Integrated optical sensing module and method of manufacturing the same

Abstract

An integrated optical sensing module includes a circuit board, a light-emitting wafer, a time-of-flight wafer, a bracket, a superlens assembly, and a light-shielding member. The light-emitting wafer is located above the circuit board. The time-of-flight wafer is located above the circuit board or within a recess of the circuit board. The bracket is located above the circuit board and has a partition wall separating the effective areas of the light-emitting wafer and the time-of-flight wafer. The superlens assembly is mounted on the bracket and has a first superlens and a second superlens corresponding to the effective areas of the light-emitting wafer and the time-of-flight wafer, respectively. The light-shielding member is disposed between the first and second superlenses and is perpendicularly adjacent to and aligned with the partition wall of the bracket, wherein the bracket and the light-shielding member are made of different materials. A method for manufacturing the integrated optical sensing module and an integrated optical sensing module manufactured by this method are also provided.

Claims

1. An integrated optical sensing module, comprising: A circuit board; A light-emitting wafer is located above the circuit board; a time-of-flight (ToF) wafer is located above the circuit board or within a recess of the circuit board; a support is located above the circuit board and has a partition wall separating an effective area of ​​the light-emitting wafer and the time-of-flight wafer; a superlens assembly is mounted on the support and has a first superlens and a second superlens respectively facing the effective areas of the light-emitting wafer and the time-of-flight wafer, wherein a bevel of the first superlens and a bevel of the second superlens are opposite each other to define a groove; and a light-shielding member is disposed in the groove between the first superlens and the second superlens and contacts the bevel of the first superlens and the bevel of the second superlens, and is perpendicularly adjacent to and aligned with the partition wall of the support, wherein the support and the light-shielding member are made of different materials, and the top width of the light-shielding member is greater than the bottom width of the light-shielding member.

2. The integrated optical sensing module as described in claim 1, wherein the light-shielding element is made of a light-shielding adhesive.

3. The integrated optical sensing module as described in claim 1, wherein the light emitting chip is a vertical-cavity surface-emitting laser (VCSEL) chip.

4. A method for manufacturing an integrated optical sensing module, comprising: A receiving assembly structure is provided, comprising: a circuit board; a light-emitting wafer located above the circuit board; a time-of-flight wafer located above the circuit board or within a recess of the circuit board; and a support located above the circuit board and having a partition wall separating an effective area of ​​the light-emitting wafer and the time-of-flight wafer; mounting a monolithic superlens on the support of the assembly structure, aligning it with the effective areas of the light-emitting wafer and the time-of-flight wafer; removing a portion of the monolithic superlens aligning with the partition wall of the support to form a groove having two opposing bevels, thereby defining a first superlens and a second superlens, respectively aligning with the effective areas of the light-emitting wafer and the time-of-flight wafer; and forming a light-shielding member within the groove and contacting the bevels, wherein a top width of the light-shielding member is greater than a bottom width of the light-shielding member.

5. The manufacturing method as described in claim 4, wherein removing the portion of the monolithic superlens corresponding to the partition wall of the support to form the groove having the two opposing bevels is achieved by a laser cutting process.

6. The manufacturing method as described in claim 4, wherein forming the light-shielding member in the groove and contacting the inclined surfaces is achieved by filling the groove with a light-shielding adhesive.

7. An integrated optical sensing module, manufactured by the method described in claim 4.

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