Motherboard and cooling module

Abstract

A motherboard includes a circuit board, a processor, and a heat-conducting assembly. The circuit board includes a substrate and an electrical socket. The electrical socket is disposed on the substrate. The processor is inserted into and electrically connected to the electrical socket. The heat-conducting assembly includes a first assembly, a second assembly, and a heat-conducting element. The first assembly and the second assembly are disposed on the substrate of the circuit board, and the processor is located between the first assembly and the second assembly. The heat-conducting element includes a pressing portion, a first assembly portion, and a second assembly portion. The pressing portion is connected between the first assembly portion and the second assembly portion, and the pressing portion has a hollow structure. The first assembly portion abuts against the first assembly portion, and the second assembly portion is interlocked with the second assembly portion to press a portion of the processor between the circuit board and the pressing portion, and the processor portion is located within the hollow structure.

Claims

1. A motherboard, comprising: a circuit board including a substrate and an electrical socket disposed on the substrate; a processor inserted into and electrically connected to the electrical socket; and a heat-conducting assembly including: a first assembly and a second assembly disposed on the substrate of the circuit board, and the processor located between the first assembly and the second assembly; and a heat-conducting member including a pressing portion, a first assembly portion, and a second assembly portion, the first assembly portion and the second assembly portion being respectively located on opposite sides of the pressing portion, and the pressing portion having a hollow structure; wherein, The first assembly abuts against the first assembly, and the second assembly engages with the second assembly to press the processor portion between the circuit board and the pressing portion, and the processor portion is located in the hollow structure.

2. The motherboard as claimed in claim 1, wherein the thermal conductive element further has two heat dissipation sides, the pressing portion is located between the two heat dissipation sides, the two heat dissipation sides have a plurality of heat dissipation fins, and the two heat dissipation sides are thermally coupled to the circuit board.

3. The motherboard as claimed in claim 1, wherein the processor has a thermal contact surface facing away from the substrate and exposed through the cutout structure for thermal contact with a heat sink, the thermally conductive component further having a heat dissipation surface facing away from the substrate, and the thermal contact surface being higher than or flush with the heat dissipation surface.

4. The motherboard as claimed in claim 1, wherein the first assembly has a support flange, and the first assembly portion is positioned and mounted on the support flange such that the first assembly portion can be fixed to the first assembly.

5. The motherboard as claimed in claim 1, wherein the first assembly has at least one hole, the first assembly portion has at least one hook-like structure, and the first assembly portion is hooked onto the at least one hole through the at least one hook-like structure so that the first assembly portion can be fixed to the first assembly.

6. The motherboard as described in claim 4 or 5, wherein the second assembly includes a fixing part, a resilient part, a snap-fit ​​part, and an operating part, the fixing part being disposed on the circuit board, the resilient part being disposed on the fixing part, the operating part being disposed on the resilient part, and the snap-fit ​​part being disposed on the resilient part such that the snap-fit ​​part can be detachably engaged with the second assembly.

7. The motherboard as described in claim 4 or 5, wherein the second assembly includes a latching block and a resetting member, the pressing part has a groove, and the latching block and the resetting member are assembled in the groove so that the latching block can slide and selectively engage with the second assembly.

8. The motherboard as claimed in claim 1, wherein the pressing portion has an inner surface surrounding the hollow structure, and the pressing portion has a plurality of protrusions protruding perpendicular to the inner surface.

9. The motherboard as claimed in claim 1, further comprising a plurality of fasteners, wherein the first assembly and the second assembly are secured to the circuit board by the fasteners.

10. A heat-conducting assembly for mounting on a circuit board having a processor, the heat-conducting assembly comprising: a first assembly and a second assembly mounted on a substrate of the circuit board, the processor being located between the first assembly and the second assembly; and a heat-conducting member comprising a pressing portion, a first assembly, and a second assembly, the pressing portion being connected between the first assembly and the second assembly located on opposite sides of the pressing portion, and the pressing portion having a hollow structure; wherein, The first assembly abuts against the first assembly, and the second assembly engages with the second assembly to press the processor portion between the circuit board and the pressing portion, and the processor portion is located in the hollow structure.

11. The thermally conductive assembly as claimed in claim 10, wherein the thermally conductive member further has two heat dissipation sides, the pressing portion is located between the two heat dissipation sides, the two heat dissipation sides have a plurality of heat dissipation fins, and the two heat dissipation sides are thermally coupled to the circuit board.

12. The thermally conductive assembly as claimed in claim 10, wherein the processor has a thermal contact surface facing away from the substrate and exposed through the cutout structure for thermal contact with a heat sink, the thermally conductive member further having a heat dissipation surface facing away from the substrate, and the thermal contact surface being higher than or flush with the heat dissipation surface.

13. The heat-conducting assembly as claimed in claim 10, wherein the first assembly has a support flange, the first assembly portion has a positioning groove, and the first assembly portion is positioned and mounted on the support flange through the positioning groove so that the first assembly portion can be fixed to the first assembly.

14. The heat-conducting assembly as claimed in claim 10, wherein the first assembly has at least one hole, the first assembly portion has at least one hook-like structure, and the first assembly portion hooks onto the at least one hole through the at least one hook-like structure so that the first assembly portion can be fixed to the first assembly.

15. The heat-conducting assembly as described in claim 13 or 14, wherein the second assembly includes a fixing portion, an elastic portion, a snap-fit ​​portion, and an operating portion, the fixing portion being disposed on the circuit board, the elastic portion being disposed on the fixing portion, the operating portion being disposed on the elastic portion, and the snap-fit ​​portion being disposed on the elastic portion such that the snap-fit ​​portion can be detachably engaged with the second assembly.

16. The heat-conducting assembly as described in claim 13 or 14, wherein the second assembly includes a snap-fit ​​block and a reset member, the pressing portion has a groove, and the snap-fit ​​block and the reset member are assembled in the groove such that the snap-fit ​​block can slide and selectively engage with the second assembly.

17. The heat-conducting assembly as claimed in claim 10, wherein the pressing portion has an inner surface surrounding the hollow structure, and the pressing portion has a plurality of protrusions protruding perpendicular to the inner surface.

18. The thermally conductive assembly as described in claim 10, further comprising a plurality of fasteners, wherein the first assembly and the second assembly are secured to the circuit board via the fasteners.

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