Ultrasonic piezoelectric element signal isolation structure and ultrasonic piezoelectric element array structure

Abstract

This invention discloses an ultrasonic piezoelectric element signal isolation structure, comprising a plurality of isolation elements. The plurality of isolation elements and a plurality of ultrasonic piezoelectric element arrays are disposed on a substrate and surround the plurality of ultrasonic piezoelectric element arrays, such that each ultrasonic piezoelectric element array is isolated by the plurality of isolation elements, and each ultrasonic piezoelectric element array contains a plurality of ultrasonic piezoelectric elements. This invention also discloses an ultrasonic piezoelectric element array structure, comprising a plurality of ultrasonic piezoelectric element arrays and a plurality of isolation elements. Each ultrasonic piezoelectric element array contains a plurality of ultrasonic piezoelectric elements. The plurality of isolation elements and the plurality of ultrasonic piezoelectric element arrays are disposed on a substrate and surround the plurality of ultrasonic piezoelectric element arrays, such that each ultrasonic piezoelectric element array is isolated by the plurality of isolation elements.

Claims

1. An ultrasonic piezoelectric element signal isolation structure, comprising: a plurality of isolation elements and a plurality of ultrasonic piezoelectric element arrays disposed on a substrate, wherein each of the isolation elements encloses and surrounds the ultrasonic piezoelectric element arrays, such that each group of ultrasonic piezoelectric element arrays is completely isolated from each other by the isolation elements; wherein each group of ultrasonic piezoelectric element arrays comprises a plurality of first ultrasonic piezoelectric elements.

2. The ultrasonic piezoelectric element signal isolation structure as described in claim 1, wherein the isolation element includes a second ultrasonic piezoelectric element.

3. The ultrasonic piezoelectric element signal isolation structure as described in claim 1 further includes a plurality of interconnecting pad arrays, each interconnecting pad array being disposed on the substrate around the isolation element, such that the area formed by the connection of each interconnecting pad array is larger than the area formed by the isolation element around the ultrasonic piezoelectric element array; wherein each interconnecting pad array includes a plurality of interconnecting pads.

4. The ultrasonic piezoelectric element signal isolation structure as described in claim 3, wherein the complex array of ultrasonic piezoelectric elements is disposed adjacently on the substrate.

5. The ultrasonic piezoelectric element signal isolation structure as described in claim 4, wherein the adjacent array of connecting pads on the substrate are interconnected.

6. The ultrasonic piezoelectric element signal isolation structure as described in claim 1, wherein an ultrasonic isolation frequency generated by the isolation element is different from an ultrasonic element frequency generated by the ultrasonic piezoelectric element.

7. An ultrasonic piezoelectric element array structure, comprising: a plurality of ultrasonic piezoelectric element arrays, each of the ultrasonic piezoelectric element arrays comprising a plurality of first ultrasonic piezoelectric elements; and a plurality of isolation elements disposed on a substrate with the plurality of ultrasonic piezoelectric element arrays, each of the isolation elements enclosing and surrounding the ultrasonic piezoelectric element arrays, such that each of the ultrasonic piezoelectric element arrays is completely isolated from each other by the isolation elements.

8. The ultrasonic piezoelectric element array structure as described in claim 7, wherein the plurality of ultrasonic piezoelectric elements each include a silicon via or a wafer-sized package, and are connected through the silicon via or the wafer-sized package respectively.

9. The ultrasonic piezoelectric element array structure as claimed in claim 7, wherein the isolation element includes the ultrasonic piezoelectric element, and the isolation element generates an ultrasonic isolation frequency that is different from the ultrasonic element frequency generated by the ultrasonic piezoelectric element.

10. The ultrasonic piezoelectric element array structure as described in claim 7 further includes a plurality of arrays of connecting pads, each array of connecting pads being disposed on the substrate around the isolation element, such that the area formed by the connection of each array of connecting pads is larger than the area formed by the isolation element around the ultrasonic piezoelectric element array; wherein each array of connecting pads includes a plurality of connecting pads.

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