Manufacturing method of resin components for electronic device manufacturing process

Abstract

This invention provides a method for manufacturing resin components for electronic device manufacturing processes that can suppress the adhesion of deposits to surfaces for extended periods. The method for manufacturing resin components used in the manufacturing process of electronic devices includes a processing step of abrasive grains to process the surface of the original component, reducing the surface roughness Ra to 100 nm or less, and ensuring that the contact angle of pure water with the surface is 70˚ or more but less than 110˚.

Description

Technical Field

[0001] This invention relates to a method for manufacturing resin components for electronic device manufacturing processes. Prior Technology

[0002] Resins are used for a variety of applications due to their processability, water-repellent, oil-repellent, low-friction, chemical resistance, corrosion resistance, and insulation properties. In particular, in the manufacturing process of electronic devices, wet processes such as cleaning, grinding, and plating are often carried out using chemicals and processing fluids. Therefore, from the point of view of chemical resistance and corrosion resistance, resins are more suitable as materials for piping components or baths.

[0003] When resin components are used in the manufacturing process of electronic devices, dust may rise from the surface of the resin components, or deposits adhering to the surface of the resin components may detach, potentially contaminating the electronic devices. This could reduce the electrical characteristics of the manufactured electronic devices and decrease yield. Examples of deposits adhering to the surface of resin components include contaminants originating from the aforementioned processing fluids that adhere to and accumulate on the surface of the resin components. Therefore, it is necessary to suppress the rise of dust from the surface of resin components and the detachment of deposits adhering to the surface of the resin components over a long period of time.

[0004] Previously, resin components used surface roughness Ra (surface smoothness) ranging from submicron to tens of nanometers (see, for example, Patent Document 1). However, when only the surface roughness Ra of the resin component is controlled, it is difficult to sufficiently suppress dust generation from the surface of the resin component or the detachment of deposits attached to the surface of the resin component over a long period of time, and further improvements are required. [Previous Technical Documents] [Patent Literature]

[0005] [Patent Document 1] Japanese Patent Publication No. 293069, Heisei 6 Summary of the Invention

[0006] [The problem that the invention aims to solve]

[0007] The present invention provides a method for manufacturing resin components for electronic device manufacturing processes that can suppress the adhesion of deposits to the surface for a long period of time. [Methods for solving the problem]

[0008] Through dedicated examination, the inventors discovered that by applying abrasive particles to the surface of resin components to reduce surface roughness and by setting a specific contact angle, it is possible to suppress the adhesion of deposits to the surface of resin components for a long period of time, thus completing the present invention. That is, the method for manufacturing resin components for electronic device manufacturing process of one aspect of the present invention is a method for manufacturing resin components used in the manufacturing process of electronic devices. The main point is to have a processing step of abrasive grains processing the surface of the original component to make the surface roughness Ra less than 100 nm and the contact angle of pure water with the surface more than 70˚ and less than 110˚. [The effects of the invention]

[0009] According to the present invention, a resin component for electronic device manufacturing process can be obtained, which can suppress the adhesion of deposits to the surface for a long period of time. Implementation

[0010] [Forms of Invention]

[0011] This invention provides a detailed description of one embodiment. However, the following embodiments are merely examples illustrating the invention, and the invention is not limited to these embodiments. Furthermore, various modifications or alterations can be made to the following embodiments, and such modifications or alterations may also be included in the invention.

[0012] <Electronic Device Manufacturing Process> The method for manufacturing resin components for electronic device manufacturing processes according to this embodiment is a method for manufacturing resin components used in the manufacturing process of electronic devices. However, the types of electronic devices are not particularly limited, such as semiconductor devices, hard drives, sensors, photomasks, MEMS (Micro Electro Mechanical Systems), and MicroLED (Light Emitting Diode). Among these, in the manufacturing processes of semiconductor devices and hard drives, even a small amount of contamination can have a significant impact on yield. Therefore, it is appropriate to use the resin components for electronic device manufacturing processes according to this embodiment in these processes.

[0013] There is no particular limitation on the types of manufacturing processes for electronic devices, but examples include wet processes such as grinding, cleaning, photolithography, plating, and anodizing. Among these, grinding, cleaning, and photolithography are processes that are sensitive to contamination, and contamination significantly affects yield. Therefore, it is preferable to use resin components of the electronic device manufacturing process of this embodiment in these processes.

[0014] Furthermore, the resin component for electronic device manufacturing process of this embodiment is used in the process of manufacturing electronic devices. However, it is particularly applicable to electronic device manufacturing processes in which the surface of the resin component is kept wet.

[0015] Examples of keeping the surface of resin components used in the manufacturing process of electronic devices in a wet state include using the component in a state where part or all of it is immersed in liquids such as pure water or solutions, or using the component in a state where part or all of its surface is in contact with liquids such as pure water or solutions. Among these examples, the use of the component in a state where the entire resin component is immersed in liquids such as pure water or solutions, and the use of the component in a state where the entire surface is in contact with liquids such as pure water or solutions, are preferred.

[0016] <Resin Components> The type of resin used in the manufacturing process of the electronic device according to this embodiment is not particularly limited, but it is preferably a resin with high water repellency. Examples of resins with high water repellency include fluoropolymers, polyphenylene sulfide (PPS), and polyether ether ketone (PEEK).

[0017] Examples of fluorinated resins include fully fluorinated resins such as polytetrafluoroethylene (PTFE), partially fluorinated resins such as polychlorotrifluoroethylene (PCTFE), polyvinylidene fluoride (PVDF), and polyvinyl fluoride (PVF), and fluorinated resin copolymers such as perfluoroalkoxy resin (PFA), tetrafluoroethylene-hexafluoropropylene copolymer (FEP), ethylene-tetrafluoroethylene copolymer (ETFE), and ethylene-chlorotrifluoroethylene copolymer (ECTFE).

[0018] Furthermore, the method (manufacturing method) for preparing the original component (resin component before abrasive processing) of the resin component used in the manufacturing process of the electronic device of this embodiment is not particularly limited. For example, machining such as cutting and grinding, molding such as injection molding, film forming, coating and so on can be cited.

[0019] <Processing Steps (Abrasive Particle Processing Method)> The abrasive grain processing method for the original component in the manufacturing method of resin components for electronic device manufacturing process of this embodiment is not particularly limited. For example, processing with fixed abrasive grains using sandpaper, resin-bonded particles, metal-bonded particles, electroplated abrasives, etc., or grinding using free abrasive grains (CMP) can be cited.

[0020] In the final finishing of resin components, grinding with free abrasive grains is more suitable. In the pre-finishing stage (pre-processing) before the final finishing, grinding with fixed abrasive grains can be used. The method for manufacturing resin components for electronic device manufacturing processes according to this embodiment can be used for resin components with any surface properties (e.g., surface roughness) before abrasive grain processing. However, it is particularly suitable for resin components with a surface roughness Ra of 100 nm or more before abrasive grain processing.

[0021] The mechanism by which abrasive particles improve antifouling properties may not be clear, but it is speculated that, for example, the following reasons may be considered as sources of contamination from electronic devices on the surface of resin components: (1) Because the surface of resin components has a high contact angle and high water repellency, when contaminants from the processing fluid adhere to the surface of resin components during the wet process of electronic device manufacturing, they cannot flow through the dispersion medium and the contaminants are easily left on the surface of the resin components. This is a source of contamination that detaches from the surface of the resin components. (2) Because resin components are soft, scratches are easily introduced into the surface of resin components during the molding, cutting, coating and other processes. Various contaminants that are difficult to remove adhere to and remain on the scratched parts. This is a source of contamination that detaches from the surface of the resin components during the electronic device manufacturing process. (3) The surface roughness of resin components is large, and dust rises from the raised parts, becoming a source of contamination.

[0022] (1) The high contact angle of the surface of resin components is believed to be due to the highly bonded state of the atoms on the surface of the molded resin. However, by processing the surface of the resin component with abrasive particles, the bonded state of the surface is appropriately cut off, which has the effect of adjusting to a specific contact angle. (2) Abrasive particle processing has the effect of removing various contaminants attached to the surface of the resin component during the molding, cutting, coating and other construction processes. (3) Abrasive particle processing can make the surface of the resin component smooth, so it is believed to have the effect of suppressing dust generation on the raised parts of the surface of the resin component, thereby improving the anti-fouling performance. Furthermore, the above mechanism is based on speculation, and its correctness does not affect the technical scope of the present invention.

[0023] <Abrasive particles> The abrasive particles used in abrasive processing serve to mechanically grind the resin-made components (original components) of the object being abraded. There are no particular limitations on the type of abrasive particles; examples include particles composed of at least one oxide of silicon, such as alumina, silicon dioxide, cerium oxide, zirconium oxide, titanium oxide, iron oxide, and manganese oxide, as well as oxides of metallic elements. Among these, alumina and silicon dioxide are preferred, with alumina being the most desirable. Alumina can be any of α-alumina, δ-alumina, θ-alumina, κ-alumina, and amorphous alumina, with α-alumina being the most desirable.

[0024] The average secondary particle size (hereinafter also referred to as "D50") of the abrasive grains based on volume is not particularly limited, but is preferably 0.01 μm or more, more preferably 0.03 μm or more, even more preferably 0.05 μm or more, even more preferably 0.1 μm or more, even more preferably 0.3 μm or more, and most preferably 0.5 μm or more. Within this range, a high grinding speed can be achieved. Furthermore, the average secondary particle size of the abrasive grains based on volume is preferably 3 μm or less, more preferably 2 μm or less, and even more preferably 1.5 μm or less. Within this range, the surface properties and shape of the resin component are improved. Moreover, the average secondary particle size based on volume in this invention refers to the cumulative central value measured by a laser diffraction scattering particle size distribution measuring device.

[0025] The 10% particle size (the particle size that accumulates to 10% from the smallest particle size side, hereinafter also referred to as "D10") in the volumetric particle size distribution of the abrasive particles is not particularly limited, but is preferably 0.005 μm or more, more preferably 0.01 μm or more, even more preferably 0.02 μm or more, even more preferably 0.05 μm, even more preferably 0.2 μm or more, and most preferably 0.4 μm or more. Within this range, a high grinding speed can be achieved. Furthermore, D10 is preferably 2 μm or less, more preferably 1.5 μm or less, even more preferably 1.0 μm or less, and most preferably 0.8 μm or less. Within this range, the surface properties and shape of the resin-made components are improved.

[0026] The 90% particle size (the particle size that accounts for 90% of the cumulative particle size distribution from the smallest particle size side, hereinafter also referred to as "D90") in the volumetric reference of the abrasive particles is not particularly limited, but is preferably 0.02 μm or more, more preferably 0.04 μm or more, especially preferably 0.1 μm or more, even more preferably 0.3 μm or more, even more preferably 0.6 μm or more, particularly preferably 1.0 μm or more, and most preferably 1.3 μm or more. Within this range, a high grinding speed can be achieved. Furthermore, D90 is preferably 8 μm or less, more preferably 5 μm or less, and especially preferably 3 μm or less. Within this range, the surface properties and shape of the resin component are improved.

[0027] The ratio of D90 to D50 of the abrasive grains (D90 / D50) is not particularly limited, but it is preferably 1.1 or higher, more preferably 1.2 or higher, and especially preferably 1.3 or higher. Within this range, a high grinding speed can be achieved. Furthermore, D90 / D50 is preferably 3.0 or lower, more preferably 2.5 or lower, and especially preferably 2.2 or lower. Within this range, the surface properties and shape of the resin-made components become better.

[0028] The ratio of D90 to D10 of the abrasive grains (D90 / D10) is not particularly limited, but it is preferably 1.2 or higher, more preferably 1.5 or higher, and especially preferably 2.0 or higher. Within this range, a high grinding speed can be achieved. Furthermore, D90 / D10 is preferably 7.0 or lower, more preferably 6.0 or lower, and especially preferably 5.0 or lower. Within this range, the surface properties and shape of the resin-made components become better.

[0029] The ratio of D50 to D10 of the abrasive grains (D50 / D10) is not particularly limited, but it is preferably 1.1 or higher, more preferably 1.2 or higher, and especially preferably 1.3 or higher. Within this range, a high grinding speed can be achieved. Furthermore, D50 / D10 is preferably 3.0 or lower, more preferably 2.5 or lower, and especially preferably 2.2 or lower. Within this range, the surface properties and shape of the resin-made components become better.

[0030] Furthermore, while there is no particular limitation on the BET specific surface area of ​​the abrasive particles, it is preferably 5 m² / g or higher, more preferably 10 m² / g or higher, and even more preferably 15 m² / g or higher. Also, the BET specific surface area of ​​the abrasive particles is preferably 250 m² / g or lower, more preferably 100 m² / g or lower, even more preferably 50 m² / g or lower, and most preferably 25 m² / g or lower. Within this range, a good surface shape can be maintained while achieving a high grinding speed. Moreover, the BET specific surface area can be measured, for example, using a FlowSorb II 2300 manufactured by Micromeritics. The gas adsorbed on the free abrasive particles in the determination of the BET specific surface area can be nitrogen, argon, krypton, etc.

[0031] Furthermore, the shape of the abrasive particles is not particularly limited; for example, true spheres, ellipsoids, cocoons, fragments, and angular shapes can be mentioned. Among these, from the viewpoint of improving processing speed, ellipsoids, cocoons, fragments, and angular shapes are preferred. Furthermore, when using alumina as abrasive, there is no particular limitation on its α-aggregate ratio, but it is preferably 30% or more, more preferably 50% or more, especially 70% or more, even more preferably 80% or more, and particularly preferably 90% or more. Within this range, a good surface shape can be maintained while achieving a high grinding speed. Moreover, the α-aggregate ratio can be obtained, for example, from the integral intensity ratio of the (113) surface diffraction rays measured by X-ray diffraction.

[0032] Grinding using free abrasive particles When grinding the original component of the object to be ground using a processing fluid (hereinafter also referred to as "grinding composition") used in grinding with free abrasive particles, grinding can be performed, for example, by the following operation.

[0033] That is, while the pressure plate, grinding pad, etc. are in contact with the surface of the object to be ground, and pressure is applied to the object to be ground as needed, grinding components are supplied between the pressure plate, grinding pad and the surface of the object to be ground, and any one of the pressure plate, grinding pad and the object to be ground slides relative to the other, so that the surface of the object to be ground can be ground.

[0034] There are no particular limitations on the apparatus used for grinding; examples include stationary grinding apparatus, hand polishing machines, and robots with rotating bodies. Furthermore, there are no particular limitations on the method of supplying the grinding components; depending on the size or shape (planar, curved, or three-dimensional) of the object being ground or the grinding apparatus, appropriate methods can be selected, such as overflow supply, circulation supply, supply in a state of accumulation on the surface of the pressure plate or grinding pad that contacts the surface of the object being ground, supply by dripping onto the object being ground, supply by spraying, or supply by coating.

[0035] The concentration of abrasive particles in the grinding composition is not particularly limited, but it is preferably 0.1% by mass or more, more preferably 1% by mass or more, and even more preferably 3% by mass or more. Within this range, a high grinding speed can be achieved. Furthermore, the concentration of abrasive particles in the grinding composition is preferably 40% by mass or less, more preferably 20% by mass or less, and even more preferably 15% by mass or less. Within this range, the cost of the grinding composition is appropriate.

[0036] The grinding composition contains a dispersion medium. The dispersion medium acts as a medium to disperse or dissolve components other than the dispersion medium itself in the grinding composition. When water is used as the dispersion medium, industrial water, tap water, distilled water, or purified water or ultrapure water filtered through a filter can be used. Among these, distilled water, purified water, and ultrapure water are preferred due to their lower impurity content.

[0037] The pH of the grinding composition is preferably 1.0 or higher, more preferably 2.0 or higher, and especially preferably 3.0 or higher. Furthermore, the pH of the grinding composition is preferably 13.0 or lower, more preferably 10.0 or lower, especially preferably 7.0 or lower, and most preferably 5.0 or lower. If the pH of the grinding composition is within this range, the grinding ability of the grinding composition is improved, and the surface smoothness of the resin components after grinding is improved. Moreover, the pH of the grinding composition can be adjusted by appropriately adding well-known acids such as nitric acid and sulfuric acid, or well-known bases such as potassium hydroxide.

[0038] The grinding components may further contain water-soluble polymers. By containing water-soluble polymers, the smoothness of the surface of resin components is improved. The grinding composition is preferably any one of a slurry of an aqueous solvent, an emulsion of a mixture of an aqueous solvent and a non-aqueous solvent, or a high-viscosity complex in which a thickener is added to the emulsion. The grinding components can be prepared by diluting a stock solution made at a higher concentration than that used in the grinding process with water. By preparing the stock solution at a higher concentration than that used in the grinding process, the transportation costs or storage space requirements of the grinding components can be reduced.

[0039] <Abrasive Pad> When using a polishing pad for grinding the surface of an original component, there are no particular limitations on the material or shape of the polishing pad. However, any polishing pad can be used, such as polyurethane type, non-woven type, suede type, wool polishing wheel type, sponge polishing wheel type, plush type, belt type, etc. Among these, polyurethane type and suede type polishing pads are preferred. Furthermore, there are no particular limitations on the structure of the polishing pad. For example, a single-layer structure or a multi-layer structure with two or more layers supporting the polishing surface on the side opposite to the polishing surface can be used.

[0040] There are no particular limitations on the hardness of the abrasive pad. When abrading objects with a flat surface, the A hardness, as measured according to the method of JIS K6253, is preferably 50 or higher, more preferably 60 or higher, and especially preferably 70 or higher. Furthermore, the hardness of the abrasive pad is preferably 90 or lower, and more preferably 85 or lower.

[0041] When grinding objects with three-dimensional shapes, the hardness of the grinding pad, measured according to the method in Appendix 2 of JIS K7312:1996, is preferably 40 or higher, more preferably 50 or higher. Furthermore, the hardness of the grinding pad is preferably 90 or lower, more preferably 80 or lower. If the hardness of the grinding pad is within this range, the grinding ability of the grinding components is improved, and the smoothness of the surface of the resin component after grinding is improved.

[0042] There is no particular limitation on the thickness of the polishing pad, but it is preferably 0.5 mm or more, more preferably 1 mm or more, and even more preferably 2 mm or more. Furthermore, the thickness of the polishing pad is preferably 50 mm or less, more preferably 30 mm or less, and even more preferably 20 mm or less. If the thickness of the polishing pad is within this range, the polishing ability of the polishing components is improved, and the smoothness of the surface of the polished resin component is improved.

[0043] <Other grinding conditions> When applying pressure to the object to be ground, the pressure is preferably 0.1 kPa or more, more preferably 1 kPa or more, and especially preferably 2 kPa or more. Furthermore, the pressure applied to the object to be ground is preferably 100 kPa or less, more preferably 50 kPa or less, and especially preferably 15 kPa or less. If the pressure is within this range, the grinding ability of the grinding components is improved, and the smoothness of the surface of the resin component after grinding is improved.

[0044] The linear velocity of either the abrasive pad or the object being abraded relative to the other is preferably 10 m / min or more, more preferably 20 m / min or more. Furthermore, the linear velocity is preferably 1000 m / min or less, more preferably 500 m / min or less. If the linear velocity is within this range, the abrasive capability of the abrasive components is improved, and the smoothness of the surface of the resin component after abrasion is improved.

[0045] Properties and Shapes of Resin Components Used in Electronic Device Manufacturing Processes The surface roughness Ra of resin components used in electronic device manufacturing processes is below 100 nm, preferably below 50 nm, more preferably below 20 nm, even more preferably below 15 nm, and most preferably below 10 nm. Within this range, the adhesion of contaminants to the surface of the resin components can be suppressed for a long period. The surface roughness of the resin components can be measured, for example, using a measuring device such as the Laser Microscope VK-X200 manufactured by KEYENCE Inc.

[0046] For resin components used in the manufacturing process of electronic devices, the contact angle of pure water with the surface is 70˚ or higher, preferably 75˚ or higher, more preferably 80˚ or higher, especially 85˚ or higher, and most preferably 90˚ or higher. Furthermore, the contact angle of pure water with the surface is less than 110˚, preferably less than 108˚, and more preferably less than 106˚. When the resin components used in the manufacturing process of electronic devices are made of fluororesin, the contact angle of pure water with the surface is preferably less than 105˚.

[0047] If this range is met, then the hydrophilicity of the surface of the resin component is appropriate, inhibiting the adhesion of contaminants to the surface of the resin component, and maintaining its anti-fouling properties even after prolonged exposure to contaminants. The contact angle of pure water to the surface can be measured, for example, using a portable contact angle meter PG-X+ manufactured by MATSUBO Inc.

[0048] Furthermore, through abrasive grinding and other processes, the contact angle of pure water on the surface of resin components used in electronic device manufacturing processes is preferably reduced by 3˚ or more, more preferably by 5˚ or more, and even more preferably by 7˚ or more compared to before grinding. If this range is achieved, the hydrophilicity of the surface of the resin component becomes appropriate, which can further suppress the adhesion of contaminants to the surface of the resin component.

[0049] [Example] The following examples and comparative examples illustrate the present invention in more detail. (Example 1 and Comparative Examples 1-3) The resin components used in the electronic device manufacturing process of Examples 1 and Comparative Examples 1-3 are molded products of perfluoroalkoxy resin (PFA). Furthermore, in Example 1, the surface of the resin component (original component) was polished using an abrasive composition containing alumina dispersed in water at a concentration of 20% by mass. In Comparative Examples 1 and 3, the surface of the resin component (original component) was polished with sandpaper. The grit size of the sandpaper was #1000 in Comparative Example 1 and #320 in Comparative Example 3. In Comparative Example 2, the surface of the resin component (original component) was not polished.

[0050] The contact angle of pure water to the surface before grinding, the contact angle of pure water to the surface after grinding, and the surface roughness Ra of the ground surface are shown in Table 1. For Comparative Example 2, since grinding was not performed, the contact angle of pure water to the surface after grinding is not recorded. The contact angle of pure water was measured using a portable contact angle meter PG-X+ manufactured by MATSUBO Inc., with a water droplet volume of 1.5 μL. The surface roughness Ra was measured using a laser microscope VK-X200 manufactured by KEYENCE Inc., under a field of view of 284 × 213 μm.

[0051] The specific grinding conditions for Example 1 are as follows. Grinding machine: EJ-380IN manufactured by ENGIS Co., Ltd., Japan Abrasive pad: FUJIBO Ehime Co., Ltd. K-1WNX-202U Grinding load: 15kPa Feed rate of grinding components: 30 mL / min

[0052] [Table 1] Resin molded articles Rating 1 Rating 2 resin type Grinding Contact angle surface roughness Ra[nm] Pollution levels slip angle Pollution levels slip angle Grinding forward Grinding back Example 1 PFA Abrasive processing 105˚ 99˚ 12 A twenty three A twenty four Example 2 PTFE Abrasive processing 110˚ 101˚ 14 A twenty three A twenty four Example 3 PEEK Abrasive processing 85˚ 77˚ 7 A - - - Comparative Example 1 PFA Abrasive processing 105˚ 116˚ 412 B 30˚ B 56˚ Comparative Example 2 PFA none 105˚ - 679 B 20˚ B 30˚ Comparative Example 3 PFA Abrasive processing 105˚ 151˚ 1883 B 3˚ B 36˚ Comparative Example 4 PTFE Abrasive processing 110˚ 117˚ 442 B 37˚ B 46˚ Comparative Example 5 PTFE none 110˚ - 988 B 25˚ B 41˚ Comparative Example 6 PTFE Abrasive processing 110˚ 151˚ 3011 B 3˚ B twenty three Comparative Example 7 PEEK Abrasive processing 85˚ 87˚ 417 B - - - Comparative Example 8 PEEK none 85˚ - 700 B - - - Comparative Example 9 PEEK Abrasive processing 85˚ 84˚ 1042 B - - -

[0053] The following evaluation was conducted on the resin components of Example 1 and Comparative Examples 1-3. (Evaluation 1) Resin components were impregnated in a colloidal silica solution (20% by mass) containing colloidal silica particles with a primary particle size of 100 nm in water for 1 hour. The solution was then replaced with pure water and dried with dry air. The surface of the dried resin components was then observed at 3000x magnification using a Hitachi High Technology SU8000 scanning electron microscope to evaluate the amount of surface contamination. The results are shown in Table 1.

[0054] In Table 1, cases where fewer than 10 colloidal silica aggregates were observed within a 40μm × 40μm field of view are indicated by "A", and cases where more than 10 are indicated by "B". Furthermore, the slip angle of the colloidal silica liquid on the surface of a dried resin component was measured. Specifically, using an automatic tilting stage manufactured by Takeshi Kawakami Co., Ltd., the resin component was tilted at a speed of 0.5˚ / sec, and the angle at which a droplet of 50μL of colloidal silica liquid slipped was taken as the slip angle. The results are shown in Table 1.

[0055] (Evaluation 2) For resin components, a colloidal silica solution (concentration 20% by mass) with a particle size of 100 nm dispersed in water was sprayed for 30 seconds, followed by one day of static drying and rinsing with running water. This process was repeated six times. The surface of the resin components was then photographed using a Microscope VHX-2000 (KEYENCE Inc.) with a magnification of 32 mm × 32 mm to observe and evaluate the formation of the dried solidified material. The results are shown in Table 1.

[0056] In Table 1, "A" indicates that no dried solidified material is visible on the surface of the resin component in the photographed image, and "B" indicates that dried solidified material is visible. Furthermore, the slip angle of the colloidal silica liquid was measured on the surface of the resin component after the above operation was repeated 6 times. That is, using an automatic tilting stage manufactured by Takeshi Seiko Co., Ltd., the resin component was tilted at a speed of 0.5˚ / sec, and the angle at which a droplet of 50μL of colloidal silica liquid slipped was taken as the slip angle. The results are shown in Table 1.

[0057] (Example 2 and Comparative Examples 4-6) Except for the fact that the resin was polytetrafluoroethylene (PTFE), the tests were conducted in the same manner as in Example 1 and Comparative Examples 1-3. The results are shown in Table 1. (Example 3 and Comparative Examples 7-9) Except for the fact that the resin type is polyetheretherketone (PEEK), the tests were conducted in the same manner as in Example 1 and Comparative Examples 1-3. However, only the amount of contamination in Evaluation 1 was evaluated; the drop angle of Evaluation 1 and the amount of contamination and drop angle of Evaluation 2 were not evaluated. The results are shown in Table 1.

[0058] As shown in Table 1, Examples 1-3, which processed resin components with abrasive particles to achieve a surface roughness Ra of less than 100 nm and a contact angle of pure water with the surface of 70˚ or more but less than 110˚, are examples of low contamination and high anti-fouling properties as described in Evaluation 1. Furthermore, in Examples 1 and 2, the resin components in Evaluation 2 showed less contamination after 6 days of continued contamination. In addition, in Examples 1 and 2, the slip angle of one of the antifouling indicators changed less than in Evaluation 1, indicating that the surface properties and shape of the resin components can be maintained for a long period of time. On the other hand, the resin components in Comparative Examples 1-9 were heavily contaminated. Furthermore, in Comparative Examples 1-6, the slip angle of Evaluation 2 varied more than that of Evaluation 1, indicating that the surface properties and shape of the resin components could not be maintained for a long period of time.

Claims

1. A method for manufacturing a resin component for use in the manufacturing process of an electronic device, comprising a step of processing the surface of the original component with abrasive particles to make the surface roughness Ra less than 100 nm and the contact angle of pure water with the surface greater than 70˚ and less than 110˚.

2. The method for manufacturing resin components for electronic device manufacturing process as claimed in claim 1, wherein the aforementioned original component is made of fluororesin, and the aforementioned processing step is to process the surface of the aforementioned original component with abrasive particles to make the surface roughness Ra less than 100 nm, and to make the contact angle of pure water with the surface greater than 85˚ and less than 105˚.

3. A method for manufacturing resin components for electronic device manufacturing processes as claimed in claim 1 or 2, wherein the aforementioned processing step is a step in which the contact angle of pure water with the surface is reduced by more than 5˚ compared with that before processing by the aforementioned abrasive grain processing.