Polymers and their photosensitive resin components

Abstract

The purpose of this invention is to provide a polymer with fast development speed, capable of forming fine patterns, and producing a cured product with excellent fine line adhesion, as well as a photosensitive resin composition comprising the above-mentioned polymer. This invention relates to a polymer, and a photosensitive resin composition comprising the above-mentioned polymer and multifunctional monomers. The polymer has acid groups, and the polymer comprises structural units with a ring structure in the main chain, and structural units of monomers from homopolymers with a Tg below -5°C represented by a specific structural formula. It substantially does not have vinyl unsaturated double bonds in the side chains, and the acid groups are spaced from the main chain by an atomic number of 6 or less. Preferably, it further comprises a photopolymerization initiator and a colored material, and even more preferably, a color filter inhibitor.

Description

Polymers and their photosensitive resin components This invention relates to a polymer and a photosensitive resin composition thereof. More specifically, it relates to a polymer and a photosensitive resin composition comprising the polymer and a multifunctional monomer. Various studies have been conducted on curable resin compositions that can be cured by heat or active energy lines, and their applications in various optical components such as color filters, inks, printing plates, printed wiring boards, semiconductor components, and photoresists used in liquid crystal display devices or solid-state imaging elements, as well as in motors and electronic machines. Curable resin compositions with excellent properties required for each application are being developed. As a coloring resin composition with excellent contact hole forming or pattern forming properties, for example, Patent Document 1 describes a coloring resin composition containing (A) a dye, (B) a solvent, and (C) an adhesive resin, and further containing (D) a specific antioxidant and (E) a specific ultraviolet absorber. Furthermore, as a particularly preferred adhesive resin, a resin (C-1) is described, which is a resin obtained by adding an unsaturated monobasic acid to at least a portion of the epoxy groups of a copolymer of an epoxy-containing (meth)acrylate and other free radical polymerizable monomers, or by adding a polyacid anhydride to at least a portion of the hydroxyl groups generated by the addition reaction, resulting in an alkali-soluble resin. Patent Document 1 requires that the pattern diameter during the curing of the color filter resist be close to the photomask diameter during exposure. Furthermore, as a photosensitive resin composition exhibiting excellent dispersibility for organic pigments, for example, Patent Document 2 describes a photosensitive resin composition comprising an alkali-soluble resin. This alkali-soluble resin comprises a polymer obtained by polymerizing monomers containing (meth)acrylate and (meth)acrylic acid, which are essential components of a hydrocarbon group having 8 to 20 carbon atoms. This polymer incorporates not only groups exhibiting alkali solubility but also unsaturated groups with free radical polymerization properties. Patent Document 2 requires the adhesive for resisting to have high curing properties. (Prior Art Documents, Patent Documents) Patent Document 1: Japanese Patent Application Publication No. 2015-98537; Patent Document 2: Japanese Patent Application Publication No. 2011-145553 [The problem that the invention aims to solve] However, conventional photosensitive resin compositions struggle to balance fast development speeds, fine pattern formation, and tight line adhesion. Faster development times make it easier for the pattern to peel off along with the fine lines, compromising adhesion and hindering the maintenance of development margin. Furthermore, the increasing resolution of displays necessitates improvements in fine pattern formation and line adhesion. In view of the above-mentioned situation, the present invention aims to provide a polymer with faster development speed, capable of forming fine patterns, and producing a cured product with excellent fine line adhesion, as well as a photosensitive resin composition comprising the above polymer. [Technical Means for Solving the Problem] To solve the aforementioned problems, the inventors conducted various studies on polymers suitable for use in optical components or motors and electronic devices. They discovered that by using polymers with the following characteristics, development speed is faster, patterns do not thicken or disappear, and even micro-patterns at the micrometer level can be well formed, resulting in a cured material (cured film) with excellent adhesion of the formed pattern (especially fine line adhesion). These polymers contain acid groups, and their main chain includes structural units with ring structures and specific structural units, with the acid groups positioned within a specific range, and substantially lacking vinyl unsaturated double bonds in the side chains. Furthermore, the inventors found that photosensitive resin compositions containing such polymers are particularly suitable as resin compositions for forming optical components such as color filters, thus completing the present invention. That is, the object of the present invention is achieved by the following <1> to <9>. <1> A polymer having an acid group, wherein the polymer comprises in its main chain: a structural unit having a ring structure, and a structural unit of a monomer from a homopolymer having a Tg of -5°C or less, represented by the following general formula (1), substantially not having vinyl unsaturated double bonds in the side chain, wherein the acid group is spaced from the main chain by an atomic number of 6 or less. (where R) 1 Represents a hydrogen atom or a methyl group. R 2 <2> A polymer having an acid group, and the polymer comprising in its main chain: a structural unit having a ring structure, and a structural unit from a monomer of homopolymer with a Tg of -5°C or less, represented by the following general formula (1), wherein the acid group is spaced from the main chain by an atomic number of 6 or less, and the content of the structural unit represented by the following general formula (2) is 5% by mass or less relative to 100% by mass of all structural units of the polymer. (where R) 1 Represents a hydrogen atom or a methyl group. R 2 (Represents a straight-chain or branched hydrocarbon group with 6 to 20 carbon atoms). (where R) 3 and R 4 Same or different indicates a hydrogen atom or a methyl group. Z indicates a divalent organogroup. <3> The polymer described in <1> or <2> above, wherein the acid group is derived from the carboxyl group of (meth)acrylic acid. <4> The polymer described in any one of <1> to <3> above, wherein the polymer has a structural unit derived from an N-substituted maleic anhydride monomer. Preferably, the polymer is a polymer for use as a resist. <5> A photosensitive resin composition comprising the polymer described in any one of <1> to <4> above, and a multifunctional monomer. <6> The photosensitive resin composition described in <5> above, further comprising a photopolymerization initiator and a colored material. <7> The photosensitive resin composition described in <5> or <6> above is a resist for color filters. <8> A hardened film formed by hardening the photosensitive resin composition described in any one of <5> to <7> above. <9> A component for a display device having the hardened film described in <8> above. [Effects of the Invention] The polymer and photosensitive resin composition of this invention exhibits a faster development speed, resulting in cured products with excellent pattern-forming properties and fine-line adhesion. This polymer and photosensitive resin composition of the present invention is suitable for various applications, including color filters, inks, printing plates, printed wiring boards, semiconductor components, photoresists, and other optical components, as well as motors and electronic devices used in liquid crystal display devices or solid-state imaging devices. The present invention will now be described in detail. Furthermore, combinations of two or more preferred embodiments of the present invention described below also constitute preferred embodiments of the present invention. Also, in this specification, "(meth)acrylic acid" refers to "acrylic acid and / or methacrylic acid," and "(meth)acrylate" refers to "acrylate and / or methacrylate." Also, in this specification, the numerical range "Min to Max" refers to a minimum value of Min and a maximum value of Max. Furthermore, regarding upper and lower limits, when appropriate values ​​are recorded in stages, a numerical range formed by appropriately combining the separately recorded upper and lower limits is also an appropriate numerical range. 1. Polymer The polymer of the present invention is the following polymer (also referred to as "polymer-1"), which has an acid group (preferably an acid group on the side chain), and further comprises in the main chain: a structural unit having a ring structure, and a structural unit of a monomer represented by the following general formula (1) and derived from a homopolymer with a Tg (glass transition temperature) of -5°C or less, substantially not having an ethylene unsaturated double bond on the side chain, wherein the acid group is spaced from the main chain by an atomic number of 6 or less. (where R) 1 Represents a hydrogen atom or a methyl group. R 2 (Represents a straight-chain or branched hydrocarbon group with 6 to 20 carbon atoms). Furthermore, the polymer of the present invention is a polymer (also referred to as "polymer-2") having an acid group (preferably an acid group on the side chain), and further comprising in the main chain: a structural unit having a ring structure, and a structural unit of a monomer with a Tg of -5°C or less derived from a homopolymer represented by the following general formula (1), wherein the acid group is spaced from the main chain by an atomic number of 6 or less, and the content ratio of the structural unit represented by the following general formula (2) is 5% by mass or less relative to 100% by mass of all structural units of the polymer. (where R) 1 Represents a hydrogen atom or a methyl group. R 2 (Represents a straight-chain or branched hydrocarbon group with 6 to 20 carbon atoms). (where R) 3 and R 4 Same or different indicates a hydrogen atom or a methyl group. Z indicates a divalent organogroup. Polymer-1 and Polymer-2 of the present invention, being composed of the above-described structures, exhibit faster development speeds, are capable of forming fine patterns, and can produce hardened products (hardened films, fine line patterns) with excellent adhesion. It is presumed that the polymers of the present invention improve developability, pattern-forming properties, and adhesion by including specific structural units; improve developability and adhesion by positioning acid groups within a specific range, i.e., with an atomic interval of 6 or less from the main chain; and prevent hardening caused by diffraction during UV exposure by substantially lacking vinyl unsaturated double bonds in the side chains, thus enabling the miniaturization of patterns. A detailed description follows. The polymer of this invention has structural units containing acid groups. Because the polymer contains acid groups, it is alkali-soluble and can exhibit developing properties. The aforementioned acid groups are located at positions with an atomic number of 6 or less between them and the main chain. By placing the aforementioned acid groups in such a specific range close to the main chain, the developability of the aforementioned polymer is improved. Furthermore, by combining this with the fact that the hydrocarbon groups of the structural units represented by the aforementioned general formula (1) contained in the aforementioned polymer have a carbon number of 6 to 20 (low Tg), the development speed is further accelerated. Typically, when manufacturing polymers with acid groups located relatively far from the main chain, a compound or anhydride containing an acid group is reacted with an ethylene monomer to synthesize a monomer with an acid group located far from the vinyl group, and then copolymerization is performed using this monomer. For example, a monomer with an acid group located far from the vinyl group can be obtained by reacting (meth)acrylate with maleic anhydride. However, if the polymer produced by copolymerizing this monomer is used to manufacture color filters, the following situation arises: during the post-curing step (heating step), water addition occurs, and maleic acid partially detaches, becoming a foreign substance, leading to a decrease in the heat resistance or transparency of the obtained cured product. In contrast, when the interval between the acid group and the main chain is less than 6 atoms, it is not necessary to use a monomer obtained by reacting a compound or anhydride containing an acid group with an ethylene monomer. Therefore, there are advantages such as the absence of partial detachment of acid groups in the color filter manufacturing process, and the reduced heat resistance or transparency of the polymer. In this invention, the term "interval with the main chain of 6 or fewer atoms" refers to a distance of 6 or fewer atoms between the atoms of the main chain bonded to the side chain and the atoms bonded to the acid group on the side chain. For example, in the structural unit represented by (a1) below, the interval between the acid group X and the main chain is 4 atoms; in the structural unit represented by (a2) below, the interval between the acid group X and the main chain is 6 atoms. Furthermore, when the acid group is directly bonded to the main chain, the interval between it and the main chain is 0 atoms. The spacing between the aforementioned acid group and the main chain is preferably 6 or less, more preferably 5 or less, even more preferably 3 or less, and most preferably 0. The aforementioned acid group is preferably directly bonded to the main chain. Examples of the aforementioned acid groups include functional groups that undergo neutralization reactions with alkaline water, such as carboxyl groups, phenolic hydroxyl groups, carboxylic anhydride groups, phosphate groups, and sulfonic acid groups. Among these, carboxyl groups or carboxylic anhydride groups are preferred, carboxyl groups are more preferred, and (meth)acrylic acid groups are even more preferred. That is, the aforementioned acid group is preferably a carboxyl group derived from (meth)acrylic acid, and the structural unit containing the aforementioned acid group is preferably a structural unit derived from (meth)acrylic acid. Furthermore, based on the ability to improve the overall Tg of the resin and the ability to improve the fine wire adhesion, structural units derived from methacrylic acid are particularly preferred. Although the reason is not clear, it is believed that by combining the structure represented by the above general formula (1) with a unit such as methacrylic acid that has a higher Tg, the tracking of the substrate becomes better, thereby improving the fine wire adhesion. Regarding the percentage of structural units containing the aforementioned acid groups, considering both the reproducibility and adhesion of the polymer, it is preferably 1 to 50% by mass relative to 100% of all structural units of the polymer. More preferably, it is 5% by mass or more, further preferably 45% by mass or less, and even more preferably 40% by mass or less, and particularly preferably 35% by mass or less. That is, the percentage of structural units containing the aforementioned acid groups relative to 100% by mass of all structural units of the polymer is preferably 5 to 45% by mass, more preferably 5 to 40% by mass, and even more preferably 5 to 35% by mass. Furthermore, the structural unit containing the acid group is preferably introduced by polymerizing a monomer containing the acid group (also referred to as "monomer(s) containing the acid group"). Examples of such monomer(s) containing the acid group include: unsaturated monocarboxylic acids such as (meth)acrylic acid, butenoic acid, cinnamic acid, and vinylbenzoic acid; unsaturated polycarboxylic acids such as maleic acid, fumaric acid, itconic acid, citraconic acid, and mesocarboxylic acid; unsaturated anhydrides such as maleic anhydride and itconic anhydride; and unsaturated compounds containing phosphate groups such as Lightester P-1M (Kyoei Chemical Manufacturing Co., Ltd.); etc. Among these, carboxylic acid monomers (unsaturated monocarboxylic acids, unsaturated polycarboxylic acids, and unsaturated anhydrides) are suitable from the perspectives of versatility and availability. Unsaturated monocarboxylic acids are preferred from the perspectives of reactivity, heat resistance, and colorfastness, and (meth)acrylic acid is even more preferred. The polymer-1 of this invention substantially lacks vinyl unsaturated double bonds in its side chains. This reduces light sensitivity, making it less prone to line thickening (forming patterns wider than the exposure mask diameter) during exposure, thus enabling pattern miniaturization. In this invention, the aforementioned vinyl unsaturated double bond refers to a polymerizable double bond, i.e., a carbon-carbon double bond. The phrase "substantially lacking vinyl unsaturated double bonds in the side chains" refers to a range in which the effects of this invention are not achieved. For example, it refers to a range in which the content of structural units with vinyl unsaturated double bonds in the side chains is less than 5% by mass relative to 100% by mass of all structural units of the polymer, preferably 0-3% by mass, more preferably 0-1% by mass, and even more preferably 0-0.5% by mass. The double bond equivalent of the above-mentioned polymer is preferably 3000 (g / mol) or higher, and most preferably 30000 (g / mol) or higher. Regarding the actual determination of the above-mentioned double bond equivalent, the range below the determination limit is used in various analyses such as NMR and IR, and in the iodine value test methods described in JIS K 0070:1992. Examples of the aforementioned vinyl unsaturated double bonds include (meth)acrylic, vinyl, allyl, methylallyl, etc. The aforementioned vinyl unsaturated double bond is introduced into the polymer, for example, by reacting an epoxy-containing monomer with the acid group of the polymer to enhance reactivity. However, in this invention, it is not introduced, or substantially not introduced. Examples of the aforementioned epoxy-containing monomers include compounds containing an epoxy group and a polymerizable double bond. Examples of polymerizable double bonds, similar to the aforementioned vinyl unsaturated double bond, include (meth)acrylic, vinyl, allyl, and methylallyl. In this specification, the epoxy group includes not only epoxy groups in the narrow sense, but also groups such as those with an ethylene oxide ring bonded to a carbon atom (e.g., glycidyl), or those containing ether or ester bonds (e.g., glycidyl ether and glycidyl ester), and those with an cyclohexane oxide ring. Examples of the aforementioned epoxy-containing monomers include: glycidyl methacrylate, β-methyl glycidyl methacrylate, β-ethyl glycidyl methacrylate, vinyl benzyl glycidyl ether, allyl glycidyl ether, methyl (3,4-epoxycyclohexyl) methacrylate, and vinylcyclohexene oxide. As a structural unit containing ethylene unsaturated double bonds in the side chain, the structural unit represented by the following general formula (2) can be cited as an example. In the formula, R 3 and R 4 The same or different indicates a hydrogen atom or a methyl group. Z indicates a divalent organic group. Based on the structure of the above-mentioned monomers containing epoxy groups, various organic groups can be exemplified. For example, the organic groups represented by the following general formulas (61) or (62) can be exemplified as Z. Here, the * in the following general formulas (61) and (62) 1 It relates to the position of the oxygen atoms bonded to the main chain of the polymer. 2 The position of the bond between the oxygen atom and the ethylene unsaturated double bond on the side chain. Regarding the polymer-2 of the present invention, the content ratio of the structural unit represented by the above general formula (2) is 5% by mass or less relative to 100% by mass of all structural units of the polymer. The polymer-2 is preferably substantially free of this structural unit. Specifically, regarding the content ratio of the structural unit represented by the above general formula (2), based on the aspect of pattern miniaturization, it is preferably 3% by mass or less relative to 100% by mass of all structural units of the polymer, more preferably 1% by mass or less, particularly preferably 0.5% by mass or less, and most preferably 0% by mass. Furthermore, in the polymer-2 of the present invention, the percentage of structural units containing ethylene unsaturated double bonds in the side chain, including the structural units represented by the above general formula (2), is preferably 5% by mass or less, more preferably 3% by mass or less, further preferably 1% by mass or less, particularly preferably 0.5% by mass or less, and most preferably 0% by mass, relative to 100% by mass of all structural units of the polymer. Examples of structural units containing ethylene unsaturated double bonds in the side chain of the polymer-2 described above can be the same as those in the polymer-1 described above. The polymer of the present invention comprises, in its main chain, structural units having a ring structure and structural units represented by the above general formula (1). Each structural unit will be described. Hereinafter, the structural unit having a ring structure in the main chain will also be referred to as "structural unit (A)". Because the polymer's main chain backbone includes structural units with ring structures, the polymer of this invention exhibits improved heat resistance and enhanced adhesion of the cured product. It is believed that the ring structure in the main chain improves the polymer's resistance to thermal decomposition, thus ensuring the tight adhesion of the fine lines in the cured film. Furthermore, it is believed that combining with methacrylic acid as an acid compound further enhances the tight adhesion of the fine lines. The monomer providing the above-mentioned structural unit (A) is preferably one or more monomers having a ring structure containing a double bond within the molecule, or monomers that are cyclized and polymerized to form a polymer with a ring structure in the main chain. As such a monomer, it is preferable to use at least one selected from the group consisting of N-substituted maleic anhydride monomers, 2,2'-(oxydimethyl)dialkyl diacrylate monomers, and α-(unsaturated alkoxyalkyl)acrylate monomers. Thus, the structural unit having a ring structure in the main chain is preferably selected from at least one selected from the group consisting of N-substituted maleic anhydride monomer units (structural units derived from N-substituted maleic anhydride monomers), 2,2'-(oxydimethyl)dialkyl diacrylate monomer units, and α-(unsaturated alkoxyalkyl)acrylate monomer units. In particular, polymers containing N-substituted maleic diimide monomer units can provide hardened products with further improvements in heat resistance or dispersibility (e.g., dispersibility of colored materials), hardness, etc. Polymers containing the aforementioned monomer units, for example, refer to polymers that contain structural units derived from the monomers through polymerization or crosslinking reactions. Examples of N-substituted maleic anhydride monomers include N-cyclohexylmaleic anhydride, N-phenylmaleic anhydride, N-methylmaleic anhydride, N-ethylmaleic anhydride, N-isopropylmaleic anhydride, N-tert-butylmaleic anhydride, N-dodecylmaleic anhydride, N-benzylmaleic anhydride, and N-naphthylmaleic anhydride. One or more of these monomers may be used. Among these, N-cyclohexylmaleic anhydride, N-phenylmaleic anhydride, and N-benzylmaleic anhydride are preferred for their low coloring intensity or excellent dispersibility, with N-benzylmaleic anhydride being particularly suitable. Examples of the aforementioned N-benzylcis-butene diimide include: benzylcis-butene diimide; alkyl-substituted benzylcis-butene diimide such as p-methylbenzylcis-butene diimide and p-butylbenzylcis-butene diimide; phenolic hydroxyl-substituted benzylcis-butene diimide such as p-hydroxybenzylcis-butene diimide; and halogen-substituted benzylcis-butene diimide such as o-chlorobenzylcis-butene diimide, o-dichlorobenzylcis-butene diimide and p-dichlorobenzylcis-butene diimide. Examples of the aforementioned N-phenylcis-butene diimide include: phenylcis-butene diimide; alkyl-substituted phenylcis-butene diimide such as p-methylphenylcis-butene diimide and p-butylphenylcis-butene diimide; phenolic hydroxyl-substituted phenylcis-butene diimide such as p-hydroxyphenylcis-butene diimide; and halogen-substituted phenylcis-butene diimide such as o-chlorophenylcis-butene diimide, o-dichlorophenylcis-butene diimide, and p-dichlorophenylcis-butene diimide. As for the aforementioned 2,2'-(oxydimethylene)dialkyl acrylate monomers, from the viewpoints of less coloring or dispersibility and ease of industrial acquisition, dimethyl-2,2'-[oxybis(methylene)]bis-2-propenoate is suitable for use, for example. As the aforementioned α-(unsaturated alkoxyalkyl) acrylate monomers, preferably, for example, are: α-allyloxymethacrylate, α-allyloxymethacrylate methyl ester, α-allyloxymethacrylate ethyl ester, α-allyloxymethacrylate n-propyl ester, α-allyloxymethacrylate isopropyl ester, α-allyloxymethacrylate n-butyl ester, α-allyloxymethacrylate dibutyl ester, α-allyloxymethacrylate tributyl ester, α-allyloxymethacrylate n-pentyl ester, α-allyloxymethacrylate di-pentyl ester, α-allyloxymethacrylate neopentyl ester, α-allyloxymethacrylate n-hexyl ester, α-allyloxymethacrylate di-hexyl ester, α-allyloxymethacrylate n-heptyl ester, α-allyloxymethacrylate n-octyl ester, α-allyloxymethacrylate di-octyl ester, α-allyloxymethacrylate n-octyl ester, etc. Acrylates containing chain-like saturated hydrocarbon groups include trioctyl α-oxymethyl methacrylate, 2-ethylhexyl α-allyloxymethyl methacrylate, octyl α-allyloxymethyl methacrylate, nonyl α-allyloxymethyl methacrylate, decyl α-allyloxymethyl methacrylate, undecyl α-allyloxymethyl methacrylate, lauryl α-allyloxymethyl methacrylate, tridecyl α-allyloxymethyl methacrylate, myristyl α-allyloxymethyl methacrylate, pentadecyl α-allyloxymethyl methacrylate, cetyl α-allyloxymethyl methacrylate, heptadecanyl α-allyloxymethyl methacrylate, stearyl α-allyloxymethyl methacrylate, nonadecanyl α-allyloxymethyl methacrylate, eicosyl α-allyloxymethyl methacrylate, hexadecyl α-allyloxymethyl methacrylate, and triacontyl α-allyloxymethyl methacrylate. Alkyl (α-methylallyloxymethyl)acrylate monomers are also preferred. Among them, α-allyloxymethyl methacrylate (also known as α-(allyloxymethyl) methacrylate) is particularly suitable. The aforementioned α-(unsaturated alkoxyalkyl)acrylate monomers can be manufactured, for example, by the manufacturing method disclosed in International Patent Publication No. 2010 / 114077. In the aforementioned polymer, there may be only one or more structural units (A). Regarding the content ratio of the aforementioned structural unit (A), considering both the developability and adhesion of the polymer, it is preferably 0.5% to 50% by mass relative to 100% of all structural units of the polymer. More preferably, the content ratio of the aforementioned structural unit (A) relative to 100% by mass of all structural units of the polymer is 1% by mass or more, further preferably 2% by mass or more, and even more preferably 45% by mass or less, further preferably 40% by mass or less. That is, the content ratio of the aforementioned structural unit (A) relative to 100% by mass of all structural units of the polymer is preferably 1% to 45% by mass, and further preferably 2% to 40% by mass. Furthermore, the structural unit represented by the following general formula (1) is also referred to as "structural unit (B)". The above-mentioned structural unit (B) is preferably a structural unit derived from a monomer whose Tg (Tg when the homopolymer is made) is below -5°C. By having structural units (B) derived from monomers whose Tg is below -5°C, the polymer of the present invention allows the developer to easily penetrate during development, thereby accelerating the development speed. Furthermore, it is possible to achieve pattern miniaturization. The above-mentioned Tg of the homopolymer is preferably below -10°C, more preferably below -20°C, and even more preferably below -40°C. Moreover, the lower limit of the above-mentioned Tg of the homopolymer is -60°C. If the Tg is below -60°C, the developability is excessively increased, resulting in a pattern smaller than the photomask diameter, which is undesirable. That is, by setting the Tg range to the above range, a pattern diameter close to the photomask diameter can be obtained. In the above general formula (1), R 1 Represents a hydrogen atom or a methyl group. Regarding development speed, R... 1 The preferred atom is hydrogen. In the above general formula (1), R 2 This refers to a straight-chain or branched hydrocarbon group having 6 to 20 carbon atoms. Examples of such straight-chain or branched hydrocarbon groups having 6 to 20 carbon atoms include: 1-methylpentyl, 2-methylpentyl, 3-methylpentyl, 4-methylpentyl, 1,1-dimethylbutyl, 1,2-dimethylbutyl, 1,3-dimethylbutyl, 2,2-dimethylbutyl, 2,3-dimethylbutyl, 3,3-dimethylbutyl, 1-ethylbutyl, 2-ethylbutyl, 1,2,2-trimethylpropyl, 1-ethyl-1-methylpropyl, 1-ethyl-2-methylpropyl, n-heptyl, n-octyl, 2-ethylhexyl, n-nonyl, n-decyl, n-undecyl, n-dodecyl, n-tridecyl, n-tetradecyl, n-pentadecanyl, n-hexadecyl, n-heptadecyl, n-octadecyl, n-nonadecanyl, or n-eicosyl, etc. The aforementioned straight-chain or branched hydrocarbon groups with 6 to 20 carbon atoms are preferably straight-chain or branched hydrocarbon groups with 6 to 18 carbon atoms, more preferably straight-chain or branched hydrocarbon groups with 6 to 14 carbon atoms, and even more preferably branched hydrocarbon groups with 7 to 12 carbon atoms. Selecting a carbon number within the above range improves the adhesion to the substrate. This is due to the hydrophobic interaction of the carbon chains. If the carbon number is less than 6, the hydrophobic interaction is weak, and the adhesion is reduced. On the other hand, if the carbon number is 21 or more, the hydrophobic interaction is enhanced, and the adhesion is improved. However, if the adhesion is too strong, there is a risk of problems such as longer development time or thicker lines in the pattern. As mentioned above, R 2Specifically, examples of preferred compounds include n-octyl, n-dodecyl, 2-ethylhexyl, 2-ethylbutyl, and n-stearyl, with 2-ethylhexyl being a more preferred example. Regarding R... 2 Compared to straight chains, branched chains can more effectively exhibit hydrophobic interactions and have excellent close-knit properties. As a monomer providing the above-mentioned structural unit (B), examples of compounds represented by the following general formula (1-1) are preferred. CH 2=CR 1 -C(O)-OR 2 (1-1) (where R is the formula) 1 Represents a hydrogen atom or a methyl group. R 2 (Represents a straight-chain or branched hydrocarbon group having 6 to 20 carbon atoms). By polymerizing a monomeric component containing such a monomeric compound, a polymer having the above-described structural unit (B) can be obtained. R in the above general formula (1-1) 1 and R 2 Examples of R in the above general formula (1) can be given respectively. 1 and R 2 Those that are the same. Specifically, examples of monomers providing the above structural unit (B) include: n-octyl methacrylate, 2-ethylhexyl methacrylate, 2-ethylbutyl methacrylate, n-dodecyl methacrylate, n-octadecyl methacrylate, etc., and more preferably 2-ethylhexyl methacrylate. In the above polymers, there may be only one type of structural unit (B), or there may be two or more types. Regarding the content ratio of the aforementioned structural unit (B), considering the balance between the developability, pattern-forming properties, and adhesion of the polymer, it is preferably 10% by mass or more relative to 100% by mass of all structural units of the polymer. More preferably, the content ratio of the aforementioned structural unit (B) relative to 100% by mass of all structural units is 15% by mass or more, further preferably 20% by mass or more, and more preferably 80% by mass or less, and more preferably 70% by mass or less. That is, the content ratio of the aforementioned structural unit (B) relative to 100% by mass of all structural units of the polymer is preferably 10 to 80% by mass, more preferably 15 to 70% by mass, and further preferably 20 to 70% by mass. The polymers of the present invention may also have cyclic structures in their side chains. That is, the polymers may also contain structural units with cyclic structures (hereinafter also referred to as "structural units (C)") in their side chains. By having cyclic structures in their side chains, the hydrophobicity of the polymers can be improved, for example, solvent resistance can be improved. Examples of the aforementioned ring structures include aromatic ring structures such as benzene, or alicyclic structures such as cyclohexane skeletons, adamantane skeletons, and norcamphene skeletons. To give the polymer a ring structure in its side chains, monomer components containing monomers having aromatic hydrocarbon groups or alicyclic hydrocarbon groups and polymerizable double bonds can be polymerized. Examples of aromatic hydrocarbon groups mentioned above include benzyl, toluyl, naphthyl, biphenyl, and other aryl groups. Examples of the aforementioned alicyclic hydrocarbon groups include those with 3 to 20 carbon atoms, and more preferably 3 to 15 carbon atoms. Specifically, examples of such alicyclic hydrocarbon groups include monocyclic hydrocarbon groups such as cyclopropyl, cyclopentyl, cyclohexyl, cyclooctyl, cyclododecyl, cycloheptyl, cyclobutenyl, cyclopentenyl, and cyclohexenyl; and polycyclic hydrocarbon groups such as dicyclopentyl, dicyclopentenyl, tricyclodecyl, adamantyl, and isocamphenyl. These may also have substituents. Examples of polymerizable double bonds, similar to the vinyl unsaturated double bonds described above, include (meth)acryl, vinyl, allyl, and methylallyl. Among these, (meth)acryl is preferred in terms of reactivity. Specifically, monomers providing the aforementioned structural unit (C) may include, for example, monomers containing alicyclic hydrocarbon groups such as cyclohexyl methacrylate, cyclohexyl methyl methacrylate, isoborneol methacrylate, 1-adamantane methacrylate, (3,4-epoxycyclohexyl) methyl methacrylate, dicyclopentyl methacrylate, dicyclopentenyl methacrylate, dicyclopentenoxyethyl methacrylate, tricyclodecyl methacrylate, dimethyloltricyclodecane di(meth)acrylate, pentacyclic pentadecyl di(meth)acrylate, cyclohexanediethanol di(meth)acrylate, and norborneol diethanol di(meth)acrylate; and monomers containing aromatic hydrocarbon groups such as benzyl methacrylate and 1 molar ethoxylated phenylphenol acrylate. Among these, monomers containing alicyclic hydrocarbon groups are preferred for improving hydrophobicity, and cyclohexyl methacrylate is more preferably used. The content ratio of the above structural unit (C) relative to 100% mass of all structural units of the above polymer is preferably 1 to 60% by mass, more preferably 5 to 50% by mass, and even more preferably 5 to 40% by mass. In the above polymers, there may be only one type of structural unit (C), or there may be two or more types. The polymer may further have other structural units (D) as needed. Examples of other structural units (D) include (meth)acrylate monomers, hydroxyl-containing monomers, or other copolymerizable monomers other than the monomers that provide the structural unit (B). Examples of (meth)acrylate monomers other than those providing the above-mentioned structural unit (B) include: methyl methacrylate, ethyl methacrylate, n-propyl methacrylate, isopropyl methacrylate, n-butyl methacrylate, tributyl methacrylate, 1-methylpropyl methacrylate, 2-methylpropyl methacrylate, 1,1-dimethylethyl methacrylate, n-pentyl methacrylate, 1-methylbutyl methacrylate, 2-methylbutyl methacrylate. Ester, 3-methylbutyl methacrylate, 2,2-dimethylpropyl methacrylate, 1-ethylpropyl methacrylate, n-hexyl methacrylate, 1,1-dimethylpropyl methacrylate, 1,2-dimethylpropyl methacrylate, 2-methoxyethyl methacrylate, 2-ethoxyethyl methacrylate, tetrahydrofuran methyl methacrylate, N,N-dimethylaminoethyl methacrylate, 1,4-dioxaspiro[4,5]dec-2-yl-methacrylic acid, (meth)acrylic acid Phosphorus, 4-(methyl)acryloyloxymethyl-2-methyl-2-ethyl-1,3-dioxolane, 4-(methyl)acryloyloxymethyl-2-methyl-2-isobutyl-1,3-dioxolane, 4-(methyl)acryloyloxymethyl-2-methyl-2-cyclohexyl-1,3-dioxolane, 4-(methyl)acryloyloxymethyl-2,2-dimethyl-1,3-dioxolane, etc. Examples of hydroxyl-containing monomers include: 2-hydroxyethyl methacrylate, 2-hydroxypropyl methacrylate, 3-hydroxypropyl methacrylate, 2-hydroxybutyl methacrylate, 3-hydroxybutyl methacrylate, 4-hydroxybutyl methacrylate, 2,3-hydroxypropyl methacrylate, and other hydroxyalkyl methacrylates. Other monomers capable of copolymerization include, for example, one or more of the following compounds: (meth)acrylamides such as N,N-dimethyl(meth)acrylamide and N-hydroxymethyl(meth)acrylamide; macromonomers such as polystyrene, poly(meth)acrylate, polyethylene oxide, polypropylene oxide, polysiloxane, polycaprolactone, and polycaprolactone, whose polymer chains have a (meth)acrylamide group at one end; conjugated dienes such as 1,3-butadiene, isoprene, and chloroprene; and vinyl esters such as vinyl acetate, vinyl propionate, vinyl butyrate, and vinyl benzoate. Vinyl ethers include methyl vinyl ether, ethyl vinyl ether, propyl vinyl ether, butyl vinyl ether, 2-ethylhexyl vinyl ether, n-nonyl vinyl ether, lauryl vinyl ether, cyclohexyl vinyl ether, methoxyethyl vinyl ether, ethoxyethyl vinyl ether, methoxyethoxyethyl vinyl ether, methoxy polyethylene glycol vinyl ether, 2-hydroxyethyl vinyl ether, 4-hydroxybutyl vinyl ether, and other vinyl ethers; N-vinylpyrrolidone, N-vinylcaprolactone, N-vinylimidazolium, N-vinyl... N-ethylene compounds such as porphyrin and N-vinylacetamide; unsaturated isocyanates such as ethyl isocyanate and allyl isocyanate. In the above polymers, the structural unit (D) may be only one type or may be two or more types. The content ratio of the above-mentioned structural unit (D) relative to 100% mass of all structural units of the above-mentioned polymer is preferably 0 to 60% by mass, more preferably 0.5 to 50% by mass, and even more preferably 1 to 40% by mass. The weight-average molecular weight of the polymer is preferably 3,000 to 50,000. If the weight-average molecular weight is within this range, the viscosity can be adjusted to an appropriate range, resulting in good usability, and further improved adhesion and developability. More preferably, the weight-average molecular weight is 4,000 to 30,000, more preferably 5,000 to 20,000, and even more preferably 5,000 to 15,000. In this specification, the weight-average molecular weight can be determined by the method described in the following examples. The preferred acid value of the polymer is 50–200 mgKOH / g. If the acid value is within this range, not only will it exhibit alkali solubility, but the adhesion of the cured material will also be higher, and the development speed will be faster. Furthermore, the dispersibility of the polymer will also improve. More preferably, the acid value is 60–150 mgKOH / g, and even more preferably 70–150 mgKOH / g. In this specification, the acid value can be determined by the method described in the examples below. The glass transition temperature (Tg) of the aforementioned polymer is preferably below 100°C. If the glass transition temperature is within the above range, the developability and adhesion are excellent. The glass transition temperature is preferably below 90°C, more preferably below 80°C, and even more preferably below 70°C. Furthermore, regarding heat resistance, the glass transition temperature is preferably above -20°C, more preferably above 0°C, and particularly preferably above 20°C. That is, the glass transition temperature (Tg) of the aforementioned polymer is preferably -20 to 100°C, more preferably 0 to 90°C, even more preferably 20 to 80°C, and particularly preferably 20 to 70°C. In this specification, the glass transition temperature can be determined by the method described in the following examples. (Method for Manufacturing the Polymer) A method for manufacturing the polymer of the present invention will be described. The method for obtaining the polymer is not particularly limited; however, it is preferred to polymerize a monomeric component comprising at least a monomer (a) providing the structural unit (A), a monomer (b) providing the structural unit (B), and the monomer (s) containing an acid group. The synthesis method will be described below. The monomer component used for polymerization comprises at least the monomer (a), monomer (b), and the monomer (s) containing an acid group described above. The ratio of each monomer shown in the monomer component is not particularly limited, as long as a polymer with excellent developability and adhesion of the cured product can be obtained. For example, regarding the content ratio of the monomers (a), (b), and (s), relative to 100% by mass of the total monomer component of the obtained polymer, it is preferably 0.5–50% by mass of monomer (a), 15–80% by mass of monomer (b), and 1–50% by mass of monomer (s), more preferably 1–40% by mass of monomer (a), 20–70% by mass of monomer (b), and 5–35% by mass of monomer (s). Furthermore, when the monomer composition of the obtained polymer includes the monomer (a), monomer (b), monomer (s), and monomer (c) that provides the structural unit (C), the content ratio of each monomer relative to 100% by mass of the total monomer composition of the obtained polymer is preferably 0.5 to 50% by mass of monomer (a), 15 to 80% by mass of monomer (b), 1 to 50% by mass of monomer (s), and 1 to 60% by mass of monomer (c), more preferably 1 to 40% by mass of monomer (a), 20 to 70% by mass of monomer (b), 5 to 35% by mass of monomer (s), and 5 to 40% by mass of monomer (c). Furthermore, when the monomer composition of the obtained polymer includes the monomer (a), monomer (b), monomer (s), monomer (c), and monomer (d) that provides the structural unit (D), the content ratio of each monomer relative to 100% by mass of the total monomer composition of the obtained polymer is preferably 0.5 to 50% by mass of monomer (a), 15 to 80% by mass of monomer (b), 1 to 50% by mass of monomer (s), 1 to 60% by mass of monomer (c), and 1 to 60% by mass of monomer (d), more preferably 1 to 40% by mass of monomer (a), 20 to 70% by mass of monomer (b), 5 to 35% by mass of monomer (s), 5 to 40% by mass of monomer (c), and 1 to 40% by mass of monomer (d). There are no particular limitations on the method for polymerizing the aforementioned monomer components. Commonly used methods such as bulk polymerization, solution polymerization, and emulsion polymerization can be used, and the appropriate method can be selected according to the purpose and application. Among these, solution polymerization is advantageous in industrial applications, and structural adjustments such as molecular weight are easier, making it preferred. Furthermore, regarding the polymerization mechanism of the aforementioned monomer components, polymerization methods based on free radical polymerization, anionic polymerization, cationic polymerization, and coordination polymerization can be used. Polymerization methods based on free radical polymerization are also advantageous in industrial applications, making them preferred. The preferred form of the polymerization reaction is as described in Japanese Patent Application Publication No. 2016-29151. Regarding the polymerization initiation methods in the aforementioned polymerization reactions, as long as the energy required for polymerization initiation is supplied to the monomer components by an active energy source such as self-heating, electromagnetic waves (e.g., infrared, ultraviolet, X-rays), or electron beams, the energy required for polymerization initiation can be significantly reduced. Furthermore, the reaction is easier to control, making this method more suitable. Moreover, the molecular weight of the polymer obtained by polymerizing the aforementioned monomer components can be controlled by adjusting the amount or type of polymerization initiator, the polymerization temperature, and the type or amount of chain transfer agent. Examples of polymerization initiators include peroxides or azo compounds, which are commonly used as polymerization initiators. Examples of chain transfer agents include alkyl thiols, mercaptocarboxylic acids, mercaptocarboxylic acid esters, and other compounds containing a thiol group, which are commonly used as chain transfer agents. One of these compounds may be used alone, or two or more may be used in combination. Furthermore, the amount added can be appropriately set according to known methods. Examples of solvents used in the above polymerization include: methanol, ethanol, isopropanol, n-butanol, ethylene glycol monomethyl ether, propylene glycol monomethyl ether, and other alcohols; tetrahydrofuran, dimethyl ether, etc. Ethers such as alkanes, ethylene glycol dimethyl ether, and diethylene glycol dimethyl ether; ketones such as acetone and methyl ethyl ketone; esters such as ethyl acetate, butyl acetate, propylene glycol monomethyl ether acetate, and 3-methoxybutyl acetate; aromatic hydrocarbons such as toluene, xylene, and ethylbenzene; chloroform; dimethyl sulfoxide; and dimethyl carbonate. These solvents can be used alone or in combination of two or more. Furthermore, without compromising the effects of the present invention, an addition reaction can also be carried out between the epoxy-containing monomer and a portion of the acid groups contained in the aforementioned polymer. The reaction method is not particularly limited, and known methods can be appropriately employed; for example, it is preferred to set the reaction temperature to 60–140°C. Also, it is preferred to use: amine compounds such as triethylamine or dimethylbenzylamine; ammonium salts such as tetraethylammonium chloride; phosphonium salts such as tetraphenylphosphonium bromide; amide compounds such as dimethylformamide; and other known catalysts. Regarding the amount of the epoxy-containing monomer used, it is preferable that the content ratio of the structural unit represented by the above general formula (2) is 5% by mass or less relative to 100% by mass of all structural units of the polymer, more preferably 3% by mass or less, even more preferably 0.5% by mass or less, and most preferably 0% by mass. For example, relative to 100 parts by mass of the total monomer component of the obtained polymer, it is preferable to set it to 0 to 5 parts by mass, more preferably 0 to 3 parts by mass, even more preferably 0 to 1 part by mass, and most preferably 0 to 0.5 parts by mass (a range that is not substantially present). In this way, the fine line adhesion is further improved, and pattern miniaturization can be achieved. Furthermore, during synthesis, it is preferable to set the amounts of solvent and each monomer component such that the final solids concentration of the polymer solution is 10-70% by mass. From the perspectives of productivity and polymerizability, a more preferred final solids concentration (non-volatile concentration) is 20-65% by mass, and even more preferably 25-60% by mass. The polymer of this invention exhibits excellent developability, enabling the production of cured products (cured films, micro-patterns) with excellent pattern-forming properties and fine-line adhesion. Therefore, it can be used as a resist polymer or an alkaline-developable negative resist material for fabricating colored pixels, black matrices, black column spacers, overcoats, photo spacers, or optical waveguides in color filters. Furthermore, due to its good dispersibility of colored materials, it can also be used as a component of color-sensitive photoresist for color filters. The aforementioned polymer is particularly preferred as an alkali-soluble resin used as an adhesive resin for color photoresists, and it is extremely useful as a component of photosensitive resin compositions. 2. Photosensitive Resin Composition The aforementioned polymer can be further formulated into a photosensitive resin composition containing multifunctional monomers. Furthermore, a photosensitive resin composition containing a photopolymerization initiator and a colored material can be formulated as needed. Because the aforementioned photosensitive resin composition contains the aforementioned polymer, it has a faster development speed and can obtain a cured product with excellent pattern forming properties and fine line adhesion. Furthermore, by further containing multifunctional monomers, a cured product with excellent curability, adhesion to the substrate, mechanical strength, heat resistance, and other physical properties can be obtained. This type of photosensitive resin composition containing the aforementioned polymer and multifunctional monomers is also one aspect of the present invention. Its application is not limited, and it is suitable for use as a material for forming protective films for colored pixels of color filters, color filters, liquid crystal display elements, integrated circuit elements, solid-state imaging elements, etc. In the aforementioned photosensitive resin composition, the polymer content is preferably 5% by mass or more, and more preferably 70% by mass or less, relative to 100% by mass of the total solids content of the photosensitive resin composition. Within this range, the effects of the present invention can be more significantly achieved. More preferably, it is 10-65% by mass, further preferably 10-50% by mass, especially preferably 10-40% by mass, even more preferably 10-35% by mass, and most preferably 15-35% by mass. Furthermore, the term "total solids content" refers to the total amount of components that form the cured product (excluding solvents, etc., that evaporate during the formation of the cured product). Among the aforementioned photosensitive resin compositions, the multifunctional monomers are low-molecular-weight compounds possessing polymerizable unsaturated bonds (also called polymerizable unsaturated groups) that can be polymerized by irradiation with active energy lines such as free radicals, electromagnetic waves (e.g., infrared, ultraviolet, X-rays), or electron beams. For example, multifunctional compounds having two or more polymerizable unsaturated groups in their molecules can be cited. The molecular weight of the aforementioned multifunctional monomers is not particularly limited, but from a practical point of view, it is preferably 3000 or less, and more preferably 2000 or less. Among the aforementioned multifunctional monomers, polyfunctional (meth)acrylate compounds with two or more functions (hereinafter also simply referred to as "polyfunctional (meth)acrylate compounds") are particularly preferred. These are compounds having two or more (meth)acrylic groups in one molecule. By including such compounds, the photosensitive resin composition becomes one with excellent photosensitivity and curing properties, and a curing film (micro-pattern) with high hardness and high adhesion can be obtained. The aforementioned polyfunctional (meth)acrylate compounds preferably have 3 or more functions, more preferably 4 or more, and even more preferably 5 or more. Furthermore, from the viewpoint of further suppressing curing shrinkage, the functionality number is preferably 10 or less, more preferably 8 or less, and even more preferably 6 or less. That is, the aforementioned polyfunctional (meth)acrylate compounds preferably have 3 to 10 functions, more preferably 4 to 8, and even more preferably 5 to 6. Examples of the aforementioned multifunctional monomers include: (ii) ethylene glycol di(meth)acrylate, propylene glycol di(meth)acrylate, trimethylolpropane di(meth)acrylate, trimethylolpropane tri(meth)acrylate, neopentyltetroxide di(meth)acrylate, neopentyltetroxide tri(meth)acrylate, neopentyltetroxide tetra(meth)acrylate, dinepentyltetroxide di(meth)acrylate, dinepentyltetroxide tri(meth)acrylate, dinepentyltetroxide tetra(meth)acrylate, dinepentyltetroxide penta(meth)acrylate, dinepentyltetroxide hexa(meth)acrylate, tri(hydroxyethyl)isocyanurate tri(meth)acrylate, and other multifunctional (meth)acrylates. The preferred formulations are: trimethylolpropane tri(meth)acrylate, neopentyltetra(meth)acrylate, dinepentyltetra(meth)acrylate, ethylene oxide-added dinepentyltetra(meth)acrylate, propylene oxide-added trimethylolpropane tri(meth)acrylate, propylene oxide-added di-trimethylolpropane tetra(meth)acrylate, propylene oxide-added neopentyltetra(meth)acrylate, propylene oxide-added dinepentyltetra(meth)acrylate, ε-caprolactone-added trimethylolpropane tri(meth)acrylate, ε-caprolactone-added di-trimethylolpropane tetra(meth)acrylate, ε-caprolactone-added neopentyltetra(meth)acrylate, and ε-caprolactone-added dinepentyltetra(meth)acrylate. The content ratio of the aforementioned multifunctional monomers can be appropriately set according to the type of multifunctional monomers or polymers used, as well as the purpose or application. From the viewpoint of superior developability, curing properties, and adhesion, it is preferably 2% by mass or more, and more preferably 85% by mass or less, relative to 100% of the total solid content of the photosensitive resin composition. The lower limit is more preferably 5% by mass or more, more preferably 10% by mass or more, and even more preferably 15% by mass or more. The upper limit is more preferably 75% by mass or less, more preferably 60% by mass or less, even more preferably 50% by mass or less, and most preferably 40% by mass or less. That is, the content ratio of the aforementioned multifunctional monomers relative to 100% of the total solid content of the photosensitive resin composition is more preferably 5 to 75% by mass, more preferably 10 to 60% by mass, even more preferably 15 to 50% by mass, and most preferably 15 to 40% by mass. Furthermore, the content of the aforementioned multifunctional monomer relative to 100 parts by mass of the polymer is preferably 50 to 500 parts by mass. If the content of the multifunctional monomer is within this range, a hardened film with higher surface hardness can be obtained, and combined with the fact that the polymer preferably has a weight average molecular weight of 3000 or more, the developability is further improved. More preferably, it is 80 parts by mass or more, further preferably 100 parts by mass or more, and even more preferably 120 parts by mass or more. Also, from the viewpoint of further improving developability, it is more preferably 400 parts by mass or less. Further preferably, it is 300 parts by mass or less, even more preferably 200 parts by mass or less, and most preferably 150 parts by mass or less. That is, the content of the aforementioned multifunctional monomer relative to 100 parts by mass of the polymer is preferably 80 to 400 parts by mass, further preferably 100 to 300 parts by mass, even more preferably 120 to 200 parts by mass, and most preferably 120 to 150 parts by mass. Regarding the aforementioned photosensitive resin composition, it is preferable to use a photopolymerization initiator when curing the photosensitive resin composition. Examples of photopolymerization initiators that can be used include: alkylphenone compounds, amino ketone compounds, benzophenone compounds, benzoin compounds, and 9-oxosulfur compounds. (thioxanthone) series compounds, halomethylated trimethylolpropionic acid System compounds, halomethylation Diazole compounds, biimidazole compounds, oxime ester compounds, oxime ether compounds, titanium dioxide compounds, benzoate compounds, acridine compounds, and other known photopolymerization initiators. Specifically, examples include: diethoxyacetophenone, 2-hydroxy-2-methyl-1-phenylprop-1-one, benzil dimethylketal, 4-(2-hydroxyethoxy)phenyl-(2-hydroxy-2-propyl)one, 1-hydroxycyclohexylphenyl ketone, 2-methyl-1-[4-(methylthio)phenyl]-2- linylpropion-1-one, 2-benzyl-2-dimethylamino-1-(4- Phthalophenyl)butanone, oligomeric {2-hydroxy-2-methyl-1-[4-(1-methylvinyl)phenyl]acetone}, 2-hydroxy-1-{4-[4-(2-hydroxy-2-methylpropionic)benzyl]phenyl}-2-methylprop-1-one and other acetophenones; benzoin, benzoin methyl ether, benzoin ethyl ether, benzoin isopropyl ether, benzoin isobutyl ether and other benzoin derivatives; benzophenone, methyl o-benzoate, 4 Benzyl benzophenone, 4-benzoyl-4'-methyl-diphenyl sulfide, 3,3',4,4'-tetra(tert-butylperoxycarbonyl)benzophenone, 2,4,6-trimethylbenzophenone, 4-benzoyl-N,N-dimethyl-N-[2-(1-sidekto-2-propenyloxy)ethyl]benzamide bromide, (4-benzoylbenzyl)trimethylammonium chloride and other benzophenone derivatives; 2-isopropyl-9-oxosulfuron 4-Isopropyl-9-Oxysulfur 2,4-Diethyl-9-oxosulfur 2,4-Dichloro-9-oxysulfur 1-Chloro-4-propoxy-9-oxosulfur 2-(3-Dimethylamino-2-hydroxy)-3,4-dimethyl-9H-9-oxosulfur 9-keto mesochloride and other 9-oxosulfur compounds Examples of this class include: methyl phenylglyoxylate, 2,4,6-trimethylbenzoyl-diphenylphosphine oxide, and bis(2,4,6-trimethylbenzoyl)-phenylphosphine oxide. Among these, 2-methyl-1-[4-(methylthio)phenyl]-2- linylpropion-1-one, 2-benzyl-2-dimethylamino-1-(4- (Linylphenyl)butanone. Examples of other examples include: organic peroxides such as cumene hydroperoxide, diisopropylbenzene hydroperoxide, ditert-tert-butyl peroxide, lauryl peroxide, benzoyl peroxide, tert-butyl peroxyisopropyl carbonate, tert-pentyl peroxy-2-ethylhexanoate, and tert-butyl peroxy-2-ethylhexanoate; azo compounds such as 2,2'-azobis(isobutyronitrile), 1,1'-azobis(cyclohexanenitrile), 2,2'-azobis(2,4-dimethylpentanonitrile), and 2,2'-azobis(dimethyl 2-methylpropionate); and diacene compounds such as bis(η5-2,4-cyclopentadien-1-yl)-bis(2,6-difluoro-3-(1H-pyrrolo-1-yl)-phenyl)titanium ("IRGACURE 784", manufactured by BASF). Among these, the preferred photopolymerization initiators are: phenyl ketone compounds, amino ketone compounds, oxime ester compounds, and oxime ether compounds; more preferably, they are: 2-methyl-1-[4-(methylthio)phenyl]-2- 2-Pyrolactone ("IRGACURE 907", manufactured by BASF), 2-Benzyl-2-dimethylamino-1-(4- Phenyl ketone compounds such as linylphenyl)-butanone-1 ("IRGACURE 369", manufactured by BASF); or 1,2-octanedione-1-[4-(phenylthio)phenyl]-2-(O-benzoxime) ("OXE01", manufactured by BASF), acetone-1-[9-ethyl-6-(2-methylbenzoyl)-9H-carbazole-3-yl]-1-(O-acetyloxime) Oxime ester compounds, including 1,2-octanedione-1-[4-(phenylthio)-2-(O-benzoxime)] ("OXE03", manufactured by BASF), and acetone-1-[9-ethyl-6-(2-methylbenzoyl)-9H-carbazole-3-yl]-1-(O-acetyloxime) ("OXE04", manufactured by BASF). These photopolymerization initiators can be used alone or in combination of two or more. Among the aforementioned photopolymerization initiators, it is particularly suitable to use at least benzyl ketone compounds and amino ketone compounds (also known as amino ketone polymerization initiators). That is, the aforementioned photosensitive resin composition preferably further includes an amino ketone polymerization initiator. This results in superior hardness and adhesion. The content of the aforementioned photopolymerization initiator can be appropriately set according to the purpose and application, and is not particularly limited. It is suitable to be 0.5 parts by mass or more relative to 100 parts by mass of the total solid content of the photosensitive resin composition. This allows for the acquisition of a hardened film with superior adhesion. More preferably, it is 1 part by mass or more, and even more preferably, 1.5 parts by mass or more. Furthermore, considering the balance between the effects of decomposition products of the photopolymerization initiator and economic efficiency, it is preferable to be 30 parts by mass or less. More preferably, it is 20 parts by mass or less, and even more preferably, 10 parts by mass or less. That is, the content of the aforementioned photopolymerization initiator relative to 100 parts by mass of the total solid content of the photosensitive resin composition is preferably 0.5 to 30 parts by mass, more preferably 1 to 20 parts by mass, and even more preferably 1.5 to 10 parts by mass. Furthermore, examples of photosensitizers or photoradical polymerization accelerators that can be used in conjunction with the aforementioned photopolymerization initiators include: xanthene pigments, coumarin pigments, 3-ketocoumarin compounds, pyrromethene pigments, and other pigment compounds; dialkylaminobenzoate, 2-ethylhexyl 4-dimethylaminobenzoate, and other dialkylaminobenzoate compounds; 2-mercaptobenzothiazole, 2-mercaptobenzo[…] Thiol-based hydrogen donors such as azoles and 2-mercaptobenzimidazole. The photosensitive resin composition of the present invention (preferably a negative photosensitive resin composition) preferably includes a colored material. Examples of such colored materials include pigments or dyes. One of the pigments or dyes can be used, or a combination of pigments and dyes can be used. For example, when forming red, blue, and green pixels for a color filter, known methods such as appropriately combining blue and purple, green and yellow, etc., to achieve the desired color characteristics can be used. Furthermore, when forming a black matrix or black pillar spacers, a black colored material can be used. Among the colored materials, pigments are preferred for durability, while dyes are preferred for improving the brightness of the panel, etc. These can be appropriately selected according to the desired characteristics. In the photosensitive resin composition of the present invention, a pigment is preferred from the perspective of improving the heat resistance and colorfastness of the cured material. As the pigment, the same pigments described in Japanese Patent Application Publication No. 2015-157909 may be used. The aforementioned pigments are not particularly limited, and examples include: azo pigments, phthalocyanine pigments, polycyclic pigments (quinacridone-based, perylene-based, pyrene-based, isoindolineone-based, isoindoline-based, dicyclic pigments, etc.). Organic pigments include: pigments of various types such as thio-indigo, anthraquinone, quinoline, metal complex, and pyrrolopyrrole dione; pigments of various types such as lake pigments; pigments of various types such as white pigments, extender pigments (titanium oxide, zinc oxide, zinc sulfide, clay, talc, barium sulfate, calcium carbonate, etc.); pigments of various types such as chrome yellow, cadmium, chrome red, nickel titanium, chrome titanium, yellow iron oxide, iron oxide, zinc chromate, lead oxide, sapphire blue, iron blue, cobalt blue, chrome green, chromium oxide, bismuth vanadate, etc.); pigments of various types such as carbon black, bone black, graphite, iron black, titanium black, etc.; pigments of various types such as pearlescent pigments, aluminum pigments, bronze pigments, etc.; and pigments of various types such as fluorescent pigments (zinc sulfide, strontium sulfide, strontium aluminate, etc.). As the aforementioned dyes, organic dyes described in Japanese Patent Application Publication Nos. 2010-9033, 2010-211198, 2009-51896, and 2008-50599 may be used. Among these, azo dyes, anthraquinone dyes, phthalocyanine dyes, quinone imine dyes, quinoline dyes, nitro dyes, carbonyl dyes, and methylene dyes are preferred. These colored materials may be used alone or in combination of two or more. The content ratio of the aforementioned colored materials is not particularly limited and can be appropriately set according to the purpose and application. Relative to 100% by mass of the total solid content of the aforementioned photosensitive resin composition, it is preferably 2-80% by mass, more preferably 5-70% by mass, and even more preferably 10-60% by mass. By controlling it within these ranges, the requirements for higher color purity or higher brightness in recent years can be adequately met. Furthermore, when the photosensitive resin composition of the present invention contains the aforementioned colored material, it is preferable to further include a dispersant. The aforementioned dispersant refers to a substance having interaction sites with the colored material and with the dispersion medium (e.g., solvent or binder resin), and having the function of stabilizing the dispersion of the colored material in the dispersion medium. Generally, it is classified into resin-type dispersants (e.g., polymeric dispersants), surfactants (e.g., low-molecular-weight dispersants), and pigment derivatives. One of these can be used alone, or two or more can be used in combination. Examples of the aforementioned resin-type dispersants include: polyurethane, polycarboxylate esters such as polyacrylates, unsaturated polyamides, polycarboxylic acids, polycarboxylic acid amine salts, polycarboxylic acid ammonium salts, polycarboxylic acid alkylamine salts, polysiloxanes, long-chain polyaminoamide phosphates, hydrogen-containing polycarboxylate esters, amides or their salts formed by the reaction of poly(lower alkylimides) with polyesters having free carboxyl groups, (meth)acrylate-styrene copolymers, (meth)acrylate-(meth)acrylate copolymers, styrene-maleic acid copolymers, polyvinyl alcohol, polyvinylpyrrolidone, polyesters, modified polyacrylates, ethylene oxide / polypropylene oxide adducts, etc. Commercially available examples of the aforementioned resin-type dispersants include those identical to those described in Japanese Patent Application Publication No. 2015-157909. Examples of the aforementioned surfactants include: anionic surfactants such as polyoxyethylene alkyl ether sulfates, sodium dodecylbenzene sulfonate, sodium alkylnaphthalene sulfonate, sodium alkyl diphenyl ether disulfonate, monoethanolamine lauryl sulfate, triethanolamine lauryl sulfate, ammonium lauryl sulfate, sodium stearate, and sodium lauryl sulfate; nonionic surfactants such as polyoxyethylene oil ethers, polyoxyethylene lauryl ethers, polyoxyethylene nonylphenyl ethers, polyoxyethylene sorbitan monostearate, and polyethylene glycol monolaurate; cationic surfactants such as alkyl quaternary ammonium salts or their ethylene oxide adducts; and amphoteric surfactants such as alkyl betaines and alkyl imidazolines. The aforementioned pigment derivatives refer to compounds whose structures incorporate functional groups into pigments. Examples of functional groups include: sulfonic acid groups, sulfonamide groups and their quaternary salts, dialkylamine groups, hydroxyl groups, carboxyl groups, amide groups, and phthalimide groups. Examples of pigment structures that form the parent compound include: azo compounds, anthraquinone compounds, quinoline compounds, phthalocyanine compounds, quinacridone compounds, benzimidazolone compounds, isoindolinide compounds, and di-... Series, including indanthrene series, perylene series, and pyrrolopyrrole dione series. The content ratio of the above-mentioned dispersant can be appropriately set according to the purpose or application. From the viewpoint of balancing dispersion stability, durability (heat resistance, light resistance, weather resistance, etc.) and transparency, for example, it is preferably 0.01 to 60% by mass relative to 100% by mass of the total solid content of the photosensitive resin composition. More preferably, it is 0.1 to 50% by mass, and even more preferably, it is 0.3 to 40% by mass. The method for preparing the above-mentioned photosensitive resin composition is not particularly limited, and any known method may be used. For example, a method in which the above-mentioned constituent components are mixed and dispersed using various mixers or dispersers may be cited. The mixing and dispersion steps are not particularly limited, and may be carried out by known methods. Furthermore, other commonly performed steps may also be included. Moreover, when the above-mentioned photosensitive resin composition contains colored materials, it is preferable to prepare it through a colored material dispersion treatment step. As a dispersion treatment step for the aforementioned colored materials, an example method can be given as follows: First, specific amounts of the colored material (preferably an organic pigment), dispersant, and solvent are weighed out, and the colored material is dispersed into microparticles using a disperser to obtain a liquid colored material dispersion (also called a "mill base"). Examples of such dispersers include: paint conditioners, bead mills, roller mills, ball mills, jet mills, homogenizers, kneaders, and mixers. A preferred dispersion treatment step is to perform a method of micro-dispersion treatment using a media mill such as a bead mill filled with 0.01–1 mm beads after mixing and dispersing using a roller mill, kneader, or mixer. A pre-mixed composition (preferably a transparent liquid) containing the aforementioned polymer and multifunctional monomers is added to the obtained mill base to prepare a uniform dispersion solution, thereby obtaining a photosensitive resin composition. Furthermore, the obtained photosensitive resin composition is preferably filtered using a filter or similar device to remove fine contaminants. The photosensitive resin composition of the present invention (preferably a negative photosensitive resin composition) preferably includes a solvent as a diluent, as needed. As a solvent, there are no particular limitations as long as it can uniformly dissolve the aforementioned polymer, multifunctional monomer, photopolymerization initiator, and colored material. Specifically, examples include: tetrahydrofuran, dihydrofuran, etc. Ethers such as alkanes, ethylene glycol dimethyl ether, and diethylene glycol dimethyl ether; ketones such as acetone, methyl ethyl ketone, methyl isobutyl ketone, and cyclohexanone; esters such as ethyl acetate, butyl acetate, propylene glycol monomethyl ether acetate, and 3-methoxybutyl acetate; alcohols such as methanol, ethanol, isopropanol, n-butanol, ethylene glycol monomethyl ether, and propylene glycol monomethyl ether; aromatic hydrocarbons such as toluene, xylene, and ethylbenzene; chloroform and dimethyl sulfoxide; etc. Furthermore, the solvent content can be appropriately set according to the optimal viscosity when using the photosensitive resin composition. For example, it should be 1000 parts by weight or less, more preferably 700 parts by weight or less, relative to 100 parts by weight of the polymer. As a preferred lower limit, it should be 30 parts by weight or more, more preferably 60 parts by weight or more, relative to 100 parts by weight of the polymer. By controlling it within the above-mentioned value range, the usability or storage stability of the composition, and thus the efficiency of the coating operation, are improved. That is, the solvent content relative to 100 parts by mass of polymer is preferably 30 to 1000 parts by mass, and more preferably 60 to 700 parts by mass. The viscosity of the aforementioned photosensitive resin composition can be appropriately set according to the desired thickness of the cured film. The viscosity of the photosensitive resin composition can be adjusted by adding a solvent. The upper limit of the viscosity of a photosensitive resin composition with a solid content (non-volatile matter) adjusted to 40% by adding a solvent is preferably 30 mPa·s or less, more preferably 20 mPa·s or less, and particularly preferably 15 mPa·s or less. Furthermore, the lower limit of the viscosity, depending on the desired thickness of the cured film, is preferably 1 mPa·s or more, and more preferably 5 mPa·s or more. By setting the viscosity within the above range, usability and coating workability are improved. In addition to the above-mentioned components, the photosensitive resin composition of the present invention may also contain, to the extent that it does not impair the effects of the present invention, fillers such as aluminum hydroxide, talc, clay, barium sulfate, quantum dot particles, defoamers, coupling agents, leveling agents, sensitizers, release agents, lubricants, plasticizers, antioxidants, ultraviolet absorbers, light stabilizers, flame retardants, polymerization inhibitors, polymerization retarders, polymerization accelerators, tackifiers, dispersants, surfactants, and other known additives. Furthermore, the present invention can also be a hardened film obtained by curing the aforementioned polymer and / or the aforementioned photosensitive resin composition. For example, the aforementioned photosensitive resin composition can be coated onto a substrate and then cured to obtain a hardened film. Examples of materials used as the substrate for coating include transparent materials such as glass, acrylic resin, polycarbonate resin, polyester resin such as PET, and polystyrene resin, or metallic materials such as aluminum, copper, iron, and stainless steel. The film thickness of the aforementioned hardened film is preferably 0.1 to 20 μm. This adequately addresses the requirement for low-profile components or display devices using the aforementioned hardened film. More preferably, it is 0.5 to 10 μm, and even more preferably, it is 0.5 to 8 μm. The aforementioned hardened film is suitable for applications such as color filters, black matrices, optical spacers, black column spacers, inks, printing plates, printed wiring boards, semiconductor components, photoresists, insulating films, films, organic protective films, and other components used in liquid crystal displays, organic EL displays, quantum dot displays, micro LED liquid crystal displays, solid-state imaging devices, touch panel display devices, etc., as well as in motors, electronic devices, etc. Its application in color filters is preferred. A color filter made using the aforementioned photosensitive resin composition, specifically a color filter having a hardened material (hardened film) formed from the aforementioned photosensitive resin composition on a substrate, and a method for manufacturing the color filter, are suitable embodiments of the present invention. 3. As an example of a color filter having the aforementioned hardened material (hardened film), a color filter having the aforementioned hardened film on a substrate can be cited as an example. The manufacturing method will be described in detail below. Furthermore, the components constituting the color filter specifically include RGB pixels, a resin black matrix, a protective film, and columnar spacers, etc. Preferably, at least one of these components constituting the color filter has a hardened film formed from the photosensitive resin composition of the present invention. Here, when forming RGB pixels, the resin composition of the present invention includes colored materials of each of the three primary colors: red, green, and blue; when forming the resin black matrix, it includes black colored material. The aforementioned color filter can be manufactured, for example, in the following manner: 1) A photosensitive resin composition is coated onto a substrate using a known coating method, and then dried to form a coating film. The substrate is preferably a transparent substrate; specifically, examples include glass (preferably alkali-free glass) or transparent plastic. Depending on the need, the substrate may also be subjected to corona discharge treatment, ozone treatment, or chemical treatment using a silane coupling agent. Known coating methods include spin coating and spray coating, with spin coating being preferred. Regarding drying conditions, the drying temperature is preferably room temperature to 120°C, more preferably 60 to 100°C. The drying time is preferably 10 seconds to 60 minutes, more preferably 30 seconds to 10 minutes. Furthermore, it is preferable to perform heating drying under normal pressure or vacuum. 2) Subsequently, a photomask (patterned film) with openings corresponding to the desired pattern shape is placed on the coating obtained in step 1) in either a contact or non-contact state, and then irradiated with light to harden it. The light refers not only to visible light but also to radiation such as ultraviolet light, X-rays, and electron beams, with ultraviolet light being the most suitable. High-pressure mercury lamps are generally suitable as ultraviolet light sources. 3) After light irradiation as described in 2), development is performed using a solvent, water, or an alkaline aqueous solution. Alkaline aqueous solutions are preferred due to their low environmental impact and ability to achieve high-sensitivity development. The alkaline component in the alkaline aqueous solution is not particularly limited, but potassium hydroxide, sodium hydroxide, and / or sodium carbonate are preferred. The concentration of the alkaline component in a 100% by mass alkaline aqueous solution is preferably 0.01–5% by mass. If the concentration of the alkaline component is within this range, the solubility of the alkali-soluble polymer is further improved, thereby further enhancing developability (development speed). More preferably, it is 0.05–3% by mass, and even more preferably 0.1–1% by mass. Surfactants may also be added to the alkaline aqueous solution. 4) Using a photosensitive resin composition containing black colored material, perform steps 1) to 3) above to form a resin black matrix on the substrate. 5) Then, the colored materials of the photosensitive resin composition are changed sequentially to red (R), green (G), and blue (B), and the steps 1) to 3) above are repeated to form R, G, and B pixels to create RGB pixels. 6) Then, in order to improve the protection or surface smoothness of the RGB pixels formed on the substrate, a protective film is formed as needed. 7) When the above-mentioned color filter is a color filter for a liquid crystal display device, it is preferable to further form a columnar spacer. The columnar spacer can be made by coating a photosensitive resin composition on the surface where the spacer is to be formed with a thickness that is the desired height of the spacer, through the steps of 1) to 3) above. Here, when manufacturing the color filter, it is preferable to perform post-development heating (post-baking) during the fabrication of each component to further harden it and completely remove any residual solvent. The post-baking temperature is preferably 120–300°C. Setting it to this temperature can more effectively suppress the reduction in coating smoothness caused by pixel coloring and thermal decomposition, and further enhance coating strength through further hardening. Therefore, the hardness and adhesion of the patterned hardened film can be made more robust. More preferably, it is 150–250°C, and even more preferably, it is 180–230°C. Post-baking can be performed after development during the formation of each component (after step 3 above when fabricating each component) or after all components have been formed. As described above, the polymer of the present invention exhibits excellent developability, enabling the production of cured products with excellent adhesion. Furthermore, the photosensitive resin composition comprising the polymer of the present invention and multifunctional monomers exhibits faster development speed, resulting in cured products with excellent adhesion to the substrate and heat resistance. This polymer and photosensitive resin composition of the present invention can be used as resist materials (preferably resists for color filters), various coatings, paints, and other applications. Moreover, because the polymer contains acid groups such as carboxyl groups, it can be appropriately used as an alkaline developable negative resist material for manufacturing color-filtering pixels, black matrices, outer coatings, optical spacers, or optical waveguides. 4. Components for a Display Device and a Display Device The components for a display device and the display device of the present invention have the aforementioned hardened film, and may also have one or more other constituent components. In recent years, with the advancement of display device technology, there has been a strong demand for higher performance in the components used. Using the photosensitive resin composition of the present invention can significantly improve the reliability of the display quality or image quality of various display devices to a level that adequately meets these demands. The display device is not particularly limited; for example, it is suitable for liquid crystal display devices, solid-state imaging elements, touch panel display devices, etc. As a touch panel display device, a capacitive type is particularly preferred. The components for the aforementioned display device can be single-layer or multi-layer components formed by the aforementioned hardened film, or components formed by combining other layers into the single-layer or multi-layer components, or components that include the aforementioned hardened film in their structure (e.g., color filters). Examples The present invention will be further described in detail below by way of examples, but the following examples do not limit the present invention. All modifications and implementations without departing from the spirit of the present invention are included within the technical scope of the present invention. The present invention is specifically illustrated by examples, comparative examples, and characteristic evaluations. Furthermore, in the examples and comparative examples, unless otherwise specified, %, wt% refers to mass, and parts refers to parts by mass. In the following manufacturing examples, etc., various physical properties are evaluated in the following manner. [Evaluation Method] (1) Weight Average Molecular Weight (Mw) was determined by using GPC (HLC-8320GPC, manufactured by Tosoh) with THF as the dissolution solution and TSK gel SuperHZM-M (manufactured by Tosoh) as the column, and calculated by conversion to standard polystyrene. (2) Solids Composition: Approximately 0.3 g of the polymer solution prepared in the examples and comparative examples was placed in an aluminum cup, and approximately 1 g of acetone was added to dissolve it. The solution was then allowed to dry naturally at room temperature. Subsequently, a hot air dryer (trade name: PHH-101, manufactured by ESPEC) was used to dry the solution at 140°C for 3 hours. After cooling in the dryer, the weight was measured. Based on the weight reduction, the weight (%) of the solids composition (polymer) of the polymer solution was calculated. (3) Acid value: 1.5 g of the polymer solution prepared in the examples and comparative examples was accurately weighed and dissolved in a mixed solvent of 90 g of acetone and 10 g of water. The solution was titrated with a 0.1 N KOH aqueous solution. The titration was performed using an automatic titration apparatus (trade name: COM-1700A, manufactured by Hiranuma Sangyo Co., Ltd.). The acid value (mgKOH / g) of the polymer per 1 g was determined based on the concentration of the solid components. (4) Glass transition temperature (Tg) In this embodiment, the glass transition temperature (Tg) of each polymer is calculated. The calculation method is based on the following FOX formula: 1 / (Tg+273)=Σ[wi / (Tgi+273)] (where wi is the mass ratio of monomer i, and Tgi is the glass transition temperature (°C) of the homopolymer of monomer i). The Tg of the homopolymer of the monomer used in the above FOX formula can be, for example, the value described in "POLYMER HANDBOOK THIRD EDITION" (J. BRANDRUP and EHIMMERGUT, 1989, John Wiley & Sons, Inc., pp. VI / 209~VI / 277) (the lowest value when multiple glass transition temperatures are described). Furthermore, for monomers not described in the "POLYMER HANDBOOK THIRD EDITION," values ​​can be obtained using commercially available glass transition temperature calculation software (e.g., "MATERIALS STUDIO" manufactured by Accelrys Software Inc.; version: 4.0.0.0; module: Synthia; conditions: calculation based on an average polymer molecular weight of 100,000). Specifically, the Tg of the polymer of this invention is calculated according to the following formula: 1 / (Tg + 273) = w 1 / (Tg) 1 + 273) + w 2 / (Tg) 2 + 273) + ... Tg: Polymer Tg (w 1. w 2、・・・:The weight fraction (Tg) of monomers 1, 2、・・・ in the polymer. 1. Tg 2. ...: Homopolymers of monomers 1, 2, ... (Tg) Furthermore, in actual measurements, the polymer solution was coated onto a 5 cm square glass substrate, spin-coated onto the substrate, and dried at room temperature under reduced pressure for 4 hours to form a thin film with a mass of less than 30 mg, thereby removing volatile components and obtaining the solid content. Regarding the solid content, quantification using gas chromatography confirmed that the residual solvent was less than 0.1 wt%. The obtained solid content was determined using DSC (Differential Scanning Calorimeter; measuring instrument: NETZSCH DSC3500) under a nitrogen flow at a heating rate of 10 °C / min, according to JIS-K7121. (5) Double bond equivalent (g / mol) is determined by dividing the mass (g) of the polymer solids by the amount of double bonds (mol) in the polymer. [Polymer Manufacturing] The following polymer is used. [Example 1] In a reaction vessel equipped with a thermometer, a stirrer, a gas inlet tube, a condenser tube, and a dropper inlet, 630 g of propylene glycol monomethyl ether acetate (PGMEA) and 308 g of propylene glycol monomethyl ether (PGME) were added. After nitrogen purging, the mixture was heated to 90°C. On the other hand, a mixture of 210 g of N-benzylcis-butene diimide (BzMI), 134 g of methacrylic acid (MAA), 8 g of cyclohexyl methacrylate (CHMA), 8 g of methyl methacrylate (MMA), 479 g of 2-ethylhexyl acrylate (2EHA), 147 g of propylene glycol monomethyl ether acetate (PGMEA), 63 g of propylene glycol monomethyl ether (PGME), and 17 g of tributyl peroxide (PERBUTYL O, manufactured by Nippon Oils & Fats Co., Ltd.) was prepared by stirring in a dropper (B). Meanwhile, a mixture of 38 g of n-dodecyl mercaptan (nDM) and 88 g of propylene glycol monomethyl ether acetate (PGMEA) was prepared by stirring in a dropper (B). After the reaction vessel reached a temperature of 90°C, the mixture was continuously added dropwise from the dropper while maintaining the same temperature for 3 hours for polymerization. After the addition was complete, the reaction vessel was kept at 90°C for 30 minutes, and then 4 g of PERBUTYL O was added. The mixture was then kept at 90°C for another 30 minutes, and then heated to 115°C for 90 minutes of ripening. Afterward, it was cooled to room temperature to obtain polymer solution A-1. [Example 2] 978 g of propylene glycol monomethyl ether acetate (PGMEA) was added to a reaction vessel equipped with a thermometer, a stirrer, a gas inlet pipe, a condenser and a dropper inlet. After nitrogen purging, the mixture was heated to 90°C. On the other hand, a mixture of 120 g of N-benzylcis-butene diimide (BzMI), 72 g of methacrylic acid (MAA), 80 g of cyclohexyl methacrylate (CHMA), 248 g of methyl methacrylate (MMA), 280 g of 2-ethylhexyl acrylate (2EHA), 120 g of propylene glycol monomethyl ether acetate (PGMEA), and 16 g of tributyl peroxide (PERBUTYL O, manufactured by Nippon Oils & Fats Co., Ltd.) was prepared by stirring in a beaker serving as a dropping tank (A). Meanwhile, a mixture of 30 g of n-dodecyl mercaptan (nDM) and 71 g of propylene glycol monomethyl ether acetate (PGMEA) was prepared by stirring in a dropping tank (B). After the reaction tank reached a temperature of 90°C, the mixture was continuously added dropwise from the dropping tank while maintaining the same temperature for 3 hours for polymerization. After the addition was complete, the reaction vessel was kept at 90°C for 30 minutes, and then 4 g of PERBUTYL O was added. The mixture was then kept at 90°C for another 30 minutes, and then heated to 115°C for 90 minutes of ripening. Afterward, it was cooled to room temperature to obtain polymer solution A-2. [Example 3] In a reaction vessel equipped with a thermometer, a stirrer, a gas inlet pipe, a condenser and a dropper inlet, 572 g of propylene glycol monomethyl ether acetate (PGMEA) and 276 g of propylene glycol monomethyl ether (PGME) were added. After nitrogen purging, the mixture was heated to 90°C. On the other hand, a mixture of 240 g of N-benzylcis-butene diimide (BzMI), 172 g of methacrylic acid (MAA), 160 g of cyclohexyl methacrylate (CHMA), 68 g of methyl methacrylate (MMA), 160 g of 2-ethylhexyl acrylate (2EHA), 168 g of propylene glycol monomethyl ether acetate (PGMEA), 72 g of propylene glycol monomethyl ether (PGME), and 16 g of tributyl peroxide (PERBUTYL O, manufactured by Nippon Oils & Fats Co., Ltd.) was prepared by stirring in a dropper (B). Meanwhile, a mixture of 24 g of n-dodecyl mercaptan (nDM) and 72 g of propylene glycol monomethyl ether acetate (PGMEA) was prepared by stirring in a dropper (B). After the reaction vessel reached a temperature of 90°C, the mixture was continuously added dropwise from the dropper while maintaining the same temperature for 3 hours for polymerization. After the addition was complete, the reaction vessel was kept at 90°C for 30 minutes, and then 4 g of PERBUTYL O was added. The mixture was then kept at 90°C for another 30 minutes, and then heated to 115°C for 90 minutes of ripening. Afterward, it was cooled to room temperature to obtain polymer solution A-3. [Example 4] In a reaction vessel equipped with a thermometer, a stirrer, a gas inlet pipe, a condenser and a dropper inlet, 586 g of propylene glycol monomethyl ether acetate (PGMEA) and 283 g of propylene glycol monomethyl ether (PGME) were added. After nitrogen purging, the mixture was heated to 90°C. On the other hand, a mixture of 40 g of N-benzylcis-butene diimide (BzMI), 128 g of acrylic acid (AA), 64 g of cyclohexyl methacrylate (CHMA), 8 g of methyl methacrylate (MMA), 560 g of 2-ethylhexyl acrylate (2EHA), 159 g of propylene glycol monomethyl ether acetate (PGMEA), 68 g of propylene glycol monomethyl ether (PGME), and 16 g of tributyl peroxide (PERBUTYL O, manufactured by Nippon Oils & Fats Co., Ltd.) was prepared by stirring in a beaker serving as a dropping tank (A). Meanwhile, a mixture of 32 g of n-dodecyl mercaptan (nDM) and 75 g of propylene glycol monomethyl ether acetate (PGMEA) was prepared by stirring in a dropping tank (B). After the reaction tank reached a temperature of 90°C, the mixture was continuously added dropwise from the dropping tank while maintaining the same temperature for 3 hours for polymerization. After the addition was complete, the reaction vessel was kept at 90°C for 30 minutes, and then 4 g of PERBUTYL O was added. The mixture was then kept at 90°C for another 30 minutes, and then heated to 115°C for 90 minutes of ripening. Afterward, it was cooled to room temperature to obtain polymer solution A-4. [Example 5] In a reaction vessel equipped with a thermometer, a stirrer, a gas inlet pipe, a condenser and a dropper inlet, 620 g of propylene glycol monomethyl ether acetate (PGMEA) and 294 g of propylene glycol monomethyl ether (PGME) were added. After nitrogen purging, the mixture was heated to 90°C. On the other hand, a mixture of 80 g of N-benzylcis-butene diimide (BzMI), 112 g of methacrylic acid (MAA), 208 g of cyclohexyl methacrylate (CHMA), 400 g of 2-ethylbutyl acrylate (2EBA), 131 g of propylene glycol monomethyl ether acetate (PGMEA), 56 g of propylene glycol monomethyl ether (PGME), and 16 g of tributyl peroxide (PERBUTYL (registered trademark) manufactured by Nippon Oils & Fats Co., Ltd.) was prepared by stirring in a dropper (B). Meanwhile, a mixture of 28 g of n-dodecyl mercaptan (nDM) and 65 g of propylene glycol monomethyl ether acetate (PGMEA) was prepared by stirring in a dropper (B). After the reaction vessel reached a temperature of 90°C, the mixture was continuously added dropwise from the dropper while maintaining the same temperature for 3 hours for polymerization. After the addition was complete, the reaction vessel was kept at 90°C for 30 minutes, and then 4 g of PERBUTYL O was added. The mixture was then kept at 90°C for another 30 minutes, and then heated to 115°C for 90 minutes of ripening. Afterward, it was cooled to room temperature to obtain polymer solution A-5. [Example 6] After obtaining polymer solution A-1 using the same method as in [Example 1], bubbling of an oxygen / nitrogen mixture of 7 / 93 (v / v) was initiated. Then, in the reaction vessel, 14 g of glycidyl methacrylate (GMA), 3 g of triethylamine (TEA) as a catalyst, and 1 g of Antage W-400 (manufactured by Kawaguchi Chemical Co., Ltd.) as a polymerization inhibitor were added, and the reaction was carried out at 115°C for 11 hours. Afterward, the mixture was cooled to room temperature to obtain polymer solution A-6. [Example 7] In [Example 1], N-phenylcis-butenediamine (PMI) was used instead of N-benzylcis-butenediamine. Otherwise, polymer solution A-7 was obtained by the same method as in Example 1. [Example 8] In [Example 1], 252 g of 2,2'-[oxybis(methylene)]bis-2-acrylate (MD) was used instead of 210 g of N-benzylcis-butene diimide (BzMI), and 437 g of 2-ethylhexyl acrylate (2EHA) was used instead of 479 g. Otherwise, polymer solution A-8 was obtained by the same method as in Example 1. [Example 9] In [Example 5], octyl acrylate (OA) was used instead of 2-ethylbutyl acrylate. Otherwise, polymer solution A-9 was obtained by the same method as in Example 5. [Example 10] In [Example 5], stearyl methacrylate (STMA) was used instead of 2-ethylbutyl acrylate. Otherwise, polymer solution A-10 was obtained by the same method as in Example 5. [Comparative Example 1] In Example 5, lauryl acrylate (LA) was used instead of 2-ethylbutyl acrylate. Otherwise, polymer solution A-11 was obtained by the same method as in Example 5. [Comparative Example 2] In Example 5, ethyl methacrylate (EMA) was used instead of 2-ethylbutyl acrylate. Otherwise, polymer solution A-12 was obtained by the same method as in Example 5. [Comparative Example 3] In a reaction vessel equipped with a thermometer, a stirrer, a gas inlet pipe, a condenser and a dropper inlet, 610 g of propylene glycol monomethyl ether acetate (PGMEA) and 297 g of propylene glycol monomethyl ether (PGME) were added. After nitrogen purging, the mixture was heated to 90°C. On the other hand, a mixture of 70 g of N-benzylcis-butene diimide (BzMI), 98 g of methacrylic acid (MAA), 182 g of cyclohexyl methacrylate (CHMA), 350 g of 2-ethylbutyl acrylate (2EBA), 147 g of propylene glycol monomethyl ether acetate (PGMEA), 63 g of propylene glycol monomethyl ether (PGME), and 14 g of tributyl peroxide (PERBUTYL (registered trademark) manufactured by Nippon Oils & Fats Co., Ltd.) was prepared by stirring in a dropper (B). Meanwhile, a mixture of 25 g of n-dodecyl mercaptan (nDM) and 84 g of propylene glycol monomethyl ether acetate (PGMEA) was prepared by stirring in a dropper (B). After the reaction vessel reached a temperature of 90°C, the mixture was continuously added dropwise from the dropper while maintaining the same temperature for 3 hours for polymerization. After the dropwise addition was complete, the reaction vessel was maintained at 90°C for 30 minutes, and then 4 g of PERBUTYL O was added. The mixture was then maintained at 90°C for another 30 minutes, followed by a 90-minute ripening process at 115°C. Afterward, the mixture was cooled to room temperature, and bubbling of an oxygen / nitrogen mixture of 7 / 93 (v / v) was initiated. 81 g of glycidyl methacrylate, 2 g of triethylamine (TEA) as a catalyst, and 1 g of Antage W-400 (manufactured by Kawaguchi Chemical Co., Ltd.) as a polymerization inhibitor were added, and the reaction was carried out at 115°C for 11 hours. After cooling to room temperature, polymer solution A-13 was obtained. [Comparative Example 4] In a reaction vessel equipped with a thermometer, a stirrer, a gas inlet pipe, a condenser and a dropper inlet, 604 g of propylene glycol monomethyl ether acetate (PGMEA) and 290 g of propylene glycol monomethyl ether (PGME) were added. After nitrogen purging, the mixture was heated to 90°C. On the other hand, a mixture of 88 g of methacrylic acid (MAA), 183 g of cyclohexyl methacrylate (CHMA), 132 g of methyl methacrylate (MMA), 330 g of 2-ethylhexyl acrylate (2EHA), 92 g of propylene glycol monomethyl ether acetate (PGMEA), 40 g of propylene glycol monomethyl ether (PGME), and 15 g of tributyl peroxide (PERBUTYL O, manufactured by Nippon Oils & Fats Co., Ltd., a registered trademark) was prepared by stirring in a dropper (B). A mixture of 18 g of n-dodecyl mercaptan (nDM) and 73 g of propylene glycol monomethyl ether acetate (PGMEA) was prepared by stirring in a dropper (B). After the reaction vessel reached a temperature of 90°C, polymerization was carried out dropwise from the dropper while maintaining the same temperature for 3 hours. After the dropwise addition was completed, the reaction vessel was maintained at 90°C for 30 minutes, and then 4 g of PERBUTYL O was added. Then, after maintaining the temperature at 90°C for 30 minutes, the temperature was increased to 115°C and matured for 90 minutes. Subsequently, it was cooled to room temperature to obtain polymer solution A-14. [Comparative Example 5] In [Example 1], butyl acrylate (BA) was used instead of 2-ethylhexyl acrylate (2EHA). Otherwise, polymer solution A-15 was obtained by the same method as in Example 1. [Comparative Example 6] In [Example 1], 2-acryloyloxyethyl succinic acid (HOA-MS) was used instead of methacrylic acid. Otherwise, polymer solution A-16 was obtained by the same method as in Example 1. The composition and physical properties of the polymers in the above polymer solutions A-1 to A-10 (Examples 1 to 10) and A-11 to A-16 (Comparative Examples 1 to 6) are described in Table 1. [Table 1] Furthermore, the information recorded in Table 1 is as follows. BzMI: N-Benzylcis-Butene Diimidide; PMI: N-Phenyriccis-Butene Diimidide; MD: 2,2'-[Oxybis(Methylene)]bis-2-Dimethyl Acrylate; MAA: Methacrylate; AA: Acrylate; HOA-MS: 2-Acryloyloxyethylsuccinic acid; CHMA: Cyclohexyl Methacrylate; MMA: Methyl Methacrylate; 2EHA: 2-Ethylhexyl Acrylate (Homopolymer Tg: approx. -50℃); 2EBA: 2-Ethylbutyl Acrylate (Homopolymer Tg: approx. -50℃); STMA: Stearyl Methacrylate (Homopolymer Tg: -100℃); OA: Octyl Acrylate (Homopolymer Tg: approx. -65℃); LA: Lauryl Acrylate (Homopolymer Tg: approx. -3℃); BA: Butyl Acrylate (Homopolymer Tg: approx. -54℃); EMA: Ethyl Methacrylate (Homopolymer Tg: approx. 65℃). GMA: Glycidyl methacrylate (Examples 11-20, Comparative Examples 7-12) Using the obtained alkali-soluble resin solutions (polymer solutions A-1 to A-16), photosensitive resin compositions were prepared by the following method and evaluated by the following evaluation method (6). The results are shown in Table 2. [Preparation of Pigment Dispersion 1] 12.9 parts of propylene glycol monomethyl ether acetate (PGMEA), 0.4 parts of Disparlon DA-7301 as a dispersant, 2.25 parts of CI pigment green 58 as a colored material, and 1.5 parts of CI pigment yellow 138 were mixed and dispersed in a paint shaker for 3 hours to obtain pigment dispersion 1 (solid content 22% by mass). [Preparation of Photosensitive Resin Composition] The above polymer solution A-1, containing 8.4 g (total solids 3.5 g) of the adhesive resin, 3.5 g of dipentylenetetramethylol hexaacrylate (DPHA) as a multifunctional monomer, 39.8 g (total solids 8.75 g) of pigment dispersion 1, and 1.75 g of 2-methyl-1-[4-(methylthio)phenyl]-2- as a photopolymerization initiator were added. Linyl-propane-1-one (trade name "IRGACURE (registered trademark) 907", manufactured by BASF Japan, hereinafter referred to as Irg907) was diluted with PGMEA to a non-volatile content of 20% by weight to prepare photosensitive resin composition B1. Similarly, the above polymer solutions (A-2 to A-16) were used as adhesive resins to prepare photosensitive resin compositions B2 to B16. The compositions are shown in Table 2. (6) Evaluation of the photosensitive resin composition [development speed]: The photosensitive resin composition was coated on a 10 cm square glass substrate using a spin coater and dried in an oven at 90°C for 3 minutes. After drying, a photomask with lines and gaps of 1–100 μm was placed at a distance of 100 μm from the coating. A UV alignment machine (trade name "TME-150RNS", manufactured by TOPCON) equipped with a 2.0 kW ultra-high pressure mercury lamp was used, and the photomask was developed at 100 mJ / cm². 2 The coating was irradiated with ultraviolet light at an intensity equivalent to 365 nm illuminance. After irradiation, a 0.05% (w / w) potassium hydroxide aqueous solution was spread onto the coating using a rotary developer to dissolve and remove the unexposed areas. The remaining exposed areas were then rinsed with pure water for 10 seconds to develop the coating and form a pattern of lines and gaps. The time required to dissolve and remove the unexposed areas was measured and taken as the development time (seconds), and evaluated according to the following criteria. The results are shown in Table 2. [Pattern Diameter] The diameter of the pattern formed on the glass substrate with a photomask diameter of 20 μm obtained in the development speed test was measured using a surface roughness meter (manufactured by Ryoka Systems, trade name VertScan2.0). The results are shown in Table 2. The closer the obtained pattern diameter is to 20 μm, the better the obtained pattern diameter is considered. [Minimum Closest Pattern] The time for distributing the potassium hydroxide aqueous solution was changed to twice the development time determined in the development speed test. Otherwise, a pattern of lines and gaps was formed in the same manner as in the development speed test. The size of the smallest pattern that could form the pattern was observed using an optical microscope and was taken as the minimum closest pattern. The results are shown in Table 2. The closer the minimum closest pattern is to 1, the better the judgment. [Table 2] The abbreviation is as follows. Irg907: IRGACURE (registered trademark) 907, 2-methyl-1-[4-(methylthio)phenyl]-2- PO4-1-one DPHA: Dinepentyl Tetraol Hexaacrylate Based on the differences in the polymers listed in Table 1, Table 2 shows the evaluation of the photosensitive resin composition, and the following points were confirmed: [Examples 11-13, 16-18] The development time was relatively fast, within 12 seconds, and the pattern diameter was also smaller than the photomask diameter, with less line thickening. Even with a development time set to twice the image exit time, the minimum close-fitting pattern was still sufficiently small, balancing development speed, pattern diameter, and development latitude. Furthermore, the 2EHA-based polymers in Examples 1-4 and 6-8 had a Tg of approximately -50°C. Also, the 2EBA-based polymer in Example 5 had a Tg of approximately -50°C. [Example 14] The development time was relatively fast, at 9 seconds. The minimum close-fitting pattern was worse than that of Examples 11-13 and 15-18, but still good. [Example 15] The development time was relatively fast, at 12 seconds. The minimum close-packed pattern was also worse than that of Examples 11-13 and 16-18, but still good. The pattern diameter was also good, at 21 μm. [Examples 19, 20] The development time was relatively fast, less than 10 seconds. The pattern diameter was also smaller compared to Comparative Examples 7-9 and the mask system. The minimum close-fitting pattern tended to deteriorate compared to Examples 11-18, but was better than Comparative Examples 8-12. [Comparative Example 7] The minimum close-packed pattern is sufficiently small, at 3 μm. On the other hand, the development time is relatively slow, at 20 seconds, and the pattern diameter is relatively large, at 25 μm, which is worse than in Examples 11-20. Furthermore, the LA-based polymer in the polymer of Comparative Example 7 has a monomer Tg of approximately -3°C. [Comparative Example 8] The development time was slower, at 25 seconds, the pattern diameter was larger, at 26 μm, and the smallest closely spaced pattern was larger, at 8 μm, which was worse than that of Examples 11-20. Furthermore, the EMA-based polymer in the polymer of Comparative Example 8 was a monomer with a Tg of approximately 65°C. [Comparative Example 9] The development time was fast enough, at 9 seconds. On the other hand, the pattern diameter was large, at 28 μm, and the smallest close-packed pattern was large, at 8 μm, which was worse than in Examples 11-20. Furthermore, the polymer of Comparative Example 9 was a polymer with vinyl unsaturated double bonds in its side chains. [Comparative Examples 10-12] The pattern diameter was good, at 22 μm. On the other hand, the development time was slow, at 13 seconds, and the minimum close-fitting pattern was large, at 8-10 μm, which was worse than that of Examples 11-20. Furthermore, the polymer of Comparative Example 10 was a polymer without structural unit (A), and the BA in the polymer of Comparative Example 11 was a monomer containing butyl and with a polymer Tg of about -54°C. The HOA-MS in Comparative Example 12 was a monomer compound containing an acid group, which was an acid group spaced from the main chain by 8 atoms. (Examples 21, Comparative Examples 13 and 14) Using the obtained alkali-soluble resin solution, with the composition shown in Table 3, and diluted with PGMEA to a non-volatile content of 20% by weight, photosensitive resin compositions C1 to C3 were prepared. The heat resistance was evaluated by the following method. The results are shown in Table 3. (7) Heat Resistance: A photosensitive resin composition was coated onto a 10 cm square glass substrate using a spin coater and dried in an oven at 250°C for 1 hour. After drying, one substrate was heated at 250°C for 1 hour to obtain a hardened film without the 250°C heating test and a hardened film with the heating test. The color difference (ΔEab) between the two hardened films obtained in this manner was measured using a colorimeter. The results are shown in Table 3 below. The smaller the ΔEab value, the smaller the color difference before and after the heating test, and the better the heat resistance. [Table 3] According to Table 3, the value of ΔEab was 0.5 in Example 21, 1.0 in Comparative Example 13, and 0.9 in Comparative Example 14, which is better than the values ​​in Comparative Examples 13 and 14. The polymer in Comparative Example 13 is a polymer without structural unit (A), and HOA-MS in Comparative Example 14 is a monomeric compound containing an acid group, which is an acid group spaced from the main chain by 8 atoms. Based on the above, the superiority of the polymer and photosensitive resin composition of the present invention is confirmed. [Industrial Applicability] The free radical polymer and photosensitive resin composition of the present invention can be applied, for example, to resist materials, and can be suitably used in the optical field or the electrical and electronic fields. none none

Claims

1. A polymer having structural units containing acid groups, wherein the polymer comprises N-benzyl maleic anhydride units and structural units derived from a monomer of homopolymer having a Tg of -100°C to -20°C as represented by the following general formula (1), wherein the content of structural units having vinyl unsaturated double bonds in the side chains is 5% by mass or less relative to 100% by mass of all structural units of the polymer, wherein the structural units having vinyl unsaturated double bonds in the side chains are structural units represented by the following general formula (2); wherein the structural units containing acid groups are introduced by polymerizing a monomer containing acid groups, wherein the monomer containing acid groups is (meth)acrylic acid, butenoic acid, cinnamic acid, vinylbenzoic acid, maleic acid, fumaric acid, itaconic acid, citraconic acid, mesocarboxylic acid, maleic anhydride or itaconic anhydride, wherein the interval between the acid group and the main chain is 6 atoms or less; (In the formula, R1 represents a hydrogen atom or a methyl group; R2 represents a straight-chain or branched hydrocarbon group with 6 to 20 carbon atoms), (In the formula, R3 and R4 may be the same or different, representing a hydrogen atom or a methyl group; Z represents a divalent organic group).

2. The polymer as claimed in claim 1, wherein, The acid group mentioned above is derived from the carboxyl group of (meth)acrylic acid.

3. The polymer as claimed in claim 1, wherein, The Tg of the above homopolymers is -60℃ to -20℃.

4. The polymer as claimed in claim 1, wherein, The percentage of structural units of the monomers from the homopolymer with a Tg of -100℃ to -20℃, as represented by the above general formula (1), is 35% to 80% by mass relative to 100% by mass of all structural units of the above polymer.

5. The polymer of claim 1, wherein the side chain further comprises structural units having an alicyclic structure.

6. A photosensitive resin composition comprising the polymer of claim 1 and a multifunctional monomer.

7. The photosensitive resin composition of claim 6 further includes a photopolymerization initiator and a colored material.

8. The photosensitive resin composition of claim 6 is a color filter resist.

9. A curing film formed by curing the photosensitive resin composition of claim 6.

10. A component for a display device having the hardened film of claim 9.