Heat dissipation structure and heat dissipation coating

Abstract

This invention discloses a heat dissipation structure and a heat dissipation coating. The heat dissipation structure includes a heat dissipation substrate, at least one heat dissipation fin, and a heat dissipation coating. The heat dissipation fin is disposed on the heat dissipation substrate, and the heat dissipation coating is formed and covers the surface of the heat dissipation fin. The heat dissipation coating includes a plurality of micro-protrusion structures arranged along the surface of the heat dissipation fin, and each micro-protrusion structure includes a plurality of heat-conducting particles and a plurality of heat-radiating particles. The plurality of heat-conducting particles are stacked on top of each other to form a three-dimensional profile of the micro-protrusion structure, and have a first average particle size and a thermal conductivity of not less than 200 W / m·K. The plurality of heat-radiating particles are at least partially dispersed on the outer surface of the three-dimensional profile, and have a second average particle size and a thermal emissivity of not less than 0.85, wherein the second average particle size is 0.01 to 0.2 times the first average particle size.

Claims

1. A heat dissipation structure, comprising: A heat dissipation substrate; At least one heat dissipation fin is disposed on the heat dissipation substrate; A heat dissipation coating is formed and covers the surface of the heat dissipation fins; wherein the heat dissipation coating comprises a plurality of micro-protrusion structures arranged along the surface of the heat dissipation fins, and each micro-protrusion structure comprises: a plurality of heat-conducting particles stacked on top of each other to form a three-dimensional profile of the micro-protrusion structure; wherein the plurality of heat-conducting particles have a first average particle size and a thermal conductivity of not less than 200 W / m·K; and a plurality of heat-radiating particles, at least partially dispersed on the outer surface of the three-dimensional profile; wherein the plurality of heat-radiating particles have a second average particle size and a thermal radiation coefficient of not less than 0.85, and the second average particle size is 0.01 to 0.2 times the first average particle size.

2. The heat dissipation structure as described in claim 1, wherein, Each of the microbump structures has a stacking height, which is between 15 and 25 micrometers.

3. The heat dissipation structure as described in claim 1, wherein, Each of the microprotrusions is at least one of the following: hill-shaped, cone-shaped, or pyramid-shaped.

4. The heat dissipation structure as described in claim 1, wherein, The first average particle size of the plurality of heat-conducting particles is between 50 nm and 100 nm, and the second average particle size of the plurality of heat-radiating particles is between 1 nm and 10 nm.

5. The heat dissipation structure as described in claim 1, wherein, The plurality of the heat-conducting particles are particles composed of a diamond-like carbon composition.

6. The heat dissipation structure as described in claim 5, wherein, The diamond-like carbon composition comprises diamond-like carbon and selectively comprises at least one of mesoporous silicon dioxide, silicon, and germanium.

7. The heat dissipation structure as described in claim 1, wherein, The thermal conductivity of the thermally conductive particles is between 200 W / m·K and 1200 W / m·K, and the thermal emissivity of the plurality of thermally radiating particles is between 0.85 and 0.

95.

8. The heat dissipation structure as described in claim 1, wherein, The plurality of said thermal radiation particles are at least one of silicon dioxide, titanium dioxide, aluminum oxide and zinc oxide.

9. A heat dissipation coating comprising: Multiple micro-protrusion structures are arranged in a two-dimensional direction, and each micro-protrusion structure comprises: multiple thermally conductive particles stacked on top of each other to form a three-dimensional profile of the micro-protrusion structure; wherein the multiple thermally conductive particles have a first average particle size and a thermal conductivity coefficient of not less than 200 W / m·K; and multiple thermally radiative particles, at least partially dispersed on the outer surface of the three-dimensional profile; wherein the multiple thermally radiative particles have a second average particle size and a thermal radiation coefficient of not less than 0.85, and the second average particle size is 0.01 to 0.2 times the first average particle size.

10. The heat dissipation coating as described in claim 9, wherein, Multiple micro-protrusion structures have a stacking height between 15 and 25 micrometers; wherein the thermal conductivity of the thermally conductive particles is between 200 W / m·K and 1200 W / m·K, and the thermal emissivity of the multiple thermally radiating particles is between 0.85 and 0.95.

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