of formula (1), (B) an epoxy resin, and (C) an active ester compound (in formula (1), ring A represents a nitrogen-containing aromatic ring that may have substituents; rings B and C each independently represent aromatic rings that may have substituents; X represents a single bond or a divalent non-aromatic hydrocarbon group).

Description

resin composition This invention relates to resin compositions comprising epoxy resin. Furthermore, it relates to cured products, sheet-like laminates, resin sheets, printed circuit boards, and semiconductor devices obtained using these resin compositions. As a manufacturing technology for printed circuit boards, a known manufacturing method involves alternating stacking of insulating and conductive layers (build-up). In this build-up method, the insulating layer is generally formed by curing a resin composition. However, in the step of laminating the resin composition onto a sheet support substrate, unevenness is known to occur after the lamination process. To date, resin compositions using polymers containing nitrogen-containing heterocyclic bisphenol ethers are known (Patent Documents 1 and 2). [Prior Art][Patent Documents] [Patent Document 1] International Publication No. 2019 / 054335 [Patent Document 2] International Publication No. 2020 / 021827 [Problem to be Solved by the Invention] The problem of the present invention is to provide a resin composition that can produce a cured product with suppressed unevenness after lamination. [Means for Solving the Problem] In order to achieve the objectives of this invention, the inventors conducted intensive research and discovered that by using a compound containing (B) epoxy resin and (C) active ester compound, a hardened material that suppresses uneven lamination can be obtained by using (A) a compound containing repeating units of formula (1), thus completing this invention. That is, the present invention includes the following: [1] A resin composition comprising (A) a compound comprising repeating units of formula (1), (B) an epoxy resin, and (C) an active ester compound. [In the formula, ring A represents a nitrogen-containing aromatic ring that may have substituents; rings B and C each independently represent aromatic rings that may have substituents; X represents a single bond or a divalent non-aromatic hydrocarbon group]. [2] As described in [1] above, the resin composition, wherein component (A) is a compound containing the repeating unit represented by formula (1A) or (1B), [In the formula, X] 1 X 2 X 3 and X 4 Each can be represented independently as N, CH, or CR. a And X 1 X 2 X 3and X 4 At least one of them is N; R 1 and R 2 Each can be independently represented by a hydrogen atom, alkyl group, or alkenyl group, or R 1 and R 2 They become bonded together to form a cycloalkane ring, which may have a group selected from alkyl and alkenyl groups, or a cycloalkene ring, which may have a group selected from alkyl and alkenyl groups; R a R b and R c[3] As described in [1] or [2] above, the content of component (A) is 0.01% to 3% by mass when the non-volatile component in the resin composition is defined as 100% by mass. [4] As described in any one of [1] to [3] above, component (B) is an epoxy resin containing a condensation ring structure (B-1). [5] As described in [4] above, component (B-1) is a monomeric epoxy resin containing a condensation ring structure. [6] As described in any one of [1] to [5] above, the content of component (B) is 1% to 30% by mass when the non-volatile component in the resin composition is defined as 100% by mass. [7] The resin composition described in any of [1] to [6] above, wherein the mass ratio of component (B) to component (A) (component (B) / component (A)) is 10 to 50. [8] The resin composition described in any of [1] to [7] above, wherein the content of component (C) is 5% to 30% by mass when the non-volatile components in the resin composition are defined as 100% by mass. [9] The resin composition described in any of [1] to [8] above, wherein the mass ratio of component (C) to component (A) (component (C) / component (A)) is 30 to 100.

[10] The resin composition described in any of [1] to [9] above, further includes inorganic filler material (D).

[11] The resin composition described in

[10] above, wherein component (D) is silicon dioxide.

[12] The resin composition described in

[10] or

[11] above, wherein the content of component (D) is 50% by mass or more when the non-volatile component in the resin composition is defined as 100% by mass.

[13] The resin composition described in

[12] above, wherein the content of component (D) is 70% by mass or more when the non-volatile component in the resin composition is defined as 100% by mass.

[14] The resin composition described in any one of [1] to

[13] above further includes (E) a free radical polymerizable compound.

[15] The resin composition described in any one of [1] to

[14] above further includes (F-1) a carbodiimide-based curing agent.

[16] A cured product of the resin composition described in any one of [1] to

[15] above.

[17] A sheet-like laminate containing a resin composition as described in any one of [1] to

[15] above.

[18] A resin sheet having a support and a resin composition layer formed by the resin composition as described in any one of [1] to

[15] above disposed on the support.

[19] A printed wiring board having an insulating layer made of a hardened resin composition as described in any one of [1] to

[15] above.

[20] A semiconductor device comprising the printed wiring board as described in

[19] above. [Effects of the invention]. According to the resin composition of the present invention, a hardened product that suppresses unevenness after lamination can be obtained. The present invention will now be described in detail with respect to suitable embodiments thereof. However, the present invention is not limited to the embodiments and examples described below, and any modifications may be made to implement it without departing from the scope of the claims and their equivalents. <Resin Composition> The resin composition of the present invention comprises (A) a compound containing repeating units of formula (1), (B) an epoxy resin, and (C) an active ester compound. By using such a resin composition, uneven curing after lamination can be obtained. Furthermore, in a specific embodiment, a cured product with low dielectric tangent (Df) can be obtained. Furthermore, in a specific embodiment, a cured product with good plating adhesion (peel strength of the plating conductor layer) can be obtained. In addition to comprising (A) a compound containing repeating units of formula (1), (B) an epoxy resin, and (C) an active ester compound, the resin composition of the present invention may further comprise any other components. Examples of such arbitrary components include (D) inorganic fillers, (E) free radical polymerizable compounds, (F) curing agents, (G) curing accelerators, (H) other additives, and (I) organic solvents. The components comprised in the resin composition will be described in detail below. <(A) Compounds containing repeating units of formula (1)> The resin composition system of the present invention contains compounds containing repeating units of formula (1) of formula (A). [In the formula, ring A represents a nitrogen-containing aromatic ring that may have substituents; rings B and C each independently represent aromatic rings that may have substituents; X represents a single bond or a divalent non-aromatic hydrocarbon group]. Ring A represents a nitrogen-containing aromatic ring that may have substituents. An aromatic ring is defined as a ring that conforms to Hückel's rule, which states that the number of electrons in the π-electron system of the ring is 4n+2 (where n is a natural number). The nitrogen-containing aromatic ring represented by Ring A, as a constituent atom, has one or more (preferably two or more, especially two) nitrogen atoms in addition to carbon atoms, and may further have heteroatoms other than nitrogen atoms such as oxygen and sulfur atoms. The nitrogen-containing aromatic ring represented by Ring A is preferably a 5-14 member nitrogen-containing aromatic ring, more preferably a 5-10 member nitrogen-containing aromatic ring, even more preferably a 5 or 6 member nitrogen-containing aromatic ring, and especially preferably a 6-member nitrogen-containing aromatic ring. The nitrogen-containing aromatic ring represented by ring A includes not only condensed monocyclic aromatic rings and condensed rings of two or more monocyclic aromatic rings, but also condensed rings of one or more monocyclic aromatic rings condensed with one or more monocyclic non-aromatic rings. Suitable specific examples of nitrogen-containing aromatic rings represented by ring A include monocyclic nitrogen-containing aromatic rings such as pyrrole rings, imidazole rings, pyrazole rings, 1,2,3-triazole rings, 1,2,4-triazole rings, tetrazolium rings, pyridine rings, pyrazine rings, pyrimidine rings, pyridazine rings, 1,2,3-triazine rings, 1,2,4-triazine rings, and 1,3,5-triazine rings; condensation rings of monocyclic nitrogen-containing aromatic rings with benzene rings such as indole rings, isoindole rings, benzimidazole rings, indazole rings, benzotriazole rings, quinoxaline rings, borazine rings, quinazoline rings, and phthalazine rings; and pteridine rings, purine rings, and 4- The ring is a condensation ring of monocyclic nitrogen-containing aromatic rings such as azirindole ring, 5-azirindole ring, 6-azirindole ring, 7-azirindole ring, 7-azirindazole ring, pyrazolo[1,5-a]pyrimidine ring, 1,8-naphthidine ring, pyrido[3,2-d]pyrimidine ring, pyrido[4,3-d]pyrimidine ring, pyrido[3,4-b]pyrazine ring, pyrido[2,3-b]pyrazine ring, etc., preferably a monocyclic nitrogen-containing aromatic ring, more preferably a 6-membered monocyclic nitrogen-containing aromatic ring, even more preferably a pyrimidine ring or a pyridazine ring, and especially preferably a pyrimidine ring. In this specification, the term "substituent" is not specifically limited, but may include, for example, monovalent substituents such as alkyl, alkenyl, aryl, alkyl-aryl (aryl group substituted with one or more alkyl groups), aryl-aryl (aryl group substituted with one or more aryl groups), aryl-alkyl (alkyl group substituted with one or more aryl groups), alkyl-oxy, alkenyl-oxy, aryl-oxy, alkyl-carbonyl, alkenyl-carbonyl, aryl-carbonyl, alkyl-oxy-carbonyl, alkenyl-oxy-carbonyl, aryl-oxy-carbonyl, alkyl-carbonyl-oxy, alkenyl-carbonyl-oxy, aryl-carbonyl-oxy, alkyl-carbonyl-oxy, alkenyl-carbonyl-oxy, aryl-carbonyl-oxy, and, if substitution is possible, divalent substituents such as oxo (=O). The term "alkane" refers to a straight-chain, branched-chain, and / or cyclic monovalent aliphatic saturated hydrocarbon group. Preferably, the alkane has 1 to 14 carbon atoms, more preferably 1 to 10 carbon atoms, and even more preferably 1 to 6 or 4 to 10 carbon atoms. Examples of alkane groups include methyl, ethyl, propyl, isopropyl, butyl, isobutyl, sec-butyl, tert-butyl, pentyl, hexyl, heptyl, octyl, nonyl, decyl, cyclopentyl, cyclohexyl, methylcyclohexyl, dimethylcyclohexyl, trimethylcyclohexyl, cyclopentylmethyl, and cyclohexylmethyl. The term "alkene" refers to a straight-chain, branched-chain, and / or cyclic monovalent aliphatic unsaturated hydrocarbon group having at least one carbon-carbon double bond. The alkenyl group preferably has 2 to 14 carbon atoms, more preferably 2 to 10 carbon atoms, and even more preferably 2 to 6 or 4 to 10 carbon atoms. Examples of alkenyl groups include vinyl, propenyl, butenyl, pentenyl, hexenyl, heptenyl, octenyl, nonenyl, decenyl, and cyclohexenyl. The term aryl refers to a monovalent aromatic hydrocarbon group. Aromatic groups preferably have 6 to 14 carbon atoms. Examples of aryl groups include phenyl, 1-naphthyl, and 2-naphthyl. Ring B and ring C independently represent aromatic rings that may have substituents. While the aromatic ring represented by ring B or ring C may be a carbon ring with a carbon atom as the ring-forming atom, or a heteroring with heteroatoms such as oxygen, nitrogen, and sulfur atoms in addition to carbon atoms, in one embodiment, a carbon ring is preferred. The aromatic ring represented by ring B or ring C is preferably a 5-14 member aromatic ring, more preferably a 5-10 member aromatic ring, even more preferably a 5 or 6 member aromatic ring, and particularly preferably a 6-member aromatic ring. The aromatic ring represented by ring B or ring C includes not only condensed monocyclic aromatic rings and condensed rings of two or more monocyclic aromatic rings, but also condensed rings of one or more monocyclic aromatic rings condensed with one or more monocyclic non-aromatic rings. Suitable specific examples of aromatic rings represented by ring B or ring C include monocyclic aromatic rings such as benzene rings, furan rings, thiophene rings, pyrrole rings, pyrazole rings, oxazole rings, isoxazole rings, thiazole rings, imidazole rings, pyridine rings, pyridazine rings, pyrimidine rings, and pyrazine rings; and naphthyl rings, anthracene rings, benzofuran rings, isobenzofuran rings, indole rings, isoindole rings, benzothiophene rings, benzimidazole rings, indazole rings, benzoxazole rings, and benzimidazole rings. A condensation ring of two or more monocyclic aromatic rings, such as oxazole ring, benzothiazole ring, quinoline ring, isoquinoline ring, quinoxaloline ring, acridine ring, quinazoline ring, cyclophosphine ring, etc.; or a condensation ring of one or more monocyclic aromatic rings, such as indene ring, fumonisin ring, tetrahydronaphthalene ring, etc., condensed with one or more monocyclic non-aromatic rings, preferably a monocyclic aromatic ring, more preferably a 6-membered monocyclic aromatic ring, and especially preferably a benzene ring. X is a single bond or a divalent non-aromatic hydrocarbon group. The divalent non-aromatic hydrocarbon group represented by X is a saturated or unsaturated straight-chain, branched-chain, and / or cyclic divalent non-aromatic hydrocarbon group. The divalent non-aromatic hydrocarbon group represented by X has, for example, 1 to 100 carbon atoms, preferably 1 to 50, more preferably 1 to 30, and even more preferably 1 to 20 carbon atoms. X is preferably a divalent non-aromatic hydrocarbon group, and more preferably a divalent group represented by formula (X1). [In the formula, R] 1 and R 2 Each can be independently represented by a hydrogen atom, alkyl group, or alkenyl group, or R 1 and R 2 They become bonded together and form a cycloalkane ring having a group selected from alkyl and alkenyl groups, or a cycloalkene ring having a group selected from alkyl and alkenyl groups; * indicates the bonding site] More preferably, a divalent group represented by any one of formulas (X2-1) to (X2-3), [In the formula, R] 3 R 4 , and R 5 Each alkyl group is represented independently; x represents an integer from 0 to 5 (preferably 1 to 5, more preferably 2 to 4); * represents the bonding site] preferably a divalent group represented by formula (X2-1). The term "cycloalkane ring" refers to a cyclic aliphatic saturated hydrocarbon ring. Cycloalkane rings are preferably 3 to 8 carbon atoms, and more preferably 5 or 6 carbon atoms. Examples of cycloalkane rings include cyclobutane, cyclopentane, cyclohexane, cycloheptane, and cyclooctane. The term "cycloalkene ring" refers to a cyclic aliphatic unsaturated hydrocarbon ring having at least one carbon-carbon double bond. Cycloalkene rings are preferably 4 to 8 carbon atoms, and more preferably 5 or 6 carbon atoms. Examples of cycloalkene rings include cyclobutene, cyclopentene, cyclohexene, cycloheptene, cyclooctene, cyclopentadiene, and cyclohexadiene. (A) A compound containing the repeating unit represented by formula (1), preferably a compound containing the repeating unit represented by formula (1A) or (1B). [In the formula, X] 1 X 2 X 3 and X 4 Each can be represented independently as N, CH, or CR. a (Preferably N or CH), and X 1 X 2 X 3 and X 4 At least one of them (preferably at least two, especially two) is N; R a R b and R c Each of the following symbols independently represents a substituent (preferably alkyl, alkenyl, aryl, alkyl-aryl, aryl-aryl, or aryl-alkyl, more preferably alkyl, alkenyl, or aryl, especially aryl); b and c independently represent integers from 0 to 3 (preferably 0); other symbols are the same as in formula (X1). More preferably, it is a compound containing repeating units represented by any one of formulas (1A-1) to (1B-3). [In the formula, a represents an integer from 0 to 2 (preferably 0); other notations are the same as those in formulas (1A), (1B) and (X2-1) to (X2-3)] Preferably, it is a compound containing the repeating unit represented by formula (1A-1). (A) In one embodiment, a compound containing the repeating unit represented by formula (1) may have reactive groups such as phenolic hydroxyl, thiol, amino, carboxyl, sulfonyl, etc., preferably phenolic hydroxyl. In one embodiment, the reactive groups are preferably two or more in one molecule. (A) In compounds containing repeating units represented by formula (1), the number of repeating units is preferably 5 or more, more preferably 10 or more, even more preferably 30 or more, and most preferably 50 or more. The upper limit of the number of repeating units is not specifically limited, but may be, for example, less than 10,000, less than 5,000, less than 3,000, less than 2,000, less than 1,000, etc. (A) The weight-average molecular weight (Mw) of the compound containing the repeating units represented by formula (1), while not particularly limited, is preferably 1,000 to 200,000, more preferably 5,000 to 150,000, and even more preferably 10,000 to 120,000. The weight-average molecular weight of the resin can be determined by gel permeation chromatography (GPC) as a value converted from polystyrene. (A) The glass transition temperature (Tg) of the compound containing the repeating unit represented by formula (1) is not particularly limited, but is preferably 100 to 300°C, and more preferably 150 to 250°C. (A) A compound containing the repeating unit represented by formula (1) may be synthesized using, for example, the methods described in or in accordance with International Publication No. 2019 / 054335 or International Publication No. 2020 / 021827. The content of the compound represented by the repeating unit of formula (1) in the resin composition (A) is not particularly limited, but when the non-volatile component in the resin composition is defined as 100% by mass, it is preferably 10% by mass or less, more preferably 5% by mass or less, even more preferably 3% by mass or less, even more preferably 1% by mass or less, and most preferably 0.5% by mass or less. The lower limit of the content of the compound represented by the repeating unit of formula (1) in the resin composition (A) is not particularly limited, but when the non-volatile component in the resin composition is defined as 100% by mass, it is preferably 0.0001% by mass or more, more preferably 0.001% by mass or more, even more preferably 0.01% by mass or more, even more preferably 0.05% by mass or more, and most preferably 0.1% by mass or more. <(B) Epoxy Resin> The resin composition of the present invention contains (B) epoxy resin. (B) epoxy resin refers to a curable resin having epoxy groups. Preferably, (B) epoxy resin is an epoxy resin containing a condensation ring structure (B-1). <(B-1) Epoxy Resins Containing Condensed Ring Structure> The term (B-1) epoxy resin containing condensed ring structure refers to a resin having one or more condensed rings and one or more (preferably two or more) epoxy groups in one molecule. Epoxy resins containing condensed ring structure (B-1) can be used alone or in any combination of two or more types. (B-1) The condensation ring contained in the epoxy resin containing the condensation ring structure is preferably a condensation aromatic carbon ring. The condensation aromatic carbon ring is a two-ring or more aromatic carbon ring obtained by condensing two or more benzene rings, and the number of carbons is preferably 10 to 18, more preferably 10 to 14, such as naphthalene ring, anthracene ring, phenanthrene ring, etc., and naphthalene ring is particularly preferred. (B-1) Epoxy resins containing condensed ring structures can be of any type, such as glycidyl ether, glycidylamine, glycidyl ester, or oleic acid (alicyclic), but glycidyl ether is preferred. (B-1) Epoxy resins containing condensation ring structures can be monomeric or repeating-structure types. Here, a repeating-structure type refers to a polymer structure having an average of three or more repeating units containing one or two or more condensation rings. A monomeric type refers to a molecular structure that does not have repeating units, or has two repeating units containing one or two or more condensation rings. (B-1) Epoxy resins containing condensation ring structures are selected from (B-1-1) monomeric epoxy resins containing condensation ring structures and (B-1-2) repeating-structure epoxy resins containing condensation ring structures, preferably (B-1-1) monomeric epoxy resins containing condensation ring structures. Examples of (B-1-1) monomeric epoxy resins containing condensation ring structures include 1,6-bis(epoxypropoxy)naphthalene, 1,5-bis(epoxypropoxy)naphthalene, 2,7-bis(epoxypropoxy)naphthalene, and 2,6-bis(epoxypropoxy)naphthalene, which are monomeric epoxy resins containing one condensation ring in one molecule; bis[2-(epoxypropoxy)-1-naphthyl]methane, 2,2-bis[2-(epoxypropoxy)-1-naphthyl]propane, Epoxy resins containing condensation ring structures, such as bis[2,7-bis(epoxypropoxy)-1-naphthyl]methane, 2,2-bis[2,7-bis(epoxypropoxy)-1-naphthyl]propane, [2,7-bis(epoxypropoxy)-1-naphthyl][2-(epoxypropoxy)-1-naphthyl]methane, and 2-[2,7-bis(epoxypropoxy)-1-naphthyl]-2-[2-(epoxypropoxy)-1-naphthyl]propane, are monomeric types containing condensation ring structures in one molecule. (B-1-1) In one embodiment, the monomeric epoxy resin containing a condensation ring structure is preferably a monomeric epoxy resin containing a condensation ring structure having one condensation ring in one molecule, and particularly preferably 1,6-bis(epoxypropoxy)naphthalene. (B-1-1) In one embodiment, the monomeric epoxy resin containing a condensation ring structure is preferably a 2- to 4-functional epoxy resin, more preferably a 2- or 3-functional epoxy resin, and especially preferably a 2-functional epoxy resin. (B-1-1) The epoxy equivalent of monomeric epoxy resins containing condensation ring structures is not particularly limited, but preferably 50 g / eq. or more, more preferably 80 g / eq. or more, even more preferably 100 g / eq. or more, even more preferably 120 g / eq. or more, and particularly preferably 130 g / eq. or more. (B-1-1) The upper limit of the epoxy equivalent of monomeric epoxy resins containing condensation ring structures is not particularly limited, but preferably 1000 g / eq. or less, more preferably 500 g / eq. or less, even more preferably 300 g / eq. or less, even more preferably 200 g / eq. or less, and particularly preferably 160 g / eq. or less. Epoxy equivalent refers to the mass of resin per equivalent of epoxy groups. Epoxy equivalent can be determined according to JIS K7236. (B-1-1) The molecular weight of the monomeric epoxy resin containing a condensation ring structure is not particularly limited, but it is preferably 2000 or less, more preferably 1000 or less, even more preferably 700 or less, even more preferably 600 or less, and most preferably 500 or less. Commercially available epoxy resins containing condensation ring structures of the (B-1-1) monomer type include, for example, "HP-4032D" and "HP-4032SS" (epoxy resins with one naphthalene ring in one molecule) manufactured by DIC Corporation; "EXA-4750", "HP-4770", "HP-4700", and "HP-4710" (epoxy resins with two naphthalene rings in one molecule) manufactured by DIC Corporation, etc. Examples of epoxy resins containing condensation ring structures in the repeating structural type (B-1-2) include naphthol phenolic varnish type epoxy resin, naphthol-phenol cocondensed phenolic varnish type epoxy resin, naphthol-cresol cocondensed phenolic varnish type epoxy resin, naphthol aralkyl type epoxy resin, naphthalene glycol aralkyl type epoxy resin, and naphthyl ether type epoxy resin, which are epoxy resins containing condensation ring structures in the repeating structural type with three or more condensation rings in one molecule. (B-1-2) The epoxy equivalent of the epoxy resin containing condensation ring structure of the repeating structure is not particularly limited, but is preferably 50 g / eq. or more, more preferably 100 g / eq. or more, even more preferably 200 g / eq. or more, even more preferably 250 g / eq. or more, and most preferably 300 g / eq. or more. (B-1-2) The upper limit of the epoxy equivalent of the epoxy resin containing condensation ring structure of the repeating structure is not particularly limited, but is preferably 2000 g / eq. or less, more preferably 1000 g / eq. or less, even more preferably 500 g / eq. or less, and even more preferably 400 g / eq. or less. Commercially available epoxy resins containing condensation ring structures of the repeating structure type (B-1-2) include, for example, "ESN-155", "ESN-185V", "ESN-175", "ESN-475V", "ESN-485", and "TX-1507B" (naphthol aralkyl type epoxy resin) manufactured by Nippon Steel Chemical Materials Co., Ltd.; "EXA-7311", "EXA-7311-G3", "EXA-7311-G4", "EXA-7311-G4S", "HP-6000", and "HP-6000-L" (naphthyl ether type epoxy resin) manufactured by DIC Co., Ltd.; and "NC7000L" (naphthol phenolic varnish type epoxy resin) manufactured by Nippon Kayaku Co., Ltd. Although the resin composition may contain epoxy resin with condensation ring structure (B-1) and other epoxy resins (B-2), from the viewpoint that the desired effect of the present invention is significantly obtained when the content of epoxy resin with condensation ring structure (B-1) in the resin composition is set to 100% by mass, it is more preferably 50% by mass or more, 60% by mass or more, more preferably 70% by mass or more, 80% by mass or more, even more preferably 90% by mass or more, 95% by mass or more, even more preferably 98% by mass or more, 99% by mass or more, and most preferably 100% by mass. <(B-2) Other Epoxy Resins> Examples of other epoxy resins in (B-2) include, for instance, bixylenol type epoxy resins, bisphenol A type epoxy resins, bisphenol F type epoxy resins, bisphenol S type epoxy resins, bisphenol AF type epoxy resins, dicyclopentadiene type epoxy resins, phenolic resins, phenolic varnish type epoxy resins, tert-butyl-catechol type epoxy resins, epoxypropylamine type epoxy resins, epoxypropyl ester type epoxy resins, and cresol-phenolic varnish type epoxy resins. Paint-type epoxy resins, phenolic alkyl-type epoxy resins, biphenyl-type epoxy resins, linear aliphatic epoxy resins, epoxy resins with butadiene structures, alicyclic epoxy resins, heterocyclic epoxy resins, epoxy resins containing spirocyclic rings, cyclohexane-type epoxy resins, cyclohexane-diethanolene-type epoxy resins, trimethylolpropionic acid epoxy resins, tetraphenylethane-type epoxy resins, isocyanurate-type epoxy resins, phenolic phthalimide-type epoxy resins, phenolic phthalocyanine-type epoxy resins, etc. (B-2) Other epoxy resins can be used alone or in combination of two or more types. The resin composition, as another epoxy resin in (B-2), is preferably an epoxy resin containing two or more epoxy groups per molecule. The proportion of the epoxy resin containing two or more epoxy groups per molecule, relative to 100% by mass of the non-volatile components of the other epoxy resin in (B-2), is preferably 50% by mass or more, more preferably 60% by mass or more, and particularly preferably 70% by mass or more. Among epoxy resins, there are epoxy resins that are liquid at 20°C (hereinafter, sometimes referred to as "liquid epoxy resin") and epoxy resins that are solid at 20°C (hereinafter, sometimes referred to as "solid epoxy resin"). The resin composition of the present invention, as (B-2) other epoxy resins, may contain only liquid epoxy resin, or only solid epoxy resin, or may contain a combination of liquid epoxy resin and solid epoxy resin. As a liquid epoxy resin, it is preferred to be a liquid epoxy resin having two or more epoxy groups in one molecule. As liquid epoxy resins, bisphenol A type epoxy resin, bisphenol F type epoxy resin, bisphenol AF type epoxy resin, epoxypropyl ester type epoxy resin, epoxypropylamine type epoxy resin, phenolic varnish type epoxy resin, alicyclic epoxy resin having an ester skeleton, cyclohexane type epoxy resin, cyclohexanediethanol type epoxy resin, and epoxy resin having a butadiene structure are preferred. Specific examples of liquid epoxy resins include Mitsubishi Chemical's "828US", "828EL", "jER828EL", "825", and "EPIKOTE 828EL" (bisphenol A type epoxy resin); Mitsubishi Chemical's "jER807" and "1750" (bisphenol F type epoxy resin); Mitsubishi Chemical's "jER152" (phenolic varnish type epoxy resin); Mitsubishi Chemical's "630", "630LSD", and "604" (epoxypropylamine type epoxy resin); and ADEKA's "ED-523T" (glycyrol type epoxy resin). The following epoxy resins are manufactured by various companies: "EP-3950L" and "EP-3980S" (epoxypropylamine type epoxy resin); "EP-4088S" (dicyclopentadiene type epoxy resin) manufactured by ADEKA; "ZX1059" (a mixture of bisphenol A and bisphenol F type epoxy resins) manufactured by Nippon Steel & Sumitomo Chemical Co., Ltd.; "EX-721" (epoxypropyl ester type epoxy resin) manufactured by Nagasemtex Co., Ltd.; and "CELLOXIDE" manufactured by Daicel Co., Ltd. 2021P (alicyclic epoxy resin with an ester skeleton); Daicel's PB-3600; Nippon Soda's JP-100 and JP-200 (epoxy resins with a butadiene structure); Nippon Steel & Sumitomo Chemical's ZX1658 and ZX1658GS (liquid 1,4-epoxypropylcyclohexane type epoxy resin), etc. These can be used alone or in combination with two or more other types. As a solid epoxy resin, it is preferred to be a solid epoxy resin having three or more epoxy groups in one molecule, and more preferably an aromatic solid epoxy resin having three or more epoxy groups in one molecule. As solid epoxy resins, the preferred types are xylenol-type epoxy resins, cresol-phenolic varnish-type epoxy resins, dicyclopentadiene-type epoxy resins, phenol-type epoxy resins, biphenyl-type epoxy resins, bisphenol A-type epoxy resins, bisphenol AF-type epoxy resins, phenolic aralkyl-type epoxy resins, tetraphenylethane-type epoxy resins, phenolic phthalimide-type epoxy resins, and phenolphthalocyanine-type epoxy resins. Specific examples of solid epoxy resins include: DIC's "N-690" (cresol phenolic varnish type epoxy resin); DIC's "N-695" (cresol phenolic varnish type epoxy resin); DIC's "HP-7200", "HP-7200HH", "HP-7200H", and "HP-7200L" (dicyclopentadiene type epoxy resin); Nippon Kayaku Co., Ltd.'s "EPPN-502H" (phenolic type epoxy resin); Nippon Kayaku Co., Ltd.'s "NC3000H", "NC3000", "NC3000L", "NC3000FH", and "NC3100" (biphenyl type epoxy resin); and Mitsubishi Chemical Co., Ltd.'s "YX4000H" and "YX4000". "YX4000HK" and "YL7890" (bi-xylenol type epoxy resin); "YL6121" (biphenyl type epoxy resin) manufactured by Mitsubishi Chemical Corporation; "YX7700" (phenolic aralkyl type epoxy resin) manufactured by Mitsubishi Chemical Corporation; "PG-100" and "CG-500" manufactured by Osaka Gas Chemical Co., Ltd.; "YL7760" (bisphenol AF type epoxy resin) manufactured by Mitsubishi Chemical Corporation; "YL7800" (purinol type epoxy resin) manufactured by Mitsubishi Chemical Corporation; "jER1010" (bisphenol A type epoxy resin) manufactured by Mitsubishi Chemical Corporation; "jER1031S" (tetraphenylethane type epoxy resin) manufactured by Mitsubishi Chemical Corporation; "WHR991S" (phenolic phthalimide type epoxy resin) manufactured by Nippon Kayaku Co., Ltd., etc. These can be used alone or in combination of two or more types. (B-2) The epoxy equivalent of other epoxy resins is preferably 50 g / eq. to 5,000 g / eq., more preferably 60 g / eq. to 2,000 g / eq., even more preferably 70 g / eq. to 1,000 g / eq., and even more preferably 80 g / eq. to 500 g / eq. (B-2) The weight-average molecular weight (Mw) of other epoxy resins is preferably 100–5,000, more preferably 300–3,000, and even more preferably 400–1,500. The weight-average molecular weight of the resin can be determined by gel permeation chromatography (GPC) as a conversion value to polystyrene. While the content of (B) epoxy resin in the resin composition is not specifically limited, when the non-volatile component in the resin composition is defined as 100% by mass, it is preferably 60% by mass or less, more preferably 40% by mass or less, even more preferably 30% by mass or less, even more preferably 20% by mass or less, and most preferably 10% by mass or less. While the lower limit of the content of (B) epoxy resin in the resin composition is not specifically limited, when the non-volatile component in the resin composition is defined as 100% by mass, it is preferably 0.01% by mass or more, more preferably 0.1% by mass or more, even more preferably 0.5% by mass or more, even more preferably 1% by mass or more, even more preferably 3% by mass or more, and most preferably 5% by mass or more. The mass ratio ((B) component / (A) component) of epoxy resin to (B) component of compound (A) comprising repeating units of formula (1) in the resin composition is not particularly limited, but is preferably 1 or more, more preferably 5 or more, even more preferably 10 or more, and particularly preferably 20 or more. The upper limit of the mass ratio ((B) component / (A) component) of epoxy resin to (B) component of compound (A) comprising repeating units of formula (1) in the resin composition is not particularly limited, but is preferably 200 or less, more preferably 100 or less, even more preferably 50 or less, and particularly preferably 30 or less. <(C) Active Ester Compound> The resin composition of this invention contains (C) active ester compound. Generally, (C) active ester compound can react with (B) epoxy resin to harden the resin composition. (C) active ester compound can be used alone or in any combination of two or more. As for (C) the active ester compound, it is generally preferred to use compounds with highly reactive ester groups, such as phenolic esters, thiophenolic esters, N-hydroxyamine esters, and heterocyclic hydroxyl compounds, in one molecule. This active ester compound is preferably obtained by a condensation reaction of a carboxylic acid compound and / or a thiocarboxylic acid compound with a hydroxyl compound and / or a thiol compound. Especially from the viewpoint of improving heat resistance, active ester compounds obtained from carboxylic acid compounds and hydroxyl compounds are preferred, and more preferably active ester compounds obtained from carboxylic acid compounds and phenolic compounds and / or naphthol compounds. Examples of carboxylic acid compounds include benzoic acid, acetic acid, succinic acid, maleic acid, itaconic acid, phthalic acid, isophthalic acid, terephthalic acid, and pyrocarbonate. Examples of phenolic or naphthol compounds include hydroquinone, resorcinol, bisphenol A, bisphenol F, bisphenol S, phenolphthalein, methylated bisphenol A, methylated bisphenol F, methylated bisphenol S, phenol, o-cresol, m-cresol, p-cresol, catechol, α-naphthol, β-naphthol, 1,5-dihydroxynaphthol, 1,6-dihydroxynaphthol, 2,6-dihydroxynaphthol, dihydroxybenzophenone, trihydroxybenzophenone, tetrahydroxybenzophenone, pyrogallol, phenyltriol dicyclopentadiene-type diphenol compounds, and phenolic varnishes. Here, "dicyclopentadiene-type diphenol compounds" refers to diphenol compounds obtained by condensing one molecule of dicyclopentadiene into two molecules of phenol. Specifically, as (C) the active ester compound, it is preferably a dicyclopentadiene-type active ester compound, a naphthalene-type active ester compound containing a naphthalene structure, an active ester compound containing an acetylene varnish, or an active ester compound containing a benzoylene varnish. More preferably, it is selected from at least one of the dicyclopentadiene-type and naphthalene-type active ester compounds, and even more preferably, it is a dicyclopentadiene-type active ester compound. As a dicyclopentadiene-type active ester compound, it is preferably an active ester compound containing a dicyclopentadiene-type diphenol structure. The term "dicyclopentadiene-type diphenol structure" refers to a divalent structural unit composed of pentenyl-dicyclopentyl-penttenylphenyl. Commercially available products containing (C) active ester compounds, including active ester compounds with a dicyclopentadiene-type diphenol structure, such as "EXB9451", "EXB9460", "EXB9460S", "EXB-8000L", "EXB-8000L-65M", "EXB-8000L-65TM", "HPC-8000L-65TM", "HPC-8000", "HPC-8000-65T", "HPC-8000H", "HPC-8000H-65TM", (manufactured by DIC Corporation); and active ester compounds containing a naphthalene structure, such as "EXB-8100L-65T", "EXB-8150-60T", etc. Examples of active ester compounds containing phosphorus include EXB-8150-62T, EXB-9416-70BK, HPC-8150-60T, and HPC-8150-62T (manufactured by DIC Corporation); examples of active ester compounds containing phosphorus include EXB9401 (manufactured by DIC Corporation); examples of active ester compounds containing acetylated compounds in phenolic varnishes include DC808 (manufactured by Mitsubishi Chemical Corporation); examples of active ester compounds containing benzoyl compounds in phenolic varnishes include YLH1026, YLH1030, and YLH1048 (manufactured by Mitsubishi Chemical Corporation); and examples of active ester compounds containing styrene and naphthalene structures include PC1300-02-65MA (manufactured by AIR WATER Corporation). (C) The active ester equivalent of the active ester compound is preferably 50 g / eq. to 500 g / eq., more preferably 50 g / eq. to 400 g / eq., and even more preferably 100 g / eq. to 300 g / eq. The active ester equivalent refers to the mass of the active ester compound per 1 active ester equivalent. While the content of (C) active ester compounds in the resin composition is not particularly limited, when the non-volatile components in the resin composition are defined as 100% by mass, it is preferably 60% by mass or less, more preferably 50% by mass or less, even more preferably 40% by mass or less, even more preferably 30% by mass or less, and most preferably 20% by mass or less. While the lower limit of the content of (C) active ester compounds in the resin composition is not particularly limited, when the non-volatile components in the resin composition are defined as 100% by mass, it is preferably 0.1% by mass or more, more preferably 1% by mass or more, even more preferably 3% by mass or more, even more preferably 5% by mass or more, and most preferably 10% by mass or more. The mass ratio ((C) component / (A) component) of the active ester compound (containing repeating units of compound (A) represented by formula (1)) in the resin composition is not particularly limited, but is preferably 5 or more, more preferably 10 or more, even more preferably 30 or more, and particularly preferably 40 or more. The upper limit of the mass ratio ((C) component / (A) component) of the active ester compound (containing repeating units of compound (A) represented by formula (1)) in the resin composition is not particularly limited, but is preferably 500 or less, more preferably 200 or less, even more preferably 100 or less, and particularly preferably 60 or less. The mass ratio ((C) component / (B) component) of (B) epoxy resin to (C) active ester compound in the resin composition is not particularly limited, but is preferably 0.1 or more, more preferably 0.5 or more, even more preferably 1 or more, and particularly preferably 1.5 or more. The upper limit of the mass ratio ((C) component / (B) component) of (B) epoxy resin to (C) active ester compound in the resin composition is not particularly limited, but is preferably 10 or less, more preferably 5 or less, even more preferably 3 or less, and particularly preferably 2 or less. <(D) Inorganic Filler Material> The resin composition of the present invention may include (D) inorganic filler material as an optional component. (D) Inorganic filler material is contained in the resin composition in the form of particles. The materials used as (D) inorganic fillers are inorganic compounds. Examples of materials used as (D) inorganic fillers include silicon dioxide, alumina, glass, cordierite, silicon oxide, barium sulfate, barium carbonate, talc, clay, mica powder, zinc oxide, hydrotalcite, boehmite, aluminum hydroxide, magnesium hydroxide, calcium carbonate, magnesium carbonate, magnesium oxide, boron nitride, aluminum nitride, manganese nitride, aluminum borate, strontium carbonate, strontium titanate, calcium titanate, magnesium titanate, bismuth titanate, titanium dioxide, zirconium oxide, barium titanate, barium zirconate titanate, barium zirconate, calcium zirconate, zirconium phosphate, and zirconium tungstate phosphate. Among these, silicon dioxide is particularly suitable. Examples of silicon dioxide include amorphous silicon dioxide, fused silicon dioxide, crystalline silicon dioxide, synthetic silicon dioxide, and hollow silicon dioxide. Furthermore, spherical silicon dioxide is preferred as the silicon dioxide. (D) Inorganic filler materials can be used alone or in any combination of two or more types. Commercially available products as (D) inorganic filler materials include, for example, "UFP-30" manufactured by Denka Chemical Industry Co., Ltd.; "SP60-05" and "SP507-05" manufactured by Nippon Steel & Sumitomo Metal Materials Co., Ltd.; "YC100C", "YA050C", "YA050C-MJE", and "YA010C" manufactured by Admatex Co., Ltd.; "UFP-30" manufactured by Denka Co., Ltd.; "SILFIL NSS-3N", "SILFIL NSS-4N", and "SILFIL NSS-5N" manufactured by Tokuyama Co., Ltd.; "SC2500SQ", "SO-C4", "SO-C2", and "SO-C1" manufactured by Admatex Co., Ltd.; and "DAW-03" and "FB-105FD" manufactured by Denka Co., Ltd. (D) The average particle size of the inorganic filler material is not particularly limited, but preferably 10 μm or less, more preferably 5 μm or less, even more preferably 2 μm or less, even more preferably 1 μm or less, and particularly preferably 0.7 μm or less. (D) The lower limit of the average particle size of the inorganic filler material is not particularly limited, but preferably 0.01 μm or more, more preferably 0.05 μm or more, even more preferably 0.1 μm or more, and particularly preferably 0.2 μm or more. (D) The average particle size of the inorganic filler material can be determined according to the Mie scattering theory using laser diffraction and scattering methods. Specifically, the particle size distribution of the inorganic filler material can be prepared on a volume basis using a laser diffraction and scattering particle size distribution measuring device, and the median diameter can be used as the average particle size for measurement. The sample for testing can be prepared by weighing 100 mg of inorganic filler material and 10 g of methyl ethyl ketone into a tubular bottle and dispersing them ultrasonically for 10 minutes. The sample is measured using a laser diffraction particle size distribution measuring device, with the light source wavelengths set to blue and red. The particle size distribution of the inorganic filler material is measured using a flow cell method based on a volume reference, and the average particle size is calculated from the obtained particle size distribution as the median diameter. Examples of laser diffraction particle size distribution measuring devices include the "LA-960" manufactured by Horiba Manufacturing Co., Ltd. (D) The specific surface area of ​​the inorganic filler material, while not specifically limited, is preferably 0.1 m². 2 / g or higher, preferably 0.5m 2 / g or higher, preferably 1m 2 / g or above, with an optimal value of 3m 2 / g or more. (D) The upper limit of the specific surface area of ​​inorganic filler materials, although not specifically limited, is preferably 100m². 2 / g or less, preferably 70m 2 / g or less, preferably 50m 2 Below / g, the optimal value is 40m. 2 / g or less. The specific surface area of ​​the inorganic filler material was obtained by using a specific surface area measuring device (Macsorb HM-1210 manufactured by Mountech) to adsorb nitrogen gas on the surface of the sample according to the BET method, and then calculating the specific surface area using the BET multi-point method. (D) Inorganic filler materials are preferably surface-treated with a suitable surface treatment agent. Surface treatment improves the moisture resistance and dispersibility of (D) inorganic filler materials. Examples of surface treatment agents include vinyl silane coupling agents such as vinyltrimethoxysilane and vinyltriethoxysilane; epoxy silane coupling agents such as 2-(3,4-epoxycyclohexyl)ethyltrimethoxysilane, 3-epoxypropoxypropylmethyldimethoxysilane, 3-epoxypropoxypropyltrimethoxysilane, 3-epoxypropoxypropylmethyldiethoxysilane, and 3-epoxypropoxypropyltriethoxysilane; styrene silane coupling agents such as p-styrenetrimethoxysilane; and 3-methacryloxypropylmethyldimethoxysilane, 3-methacryloxypropyltriethoxysilane. Methacrylic silane coupling agents for methyltrimethoxysilane, 3-methacrylic propylmethyldiethoxysilane, 3-methacrylic propyltriethoxysilane, etc.; acryloxysilane coupling agents for 3-propenyl propyltrimethoxysilane, etc.; N-2-(aminoethyl)-3-aminopropylmethyldimethoxysilane, N-2-(aminoethyl)-3-aminopropyltrimethoxysilane, 3-aminopropyltrimethoxysilane, 3-aminopropyltriethoxysilane, 3-triethoxysilyl-N-(1,3-dimethyl-butylene)propylamine, N-phenyl-3- Amine-based silane coupling agents such as aminopropyltrimethoxysilane, N-phenyl-8-aminooctyltrimethoxysilane, and N-(vinylbenzyl)-2-aminoethyl-3-aminopropyltrimethoxysilane; isocyanurate-based silane coupling agents such as tri-(trimethoxysilylpropyl)isocyanurate; urea-based silane coupling agents such as 3-urea propyltrialkoxysilane; mercapto-based silane coupling agents such as 3-mercaptopropylmethyldimethoxysilane and 3-mercaptopropyltrimethoxysilane; isocyanates such as 3-isocyanate propyltriethoxysilane. These include silane coupling agents; anhydride-based silane coupling agents such as 3-trimethoxysilylpropyl succinic anhydride; silane coupling agents of various kinds; and non-silane coupling-alkoxysilane compounds such as methyltrimethoxysilane, dimethyldimethoxysilane, phenyltrimethoxysilane, methyltriethoxysilane, dimethyldiethoxysilane, phenyltriethoxysilane, n-propyltrimethoxysilane, n-propyltriethoxysilane, hexyltrimethoxysilane, hexyltriethoxysilane, octyltriethoxysilane, decyltrimethoxysilane, 1,6-bis(trimethoxysilyl)hexane, and trifluoropropyltrimethoxysilane. Furthermore, surface treatment agents can be used alone or in any combination of two or more in any ratio. Commercially available surface treatment agents include, for example, Shin-Etsu Chemical Co., Ltd.'s "KBM-1003" and "KBE-1003" (vinyl silane coupling agents); "KBM-303," "KBM-402," "KBM-403," "KBE-402," and "KBE-403" (epoxy silane coupling agents); "KBM-1403" (styrene-based silane coupling agent); and "KBM- 502, KBM-503, KBE-502, KBE-503 (methacrylic silane coupling agent); KBM-5103 (acrylic silane coupling agent); KBM-602, KBM-603, KBM-903, KBE-903, KBE-9103P, KBM-573, KBM-575 (amine silane coupling agent) Silane coupling agents; "KBM-9659" (isocyanurate-based silane coupling agent); "KBE-585" (urea-based silane coupling agent); "KBM-802", "KBM-803" (mercapto-based silane coupling agents); "KBE-9007N" (isocyanate-based silane coupling agent); "X-12-967C" (anhydride-based silane coupling agent); "KBM-13", "KBM- 22”, “KBM-103”, “KBE-13”, “KBE-22”, “KBE-103”, “KBM-3033”, “KBE-3033”, “KBM-3063”, “KBE-3063”, “KBE-3083”, “KBM-3103C”, “KBM-3066”, “KBM-7103” (non-silane coupled-alkoxysilane compound) etc. From the perspective of improving the dispersibility of inorganic fillers, the degree of surface treatment by the surface treatment agent is preferably controlled within a specified range. Specifically, it is preferable to surface treat 100% by mass of the inorganic filler with 0.2% to 5% by mass of the surface treatment agent, more preferably with 0.2% to 3% by mass, and even more preferably with 0.3% to 2% by mass. The degree of surface treatment by the surface treatment agent can be evaluated by the carbon content per unit surface area of ​​the inorganic filler. From the perspective of improving the dispersibility of the inorganic filler, the optimal carbon content per unit surface area is 0.02 mg / m². 2 The above is preferred, with 0.1 mg / m² being ideal. 2 The above is even better at 0.2 mg / m². 2 That's all. On the other hand, from the viewpoint of preventing an increase in the melt viscosity of the resin composition or the melt viscosity in sheet form, 1.0 mg / m³ is preferred. 2 The preferred value is 0.8 mg / m². 2 The following is even better: 0.5 mg / m² 2 the following. (D) The carbon content per unit surface area of ​​the inorganic filler material can be determined after the surface-treated inorganic filler material has been washed with a solvent (e.g., methyl ethyl ketone (MEK)). Specifically, as a solvent, the inorganic filler material surface-treated with a sufficient amount of MEK is ultrasonically washed at 25°C for 5 minutes. The supernatant is removed, the solid components are dried, and the carbon content per unit surface area of ​​the inorganic filler material is determined using a carbon analyzer. A carbon analyzer such as the "EMIA-320V" manufactured by Horiba Corporation can be used. While the content of (D) inorganic filler material in the resin composition is not particularly limited, when the non-volatile component in the resin composition is defined as 100% by mass, it may be 98% by mass or less, 95% by mass or less, 90% by mass or less, or 85% by mass or less. While the lower limit of the content of (D) inorganic filler material in the resin composition is not particularly limited, when the non-volatile component in the resin composition is defined as 100% by mass, it may be 0% by mass or more, 1% by mass or more, 5% by mass or more, 10% by mass or more, preferably 20% by mass or more, 30% by mass or more, more preferably 40% by mass or more, 50% by mass or more, even more preferably 55% by mass or more, 60% by mass or more, and particularly preferably 65% ​​by mass or more, 70% by mass or more. <(E) Free Radical Polymerizing Compound> The resin composition of the present invention may further include (E) free radical polymerizing compound as an optional component. One type of (E) free radical polymerizing compound may be used alone, or two or more types may be used in any combination. (E) A free radical polymerizable compound, for example, a compound having a free radical polymerizable unsaturated group. While not particularly limited, the free radical polymerizable unsaturated group is preferably an vinyl unsaturated group having a carbon-carbon double bond at the end or internally, provided free radical polymerization is possible. Specifically, it can be an allyl, 3-cyclohexenyl, or other unsaturated aliphatic group; an aromatic group containing an unsaturated aliphatic group such as p-vinylphenyl, m-vinylphenyl, or styryl; or an α,β-unsaturated carbonyl group such as acrylonitrile, methacryl, maleic acid, or fumarate. (E) The free radical polymerizable compound preferably has one or more free radical polymerizable unsaturated groups, more preferably two or more. As (E) radical polymerizable compounds, a wide range of well-known radical polymerizable compounds can be used, although they are not specifically limited to any particular type. Examples include (E-1) maleimine radical polymerizable compounds, (E-2) vinylphenyl radical polymerizable compounds, and (E-3) (meth)acrylyl radical polymerizable compounds. <(E-1) Maleimide-based free radical polymerizable compound> An (E-1) maleimide-based free radical polymerizable compound is an organic compound containing one or more (preferably two or more) maleimide groups (2,5-dihydro-2,5-dioxo-1H-pyrrole-1-yl) in one molecule. The (E-1) maleimide-based free radical polymerizable compound can be used alone or in combination of two or more in any ratio. The (E-1) maleimide-based free radical polymerizable compound is preferably a maleimide compound containing, for example, at least one selected from (E-1-1) maleimide-terminated polyimide compounds, (E-1-2) aromatic maleimide compounds, and (E-1-3) aliphatic maleimide compounds. <(E-1-1) Maleimide-terminated polyimide compounds> (E-1-1) maleimide-terminated polyimide compounds are chain-like polyimides (chain polymers containing two or more amide groups) with maleimide groups at both ends. (E-1-1) maleimide-terminated polyimide compounds can be, for example, components that can be obtained by amide-imidization of a component containing a diamine compound, maleic anhydride, and tetracarboxylic dianhydride. In one embodiment, (E-1-1) maleimide-terminated polyimide compound is, for example, a maleimide-terminated polyimide compound represented by the following formula (2). [In the formula, A] 1 Each of these groups independently represents a divalent organogroup (preferably a divalent ring (e.g., an aromatic ring or a non-aromatic ring) containing an organogroup) composed of two or more (e.g., 2-3000, 2-1000, 2-100, or 2-50) skeletal atoms selected from carbon, oxygen, nitrogen, and sulfur atoms; A 2 Each of these can be independently represented as a divalent organogroup composed of one or more skeletal atoms selected from single bonds, or carbon, oxygen, nitrogen, and sulfur atoms (e.g., 1–3000, 1–1000, 1–100, 1–50, respectively); R p and R qEach of the following represents a substituent independently; n represents an integer greater than or equal to 1 (preferably an integer from 1 to 100, more preferably an integer from 1 to 50, and especially preferably an integer from 1 to 20); m represents 0 or 1 independently; p and q represent integers from 0 to 3 independently (preferably 0)). A 1 It is preferable to represent the two-valent basis separately as shown in the following formula (Y1). [In the formula, Y] 11 Each can be represented independently as a single bond, an alkyl group, or an alkenyl group; Y 12 Each of these can be represented independently as a single bond, alkyl group, alkenyl group, -O-, -CO-, -S-, -SO-, -SO 2-, -CONH-, -NHCO-, -COO- or -OCO-; ring Z 1 Each can be independently represented as a non-aromatic ring that may have substituents or an aromatic ring that may have substituents; y1 represents an integer of 0 or more (preferably an integer of 0 or 1 to 5); * represents a bonding site. The term "alkyl group" refers to a divalent aliphatic saturated hydrocarbon group, either straight-chain or branched-chain. Alkyl groups are preferably alkyl groups with 1 to 14 carbon atoms. Examples of alkyl groups include straight-chain alkyl groups such as methylene, ethyl alkyl group, trimethylene, tetramethylene, pentamethylene, hexamethylene, heptamethylene, octamethylene, nonamethylene, and decamethylene; ethyl alkyl group (-CH(CH) 3)-), Propylene(-CH(CH) 2CH 3)-), Isopropylidene (-C(CH) 3) 2-), Ethylmethylmethylene (-C(CH) 3)(CH 2CH 3)-), diethylmethylene (-C (CH 2CH 3) 2-), branched alkyl groups such as 2-methyltetramethylene, 2,3-dimethyltetramethylene, 1,3-dimethyltetramethylene, 2-methylpentamethylene, 2,2-dimethylpentamethylene, 2,4-dimethylpentamethylene, 1,3,5-methylpentamethylene, 2-methylhexamethylene, 2,2-dimethylhexamethylene, 2,4-dimethylhexamethylene, 1,3,5-trimethylhexamethylene, 2,2,4-trimethylhexamethylene, and 2,4,4-trimethylhexamethylene. An alkenyl group refers to a divalent aliphatic unsaturated hydrocarbon group having at least one carbon-carbon double bond in a straight or branched chain. Preferably, the alkenyl group has 2 to 14 carbon atoms. Specific examples of alkenyl groups include alkyl groups formed by replacing any carbon-carbon single bond in the specifically exemplified group with a carbon-carbon double bond. The ring Z of equation (Y1) 1 The aromatic ring system represented is the same as that represented by ring B or ring C in formula (1). Ring Z in formula (Y1) 1 The term "non-aromatic ring" refers to a ring other than an aromatic ring, including monocyclic non-aromatic rings and condensed non-aromatic rings composed of two or more monocyclic non-aromatic rings. While the non-aromatic ring can be a carbocyclic or heterocyclic ring, it is preferably a carbocyclic ring in one embodiment. The non-aromatic ring can be a saturated or unsaturated ring, but it is preferably a saturated ring in one embodiment. Examples of non-aromatic rings include cycloalkanes; cycloalkenes; monocyclic non-aromatic heterocycles such as pyrrolidine rings, tetrahydrofuran rings, dioxane rings, and tetrahydropyran rings (preferably 3 to 10 members); and condensed non-aromatic carbocyclic rings of two or more elements such as norbornene rings, decahydronaphthalene rings, adamantane rings, and tetrahydrodicyclopentadiene rings (preferably 8 to 15 members). As specific examples of divalent bases represented by formula (Y1), although not specifically limited, the following divalent organic groups can be listed: [In the formula, * indicates the bonding location]. A 2 It is better to represent the divalent base (including single bonds) separately as shown by equation (Y2). [In the formula, Y] 2 Each of these can be represented independently as a single bond, alkyl group, alkenyl group, -O-, -CO-, -S-, -SO-, -SO 2-, -CONH-, -NHCO-, -COO- or -OCO-; ring Z 2 Each can independently represent a non-aromatic ring that may have substituents, or an aromatic ring that may have substituents; y2 represents an integer of 0 or more (preferably an integer of 0 or 1 to 5); * represents the bonding site of the ring Z in formula (Y2). 2 The aromatic ring and non-aromatic ring represented by them are respectively the aromatic ring represented by ring B or ring C in formula (1) and ring Z in formula (Y1). 1 The non-aromatic rings are the same. As a specific example of the divalent basis represented by formula (Y2), although not specifically limited, except for -CH 2-、-CH(CH 3) -, -CH (CH 2CH 3)-、-C(CH 3) 2-、-C(CH 3)(CH 2CH 3)-、-C (CH 2CH 3) 2-, -O-, -CO-, -S-, -SO- and -SO 2-, or the following examples of divalent organic groups can also be listed: [In the formula, * indicates the bonding location]. (E-1-1) The weight average molecular weight (Mw) of the maleimide-terminated polyimide compound is preferably 500 to 50,000, more preferably 1,000 to 20,000. (E-1-1) The functional group equivalent of the maleimide group in the maleimide-terminated polyimide compound is preferably 300 g / eq. to 20,000 g / eq., more preferably 500 g / eq. to 10,000 g / eq. Commercially available products that are (E-1-1) maleimide-terminated polyimide compounds include, for example, "BMI-1500", "BMI-1700", "BMI-3000J", "BMI-6000", and "BMI-6100" manufactured by Designer MOLECULES. <(E-1-2) Aromatic Maleimine Compounds> (E-1-2) Aromatic maleimine compounds are maleimine compounds that are not part of (E-1-1), meaning maleimine compounds containing one or more aromatic rings and two or more maleimine groups per molecule. In one embodiment, (E-1-2) aromatic maleimine compounds may be addition-polymerized aromatic maleimine compounds. (E-1-2) Aromatic maleimine compounds, which may be maleimine compounds with one aromatic ring such as N,N'-1,3-epenylenyl dimaleimine and N,N'-1,4-epenylenyl dimaleimine, or maleimine compounds with two or more aromatic rings, but are preferably maleimine compounds with two or more aromatic rings. In one embodiment, the aromatic maleimide compound (E-1-2) is, for example, a maleimide compound represented by formula (3). [In the formula, R] u Each substituent is represented independently; Y 3 Each of these can be represented independently as a single bond, alkyl group, alkenyl group, -O-, -CO-, -S-, -SO-, -SO 2-, -CONH-, -NHCO-, -COO-, or -OCO- (preferably single bond or extended alkyl group); cyclo-Z 3 Each of the following can be independently represented as a non-aromatic ring that may have substituents, or an aromatic ring that may have substituents (preferably an aromatic ring that may have substituents, especially a benzene ring that may have substituents); s represents an integer of 1 or more (preferably an integer of 1 to 100, more preferably an integer of 1 to 50, and even more preferably an integer of 1 to 20); t represents an integer of 0 or 1 or more; u represents an integer of 0 to 2 (preferably 0)] and especially as a maleimine compound represented by formula (3'). [In the formula, s is the same as in formula (3)] The ring Z in formula (3) 3 The aromatic ring and non-aromatic ring represented by them are respectively the aromatic ring represented by ring B or ring C in formula (1) and ring Z in formula (Y1). 1 The non-aromatic rings are the same. In one embodiment, the (E-1-2) aromatic maleimide compound is preferably a phenolic varnish-type polymaleimide comprising repeating units comprising a combination of an N-phenylmaleimide skeleton and a methylene skeleton; more preferably, it comprises an aralkylphenolic varnish-type polymaleimide comprising repeating units comprising a combination of an aromatic carbocyclic skeleton and a methylene skeleton alternating between N-phenylmaleimide skeleton and a methylene skeleton; and even more preferably, it comprises a biphenyl aralkylphenolic varnish-type polymaleimide comprising repeating units comprising a combination of an N-phenylmaleimide skeleton and a methylene skeleton and a biphenyl skeleton and a methylene skeleton alternating between repeating units. (E-1-2) The weight-average molecular weight (Mw) of the aromatic maleimide compound is preferably 150 to 5000, more preferably 300 to 2500. (E-1-2) The functional group equivalent of the maleimide group in the aromatic maleimide compound is preferably 50 g / eq. to 2000 g / eq., more preferably 100 g / eq. to 1000 g / eq., even more preferably 150 g / eq. to 500 g / eq., and particularly preferably 200 g / eq. to 300 g / eq. Commercially available products of (E-1-2) aromatic maleimide compounds include, for example, "MIR-3000-70MT" manufactured by Nippon Kayaku Co., Ltd.; "BMI-50P" manufactured by K.I. Chemical Co., Ltd.; "BMI-1000", "BMI-1000H", "BMI-1100", "BMI-1100H", "BMI-4000", and "BMI-5100" manufactured by Daiwa Chemical Industries Co., Ltd.; "BMI-4,4'-BPE", "BMI-70", and "BMI-80" manufactured by K.I. Chemical Co., Ltd., etc. <(E-1-3) Aliphatic Maleimine Compounds> The term (E-1-3) aliphatic maleimine compounds refers to compounds that use a non-aromatic hydrocarbon (preferably with 2 to 50 carbon atoms) as the basic skeleton and have two or more (preferably two) maleimine groups in one molecule. In one embodiment, (E-1-3) is an aliphatic maleimide compound, for example, a maleimide compound represented by the following formula (4). [In the formula, Y] 4 Each of these can be independently represented as a single bond, an alkyl group, or an alkenyl group (preferably an alkyl group or an alkenyl group); cyclo(Z) 4 Each of the following independently represents a non-aromatic ring that may have a group selected from alkyl and alkenyl groups (preferably a cycloalkane ring or a cycloalkene ring that may have a group selected from alkyl and alkenyl groups); y4 represents an integer of 0 or more than 1 (preferably an integer of 1 or more, especially 1)] ring Z of formula (4) 4The non-aromatic ring system represented by the ring Z in formula (Y1) 1 The non-aromatic rings are the same. Specific examples of (E-1-3) aliphatic maleimide compounds include chain-like aliphatic bismaleimide compounds such as N,N'-ethylenedimaleimide, N,N'-tetramethylenedimaleimide, and N,N'-hexamethylenedimaleimide; alicyclic bismaleimide compounds such as 1-maleimide-3-maleimidemethyl-3,5,5-trimethylcyclohexane (IPBM), 1,1'-(cyclohexane-1,3-dimethylbis(1H-pyrrole-2,5-dione) (CBM), and 1,1'-(4,4'-methylenebis(cyclohexane-4,1-diyl))bis(1H-pyrrole-2,5-dione) (MBCM); and bismaleimides containing a dimer acid backbone. The term "bismaleimide containing a dimer acid backbone" refers to a bismaleimide compound in which the two terminal carboxyl groups (-COOH) of a dimer acid are replaced with maleimide groups or maleimide methyl groups (2,5-dihydro-2,5-dioxo-1H-pyrrole-1-ylmethyl). Dimer acids are known compounds obtained by diluting unsaturated fatty acids (preferably with 11 to 22 carbons, especially with 18 carbons), and their industrial manufacturing process is almost standardized in the industry. Dimer acids can be readily obtained by using 36-carbon dimers obtained from diluting particularly inexpensive and readily available 18-carbon unsaturated fatty acids such as oleic acid and linoleic acid as the main component. Furthermore, depending on the manufacturing method and the degree of purification, dimers may contain any amount of monomeric acids, trimer acids, or other polymeric fatty acids. Furthermore, although double bonds remain after the polymerization reaction of unsaturated fatty acids, in this specification, hydrogen additions that reduce the degree of unsaturation are also included in dimer acids, as they are further subjected to hydrogen addition reactions. (E-1-3) The molecular weight of the aliphatic maleimine compound is preferably 150 to 5000, more preferably 300 to 1000. (E-1-3) The functional group equivalent of the maleimine group in the aliphatic maleimine compound is preferably 50 g / eq. to 2000 g / eq., more preferably 100 g / eq. to 1000 g / eq., even more preferably 200 g / eq. to 600 g / eq., and particularly preferably 300 g / eq. to 400 g / eq. Commercially available products that are (E-1-3) aliphatic maleimide compounds include, for example, "BMI-689" manufactured by Designer Molcules. <(E-2) Vinylphenyl-based free radical polymerizable compound> The (E-2) vinylphenyl-based free radical polymerizable compound is a free radical polymerizable compound having vinylphenyl groups. Preferably, each molecule of the vinylphenyl-based free radical polymerizable compound has two or more vinylphenyl groups. The (E-2) vinylphenyl-based free radical polymerizable compound is preferably a vinylbenzyl-modified polyphenylene ether having a vinylbenzyl group and a polyphenylene ether backbone, particularly a vinylbenzyl-modified polyphenylene ether having a repeating unit represented by formula (5) (the number of repeating units is preferably 2 to 300, more preferably 2 to 100) and a vinylbenzyl group (especially a vinylbenzyl-modified polyphenylene ether with the hydrogen atoms of the two terminal hydroxyl groups of the polyphenylene ether replaced by vinylbenzyl groups). [In the formula, R] 11 R 12 R 13 and R 14 Each of the following can be independently represented as a hydrogen atom or a substituent (preferably a hydrogen atom or an alkyl group, especially a hydrogen atom or a methyl group)). The number average molecular weight of the (E-2) vinylphenyl free radical polymerizable compound is preferably 500 to 10,000, more preferably 700 to 5,000. The functional group equivalent of the vinyl group in the (E-2) vinylphenyl free radical polymerizable compound is preferably 200 g / eq. to 3,000 g / eq., more preferably 300 g / eq. to 2,000 g / eq. Commercially available (E-2) vinylphenyl free radical polymerizable compounds include, for example, "OPE-2St 1200" and "OPE-2St 2200" (vinyl benzyl modified polyphenylene ether) manufactured by Mitsubishi Gas Chemical Co., Ltd. <(E-3)(meth)acrylic acid-based free radical polymerizable compounds> (E-3)(meth)acrylic acid-based free radical polymerizable compounds are free radical polymerizable compounds having an acrylonitrile group and / or a methacrylic acid group. Preferably, each molecule of an (E-3)(meth)acrylic acid-based free radical polymerizable compound has two or more acrylonitrile groups and / or a methacrylic acid groups. (E-3) (meth)acrylic acid is a free radical polymerizable compound, preferably a (meth)acrylic acid modified polyphenylene ether having an acrylonitrile and / or methacrylic acid and a polyphenylene ether backbone, particularly a repeating unit represented by formula (6) (the number of repeating units is preferably 2 to 300, more preferably 2 to 100) and a (meth)acrylic acid modified polyphenylene ether having an acrylonitrile and / or methacrylic acid (especially a (meth)acrylic acid modified polyphenylene ether in which the hydrogen atoms of the two terminal hydroxyl groups of the polyphenylene ether are replaced with acrylonitrile and / or methacrylic acid at the two terminal (meth)acrylic acid) groups. [In the formula, R] 21 R 22 R 23 and R 24 Each of the following can be independently represented as a hydrogen atom or a substituent (preferably a hydrogen atom or an alkyl group, especially a hydrogen atom or a methyl group)). The number-average molecular weight of the (E-3)(meth)acrylic acid-based free radical polymerizable compound is preferably 500 to 10,000, more preferably 700 to 5,000. The functional equivalent of the acrylonitrile and methacrylic acid groups in the (E-3)(meth)acrylic acid-based free radical polymerizable compound is preferably 200 g / eq. to 3,000 g / eq., more preferably 300 g / eq. to 2,000 g / eq. Commercially available (E-3)methacrylic acid-based free radical polymerizable compounds include, for example, "SA9000" and "SA9000-111" (methacrylic acid-modified polyphenylene ether) manufactured by SABIC INNOVATIVE PLASTICS. While the content of (E) free radical polymerizable compounds in the resin composition is not particularly limited, when the non-volatile components in the resin composition are defined as 100% by mass, it is preferably 40% by mass or less, more preferably 20% by mass or less, even more preferably 10% by mass or less, even more preferably 5% by mass or less, and particularly preferably 3% by mass or less. While the lower limit of the content of (E) free radical polymerizable compounds in the resin composition is not particularly limited, when the non-volatile components in the resin composition are defined as 100% by mass, it can be, for example, 0% by mass or more, 0.001% by mass or more, preferably 0.01% by mass or more, more preferably 0.05% by mass or more, even more preferably 0.1% by mass or more, and particularly preferably 0.5% by mass or more. <(F) Hardener> The resin composition of the present invention may include (F) hardener as an optional component. (F) hardener has the function of hardening the resin composition (especially the function of reacting with (B) epoxy resin and / or (E) free radical polymerizable compound to harden). Herein, (F) hardener is a component that is not part of components (A) to (E). While not particularly limited, the (F) curing agent can include, for example, (F-1) carbodiimide-based curing agents, (F-2) phenolic and naphthol-based curing agents, (F-3) acid anhydride-based curing agents, (F-4) amine-based curing agents, (F-5) benzoxazine-based curing agents, (F-6) cyanate ester-based curing agents, and (F-7) thiol-based curing agents. The (F) curing agent can be used alone or in combination of two or more. In one embodiment, the (F) curing agent preferably comprises one or more curing agents selected from the group consisting of (F-1) carbodiimide-based curing agents and (F-2) phenolic and naphthol-based curing agents, and particularly preferably comprises (F-1) carbodiimide-based curing agents. In one embodiment, from the viewpoint that the resin composition of the present invention particularly significantly achieves the desired effects of the present invention, it is particularly preferred to include (F-1) carbodiimide-based curing agents. As a (F-1) carbodiimide-based curing agent, it is a curing agent having one or more carbodiimide structures within one molecule, preferably having two or more. Examples include aliphatic carbodiimides such as tetramethylene-bis(t-butylcarbodiimide) and cyclohexane-bis(methylene-t-butylcarbodiimide); aromatic carbodiimides such as pentylene-bis(xylylcarbodiimide); polyhexamethylenecarbodiimide, polytrimethylhexamethylenecarbodiimide, polycyclohexylcarbodiimide, poly(methylene dicyclohexylcarbodiimide), and poly(isophoronecarbodiimide). Aliphatic polycarbodiimides; poly(phenylcarbodiimide), poly(naphthylcarbodiimide), poly(methylphenylcarbodiimide), poly(methyldiisopropylphenylcarbodiimide), poly(triethylphenylcarbodiimide), poly(diethylphenylcarbodiimide), poly(triisopropylphenylcarbodiimide), poly(diisopropylphenylcarbodiimide), poly(dimethylphenylcarbodiimide), poly(tetramethyldimethylphenylcarbodiimide), poly(methylenediphenylcarbodiimide), poly[methylenebis(methylphenyl)carbodiimide] and other aromatic polycarbodiimides. Commercially available (F-1) carbodiimide curing agents include, for example, "Carbodilite V-02B", "Carbodilite V-03", "Carbodilite V-04K", "Carbodilite V-07" and "Carbodilite V-09" manufactured by Nisshinbo Chemical Co., Ltd.; and "Stabaxol P", "Stabaxol P400" and "HIKAZIL 510" manufactured by LANXESS Co., Ltd. From the viewpoint of heat resistance and water resistance, phenolic curing agents or naphthol curing agents with a phenolic varnish structure are preferred as (F-2) phenolic curing agents and naphthol curing agents. Furthermore, from the viewpoint of adhesion to the substrate, nitrogen-containing phenolic curing agents or nitrogen-containing naphthol curing agents are preferred, and phenolic curing agents or naphthol curing agents containing a triazine skeleton are even more preferred. Among these, from the viewpoint of highly satisfying heat resistance, water resistance, and adhesion, phenolic varnish resins containing a triazine skeleton are preferred. Specific examples of (F-2) phenolic and naphthol-based curing agents include Meiwa Chemical Co., Ltd.'s "MEH-7700", "MEH-7810", "MEH-7851", Nippon Kayaku Co., Ltd.'s "NHN", "CBN", "GPH", Nippon Steel Chemical Materials Co., Ltd.'s "SN-170", "SN-180", "SN-190", "SN-475", "SN-485", "SN-495", "SN-375", "SN-395", DIC Co., Ltd.'s "LA-7052", "LA-7054", "LA-3018", "LA-3018-50P", "LA-1356", "TD2090", "TD-2090-60M", etc. As (F-3) anhydride-based curing agents, examples include curing agents having one or more anhydride groups per molecule, preferably curing agents having two or more anhydride groups per molecule. Specific examples of (F-3) anhydride-based curing agents include phthalic anhydride, tetrahydrophthalic anhydride, hexahydrophthalic anhydride, methyltetrahydrophthalic anhydride, methylhexahydrophthalic anhydride, methylnadic anhydride, hydrogenated methylnadic anhydride, trialkyltetrahydrophthalic anhydride, dodecenylsuccinic anhydride, 5-(2,5-dioxotetrahydro-3-furanyl)-3-methyl-3-cyclohexene-1,2-dicarboxylic anhydride, trimellitic anhydride, pyrocarbonate anhydride, benzophenone tetracarboxylic anhydride, etc. Polymer anhydrides such as biphenyltetracarboxylic acid dianhydride, naphthalenetetracarboxylic acid dianhydride, oxydiphthalic acid dianhydride, 3,3'-4,4'-diphenyltetracarboxylic acid dianhydride, 1,3,3a,4,5,9b-hexahydro-5-(tetrahydro-2,5-dioxo-3-furanyl)-naphtho[1,2-C]furan-1,3-dione, ethylene glycol bis(anhydrotrimellitate), and styrene-maleic acid resin copolymerized with styrene and maleic acid. Commercially available (F-3) anhydride-based hardeners include: "HNA-100", "MH-700", "MTA-15", "DDSA", "OSA" manufactured by New Japan Rika Co., Ltd.; "YH-306" and "YH-307" manufactured by Mitsubishi Chemical Co., Ltd.; and "HN-2200" and "HN-5500" manufactured by Hitachi Chemical Co., Ltd. As (F-4) amine-based curing agents, examples include curing agents having one or more amine groups per molecule, preferably two or more, such as aliphatic amines, polyether amines, alicyclic amines, aromatic amines, etc., wherein, from the viewpoint of achieving the desired effect of the present invention, aromatic amines are preferred. (F-4) amine-based curing agents are preferably primary or secondary amines, more preferably primary amines. Specific examples of (F-4) amine-based curing agents include 4,4'-methylenebis(2,6-dimethylaniline), 4,4'-diaminodiphenylmethane, 4,4'-diaminodiphenyl sulfone, 3,3'-diaminodiphenyl sulfone, m-phenylenediamine, m-diphenylenediamine, diethyltoluenediamine, 4,4'-diaminodiphenyl ether, 3,3'-dimethyl-4,4'-diaminobiphenyl, 2,2'-dimethyl-4,4'-diaminobiphenyl, 3,3'-dihydroxybenzidine, and 2,2'-bis(2,6-dimethylaniline). (3-amino-4-hydroxyphenyl)propane, 3,3-dimethyl-5,5-diethyl-4,4-diphenylmethanediamine, 2,2-bis(4-aminophenyl)propane, 2,2-bis(4-(4-aminophenoxy)phenyl)propane, 1,3-bis(3-aminophenoxy)benzene, 1,3-bis(4-aminophenoxy)benzene, 1,4-bis(4-aminophenoxy)benzene, 4,4'-bis(4-aminophenoxy)biphenyl, bis(4-(4-aminophenoxy)phenyl)guanidine, bis(4-(3-aminophenoxy)phenyl)guanidine, etc. (F-4) Amine-based hardeners can be commercially available products, such as SEIKA's "SEIKACURE-S", Nippon Kayaku Co., Ltd.'s "KAYABOND C-200S", "KAYABOND C-100", "Kayahard AA", "Kayahard AB", "Kayahard AS", and Mitsubishi Chemical Co., Ltd.'s "EPIKURE W". Specific examples of (F-5) benzoxazine hardeners include "JBZ-OP100D" and "ODA-BOZ" manufactured by JFE Chemical Co., Ltd.; "HFB2006M" manufactured by Showa Polymer Co., Ltd.; and "Pd" and "Fa" manufactured by Shikoku Chemical Co., Ltd. Examples of (F-6) cyanate-based curing agents include bisphenol A dicyanate, polyphenol cyanate (oligo(3-methylene-1,5-phenyl cyanate)), 4,4'-methylene bis(2,6-dimethylphenyl cyanate), 4,4'-ethylene diphenyl dicyanate, hexafluorobisphenol A dicyanate, 2,2-bis(4-cyanate)phenylpropane, 1,1-bis(4-cyanate phenylmethane), bis(4-cyanate-3,5-dimethylphenyl)methane, 1,3-bis(4-cyanate phenyl-1-(methylethylene))benzene, bis(4-cyanate phenyl) sulfide, and bis(4-cyanate phenyl) ether, etc., as well as multifunctional cyanate resins derived from phenolic varnishes and cresol varnishes, and prepolymers of some of these cyanate resins that have been triazineized. Specific examples of (F-6) cyanate-based curing agents include Lonza Japan's "PT30" and "PT60" (both phenolic varnish-type multifunctional cyanate resins), "BA230", and "BA230S75" (prepolymers that are part or all of the triazine-modified trimer of bisphenol A dicyanate). Examples of (F-7) thiol-based curing agents include trimethylolpropane benzoate (3-mercaptopropionate), pentaerythritol tetramethylol benzoate (3-mercaptobutyrate), and benzoate (3-mercaptopropyl) isocyanurate. (F) The reactive equivalent of the hardener is preferably 50 g / eq. to 3000 g / eq., more preferably 100 g / eq. to 1000 g / eq., even more preferably 100 g / eq. to 500 g / eq., and most preferably 100 g / eq. to 300 g / eq. The reactive equivalent refers to the mass of hardener per 1 equivalent of the reactive base. While the content of (F) curing agent in the resin composition is not particularly limited, when the non-volatile component in the resin composition is defined as 100% by mass, it is preferably 15% by mass or less, more preferably 10% by mass or less, even more preferably 5% by mass or less, and particularly preferably 3% by mass or less. While the lower limit of the content of (F) curing agent in the resin composition is not particularly limited, when the non-volatile component in the resin composition is defined as 100% by mass, it can be, for example, 0% by mass or more, 0.01% by mass or more, 0.1% by mass or more, 1% by mass or more, 2% by mass or more, etc. <(G) Curing Accelerator> The resin composition of the present invention may contain (G) curing accelerator as an optional component. Examples of curing accelerators include (G-1) imidazole-based curing accelerators, (G-2) phosphorus-based curing accelerators, (G-3) urea-based curing accelerators, (G-4) guanidine-based curing accelerators, (G-5) metal-based curing accelerators, and (G-6) amine-based curing accelerators. In one embodiment, the (G) curing accelerator preferably includes (G-1) imidazole-based curing accelerators. The (G) curing accelerators can be used alone or in combination of two or more. Examples of (G-1) imidazole-based hardening accelerators include 2-methylimidazolium, 2-undecylimidazolium, 2-heptadecylimidazolium, 1,2-dimethylimidazolium, 2-ethyl-4-methylimidazolium, 1,2-dimethylimidazolium, 2-ethyl-4-methylimidazolium, 2-phenylimidazolium, 2-phenyl-4-methylimidazolium, 1-benzyl-2-methylimidazolium, 1-benzyl-2-phenylimidazolium, 1-cyanoethyl-2-methylimidazolium, 1-cyanoethyl-2-undecylimidazolium, 1-cyanoethyl-2-ethyl-4-methylimidazolium, 1-cyanoethyl-2-phenylimidazolium, 1-cyanoethyl-2-undecylimidazolium trimellitate, 1-cyanoethyl-2-phenylimidazolium trimellitate, 2,4-diamino-6-[2'-methylimidazolyl-(1')]- Imidazole compounds of ethyl-s-triazine, 2,4-diamino-6-[2'-undecylimidazolyl-(1')]-ethyl-s-triazine, 2,4-diamino-6-[2'-ethyl-4'-methylimidazolyl-(1')]-ethyl-s-triazine, 2,4-diamino-6-[2'-methylimidazolyl-(1')]-ethyl-s-triazine isocyanuric acid adduct, 2-phenylimidazolyl isocyanuric acid adduct, 2-phenyl-4,5-dihydroxymethylimidazolium, 2-phenyl-4-methyl-5-hydroxymethylimidazolium, 2,3-dihydro-1H-pyrrole[1,2-a]benzo(Benz)imidazolium, 1-dodecyl-2-methyl-3-benzyl chloride imidazolyl, 2-methylimidazoline, 2-phenylimidazoline, etc., and adducts of imidazolium compounds with epoxy resins. As a (G-1) imidazole hardening accelerator, commercially available products can be used, such as "1B2PZ", "2MZA-PW", and "2PHZ-PW" manufactured by Shikoku Chemical Industry Co., Ltd., and "P200-H50" manufactured by Mitsubishi Chemical Co., Ltd. Examples of (G-2) phosphorus-based curing accelerators include tetrabutylphosphonium bromide, tetrabutylphosphonium chloride, tetrabutylphosphonium acetate, tetrabutylphosphonium decanoate, tetrabutylphosphonium laurate, bis(tetrabutylphosphonium)pyromellitic ester, tetrabutylphosphonium hydrogen hexahydrophthalate, tetrabutylphosphonium 2,6-bis[(2-hydroxy-5-methylphenyl)methyl]-4-methylphenolate (Phenolate), di-tert-butylmethylphosphonium tetraphenylboronic acid ester, and other aliphatic phosphonium salts; methyltriphenylphosphonium bromide, ethyltriphenylphosphonium bromide, propyltriphenylphosphonium bromide, butyltriphenylphosphonium bromide, benzyltriphenylphosphonium chloride, tetraphenylphosphonium bromide, and p-toluene. Aromatic phosphonium salts of triphenylphosphonium tetra-p-tolylborate, tetraphenylphosphonium tetraphenylborate, tetraphenylphosphonium tetrap-tolylborate, triphenylethylphosphonium tetraphenylborate, tris(3-methylphenyl)ethylphosphonium tetraphenylborate, tris(2-methoxyphenyl)ethylphosphonium tetraphenylborate, (4-methylphenyl)triphenylphosphonium thiocyanate, tetraphenylphosphonium thiocyanate, butyltriphenylphosphonium thiocyanate, etc.; aromatic phosphine-borane complexes of triphenylphosphine-triphenylborane, etc.; aromatic phosphine-quinone addition reactants of triphenylphosphine-p-benzoquinone addition reactants, etc.; tributylphosphine, tri-tert-butylphosphine, trioctylphosphine, di-tert-butylphosphine, etc. Aliphatic phosphines such as butyl(2-butenyl)phosphine, di-tert-butyl(3-methyl-2-butenyl)phosphine, and tricyclohexylphosphine; dibutylphenylphosphine, di-tert-butylphenylphosphine, methyldiphenylphosphine, ethyldiphenylphosphine, butyldiphenylphosphine, diphenylcyclohexylphosphine, triphenylphosphine, tri-o-tolylphosphine, tri-m-tolylphosphine, tri-p-tolylphosphine, tris(4-ethylphenyl)phosphine, tris(4-propylphenyl)phosphine, tris(4-isopropylphenyl)phosphine, tris(4-butylphenyl)phosphine, tris(4-tert-butylphenyl)phosphine, tris(2,4-dimethylphenyl)phosphine, and tris(2,5-dimethylphenyl)phosphine. Aromatic phosphines, including phosphine, triphenylphosphine (2,6-dimethylphenyl)phosphine, triphenylphosphine (3,5-dimethylphenyl)phosphine, triphenylphosphine (2,4,6-trimethylphenyl)phosphine, triphenylphosphine (2,6-dimethyl-4-ethoxyphenyl)phosphine, triphenylphosphine (2-methoxyphenyl)phosphine, triphenylphosphine (4-methoxyphenyl)phosphine, triphenylphosphine (4-ethoxyphenyl)phosphine, triphenylphosphine (4-tert-butoxyphenyl)phosphine, diphenyl-2-pyridylphosphine, 1,2-bis(diphenylphosphino)ethane, 1,3-bis(diphenylphosphino)propane, 1,4-bis(diphenylphosphino)butane, 1,2-bis(diphenylphosphino)acetylene, and 2,2'-bis(diphenylphosphino)diphenyl ether. Examples of (G-3) urea-based hardening accelerators include: aliphatic dimethylureas such as 1,1-dimethylurea; 1,1,3-trimethylurea, 3-ethyl-1,1-dimethylurea, 3-cyclohexyl-1,1-dimethylurea, and 3-cyclooctyl-1,1-dimethylurea; 3-phenyl-1,1-dimethylurea, 3-(4-chlorophenyl)-1,1-dimethylurea, 3-(3,4-dichlorophenyl)-1,1-dimethylurea, 3-(3-chloro-4-methylphenyl)-1,1-dimethylurea, 3-(2-methylphenyl)-1,1-dimethylurea, 3-(4-methylphenyl)-1,1-dimethylurea, and 3-(3,4-dimethylphenyl) Aromatic dimethylureas such as 1,1-dimethylurea, 3-(4-isopropylphenyl)-1,1-dimethylurea, 3-(4-methoxyphenyl)-1,1-dimethylurea, 3-(4-nitrophenyl)-1,1-dimethylurea, 3-[4-(4-methoxyphenoxy)phenyl]-1,1-dimethylurea, 3-[4-(4-chlorophenoxy)phenyl]-1,1-dimethylurea, 3-[3-(trifluoromethyl)phenyl]-1,1-dimethylurea, N,N-(1,4-epenylphenyl)bis(N',N'-dimethylurea), N,N-(4-methyl-1,3-epenylphenyl)bis(N',N'-dimethylurea)[toluenebisdimethylurea], etc. Examples of (G-4) guanidine-based hardening accelerators include dicyandiamide, 1-methylguanidine, 1-ethylguanidine, 1-cyclohexylguanidine, 1-phenylguanidine, 1-(o-tolyl)guanidine, dimethylguanidine, diphenylguanidine, trimethylguanidine, tetramethylguanidine, pentamethylguanidine, 1,5,7-triazabicyclo[4.4.0]dec-5-ene, 7-methyl-1,5,7-triazabicyclo[4.4.0]dec-5-ene, 1-methylbiguanidine, 1-ethylbiguanidine, 1-n-butylbiguanidine, 1-n-octadecylbiguanidine, 1,1-dimethylbiguanidine, 1,1-diethylbiguanidine, 1-cyclohexylbiguanidine, 1-allylbiguanidine, 1-phenylbiguanidine, and 1-(o-tolyl)biguanidine. Examples of (G-5) metal-based hardening accelerators include organometallic complexes or organometallic salts of metals such as cobalt, copper, zinc, iron, nickel, manganese, and tin. Specific examples of organometallic complexes include organocobalt complexes such as cobalt(II) and cobalt(III) acetoacetone, organocopper complexes such as copper(II) acetoacetone, organozinc complexes such as zinc(II) acetoacetone, organoiron complexes such as iron(III) acetoacetone, organonickel complexes such as nickel(II) acetoacetone, and organomanganese complexes such as manganese(II) acetoacetone. Examples of organometallic salts include zinc octoate, tin octoate, zinc naphthenic acid, cobalt naphthenate, tin stearate, and zinc stearate. Examples of (G-6) amine hardening accelerators include trialkylamines such as triethylamine and tributylamine, 4-dimethylaminopyridine, benzyldimethylamine, 2,4,6-tris(dimethylaminomethyl)phenol, and 1,8-diazabicyclo(5,4,0)-undecene. As a (G-6) amine hardening accelerator, commercially available products can be used, such as "MY-25" manufactured by Ajinomoto Fine Techno. While the content of (G) curing accelerator in the resin composition is not particularly limited, when the non-volatile component in the resin composition is defined as 100% by mass, it is preferably 15% by mass or less, more preferably 10% by mass or less, even more preferably 5% by mass or less, even more preferably 3% by mass or less, and most preferably 1% by mass or less. While the lower limit of the content of (G) curing accelerator in the resin composition is not particularly limited, when the non-volatile component in the resin composition is defined as 100% by mass, it can be, for example, 0% by mass or more, 0.001% by mass or more, 0.01% by mass or more, 0.05% by mass or more, etc. <(H) Other Additives> The resin composition of the present invention, as a non-volatile component, may further contain any additives. Examples of such additives include, for instance, free radical polymerization initiators such as peroxide-based free radical polymerization initiators and azo-based free radical polymerization initiators; thermoplastic resins such as phenoxy resins, polyvinyl acetal resins, polyolefin resins, polyurethane resins, polyether acetal resins, polycarbonate resins, polyether ether ketone resins, and polyester resins; organic fillers such as rubber particles; organometallic compounds such as organocopper compounds, organozinc compounds, and organocobalt compounds; and phthalocyanine blue and phthalocyanine green. Colorants such as iodine green, diazo yellow, crystal violet, titanium dioxide, and carbon black; polymerization inhibitors such as hydroquinone, catechol, pyrogallol, and phenothiazine; leveling agents such as polysiloxane-based leveling agents and acrylonitrile-based leveling agents; tackifiers such as Benton and montmorillonite; defoamers such as polysiloxane-based defoamers, acrylonitrile-based defoamers, fluorinated defoamers, and vinyl resin-based defoamers; ultraviolet absorbers such as benzotriazole-based ultraviolet absorbers; and bonding agents such as urea silane. Adhesion enhancers; adhesion enhancers such as triazole-based, tetraazole-based, and triazine-based adhesion enhancers; antioxidants such as hindered phenol-based and hindered amine-based antioxidants; fluorescent brighteners such as stilbene derivatives; surfactants such as fluorine-based and polysiloxane-based surfactants; phosphorus-based flame retardants (e.g., phosphate ester compounds, phosphazene compounds, phosphine oxide compounds, red phosphorus); nitrogen-based flame retardants (e.g., melamine sulfate). Flame retardants include halogenated flame retardants and inorganic flame retardants (such as antimony trioxide); dispersants include phosphate ester dispersants, polyoxyalkylene dispersants, acetylene dispersants, polysiloxane dispersants, anionic dispersants, and cationic dispersants; stabilizers include borate ester stabilizers, titanate stabilizers, aluminate stabilizers, zirconate stabilizers, isocyanate stabilizers, carboxylic acid stabilizers, and carboxylic anhydride stabilizers. (H) Other additives may be used alone or in any combination of two or more. (H) The content of other additives may be appropriately set if the inventor is knowledgeable in the field. <(I) Organic Solvents> In addition to the non-volatile components mentioned above, the resin composition of the present invention may further contain any organic solvent as a volatile component. As the (I) organic solvent, known solvents may be used appropriately, and their types are not particularly limited. Examples of (I) organic solvents include ketone solvents such as acetone, methyl ethyl ketone, methyl isobutyl ketone, and cyclohexanone; ester solvents such as methyl acetate, ethyl acetate, butyl acetate, isobutyl acetate, isoamyl acetate, methyl propionate, ethyl propionate, and γ-butyrolactone; ether solvents such as tetrahydropyran, tetrahydrofuran, 1,4-dioxane, diethyl ether, diisopropyl ether, dibutyl ether, and diphenyl ether; alcohol solvents such as methanol, ethanol, propanol, butanol, and ethylene glycol; and ether ester solvents such as 2-ethoxyethyl acetate, propylene glycol monomethyl ether acetate, diethylene glycol monoethyl ether acetate, ethyl diethylene glycol acetate, γ-butyrolactone, and methyl methoxypropionate. Solvents: ester alcohol solvents such as methyl lactate, ethyl lactate, and methyl 2-hydroxyisobutyrate; ether alcohol solvents such as 2-methoxypropanol, 2-methoxyethanol, 2-ethoxyethanol, propylene glycol monomethyl ether, and diethylene glycol monobutyl ether (butyl carbitol); acetylamine solvents such as N,N-dimethylformamide, N,N-dimethylacetamide, and N-methyl-2-pyrrolidone; urethane solvents such as dimethyl sulfoxide; nitrile solvents such as acetonitrile and propionitrile; aliphatic hydrocarbon solvents such as hexane, cyclopentane, cyclohexane, and methylcyclohexane; aromatic hydrocarbon solvents such as benzene, toluene, xylene, ethylbenzene, and trimethylbenzene. (I) Organic solvents can be used alone or in any combination of two or more. In one embodiment, (I) the content of organic solvent is not particularly limited, but when the total content of the resin composition is defined as 100% by mass, it may be 60% or less by mass, 40% or less by mass, 30% or less by mass, 20% or less by mass, 15% or less by mass, 10% or less by mass, etc. <Method for Manufacturing Resin Composition> The resin composition of the present invention can be manufactured, for example, in any mixing container, by adding and mixing (A) a compound comprising repeating units of formula (1), (B) an epoxy resin, (C) an active ester compound, (D) an inorganic filler material if necessary, (E) a free radical polymerizable compound if necessary, (F) a curing agent if necessary, (G) a curing accelerator if necessary, (H) other additives if necessary, and (I) an organic solvent if necessary, in any order and / or partially or entirely simultaneously. Furthermore, during the process of adding and mixing the components, the temperature can be appropriately set, and heating and / or cooling can be performed momentarily or continuously. Furthermore, during or after the process of adding and mixing the components, the resin composition can be stirred or agitated using a stirring device or oscillating device, such as a mixer, to uniformly disperse it. Furthermore, degassing can be performed simultaneously with stirring or agitation under low pressure conditions such as vacuum. <Characteristics of the Resin Composition> The resin composition of the present invention comprises (A) a compound containing repeating units of formula (1), (B) an epoxy resin, and (C) an active ester compound. By using such a resin composition, a cured product with suppressed post-lamination unevenness can be obtained. Post-lamination unevenness refers to the unevenness that can occur in the resin composition layer when a sheet-like laminated material such as a laminated resin sheet and an inner substrate are formed on an inner substrate. This unevenness usually occurs in parts where the thickness of the resin composition layer is uneven. Although this unevenness occurs more often near the edges of the resin composition layer, the inventors have unexpectedly discovered that this unevenness can be suppressed by using the resin composition of the present invention. Furthermore, in certain embodiments, a cured product with low dielectric tangent (Df) can be obtained. Furthermore, in certain embodiments, a cured product with good plating adhesion can be obtained. In one embodiment, the cured resin composition of the present invention may have a low dielectric tangent (Df). Accordingly, in one embodiment, as in Test Example 1 below, the dielectric tangent (Df) of the cured resin composition measured at 5.8 GHz and 23 °C is preferably 0.02 or less, 0.01 or less, more preferably 0.005 or less, 0.004 or less, even more preferably 0.003 or less, 0.0028 or less, and particularly preferably 0.0027 or less, 0.0026 or less. In one embodiment, the cured resin composition of the present invention exhibits good plating adhesion. Accordingly, in one embodiment, the peel strength of the plated conductor layer of the cured resin composition, as measured in Test Example 4 below, is preferably 0.1 kgf / cm or more, more preferably 0.2 kgf / cm or more, and even more preferably 0.3 kgf / cm or more. The upper limit can be set to 10 kgf / cm or less, etc. In one embodiment, the cured resin composition of the present invention may have a low arithmetic mean roughness (Ra). Accordingly, in one embodiment, the arithmetic mean roughness (Ra) of the surface of the insulating layer after roughening treatment, as measured in Test Example 3 below, is preferably 200 nm or less, more preferably 100 nm or less, and even more preferably 50 nm or less. The lower limit is not particularly limited; for example, it may be set to 1 nm or more, 2 nm or more, etc. The arithmetic mean roughness (Ra) of the insulating layer surface can be measured using a non-contact surface roughness meter. Furthermore, in one embodiment, the relative permittivity (Dk) of the cured resin composition of the present invention, when measured at 5.8 GHz and 23°C as in Test Example 1 below, is preferably 5.0 or less, more preferably 4.5 or less, even more preferably 4.0 or less, and particularly preferably 3.5 or less. <Uses of the Resin Composition> The resin composition of the present invention is suitable for use as a resin composition for insulating purposes, especially for forming an insulating layer. Specifically, it is suitable for use as a resin composition for forming an insulating layer (including a rewiring layer) on an insulating layer. Furthermore, in the printed circuit board described later, it is suitable for use as a resin composition for forming an insulating layer of the printed circuit board (resin composition for forming an insulating layer of the printed circuit board). The resin composition of the present invention can also be widely used in sheet-like laminates such as resin sheets and prepregs, solder resists, underfill materials, die bonding materials, semiconductor sealing materials, embedding resins, component embedding resins, and other applications where resin compositions are essential. Furthermore, for example, when manufacturing a semiconductor wafer package via steps (1) to (6) below, the resin composition of the present invention can also be used as a resin composition for forming a rewiring layer (resin composition for forming a rewiring layer) for forming an insulating layer of a rewiring layer, and as a resin composition for sealing a semiconductor wafer (resin composition for sealing a semiconductor wafer). When manufacturing a semiconductor wafer package, a rewiring layer can be further formed on the sealing layer. (1) Step of bonding a temporary fixing film to a substrate, (2) Step of temporarily fixing the semiconductor wafer on the temporary fixing film, (3) Step of forming a sealing layer on the semiconductor wafer, (4) Step of peeling the substrate and the temporary fixing film from the semiconductor wafer, (5) Step of forming a rewiring layer as an insulating layer on the surface of the substrate and the temporary fixing film peeled from the semiconductor wafer, and (6) Step of forming a rewiring layer as a conductor layer on the rewiring layer. Furthermore, the resin composition of the present invention provides a good insulating layer for component embedding, and is therefore also suitable for use in printed wiring boards where components are embedded in the circuit board. <Sheet-like laminated material> Although the resin composition of the present invention can also be used in a varnish state, it is generally suitable for use in the form of a sheet-like laminate containing the resin composition in industrial applications. As a sheet-like laminated material, the resin sheet and prepreg shown below are preferred. In one embodiment, the resin sheet comprises a support and a resin composition layer disposed on the support, wherein the resin composition layer is formed of the resin composition of the present invention. From the perspective of achieving thinner printed circuit boards and ensuring that the cured resin composition provides excellent insulation even as a thin film, the thickness of the resin composition layer is preferably 50 μm or less, and more preferably 40 μm or less. While there is no particular limitation on the lower limit of the resin composition layer thickness, it is generally set at 5 μm or more, 10 μm or more, etc. Examples of support materials include films made of plastic materials, metal foils, and release paper, with films and metal foils made of plastic materials being more preferred. When a film made of plastic material is used as the support, examples of plastic materials include polyesters such as polyethylene terephthalate (hereinafter sometimes abbreviated as "PET") and polyethylene naphthalate (hereinafter sometimes abbreviated as "PEN"), acrylonitrile polycarbonate (hereinafter sometimes abbreviated as "PC"), polymethyl methacrylate (PMMA), cyclic polyolefins, triacetin (TAC), polyether sulfide (PES), polyether ketone, and polyimide. Among these, polyethylene terephthalate and polyethylene naphthalate are preferred, and inexpensive polyethylene terephthalate is particularly preferred. When using metal foil as a support, examples of metal foils include copper foil and aluminum foil, with copper foil being preferred. Copper foil can be used as the copper foil, either as a single metal such as copper or as an alloy of copper with other metals (such as tin, chromium, silver, magnesium, nickel, zirconium, silicon, titanium, etc.). The support can be treated with matte finish, corona treatment, or antistatic treatment on the surface that bonds with the resin composition layer. Furthermore, as a support, a release layer support with a release layer can be used on the surface bonded to the resin composition layer. As a release agent used in the release layer support of the release layer, examples include one or more release agents selected from the group consisting of alkyd resins, polyolefin resins, urethane resins, and polysiloxane resins. Commercially available products can be used as the release layer support, such as PET films having a release layer with an alkyd resin-based release agent as the main component, such as Lintec's "SK-1," "AL-5," and "AL-7," Toray's "Lumirror T60," Teijin's "Purex," and UNITIKA's "Unipeel." While the thickness of the support is not particularly limited, it is preferably in the range of 5μm to 75μm, more preferably in the range of 10μm to 60μm. Furthermore, when using a support with an attached release layer, it is preferable that the total thickness of the support with the release layer is within the above-mentioned range. In one embodiment, the resin sheet may further include any layer if necessary. Examples of such arbitrary layers include, for instance, a protective film disposed on the side of the support that is not bonded to the resin composition layer (i.e., the side opposite to the support). The thickness of the protective film is not particularly limited, but may be, for example, 1 μm to 40 μm. By laminating the protective film, the adhesion or scratches of dust and other contaminants to the surface of the resin composition layer can be suppressed. Resin sheets can be manufactured, for example, by preparing a resin varnish (which dissolves the resin composition directly in a liquid resin composition or an organic solvent), applying this resin varnish onto a support using a mold coating machine or the like, and then drying it to form a resin composition layer. As organic solvents, those identical to those described in the components of the resin can be listed. One organic solvent may be used alone, or two or more may be used in combination. Drying can be carried out by known methods such as heating or hot air blowing. While the drying conditions are not particularly limited, drying is preferably carried out when the content of organic solvent in the resin composition layer is 10% by mass or less, preferably 5% by mass or less. Although the drying method varies depending on the boiling point of the organic solvent in the resin composition or varnish, for example, when using a resin composition or varnish containing 30% to 60% by mass, a resin composition layer can be formed by drying at 50°C to 150°C for 3 to 10 minutes. Resin sheets can be rolled into rollers for storage. When resin sheets have a protective film, they can be used by peeling off the protective film. In one embodiment, the prepreg can be formed by impregnating a sheet-like fiber substrate with the resin composition of the present invention. The sheet-like fiber substrate used in the prepreg is not particularly limited; commonly used substrates for prepregs such as glass cloth, aramid nonwovens, and liquid crystal polymer nonwovens can be used. From the viewpoint of thinning printed circuit boards, the thickness of the sheet-like fiber substrate is preferably 50 μm or less, more preferably 40 μm or less, even more preferably 30 μm or less, and most preferably 20 μm or less. The lower limit of the thickness of the sheet-like fiber substrate is not particularly limited; it is typically 10 μm or more. Prepregs can be manufactured using known methods such as hot-melt methods and solvent methods. The thickness of the prepreg can be set to be the same range as that of the resin composition layer in the aforementioned resin sheet. The sheet-like laminate material of the present invention is suitable for use in forming an insulating layer for a printed wiring board (for the insulating layer of a printed wiring board), and is more suitable for use in forming an interlayer insulating layer for a printed wiring board (for the interlayer insulating layer of a printed wiring board). <Printed Wiring Board> The printed wiring board of the present invention comprises an insulating layer composed of a hardened material obtained by curing the resin composition of the present invention. Printed wiring boards can be manufactured by, for example, using the resin sheet described above, including the steps (I) and (II) below. (I) A step of laminating the resin sheet onto the inner layer substrate in such a way that the resin composition layer of the resin sheet is bonded to the inner layer substrate. (II) A step of curing (e.g., thermosetting) the resin composition layer to form an insulating layer. The term "inner layer substrate" used in step (I) refers to a component that forms the substrate of a printed wiring board, such as glass epoxy substrates, metal substrates, polyester substrates, polyimide substrates, BT resin substrates, and thermosetting polyphenylene ether substrates. Furthermore, this substrate may have a conductor layer on one or both sides, and this conductor layer can be patterned. An inner layer substrate with a conductor layer (circuit) formed on one or both sides of the substrate is sometimes called an "inner layer circuit substrate." Additionally, intermediate components that form an insulating layer and / or a conductor layer during the manufacture of the printed wiring board are also included in the term "inner layer substrate" in this invention. When the printed wiring board is a component-embedded circuit board, an inner layer substrate containing the components can be used. The lamination of the inner substrate and the resin sheet can be performed, for example, by heating and pressing the resin sheet onto the inner substrate from the support side. Examples of components for heating and pressing the resin sheet onto the inner substrate (hereinafter also referred to as "heat-pressing components") include heated metal plates (SUS mirror plates, etc.) or metal rollers (SUS rollers). Preferably, instead of directly pressing the heat-pressing component onto the resin sheet, the resin sheet is pressed onto the surface of the inner substrate in a manner that allows the resin sheet to fully follow the contours of the surface, using an elastic material such as heat-resistant rubber. The lamination of the inner substrate and the resin sheet can be performed using a vacuum lamination method. In the vacuum lamination method, the heat-pressing temperature is preferably in the range of 60°C to 160°C, more preferably in the range of 80°C to 140°C; the heat-pressing pressure is preferably in the range of 0.098 MPa to 1.77 MPa, more preferably in the range of 0.29 MPa to 1.47 MPa; and the heat-pressing time is preferably in the range of 20 seconds to 400 seconds, more preferably in the range of 30 seconds to 300 seconds. Lamination can be performed under reduced pressure conditions, preferably below 26.7 hPa. Lamination can be performed using commercially available vacuum laminators. Examples of commercially available vacuum laminators include the vacuum pressure laminator manufactured by Meiki Manufacturing Co., Ltd., the vacuum applicator manufactured by Nikko Materials Co., Ltd., and batch vacuum pressure laminators. After lamination, the laminated resin sheet can be smoothed by pressing the heated pressing component from the support side under normal pressure (one atmosphere). The pressing conditions for smoothing can be set to the same conditions as the heating and pressing conditions for lamination described above. The smoothing process can be performed using a commercially available laminator. Alternatively, lamination and smoothing can be performed continuously using the aforementioned commercially available vacuum laminator. The support can be removed between steps (I) and (II), or after step (II). In step (II), the resin composition layer is cured (e.g., thermocure) to form an insulating layer composed of the cured resin composition. The curing conditions for the resin composition layer are not particularly limited and can be those commonly used when forming the insulating layer of a printed wiring board. For example, although the thermosetting conditions of the resin composition layer vary depending on the type of resin composition, in one embodiment, the curing temperature is preferably 120°C to 240°C, more preferably 150°C to 220°C, and even more preferably 170°C to 210°C. The curing time is preferably 5 minutes to 120 minutes, more preferably 10 minutes to 100 minutes, and even more preferably 15 minutes to 100 minutes. Before applying the thermosetting resin composition layer, the resin composition layer can be preheated at a temperature lower than the curing temperature. For example, before thermosetting the resin composition layer, it can be preheated at a temperature of 50°C to 120°C, preferably 60°C to 115°C, more preferably 70°C to 110°C for at least 5 minutes, preferably 5 minutes to 150 minutes, more preferably 15 minutes to 120 minutes, and even more preferably 15 minutes to 100 minutes. In manufacturing a printed wiring board, steps (III) drilling holes in the insulating layer, (IV) roughening the insulating layer, and (V) forming a conductor layer can be further performed. These steps (III) to (V) can be performed using various methods known to those skilled in the art of the invention for use in the manufacture of printed wiring boards. Furthermore, when removing the support after step (II), the removal of the support can be performed between steps (II) and (III), between steps (III) and (IV), or between steps (IV) and (V). Also, if necessary, the formation of the insulating and conductor layers in steps (I) to (V) can be repeated to form a multilayer wiring board. In other embodiments, the printed wiring board of the present invention can be manufactured using the aforementioned prepreg. The manufacturing method is basically the same as that used in the case of resin sheets. Step (III) is the drilling step in the insulating layer. This allows the formation of through holes, vias, etc., in the insulating layer. Step (III) can be performed using, for example, a drilling machine, laser, or plasma, depending on the composition of the resin used in the formation of the insulating layer. The size and shape of the holes can be appropriately set according to the design of the printed circuit board. Step (IV) is the roughening process for the insulating layer. Typically, residue removal is also performed in this step (IV). The order and conditions of the roughening process are not particularly limited; well-known sequences and conditions commonly used in forming the insulating layer of printed circuit boards can be employed. For example, the insulating layer can be roughened by a swelling treatment with a swelling solution, a roughening treatment with an oxidizing agent, and a neutralization treatment with a neutralizing solution in that order. While not particularly limited, the swelling solution used in roughening treatment can include alkaline solutions and surfactant solutions, with alkaline solutions being preferred. Sodium hydroxide solution or potassium hydroxide solution is even more preferred. Commercially available swelling solutions include, for example, "Swelling Dip Securiganth P" and "Swelling Dip Securiganth SBU" manufactured by Atotech Japan. While the swelling treatment using the swelling solution is not particularly limited, it can be performed by immersing the insulating layer in a swelling solution at a temperature of 30°C to 90°C for 1 to 20 minutes. From the viewpoint of suppressing the swelling of the resin in the insulating layer to a suitable level, immersing the insulating layer in a swelling solution at a temperature of 40°C to 80°C for 5 to 15 minutes is preferred. While not particularly limited, oxidants used in roughening treatments include, for example, potassium permanganate dissolved in an aqueous solution of sodium hydroxide or an alkaline permanganate solution. Roughening treatment with an oxidant, such as an alkaline permanganate solution, is preferably performed by immersing the insulating layer in an oxidant solution heated to 60°C to 100°C for 10 to 30 minutes. Furthermore, the concentration of permanganate in the alkaline permanganate solution is preferably 5% to 10% by mass. Commercially available oxidants include, for example, alkaline permanganate solutions such as "Concentrate･Compact CP" and "Dosing solution･Securiganth P" manufactured by Atotech Japan. Furthermore, as a neutralizing solution used in roughening treatment, it is preferably an acidic aqueous solution. As a commercially available product, for example, "Reduction solution・Securigant P" manufactured by Atotech Japan can be cited. By using a neutralizing solution, the surface roughened by the oxidant can be immersed in the neutralizing solution at 30°C to 80°C for 5 to 30 minutes. From a workability perspective, it is preferable to immerse the roughened surface by the oxidant in a neutralizing solution at 40°C to 70°C for 5 to 20 minutes. Step (V) is the step of forming a conductor layer, which is formed on the insulating layer. The conductor material used in the conductor layer is not particularly limited. In a suitable embodiment, the conductor layer comprises one or more metals selected from the group consisting of gold, platinum, palladium, silver, copper, aluminum, cobalt, chromium, zinc, nickel, titanium, tungsten, iron, tin, and indium. The conductor layer can be a single metal layer or an alloy layer. For example, an alloy layer can be formed from an alloy of two or more metals selected from the above group (e.g., nickel-chromium alloy, copper-nickel alloy, and copper-titanium alloy). From the perspective of the versatility, cost, and ease of patterning of conductor layer formation, a single metal layer of chromium, nickel, titanium, aluminum, zinc, gold, palladium, silver, or copper is preferred, or an alloy layer of nickel-chromium alloy, copper-nickel alloy, or copper-titanium alloy. More preferably, a single metal layer of chromium, nickel, titanium, aluminum, zinc, gold, palladium, silver, or copper, or an alloy layer of nickel-chromium alloy, and even more preferably, a single metal layer of copper. The conductor layer can be a single-layer structure or a multi-layer structure consisting of two or more single-metal or alloy layers made of different types of metals or alloys. When the conductor layer is a multi-layer structure, the layer in contact with the insulating layer is preferably a single-metal layer of chromium, zinc, or titanium, or an alloy layer of nickel-chromium alloy. The thickness of the conductor layer varies depending on the desired design of the printed circuit board, but it is generally 3μm to 35μm, and preferably 5μm to 30μm. In one embodiment, the conductor layer can be formed by plating. For example, by using conventionally known techniques such as semi-additive or fully additive plating, a conductor layer with the desired wiring pattern can be formed by plating onto the surface of the insulating layer. From the viewpoint of ease of manufacturing, it is preferable to form it by the semi-additive method. The following illustrates an example of forming the conductor layer by the semi-additive method. First, a seed layer is formed on the surface of the insulating layer using electroless plating. Next, a masking pattern is formed on the formed seed layer, exposing a portion of the seed layer, corresponding to the desired wiring pattern. A metal layer is formed on the exposed seed layer using electrolytic plating, and then the masking pattern is removed. Finally, the unwanted seed layer is removed by etching or the like, thus forming a conductor layer with the desired wiring pattern. In other embodiments, the conductor layer can be formed using metal foil. When forming the conductor layer using metal foil, step (V) is suitable to be performed between steps (I) and (II). For example, after step (I), the support is removed, and metal foil is laminated onto the surface of the exposed resin composition layer. The lamination of the resin composition layer and the metal foil can be performed legally using a vacuum layer. The lamination conditions can be the same as those described for step (I). Next, step (II) is performed to form an insulating layer. Then, using the metal foil on the insulating layer, a conductor layer with the desired wiring pattern can be formed using conventionally known techniques such as the subtractive method or the modified semi-additive method. Metal foil can be manufactured using known methods such as electrolysis and rolling. Commercially available metal foils include, for example, HLP foil and JXUT-III foil manufactured by JX Minerals & Metals Corporation, and 3EC-III foil and TP-III foil manufactured by Mitsui Mining & Metals Corporation. <Semiconductor Device> The semiconductor device of the present invention includes the printed wiring board of the present invention. The semiconductor device of the present invention can be manufactured using the printed wiring board of the present invention. Examples of semiconductor devices include various semiconductor devices used in electrical products (such as computers, mobile phones, digital cameras, and televisions) and vehicles (such as motorcycles, automobiles, trams, ships, and aircraft). [Example] The present invention will now be described in detail by way of embodiments. The present invention is not limited to these embodiments. Furthermore, unless otherwise stated, the terms "parts" and "%" to indicate quantities refer to "parts by mass" and "% by mass," respectively. In particular, the temperature and pressure conditions without a specified temperature are room temperature (25°C) and one atmosphere (1 atm). <Synthetic Example 1> 894.96 mmol of dichloropyrimidine, 900.00 mmol of 1,1-bis(4-hydroxyphenyl)-3,3,5-trimethylcyclohexane, 1.2 mol of potassium carbonate, and 450 g of N-methyl-2-pyrrolidone were placed in a four-necked flask. After nitrogen substitution of the flask contents, the contents were heated at 130°C for 6 hours, and the water generated during heating was removed from the Dean-Stark tube as needed. After cooling the contents of the flask to room temperature, the precipitated solids were filtered off. Methanol was added to the filtrate, and the precipitated solids were washed with methanol and dried to obtain the polymer compound represented by the following formula (1') (weight average molecular weight (Mw): 87000 (conversion to polystyrene)). The obtained compound was then... 13 C-NMR analysis confirmed the product. <Example 1> A mixture of 2 parts of the polymer compound obtained in Synthesis Example 1 (cyclohexanone solution with 20% non-volatile component), 10 parts of naphthalene-type epoxy resin (DIC Corporation "HP-4032-SS", 1,6-bis(epoxypropoxy)naphthalene, epoxy equivalent approximately 145 g / eq.), 30 parts of an active ester compound (DIC Corporation "HPC-8000-65T", active ester equivalent approximately 223 g / eq., toluene solution with 65% non-volatile component), and spherical silica (Admatex Corporation "SO-C2", average particle size 0.5 μm, specific surface area 5.8 m²) surface-treated with a silane coupling agent (Shin-Etsu Chemical Industry Co., Ltd. "KBM-573"). 2 90 parts of a phenolic curing agent containing a triazine skeleton (DIC Corporation's "LA-3018-50P", active group equivalent of approximately 151 g / eq., 2-methoxypropanol solution with 50% non-volatile components) 2 parts of a carbodiimide curing agent (Nisshinbo Chemical Co., Ltd.'s "V-03", active group equivalent of approximately 216 g / eq., toluene solution with 50% non-volatile components) 5 parts of a toluene solution 5 parts of a carbodiimide curing agent (Shikoku Chemical Industry Co., Ltd.'s "1B2PZ", 1-benzyl-2-phenylimidazolium) were uniformly dispersed using a high-speed rotary mixer to prepare the resin composition. <Example 2> Except for replacing 30 parts of the active ester compound (DIC Company's "HPC-8000-65T"), using 30 parts of the active ester compound (DIC Company's "HPC-8150-62T", with an active ester equivalent of about 220 g / eq. and a non-volatile component content of 62% by mass in toluene solution), the other steps were the same as in Example 1 to prepare the resin composition. <Example 3> Except that the amount of spherical silica (Admatex SO-C2) surface-treated with silane coupling agent (Shin-Etsu Chemical Co., Ltd. "KBM-573") was changed from 90 parts to 92 parts, and 2 parts of biphenyl alkylphenol varnish type maleimide (MIR-3000-70MT, Nippon Kayaku Co., Ltd., MEK / toluene mixed solution with 70% non-volatile component) was used, the same procedure as in Example 2 was followed to prepare the resin composition. <Example 4> Except for changing the amount of spherical silica (Admatex SO-C2) surface-treated with silane coupling agent (Shin-Etsu Chemical Co., Ltd. "KBM-573") from 90 parts to 93 parts, changing the amount of imidazole curing accelerator (Shikoku Chemical Co., Ltd. "1B2PZ") from 0.1 parts to 0.5 parts, and using 1 part of maleimide-terminated polyimide compound (DMI Co., Ltd. "BMI-1500"), the resin composition was prepared in the same manner as in Example 2. <Example 5> Except for changing the amount of spherical silica (Admatex SO-C2) surface-treated with silane coupling agent (Shin-Etsu Chemical Co., Ltd. "KBM-573") from 90 parts to 93 parts, and using 2 parts of methacrylic acid modified polyphenylene ether (SABIC INNOVATIVE PLASTICS Co., Ltd. "SA9000-111"), the process was the same as in Example 2 to prepare the resin composition. <Example 6> Except for changing the amount of spherical silica (Admatex SO-C2) surface-treated with silane coupling agent (Shin-Etsu Chemical Co., Ltd. "KBM-573") from 90 parts to 93 parts, changing the amount of imidazole curing accelerator (Shikoku Chemical Co., Ltd. "1B2PZ") from 0.1 parts to 0.5 parts, and using 2 parts of vinyl benzyl modified polyphenylene ether (Mitsubishi Gas Chemical Co., Ltd. "OPE-2St 2200", toluene solution with 65% non-volatile content), the resin composition was prepared in the same manner as in Example 2. <Comparative Example 1> In addition to replacing 2 parts of the polymer compound (cyclohexanone solution with 20% non-volatile component) obtained in Synthetic Example 1, 1.5 parts of phenoxy resin (YX7553BH30 manufactured by Mitsubishi Chemical Co., Ltd.), 1.5 parts of MEK with 30% non-volatile component and cyclohexanone in a 1:1 solution, and changing the amount of imidazole curing accelerator (1B2PZ manufactured by Shikoku Chemical Co., Ltd.) from 0.1 parts to 0.5 parts, the resin composition was prepared in the same manner as in Example 1. <Comparative Example 2> In addition to replacing 2 parts of the polymer compound (cyclohexanone solution with 20% non-volatile component) obtained in Synthesis Example 1, 1.5 parts of phenoxy resin (YX7553BH30 manufactured by Mitsubishi Chemical Co., Ltd.), 1.5 parts of MEK with 30% non-volatile component and cyclohexanone in a 1:1 solution, and changing the amount of imidazole curing accelerator (1B2PZ manufactured by Shikoku Chemical Co., Ltd.) from 0.1 parts to 0.5 parts, the resin composition was prepared in the same manner as in Example 2. <Experimental Example 1: Determination of Relative Permittivity and Dielectric Tangent> (1) Preparation of a resin sheet A with a resin composition layer thickness of 40 μm as a support: A polyethylene terephthalate film (Lintec "AL5", thickness 38 μm) with a release layer was prepared. On the release layer of this support, the resin composition obtained in the Examples and Comparative Examples was uniformly coated so that the thickness of the dried resin composition layer was 40 μm. Then, the resin composition was dried at 80°C to 100°C (average 90°C) for 4 minutes to obtain a resin sheet A containing the support and the resin composition layer. (2) Preparation of Evaluation Hardened Material B: Resin sheet A was cured in an oven at 190°C for 90 minutes. By removing resin sheet A from the oven and peeling off the support, a hardened material of resin composition layer was obtained. The hardened material was cut into sections with a length of 80 mm and a width of 2 mm as evaluation hardened material B. (3) Measurement of relative permittivity and dielectric tangent: For the evaluation hardened material B, the relative permittivity (Dk value) and dielectric tangent (Df value) were measured using an Agilent Technologies HP8362B instrument via the cavity resonance perturbation method at a measurement frequency of 5.8 GHz and a measurement temperature of 23 °C. The measurements were performed on two test pieces, and the average value was calculated. <Experimental Example 2: Evaluation of Unevenness after Lamination> (1) Preparation of Inner Layer Substrate The glass cloth substrate with double-sided copper-clad epoxy resin (copper foil thickness 18μm, substrate thickness 0.4mm, Panasonic "R1515A") forming the inner layer circuit was etched to 1μm on both sides with micro-etching agent (MEC "CZ8101") to roughen the copper surface. (2) The resin sheet A was laminated using a batch vacuum pressure laminator (Nikko Materials Co., Ltd., 2-stage stacking laminator "CVP700"). The resin sheet A obtained in Test Example 1 (1) was laminated onto both sides of the inner substrate in such a way that the resin composition layer was in contact with the inner substrate. The lamination was performed by depressurizing for 30 seconds, adjusting the pressure to below 13 hPa, and then pressing at 120°C and 0.74 MPa for 30 seconds. Then, a hot stamping was performed at 100°C and 0.5 MPa for 60 seconds. (3) Evaluation of unevenness after lamination: After lamination, along the periphery of the inner substrate, those with resin indentations are evaluated as "present", and those without indentations are evaluated as "absent". <Experimental Example 3: Determination of Arithmetic Mean Roughness (Ra)> (1) Thermosetting of the resin composition layer: The inner layer substrate of the laminated resin sheet A in Experimental Example 2 (2) was placed in an oven at 130°C and heated for 30 minutes. Then, it was transferred to an oven at 170°C and heated for 30 minutes to thermoset the resin composition layer and form an insulating layer. Then, the support was peeled off to obtain a hardened substrate A with an insulating layer, an inner layer substrate, and an insulating layer in that order. (2) Roughening treatment: A roughening treatment is performed on the hardened substrate A as a desmearing treatment. As a desmearing treatment, the following wet desmearing treatment is performed. (Wet Residue Removal Process) The hardened substrate A was immersed in a swelling solution (an aqueous solution of Swelling Dip Securigant P manufactured by Atotech Japan, diethylene glycol monobutyl ether, and sodium hydroxide) at 60°C for 5 minutes. Then, it was immersed in an oxidizing agent solution (an aqueous solution of Concentrate·Compact CP manufactured by Atotech Japan, approximately 6% potassium permanganate and approximately 4% sodium hydroxide) at 80°C for 20 minutes. Next, it was immersed in a neutralizing solution (a sulfuric acid aqueous solution manufactured by Atotech Japan) at 40°C for 5 minutes, and then dried at 80°C for 15 minutes. (3) Determination of the arithmetic mean roughness (Ra) of the surface of the roughened insulating layer: The arithmetic mean roughness (Ra) of the surface of the roughened insulating layer was determined using a non-contact surface roughness meter (Bruker WYKO NT3300) with VSI mode and a 50x lens. The measurement range was set to 121μm × 92μm. The average value of 10 points was calculated for the determination. <Example 4: Determination of Peel Strength> (1) Formation of the Conductor Layer: The conductor layer was formed on the roughened surface of the insulating layer in the hardened substrate A of Example 3 (2) using a semi-additive method. That is, the roughened substrate was formed on the surface containing PdCl After immersing in an electroless plating solution at 40°C for 5 minutes, the substrate is then immersed in an electroless copper plating solution at 25°C for 20 minutes. Next, it is annealed at 150°C for 30 minutes to form an etching resist, which is then used to form a pattern. Following this, copper sulfate electrolytic plating is performed to form a 25μm thick conductor layer, and the substrate is annealed at 190°C for 60 minutes. The resulting substrate is referred to as "Evaluation Substrate B". (2) Determination of the peel strength of the plated conductor layer: The peel strength of the insulation layer and the conductor layer was determined according to Japanese Industrial Standard (JIS C6481). Specifically, a 10 mm wide and 100 mm long cut was made in the conductor layer of the evaluation substrate B. This end was peeled off and held in a clamp. At room temperature, the load (kgf / cm) when peeling 35 mm in the vertical direction was measured at a speed of 50 mm / min, and the peel strength was determined. A tensile testing machine (TSE Corporation "AC-50C-SL") was used for the test. The amount of non-volatile components used in the resin compositions of the examples and comparative examples, the test results, and the evaluation results are shown in Table 1 below. It is understood that by using (A) a compound containing repeating units of formula (1), (B) an epoxy resin, and (C) an active ester compound, a hardened material with low dielectric tangent (Df) and good peel strength can be obtained, which suppresses unevenness after lamination.

Claims

1. A resin composition comprising: (A) a compound comprising repeating units represented by at least any one of formulas (1A-1) to (1B-3), (B) an epoxy resin, and (C) an active ester compound, [wherein, R3, R4, and R5 independently represent alkyl groups; Ra independently represent alkyl, alkenyl, aryl, alkyl-aryl, aryl-aryl, aryl-alkyl, alkyl-oxy, alkenyl-oxy, alkyl-carbonyl, alkenyl-carbonyl, aryl-carbonyl, alkyl-oxy-carbonyl, alkenyl-oxy-carbonyl, aryl-oxy-carbonyl, alkyl-carbonyl-oxy, alkenyl-carbonyl-oxy, or aryl-carbonyl-oxy; Rb and Rc independently represent substituents; a represents an integer from 0 to 2; b and c independently represent integers from 0 to 3; x represents an integer from 0 to 5], (A) The content of the component is defined as 0.01% by mass and 3% by mass when the non-volatile component in the resin composition is defined as 100% by mass. (B) The content of the component is defined as 0.01% by mass and 60% by mass when the non-volatile component in the resin composition is defined as 100% by mass. (C) The content of the component is defined as 0.1% by mass and 60% by mass when the non-volatile component in the resin composition is defined as 100% by mass.

2. The resin composition as claimed in claim 1, wherein, (B) Components include (B-1) epoxy resin containing a condensation ring structure.

3. The resin composition as claimed in claim 2, wherein, (B-1) is a monomeric epoxy resin containing a condensation ring structure.

4. The resin composition as claimed in claim 1, wherein, (B) The content of the component is 1% to 30% by mass when the non-volatile component in the resin composition is defined as 100% by mass.

5. The resin composition as claimed in claim 1, wherein, The mass ratio of component (B) to component (A) (component (B) / component (A)) is 10 to 50.

6. The resin composition as claimed in claim 1, wherein, (C) The content of the component is 5% to 30% by mass when the non-volatile component in the resin composition is defined as 100% by mass.

7. The resin composition as claimed in claim 1, wherein, The mass ratio of component (C) to component (A) (component (C) / component (A)) is 30 to 100.

8. The resin composition of claim 1 further comprises (D) inorganic filler material.

9. The resin composition as claimed in claim 8, wherein, (D) The component is silicon dioxide.

10. The resin composition as claimed in claim 8, wherein, (D) The content of component is 50% or more when the non-volatile components in the resin composition are defined as 100% by mass.

11. The resin composition as claimed in claim 10, wherein, (D) The content of component is 70% or more when the non-volatile components in the resin composition are defined as 100% by mass.

12. The resin composition of claim 1 further comprises (E) a free radical polymerizable compound.

13. The resin composition of claim 1 further comprises a (F-1)carbodiimide curing agent.

14. A cured form of a resin composition as claimed in any one of claims 1 to 13.

15. A sheet-like laminate material comprising a resin composition as claimed in any one of claims 1 to 13.

16. A resin sheet having a support and a resin composition layer formed from a resin composition disposed on the support, as claimed in any one of claims 1 to 13.

17. A printed wiring board having an insulating layer made of a cured resin composition as claimed in any one of claims 1 to 13.

18. A semiconductor device comprising a printed wiring board as claimed in claim 17.