Method and device for transferring and preparing components

Abstract

The present invention relates to a method and apparatus for preparing an assembly on a carrier substrate and a method and apparatus for transferring an assembly from a carrier substrate to a product substrate.

Description

Methods and apparatus for transferring and preparing components This invention relates to a method and apparatus for transferring components and a method and apparatus for preparing components. Specifically, a component should be understood to mean an electronic component, preferably a functional component, such as, for example, a chip or MEMS. In this sense, the invention relates to a method and apparatus for transferring or preparing very small components that are precisely aligned, transferred, and processed. This invention describes a method and apparatus for transferring a plurality of components (specifically, wafers) from a first substrate (a transfer substrate) to a second substrate (a product substrate). Furthermore, this invention describes a method and apparatus for preparing a plurality of (specifically, structurally identical) components on a transfer substrate. In the prior art, specific electronic components are produced from or on a component substrate. These processes typically occur in the atmosphere. In the atmosphere, the component surface is continuously exposed to reactive substances, such as oxygen or nitrogen. It is particularly important that the surfaces awaiting bonding are free of contaminants during the transfer and preparation of components. In the prior art, apparatus and methods are described in which the surface of a component can be treated or cleaned in the absence of oxygen and / or nitrogen compounds. In each case, the treatment and cleaning of the component surface occurs in an apparatus that can operate under vacuum. However, the component is then removed from this apparatus and thus exposed to the atmosphere. Subsequently, the component is bonded to a product substrate in another apparatus. Along this path, the component surface may be contaminated again. Due to contamination, the number of defective components and the processing costs increase. Therefore, one objective of this invention is to provide a method and apparatus for transferring and preparing components that at least partially eliminates, and specifically, completely eliminates, the disadvantages mentioned in the prior art. Specifically, an improved method and apparatus for transferring and preparing components is particularly an objective of this invention. Specifically, one objective of this invention is to provide a method and apparatus for transferring and preparing components that reduces the component rejection rate. Furthermore, one objective of this invention is to provide a method and apparatus for transferring and preparing components that is implementable or operable, and specifically, reliable and pollution-free. This problem is solved by the features of the harmonized request. Advantageous developments of the invention are stated in the supplementary request. All combinations of at least two features described in the specification, request, and / or drawings also fall within the scope of the invention. Values ​​within the stated limits are also considered limits within the range of values ​​and can be claimed in any combination. Therefore, the present invention relates to a method for preparing an assembly on a carrier substrate using at least the following steps: a1) preparing an assembly substrate, a2) applying a bonding layer to a first surface of the assembly substrate, and then b) separating the assembly substrate into assemblies, c) positioning the assemblies on a carrier substrate, wherein the assemblies are fixed to the carrier substrate, and wherein a first component surface includes the bonding layer. Because the bonding layer is specifically applied to the entire area of ​​the first surface of the prepared component substrate before the component substrate is separated into components, contamination is advantageously minimized. Therefore, it is unnecessary to apply the bonding layer to the carrier substrate to bond or fix the components to it. Thus, applying a bonding layer to the carrier substrate is advantageously eliminated. Since the component substrate is separated into components after the bonding layer is applied, it is ensured that the carrier substrate only contacts the material of the bonding layer in the areas of the components. Furthermore, it is advantageously ensured that there is no bonding material between the components positioned on the carrier substrate. Accordingly, the amount of material used in the bonding layer for fixing the components to the carrier substrate is generally small. Furthermore, when processing the components prepared on the carrier substrate, specifically across the entire area, it is ensured that the bonding layer is not carried away or processed from the gaps between the components. Therefore, contamination of the bonding material is also reduced when the bonding layer is removed. Since this method is preferably carried out in a vacuum environment or under vacuum, reducing contamination, specifically by the bonding material, is particularly important. Furthermore, during positioning, it is preferable to use a pick-and-place method in step c) to ensure that the bonding layer has been provided on the components previously separated into single units. In this way, the alignment marks on the carrier substrate can be advantageously kept visible to accurately position the components on the carrier substrate, since the latter are not hidden by a bonding layer. Therefore, the carrier substrate is less contaminated overall. In the positioning in step c), all components or only a portion of the separated components can be positioned on the carrier substrate. If not all components separated from the component substrate are positioned on the carrier substrate, the latter can be (for example) transferred to another carrier substrate or, after transferring or peeling the previously positioned components from the carrier substrate, positioned or fixed on the same carrier substrate in a subsequent process step. In a preferred embodiment of the method for preparing an assembly on a carrier substrate, a protective layer is applied, in step a2), also, to a second surface of the assembly substrate. This protective layer may be applied to the assembly substrate before, during, or simultaneously with the coating on the substrate side opposite the bonding layer. The protective layer is applied before the assemblies are separated into individual units, such that the assemblies advantageously include both the bonding layer and the protective layer. In this manner, it is advantageous to minimize contamination, specifically of the carrier substrate and other components used in this process step, and of the material of the protective layer. In particular, it is advantageous not to remove the bonding layer during the subsequent removal of the protective layer from the assemblies prepared on the carrier substrate, because no bonding layer is disposed on the carrier substrate in the gaps between the assemblies, and furthermore, the bonding layer applied to the surface of the first assembly is hidden by the assemblies. In a preferred embodiment of a method for preparing components on a carrier substrate, measures are taken such that, in step c), at least one support component is positioned on the carrier substrate, in addition to the components. Specifically, the support component is not a functional component. Rather, the support component is also positioned on the carrier substrate to prevent the product substrate from bending during a subsequent bonding process, specifically at its edges. In a preferred embodiment of a method for preparing an assembly on a carrier substrate, measures are taken such that at least one support component is positioned outside a component positioning region on the carrier substrate. The component positioning region is a region on the carrier substrate where a previously separated single-unit assembly is positioned. This component positioning region is preferably disposed at the center of the carrier substrate or on a surface of the carrier substrate. The support components are particularly preferably positioned at an outer edge of the surface of the carrier substrate. In a preferred embodiment of the method for preparing an assembly on a carrier substrate, steps are taken such that the at least one support assembly is produced by separating the assembly substrate into a single unit in step b). In this manner, the at least one support assembly can be advantageously produced or separated from the assemblies from the assembly substrate into a single unit. Therefore, the at least one support assembly advantageously also includes a previously applied bonding layer. Thus, the at least one support assembly can also be positioned and secured on the carrier substrate with minimal contamination. Therefore, the support assembly can be prepared in a particularly simple and efficient manner. In a preferred embodiment of a method for preparing components on a carrier substrate, measures are taken such that the at least one support component has the same height as the components. Therefore, the at least one support component can particularly effectively support the outer regions of the product substrate and the carrier substrate during a bonding process or during the transfer of one of the components. If the support component is produced by separating the component substrates into single units in step b), it is particularly advantageous to ensure that the height of the support component corresponds to the height of the components. Specifically, the height should be understood as the distance from the surface of the first component, including the bonding layer, to the carrier substrate. The at least one support component also preferably has the bonding layer. In a preferred embodiment of a method for preparing an assembly on a carrier substrate, measures are taken such that at least two, preferably at least four, support components are uniformly and alternately positioned outside the assembly positioning area. These support components are particularly preferably arranged in an alternating pattern around a periphery of the carrier substrate or around the edge of the assembly positioning area, so that the support components advantageously provide a particularly uniform support effect. In a preferred embodiment of a method for preparing components on a carrier substrate, measures are taken such that after the components are peeled off from the carrier substrate, at least one support component remains on the carrier substrate. The support component is particularly preferably held secured or engaged to the carrier substrate during peeling. During peeling from the carrier substrate, the components in the positioning region are released from the carrier substrate, allowing the components to be transferred to a product substrate. The carrier substrate can be advantageously reused due to the fact that at least one support component remains on the carrier substrate. Furthermore, the present invention relates to a method for transferring components from a carrier substrate to a product substrate using at least the following steps, specifically in the following order: i) specifically, preparing components on a carrier substrate according to a method for preparing components on a carrier substrate, wherein each of the components includes a first component surface and a second component surface, and wherein the components are fixed to the carrier substrate using the first component surface; ii) processing the second component surface of the components; iii) bonding the second component surface of the components to the product substrate, wherein steps ii) and iii) are performed under a vacuum, characterized in that the vacuum is maintained between steps ii) and iii). In the method for transferring components, it is particularly preferred to use a method for preparing a substrate on a carrier substrate to prepare the components on the carrier substrate. Next, the surface of the free second component facing away from the carrier substrate is treated. The treatment of the component surface preferably includes cleaning, specifically cleaning to remove oxide layers and other contaminating materials. Preferably, the following bonding process is introduced by bringing the surfaces of all components into contact with a product substrate or the surface of the product substrate. Because the vacuum between the treatment of the two component surfaces in step ii) and the bonding of the second component surface to the product substrate in step iii) is advantageously maintained, the treated component surfaces are advantageously free of contaminating material. Therefore, the treated component surfaces are not in contact with an atmosphere before bonding. The same applies particularly well to the carrier substrate. Therefore, the treated surfaces of these components are particularly suitable for bonding to the product substrate. The treatment may also primarily involve removing a protective layer, or include removing a protective layer. In this way, bonding can be performed particularly easily. Furthermore, the defect rate can be reduced, or the number of defective components on the product substrate can be decreased. The vacuum is below 1 mbar, more preferably below 10 mbar. -5 millibars, ideally below 10 -9 millibars, with a maximum and optimal value of up to 10. -12 millibar. In a preferred embodiment of a method for transferring components from a carrier substrate to a product substrate, measures are taken such that the method for transferring components from a carrier substrate to a product substrate according to step iii) additionally includes the step of: iv) peeling the components from the carrier substrate, wherein the peeling in step iv) is preferably performed under a vacuum. Specifically, during the peeling process, the components are released or separated from the carrier substrate. The peeling preferably also occurs in a vacuum environment. More preferably, this vacuum is maintained between the bonding in step iii) and the peeling in step iv). Due to the subsequent peeling of the components, specifically by weakening the adhesive properties of the bonding layer applied between the surface of the first component and the carrier substrate in a vacuum, contamination of the components or their surfaces is advantageously further reduced. In a preferred embodiment of a method for transferring components from a carrier substrate to a product substrate, measures are taken such that all components are simultaneously bonded during the bonding process in step iii). By maintaining a vacuum between processing and bonding, it is advantageous to bond all components, preferably in parallel, onto the product substrate. This is particularly effective and error-free in transferring the components from the carrier substrate to the product substrate. In a preferred embodiment of a method for transferring a component from a carrier substrate to a product substrate, measures are taken such that a protective layer disposed on the surface of the second component is removed prior to the processing in step ii). Combining this vacuum processing with subsequent bonding, a particularly contamination-free component surface can thus be prepared. Alternatively, the removal of the protective layer can be performed immediately before processing the surfaces of the second components. Furthermore, the surface processing can also primarily involve the removal of the protective layer. Furthermore, the present invention relates to an apparatus for preparing an assembly on a carrier substrate according to a method for preparing an assembly on a carrier substrate, characterized in that the apparatus operates under a vacuum. Particularly preferred is that the apparatus operates entirely under a vacuum, such that the carrier substrate and the components are not in contact with an atmosphere. The apparatus preferably includes a coating module and a separation module. Furthermore, the present invention relates to an apparatus for transferring a component from a carrier substrate to a product substrate, wherein the apparatus is designed to transfer a component prepared on the carrier substrate to the product substrate under vacuum according to a method for transferring a component from a carrier substrate to a product substrate. Preferably, the device is designed to perform all operational steps under a vacuum. Components prepared on the carrier substrate can be transferred to the product substrate while maintaining the vacuum. In a preferred embodiment of the apparatus for transferring components from a carrier substrate to a product substrate, measures are taken such that the apparatus is designed such that the carrier substrate carrying the components can be transferred from a surface treatment modularization unit to a bonding modularization unit while maintaining the vacuum. In this way, contamination of the components, specifically the second and treated component surfaces, is ensured to be reduced. Therefore, significantly better bonding results can be achieved using this apparatus. One aspect of the present invention primarily involves placing the components into a device or a modular system, aligning and bonding the components to a carrier substrate without removing a protective layer until entering the modular system to clean the surface free of, for example, oxygen and / or nitrogen compounds. Subsequently, the components are preferably still bonded to a product substrate in the modular system and removed from the carrier substrate (i.e., separated by a peeling process). Therefore, the method preferably relates to a parallel component transfer, wherein a plurality of components are transferred simultaneously. The components preferably have the same dimensions, specifically the same height. Furthermore, a further step involves implementing the method in a modular system, wherein the surfaces of the components are cleaned without re-exposing them to a polluted atmosphere, at least until the components come into contact with the product substrate. Therefore, specifically, the surfaces of these components are clean only inside the modular system, free of, for example, oxygen and / or nitrogen compounds, and remain bonded to one of the product substrates in the modular system. In one embodiment, individual components are aligned and pre-fixed with high precision to a carrier substrate for simultaneous transfer to a product substrate in a later process step. Preferably, these components are first fixed with high precision relative to one of the alignment marks on the carrier substrate using a pick-and-place system. Subsequently, an alignment of the product substrate with one of the carrier substrates occurs, for which further alignment marks are specifically provided. In one embodiment, the interface between the component and the product substrate is optically transparent and / or conductive. These physical properties are ensured by a suitable surface treatment prior to bonding the component to the product substrate. Further procedural steps or a further modular unit may be used. Generally, the emerging interface can be considered optically and / or mechanically and / or thermally and / or electrically ideal. Ideally, this means achieving the best possible optically and / or mechanically and / or thermally and / or electrically properties through the surface treatment, specifically by removing harmful oxides and / or nitrides. Mechanical ideality means that the mechanical properties of the interface, specifically the bonding strength, enable the most efficient possible adhesion between the component and the product substrate. Specifically, for hydrophilic fusion bonding, preferably achieved by contacting the oxide surfaces of the component and / or the product substrate, the bonding strength between the component and the product substrate is characterized by the surface energy required to separate a unit area from a square meter. Specifically, the bonding strength is greater than 0.5 J / m², preferably greater than 1.0 J / m², more preferably greater than 1.5 J / m², most preferably greater than 2.5 J / m², and most preferably greater than 2.5 J / m². Optical ideality means that electromagnetic radiation can pass through the interface in the best possible way (i.e., preferably with little or no intensity loss). Specifically, the transmittance is greater than 10%, preferably greater than 50%, preferably greater than 75%, most preferably greater than 95%, and most preferably greater than 99%. Thermal ideality means that a heat flow can pass through the interface in the best possible way (i.e., preferably with little or no heat loss). Specifically, heat loss is less than 50%, preferably less than 25%, more preferably less than 10%, most preferably less than 5%, and most preferably less than 1%. Electrical conductivity ideally means that the conductivity through the interface is as high as possible. The conductivity should be greater than 1 S / m, preferably greater than 10 S / m, and even more preferably greater than 10 2 S / m, ideally greater than 10 4S / m, and preferably greater than 10 6 S / m. If the surfaces of the components and / or the areas of the product substrate to which the components are bonded are mixed surfaces, the conductivity data applies only to those electrical regions. In a preferred embodiment, the components are coated with a bonding layer before being separated into individual units, such that after the components are bonded to a carrier substrate, there is no bonding material between the components that could unnecessarily contaminate the modules of the modular system. In another embodiment, the component is located at the edge of the carrier substrate to prevent peripheral bending of the product substrate during engagement with the component in the component positioning region. Specifically, a corresponding carrier substrate may be pre-manufactured and introduced into a modular system along with the pressure-absorbing component. In this particular embodiment, it is especially useful if the pressure-absorbing component is permanently attached to the carrier substrate. However, in a further embodiment of the latter, the pressure-absorbing component may also be produced from or on the same component substrate, from or on the substrate, of a preferred functional component to be transferred and positioned in the component positioning region. In this case, it is conceivable that the pressure-absorbing component is also transferred during the transfer of the component from the carrier substrate to the product substrate. Within the scope of this invention, a component is understood to be a specific functional object bonded to a substrate. Such components are preferably a chip, a MEMS, an LED, a microchip, or similar components. It is also conceivable that such components are preferably manufactured from a component substrate. It is also conceivable that such components are manufactured on a substrate. The component itself has component alignment marks or geometric features (such as corners, lines, or structures on the component) used as component alignment marks. Within the scope of this invention, a component for pressure absorption, or a support component, is understood to mean a component with a stabilizing mechanical function that can be disposed or prepared on the carrier substrate. It performs a stabilizing task, particularly for the transfer and bonding process, compared to the component actually to be transferred. Preferably, it has the same height as the component to be transferred and can be produced together with such components. The component for pressure absorption is preferably positioned, and specifically engaged, at the periphery, specifically at a region of the carrier substrate outside the center point of the substrate holding surface. The support component prevents the product substrate, which is in contact with the component pre-fixed to the carrier substrate, from bending at its periphery. Since the component to be transferred is typically not distributed across the entire surface of the carrier substrate but only fixed in a component positioning area, it is particularly preferred to use the component for pressure absorption. A component substrate should be understood as a substrate used to produce components. The functional areas of these subsequent components are preferably produced in a wafer-level process. In this process, multiple process steps can be performed to ensure the functionality of the subsequent components. Specifically, at the end of the process, the component substrate is separated into individual units. The separation of the component substrate into these components, and, where appropriate, into supporting components, is achieved by, for example, a saw, a wire, a laser, or a similar tool. A carrier substrate is understood to mean a substrate to which components are aligned and temporarily bonded. It is particularly used for temporarily mounting components or support components. The carrier substrate preferably has a plurality of alignment marks along its surface for aligning the components relative to the carrier substrate. Therefore, these alignment marks may also be referred to as component alignment marks. Furthermore, the carrier substrate has alignment marks to enable alignment with the product substrate. Therefore, these further alignment marks may also be referred to as substrate alignment marks. In one embodiment, the carrier substrate already has one or more components for pressure absorption or support. These support components are preferably permanently attached to the carrier substrate. Advantageously, the carrier substrate can be made of any material. Once the method for preparing the components is implemented, a bonding layer on the carrier substrate can also be advantageously eliminated. The product substrate is the substrate on which the components are transferred from the carrier substrate. The product substrate has alignment marks for alignment relative to the carrier substrate. In the case of the carrier substrate, these alignment marks may be referred to as substrate alignment marks. A modular system (sometimes also referred to as a vacuum device or cluster) should be understood to mean a number of associated modules or modular units. A vacuum can preferably be generated or provided within these modules. One particularly preferred feature of the proposed modular system is that the substrates are not exposed to the atmosphere between different process steps and can therefore operate continuously under a vacuum. Once a substrate is located inside the modular system, it is further processed or prepared in an optimal vacuum environment. All modules of the modular system can preferably be individually evacuated. Particularly preferably, the modular system includes at least one lock for introducing the substrates or for preparing the components. To enable the construction of such devices or the implementation of such procedures, several special modules are described below, which are preferably part of such devices or modular systems. Therefore, specifically, these modules are listed in the method in the order of use. The transport of substrates or substrate stacks in the modular system is preferably carried out by a robot located at the center of the modular system or moving accordingly along a track system. If the modular system or apparatus used for transfer or preparation includes a coating module, the bonding layer and / or the protective layer can be applied to the component substrate. The coating module is selected. It is also conceivable, for example, that the component substrate is coated with the bonding layer and / or the protective layer outside the modular system and then introduced into the modular system. This is particularly advantageous when the manufacturer of the functionalized component substrate supplies the component substrate immediately after the functionalization of the protective layer. If a coating module is present in the modular system, at least one bonding layer can be applied. In contrast, the protective layer may be contaminated during transport from the manufacturer of the functionalized component substrate to the modular system. If the modular system includes a separation module, the component substrate can be separated into individual units within the modular system. It is also conceivable that the components can be separated into individual units outside the modular system and then transported into the modular system. A separation module within the modular system is particularly advantageous when using methods or apparatus for preparing components (where a bonding layer is applied to the component substrate before separation into individual units). The pick-and-place module is designed to align, position, and attach or secure individual components to the carrier substrate. This is particularly advantageous when a bonding layer is applied to the component substrate before it is separated into individual units, allowing for easy pick-and-placement of, alignment, positioning, and attachment or securing of these components. In this case, the absence of bonding material between the components prepared on the carrier substrate is advantageous. If the carrier substrate itself is coated with the bonding layer on its entire surface, the components are directly bonded to the bonding layer on the carrier substrate. In this case, there is an undesirable bonding material between the components, which causes unwanted additional contamination during subsequent passage through a module. A cleaning module is used to remove the protective layer from the components. It is conceivable that the cleaning module is located outside the modular system. In this case, the components would be delivered into the modular system without the protective layer. However, in a particularly preferred embodiment, the cleaning module is also part of the modular system. The surface treatment module or the surface treatment modular unit is part of the modular system of the device for transferring components. Therefore, the surface treatment module is part of the modular system in which the surfaces of the components without the protective layer are treated. However, a cleaning module integrated into the surface treatment module is also conceivable. The treatment or disposal of the component surfaces should be understood to mean, in particular, the removal of interfering materials, specifically oxygen and / or nitrogen compounds. Since the first component surfaces remain more reactive after the removal of oxygen and / or nitrogen compounds and should not be exposed to the atmosphere again before contacting the product substrate, the surface treatment module is preferably part of the modular system. The surface treatment module may be, for example, a plasma chamber or an ion beam chamber. An ion beam chamber is preferred, as shown in disclosure WO2015197112A1. It is also conceivable that the activation of the surfaces of these components will occur within the surface treatment module. Furthermore, it is conceivable that hydrophilization of one of the surfaces of these components will occur within the surface treatment module. Additionally, it is conceivable that a special layer will be applied within the surface treatment module to improve the bonding between the components and the product substrate. After the surface treatment module has treated or disposed of the component surfaces, the bonding module performs bonding between a product substrate and the treated component surfaces. For this purpose, the product substrate is aligned and bonded relative to the carrier substrate. Alignment is preferably achieved using alignment marks located on the carrier substrate and the product substrate. Therefore, the bonding module preferably has, and particularly preferably does, an optical alignment system. Furthermore, the bonding module includes means for contacting the product substrate with the components or component surfaces facing the product substrate. After the peeling module comes into contact with the product substrate and the components, the connection between the components and the carrier substrate is preferably weakened or completely removed. This preferably occurs in a separate peeling module or a peeling modular unit. It is also conceivable to integrate the corresponding peeling device into the bonding module so that the carrier substrate-component-product substrate stack does not need to be transported to a further module. The methods described below include important procedural steps. The exemplary methods describe individual procedural steps for transferring and preparing the components. Accordingly, these exemplary methods form the pattern of methods for transfer and methods for preparing the components. Those skilled in the art will recognize that there are, of course, several further procedural steps that may be part of the method but are not explicitly mentioned. Since the latter are not essential to understanding the exemplary methods and some cannot be definitively determined as a further step, these exemplary methods are described only based on the following procedural steps. In one exemplary method, a first process step involves applying a protective coating to the surface of a first component substrate and applying a bonding layer to the surface of a second component substrate. The bonding layer preferably allows bonding between room temperature and approximately 300°C. Furthermore, the bonding layer should preferably have little or no outgassing. The thickness of the bonding layer is between 1 nm and 100 μm, preferably between 1 nm and 50 μm, more preferably between 1 nm and 10 μm, most preferably between 1 nm and 1 μm, and most preferably between 1 nm and 100 nm. The bonding layer has the important function of holding the components in place until they are bonded to the product substrate, and its side is opposite to the bonding layer. In the second step of one of the exemplary methods, a component substrate is separated into individual components. Specifically, the separation is achieved by means of a saw and / or a wire and / or a laser and / or a particle—specifically, an ion beam. Applying the bonding layer system to the component substrate before separating these components into individual units is an important aspect of the method for preparing the components. In the prior art, the bonding layer is typically applied to the carrier substrate. In the subsequent fifth step (i.e., the cleaning step), this therefore leads to contamination… In a third step of one of the exemplary methods, an alignment and bonding process of at least one component, preferably one of all components, occurs relative to a carrier substrate. The alignment of the components relative to the carrier substrate occurs particularly with respect to alignment marks located on the carrier substrate. Thus, precise positioning of the components relative to the carrier substrate is achieved. Preferably, alignment is performed using an optical system. Subsequently, in the bonding process, the components come into contact with the carrier substrate. In one of the exemplary methods, a fourth procedure step involves removing the protective layer from the surfaces of the first components, thereby releasing the surfaces of the first components. This procedure step occurs particularly in a separate cleaning module. In the fifth step of one of the exemplary methods, the surfaces of the first components are cleaned. Specifically, cleaning should be understood as the removal of oxygen and / or nitrogen compounds. This cleaning preferably occurs under vacuum (i.e., in a vacuum apparatus, specifically in a separate module). It is also conceivable that the fourth and fifth steps will be performed in the same module, and in particular, using the same apparatus. However, for this purpose, the apparatus must be designed to remove the protective layer and the oxygen and / or nitrogen compounds. Since the protective layer and the oxygen and / or nitrogen compounds are typically made of different materials, it is preferable to perform these two steps in different modules. In the sixth step of one of the exemplary methods, the product substrate is bonded to the components of the carrier substrate. Alignment of the product substrate with respect to the carrier substrate is achieved by means of substrate alignment marks. In the seventh step of one of the exemplary methods, the product substrate is lifted from the carrier substrate. The components remain on the product substrate because the permanent bonding between the surface of the first component and the surface of the product substrate is stronger than the temporary bonding between the surface of the second component and the surface of the carrier substrate. Specifically, a peeling process can be used to assist in removing the components from the carrier substrate. A thermal effect, specifically softening of a bonding layer, or in particular, the effect of electromagnetic radiation from a laser, can be conceived. The modified method is derived by modifying one of the exemplary methods. The difference lies in the fact that it is not necessary to apply a bonding layer to the component substrate according to the second procedure step. Instead, a bonding layer is applied to the carrier substrate, specifically across the entire surface. One disadvantage of this method is that the exposed bonding material can contaminate the modules through which the method is performed. Since a bonding material is typically an organic polymer, contamination by this organic polymer is undesirable. Especially in the cleaning and removal of oxygen and / or nitrogen compounds from modules, a very large proportion of the bonding material between the bonded components can be removed by the procedure steps, potentially contaminating the modules and therefore the components. For completeness, only this modified method is mentioned, and it is not necessarily superior to the exemplary method. Components that are identical or have the same function are designated by the same element symbol in the drawing. These parts are not shown by size or scale. Specifically, component 4 and supporting component 4' are shown as much thicker to indicate improvement. The relatively thinner alignment marks 5, 5', 5'' are also indicated as thicker. All drawings are schematic. An exemplary method is carried out in a vacuum in a modular system (sometimes referred to as a cluster, which is evacuable). The modular system is preferably designed such that all modules are interconnected and can be completely evacuated, so that the carrier substrate 6, product substrate 8, and components 4, 4' are preferably no longer in contact with an atmosphere until the method is fully completed. In a particularly preferred embodiment, the exemplary method has been implemented from the first process step of the aforementioned modular system. In this case, the module responsible for coating and separating into individual units must be able to be separated from other modules as much as possible, so as to avoid or at least minimize contamination of other modules, since the separation of the component substrate 1 into components 4, 4' is particularly accompanied by a large number of particles. Figure 1a illustrates the first process step of one of the exemplary methods, wherein component substrate 1, which serves as the initial substrate for the subsequently generated component 4, is coated on both sides. Component substrate 1 preferably includes alignment marks 5, by which the subsequently generated component 4 can be correctly positioned. Component 4, in a state not yet separated into individual units, is preferably functionalized (i.e., possesses all necessary properties). It is also conceivable, for example, that component 4 could also be a microchip. In this case, all circuitry has already been generated in component substrate 1. If the component is a MEMS, then all mechanical and / or electrical components have been generated. A protective layer 2 is applied to a component substrate surface 1o. A bonding layer 3 is applied to a component substrate surface 1u. The application of bonding layer 3 occurs prior to separation into individual units in process step 2 (see Figure 1b). Figure 1b illustrates a second process step of one of the exemplary methods, wherein the component substrate 1 is separated into individual components 4. Component 4' may be produced from the substrate component 1 from which component 4 is produced or from any other substrate (not shown) having the corresponding necessary physical (specifically mechanical) properties. Component 4' may be used as a support component in a subsequent process step. Component 4' may also include alignment marks 5. To distinguish it from the actual functional component 4 and because its positioning does not need to be exactly the same as that of component 4, the indication of alignment marks on component 4' is omitted. Component 4' typically includes another bonding layer 3', which preferably permanently connects it to the carrier substrate 6 (see Figure 1c). However, it is also conceivable that bonding layers 3 and 3' are the same. In this case, component 4', which should have a better support effect, can be transferred to the subsequent product substrate 8 like component 4. However, for the sake of generality, it is assumed below that component 4' remains fixedly connected to the carrier substrate 6. Component 4' preferably has the same thickness as component 4, wherein the height of all components 4, 4' is particularly preferably the same relative to the surface 6o of the carrier substrate. Figure 1c illustrates a third process step of one of the exemplary methods, wherein the carrier substrate 6 has individual components 4, 4'. Component 4 preferably includes alignment marks 5. Component 4 is then preferably aligned with alignment marks 5' located on the carrier substrate 6 using alignment marks 5. Alignment marks 5' are specifically used for the alignment of component 4. Alternatively, the geometry of component 4 (especially its corners and edges) can be used for alignment. After and / or during alignment, components 4, 4' come into contact with the carrier substrate 6. Alignment marks 5'' are also located on the carrier substrate 6, and the product substrate 8 is aligned in subsequent process steps. Component 4' may be specifically positioned at the edge of the carrier substrate 6, and these components have a supporting effect in subsequent process steps. The positioning of component 4' can also occur using alignment marks 5 (not shown in the figure). However, it is also conceivable to provide component 4' to the carrier substrate 6 without an alignment process. Component 4' is preferably positioned at at least two points, more preferably at at least three points, and most preferably at at least four points on the carrier substrate 6 to ensure an optimal support effect. Figure 1d illustrates a fourth step of one of the exemplary methods, in which a cleaning step of the component surface 4o occurs. The component surface 4o can be removed from the protective layer 2 by any method. Wet chemical methods are also conceivable (e.g.). If the protective layer 2 is a solid layer (specifically a dielectric, preferably an oxide and / or nitrogen compound), it can be removed by an ion beam or generally by sputtering. Since a particularly preferred state of bonding layer 3 (see Figure 1a) has been applied to the component substrate 1 prior to the separation process (see Figure 1b), a particularly preferred effect is achieved, and the carrier substrate surface 6o is free of bonding material at the points where components 4, 4' are not positioned. Therefore, the modules of the modular system 9 (see Figure 3) are not unnecessarily contaminated. Thus, the characteristic of the component substrate 1 having a bonding layer 3 before the separation process represents an important state. Figure 1e illustrates one of the exemplary methods, specifically the fifth process step and the resulting surface treatment. Surface treatment can be understood as the removal of oxides and / or nitrides and / or surface activation and / or deposition of a layer used to bond component 4 to the product substrate 8, which can be used in subsequent processes. If the protective layer 2 is composed of oxides and / or nitrides, this process step can be performed simultaneously with the preceding process steps. Since the exemplary method has occurred in a modular system (see Figure 3), the (second) component surface 4o cannot be recontaminated after the removal of oxygen and / or nitrogen compounds. The removal of oxygen and / or nitrogen compounds can be performed using any procedure or apparatus suitable for this purpose. However, it is particularly preferred that oxygen and / or nitrogen compounds be removed by a particle beam, specifically an ion beam. Similar considerations apply to nitrogen removal. Surface activation can occur, particularly during and / or after the removal of oxygen and / or nitrogen compounds. It is also conceivable that one of the component surfaces 4o may be intentionally hydrophilicized to improve the so-called pre-bonding between component 4 and the subsequent product substrate 8. It is also conceivable to intentionally deposit specific organic and / or inorganic layers to create a connection between component 4 and product substrate 8. Specifically, component 4 comprises a native oxide. In a particularly preferred embodiment, component 4 has a hybrid bonding surface. A hybrid bonding surface is a surface primarily composed of oxide with metallic regions, specifically copper regions, located therein. The metallic regions represent contact points that electrically contact functional areas of component 4. Especially in the case of a direct bonding between component 4 and product substrate 8, the use of appropriately selected materials results in an interface that is optically transparent and / or conductive. It is also conceivable that electrical and dielectric regions are located on the component surface 4o and the product substrate 8, and in each case, they are bonded together. The electrical regions are preferably contact points that create a conductive connection between the product substrate 8 and component 4. Such bonding between two components having electrical and dielectric regions or surfaces is called hybrid bonding. Its detailed structure and application are known to those skilled in the art and will not be explained in detail here. However, this invention discloses that the method is suitable and even specifically designed for producing hybrid bonding. Figure 1f illustrates a sixth step of one of the exemplary methods, wherein a product substrate 8 is aligned and in contact with a carrier substrate 6. The force with which the product substrate 8 presses against the components 4, 4' and thus the carrier substrate 6 is between 1 N and 100 kN, preferably between 1 N and 10 kN, more preferably between 1 N and 1 kN, most preferably between 1 N and 100 N, and most preferably between 1 N and 10 N. Therefore, it is preferable to use a smaller force to minimize damage to the components 4, 4' and / or the product substrate 8. Alignment occurs via alignment marks 5'' on the carrier substrate 6 and the product substrate 8. The provided component 4' can act as a support component in this contact process. This process step may be followed by a process step that increases the adhesive effect between the component surface 4o and the product substrate surface 8o, depending on the circumstances. For example, a heat treatment step at 50°C or higher, preferably 75°C or higher, more preferably 100°C or higher, and most preferably 150°C or higher is conceivable. However, preferably, direct contact should produce a sufficiently strong adhesion to separate the component 4 along the bonding layer 3 in the next process step. Subsequently, a temperature treatment can preferably be omitted, which would be disadvantageous because the material of the bonding layer 3 can be vented. Figure 1g illustrates the seventh step of one of the exemplary methods, in which the product substrate 8 is separated from the carrier substrate 6. In one embodiment, separation can occur purely mechanically. This is based on the fact that the adhesive effect of component 4 relative to product substrate 8 is greater than the static friction of component relative to carrier substrate 6. Alternatively and more preferably, the bonding layer between component 4 and carrier substrate 6 may be weakened. This weakening may occur throughout the entire area or selectively per component 4. It is conceivable to apply a heat treatment to the bonding layer 3 by performing a heat treatment on all components (e.g., in a furnace). Alternatively, a selective thermal effect can be conceived, specifically by means of a laser. The laser selectively focuses on the bonding layer and weakens it. The wavelength of the laser used is between 140 nm and 6000 nm (i.e., a laser encompassing wavelengths from the UV region to the infrared region). The precise laser wavelength used depends on the material used for the bonding layer 8. It is conceivable that the use of electromagnetic radiation would weaken the adhesion of the bonding layer 3 by disrupting the bonds of macromolecules. Alternatively, it is conceivable to reduce the adhesion of the bonding layer 3 by microwave radiation. When the product substrate 8 is removed, the bonding layer 3 preferably and typically partially remains on the component 4 and partially remains on the carrier substrate 6 and can be removed in a subsequent cleaning step. At the end of this procedure step, a plurality of components 4 are obtained on a product substrate 8. Figure 2 shows a plan view of a carrier substrate 6. For example, four components 4' are present on the carrier substrate 6, which act as support components. According to Figure 1e, they have a support effect during process steps. A plurality of alignment marks 5' are distributed on the carrier substrate 6. For example, 16 alignment marks 5' are shown in the figure. The first alignment mark 5' is hidden by a component 4 having an alignment mark 5. Two further alignment marks 5'' are located on the carrier substrate 6, which are used for the alignment of the carrier substrate 6 relative to the product substrate 8 (not shown in the figure, see Figure 1e). For clarity, the alignment marks 5 (white), 5' (black), and 5'' (gray) are different colors for easy illustration. Components 4 are specifically positioned and engaged in a component positioning area 12. If, in the sixth process step (see Figure 1f), a product substrate 8 is bonded to component 4, and if component 4' is not located on the carrier substrate 6, the product substrate 8 may be pressed at its periphery in the direction of the carrier substrate 6, and in the worst case, even under excessive pressure, it may crack. This can be prevented by using component 4' as a support element. Therefore, component 4' represents an important state. Figure 3 shows a plan view of an exemplary modular system 9 consisting of a plurality of modules 10, 10', 10'', 10''', and 10''''. The number of modules is arbitrary. For example, and without limitation, modules 10, 10', 10'', 10''' and 10'''' are designed as follows: Module 10 represents a coating module in which a bonding layer 3 and / or a protective layer 2 can be applied (see Figure 1a). Module 10' represents a separation module in which the component substrate 1 can be separated into individual units (see Figure 1b). Module 10'' represents an alignment and bonding module in which individual components 4, 4' can be aligned and positioned on the carrier substrate 6. Therefore, a type of pick-and-place device is preferably present in this module. Module 10''' represents a cleaning module in which the protective layer 2 can be removed. Module 10'''' represents an alignment and bonding module in which the substrate, specifically the carrier substrate 6 with components 4, 4', and the product substrate 8 can be aligned and bonded to each other. If necessary, a task can also be performed by a single module. It is also conceivable that the modular system 9 includes further modules. Specifically, coating and separation into individual units can also occur outside the modular system 9, allowing only the separated components 4, 4' to be introduced into the modular system 9. In this case, the aforementioned two modules 10, 10' can be omitted. Importantly, the modular system 9, specifically the individual modules between each other, allows the transfer of components 4, 4' and substrates 6, 8 without exposing the latter to the atmosphere. Therefore, the entire modular system 9 can be evacuated and isolated from the surrounding atmosphere. The loading and unloading of all necessary items preferably occurs via a lock 11, so that the interior of the modular system 9 can be kept evacuated for as long as possible. The modular system 9 or individual modules 10, 10', 10'', 10''', 10''' can be evacuated to less than 1 bar, preferably less than 1 millibar, more preferably less than 10 bar. -5 millibars, ideally less than 10 -9 millibars, and optimally up to 10. -12 One millibar of pressure. This data corresponds to the value proposed by the prevailing vacuum. Figure 4 shows a side view of a pre-manufactured carrier substrate 6, in which an illustrative method for stabilizing and distributing pressure components 4' is provided. This pre-manufactured carrier substrate 6 can be loaded into a modular system 9 and used immediately. In particular, when, according to the illustrative method, the component 4 has been coated with the bonding layer 3 before being separated into individual units, the pre-manufactured carrier substrate 6 can quickly have other components 4. After the components 4 are transferred to the product substrate 8 (see Figure 1g), the carrier substrate 6, specifically after cleaning, can be reused. 1: Component substrate 1o: Component substrate surface 1u: Component substrate surface 2: Protective layer 3: Bonding layer 3': Bonding layer 4: Component 4': Support component 4o: Component surface 5: Alignment mark 5': Alignment mark 5'': Alignment mark 6: Carrier substrate 6o: Carrier substrate surface 8: Product substrate 9: Modular system 10: Module 10': Module 10'': Module 10''': Module 10'''': Module 11: Lock 12: Component positioning area Further advantages, features, and details of the present invention are described below from preferred embodiments and by means of drawings. Figure 1a illustrates a first process step of an exemplary method; Figure 1b illustrates a second process step of an exemplary method; Figure 1c illustrates a third process step of an exemplary method; Figure 1d illustrates a fourth process step of an exemplary method; Figure 1e illustrates a fifth process step of an exemplary method; Figure 1f illustrates a sixth process step of an exemplary method; Figure 1g illustrates a seventh process step of an exemplary method; Figure 2 shows a plan view of an exemplary carrier substrate; Figure 3 shows a plan view of an exemplary modular system; and Figure 4 shows a carrier substrate having a front support component. 1: Component substrate 1o: Surface of the component substrate 1u: Surface of the component substrate 2: Protective layer 3: Bonding layer 5: Alignment Marks

Claims

1. A method for preparing components (4, 4') on a carrier substrate (6) using at least the following steps: a1) preparing a component substrate (1), a2) applying a bonding layer (3) on a first surface (1u) of the component substrate (1) and applying a protective layer (2) on a second surface (1o) of the component substrate (1), and then b) separating the component substrate (1) into components (4, 4'), c) positioning the components (4, 4') on a carrier substrate (6), wherein the components (4, 4') are fixed on the carrier substrate (6) and a first component surface includes the bonding layer (3).

2. The method of claim 1, wherein in step c), in addition to the components (4, 4'), at least one support component (4') is positioned on the carrier substrate (6) to prevent bending of the product substrate, particularly at the edges.

3. The method of claim 1 or 2, wherein the at least one support component (4') is positioned outside one of the component positioning regions (12) on the carrier substrate (6).

4. The method of claim 1 or 2, wherein the at least one support component (4') is produced by separating the component substrate (1) into a single unit in step b).

5. The method of claim 1 or 2, wherein the at least one support component (4') has the same height as the components (4).

6. The method of claim 1 or 2, wherein at least two, preferably at least four, support components (4') are uniformly and alternately positioned outside the component positioning area (12).

7. The method of claim 1 or 2, wherein after the components (4, 4') are peeled off from the carrier substrate (6), the at least one support component (4') remains on the carrier substrate (6).

8. A method for transferring components (4, 4') from a carrier substrate (6) to a product substrate (8) in the following order using at least the following steps: i) preparing components (4, 4') on a carrier substrate (6) as described in claims 1 to 7 above, wherein each of the components (4, 4') includes a first component surface and a second component surface (4o), and wherein the components (4, 4') are fixed to the carrier substrate (6) by means of the first component surface; ii) processing the second component surface (4o) of the components (4, 4'); iii) bonding the second component (4o) of the components (4, 4') to a product substrate (8), wherein steps ii) and iii) are performed under a vacuum, characterized in that the vacuum is maintained between steps ii) and iii).

9. The method of claim 8, wherein the method also includes the following steps after step iii): iv) peeling the components (4, 4') from the carrier substrate (6), wherein the peeling in step iv) is performed under vacuum.

10. The method of claim 8 or 9, wherein all components (4, 4') are engaged simultaneously in the engagement in step iii).

11. The method of request item 8 or 9, wherein prior to the processing in step ii), the removal of a protective layer (2) disposed on the surface (4o) of the second component is performed.

12. An apparatus (9) for preparing a substrate (4, 4') on a carrier substrate (6), which is designed to perform a method as claimed in at least one of claims 1 to 7, characterized in that the apparatus (9) operates under a vacuum.

13. An apparatus (9) for transferring components (4, 4') from a carrier substrate (6) to a product substrate (8), wherein the apparatus (9) is designed to transfer the components (4, 4') prepared on the carrier substrate (6) to the product substrate (8) under vacuum according to at least one of claims 8 to 11.

14. The apparatus (9) of claim 13, wherein the apparatus (9) is designed such that the carrier substrate (6) can be transferred from a surface treatment modular unit to a bonding modular unit while maintaining the vacuum.

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