Storage device with double-layer staggered separation heat dissipation

Abstract

This invention provides a dual-layer staggered heat dissipation storage device, including a circuit board, a first heat-generating chip, a second heat-generating chip, a first heat dissipation fin assembly, and a second heat dissipation fin assembly. The first heat-generating chip and the second heat-generating chip are stacked on the circuit board along a first direction. The first heat dissipation fin assembly is thermally coupled to the first heat-generating chip and includes a first bonding portion and a first fin. The first bonding portion is attached to the first heat-generating chip. The first fin is disposed at least above the second heat-generating chip and extends or connects to the first bonding portion. The second heat dissipation fin assembly is thermally coupled to the second heat-generating chip and includes a second bonding portion and a second fin. The second bonding portion is attached to the second heat-generating chip. The second fin is disposed at least above the first heat-generating chip and extends or connects to the second bonding portion.

Claims

1. A dual-layer staggered, separated heat dissipation storage device, comprising: A circuit board has an upper surface; a first heating chip is stacked on the upper surface of the circuit board along a first direction. A second heat-generating chip is stacked on the upper surface of the circuit board along the first direction and spaced apart from the first heat-generating chip in a second direction, wherein the heat generation of the first heat-generating chip is greater than that of the second heat-generating chip, and the second direction is perpendicular to the first direction; a first heat dissipation fin assembly is thermally coupled to the first heat-generating chip and includes a first bonding portion and a plurality of first fins, wherein the first bonding portion is attached to the first heat-generating chip, the plurality of first fins are spatially disposed at least above the second heat-generating chip, and the plurality of first fins extend or connect to the first bonding portion; and a second heat dissipation fin assembly is thermally coupled to the second heat-generating chip and includes a second bonding portion and a plurality of second fins, wherein the second bonding portion is attached to the second heat-generating chip, the plurality of second fins are spatially disposed at least above the first heat-generating chip, and the plurality of second fins extend or connect to the second bonding portion.

2. The dual-layer staggered split heat dissipation storage device as claimed in claim 1, wherein the first bonding portion is connected to the plurality of first fins via a first connecting portion, the second bonding portion is connected to the plurality of second fins via a second connecting portion, and the first connecting portion and the second connecting portion are staggered with each other in the viewing direction of the first direction.

3. The dual-layer staggered split heat dissipation storage device as claimed in claim 2, wherein each of the plurality of first fins and the plurality of second fins extends along a third direction and is spaced apart from each other in the second direction.

4. The dual-layer staggered heat dissipation storage device as claimed in claim 2, wherein the plurality of first fins and the plurality of second fins are made of an aluminum material, and the first bonding portion, the first connecting portion, the second bonding portion and the second connecting portion are made of a copper material.

5. The dual-layer staggered heat dissipation storage device as claimed in claim 1, wherein the first heat dissipation fin assembly is made of copper and the second heat dissipation fin assembly is made of aluminum.

6. The dual-layer staggered split heat dissipation storage device as claimed in claim 1, wherein the plurality of first fins extend along the second direction to above the first mating portion, the plurality of second fins extend along the second direction to above the second mating portion, and the plurality of first fins and the plurality of second fins are staggered with each other in the view along the first direction.

7. The dual-layer staggered heat dissipation storage device as claimed in claim 1, wherein the plurality of first fins extend along the second direction to above the first mating portion, the plurality of second fins extend along the second direction to above the second mating portion, and the plurality of first fins and the plurality of second fins are staggered relative to each other in the view along the first direction.

8. The dual-layer staggered split heat dissipation storage device as claimed in claim 1, wherein the plurality of first fins and the second bonding portion are spaced apart in the first direction, and the plurality of second fins and the first bonding portion are spaced apart in the first direction.

9. The dual-layer staggered split heat dissipation storage device as claimed in claim 1, wherein the first heat dissipation fin assembly and the second heat dissipation fin assembly have the same structure.

10. The dual-layer staggered split heat dissipation storage device as claimed in claim 1, wherein the first heat-generating chip is a controller chip and the second heat-generating chip is a flash memory chip.

11. The dual-layer staggered split heat dissipation storage device as claimed in claim 1, wherein the first bonding portion is bonded to a top surface of the first heat-generating chip via a thermal interface material layer, and the second bonding portion is bonded to a top surface of the second heat-generating chip via a thermal interface material layer.

12. The dual-layer staggered split heat dissipation storage device as claimed in claim 1, wherein the top edges of the plurality of first fins and the top edges of the plurality of second fins are configured to form a common plane or a convex arc surface relative to the upper surface of the circuit board.

13. The dual-layer staggered split heat dissipation storage device as claimed in claim 1, further comprising a locking fastener for locking the first heat dissipation fin assembly and the circuit board, such that the first bonding portion is thermally coupled to a top surface of the first heat-generating chip, and / or locking the second heat dissipation fin assembly and the circuit board, such that the second bonding portion is thermally coupled to a top surface of the second heat-generating chip.

14. The dual-layer staggered split heat dissipation storage device as claimed in claim 13, wherein the fastener engages two opposite sides of the circuit board and two opposite sides of the first bonding portion and / or two opposite sides of the second bonding portion.

15. The dual-layer staggered heat dissipation storage device as claimed in claim 1, wherein the first heat dissipation fin assembly and the second heat dissipation fin assembly are not in contact with each other and are not thermally coupled.

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