Method for manufacturing resin composition for temporary fixing material formation, temporary fixing material, support belt for substrate transport, and electronic device.

Abstract

The resin composition for forming the temporary fixation material contains acrylic rubber with epoxy groups and silicone compound with amino groups. When a film is formed by heating at 90°C for 5 minutes and then at 140°C for 5 minutes, the elastic modulus of the film is 2 MPa or more at 100°C. After heating at 170°C for 2 hours, the elastic modulus of the film is 500 MPa or more at 25°C.

Description

Technical Field

[0001] This disclosure relates to a resin composition for forming a temporary fixing material, a temporary fixing material, a support belt for transporting a substrate, and a method for manufacturing an electronic device. Prior Technology

[0002] With the miniaturization and increasing performance of electronic devices such as smartphones and tablet PCs, the mounting density of semiconductor components or semiconductor packages used in these devices is increasing. For example, flip-chip mounting is being used instead of wire bonding for the connection between the wiring board and the semiconductor chip. Furthermore, to cope with high-density mounting, multilayer wiring boards with a core layer and a wiring layer with an added layer structure on both sides are also being used. As a manufacturing method utilizing such semiconductor packages, for example, Patent Document 1 discloses a method in which, after forming a solder resist layer on the multilayer wiring board, the wiring of the wiring board is connected to the semiconductor chip by reflow soldering using a soldering material.

[0003] [Patent Document 1] International Publication No. 2009 / 081518

[0004] To further reduce the thickness of electronic components such as semiconductor devices and semiconductor packages, thin organic substrates are being explored as substrates. Specifically, the development of coreless substrates, which do not use a core layer impregnated with thermosetting resin in glass cloth, is actively underway. Coreless substrates do not have a core layer, thus reducing the substrate thickness. However, due to the lack of a highly elastic core layer, it is difficult to ensure the rigidity of the substrate itself, posing a problem for the operability in the manufacturing process of electronic components.

[0005] Against this backdrop, the inventors attempted the following method: by attaching a support to a substrate as a laminate using a temporary fixing material, rigidity is ensured and operability in the manufacturing process of electronic components is improved. However, in the aforementioned manufacturing process, processes such as the formation of solder resist including heat treatment and reflow are performed in the laminated state. Therefore, during processing, peeling or foaming that becomes the starting point for peeling can easily occur between the support and the substrate (between the support and the temporary fixing material or between the temporary fixing material and the substrate). Furthermore, after processing, the temporary fixing material and the support will be peeled off from the substrate. At this time, it is not ideal if the temporary fixing material remains on the substrate side. Summary of the Invention

[0006] In view of the above, the purpose of this disclosure is to provide a temporary fixing material that can suppress peeling between the support and the substrate during processing including heat treatment and peeling off from the substrate after processing, as well as a resin composition for forming the temporary fixing material, a support belt for transporting the substrate, and a method for manufacturing an electronic device.

[0007] To address the aforementioned issues, the inventors attempted to embed a temporary fixing material with a low elastic modulus into the fine irregularities on the substrate to suppress foaming during the reflow process. However, it was found that it was difficult to adjust the appropriate elastic modulus based on the aspect ratio or depth of the irregularities. If the elastic modulus was excessively lowered, the temporary fixing material would easily remain on the substrate side when peeling it off from the substrate at room temperature after the reflow process. Therefore, the inventors attempted to suppress peeling during the reflow process by intentionally reducing the embedding properties of the temporary fixing material against the irregularities. They discovered that by combining specific thermoplastic resins and specific silicone compounds to adjust the elastic modulus of the temporary fixing material within a specific range, it was possible to achieve both suppression of peeling during the reflow process and ease of peeling after the reflow process, thus completing this invention.

[0008] This disclosure provides a resin composition for forming a temporary fixing material, which is used to form a temporary fixing material for temporarily fixing a substrate transport support to an organic substrate. It contains an acrylic rubber having epoxy groups and a silicone compound having amine groups. When a film is formed by heating at 90°C for 5 minutes and then at 140°C for 5 minutes, the elastic modulus of the film is 2 MPa or more at 100°C. After heating at 170°C for 2 hours, the elastic modulus of the film is 500 MPa or more at 25°C.

[0009] Based on the aforementioned resin composition for forming temporary fixing materials, a temporary fixing material can be formed that can simultaneously suppress peeling between the support and the substrate during processing, including heat treatment, and prevent peeling from the substrate after processing. The inventors believe the reasons for this effect are as follows: First, it is believed that when the film is formed from the resin composition, the epoxy-based acrylic rubber reacts with the amine-based silicone compound, thereby increasing the elastic modulus when the uncured film is attached to the substrate. Although embedding is suppressed, the wettability to the substrate is improved, thereby sufficiently suppressing peeling during processing. Furthermore, the inventors speculate that, in addition to suppressing the aforementioned embedding, the elastic modulus of the cured film at room temperature is also sufficiently increased, thereby sufficiently suppressing the residue of the temporary fixing material on the substrate side when peeling the temporary fixing material and the support from the substrate at room temperature after processing.

[0010] The resin composition for forming the temporary fixation material may further contain an epoxy curing agent.

[0011] The content of the silicone compound in the resin composition for forming the temporary fixing material can be 1 to 10 parts by mass relative to 100 parts by mass of the acrylic rubber. By keeping the content of the silicone compound within the above range, it is easy to form a temporary fixing material with an elastic modulus of 2 MPa or more at 100°C, and it is easy to obtain wettability to the substrate.

[0012] This disclosure also provides a temporary fixing material, which is formed using the resin composition for forming the temporary fixing material disclosed above. According to this temporary fixing material, it is possible to simultaneously suppress peeling between the support and the substrate during processing, including heat treatment, and to prevent peeling from the substrate after processing.

[0013] This disclosure also provides a substrate transport support belt comprising: a support film for transporting an organic substrate; and a temporary fixing material layer disposed on the support film and used for temporarily fixing the organic substrate and the support film, wherein the temporary fixing material layer is formed using the resin composition for forming temporary fixing material disclosed above.

[0014] The aforementioned substrate transport support belt can improve the operability of organic substrates and can also suppress the peeling between the support and the substrate during processing including heat treatment and the peelability of the temporary fixing material from the substrate after processing.

[0015] This disclosure also provides a method for manufacturing an electronic device, comprising: a first step of obtaining a laminate by attaching a support to an organic substrate via a temporary fixing material; a second step of heating the temporary fixing material of the laminate; a third step of subjecting the laminate obtained in the second step to a process including heat treatment; and a fourth step of peeling the support and the temporary fixing material from the organic substrate of the laminate obtained in the third step, wherein the temporary fixing material is formed using the resin composition for forming temporary fixing material disclosed above.

[0016] According to the above-described method for manufacturing electronic devices, electronic devices incorporating thin organic substrates can be manufactured with high productivity. Specifically, in the above-described manufacturing method, the temporary fixing material is formed using the temporary fixing resin composition disclosed herein, thereby achieving the following effects: (i) the organic substrate and the support can be bonded in the first step, and the operability of the thin organic substrate is improved (e.g., easy transport of the thin organic substrate); (ii) the temporary fixing material from the second step can adequately fix the organic substrate and the support in the third step, and processing including heat treatment can be performed well; (iii) it can be easily peeled off from the organic substrate in the fourth step without contaminating the substrate surface; etc.

[0017] In the above manufacturing method, the processing in step 3 may include at least one of the formation of solder resist and reflow soldering.

[0018] In the above manufacturing method, the thickness of the organic substrate can be 200 μm or less. Furthermore, the organic substrate can be a coreless substrate. [Invention Effects]

[0019] According to this disclosure, a temporary fixing material that can suppress peeling between the support and the substrate during processing including heat treatment and peeling off from the substrate after processing can be provided, as well as a resin composition for forming the temporary fixing material, a support belt for substrate transport, and a method for manufacturing an electronic device.

[0020] The resin composition for forming the temporary fixing material disclosed herein can form a temporary fixing material that can adequately fix the organic substrate and the transport support, and allows the support to be easily peeled off from the organic substrate without soiling the substrate surface. The substrate transport support belt disclosed herein can improve the operability of the organic substrate and allows for easy peeling off from the organic substrate without soiling the substrate surface. Simple Explanation of the Diagram

[0021] Figure 1 shows one embodiment of the support belt for substrate transport. Figure 1(A) is a top view, and Figure 1(B) is a schematic cross-sectional view cut along line II of Figure 1(A). Figures 2(a) to 2(c) are schematic cross-sectional views illustrating one embodiment of a method for manufacturing an electronic device. Figures 3(d) to 3(e) are schematic cross-sectional views illustrating one embodiment of the manufacturing method of an electronic device. Figures 4(f) to 4(h) are schematic cross-sectional views illustrating one embodiment of the manufacturing method of an electronic device. Implementation

[0022] The following describes in detail the forms used to implement this disclosure, with reference to the accompanying drawings as appropriate. However, this disclosure is not limited to the following embodiments. Furthermore, in this specification, "(meth)acrylic acid" means acrylic acid or methacrylic acid, and "(meth)acrylate" means acrylate or its corresponding methacrylate. "A or B" may contain either A or B, or both.

[0023] Furthermore, in this specification, the term "layer," when viewed as a planar diagram, includes not only the structure forming a shape across the entire surface but also the structure forming a shape within a portion of it. Also, in this specification, the term "step" includes not only independent steps but also steps that cannot be clearly distinguished from others, as long as the desired effect of the step can be achieved. Furthermore, the numerical range indicated by "~" shows the range of minimum and maximum values ​​for the values ​​before and after "~".

[0024] [Resin composition for temporary fixation material formation] The resin composition for forming the temporary fixing material in this embodiment contains an acrylic rubber having epoxy groups and a silicone compound having amino groups. In addition to the above components, the resin composition for forming the temporary fixing material may further contain an epoxy curing agent or other components.

[0025] The resin composition for forming temporary fixing material in this embodiment can be used as a temporary fixing material for temporarily fixing a substrate transport support to an organic substrate.

[0026] <Acrylic rubber with epoxy groups> Acrylic rubber with epoxy groups can be made from (meth)acrylic copolymers with epoxy groups, which can have epoxy groups in the polymer chain or at the end of the polymer chain.

[0027] (Meth)acrylic acid copolymers containing epoxy groups can be obtained by polymerization methods such as bead polymerization and solution polymerization, or commercially available products can be used. Examples of monomers constituting the copolymer include glycidyl (meth)acrylate, (meth)acrylic acid, (meth)acrylate, and styrene.

[0028] In epoxy-containing (meth)acrylic acid copolymers, the amount of glycidyl (meth)acrylic acid in the formulation can be 1 to 20% by mass or 5 to 15% by mass, based on the total amount of monomers constituting the copolymer.

[0029] The glass transition temperature (hereinafter sometimes referred to as "Tg") of epoxy-based acrylic rubber is preferably -50°C to 50°C, and even better is -40°C to 20°C. If the Tg is within this range, it is possible to suppress excessive increase in adhesion that leads to poor processability, while obtaining more sufficient flowability.

[0030] Tg is the midpoint glass transition temperature value determined using differential scanning calorimetry (DSC, such as Rigaku Corporation's "Thermo Plus 2") for thermoplastic resins. Specifically, the aforementioned Tg is the midpoint glass transition temperature calculated by measuring the heat change under conditions of a heating rate of 10°C / min and a measurement temperature of -80 to 80°C, based on the method in JIS K 7121:1987.

[0031] The weight-average molecular weight of epoxy-based acrylic rubber is not particularly limited and can range from 100,000 to 1.2 million, or from 200,000 to 1 million. If the weight-average molecular weight of the acrylic rubber falls within this range, film-forming properties and flowability are easily ensured. The weight-average molecular weight is a polystyrene conversion value used in gel permeation chromatography (GPC) based on a calibration curve for standard polystyrene.

[0032] Acrylic rubbers with epoxy groups can be used alone or in combination of two or more.

[0033] From the viewpoint of balancing the suppression of peeling between the support and the substrate during processing including heat treatment and the peelability of peeling off from the substrate after processing, the content of epoxy-based acrylic rubber in the resin composition for forming the temporary fixing material in this embodiment can be set to 40-90 parts by mass, 60-80 parts by mass, or 70-80 parts by mass relative to 100 parts by mass of the total composition.

[0034] The resin composition for forming the temporary fixing material in this embodiment may contain a thermoplastic resin other than acrylic rubber having epoxy groups. The thermoplastic resin may be a resin that forms a cross-linked structure by heating or the like. Examples of such resins include polymers having cross-linking functional groups. Examples of polymers having cross-linking functional groups include thermoplastic polyimide resins, (meth)acrylic acid copolymers having cross-linking functional groups, amine resins, polyphenylene ether resins, polyether propylene ether resins, phenoxy resins, and modified polyphenylene ether resins.

[0035] Polymers with crosslinking functional groups can have crosslinking functional groups in the polymer chain or at the ends of the polymer chain. Specific examples of crosslinking functional groups include alcohol hydroxyl groups, phenolic hydroxyl groups, and carboxyl groups.

[0036] The Tg of thermoplastic resins can be -50℃ to 50℃, or -40℃ to 20℃. The weight average molecular weight of thermoplastic resins is not particularly limited and can be 100,000 to 1.2 million, or 200,000 to 1 million.

[0037] <Silicone compounds containing amino groups> Silicone compounds containing amino groups can use known silicones. For example, it can be a modified silicone oil in which the methyl group of dimethyl silicone oil is replaced by an organic group containing an amino group. The amino group can be contained at the ends of the silicone backbone (two ends or one end), or in the side chain, or in both the ends (two ends or one end) and the side chain.

[0038] There is no particular limitation on the molecular weight of the silicone backbone, and the functional group (amine group) equivalent can be 10~3000 g / mol.

[0039] Silicone compounds with amino groups can be used alone or in combination of two or more.

[0040] From the viewpoint of balancing ensuring the adhesion of the temporary fixing material to the substrate, suppressing the embedding of the material into the substrate, and improving the wettability between the material and the substrate, the content of the silicone compound with an amino group in the resin composition for forming the temporary fixing material in this embodiment can be set to 1 to 10 parts by mass, or 4 to 6 parts by mass, relative to 100 parts by mass of the acrylic rubber with an epoxy group.

[0041] <Epoxy Curing Agent> Epoxy curing agents can be commonly used and are known curing agents. Examples of epoxy curing agents include: amines; polyamides; acid anhydrides; polysulfides; boron trifluoride; bisphenols such as bisphenol A, bisphenol F, and bisphenol S, which have two or more phenolic hydroxyl groups in one molecule; phenolic resins such as phenolic varnish resins, bisphenol A phenolic varnish resins, and cresol phenolic varnish resins; etc.

[0042] From the perspective of suppressing embedding into the substrate, the epoxy curing agent can be a phenolic varnish resin. Such epoxy curing agents can be commercially available products such as "PSM-4326" (manufactured by Gunei Chemical Industry Co., Ltd., trade name) and "MEH-7800M" (manufactured by Meiwa Plastic Industries, Ltd., trade name).

[0043] Epoxy curing agents can be used alone or in combination of two or more.

[0044] In this embodiment, the content of epoxy curing agent in the resin composition for forming the temporary fixing material can be set to 5-40 parts by mass or 15-25 parts by mass relative to 100 parts by mass of the epoxy-based acrylic rubber. If the epoxy curing agent content is within the above range, the temporary fixing material easily possesses sufficient adhesion, heat resistance, curability, and peelability. Furthermore, if the epoxy curing agent content is 15 parts by mass or more, curing can be achieved in a shorter time, heat resistance is improved, and the retention of the organic substrate during the manufacture of electronic devices is also improved, making it less likely for components constituting electronic devices (e.g., semiconductor wafers) to be damaged. Furthermore, it is easier to increase the elastic modulus of the temporary fixing material at 100°C before curing, suppressing unevenness embedded in the substrate, thereby easily obtaining good peelability. On the other hand, if the epoxy curing agent content is 25 parts by mass or less, the elastic modulus of the temporary fixing material at 100°C before curing is less likely to become excessively high, easily ensuring adhesion. Furthermore, the elastic modulus of the cured temporary fixation material at 25°C is not likely to become too high, which can suppress the fixation effect during peeling and make it easier to balance the retention of the organic substrate and the peelability between the organic substrate and the support at a higher level.

[0045] <Other Ingredients> Other than the components mentioned above may include thermosetting resins, inorganic fillers (inorganic filler materials), organic fillers (organic filler materials), curing accelerators, silicone compounds other than silicone compounds with amino groups, and silane coupling agents.

[0046] Examples of thermosetting resins include epoxy resins, acrylic resins, silicone resins, thermosetting polyimide resins, polyurethane resins, melamine resins, and urea resins.

[0047] Examples of inorganic fillers include silicon dioxide, alumina, boron nitride, titanium dioxide, glass, iron oxide, and ceramics. Inorganic fillers can be added to impart low thermal expansion and low hygroscopicity to temporarily fixed materials. Inorganic fillers can be used alone or in combination of two or more.

[0048] Examples of organic fillers include carbon, rubber-based fillers, silicone-based microparticles, polyamide microparticles, and polyimide microparticles. Organic fillers can be used alone or in combination of two or more.

[0049] Examples of curing accelerators include imidazoles, cyanoguanidine derivatives, dicarboxylic acid diazonium, triphenylphosphine, tetraphenylphosphonium tetraphenylboronic acid ester, 2-ethyl-4-methylimidazolium tetraphenylboronic acid ester, and 1,8-diacrylbicyclo[5,4,0]undecene-7-tetraphenylboronic acid ester. Curing accelerators can be used alone or in combination of two or more.

[0050] Other silicone compounds, as long as they have a polysiloxane structure, can be used without particular restrictions. Examples include silicone-modified resins, pure silicone oils, non-reactive modified silicone oils, and reactive modified silicone oils. Silicone compounds can be used alone or in combination of two or more.

[0051] When the resin composition for forming the temporary fixing material of this embodiment forms a film, the elastic modulus of the film is 2 MPa or more at 100°C, and the elastic modulus of the film after heating at 170°C for 2 hours is 500 MPa or more at 25°C.

[0052] The film can be made by coating a varnish of a resin composition for forming a temporary fixing material onto a substrate, and heating and drying the coating (e.g., heating at 90°C for 5 minutes and then at 140°C for 5 minutes) to form a temporary fixing material layer.

[0053] <Elastic modulus of the film at 100°C before heating (before curing)> The elastic modulus of the film before heating at 100°C was determined according to the following steps. First, a temporary fixing material layer with a thickness of 30 μm was formed on the substrate using the method described above. First, eight layers of this temporary fixing material were laminated at 60°C to produce a film with a thickness of 240 μm. The film was cut into pieces with a width of 4 mm and a length of 33 mm. The cut film was placed in a dynamic viscoelastic apparatus (trade name: Rheogel-E4000, manufactured by UMB Corporation), and a tensile load was applied. Under the measurement conditions of a clamping distance of 20 mm, a frequency of 10 Hz, a heating rate of 5°C / min, and a constant heating rate, the stored elastic modulus E' from 23°C to 260°C was measured to obtain the value of the stored elastic modulus E' at 100°C.

[0054] From the viewpoint of achieving a high level of adhesion to the substrate while suppressing unevenness in the embedding of the temporary fixing material, and of ensuring peelability of the temporary fixing material from the substrate after processing including heat treatment (e.g., reflow soldering), the elastic modulus at 100°C can be 2 MPa or more, 3 MPa or more, or 4 MPa or more. From the viewpoint of easily ensuring the adhesion of the temporary fixing material to the substrate, the elastic modulus at 100°C can be 8 MPa or less or 6 MPa or less.

[0055] The elastic modulus at 100°C can be adjusted, for example, by appropriately changing the formulation amounts of epoxy-based acrylic rubber, epoxy curing agent, amine-based silicone compound, and curing accelerator, as well as the Tg or epoxy equivalent of the epoxy-based acrylic rubber.

[0056] <Elastic modulus of the film after heating (curing) at 25°C> The elastic modulus of the heated film at 25°C was determined using the following steps. First, a temporary fixing material layer with a thickness of 30 μm was formed on the substrate using the method described above. Then, eight layers of this temporary fixing material were laminated at 60°C to create a film with a thickness of 240 μm. The film was heated in an oven at 170°C for 1 hour and cut into pieces 4 mm wide and 33 mm long along the thickness direction. The cut film was placed in a dynamic viscoelastic apparatus (trade name: Rheogel-E4000, manufactured by UMB Corporation), and a tensile load was applied. Measurements were performed at a frequency of 10 Hz and a heating rate of 5°C / min. A tensile load was also applied, and the storage elastic modulus E' from 23°C to 260°C was measured under the following conditions: clamp distance: 20 mm; frequency: 10 Hz; heating rate: 5°C / min; constant heating rate. The value of the storage elastic modulus E' at 25°C was obtained.

[0057] From the viewpoint of suppressing peeling during processing including heat treatment (e.g., reflow soldering), the elastic modulus at 25°C can be 500 MPa or more, or 600 MPa or more. From the viewpoint of the adhesion effect during peeling suppression, the elastic modulus at 25°C can be 1000 MPa or less, or 900 MPa or less.

[0058] The elastic modulus at 25°C can be adjusted, for example, by appropriately changing the formulation amounts of the epoxy-based acrylic rubber, epoxy curing agent, and curing accelerator, as well as the Tg or epoxy equivalent of the epoxy-based acrylic rubber.

[0059] [Temporarily fixed materials] The temporary fixing material of this embodiment is formed using the resin composition for forming the temporary fixing material described above. In particular, the resin composition for forming the temporary fixing material of this embodiment can form a film-like temporary fixing material. This makes it easier to control the film thickness of the temporary fixing material, reducing uneven thickness of the laminate of the organic substrate, the temporary fixing material, and the support. Furthermore, the film-like temporary fixing material can be easily bonded to the organic substrate or support using simple methods such as lamination, resulting in excellent workability.

[0060] A film-like temporary fixing material can be formed by coating a substrate with a resin composition of the temporary fixing material and then heating and drying the coating at 90~140°C.

[0061] The thickness of the film-like temporary fixing material is not particularly limited. From the viewpoint of fully fixing the organic substrate and the transport support, it can be 10~350μm or 10~200μm. If the thickness is 10μm or more, the thickness unevenness during coating is reduced, and the thickness is sufficient, so the strength of the temporary fixing material or the cured temporary fixing material becomes good, and the organic substrate and the transport support can be fixed more fully. If the thickness is 350μm or less, the thickness unevenness of the temporary fixing material is less likely to occur, and the residual solvent in the temporary fixing material can be reduced by sufficient drying, which can further reduce foaming when heating the cured temporary fixing material.

[0062] [Support belt for substrate transport] The substrate transport support belt of this embodiment includes: a support film for transporting an organic substrate; and a temporary fixing material layer disposed on the support film and used for temporarily fixing the organic substrate and the support film. The temporary fixing material layer is formed using the resin composition for forming temporary fixing material of this embodiment described above.

[0063] The elastic modulus of the temporarily fixed material layer at 100°C can be 2 MPa or higher, and the elastic modulus at 25°C after heating at 170°C for 1 hour can be 500 MPa or higher. Furthermore, the elastic modulus at 100°C and the elastic modulus at 25°C can be within the above-mentioned ranges.

[0064] Figure 1 shows an embodiment of a substrate transport support belt. Figure 1(A) is a top view, and Figure 1(B) is a schematic cross-sectional view cut along line II of Figure 1(A). The substrate transport support belt 10 shown in these figures sequentially includes a support film 1, a temporary fixing material layer 2A formed using a resin composition for forming temporary fixing material according to this embodiment, and a protective film 3.

[0065] As for the support film 1, there are no particular limitations as long as it is capable of transporting the organic substrate. Examples include polyethylene terephthalate film, polyethylene terephthalate film, polyethylene naphthalate film, polyethylene film, polypropylene film, polyamide film, and polyimide film. From the viewpoint of excellent flexibility and toughness, the support film 1 can be a polyethylene terephthalate film, polyethylene terephthalate film, polyethylene naphthalate film, polypropylene film, polyamide film, and polyimide film. Furthermore, from the viewpoint of heat resistance and strength, it can be a polyimide film.

[0066] The thickness of the support membrane 1 can be appropriately set according to the target strength and flexibility, and can be 3~350μm. If the thickness is above 3μm, sufficient membrane strength is tended to be obtained; if the thickness is below 350μm, sufficient flexibility is tended to be obtained. From this point of view, the thickness of the support membrane 1 can be 5~200μm, or it can be 7~150μm.

[0067] There are no particular limitations on the protective film 3; for example, polyethylene terephthalate film, polybutylene terephthalate film, polyethylene naphthalate film, polyethylene film, and polypropylene film can be used. From the viewpoint of flexibility and toughness, the protective film 3 can be a polyethylene terephthalate film, a polyethylene film, or a polypropylene film. Furthermore, from the viewpoint of improving the peelability from the temporarily fixed material layer, a film treated with a release agent such as a silicone compound or a fluorine compound can be used as the protective film 3.

[0068] The thickness of the protective film 3 can be appropriately set according to the target strength and flexibility, for example, it can be 10~350μm. If the thickness is above 10μm, sufficient film strength is tended to be obtained, and if the thickness is below 350μm, sufficient flexibility is tended to be obtained. From this point of view, the thickness of the protective film 3 can be 15~200μm, or it can be 20~150μm.

[0069] The temporary fixing material layer 2A can be formed by mixing and kneading the components of the resin composition for forming the temporary fixing material described above in an organic solvent to prepare a varnish, and then applying the prepared varnish onto the support film 1 and drying it.

[0070] There are no particular limitations on the organic solvents used; the choice can be made based on factors such as boiling point and volatility during film formation. Specifically, from the viewpoint of making film curing difficult, solvents with low boiling points such as methanol, ethanol, 2-methoxyethanol, 2-ethoxyethanol, 2-butoxyethanol, methyl ethyl ketone, acetone, methyl isobutyl ketone, toluene, and xylene can be used. Conversely, to improve film formation properties, solvents with higher boiling points such as dimethylacetamide, dimethylformamide, N-methylpyrrolidone, and cyclohexanone can be used. These solvents can be used alone or in combination of two or more. The concentration of solids in the varnish can be set to 10-80% by mass.

[0071] Mixing and kneading can be performed using common mixers, pounders, three-shaft roller mills, ball mills, and other dispersants, and these can be combined appropriately. Drying is not particularly limited as long as the organic solvent used is sufficiently evaporated. From the viewpoint of easily adjusting the elastic modulus at 100°C and 25°C to the desired range, heating at 90~140°C, 120~140°C, or 130~140°C for 5~10 minutes is acceptable.

[0072] After forming a temporary fixing material layer 2A on the support film 1, a protective film 3 is attached to the temporary fixing material layer 2A, thereby obtaining a substrate transport support belt 10.

[0073] Alternatively, a temporary fixing material layer can be coated on any film that has undergone a release treatment, instead of coating the support film, to preserve it in a state of being bonded to a protective film. When bonding the substrate, the protective film can be replaced with the support film. In this case, a substrate or the like, which is a thermosetting laminate of glass fiber impregnated with epoxy resin, can be used as the support material instead of the support film.

[0074] Methods for manufacturing electronic devices The manufacturing method of an electronic device using the temporary fixing material of this embodiment can be broadly divided into the following four steps. (a) Step 1, a laminate is obtained by attaching a support to an organic substrate via a temporary fixing material (temporary fixing material layer). (b) Step 2, heating the temporary fixing material of the laminate. (c) Step 3: Processing the laminated body obtained from Step 2, including heat treatment. (d) Step 4: Peel the support and temporary fixing material from the organic substrate of the laminate obtained in step 3.

[0075] Figures 2 and 3 are schematic cross-sectional views illustrating one embodiment of the manufacturing method of an electronic device. Furthermore, Figures 2 and 3 show the case where the temporary fixing material (temporary fixing material layer) is the temporary fixing material layer 2A of the substrate transport support belt 10 shown in Figure 1(B), but the composition of the temporary fixing material is not limited to this.

[0076] <(a) Step 1> In step 1, an organic substrate 30 is prepared (Fig. 2(a)), and a support film 1 is bonded to the organic substrate 30 via a temporary fixing material layer 2A to obtain a laminate 15 (Fig. 2(b)).

[0077] The organic substrate 30 shown in Figure 2(a) includes a core layer 32, wiring layers 35 with an uplayer structure disposed on two sides of the core layer 32, and a solder mask layer 38 disposed on one of the wiring layers 35. The organic substrate 30 includes via electrodes 36 and wiring 34. The core layer 32 can be formed of an interlayer insulating material such as "Ajinomoto Build-up Film" (ABF) (manufactured by Ajinomoto Co., Inc., trade name). The wiring layer 35 can be formed using an uplayer material such as an epoxy resin composition. The solder mask layer 38 can be formed of a composition containing an acrylate resin.

[0078] The organic substrate 30 is not limited to the structure shown in FIG2(a), and various known substrates can be used.

[0079] As the organic substrate 30, a substrate with a thickness of 10 to 1000 μm can be used, for example. From the viewpoint of thin electronic components or electronic devices, the thickness of the organic substrate 30 can be less than 200 μm or less than 100 μm. From the viewpoint of maintaining the strength of electronic components such as semiconductor packages and reducing warpage, the thickness of the organic substrate 30 can be 30 μm or more or 50 μm or more.

[0080] The organic substrate 30 can be a coreless substrate. The coreless substrate referred to here means a substrate that does not contain a core layer obtained by impregnating reinforcing fibers such as glass cloth with thermosetting resin.

[0081] As shown in Figure 2(b), when the laminate 15 is obtained using the substrate transport support belt 10, the organic substrate 30 and the support film 1 can be laminated using a roll laminator via the temporary fixing material layer 2A. When the substrate transport support belt 10 is equipped with a protective film 3, the protective film 3 can be peeled off before lamination, or the temporary fixing material layer 2A and the support film 1 can be laminated while the protective film 3 is being peeled off.

[0082] As a roll laminator, for example, the VA400III roll laminator (trade name) manufactured by Taisei Laminator Co., LTD. can be used to bond an organic substrate 30 and a support film 1 via a temporary fixing material layer 2A under conditions of pressure 0.1 MPa to 1.0 MPa, temperature 40°C to 150°C, and speed 0.1 to 1.0 m / min.

[0083] A vacuum laminator can also be used instead of a roller laminator.

[0084] Examples of vacuum laminators include the LM-50×50-S (trade name) vacuum laminator manufactured by NPC Incorporated and the V130 (trade name) vacuum laminator manufactured by Nichigo-Morton Co., Ltd. As for lamination conditions, the organic substrate 30 and the support film 1 can be bonded via the temporary fixing material layer 2A under the following conditions: pressure below 1 hPa, pressing temperature 40°C to 150°C (preferably 60°C to 120°C), lamination pressure 0.01 to 0.5 MPa (preferably 0.1 to 0.5 MPa), and holding time 1 second to 600 seconds (preferably 30 seconds to 300 seconds).

[0085] <(b) Step 2> In step 2, the temporary fixing material layer 2A of the laminate 15 is heated. By means of this step, the organic substrate 30 and the support film 1 can be sufficiently fixed by the cured temporary fixing material layer 2C (FIG. 2(c)), thereby improving the operability of the organic substrate 30.

[0086] Heating can be performed, for example, using an explosion-proof dryer. The preferred heating conditions are curing at 100-200°C for 10-300 minutes (preferably 20-210 minutes). Temperatures above 100°C ensure sufficient curing of the temporary fixing material, minimizing problems in subsequent steps. Temperatures below 200°C reduce the likelihood of degassing during curing, further inhibiting peeling. Furthermore, heating for 10 minutes or more minimizes problems in subsequent steps, while heating for less than 300 minutes minimizes operational inefficiency. Figure 2(c) shows the cured form of the temporary fixing material layer 2A (layer 2C).

[0087] <(c) Step 3> In step 3, processing including heat treatment can be performed. Examples of such processing include the formation of solder resist (e.g., solder resist layer 39 shown in FIG. 3(d)), mounting of semiconductor wafers, reflow soldering, and sealing. The processing may include at least one of solder resist formation and reflow soldering.

[0088] Semiconductor wafers can be mounted on organic substrates using flip-chip bonding devices, for example. Examples of mounting devices include the FC3000L (trade name) manufactured by TORAY ENGINEERING Co., Ltd., and the mounting conditions can be arbitrarily selected based on the desired organic substrate and semiconductor wafer.

[0089] The reflow soldering step can be performed by heating at the temperature at which the solder melts. The heating temperature can be adjusted according to the type of solder, for example, it can be 190~280°C or 220~270°C. By using a temporary fixing material formed from a resin composition for forming temporary fixing material according to this embodiment, even when the reflow soldering step is performed at the above-mentioned temperature, it is possible to suppress the peeling of the organic substrate 30 and the support film 1 bonded by the temporary fixing material layer 2A during the reflow soldering step, and it is possible to suppress the temporary fixing material layer 2A from remaining on the organic substrate 30 at room temperature after the reflow soldering step while easily peeling the support film 1 from the organic substrate 30.

[0090] Furthermore, in this embodiment, after the semiconductor wafer 40 is connected to the organic substrate 30 via solder 42 through a reflow step, the semiconductor wafer 40 mounted on the organic substrate 30 can be sealed with a sealing material 50 (see Figure 3(e)). As a sealing device, examples include the TOWA JAPAN FFT1030G (trade name), and the sealing conditions can be arbitrarily selected based on the desired organic substrate, semiconductor wafer, and sealing material. Furthermore, the curing conditions of the sealing material after sealing can be arbitrarily selected based on the type of sealing material.

[0091] <(d) Step 4> In step 4, as shown in Figure 3(e), the support film 1 and the temporary fixing material layer 2C are peeled off from the organic substrate 30 of the laminate (semiconductor wafer mounting substrate 55 on which semiconductor wafers are mounted and sealed) formed in step 3. Examples of peeling methods include: horizontally fixing one of the organic substrate or the support film and pulling the other up at an angle to the horizontal direction; and attaching a protective film to the organic substrate and peeling the organic substrate and the protective film off from the support film by peeling; etc.

[0092] These stripping methods are typically carried out at room temperature, but can also be carried out at temperatures of around 40 to 100°C.

[0093] In this embodiment, when temporary fixing material remains partially on the semiconductor wafer mounting substrate, a cleaning step for removing the temporary fixing material can be provided. The removal of the temporary fixing material can be performed, for example, by cleaning the semiconductor wafer mounting substrate.

[0094] There are no particular limitations as long as the cleaning solution can remove localized residues of temporary fixation material. Examples of such cleaning solutions include the aforementioned organic solvents that can be used to dilute resin compositions for the formation of temporary fixation materials. These organic solvents can be used alone or in combination of two or more.

[0095] Furthermore, in cases where residual temporary fixative materials are difficult to remove, alkalis or acids can be added to the organic solvent. Examples of alkalis include amines such as ethanolamine, diethanolamine, triethanolamine, triethylamine, and ammonia; and ammonium salts such as tetramethylammonium hydroxide. Acids can include organic acids such as acetic acid, oxalic acid, benzenesulfonic acid, and dodecylbenzenesulfonic acid. The amount added can be 0.01% to 10% by mass, based on the concentration in the cleaning solution. Additionally, to improve the removal of residues, existing surfactants can be added to the cleaning solution.

[0096] There are no particular limitations on the cleaning method. For example, methods such as cleaning with the above-mentioned cleaning solution under stirring, cleaning by spraying with a sprayer, and immersion in a cleaning solution tank can be used. The suitable temperature is 10~80℃, preferably 15~65℃. Finally, the substrate is washed with water or alcohol and dried to obtain a semiconductor wafer mounting substrate.

[0097] Furthermore, as described above, the temporary fixing material according to this embodiment can be easily peeled off from the organic substrate and can suppress the temporary fixing material from remaining on the organic substrate, thus eliminating the need for a cleaning step.

[0098] In this embodiment, the semiconductor wafer mounting substrate 55, on which the semiconductor wafer is mounted and sealed, is further diced into individual semiconductor elements 60 (Figures 4(f) and 4(g)). Furthermore, the DL display in Figure 4(f) shows the dicing lines.

[0099] Figure 4(h) schematically shows a cross-sectional view of the electronic device 100 manufactured by the above steps. The electronic device 100 has a plurality of semiconductor elements 60 disposed on the wiring board 70 via solder balls 65.

[0100] The above describes the implementation forms of this disclosure, but this disclosure is not necessarily limited to the above implementation forms and may be appropriately modified within the scope of its purpose. [Example]

[0101] The present disclosure will be further described in detail below with reference to embodiments and comparative examples, but the present disclosure is not limited to the following embodiments.

[0102] Synthesis of Acrylic Rubber K-1 In a 500cc detachable flask equipped with a stirrer, thermometer, nitrogen purging device (nitrogen inlet pipe), and reflux cooler with a water receiving container, 200g deionized water, 70g butyl acrylate, 9.5g methyl methacrylate, 10g hydroxyethyl 2-methacrylate, 10g glycidyl methacrylate, 0.5g styrene, 1.94g 1.8% polyvinyl alcohol aqueous solution, 0.2g lauryl peroxide, and 0.04g n-octyl mercaptan were prepared. Next, N2 gas was blown into the flask to remove air from the system for 60 minutes, and the temperature was raised to 65°C for 5 hours for polymerization. Then, the temperature was raised to 90°C and stirred continuously for 2 hours to complete the polymerization. The transparent beads obtained from the polymerization reaction were separated by filtration, washed with deionized water, and dried in a vacuum dryer at 50°C for 6 hours to obtain acrylic rubber K-1.

[0103] The weight-average molecular weight of acrylic rubber K-1, determined by GPC, is 600,000 when converted to polystyrene. Furthermore, the Tg of acrylic rubber K-1 is -28℃.

[0104] Synthesis of Acrylic Rubber K-2 In a 500cc detachable flask equipped with a stirrer, thermometer, nitrogen purging device (nitrogen inlet pipe), and reflux cooler with a water receiving container, 200g deionized water, 70g butyl acrylate, 9.5g methyl methacrylate, 10g hydroxyethyl 2-methacrylate, 10g glycidyl methacrylate, 0.5g styrene, 1.94g 1.8% polyvinyl alcohol aqueous solution, 0.2g lauryl peroxide, and 0.06g n-octyl mercaptan were prepared. Next, N2 gas was blown into the flask to remove air from the system for 60 minutes, and the temperature was raised to 65°C for 5 hours for polymerization. Then, the temperature was raised to 90°C and stirred continuously for 2 hours to complete the polymerization. The transparent beads obtained from the polymerization reaction were separated by filtration, washed with deionized water, and dried in a vacuum dryer at 50°C for 6 hours to obtain acrylic rubber K-2.

[0105] The weight-average molecular weight of acrylic rubber K-2, determined by GPC and converted to polystyrene, is 400,000. Furthermore, the Tg of acrylic rubber K-2 is -28℃.

[0106] Synthesis of Acrylic Rubber K-3 In a 500cc detachable flask equipped with a stirrer, thermometer, nitrogen purging device (nitrogen inlet pipe), and reflux cooler with a water receiving container, 200g deionized water, 77.5g butyl acrylate, 2g methyl methacrylate, 10g hydroxyethyl 2-methacrylate, 10g glycidyl methacrylate, 0.5g styrene, 1.94g 1.8% polyvinyl alcohol aqueous solution, 0.2g lauryl peroxide, and 0.04g n-octyl mercaptan were prepared. Next, N2 gas was blown into the flask to remove air from the system for 60 minutes, and the temperature was raised to 65°C for 5 hours for polymerization. Then, the temperature was raised to 90°C and stirred continuously for 2 hours to complete the polymerization. The transparent beads obtained from the polymerization reaction were separated by filtration, washed with deionized water, and dried in a vacuum dryer at 50°C for 6 hours to obtain acrylic rubber K-3.

[0107] The weight-average molecular weight of acrylic rubber K-3, determined by GPC, is 600,000 when converted to polystyrene. Furthermore, the Tg of acrylic rubber K-3 is -37℃.

[0108] (Examples 1-5, Comparative Examples 1-3) [Creation of Temporary Fixing Material (Temporary Fixing Material Layer)] A varnish containing a resin composition for forming a temporary fixing material layer was prepared according to the parts by weight shown in Table 1. The prepared varnish was applied to a 38 μm thick polyethylene terephthalate (PET) film that had undergone a release treatment. The film was then heated and dried at 90°C for 5 minutes, followed by heating and drying at 140°C for 5 minutes, thereby forming a 30 μm thick temporary fixing material layer. Subsequently, a protective film was laminated onto the temporary fixing material layer to obtain a strip comprising a PET film, a temporary fixing material layer, and a protective film.

[0109] Table 1 Example 1 Example 2 Example 3 Example 4 Example 5 Comparative Example 1 Comparative Example 2 Comparative Example 3 thermoplastic resin Acrylic rubber K-1 100 - - 100 100 100 100 100 Acrylic rubber K-2 - 100 - - - - - - Acrylic rubber K-3 - - 100 - - - - - curing agent PSM-4326 20 20 30 20 20 20 - 20 MEH-7800M - - - - - - 20 - Amine-modified Silicone PAM-E 5 5 5 5 5 - - 5 Inorganic filler materials YA050C-HHG - - - 20 - - - - Curing accelerator 2PZ-CN 1 1 1 1 - 1 1 1 Non-volatile components (mass %) Solvent: Cyclohexanone twenty three twenty three twenty three twenty three twenty three twenty three twenty three twenty three

[0110] The details of each component listed in Table 1 are as follows. (Thermoplastic resin) Acrylic Rubber K-1: The acrylic rubber synthesized above (with a weight average molecular weight of 600,000 as determined by GPC, glycidyl methacrylate content of 10% by mass, and Tg of -28℃). Acrylic rubber K-2: The acrylic rubber synthesized above (with a weight average molecular weight of 400,000 as determined by GPC, glycidyl methacrylate content of 10% by mass, and Tg of -28℃). Acrylic rubber K-3: The acrylic rubber synthesized above (with a weight average molecular weight of 600,000 as determined by GPC, glycidyl methacrylate content of 10% by mass, and Tg of -37℃). (Curing agent) PSM-4326: Phenolic resin (manufactured by Gunei Chemical Industry Co., Ltd., trade name) MEH-7800M: Phenolic resin (manufactured by MEIWA PLASTIC INDUSTRIES, LTD., trade name) (Amine-modified silicone) PAM-E: Silicone modified with two terminal amino groups (manufactured by Shin-Etsu Chemical Co., Ltd., trade name) (Inorganic filler materials) YA050C-HHG: Vinyl silane surface-treated silica filler (manufactured by ADMATECHS COMPANY LIMITED, trade name, average particle size 50nm) (Curing accelerator) 2PZ-CN: Imidazole-based curing accelerator (manufactured by SHIKOKU CHEMICALS CORPORATION, trade name)

[0111] The elastic modulus of the temporary fixing material layer and the elastic modulus of the cured temporary fixing material layer were evaluated using the methods shown below. The evaluation results are shown in Table 2.

[0112] [Determination of the elastic modulus of the temporarily fixed material layer] The elastic modulus of the temporary fixing material layer was determined according to the following steps. First, each varnish was applied to a PET film, heated and dried at 90°C for 5 minutes, and then heated and dried at 140°C for 5 minutes to form a temporary fixing material layer with a thickness of 30 μm. Eight layers of this temporary fixing material were then laminated at 60°C to produce a film with a thickness of 240 μm. The film was cut into pieces with a width of 4 mm and a length of 33 mm. The cut film was placed in a dynamic viscoelastic apparatus (trade name: Rheogel-E4000, manufactured by UMB Corporation), and a tensile load was applied. Under the conditions of a clamping distance of 20 mm, a frequency of 10 Hz, a heating rate of 5°C / min, and a constant heating rate, the storage elastic modulus E' from 23°C to 260°C was measured to obtain the value of the storage elastic modulus E' at 100°C.

[0113] [Determination of the elastic modulus of the cured temporary fixing material layer] The elastic modulus of the temporarily fixed material layer after curing was determined according to the following steps. First, a film with a thickness of 240 μm was prepared according to the same steps as described above. After heating in an oven at 170°C for 1 hour, it was cut into pieces with a width of 4 mm and a length of 33 mm along the thickness direction. The cut film was placed in a dynamic viscoelastic apparatus (trade name: Rheogel-E4000, manufactured by UMB Corporation), a tensile load was applied, and the measurement was performed at a frequency of 10 Hz and a heating rate of 5°C / min. Then, a tensile load was applied, and the storage elastic modulus E' from 23°C to 260°C was measured under the following conditions: clamp distance: 20 mm, frequency: 10 Hz, heating rate: 5°C / min, and constant heating rate. The value of the storage elastic modulus E' at 25°C was obtained.

[0114] The substrate transport support tapes fabricated using the following methods were evaluated for peeling during reflow and peeling properties after reflow. The evaluation results are shown in Table 2.

[0115] [Evaluation of whether peeling occurred during reflow] The protective film of the strips made in the examples and comparative examples was peeled off, and a polyimide film (manufactured by UBE Corporation, trade name: Upilex 25SGA, thickness: 25μm) was deposited on the inner side of the exposed temporary fixing material layer using an AS ONE Corporation heating plate HI-1000 at 60°C to obtain a substrate transport support strip.

[0116] Next, an organic substrate (material: glass epoxy board) with a surface thickness of 1000 μm and solder resist AUS308 (manufactured by TAIYO INK MFG. CO., LTD., trade name: PSR-4000 AUS308) is placed on the stage of a roll laminator (manufactured by Taisei Laminator Co., LTD., VA-400III). At a temperature of 100°C, a pressure of 0.2 MPa, and a speed of 0.2 m / min, a substrate transport support belt for peeling off the PET film is laminated by temporarily attaching a fixing material layer to the side of the organic substrate, to obtain a laminate of support film (polyimide film) / temporary fixing material layer / organic substrate.

[0117] After heating the laminate obtained above in an oven at 170°C for 1 hour, the sample was placed on a hot plate heated to 260°C for 5 minutes with the organic substrate in contact with the hot plate. The presence of delamination (foaming) between the organic substrate and the support film (i.e., between the organic substrate and the temporary fixing material layer and / or between the support film and the temporary fixing material layer) was visually confirmed. Subsequently, the delamination status during reflow was evaluated according to the following evaluation criteria. A: No delamination (foaming) occurred between the organic substrate and the temporary fixation material layer, or between the support film and the temporary fixation material layer. B: At least one point of slight delamination (foaming) occurred between the organic substrate and the temporary fixing material layer, and between the support film and the temporary fixing material layer. The area of ​​the delamination (foaming) portion is less than 2% of the total area. C: Delamination (foaming) occurred at least at one point between the organic substrate and the temporary fixing material layer, and between the support film and the temporary fixing material layer. The area of ​​the delamination (foaming) portion exceeded 2% of the total area.

[0118] [Evaluation of peelability after reflow] After the samples evaluated for peeling during reflow were cooled to room temperature (25°C), the support film was peeled off from the organic substrate, and it was visually confirmed whether the temporary fixing material layer adhered to the organic substrate and remained. Subsequently, the peelability after reflow was evaluated according to the following evaluation criteria. A: The temporary fixation material layer did not remain on the organic substrate. B: A portion of the temporary fixation material layer remains on the organic substrate. C: Delamination occurred between the support film and the temporary fixation material layer, and most of the temporary fixation material layer remained on the organic substrate.

[0119] Table 2 Example 1 Example 2 Example 3 Example 4 Example 5 Comparative Example 1 Comparative Example 2 Comparative Example 3 Temporarily fixed material layer elastic modulus at 100℃ (MPa·s) 4.2 4 3 4 3.5 0.6 0.2 2.5 Cured temporary fixing material layer elastic modulus at 25℃ (MPa·s) 638 621 546 523 504 637 536 301 Is there any peeling during reflow? A A A A B B B C Peelability after reflow A A B A B C C C

[0120] The results shown in Table 2 confirm that the substrate transport support belt, which has an elastic modulus of 2 MPa or more at 100°C and an elastic modulus of 500 MPa or more at 25°C when heated at 170°C for 1 hour, formed using the resin composition of Examples 1 to 5 containing silicone with amine groups and acrylic rubber with epoxy groups, can suppress the peeling between the support film and the organic substrate during reflow and can obtain excellent peelability of the temporary fixing material layer from the organic substrate after reflow.

[0121] 1: Support membrane 2A: Temporarily fixed material layer 2C: Temporary fixing material layer after curing 3: Protective film 10: Support belt 15: Laminated body 30: Organic substrate 40: Semiconductor wafers 50: Sealing material 55: Semiconductor wafer mounting substrate 60: Semiconductor components 65: Welding ball 70: Wiring board 100: Electronic machinery and equipment

Claims

1. A resin composition for forming a temporary fixing material, used to form a temporary fixing material for temporarily fixing a substrate transport support to an organic substrate, comprising an acrylic rubber having epoxy groups and a silicone compound having amino groups, wherein the amino equivalent of the aforementioned silicone compound having amino groups is 10 to 3000 g / mol, and when a film is formed by heating at 90°C for 5 minutes and then at 140°C for 5 minutes, the elastic modulus of the film is 2 MPa or more at 100°C, and the elastic modulus of the aforementioned film after heating at 170°C for 2 hours is 500 MPa or more at 25°C.

2. The resin composition for forming temporary fixing materials as described in claim 1, further comprising an epoxy curing agent.

3. The resin composition for forming a temporary fixing material as described in claim 2, wherein the content of the aforementioned epoxy curing agent is 15 parts by mass or more relative to 100 parts by mass of the aforementioned acrylic rubber having epoxy groups.

4. The resin composition for forming a temporary fixing material as described in claim 1 or claim 2, wherein the content of the aforementioned silicone compound having an amino group is 1 to 10 parts by mass relative to 100 parts by mass of the aforementioned acrylic rubber having an epoxy group.

5. A temporary fixation material formed using a resin composition for forming temporary fixation materials as described in any one of claims 1 to 4.

6. A substrate transport support belt comprising: a support film for transporting an organic substrate; and a temporary fixing material layer disposed on the support film and used for temporarily fixing the organic substrate and the support film, wherein the temporary fixing material layer is formed using a resin composition for forming temporary fixing material as described in any one of claims 1 to 4.

7. A method for manufacturing an electronic machine device, comprising: Step 1: A laminate is obtained by attaching a support to an organic substrate using a temporary fixing material. Step 2: The temporary fixing material of the laminate is heated. Step 3: The laminate processed by Step 2 is subjected to a heat treatment. Step 4: The support and the temporary fixing material are peeled off from the organic substrate of the laminate processed by Step 3. The temporary fixing material is formed using a resin composition for forming temporary fixing materials as described in any one of claims 1 to 4.

8. A method for manufacturing an electronic device as claimed in claim 7, wherein the aforementioned processing in step 3 includes at least one of forming a solder resist and reflow soldering.

9. A method for manufacturing an electronic device as described in claim 7 or claim 8, wherein the thickness of the aforementioned organic substrate is 200 μm or less.

10. A method for manufacturing an electronic device as described in claim 7 or claim 8, wherein the aforementioned organic substrate is a coreless substrate.

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