Ultrasonic fingerprint recognition module

Abstract

An ultrasonic fingerprint recognition module includes a bare glass substrate, a first metal wire layer, a piezoelectric layer, a second metal wire layer, and a protective layer. The first metal wire layer is disposed on the upper surface of the substrate and includes multiple first wires extending along a first direction and first contact areas electrically connected to the first wires. The piezoelectric layer is disposed in a portion of the first metal wire layer, exposing the first contact areas. The second metal wire layer is disposed on the piezoelectric layer and includes multiple second wires extending along a second direction and second contact areas electrically connected to the second wires. The protective layer covers the second metal wire layer. The first and second contact areas are used for electrically connecting an algorithm chip and a power control chip, respectively. This invention simplifies the module structure, improves integration flexibility and manufacturing efficiency, and contributes to sensing stability and module thinning.

Claims

1. An ultrasonic fingerprint recognition module, comprising: a substrate made of plain glass and having an upper surface; a first metal wire layer disposed on the upper surface, comprising: a plurality of first wires extending along a first direction; and a first contact area electrically connected to the first wires, the first contact area comprising a plurality of contacts for electrically connecting to an algorithm chip; a piezoelectric layer disposed on a portion of the first metal wire layer and exposing the first contact area; a second metal wire layer disposed on the piezoelectric layer, comprising: a plurality of second wires extending along a second direction perpendicular to the first direction; and a second contact area electrically connected to the second wires, the second contact area comprising a plurality of contacts for electrically connecting to a power control chip; and a protective layer covering the second metal wire layer.

2. The ultrasonic fingerprint recognition module as claimed in claim 1, wherein the algorithm chip and the power control chip are disposed on a flexible circuit board, and the flexible circuit board is electrically connected to the first contact area and the second contact area respectively.

3. The ultrasonic fingerprint recognition module as claimed in claim 1, wherein the algorithm chip is disposed above the substrate and electrically connected to the first contact area, and the power control chip is disposed on a flexible circuit board, the flexible circuit board being electrically connected to the second contact area.

4. The ultrasonic fingerprint recognition module as claimed in claim 1, wherein the thickness of the substrate is between 50 and 150 micrometers.

5. The ultrasonic fingerprint recognition module as claimed in claim 1, wherein the first metal wire layer and the second metal wire layer are MoAlMo or Cu / Ti metal materials.

6. The ultrasonic fingerprint recognition module as claimed in claim 1 further includes an ITO conductive film disposed on the surface of the first metal wire layer.

7. The ultrasonic fingerprint recognition module as claimed in claim 6, wherein the thickness of the ITO conductive film is between 0.05 and 0.1 micrometers.

8. The ultrasonic fingerprint recognition module as claimed in claim 1, wherein the thicknesses of the first metal wire layer and the second metal wire layer are respectively between 0.5 and 1 micrometer.

9. The ultrasonic fingerprint recognition module as claimed in claim 1, wherein the thickness of the piezoelectric layer is between 5 and 15 micrometers.

10. The ultrasonic fingerprint recognition module as claimed in claim 1, wherein the protective layer is a polymer coating or film with a thickness between 10 and 30 micrometers.

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