Dispensing system for and method of dispensing viscous material on electronic substrate

Abstract

A dispensing system includes a frame; a support coupled to the frame; a dispensing unit configured to dispense an viscous material; and a support assembly coupled to the frame. The support assembly includes a support configured to support the dispensing unit and allow movement of the dispensing unit in x, y, and z axes; and a tilting and rotating sub-assembly configured to tilt and rotate the dispensing unit. The dispensing system further includes a controller configured to control the dispensing unit and the support assembly to perform a dispensing operation on an electronic substrate. The controller is configured to control the dispensing unit to dispense material from its nozzles at a flow rate configured to deposit a desired amount or density of material onto the electronic substrate along a three-dimensional path.

Description

technical field

[0001] The present disclosure relates generally to apparatus and methods for dispensing viscous materials on substrates such as printed circuit boards, and more particularly to mechanisms for dispensing units configured to tilt and rotate Method and apparatus for dispensing material on a substrate. prior art

[0002] Several types of dispensing systems exist for dispensing precise quantities of liquids or slurries for various applications. One such application is the assembly of integrated circuit chips and other electronic components onto circuit board substrates. In this application, an automated dispensing system is used to dispense dots of liquid epoxy or solder paste, or some other related material, onto a printed circuit board. Automated dispensing systems have also been used to dispense lines of underfill material and encapsulant that can be used to mechanically fasten components to printed circuit boards. Exemplary dispensing systems described above include those manufactured and distributed by Illinois Tool Works Electronic Assembly Equipment (ITWEAE) with offices in Hopkinton, Massachusetts.

[0003] In a typical dispensing system, the dispensing unit is mounted to a mobile station for moving the dispensing unit along three mutually orthogonal axes (x-axis, y-axis, and z-axis) using servo motors controlled by a computer system or controller. assembly or bracket. To dispense a dot of liquid at a desired location on a printed circuit board or other substrate, the dispensing unit is moved along coplanar horizontal x- and y-axes until the dispensing unit is over the desired location. The dispensing unit is then lowered in the direction of the vertically oriented vertical z-axis until the dispensing unit and nozzles / needles of the dispensing system are at the proper dispensing height on the substrate. The dispensing unit dispenses a dot of liquid, then lifts along the z-axis, moves along the x-axis and y-axis to a new position, and lowers along the z-axis to dispense the next dot of liquid. For applications such as sealing or dispensing of underfills as described above, the dispensing unit is typically controlled to dispense a line of material as the dispensing unit is moved in the x- and y-axes along the desired path of the line. For some types of dispensing units, such as jet pumps, z-axis movement before and after the dispensing operation may not be required.

[0004] Greater control over the dispensing unit to accurately place the dispensed material closer to the corner where the edge of the component meets the substrate or other space / orientation that requires this motion is required. Contents of the invention

[0005] One aspect of the present disclosure is directed to a dispensing system for dispensing viscous materials on electronic substrates. In one embodiment, the dispensing system includes a frame; a support coupled to the frame, the support configured to receive and support an electronic substrate during a dispensing operation; and a dispensing unit assembled Fitted with dispensing viscous material, the dispensing unit has a nozzle. The dispensing system further includes a bracket assembly coupled to the frame, the bracket assembly including a bracket assembled to support the dispensing unit and position the dispensing unit in the x-axis, y-axis and z-axis direction; and a tilt and swivel subassembly configured to tilt and swivel the dispensing unit. The dispensing system further includes a controller configured to control the dispensing unit and the rack assembly to perform dispensing operations on the electronic substrate. The controller is configured to control the dispensing unit to dispense material from nozzles of the dispensing unit at a flow rate configured to deposit a desired amount or density of material on the electronic substrate along a three-dimensional path.

[0006] Embodiments of the dispensing system may further include a flow rate of up to 2000 mg / sec. The flow rate may be between 0.05 mg / sec and 10 mg / sec. The flow rate can be controlled by controlling the material pressure within the dispensing unit. The controller can further be configured to coordinate movement of the support system and the tilt and rotate subassembly to position and orient the nozzle of the dispensing unit at a predetermined distance and orientation from the electronic substrate when dispensing material. The predetermined distance may be at most 5.0 mm. The controller can further be configured to maintain the nozzle of the dispensing unit at a predetermined angle relative to the horizontal plane of the electronic substrate. The predetermined angle may be between 0° and 90°. The controller can further be configured to move the nozzle of the dispensing unit at a constant speed relative to the electronic substrate. This constant velocity may be up to 1000 mm / s. The constant speed may be between 20 mm / sec and 200 mm / sec. The controller may further be configured to calibrate the dispensing position of the nozzle of the dispensing unit relative to the vision system by dispensing on the electronic substrate provided on the support. The controller may include or have access to a database having a table of nozzle to vision system orientations. The controller can be configured to calibrate the orientation of the nozzle based in part on interpolation of known positions and orientations.

[0007] Another aspect of the disclosure is directed to a method of dispensing an adhesive material on an electronic substrate. In one embodiment, the method includes: transporting an electronic substrate to a dispensing location; capturing at least one image of the electronic substrate; analyzing the at least one image of the electronic substrate to determine the location of the electronic substrate; The dispensing unit attached to the stand tilts and swivels to perform the dispensing operation. Performing the dispensing operation includes dispensing material from nozzles of the dispensing unit at a flow rate configured to deposit a desired amount or density of material on the electronic substrate along a three-dimensional path.

[0008] Embodiments of the method may further comprise a flow rate of up to 2000 mg / sec. The flow rate at which material is dispensed from the nozzles of the dispensing unit can be controlled by controlling the pressure of the material within the dispensing unit. The method may further include coordinating movement of the carriage assembly and the tilt and rotate subassembly to position and orient a nozzle of the dispensing unit at a predetermined distance and orientation from the electronic substrate when dispensing material. Performing the dispensing operation may include maintaining the nozzle of the dispensing unit at a predetermined angle relative to a horizontal plane of the electronic substrate. Performing the dispensing operation may comprise moving the nozzle of the dispensing unit relative to the package at a constant speed. Brief description of the diagram

[0009] Various aspects of at least one embodiment are discussed below with reference to the accompanying drawings, which are not intended to be drawn to scale. The drawings are included to provide illustration and further understanding of various aspects and embodiments, and are incorporated in and constitute a part of this specification, but are not intended as definitions of limitation of any particular embodiment. Together with the remainder of the specification, the drawings serve to explain the principles and operations of the described and claimed aspects and embodiments. In the figures, each identical or nearly identical component that is illustrated in various figures is represented by a like numeral. For purposes of clarity, not every component may be labeled in every figure. In the picture:

[0010] Figure 1 is a schematic diagram of the distribution system;

[0011] Figure 2 is a perspective view of the dispensing system with the enclosure removed to reveal the dispensing system assembled to handle a single dispensing unit;

[0012] Figure 3 is a perspective view of the distribution system shown in Figure 2 with the distribution unit removed;

[0013] Figure 4 is an enlarged perspective view of the distribution system;

[0014] Figure 5 is an enlarged perspective view of the distribution system shown in Figure 4 with the distribution unit spaced apart from the remaining components of the distribution system;

[0015] Figure 6 is a cross-sectional view of the distribution system;

[0016] Figure 7A shows an exemplary package mounted on an electronic substrate;

[0017] Figure 7B shows an exemplary package mounted on an electronic substrate;

[0018] FIG. 8 illustrates an exemplary computer system upon which various aspects of the disclosure may be practiced; and

[0019] Figure 9 illustrates an exemplary storage system capable of implementing various aspects of the present disclosure. Implementation

[0020] Various embodiments of the present disclosure are directed to viscous material dispensing systems, devices including dispensing systems. Embodiments disclosed herein are directed to techniques for dispensing materials on electronic substrates by dispensing systems having dispensing units configured to tilt and rotate to dispense materials onto electronic substrates.

[0021] For purposes of illustration only, and without limitation of generality, the disclosure will now be described in detail with reference to the accompanying drawings. The disclosure is not limited in its application to the details of construction and the arrangement of components set forth in the following description or illustrated in the drawings. The principles set forth in this disclosure are capable of other embodiments and of being practiced or carried out in various ways. Also, the phraseology and terminology used herein are for the purpose of description and should not be regarded as limiting. Any reference herein to an instance, embodiment, component, element, or act of a system and method referred to in the singular may also include plural embodiments, and reference herein to any plural form of any embodiment, component, element, or act Any reference may also encompass only a single embodiment. References in singular or plural are not intended to limit the presently disclosed systems or methods, components, acts, or elements thereof. The use of "including", "comprising", "having", "containing", "involving" and variations thereof herein is meant to encompass the items of the list thereafter and their equivalents as well as additional items. References to "or" are deemed inclusive such that any term described using "or" may denote any of a single, more than one, and all of the described terms. Additionally, in the event of inconsistent usage of terms between this document and a document incorporated by reference herein, the usage of the term in the incorporated document is supplemental to that of this document; for irreconcilable inconsistencies, this Term usage control in the document.

[0022] Figure 1 schematically illustrates a dispensing system indicated generally at 10 according to one embodiment of the present disclosure. Dispensing system 10 is used to dispense viscous materials (e.g., adhesives, encapsulants, epoxies, solder paste, underfill materials, etc.) or semi-viscous materials (e.g., solder flux, etc.) on a round electronic substrate 12. The dispensing system 10 may alternatively be used in other applications, such as for applying automotive upholstery or in certain medical applications, or for applying conductive inks. It should be understood that, as used herein, references to viscous or semi-viscous materials are exemplary and are intended to be non-limiting. In one embodiment, dispensing system 10 includes first and second dispensing units, generally indicated at 14 and 16, respectively, and a controller 18 to control the operation of the dispensing system. It should be understood that a dispensing unit may also be referred to herein as a dispensing pump and / or a dispensing head. Although two dispensing units are shown, it should be understood that a single dispensing unit or multiple dispensing units may be used.

[0023] The dispensing system 10 may also include a frame 20 having a base or support 22 for supporting the electronic substrate 12; a dispensing unit bracket 24 movably coupled to the frame 20 for supporting and moving the dispensing unit; units 14, 16; and a weight measuring device or scale 26 for weighing dispensed quantities of viscous material, for example, as part of a calibration procedure, and providing weight information to controller 18. A conveyor system (not shown) or other transport mechanism such as a walking beam may be used in the distribution system 10 to control the loading and unloading of electronic substrates to and from the distribution system. The carriage 24 can be moved using a motor under the control of the controller 18 to position the dispensing units 14, 16 at predetermined locations on the electronic substrate. Dispensing system 10 may include a display unit 28 coupled to controller 18 for displaying various information to an operator. There may be an optional second controller for controlling the dispensing unit. Additionally, each dispensing unit 14, 16 may be incorporated with a z-axis sensor to detect the height at which the dispensing unit is positioned above the electronic substrate 12 or features mounted on the electronic substrate. The z-axis sensor is coupled to the controller 18 for relaying information obtained by the sensor to the controller.

[0024] Before performing a dispensing operation, as described above, an electronic substrate, eg, a printed circuit board, must be aligned or otherwise registered with a dispensing unit of the dispensing system. The dispensing system further includes a vision system 30, which in one embodiment is coupled to a vision system mount 32 movably coupled to the frame 20 for supporting and moving the vision system. In another embodiment, the vision system 30 may be provided on the dispensing unit bracket 24 . As described, vision system 30 is used to verify known fiducial landmarks on the electronic substrate, or the location of components. Once positioned, the controller can be programmed to manipulate the movement of one or more of the dispensing units 14, 16 to dispense the material on the electronic substrate.

[0025] The systems and methods of the present disclosure are directed to dispensing materials onto electronic substrates, such as printed circuit boards. The descriptions of the systems and methods provided herein refer to exemplary electronic substrates 12 (eg, printed circuit boards) supported on supports 22 of dispensing system 10 . In one embodiment, dispensing operations are controlled by a controller 18, which may include a computer system configured to control the material dispensing unit. In another embodiment, the controller 18 may be manipulated by an operator. Controller 18 is configured to manipulate movement of vision system mount 32 to move the vision system in order to obtain one or more images of electronic substrate 12 . The controller 18 is further configured to manipulate movement of the dispensing unit bracket 24 to move the dispensing units 14, 16 to perform dispensing operations.

[0026] Embodiments of the present disclosure are directed to a strain wave gear drive assembly configured to tilt and rotate a dispensing unit of a dispensing system. Alternative and competitive means are provided for dispensing accurately simultaneously on one or more electronic substrates or two or more patterns associated with a single electronic substrate. The methods disclosed herein further support the use of various types of dispensing units including, but not limited to, augers, pistons, and jet pumps.

[0027] Referring to Figures 2 and 3, the dispensing system is generally indicated at 40. As shown, distribution system 40 includes a frame 42 assembled to support the major subassemblies of the distribution system. Dispensing system 40 further includes a carriage system, indicated generally at 44, that is configured to move in x-axis and y-axis directions. The dispensing system 40 further includes a dispensing unit assembly, generally indicated at 46 , which is supported by a bracket system 44 . Figure 2 illustrates the dispensing system 40 with the dispensing unit assembly 46 and Figure 3 illustrates the dispensing system 40 with the dispensing unit assembly removed. A conveyor system (not shown) may be used in the distribution system 40 to control the loading and unloading of substrates, such as electronic substrates 12, to and from supports 50 of the distribution system. The bracket system 44 can be moved in the x-axis and y-axis directions using motors under the control of the controller 10 in a manner similar to the controller 18 of the dispensing system 10 to position the dispensing unit assembly 46 at a predetermined position above the electronic substrate .

[0028] In one embodiment, as shown in FIGS. 2 and 3, the bracket system 44 can be assembled to include a left side rail 52, a right side rail 54, and a cross member 56 extending between the two side rails. The beam 56 is configured to move in the y-axis direction along the side rails 52 , 54 to achieve the y-axis movement of the distribution unit assembly 46 . Bracket system 44 further includes a slider 58 coupled to beam 56 and configured to move along the length of the beam to provide x-axis movement of dispensing unit assembly 46 . In particular, the slider 58 supports the dispensing unit assembly 46 and is configured to move in the x-axis direction along the length of the beam to place the dispensing unit 48 on the electronic substrate 12 positioned on the support 50 of the dispensing system 40. Move up to the desired position. In certain embodiments, the movement of the carriage system 44 in the x-y plane (i.e., the movement of the beam 56 and the slider 58) can be achieved by using a ball screw mechanism, which is achieved by using a ball screw mechanism as is well known in the prior art. Driven by individual motors.

[0029] In one embodiment, the exemplary dispensing system described herein may embody the Camalot® dispensing system sold by ITWEAE of Hopkinton, Massachusetts.

[0030] Dispensing unit assembly 46 is configured to move dispensing unit 48 in the z-axis direction via z-axis drive mechanism 60, which is shown in FIG. 2 . The amount of z-axis movement can be determined by measuring the distance between the top of a nozzle, sometimes referred to as a needle (not shown), of dispensing unit 48 and electronic substrate 12 . When moved, the dispensing unit 48 may be positioned at a nominal clearance height above the electronic substrate 12 . The clearance height may be maintained at a relatively consistent elevation above the electronic substrate 12 when moving from one dispensing location to another. When the predetermined distribution position is reached, the z-axis driving mechanism 60 lowers the distribution unit 48 to the electronic substrate 12, so that the distribution of the material on the electronic substrate can be achieved.

[0031] Still referring to FIGS. 2 and 3, the dispensing unit 48 moves across the electronic substrate 12 in such a way that the dispensing unit is used to perform dispensing operations. However, prior to dispensing, the positioning of the electronic substrate 12 relative to the dispensing unit 48 is determined so that precise dispensing can occur. In particular, in one embodiment, slider 58 may be configured to include an optical element or camera designed to take an image of electronic substrate 12 . Although the camera has been described as being mounted on the slider 58, it should be understood that the camera could be mounted separately on the beam 56 or on a separate stand. Cameras may be referred to herein as "vision systems" or "imaging systems." In order to align the electronic substrate 12 with the dispensing unit 48 and the mounting system 44, images of at least two fiducials provided on the electronic substrate 12 are captured by a camera. If the electronic substrate 12 is not in proper positioning, the support system 44 can be manipulated to account for the actual positioning of the electronic substrate. In one embodiment, the camera may be calibrated to determine the camera-to-needle offset distance for the dispensing unit 48 . In another embodiment, visual alignment and clearance height sensing can be achieved with a laser or another calibrated distance measuring device.

[0032] Dispensing systems generally have dispensing units that are vertically oriented and thus clamp the substrate perpendicular to the horizontal. In some applications, it may be advantageous to tilt the dispensing unit away from vertical to deposit material dispensed in a location otherwise inaccessible from a vertical orientation. Since the inclined distribution unit is articulated to various desired orientations, it may also be advantageous to vary not only the angle of the distribution unit from vertical, but also the direction in which the distribution unit is inclined, envisioning depositing material on sections along more than one side at the bottom edge.

[0033] As will be appreciated by those familiar with mobile structures, the mechanism utilized to tilt and rotate the distribution unit 48 adds mass and reduces structural stiffness, since any added mechanism results in increased compliance. As the supported mass increases and the rigidity of the structure decreases, the natural frequency of the assembly decreases. Therefore, the designer is obliged to provide the necessary degrees of freedom with the minimum added mass and as rigid a structure as possible.

[0034] Embodiments of the dispensing system 40 of the present disclosure accomplish this goal by incorporating extremely compact and highly integrated rotary actuators such as those available from Harmonic Drive of Beverly, Massachusetts, which The actuator consists of a motor, a strain wave harmonic reduction gearbox and an extremely rigid rotating cross-roller bearing. This level of integration in the strain wave gearbox actuator serves to minimize added mass and compliance. The strain wave gearbox further has the benefit of extremely low backlash. Additionally, an integrated motor, bearing and gearbox assembly is used to minimize the number of parts that must be purchased, assembled and tested.

[0035] 4 and 5, dispensing unit assembly 46 includes a drive assembly assembled to support dispensing unit 48, which is shown in an operative position in FIG. Shown in a pre-operational position, with the dispensing unit spaced apart from components of the dispensing unit assembly assembled to support the dispensing unit. As shown, the dispensing unit assembly 46 includes a support bracket 62 having an L-shaped configuration in which a first portion 64 of the support bracket is secured to the z-axis drive mechanism 60 of the slider 58 and extends perpendicularly therefrom. The second part of 66. Dispensing unit assembly 46 further includes a movable bracket 68 rotatably coupled to support bracket 62 at support bracket second portion 66 by a first strain wave gear system 70 . In the illustrated embodiment, the movable bracket 68 is configured to rotate about a generally vertical axis A relative to the support bracket 62 .

[0036] The movable carriage 68 includes a second strain wave gear system 72 assembled to support the dispensing unit 48 . As shown, the second strain wave gear system 72 includes a mounting plate 74 configured to receive and support the dispensing unit 48 when the dispensing unit is in its operative position. The second strain wave gear system 72 is configured to rotate and tilt the dispensing unit 48 about an axis B generally perpendicular to the axis A to a desired orientation during a dispensing operation. In one embodiment, the first strain wave gear system 70 is constructed similarly, if not identically, to the second strain wave gear system 72 .

[0037] It should be understood that the orientation of the movable bracket 68 relative to the support bracket 62 about axis A and the orientation of the dispensing unit 48 relative to the movable bracket may be varied to suit a particular application. For example, movable bracket 68 may be rotatably coupled to support bracket 62 about a generally horizontal axis, and the dispensing unit may be rotatably coupled to the movable bracket about a generally vertical axis.

[0038] FIG. 6 illustrates a cross-sectional view of the distribution unit assembly 46 of the first strain wave gear system 70 and the second strain wave gear system 72 . The movable bracket 68 is configured to rotate up to a full 360 degrees, ie, 0 to 360 degrees, relative to the support bracket 62 . Similarly, dispensing unit 48 is configured to rotate up to a full 360 degrees, ie, 0 to 360 degrees, relative to movable carriage 68 . Thus, the amount of rotation and tilt of the dispensing head 48 is unlimited.

[0039] In one embodiment, a controller or control system such as controller 18 may be configured with a suitable operating system with application specific software to control the operation of dispensing system 40. In certain embodiments, an operator of the dispensing system 40 may operate the dispensing system manually by manipulating a keyboard and mouse with the control system or automatically through the control system by programming the control system with the aid of a keyboard and mouse. The controller is further configured to analyze at least one image of the electronic substrate 12 to determine the orientation of the electronic substrate in the x-axis, y-axis, and theta directions, calculate the rotation angle of the electronic substrate, and when performing a dispensing operation, cause the dispensing unit 48 to Rotate to match the angle of the electronic substrate.

[0040] During operation, when depositing material on a substrate such as an electronic substrate, the dispensing unit 48 of the dispensing unit assembly 46 is positioned in close proximity to the electronic substrate by manipulating the rack system. The controller controls the automatic movement of the dispensing unit 48 by manipulating the support system 44 to distribute materials on the electronic substrate 12 by rotating the dispensing unit around the A-axis and the B-axis. The controller controls the movement (linear and rotational) of the dispensing unit of the dispensing unit assembly 46 by controlling the operation of the bracket system 44 and the drive assembly.

[0041] Thus, it should be observed that the movable bracket 68 is configured to rotate a full 360 degrees relative to the support bracket 62 and the dispensing unit 48 is configured to rotate a full 360 degrees relative to the movable bracket. This enables the dispensing unit 48 to deposit material on hard-to-reach places on the electronic substrate 12 . The dispensing system 40 disclosed herein uses a specific combination of drive assemblies to control the direction of the dispensing unit 48, with the benefit of increased speed and precision for dispensing applications. sport control

[0042] As mentioned above, the dispensers of embodiments of the present disclosure may include dispensing units including, but not limited to, augers, pistons, and jet dispensing units. A controller of a dispensing system, such as controller 18 of dispensing system 10, is configured to perform dispensing operations on electronic substrates. Specifically, the controller is configured to control the movement of the vision system and vision system support, for example, movement of vision system 30 and vision system stage 32, to obtain an electronic substrate such as electronic substrate 12 and any components mounted on the substrate. Image of a component or package. Referring to FIGS. 7A and 7B , an exemplary electronic substrate 80 includes a package 82 mounted on the electronic substrate. Package 82 may include any type of electronic component, such as an integrated circuit. Also shown is a nozzle 90 of a dispensing unit, such as dispensing unit 48 , positioned relative to the intersection or junction edge point of package 82 and electronic substrate 80 .

[0043] As discussed above, it is desirable to deposit material around the perimeter of package 82 on electronic substrate 80, and conventional vertical distribution is insufficient in performing this function. However, with the dispensing systems of the embodiments disclosed herein, including dispensing system 40, the ability to tilt and rotate the dispensing unit can position the nozzle 90 of the dispensing unit to optimize the dispensing operation around the package 82. Additionally, the dispensing system is configured to dispense material around packages or other components of varying shapes and sizes.

[0044] Once the image is acquired, the controller is configured to control the movement of the carriage, the first strain wave gear system and the second strain wave gear system, and the activation of the dispensing unit to dispense material onto the package 82 mounted on the electronic substrate 80 around. The speed of movement of the nozzles 90 of the dispensing unit is determined by the controller, in part to achieve the desired amount and density of material dispensed on the electronic substrate.

[0045] In one embodiment, the tip of nozzle 90 may be controlled to achieve or otherwise maintain a predetermined distance 100 from the intersection of package 82 and electronic substrate 80 when dispensing material around the package. Specifically, the controller is configured to control the dispensing unit bracket, such as the bracket system 44, and tilt and rotate a subassembly, such as the first strain wave gear system 70 and the second strain wave gear system 72, to position the nozzle 90 such that the tip maintains a predetermined distance 100 from the edge of the package 82 at the intersection of the package and the electronic substrate 80. As shown, the nozzle 90 of the dispensing unit is positioned at a predetermined angle by a second strain wave gear system. The tip of the nozzle 90 of the dispensing unit can be positioned by rotating the dispensing unit by controlling the first strain wave gear system with the controller. The configuration enables the tip of the nozzle of the dispensing unit to maintain a predetermined distance from the intersection point as it transitions around the corner of the package from the straight side of the package 82 to the vertical straight side of the package by rotating the dispensing unit when the dispensing unit is moved with the carriage 100. In certain embodiments, for example, predetermined distance 100 is at most 5.0 mm. In another example, the predetermined distance 100 is between 0.025 mm and 1.0 mm.

[0046] In one embodiment, the nozzles 90 may be controlled to achieve or otherwise maintain the nozzles of the dispensing unit at a predetermined angle 102 relative to the horizontal plane of the electronic substrate 80 . As discussed above, the angle 102 of the nozzle 90 of the dispensing unit can be optimized to position the tip of the nozzle 90 close to the intersection of the package 82 and the electronic substrate 80 . Although a perpendicular angle (90°) is shown between the package and the electronic substrate, the package can be shaped to extend from the electronic substrate at any angle. The second strain wave gear system can be controlled by the controller to achieve the predetermined angle 102 . For example, the predetermined angle 102 may be between 0° and 90°. In another example, the predetermined angle 102 may be approximately 45°.

[0047] In one embodiment, nozzle 90 may be controlled by a controller to achieve or otherwise cause the nozzle of the dispensing unit to move at a constant velocity relative to package 82 . As mentioned above, the controller is configured to manipulate the carriage, the first strain wave gear system, and the second strain wave gear system to position the tip of the nozzle 90 of the dispensing unit a predetermined distance from the intersection of the package 82 and the electronic substrate 80. Distance 100. In addition, the controller is configured to manipulate the second strain wave gear system to position the nozzle 90 of the dispensing unit at a predetermined angle 102 to optimize the positioning of the tip of the nozzle. The controller is configured to move the dispensing unit such that the nozzle 90 of the dispensing unit moves at a constant speed, thereby helping to ensure that a desired amount or density of material is deposited on the electronic substrate 80 adjacent to the package 82 . The speed of the dispensing unit can be varied; however, a constant speed, especially during the straight portion of packaging, is desirable. For example, a constant velocity of at most 1000 mm / s. In another example, the constant speed is between 20 mm / sec and 200 mm / sec.

[0048] The space of the predetermined distance 100 of the tip of the nozzle 90 from the intersection of the package 82 and the electronic substrate 100, the predetermined angle 102 of the nozzle of the dispensing unit, and the speed of the dispensing unit together provide motion control of the dispensing unit. Controlling the movement of the tip of the dispenser's nozzle 90 occurs along the x-axis, y-axis, and rotational axis, and is accomplished with the controller through the bracket, the first strain wave gear system, and the second strain wave gear system. As mentioned above, a vision system may be used to obtain an image of the location of the package 82, wherein the controller is configured to determine the path for the nozzle 90 of the dispensing unit to dispense material around the package. A controller provides commands for the carriage, the first strain wave gear system, and the second strain wave gear system to control movement of the dispensing unit during a dispensing operation.

[0049] As mentioned above, the size and shape of package 82 can embody a variety of shapes and sizes. The controller is configured to control the movement of the dispensing unit by controlling the carriage of the dispensing system, the first strain wave gear system, and the second strain wave gear system to perform dispensing operations on the packages and components provided on the electronic substrate 80 .

[0050] In one embodiment, the controller is configured to simultaneously coordinate movement of the bracket assembly including the bracket, and tilt and rotate the sub-assembly including the first strain wave gear system and the second strain wave gear system to move along the The three-dimensional path dispenses the material with the nozzles of the dispensing unit positioned and oriented at a predetermined distance 100 and orientation 102 from the electronic substrate 80 . flow rate control

[0051] It should be understood that the amount of material deposited by the dispensing unit of the dispensing system depends not only on the movement control of the nozzles 90 of the dispensing unit, but also on the flow rate of the material dispensed by the dispensing unit. Specifically, with regard to flow rate, the pressure of the material in the dispensing unit and the size of the opening of the nozzle 90 of the dispensing unit determine the flow rate of the material from the dispensing unit. As mentioned above, the bracket, the first strain wave gear system, and the second strain wave gear system are controlled by the controller to move the dispensing unit so that the tip of the nozzle 90 of the dispensing unit is precisely positioned relative to the package. Based on the positioning of the tip of the nozzle 90 and the speed of the dispensing unit, the flow rate of the material is precisely controlled by the controller to distribute the desired amount and density of material around the package 82 on the electronic substrate 80 .

[0052] As mentioned above, the flow rate is determined in part by the viscosity of the material being dispensed, the pressure of the material within the nozzle 90, and the diameter of the nozzle through which the material is dispensed. The dispensing unit can be configured to control the pressure of the material within the nozzle 90 . The pressure of the material can be controlled within the chamber of the dispensing unit by applying pressurized air within the chamber. In some embodiments, the size of the opening of the nozzle 90 of the dispensing unit can be selected to achieve a desired flow rate. It should be understood that as the material flows through the nozzle 90 and the diameter of the nozzle decreases or increases, the flow rate of the material increases or decreases, respectively.

[0053] In one embodiment, the controller is further configured to dispense material from nozzles 90 of the dispensing unit at a flow rate configured to deposit a desired amount or density of material on the electronic substrate. The flow rate is determined by the viscosity of the material being dispensed, the pressure of the material within the nozzle 90, and the diameter of the nozzle through which the material is dispensed. For example, the flow rate can be up to 100 mg / sec. In another example, the flow rate can be between 0.05 mg / sec and 10 mg / sec. multiple allocation units

[0054] As mentioned above, embodiments of the dispensing system may include two or more dispensing units that may be configured to simultaneously and accurately distribute in one or more dispensing units in a synchronous or asynchronous mode electronic substrates or two or more patterns associated with a single electronic substrate. In particular, if the electronic substrates are not properly aligned as determined by the controller, the dispensing system may switch from a distributed synchronous mode from two of the electronic substrates or patterns to a non-distributed mode in which only one of the electronic substrates or patterns is dispensed. synchronous mode. The methods disclosed herein further support the use of various types of dispensing pumps including, but not limited to, auger, piston, and jet pumps.

[0055] An exemplary dispensing operation for two substrates or for two substrate patterns may consist of the following steps: delivering a first electronic substrate pattern to a dispensing location; delivering a second electronic substrate pattern to a dispensing location; delivering the first electronic substrate pattern to a dispensing location; aligning with the first dispensing unit; positioning the second dispensing unit a predetermined distance from the first dispensing unit; dispensing material from the first dispensing unit at a desired location on the first electronic substrate pattern; and dispensing material on the second electronic substrate pattern Dispensing material from the second dispensing unit at the desired location on the In some embodiments, dispensing material from the first dispensing unit may include lowering the first dispensing unit toward the first electronic substrate pattern. Similarly, the step of dispensing material from the second dispensing unit may comprise lowering the second dispensing unit towards the second electronic substrate pattern.

[0056] Another exemplary dispensing operation may consist of the steps of: delivering the first electronic substrate pattern and the second electronic substrate pattern to respective dispensing locations; positioning the first dispensing unit over the first electronic substrate pattern; positioning the second dispensing unit Dispensing material from the first dispensing unit at a desired location on the first electronic substrate pattern at a predetermined distance from the first dispensing unit; and dispensing material from the second dispensing unit at a desired location on the second electronic substrate pattern. Dispensing the material from the first dispensing unit includes lowering the first dispensing unit toward the first electronic substrate pattern. Similarly, dispensing material inclusions from the second dispensing unit lowers the second dispensing unit towards the second electronic substrate pattern. In some embodiments, the predetermined distance is determined by identifying a first reference point associated with the first electronic substrate pattern and a second reference point associated with the second electronic substrate pattern.

[0057] Yet another exemplary dispensing operation for two substrates may consist of the following steps: (1) calibrating the actual distance between each of the dispensing units and the camera; (2) identifying fiducial locations on the substrate or substrates (3) move the first distribution unit to the first distribution position on the first substrate; (4) distribute at the first distribution position on the first substrate; (5) move the second distribution unit to The first allocation location on the second substrate, which is a small and therefore fast-executing execution; (6) allocate at the first allocation location on the second substrate; and (7) for one of the remaining allocation locations on the substrate Steps (3) to (6) are repeated for each one. The previous operations may be performed when dispensing on a single substrate with multiple patterns on the substrate.

[0058] It is further contemplated that this method of dispensing simultaneously on every other substrate may be used when more than two dispensing units are used. For example, when three distribution units are used, the first, third and fifth substrates can be distributed simultaneously by the first, second and third distribution units respectively. After dispensing on these substrates, the dispensing unit may be moved such that dispensing takes place on the second, fourth and sixth substrates with the first, second and third dispensing units, respectively.

[0059] In an exemplary embodiment, a method of dispensing material may include delivering an electronic substrate to a dispensing location, the electronic substrate having at least two identical patterns; obtaining information about the at least two patterns; and determining whether the at least two patterns are based on the obtained information. suitably suitable for simultaneous dispensing to perform simultaneous dispensing operations on at least two patterns; and performing simultaneous dispensing operations on at least two patterns if the two patterns are suitably suitable for simultaneous dispensing.

[0060] Dispensing the material may include positioning a first dispensing unit over a first location of a first pattern and positioning a second dispensing unit over a first location of a second pattern. As discussed above, the second dispensing unit may be spaced apart from the first dispensing unit by a predetermined distance. Specifically, the material can be dispensed from the first dispensing unit and the second dispensing unit on respective first positions of the first pattern and the second pattern. Once dispensing occurs, the first dispensing unit moves over the second position of the first pattern and the second dispensing unit simultaneously moves over the second position of the second pattern of the electronic substrate. Once moved, material can be dispensed from the first dispensing unit and the second dispensing unit at respective second positions of the first pattern and the second pattern.

[0061] In another exemplary embodiment, a method of dispensing material may include (1) identifying the location of more than one location on an electronic substrate, (2) determining a location for dispensing a first pattern and a location for dispensing a second pattern based on the identified locations Is the location properly suited for simultaneous dispensing to perform simultaneous dispensing operations on the first pattern and the second pattern, (3) moving the first dispensing unit to the dispensing position on the first pattern and moving the second dispensing unit to the second pattern The distribution position on the first pattern, the distribution position on the first pattern conforms to the distribution position on the second pattern, (4) use the first distribution unit at the first distribution position on the first pattern and the first distribution position on the second pattern distribute with the second distribution unit, and (5) repeat steps (3) and (4) for each remaining distribution position on the first pattern and the second pattern of the electronic substrate. As discussed above, the distance between the first distribution unit and the camera and the distance between the second distribution unit and the camera may be calibrated before performing the method.

[0062] In one embodiment, to make static one-time adjustments per substrate presented to the dispenser, the vision system and controller position and calculate the distance from one portion of the substrate to another portion of the same substrate, as well as the distance of the substrate relative to the racking system. any rotation and adjust the second dispensing unit once before dispensing at the same time. In another embodiment, an automatic adjustment mechanism may be utilized to dynamically adjust upon dispensing. Thus, when two patterns are not suitable for simultaneous dispensing, or in the case of two substrates are not suitable for simultaneous dispensing, the method comprises performing the first dispensing on the first pattern (or substrate) simultaneously with the first dispensing unit The dispensing operation and performing the second dispensing operation on the second pattern (or substrate) with the second dispensing unit. This can be achieved by dynamically positioning the second dispensing unit with an automatic adjustment mechanism while continuing to dispense with the first dispensing unit and the second dispensing unit.

[0063] Dispensers of embodiments of the present disclosure are capable of dispensing different patterns simultaneously. In this method, the rack carrying the dispensing unit, and the automatic adjustment mechanism associated with the second dispensing unit (and / or the first dispensing unit) are manipulated to dispense different patterns simultaneously. In this way, the lines distributed by the first distribution unit and the second distribution unit can be drawn synchronously.

[0064] Thus, for a dispenser with multiple distribution units, the distance and relative positioning of each of the multiple distribution units can be configured to match the distance and relative spacing between each of the multiple substrates or components. After collecting and analyzing alignment information from the automated vision alignment system, a first dispensing unit of the plurality of dispensing units is positioned over a first dispensing location on a first substrate or component. After performing the dispensing operation, the carriage can be manipulated to make any desired x-axis and y-axis planar orientation adjustments such that a second dispensing unit of the plurality of dispensing units is placed on the plurality of substrates or Necessary for alignment over the corresponding first dispensing position of the second substrate or component in the assembly. Because the distance and relative positioning between each of the plurality of distribution units is generally similar, though not necessarily identical, to the distance and relative positioning between each of the plurality of substrates or components, any such adjustment of the support will be very small, and thus fast to execute. Each of the remaining plurality of dispensing units can be similarly utilized to dispense material at a corresponding first dispensing location on each of the remaining substrates or components before any large x- and y-axis carriage movements are required. However, if the number of substrates or components is greater than the number of dispensing units, the rack may need to be repositioned to complete dispensing operations on all substrates. The method is repeated to assign each of the second and subsequent assignment locations. It should be understood that steps may be interchanged if dictated by throughput or process improvements.

[0065] As discussed above, in one embodiment, the dispensing unit may be mounted on a separate z-axis drive mechanism. This configuration enables the execution of independent operations as appropriate, including but not limited to dispensing, cleaning (as by, for example, an automatic needle / nozzle cleaner), purging, and calibration (x- or y-axis positioning or z-axis positioning). It should be noted, however, that the dispenser may be particularly suited for contactless dispensing, such as a flush or spray of material from a needle / nozzle. When assembled for contactless dispensing, dispensing operations can be performed with two (or more than two) dispensing units mounted on a single z-axis drive mechanism.

[0066] One embodiment of the present disclosure is directed to a method of allocating between synchronous and asynchronous modes. As mentioned above, when a vision system is used to determine whether a substrate or substrates are properly suitable for simultaneous dispensing, or whether a pattern or patterns are suitable for simultaneous dispensing, the substrate Or patterns can be dispensed synchronously by the dispensing unit by using a synchronous mode of operation. However, when not properly suited for simultaneous dispensing, substrates or patterns can be dispensed independently automatically and asynchronously by using the asynchronous mode of operation.

[0067] In some embodiments, the tilt and swivel subassembly is configured to tilt the dispensing unit up to 360° and to rotate the dispensing unit up to 360°.

[0068] In some embodiments, the stand further includes a z-axis drive mechanism to provide z-axis movement of the dispensing unit. computer system

[0069] As described above, a controller (eg, controller 18 ) may be included in the computer systems described below with respect to FIGS. 8 and 9 . In particular, FIG. 8 illustrates an exemplary computer system 104 for implementing various aspects of the dispensing system (eg, dispensing system 40 ) described herein. Figure 9 shows an exemplary storage system that may be used.

[0070] System 104 is merely an exemplary embodiment of a computer system suitable for practicing various aspects of the invention. This exemplary embodiment is not intended to limit the scope of the invention, as any of many other implementations of the system are possible and intended to be within the scope of the invention, for example. For example, a virtual computing platform can be used. Nothing in the claims set forth below is intended to be limited to any particular implementation of the system, unless this claim includes a limitation that expressly recites a particular implementation.

[0071] Various embodiments in accordance with the invention may be implemented on one or more computer systems. These computer systems can be, for example, general-purpose computers, such as those based on Intel PENTIUM-type processors, Motorola PowerPC, Sun UltraSPARC, Hewlett-Packard PA-RISC processors, or any other type of processor. It should be appreciated that one or more of any type of computer system may be used to partially or fully automate the integration of the devices and systems according to various embodiments of the invention with another system and service. In addition, software may reside on a single computer, or may be distributed among multiple computers attached by a communication network. This communication network is utilized in some embodiments to remotely control or remotely communicate information to / from the distribution systems described herein.

[0072] Aspects of the invention can be implemented as specialized software executing on a general-purpose computer system 104, such as the one shown in FIG. The computer system 104 may include a processor 106 coupled to one or more memory devices 116, such as disc drives, memory, or other devices for storing data. Memory 116 is typically used to store programs and data during operation of computer system 104 . Components of the computer system 104 may be connected via a network that may include one or more buses (e.g., between components integrated within the same machine) and / or networks (e.g., between components resident on separate discrete machines). between the components) interconnect mechanism 114 coupling. Interconnect mechanism 114 enables communications (eg, data, commands) to be exchanged between system components of system 104 . The computer system 104 also includes one or more input devices 108, such as keyboards, mice, trackballs, microphones, cameras, touch screens, and one or more output devices 110, such as distribution units, motors, cameras, columns printing devices, display units, touch screens, and / or speakers. Additionally, computer system 104 may include one or more interfaces (not shown) that connect computer system 104 to a communications network (in addition to or as an alternative to interconnection mechanism 114).

[0073] Storage system 112, shown in more detail in FIG. Information on or in the medium 118 to be processed by the program. Media 118 may be, for example, a disc or flash memory. Generally, in operation, the processor 106 causes data to be read from the non-volatile recording medium 118 into another memory 120 that allows faster retrieval of information by the processor than the medium 118 access. The memory 120 is usually a volatile random-access memory, such as dynamic random-access memory (DRAM) or static memory (SRAM).

[0074] The data may be located in storage system 112 , as shown, or in memory system 104 . Processor 106 typically manipulates data within IC memory 116, 120 and then copies the data to media 118 after processing is complete. Various mechanisms are known for managing the movement of data between the media 118 and the IC memory elements 116, 120, and the invention is not limited thereto. The invention is not limited to a particular memory system 116 or storage system 112 .

[0075] While computer system 104 is shown by way of example as one type of computer system on which various aspects of the present invention may be practiced, it should be understood that aspects of the present invention are not limited to practice as shown in FIG. on the computer system. Various aspects of the invention may be practiced on one or more computers having a different architecture or components than that shown in FIG. 8 .

[0076] The computer system 104 can be a general-purpose computer system that can be programmed using a high-level computer programming language. Computer system 104 may also be implemented using specially programmed special purpose hardware. In computer system 104, processor 106 is typically a commercially available processor such as a Pentium, Core, Core Vpro, Xeon, or Itanium-type processor available from Intel Corporation. Many other processors are available. This processor typically executes an operating system, which may be provided, for example, by Microsoft Corporation or Apple Corporation, including versions for PCs as well as mobile devices, iOS, Android OS operating systems, or available from various sources UNIX. Many other operating systems can be used.

[0077] Various embodiments of the invention can be programmed using an object-oriented programming language such as SmallTalk, Python, Java, C++, Ada, or C# (C-Sharp). Other object-oriented programming languages ​​may also be used. Alternatively, functional, scripted, and / or logical programming languages ​​may be used. Aspects of the invention can be practiced in non-programming environments (e.g., documents created in HTML, XML, or other formats that, when viewed in a window of a browser program, present a graphical user interface (graphical user interface). - user interface, GUI) or perform other functions). Aspects of the invention can be implemented using a variety of Internet technologies such as, for example, Common Gateway Interface (CGI) scripts, PHP Hypertext Preprocessor (PHP Hypertext Preprocessor) -text Preprocessor (PHP), Active Server Page (ASP), Hypertext Markup Language (HyperText Markup Language, HTML), Extensible Markup Language (Extensible Markup Language, XML), Java, JavaScript and extension Open source libraries for Javascript, Asynchronous JavaScript and XML (AJAX), Flash, and other programming methods. Furthermore, various aspects of the invention can be implemented in cloud-based computing platforms such as the EC2 platform commercially available from Amazon.com (Seattle, WA). Various aspects of the invention can be implemented as programmed or non-programmed elements, or any combination thereof.

[0078] Some examples of vision systems or imaging systems as described above include a camera (e.g., input device 108) having an image sensor configured to provide digital images and / or digital video To a computer system (eg, computer system 104) that operates a dispensing system (eg, dispensing system 40) as described herein. An example of an image sensor is a complementary metal-oxide semiconductor (CMOS). The image sensor produces a digital image or digital video frame that includes image features, such as the fiducials described above. The images generated by the sensors are processed (e.g., by the controller 18 or the processor 106) to perform the functions of the distribution system, including camera calibration and determining which cameras to use for the distribution unit (e.g., the output device 110) to Needle offset distance.

[0079] To operate a dispensing system as described herein, processor 106 executes one or more software programs stored in memory 116 and / or storage 112 . As an example, for controlling and operating the dispensing mechanism, motors, and other devices electrically connected to the computer system 104, a control circuit may be provided. This control loop may be implemented by processor 106, which executes stored software to receive input data, such as images generated by a vision system and / or the status of the distribution unit, process the input data to make decisions such as where to move the distribution unit to action at a particular location on the substrate, new input data is obtained at subsequent points in time, and the new data is then processed to determine a new location to which the dispense head moves.

[0080] The stored software may also receive information and / or provide information to a display unit (eg, display unit 28) of the dispensing system. The display unit displays a GUI for user interaction to receive user input for modifying or selecting operations to be performed with the dispensing system. In some examples, the display unit 28 is a touch screen. In other examples, the user interacts with the GUI via keyboard and mouse. The display unit in some examples provides a status indication to the user as the dispensing operation progresses. For example, a vision system may track the progress of the dispensing unit as material is dispensed on the substrate, and provide an indication of that progress on the display unit. In other examples, a predetermined point of dispense progress may be reached and require, for example, user input, and the GUI then prompts the user for confirmation to proceed with subsequent motor and dispense operations.

[0081] It should be understood that the software functions described above are merely examples and that the computer system 104 can be configured to control various additional aspects of the dispensing systems described herein.

[0082] In some embodiments, the controller may be configured with machine learning techniques to develop algorithms to distribute materials around the same package and / or the same electronic substrate. As is well known in the art, machine learning techniques are directed to data analysis techniques that automate the construction of analytical models. Machine learning techniques are a subset of artificial intelligence based on the notion that a system can learn from data, recognize patterns, and make decisions with no or minimal human intervention. calibration

[0083] In some embodiments, a table with many orientations may be provided, for example, up to or greater than 20 orientations. Each position is nearly infinitely definable within the resolution of the encoder, eg, up to 1111 counts per degree. Each orientation can be identified to include a predefined camera-to-needle calibration, where each calibration contains variables set by the operator, such as tilt, rotation, and dispense height, since these define where the dispensed material will fall in the predetermined orientation on electronic substrates. These positions can be retrieved from the program and used to assign at a given location based on vision and z-axis sensing data. Many orientations can be used throughout the program to achieve the desired result.

[0084] Although each azimuth has its own camera-to-needle calibration, it is not necessary to actually assign at each azimuth to determine these calibrations. Once a smaller number of positions are calibrated by using visual assignment and positioning, the other positions can be interpolated to complete the calibration.

[0085] For example, an orientation with the same tilt and assigned height requires only two to three rotational positions to interpolate all other rotational positions with the same tilt and assigned height.

[0086] In one embodiment, the controller is further configured to calibrate the dispensing position of the nozzles of the dispensing unit relative to the vision system by dispensing on the electronic substrate provided on the support. The controller may include or otherwise be in communication with a database having a table of nozzle to vision system orientations. In particular, the controller can be configured to calibrate the orientation of the nozzle based in part on interpolation of known positions and orientations.

[0087] As used herein, "suitably adapted for simultaneous distribution" means that two or more substrates or patterns are positioned such as by control after inspection of data associated with one or more images taken by a vision system or camera. at known positions determined by the detector, where such known positions are within predetermined tolerances, and no other acquired information indicates a rationale for not assigning on one or more of the substrate or pattern.

[0088] As used herein, "obtained data" means data such as visual data generated within a distribution system, or data delivered from an external source based on previous processing.

[0089] Having thus described several aspects of at least one embodiment of the present disclosure, it is to be appreciated various alterations, modifications, and improvements will readily occur to those skilled in the art. Such alterations, modifications, and improvements are intended to be part of this disclosure, and are intended to be within the spirit and scope of the invention. Accordingly, the foregoing description and drawings are by way of example only.

[0090] 10: distribution system 12: Electronic substrate 14: The first distribution unit 16: Second distribution unit 18: Controller 20: frame 22: Base / support 24: distribution unit bracket 26: Weight measuring device / weighing scale 28: Display unit 30:Vision system 32: Vision system bracket 40: distribution system 42: frame 44: Bracket system 46: Distribution unit assembly 48: distribution unit / distribution head 50: support 52: left track 54: Right track 56: Beam 58:Slider 60: z-axis drive mechanism 62: Support bracket 64: Part 1 66: Part Two 68: Movable bracket 70: First Strain Wave Gear System 72: Second strain wave gear system 74: Mounting plate 80: Electronic substrate 82: Encapsulation 90: Nozzle 100: predetermined distance 102: predetermined angle 104:Computer system 106: Processor 108: input device 110: output device 112: storage system 114:Interconnection mechanism 116:Memory device / memory system / memory 118: Media 120: memory A: axis B: axis

[0091] Domestic deposit information (please note in order of depositor, date, and number) none Overseas storage information (please note in order of storage country, institution, date, and number) none

Claims

1. A dispensing system for dispensing an adhesive material onto an electronic substrate, the dispensing system comprising: a frame; a support member coupled to the frame, the support member being configured to receive and support the electronic substrate during a dispensing operation; a dispensing unit configured to dispense an adhesive material including solder paste, the dispensing unit having a nozzle; a support assembly coupled to the frame, the support assembly including a support being configured to support the dispensing unit and to move the dispensing unit in x-axis, y-axis, and z-axis directions; and a tilting and rotating sub-assembly configured to tilt and rotate the dispensing unit; and a controller configured to control the dispensing unit and the support assembly to perform a dispensing operation on the electronic substrate, the controller being configured to control the dispensing unit to dispense material from the nozzle of the dispensing unit at a flow rate, the flow rate being configured to deposit a desired amount or density of material onto the electronic substrate along a three-dimensional path. The controller is further configured to move the nozzle of the dispensing unit relative to a component mounted on the electronic substrate at a constant speed, the controller being configured to move the nozzle at a constant speed of 1000 mm / sec; and the controller is further configured to dispense material from the nozzle of the dispensing unit at a flow rate, the flow rate being configured to deposit the desired density of material onto the electronic substrate, the controller being configured to dispense material from the nozzle at a flow rate of 2000 mg / sec.

2. The distribution system as described in claim 1, wherein the flow rate is between 0.05 mg / sec and 10 mg / sec.

3. The distribution system as described in claim 1, wherein the flow rate is controlled by controlling a material pressure within the distribution unit.

4. The dispensing system as claimed in claim 1, wherein the controller is further configured to coordinate the movement of the support assembly and the tilting and rotating subassemblies to position and orient the nozzle of the dispensing unit at a predetermined distance and orientation from the electronic substrate during material dispensing.

5. The distribution system as described in claim 4, wherein the predetermined distance is at most 5.0 mm.

6. The dispensing system as claimed in claim 1, wherein the controller is further configured to maintain the nozzle of the dispensing unit at a predetermined angle relative to one of the horizontal planes of the electronic substrate.

7. The distribution system as described in claim 6, wherein the predetermined angle is between 0° and 90°.

8. The dispensing system as claimed in claim 1, wherein the controller is further configured to move the nozzle of the dispensing unit relative to the electronic substrate at a constant speed.

9. The distribution system as described in claim 1, wherein the constant speed is between 20 mm / sec and 200 mm / sec.

10. The dispensing system as claimed in claim 1, wherein the controller is further configured to calibrate the dispensing position of one nozzle of the dispensing unit relative to a vision system by dispensing onto the electronic substrate provided on the support.

11. The distribution system as claimed in claim 10, wherein the controller includes or has access to a database having a table of nozzle-to-vision system orientation.

12. The dispensing system as claimed in claim 11, wherein the controller is configured to calibrate the orientation of the nozzle in part based on an interpolation method of known location and orientation.

13. A method for dispensing an adhesive material onto an electronic substrate using the dispensing system of claim 1, the method comprising the steps of: conveying an electronic substrate to a dispensing position in the dispensing system; capturing at least one image of the electronic substrate; analyzing the at least one image of the electronic substrate to determine a position of the electronic substrate; and performing a dispensing operation by tilting and rotating a dispensing unit of the dispensing system, the dispensing unit being coupled to a support, wherein performing the dispensing operation comprises the step of dispensing material from a nozzle of the dispensing unit at a flow rate configured to deposit a desired amount or density of material onto the electronic substrate along a three-dimensional path.

14. The method as described in claim 13, wherein the flow rate is at most 2000 mg / sec.

15. The method as described in claim 13, wherein the material is dispensed from the nozzle of the dispensing unit at a flow rate by controlling a material pressure within the dispensing unit.

16. The method as described in claim 13 further comprises the step of: coordinating the movement of the support assembly and the tilting and rotating subassembly to position and orient one of the nozzles of the dispensing unit at a predetermined distance and orientation from the electronic substrate during material dispensing.

17. The method as described in claim 16, wherein the step of performing the dispensing operation includes the step of maintaining the nozzle of the dispensing unit at a predetermined angle relative to one of the horizontal planes of the electronic substrate.

18. The method as described in claim 13, wherein the step of performing the dispensing operation includes the step of moving the nozzle of the dispensing unit relative to the package at a constant speed.

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