Manufacturing methods of photosensitive components, curing materials, display devices, electronic components and curing materials

Abstract

The purpose of this invention is to provide a photosensitive composition that combines enhanced sensitivity during exposure, narrow mask error suppression in the aperture pattern size after development, and superior halftone characteristics; in addition, it provides a curing film that can improve the reliability of light-emitting elements in display devices and improve the migration resistance of electronic components. To achieve the above objectives, the photosensitive composition system of the present invention satisfies either condition (α) or condition (β), wherein, The double bond equivalent in the total solids is 600~6,000 g / mol; Condition (α): Contains a compound of (I) below and / or a compound of (II) below; (I) Compounds possessing specific (WA) weak acidic groups and free radical polymerizable groups; (II) Compounds with specific (WA) weak acidic groups and compounds with free radical polymerizable groups; Condition (β): Contains (A) alkali-soluble resin, (B) free radical polymerizable compound and (C) photosensitizer.

Description

Technical field

[0001] The present invention relates to a photosensitive composition, a cured product, a display device, an electronic component, and a method for manufacturing the cured product. prior art

[0002] In recent years, many products using organic electroluminescence (hereinafter referred to as "organic EL") displays have been developed in display devices with thin displays such as smartphones, tablet PCs, and televisions.

[0003] In order to improve the luminescence characteristics and reliability of organic EL displays, when the pixel dividing layer, thin film transistor (hereinafter referred to as TFT) planarization layer, TFT protective layer, and TFT matrix of the organic EL display are formed, The interlayer insulating layer or gate insulating layer uses a photosensitive composition with high heat resistance. For example, in the photosensitive composition used to form the pixel dividing layer formed on the first electrode, the first electrode serving as the anode must be exposed by photolithography. Therefore, in order to reduce the process and improve productivity during the manufacture of organic EL displays, the photosensitive composition is required to increase the sensitivity during exposure. On the other hand, as the light-emitting characteristics of organic EL displays are improved, the reliability of light-emitting components is also required to be improved. By improving the reliability of light-emitting elements, the durability of organic EL displays can be improved.

[0004] In addition, generally after forming the pixel dividing layer, the light-emitting material is deposited into a film by evaporation through a deposition mask, and then the second electrode is formed by evaporation. Furthermore, as a support base for a vapor deposition mask when depositing a luminescent material by vapor deposition, a region with a relatively thick film thickness (hereinafter referred to as a "thick film portion") is generally formed in a portion of the pixel dividing layer. Such a thicker area in a part of the pixel dividing layer can be formed by a two-layer film-forming process in which, after forming the pixel dividing layer, a photosensitive composition is again formed on the upper layer and patterned. On the other hand, in such a two-layer film-forming process, there is a risk that productivity and yield may decrease due to an increase in the number of steps. Therefore, when the pixel dividing layer is formed by photolithography, a process is applied in which the pixel dividing layer and the thick film portion are uniformly formed in a pattern that becomes the step shape of the pixel dividing layer by using a half-tone mask.

[0005] On the other hand, since organic EL displays have self-luminous elements, when external light such as outdoor sunlight is incident, the external light is reflected and visibility and contrast are reduced. Therefore, as a technology for blocking external light and reducing external light reflection, the photosensitive composition forming the pixel dividing layer generally contains a colorant to improve the light-shielding property.

[0006] In addition, in recent years, electronic terminal equipment has been progressing toward higher functionality, miniaturization, thinness, and weight reduction. These electronic terminal machines are equipped with semiconductor devices, such as processors or memories. As the use of semiconductors expands or their performance improves, semiconductor devices that form multi-layered metal rewiring are attracting attention in an attempt to achieve cost reduction and high integration through efficiencies in manufacturing steps. Due to the miniaturization of wiring associated with the high integration of semiconductor devices, the materials used for the interlayer insulating layers in such multi-layer metal rewiring are also required to have reliability related to electrical insulation, and therefore are also required to have high migration. patience.

[0007] Examples of the photosensitive composition include a negative photosensitive composition containing a first resin such as polyimide and a second resin such as Cardo resin (see Patent Document 1), and a negative photosensitive composition containing epoxy. A negative photosensitive composition of an acrylic resin and a novolak resin (see Patent Document 2), etc. [Prior technical literature] [Patent Document]

[0008] Patent Document 1: International Patent Publication No. 2017 / 159876 Patent Document 2: Japanese Patent Application Publication No. 2009-003442 Contents of the invention

[0009] (The problem that the invention wants to solve)

[0010] The above-mentioned increase in sensitivity of the photosensitive composition upon exposure is due to an increase in the light-shielding property of the photosensitive composition. Therefore, increasing the colorant content may cause problems. In particular, when black pigments with high light-shielding properties are included, ultraviolet rays, etc. are also blocked during pattern exposure, which causes a decrease in sensitivity during exposure.

[0011] Furthermore, in the process of forming a thick film portion on a part of the pixel dividing layer, depending on the characteristics of the photosensitive composition, the pixel dividing layer and the thick film portion can be uniformly formed by pattern exposure through a halftone mask. (hereinafter referred to as "halftone characteristics") is insufficient. Specifically, even if a halftone mask is used, there may be cases where the film thickness difference between the pixel dividing layer and the thick film portion cannot be formed, or the area of ​​the pixel dividing layer disappears during development. It is considered that the main reason for this is that the sensitivity of the photosensitive composition dominates the light exposure amount that passes through the halftone portion of the halftone mask. That is, in the case of a positive-type photosensitive composition, if the sensitivity is excessive relative to the light passing through the halftone portion, the area of ​​the pixel dividing layer will easily disappear during development. On the other hand, in the case of a negative photosensitive composition, if the sensitivity to light passing through the halftone portion is excessive, it will become difficult to form a film thickness difference between the pixel dividing layer and the thick film portion. Especially in the case of negative photosensitive compositions, insufficient photohardening is likely to occur in areas where the exposure is small, and most areas of the pixel dividing layer disappear during development, making it difficult to perform stable pattern processing.

[0012] On the other hand, when a photosensitive composition is used and the opening is formed by photolithography, the error between the pattern size and the opening size of the mask (hereinafter referred to as "mask error") will be large. The design error of the light-emitting pixel area on the anode has a negative impact on the light-emitting characteristics of the organic EL display. In order to suppress the mask error, for example, a method can be used to adjust the pattern size of the mask according to the characteristics of the photosensitive composition. However, other issues such as the pattern arrangement and resolution of the mask are also limited in the design. In addition, when the mask error is too large, it will be difficult to improve it by adjusting the pattern size of the mask. Mask error characteristics include: a characteristic in which the aperture size is narrowed compared to the pattern size of the mask (hereinafter referred to as "narrow mask error characteristics"); and a characteristic in which the aperture size is widened in comparison to the pattern size of the mask Characteristics (hereinafter referred to as "wide mask tolerance"). It can be considered that this kind of mask error is caused by the influence of diffracted light when the pattern is exposed, and is affected by the material characteristics. In the case of positive-type photosensitive compositions, the alkali solubility improvement of the exposed part depends on the degree of influence of diffracted light, and the mask error varies. Generally speaking, when the alkali solubility of the exposed part is insufficient, it is easy to become a narrow mask error; when the alkali solubility of the exposed part is excessive, it is easy to become a wide mask error. On the other hand, in the case of a negative photosensitive composition, the reduction in alkali solubility caused by photohardening of the exposed part depends on the degree of influence of diffracted light, and the mask error varies. Especially in the case of negative photosensitive compositions, the influence of photohardening caused by free radicals generated by diffracted light is likely to be dominant, often resulting in narrow mask errors. In addition, when the light hardening of the exposed part is insufficient, it is easy to cause a wide mask error.

[0013] In order to suppress such mask errors, if the process of forming the pixel division layer is changed or the composition of the photosensitive composition is changed, the pattern processability of the photosensitive composition may be adversely affected. Therefore, it is difficult to simultaneously take into account various aspects such as the improvement of sensitivity during exposure, which is required from the perspective of reducing process time and improving productivity, and the excellent halftone characteristics, which are required from the perspective of improving productivity and productivity. characteristic. Therefore, as a photosensitive composition, there is a demand for a material that has both improved sensitivity during exposure, narrow mask error in the opening pattern size after display, and excellent halftone characteristics. In addition, there is also a demand for materials that can provide cured films that can improve the reliability of light-emitting elements in display devices. Furthermore, conventional compositions still have problems in providing a hardened product with migration resistance. However, the photosensitive compositions described in the above-mentioned Patent Documents 1 and 2 are still insufficient in any of the above characteristics. (Technical means to solve problems)

[0014] In order to solve the above-mentioned problems, the present invention has the following configuration. That is to say [1] A photosensitive composition that satisfies the following condition (α) or condition (β), in which the double bond equivalent in the total solid content is 600~6,000g / mol; Condition (α): Contains the compound of the following (I) and / or the compound of the following (II); (I) Compounds having the following (WA) weakly acidic groups and radically polymerizable groups; (II) Compounds having the following (WA) weakly acidic groups and compounds having radically polymerizable groups; Condition (β): Contains (A) alkali-soluble resin, (B) radically polymerizable compound and (C) photosensitizer; (WA) Weakly acidic group: selected from one of the group consisting of phenolic hydroxyl group, hydroxyamide group, hydroxyamide group, silicone group, 1,1-bis(trifluoromethyl)hydroxymethyl group and mercapto group The foundation of more than one kind. [2] The photosensitive composition of [1] above, wherein the equivalent weight of weakly acidic groups in the total solid content is 400~6,000g / mol. [3] The photosensitive composition of [1] or [2] above, which further contains a cyclic amide compound represented by the general formula (20), a amide compound represented by the general formula (21), a amide compound represented by the general formula (21), One or more of the group consisting of the cyclic urea compound represented by (22) and the urea compound represented by general formula (23); and satisfying the following conditions (4); (4) The cyclic amide compound represented by the general formula (20), the amide compound represented by the general formula (21), and the cyclic amide compound represented by the general formula (22) in the total solid content of the photosensitive composition The total content of the urea compound and the urea compound represented by general formula (23) is 0.010~5.0 mass%;

[0015] [Chemical 1]

[0016] (In general formulas (20) to (23), R 46 to R 54 independently represent a hydrogen atom, an alkyl group with 1 to 6 carbon atoms, a cycloalkyl group with 4 to 10 carbon atoms, and an aryl group with 6 to 15 carbon atoms. , alkenyl group with 2 to 6 carbon atoms, or hydroxyalkyl group with 1 to 6 carbon atoms; R 130 represents a hydrogen atom, an alkyl group with 1 to 6 carbon atoms, an alkoxy group with 1 to 6 carbon atoms, or an alkoxy group with 1 to 6 carbon atoms. 6-hydroxyalkyl group, hydroxyalkoxy group with 1 to 6 carbon atoms, hydroxyl group, amine group, monoalkylamino group with 1 to 6 carbon atoms, or dialkylamino group with 2 to 12 carbon atoms; R 131~ R 138 each independently represents an alkyl group with 1 to 6 carbon atoms; a, b and c each independently represent an integer from 0 to 6; d represents 1 or 2; e, f, g, h and i each independently represent an integer from 0 to 2 Integer; when b is 0, d is 1). [4] The photosensitive composition of [3] above, which further contains a component selected from the group consisting of a sodium-containing component, a potassium-containing component, a magnesium-containing component, a calcium-containing component, and an iron-containing component. More than one group consisting of components containing copper elements and components containing chromium elements; and meeting the following conditions (5); (5) The total content of sodium, potassium, magnesium, calcium, iron, copper and chromium in the total solid content of the photosensitive composition is 0.010 to 500 ppm by mass. [5] The photosensitive composition according to any one of the above [1] to [4], which contains (A) an alkali-soluble resin; The (A) alkali-soluble resin system has the above-mentioned (WA) weakly acidic group; The phenolic equivalent in the total solid content is 400~6,000g / mol; The alkali-soluble resin (A) mentioned above has a phenolic hydroxyl group. [6] The photosensitive composition of the above [5], wherein the alkali-soluble resin (A) contains the following (A3-1) resin, (A3-2) resin, (A3-3) resin and (A3-4) More than one type of group composed of resin; (A3-1) Resin: phenol resin; (A3-2) Resin: polyhydroxystyrene; (A3-3) Resin: epoxy resin containing phenol group; (A3-4) Resin: Acrylic resin containing phenol groups. [7] The photosensitive composition of the above [6], wherein the (A3-1) resin, (A3-2) resin, (A3-3) resin and (A3-4) resin are selected from the following One or more groups consisting of (3x) structural units, (3y) structural units and (3z) structural units; The aromatic group in the (3y) structural unit is another aromatic group that is different from the aromatic ring to which the phenolic hydroxyl group is bonded; The second aromatic group in the (3z) structural unit is an aromatic group other than the aromatic ring to which the phenolic hydroxyl group is bonded; (3x) Structural unit: Structural unit containing at least 2 phenolic hydroxyl groups; (3y) Structural unit: Structural unit containing phenolic hydroxyl and aromatic groups; (3z) Structural unit: a structural unit containing a phenolic hydroxyl group and a structural unit containing a second aromatic group. [8] The photosensitive composition according to any one of the above [2] to [7], which contains (A) an alkali-soluble resin, (B) a radically polymerizable compound, and (C) a photosensitive agent; The (A) alkali-soluble resin contains a resin with radically polymerizable groups and a resin without radically polymerizable groups; This (C) photosensitive agent contains (C1) photopolymerization initiator. [9] The photosensitive composition according to any one of the above [1] to [8], wherein the equivalent weight of weakly acidic groups in the total solid content is 400~1,500g / mol; The above double bond equivalent is 750~6,000g / mol.

[10] The photosensitive composition according to any one of the above [1] to [9], further containing (I) inorganic particles; The (I) inorganic particle system contains (I1) silica particles.

[11] The photosensitive composition according to any one of the above [1] to

[10] , further containing a component selected from the group consisting of a halogen element-containing component, a sulfur element-containing component, and a phosphorus element-containing component. More than one type, and meeting more than one of the following conditions (1)~(3); (1) The content of halogen element in the photosensitive composition is 0.01~100 ppm by mass; (2) The content of sulfur element in the photosensitive composition is 0.01~100 ppm by mass; (3) The content of phosphorus element in the photosensitive composition is 0.01 to 100 ppm by mass.

[12] The photosensitive composition according to any one of the above [1] to

[11] , which contains (A) an alkali-soluble resin; The (A) alkali-soluble resin contains at least one selected from the group consisting of the following (A1) resin, (A2) resin and (A3) resin; (A1) Resin: has the above-mentioned (WA) weakly acidic group, and has one or more structural units selected from the group consisting of amide imine structure, amide structure, oxazole structure and siloxane structure, and does not Resins with free radical polymerizable groups; (A2) Resin: Resin with free radical polymerizable groups; (A3) Resin: Resin with phenolic hydroxyl group.

[13] The photosensitive composition of

[12] above, wherein the (A) alkali-soluble resin contains the above-mentioned (A1) resin and / or (A3) resin, and further contains the above-mentioned (A2) resin; (A2) Resin; a resin having radically polymerizable groups.

[14] The photosensitive composition according to any one of the above [1] to

[13] , which further contains (D1a-1) an organic black pigment and / or (D1a-3) a mixture of two or more colored pigments; The (D1a-1) organic black pigment contains a group selected from the group consisting of (D1a-1a) benzofuranone-based black pigment, (D1a-1b) perylene-based black pigment, and (D1a-1c) azo-based black pigment. one or more; The (D1a-3) two- or more-color colored pigment mixture contains two or more colors of pigments selected from the group consisting of red, orange, yellow, green, blue, and violet pigments.

[15] The photosensitive composition according to any one of the above [1] to

[14] , which contains (B) a radically polymerizable compound; Further satisfy at least one of the following conditions (γ), condition (δ) and condition (ε); Condition (γ): The (B) radically polymerizable compound contains the following (B4) fourth polymerizable compound and (B5) fifth polymerizable compound; Condition (δ): The (B) radically polymerizable compound contains the following (B6) sixth polymerizable compound and (B7) seventh polymerizable compound; Condition (ε): The (B) radical polymerizable compound contains the following (B4) fourth polymerizable compound or (B5) fifth polymerizable compound, and further contains the following (B6) sixth polymerizable compound or (B7) The 7th polymerizable compound; (B4) The fourth polymerizable compound: a compound having the following structure (I-b4) and further having at least 2 radically polymerizable groups; (I-b4) Structure: a structure containing an alicyclic structure and / or a structure containing a heteroalicyclic structure; (B5) The fifth polymerizable compound: a compound having the following (I-b5) structure and (II-b5) structure, and further having at least 2 radically polymerizable groups; (I-b5) Structure: Structure containing aromatic structures; (II-b5) Structure: Structure containing aliphatic structures; (B6) The sixth polymerizable compound: a compound having at least two (meth)acrylyl groups and further having the following structure (I-b6); (I-b6) Structure: A structure in which at least two (meth)acrylyl groups are connected by a minimum number of atoms of 4 to 10 and contains an aliphatic structure; (B7) The seventh polymerizable compound: a compound having at least two (meth)acrylyl groups and further having the following structure (I-b7); (I-b7) Structure: A structure in which at least two (meth)acrylyl groups are connected by a minimum number of atoms of 11 to 45 and contains an aliphatic structure.

[16] A hardened product obtained by hardening the photosensitive composition of any one of the above [1] to

[15] .

[17] A display device including the hardened material of

[16] above.

[18] An electronic component comprising the hardened material of the above

[16] .

[19] A method of manufacturing a hardened object, which has the following steps: (1) The film forming step of forming a coating film of the photosensitive composition of any one of the above [1] to

[15] on a substrate; (2) The step of irradiating the coating film of the above-mentioned photosensitive composition with active chemical rays through a photomask; (3) The step of developing using an alkali solution to form a pattern of the above-mentioned photosensitive composition; and (4) The step of heating the above pattern to obtain a hardened pattern of the above photosensitive composition; The photomask is a half-tone photomask that includes a light-transmitting part and a light-shielding part, and has a semi-transparent part between the light-transmitting part and the light-shielding part. The semi-light-transmitting part has a transmittance higher than that of the light-transmitting part. The value is low and the transmittance is higher than the value of the light-shielding part.

[20] A display device having at least a first electrode, a second electrode and a pixel dividing layer on a substrate, and further having an organic EL layer containing a luminescent layer and / or a light emitting layer containing a luminescent layer; The pixel dividing layer is formed to overlap with a portion of the first electrode; The organic EL layer containing a luminescent layer and / or the light extraction layer containing a luminescent layer is formed on the first electrode and between the first electrode and the second electrode; The pixel dividing layer contains (D-DL) colorant, and the optical concentration of the pixel dividing layer per 1 μm of visible light wavelength is 0.5~5.0; The pixel dividing layer contains a resin with the following (WA) weakly acidic group; The resin with (WA) weakly acidic group contains one selected from the group consisting of the following (XA3-1) resin, (XA3-2) resin, (XA3-3) resin and (XA3-4) resin. above; The display device meets the following conditions (1x) and / or (2x); (WA) Weakly acidic group: selected from one of the group consisting of phenolic hydroxyl group, hydroxyamide group, hydroxyamide group, silicone group, 1,1-bis(trifluoromethyl)hydroxymethyl group and mercapto group The foundation of more than one kind; (XA3-1) Resin: phenol resin; (XA3-2) Resin: polyhydroxystyrene; (XA3-3) Resin: epoxy resin containing phenol group; (XA3-4) Resin: Acrylic resin containing phenolic groups; (1x) Let the maximum value of the surface roughness of the thin film part surface in the step shape of the pixel division layer be (Ra HT / max), and set the maximum surface roughness value of the thick film part surface in the step shape of the pixel division layer When set to (Ra FT / max), the difference ∣Δ(Ra HT / max-Ra FT / max)∣ between (Ra HT / max) and (Ra FT / max) is 1.0~50.0nm; (2x) When the maximum surface roughness value of the surface of the pixel division layer is set to (Ra DL / max), and the maximum surface roughness value of the interlayer surface between the pixel division layers is set to (Ra SP / max), The difference between (Ra DL / max) and (Ra SP / max) ∣Δ(Ra DL / max – Ra SP / max)∣ is 1.0~50.0nm. (Compare the effectiveness of previous technologies)

[0017] The photosensitive composition of the present invention has the advantages of improved sensitivity during exposure, narrow mask error suppression in the opening pattern size after development, and excellent halftone characteristics. Furthermore, according to the photosensitive composition of the present invention, it is possible to provide a cured film that can improve the reliability of light-emitting elements in display devices. In addition, according to the photosensitive composition of the present invention, a cured film capable of improving the migration resistance of electronic components can be provided. Furthermore, according to the display device of the present invention, the reliability of the light-emitting element can be improved. In addition, according to the electronic component of the present invention, the migration resistance of the component can be improved. Simple explanation of the diagram

[0018] FIG. 1 is a cross-sectional view showing an example of a cross-section of a hardened pattern having a step shape. 2 is a schematic cross-sectional view showing an enlarged cross-section of a pad portion of an example of a semiconductor device having bumps. 3 is a schematic cross-sectional illustration of steps 1 to 7 of the manufacturing process of an organic EL display using a cured product of the photosensitive composition of the present invention. 4 is a schematic diagram illustrating the arrangement and size of the light-transmitting portion, the light-shielding portion, and the semi-light-transmitting portion in the half-tone mask used for evaluation of half-tone characteristics. FIG. 5 is a schematic diagram illustrating the manufacturing process of steps 1 to 4 in the organic EL display substrate used in the evaluation of luminescence characteristics through a top view. Implementation

[0019] <Photosensitive composition> The photosensitive composition of the present invention will be described below. The photosensitive composition of the present invention satisfies the following condition (α) or condition (β), wherein, The double bond equivalent in the total solid content is 600~6,000g / mol. Condition (α): Contains the compound of the following (I) and / or the compound of the following (II); (I) Compounds having the following (WA) weakly acidic groups and radically polymerizable groups; (II) Compounds having the following (WA) weakly acidic groups and compounds having radically polymerizable groups; Condition (β): Contains (A) alkali-soluble resin, (B) radically polymerizable compound and (C) photosensitizer; (WA) Weakly acidic group: selected from one of the group consisting of phenolic hydroxyl group, hydroxyamide group, hydroxyamide group, silicone group, 1,1-bis(trifluoromethyl)hydroxymethyl group and mercapto group The foundation of more than one kind.

[0020] In addition, in the present invention, a photosensitive composition that satisfies the above condition (α) and has a double bond equivalent in the total solid content within the above range is sometimes referred to as the first aspect of the photosensitive composition of the present invention. In addition, a photosensitive composition that satisfies the above condition (β) and has a double bond equivalent in the total solid content within the above range is sometimes referred to as the second aspect of the photosensitive composition of the present invention. In addition, "(I) the compound having (WA) a weakly acidic group and a radically polymerizable group" may be simply called "(I) compound". In addition, the "compound having a (WA) weakly acidic group" in the above (II) may be abbreviated as "(IIa) compound", and the "compound having a radically polymerizable group" in the above (II) may be abbreviated as " (IIb) compound".

[0021] In the present invention, the so-called radically polymerizable radical refers to a radical that can add a methyl radical at room temperature, and when a methyl radical is added, it refers to a radical that generates other radicals. An example of a method for generating methyl radicals at room temperature is a method of irradiating an active chemical ray (radiation) to a photopolymerization initiator having an acetyl oxime ester structure. When methyl radicals are added, electron spin resonance analysis can be used as a method to detect other generated radicals. In addition, when a methyl radical is added, a method for confirming the generation of other radicals may include, for example, a photopolymerization initiator that combines a compound with a radical polymerizable group and an acetyl oxime ester structure. A composition dissolved in a solvent is irradiated with active chemical rays, and is confirmed by the increase in viscosity before and after irradiation with active chemical rays, or the presence of changes in appearance such as gelation or film formation. Examples of active chemical rays include visible rays, ultraviolet rays, electron beams, or X-rays. Moreover, it is preferable that other radicals generated when a methyl radical is added to a radical polymerizable group can be further added to other radical polymerizable groups. Moreover, when it is further added to other radical polymerizable groups, it is preferable to generate other radicals similarly. The other radical generated when a methyl radical is added to a radical polymerizable radical is preferably a carbon radical, an oxygen radical, a nitrogen radical or a sulfur radical, and more preferably a carbon radical.

[0022] <Double bond equivalent in total solid content of photosensitive composition> The photosensitive composition of the present invention has a double bond equivalent in the total solid content of 600 to 6,000 g / mol. If the double bond equivalent in the total solid content of the photosensitive composition is 600~6,000g / mol, the sensitivity improvement effect during exposure becomes significant. In addition, the reliability improvement effect of the light-emitting elements in the display device becomes significant.

[0023] As mentioned above, in the case of a positive photosensitive composition, if the alkali solubility of the exposed part is not improved enough, it is easy to cause a narrow mask error. It is presumed that by setting the double bond equivalent in the total solid content of the photosensitive composition to a specific range, the double bond group possessed by the resin, etc. in the photosensitive composition and the photosensitive agent (C) described below are The interaction between aromatic rings improves the alkali solubility of the exposed part and suppresses narrow mask errors. In addition, it is presumed that in the unexposed portion, since there is no increase in alkali solubility due to the photosensitive agent (C) described below, the double bond group contained in the resin, etc. in the photosensitive composition is different from the photosensitivity (C) described below. The π bond accumulation caused by the interaction between the aromatic rings of the agent dominates, and the development film that relaxes the half-tone exposed part is reduced, so the half-tone processability is improved.

[0024] On the other hand, in the case of negative photosensitive compositions, narrow mask errors are prone to occur due to the photohardening effect caused by free radicals generated by diffracted light. It is speculated that by setting the double bond equivalent in the total solid content of the photosensitive composition to a specific range, the photohardening effect of free radicals generated by diffracted light during pattern exposure can be minimized, and the narrow mask can be suppressed. error. In addition, it is speculated that by using an appropriate amount of double bond groups to suppress excessive photohardening of the exposed portion, the slope of the photohardening degree relative to the exposure amount can be relaxed, so the halftone processability is improved.

[0025] In the photosensitive composition of the present invention, the double bond equivalent in the total solid content of the photosensitive composition is preferably 650 g / mol or more from the viewpoint of suppressing narrow mask errors after development and improving halftone characteristics. , more preferably 700g / mol or more, still more preferably 750g / mol or more, still more preferably 800g / mol or more, particularly preferably 850g / mol or more. Furthermore, from the viewpoint of suppressing narrow mask errors after development and improving halftone characteristics, it is preferably 900 g / mol or more, and more preferably 1,000 g / mol or more. On the other hand, the double bond equivalent in the total solid content of the photosensitive composition is preferably 3,000 g / mol from the perspective of improving sensitivity during exposure and improving the reliability of light-emitting elements in display devices. or less, more preferably 2,500 g / mol or less, still more preferably 2,000 g / mol or less, even more preferably 1,700 g / mol or less, particularly preferably 1,500 g / mol or less.

[0026] The double bond equivalent is calculated from the mass of the total solid content in the photosensitive composition and the iodine value of each component having a double bond group in the photosensitive composition. In addition, the iodine value refers to the value obtained by converting the amount of halogen that reacts with the photosensitive composition per 100 g into the mass of iodine, and converting the mass of iodine into the solid content of the photosensitive composition per 100 g. The unit of iodine value is gl / 100g.

[0027] Among the photosensitive compositions of the present invention, it is preferable to select only (A) alkali-soluble resin, (B) radically polymerizable compound, (C) photosensitizer, (E) dispersant, (F) compound and (G) ) cross-linking agent, one or more of the group has an ethylenically unsaturated double bond group, and more preferably is selected from the group consisting of (A) alkali-soluble resin, (B) radically polymerizable compound and (G) cross-linking agent. At least one member of the group has an ethylenically unsaturated double bond group, and more preferably only (A) the alkali-soluble resin and / or (B) the radically polymerizable compound has an ethylenically unsaturated double bond group.

[0028] The photosensitive composition of the present invention contains a compound having a radically polymerizable group. The radically polymerizable group is preferably an ethylenically unsaturated double bond group. From the viewpoint of improving the sensitivity during exposure, improving the reliability of the light-emitting element in the display device, and promoting radical polymerization when heated at low temperature, the radical polymerizable group is preferably selected from a photoreactive group, a carbon number One or more of the group consisting of alkenyl groups with 2 to 5 carbon atoms and alkynyl groups with 2 to 5 carbon atoms. The photoreactive group is preferably a styryl group, a cinnamonyl group, a maleimide group or a (meth)acrylyl group, and more preferably a (meth)acrylyl group. On the other hand, the alkenyl group having 2 to 5 carbon atoms or the alkynyl group having 2 to 5 carbon atoms is preferably vinyl, allyl, 2-methyl-2-propenyl, crotonyl, 2-methyl- 2-butenyl, 3-methyl-2-butenyl, 2,3-dimethyl-2-butenyl, ethynyl or 2-propynyl, preferably vinyl or allyl. In the second aspect of the photosensitive composition of the present invention, from the viewpoint of improvement in sensitivity during exposure, improvement in half-tone characteristics, and improvement in reliability of light-emitting elements in display devices, (A) alkali solubility The resin preferably contains resin (A2) described below. (A2) Resin: Resin having radically polymerizable groups.

[0029] Among the photosensitive compositions of the present invention, it is preferable to select from the following (A) alkali-soluble resin, (B) radically polymerizable compound, (C) photosensitizer, (E) dispersant, (F) compound and ( G) One or more of the group consisting of cross-linking agents has radically polymerizable groups, and (D) colorants and (H) dissolution accelerators mentioned below do not have radically polymerizable groups; More preferably, at least one selected from the group consisting of (A) alkali-soluble resin, (B) radically polymerizable compound, and (G) cross-linking agent has radically polymerizable groups, (C) photosensitizer, ( D) Colorants, (E) dispersants, (F) compounds and (H) dissolution accelerators do not have free radical polymerizable groups; More preferably, (A) alkali-soluble resin and / or (B) radically polymerizable compound has radically polymerizable groups, (C) photosensitizer, (D) colorant, (E) dispersant, (F) compound , (G) cross-linking agent and (H) dissolution accelerator do not have free radical polymerizable groups.

[0030] In the first aspect of the photosensitive composition of the present invention, the compound (I) preferably contains a compound selected from the group consisting of (A) an alkali-soluble resin, (B) a radically polymerizable compound, and (G) a cross-linking agent described later. It consists of more than one group; more preferably, it contains (A) alkali-soluble resin and / or (G) cross-linking agent. The compound (IIa) preferably contains at least one selected from the group consisting of (A) alkali-soluble resin, (B) radically polymerizable compound, (G) cross-linking agent and (H) dissolution accelerator described later; More preferably, it contains (A) alkali-soluble resin and / or (G) cross-linking agent. The compound (IIb) preferably contains a compound selected from the group consisting of (A) alkali-soluble resin, (B) radically polymerizable compound, (C) photosensitizer, (E) dispersant, (F) compound and (G) crosslinking mentioned below. More preferably, it contains at least one type selected from the group consisting of (A) alkali-soluble resin, (B) radically polymerizable compound, and (G) cross-linking agent.

[0031] <Equivalent of weakly acidic groups in the total solid content of the photosensitive composition> The first preferred aspect of the photosensitive composition of the present invention is a photosensitive composition that satisfies the above condition (α), and the weakly acidic group equivalent in the total solid content is 400~6,000g / mol.

[0032] Furthermore, the second preferred aspect of the photosensitive composition of the present invention is a photosensitive composition that satisfies the above condition (β), and the weakly acidic group equivalent in the total solid content is 400 to 6,000 g / mol.

[0033] In the photosensitive composition of the present invention, if the equivalent of weakly acidic groups in the total solid content of the photosensitive composition is 400 to 6,000 g / mol, the effects of narrow mask error suppression and halftone characteristics improvement after development will be significant. Moreover, the weakly acidic group equivalent to the weakly acidic group refers to the above-mentioned (WA) weakly acidic group.

[0034] As mentioned above, generally speaking, in the case of a positive-type photosensitive composition, if the alkali solubility of the exposed part is not improved enough, it is easy to cause a narrow mask error. On the other hand, in the present invention, it is presumed that by setting the equivalent amount of weakly acidic groups in the total solid content of the photosensitive composition to a specific range, an appropriate amount of weakly acidic groups can suppress residues in the exposed portion, and thereby improve the pattern exposure during pattern exposure. The alkali solubility is still improved under diffracted light, and the narrow mask error can be suppressed. In addition, it is speculated that the mild acidity of the weak acidic group in the unexposed area relaxes the reduction of the developed film in the halftone exposed area, so the halftone processability is improved.

[0035] In addition, in the case of negative photosensitive compositions, generally speaking, narrow mask errors are likely to occur due to the photohardening effect of free radicals generated by diffracted light. On the other hand, in the present invention, it is speculated that by setting the weak acidic group equivalent in the total solid content of the photosensitive composition to a specific range, residues are suppressed by an appropriate amount of weakly acidic groups in the exposed part, and the alkali in the exposed part is During development, side etching in the deep part of the film is suppressed, so narrow mask errors can be suppressed. In addition, it is speculated that the mild acidity of the weakly acidic group relaxes the halftone exposure area and reduces the development film, so the halftone processability is improved. In addition, in addition to setting the weakly acidic group equivalent in the total solid content of the photosensitive composition to a specific range, by setting the phenolic equivalent in the total solid content of the photosensitive composition to a specific range, the phenolic hydroxyl group can be used. Because the free radicals generated by diffracted light during pattern exposure are stabilized and excessive photohardening of the exposed area is suppressed by phenolic hydroxyl groups, the slope of the photohardening degree relative to the exposure amount can be relaxed, thereby suppressing narrow mask errors and And it is better from the perspective of improving halftone characteristics.

[0036] In the photosensitive composition of the present invention, the equivalent amount of weakly acidic groups in the total solid content of the photosensitive composition is higher than that of the light-emitting element in the display device from the perspective of improving the sensitivity during exposure and improving the reliability of the light-emitting element in the display device. It is preferably 450 g / mol or more, more preferably 500 g / mol or more, still more preferably 550 g / mol or more, still more preferably 600 g / mol or more, and particularly preferably 700 g / mol or more. Furthermore, from the viewpoint of suppressing narrow mask errors after development and improving halftone characteristics, it is preferably 750 g / mol or more, and more preferably 800 g / mol or more. On the other hand, the equivalent of weakly acidic groups in the total solid content of the photosensitive composition is preferably 3,000 g from the viewpoint of suppression of residues after development, suppression of narrow mask errors after development, and improvement of halftone characteristics. / mol or less, more preferably 2,500 g / mol or less, still more preferably 2,000 g / mol or less, still more preferably 1,700 g / mol or less, particularly preferably 1,500 g / mol or less.

[0037] In the photosensitive composition of the present invention, from the viewpoint of suppressing narrow mask errors after development and improving halftone characteristics, it is preferable that the weakly acidic group equivalent is within any of the above ranges. The phenol equivalent, hydroxyimine equivalent, hydroxyamide equivalent or silicon alcohol equivalent in the total solid content of the substance is 400~6,000g / mol, and more preferably, the phenol equivalent or silicon alcohol equivalent is 400~6,000g / mol, and A more preferred phenol equivalent is 400~6,000g / mol. The preferred ranges of phenol equivalents, hydroxyimide equivalents, hydroxyamide equivalents or silicon alcohol equivalents are the same as the preferred ranges of the weakly acidic group equivalents mentioned above. Among them, by setting the phenol equivalent in the above range, the narrow mask error suppression and halftone characteristics improvement effects become significant. The reason for this has not yet been clarified, but it can be speculated as follows. That is, it is speculated that the phenolic hydroxyl group stabilizes free radicals generated by diffracted light during pattern exposure. In addition, it is speculated that the slope of the degree of photohardening with respect to the exposure amount can be softened by suppressing excessive photohardening of the exposed portion by the phenolic hydroxyl group. As a result, it is speculated that the narrow mask error suppression and the improvement of halftone characteristics will become more significant.

[0038] The weakly acidic group equivalent can be obtained by measuring the following weakly acidic group value. Weakly acidic base value: the total of phenol value, hydroxyimine value, hydroxyamide value, silicon alcohol value, 1,1-bis(trifluoromethyl)hydroxymethyl value and sulfhydryl value.

[0039] In the photosensitive composition of the present invention, the weak acidic group equivalent is the weak acidic group equivalent calculated from the weak acidic group value in the total solid content of the photosensitive composition. That is, it is the weakly acidic group equivalent calculated from the mass of the total solid content in the photosensitive composition and the weakly acidic group value of each component having a weakly acidic group in the photosensitive composition. In addition, the so-called weakly acidic base value refers to the value calculated by converting the mass of potassium hydroxide reacting with the photosensitive composition per 1g into the solid content of the photosensitive composition per 1g. The unit of weakly acidic base value is mgKOH / g.

[0040] Among the photosensitive compositions of the present invention, it is preferable that only one selected from the group consisting of (A) alkali-soluble resin, (B) radically polymerizable compound, (G) cross-linking agent, and (H) dissolution accelerator More than two kinds have (WA) weak acidic groups, more preferably only (A) alkali-soluble resin and / or (G) cross-linking agent have (WA) weakly acidic groups, and more preferably only (A) alkali-soluble resin has (WA) weakly acidic groups WA) weakly acidic group.

[0041] The photosensitive composition of the present invention is preferred from the viewpoints of improvement in sensitivity during exposure, suppression of narrow mask errors after development, improvement in half-tone characteristics, and improvement in reliability of light-emitting elements in display devices. The equivalent weight of weakly acidic groups in the total solid content of the photosensitive composition is 400~1,500g / mol, and the equivalent weight of double bonds in the total solid content of the photosensitive composition is 750~6,000g / mol.

[0042] Furthermore, when the photosensitive composition contains a plurality of resins such as a resin having a (WA) weakly acidic group and a resin having other acidic groups, it is preferable to separate the composition by centrifugal separation and liquid extraction. , and column chromatography and other methods to remove the components separated, and then separate various resins through GPC fractionation. Thereafter, it is preferred to measure the weakly acidic group equivalents and other acid equivalents of each resin. In addition, it is preferable when the photosensitive composition contains a resin having (WA) weak acidic groups and other acidic groups, and when the photosensitive composition contains resins having two or more (WA) weakly acidic groups. By utilizing the reactivity difference of each acidic group to add a protecting group, one acidic group is freed. Thereafter, it is preferred to measure the equivalent weight of weakly acidic groups or other acid equivalents. Then, preferably, each acidic group is freed by appropriately repeating further addition of the protecting group and deprotection of the protecting group. Thereafter, it is preferable to measure the weak acidic group equivalent or other acid equivalent for each acidic group.

[0043] In the photosensitive composition of the present invention, the (WA) weakly acidic group preferably contains a phenolic hydroxyl group, a hydroxycarboxylimine group, a hydroxycarboxylic acid amide group or a silicone alcohol group, and more preferably it contains a phenolic hydroxyl group or a silicone alcohol group. More preferably, it contains phenolic hydroxyl groups.

[0044] Among the photosensitive compositions of the present invention, it is preferable to be selected from the group consisting of (A) alkali-soluble resin, (B) radically polymerizable compound, (G) cross-linking agent and (H) dissolution accelerator mentioned later. More than one type has a phenolic hydroxyl group, and more preferably (A) the alkali-soluble resin and / or (G) the cross-linking agent has a phenolic hydroxyl group. In this case, it is preferable that the (C) photosensitive agent, (D) colorant, (E) dispersing agent and (F) compound described below do not have a phenolic hydroxyl group.

[0045] <(A) Alkali-soluble resin> The first aspect of the photosensitive composition of the present invention preferably contains (A) an alkali-soluble resin. In the first aspect of the photosensitive composition of the present invention, it is preferred that the compound (I) and / or the compound (IIa) contain (A) an alkali-soluble resin, and it is more preferred that the compound (IIa) contains (A) an alkali-soluble resin. . Still more preferably, the compound (I) and the compound (IIa) contain (A) alkali-soluble resin. On the other hand, the second aspect of the photosensitive composition of the present invention contains (A) an alkali-soluble resin.

[0046] From the viewpoint of suppressing narrow mask errors after development and improving halftone characteristics, the photosensitive composition of the present invention preferably contains (A) an alkali-soluble resin, and the (A) alkali-soluble resin has (WA) Weakly acidic base. (WA) The weakly acidic group preferably contains a phenolic hydroxyl group.

[0047] When the photosensitive composition of the present invention contains (A) an alkali-soluble resin, and (A) an alkali-soluble resin has a (WA) weakly acidic group, from the viewpoint of suppressing narrow mask errors after development and improving halftone characteristics Specifically, it is preferable that the phenolic equivalent in the total solid content of the photosensitive composition of the present invention is 400 to 6,000 g / mol, and (A) the alkali-soluble resin has a phenolic hydroxyl group. When (A) the alkali-soluble resin has a phenolic hydroxyl group, it is preferable that the (C) photosensitive agent, (D) colorant, (E) dispersant and (F) compound described below do not have a phenolic hydroxyl group, and more preferably The (B) radically polymerizable compound and (H) dissolution accelerator described below do not have phenolic hydroxyl groups.

[0048] The photosensitive composition of the present invention preferably contains (A) an alkali-soluble resin, and the (A) alkali-soluble resin has a radical polymerizable group. The photosensitive composition of the present invention is composed of (A) alkali-soluble resins from the viewpoints of improvement in sensitivity during exposure, improvement in reliability of light-emitting elements in display devices, and acceleration of radical polymerization when heated at low temperatures. The radically polymerizable group is preferably at least one selected from the group consisting of a photoreactive group, an alkenyl group having 2 to 5 carbon atoms, and an alkynyl group having 2 to 5 carbon atoms. The photoreactive group is more preferably a (meth)acrylyl group. The alkenyl group having 2 to 5 carbon atoms or the alkynyl group having 2 to 5 carbon atoms is more preferably vinyl group or allyl group. When (A) the alkali-soluble resin has a (meth)acryl group, a vinyl group, or an allyl group, it is preferable that the colorant (D) and (H) a dissolution accelerator described below do not have a (meth)acryl group. group, vinyl or allyl group, and it is more preferable that the (C) photosensitive agent, (E) dispersant and (F) compound mentioned later do not have (meth)acrylyl group, vinyl group or allyl group.

[0049] In the photosensitive composition of the present invention, the sensitivity during exposure is improved, the narrow mask error is suppressed after development, the halftone characteristics are improved, the reliability of the light-emitting element in the display device is improved, and the mechanical properties when heated at low temperature are improved. And from the viewpoint of improving migration resistance, it is preferable that the alkali-soluble resin contains (A) an alkali-soluble resin and (B) a radically polymerizable compound described below, and (A) the alkali-soluble resin contains a resin having a radically polymerizable group and a resin that does not have a radically polymerizable group. Polymer-based resin.

[0050] It is considered that by having the above-mentioned structure, the resin without radically polymerizable groups exerts the ability to suppress post-development residues due to alkali-soluble groups or organic solvent-soluble structures, and capture metal impurities, ionic impurities, etc. Migration inhibition, etc.; on the other hand, resins with radically polymerizable groups play a role in improving sensitivity during exposure and promoting radical polymerization when heated at low temperatures. It is presumed that through the functional separation of this resin, the effect of improving multiple properties becomes significant.

[0051] In the photosensitive composition of the present invention, when the equivalent weight of weakly acidic groups in the total solid content of the photosensitive composition is 400~6,000g / mol, The photosensitive composition of the present invention preferably contains (A) an alkali-soluble resin, (B) a radically polymerizable compound described below, and (C) a photosensitive agent described below, and (A) the alkali-soluble resin contains a radical polymerizable compound. The photosensitive agent (C) contains the photopolymerization initiator (C1) described below for resins with radical polymerizable groups and resins without radically polymerizable groups. The radical polymerizable group contained in (A) the alkali-soluble resin and (B) the radical polymerizable compound is preferably an ethylenically unsaturated double bond group.

[0052] In the photosensitive composition of the present invention, the radical polymerizable group in (A) the alkali-soluble resin and (B) the radical polymerizable compound described below is preferably selected from a photoreactive group and one having 2 to 5 carbon atoms. One or more of the group consisting of alkenyl groups and alkynyl groups having 2 to 5 carbon atoms. The photoreactive group is more preferably a (meth)acrylyl group. The alkenyl group having 2~5 carbon atoms or the alkynyl group having 2~ carbon atoms is more preferably vinyl group or allyl group. When (A) the alkali-soluble resin and (B) the radically polymerizable compound mentioned below have a (meth)acryl group, a vinyl group or an allyl group, it is preferable that the (D) coloring agent and (H) soluble below are The accelerator does not have a (meth)acrylyl group, a vinyl group, or an allyl group, and more preferably, the (C) photosensitive agent, (E) dispersant, and (F) compound described below do not have a (meth)acrylyl group. , vinyl or allyl.

[0053] <(A) Alkali-soluble resin; (A1) resin, (A2) resin and (A3) resin> The photosensitive composition of the present invention preferably contains (A) alkali from the viewpoint of suppressing narrow mask errors after development, improving half-tone characteristics, and improving the reliability of light-emitting elements in display devices. Soluble resin, and (A) alkali-soluble resin contains at least one selected from the group consisting of the following (A1) resin, (A2) resin and (A3) resin; more preferably, it contains (A1) resin and / or ( A3) Resin. Furthermore, from the viewpoint of improvement in mechanical properties and migration resistance when heated at low temperatures, it is preferable to contain the resin (A1). (A1) Resin: has (WA) weakly acidic group, and has one or more structural units selected from the group consisting of amide imine structure, amide structure, ethazole structure and siloxane structure, and does not have Free radical polymerizable resin; (A2) Resin: Resin with free radical polymerizable groups; (A3) Resin: Resin with phenolic hydroxyl group. (A3) The resin is preferably a resin containing a phenolic hydroxyl group and a radically polymerizable group.

[0054] (A1) The resin preferably has at least one structural unit selected from the group consisting of an amide imine structure, an amide structure, an oxazole structure, and a siloxane structure. (A1) The resin preferably has a (WA) weakly acidic group in at least one of the main chain of the resin, the side chains of the resin, and the terminal of the resin. (A3) The resin preferably has a phenolic hydroxyl group in at least one of the main chain of the resin, the side chains of the resin, and the terminal of the resin, and more preferably has a phenolic hydroxyl group in the structural unit of the main chain of the resin. The (A1) resin, the (A3) resin and the following (A2) resin are different resins.

[0055] In addition, among the (A1) resin, (A2) resin and (A3) resin, if each of them has a structure or group constituting other resins, it is classified into any one according to the following rules. When a certain resin may be equivalent to two or more of (A1) resin, (A2) resin, and (A3) resin, determine which resin it corresponds to as follows. That is, having one or more structural units including one or more selected from the group consisting of amide imine structure, amide structure, oxazole structure and siloxane structure (hereinafter referred to as "structural units such as amide imine structure") , and when a resin without radically polymerizable groups has a phenolic hydroxyl group, the resin is regarded as equivalent to resin (A1). In addition, when a resin having a structural unit such as an amide imine structure has a radically polymerizable group and does not have a phenolic hydroxyl group, the resin is considered to be equivalent to the resin (A2). On the other hand, when a resin does not have a structural unit such as an amide imine structure and has a radically polymerizable group and has a phenolic hydroxyl group, the resin is considered to be equivalent to the resin (A3). In addition, when a resin having a structural unit such as an amide imine structure has a radically polymerizable group and further has a phenolic hydroxyl group, the resin is considered to be equivalent to the resin (A2).

[0056] As mentioned above, in the case of a positive photosensitive composition, if the alkali solubility of the exposed part is not improved enough, it is easy to cause a narrow mask error. It is considered that by containing the (A3) resin with phenolic hydroxyl groups, the exposure portion utilizes the alkali dissolution promoting effect of the phenolic hydroxyl groups to suppress residues, and the alkali solubility is still improved even under diffracted light during pattern exposure, thereby suppressing narrow Mask error. Furthermore, it is presumed that the half-tone processability is improved due to the reduction in the amount of developed film that is relaxed in the half-tone exposed area due to the mild acidity of the phenolic hydroxyl group in the unexposed area. Similarly, it is considered that by containing the resin (A1) having one or more structural units selected from the group consisting of a free imine structure, an amide structure, an oxazole structure, and a siloxane structure belonging to a rigid skeleton, The alkali dissolution resistance caused by the rigid skeleton makes it difficult for the exposed part to become excessive in alkali solubility, and the development film used to relax the halftone exposed part is reduced, so the narrow mask error after development is suppressed and the halftone characteristics are improved. Therefore, (A) the alkali-soluble resin preferably contains (A1) resin and / or (A3) resin, and more preferably (A1) resin has a phenolic hydroxyl group.

[0057] On the other hand, in the case of negative photosensitive compositions, narrow mask errors are likely to occur due to the photohardening effect of free radicals generated by diffracted light. It is considered that by containing the (A3) resin having a phenolic hydroxyl group, the unexposed portion utilizes the alkali dissolution-promoting effect of the phenolic hydroxyl group to suppress residues, and the phenolic hydroxyl group stabilizes the free radicals generated by the diffracted light during pattern exposure. ization, while suppressing narrow mask errors. In addition, it is considered that the phenolic hydroxyl group suppresses excessive photohardening of the exposed portion and moderates the slope of the photohardening degree with respect to the exposure amount. In addition, it is estimated that the half-tone processability is improved because the developed film that relaxes the half-tone exposed portion due to the mild acidity of the phenolic hydroxyl group is reduced. Similarly, it is considered that by containing the resin (A1) having one or more structural units selected from the group consisting of a free imine structure, an amide structure, an oxazole structure, and a siloxane structure belonging to a rigid skeleton, The three-dimensional hindrance or molecular motion hindrance caused by the rigid skeleton inhibits excessive photohardening of the exposed area. Furthermore, the alkali dissolution barrier caused by the rigid skeleton suppresses side etching in the deep part of the film during alkali development of the exposed part, and the effect of reducing the developed film by relaxing the half-tone exposed part becomes significant. Therefore, it is considered that the narrow mask error after development can be suppressed and the halftone characteristics can be improved. Therefore, (A) the alkali-soluble resin preferably contains (A1) resin and / or (A3) resin, and more preferably (A1) resin has a phenolic hydroxyl group.

[0058] When the photosensitive composition of the present invention contains (A) alkali-soluble resin, and (A) alkali-soluble resin contains (A1) resin and / or (A3) resin, the photosensitive composition of the present invention is formed after development. From the viewpoints of suppressing narrow mask errors, improving half-tone characteristics, improving the reliability of light-emitting elements in display devices, improving mechanical properties when heated at low temperatures, and improving migration resistance, it is preferable that (A) the alkali-soluble resin contains (A1) Resin, (A1) resin contains a resin selected from the following (A1-1) resin, (A1-2) resin, (A1-3) resin, (A1-4) resin, (A1-5) resin, ( One or more types of the group consisting of A1-6) resin and (A1-7) resin. (A1) Resin more preferably contains a resin selected from the following (A1-1) resin, (A1-2) resin, (A1-3) resin, (A1-4) resin, (A1-5) resin, and (A1 -6) One or more types of resins; more preferably, they contain (A1-1) resin and / or (A1-5) resin. The resin (A1) may be a single resin or any of these copolymers. (A1-1) Resin; polyimide; (A1-2) Resin: polyimide precursor; (A1-3) Resin: polybenzoethazole; (A1-4) Resin: polybenzoethazole precursor; (A1-5) Resin: polyamide imide; (A1-6) Resin: polyamide imine precursor; (A1-7) Resin: polysiloxane.

[0059] The above-mentioned (A1) resin system can obtain a mechanical physical property improvement effect by having a structural unit including an imine structure, an amide structure, an oxazole structure, or a siloxane structure. In addition, it is presumed that these structures suppress ion migration or electron migration and improve migration resistance by trapping metal impurities or ionic impurities that adversely affect electrical insulation.

[0060] In the photosensitive composition of the present invention, the phenolic equivalent in the total solid content is 400 to 6,000 g / mol, and (A) the alkali-soluble resin has a phenolic hydroxyl group, the photosensitive composition of the present invention is preferably ( A) The alkali-soluble resin contains (A1) resin and / or (A3) resin, more preferably contains (A1) resin, and more preferably contains (A1) resin and (A3) resin.

[0061] In the photosensitive composition of the present invention, the phenolic equivalent in the total solid content is 400~6,000g / mol, and (A) the alkali-soluble resin has a phenolic hydroxyl group, the photosensitive composition of the present invention is formed after development From the viewpoints of suppressing narrow mask errors, improving half-tone characteristics, improving the reliability of light-emitting elements in display devices, improving mechanical properties when heated at low temperatures, and improving migration resistance, (A) alkali-soluble resins are preferred Contains (A3) resin, and (A3) resin contains one selected from the group consisting of the following (A3-1) resin, (A3-2) resin, (A3-3) resin and (A3-4) resin above. (A3) Resin more preferably contains (A3-1) resin and / or (A3-3) resin, and more preferably contains (A3-1) resin. (A3) The resin may be a single resin or any of these copolymers. (A3-1) Resin: phenol resin; (A3-2) Resin: polyhydroxystyrene; (A3-3) Resin: epoxy resin containing phenol group; (A3-4) Resin: Acrylic resin containing phenol groups.

[0062] The photosensitive composition of the present invention preferably contains (A) an alkali-soluble resin from the viewpoint of improvement in sensitivity during exposure, improvement in half-tone characteristics, and improvement in reliability of light-emitting elements in a display device. (A) Alkali-soluble resin contains (A2) resin.

[0063] When the photosensitive composition of the present invention contains (A) alkali-soluble resin, and (A) alkali-soluble resin contains (A1) resin and / or (A3) resin, the photosensitive composition of the present invention is determined by the sensitivity at the time of exposure. From the viewpoints of improvement, suppression of narrow mask errors after development, improvement of halftone characteristics, improvement of reliability of light-emitting elements in display devices, improvement of mechanical properties when heated at low temperatures, and improvement of migration resistance, (A ) The alkali-soluble resin further contains (A2) resin. (A) The alkali-soluble resin preferably contains (A1) resin and (A2) resin, and more preferably contains (A1) resin, (A3) resin and (A2) resin.

[0064] (A2) The radically polymerizable group contained in the resin is preferably selected from a photoreactive group, an alkenyl group having 2 to 5 carbon atoms, and an alkenyl group having 2 to 5 carbon atoms, from the viewpoint of improving the sensitivity during exposure. More than one type of group consisting of alkynyl groups. The photoreactive group is preferably a styryl group, a cinnamonyl group, a maleimide group or a (meth)acrylyl group, and more preferably a (meth)acrylyl group. On the other hand, the alkenyl group having 2 to 5 carbon atoms or the alkynyl group having 2 to 5 carbon atoms is preferably vinyl, allyl, 2-methyl-2-propenyl, crotonyl, 2-methyl- 2-butenyl, 3-methyl-2-butenyl, 2,3-dimethyl-2-butenyl, ethynyl or 2-propynyl, preferably vinyl or allyl.

[0065] (A2) The resin preferably contains a resin selected from the group consisting of (A2-a) from the viewpoint of suppressing narrow mask errors after development, improving half-tone characteristics, and improving the reliability of light-emitting elements in display devices. Resin, (A2-b) resin, (A2-c) resin, (A2-d) resin, (A2-e) resin, (A2-f) resin, (A2-g) resin, (A2-1) resin , (A2-2) resin, and (A2-3) resin. (A2) Resin more preferably contains a resin selected from (A2-a) resin, (A2-b) resin, (A2-c) resin, (A2-d) resin, (A2-e) resin, (A2-f) Resin, (A2-g) resin is one or more of the group consisting of resin, and more preferably contains resin selected from (A2-a) resin, (A2-b) resin, (A2-c) resin, (A2-d) One or more of the group consisting of resin, (A2-e) resin, and (A2-f) resin; particularly preferably, it contains (A2-a) resin and / or (A2-e) resin. On the other hand, from the viewpoint of improving sensitivity during exposure and improving halftone characteristics, (A2) resin preferably contains a resin selected from the group consisting of (A2-1) resin, (A2-2) resin, and (A2-3). ) is one or more of the group consisting of resins, and more preferably contains (A2-1) resin and / or (A2-2) resin. In addition, (A2) resin is also preferred from the viewpoints of improved sensitivity during exposure, suppression of narrow mask errors after development, improved halftone characteristics, and improved reliability of light-emitting elements in display devices. Contains a resin selected from (A2-a) resin, (A2-b) resin, (A2-c) resin, (A2-d) resin, (A2-e) resin, (A2-f) resin and (A2-g) One or more types of resins, and further contains one or more types selected from the group consisting of (A2-1) resin, (A2-2) resin, and (A2-3) resin. The resin (A2) may be a single resin or any of these copolymers. (A2-a) Resin: polyimide containing unsaturated groups; (A2-b) Resin: polyimide precursor containing unsaturated groups; (A2-c) Resin: polybenzoethazole containing unsaturated groups; (A2-d) Resin: polybenzoethazole precursor containing unsaturated groups; (A2-e) Resin: polyamide imine containing unsaturated groups; (A2-f) Resin: polyamide imine precursor containing unsaturated groups; (A2-g) Resin: polysiloxane containing unsaturated groups; (A2-1) Resin: resin containing polycyclic side chains; (A2-2) Resin: acid modified epoxy resin; (A2-3) Resin: acrylic resin.

[0066] <(A) Alkali-soluble resin; (A3a) resin and (A3b) resin> The photosensitive composition of the present invention preferably contains the following resin (A3b) as the (A) alkali-soluble resin from the viewpoint of improvement in sensitivity during exposure and improvement in halftone characteristics. (A3b) Resin: Among (A3) resins, resins having phenolic hydroxyl groups and radically polymerizable groups.

[0067] (A3b) The resin preferably has a phenolic hydroxyl group in at least one of the main chain of the resin, the side chains of the resin, and the terminal of the resin, and has free radical polymerization in at least one of the side chains of the resin and the terminal of the resin. Sex base. Moreover, (A3b) resin is a resin different from (A1) resin and (A2) resin.

[0068] (A3b) The radically polymerizable group contained in the resin is preferably selected from a photoreactive group, an alkenyl group having 2 to 5 carbon atoms, and an alkenyl group having 2 to 5 carbon atoms, from the viewpoint of improving the sensitivity during exposure. More than one type of group composed of alkynyl groups. The photoreactive group is preferably a styryl group, a cinnamonyl group, a maleimide group or a (meth)acrylyl group, and more preferably a (meth)acrylyl group. On the other hand, the alkenyl group having 2 to 5 carbon atoms or the alkynyl group having 2 to 5 carbon atoms is preferably vinyl, allyl, 2-methyl-2-propenyl, crotonyl, 2-methyl- 2-butenyl, 3-methyl-2-butenyl, 2,3-dimethyl-2-butenyl, ethynyl or 2-propynyl, preferably vinyl or allyl.

[0069] (A3b) The double bond equivalent of the resin is preferably 500 g / mol or more, more preferably 700 g / mol or more, and still more preferably 1,000 from the viewpoint of suppressing narrow mask errors after development and improving halftone characteristics. g / mol or more. On the other hand, the double bond equivalent is preferably 3,000 g / mol or less, and more preferably 2,000 g / mol or less, from the viewpoint of improving sensitivity during exposure and improving the reliability of the light-emitting element in the display device. , and more preferably below 1,500g / mol.

[0070] The photosensitive composition of the present invention preferably contains the following resin (A3a) as the (A) alkali-soluble resin from the viewpoint of suppressing narrow mask errors after development and improving halftone characteristics. (A3a) Resin: Among the (A3) resins, it is a resin that has a phenolic hydroxyl group and does not have a radically polymerizable group.

[0071] (A3a) The resin preferably has a phenolic hydroxyl group in at least one of the main chain of the resin, the side chains of the resin, and the terminal of the resin. Moreover, (A3a) resin is a resin different from (A1) resin and (A2) resin.

[0072] The photosensitive composition of the present invention is preferred from the viewpoints of improvement in sensitivity during exposure, suppression of narrow mask errors after development, improvement in half-tone characteristics, and improvement in reliability of light-emitting elements in display devices. The (A) alkali-soluble resin contains the (A3b) resin, and the (A) alkali-soluble resin further contains the (A3a) resin.

[0073] <Alkali-soluble base> The resin (A1) and the resin (A2) have an acidic group as an alkali-soluble group in at least one of the main chain of the resin, the side chain of the resin, and the terminal of the resin. (A1) The resin system has (WA) a weakly acidic group as an acidic group. Furthermore, among the (A2) resins, the (A2) resin having structural units such as the above-described amide imide structure is preferably one that has (WA) from the viewpoint of suppressing narrow mask errors after development and improving halftone characteristics. Weakly acidic groups serve as acidic groups. On the other hand, the resin (A1) and the resin (A2) preferably have a carboxyl group, a carboxylic anhydride group or a sulfonic acid group as an acidic group, and more preferably have a carboxyl group or a carboxylic anhydride group from the viewpoint of suppressing residue after development. base. It is also preferable that the resin (A1) and the resin (A2) have (WA) a weakly acidic group as an acidic group, and further have a carboxyl group, a carboxylic acid anhydride group or a sulfonic acid group. Moreover, it is also preferable that (A1) resin and (A2) resin are alkali-soluble resins, and it is also preferable that they are organic solvent-soluble resins. The so-called alkali-soluble resin refers to a resin that is soluble in an alkali developer. Organic solvent-soluble resin refers to a resin that has solubility in organic solvent developers.

[0074] (A1) The acid equivalent of the resin is preferably 200 g / mol or more, more preferably 250 g / mol or more, and still more preferably from the viewpoint of improvement in sensitivity during exposure and improvement in reliability of the light-emitting element in the display device. It is above 300g / mol. On the other hand, the acid equivalent is preferably 600 g / mol or less, more preferably 500 g / mol or less, and from the viewpoints of residue suppression after development, narrow mask error suppression after development, and improvement of halftone characteristics. More preferably, it is 450g / mol or less. Furthermore, it is more preferable that the weakly acidic group equivalent of the resin (A1) is within a specific range, and more preferably the phenol equivalent, hydroxyimide equivalent, hydroxyamide equivalent, or silicon alcohol equivalent of the resin (A1) is within a specific range, and more preferably The phenolic equivalent or silicon alcohol equivalent of the best series (A1) resin is within a specific range, and the phenol equivalent of the particularly good series (A1) resin is within a specific range. In addition, the specific range of the weakly acidic group equivalent, the phenol equivalent, the hydroxyamide equivalent, the hydroxyamide equivalent, or the silicon alcohol equivalent is the same as the above-mentioned preferable range of the acid equivalent.

[0075] (A2) The acid equivalent of the resin is preferably 300 g / mol or more, more preferably 350 g / mol or more, and still more preferably from the viewpoint of improvement in sensitivity during exposure and improvement in reliability of the light-emitting element in the display device. It is above 400g / mol. On the other hand, the acid equivalent is preferably 700 g / mol or less, more preferably 600 g / mol or less, from the viewpoints of residue suppression after development, narrow mask error suppression after development, and improvement of halftone characteristics. More preferably, it is 550g / mol or less. Furthermore, it is more preferable that the weakly acidic group equivalent of the resin (A2) is within a specific range, and more preferably the phenol equivalent, hydroxyimide equivalent, hydroxyamide equivalent, or silicon alcohol equivalent of the resin (A2) is within a specific range. The phenolic equivalent or silicon alcohol equivalent of the best series (A2) resin is within a specific range, and the phenol equivalent of the particularly good series (A2) resin is within a specific range. In addition, the specific range of the weakly acidic group equivalent, the phenol equivalent, the hydroxyamide equivalent, the hydroxyamide equivalent, or the silicon alcohol equivalent is the same as the above-mentioned preferable range of the acid equivalent.

[0076] (A3) The resin system has a phenolic hydroxyl group. (A3) The resin preferably has at least one of a structural unit having a phenolic hydroxyl group and a terminal structure having a phenolic hydroxyl group. In addition, from the viewpoint of suppressing narrow mask errors after development and improving halftone characteristics, the resin (A3) preferably further has a hydroxyamide group, a hydroxyamide group, a silanol group, and 1,1 -Bis(trifluoromethyl)hydroxymethyl or mercapto. On the other hand, from the viewpoint of suppressing residue after development, the resin (A3) preferably further has a carboxyl group, a carboxylic anhydride group or a sulfonic acid group, and more preferably has a carboxyl group or a carboxylic anhydride group.

[0077] (A3) The acid equivalent of the resin is preferably 70 g / mol or more, more preferably 80 g / mol or more, and still more preferably from the viewpoint of improvement in sensitivity during exposure and improvement in reliability of the light-emitting element in the display device. It is above 90g / mol. On the other hand, the acid equivalent is preferably 450 g / mol or less, more preferably 350 g / mol or less, from the viewpoint of residue suppression after development, narrow mask error suppression after development, and improvement of halftone characteristics. More preferably, it is 300g / mol or less. Furthermore, it is preferable that the weakly acidic group equivalent of the resin (A3) is within a specific range, and it is more preferable that the phenolic equivalent of the resin (A3) is within a specific range. The preferable specific range of the weakly acidic group equivalent or the phenol equivalent is the same as the preferable range of the above-mentioned acid equivalent.

[0078] <(A) Alkali-soluble resin; polyimide and polyimide precursor> The integration of (A1-1) resin and (A2-a) resin belonging to polyimide will be described below. Similarly, the integration of (A1-2) resin and (A2-b) resin which are polyimide precursors will be described. Examples of the polyimide precursor include resins obtained by reacting tetracarboxylic acid or a corresponding tetracarboxylic dianhydride with a diamine or a diisocyanate compound. Furthermore, other examples of the polyamide precursor include polyamide acid, polyamide ester, polyamide acid amide, or polyisoamide imide. Examples of polyimide include resins obtained by subjecting a polyimide precursor to dehydration and ring-closure by heating or reaction using a catalyst. Polyamide and polyamide precursors can also be resins that are copolymers with polyamide obtained by further using dicarboxylic acids or corresponding dicarboxylic acid active diesters in the reaction of synthetic resins. .

[0079] From the viewpoint of suppressing narrow mask errors after development and improving halftone characteristics, polyimide preferably has a structural unit represented by general formula (1). The content ratio of the structural units represented by the general formula (1) in the polyimide is preferably 50 to 100 mol%, more preferably 60 to 100 mol%, and still more preferably 70 to 100 mol%. .

[0080] From the viewpoint of suppressing narrow mask errors after development and improving halftone characteristics, the polyimide precursor preferably has a structural unit represented by general formula (3). The content ratio of the structural units represented by general formula (3) among the total structural units in the polyimide precursor is preferably 50~100 mol%, more preferably 60~100 mol%, and still more preferably 70~ 100mol%.

[0081] [Chemicalization 2]

[0082] In the general formula (1) and the general formula (3), R 1 and R 9 respectively independently represent an organic group with 4 to 10 valences. R 2 and R 10 respectively independently represent an organic group with a valence of 2 to 10. R 3, R 4 and R 13 respectively independently represent a phenolic hydroxyl group, a sulfonic acid group, a mercapto group or a substituent represented by general formula (7) or general formula (8). R 11 represents a substituent represented by general formula (7) or general formula (8). R 12 represents a phenolic hydroxyl group, a sulfonic acid group, or a mercapto group. p represents an integer from 0 to 6. q represents an integer from 0 to 8. t represents an integer from 2 to 8, u represents an integer from 0 to 6, 2≦t+u≦8. v represents an integer from 0 to 8. When R 3 or R 4 represents a phenolic hydroxyl group, the structure in R 1 or the structure in R 2 bonded to the phenolic hydroxyl group represents an aromatic structure. When R 12 or R 13 represents a phenolic hydroxyl group, the structure in R 9 or the structure in R 10 bonded to the phenolic hydroxyl group represents an aromatic structure.

[0083] In the general formula (1) and the general formula (3), it is preferred that R 1, R 9, R 2 and R 10 independently have an aliphatic structure with a carbon number of 2 to 20 and an alicyclic structure with a carbon number of 4 to 20. , or aromatic structure with 6 to 30 carbon atoms. q is preferably an integer from 1 to 8. v is preferably an integer from 1 to 8. R 1 and R 9 each independently represent an acid monomer residue. R 2 and R 10 each independently represent an amine monomer residue. The above-mentioned aliphatic structure, alicyclic structure and aromatic structure may have heteroatoms, and may be either unsubstituted or substituted.

[0084] [Chemical 3]

[0085] In general formula (7) and general formula (8), R 28 ~ R 30 independently represent a hydrogen atom, an alkyl group with 1 to 10 carbon atoms, a acyl group with 2 to 6 carbon atoms, or an aryl group with 6 to 15 carbon atoms. . In the general formula (7) and the general formula (8), R 28 to R 30 are each independently preferably a hydrogen atom, an alkyl group with 1 to 6 carbon atoms, a hydroxyl group with 2 to 4 carbon atoms, or a hydroxyl group with 6 to 10 carbon atoms. Aryl. The above-mentioned alkyl group, acyl group and aryl group may have heteroatoms, and may be unsubstituted or substituted.

[0086] As a polyimide precursor, when R 11 in the structural unit represented by the general formula (3) is a substituent represented by the general formula (7), the structural unit in which R 28 is a hydrogen atom is called a amide structure. unit. When R 11 in the structural unit represented by the general formula (3) is a substituent represented by the general formula (7), R 28 is an alkyl group with 1 to 10 carbon atoms, a hydroxyl group with 2 to 6 carbon atoms, or a carbon number The structural unit of aryl groups of 6 to 15 is called acylamine ester structural unit. The structural unit when R 11 in the structural unit represented by the general formula (3) is a substituent represented by the general formula (8) is called the amide amide structural unit. From the viewpoint of suppressing narrow mask errors after development and improving halftone characteristics, the polyimide precursor preferably has a amide ester structural unit and / or a amide amide structural unit. Examples of the polyimide precursor having a amide ester structural unit and / or a amide amide structural unit include tetracarboxylic acid residues and / or some carboxyl groups belonging to tetracarboxylic acid derivative residues. Resin obtained by esterification and / or acylation. Moreover, the polyamide imine precursor may have a amide imine closed ring structural unit in which a part of a amide acid structural unit, a amide ester structural unit, or a amide acid amide structural unit is closed with a amide imine. The proportion of amide ester structural units and amide acid amide in the total content ratio of amide acid structural units, amide ester structural units, amide acid amide structural units, and amide imine closed-ring structural units. The total content ratio of structural units is preferably 10 mol% or more, more preferably 30 mol% or more, and still more preferably 50 mol% or more, from the viewpoint of suppressing narrow mask errors after development and improving halftone characteristics. On the other hand, the total content ratio of the amide ester structural unit and the amide amide structural unit is preferably 100 mol% or more, more preferably 90 mol% or more, and more preferably 100 mol% or more from the viewpoint of suppressing residue after development. More preferably, it is 80 mol% or more.

[0087] <(A) Alkali-soluble resin; polybenzoconazole precursor, and polybenzoconazole> The following describes the integration of the (A1-3) resin and (A2-c) resin belonging to polybenzoethazole. Similarly, the integration of (A1-4) resin and (A2-d) resin, which are polybenzoconazole precursors, will be described. Examples of the polybenzoethazole precursor include a resin obtained by reacting a dicarboxylic acid or a corresponding dicarboxylic acid active diester with a bisaminophenol compound as a diamine. Moreover, as another example of a polybenzoethazole precursor, polyhydroxyamide is mentioned, for example. Examples of polybenzoethazole include resins obtained by subjecting a polybenzoethazole precursor to dehydration and ring-closure by heating or reaction using a catalyst. Polybenzoconazole and polybenzoconazole precursors may also be resins that are copolymers with polyamide obtained by further using diamines or diisocyanate compounds in the reaction of synthetic resins.

[0088] From the viewpoint of suppressing narrow mask errors after development and improving halftone characteristics, the polybenzoconazole preferably has a structural unit represented by the general formula (2). The content ratio of the structural units represented by the general formula (2) among the total structural units in polybenzoethazole is preferably 50 to 100 mol%, more preferably 60 to 100 mol%, and still more preferably 70 to 70 mol%. 100mol%.

[0089] From the viewpoint of suppressing narrow mask errors after development and improving halftone characteristics, the polybenzoethazole precursor preferably has a structural unit represented by general formula (4). Among the total structural units in the polybenzoethazole precursor, the content ratio of the structural units represented by the general formula (4) is preferably 50 to 100 mol%, more preferably 60 to 100 mol%, and still more preferably 70~100mol%.

[0090] [Chemical 4]

[0091] In the general formula (2) and the general formula (4), R 5 and R 14 respectively independently represent an organic group with 2 to 10 valences. R 6 and R 15 each independently represent a 4 to 10 valent organic group having an aromatic structure. R 7, R 8 and R 16 each independently represent a phenolic hydroxyl group, a sulfonic acid group, a mercapto group or a substituent represented by the above general formula (7) or general formula (8). R 17 represents a phenolic hydroxyl group. R 18 represents a sulfonic acid group, a mercapto group, or a substituent represented by the above general formula (7) or general formula (8). r represents an integer from 0 to 8. s represents an integer from 0 to 6. w represents an integer from 0 to 8. x represents an integer from 2 to 8, y represents an integer from 0 to 6, 2≦x+y≦8. When R 7 or R 8 represents a phenolic hydroxyl group, the structure in R 5 or the structure in R 6 bonded to the phenolic hydroxyl group represents an aromatic structure. Furthermore, when R 16 represents a phenolic hydroxyl group, the structure in R 14 bonded to the phenolic hydroxyl group represents an aromatic structure. In addition, the structure in R 15 bonded to R 17 represents an aromatic structure.

[0092] In the general formula (2) and the general formula (4), it is preferred that R 5, R 14, R 6 and R 15 independently have an aliphatic structure with a carbon number of 2 to 20 and an alicyclic structure with a carbon number of 4 to 20. , or aromatic structure with 6 to 30 carbon atoms. s is preferably an integer from 1 to 6. R 5 and R 14 each independently represent an acid monomer residue. R 6 and R 15 each independently represent an amine monomer residue. The above-mentioned aliphatic structure, alicyclic structure and aromatic structure may have heteroatoms, and may be either unsubstituted or substituted.

[0093] <(A) Alkali-soluble resin; polyamide imine and polyamide imine precursor> The following describes the integration of (A1-5) resin, (A1-6) resin, (A2-e) resin and (A2-f) resin which are polyamide imine or polyamide imine precursors. Examples of the polyamide imine precursor include resins obtained by reacting tricarboxylic acid or a corresponding tricarboxylic acid anhydride with a diamine or a diisocyanate compound. Examples of the polyamide imine include a resin obtained by subjecting a polyamide imine precursor to dehydration and ring-closure by heating or reaction using a catalyst. Polyamide imine and polyamide imine precursor can also be obtained by further using dicarboxylic acid or the corresponding dicarboxylic acid active diester in the reaction of synthetic resin, and are related to polyamide. Copolymer resin.

[0094] From the viewpoint of suppressing narrow mask errors after development and improving halftone characteristics, the polyamideimide preferably has a structural unit represented by general formula (5). The content ratio of the structural units represented by the general formula (5) among the total structural units in the polyamide imine is preferably 50 to 100 mol%, more preferably 60 to 100 mol%, and still more preferably 70 to 100mol%.

[0095] From the viewpoint of suppressing narrow mask errors after development and improving halftone characteristics, the polyamide imine precursor preferably has a structural unit represented by general formula (6). The content ratio of the structural units represented by the general formula (6) among the total structural units in the polyamide imine precursor is preferably 50 to 100 mol%, more preferably 60 to 100 mol%, and still more preferably It is 70~100mol%.

[0096] [Chemistry 5]

[0097] In the general formula (5) and the general formula (6), R 19 and R 23 respectively independently represent an organic group with 3 to 10 valences. R 20 and R 24 respectively independently represent an organic group with 2 to 10 valences. R 21, R 22 and R 27 each independently represent a phenolic hydroxyl group, a sulfonic acid group, a mercapto group or a substituent represented by the above general formula (7) or general formula (8). R 25 represents a substituent represented by general formula (7) or general formula (8). R 26 represents a phenolic hydroxyl group, a sulfonic acid group, or a mercapto group. m represents an integer from 0 to 7. n represents an integer from 0 to 8. a represents an integer from 0 to 7. b represents an integer from 0 to 8. When R 21 or R 22 represents a phenolic hydroxyl group, the structure in R 19 or R 20 bonded to the phenolic hydroxyl group represents an aromatic structure. When R 26 or R 27 represents a phenolic hydroxyl group, the structure in R 23 or R 24 bonded to the phenolic hydroxyl group represents an aromatic structure.

[0098] In the general formula (5) and the general formula (6), it is preferred that R 19, R 23, R 20 and R 24 independently have an aliphatic structure with a carbon number of 2 to 20 and an alicyclic structure with a carbon number of 4 to 20. , or aromatic structure with 6 to 30 carbon atoms. n is preferably an integer from 1 to 8. b is preferably an integer from 1 to 8. R 19 and R 23 each independently represent an acid monomer residue. R 20 and R 24 each independently represent an amine monomer residue. The above-mentioned aliphatic structure, alicyclic structure and aromatic structure may have heteroatoms, and may be either unsubstituted or substituted.

[0099] <Structural unit with fluorine atoms> Polyimide, polyimide precursor, polybenzoethazole, polybenzoethazole precursor, polyimide imine and polyimide imine precursor (hereinafter referred to as "polyimide" "Resin") is preferably a structural unit having fluorine atoms from the viewpoint of sensitivity improvement during exposure, narrow mask error suppression after development, and improvement in halftone characteristics. The term "exposure" here refers to the irradiation of active chemical rays (radiation), and examples thereof include irradiation of visible rays, ultraviolet rays, electron beams, or X-rays. Hereinafter, the so-called exposure refers to the irradiation of active chemical rays (radiation rays).

[0100] Among polyimide-based resins, among the total structural units of various resins, there are fluorine atoms in the structural units derived from carboxylic acid or structural units derived from carboxylic acid derivatives, and in the structural units derived from amines Or when there is a fluorine atom in the structural unit derived from an amine derivative, the total content ratio of the structural unit having a fluorine atom in the total structural units of various resins is preferably 10 to 100 mol%, more preferably It is 30~100mol%, and more preferably, it is 50~100mol%. In addition, the so-called structural units derived from carboxylic acid or structural units derived from carboxylic acid derivatives include structural units derived from tetracarboxylic acid or the corresponding tetracarboxylic dianhydride, and structural units derived from dicarboxylic acid or the corresponding two Structural units derived from active diesters of carboxylic acids, or structural units derived from tricarboxylic acids or corresponding tricarboxylic anhydrides. In addition, the so-called structural units derived from amines or structural units derived from amine derivatives include structural units derived from diamines, structural units derived from diisocyanate compounds, or structural units derived from bisaminophenol compounds. wait.

[0101] Furthermore, among the total structural units of various resins, if there is a fluorine atom only in the structural unit derived from carboxylic acid or the structural unit derived from carboxylic acid derivatives, all structural units derived from carboxylic acid or all structural units derived from carboxylic acid derivatives shall The total content ratio of the structural units having fluorine atoms in the total structural units derived from the carboxylic acid derivative is preferably 10 to 100 mol%, more preferably 30 to 100 mol%, and still more preferably 50 to 100 mol%. %.

[0102] On the other hand, among the total structural units of various resins, when there are fluorine atoms only in the structural units derived from amines or structural units derived from amine derivatives, all structural units derived from amines or all structural units derived from amines The total content ratio of structural units having fluorine atoms among the total structural units derived from the derivative is preferably 10 to 100 mol%, more preferably 30 to 100 mol%, and still more preferably 50 to 100 mol%.

[0103] <Alkali-soluble base> The polyimide-based resin has an acidic group as an alkali-soluble group in at least one of the main chain of the resin, the side chains of the resin, and the terminal end of the resin. These resins preferably have a structural unit having an acidic group such as a structural unit derived from a carboxylic acid having an acidic group or a structural unit derived from a diamine having an acidic group, or a terminal structure having an acidic group. Furthermore, it is also preferable to use a resin obtained by reacting a part of the hydroxyl groups of various resins with a polyfunctional carboxylic dianhydride. It is also preferable to tie it to the main chain of various resins, the side chains of the resin, and the terminals of the resin. At least one of the resins has an acidic group introduced through a reaction using a catalyst.

[0104] <Radically polymerizable radical> (A2-a) resin, (A2-b) resin, (A2-c) resin, (A2-d) resin, (A2-e) resin and (A2-f) resin (hereinafter referred to as "Polyimide-based (A2) resin") has radically polymerizable groups. These (A2) resins are preferably selected from (A1-1) resin, (A1-2) resin, (A1-3) resin, (A1-4) resin, (A1-5) resin and (A1-6) Among the resins (hereinafter referred to as "polyimide-based (A1) resin"), a resin obtained by reacting a compound having a radically polymerizable group such as a part of the acidic groups possessed by various resins. Furthermore, a resin in which a radical polymerizable group is introduced into at least one of the side chains of various resins and the terminals of the resin through a reaction using a catalyst is also preferred. The compound having a radically polymerizable group is preferably an electrophilic compound having a radically polymerizable group. The compound having a radically polymerizable group is preferably an isocyanate compound, an epoxy compound, an aldehyde compound, a ketone compound, an acetic acid compound, a carboxylic acid compound, or a carboxylic acid derivative, from the viewpoint of reactivity and compound availability. Halogenated alkyl compound, azide alkyl compound, sulfonate alkyl ester compound, cyanated alkyl compound, or alcohol compound. It is also preferred that these compounds have urea linkages or urethane linkages.

[0105] Examples of the alcohol compound having a radically polymerizable group include 2-hydroxyethyl (meth)acrylate, 4-hydroxybutyl (meth)acrylate, 4-hydroxyhexyl (meth)acrylate, and di(meth)acrylate. Glyceryl acrylate, trimethylolpropane di(meth)acrylate, di(trimethylol)propane tri(meth)acrylate, neopentylerythritol tri(meth)acrylate, dineopentyl Tetraol penta(meth)acrylate, or trineopenterythritol hepta(meth)acrylate.

[0106] The polyimide resin (A2) is preferably a radically polymerizable group selected from any one of the general formulas (51), (52), (53), (54) and (55). More than one kind of group.

[0107] [Chemical 6]

[0108] In the general formulas (51) to (55), X 21 to . X 25 represents an organic radical with 2 to 6 valences. X 26 represents direct bonding or organic groups with 2~6 valence. R 231 to R 252 each independently represent a hydrogen atom, an alkyl group having 1 to 10 carbon atoms, or an aryl group having 6 to 15 carbon atoms. a, b, c, d and e independently represent 0 or 1. f and g independently represent integers from 1 to 5.

[0109] In the general formulas (51) to (55), X 25 is preferably a 2 to 6-valent aliphatic group, more preferably a 2 to 6-valent alkyl alkylene group with 1 to 10 carbon atoms. X 26 is preferably a direct bond or a 2 to 6-valent aliphatic group, more preferably a 2 to 6-valent alkyl alkylene group with 1 to 10 carbon atoms. The above-mentioned alkyl group, aryl group, alkylene group, cycloalkyl group and aryl group may have heteroatoms, and may be unsubstituted or substituted.

[0110] The double bond equivalent of the above-mentioned polyimide-based (A2) resin is preferably 200g / mol or more, and more preferably 400g / mol from the viewpoint of suppressing narrow mask errors after development and improving halftone characteristics. More preferably, it is 500g / mol or more, still more preferably 700g / mol or more, and particularly preferably 1,000g / mol or more. On the other hand, the amount of double bonds is preferably 3,000 g / mol or less, more preferably 2,000 g / mol or less, from the viewpoint of improving the sensitivity during exposure and improving the reliability of the light-emitting element in the display device. More preferably, it is 1,500g / mol or less.

[0111] <Other structural units, blocking agents and molecular weight> From the perspective of improving the reliability of the light-emitting element in the display device, the structural unit of the polyimide-based resin is preferably a structural unit derived from an aromatic carboxylic acid or an aromatic diamine. Structural units such as structural units having aromatic groups. Furthermore, from the viewpoint of reducing the drawing of the pattern shape, structural units having a silicon group or siloxane bond, such as structural units derived from polysiloxydiamine, or oxyalkylenediamine are preferred. Derived structural units such as structural units having an oxyalkylene skeleton. Furthermore, it is preferable to have a structure in which the ends of the resin are capped with a capping agent such as monoamine or dicarboxylic anhydride.

[0112] The weight average molecular weight (hereinafter referred to as "Mw") of polyimide-based resin is determined by gel permeation chromatography (hereinafter referred to as "GPC") from the viewpoint of improving the reliability of light-emitting elements in display devices. ") measured in terms of polystyrene conversion, it is preferably 1,000 or more, more preferably 3,000 or more, and still more preferably 5,000 or more. On the other hand, Mw is preferably 100,000 or less, more preferably 50,000 or less, still more preferably 30,000 or less, and particularly preferably 20,000 or less, from the viewpoint of suppressing residue after development and reducing pattern shape pull-out. . Polyimide-based resins can be synthesized according to known methods. Examples of tetracarboxylic acids, tricarboxylic acids, dicarboxylic acids and their derivatives used in the synthesis of various resins, as well as diamines, diaminophenol compounds, monoamines and their derivatives, include Compounds described in International Patent Publication No. 2017 / 057281 or International Patent Publication No. 2017 / 159876.

[0113] <(A) Alkali-soluble resin; polysiloxane> The integration of (A1-7) resin and (A2-g) resin belonging to polysiloxane will be described below. Examples of the polysiloxane include those obtained by hydrolyzing one or more types selected from the group consisting of trifunctional organosilane, tetrafunctional organosilane, difunctional organosilane, and monofunctional organosilane, followed by dehydration condensation. resin.

[0114] From the viewpoint of suppressing narrow mask errors after development, improving half-tone characteristics, and improving reliability of light-emitting elements in display devices, polysiloxane is preferably one having the general formula (9) Trifunctional organosilane units and / or tetrafunctional organosilane units represented by general formula (10).

[0115] [Chemical 7]

[0116] In general formula (9), R 41 represents a hydrogen atom or a monovalent organic group. In general formula (9) and general formula (10), ✽ 1 ~ ✽ 3 independently represent the bonding points in the resin. In the general formula (9), R 41 is preferably a hydrogen atom, an alkyl group with 1 to 10 carbon atoms, a cycloalkyl group with 4 to 10 carbon atoms, an aryl group with 6 to 15 carbon atoms, or a halogenated group with 1 to 10 carbon atoms. Alkyl group, halogenated cycloalkyl group with 4 to 10 carbon atoms, or halogenated aryl group with 6 to 15 carbon atoms. The above-mentioned alkyl group, cycloalkyl group, aryl group, halogenated alkyl group, halogenated cycloalkyl group and halogenated aryl group may have heteroatoms, and may be unsubstituted or substituted.

[0117] The content ratio of the trifunctional organosilane unit represented by the general formula (9) in the polysiloxane is preferably 50 to 100 mol%, more preferably 60 to 100 mol%, and still more preferably 70 in terms of Si atom molar ratio. ~100mol%. From the viewpoint of suppressing residue after development, the trifunctional organosilane unit is preferably an organosilane unit having an epoxy group.

[0118] The content ratio of the tetrafunctional organosilane unit represented by the general formula (10) in the polysiloxane is preferably 1 mol% or more in terms of Si atom molar ratio, and more preferably 5 mol% or more, more preferably 10 mol% or more. On the other hand, the content ratio of the tetrafunctional organosilane unit represented by the general formula (10) is preferably 40 mol% or less and more preferably 30 mol% in terms of Si atom molar ratio from the viewpoint of reducing the pattern shape. below, and more preferably below 20 mol%.

[0119] <Alkali-soluble base> Polysiloxane has an acidic group as an alkali-soluble group in at least one of the main chain of the resin, the side chain of the resin, and the terminal of the resin. Polysiloxane is preferably a resin having an organosilane unit with an acidic group. Furthermore, it is preferably a resin obtained by reacting a part of the hydroxyl groups of the resin with a polyfunctional carboxylic dianhydride. It is also preferred that at least one of the main chain of the resin, the side chain of the resin and the terminal of the resin is modified. It is a resin that introduces acidic groups through a reaction using a catalyst.

[0120] <Radically polymerizable radical> The resin (A2-g) belonging to the resin (A2) has a radically polymerizable group. The resin (A2-g) is preferably a resin having an organosilane unit having a radically polymerizable group. Furthermore, it is preferable that the resin is obtained by reacting a compound having a radically polymerizable group such as a part of the acidic groups of the resin, and it is also preferable that the resin is bonded to at least one of the side chain of the resin and the terminal of the resin. A resin in which radically polymerizable groups are introduced through a reaction using a catalyst. The double bond equivalent of the (A2-g) resin is preferably 500g / mol or more, more preferably 700g / mol or more, and still more preferably from the viewpoint of suppressing narrow mask errors after development and improving halftone characteristics. It is above 1,000g / mol. On the other hand, from the viewpoint of improving the sensitivity during exposure and improving the reliability of the light-emitting element in the display device, the double bond equivalent is preferably 3,000 g / mol or less, more preferably 2,000 g / mol or less, and More preferably, it is 1,500g / mol or less.

[0121] <Other structural units, and molecular weight> The structural unit of polysiloxane is preferably a difunctional organosilane unit or a monofunctional organosilane unit from the viewpoint of low extraction of pattern shape. Furthermore, from the viewpoint of improving the reliability of the light-emitting element in the display device, an organosilane unit having an aromatic group is preferred. Each organosilane unit may be arranged regularly or irregularly. Examples of the regular arrangement include alternating copolymerization, periodic copolymerization, block copolymerization, or graft copolymerization. Examples of the irregular arrangement include random copolymerization and the like. In addition, each organosilane unit may be arranged in either a two-dimensional arrangement or a three-dimensional arrangement. Examples of the two-dimensional arrangement include linear ones. Examples of the three-dimensional arrangement include ladder-like, cage-like, mesh-like, and the like.

[0122] From the viewpoint of improving the reliability of the light-emitting element in the display device, the Mw of the polysiloxane is preferably 500 or more and more preferably 1,000 or more in terms of polystyrene conversion measured by GPC. On the other hand, Mw is preferably 50,000 or less, and more preferably 10,000 or less, from the viewpoint of suppressing residue after development and reducing the pull-out of the pattern shape. Polysiloxane can be synthesized according to known methods. Examples of organosilanes include compounds described in International Patent Publication No. 2017 / 057281 or International Patent Publication No. 2017 / 159876.

[0123] <(A) Alkali-soluble resin; resin containing polycyclic side chains> The following describes resin (A2-1), which is a polycyclic side chain-containing resin. Examples of resins containing polycyclic side chains include resins obtained by the following (1-a2-1) to (6-a2-1). If necessary, the polyfunctional alcohol compound may be further reacted in any reaction stage. (1-a2-1) A resin obtained by reacting an epoxy compound with a compound obtained by reacting a polyfunctional phenol compound and a polyfunctional carboxylic dianhydride. (2-a2-1) A resin obtained by reacting a polyfunctional carboxylic dianhydride with a compound obtained by reacting a polyfunctional phenol compound and an epoxy compound. (3-a2-1) A resin obtained by reacting an epoxy compound with a compound obtained by reacting a polyfunctional alcohol compound containing a cyclic skeleton with a polyfunctional carboxylic dianhydride. (4-a2-1) A resin obtained by reacting a polyfunctional carboxylic dianhydride with a compound obtained by reacting a polyfunctional alcohol compound containing a cyclic skeleton and an epoxy compound. (5-a2-1) A resin obtained by reacting an epoxy compound with a compound obtained by reacting a polyfunctional epoxy compound and a polyfunctional carboxylic acid compound. (6-a2-1) A resin obtained by reacting a polyfunctional carboxylic dianhydride with a compound obtained by reacting a polyfunctional epoxy compound and a carboxylic acid compound.

[0124] Resins containing polycyclic side chains have a structure in which large side chains including a main chain and a cyclic skeleton are connected by one atom in the structural unit of the resin. In addition, from the viewpoint of suppressing narrow mask errors after development and improving halftone characteristics, it is preferable to have a structural unit represented by general formula (41).

[0125] [Chemical 8]

[0126] In general formula (41), X 41 and X 42 independently represent direct bonding, substituents represented by general formula (42) or general formula (43). Y 41 represents a 3- to 4-valent organic group belonging to a carboxylic acid residue or a carboxylic acid derivative residue. W 1 represents an organic group having at least 2 aromatic groups. R 101 and R 102 each independently represent a hydrogen atom or an alkyl group with 1 to 6 carbon atoms, and R 103 and R 104 each independently represent a hydrogen atom, an alkyl group with 1 to 10 carbon atoms, or an organic group with a radical polymerizable group. . a and b independently represent integers from 0 to 10. c means 0 or 1. In General Formula (42) and General Formula (43), R 105 and R 106 respectively independently represent a hydrogen atom, an alkyl group having 1 to 10 carbon atoms, or an organic group having a radical polymerizable group. ✽ 1 and ✽ 2 respectively independently represent the bonding point with W 1 in the general formula (41) or the bonding point with the carbon atom. ✽ 3 and ✽ 4 independently represent the bonding point with the oxygen atom in the general formula (41).

[0127] In the general formula (41), Y 41 is preferably a 3- to 4-valent organic group having an aliphatic structure with 2 to 20 carbon atoms, an alicyclic structure with 4 to 20 carbon atoms, or an aromatic structure with 6 to 30 carbon atoms. . From the viewpoint of suppressing narrow mask errors after development, improving half-tone characteristics, and improving the reliability of light-emitting elements in display devices, W 1 is preferably any one of general formulas (44) to (49) the substituent shown. R 103 and R 104 each independently represent a hydrogen atom or an organic group having a radically polymerizable group. In the general formulas (41) to (43), the organic group having a radical polymerizable group among R 103 to R 106 is preferably a (meth)acrylyl group or a substituent represented by the general formula (50). The above-mentioned alkyl group, aliphatic structure, alicyclic structure and aromatic structure may have heteroatoms, and may be either unsubstituted or substituted.

[0128] [Chemical 9]

[0129] In general formulas (44) to (49), X 43 to X 52 independently represent monocyclic or condensed polycyclic hydrocarbon rings. Y 43 and Y 53 independently represent direct bonding, carbon atom, nitrogen atom, oxygen atom or sulfur atom. R 107 to R 117 each independently represent a halogen atom or an alkyl group having 1 to 10 carbon atoms. R 118 to R 124 independently represent a hydrogen atom, a halogen atom, an alkyl group having 1 to 10 carbon atoms, a cycloalkyl group having 4 to 10 carbon atoms, or an aryl group having 6 to 15 carbon atoms. a, b, c and d independently represent integers from 0 to 4. e and f independently represent integers from 0 to 5. g, h and i respectively independently represent integers from 0 to 4. j and k independently represent integers from 0 to 3. Y 43 is the case of direct bonding, oxygen atom or sulfur atom, and I is 0. When Y 43 is a nitrogen atom, I is 1. When Y 43 is a carbon atom, I is 2. Y 53 is the case of direct bonding, oxygen atom or sulfur atom, and m is 0. When Y 53 is a nitrogen atom, m is 1. When Y 53 is a carbon atom, m is 2. ✽ 1~✽ 6 independently represent the bonding point with X 41 in the above general formula (47) or the bonding point with the oxygen atom. ✽ 7 ~ ✽ 12 independently represent the bonding point with X 42 in the above general formula (47) or the bonding point with the oxygen atom.

[0130] In the general formulas (44) to (49), X 43 to X 52 are each independently preferably a monocyclic or condensed polycyclic hydrocarbon ring with 6 to 15 carbon atoms. Y 43 and Y 53 are each independently preferably a direct bond or an oxygen atom. The above-mentioned alkyl group, cycloalkyl group, aryl group and monocyclic or condensed polycyclic aromatic hydrocarbon ring system may have heteroatoms, and may be either unsubstituted or substituted.

[0131] [Chemical 10]

[0132] In the general formula (50), X 54 represents a direct bond, an alkylene group with 1 to 10 carbon atoms, a cycloalkylene group with 4 to 10 carbon atoms, or an aryl group with 6 to 15 carbon atoms. R 125 represents a vinyl group, an allyl group, a crotonyl group, a styryl group, a cinnamyl group, a maleimide group, or a (meth)acrylyl group. R 126 represents a hydrogen atom, an alkyl group having 1 to 10 carbon atoms, or a carboxylic acid derivative residue having a carboxyl group. The above-mentioned alkylene group, cycloalkylene group and aryl group may have heteroatoms, and may be unsubstituted or substituted.

[0133] The resin containing polycyclic side chains is preferably a resin with condensed polycyclic side chains from the viewpoint of suppressing narrow mask errors after development, improving half-tone characteristics, and improving the reliability of light-emitting elements in display devices. A structural unit with a formula structure or a structural unit with a condensed polycyclic heterocyclic structure. The condensed polycyclic structure or the condensed polycyclic heterocyclic structure is preferably a fluorine skeleton, 𠮿 skeleton or isoindolinone skeleton. In the above general formula (41), W 1 is the general formula (44) or the general formula (49). If Y 43 is a direct bond or an oxygen atom, it has a structural unit with a skeleton or has 𠮿 The structural unit of the skeleton. Moreover, in the above-mentioned general formula (41), if W 1 is the general formula (48), it has a structural unit having an isoindolinone skeleton.

[0134] <Alkali-soluble base> The resin containing polycyclic side chains has an acidic group as an alkali-soluble group in at least one of the main chain of the resin, the side chains of the resin, and the terminal end of the resin. The resin containing polycyclic side chains preferably has at least one of a structural unit derived from a polyfunctional carboxylic acid compound, a structural unit derived from a polyfunctional carboxylic dianhydride, and a terminal structure having an acidic group. Furthermore, the resin is preferably a resin obtained by reacting a part of the hydroxyl group of the resin with a polyfunctional carboxylic dianhydride, and it is also preferably a resin that reacts with at least one of the main chain of the resin, the side chain of the resin, and the terminal of the resin. , a resin that introduces acidic groups through a reaction using a catalyst.

[0135] <Radically polymerizable radical> The resin (A2-1) belonging to the resin (A2) has a radical polymerizable group. (A2-1) The resin preferably has at least one of a structural unit derived from a carboxylic acid compound having a radical polymerizable group and a terminal structure having a radical polymerizable group. Furthermore, it is preferable that the resin is obtained by reacting a compound having a radically polymerizable group such as a part of the acidic groups of the resin, and it is also preferable that the resin is bonded to at least one of the side chain of the resin and the terminal of the resin. A resin in which radically polymerizable groups are introduced through a reaction using a catalyst. (A2-1) The double bond equivalent of the resin is preferably 300 g / mol or more, more preferably 400 g / mol or more, and still more preferably from the viewpoint of suppressing narrow mask errors after development and improving halftone characteristics. It is above 500g / mol. On the other hand, from the viewpoint of improving the sensitivity during exposure and improving the reliability of the light-emitting element in the display device, the double bond equivalent is preferably 1,500 g / mol or less, more preferably 1,000 g / mol or less, and More preferably, it is 700g / mol or less.

[0136] <Other structural units, blocking agents and molecular weight> From the viewpoint of improving the reliability of the light-emitting element in the display device, the structural unit of the resin containing polycyclic side chains is preferably a structural unit derived from an aromatic polyfunctional carboxylic acid compound or a structural unit derived from an aromatic polyfunctional carboxylic acid compound. Structural units derived from carboxylic dianhydrides and other structural units with aromatic groups. Furthermore, it is preferable to have a structure in which the resin terminals are capped with a capping agent such as monocarboxylic acid, dicarboxylic anhydride, or tricarboxylic anhydride.

[0137] From the viewpoint of improving the reliability of the light-emitting element in the display device, the Mw of the resin containing polycyclic side chains is preferably 500 or more and more preferably 1,000 or more in terms of polystyrene conversion measured by GPC. On the other hand, Mw is preferably 50,000 or less, and more preferably 10,000 or less, from the viewpoint of suppressing residue after development and reducing the pull-out of the pattern shape. Resins containing polycyclic side chains can be synthesized according to known methods. Examples of the phenol compound, alcohol compound, epoxy compound, carboxylic acid anhydride and carboxylic acid compound include compounds described in International Patent Publication No. 2017 / 057281 or International Patent Publication No. 2017 / 159876.

[0138] Examples of resins containing polycyclic side chains include "ADEKA ARKLS" (registered trademark) WR-101 or WR-301 (both manufactured by ADEKA Corporation), or "OGSOL" (registered trademark) CR-1030 (Osaka Gas chemical company).

[0139] <(A) Alkali-soluble resin; acid-modified epoxy resin> The following describes resin (A2-2) which is an acid-modified epoxy resin. Examples of acid-modified epoxy resins include resins obtained by the following (1-a2-2) to (2-a2-2). If necessary, the polyfunctional alcohol compound may be further reacted in any reaction stage. (1-a2-2) A resin obtained by reacting an epoxy compound with a compound obtained by reacting a polyfunctional epoxy compound and a polyfunctional carboxylic acid compound. (2-a2-2) A resin obtained by reacting a polyfunctional carboxylic acid dianhydride with a compound obtained by reacting a polyfunctional epoxy compound and a carboxylic acid compound.

[0140] Acid-modified epoxy resin has a cyclic skeleton in the structural unit of the resin. Furthermore, from the viewpoint of suppressing narrow mask errors after development and improving halftone characteristics, it is preferable to have a structural unit selected from any one of general formulas (61), (62) and (63). More than one kind of group.

[0141] [Chemical 11]

[0142] In general formulas (61) to (63), X 61 and X 62 independently represent an aliphatic structure with carbon numbers of 1 to 6. X 63 represents an alkylene group having 1 to 6 carbon atoms. W 2 represents an organic group having at least one aromatic group. R 141 and R 142 each independently represent a halogen atom, an alkyl group having 1 to 10 carbon atoms, a cycloalkyl group having 4 to 10 carbon atoms, or an aryl group having 6 to 15 carbon atoms. R 143 represents a halogen atom or an alkyl group having 1 to 10 carbon atoms. R 144 to R 146 independently represent a halogen atom, an alkyl group with 1 to 10 carbon atoms, a cycloalkyl group with 4 to 10 carbon atoms, an aryl group with 6 to 15 carbon atoms, or a substituent represented by the general formula (69). R 147 represents a hydrogen atom or a substituent represented by general formula (70). R 148 and R 149 each independently represent an organic group having a radically polymerizable group. a and b independently represent integers from 0 to 10. c represents an integer from 0 to 14. d represents an integer from 0 to 3. e and f independently represent integers from 0 to 4.

[0143] In the general formula (61), W 2 is preferably the general formula (64) from the viewpoint of suppressing narrow mask errors after development, improving half-tone characteristics, and improving the reliability of the light-emitting elements in the display device. )~(68) as any substituent. In the general formulas (61) to (63), the organic group having a radical polymerizable group in R 148 and R 149 is preferably a (meth)acrylyl group or the general formula (72) or the general formula (73) substituents shown. The aliphatic structure, alkylene group, alkyl group, cycloalkyl group and aryl group may have heteroatoms, and may be unsubstituted or substituted.

[0144] [Chemical 12]

[0145] In the general formulas (64) to (68), X 64 represents an aliphatic structure with a carbon number of 1 to 6. X 65 and X 66 independently represent a monocyclic or condensed polycyclic hydrocarbon ring. Y 65 represents a direct bond, a carbon atom, a nitrogen atom, an oxygen atom or a sulfur atom. R 150 represents a halogen atom, an alkyl group having 1 to 10 carbon atoms, a cycloalkyl group having 4 to 10 carbon atoms, or an aryl group having 6 to 15 carbon atoms. R 151 to R 159 each independently represent a halogen atom, an alkyl group with 1 to 10 carbon atoms, a cycloalkyl group with 4 to 10 carbon atoms, an aryl group with 6 to 15 carbon atoms, or a substituent represented by the general formula (69). R 160 to R 162 independently represent a hydrogen atom, a halogen atom, an alkyl group having 1 to 10 carbon atoms, a cycloalkyl group having 4 to 10 carbon atoms, or an aryl group having 6 to 15 carbon atoms. R 163 to R 169 each independently represent an organic group having a radically polymerizable group. a represents an integer from 0 to 10. b represents an integer from 0 to 3. c represents an integer from 0 to 5. d represents an integer from 0 to 3. e, f, g and h independently represent integers from 0 to 4. i and j respectively independently represent integers from 0 to 3. Y 65 is the case of direct bonding, oxygen atom or sulfur atom, and k is 0. When Y 65 is a nitrogen atom, k is 1. When Y 65 is a carbon atom, k is 2. ✽ 1~✽ 5 independently represent the bonding points with X 61 in the above general formula (61). ✽ 6 ~ ✽ 10 independently represent the bonding points in the above general formula (61).

[0146] In the general formulas (64) to (68), X 65 and X 66 are each independently preferably a monocyclic or condensed polycyclic hydrocarbon ring with 6 to 15 carbon atoms. Y 65 is preferably a direct bond or an oxygen atom. The organic group having a radically polymerizable group among R 163 to R 169 is preferably a (meth)acrylyl group or a substituent represented by general formula (72) or general formula (73). The above-mentioned aliphatic structure, alkyl group, cycloalkyl group, aryl group and monocyclic or condensed polycyclic aromatic hydrocarbon ring system may have heteroatoms, and may be either unsubstituted or substituted.

[0147] [Chemical 13]

[0148] In the general formula (69) and the general formula (70), R 170 and R 172 independently represent the substituent represented by the general formula (72) or the general formula (73). R 171 represents a halogen atom, an alkyl group with 1 to 10 carbon atoms, a cycloalkyl group with 4 to 10 carbon atoms, an aryl group with 6 to 15 carbon atoms, or a substituent represented by general formula (69) or general formula (71) . a represents an integer from 0 to 4. In the general formula (71), R 173 and R 174 independently represent a hydrogen atom, a halogen atom, or an alkyl group having 1 to 10 carbon atoms. R 175 represents a halogen atom, an alkyl group having 1 to 10 carbon atoms, or a substituent represented by general formula (69). b represents an integer from 0 to 5. In general formula (72) and general formula (73), X 67 and ~15 of the aryl group. R 176 and R 177 each independently represent a vinyl group, an allyl group, a crotonyl group, a styryl group, a cinnamyl group, a maleimide group, or a (meth)acrylyl group. R 178 and R 179 each independently represent a hydrogen atom, an alkyl group having 1 to 10 carbon atoms, or a substituent represented by the general formula (74). In the general formula (74), group or aryl group with 6 to 15 carbon atoms. X 69 is preferably a carboxylic acid anhydride residue. The above-mentioned alkyl group, cycloalkyl group, aryl group, alkylene group, alkenylene group, cycloalkyl group, cycloalkenyl group and aryl group may have heteroatoms, and may be unsubstituted or substituted. .

[0149] Acid-modified epoxy resin is preferably one that has condensed polycyclic rings from the viewpoint of suppressing narrow mask errors after development, improving half-tone characteristics, and improving the reliability of light-emitting elements in display devices. A structural unit with a formula structure, a structural unit with a condensed polycyclic heterocyclic structure, a structural unit with a structure in which an aromatic ring skeleton and an alicyclic skeleton are directly connected, or a structure in which at least two aromatic ring skeletons are directly connected. structural unit. The condensed polycyclic structure or the condensed polycyclic heterocyclic structure is preferably a naphthalene skeleton, a benzene skeleton or a 𠮿 skeleton. The alicyclic skeleton is preferably a tricyclic [5.2.1.0 2,6] decane skeleton. A structure in which at least two aromatic ring skeletons are directly connected is preferably a biphenyl skeleton. In the above general formula (61), W 2 is a substituent represented by any one of the general formulas (65) to (67). If Y 65 is a direct bond or an oxygen atom, it has a structural unit with a naphthalene skeleton. The structural unit of the biphenyl skeleton, the structural unit of the biphenyl skeleton, or the structural unit of the biphenyl skeleton. The structural unit of the skeleton. Moreover, if it is the above general formula (62), it has a structural unit having a structure in which the aromatic ring skeleton and the tricyclic [5.2.1.0 2,6]decane skeleton are directly connected.

[0150] <Alkali-soluble base> Acid-modified epoxy resin has an acidic group as an alkali-soluble group in at least one of the main chain of the resin, the side chains of the resin, and the terminal end of the resin. The acid-modified epoxy resin preferably has at least one of a structural unit derived from a polyfunctional carboxylic acid compound, a structural unit derived from a polyfunctional carboxylic dianhydride, and a terminal structure having an acidic group. Examples of methods for producing an acid-modified epoxy resin include a method in which a polyfunctional epoxy compound and a polyfunctional carboxylic acid compound are reacted to obtain a resin having a carboxyl group in the resin; or a method in which a polyfunctional epoxy compound and a carboxyl group are reacted. After the acid compound reacts, a part of the hydroxyl groups in the resin react with the polyfunctional carboxylic dianhydride. Another method for producing an acid-modified epoxy resin is, for example, a method of introducing an acidic group into a resin that does not have an acidic group. More specific examples include: a method of reacting part of the hydroxyl groups of the resin with a polyfunctional carboxylic dianhydride; or using at least one of the main chain of the resin without carboxyl groups, the side chains of the resin, and the terminals of the resin. Methods such as introducing acidic groups through a reaction using a catalyst.

[0151] <Radically polymerizable radical> The resin (A2-2) belonging to the resin (A2) has a radical polymerizable group. (A2-2) The resin preferably has a structural unit derived from an epoxy compound having a radical polymerizable group, a structural unit derived from a carboxylic acid compound having a radical polymerizable group, and a structural unit derived from a carboxylic acid compound having a radical polymerizable group. At least one of the terminal structures. Furthermore, it is preferable that the resin is obtained by reacting a compound having a radically polymerizable group such as a part of the acidic groups of the resin, and it is also preferable that the resin is bonded to at least one of the side chain of the resin and the terminal of the resin. A resin in which radically polymerizable groups are introduced through a reaction using a catalyst. (A2-2) The double bond equivalent of the resin is preferably 300g / mol or more, more preferably 400g / mol or more, and still more preferably from the viewpoint of suppressing narrow mask errors after development and improving halftone characteristics. It is above 500g / mol. On the other hand, from the viewpoint of improving the sensitivity during exposure and improving the reliability of the light-emitting element in the display device, the double bond equivalent is preferably 1,500 g / mol or less, more preferably 1,000 g / mol or less, and More preferably, it is 700g / mol or less.

[0152] <Other structural units, blocking agents and molecular weight> From the perspective of improving the reliability of the light-emitting element in the display device, the acid-modified epoxy resin has a structural unit that is preferably a structural unit derived from an aromatic polyfunctional carboxylic acid compound or an aromatic polyfunctional carboxylic acid compound. Structural units derived from acid dianhydrides and other structural units with aromatic groups. Furthermore, it is preferable to have a structure in which the resin terminals are capped with a capping agent such as monocarboxylic acid, dicarboxylic anhydride, or tricarboxylic anhydride.

[0153] From the viewpoint of improving the reliability of the light-emitting element in the display device, the Mw of the acid-modified epoxy resin is preferably 500 or more and more preferably 1,000 or more in terms of polystyrene conversion measured by GPC. On the other hand, Mw is preferably 50,000 or less, and more preferably 20,000 or less, from the viewpoint of suppressing residue after development and reducing drawing of the pattern shape. Acid-modified epoxy resin can be synthesized according to known methods. Examples of the epoxy compound, carboxylic acid anhydride and carboxylic acid compound include compounds described in International Patent Publication No. 2017 / 057281 or International Patent Publication No. 2017 / 159876.

[0154] Examples of the acid-modified epoxy resin include "KAYARAD" (registered trademark) PCR-1222H, Same as CCR-1171H, Same as TCR-1348H, Same as ZAR-1494H, Same as ZFR-1401H, Same as ZCR-1798H, Same as ZXR- 1807H, same as ZCR-6002H or same as ZCR-8001H (the above are all manufactured by Nippon Kayaku Co., Ltd.).

[0155] <(A) Alkali-soluble resin; acrylic resin> The following describes resin (A2-3) which is an acrylic resin. Examples of the acrylic resin include radical copolymerization of one or more types selected from the group consisting of (meth)acrylic acid derivatives, (meth)acrylic acid ester derivatives, styrene derivatives, and other copolymerized components. Resin obtained. From the viewpoint of suppressing narrow mask errors after development and improving halftone characteristics, the acrylic resin preferably has a structural unit represented by general formula (81) and / or a structural unit represented by general formula (82).

[0156] [Chemical 14]

[0157] In General Formula (81) and General Formula (82), X 81 represents a direct bond or an alkylene group having 1 to 10 carbon atoms. X 82 represents a direct bond, an alkene group having 1 to 10 carbon atoms, a cycloalkylene group having 4 to 10 carbon atoms, or an aryl group having 6 to 15 carbon atoms. R 201 to R 206 each independently represent a hydrogen atom or an alkyl group having 1 to 6 carbon atoms. R 207 represents a hydrogen atom, an alkyl group with 1 to 10 carbon atoms, a cycloalkyl group with 4 to 10 carbon atoms, an aryl group with 6 to 15 carbon atoms, a halogenated alkyl group with 1 to 10 carbon atoms, or an alkyl group with 4 to 10 carbon atoms. Halogenated cycloalkyl group, or halogenated aryl group with 6 to 15 carbon atoms. R 208 represents a vinyl group, an allyl group, a crotonyl group, a styryl group, a cinnamyl group, a maleimide group, or a (meth)acrylyl group. R 209 represents a hydrogen atom, an alkyl group having 1 to 10 carbon atoms, or a substituent represented by general formula (83). In the general formula (83), Base, aryl group with 6 to 15 carbon atoms. X 83 is preferably a carboxylic acid anhydride residue. In the general formula (81), it is preferable that X 81 is a direct bond and R 207 is a hydrogen atom. The above-mentioned alkyl group, cycloalkyl group, aryl group, halogenated alkyl group, halogenated cycloalkyl group, halogenated aryl group, alkylene group, alkenylene group, cycloalkylene group, cycloalkenylene group and aryl group may have heteroatoms. , can be either unsubstituted or substituted.

[0158] <Alkali-soluble base> The acrylic resin has an acidic group as an alkali-soluble group in at least one of the main chain of the resin, the side chain of the resin, and the terminal of the resin. The acrylic resin preferably has a structural unit derived from a (meth)acrylic acid derivative or a terminal structure having an acidic group. Furthermore, the resin is preferably a resin obtained by reacting a part of the hydroxyl group of the resin with a polyfunctional carboxylic dianhydride, and it is also preferably a resin that reacts with at least one of the main chain of the resin, the side chain of the resin, and the terminal of the resin. A resin that introduces acidic groups through a reaction using a catalyst.

[0159] <Radically polymerizable radical> The resin (A2-3) belonging to the resin (A2) has a radical polymerizable group. (A2-3) The resin is preferably a resin obtained by reacting a part of the acidic group the resin has with an epoxy compound having a radically polymerizable group. Furthermore, a resin obtained by reacting an epoxy group or the like contained in the resin with a carboxylic acid compound having a radically polymerizable group or the like is also preferred. Furthermore, a resin in which a radical polymerizable group is introduced into at least one of the side chain of the resin and the terminal of the resin through a reaction using a catalyst is also preferred. (A2-3) The double bond equivalent of the resin is preferably 500g / mol or more, more preferably 700g / mol or more, and still more preferably from the viewpoint of suppressing narrow mask errors after development and improving halftone characteristics. It is above 1,000g / mol. On the other hand, from the viewpoint of improving the sensitivity during exposure and improving the reliability of the light-emitting element in the display device, the double bond equivalent is preferably 4,000 g / mol or less, more preferably 3,000 g / mol or less, and More preferably, it is 2,000g / mol or less, and particularly preferably, it is 1,500g / mol or less.

[0160] <Other structural units, and molecular weight> From the viewpoint of improving the reliability of the light-emitting element in the display device, the structural unit of the acrylic resin is preferably a structural unit derived from an aromatic (meth)acrylate compound or a styrene derivative. Structural units having an aromatic group, such as structural units, are also preferably structural units having an alicyclic group, such as structural units derived from alicyclic (meth)acrylate derivatives.

[0161] From the viewpoint of improving the reliability of the light-emitting element in the display device, the Mw of the acrylic resin is preferably 1,000 or more and more preferably 3,000 or more in terms of polystyrene conversion measured by GPC. On the other hand, Mw is preferably 50,000 or less, and more preferably 20,000 or less, from the viewpoint of suppressing residue after development and reducing drawing of the pattern shape. Acrylic resin can be synthesized according to known methods. Examples of (meth)acrylic acid derivatives, (meth)acrylic acid ester derivatives, styrene derivatives and other copolymerization components include those described in International Patent Publication No. 2017 / 057281 or International Patent Publication No. 2017 / 159876 compound.

[0162] <(A) Alkali-soluble resin; (A3x) resin, (A3y) resin and (A3z) resin> In the photosensitive composition of the present invention, the phenolic equivalent in the total solid content is 400~6,000g / mol, and (A) the alkali-soluble resin has a phenolic hydroxyl group. The photosensitive composition of the present invention is formed after development. From the viewpoint of suppressing narrow mask errors, improving half-tone characteristics, and improving the reliability of light-emitting elements in display devices, (A) the alkali-soluble resin system contains (A3) resin, and (A3) resin contains a resin selected from One or more types of the group consisting of (A3-1) resin, (A3-2) resin, (A3-3) resin, and (A3-4) resin; (A3-1) resin, (A3-2) resin, (A3-3) resin and (A3-4) resin have a structural unit selected from the following (3x) structural unit, (3y) structural unit, (3z) structural unit More than one type of group; (3y) The aromatic group in the structural unit is another aromatic group that is different from the aromatic ring to which the phenolic hydroxyl group is bonded; (3z) The second aromatic group in the structural unit is an aromatic group other than the aromatic ring to which the phenolic hydroxyl group is bonded; (3x) Structural unit: Structural unit containing at least 2 phenolic hydroxyl groups; (3y) Structural unit: Structural unit containing phenolic hydroxyl and aromatic groups; (3z) Structural unit: a structural unit containing a phenolic hydroxyl group and a structural unit containing a second aromatic group.

[0163] Here, the aromatic group in the (3y) structural unit is another aromatic group that is different from the aromatic ring to which the phenolic hydroxyl group is bonded. Furthermore, the second aromatic group in the structural unit (3z) is an aromatic group other than the aromatic ring to which the phenolic hydroxyl group is bonded. In addition, the so-called second aromatic group is a name used to distinguish the aromatic group (an aromatic group different from the aromatic ring to which the phenolic hydroxyl group is bonded) in the (3y) structural unit.

[0164] Among the photosensitive compositions of the present invention, it is preferable that at least one selected from the group consisting of (A3-1) resin, (A3-2) resin, (A3-3) resin, and (A3-4) resin It has at least one selected from the group consisting of (3x) structural unit, (3y) structural unit, and (3z) structural unit, more preferably (A3-1) resin, (A3-2) resin, (A3- 3) All of the resin and (A3-4) resin have at least one type selected from the group consisting of (3x) structural units, (3y) structural units, and (3z) structural units.

[0165] The (A3) resin preferably contains at least one selected from the group consisting of the following (A3x) resin, (A3y) resin, and (A3z) resin. The (A3) resin more preferably contains (A3x) resin and / or (A3y) resin, and more preferably contains (A3x) resin. It is also preferable that (A3) resin contains (A3x) resin, and further contains (A3y) resin and / or (A3z) resin. (A3) The resin may be a single resin or any of these copolymers. (A3x) Resin: Resin with (3x) structural units; (A3y) Resin: Resin with (3y) structural unit; (A3z) Resin: A resin with (3z) structural units.

[0166] (A3x) The resin is a resin containing at least two phenolic hydroxyl groups in one structural unit of the resin. (A3y) Resin is a resin containing a phenolic hydroxyl group and an aromatic group in one structural unit of the resin. Here, the aromatic group is another aromatic group that is different from the aromatic ring to which the phenolic hydroxyl group is bonded. (A3z) The resin is a resin containing a phenolic hydroxyl group in one structural unit of the resin and a second aromatic group in another structural unit of the resin. Here, the second aromatic group is an aromatic group other than the aromatic ring to which the phenolic hydroxyl group is bonded.

[0167] Furthermore, resins having (3x) structural units, and having (3y) structural units and / or (3z) structural units are included in (A3x) resins. In addition, resins having (3y) structural units and (3z) structural units are included in (A3y) resins.

[0168] (3x) At least 2 phenolic hydroxyl groups in the structural unit, preferably at least 2 phenolic hydroxyl groups bonded to the same aromatic ring, or at least 2 phenolic hydroxyl groups bonded to different aromatic rings, preferably bonded At least 2 phenolic hydroxyl groups attached to different aromatic rings. The aromatic group in (3y) the structural unit and the second aromatic group in (3z) the structural unit are preferably benzene skeleton, triisopolycyanuric acid skeleton, trisulfonate skeleton, skeleton derived from bisphenol A, or A skeleton derived from bisphenol F. Furthermore, the aromatic group in (3y) structural unit and the second aromatic group in (3z) structural unit preferably have: a condensed polycyclic structure, a condensed polycyclic heterocyclic structure, an aromatic ring skeleton and A structure in which an alicyclic skeleton is directly connected, or a structure in which at least two aromatic ring skeletons are directly connected; more preferably, it has a condensed polycyclic structure or a condensed polycyclic heterocyclic structure.

[0169] Preferable condensed polycyclic structures are naphthalene skeleton, anthracene skeleton, indene skeleton, indene skeleton, indene skeleton, benzindene skeleton, benzindene skeleton, benzobenzocene skeleton, dibenzobenzocene skeleton and dihydronaphthalene skeleton. , tetralin skeleton, dihydroanthracene skeleton, or dihydrophenanthrene skeleton, more preferably naphthalene skeleton, anthracene skeleton, benzene skeleton, dihydroanthracene skeleton. Preferred condensed polycyclic heterocyclic structures are carbazole skeleton, dibenzofuran skeleton, dibenzothiophene skeleton, benzocarbazole skeleton, naphthobenzofuran skeleton, naphthobenzothiophene skeleton, indole skeleton, benzene skeleton Furan skeleton, benzothiophene skeleton, indoline skeleton, indolinone skeleton, isoindolinone skeleton, acridine skeleton, 𠮿 skeleton, or sulfur Skeleton, more preferably carbazole skeleton, dibenzofuran skeleton, benzocarbazole skeleton, indolinone skeleton, isoindolinone skeleton, acridine skeleton, or 𠮿 skeleton. The aromatic ring skeleton in the structure in which the aromatic ring skeleton and the alicyclic skeleton are directly connected is preferably the above-mentioned aromatic group or condensed polycyclic structure. The alicyclic skeleton in the structure in which the aromatic ring skeleton and the alicyclic skeleton are directly connected is preferably a cyclopentane skeleton, a cyclohexane skeleton, a cycloheptane skeleton, a bicyclo[4.3.0]nonane skeleton, or a bicyclic skeleton. [5.4.0] undecane skeleton, bicyclic [2.2.2] octane skeleton, tricyclic [5.2.1.0 2,6] decane skeleton, pentacyclic pentadecane skeleton or adamantane skeleton. The structure in which at least two aromatic ring skeletons are directly connected is preferably a structure in which a biphenyl skeleton, a terphenyl skeleton, or the above-mentioned aromatic group or condensed polycyclic structure is directly connected.

[0170] In the photosensitive composition of the present invention, the (A3x) resin, (A3y) resin and (A3z) resin are preferably selected from the above-mentioned (A3-1) resin, (A3-2) resin, (A3-3) resin, and (A3-4) one or more types of resins.

[0171] <(A) Alkali-soluble resin; phenol resin> The resin (A3-1) which is a phenol resin is described below. Examples of the phenol resin include resins obtained by reacting a phenol compound and the like with one or more selected from the group consisting of an aldehyde compound, a ketone compound, an alkoxymethyl compound, and a hydroxymethyl compound. The phenol resin preferably contains novolac resin and / or cresol resin. The so-called novolac resin refers to the resin obtained by reacting under an acid catalyst. Cresol resin refers to a resin obtained by reacting under an alkali catalyst.

[0172] Structural units in phenolic resins refer to repeating units containing the following structures: (I) structures derived from phenolic compounds; and (II) derived from aldehyde compounds, ketone compounds, alkoxymethyl compounds or hydroxymethyl compounds structure. The structural unit in the phenolic resin may further have (III) a structure derived from other compounds.

[0173] The phenol resin preferably contains a resin selected from the group consisting of general formula (31) from the viewpoint of suppressing narrow mask errors after development, improving half-tone characteristics, and improving the reliability of light-emitting elements in display devices. , (32), (33), (34), (35), (38), (39) and (40), one or more of the group consisting of resins of structural units.

[0174] [Chemical 15]

[0175] In the general formulas (31) to (35), X 31 to X 37 independently represent an aliphatic structure with carbon numbers of 1 to 2. Y 33 represents an alkylene group having 1 to 10 carbon atoms. Y 35 represents direct bonding, alkylene group with 1 to 6 carbon atoms, alkylene group with 1 to 6 carbon atoms, halogenated alkylene group with 1 to 6 carbon atoms, halogenated alkylene group with 1 to 6 carbon atoms, aromatic Family group, condensed polycyclic structure, condensed polycyclic heterocyclic structure, a structure in which an aromatic ring skeleton and an alicyclic skeleton are directly connected, or a structure in which at least two aromatic ring skeletons are directly connected. R 71~R 82 independently represent a halogen atom, an alkyl group with 1 to 10 carbon atoms, an aryl group with 6 to 15 carbon atoms, an alkenyl group with 2 to 10 carbon atoms, an alkoxy group with 1 to 10 carbon atoms, and Alkenyloxy group with 2 to 10 carbon atoms, hydroxyl group with 1 to 10 carbon atoms, carboxyl group, amino group, or ring-forming group. The ring connected by a ring-forming group represents a monocyclic or condensed polycyclic hydrocarbon ring. R 83 to R 88 each independently represent an alkyl group having 1 to 10 carbon atoms, a cycloalkyl group having 4 to 10 carbon atoms, an aryl group having 6 to 15 carbon atoms, or a hydroxyl group. a represents an integer from 1 to 4. b represents an integer from 1 to 5. m represents an integer from 0 to 3. n represents an integer from 0 to 4. c represents an integer from 1 to 4. o and p independently represent integers from 0 to 3. q represents an integer from 0 to 4. d represents an integer from 1 to 4. r and s independently represent integers from 0 to 3. t represents an integer from 0 to 4. e represents an integer from 1 to 4. f, g, v and w independently represent integers from 0 to 4. u represents an integer from 0 to 3. h represents an integer from 1 to 3. x represents an integer from 0 to 2. y and z independently represent 0 or 1. α, β, γ, δ, ε and ζ respectively independently represent integers from 0 to 4. ✽ 1 and ✽ 2 independently represent the bonding points in the resin.

[0176] In the general formulas (31) to (35), Y 35 is preferably an aromatic group, a condensed polycyclic structure, a condensed polycyclic heterocyclic structure, a structure in which an aromatic ring skeleton and an alicyclic skeleton are directly connected, or A structure in which at least two aromatic ring skeletons are directly connected is more preferably a condensed polycyclic structure or a condensed polycyclic heterocyclic structure. Furthermore, preferred are aromatic groups, condensed polycyclic structures, condensed polycyclic heterocyclic structures, and aromatic groups with preferred structures exemplified among the above-mentioned (3x) structural units, (3y) structural units, and (3z) structural units. A structure in which a cyclic skeleton and an alicyclic skeleton are directly connected, or a structure in which at least two aromatic ring skeletons are directly connected. The above-mentioned aliphatic structure, alkyl group, cycloalkyl group, aryl group, alkenyl group, alkoxy group, alkenyloxy group, hydroxyl group, ring-forming group, alkylene group, alkylene group, aromatic group, condensed polycyclic formula Structure, condensed polycyclic heterocyclic structure, aromatic ring skeleton and alicyclic skeleton may have heteroatoms and may be unsubstituted or substituted. The condensed polycyclic hydrocarbon ring formed by the ring-forming base is preferably a naphthalene ring, anthracene ring, pyrene ring, indene ring, indene ring, tetrahydronaphthalene ring, fluorine ring, 𠮿 ring, or isoindolinone ring.

[0177] [Chemical 16]

[0178] In general formulas (38) to (40), Z 31 to Z 34 independently represent an aliphatic structure with carbon numbers of 1 to 2. W 32 represents an aromatic group, a condensed polycyclic structure, a condensed polycyclic heterocyclic structure, a structure in which an aromatic ring skeleton and an alicyclic skeleton are directly connected, or a structure in which at least two aromatic ring skeletons are directly connected. W 34 represents direct bonding, alkylene group with 1 to 6 carbon atoms, alkylene group with 1 to 6 carbon atoms, halogenated alkylene group with 1 to 6 carbon atoms, halogenated alkylene group with 1 to 6 carbon atoms, aromatic A family group, a condensed polycyclic structure, a condensed polycyclic heterocyclic structure, a structure in which an aromatic ring skeleton and an alicyclic skeleton are directly connected, or a structure in which at least two aromatic ring skeletons are directly connected. R 91 to R 96 independently represent a halogen atom, an alkyl group with 1 to 10 carbon atoms, an aryl group with 6 to 15 carbon atoms, an alkenyl group with 2 to 10 carbon atoms, an alkoxy group with 1 to 10 carbon atoms, and Alkenyloxy group with 2 to 10 carbon atoms, hydroxyl group with 1 to 10 carbon atoms, carboxyl group, amino group, or ring-forming group. The ring connected by a ring-forming group represents a monocyclic or condensed polycyclic hydrocarbon ring. R 97 to R 99 independently represent an alkyl group with 1 to 10 carbon atoms, a cycloalkyl group with 4 to 10 carbon atoms, an aryl group with 6 to 15 carbon atoms, or a hydroxyl group. a represents an integer from 1 to 4. m represents an integer from 0 to 3. n represents an integer from 0 to 5. b represents an integer from 1 to 4. o represents an integer from 0 to 3. p represents an integer from 0 to 10. Among them, when the valence of W 32 is set to X, 0≦p≦(X-2). c and d independently represent integers from 1 to 4. q and r independently represent integers from 0 to 3. α, β and γ respectively independently represent integers from 0 to 4. In general formulas (38) to (40), W 32 is preferably a condensed polycyclic structure or a condensed polycyclic heterocyclic structure. W 34 is preferably an aromatic group, a condensed polycyclic structure, a condensed polycyclic heterocyclic structure, a structure in which an aromatic ring skeleton and an alicyclic skeleton are directly connected, or at least two aromatic ring skeletons are directly connected. The structure is preferably a condensed polycyclic structure or a condensed polycyclic heterocyclic structure. In addition, W 32 and W 34 are respectively independent of the aromatic group, condensed polycyclic structure, and condensed polycyclic heterocyclic structure of the preferred structures illustrated in the above-mentioned (3x) structural unit, (3y) structural unit, and (3z) structural unit. A ring structure is a structure in which an aromatic ring skeleton and an alicyclic skeleton are directly connected, or a structure in which at least two aromatic ring skeletons are directly connected. The above-mentioned aliphatic structure, alkyl group, cycloalkyl group, aryl group, alkenyl group, alkoxy group, alkenyloxy group, hydroxyl group, ring-forming group, alkylene group, alkylene group, aromatic group, condensed polycyclic formula Structure, condensed polycyclic heterocyclic structure, aromatic ring skeleton and alicyclic skeleton may have heteroatoms and may be unsubstituted or substituted. The condensed polycyclic hydrocarbon ring formed by the ring-forming base is preferably a naphthalene ring, anthracene ring, pyrene ring, indene ring, indene ring, tetrahydronaphthalene ring, fluorine ring, 𠮿 ring, or isoindolinone ring.

[0179] Furthermore, when the phenolic resin is one or more of the group consisting of structural units represented by any of the general formulas (31), (32), (33), (35) and (40), it is included in ( A3x) resin. Phenolic resin has a structural unit represented by general formula (34). In general formula (34), when f and g independently represent integers from 1 to 4, they are included in the (A3x) resin. In addition, the phenol resin has a structural unit represented by the general formula (34). In the general formula (34), when f and g are 0, it is included in the (A3y) resin. When the phenolic resin has a structural unit represented by general formula (38) and / or a structural unit represented by general formula (39), it is included in the (A3y) resin.

[0180] The content ratio of the structural units represented by the general formula (31) among the total structural units of the phenolic resin is preferably 50 mol% or more, more preferably 60 mol% or more, and still more preferably 70 mol% or more. On the other hand, the content ratio of the structural unit represented by the general formula (31) is preferably 100 mol% or less, more preferably 90 mol% or less. Among the total structural units of the phenolic resin, the content ratio of the structural units represented by the general formula (32) is preferably 50 to 100 mol%, more preferably 60 to 100 mol%, and still more preferably 70 to 100 mol%. The content ratio of the structural units represented by the general formula (33) among the total structural units of the phenolic resin is preferably 5 mol% or more, more preferably 10 mol% or more, still more preferably 15 mol% or more, and particularly preferably 20 mol%. %above. On the other hand, the content ratio of the structural unit represented by the general formula (33) is preferably 60 mol% or less, more preferably 45 mol% or less. The content ratio of the structural units represented by the general formula (34) among the total structural units of the phenolic resin is preferably 50 mol% or more, more preferably 60 mol% or more, and still more preferably 70 mol% or more. On the other hand, the content ratio of the structural unit represented by the general formula (34) is preferably 100 mol% or less, more preferably 90 mol% or less. Among the total structural units of the phenolic resin, the content ratio of the structural units represented by the general formula (35) is preferably 50 to 100 mol%, more preferably 60 to 100 mol%, and still more preferably 70 to 100 mol%. The content ratio of the structural units represented by the general formula (38) among the total structural units of the phenolic resin is preferably 50 mol% or more, more preferably 60 mol% or more, and still more preferably 70 mol% or more. On the other hand, the content ratio of the structural unit represented by the general formula (38) is preferably 100 mol% or less, more preferably 90 mol% or less. The content ratio of the structural units represented by the general formula (39) among the total structural units of the phenolic resin is preferably 5 mol% or more, more preferably 10 mol% or more, still more preferably 15 mol% or more, and particularly preferably 20 mol%. %above. On the other hand, the content ratio of the structural unit represented by the general formula (39) is preferably 70 mol% or less, more preferably 60 mol% or less, still more preferably 50 mol% or less. Among the total structural units of the phenolic resin, the content ratio of the structural units represented by the general formula (40) is preferably 5 mol% or more, more preferably 10 mol% or more, still more preferably 15 mol% or more, and particularly preferably 20 mol%. %above. On the other hand, the content ratio of the structural unit represented by the general formula (40) is preferably 70 mol% or less, more preferably 60 mol% or less, and still more preferably 50 mol% or less.

[0181] From the viewpoint of suppressing narrow mask errors after development and improving halftone characteristics, the phenolic resin preferably has a structural unit represented by general formula (36). Among the total structural units of the phenolic resin, the content ratio of the structural units represented by the general formula (36) is preferably 50 to 100 mol%, more preferably 60 to 100 mol%, and still more preferably 70 to 100 mol% or more.

[0182] [Chemical 17]

[0183] In the general formula (36), X 38 represents an aliphatic structure with a carbon number of 1 to 6. R 89 represents a halogen atom, an alkyl group with 1 to 10 carbon atoms, an aryl group with 6 to 15 carbon atoms, an alkenyl group with 2 to 10 carbon atoms, an alkoxy group with 1 to 10 carbon atoms, and an alkenyl group with 2 to 10 carbon atoms. Oxygen group, hydroxyl group with 1 to 10 carbon atoms, carboxyl group, amino group, or ring-forming group. Rings connected by the base forming the ring are represented by monocyclic or condensed polycyclic hydrocarbon rings. R 90 represents an alkyl group having 1 to 10 carbon atoms, a cycloalkyl group having 4 to 10 carbon atoms, or an aryl group having 6 to 15 carbon atoms. a represents an integer from 1 to 4. b represents an integer from 0 to 3. α represents an integer from 0 to 4. The aliphatic structure, alkyl group, aryl group, alkenyl group, alkoxy group, hydroxyl group, ring-forming group, and alkylene group may have heteroatoms, and may be unsubstituted or substituted. The condensed polycyclic hydrocarbon ring formed by the ring-forming base is preferably a naphthalene ring, anthracene ring, pyrene ring, indene ring, indene ring, tetrahydronaphthalene ring, fluorine ring, 𠮿 ring, or isoindolinone ring.

[0184] <Alkali-soluble base> The phenolic resin has a phenolic hydroxyl group as an alkali-soluble group in at least one of the main chain of the resin, the side chain of the resin, and the terminal of the resin. The phenol resin is preferably a resin obtained by reacting a phenol compound with one or more types selected from the group consisting of an aldehyde compound, an alkoxymethyl compound, and a hydroxymethyl compound. Furthermore, the resin is preferably a resin in which a phenolic hydroxyl group is introduced into at least one of the main chain of the resin, the side chains of the resin, and the terminal of the resin through a reaction using a catalyst. Furthermore, it may have a carboxyl group and / or a carboxylic anhydride group. Examples thereof include a resin obtained by reacting a phenolic hydroxyl group contained in a resin with a carboxylic anhydride, or a resin obtained by reacting a phenolic compound having a carboxyl group and / or a carboxylic anhydride group.

[0185] <Radically polymerizable radical> The phenol resin preferably contains the following resin (A3b-1). The resin (A3b-1) is a resin (A3b) having at least one radically polymerizable group. (A3b-1) Resin: phenol resin containing unsaturated groups.

[0186] The resin (A3b-1) is preferably a resin obtained by reacting a part of the acidic group the resin has with an epoxy compound having a radically polymerizable group. Furthermore, a resin in which a radical polymerizable group is introduced into at least one of the side chain of the resin and the terminal of the resin through a reaction using a catalyst is also preferred. Moreover, when (A) alkali-soluble resin contains (A3b-1) resin, (A) alkali-soluble resin preferably further contains the following (A3a-1) resin. The unsaturated group is preferably an ethylenically unsaturated double bond group. The resin (A3a-1) is a resin (A3a) that does not have a radically polymerizable group. (A3a-1) Resin: phenol resin without unsaturated groups.

[0187] <Other structural units, and molecular weight> From the viewpoint of improving the reliability of the light-emitting element in the display device, the structural unit of the phenolic resin is preferably a structural unit derived from an aromatic aldehyde compound or a structural unit derived from an aromatic ketone compound. The structural unit of the family group is also preferably a structural unit derived from an alicyclic aldehyde compound, a structural unit derived from an alicyclic ketone compound, a structural unit derived from an alicyclic alkoxymethyl compound, Or structural units with alicyclic groups such as structural units derived from alicyclic hydroxymethyl compounds.

[0188] From the viewpoint of improving the reliability of the light-emitting element in the display device, the Mw of the phenolic resin is preferably 500 or more and more preferably 1,000 or more in terms of polystyrene conversion measured by GPC. On the other hand, Mw is preferably 50,000 or less, more preferably 30,000 or less, still more preferably 10,000 or less, and still more preferably 5,000, from the viewpoint of suppressing residue after development and reducing pattern shape pull-out. Below, the best value is below 3,000. Phenol resin can be synthesized according to known methods. Examples of the phenol compound, aldehyde compound, ketone compound, alkoxymethyl compound, and hydroxymethyl compound include compounds described in International Patent Publication No. 2017 / 159876.

[0189] <(A) Alkali-soluble resin; polyhydroxystyrene> The following describes resin (A3-2) belonging to polyhydroxystyrene. Examples of polyhydroxystyrene include resins obtained by radical copolymerization of hydroxystyrene derivatives, etc., and styrene derivatives and / or other copolymerization components. Examples of other copolymerized components include (meth)acrylic acid derivatives and (meth)acrylic acid ester derivatives. From the viewpoint of suppressing narrow mask errors after development and improving halftone characteristics, polyhydroxystyrene preferably has a structural unit represented by general formula (91) and / or a structural unit represented by general formula (92) . Among the total structural units of polyhydroxystyrene, the content ratio of the structural units represented by general formula (91) and the structural units represented by general formula (92) is preferably 50 to 100 mol%, more preferably 60 to 100 mol%. , and more preferably 70~100mol%.

[0190] [Chemical 18]

[0191] In General Formula (91) and General Formula (92), X 121 represents an alkylene group having 1 to 10 carbon atoms, a cycloalkylene group having 4 to 10 carbon atoms, or an aryl group having 6 to 15 carbon atoms. R 221 to R 226 each independently represent a hydrogen atom or an alkyl group having 1 to 6 carbon atoms. R 227 and R 228 independently represent a halogen atom, an alkyl group with 1 to 10 carbon atoms, an aryl group with 6 to 15 carbon atoms, an alkenyl group with 2 to 10 carbon atoms, an alkoxy group with 1 to 10 carbon atoms, and Alkenyloxy group with 2 to 10 carbon atoms, hydroxyl group with 1 to 10 carbon atoms, carboxyl group, amino group, or ring-forming group. The ring connected by a ring-forming group represents a monocyclic or condensed polycyclic hydrocarbon ring. a and b independently represent integers from 1 to 5. c and d independently represent integers from 0 to 4. The above-mentioned alkyl group, aryl group, alkenyl group, alkoxy group, acyl group, ring-forming group, alkylene group, cycloalkylene group and arylyl group may have heteroatoms and may be unsubstituted or substituted. A sort of. The condensed polycyclic hydrocarbon ring formed by the ring-forming base is preferably a naphthalene ring, anthracene ring, pyrene ring, indene ring, indene ring, tetrahydronaphthalene ring, fluorine ring, 𠮿 ring, or isoindolinone ring.

[0192] <Alkali-soluble base> Polyhydroxystyrene has a phenolic hydroxyl group as an alkali-soluble group in at least one of the main chain of the resin, the side chains of the resin, and the terminal of the resin. Polyhydroxystyrene is preferably a resin obtained by radical copolymerization of at least a copolymer component containing a hydroxystyrene derivative. Furthermore, it is preferable to use a resin obtained by radical copolymerization of a copolymerized component containing a (meth)acrylate having a reactive group such as an epoxy group, so that the epoxy group, etc., possessed by the resin is combined with the resin. The resin obtained by reacting a phenolic compound with a carboxyl group is also preferably a resin in which a phenolic hydroxyl group is introduced into at least one of the main chain of the resin, the side chains of the resin, and the terminal end of the resin through a reaction using a catalyst. Furthermore, it may have a carboxyl group and / or a carboxylic anhydride group. Examples include a resin obtained by reacting a phenolic hydroxyl group contained in a resin with a carboxylic acid anhydride, or a resin obtained by reacting a copolymerized component having a carboxyl group and / or a carboxylic anhydride group as another copolymerized component.

[0193] <Radically polymerizable radical> The polyhydroxystyrene preferably contains the following resin (A3b-2). The resin (A3b-2) is the resin (A3b) having at least one radically polymerizable group. (A3b-2) Resin: polyhydroxystyrene containing unsaturated groups.

[0194] (A3b-2) The resin is preferably a resin obtained by reacting a part of the acidic group the resin has with an epoxy compound having a radically polymerizable group. Furthermore, a resin obtained by reacting an epoxy group or the like contained in the resin with a carboxylic acid compound having a radically polymerizable group or the like is preferably used. Furthermore, when (A) alkali-soluble resin contains (A3b-2) resin, (A) alkali-soluble resin preferably further contains the following (A3a-2) resin. The unsaturated group is preferably an ethylenically unsaturated double bond group. The resin (A3a-2) is the resin (A3a) that does not have a radically polymerizable group. (A3a-2) Resin: Polyhydroxystyrene without unsaturated groups.

[0195] <Other structural units, and molecular weight> From the viewpoint of improving the reliability of light-emitting elements in display devices, the structural units of polyhydroxystyrene are preferably structural units derived from aromatic (meth)acrylate derivatives and the like having aromatic groups. The structural unit is also preferably a structural unit having an alicyclic group such as a structural unit derived from an alicyclic (meth)acrylate derivative.

[0196] From the viewpoint of improving the reliability of the light-emitting element in the display device, the Mw of the polyhydroxystyrene is preferably 500 or more and more preferably 1,000 or more in terms of polystyrene conversion measured by GPC. On the other hand, Mw is preferably 50,000 or less, and more preferably 20,000 or less, from the viewpoint of suppressing residue after development and reducing drawing of the pattern shape. Polyhydroxystyrene can be synthesized according to known methods. Examples of hydroxystyrene derivatives, styrene derivatives, and other copolymerization components include compounds described in International Patent Publication No. 2017 / 159876.

[0197] <(A) Alkali-soluble resin; epoxy resin containing phenol group> The following describes resin (A3-3) which is a phenol group-containing epoxy resin. Examples of the phenol group-containing epoxy resin include resins shown below (1-a3-3) to (2-a3-3). If necessary, the polyfunctional alcohol compound can be further reacted in any reaction stage. Epoxy resins containing phenol groups have a cyclic skeleton in the structural unit of the resin. (1-a3-3) A resin obtained by reacting a polyfunctional epoxy compound and a phenol compound having an epoxy reactive group. (2-a3-3) A resin obtained by further reacting the resin (1-a3-3) above with a polyfunctional carboxylic dianhydride or a polyfunctional carboxylic acid compound.

[0198] <Alkali-soluble base> The epoxy resin containing a phenolic group has a phenolic hydroxyl group as an alkali-soluble group in at least one of the main chain of the resin, the side chain of the resin, and the terminal end of the resin. The phenol group-containing epoxy resin is preferably a resin obtained by reacting at least a polyfunctional epoxy compound and the like with a phenol compound having a carboxyl group. Furthermore, the resin is preferably a resin in which a phenolic hydroxyl group is introduced into at least one of the main chain of the resin, the side chains of the resin, and the terminal of the resin through a reaction using a catalyst. Furthermore, it may have a carboxyl group and / or a carboxylic anhydride group. For example, a resin obtained by reacting a hydroxyl group contained in a resin with a carboxylic acid anhydride can be used.

[0199] <Radically polymerizable radical> The phenol group-containing epoxy resin preferably contains the following resin (A3b-3). The resin (A3b-3) is a resin (A3b) having at least one radically polymerizable group. (A3b-3) Resin: epoxy resin containing unsaturated groups and phenolic groups.

[0200] (A3b-3) The resin is preferably a resin obtained by reacting a part of the acidic group the resin has with an epoxy compound having a radically polymerizable group. Furthermore, a resin obtained by reacting an epoxy group or the like contained in the resin with a carboxylic acid compound having a radically polymerizable group or the like is preferably used. Furthermore, when (A) alkali-soluble resin contains (A3b-3) resin, (A) alkali-soluble resin preferably further contains the following (A3a-3) resin. The unsaturated group is preferably an ethylenically unsaturated double bond group. The resin (A3a-3) is a resin (A3a) that does not have a radically polymerizable group. (A3a-3) Resin: phenolic group-containing epoxy resin without unsaturated groups.

[0201] <Other structural units, and molecular weight> From the viewpoint of improving the reliability of the light-emitting element in the display device, the structural unit of the phenol group-containing epoxy resin is preferably a structural unit derived from an aromatic polyfunctional carboxylic acid compound or an aromatic polyfunctional carboxylic acid compound. A structural unit having an aromatic group such as a structural unit derived from a functional carboxylic dianhydride.

[0202] From the viewpoint of improving the reliability of the light-emitting element in the display device, the Mw of the phenol group-containing epoxy resin is preferably 500 or more and more preferably 1,000 or more in terms of polystyrene conversion measured by GPC. On the other hand, Mw is preferably 50,000 or less, and more preferably 20,000 or less, from the viewpoint of suppressing residue after development and reducing drawing of the pattern shape. Epoxy resins containing phenol groups can be synthesized according to known methods.

[0203] <(A) Alkali-soluble resin; phenolic group-containing acrylic resin> The following describes resin (A3-4) which is a phenol group-containing acrylic resin. Examples of the phenol group-containing acrylic resin include resins obtained according to the following (1-a3-4) to (5-a3-4). (1-a3-4) Subjecting one or more species selected from the group consisting of (meth)acrylic acid derivatives, (meth)acrylate derivatives, styrene derivatives, and other copolymerizable components to radical copolymerization A resin obtained by polymerization and further reacting a phenolic compound with an addition reactive group. (2-a3-4) A resin obtained by further reacting the resin of (1-a3-4) above with a polyfunctional carboxylic dianhydride or a polyfunctional carboxylic acid compound. (3-a3-4) A copolymerized component having a phenolic hydroxyl group and a copolymerized component selected from (meth)acrylic acid derivatives, (meth)acrylate derivatives, styrene derivatives, and other copolymerized components One or more resins obtained by free radical copolymerization. Here, the copolymerized component with phenolic hydroxyl group is different from other copolymerized components of hydroxystyrene derivatives. (4-a3-4) A resin obtained by further reacting the resin (3-a3-4) above with a phenol compound having an addition reactive group. (5-a3-4) A resin obtained by further reacting the resin of the above (4-a3-4) with a polyfunctional carboxylic dianhydride or a polyfunctional carboxylic acid compound.

[0204] <Alkali-soluble base> The phenolic group-containing acrylic resin has a phenolic hydroxyl group as an alkali-soluble group in at least one of the main chain of the resin, the side chain of the resin, and the terminal of the resin. The phenolic group-containing acrylic resin is preferably a resin obtained by radical copolymerization of a copolymerized component containing a (meth)acrylate having a reactive group such as an epoxy group, so that the resin has epoxy group, etc., and a resin obtained by reacting with a phenolic compound having a carboxyl group. Furthermore, the resin is preferably a resin in which a phenolic hydroxyl group is introduced into at least one of the main chain of the resin, the side chains of the resin, and the terminal of the resin through a reaction using a catalyst. Furthermore, it may have a carboxyl group and / or a carboxylic anhydride group. For example, a resin obtained by reacting a hydroxyl group contained in a resin with a carboxylic acid anhydride can be used.

[0205] <Radically polymerizable radical> The phenol group-containing acrylic resin preferably contains the following resin (A3b-4). The resin (A3b-4) is the resin (A3b) having at least one radically polymerizable group. (A3b-4) Resin: Unsaturated group-containing phenol group-containing acrylic resin.

[0206] (A3b-4) The resin is preferably a resin obtained by reacting a part of the acidic group the resin has with an epoxy compound having a radically polymerizable group. Furthermore, a resin obtained by reacting an epoxy group or the like contained in the resin with a carboxylic acid compound having a radically polymerizable group or the like is preferably used. Furthermore, when (A) alkali-soluble resin contains (A3b-4) resin, (A) alkali-soluble resin preferably further contains the following (A3a-4) resin. The unsaturated group is preferably an ethylenically unsaturated double bond group. The resin (A3a-4) is the resin (A3a) which does not have a radically polymerizable group. (A3a-4) Resin: phenolic group-containing acrylic resin without unsaturated groups.

[0207] <Other structural units, and molecular weight> From the viewpoint of improving the reliability of the light-emitting element in the display device, the structural unit of the phenol group-containing acrylic resin is preferably a structural unit derived from an aromatic (meth)acrylate derivative or a structural unit derived from an aromatic (meth)acrylate derivative. A structural unit having an aromatic group, such as a structural unit derived from a styrene derivative, and preferably a structural unit having an alicyclic group, such as a structural unit derived from an alicyclic (meth)acrylate derivative. .

[0208] From the viewpoint of improving the reliability of the light-emitting element in the display device, the Mw of the phenol group-containing acrylic resin is preferably 1,000 or more and more preferably 3,000 or more in terms of polystyrene conversion measured by GPC. On the other hand, Mw is preferably 50,000 or less, and more preferably 20,000 or less, from the viewpoint of suppressing residue after development and reducing drawing of the pattern shape. Acrylic resin containing phenol groups can be synthesized according to known methods.

[0209] <(A) Content ratio of alkali-soluble resin> In the photosensitive composition of the present invention, the total content ratio of the (A1) resin in the total 100% by mass of the (A) alkali-soluble resin is due to the narrow mask error suppression after development and the improvement of the halftone characteristics. From the viewpoint of improving the reliability of the light-emitting element in the display device, improving the mechanical properties when heated at low temperatures, and improving migration resistance, the content is preferably 5 mass % or more, more preferably 10 mass % or more, and still more preferably 20 mass %. % by mass or more, more preferably 30 mass % or more, particularly preferably 35 mass % or more. On the other hand, the total content ratio of the resin (A1) is preferably 100 mass% or less, more preferably 90 mass% or less, and still more preferably 80 mass% from the viewpoint of reducing the drawing of the pattern shape. or less, preferably 75 mass% or less, and particularly preferably 70 mass% or less.

[0210] In the photosensitive composition of the present invention, the total content ratio of (A2) resin in the total 100% by mass of (A) alkali-soluble resin is determined by the sensitivity improvement during exposure, the improvement in halftone characteristics, and the heating at low temperature. From the viewpoint of improving mechanical properties, it is preferably 5 mass% or more, more preferably 10 mass% or more, still more preferably 15 mass% or more, still more preferably 20 mass% or more, and particularly preferably 25 mass% or more. On the other hand, the total content ratio of resin (A2) is preferably 95 mass % or less from the viewpoint of suppressing narrow mask errors after development, improving halftone characteristics, and reducing pattern shape. More preferably, it is 85 mass% or less, still more preferably, it is 75 mass% or less, still more preferably, it is 70 mass% or less, and particularly preferably, it is 65 mass% or less.

[0211] In the photosensitive composition of the present invention, the total content ratio of the (A3) resin in the total 100% by mass of the (A) alkali-soluble resin is due to the narrow mask error suppression after development and the improvement of the halftone characteristics. From the viewpoint of improvement of mechanical properties when heated at low temperature, it is preferably 5 mass% or more, more preferably 7 mass% or more, still more preferably 10 mass% or more, still more preferably 15 mass% or more, and particularly preferably It is 20 mass% or more. On the other hand, the total content ratio of (A3) resin is preferably 90 from the viewpoints of residue suppression after development, sensitivity improvement during exposure, narrow mask error suppression after development, and halftone characteristics improvement. % by mass or less, more preferably 80 mass % or less, still more preferably 70 mass % or less, still more preferably 65 mass % or less, and particularly preferably 60 mass % or less.

[0212] The content ratio of (A) alkali-soluble resin in the total solid content of the photosensitive composition of the present invention excluding solvents is due to the narrow mask error suppression after development, the improvement of half-tone characteristics, and the use of light-emitting elements in display devices. From the viewpoints of improved reliability, improved mechanical properties when heated at low temperatures, and improved migration resistance, it is preferably 10 mass% or more, more preferably 20 mass% or more, and still more preferably 25 mass% or more. On the other hand, the content ratio of (A) the alkali-soluble resin is preferably 75 mass % or less, more preferably 65 mass % or less, and more preferably 75 mass % or less, from the viewpoint of sensitivity improvement during exposure and residue suppression after development. Preferably, it is 55 mass % or less. Furthermore, when the photosensitive composition of the present invention contains (A) an alkali-soluble resin and (B) a radical polymerizable compound, the content of (A) the alkali-soluble resin in the photosensitive composition of the present invention is When the total amount of (A) alkali-soluble resin and (B) radically polymerizable compound is 100 parts by mass, it is preferably 25 parts by mass or more, more preferably 35 parts by mass or more, and still more preferably 45 parts by mass or more. . On the other hand, the content of (A) alkali-soluble resin is preferably 85 parts by mass or less, more preferably 80 parts by mass or less, and still more preferably 75 parts by mass or less.

[0213] <(B) Radically polymerizable compound> The first aspect of the photosensitive composition of the present invention preferably contains (B) a radically polymerizable compound (hereinafter referred to as "(B) compound"). Preferably, the compound (I) and / or the compound (IIb) contains the compound (B), and more preferably the compound (IIb) contains the compound (B). On the other hand, the second aspect of the photosensitive composition of the present invention contains the (B) compound. The compound (B) refers to a compound having at least two radically polymerizable groups. When the photosensitive composition of the present invention has negative photosensitivity, radical polymerization of the compound (B) proceeds by radicals generated from the photopolymerization initiator (C1) described later during pattern exposure. , the exposed part of the film of the composition is insoluble in the alkali developer, thereby forming a negative pattern. In addition, the effect of promoting light hardening during exposure and improving sensitivity during exposure becomes significant. On the other hand, when the photosensitive composition of the present invention has positive photosensitivity, the compound (B) undergoes radical polymerization in the unexposed portion during pattern exposure, during exposure after development, or during thermal hardening, and the composition The cross-linking degree of the film is increased, and the pattern shape control effect after thermal hardening is significant. The radically polymerizable group of the compound (B) preferably has a (meth)acrylyl group from the viewpoint of easy radical polymerization. (B) The compound preferably contains a radical polymerizable compound selected from (B1) a hydrophobic skeleton-containing radical polymerizable compound, (B2) a soft skeleton-containing radical polymerizable compound, and (B3) a cyclic skeleton-containing radical polymerizable compound described later. More than one type of group consisting of sexual compounds. Furthermore, the compound (B) more preferably contains (B1) a radically polymerizable compound containing a hydrophobic skeleton and / or (B3) a radically polymerizable compound containing a cyclic skeleton, and further contains (B2) a radically polymerizable compound containing a soft skeleton. Free radical polymerizable compound.

[0214] The compound (B) preferably has a phenolic hydroxyl group from the viewpoint of suppressing narrow mask errors after development and improving halftone characteristics. On the other hand, when the alkali-soluble resin (A) mentioned above has a phenolic hydroxyl group, it is preferable that the compound (B) does not have a phenolic hydroxyl group. The compound (B) preferably has a (meth)acrylyl group, a vinyl group, or an allyl group from the viewpoint of improvement in sensitivity during exposure and improvement in reliability of the light-emitting element in the display device. More preferably, the above-mentioned (A) alkali-soluble resin and (B) compound have a (meth)acrylyl group, a vinyl group, or an allyl group. When the compound (B) has a (meth)acrylyl group, a vinyl group or an allyl group, it is preferable that the alkali-soluble resin (A) does not have a (meth)acrylyl group, a vinyl group or an allyl group.

[0215] (B) The double bond amount of the compound is preferably 80 g / mol or more, more preferably 90 g / mol or more, from the viewpoint of suppressing narrow mask errors after development and improving halftone characteristics. On the other hand, from the viewpoint of improving the sensitivity during exposure, the double bond equivalent is preferably 800 g / mol or less, more preferably 600 g / mol or less.

[0216] When the photosensitive composition of the present invention contains (A) alkali-soluble resin and (B) compound, the content of (B) compound in the photosensitive composition of the present invention is calculated by dividing (A) alkali-soluble resin and (B). When the total amount of B) compounds is 100 parts by mass, from the viewpoint of sensitivity improvement during exposure and suppression of residues after development, it is preferably 15 parts by mass or more, more preferably 20 parts by mass or more, and still more preferably 25 parts by mass or more. On the other hand, the content of the compound (B) is preferably 75 mass from the viewpoint of suppressing narrow mask errors after development, improving half-tone characteristics, and improving the reliability of light-emitting elements in display devices. parts by mass or less, more preferably 65 parts by mass or less, and more preferably 55 parts by mass or less.

[0217] <(B) Radically polymerizable compound; (B1) compound> The photosensitive composition of the present invention preferably contains (B) compound, (B) compound contains (B1) hydrophobic skeleton-containing radically polymerizable compound (hereinafter referred to as "(B1) compound"), (B1) compound Have the following (I-b1) structure and (II-b1) structure, and have at least 2 (II-b1) structures. (I-b1) Structure: Contains one or more structures selected from the group consisting of a fluorine structure, an indene structure, a condensed polycyclic alicyclic structure, an indolinone structure, and an isoindolinone structure. (II-b1) Structure: organic radical with radical polymerizable radical.

[0218] The radically polymerizable group preferably has a (meth)acrylyl group. By containing the (B1) compound, the effect of suppressing narrow mask errors after development and improving halftone characteristics is remarkable.

[0219] From the viewpoint of suppressing narrow mask errors after development and improving halftone characteristics of the compound (B1), the structure of the above-mentioned (I-b1) is preferably represented by any one of the general formulas (141) to (147) structure.

[0220] [Chemical 19]

[0221] In the general formulas (141) to (147), X 201 to X 208 independently represent a monocyclic or condensed polycyclic hydrocarbon ring. X 210~X 214 independently represent the aliphatic structure with carbon numbers 1~6. Y 201 and Y 209 independently represent a direct bond, a carbon atom, a nitrogen atom, an oxygen atom or a sulfur atom. R 301 to R 309 each independently represent a halogen atom or an alkyl group having 1 to 10 carbon atoms. R 310 to R 316 respectively independently represent a hydrogen atom, a halogen atom, an alkyl group with 1 to 10 carbon atoms, a cycloalkyl group with 4 to 10 carbon atoms, or an aryl group with 6 to 15 carbon atoms. R 317 and R 318 each independently represent a halogen atom or an alkyl group having 1 to 10 carbon atoms. a, b, c, d, e, f and g respectively independently represent integers from 0 to 4. h and i respectively independently represent integers from 0 to 3. When Y 201 is a direct bond, oxygen atom or sulfur atom, j is 0. When Y 201 is a nitrogen atom, j is 1. When Y 201 is a carbon atom, j is 2. When Y 209 is a direct bond, oxygen atom or sulfur atom, k is 0. When Y 209 is a nitrogen atom, k is 1. When Y 209 is a carbon atom, k is 2. l and m independently represent integers from 0 to 14. n represents an integer from 0 to 2. ✽ 1~✽ 15 independently represent the key nodes with the above (II-b1) structure.

[0222] In the general formulas (141) to (147), X 201 to X 208 are each independently preferably a monocyclic or condensed polycyclic hydrocarbon ring with 6 to 15 carbon atoms. Y 201 and Y 209 are each independently preferably directly bonded or an oxygen atom. The above-mentioned aliphatic structure, alkyl group, cycloalkyl group, aryl group and monocyclic or condensed polycyclic aromatic hydrocarbon ring system may have heteroatoms, and may be either unsubstituted or substituted.

[0223] (B1) The compound is more preferably a compound having (I-b1) structure, (II-b1) structure or the following from the viewpoint of sensitivity improvement during exposure, narrow mask error suppression after development, and improvement in halftone characteristics. Its (III-b1) structure or (IV-b1) structure. (III-b1) Structure: alkylenecarbonyl group, oxyalkylenecarbonyl group or aminoalkylenecarbonyl group. (IV-b1) Structure: hydroxyl-containing alkylene group, or hydroxyl-containing oxyalkylene group.

[0224] The total number of structures (III-b1) or (IV-b1) possessed by the compound (B1) is preferably 2 or more, more preferably 3 or more, and still more preferably 4 or more. On the other hand, the total number of (III-b1) structures or (IV-b1) structures is preferably 10 or less, more preferably 8 or less, and still more preferably 6 or less. The compound (B1) preferably has the structure (III-b1). The structure (III-b1) is preferably a structure derived from a lactone or a structure derived from a lactam. When the (B1) compound has the (III-b1) structure or the (IV-b1) structure, in the above general formulas (141) ~ (147), ✽ 1 ~ ✽ 15 independently represent the difference between the above (II-b1) structure. A bonding point, a bonding point with the above-mentioned (III-b1) structure, or a bonding point with the above-mentioned (IV-b1) structure.

[0225] When the compound (B1) has a structure represented by the general formula (157) described below, it has the above-mentioned structure (III-b1). Furthermore, when the compound (B1) has a structure represented by the general formula (156) described below, and X 231 represents a hydroxyl-containing alkylene group having 1 to 10 carbon atoms, the compound (B1) has the structure (IV-b1) described above. In addition, in the general formula (156) and the general formula (157), ✽ 1 and ✽ 2 respectively independently represent the key nodes with the above-mentioned (I-b1) structure. ✽ 3 and ✽ 4 independently represent the key nodes with the above (II-b1) structure. In the general formula (157), ✽ 1 and ✽ 2 are preferably independently the bonding points with the oxygen atoms in the above general formulas (141) to (147).

[0226] The double bond equivalent of the compound (B1) is preferably 150 g / mol or more, more preferably 190 g / mol or more, from the viewpoint of suppressing narrow mask errors after development and improving halftone characteristics. On the other hand, from the viewpoint of suppressing residue after development, the double bond equivalent is preferably 600 g / mol or less, more preferably 400 g / mol or less.

[0227] When the photosensitive composition of the present invention contains (A) alkali-soluble resin and (B) compound, the content of (B1) compound in the photosensitive composition of the present invention is calculated by dividing (A) alkali-soluble resin When the total amount of the compound (B) is 100 parts by mass, it is preferably 5 parts by mass or more, and more preferably 10 parts by mass or more from the viewpoint of suppressing narrow mask errors after development and improving halftone characteristics. On the other hand, from the viewpoint of suppressing residue after development, the content of the compound (B1) is preferably 25 parts by mass or less, more preferably 20 parts by mass or less.

[0228] <(B) Radically polymerizable compound; (B2) compound> The photosensitive composition of the present invention preferably contains (B) compound, (B) compound contains (B2) soft skeleton-containing radically polymerizable compound (hereinafter referred to as "(B2) compound"), (B2) compound has The following (I-b2) structure, (II-b2) structure and (III-b2) structure, and have at least 2 (II-b2) structures. (I-b2) Structure: Structure derived from compounds with at least 2 hydroxyl groups (II-b2) Structure: organic radical with free radical polymerizable radical; (III-b2) Structure: alkylene group, oxyalkylene group, hydroxyl-containing alkylene group, hydroxyl-containing oxyalkylene group, alkylenecarbonyl group, oxyalkylenecarbonyl group or amino alkylenecarbonyl group.

[0229] The radically polymerizable group preferably has a (meth)acrylyl group. By containing the (B2) compound, the effects of improving sensitivity during exposure, suppressing residue after development, and improving halftone characteristics are significant.

[0230] Among the compounds (B2), from the viewpoint of sensitivity improvement during exposure, suppression of residue after development, and improvement in halftone characteristics, the (I-b2) structure is more preferable as the following (I-b2x) structure. (I-b2x) Structure: Contains one or more structures selected from the group consisting of structures derived from aliphatic polyfunctional alcohols, alicyclic structures, and heteroalicyclic structures.

[0231] The (B2) compound is preferably any one of the general formulas (151) to (154) from the viewpoint of sensitivity improvement during exposure, residue suppression after development, and improvement in halftone characteristics. The structure shown.

[0232] [Chemistry 20]

[0233] In the general formulas (151) to (154), X 221 to X 228 independently represent an aliphatic structure with carbon numbers of 1 to 6. R 321 to R 325 independently represent a hydrogen atom, a halogen atom, an alkyl group having 1 to 10 carbon atoms, or a cycloalkyl group having 4 to 10 carbon atoms. a and b independently represent integers from 0 to 5. ✽ 1~✽ 16 independently represent the bonding point with the above-mentioned (II-b2) structure or the bonding point with the above-mentioned (III-b2) structure. The above-mentioned aliphatic structure, alkyl group, and cycloalkyl group may have heteroatoms, and may be either unsubstituted or substituted.

[0234] When the compound (B2) contains a compound having the above-mentioned (I-b2x) structure, from the viewpoint of suppressing narrow mask errors after development, improving halftone characteristics, and reducing pattern shape, the compound (B2) More preferably, the compound further contains a compound having a structure represented by general formula (155) as the above-mentioned structure (I-b2).

[0235] [Chemistry 21]

[0236] In the general formula (155), X 229 and X 230 independently represent an aliphatic structure with carbon numbers of 1 to 6. Y 229 represents a direct bond, nitrogen atom or oxygen atom. R 326 represents a hydrogen atom, a halogen atom, an alkyl group having 1 to 10 carbon atoms, or a cycloalkyl group having 4 to 10 carbon atoms. When Y 229 is a direct bond or an oxygen atom, a is 0. When Y 229 is a nitrogen atom, a is 1. ✽ 1 and ✽ 2 independently represent the key nodes with the above (III-b2) structure. The above-mentioned aliphatic structure may have heteroatoms, and may be either unsubstituted or substituted.

[0237] The compound (B2) preferably has the following structure (III-b2x) from the viewpoints of sensitivity improvement during exposure, residue suppression after development, narrow mask error suppression after development, and improvement in halftone characteristics. (III-b2x) Structure: alkylenecarbonyl, oxyalkylenecarbonyl or aminoalkylenecarbonyl.

[0238] (B2) The total number of (III-b2) structures and the total number of (III-b2x) structures possessed by the compound is preferably 2 or more, more preferably 3 or more, and still more preferably 4 or more. On the other hand, the total number of (III-b2) structures and (III-b2x) structures is preferably 12 or less, more preferably 10 or less, and still more preferably 8 or less. The alkylene group, oxyalkylene group, hydroxyl-containing alkylene group, and hydroxyl-containing oxyalkylene group are preferably structures derived from epoxy compounds or structures derived from alkylene glycols. The compound (B2) preferably has a (III-b2x) structure. The structure (III-b2x) is preferably a structure derived from a lactone or a structure derived from a lactam.

[0239] The (B2) compound is preferably selected from the general formula (156) and the general formula (157) for the structure (III-b2) from the viewpoint of sensitivity improvement during exposure, residue suppression after development, and improvement in halftone characteristics. ) is one or more of the groups consisting of the structures shown in any one of them.

[0240] [Chemistry 22]

[0241] In General Formula (156) and General Formula (157), X 231 and X 232 each independently represent an alkylene group having 1 to 10 carbon atoms or an alkylene group having 1 to 10 carbon atoms containing a hydroxyl group. Y 231 and Y 232 independently represent direct bonding, nitrogen atom or oxygen atom. R 327 represents a hydrogen atom, a halogen atom, an alkyl group having 1 to 10 carbon atoms, or a cycloalkyl group having 4 to 10 carbon atoms. a and b independently represent integers from 1 to 4. Y 232 is the case of direct bonding or oxygen atom, and c is 0. When Y 232 is a nitrogen atom, c is 1. ✽ 1 and ✽ 2 independently represent the key nodes with the above (I-b2) structure. ✽ 3 and ✽ 4 independently represent the key nodes with the above (II-b2) structure. In the general formula (156) and the general formula (157), ✽ 1 and ✽ 2 are independently preferably the bonding points with the oxygen atoms in the above general formulas (151) to (154). The above-mentioned alkylene group, alkyl group and cycloalkyl group may have heteroatoms, and may be unsubstituted or substituted. When the compound (B2) has a structure represented by the general formula (157), it has the above-mentioned structure (III-b2x).

[0242] (B2) The number of radical polymerizable groups of the compound is preferably 2 or more, more preferably 3 or more, from the viewpoint of sensitivity improvement during exposure, suppression of residue after development, and improvement in halftone characteristics. , and preferably more than 4. On the other hand, the number of radically polymerizable radicals is preferably 12 or less, more preferably 10 or less, and still more preferably 8 or less from the viewpoint of improving halftone characteristics and reducing pattern shape. . In addition, the double bond equivalent of the compound (B2) is preferably 100 g / mol or more, more preferably 120 g / mol or more, from the viewpoint of improving halftone characteristics and reducing pattern shape. On the other hand, the double bond equivalent is preferably 600 g / mol or less, more preferably 400 g / mol or less, from the viewpoint of sensitivity improvement during exposure, residue suppression after development, and improvement in halftone characteristics. (B2) The compound preferably contains at least 3 (II-b2) from the viewpoints of sensitivity improvement during exposure, residue suppression after development, narrow mask error suppression after development, and improvement in halftone characteristics. Compounds with structures and compounds with two (II-b2) structures.

[0243] When the photosensitive composition of the present invention contains (A) alkali-soluble resin and (B) compound, the content of (B2) compound in the photosensitive composition of the present invention is calculated by dividing (A) alkali-soluble resin When the total amount of the compound (B) is 100 parts by mass, from the viewpoint of sensitivity improvement during exposure, suppression of residue after development, and improvement in halftone characteristics, it is preferably 10 parts by mass or more, more preferably 20 parts by mass. More than one serving. On the other hand, the content of the (B2) compound is preferably 40 parts by mass or less, more preferably 35 parts by mass or less, from the viewpoint of improving halftone characteristics and reducing the drawing of the pattern shape.

[0244] <(B) Radically polymerizable compound; (B3) compound> The photosensitive composition of the present invention preferably contains (B) compound, (B) compound contains (B3) cyclic skeleton-containing radically polymerizable compound (hereinafter referred to as "(B3) compound"), (B3) compound Have the following (I-b3) structure and (II-b3) structure, and have at least 2 (II-b3) structures. (I-b3) Structure: a structure containing an alicyclic structure and / or a heteroalicyclic structure; (II-b3) Structure: organic radical with free radical polymerizable radical.

[0245] The compound (B3) is a compound different from the compound (B1) and the compound (B2). In addition, compounds belonging to both the (B1) compound and the (B2) compound are deemed to be included in the (B1) compound. The radically polymerizable group preferably has a (meth)acrylyl group. By containing the (B3) compound, the effect of suppressing narrow mask errors after development and improving halftone characteristics is remarkable.

[0246] Among the compounds (B3), from the viewpoint of residue suppression after development, narrow mask error suppression after development, and improvement of halftone characteristics, the structure (I-b3) preferably contains at least two nitrogen atoms. The construction of a ring-shaped structure. The cyclic structure with at least 2 nitrogen atoms is preferably a isocyanate structure and / or a triisocyanuric acid structure.

[0247] The double bond equivalent of the compound (B3) is preferably 150 g / mol or more, more preferably 190 g / mol or more, from the viewpoint of suppressing narrow mask errors after development and improving halftone characteristics. On the other hand, from the viewpoint of suppressing residue after development, the double bond equivalent is preferably 600 g / mol or less, more preferably 400 g / mol or less.

[0248] When the photosensitive composition of the present invention contains (A) alkali-soluble resin and (B) compound, the content of (B3) compound in the photosensitive composition of the present invention is calculated by dividing (A) alkali-soluble resin When the total amount of the compound (B) is 100 parts by mass, it is preferably 5 parts by mass or more, and more preferably 10 parts by mass or more from the viewpoint of suppressing narrow mask errors after development and improving halftone characteristics. On the other hand, from the viewpoint of suppressing residue after development, the content of the compound (B3) is preferably 25 parts by mass or less, and more preferably 20 parts by mass or less.

[0249] Furthermore, the total content of the (B1) compound, the (B2) compound and the (B3) compound is preferably 15 parts by mass or more, more preferably 20 parts by mass or more, and still more preferably 25 parts by mass or more. On the other hand, the total content of the (B1) compound, the (B2) compound and the (B3) compound is preferably 75 parts by mass or less, more preferably 65 parts by mass or less, and still more preferably 55 parts by mass or less.

[0250] <(B) Radically polymerizable compound; (B4) compound ~ (B8) compound> The photosensitive composition of the present invention preferably contains the compound (B) from the viewpoint of improvement in sensitivity during exposure and improvement in mechanical properties when heated at low temperature. And further satisfy at least one of the following conditions (γ), condition (δ) and condition (ε). Condition (γ): (B) compound contains the following (B4) fourth polymerizable compound (hereinafter referred to as “(B4) compound”) and (B5) fifth polymerizable compound (hereinafter referred to as “(B5) compound”) ”). Condition (δ): (B) The radically polymerizable compound contains the following (B6) sixth polymerizable compound (hereinafter referred to as “(B6) compound”) and (B7) seventh polymerizable compound (hereinafter referred to as “ (B7) Compound"). Condition (ε): (B) The radically polymerizable compound contains the following (B4) compound or (B5) compound, and further contains the following (B6) compound or (B7) compound. (B4) Compound: A compound having the following structure (I-b4) and further having at least 2 radically polymerizable groups; (I-b4) Structure: a structure containing an alicyclic structure and / or a structure containing a heteroalicyclic structure; (B5) Compound: A compound having the following (I-b5) structure and (II-b5) structure, and further having at least 2 radically polymerizable groups; (I-b5) Structure: Structure containing aromatic structures; (II-b5) Structure: Structure containing aliphatic structures; (B6) Compound: A compound having at least 2 (meth)acrylyl groups and further having the following (I-b6) structure; (I-b6) Structure: A structure in which at least two (meth)acrylyl groups are connected by a minimum number of atoms of 4 to 10 and contains an aliphatic structure; (B7) Compound: A compound having at least 2 (meth)acrylyl groups and further having the following structure (I-b7); (I-b7) Structure: A structure in which at least two (meth)acrylyl groups are connected by a minimum number of atoms of 11 to 45 and contains an aliphatic structure.

[0251] Moreover, when the compound (B) contains the (B4) compound, (B5) compound, (B6) compound, or (B7) compound, the (B) compound does not contain the (B1) compound, (B2) compound, and (B3) compound.

[0252] Among the compounds (B4), the alicyclic structure in the structure (I-b4) is preferably a condensed polycyclic alicyclic structure, and more preferably a tricyclic structure, from the viewpoint of improvement in mechanical properties when heated at low temperatures. [5.2.1.0 2,6] Decane structure. Furthermore, from the same point of view, the heteroalicyclic structure in the above (I-b4) structure is preferably a nitrogen-containing cyclic structure, more preferably a cyclic structure having at least two nitrogen atoms, and more preferably three. Polyisocyanate structure and / or three-dimensional structure. In the compound (B4), the number of nitrogen atoms contained in the heteroalicyclic structure in the structure (I-b4) is preferably 1 or more, more preferably 2 or more, and still more preferably 3 or more. On the other hand, the number of nitrogen atoms is preferably 6 or less, more preferably 4 or less.

[0253] The compound (B4) preferably further has the following structure (II-b4). (II-b4) Structure: Structure containing aliphatic structure Among the compounds (B1), the aliphatic structure in the structure (II-b4) mentioned above is preferably an alkylene group, an oxyalkylene group, or an alkylene group containing a hydroxyl group from the viewpoint of improvement in sensitivity and migration resistance during exposure. Alkyl, oxyalkylene group containing hydroxyl group, alkylenecarbonyl group, oxyalkylenecarbonyl group or aminoalkylenecarbonyl group.

[0254] Among the compounds (B5), the aromatic structure in the structure (I-b5) is preferably a benzene structure or a biphenyl structure from the viewpoint of improvement in mechanical properties when heated at low temperature. Moreover, from the same viewpoint, the aromatic structure in the above-mentioned (I-b5) structure is preferably a condensed polycyclic structure, and more preferably a fluorine structure, an indene structure or a naphthalene structure. In addition, from the same point of view, the aromatic structure in the above (I-b5) structure is preferably a condensed polycyclic heterocyclic structure, and more preferably 𠮿 structure, indolinone structure, or isoindolinone structure.

[0255] Among the compounds (B5), the aliphatic structure in the structure (II-b5) is preferably an alkylene group, an oxyalkylene group, or a hydroxyl-containing one from the viewpoint of improvement in sensitivity during exposure and improvement in migration resistance. Alkylene group, oxyalkylene group containing hydroxyl group, alkylenecarbonyl group, oxyalkylenecarbonyl group or aminoalkylenecarbonyl group.

[0256] When compound (B6) or compound (B7) has two (meth)acrylyl groups, the minimum number of atoms in the above-mentioned (I-b6) structure or (I-b7) structure refers to two (meth)acrylyl groups. ) The minimum number of atoms including carbon atoms and heteroatoms in the carbonyl group of the acrylyl group. In addition, the carbon atoms in the middle of the carbonyl group and the atoms bonded to the heteroatoms are not included in the calculation of the minimum number of atoms. For example, if there are oxygen atoms, propyl groups and oxygen atoms between carbonyl carbon groups, the minimum number of atoms is 5. Furthermore, when the compound (B6) or the compound (B7) has three or more (meth)acrylyl groups, the minimum number of atoms mentioned above refers to the carbon atoms including all the carbon atoms connected to the carbonyl group of the (meth)acrylyl group and Minimum atomic number of heteroatoms. Likewise, atoms bonded to the carbon atoms and heteroatoms connecting the carbons of the carbonyl group are not included in the calculation of the minimum number of atoms.

[0257] By setting the minimum number of atoms in the (I-b6) structure to a specific range, the (B6) compound can further reduce the low molecules derived from the (B) compound in the cured product, and has a significant effect of improving migration resistance. The minimum number of atoms in the above-mentioned (I-b6) structure is preferably 5 or more, more preferably 6 or more. On the other hand, the minimum number of atoms in the structure (I-b6) is preferably 9 or less, more preferably 8 or less. On the other hand, the compound (B7) has a specific range in which the minimum number of atoms in the structure (I-b7) mentioned above can be increased by molecular motion to cause (meth)acrylyl groups to interact with each other or (meth)acrylyl groups. ) The probability of conflict between the acrylic group and other radically polymerizable groups increases, and the sensitivity improvement effect during exposure is significant. The minimum number of atoms in the structure (I-b7) is preferably 13 or more, more preferably 15 or more, still more preferably 17 or more, and particularly preferably 20 or more. On the other hand, the minimum number of atoms in the structure (I-b7) is preferably 40 or less, more preferably 35 or less, still more preferably 30 or less, and particularly preferably 25 or less.

[0258] Among the (B6) compounds and (B7) compounds, the aliphatic structure in the above-mentioned (I-b6) structure and (I-b7) structure is preferred from the viewpoint of improvement in sensitivity and migration resistance during exposure. Alkylene group, oxyalkylene group, hydroxyl-containing alkylene group, hydroxyl-containing oxyalkylene group, alkylenecarbonyl group, oxyalkylenecarbonyl group or amino alkylenecarbonyl group. Furthermore, the aliphatic structure in the above-mentioned (I-b6) structure and (I-b7) structure is preferably a structure derived from an aliphatic polyfunctional alcohol. In addition, the (B6) compound and the (B7) compound are compounds different from the above-mentioned (B4) compound and the (B5) compound, and do not have a structure containing an alicyclic structure, a structure containing a heteroalicyclic structure, or an aromatic structure. Structure of structure.

[0259] It is presumed that the above-mentioned (B) compound can obtain the effect of increasing the cross-linking degree of the cured product by the generation of free radicals during exposure or the generation of free radicals during heating at low temperatures, and can also obtain side effects with the resin. The degree of cross-linking caused by the reaction of free radical polymerizable groups at the chain or terminals improves the mechanical properties when heated at low temperatures. Furthermore, it is estimated that the (B) compound having an aliphatic structure among the above-mentioned (II-b4) structure, (II-b5) structure, (I-b6) structure or (I-b7) structure is composed of (B) in the cured product ) compound-derived low molecular components are reduced, so ion migration or electron migration is inhibited, and migration resistance is improved.

[0260] From the viewpoint of improving mechanical properties when heating at low temperature, the compound (B) preferably further contains the following compound (B8). In addition, the compound (B8) is a compound different from the compound (B5) mentioned above and does not have the structure (II-b5) mentioned above. (B8) Compound: A compound having a structure containing a condensed polycyclic structure and / or a structure containing a condensed polycyclic heterocyclic structure, and further having at least two radically polymerizable groups. Among the compounds (B8), the condensed polycyclic structure is preferably a fluorine structure, an indene structure or a naphthalene structure. Furthermore, among the compounds (B8), the preferred condensed polycyclic heterocyclic structure is 𠮿 structure, indolinone structure or isoindolinone structure.

[0261] The (B) compound preferably contains one or more types selected from the group consisting of the above-mentioned (B4) compound, (B5) compound, (B6) compound, (B7) compound and (B8) compound. Preferably, the compound (B) contains two or more types selected from the group consisting of the above-mentioned (B4) compound, (B5) compound, (B6) compound and (B7) compound, and more preferably, the compound (B8) further contains the above-mentioned compound (B8).

[0262] When the photosensitive composition of the present invention contains (A) alkali-soluble resin and (B) compound, the content of (B4) compound is when the total of (A) alkali-soluble resin and (B) compound is 100 parts by mass. , from the viewpoint of improvement in sensitivity during exposure and improvement in mechanical properties during heating at low temperature, it is preferably 5 parts by mass or more, more preferably 10 parts by mass or more, still more preferably 15 parts by mass or more, and particularly preferably 20 parts by mass or more. On the other hand, the content of the (B4) compound is preferably 50 parts by mass or less, more preferably 45 parts by mass or less, and still more preferably 50 parts by mass or less, from the viewpoint of improvement in mechanical properties when heated at low temperatures and improvement in migration resistance. 40 parts by mass or less, more preferably 35 parts by mass or less, particularly preferably 30 parts by mass or less, and most preferably 25 parts by mass or less. The preferred contents of the (B5) compound, the (B6) compound, the (B7) compound and the (B8) compound are the same as above.

[0263] Furthermore, the total content of the (B4) compound, the (B5) compound, the (B6) compound, the (B7) compound and the (B8) compound is preferably 15 parts by mass or more, more preferably 20 parts by mass or more, and still more preferably 25 parts by mass. More than parts by mass. On the other hand, the total content of the (B4) compound, (B5) compound, (B6) compound, (B7) compound and (B8) compound is preferably 75 parts by mass or less, more preferably 65 parts by mass or less, and still more preferably It is 55 parts by mass or less.

[0264] <(C)Photosensitizer> The first aspect of the photosensitive composition of the present invention preferably further contains (C) a photosensitive agent. The second aspect of the photosensitive composition of the present invention contains (C) a photosensitive agent. The so-called (C) photosensitive agent refers to a compound that undergoes bond cleavage, reaction or structural change by exposure to produce other compounds, thereby imparting positive or negative photosensitivity to the composition. (C) The photosensitizer preferably contains a photopolymerization initiator (hereinafter referred to as "(C1) compound") selected from the group consisting of (C1), (C2) a photoacid generator, and (C3) a naphthoquinone diazide compound ( Hereinafter referred to as "(C3) compound"), one or more types of the group consisting of. When imparting negative photosensitivity to a composition, it is preferable to contain a (C1) compound, and it is more preferable to further contain a (C2) photoacid generator and / or a (C3) compound. When providing positive photosensitivity to the composition, it is preferable to contain the (C3) compound, and more preferably, it further contains the (C1) compound and / or (C2) photoacid generator.

[0265] (C) The photosensitive agent preferably has a (meth)acrylyl group, a vinyl group, or an allyl group from the viewpoint of improving the sensitivity during exposure and improving the reliability of the light-emitting element in the display device. Among them, when the above-mentioned (A) alkali-soluble resin has a (meth)acrylyl group, a vinyl group, or an allyl group, it is preferable that the photosensitive agent (C) does not have a (meth)acrylyl group, a vinyl group, or an allyl group. base.

[0266] The content ratio of (C) photosensitive agent in the total solid content of the photosensitive composition of the present invention excluding solvents is preferably 0.3 mass % or more, and more preferably 0.3 mass % or more, from the perspective of improving sensitivity during exposure. 1.0% by mass or more, more preferably 2.0% by mass or more. On the other hand, from the viewpoint of suppressing residue after development, the content ratio of (C) photosensitive agent is preferably 25 mass% or less, more preferably 20 mass% or less, and still more preferably 15 mass% or less.

[0267] <(C) Sensitizer; (C1) Compound> The photosensitive composition of the present invention contains (C) photosensitive agent, and preferably (C) photosensitive agent contains (C1) photopolymerization initiator.

[0268] In the photosensitive composition of the present invention, when the weak acid equivalent in the total solid content of the photosensitive composition is 400~6,000g / mol, the photosensitive composition of the present invention preferably contains (C) photosensitive agent, and ( C) The photosensitizer contains (C1) photopolymerization initiator. The (C1) compound refers to a compound that generates free radicals by bond cleavage and / or reaction by exposure. When it contains (C1) compound, it is suitable for negative pattern forming. During exposure, even if the amount of free radicals generated by the (C1) compound is a small amount, since the free radical polymerization of the above-mentioned (B) compound and the like proceeds in a chain, it is suitable for negative pattern formation and exposure using low-exposure light. The effect of increasing the sensitivity of time is displayed.

[0269] The (C1) compound is preferably a benzyl ketal compound, an α-hydroxyketone compound, an α-aminoketone compound, a phosphine oxide compound, a bisimidazole compound, an oxime ester compound, or an acridine compound. , titanocene compounds, benzophenone compounds, acetophenone compounds, aromatic ketone ester compounds, or benzoate ester compounds. From the viewpoint of sensitivity improvement during exposure, α-hydroxyketone compounds, α-aminoketone compounds, hydroxyphosphine oxide compounds, bisimidazole compounds, or oxime ester compounds are more preferred. From the viewpoint of improving sensitivity, improving halftone characteristics, and suppressing residue after development, oxime ester compounds are more preferred.

[0270] The content ratio of the (C1) compound in the total solid content of the photosensitive composition of the present invention excluding the solvent is preferably 0.3 mass % or more, and more preferably 1.0 from the viewpoint of improving the sensitivity during exposure. mass% or more, more preferably 2.0 mass% or more. On the other hand, from the viewpoint of suppressing residue after development, the content ratio of the (C1) compound is preferably 25 mass% or less, more preferably 20 mass% or less, and still more preferably 15 mass% or less. Moreover, when the photosensitive composition of the present invention contains (A) alkali-soluble resin and (B) compound, the content of the (C1) compound in the photosensitive composition of the present invention is the ratio of (A) alkali-soluble resin and (B) compound. When the total amount of (B) compounds is 100 parts by mass, it is preferably 1 part by mass or more, more preferably 3 parts by mass or more, and still more preferably 5 parts by mass or more. On the other hand, the content of the (C1) compound is preferably 30 parts by mass or less, more preferably 25 parts by mass or less, and still more preferably 20 parts by mass or less.

[0271] <(C) Sensitizer; (C1-1) Compound> The photosensitive composition of the present invention preferably contains the (C1) compound (C1-1) oxime ester compound (hereinafter referred to as "(C1-1) compound"). The (C1-1) compound refers to a compound having an oxime ester structure as a skeleton for bond cleavage and / or reaction to generate radicals by exposure. By containing the (C1-1) compound, the sensitivity during exposure, halftone characteristics, and residue suppression after development are significantly improved.

[0272] The photosensitive composition of the present invention is preferably a compound (C1) containing a compound (C1-1) and further containing the above-mentioned compound from the viewpoint of improvement in sensitivity during exposure, improvement in halftone characteristics, and suppression of residue after development. (B) Compound. Since compound (C1-1) has high absorbance of light during exposure, it is suitable for high-efficiency free radical generation. The reaction speed of free radical polymerization of compound (B) is significantly increased.

[0273] The (C1-1) compound preferably has a condensed polycyclic structure, a condensed polycyclic heterocyclic structure or a diphenyl sulfide structure. The (C1-1) compound preferably has a structure in which at least one oxime ester structure is bonded to a condensed polycyclic structure, a condensed polycyclic heterocyclic structure or a diphenyl sulfide structure (α-oxime structure ), or a structure in which at least one oxime ester carbonyl structure is bonded (that is, a structure in which an oxime ester structure is bonded via a carbonyl structure; β-oxime structure); more preferably, at least one oxime ester structure is bonded structure. The condensed polycyclic structure is preferably a fluorine structure, a benzoin structure, a dibenzoin structure, an inden structure, an indene structure, a benzindene structure, or a benzindene structure, and more preferably a fluorine structure or a benzindene structure. structure, or dibenzoquin structure. Preferred condensed polycyclic heterocyclic structures are carbazole structure, dibenzofuran structure, dibenzothiophene structure, benzocarbazole structure, indole structure, indoline structure, benzindole structure, and benzoindole It is an indoline structure, a thiophene structure, or an oxythiophene structure, more preferably a carbazole structure, a benzocarbazole structure, an indole structure, or a benzindole structure. From the viewpoint of improving sensitivity during exposure, suppressing narrow mask errors after development, and improving halftone characteristics, the (C1-1) compound preferably has a fluorine structure, a benzoquinn structure, a dibenzo structure, and a benzo structure. carbazole structure, indole structure, benzoindole structure, thiophene structure, or oxythiophene structure.

[0274] The photosensitive composition of the present invention preferably contains (C) sensitizer, (C) sensitizer contains (C1) compound, (C1) compound contains (C1-1) compound, and (C1-1) compound has a selected One of the group consisting of nitro, naphthylcarbonyl structure, trimethylbenzoyl structure, thienylcarbonyl structure, furylcarbonyl structure, at least 2 oxime ester structures, and at least 2 oxime ester carbonyl structures More than one species.

[0275] By (C1-1) the compound has an oxime ester structure selected from the group consisting of nitro, naphthylcarbonyl structure, trimethylbenzoyl structure, thienylcarbonyl structure, furylcarbonyl structure, at least 2, and at least 2 If it is composed of more than one group of oxime ester carbonyl structures, the sensitivity during exposure, the narrow mask error suppression after development, and the improvement of half-tone characteristics are significant. Among them, preferred ones have a structure in which these structures are bonded to a condensed polycyclic structure, a condensed polycyclic heterocyclic structure, or a diphenyl sulfide structure.

[0276] The photosensitive composition of the present invention is a compound (C1-1) having at least two oximes selected from a nitro group, a naphthylcarbonyl structure, a trimethylbenzoyl structure, a thienylcarbonyl structure, and a furylcarbonyl structure. In the case of at least one of the group consisting of an ester structure and at least two oxime ester carbonyl structures, the (C1-1) compound preferably further has a structure selected from a free fluorine skeleton, a benzene skeleton and a dibenzoquinone skeleton. Constituting more than one type of group.

[0277] Since the (C1-1) compound has at least one selected from the group consisting of a fluorine skeleton, a benzoquinone skeleton, and a dibenzoquinone skeleton, the sensitivity at the time of exposure is due to the fact that the (C1-1) compound has photobleaching properties. The effects of enhancement, narrow mask error suppression after development, and improvement of halftone characteristics are significant. The so-called photobleaching property means that bond cleavage and / or reaction occurs through exposure, and the absorbance of wavelengths in the ultraviolet region (for example, below 400nm) and / or the absorbance of visible light wavelengths (380~780nm) decreases. Similarly, from the viewpoint of having photobleaching properties, the (C1-1) compound preferably has a diphenyl sulfide structure, an indole structure, a benzindole structure, a phenanthrene structure, or an oxyphenanthrene structure. The structure preferably has a structure in which at least one oxime ester carbonyl structure is bonded to a condensed polycyclic structure or a condensed polycyclic heterocyclic structure.

[0278] The compound (C1-1) preferably has a group substituted with a halogen atom, and more preferably has a group substituted with a fluorine atom, from the viewpoint of improvement in sensitivity during exposure, suppression of narrow mask errors after development, and improvement in halftone characteristics. Atomically substituted radicals. In the case where the above-mentioned (A) alkali-soluble resin has a structural unit containing a halogen atom, it is presumed that the compatibility between the resin and the photopolymerization initiator is improved, thereby accelerating photohardening from the film surface to the depth of the film. Furthermore, the polyimide-based resin preferably has the above-mentioned structural unit containing fluorine atoms. The group substituted by a halogen atom is preferably trifluoromethyl, trifluoropropyl, trichloropropyl, tetrafluoropropyl, fluorocyclopentyl, fluorophenyl, pentafluorophenyl, trifluoropropoxy, Tetrafluoropropoxy, or pentafluorophenoxy.

[0279] The compound (C1-1) preferably has a radically polymerizable group, and more preferably has a free radical polymerizable group, from the viewpoint of sensitivity improvement during exposure, narrow mask error suppression after development, and improvement in halftone characteristics. One or more of the group consisting of a reactive group, an alkenyl group having 2 to 5 carbon atoms, and an alkynyl group having 2 to 5 carbon atoms. Among them, preferred ones have a structure in which at least one alkenyl group having 2 to 5 carbon atoms is bonded to a condensed polycyclic structure, a condensed polycyclic heterocyclic structure or a diphenyl sulfide structure. The photoreactive group is preferably a styryl group, a cinnamonyl group, a maleimide group, or a (meth)acrylyl group, and more preferably a (meth)acrylyl group. On the other hand, the alkenyl group having 2 to 5 carbon atoms or the alkynyl group having 2 to 5 carbon atoms is preferably vinyl, allyl, 2-methyl-2-propenyl, crotyl, or 2-methyl. -2-butenyl, 3-methyl-2-butenyl, 2,3-dimethyl-2-butenyl, ethynyl or 2-propynyl, preferably vinyl or allyl .

[0280] (C1-1) compounds having a condensed polycyclic structure, condensed polycyclic heterocyclic structure or diphenyl sulfide structure are considered to improve sensitivity during exposure, improve halftone characteristics, and suppress residue after development. In particular, it is preferable to contain at least one compound selected from the group consisting of compounds represented by any one of general formulas (17), (18) and (19), and more preferably it contains a compound represented by general formula (18) . In addition, when it has a condensed polycyclic structure, in General Formula (17) and General Formula (18), Y 1 and Y 2 are each independently a carbon atom. Moreover, when having a condensed polycyclic heterocyclic structure, in General Formula (17) and General Formula (18), Y 1 and Y 2 independently represent a nitrogen atom, an oxygen atom or a sulfur atom.

[0281] [Chemistry 23]

[0282] In general formulas (17)~(19), X 1, X 2, X 4, X 5 and Alkyl group, or aryl group with 6 to 15 carbon atoms. Y 1 and Y 2 independently represent a carbon atom, a nitrogen atom, an oxygen atom or a sulfur atom. R 451 to R 456 independently represent an alkyl group with 1 to 10 carbon atoms, a cycloalkyl group with 4 to 10 carbon atoms, an aryl group with 6 to 15 carbon atoms, an alkoxy group with 1 to 10 carbon atoms, or 1 carbon group. ~10 hydroxyalkyl. R 457 to R 459 each independently represent a substituent represented by any one of the general formulas (57) to (60), or a nitro group. R 460 to R 467 respectively independently represent a hydrogen atom, an alkyl group with 1 to 10 carbon atoms, a cycloalkyl group with 4 to 10 carbon atoms, an aryl group with 6 to 15 carbon atoms, or a group forming a ring with 4 to 10 carbon atoms. . R 468 and R 469 respectively independently represent a hydrogen atom, an alkyl group with 1 to 10 carbon atoms, a cycloalkyl group with 4 to 10 carbon atoms, an aryl group with 6 to 15 carbon atoms, an alkenyl group with 2 to 10 carbon atoms, and the number of carbon atoms. Alkoxy group with 1 to 10 carbon atoms, haloalkyl group with 1 to 10 carbon atoms, haloalkoxy group with 1 to 10 carbon atoms, or hydroxyl group with 2 to 15 carbon atoms. R 471~R 473 independently represent a hydrogen atom, an alkyl group with 1 to 10 carbon atoms, a cycloalkyl group with 4 to 10 carbon atoms, an aryl group with 6 to 15 carbon atoms, an alkenyl group with 2 to 10 carbon atoms, and the number of carbon atoms Alkoxy group with 1 to 10 carbon atoms, haloalkyl group with 1 to 10 carbon atoms, haloalkoxy group with 1 to 10 carbon atoms, heterocyclic group with 4 to 10 carbon atoms, heterocyclic oxy group with 4 to 10 carbon atoms, A acyl group or nitro group with a carbon number of 2 to 10. R 474 to R 476 respectively independently represent a hydrogen atom, an alkyl group with 1 to 10 carbon atoms, a cycloalkyl group with 4 to 10 carbon atoms, and an aryl group with 6 to 15 carbon atoms. a represents an integer from 0 to 3. c represents an integer from 0 to 5. b and d independently represent 0 or 1 respectively. e and f independently represent integers from 0 to 2. When Y 1 and Y 2 are independently carbon atoms, g and h are independently 2. When Y 1 and Y 2 are independently nitrogen atoms, g and h are independently 1. When Y 1 and Y 2 are independently oxygen atoms or sulfur atoms, g and h are independently 0. j, k and l independently represent 0 or 1. m, n and o respectively independently represent integers from 1 to 10. p, q and r independently represent integers from 1 to 4. x, y and z independently represent integers from 1 to 4.

[0283] [Chemistry 24]

[0284] In general formulas (57)~(60), R 477~R 480 independently represent an alkyl group with 1 to 10 carbon atoms, a cycloalkyl group with 4 to 10 carbon atoms, an aryl group with 6 to 15 carbon atoms, and 1 carbon group. ~10 alkoxy group, hydroxyalkyl group with 1~10 carbon atoms, or a ring-forming group. Examples of the ring formed by plural R 477 to R 480 include a benzene ring, a naphthalene ring, an anthracene ring, a cyclopentane ring, or a cyclohexane ring. a represents an integer from 0 to 7. b represents an integer from 0 to 2. c and d independently represent integers from 0 to 3. As the ring formed by plural R 477 to R 480, a benzene ring or a naphthalene ring is preferred.

[0285] The content ratio of the (C1-1) compound in the total solid content of the photosensitive composition of the present invention excluding the solvent is preferably 0.3 from the viewpoint of improvement in sensitivity during exposure and improvement in halftone characteristics. Mass% or more, more preferably 1.0 mass% or more, more preferably 2.0 mass% or more. On the other hand, from the viewpoint of suppressing residue after development, the content ratio of the (C1-1) compound is preferably 25 mass% or less, more preferably 20 mass% or less, and still more preferably 15 mass% or less. Furthermore, when the photosensitive composition of the present invention contains (A) alkali-soluble resin and (B) compound, the content of the (C1-1) compound in the photosensitive composition of the present invention is calculated by dividing (A) alkali-soluble resin When the total amount of the resin and the compound (B) is 100 parts by mass, it is preferably 1 part by mass or more, more preferably 3 parts by mass or more, and still more preferably 5 parts by mass or more. On the other hand, the content of the (C1-1) compound is preferably 30 parts by mass or less, more preferably 25 parts by mass or less, still more preferably 20 parts by mass or less.

[0286] <(C) Sensitizer; (C2) Compound> The photosensitive composition of the present invention preferably contains (C) a photosensitive agent, and the (C) photosensitive agent contains (C2) a photoacid generator. The so-called (C2) photoacid generator refers to a compound that generates acid by bond cleavage and / or reaction by exposure. During exposure, even if the acid generated by the (C2) photoacid generator is only a small amount, the cross-linking between the cationic polymerization of the cationic polymerizable compound and / or the (G) cross-linking agent described below and the resin proceeds in a chain manner. , so it is suitable for negative pattern forming under low exposure, and has significant effects in improving sensitivity during exposure, suppressing narrow mask errors after development, and improving halftone characteristics. (C) The photosensitizer preferably contains the above-mentioned (C1) compound and (C2) photoacid generator. On the other hand, when the photosensitive agent (C) contains the (C3) compound and the (C2) photoacid generator described below, the photoacid generator (C2) can generate acid during exposure after alkali development and before thermal hardening. The generated acid accelerates the cross-linking between the (G) cross-linking agent described below and the resin during subsequent thermal hardening, so the heat resistance of the cured film is improved and the chemical resistance of the cured film is improved. The effect is remarkable.

[0287] Examples of the (C2) photoacid generator include ionic compounds and nonionic compounds. The ionic compound is preferably a triorganosulfonium salt-based compound. The nonionic compound is preferably a halogen-containing compound, a diazomethane compound, a sulfonate compound, a sulfonate compound, a carboxylate compound, a sulfonimide compound, a phosphate compound, or a sulfonyl benzotriazole compound.

[0288] <(C) Sensitizer; (C3) Compound> The photosensitive composition of the present invention contains (C) photosensitizer, (C) The photosensitizer preferably contains (C3) naphthoquinone diazide compound. The compound (C3) refers to a compound whose structure is changed by exposure to produce indenecarboxylic acid and / or sulfonated indenecarboxylic acid. During exposure, the acidic compound whose structure is changed by the (C3) compound makes the exposed part of the film of the composition soluble to the alkali developer, thereby forming a positive pattern. In addition, the solubility of the exposed part to the alkali developer is selectively improved, and the resolution after development is significantly improved. On the other hand, when the photosensitive composition of the present invention has negative photosensitivity, since the photosensitive agent (C) contains the above-mentioned (C1) compound and (C3) compound, the narrow mask error after development and the halftone can be suppressed. The effect of improving characteristics, suppressing pattern shape changes during development, and reducing pattern shape pull-out is remarkable.

[0289] The (C3) compound is preferably a 5-naphthoquinone diazide sulfonate ester or a 4-naphthoquinone diazide sulfonate ester of a compound having a phenolic hydroxyl group. Examples of methods for producing the (C3) compound include: esterification of a compound having a phenolic hydroxyl group with naphthoquinone diazide sulfonic acid; or a method of esterifying a compound having a phenolic hydroxyl group with naphthoquinone diazide sulfonic acid. Methods for esterification reaction of quinone sulfonate sulfonyl chloride, etc. The preferred naphthoquinone diazide sulfonate chloride is 5-naphthoquinone diazide sulfonate chloride or 4-naphthoquinone diazide sulfonate chloride.

[0290] <(D) Colorant; (Da) Compound and (Db) Compound> The photosensitive composition of the present invention preferably further contains (D) a coloring agent. Moreover, it is preferable that the photosensitive composition of this invention contains (D) coloring agent and (Da) black agent. The so-called (D) colorant refers to a compound that absorbs light of the wavelength of visible light (380~780nm) and colors it. By containing the colorant (D), the light penetrating the composition film or the light reflected by the composition film can be colored into a desired color. In addition, the film of the composition can be provided with light-shielding properties. (D) The coloring agent is preferably (D1) pigment or (D2) dye. Especially when visible light shading is required, (Da) black agent is preferred. The so-called (Da) black agent refers to a compound that makes the visible light black by absorbing the wavelength of the visible light. By containing the black agent (Da), the light-shielding property of the film of the composition is improved, and the reliability of the light-emitting element in the display device is significantly improved. The film of the composition containing (Da) black agent is suitable for applications requiring high contrast by suppressing external light reflection, preventing light leakage from adjacent pixels, or preventing erroneous operation of TFTs, and is particularly suitable for use in organic EL displays. element separation layer, TFT planarization layer, TFT protective layer, interlayer insulating layer, or gate insulating layer. In addition, it is also suitable as a black matrix or black columnar spacer.

[0291] The photosensitive composition of the present invention contains (Da) black agent, the weak acidic group equivalent in the total solid content of the photosensitive composition is 400~6,000g / mol, and the Da in the total solid content of the photosensitive composition is When the bond equivalent is 600~6,000g / mol, the sensitivity during exposure, narrow mask error suppression after development, and halftone characteristics are significantly improved. Furthermore, the reliability of the light-emitting elements in the display device is significantly improved. It is speculated that this is because when the black agent (Da) is contained, it also blocks ultraviolet rays during pattern exposure, which is the main reason for the decrease in sensitivity during exposure. However, by reducing the weakly acidic groups in the total solid content of the photosensitive composition The equivalent and double bond equivalents are set to a specific range, which can control the alkali solubility of the exposed and unexposed parts at a high level.

[0292] In addition, (Da) a black agent may be contained, and (Db) a coloring agent other than black may be further contained. By containing a colorant other than (Db) black, the film of the composition can be colored to the desired color coordinates.

[0293] The so-called (D2) dye refers to a compound that colors the surface structure of an object by chemical adsorption, etc., and is generally soluble in solvents, etc. Examples of (D2) dyes include anthraquinone-based dyes, azo-based dyes, azine-based dyes, phthalocyanine-based dyes, methine-based dyes, phthalocyanine-based dyes, quinoline-based dyes, indigo-based dyes, and indigo-based dyes. Generic dyes, carbocationic dyes, indanthrene blue (threne) dyes, perinone dyes, perylene dyes, triarylmethane dyes, or 𠮿 Department of dyes.

[0294] The so-called black color of (D) colorant refers to the one that includes "BLACK" in the Color Index Generic Name (hereinafter referred to as "C.I. number"). When there is one without C.I. number, it refers to the one that is black when it is made into a cured film. The so-called black color when it is made into a cured film refers to the transmittance per 1.0 μm of film thickness at a wavelength of 550 nm in the transmission spectrum of the cured film of the composition containing the colorant (D), according to Langer-Beer Formula, when the film thickness is converted to the range of 0.1~1.5μm in such a way that the transmittance at the wavelength of 550nm is less than 10%, the converted transmission spectrum shows that the transmittance at the wavelength of 450~650nm is 25% the following. The penetration spectrum of the cured film can be obtained according to the method described in paragraph

[0285] of International Patent Publication No. 2019 / 087985.

[0295] The average primary particle size of the pigment is preferably 20 to 150 nm. From the perspective of improving the reliability of the light-emitting element, the average primary particle diameter of the pigment is preferably 20 nm or more, more preferably 30 nm or more, still more preferably 40 nm or more, still more preferably 50 nm or more, and particularly preferably 60 nm or more. . On the other hand, from the viewpoint of improving the light-shielding properties and improving the reliability of the light-emitting element, the average primary particle diameter of the pigment is preferably 150 nm or less, more preferably 120 nm or less, still more preferably 100 nm or less, and still more preferably 90 nm. below, especially preferably below 80nm. The primary particle diameter of the pigment refers to the long axis diameter of the primary particles of the pigment. The preferred range of the average primary particle diameter of the pigment in the pigment dispersion is the same as the preferred range of the average primary particle diameter of the pigment described above.

[0296] The primary particle size of the pigment was measured by cutting the cured film thinly as a sample, and using a transmission electron microscope (hereinafter referred to as "TEM") on the cross section whose smoothness was improved by grinding through ion milling. Observe the range of 0.2 to 0.8 μm in the depth direction from the surface of the cured film at a magnification of 50,000 times, and use image analysis particle size distribution measurement software (Mac-View; manufactured by MOUNTECH) to analyze the observed image. Determination. In addition, the average primary particle diameter of the pigment is measured by photographing and analyzing the cross section of the sample, and calculating the average value of 30 primary particles of the pigment. Furthermore, by observing with a transmission electron microscope-energy dispersive X-ray spectrometry (hereinafter referred to as "TEM-EDX"), the elements constituting the particles can be identified. In addition, the average primary particle size of the pigment in the pigment dispersion can be determined by measuring the particle size distribution using a dynamic light scattering method.

[0297] The content ratio of the colorant (D) in the total solid content of the photosensitive composition of the present invention excluding solvents is from the viewpoint of improving light-shielding properties and improving the reliability of light-emitting elements in display devices. , preferably 5 mass% or more, more preferably 20 mass% or more, still more preferably 30 mass% or more. On the other hand, the content ratio of the colorant (D) is preferably 70% by mass or less, and more preferably 50% by mass, from the viewpoint of improvement in sensitivity during exposure and improvement in reliability of the light-emitting element in the display device. mass% or less. In the photosensitive composition of the present invention, the preferred content ratio of the black agent (Da) is the same as the preferred content ratio of the coloring agent (D) described above.

[0298] <(D) Coloring agent; (D1a) compound and (D1b) compound> The photosensitive composition of the present invention preferably contains (Da) black agent and (D1a) black pigment. The so-called (D1a) black pigment refers to a pigment that turns black by absorbing light of the wavelength of visible light. Pigments refer to compounds that color the surface of objects by physical adsorption or interaction, and are generally insoluble in solvents. By containing the black pigment (D1a), the light-shielding property of the film of the composition is improved, and the reliability of the light-emitting element in the display device is significantly improved. Moreover, when the black pigment (D1a) is an organic black pigment (D1a-1) and / or an inorganic black pigment (D1a-2) described later, it may further contain a pigment other than black (D1b). By containing pigments other than (D1b) black, the film of the composition can be colored to the desired color coordinate. (D1b) The pigment other than black is preferably one or more selected from the group consisting of a blue pigment, a red pigment, a yellow pigment, a purple pigment, an orange pigment, and a green pigment described below. In the photosensitive composition of the present invention, the preferred content ratio of the black pigment (D1a) is the same as the preferred content ratio of the colorant (D) mentioned above.

[0299] <(D) Colorant; (D1a-1) compound, (D1a-2) compound and (D1a-3) compound> In the photosensitive composition of the present invention, it is preferable that (D1a) black pigment contains (D1a-1) organic black pigment (hereinafter referred to as "(D1a-1) compound"), (D1a-2) inorganic black pigment. One or more types of the group consisting of (hereinafter referred to as "(D1a-2) compound") and (D1a-3) a pigment mixture of two or more colors (hereinafter referred to as "(D1a-3) compound"). From the viewpoint of improving the reliability of the light-emitting element in the display device, the (D1a-1) compound and / or the (D1a-3) compound is more preferred, and the (D1a-1) compound is more preferred.

[0300] Examples of the (D1a-1) compound include (D1a-1a) benzofuranone-based black pigment, (D1a-1b) perinone-based black pigment, (D1a-1c) azo-based black pigment, and anthraquinone-based black pigment. Black pigment, aniline black pigment, or carbon black. Examples of the compound (D1a-2) include graphite, silver-tin alloy, or fine particles, oxides, and composite oxides of metals such as titanium, copper, iron, manganese, cobalt, chromium, nickel, zinc, calcium, or silver. Sulfides, sulfates, nitrates, carbonates, nitrides, carbides or nitrogen oxides. (D1a-3) The compound refers to a pigment mixture that simulates blackening by combining two or more pigments. Since two or more pigments are mixed, the film of the composition can be colored to the desired color coordinates.

[0301] The photosensitive composition of the present invention preferably further contains (D1a-1) compound and / or (D1a-3) compound, The compound (D1a-1) contains one member selected from the group consisting of (D1a-1a) benzofuranone-based black pigment, (D1a-1b) perinone-based black pigment, and (D1a-1c) azo-based black pigment. more than one species; The compound (D1a-3) contains two or more colors of pigments selected from the group consisting of red, orange, yellow, green, blue and violet pigments.

[0302] In the photosensitive composition of the present invention, even when such pigments with high light-shielding properties are included as (D1a) black pigments, it is preferred that the weakly acidic group equivalent in the total solid content of the photosensitive composition is 400 to 6,000 g. / mol, the double bond equivalent in the total solid content of the photosensitive composition is 600~6,000g / mol. It is presumed that similarly, by setting the weakly acidic group equivalent and the double bond equivalent in the total solid content of the photosensitive composition to a specific range, the alkali solubility control of the exposed portion and the unexposed portion can be controlled at a high level.

[0303] The compound (D1a-3) preferably contains two or more colors of pigments selected from the group consisting of red, orange, yellow, green, blue and violet pigments. (D1a-3) The compound is preferably a compound from the viewpoint of improvement in sensitivity during exposure, suppression of narrow mask errors after development, improvement in halftone characteristics, and improvement in reliability of light-emitting elements in display devices. (I-d1) A colored pigment mixture containing blue pigment, red pigment and yellow pigment; (II-d1) A colored pigment mixture containing blue pigment, red pigment and orange pigment; (III-d1) A colored pigment mixture containing blue pigment, Colored pigment mixtures of purple pigments and orange pigments; or (IV-d1) colored pigment mixtures containing purple pigments and yellow pigments. (D1a-3) In a mixture of two or more colored pigments, the blue pigment is preferably C.I. Pigment Blue 15:4, C.I. Pigment Blue 15:6, or C.I. Pigment Blue 60; the red pigment is preferably C.I. Pigment Red 123, C.I. Pigment Red 149, C.I. Pigment Red 177, C.I. Pigment Red 179 or C.I. Pigment Red 190; the preferred yellow pigments are C.I. Pigment Yellow 120, C.I. Pigment Yellow 151, C.I. Pigment Yellow 175, C.I. Pigment Yellow 180, C.I. Pigment Yellow 181, C.I. Pigment Yellow 192 or C.I. Pigment Yellow 194; the purple pigment is preferably C.I. Pigment Violet 19, C.I. Pigment Violet 29, or C.I. Pigment Violet 37; the orange pigment is preferably C.I. Pigment Orange 43, C.I. Pigment Orange 64 or C.I. Pigment Orange 72 (The values ​​are all C.I. numbers). In the photosensitive composition of the present invention, the total content ratio of the (D1a-1) compound, the (D1a-2) compound, and the (D1a-3) compound is the same as the preferred content ratio of the colorant (D) mentioned above.

[0304] <(D) Colorant; (D1a-1a) compound, (D1a-1b) compound and (D1a-1c) compound> The photosensitive composition of the present invention preferably contains (D1a-1) compound selected from (D1a-1a) benzofuranone-based black pigments, (D1a-1b) perylene-based black pigments, and (D1a-1c) azo-based black pigments. One or more types of black pigments (hereinafter referred to as "specific (D1a-1) organic black pigments") preferably contain (D1a-1a) benzofuranone-based black pigments. The specific (D1a-1) organic black pigment has superior light-shielding properties per unit ratio of the pigment in the composition compared to general organic pigments, and has a high transmittance of wavelengths in the ultraviolet region (for example, below 400 nm), so it is easy to expose to light. The effects of improved sensitivity, suppression of residue after development, suppression of narrow mask errors after development, and improvement of halftone characteristics are significant. In addition, compared with ordinary organic pigments or inorganic pigments, due to its superior insulation and low dielectric properties, the reliability of the light-emitting elements in the display device is significantly improved.

[0305] In the photosensitive composition of the present invention, the (D1a-1) compound suitable for setting the weakly acidic group equivalent and the double chain equivalent in the total solid content of the photosensitive composition to a specific range and suitable for combination is composed of a pigment that reacts with visible light From the viewpoint of high light-shielding properties at linear wavelengths and high transmittance of the pigment at wavelengths in the ultraviolet region, (D1a-1a) benzofuranone-based black pigments are particularly preferred.

[0306] The photosensitive composition of the present invention preferably contains (D1a-1) compound, and (D1a-1) compound contains (D1a-1a) benzofuranone-based black pigment.

[0307] (D1a-1a) The benzofuranone-based black pigment preferably has at least 2 benzofuran-2(3H)-one structures or at least 2 benzofuran-3(2H)-one structures, and more preferably has a general Compounds represented by any one of formula (161) and general formula (162), geometric isomers thereof, salts thereof, or salts of geometric isomers thereof.

[0308] [Chemical 25]

[0309] In general formula (161) and general formula (162), R 341 to R 344 independently represent a hydrogen atom, a halogen atom, or an alkyl group having 1 to 10 carbon atoms. R 345~R 348 independently represent halogen atoms, R 353, COOH, COOR 353, COO -, CONH 2, CONHR 353, CONR 353R 354, CN, OH, OR 353, OCOR 353, OCONH 2, OCONHR 353, OCONR 353R 354, NO 2, NH 2, NHR 353, NR 353R 354, NHCOR 353, NR 353COR 354, N=CH 2, N=CHR 353, N=CR 353R 354, SH, SR 353, SOR 353, SO 2R 353, SO 3R 353, SO 3H, SO 3 -, SO 2NH 2, SO 2NHR 353 or SO 2NR 353R 354. R 353 and R 354 respectively independently represent an alkyl group with 1 to 10 carbon atoms, a cycloalkyl group with 4 to 10 carbon atoms, an alkenyl group with 2 to 10 carbon atoms, a cycloalkenyl group with 4 to 10 carbon atoms, or a cycloalkenyl group with 2 to 10 carbon atoms. 10 alkynyl. The plural R 345 ~ R 348 can also be directly bonded or form a ring with an oxygen atom bridge, a sulfur atom bridge, an NH bridge or an NR 353 bridge. R 349 ​​to R 352 respectively independently represent a hydrogen atom, an alkyl group having 1 to 10 carbon atoms, or an aryl group having 6 to 15 carbon atoms. a, b, c and d independently represent integers from 0 to 4. The above-mentioned alkyl group, cycloalkyl group, alkenyl group, cycloalkenyl group, alkynyl group and aryl group may also have heteroatoms, and may be unsubstituted or substituted.

[0310] (D1a-1b) The perylene black pigment preferably has a perylene structure, more preferably it is a compound represented by any one of the general formulas (164) to (166), or a salt thereof, and more preferably it contains 3,4 , 9,10-perylenetetracarboxylic acid bisbenzimidazole structure compound, its geometric isomer, its salt or the salt of its geometric isomer.

[0311] [Chemical 26]

[0312] In the general formulas (164) to (166), X 241 and X 242 independently represent direct bonding or an alkylene group having 1 to 10 carbon atoms. Y 241 and Y 242 each independently represent a direct bond or an aryl group having 6 to 15 carbon atoms. R 361 and R 362 respectively independently represent a hydrogen atom, a hydroxyl group, an alkyl group having 1 to 10 carbon atoms, an alkoxy group having 1 to 6 carbon atoms, or a hydroxyl group having 2 to 6 carbon atoms. R 363~R 369 independently represent hydroxyl group, alkyl group with 1 to 10 carbon atoms, alkoxy group with 1 to 6 carbon atoms, hydroxyl group with 2 to 6 carbon atoms, halogen atom, R 370, COOH, COOR 370, COO -, CONH 2, CONHR 370, CONR 370R 371, CN, OH, OR 370, OCOR 370, OCONH 2, OCONHR 370, OCONR 370R 371, NO 2, NH 2, NHR 370, NR 370R 371, NHCOR 370, NR 370COR 371, N=CH 2, N=CHR 370, N=CR 370R 371, SH, SR 370, SOR 370, SO 2R 370, SO 3R 370, SO 3H, SO 3 -, SO 2NH 2, SO 2NHR 370 or SO 2NR 370R 371. R 370 and R 371 respectively independently represent an alkyl group with 1 to 10 carbon atoms, a cycloalkyl group with 4 to 10 carbon atoms, an alkenyl group with 2 to 10 carbon atoms, a cycloalkenyl group with 4 to 10 carbon atoms, or a cycloalkenyl group with 2 to 10 carbon atoms. 10 alkynyl. The plural R 367 ~ R 369 can also be directly bonded or form a ring with an oxygen atom bridge, a sulfur atom bridge, an NH bridge or an NR 370 bridge. a and b independently represent integers from 0 to 5. c, d, e and f independently represent integers from 0 to 4. g, h and i respectively independently represent integers from 0 to 8. When X241 and When X 241 and X 242 are alkylene groups having 1 to 10 carbon atoms, and Y 241 and Y 242 are directly bonded, R 361 and R 362 are preferably hydroxyl groups, and a and b are 1. When X 241 and For an alkoxy group of 6, or a hydroxyl group having 2 to 6 carbon atoms, a and b respectively independently represent an integer of 0 to 5. The above-mentioned alkylene group, aryl group, alkyl group, alkoxy group and acyl group may also have heteroatoms, and may be unsubstituted or substituted.

[0313] (D1a-1c) The azo black pigment preferably has an azo group in the molecule, more preferably contains a compound with an azomethine structure and a carbazole structure or a salt thereof, and more preferably has the general formula (168 ) or a salt thereof.

[0314] [Chemical 27]

[0315] In general formula (168), X 251 represents an aryl group having 6 to 15 carbon atoms. X 251 represents an aryl group having 6 to 15 carbon atoms. R 381~R 383 independently represent halogen atoms, R 390, COOH, COOR 390, COO -, CONH 2, CONHR 390, CONR 390R 391, CN, OH, OR 390, OCOR 390, OCONH 2, OCONHR 390, OCONR 390R 391, NO 2, NH 2, NHR 390, NR 390R 391, NHCOR 390, NR 390COR 391, N=CH 2, N=CHR 390, N=CR 390R 391, SH, SR 390, SOR 390, SO 2R 390, SO 3R 390, SO 3H, SO 3 -, SO 2NH 2, SO 2NHR 390 or SO 2NR 390R 391. R 390 and R 391 respectively independently represent an alkyl group with 1 to 10 carbon atoms, a cycloalkyl group with 4 to 10 carbon atoms, an alkenyl group with 2 to 10 carbon atoms, a cycloalkenyl group with 4 to 10 carbon atoms, or a cycloalkenyl group with 2 to 10 carbon atoms. 10 alkynyl. The plural R 381 ~ R 383 can also be directly bonded or form a ring with an oxygen atom bridge, a sulfur atom bridge, an NH bridge or an NR 390 bridge. R 384 represents a halogen atom, an alkyl group having 1 to 10 carbon atoms, an alkoxy group having 1 to 6 carbon atoms, or a nitro group. R 385 represents a halogen atom, an alkyl group having 1 to 10 carbon atoms, an alkoxy group having 1 to 6 carbon atoms, a acylamino group having 2 to 10 carbon atoms, or a nitro group. R 386 to R 389 each independently represent a hydrogen atom or an alkyl group having 1 to 10 carbon atoms. a represents an integer from 0 to 4. b represents an integer from 0 to 2. c represents an integer from 0 to 4. d and e independently represent integers from 0 to 8. n represents an integer from 1 to 4. The above-mentioned aryl group, alkyl group, alkoxy group and acylamino group may also have heteroatoms, and may be unsubstituted or substituted.

[0316] Examples of (D1a-1a) benzofuranone-based black pigments include "IRGAPHOR" (registered trademark) BLACK S0100CF (manufactured by BASF Corporation), the black pigment described in International Patent Publication No. 2010-081624, or International Patent Publication No. 2010 -Black pigment recorded in No. 081756. Examples of the (D1a-1b) perylene-based black pigment include C.I. Pigment Black 31 or C.I. Pigment Black 32 (both numerical values ​​are C.I. numbers). In addition to the above, examples include "PALIOGEN" (registered trademark) BLACK S0084, Same K0084, Same L0086, Same K0086, Same K0087, Same K0088, Same EH0788, Same as FK4280 or Same as FK4281 (the above are all made by BASF). Examples of the azo-based black pigment (D1a-1c) include "CHROMOFINE" (registered trademark) BLACK A1103 (manufactured by Dainichi Seika Industry Co., Ltd.), the black pigment described in Japanese Patent Application Laid-Open No. 01-170601, or the Japanese The black pigment described in the Japanese Patent Application Publication No. 02-034664. In the photosensitive composition of the present invention, the total content ratio of the specific (D1a-1) organic black pigment is the same as the preferred content ratio of the above-mentioned (D) colorant.

[0317] <(DC)Coating> The photosensitive composition of the present invention preferably contains (D1a-1) compound further containing (DC) coating layer. (DC) The coating layer refers to a surface formed by, for example, surface treatment with a silane coupling agent, surface treatment with a silicate, surface treatment with an alkoxide metal, or coating treatment with a resin, and which covers the surface of the pigment. layer. By having a (DC) coating layer, the acid resistance, alkali resistance, solvent resistance, dispersion stability or heat resistance of the (D1a-1) compound can be improved, the residue after development can be suppressed, the halftone characteristics can be improved, and the display can be improved. The reliability of the light-emitting components in the device is significantly improved. Especially when the compound (D1a-1) contains (D1a-1a) a benzofuranone-based black pigment, by containing the (DC) coating layer, the residue after development due to the pigment is suppressed and the light intensity after development is narrowed. The effect of suppressing mask errors and improving halftone characteristics is remarkable. In addition, the reliability of the light-emitting components in the display device is significantly improved. The average coverage rate of the (DC) coating layer with respect to the (D1a-1) compound is preferably 50 to 100% from the viewpoint of suppressing residue after development and improving the reliability of the light-emitting element in the display device. , the better is 70~100%, and the better is 90~100%. The average coverage rate of the (D1a-1) compound by the (DC) coating layer can be obtained according to the method described in paragraph

[0349] of International Patent Publication No. 2019 / 087985.

[0318] <(DC) coating layer; (DC-1) coating layer, (DC-2) coating layer and (DC-3) coating layer> The (DC) coating layer preferably contains a coating layer selected from (DC-1) silicon dioxide coating layer (hereinafter referred to as are "(DC-1) coating layer"), (DC-2) metal oxide coating layer (hereinafter referred to as "(DC-2) coating layer") and (DC-3) metal hydroxide coating layer (hereinafter referred to as "(DC-2) coating layer") It is one of the group consisting of "(DC-3) coating layer", preferably (DC-1) coating layer. Examples of the silicon dioxide in the (DC-1) coating layer include silicon dioxide or its hydrate. (DC-2) The metal oxide in the coating layer is not limited to the metal oxide itself, but also includes, for example, hydrates of metal oxides. Examples of the metal oxide include aluminum oxide (Al 2O 3) or aluminum oxide hydrate (Al 2O 3‧nH 2O). Examples of the metal hydroxide in the (DC-3) coating layer include aluminum hydroxide (Al(OH) 3).

[0319] In the photosensitive composition of the present invention, the content of the (DC-1) coating layer is based on the viewpoint of suppressing residue after development when the (D1a-1) compound is 100 parts by mass, and the light-emitting element in the display device From the viewpoint of improving reliability, it is preferably 1 part by mass or more, and more preferably 5 parts by mass or more. On the other hand, from the viewpoint of suppressing residue after development, the content of the (DC-1) coating layer is preferably 20 parts by mass or less, and more preferably 10 parts by mass or less. Moreover, in the photosensitive composition of the present invention, the total content of the (DC-2) coating layer and the (DC-3) coating layer is based on the amount after development when the (D1a-1) compound is 100 parts by mass. From the viewpoint of suppressing residues and improving the reliability of the light-emitting element in the display device, it is preferably 0.1 parts by mass or more, and more preferably 0.5 parts by mass or more. On the other hand, the total content of the (DC-2) coating layer and the (DC-3) coating layer is preferably 20 parts by mass or less, and more preferably 10 parts by mass or less from the viewpoint of suppressing residue after development. .

[0320] <(E)Dispersant> The photosensitive composition of the present invention preferably further contains (E) a dispersant. (E) Dispersant refers to a compound that has a surface affinity group that interacts with the surface of the above-mentioned (D1) pigment, etc., and a dispersion stabilizing structure that improves dispersion stability. Examples of the dispersion stabilizing structure include ionic substituents or polar substituents that stabilize dispersion by electrostatic repulsion, or polymer chains that stabilize dispersion by steric hindrance. When the number average particle diameter of the (D1) pigment is 500 nm or less, the dispersion stability is reduced due to the increase in surface area, and particle aggregation is likely to occur. By containing (E) the dispersant, the effect of suppressing residue after development and improving the resolution after development is remarkable.

[0321] (E) The dispersant preferably has a (meth)acryl group, a vinyl group, or an allyl group from the viewpoint of improving the sensitivity during exposure and improving the reliability of the light-emitting element in the display device. When the above-mentioned (A) alkali-soluble resin has a (meth)acrylyl group, a vinyl group, or an allyl group, it is more preferable that the (E) dispersant does not have a (meth)acrylyl group, a vinyl group, or an allyl group. .

[0322] From the viewpoint of suppressing residue after development, (E) the dispersant preferably has at least one type selected from the group consisting of a basic group, an acidic group, a salt structure of a basic group, and a salt structure of an acidic group. More preferably, it has a basic group and / or a salt structure of a basic group. From the viewpoint of suppressing residue after development, (E) the dispersing agent is preferably a dispersing agent having only a basic group, a dispersing agent having a basic group and an acidic group, or a dispersing agent having a structure in which a basic group forms a salt with an acid. The dispersant or the dispersant having a structure in which an acidic group forms a salt with a base is more preferably a dispersant having only a basic group or a dispersant having both a basic group and an acidic group. Furthermore, a dispersing agent having only an acidic group or a dispersing agent having neither a basic group nor an acidic group may be included.

[0323] (E) The basic group of the dispersant is preferably a tertiary amino group, or a nitrogen-containing ring skeleton such as a pyrrolidine skeleton, a pyrrole skeleton, an imidazole skeleton, or a piperidine skeleton. (E) The acidic group of the dispersing agent is preferably a carboxyl group, a sulfonic acid group, a phosphate group or a phenolic hydroxyl group. (E) The dispersant has a structure in which a basic group and an acid form a salt, preferably a quaternary ammonium salt structure or a structure in which the nitrogen-containing ring skeleton forms a salt. The relative anion in the salt structure of the basic group is preferably a carboxylate anion, a sulfonic acid anion, a phenoxy anion, a sulfate anion, a nitrate anion, a phosphate anion, or a halogen anion, and more preferably a carboxylate anion. The (E) dispersant having a polymer chain is preferably an acrylic resin dispersant, a polyoxyalkylene ether dispersant, a polyester dispersant, a polyurethane dispersant, or a polyol dispersant. agent, polyalkyleneamine-based dispersant, polyethyleneimine-based dispersant, or polyallylamine-based dispersant.

[0324] <(E) Dispersant; (E1) Compound> (E) The dispersant preferably contains (E1) a pigment dispersant having a basic group (hereinafter referred to as "(E1) compound"). More preferably, the (E1) compound has a compound selected from the group consisting of general formulas (26) and (27). ), (28) and (29), one or more structures in the group consisting of the structures shown in any one of (28) and (29), and a polyoxyalkylene structure. The compound (E1) is more preferably a compound having a structure represented by the general formula (26) and a polyoxygen compound from the viewpoint of suppressing a viscosity increase during storage of the pigment dispersion, improving the flatness of the cured film, and suppressing residue after development. Alkylene structure. In addition, (E1) the pigment dispersant having a basic group is more preferably one having the general formula (29) from the viewpoint of improving the dispersibility of the pigment and suppressing pigment aggregation during frozen storage of the pigment dispersion. structure, and polyoxyalkylene structure.

[0325] [Chemical 28]

[0326] In general formulas (26) to (28), R 56 to R 59 each independently represent an alkyl group having 1 to 6 carbon atoms. n represents an integer from 1 to 9. ✽ 1~✽ 6 independently represent the bonding points with the polyoxyalkylene structure. In the general formula (29), X 56 and X 57 independently represent a hydrogen atom or an alkyl group having 1 to 6 carbon atoms. Y 56 to Y 59 each independently represent an alkylene group having 1 to 6 carbon atoms. a and b independently represent integers from 1 to 100. c and d independently represent integers from 0 to 100. ✽ 7 represents the bonding point with a carbon atom or a nitrogen atom. a and b are each independently preferably an integer from 5 to 60, more preferably an integer from 10 to 40. c and d are independently preferably an integer from 0 to 20, more preferably an integer from 0 to 10.

[0327] The amine value of the (E) dispersant (including the (E1) compound) is preferably 5 mgKOH / g or more, more preferably 10 mgKOH / g or more, from the viewpoint of suppressing residue after development. On the other hand, from the viewpoint of suppressing residue after development, the amine value is preferably 100 mgKOH / g or less, more preferably 70 mgKOH / g or less. The amine value here refers to the mass of potassium hydroxide equivalent to acid that reacts with (E) dispersant per 1 g or (E1) compound per 1 g. The unit is mgKOH / g. The acid value of the (E) dispersant and the (E1) compound is preferably 10 mgKOH / g or more, more preferably 20 mgKOH / g or more, from the viewpoint of suppressing residue after development. On the other hand, from the viewpoint of suppressing residue after development, the acid value is preferably 100 mgKOH / g or less, more preferably 70 mgKOH / g or less. The acid value here refers to the mass of potassium hydroxide reacting with (E) dispersant per 1 g or (E1) compound per 1 g. The unit is mgKOH / g.

[0328] When the photosensitive composition of the present invention contains the pigment (D1), the total content of the (E) dispersant and the compound (E1) in the photosensitive composition of the present invention is when the pigment (D1) is When it is 100 parts by mass, from the viewpoint of suppressing residue after development, it is preferably 5 parts by mass or more, and more preferably 15 parts by mass or more. On the other hand, the total content of the (E) dispersant and the (E1) compound is preferably 50 parts by mass or less, and more preferably 40 parts by mass or less from the viewpoint of suppressing residue after development.

[0329] <(F) compound; (F0) compound and (FB) compound> The photosensitive composition of the present invention preferably further contains the following (F0) compound and / or (FB) compound. (F0) compound: a compound having an acidic group containing a phosphorus atom and / or a salt of an acidic group containing a phosphorus atom (hereinafter referred to as "(F0) compound"). (FB) compound: a compound having a betaine structure containing a phosphorus atom (hereinafter referred to as "(FB) compound").

[0330] In addition, the (F0) compound, the (FB) compound, the (FC1) compound mentioned later, and the (FT) compound mentioned later may be collectively called "(F) compound" below.

[0331] The compound (F) preferably has a (meth)acryl group, a vinyl group, or an allyl group from the viewpoint of improving the sensitivity during exposure and improving the reliability of the light-emitting element in the display device. When the alkali-soluble resin (A) has a (meth)acryl group, a vinyl group, or an allyl group, the compound (F) preferably does not have a (meth)acryl group, a vinyl group, or an allyl group.

[0332] The photosensitive composition of the present invention is preferably a (F0) compound having the following (I-f0) structure. (I-f0) Structure: Selected from an oxyalkane bonded to a 1-2 valent aliphatic group having 4 to 30 carbon atoms, an alkylaryl group with 10 to 30 carbon atoms, and an aryl group with 6 to 15 carbon atoms. One of more than one kind of bases in a group composed of bases.

[0333] The photosensitive composition of the present invention is preferably a (FB) compound having the following (I-fb) structure. (I-fb) Structure: A 1- to 2-valent aliphatic group with 1 to 6 carbon atoms having an ammonium cation structure.

[0334] By containing the (F0) compound and / or the (FB) compound, the effects of suppressing residue after development and improving halftone characteristics are significant. In addition, the reliability of the light-emitting components in the display device is significantly improved. The (F0) compound and / or the (FB) compound preferably contains two or more types of compounds, and it is also preferred that the compound contains two or more (F0) compounds and two or more (FB) compounds. Particularly preferred ones contain (F0) compounds and (FB) compounds.

[0335] <(F) compound; (F1) compound and (FB1) compound> The photosensitive composition of the present invention preferably contains the (F0) compound and / or the (FB) compound, the (F0) compound contains the following (F1) compound, and the (FB) compound contains the following (FB1) compound. (F1) Compound: One or more types selected from the group consisting of phosphoric acid compounds, phosphonic acid compounds, hypophosphorous compounds, and salts thereof (hereinafter referred to as "(F1) compounds"). (FB1) compound: one or more types selected from the group consisting of phosphobetaine compounds, phosphonate betaine compounds and hypophosphobetaine compounds (hereinafter referred to as "(FB1) compounds").

[0336] The photosensitive composition of the present invention preferably has the (F1) compound having the following (I-f1) structure and / or (II-f1) structure. (I-f1) Structure: One selected from the group consisting of a monovalent aliphatic group with 4 to 30 carbon atoms, a divalent aliphatic group with 6 to 30 carbon atoms, and an alkylaryl group with 10 to 30 carbon atoms. The basis of the above. (II-f1) Structure: Selected from an oxyalkylene group bonded to a monovalent aliphatic group having 4 to 30 carbon atoms, an oxyalkylene group bonded to an alkylaryl group having 10 to 30 carbon atoms, and bonded One or more groups consisting of an aryl group having 6 to 15 carbon atoms and an oxyalkylene group having 4 to 15 carbon atoms.

[0337] The photosensitive composition of the present invention is preferably a compound (FB1) having the following (I-fb1) structure. (I-fb1) Structure: A 1-2 valent aliphatic group with 1 to 6 carbon atoms having an ammonium cation structure.

[0338] By containing the (F1) compound and / or the (FB1) compound, the effects of suppressing residue after development and improving halftone characteristics are significant. In addition, the reliability of the light-emitting components in the display device is significantly improved. It is also more preferable that the (F1) compound and / or the (FB1) compound contains two or more compounds, and it is still more preferable that the compound (F1) and / or the (FB1) compound contain two or more (F1) compounds and two or more (FB1) compounds. A particularly preferred system contains (F1) compound and (FB1) compound.

[0339] The (F1) compound preferably has a substituent bonded to a phosphorus atom and / or a substituent bonded to an oxygen atom on the P-O bond, and the substituent is the (I-f1) structure and / or the (II-f1) structure. .

[0340] The (I-f1) structure is preferably the following (I-f1x) structure. (I-f1x) Structure: One selected from the group consisting of a monovalent aliphatic group with 6 to 12 carbon atoms, a divalent aliphatic group with 6 to 12 carbon atoms, and an alkylaryl group with 14 to 26 carbon atoms. The basis of the above.

[0341] The monovalent aliphatic group is preferably an alkyl group, an alkenyl group or an alkynyl group. The divalent aliphatic group is preferably an alkylene group, an alkenylene group or an alkynylene group. Furthermore, the (I-f1) structure is preferably a linear structure and / or a branched structure.

[0342] The (II-f1) structure is preferably the following (II-f1x) structure. (II-f1x) Structure: Selected from an oxyalkylene group bonded to a monovalent aliphatic group having 6 to 12 carbon atoms, an oxyalkylene group bonded to an alkylaryl group having 14 to 26 carbon atoms, and bonded One or more groups consisting of an aryl group having 6 to 10 carbon atoms and an oxyalkylene group having 6 to 12 carbon atoms.

[0343] The monovalent aliphatic group is preferably an alkyl group, an alkenyl group or an alkynyl group. Furthermore, the (II-f1) structure is preferably a linear structure and / or a branched structure.

[0344] (F0) The salt of the acidic group containing a phosphorus atom in the compound includes, for example, a salt of an acidic group containing a phosphorus atom and a compound having a cationic structure. Similarly, for example, the salt of a phosphoric acid compound, a salt of a phosphonic acid compound, or a salt of a hypophosphorous compound among the compounds (F1) can be exemplified, for example, a phosphoric acid compound, a phosphonic acid compound, a hypophosphorous compound, and a compound having a cationic structure. of salt. Compounds having a cationic structure include, for example, one or more compounds from the group consisting of cations having metal atoms, ammonium cations, phosphonium cations, and sulfonium cations, and compounds having ammonium cations are preferred. The ammonium cation is preferably a primary ammonium cation, a secondary ammonium cation, a tertiary ammonium cation, or a quaternary ammonium cation, and more preferably a quaternary ammonium cation. The ammonium cation preferably has at least one aliphatic group with a carbon number of 1 to 30, more preferably has an aliphatic group with a carbon number of 1 to 15, still more preferably has an aliphatic group with a carbon number of 1 to 10, and is particularly preferred. It is an aliphatic group with a carbon number of 1 to 6. The aliphatic group is preferably an aliphatic group with a linear structure and / or a branched structure of 1 to 2 valence, and is preferably selected from the group consisting of an alkyl group, an alkenyl group, and an alkynyl group with a linear structure. group, preferably an alkyl group with a straight chain structure.

[0345] The compound (F1) preferably contains one or more types selected from the group consisting of compounds represented by any one of general formulas (11), (12) and (13) and salts thereof. It is also preferable to contain two or more compounds selected from the group consisting of compounds represented by any one of general formulas (11), (12) and (13) and salts thereof. (F1) The compound is particularly preferably a compound containing at least the compound represented by the general formula (12) and / or its salt.

[0346] [Chemical 29]

[0347] In general formulas (11) to (13), Z 11 to Z 13 independently represent direct bonding, a divalent aliphatic group having 6 to 30 carbon atoms, or a group represented by general formula (14). Z 14 to Z 16 each independently represent a direct bond, a divalent aliphatic group having 6 to 30 carbon atoms, or a group represented by the general formula (15). When Z 11 in the general formula (11) is a direct bond, the corresponding R 31 represents a monovalent aliphatic group with 4 to 30 carbon atoms or an alkylaryl group with 10 to 30 carbon atoms. The relationship between Z 12 and the corresponding R 32 and Z 13 and the corresponding R 33 in the general formula (12) and the general formula (13) is the same as that of Z 11 and the corresponding R 31 in the general formula (11). When Z 14 in the general formula (11) is a direct bond, the corresponding R 34 represents a hydrogen atom, a monovalent aliphatic group with 4 to 30 carbon atoms, an alkylaryl group with 10 to 30 carbon atoms, and a photoreactive group. An alkenyl group having 2 to 5 carbon atoms, an alkynyl group having 2 to 5 carbon atoms, or a thermally reactive group. In the general formula (12) and the general formula (13), Z 15 and the corresponding R 35, and Z 16 and the corresponding R 36 have the same relationship as Z 14 and the corresponding R 34 in the general formula (11). When at least one of Z 11 and Z 14 in the general formula (11) is a divalent aliphatic group with 6 to 30 carbon atoms, the corresponding R 31 and / or R 34 independently represent a hydrogen atom, a hydroxyl group or a carbon number. 1 to 15-1-valent organic radicals. In the general formula (12) and the general formula (13), Z 12 and Z 15 and the corresponding R 32 and R 35, and Z 13 and Z 16 and the corresponding R 33 and R 36 are the same as those in the general formula (11). The relationship between Z 11 and Z 14 and the corresponding R 31 and R 34 are the same. When Z 11 in general formula (11) is a group represented by general formula (14), the corresponding R 31 represents a monovalent aliphatic group with 4 to 30 carbon atoms, an alkylaryl group with 10 to 30 carbon atoms, or a carbon number 6~15 aryl groups. In the general formula (12) and the general formula (13), Z 12 and the corresponding R 32, and Z 13 and the corresponding R 33 have the same relationship as Z 11 and the corresponding R 31 in the general formula (11). When Z 14 in general formula (11) is a group represented by general formula (15), the corresponding R 34 represents a hydrogen atom, a monovalent aliphatic group with 4 to 30 carbon atoms, an alkylaryl group with 10 to 30 carbon atoms, Aryl group with 6 to 15 carbon atoms, photoreactive group, alkenyl group with 2 to 5 carbon atoms, alkynyl group with 2 to 5 carbon atoms, or thermally reactive group. In the general formula (12) and the general formula (13), Z 15 and the corresponding R 35, and Z 16 and the corresponding R 36 have the same relationship as Z 14 and the corresponding R 34 in the general formula (11). The photoreactive group, the alkenyl group having 2 to 5 carbon atoms, and the alkynyl group having 2 to 5 carbon atoms are preferably radical polymerizable groups. The thermally reactive group is preferably an alkoxymethyl group, a hydroxymethyl group, an epoxy group, an oxo group, or a blocked isocyanate group.

[0348] In general formula (14) and general formula (15), Y 11 and Y 12 each independently represent an alkylene group having 1 to 15 carbon atoms. R 37 and R 38 each independently represent an alkyl group having 1 to 6 carbon atoms. m and n independently represent integers from 1 to 15. p and q independently represent integers from 0 to 4. ✽ 1 represents the bonding point with the oxygen atom in the general formula (11), the bonding point with the phosphorus atom in the general formula (12), or the bonding point with the phosphorus atom in the general formula (13) point. ✽ 2 represents the bonding point with R 31 in general formula (11), the bonding point with R 32 in general formula (12), or the bonding point with R 33 in general formula (13) point. ✽ 3 represents the bonding point with the oxygen atom in the general formula (11), the bonding point with the oxygen atom in the general formula (12), or the bonding point with the phosphorus atom in the general formula (13) point. ✽ 4 represents the bonding point with R 34 in general formula (11), the bonding point with R 35 in general formula (12), or the bonding point with R 36 in general formula (13) point.

[0349] The photosensitive composition of the present invention preferably contains propylene glycol monoalkyl ether acetate as a solvent having an acetate bond described below, and the compound (F1) is in the above general formulas (11) to (13), Z When 11 ~ Z 13 are directly bonded or groups represented by general formula (14), the monovalent aliphatic groups with carbon number 4 ~ 30 in R 31 ~ R 33 are independently monovalent aliphatic groups with carbon number 6 ~ 12. Base, in the above general formulas (11) ~ (13), when Z 14 ~ Z 16 are directly bonded, R 34 ~ R 36 are hydrogen atoms.

[0350] Such (F1) compound is hereinafter referred to as "specific (F1) compound". Furthermore, the compound (F1) has a monovalent aliphatic group having 6 to 12 carbon atoms as the above-mentioned (I-f1) structure, and / or has an oxyalkane to which a monovalent aliphatic group having 6 to 12 carbon atoms is bonded. When the group has the above-mentioned (II-f1) structure, this compound is also referred to as "specific (F1) compound" below.

[0351] By containing the specific (F1) compound, the solubility of the (F1) compound to propylene glycol monoalkyl ether acetate can be significantly improved. This significantly reduces residue after development and improves halftone characteristics. In addition, the reliability of the light-emitting components in the display device is significantly improved. Furthermore, the propylene glycol monoalkyl ether acetate is preferably propylene glycol monomethyl ether acetate or propylene glycol monoethyl ether acetate, and more preferably propylene glycol monomethyl ether acetate.

[0352] From the viewpoint of improving halftone characteristics, the compound (F1) preferably further has the following structure (III-f1). (III-f1) Structure: One or more types selected from the group consisting of a photoreactive group, an alkenyl group having 2 to 5 carbon atoms, and an alkynyl group having 2 to 5 carbon atoms.

[0353] (F1) The compound preferably has a substituent bonded to a phosphorus atom and / or two or more substituents bonded to an oxygen atom on a P-O bond, The substituent is (I-f1) structure and / or (II-f1) structure, and (III-f1) structure.

[0354] In the structure (III-f1), the photoreactive group is preferably a radical polymerizable group, more preferably a styrene group, a cinnamonyl group, a maleimide group or a (meth)acrylyl group, and More preferably, it is (meth)acrylyl group. On the other hand, the alkenyl group having 2 to 5 carbon atoms or the alkynyl group having 2 to 5 carbon atoms is preferably a radical polymerizable group, more preferably vinyl, allyl, 2-methyl-2-propenyl, Crotonyl, 2-methyl-2-butenyl, 3-methyl-2-butenyl, 2,3-dimethyl-2-butenyl, ethynyl or 2-propynyl, more Preferably it is vinyl or allyl.

[0355] The photosensitive composition of the present invention preferably contains the above-mentioned (F1) compound and / or (FB1) compound, and is different from the (F1) compound and contains the above-mentioned alkene selected from the photoreactive group and having 2 to 5 carbon atoms. group, and at least one type of the group consisting of an alkynyl group having 2 to 5 carbon atoms, and at least one type selected from the group consisting of a phosphoric acid compound, a phosphonic acid compound, and a hypophosphorous acid compound.

[0356] The (FB1) compound preferably has a substituent bonded to a phosphorus atom and / or a substituent bonded to an oxygen atom on a P-O bond, and the substituent has the structure (I-fb1).

[0357] In the (I-fb1) structure, the 1- to 2-valent aliphatic group having 1 to 6 carbon atoms is preferably a divalent aliphatic group having 1 to 4 carbon atoms. The monovalent aliphatic group is preferably an alkyl group, an alkenyl group or an alkynyl group. The divalent aliphatic group is preferably an alkylene group, an alkenylene group or an alkynylene group. Furthermore, the 1- to 2-valent aliphatic group having 1 to 6 carbon atoms is preferably a linear structure and / or a branched structure. The 1-2 valent aliphatic group having 1 to 6 carbon atoms may have an alkyl group having 1 to 6 carbon atoms, an alkoxy group having 1 to 6 carbon atoms, a carboxyl group or a hydroxyl group as a substituent.

[0358] In the (I-fb1) structure, the ammonium cation structure is preferably an ammonium cation, a monoalkylammonium cation, a dialkylammonium cation, or a trialkyl quaternary ammonium cation, and more preferably a trialkyl quaternary ammonium cation.

[0359] The structure (I-fb1) is more preferably a structure derived from a nitrogen-containing aliphatic alcohol compound having 1 to 6 carbon atoms having at least 1 hydroxyl group and at least 1 ammonium group or amine group. This compound is preferably ethanolamine, propanolamine, butanolamine, pentanolamine, serine, threonine, tyrosine or choline; more preferably, it is ethanolamine, serine or choline.

[0360] The photosensitive composition of the present invention preferably contains at least propylene glycol monoalkyl ether acetate as a solvent having an acetate bond described below, and further contains diethylene glycol dialkyl ether as a solvent having at least three ethers described below. solvent for the bond, and / or a solvent containing one or more selected from the group consisting of propylene glycol monoalkyl ether, alkyl lactate, alkyl glycolate, and hydroxyalkyl acetate as a solvent with alcoholic hydroxyl groups mentioned later. (hereinafter referred to as "when the specific solvent is contained"), the (FB1) compound preferably has a trialkyl quaternary ammonium cation structure in the above-mentioned (I-fb1) structure.

[0361] The trialkyl quaternary ammonium cation structure preferably has three alkyl groups with 1 to 6 carbon atoms, and more preferably has 3 alkyl groups with 1 to 4 carbon atoms. Such (FB1) compound is hereinafter referred to as "specific (FB1) compound".

[0362] When the (FB1) compound contains a specific solvent, the solubility of the (FB1) compound in the solvent can be significantly improved specifically by the (FB1) compound containing the specific (FB1) compound. This significantly reduces residue after development and improves halftone characteristics. In addition, the reliability of the light-emitting components in the display device is significantly improved. Furthermore, the propylene glycol monoalkyl ether acetate is preferably propylene glycol monomethyl ether acetate, propylene glycol monoethyl ether acetate, and more preferably propylene glycol monomethyl ether acetate. Furthermore, the diethylene glycol dialkyl ether is preferably diethylene glycol dimethyl ether, diethylene glycol diethyl ether and diethylene glycol ethyl methyl ether, and more preferably diethylene glycol ethyl ether. Methyl ether. Furthermore, propylene glycol monoalkyl ether, alkyl lactate, alkyl glycolate or hydroxyalkyl acetate are preferably propylene glycol monomethyl ether, propylene glycol monoethyl ether, methyl lactate, ethyl lactate, or methyl glycolate. ester, ethyl glycolate, 2-hydroxymethyl acetate, and 2-hydroxyethyl acetate, more preferably propylene glycol monomethyl ether, ethyl lactate, ethyl glycolate or 2-hydroxyethyl acetate.

[0363] The compound (FB1) preferably further has the following structure (II-fb1) from the viewpoints of suppressing residue after development, improving half-tone characteristics, and improving reliability of light-emitting elements in display devices. (II-fb1) Structure: a fatty acid ester structure derived from a fatty acid compound with 6 to 30 carbon atoms, and / or an aliphatic ether structure derived from an aliphatic alcohol with 6 to 30 carbon atoms.

[0364] The (FB1) compound preferably has a substituent bonded to a phosphorus atom and / or two or more substituents bonded to an oxygen atom on a P-O bond, and the substituents are (I-fb1) structure and (II-fb1 )structure.

[0365] The (II-fb1) structure preferably has a 1- to 2-valent aliphatic group having a carbon number of 6 to 30, and more preferably has a 1- to 2-valent aliphatic group having a carbon number of 10 to 20. The monovalent aliphatic group is preferably an alkyl group,...

Claims

1. A photosensitive component that satisfies either condition (α) or condition (β), wherein, The total solids content has a double bond equivalent of 600~6,000 g / mol; further contains one or more compounds selected from the group consisting of amide compounds of general formula (21), cyclic urea compounds of general formula (22), and urea compounds of general formula (23); and satisfies the following condition (4); when condition (α) is satisfied, the compound having a (WA) weak acid group and a free radical polymerizable group in the following (I) compounds contains (A) alkali-soluble resin; the compound having a (WA) weak acid group in the following (II) compounds contains (A) alkali-soluble resin, and the compound having a free radical polymerizable group contains (B) free radical polymerizable compound; when condition (β) is satisfied, (A) alkali-soluble resin has the following (WA) weak acid group, or has the following (WA) weak acid group and a free radical polymerizable group, and (B) free radical polymerizable compound has at least 2 free radical polymerizable groups; Condition (α): Contains the following (I) and / or the following (II); (I) A compound having the following (WA) weak acidic group and a free radical polymerizable group; (II) A compound having the following (WA) weak acidic group and a free radical polymerizable group; Condition (β): Contains (A) an alkali-soluble resin, (B) a free radical polymerizable compound and (C) a photosensitizer; (WA) weak acidic group: selected from one or more groups of the group consisting of phenolic hydroxyl, hydroxyimidin, hydroxyamino, silyl, 1,1-bis(trifluoromethyl)hydroxymethyl and mercapto; (4) The total content of the amide compound of general formula (21), the cyclic urea compound of general formula (22) and the urea compound of general formula (23) in the total solids of the photosensitive composition is 0.010~5.0% by mass%. (In general formulas (21) to (23), R47 to R54 independently represent hydrogen atoms, alkyl groups with 1 to 6 carbons, cycloalkyl groups with 4 to 10 carbons, or aryl groups with 6 to 15 carbons, respectively; R130 represents hydrogen atoms, alkyl groups with 1 to 6 carbons, alkoxy groups with 1 to 6 carbons, hydroxyalkyl groups with 1 to 6 carbons, hydroxyalkoxy groups with 1 to 6 carbons, hydroxyl groups, amino groups, monoalkylamino groups with 1 to 6 carbons, or dialkylamino groups with 2 to 12 carbons; R132, R133, R137, and R138 independently represent alkyl groups with 1 to 6 carbons, respectively; b and c independently represent integers from 0 to 6, respectively; d represents 1 or 2; h and i independently represent integers from 0 to 2, respectively; when b is 0, d is 1).

2. A photosensitive component that satisfies either condition (α) or condition (β), wherein, The total solids content contains a double bond equivalent of 600 to 6,000 g / mol; further comprising one or more compounds selected from the group consisting of N,N'-dimethylformamide, N,N'-diethylformamide, N,N'-dimethylacetamide, N,N'-dimethylpropionamide, N,N'-dimethylisobutylamide, N,N'-dimethyl-3-methoxypropionamide, N,N'-dimethyl-3-butoxypropionamide, 1,3-dimethyl-2-imidazolidinone, 1,3-diethyl-2-imidazolidinone, N,N'-dimethylpropylurea, 1,1,3,3-tetramethylurea and 1,1,3,3-tetraethylurea (hereinafter referred to as "specific nitrogen-containing compound α"); and satisfying the following condition (4α); Under condition (α), a compound having a (WA) weak acidic group and a free radical polymerizable group in the following (I) compounds contains (A) a base-soluble resin; a compound having a (WA) weak acidic group in the following (II) compounds contains (A) a base-soluble resin, and a compound having a free radical polymerizable group contains (B) a free radical polymerizable compound; Under condition (β), (A) a base-soluble resin has the following (WA) weak acidic group, or has the following (WA) weak acidic group and a free radical polymerizable group, and (B) a free radical polymerizable compound has at least 2 free radical polymerizable groups; Condition (α): containing the following (I) compounds and / or the following (II) compounds; (I) compounds having the following (WA) weak acidic groups and free radical polymerizable groups; (II) compounds having the following (WA) weak acidic groups and compounds having free radical polymerizable groups; Condition (β): Contains (A) alkali-soluble resin, (B) free radical polymerizable compound and (C) photosensitizer; (WA) weak acidic group: selected from one or more groups of the group consisting of phenolic hydroxyl, hydroxylimino, hydroxylamine, silyl, 1,1-bis(trifluoromethyl)hydroxymethyl and mercapto; (4α) The total content of a specific nitrogen-containing compound α in the total solids of the photosensitive composition is 0.010 to 5.0% by mass.

3. A photosensitive component that satisfies either condition (α) or condition (β), wherein, The double bond equivalent in the total solids is 600~6,000 g / mol; further satisfying at least one of the following conditions (γ) and conditions (δ); under condition (α), the compound having a (WA) weak acidic group and a free radical polymerizable group in the compound of (I) below contains (A) a base-soluble resin; the compound having a (WA) weak acidic group in the compound of (II) below contains (A) a base-soluble resin, and the compound having a free radical polymerizable group contains (B) a free radical polymerizable compound; under condition (α) below, the compound containing (I) below further contains (B) a free radical polymerizable compound, or; the compound containing (II) below, and the compound having a free radical polymerizable group contains (B) a free radical polymerizable compound. Under condition (β), (A) the alkali-soluble resin has the following (WA) weak acidic group, or has the following (WA) weak acidic group and a free radical polymerizable group, and (B) the free radical polymerizable compound has at least 2 free radical polymerizable groups; Under condition (β) above, (B) the free radical polymerizable compound has at least 2 free radical polymerizable groups (wherein, (B6) and (B7) are compounds different from (B4) and (B5) and do not have a structure containing an alicyclic structure, a structure containing a heterocyclic structure, or a structure containing an aromatic structure); Condition (α): containing a compound of (I) below and / or a compound of (II) below; (I) a compound having the following (WA) weak acidic group and a free radical polymerizable group; (II) a compound having the following (WA) weak acidic group and a compound having a free radical polymerizable group; Condition (β): Contains (A) an alkali-soluble resin, (B) a free radical polymerizable compound, and (C) a photosensitizer; (WA) a weakly acidic group: selected from one or more groups of the group consisting of phenolic hydroxyl, hydroxyimidin, hydroxyamino, silyl, 1,1-bis(trifluoromethyl)hydroxymethyl, and mercapto; Condition (γ): (B) the free radical polymerizable compound contains the following (B4) fourth polymerizable compound and (B5) fifth polymerizable compound; Condition (δ): (B) the free radical polymerizable compound contains the following (B6) sixth polymerizable compound and (B7) seventh polymerizable compound; (B4) fourth polymerizable compound: a compound having the following (I-b4) structure and further having 2 free radical polymerizable groups; (I-b4) structure: a structure containing a condensed polycyclic alicyclic structure and / or a cyclic structure having at least two nitrogen atoms; (B5) Fifth polymerizable compound: A compound having the following (I-b5) and (II-b5) structures, and further having two free radical polymerizable groups; (I-b5) structure: A structure containing a benzene structure or a structure containing a biphenyl structure;(II-b5) Structure: a structure containing an alkyl group, a structure containing an oxyalkyl group, a structure containing a hydroxyl-containing alkyl group, a structure containing a hydroxyl-containing oxyalkyl group, a structure containing an alkyl carbonyl group, a structure containing an oxyalkyl carbonyl group, or a structure containing an aminoalkyl carbonyl group; (B6) 6th polymerizable compound: a compound having at least 2 (meth)acrylonitrile groups and further having the structure described below (I-b6); (I-b6) Structure: at least 2 (meth)acrylonitrile groups are linked by a minimum number of 4 to 10 atoms, and the structure contains an alkyl group, a structure containing an oxyalkyl group, a structure containing a hydroxyl-containing alkyl group, a structure containing a hydroxyl-containing oxyalkyl group, a structure containing an alkyl carbonyl group, a structure containing an oxyalkyl carbonyl group, or a structure containing an aminoalkyl carbonyl group; (B7) 7th polymerizable compound: a compound having at least 2 (meth)acrylonitrile groups and further having the structure described below (I-b7); (I-b7) Structure: At least two (meth)acrylic groups are linked by a minimum of 11 to 45 atoms, and the structure contains an alkyl group, an oxoalkyl group, a hydroxyl-containing alkyl group, a hydroxyl-containing oxoalkyl group, an alkylcarbonyl group, an oxoalkylcarbonyl group, or an aminoalkylcarbonyl group.

4. The photosensitive composition as claimed in claim 3, wherein, Further containing one or more compounds selected from the group consisting of cyclic amide compounds of general formula (20), amide compounds of general formula (21), cyclic urea compounds of general formula (22), and urea compounds of general formula (23); and satisfying the following condition (4a): (4a) the total content of cyclic amide compounds of general formula (20), amide compounds of general formula (21), cyclic urea compounds of general formula (22), and urea compounds of general formula (23) in the total solids of the photosensitive composition is 0.010 to 5.0% by mass%. (In general formulas (20) to (23), R46 to R54 independently represent hydrogen atoms, alkyl groups with 1 to 6 carbons, cycloalkyl groups with 4 to 10 carbons, aryl groups with 6 to 15 carbons, or alkenyl groups with 2 to 6 carbons, respectively; R130 represents hydrogen atoms, alkyl groups with 1 to 6 carbons, alkoxy groups with 1 to 6 carbons, hydroxyalkyl groups with 1 to 6 carbons, hydroxyalkoxy groups with 1 to 6 carbons, hydroxyl groups, amino groups, monoalkylamino groups with 1 to 6 carbons, or dialkylamino groups with 2 to 12 carbons; R131 to R138 independently represent alkyl groups with 1 to 6 carbons, respectively; a, b, and c independently represent integers from 0 to 6; d represents 1 or 2; e, f, g, h, and i independently represent integers from 0 to 2; when b is 0, d is 1).

5. The photosensitive composition as claimed in claim 3, wherein, Further containing, selected from N-methyl-2-pyrrolidone, N-ethyl-2-pyrrolidone, N-butyl-2-pyrrolidone, N-cyclohexyl-2-pyrrolidone, N-vinyl-2-pyrrolidone, N,N'-dimethylformamide, N,N'-diethylformamide, N,N'-dimethylacetamide, N,N'-dimethylpropionic acid, N,N'-dimethylisobutylamide, N,N'-dimethyl-3- The sample comprises one or more of the group consisting of methoxypropionylamine, N,N'-dimethyl-3-butoxypropionylamine, 1,3-dimethyl-2-imidazolidinone, 1,3-diethyl-2-imidazolidinone, N,N'-dimethylpropylurea, 1,1,3,3-tetramethylurea, and 1,1,3,3-tetraethylurea (hereinafter referred to as "specific nitrogen-containing compound β"); and satisfies the following condition (4β): (4β) The total content of specific nitrogen-containing compound β in the total solids of the photosensitive composition is 0.010 to 5.0% by mass.

6. The photosensitive composition as claimed in claim 1, wherein, The equivalent of weakly acidic groups in the total solids is 400~6,000 g / mol.

7. The photosensitive composition as claimed in claim 1 or 2, wherein, It further contains one or more components selected from the group consisting of sodium, potassium, magnesium, calcium, iron, copper and chromium; and satisfies the following condition (5); (5) the total content of sodium, potassium, magnesium, calcium, iron, copper and chromium in the total solids of the photosensitive composition is 0.010 to 500 ppm by mass.

8. The photosensitive composition as claimed in claim 1 or 2, wherein, Under the condition (α) above, the compound containing (I) above further contains (B) radical polymerizable compound; or, the compound containing (II) above, and the compound having the above radical polymerizable group, contains the above (B) radical polymerizable compound; Under the condition (β) above, the above (B) radical polymerizable compound has at least 2 radical polymerizable groups; Further satisfying at least one of the following conditions (γ) and conditions (δ) (wherein, compounds (B6) and (B7) are compounds different from compounds (B4) and (B5), and do not have a structure containing an alicyclic structure, a structure containing a heterocyclic structure, or a structure containing an aromatic structure); Condition (γ): The (B) radical polymerizable compound contains the following (B4) fourth polymerizable compound and (B5) fifth polymerizable compound; Condition (δ): The (B) radical polymerizable compound contains the following (B6) sixth polymerizable compound and (B7) seventh polymerizable compound; (B4) fourth polymerizable compound: a compound having the following (I-b4) structure and further having 2 radical polymerizable groups; (I-b4) structure: a structure containing a condensed polycyclic alicyclic structure and / or a cyclic structure having at least two nitrogen atoms; (B5) fifth polymerizable compound: a compound having the following (I-b5) structure and (II-b5) structure and further having 2 radical polymerizable groups; (I-b5) structure: a structure containing a benzene structure or a structure containing a biphenyl structure; (II-b5) structure: a structure containing an alkyl group, a structure containing an oxoalkyl group, a structure containing a hydroxyl-containing alkyl group, a structure containing a hydroxyl-containing oxoalkyl group, a structure containing an alkylcarbonyl group, a structure containing an oxoalkylcarbonyl group, or a structure containing an aminoalkylcarbonyl group; (B6) Sixth polymerizable compound: A compound having two (meth)acrylic groups and further having the structure described in (I-b6); (I-b6) structure: The two (meth)acrylic groups are linked by a minimum number of 4 to 10 atoms, and the structure contains an alkyl group, an oxoalkyl group, a hydroxyl-containing alkyl group, a hydroxyl-containing oxoalkyl group, an alkylcarbonyl group, an oxoalkylcarbonyl group, or an aminoalkylcarbonyl group; (B7) Seventh polymerizable compound: A compound having two (meth)acrylic groups and further having the structure described in (I-b7); (I-b7) Structure: Two (meth)acrylic groups are linked by a minimum number of 11 to 45 atoms, and the structure contains an alkyl group, an oxyalkyl group, a hydroxyl-containing alkyl group, a hydroxyl-containing oxyalkyl group, an alkylcarbonyl group, an oxyalkylcarbonyl group, or an aminoalkylcarbonyl group.

9. The photosensitive component of any one of claims 1 to 5, wherein, The equivalent of weakly acidic groups in the total solids is 400~1,500 g / mol; the equivalent of the above double bonds is 750~6,000 g / mol.

10. The photosensitive composition of any one of claims 1 to 5, wherein, It further contains one or more components selected from the group consisting of halogen-containing elements, sulfur-containing elements and phosphorus-containing elements, and satisfies one or more of the following conditions (1) to (3): (1) The content of halogen elements in the photosensitive composition is 0.01 to 100 ppm by mass; (2) The content of sulfur elements in the photosensitive composition is 0.01 to 100 ppm by mass; (3) The content of phosphorus elements in the photosensitive composition is 0.01 to 100 ppm by mass.

11. The photosensitive composition of any one of claims 1 to 5, wherein, It further contains (I) inorganic particles; the (I) inorganic particles contain (I1) silicon dioxide particles.

12. The photosensitive component of any one of claims 1 to 5, wherein, Under the condition (α) above, the compound containing (I) above further contains (B) a free radical polymerizable compound and (C) a photosensitizer; or, the compound containing (II) above further contains (C) a photosensitizer, and the compound having the above free radical polymerizable group contains the above free radical polymerizable compound (B); under the condition (β) above, the above free radical polymerizable compound (B) has at least two free radical polymerizable groups; the (A) alkali-soluble resin contains a resin with free radical polymerizable groups and a resin without free radical polymerizable groups; the (C) photosensitizer contains a (C1) photopolymerization initiator.

13. The photosensitive composition as claimed in claim 12, wherein, The above-mentioned (A) alkali-soluble resin contains one or more of the group consisting of (A3-1) resin, (A3-2) resin, (A3-3) resin and (A3-4) resin selected from the following: (A3-1) resin: phenolic resin; (A3-2) resin: polyhydroxystyrene; (A3-3) resin: epoxy resin containing phenolic groups; (A3-4) resin: acrylic resin containing phenolic groups.

14. The photosensitive composition as claimed in claim 13, wherein, The above-mentioned (A) alkali-soluble resin contains one or more of the group consisting of the above-mentioned (A3-4) phenol-modified acrylic resin and the above-mentioned (A3-3) phenol-modified epoxy resin.

15. The photosensitive composition of any one of claims 1 to 5, wherein, Under the condition (α) above, the compound containing (I) above further contains (B) a free radical polymerizable compound; or, the compound containing (II) above, and the compound having the above free radical polymerizable group, contains the above (B) free radical polymerizable compound; Under the condition (β) above, the above (B) free radical polymerizable compound has at least two free radical polymerizable groups; The (A) alkali-soluble resin contains one or more of the group consisting of (A1) resin, (A2) resin, and (A3) resin selected below; The (A) alkali-soluble resin contains a resin having a free radical polymerizable group and a resin not having a free radical polymerizable group; The above resin having a free radical polymerizable group contains the (A2) resin and / or the (A3b) resin below; The above resin not having a free radical polymerizable group contains the (A1) resin and / or the (A3a) resin below; (A1) Resin: A resin having the weak acidic group (WA) mentioned above, and further having one or more structural units comprising a group selected from amide, amide, oxazole and siloxane structures, and without a free radical polymerizable group; (A2) Resin: A resin having a free radical polymerizable group; (A3) Resin: A resin having phenolic hydroxyl groups; (A3a) Resin: (A3) resin having phenolic hydroxyl groups and without a free radical polymerizable group; (A3b) Resin: (A3) resin having both phenolic hydroxyl groups and a free radical polymerizable group.

16. The photosensitive composition of any one of claims 1 to 5, wherein, Further comprising (D1a-1) organic black pigment and / or (D1a-3) two or more color pigment mixtures; the (D1a-1) organic black pigment comprises one or more pigments selected from the group consisting of (D1a-1a) benzofuranone black pigments, (D1a-1b) perylene black pigments and (D1a-1c) azo black pigments; the (D1a-3) two or more color pigment mixture comprises two or more pigments selected from the group consisting of red, orange, yellow, green, blue and purple pigments.

17. A hardened material formed by hardening the photosensitive composition of any one of claims 1 to 16.

18. A display device comprising the hardened material of claim 16.

19. An electronic component comprising the hardened material of claim 16.

20. A method for manufacturing a hardened material, comprising the following steps: (1) forming a coating film of any one of claims 1 to 16 on a substrate; (2) irradiating the coating film of the photosensitive composition with active chemical rays via a photomask; (3) developing the coating film of the photosensitive composition using an alkaline solution to form a pattern of the photosensitive composition; and (4) heating the pattern to obtain a hardened pattern of the photosensitive composition.

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