Substrate cleaning apparatus and substrate cleaning method

Abstract

This invention relates to a substrate cleaning apparatus and method for cleaning substrates such as semiconductor wafers, and particularly to a substrate cleaning apparatus and method for cleaning the peripheral portion of a substrate. The substrate cleaning apparatus (1) comprises: a substrate holding part (10) for holding and rotating a substrate (W); a holding part (22) having an internal space (R) for contacting a cleaning tape (19) with the peripheral portion of the substrate (W); a holding part moving mechanism (30) for controlling the position of the holding part (22) in the radial direction of the substrate (W); and a pressure adjuster (44) for controlling the pressure of the internal space (R); the holding part (22) comprises: a hollow support member (24) having an opening (24a); and an elastic body (27) for supporting the cleaning tape (19); the elastic body 27 is arranged in such a way as to close the opening (24a).

Description

Technical Field

[0001] This invention relates to a substrate cleaning apparatus and method for cleaning substrates such as semiconductor wafers, and particularly to a substrate cleaning apparatus and method for cleaning the peripheral portion of a substrate. Prior Technology

[0002] From the perspective of improving the yield rate in semiconductor device manufacturing, the management of substrate surface condition has received increasing attention in recent years. The semiconductor device manufacturing process involves forming various material films on silicon wafers. Consequently, unwanted films and surface roughness are formed at the periphery of the substrate. In recent years, robotic arms have been commonly used to transport substrates while holding only the periphery. However, in this context, the unwanted films remaining at the periphery can peel off and adhere to the devices formed on the substrate during various processes, leading to a decrease in yield. Therefore, to remove the unwanted films formed at the substrate periphery, a polishing device is used to polish the substrate periphery.

[0003] However, when polishing the periphery of a substrate, foreign matter (microparticles) such as polishing shavings adhere to the periphery. This contamination of the substrate results in a lower yield rate during semiconductor manufacturing. Therefore, in the past, the periphery of the substrate was cleaned to remove these foreign matter. One method for cleaning the periphery is to rotate a cleaning tool made of PVA (polyvinyl alcohol) sponge around its axis and slide it against the periphery of the substrate. [Previous Technical Documents] [Patent Literature]

[0004] [Patent Document 1] Japanese Patent Application Publication No. 2018-161721 [Patent Document 2] Japanese Patent Application Publication No. 2019-216207 [Patent Document 3] Japanese Patent No. 4125148 Summary of the Invention

[0005] (The problem the invention aims to solve)

[0006] However, the above-mentioned cleaning methods have problems such as discoloration due to the adhering microparticles, breakage of contact parts, and inability to remove foreign matter adhering to the substrate, leaving residues.

[0007] The present invention addresses the aforementioned problems and aims to provide a substrate cleaning apparatus and method that improves the cleaning effect on the periphery of a substrate. (Solutions)

[0008] One embodiment provides a substrate cleaning apparatus comprising: a substrate holding portion for holding and rotating a substrate; a support portion having an internal space for contacting a cleaning tape with the periphery of the substrate; a support portion moving mechanism for controlling the position of the support portion in the radial direction of the substrate; and a pressure adjuster for controlling the pressure of the internal space; wherein the support portion comprises: a hollow support member having an opening; and an elastic body for supporting the cleaning tape; wherein the elastic body is configured to close the opening.

[0009] One embodiment of the aforementioned support moving mechanism includes: a ball screw mechanism connected to the aforementioned support; and a motor for operating the aforementioned ball screw mechanism. One type is the aforementioned servo motor. One type is the aforementioned pressure regulator system, which is an electro-pneumatic pressure regulating valve. One embodiment of the aforementioned substrate cleaning apparatus further includes a vertical movement mechanism, which causes the aforementioned top portion to move vertically. One embodiment of the aforementioned substrate cleaning apparatus further includes a tape cleaning mechanism for cleaning the aforementioned cleaning tape. The tape cleaning mechanism includes a cleaning fluid supply nozzle for supplying cleaning fluid to the surface of the aforementioned cleaning tape. One embodiment of the aforementioned tape cleaning mechanism further includes a cleaning brush, which contacts the surface of the aforementioned cleaning tape to clean the tape. One embodiment of the aforementioned substrate cleaning apparatus further includes a first reel and a second reel, which respectively hold the two ends of the aforementioned cleaning tape. The first reel and the second reel are arranged such that the aforementioned cleaning tape travels in a horizontal direction.

[0010] One embodiment provides a substrate cleaning method, which involves holding and rotating a substrate by a substrate holding part, causing a cleaning tape to travel in a certain direction, and using a support part with an internal space to contact the cleaning tape with the peripheral portion of the substrate to clean the peripheral portion of the substrate. The process of cleaning the peripheral portion of the substrate includes the following steps: controlling the position of the support part in the radial direction of the substrate by a support part moving mechanism; and controlling the pressure of the internal space of the support part by a pressure adjuster. The support part includes: a hollow support member having an opening; and an elastic body supporting the cleaning tape; the elastic body is configured to close the opening.

[0011] One embodiment of the aforementioned support moving mechanism includes: a ball screw mechanism connected to the aforementioned support; and a motor for operating the aforementioned ball screw mechanism. One type is the aforementioned servo motor. One type is the aforementioned pressure regulator system, which is an electro-pneumatic pressure regulating valve. One approach is to further include the process of cleaning the periphery of the aforementioned substrate by moving the aforementioned support portion up and down during the cleaning of the periphery of the aforementioned substrate. One embodiment of the aforementioned substrate cleaning method further includes the cleaning of the peripheral portion of the aforementioned substrate, wherein a tape cleaning mechanism supplies cleaning fluid to the cleaning tape that comes into contact with the peripheral portion of the aforementioned substrate to clean the cleaning tape that comes into contact with the peripheral portion of the aforementioned substrate. One embodiment of the aforementioned substrate cleaning method further includes cleaning the periphery of the aforementioned substrate with a specified number of wafers, conveying the aforementioned cleaning tape in a certain direction, and supplying cleaning fluid to the aforementioned cleaning tape after it has come into contact with the periphery of the aforementioned substrate by means of a tape cleaning mechanism, thereby cleaning the aforementioned cleaning tape after it has come into contact with the periphery of the aforementioned substrate. One embodiment further includes a process of completely winding the aforementioned cleaning tape onto either a first spool holding one end of the aforementioned cleaning tape or a second spool holding the other end of the aforementioned cleaning tape, then causing the aforementioned cleaning tape to travel in the opposite direction and cleaning the periphery of the aforementioned substrate. One aspect is the process of making the aforementioned cleaning tape move in a certain direction, which is the process of making the aforementioned cleaning tape move in a horizontal direction. (Effects of the invention)

[0012] When using this invention, the substrate cleaning apparatus can always clean the periphery of the substrate using the clean portion of the cleaning tape. Furthermore, by controlling the movement distance of the abutment, the cleaning position can be arbitrarily changed, and by controlling the pressure within the abutment's internal space, the pressure applied to the substrate from the abutment can be controlled. As a result, the cleaning effect on the periphery of the substrate can be improved. Simple Explanation of the Diagram

[0013] Figure 1A is an enlarged cross-sectional view of the periphery of the display substrate. Figure 1B is an enlarged cross-sectional view of the periphery of the display substrate. Figure 2 is a top view of one embodiment of the substrate cleaning apparatus for display. Figure 3 is a perspective view of the substrate cleaning apparatus shown in Figure 2. Figure 4 is a view of the perimeter cleaning unit as indicated by arrow A in Figure 2. Figure 5 is a schematic diagram of the peripheral cleaning unit shown in Figures 2 to 4. Figure 6 is a view of the top section as indicated by arrow B in Figure 5. Figure 7A shows the state of the cleaning tape leaving the periphery of the wafer. Figure 7B shows the state of the cleaning tape contacting the periphery of the wafer through the elastomer. Figure 7C shows a state diagram in which the top part is moved further from the state shown in Figure 7B to the inner side in the radial direction. Figure 8 is a schematic diagram showing other implementations of the peripheral cleaning unit. Figure 9 is a view of the peripheral cleaning unit in Figure 8 from the direction indicated by arrow C in Figure 8. Figure 10A shows a state diagram where the centerline in the wafer thickness direction is located in the center of the top portion. Figure 10B shows the state diagram of the top part being lowered from the position shown in Figure 10A. Figure 10C shows a diagram of the state in which the top part is raised from the position shown in Figure 10A. Figure 11 is a schematic diagram showing another embodiment of the peripheral cleaning unit. Figure 12 is a view of the peripheral cleaning unit in Figure 11 from the direction indicated by arrow D in Figure 11. Figure 13 is a schematic diagram showing one embodiment of the tape cleaning mechanism. Figure 14 is a schematic diagram showing other embodiments of the tape cleaning mechanism. Figure 15 is a schematic diagram showing another embodiment of the peripheral cleaning unit. Figure 16 shows a perspective view of other embodiments of the substrate cleaning apparatus. Figure 17 shows a top view of another embodiment of the substrate cleaning apparatus. Figure 18 is a longitudinal cross-sectional view of the substrate cleaning apparatus shown in Figure 17. Figure 19 shows an enlarged view of the grinding head. Figure 20 shows the process of a grinding head grinding the beveled part of a wafer. Figure 21 is a schematic diagram showing another embodiment of the peripheral cleaning unit. Figure 22 is a schematic diagram showing another embodiment of the peripheral cleaning unit. Implementation

[0014] Hereinafter, embodiments of the present invention will be described with reference to the drawings. In addition, in the drawings described below, the same symbols are used on the same or equivalent constituent elements, and repeated descriptions are omitted. In this specification, the periphery of the substrate is defined as including: the beveled portion located at the outermost periphery of the substrate, the top edge portion located radially inside the beveled portion, and the bottom edge portion.

[0015] Figures 1A and 1B are enlarged cross-sectional views of the peripheral portion of the display substrate. More specifically, Figure 1A is a cross-sectional view of a so-called right-angled substrate, and Figure 1B is a cross-sectional view of a so-called rounded-corner substrate. In the wafer W (an example of a substrate) in Figure 1A, the beveled portion is the outermost peripheral surface of the wafer W (denoted by the symbol V), which is formed by the upper beveled portion (upper beveled portion) S, the lower beveled portion (lower beveled portion) U, and the side portion (vertex) T. In the wafer W in Figure 1B, the beveled portion is the portion with a curved cross-section that constitutes the outermost peripheral surface of the wafer W (denoted by the symbol V). The top edge is a flat portion Ed1 located radially inward of the beveled portion V. The bottom edge is located on the opposite side of the top edge and is a flat portion Ed2 located radially inward of the beveled portion V. The top edge Ed1 also includes an area where components are formed.

[0016] Figure 2 is a top view showing one embodiment of the substrate cleaning apparatus, and Figure 3 is a perspective view of the substrate cleaning apparatus shown in Figure 2. As shown in Figures 2 and 3, the substrate cleaning apparatus 1 includes: a substrate holding part 10 that holds and rotates a wafer W, one example of a substrate; an upper roller cleaning member (roller sponge) 12 rotatably supported on a first roller holder (not shown); a lower roller cleaning member (roller sponge) 13 rotatably supported on a second roller holder (not shown); two upper liquid supply nozzles 14 and 15 that supply liquid as cleaning fluid to the top of the wafer W; two lower liquid supply nozzles 16 and 17 that supply liquid as cleaning fluid to the bottom of the wafer W; a peripheral cleaning unit 20 that cleans the peripheral portion of the wafer W by contacting the cleaning tape 19 with the peripheral portion of the wafer W; and an operation control part 9 that controls the operation of each component of the substrate cleaning apparatus 1. In the following description, the top of the wafer W refers to the surface (component side) of the wafer W, and the bottom refers to the back side of the wafer W.

[0017] The substrate cleaning apparatus 1 of this embodiment can perform both cleaning of the upper and lower surfaces of the wafer W by means of the drum cleaning members 12 and 13 and cleaning of the periphery of the wafer W by means of the peripheral cleaning unit 20. The substrate holding unit 10 includes: a plurality of spindles 11 (four in this embodiment) for holding the periphery of the wafer W and rotating the wafer W horizontally; a spindle drive mechanism (not shown); and a substrate rotation mechanism (not shown). The plurality of spindles 11 can be moved in the direction of approaching and moving away from the wafer W (horizontal direction) by means of the spindle drive mechanism (e.g., an air cylinder). The plurality of spindles 11 are provided with a plurality of stops 11a.

[0018] The substrate holding portion 10 positions the periphery of the wafer W within a groove formed on the outer peripheral side of the stop 11a located on the upper part of each spindle 11. The wafer W is held by pressing it inward, and the wafer W is horizontally rotated by rotating the stop 11a. In this embodiment, two of the four stop 11a are connected to a substrate rotation mechanism (not shown), and these two stop 11a can rotate in the same direction via the substrate rotation mechanism. With the four stop 11a holding the wafer W, the wafer W rotates around its axis Cr by rotating two of the stop 11a. That is, two of the four stop 11a apply rotational force to the wafer W, while the other two stop 11a function as bearings to support the rotation of the wafer W. In another embodiment, all the stop 11a can be connected to the substrate rotation mechanism to apply rotational force to the wafer W.

[0019] The upper drum cleaning component 12 and the lower drum cleaning component 13 are cylindrical and extend in a long strip. The upper drum cleaning component 12 is composed of a cylindrical core material 12a and a tubular sponge component 12b fixed to the outer periphery of the core material 12a. The lower drum cleaning component 13 is composed of a cylindrical core material 13a and a tubular sponge component 13b fixed to the outer periphery of the core material 13a. The sponge components 12b and 13b are, for example, made of polyvinyl alcohol (PVA).

[0020] The substrate cleaning apparatus 1 further includes: a first roller cleaning member rotation mechanism (not shown) for rotating the upper roller cleaning member 12 around its axis AX1; and a second roller cleaning member rotation mechanism (not shown) for rotating the lower roller cleaning member 13 around its axis AX2. The roller cleaning members 12 and 13 rotate in the direction of the arrow shown in FIG3 by means of the first and second roller cleaning member rotation mechanisms.

[0021] The substrate cleaning apparatus 1 further includes: a first lifting mechanism (not shown) for moving the upper roller cleaning member 12, the first roller holder, and the first roller cleaning member rotation mechanism in the vertical direction; and a second lifting mechanism (not shown) for moving the lower roller cleaning member 13, the second roller holder, and the second roller cleaning member rotation mechanism in the vertical direction. That is, the upper roller cleaning member 12 is freely movable above the wafer W, and the lower roller cleaning member 13 is freely movable below the wafer W.

[0022] Upper liquid supply nozzles 14 and 15 are disposed above the wafer W held in the substrate holding portion 10, and lower liquid supply nozzles 16 and 17 are disposed below the wafer W held in the substrate holding portion 10. Upper liquid supply nozzle 14 and lower liquid supply nozzle 16 supply rinsing fluid (e.g., ultrapure water) to the nozzles above and below the wafer W, respectively, while upper liquid supply nozzle 15 and lower liquid supply nozzle 17 supply chemical solution to the nozzles above and below the wafer W, respectively. Upper liquid supply nozzle 14 and lower liquid supply nozzle 16 are connected to a rinsing fluid supply source (not shown), and upper liquid supply nozzle 15 and lower liquid supply nozzle 17 are connected to a chemical solution supply source (not shown).

[0023] The motion control unit 9 is electrically connected to the substrate holding part 10, the first and second roller cleaning component rotation mechanism, the first and second lifting mechanism, the lower liquid supply nozzles 16 and 17, and the upper liquid supply nozzles 14 and 15. The motion of the substrate holding part 10, the first and second roller cleaning component rotation mechanism, the first and second lifting mechanism, the lower liquid supply nozzles 16 and 17, and the upper liquid supply nozzles 14 and 15 is controlled by the motion control unit 9.

[0024] The motion control unit 9 includes: a memory device 9a for storing programs; and a processing device 9b for executing operations according to commands contained in the programs. The processing device 9b includes a CPU (Central Processing Unit) or GPU (Graphics Processing Unit) for performing operations according to commands contained in the programs stored in the memory device 9a. The memory device 9a includes: a main memory device (e.g., random access memory) capable of accessing the processing device 9b; and an auxiliary memory device (e.g., a hard disk drive or solid-state drive) for storing data and programs. The motion control unit 9 is composed of at least one computer. However, the specific configuration of the motion control unit 9 is not limited to this example.

[0025] Next, the process of cleaning the top and bottom surfaces of the wafer W will be explained. First, the wafer W is held horizontally with its surface facing upward by the substrate holding part 10, and the wafer W is rotated around its axis Cr. Next, rinsing fluid is supplied to the top and bottom surfaces of the wafer W from the upper liquid supply nozzle 14 and the lower liquid supply nozzle 16, respectively, and chemical solution is supplied to the top and bottom surfaces of the wafer W from the upper liquid supply nozzle 15 and the lower liquid supply nozzle 17, respectively. In this state, by rotating and lowering the upper roller cleaning member 12 around the axis AX1, the sponge member 12b contacts the top surface of the rotating wafer W, and by rotating and rising the lower roller cleaning member 13 around the axis AX2, the sponge member 13b contacts the bottom surface of the rotating wafer W.

[0026] In this manner, the upper and lower surfaces of the wafer W are rubbed cleaned by the roller cleaning components 12 and 13 in the presence of a cleaning solution (rinsing solution and chemical solution). The roller cleaning components 12 and 13 are longer than the diameter of the wafer W and can contact the entire upper and lower surfaces of the wafer W. In one embodiment, the cleaning process of the upper and lower surfaces of the wafer W described above is performed after the surface of the substrate has been polished by chemical mechanical polishing (CMP) or similar methods.

[0027] Next, the peripheral cleaning unit 20 will be described in detail. Figure 4 is a view of the peripheral cleaning unit 20 as indicated by arrow A in Figure 2. As shown in Figures 2 to 4, the peripheral cleaning unit 20 includes: a holding part 22 that contacts the cleaning tape 19, which serves as a cleaning tool, with the peripheral portion of the wafer W to clean the peripheral portion of the wafer W; a holding part moving mechanism 30 that moves the holding part 22 in the radial direction of the wafer W; and a tape conveying unit 40 that holds the cleaning tape 19 and allows it to travel in its longitudinal direction. Figures 2 to 4 are illustrations omitting the fluid delivery line 42, pressure regulator 44, fluid supply source 46, and on / off valves 48a and 48b, which will be described later.

[0028] The tape conveying unit 40 includes: a first spool 50 and a second spool 51 that respectively hold the two ends of the cleaning tape 19; and a first spool rotary motor 52 and a second spool rotary motor 53 that rotate the first spool 50 and the second spool 51 respectively. The first spool rotary motor 52 and the second spool rotary motor 53 are respectively connected to the first spool 50 and the second spool 51. The peripheral cleaning unit 20 is arranged such that the supporting part 22 is located between two of the four main shafts 11.

[0029] When the holding portion 22 holds the wafer W on the substrate holding portion 10, it faces the periphery of the wafer W. The cleaning tape 19 extends from the first reel 50 to the second reel 51 via the holding portion 22 with the cleaning surface of the cleaning tape 19 facing the periphery of the wafer W. The back side of the cleaning tape 19 (the side opposite to the cleaning surface) is supported by the holding portion 22.

[0030] First guide roller 54 and second guide roller 55 are respectively disposed between the first and second reels 50 and 51 and the top support portion 22. The guide rollers 54 and 55 support the cleaning tape 19 extending between the reels 50 and 51 and the top support portion 22. The cleaning tape 19 is moved in a certain direction by driving the tape conveyor unit 40.

[0031] In this embodiment, the reel motors 52 and 53 rotate the reels 50 and 51 in the direction of the arrows shown in Figure 2, pulling out the cleaning tape 19 from the first reel 50 and winding it onto the second reel 51. The cleaning tape 19, under a specified tension, sequentially travels from the first reel 50 to the second reel 51 via the first guide roller 54, the support portion 22, and the second guide roller 55. The reels 50 and 51 and the reel motors 52 and 53 are arranged such that the cleaning tape 19 travels in a horizontal direction (tangential to the wafer W). This allows for the compact formation of the tape transport unit 40.

[0032] The tape conveying unit 40 can be configured to cause the cleaning tape 19 to travel in the opposite direction to the direction of transport from the first reel 50 to the second reel 51. That is, the reel rotation motors 52 and 53 rotate the reels 50 and 51 in the opposite direction to the arrow direction shown in FIG2, pulling the cleaning tape 19 out of the second reel 51 and winding it onto the first reel 50. At this time, the cleaning tape 19, under a specified tension, travels sequentially from the second reel 51 to the first reel 50 via the second guide roller 55, the support portion 22, and the first guide roller 54.

[0033] In one embodiment, the tape conveying unit 40 may also include a tape conveying mechanism for conveying the cleaning tape 19 from the first reel 50 to the second reel 51 (or from the second reel 51 to the first reel 50). The tape conveying mechanism includes: a tape conveying roller; a tape gripping roller disposed beside the tape conveying roller; and a motor connected to the tape conveying roller. In one embodiment of the tape conveying unit 40, the cleaning tape 19 is clamped between the tape conveying roller and the tape gripping roller. In another embodiment, the tape conveying unit 40 may be configured to rotate the tape conveying roller via a motor connected to it, thereby conveying the cleaning tape 19 from the first reel 50 (or the second reel 51) to the second reel 51 (or the first reel 50) via the abutment portion 22. Alternatively, a specified tension may be applied to the cleaning tape 19 by rotating the first reel 50 and the second reel 51 in opposite directions.

[0034] The tape delivery unit 40 is electrically connected to the motion control unit 9. The movement of the tape delivery unit 40 is controlled by the motion control unit 9. Examples of cleaning tape 19 include tape made of non-woven fabric or tape made of sponge. In one embodiment, the cleaning tape 19 may also have abrasive particles such as silicon dioxide (SiO2) on its surface (cleaning surface). This allows the cleaning tape 19 to have a slight abrasive force.

[0035] Figure 5 is a schematic diagram of the peripheral cleaning unit 20 shown in Figures 2 to 4, and Figure 6 is a view of the support portion 22 viewed from the direction indicated by arrow B in Figure 5. Figure 5 omits illustrations of the tape conveying unit 40 and guide rollers 54 and 55. As shown in Figures 5 and 6, the support portion 22 includes: a hollow support member 24; and an elastic body 27 supporting the cleaning tape 19. The support portion 22 has an internal space R, and the support member 24 has an opening 24a facing the wafer W. The support member 24 has: a base 25; and a plurality of protrusions 26a, 26b, 26c, and 26d extending vertically from the base 25. The base 25 and the protrusions 26a, 26b, 26c, and 26d are arranged to surround the internal space R, and the base 25 and the protrusions 26a, 26b, 26c, and 26d are integrated.

[0036] The elastomer 27 is positioned to close the opening 24a and contacts the ends of the protrusions 26a, 26b, 26c, and 26d. More specifically, the elastomer 27 is stretched between the ends of the protrusions 26a, 26b, 26c, and 26d. An internal space R is formed in the supporting portion 22 by means of the supporting member 24 and the elastomer 27. The supporting member 24 is a rigid body, and the elastomer 27 is made of elastic rubber or the like. In one embodiment, a coating is applied to the surface of the elastomer 27 to ensure smoothness with the cleaning tape 19.

[0037] The support portion movement mechanism 30 is configured to control the position of the support portion 22 in the radial direction of the wafer W (the movement distance of the support portion 22 from a predetermined reference position). The support portion movement mechanism 30 is electrically connected to the motion control unit 9, and the movement of the support portion movement mechanism 30 is controlled by the motion control unit 9. The motion control unit 9 is configured to issue commands to the support portion movement mechanism 30 to control the position of the support portion 22. Specifically, the motion control unit 9 transmits a target value (target value of movement distance) for the position of the support portion 22 to the support portion movement mechanism 30, and the support portion movement mechanism 30 controls the position of the support portion 22 according to the target value, such that the support portion 22 is located at the target position.

[0038] The supporting part 22 is connected to the supporting part moving mechanism 30 via the fixing member 32. The supporting part moving mechanism 30 includes: a ball screw mechanism 34; and a motor 36 for operating the ball screw mechanism 34. The ball screw mechanism 34 includes: a nut mechanism 34a fixed to the fixing member 32; and a screw shaft 34b screwed into the nut mechanism 34a. The screw shaft 34b is connected to the motor 36. In this embodiment, the motor 36 is a servo motor. In another embodiment, a stepper motor may also be used as the motor 36.

[0039] The motion control unit 9 issues a command to the abutment movement mechanism 30, causing the motor 36 to rotate, and the screw shaft 34b to rotate. As a result, the abutment 22 moves in a direction close to or away from the wafer W via the nut mechanism 34a and the fixing member 32. The movement of the nut mechanism 34a is guided by the linear guide rail 38. The motor 36 rotates the screw shaft 34b by positioning the abutment 22 at the target position, thereby controlling the movement distance of the abutment 22. In one embodiment, the abutment movement mechanism 30 may also be a combination of an air cylinder and a pressure regulator.

[0040] As shown in Figure 5, the peripheral cleaning unit 20 further includes: a fluid delivery line 42; and a pressure regulator 44 for controlling the pressure of the internal space R. An internal passage 25a is formed inside the base 25 of the support member 24. One end of the fluid delivery line 42 is connected to the internal passage 25a, and the other end is connected to a fluid supply source 46. The fluid delivery line 42 is connected to the internal space R through the internal passage 25a. Fluids such as gas (air, nitrogen, etc.) and liquid (water, etc.) are supplied from the fluid supply source 46 to the internal space R through the fluid delivery line 42 and the internal passage 25a.

[0041] Pressure regulator 44 is connected to fluid delivery line 42. Fluid delivery line 42 is further connected to on / off valves 48a and 48b. By opening on / off valves 48a and 48b, fluid from fluid supply source 46 is supplied to internal space R through pressure regulator 44 and on / off valves 48a and 48b.

[0042] The motion control unit 9 is electrically connected to the pressure regulator 44 and the on / off valves 48a and 48b. The operation of the pressure regulator 44 and the on / off valves 48a and 48b is controlled by the motion control unit 9. The motion control unit 9 is configured to issue commands to the pressure regulator 44 to control the pressure of the internal space R. Specifically, the motion control unit 9 transmits a specified target pressure value to the pressure regulator 44, and the pressure regulator 44 adjusts the fluid pressure within the internal space R so that the pressure of the internal space R becomes the target pressure value. The pressure regulator 44 controls the pressure of the internal space R by adjusting the fluid pressure within the internal space R. An example of a pressure regulator 44 is an electro-pneumatic pressure regulating valve.

[0043] Figures 7A to 7C show the situation where the cleaning tape 19 contacts the periphery of the wafer W via the holding part 22. Figures 7A to 7C show an example of cleaning a so-called right-angled wafer W (see Figure 1A). The motion control unit 9 drives the holding part moving mechanism 30 from the state where the cleaning tape 19 has left the periphery of the wafer W (see Figure 7A), and moves the holding part 22 toward the wafer W until the cleaning tape 19 contacts the periphery of the wafer W. Thereby, the cleaning tape 19 contacts the periphery of the wafer W via the elastic body 27 (see Figure 7B). By holding the wafer W with the holding part 22 via the cleaning tape 19, the elastic body 27 deforms along the shape of the wafer W.

[0044] The periphery of the wafer W is cleaned by rotating the wafer W and causing the cleaning tape 19 to travel at a specified speed and contact the periphery of the wafer W. In this embodiment, the substrate cleaning apparatus 1 can consistently clean the periphery of the wafer W using only the clean portion of the cleaning tape 19. Furthermore, since the cleaning tape 19 contacts the periphery of the wafer W by surrounding it, the periphery of the wafer W can be cleaned without using a tilting mechanism or the tilting support 22. With this configuration, the periphery cleaning unit 20 can be compactly constructed.

[0045] In cleaning wafer W, fluid is supplied to the internal space R, and the internal space R is pressurized. This applies pressure P to the back surface of elastomer 27. Elastomer 27 is pressed against wafer W by cleaning tape 19 under this pressure P. As a result, cleaning tape 19 actively follows the shape of the periphery of wafer W. The pressure applied to wafer W can be controlled by adjusting the pressure in the internal space R using pressure regulator 44. This maintains a constant pressure on wafer W and reduces pressure fluctuations caused by the contact points between cleaning tape 19 and wafer W.

[0046] As shown in Figure 7C, by moving the holding part 22 further from the state shown in Figure 7B to the inner side in the radial direction, the elastomer 27 is further pressed into the wafer W, and the elastomer 27 and the cleaning tape 19 are further deformed along the shape of the wafer W. The holding part moving mechanism 30 controls the pressing amount L of the holding part 22 by controlling the position of the holding part 22 in the radial direction of the wafer W. The pressing amount L is the distance from the surface of the innermost elastomer 27 located in the radial direction of the wafer W, through the cleaning tape 19 pressing against the surface of the elastomer 27 at the outermost periphery of the wafer W (the side of the inclined part in the example shown in Figure 7C).

[0047] Figure 7C shows an example of pressing the elastomer 27 into the cleaning tape 19 until it contacts the top and bottom edges (see Figure 1A). In this way, by controlling the pressing amount L, the contact position (i.e., the cleaning position) between the cleaning tape 19 and the wafer W can be arbitrarily changed, and the top and bottom edges can be cleaned in addition to the entire beveled surface.

[0048] As described above, the internal space R is pressurized in the periphery of the cleaned wafer W. By pressurizing the internal space R, a force is applied to the support portion 22, pushing the base 25 outward in the radial direction from the internal space R. The support portion moving mechanism 30 uses a motor, such as a servo motor or a stepper motor, whose rotation axis position or rotation angle can be controlled, so that the position of the support portion 22 is not affected by the pressure of the internal space R.

[0049] In this embodiment, the cleaning tape 19 travels in a horizontal direction (the tangential direction of the wafer W). However, in another embodiment, the cleaning tape 19 supported by the top part 22 can be arranged so that it travels in a vertical direction (perpendicular to the tangential direction of the wafer W). In this case, the first reel 50 and the second reel 51 are arranged vertically.

[0050] Next, the process of cleaning the periphery of wafer W will be described. First, wafer W is held horizontally with its surface facing upward by substrate holding part 10, and wafer W is rotated around its axis Cr. Next, rinsing liquid is supplied to the top and bottom surfaces of wafer W from upper liquid supply nozzle 14 and lower liquid supply nozzle 16, respectively, and chemical solution is supplied to the top and bottom surfaces of wafer W from upper liquid supply nozzle 15 and lower liquid supply nozzle 17, respectively. The rinsing liquid and chemical solution diffuse outward from wafer W by centrifugal force, and are supplied to the periphery of wafer W. The periphery of wafer W is cleaned in the presence of the rinsing liquid and chemical solution.

[0051] In this state, the motion control unit 9 drives the tape conveyor unit 40 to apply a specified tension to the cleaning tape 19, and causes the cleaning tape 19 to move at a specified speed in a certain direction (in this embodiment, from the first reel 50 toward the second reel 51). More specifically, the tape conveyor unit 40 causes the cleaning tape 19 to move in a horizontal direction (the tangential direction of the wafer W).

[0052] In this state, the supporting part moving mechanism 30 moves the supporting part 22 toward the wafer W and brings it into contact with the wafer W. Specifically, the motion control unit 9 transmits a target value for the position of the supporting part 22 in the radial direction of the wafer W to the supporting part moving mechanism 30, and the supporting part moving mechanism 30 moves the supporting part 22 according to the target value so that the supporting part 22 is in the target position. The supporting part moving mechanism 30 controls the position of the supporting part 22 in the radial direction of the wafer W according to the target value. The supporting part 22 contacts the cleaning tape 19 with the periphery of the wafer W to clean the periphery of the wafer W.

[0053] During cleaning, the motion control unit 9 issues a command to the pressure regulator 44 to control the pressure in the internal space R. Specifically, the motion control unit 9 opens the on / off valves 48a and 48b, supplying fluids such as gas (air, nitrogen, etc.) and liquid (water, etc.) from the fluid supply source 46 to the internal space R. Then, the motion control unit 9 issues a command to the pressure regulator 44 to adjust the fluid pressure in the internal space R so that the pressure in the internal space R becomes the target pressure value.

[0054] In one embodiment, the cleaning process of the periphery of the wafer W is performed after the periphery of the substrate has been ground. In another embodiment, the cleaning process of the periphery of the wafer W can be performed simultaneously with the cleaning processes of the upper and lower surfaces of the wafer W, or performed separately.

[0055] In this embodiment, because the cleaning tape 19 travels in a certain direction and cleans the periphery of the wafer W, the clean portion of the cleaning tape 19 can always be used to clean the periphery of the wafer W. Furthermore, the cleaning position can be arbitrarily changed by controlling the movement distance of the holding part 22, and the pressure applied to the wafer W from the holding part 22 can be controlled by controlling the pressure within the internal space R of the holding part 22. As a result, the cleaning effect on the periphery of the wafer W can be improved.

[0056] Figure 8 is a schematic diagram showing another embodiment of the peripheral cleaning unit 20, and Figure 9 is a view of the peripheral cleaning unit 20 in Figure 8 viewed from the direction indicated by arrow C. Since the details of this embodiment, unless otherwise specified, are the same as those described with reference to Figures 1A to 7C, repeated descriptions are omitted. Figures 8 and 9 are illustrations omitting the fluid delivery line 42, pressure regulator 44, fluid supply source 46, and on / off valves 48a and 48b. As shown in Figure 9, the peripheral cleaning unit 20 of this embodiment further includes an up-and-down movement mechanism 60 for moving the supporting portion 22 up and down.

[0057] As shown in Figures 8 and 9, the peripheral cleaning unit 20 of this embodiment further includes a base plate 62, a support moving mechanism 30, a belt conveying unit 40, and guide rollers 54 and 55 fixed on the base plate 62. A vertical moving mechanism 60 is connected to the base plate 62. In this embodiment, the vertical moving mechanism 60 is configured to allow the base plate 62, support 22, support moving mechanism 30, belt conveying unit 40, and guide rollers 54 and 55 to move vertically as a single unit.

[0058] The up-and-down moving mechanism 60 is configured to control the position of the supporting part 22 in the vertical direction (that is, the distance the supporting part 22 moves in the vertical direction). The up-and-down moving mechanism 60 is electrically connected to the motion control unit 9, and the movement of the up-and-down moving mechanism 60 is controlled by the motion control unit 9.

[0059] The base plate 62 is connected to the vertical moving mechanism 60 via a plurality of fixed members 63. The vertical moving mechanism 60 includes a ball screw mechanism 64 and a motor 66 for operating the ball screw mechanism 64. The ball screw mechanism 64 includes a nut mechanism 64a fixed to the plurality of fixed members 63 and a screw shaft 64b screwed into the nut mechanism 64a. The screw shaft 64b is connected to the motor 66. Examples of the motor 66 include a servo motor and a stepper motor.

[0060] The motion control unit 9 issues commands to the up-and-down movement mechanism 60, causing the motor 66 to rotate, and the screw shaft 64b to rotate. As a result, the base plate 62, the support part 22, the support part moving mechanism 30, the belt conveyor unit 40, and the guide rollers 54 and 55 move up and down via the nut mechanism 64a and the fixing member 63. The up-and-down movement of the nut mechanism 64a is guided by a linear guide rail (not shown). The motor 66 controls the up-and-down movement distance of the support part 22 by rotating the screw shaft 64b by moving the support part 22 a specified distance. In one embodiment, the up-and-down movement mechanism 60 can also be a combination of an air cylinder and a pressure regulator.

[0061] In this embodiment, the base plate 62, the support part 22, the support part moving mechanism 30, the tape conveying unit 40, and the guide rollers 54 and 55 move up and down to clean the periphery of the wafer W.

[0062] Figures 10A to 10C show the contact state between the cleaning tape 19 and the wafer W when the support portion 22 moves up and down. Figures 10A to 10C show an example of cleaning a so-called right-angled wafer W (refer to Figure 1A). Figure 10A shows the state where the center line CL in the thickness direction of the wafer W is located at the center of the support portion 22, Figure 10B shows the state where the support portion 22 is lowered from the position shown in Figure 10A, and Figure 10C shows the state where the support portion 22 is raised from the position shown in Figure 10A.

[0063] As shown in Figure 10A, when the center line CL is located at the center of the top part 22, the internal space R is pressurized, and the cleaning tape 19 is brought into contact with the periphery of the wafer W. The pressure P applied to the back of the elastomer 27 will be concentrated at the corners 27a and 27b of the elastomer 27. In this way, sufficient pressure is not applied to the upper and lower inclined parts of the inclined surface (see Figure 1A).

[0064] By lowering the support portion 22 with the center line CL positioned above it, the cleaning tape 19 contacts the periphery of the wafer W, and the upper part of the elastomer 27 is pressed into the wafer W (see Figure 10B). This increases the pressure P1 applied to the upper inclined portion 27c of the elastomer 27. As a result, sufficient pressure can be applied to the upper inclined portion of the inclined surface.

[0065] By raising the support portion 22 with the center line CL located below it, the cleaning tape 19 contacts the periphery of the wafer W, and the lower part of the elastomer 27 is pressed into the wafer W (see Figure 10C). This increases the pressure P2 applied to the lower inclined portion 27d of the elastomer 27. As a result, sufficient pressure can be applied to the lower inclined portion of the inclined section.

[0066] Furthermore, by moving the holding part 22 up and down and cleaning the periphery of the wafer W, the cleaning tape 19 slides in contact with the periphery of the wafer W in the vertical direction, allowing for more aggressive cleaning. As a result, by moving the holding part 22 up and down and cleaning the periphery of the wafer W, the cleaning effect can be further improved.

[0067] Figure 11 is a schematic diagram showing another embodiment of the peripheral cleaning unit 20, and Figure 12 is a view of the peripheral cleaning unit 20 in Figure 11 viewed from the direction indicated by arrow D. Since the details of this embodiment, unless otherwise specified, are the same as those described with reference to Figures 8 to 10C, repeated descriptions are omitted. The peripheral cleaning unit 20 of this embodiment further includes a plurality of tape cleaning mechanisms 70A and 70B for cleaning the tape 19. Figures 11 and 12 are illustrations omitting the fluid delivery line 42, pressure regulator 44, fluid supply source 46, and on / off valves 48a and 48b.

[0068] Tape cleaning mechanisms 70A and 70B are arranged around the cleaning tape 19 along its path. Specifically, tape cleaning mechanism 70A is positioned between the first reel 50 and the supporting part 22, and tape cleaning mechanism 70B is positioned between the second reel 51 and the supporting part 22. Tape cleaning mechanisms 70A and 70B are configured to clean the tape 19 through their interiors. Tape cleaning mechanisms 70A and 70B are electrically connected to the motion control unit 9, and their movement is controlled by the motion control unit 9.

[0069] Figure 13 is a schematic diagram showing one embodiment of the tape cleaning mechanism 70B, and is a cross-sectional view along line EE of Figure 11. Tape cleaning mechanisms 70A and 70B have the same configuration. The following description pertains to tape cleaning mechanism 70B, but also applies to tape cleaning mechanism 70A. In the following description, tape cleaning mechanisms 70A and 70B are sometimes referred to collectively, but simply as tape cleaning mechanism 70.

[0070] As shown in Figure 13, the tape cleaning mechanism 70B includes: a tape support member 74 supporting the back side of the cleaning tape 19; a cleaning fluid supply nozzle 76 supplying cleaning fluid to the surface (cleaning surface) of the cleaning tape 19; and a housing 78 housing the tape support member 74 and the cleaning fluid supply nozzle 76. The tape support member 74 and the cleaning fluid supply nozzle 76 are fixed to the inner surface of the housing 78. A plurality of openings (not shown) are formed in the housing 78 for the cleaning tape 19 to pass through. The cleaning fluid supply nozzle 76 is disposed facing the surface of the cleaning tape 19. An example of cleaning fluid is pure water. The cleaning fluid supply nozzle 76 is connected to a cleaning fluid supply source (not shown).

[0071] This embodiment cleans the cleaning tape 19 (used for cleaning the periphery of the wafer W) after it has contacted the wafer W using a tape cleaning mechanism 70. In one embodiment, the cleaning process of the cleaning tape 19 is performed during the cleaning of the wafer W. When the cleaning tape 19 travels from the first reel 50 to the second reel 51 and cleans the periphery of the wafer W, the cleaning tape 19 sequentially passes through the tape cleaning mechanism 70A, the first guide roller 54, the support part 22, the second guide roller 55, and the tape cleaning mechanism 70B, traveling from the first reel 50 to the second reel 51. In this state, the motion control unit 9 issues a command to the tape cleaning mechanism 70B to supply cleaning fluid to the cleaning tape 19 after it has contacted the periphery of the wafer W. This cleans the cleaning tape 19 after it has contacted the periphery of the wafer W. The cleaned tape 19, after being cleaned by the tape cleaning mechanism 70B, is recycled to the second reel 51.

[0072] The cleaning tape 19 is supported on its back by the tape support member 74 and is cleaned. By supporting the back of the cleaning tape 19 and cleaning the cleaning tape 19, shaking of the cleaning tape 19 during cleaning can be prevented.

[0073] When the cleaning solution comes into contact with the wafer W, it washes away foreign matter (microparticles) such as grinding debris adhering to the surface of the cleaning tape 19. In this way, the cleaning tape 19 is continuously cleaned at the periphery of the wafer W. By cleaning the cleaning tape 19 after contact with the periphery of the wafer W, the cleaning tape 19 can be reused.

[0074] Figure 14 is a schematic diagram showing another embodiment of the tape cleaning mechanism 70. Since the details of this embodiment, unless otherwise specified, are the same as those described with reference to Figure 13, repeated descriptions are omitted. As shown in Figure 14, the tape cleaning mechanism 70 of this embodiment further includes: a plurality of cleaning fluid supply nozzles 76; and a cleaning brush 80 that contacts the surface (cleaning surface) of the cleaning tape 19 to clean the tape 19. By causing the cleaning tape 19 to travel in a certain direction, supplying cleaning fluid to the surface of the cleaning tape 19, and causing the cleaning brush 80 to contact the surface of the cleaning tape 19, the cleaning effect of the cleaning tape 19 can be improved.

[0075] In one embodiment, after the cleaning tape 19 is completely wound onto the second reel 51, the cleaning tape 19 is moved in the opposite direction by the tape conveyor unit 40 to clean the periphery of the wafer W. In this embodiment, during the cleaning of the periphery of the wafer W, the cleaning tape 19 sequentially passes through the tape cleaning mechanism 70B, the second guide roller 55, the support part 22, the first guide roller 54, and the tape cleaning mechanism 70A, moving from the second reel 51 to the first reel 50. The detailed content of the cleaning process for the periphery of the wafer W in this embodiment is the same as the above-described process, except for the direction of travel of the cleaning tape 19. In another embodiment, the cleaning process of the cleaning tape 19 can also be performed during the cleaning of the periphery of the wafer W. In this case, the motion control unit 9 issues a command to the tape cleaning mechanism 70A to supply cleaning fluid to the cleaning tape 19 after it contacts the periphery of the wafer W. This cleans the cleaning tape 19 after it contacts the periphery of the wafer W. The cleaned tape 19, after being cleaned by the tape cleaning mechanism 70A, is recycled to the first reel 50.

[0076] Furthermore, in another embodiment, after the cleaning tape 19 is completely wound around the first reel 50, the cleaning tape 19 is moved in the opposite direction (from the first reel 50 toward the second reel 51) to clean the periphery of the wafer W. The cleaning process of the cleaning tape 19 can also be performed in cleaning the periphery of the wafer W.

[0077] Thus, after the cleaning tape 19 is completely wound onto one of the first reel 50 or the second reel 51, it can be reused by winding it in the opposite direction, thereby reducing the replacement frequency of the cleaning tape 19. Furthermore, by moving the holding part 22 up and down and cleaning the periphery of the wafer W, the replacement frequency of the cleaning tape 19 can be further reduced.

[0078] Furthermore, in one embodiment, the cleaning process of the cleaning tape 19 can be performed after cleaning the peripheral portions of a specified number of wafers W. In this embodiment, after cleaning the peripheral portions of a specified number of wafers W, the cleaning tape 19 is conveyed in a certain direction (from the first reel 50 towards the second reel 51, or from the second reel 51 towards the first reel 50) by the tape conveyor unit 40. The motion control unit 9 issues commands to the tape cleaning mechanism 70A and / or the tape cleaning mechanism 70B to supply cleaning fluid from the cleaning fluid supply nozzle 76 to the cleaning tape 19 after it has contacted the peripheral portions of the wafers W. In this embodiment, the direction of travel of the cleaning tape 19 during cleaning is opposite to the direction of travel of the cleaning tape 19 during the peripheral cleaning process of the wafers W performed before the cleaning process of the cleaning tape 19. This cleans the cleaning tape 19 after it has contacted the peripheral portions of the wafers W. Even in this embodiment, after the cleaning tape 19 is completely wound around the first reel 50 or the second reel 51, the cleaning tape 19 can still be made to travel in the opposite direction by the tape conveying unit 40, and the periphery of the wafer W can be cleaned.

[0079] The embodiments illustrated with reference to Figures 11 to 14 are also applicable to the embodiments illustrated with reference to Figures 1A to 7C. Furthermore, in one embodiment, the substrate cleaning apparatus 1 may also include one of the tape cleaning mechanism 70A or the tape cleaning mechanism 70B.

[0080] Figure 15 is a schematic diagram showing another embodiment of the peripheral cleaning unit 20. Since the details of this embodiment, unless otherwise specified, are the same as those described with reference to Figures 1A to 7C, repeated descriptions are omitted. The peripheral cleaning unit 20 of this embodiment further includes a sensor 82 that irradiates the cleaning tape 19 after contact cleaning of the peripheral portion of the wafer W with light and receives the reflected light from the cleaning tape 19. Figure 15 is a diagram omitting the fluid delivery line 42, pressure regulator 44, fluid supply source 46, and on / off valves 48a and 48b.

[0081] The sensor 82 is positioned facing the surface of the cleaning tape 19 after contacting the periphery of the wafer W. The sensor 82 is configured to receive reflected light from the cleaning tape 19 and measure the intensity of the reflected light. The sensor 82 may be, for example, an RGB color sensor. The RGB color sensor illuminates white LED light, decomposes the reflected light into the three primary colors of red, green, and blue using a filter, and determines the color ratio based on the intensity of each color (red, green, and blue) using a detection element. Alternatively, the sensor 82 may use an LED capable of illuminating UV (ultraviolet) light as a light source and a fluorescent UV sensor as a light-receiving sensor to measure the intensity of the received light.

[0082] Sensor 82 is electrically connected to motion control unit 9. During the cleaning of the periphery of wafer W, motion control unit 9 receives signals from sensor 82 and compares the intensity of the reflected light received by sensor 82 with a preset specified value. When the intensity of the reflected light is lower than the specified value, motion control unit 9 determines that dirt adheres to the cleaning tape 19 and that the periphery of wafer W is unclean. When the intensity of the reflected light is higher than the specified value, motion control unit 9 determines that no dirt adheres to the cleaning tape 19 and that the periphery of wafer W is not unclean. Motion control unit 9 determines the end point of the cleaning process for the periphery of wafer W based on the time it takes for the periphery of wafer W to be determined to be unclean. This embodiment can also be applied to the embodiments described with reference to Figures 8 to 14.

[0083] Figure 16 shows a perspective view of other embodiments of the substrate cleaning apparatus. Since the details of this embodiment, unless otherwise specified, are the same as those described with reference to Figures 1A to 15, repeated descriptions are omitted. The substrate cleaning apparatus 1 of this embodiment also functions as a pen-shaped substrate cleaning apparatus for cleaning the wafer W.

[0084] As shown in Figure 16, the substrate cleaning apparatus 1 of this embodiment includes: a substrate holding part 10 for holding and rotating the wafer W; a support column 92 extending in the vertical direction; a rocker arm 94 with one end mounted on the front end of the support column 92 and extending in the horizontal direction; a cleaning member moving mechanism 93 connected to the support column 92; a cylindrical pencil cleaning member 96 (cylindrical sponge) rotatably mounted below the other end of the rocker arm 94; two upper liquid supply nozzles 14 and 15 for supplying liquid as cleaning fluid to the wafer W; two lower liquid supply nozzles 16 and 17; a peripheral cleaning unit 20; and an action control unit 9.

[0085] The substrate cleaning apparatus 1 of this embodiment can perform both cleaning of the top surface of the wafer W by means of the pencil cleaning member 96 and cleaning of the periphery of the wafer W by means of the peripheral cleaning unit 20. The pencil cleaning member 96 is connected to a cleaning member rotation mechanism (not shown) disposed in a rocker arm 94, and the pencil cleaning member 96 can rotate around its central axis extending in the vertical direction. The rocker arm 94 is disposed above the wafer W.

[0086] The substrate holding section 10 includes a plurality of spindles 90 (four in Figure 16) that hold the peripheral portion of the wafer W with its surface facing upwards and can move freely in the horizontal direction to rotate the wafer W horizontally. Each spindle 90 has a plurality of spin chucks 90a that hold the peripheral portion of the wafer W. The spin chucks 90a are configured to rotate in the same direction at the same speed. With the spin chucks 90a holding the wafer W horizontally, the wafer W rotates around its axis Cr in the direction indicated by the arrow by rotating the spin chucks 90a. The peripheral cleaning unit 20 is arranged with a holding part 22 located between two of the four spindles 90.

[0087] The cleaning component moving mechanism 93 rotates the support 92 at a specified angle, causing the rocker arm 94 to rotate in a plane parallel to the wafer W. By rotating the rocker arm 94, the pencil cleaning component 96 moves along an arc-shaped path on the wafer W. Since the front end of the rocker arm 94 extends to the center O of the wafer W, the movement path of the pencil cleaning component 96 passes through the center O of the wafer W. Furthermore, the pencil cleaning component 96 moves to the outer periphery of the wafer W. Therefore, the path of the pencil cleaning component 96, moved by the rotation of the rocker arm 94, becomes an arc with the length of the rocker arm 94 as its radius, and its range of movement extends from the outer periphery of the wafer W to beyond the center O of the wafer W.

[0088] Furthermore, the cleaning component moving mechanism 93 can be configured to move the support column 92 up and down, thereby pressing the pencil cleaning component 96 onto the surface of the wafer W with a specified pressure. The pencil cleaning component 96 is made of, for example, polyurethane foam or PVA. The motion control unit 9 is electrically connected to the cleaning component moving mechanism 93 and the cleaning component rotating mechanism (not shown). The movement of the cleaning component moving mechanism 93 and the cleaning component rotating mechanism is controlled by the motion control unit 9.

[0089] The cleaning process on wafer W is as follows: First, wafer W is held horizontally with its surface facing upward by substrate holding part 10, and wafer W is rotated around its axis Cr. While wafer W is rotating horizontally, rinsing fluid is supplied to the surface of wafer W from liquid supply nozzle 14, and chemical solution is supplied to the surface of wafer W from liquid supply nozzle 15. By rotating the pencil cleaning member 96 (rotating on its own axis) and the rocker arm 94 rotating, the pencil cleaning member 96 revolves and comes into contact with the surface of the rotating wafer W. In this way, the surface of wafer W is cleaned by friction with the pencil cleaning member 96 in the presence of cleaning fluid (rinsing fluid and chemical solution).

[0090] In one embodiment, after polishing the substrate surface using CMP or the like, a process of cleaning the surface of wafer W according to the embodiment described with reference to FIG16 is performed. The process of cleaning the surface of wafer W according to FIG16 and the cleaning process of the peripheral portion of wafer W can be performed simultaneously or separately. The substrate cleaning apparatus 1 of this embodiment includes the peripheral cleaning unit 20 of the embodiments described with reference to FIGS. 1A to 7C; however, the substrate cleaning apparatus 1 may also include the peripheral cleaning unit 20 of the embodiments described with reference to FIGS. 8 to 15.

[0091] Figure 17 is a top view showing another embodiment of the substrate cleaning apparatus 1, and Figure 18 is a longitudinal sectional view of the substrate cleaning apparatus 1 shown in Figure 17. Since the details of this embodiment, unless otherwise specified, are the same as those described with reference to Figures 1A to 15, repeated descriptions are omitted. The substrate cleaning apparatus 1 of this embodiment also functions as a bevel grinding apparatus for grinding the peripheral portion of the wafer W. The substrate cleaning apparatus 1 of this embodiment can perform both grinding the peripheral portion of the wafer W and cleaning the peripheral portion of the wafer W by means of the peripheral cleaning unit 20.

[0092] As shown in Figures 17 and 18, the substrate cleaning apparatus 1 of this embodiment includes: a substrate holding section 10 disposed in its central part; a peripheral cleaning unit 20; four polishing head assemblies 101A, 101B, 101C, and 101D disposed around the wafer W held in the substrate holding section 10; supply and recovery mechanisms 102A, 102B, 102C, and 102D disposed radially outside the polishing head assemblies 101A, 101B, 101C, and 101D; two upper liquid supply nozzles 14 and 15 that supply liquid as cleaning fluid on the wafer W; two lower liquid supply nozzles 16 and 17; and an operation control unit 9.

[0093] The substrate holding section 10 of this embodiment includes: a disk-shaped holding stage 104 that holds the back side of the wafer W by vacuum adsorption; a hollow shaft 105 connected to the center of the holding stage 104; and a motor M1 for rotating the hollow shaft 105. The wafer W is loaded onto the holding stage 104 by a transfer mechanism (not shown) in such a way that the center O of the wafer W (shown in FIG. 16) is aligned with the axis of the hollow shaft 105. The wafer W is held horizontally by the substrate holding section 10.

[0094] The hollow shaft 105 is supported by a plurality of ball spline bearings (direct-acting bearings) 106, allowing it to move freely up and down. A groove 104a is formed on the upper surface of the holding stage 104, which connects to a connecting line 107 extending through the hollow shaft 105. The connecting line 107 is connected to a vacuum line 109 via a rotary joint 108 mounted on the lower end of the hollow shaft 105. The connecting line 107 is also connected to a nitrogen supply line 110 for detaching the processed wafer W from the holding stage 104. By switching between these vacuum lines 109 and the nitrogen supply line 110, the wafer W can be vacuum-adsorbed onto or detached from the holding stage 104.

[0095] The hollow shaft 105 is rotated by the motor M1 via a pulley q1 connected to the hollow shaft 105; a pulley q2 mounted on the rotating shaft of the motor M1; and a belt b1 suspended on these pulleys q1 and q2. The rotating shaft of the motor M1 extends parallel to the hollow shaft 105. With this configuration, the wafer W held on the holding stage 104 is rotated by the motor M1.

[0096] The ball spline bearing 106 is fixed to the housing 112. Therefore, in this embodiment, the hollow shaft 105 is configured to move linearly up and down the housing 112, and the hollow shaft 105 rotates integrally with the housing 112. The hollow shaft 105 is connected to the air cylinder (lifting mechanism) 115, and the hollow shaft 105 and the holding platform 104 can be raised and lowered by the air cylinder 115.

[0097] A radial bearing 118 is provided between the chassis 112 and the chassis 114 arranged concentrically on its outer side, and the chassis 112 is rotatably supported by the bearing 118. With this configuration, the substrate holding part 10 can allow the wafer W to rotate around the axis Cr, and can allow the wafer W to rise and fall along the axis Cr.

[0098] The grinding head assemblies 101A-101D and the feed recovery mechanisms 102A-102D are separated by a partition wall 120. The interior space of the partition wall 120 forms a processing chamber 121, in which the grinding head assemblies 101A-101D and the holding platform 104 are disposed. The feed recovery mechanisms 102A-102D are disposed outside the processing chamber 121.

[0099] An opening 120c covered by louvers 140 is provided on the partition wall 120. The partition wall 120 includes: a plurality of openings 120a for the passage of the polishing belt 123 (described later); and a conveyor 120b for moving the wafer W into and out of the processing chamber 121. During cleaning (or polishing), the conveyor 120b is closed by a shutter (not shown). Therefore, exhaust is performed by a fan mechanism (not shown), creating a downward flow of clean air inside the processing chamber 121.

[0100] The polishing head assemblies 101A, 101B, 101C, and 101D each function as substrate processing units for polishing the beveled surface of the wafer W. Each polishing head assembly 101A, 101B, 101C, and 101D, as well as the feed and recovery mechanisms 102A, 102B, 102C, and 102D, has the same configuration. The polishing head assembly 101A and the feed and recovery mechanism 102A will be described below.

[0101] The supply and recovery mechanism 102A includes: a supply reel 124 for supplying the grinding belt 123 of the grinding tool to the grinding head assembly 101A; and a recovery reel 125 for recovering the grinding belt 123 used for grinding the wafer W. The supply reel 124 and the recovery reel 125 are arranged vertically. Motors M2 are connected to both the supply reel 124 and the recovery reel 125 (only the motor M2 connected to the supply reel 124 is shown in Figures 1A and 1B). Each motor M2 imparts a certain torque in a specified rotation direction, thereby imparting a specified tension to the grinding belt 123.

[0102] The polishing tape 123 is a long strip-shaped polishing tool, with one side forming a polishing surface. The polishing tape 123 is mounted in the tape supply and recovery mechanism 102A while wound on a supply reel 124. One end of the polishing tape 123 is attached to a recovery reel 125. The polishing tape 123 supplied to the polishing head assembly 101A is recovered by winding it up on the recovery reel 125. The polishing head assembly 101A includes a polishing head 130 for bringing the polishing tape 123 supplied from the tape supply and recovery mechanism 102A into contact with the periphery of the wafer W. The polishing tape 123 is supplied to the polishing head 130 with its polishing surface facing the wafer W.

[0103] The feed and recovery mechanism 102A has a plurality of guide rollers 131, 132, 133, and 134. The grinding belt 123 is guided by the guide rollers 131 to 134. The grinding belt 123 is fed from the feed reel 124 to the grinding head 130 through the opening 120a, and the used grinding belt 123 is recovered to the recovery reel 125 through the opening 120a.

[0104] As shown in Figure 18, a supply nozzle 136 is disposed on the top of the wafer W, supplying polishing slurry towards the center of the top surface of the wafer W held in the substrate holding portion 10. Furthermore, a lower supply nozzle 137 is provided to supply polishing slurry towards the boundary between the back surface of the wafer W and the holding stage 104 (the outer periphery of the holding stage 104). Pure water is typically used as the polishing slurry; however, ammonia may be used if the abrasive grains of the polishing belt 123 are silicon dioxide, etc. Moreover, the substrate cleaning apparatus 1 is equipped with a cleaning nozzle 138 for cleaning the polishing head 130 after polishing. After polishing, the wafer W rises through the substrate holding portion 10 and is sprayed with cleaning water towards the polishing head 130 to clean the polishing head 130 after polishing. The upper supply nozzle 136 and the lower supply nozzle 137 are connected to a polishing slurry supply source (not shown), and the cleaning nozzle 138 is connected to a cleaning water supply source (not shown).

[0105] As shown in Figure 17, the grinding head 130 is fixed to one end of the arm 160, which is rotatably configured around an axis Ct parallel to the tangent of the wafer W. The other end of the arm 160 is connected to the motor M4 via pulleys q3 and q4 and a belt b2. By rotating the motor M4 clockwise and counterclockwise by a specified angle, the arm 160 rotates by a specified angle around the axis Ct. In this embodiment, the motor M4, the arm 160, the pulleys q3 and q4, and the belt b2 constitute a tilting mechanism for tilting the grinding head 130.

[0106] As shown in Figure 18, the tilting mechanism is mounted on a plate-shaped moving stage 161. The moving stage 161 is movably connected to the base plate 165 via a guide rail 162 and a track 163. The track 163 extends linearly along the radial direction of the wafer W held in the substrate holding portion 10, allowing the moving stage 161 to move linearly along the radial direction of the wafer W. A connecting plate 166 penetrating the base plate 165 is installed in the moving stage 161, and a linear actuator 167 is mounted on the connecting plate 166 via a connector 168. The linear actuator 167 is directly or indirectly fixed to the base plate 165.

[0107] The linear actuator 167 can be a combination of an air cylinder or a positioning motor and a ball screw. The linear actuator 167, the track 163, and the guide rail 162 constitute a moving mechanism that causes the polishing head 130 to move linearly along the radial direction of the wafer W. That is, the moving mechanism operates by moving the polishing head 130 along the track 163 to approach and move away from the wafer W. Additionally, a feed and recovery mechanism 102A is fixed to the base plate 165.

[0108] Figure 19 is an enlarged view of the polishing head 130. As shown in Figure 19, the polishing head 130 includes: a holding mechanism 141 that holds the polishing surface of the polishing belt 123 against the wafer W with a specified force; and a belt conveying mechanism 142 that conveys the polishing belt 123 from the supply reel 124 to the take-up reel 125. The polishing head 130 has a plurality of guide rollers 143, 144, 145, 146, 147, 148, and 149, which guide the polishing belt 123 in a direction perpendicular to the tangential direction of the wafer W.

[0109] The belt conveyor mechanism 142 located on the grinding head 130 includes: a belt conveyor roller 142a, a belt gripping roller 142b, and a motor M3 for rotating the belt conveyor roller 142a. The motor M3 is located on the side of the grinding head 130, and the belt conveyor roller 142a is connected to the rotating shaft of the motor M3. A grinding belt 123 is wound around the belt conveyor roller 142a at approximately half a turn. The belt gripping roller 142b is located next to the belt conveyor roller 142a. The belt gripping roller 142b is supported by a mechanism (not shown) in a manner that generates force in the direction indicated by arrow NF in Figure 19 (towards the belt conveyor roller 142a), and is configured to press against the belt conveyor roller 142a.

[0110] The grinding belt 123 is sandwiched between the belt conveyor roller 142a and the belt gripping roller 142b. When the motor M3 rotates in the direction of the arrow shown in Figure 19, the belt conveyor roller 142a rotates, which can convey the grinding belt 123 from the supply reel 124 through the grinding head 130 to the take-up reel 125. The belt gripping roller 142b is configured to rotate around its own shaft and rotates along with the conveying grinding belt 123.

[0111] The holding mechanism 141 includes: a holding pad 141a supporting the back side of the polishing belt 123; and an air cylinder (drive mechanism) 141b that moves the holding pad 141a toward the periphery of the wafer W. The polishing head 130 holds the polishing belt 123 from its back side by the holding mechanism 141, and polishes the periphery of the substrate W by bringing the polishing surface of the polishing belt 123 into contact with the periphery of the substrate W. The holding force on the wafer W is adjusted by controlling the air pressure supplied to the air cylinder 141b.

[0112] The tilting mechanism, the holding mechanism 141, and the belt conveyor 142 of the four grinding head assemblies 101A-101D, the moving mechanism for moving each grinding head assembly, the four belt supply and recovery mechanisms 102A-102D, the upper supply nozzle 136, the lower supply nozzle 137, the cleaning nozzle 138, and the air cylinder 115 are electrically connected to the motion control unit 9. The motion control unit 9 controls the operation of the components comprising the four grinding head assemblies 101A-101D, including the tilting mechanism, the holding mechanism 141, the belt conveyor 142, the moving mechanism for moving each grinding head assembly, the four belt supply and recovery mechanisms 102A-102D, the upper supply nozzle 136, the lower supply nozzle 137, the cleaning nozzle 138, and the air cylinder 115.

[0113] The four grinding head assemblies 101A-101D are configured with tilting mechanisms, holding mechanisms 141, conveying mechanisms 142, and moving mechanisms that allow each grinding head assembly to move independently. This embodiment has four grinding head assemblies and a supply and recovery mechanism, but the number of grinding head assemblies and supply and recovery mechanisms is not limited to this embodiment.

[0114] Figure 20 shows the process of the polishing head 130 polishing the beveled portion of the wafer W. The polishing of the peripheral portion of the wafer W is as follows: First, the wafer W is held and rotated by the substrate holding part 10. Specifically, when the wafer W is transported to a designated position above the holding stage 104, the holding stage 104 rises, and the wafer W is held adsorbed on the holding stage 104. Then, the holding stage 104 holding the wafer W descends to the designated polishing position, and the substrate holding part 10 rotates the wafer W together with the holding stage 104. Furthermore, polishing slurry is supplied to the surface of the wafer W from the upper supply nozzle 136. Polishing slurry can also be supplied to the peripheral portion of the wafer W from the lower supply nozzle 137.

[0115] In this state, as shown in FIG20, the tilt angle of the polishing head 130 is continuously changed by the tilting mechanism described above, and the polishing belt 123 is brought into contact with the periphery (e.g., the beveled portion) of the wafer W by the holding mechanism 141. During polishing, the polishing belt 123 is conveyed at a specified speed by the belt conveyor mechanism 142. After polishing, the wafer W, along with the holding stage 104 and the hollow shaft 105, is raised to the transport position by the air cylinder 115, and the wafer W is detached from the holding stage 104 at the transport position.

[0116] This embodiment does not move the wafer W, but allows for both grinding and cleaning of the periphery of the wafer W. This effectively processes the wafer W. The cleaning and grinding processes of the wafer W's periphery can be performed simultaneously or separately. By performing the cleaning process of the wafer W's periphery simultaneously with or after the grinding process, the cleaning effect of the wafer W's periphery can be further improved.

[0117] The peripheral cleaning unit 20 is configured such that the supporting part 22 is located between two of the four grinding head assemblies 101A to 101D. In this embodiment, the peripheral cleaning unit 20 is configured between the grinding head assembly 101B and the grinding head assembly 101C, but the configuration of the peripheral cleaning unit 20 is not limited to this embodiment.

[0118] The cleaning tape 19 is supplied to the top section 22 through the opening 120a. In this embodiment, the top section 22, the top section moving mechanism 30, the first guide roller 54, and the second guide roller 55 are arranged inside the processing chamber 121, and the tape conveying unit 40 is arranged outside the processing chamber 121.

[0119] The substrate cleaning apparatus 1 of this embodiment includes a peripheral cleaning unit 20 as described in Figures 1A to 7C. However, the substrate cleaning apparatus 1 may also include a peripheral cleaning unit 20 as described in Figures 8 to 15. In this case, a new opening 120a for passing through the base plate 62 may be provided in the partition wall 120, or the existing opening 120a may be enlarged to allow passage through the base plate 62. Furthermore, the entire peripheral cleaning unit 20 may be arranged within the processing chamber 121.

[0120] In one embodiment, the grinding head 130 of at least one of the grinding head assemblies 101A-101D may also include a holding portion 22 and a holding portion moving mechanism 30 connected to the holding portion 22. In this case, as shown in FIG21, the holding portion 22 and the holding portion moving mechanism 30 are provided on the grinding head 130 instead of the holding mechanism 141, and the supply reel 124, the take-up reel 125, and the motor M2 are replaced by at least one of the supply and take-up mechanisms 102A-102D, with reels 50, 51 and reel rotation motors 52, 53 (not shown in FIG21) provided. Thus, the grinding head assembly and the supply and take-up mechanism constitute a peripheral cleaning unit 20.

[0121] In this embodiment, the cleaning tape 19 extends from the first reel 50 through the grinding head 130 to the second reel 51. The cleaning tape 19 is guided by guide rollers 143-149. Unless otherwise specified, the details of this embodiment are the same as those described with reference to Figures 1A to 7C. This embodiment comprises a tape conveying unit 40 consisting of a tape conveying mechanism 142, reels 50 and 51, and reel rotation motors 52 and 53.

[0122] Another embodiment is shown in Figure 22. The pressing part moving mechanism 30 provided on the grinding head 130 can also be connected to the vertical moving mechanism 60, and the peripheral cleaning unit 20 can also have tape cleaning mechanisms 70A and 70B. In this embodiment, the vertical moving mechanism 60 is connected to the pressing part moving mechanism 30 via the base plate 62. The vertical moving mechanism 60 is configured such that the pressing part 22 and the pressing part moving mechanism 30 move vertically as a whole. In this embodiment, the tape cleaning mechanism 70A is disposed between the grinding head 130 and the first reel 50, and the tape cleaning mechanism 70B is disposed between the grinding head 130 and the second reel 51. The embodiment described with reference to Figure 15 can also be applied to the embodiments described with reference to Figures 21 and 22.

[0123] The above embodiments are described with the aim of enabling those skilled in the art to implement the present invention. Those skilled in the art can naturally create various modifications to the above embodiments, and the technical concept of the present invention can be applied to other embodiments. Therefore, the present invention is not limited to the described embodiments, but is interpreted in the broadest possible sense according to the technical concept defined by the claims. [Industrial Applicability]

[0124] The present invention can be used for substrate cleaning apparatus and substrate cleaning method for cleaning the periphery of substrates such as semiconductor wafers.

[0125] 1: Substrate cleaning device 9: Motion Control Department 9a: Memory device 9b: Processing device 10: Substrate holding section 11: Spindle 11a: Stop 12: Upper drum cleaning component; drum cleaning component 12a: Core material 12b: Sponge component 13: Lower drum cleaning component; drum cleaning component 13a: Core material 13b: Sponge components 14, 15: Upper liquid supply nozzle; liquid supply nozzle 16, 17: Lower liquid supply nozzle 19: Clean the tape 20: Peripheral Cleaning Unit 22: Support Department 24: Supporting components 24a: Opening 25: Base 25a: Internal pathway 26a, 26b, 26c, 26d: Protrusions 27: Elastomers 27a, 27b: Corners 27c: Upper sloping part 27d: Lower inclined part; 30: Supporting part moving mechanism 32: Fixed components 34: Ball screw mechanism 34a: Nut Mechanism 34b: Spiral shaft 36: Motor 38: Linear guide rail 40: Belt Conveying Unit 42: Fluid transport pipeline 44: Pressure Regulator 46: Fluid supply source 48a, 48b: On / off valves 50: First scroll; scroll 51: Second scroll; scroll 52: First reel rotary motor; reel rotary motor 53: Second reel rotary motor; reel rotary motor 54: First guide roller; guide roller 55: Second guide roller; guide roller 60: Up and down moving mechanism 62: Base Plate 63: Fixed components 64: Ball screw mechanism 64a: Nut Mechanism 64b: Spiral shaft 66: Motor 70, 70A, 70B: Tape cleaning mechanism 74: Adhesive tape support components 76: Cleaning fluid supply nozzle 78: Chassis 80: Cleaning brush 82: Sensor 90: Spindle 90a: Spin chuck 92: Pillar 93: Cleaning component moving mechanism 94: Rocking arm 96: Pencil Cleaning Component 101A, 101B, 101C, 101D: Grinding head assembly 102A, 102B, 102C, 102D: Equipped with a supply and recycling mechanism 104: Maintain the stage 104a: Ditch 105: Hollow Shaft 106: Ball spline bearing 107: Connecting pipelines 108: Rotary Joint 109: Vacuum Line 110: Nitrogen supply pipeline 112: Chassis 114: Chassis 115: Air Cylinder 118: Radial bearing; bearing 120: partition wall 120a: Opening 120b:Transport port 120c: Open 121: Processing Room 123: Grinding belt 124: Supply Reel 125: Recycle Reel 130: Grinding head 131, 132, 133, 134: Guide rollers 136: Upper supply nozzle 137: Lower supply nozzle 138: Cleaning nozzle 140: Venetian blinds 141: Holding up the organization 141a: Support pad 141b: Air cylinder 142: Conveyor Mechanism 142a: With conveyor rollers 142b: With gripping roller 143, 144, 145, 146, 147, 148, 149: Guide rollers 160: Arms 161: Mobile station 162: Guide rail 163: Track 165: Base Plate 166: Connecting plate 167: Linear Actuator 168: Connector AX1, AX2: Axis b1, b2: Belt CL: Centerline Cr: Axis Ct: axis Ed1, Ed2: Flat areas L: Injection volume M1~M4: Motors O: Center P, P1, P2: Pressure q1~q4: Pulleys R: Interior space S: Upper sloping portion (upper sloping part) U: Lower sloping portion (lower oblique part) T: Side (Vertex) V: Oblique face W: Wafer (substrate)

Claims

1. A substrate cleaning apparatus comprising: a substrate holding portion for holding and rotating a substrate; a support portion having an internal space for contacting a cleaning tape with the periphery of the substrate; a first reel and a second reel for holding the two ends of the cleaning tape respectively; a support portion moving mechanism for controlling the position of the support portion in the radial direction of the substrate; and a pressure adjuster for controlling the pressure of the internal space; wherein the support portion comprises: a hollow support member having an opening; and an elastic body for supporting the cleaning tape; the elastic body is configured to close the opening; and the first reel and the second reel are configured to allow the cleaning tape to travel in a horizontal direction.

2. The substrate cleaning apparatus of claim 1, wherein the aforementioned abutment moving mechanism comprises: a ball screw mechanism connected to the aforementioned abutment; and a motor for operating the aforementioned ball screw mechanism.

3. The substrate cleaning apparatus as claimed in claim 2, wherein the aforementioned motor is a servo motor.

4. The substrate cleaning apparatus as claimed in claim 1, wherein the aforementioned pressure regulator is an electro-pneumatic pressure regulating valve.

5. The substrate cleaning apparatus of claim 1, further comprising a vertical moving mechanism for moving the aforementioned top portion vertically.

6. The substrate cleaning apparatus of claim 1, further comprising a tape cleaning mechanism for cleaning the aforementioned cleaning tape, wherein the tape cleaning mechanism comprises a cleaning fluid supply nozzle for supplying cleaning fluid to the surface of the aforementioned cleaning tape.

7. The substrate cleaning apparatus of claim 6, wherein the aforementioned tape cleaning mechanism further comprises a cleaning brush that contacts the surface of the aforementioned cleaning tape to clean the aforementioned cleaning tape.

8. The substrate cleaning apparatus of claim 7, wherein the aforementioned cleaning fluid supply nozzle is located above the aforementioned cleaning brush.

9. The substrate cleaning apparatus of claim 7, wherein the aforementioned cleaning fluid supply nozzle is located below the aforementioned cleaning brush.

10. The substrate cleaning apparatus of claim 7, further comprising a housing that houses the aforementioned cleaning fluid supply nozzle, the aforementioned cleaning brush, and the aforementioned support member, wherein the aforementioned cleaning fluid supply nozzle, the aforementioned cleaning brush, and the aforementioned support member are fixed to the inner surface of the aforementioned housing.

11. The substrate cleaning apparatus of claim 1, wherein the aforementioned support member has a plurality of protrusions arranged to surround the aforementioned internal space, and the aforementioned elastic system is stretched between the ends of the plurality of protrusions.

12. The substrate cleaning apparatus of claim 6, further comprising: a sensor for receiving reflected light from the cleaning tape that has been irradiated onto the periphery of the cleaned substrate; and an action control unit for measuring the intensity of the reflected light received by the sensor; wherein, The aforementioned sensor is disposed facing the surface of the aforementioned cleaning tape after contacting the periphery of the aforementioned substrate. When the intensity of the reflected light is higher than a specified value, the aforementioned motion control unit determines that the periphery of the aforementioned substrate is not contaminated based on the determination that no contamination is attached to the aforementioned cleaning tape, and determines the end point of the cleaning process of the periphery of the aforementioned substrate. When the intensity of the reflected light is lower than the aforementioned specified value, the aforementioned motion control unit determines that the periphery of the aforementioned substrate is contaminated based on the determination that contamination is attached to the aforementioned cleaning tape.

13. A substrate cleaning method comprising: holding a substrate by means of a substrate holding portion and rotating it, causing a cleaning tape to travel in a horizontal direction, and contacting the cleaning tape with the peripheral portion of the substrate by means of a pressing portion having an internal space, thereby cleaning the peripheral portion of the substrate, the step of cleaning the peripheral portion of the substrate comprising the following steps: controlling the position of the pressing portion in the radial direction of the substrate by means of a pressing portion moving mechanism; and controlling the pressure of the aforementioned internal space of the pressing portion by means of a pressure adjuster; the pressing portion comprising: a hollow support member having an opening; and an elastic body supporting the cleaning tape; the elastic body being configured to close the opening.

14. The substrate cleaning method of claim 13, wherein the aforementioned abutment moving mechanism comprises: a ball screw mechanism connected to the aforementioned abutment; and a motor for operating the aforementioned ball screw mechanism.

15. The substrate cleaning method of claim 14, wherein the aforementioned motor is a servo motor.

16. The substrate cleaning method of claim 13, wherein the aforementioned pressure regulator is an electro-pneumatic pressure regulating valve.

17. A substrate cleaning method comprising: holding a substrate by means of a substrate holding portion and rotating it, causing a cleaning tape to travel in a certain direction, and using a holding portion having an internal space to contact the cleaning tape with the peripheral portion of the substrate to clean the peripheral portion of the substrate, wherein the step of cleaning the peripheral portion of the substrate includes the following steps: controlling the position of the holding portion in the radial direction of the substrate by means of a holding portion moving mechanism; and controlling the pressure of the aforementioned internal space of the holding portion by means of a pressure adjuster; wherein the step of cleaning the peripheral portion of the substrate further includes a step of moving the holding portion up and down during the cleaning of the peripheral portion of the substrate, wherein the holding portion comprises: a hollow support member having an opening; and an elastic body supporting the cleaning tape; wherein the elastic body is configured to close the opening.

18. The substrate cleaning method of claim 13, further comprising, in the cleaning of the aforementioned substrate periphery, supplying cleaning fluid to the aforementioned cleaning tape that has come into contact with the aforementioned substrate periphery by means of a tape cleaning mechanism, thereby cleaning the aforementioned cleaning tape that has come into contact with the aforementioned substrate periphery.

19. The substrate cleaning method of claim 13, further comprising, after cleaning the periphery of the aforementioned substrate with a specified number of substrates, conveying the aforementioned cleaning tape in a certain direction, and supplying cleaning fluid to the aforementioned cleaning tape after contact with the periphery of the aforementioned substrate by means of a tape cleaning mechanism, thereby cleaning the aforementioned cleaning tape after contact with the periphery of the aforementioned substrate.

20. The substrate cleaning method of claim 13, further comprising the step of completely winding the aforementioned cleaning tape onto one of a first spool holding one end of the aforementioned cleaning tape or a second spool holding the other end of the aforementioned cleaning tape, and then causing the aforementioned cleaning tape to travel in the opposite direction and cleaning the periphery of the aforementioned substrate.

21. The substrate cleaning method of claim 13, wherein the aforementioned support member has a plurality of protrusions arranged in a manner that surrounds the aforementioned internal space, and the aforementioned elastic system is stretched between the ends of the plurality of protrusions.

22. The substrate cleaning method of claim 18, wherein reflected light is received from the cleaning tape that has been irradiated with light and has come into contact with the peripheral portion of the previously cleaned substrate, and the intensity of the received reflected light is measured. When the intensity of the reflected light is higher than a specified value, the peripheral portion of the aforementioned substrate is determined to be uncontaminated based on the determination that no contamination is attached to the aforementioned cleaning tape, and the end point of the cleaning process of the peripheral portion of the aforementioned substrate is determined. When the intensity of the reflected light is lower than the aforementioned specified value, the peripheral portion of the aforementioned substrate is determined to be contaminated based on the determination that contamination is attached to the aforementioned cleaning tape.

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