Resin prepreg and copper clad laminate comprising the same

Abstract

This disclosure provides a resin film comprising: a substrate; and an adhesive formed on both sides of the substrate, wherein the adhesive comprises a non-petrochemically derived epoxy resin. This disclosure also provides a copper foil substrate comprising the above-described resin film.

Claims

1. A resin film suitable for use on a copper foil substrate, comprising: One substrate; And an adhesive material formed on both sides of the substrate, wherein the adhesive material includes a non-petrochemical epoxy resin synthesized from recycled plastics and biomass epoxides, the raw materials of which include glycerol.

2. The resin film as claimed in claim 1, wherein the substrate comprises insulating paper, fiberglass cloth, or a combination thereof.

3. The resin film as claimed in claim 1, wherein the raw materials of the recycled plastic include polycarbonate (PC), acrylonitrile butadiene styrene (ABS), polysulfone (PSU), polyether, or combinations thereof.

4. The resin film as claimed in claim 1, wherein the source of the recycled plastic includes post-industrial recycled (PIR) plastic or post-consumer recycled (PCR) plastic.

5. The resin film as described in claim 1, wherein the recycled plastic includes bisphenol A (BPA).

6. The resin film as claimed in claim 1, wherein the raw materials for glycerin include biodiesel and oleochemicals.

7. The resin film as claimed in claim 1, wherein the bio-epoxide comprises epichlorohydrin (ECH).

8. The resin film as claimed in claim 1, wherein the non-petrochemical epoxy resin includes bisphenol A epoxy resin (DGEBA).

9. The resin film as claimed in claim 8, wherein the non-petrochemical bisphenol A epoxy resin (DGEBA) is synthesized from recycled bisphenol A (BPA) and bio-based epichlorohydrin (ECH).

10. The resin film as claimed in claim 1, wherein the non-petrochemical epoxy resin further comprises p-tert-butylphenol.

11. The resin film as claimed in claim 10, wherein the content of p-tert-butylphenol in the non-petrochemical epoxy resin is 0.2 to 2% by weight.

12. The resin film as claimed in claim 1, wherein the non-petrochemical epoxy resin accounts for 5 to 30 percent by weight in the adhesive material.

13. The resin film as claimed in claim 1, wherein the adhesive further comprises a hardener, a catalyst, a flame retardant, and a filler.

14. The resin film as claimed in claim 13, wherein the curing agent is present in the adhesive material at a content of 20 to 40% by weight, the catalyst is present in the adhesive material at a content of 0.01 to 0.1% by weight, the flame retardant is present in the adhesive material at a content of 5 to 20% by weight, and the filler is present in the adhesive material at a content of 10 to 50% by weight.

15. A copper foil substrate suitable for a printed circuit board, comprising: The resin film as described in claim 1; And a first copper foil disposed on a first surface of the resin film.

16. The copper foil substrate as claimed in claim 15, further comprising a second copper foil disposed on a second surface of the resin film, the second surface being opposite to the first surface.

17. A copper foil substrate suitable for a printed circuit board, comprising: A composite resin film comprising a plurality of resin films as described in claim 1; And a first copper foil, disposed on a first surface of the composite resin film.

18. The copper foil substrate as claimed in claim 17 further includes a second copper foil disposed on a second surface of the composite resin film, the second surface being opposite to the first surface.

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