Resin composition and uses of the same

Abstract

The present invention provides a resin composition comprising (A) an epoxy resin, (B) a bismaleimide resin, (C) a benzoxazine resin, (D) a flame retardant, and (E) a filler, wherein, based on the total weight of the resin composition excluding solvents, the epoxy resin (A) comprises 5% to 15% by weight, the bismaleimide resin (B) comprises 15% to 40% by weight, the benzoxazine resin (C) comprises 3% to 15% by weight, the flame retardant (D) comprises 5% to 10% by weight, and the filler (E) comprises 45% to 55% by weight.

Claims

1. A resin composition comprising: (A) an epoxy resin; (B) a bismaleimide resin; (C) a benzoxazine resin; (D) a flame retardant; and (E) a filler, wherein, based on the total weight of the resin composition excluding solvents, the epoxy resin (A) comprises 5% to 15% by weight, the bismaleimide resin (B) comprises 15% to 40% by weight, the benzoxazine resin (C) comprises 3% to 15% by weight, the flame retardant (D) comprises 5% to 10% by weight, and the filler (E) comprises 45% to 55% by weight.

2. The resin composition as claimed in claim 1, wherein the bismaleimide resin (B) comprises a biphenyl-type bismaleimide resin.

3. The resin composition as claimed in claim 1, wherein the bismaleimide resin (B) is selected from the group consisting of: 1,2-bismaleiminoethane, 1,6-bismaleiminohexane, 1,3-bismaleiminobenzene, 1,4-bismaleiminobenzene, 2,4-bismaleiminotoluene, 4,4'-bismaleiminodiphenylmethane, 4,4'-bismaleiminodiphenyl ether, 3,3'-bismaleiminodiphenyl ether, etc. Maleimino diphenyl sulfonate, 4,4'-bismaleimino diphenyl sulfonate, 4,4'-bismaleimino dicyclohexylmethane, 3,5-bis(4-maleiminophenyl)pyridine, 2,6-bismaleiminopyridine, 1,3-bis(maleiminomethyl)cyclohexane, 1,3-bis(maleiminomethyl)benzene, 1,1-bis(4-maleiminophenyl)cyclohexane, 1,3-bis(dichloromaleimino) (amino)benzene, 4,4'-biscitraconimidodiphenylmethane, 2,2-bis(4-maleiminophenyl)propane, 1-phenyl-1,1-bis(4-maleiminophenyl)ethane, α,α-bis(4-maleiminophenyl)toluene, 3,5-bismaleimino-1,2,4-triazole, N N,N'-Ethylenebismaleimide, N,N'-Hexamethylenebismaleimide, N,N'-m-Ethylenebismaleimide, N,N'-p-Ethylenebismaleimide, N,N'-α,α'-4,4'-Dimethylcyclohexanebismaleimide, N,N'-m-xylenebismaleimide, N,N'-4,4'-diphenylcyclohexanebismaleimide, and combinations thereof, wherein y is an integer from 1 to 4.

4. The resin composition as claimed in claim 1, wherein the epoxy resin (A) is selected from the group consisting of: bisphenol type epoxy resins, phenolic type epoxy resins, stilbene type epoxy resins, epoxy resins containing a triazine backbone, epoxy resins containing a pyridine backbone, pyromethane type epoxy resins, xylylene type epoxy resins, biphenyl type epoxy resins, biphenyl aralkyl type epoxy resins, naphthalene type epoxy resins, dicyclopentadiene (DCPD) type epoxy resins, cycloaliphatic epoxy resins, and combinations thereof.

5. The resin composition as claimed in any one of claims 1 to 4, wherein the benzoxazine resin (C) is selected from the group consisting of compounds having the structure of formula (I), compounds having the structure of formula (II), and combinations thereof, [formula (I)], [formula (II)], in formula (I) and formula (II), X1 and X2 are each independently C1 to C10 alkyl groups, -O-, -NH-, -S-, -SO2-, or direct bonds; R1 and R2 are each independently substituted or unsubstituted C1 to C6 hydrocarbon groups, and each R1 may be the same or different, and each R2 may be the same or different; and a and b are each independently integers from 0 to 4, and each a may be the same or different, and each b may be the same or different.

6. The resin composition as claimed in any one of claims 1 to 4, wherein the flame retardant (D) is selected from the group consisting of phosphate esters, phosphazenes, ammonium polyphosphate, metal phosphinates, melamine phosphate, and combinations thereof.

7. The resin composition as claimed in any one of claims 1 to 4, wherein the filler (E) is selected from the group consisting of: silicon dioxide, aluminum oxide, magnesium oxide, magnesium hydroxide, calcium carbonate, talc, clay, aluminum nitride, boron nitride, aluminum hydroxide, aluminum silicon carbide, silicon carbide, sodium carbonate, titanium dioxide, zinc oxide, zirconium oxide, quartz, diamond, diamond-like material, graphite, calcined kaolin, baiji, mica, hydrotalcite, polytetrafluoroethylene powder, glass beads, ceramic whiskers, carbon nanotubes, nano-sized inorganic powders, and combinations thereof.

8. A prepreg, which is prepared by impregnating or coating a substrate with a resin composition as described in any one of claims 1 to 7 and drying the impregnated or coated substrate.

9. A metal foil laminate, which is made by laminating a prepreg as described in claim 8 with a metal foil, or by coating a resin composition as described in any one of claims 1 to 7 onto a metal foil and drying the coated metal foil.

10. A printed circuit board made of a metal foil laminate as described in claim 9.