Electronic device and method of manufacturing the same

Abstract

An electronic device includes: a first substrate, wherein the first substrate is flexible; a second substrate disposed corresponding to the first substrate, wherein the second substrate is flexible; and a first conductive layer disposed on the first substrate. The first conductive layer includes: a first conductive pattern for receiving a first electrode signal and including a first bonding part; and a second conductive pattern for receiving a second electrode signal and including a second bonding part. The electronic device further includes: a second conductive layer disposed on the second substrate and electrically connected to the second conductive pattern; and a first metal layer disposed between the first substrate and at least one of the first bonding part and the second bonding part, and electrically connected to at least one of the first bonding part and the second bonding part.

Description

Electronic Device and Method for Manufacturing the Same Embodiments of the present disclosure relate to an electronic device, particularly to signal transmission assisted by a metal layer. Electronic devices have been widely applied in different fields such as communication, display, automotive, or aviation. With the booming development of electronic devices, electronic devices are being developed towards being thinner and lighter, so the requirements for the reliability or quality of electronic devices are higher. An electronic device includes: a first substrate, wherein the first substrate is flexible; a second substrate disposed corresponding to the first substrate, wherein the second substrate is flexible; and a first conductive layer disposed on the first substrate. The first conductive layer includes: a first conductive pattern for receiving a first electrode signal and including a first connection portion; and a second conductive pattern for receiving a second electrode signal and including a second connection portion. The electronic device further includes: a second conductive layer disposed on the second substrate and electrically connected to the second conductive pattern; and a first metal layer disposed between the first substrate and at least one of the first connection portion and the second connection portion and electrically connected to at least one of the first connection portion and the second connection portion. An electronic device includes: a first substrate; a second substrate disposed corresponding to the first substrate; and a first conductive layer disposed on the first substrate. The first conductive layer includes: a first conductive pattern for receiving a first electrode signal and including a first connection portion; and a second conductive pattern for receiving a second electrode signal and including a second connection portion. The electronic device further includes: a second conductive layer disposed on the second substrate and electrically connected to the second conductive pattern; a first metal layer disposed between the first substrate and at least one of the first connection portion and the second connection portion; a passivation layer disposed on the first metal layer; and a second metal layer disposed on the passivation layer. The passivation layer has an opening, and the second metal layer fills the opening and is electrically connected to the first metal layer. A method for manufacturing an electronic device includes: providing a first carrier; forming a first substrate on the first carrier, wherein the first substrate is flexible; providing a second carrier; and forming a second substrate on the second carrier, wherein the second substrate is flexible. The method for manufacturing the electronic device further includes: bonding the first substrate and the second substrate through a first adhesive and a second adhesive; removing the first carrier; removing the second carrier; and cutting the second adhesive. The following disclosure provides many different embodiments or examples for implementing different components of the embodiments of the present disclosure. Specific examples of components and configurations are described below to simplify the embodiments of the present disclosure. Of course, these are only examples and are not intended to limit the embodiments of the present disclosure. For example, when it is described that the first component is formed on the second component, it may include embodiments in which the first and second components are in direct contact, and may also include embodiments in which additional components are formed between the first and second components such that the first and second components are not in direct contact. In addition, the embodiments of the present disclosure may repeat element symbols and / or letters in different examples. Such repetition is for the purpose of simplification and clarity, and does not itself dictate the relationship between the various embodiments and / or configurations discussed. The directional terms mentioned herein, such as "up", "down", "front", "back", "left", "right" and their similar terms, are only with reference to the directions of the drawings. Therefore, the directional terms used are for illustration rather than to limit the present disclosure. In addition, in some embodiments of the present disclosure, terms regarding joining and connection, such as "connect", "interconnect", etc., unless specifically defined, may mean that two structures are in direct contact, or may also mean that two structures are not in direct contact, with other structures disposed between the two structures. Terms regarding joining and connection may also include cases where both structures are movable, or both structures are fixed. In addition, the terms "electrically connected" and "coupled" include any direct and indirect means of electrical connection. Furthermore, the "first", "second" and their similar terms mentioned in the specification or claims are only used to name different elements or to distinguish different embodiments or scopes, and are not used to limit the upper or lower limits of the number of elements, nor to limit the manufacturing order or setting order of the elements. The terms "about", "approximately", "substantially" used herein generally mean within ±20% of a given value, preferably within ±10%, and more preferably within ±5%, or ±3%, or ±2%, or ±1%, or 0.5%. The given value is an approximate value, that is, even in the case where "about", "approximately", "substantially" are not specifically stated, the given value may still implicitly imply the meaning of "about", "approximately", "substantially". Unless otherwise defined, all terms used herein (including technical and scientific terms) have the same meaning as commonly understood by those of ordinary skill in the technical field to which the present disclosure belongs. It is understood that these terms, such as those defined in a general dictionary, should be interpreted to have a meaning consistent with the relevant technology and the background or context of the present disclosure, and should not be interpreted in an idealized or overly formal manner, unless specifically defined in the embodiments of the present disclosure. The following describes some variations of the embodiments. In the embodiments shown in different figures and descriptions, like reference numerals are used to denote like elements. It can be understood that additional operations may be provided before, during, and after the method, and some of the recited operations may be replaced or deleted for other embodiments of the method. In this document, the respective directions are not limited to rectangular coordinates (such as the three axes of the X-axis, Y-axis, and Z-axis), and can be interpreted in a broader sense. For example, the X-axis, Y-axis, and Z-axis may be perpendicular to each other, or may represent different directions that are not perpendicular to each other. For the sake of convenience in description, hereinafter, the X-axis direction is the length direction, the Y-axis direction is the width direction, and the Z-axis direction is the thickness direction. In the embodiments of the present disclosure, the Z-axis direction is the normal direction of the substrate. In the embodiments of the present disclosure, the top view refers to a schematic view of observing the XY plane. In some embodiments, the dimensions in different directions can be measured by optical images (such as scanning electron microscope (SEM) images). In the present disclosure, the electronic device may include a display device, a backlight device, an antenna device, a sensing device, or a splicing device, but is not limited thereto. The electronic device may be a foldable or flexible electronic device. The display device may be a non-self-emitting display device or a self-emitting display device. The antenna device may be a liquid crystal type antenna device or a non-liquid crystal type antenna device. The sensing device may be a sensing device for sensing capacitance, light, heat, or ultrasonic waves, but is not limited thereto. Electronic components may include passive components and active components, such as capacitors, resistors, inductors, diodes, transistors, etc. The diode may include a light emitting diode (LED) or a photodiode (PD). The light emitting diode may include, for example, an organic light emitting diode (OLED), a mini light emitting diode, a micro light emitting diode (μLED), or a quantum dot light emitting diode, but is not limited thereto. The splicing device may be, for example, a display splicing device or an antenna splicing device, but is not limited thereto. It should be noted that the electronic device may be any of the foregoing permutations and combinations, but is not limited thereto. Hereinafter, the display device will be used as the electronic device or the splicing device to illustrate the content of the present disclosure, but is not limited thereto. In addition, the outer shape of the electronic device can be rectangular, circular, polygonal, a shape with curved edges, or other suitable shapes. The electronic device can have peripheral systems such as a processing system, a driving system, a control system, a light source system, a rack system, etc. to support a display device or a splicing device. It should be noted that the electronic device can be any permutation and combination of the foregoing, but is not limited thereto. FIG. 1 is a top view of an electronic device according to some embodiments of the present disclosure. For clarity of illustration, FIG. 1 only illustratively shows some components. In some embodiments, additional components can be added to the electronic device described below. In some embodiments, some components of the electronic device 10 described below can be replaced or omitted. In some embodiments, additional operation steps can be provided before, between, and / or after the method of forming the electronic device 10. In some embodiments, some of the operation steps may be replaced or omitted, and the order of some of the operation steps is interchangeable. FIGS. 2-5 are schematic cross-sectional views of an electronic device 10 according to some embodiments of the present disclosure. It should be noted that FIG. 2 is a schematic cross-sectional view obtained from the line segment A-A' of FIG. 1. In some embodiments, the electronic device 10 can include a carrier 100, a substrate 110, a metal layer 120, a conductive layer 150, a frame adhesive 160, a frame adhesive 170, a metal wire 180, a flexible printed circuit (FPC) 190, a carrier 200, a substrate 210, a conductive layer 250, and a liquid crystal 260. The conductive layer 150 can include a first conductive pattern 152 and a second conductive pattern 154. The frame adhesive 160 can include a support structure 162 and an adhesive layer 164. For illustrative purposes, FIG. 1 only shows the components above the substrate 110, including the conductive layer 150, the frame adhesive 160, the frame adhesive 170, the metal wire 180, and the flexible printed circuit 190. Referring to FIG. 2, a carrier 100 and a carrier 200 are provided. A substrate 110 and a substrate 210 are respectively disposed on the carrier 100 and the carrier 200. A metal layer 120 is disposed on the substrate 110, and a conductive layer 150 (including a first conductive pattern 152 and a second conductive pattern 154) is disposed on the substrate 110 and the metal layer 120. A frame adhesive 160 (including a support structure 162 and an adhesive layer 164), a frame adhesive 170, and a flexible printed circuit 190 are disposed on the conductive layer 150. In addition, a conductive layer 250 is disposed on the substrate 210, and a liquid crystal 260 is disposed on the conductive layer 250. According to some embodiments of the present disclosure, the carrier 100 can be used to carry the substrate 110. The carrier 100 can be a relatively hard material to effectively fix the substrate 110, such as glass. According to some embodiments of the present disclosure, the substrate 110 may be flexible. The substrate 110 may include a flexible material and an inorganic layer, where the flexible material and the inorganic layer may be single-layer or multi-layer. In some embodiments, the substrate 110 may be formed by alternating multi-layers of flexible materials and multiple inorganic layers. The flexible material may include polyethylene terephthalate (PET) resin, polycarbonate (PC) resin, polyimide (PI) resin, polymethylmethacrylates (PMMA), polystyrene resin, polyethersulfone (PES) resin, polythiophene (PT) resin, phenol novolac (PN), other similar organic materials, or combinations thereof, but not limited thereto. The inorganic layer may include silicon oxide (SiO), silicon nitride (SiN), silicon carbide (SiC), silicon carbonitride (SiCN), silicon oxynitride (SiON), silicon oxynitrocarbide (SiO x N y C 1-x-y ), or combinations thereof, but not limited thereto. In some embodiments, the substrate 110 may be glass. In some embodiments, the method of forming the substrate 110 on the carrier 100 includes slit-coating, spin-on coating, chemical vapor deposition (CVD), atomic layer deposition (ALD), or combinations thereof, but not limited thereto. In some embodiments, a metal layer 120 is formed on a substrate 110. The material of the metal layer 120 may include cobalt (Co), ruthenium (Ru), aluminum (Al), tungsten (W), copper (Cu), titanium (Ti), tantalum (Ta), silver (Ag), gold (Au), platinum (Pt), nickel (Ni), palladium (Pd), zinc (Zn), chromium (Cr), molybdenum (Mo), niobium (Nb), beryllium (Be), strontium (Sr), or a combination thereof, but is not limited thereto. In some embodiments, the method of forming the metal layer 120 includes chemical vapor deposition, atomic layer deposition, physical vapor deposition (PVD), evaporation, plating, sputtering, or a combination thereof, but is not limited thereto. A patterning process, which includes a lithography process and an etching process, other suitable processes, or a combination thereof, may be used to form the metal layer 120 into a plurality of metal patterns separated from each other, which respectively overlap and are electrically connected to a plurality of connection portions of the first conductive pattern 152 and / or the second conductive pattern 154. In some embodiments, the conductive layer 150 covers the substrate 110 and the metal layer 120. In other words, the metal layer 120 is disposed between the substrate 110 and the conductive layer 150. The conductive layer 150 can transmit electrode signals. The conductive layer 150 may include indium (III) oxide (In 2 O 3 ), zinc oxide (ZnO), indium-zinc oxide, aluminum-doped zinc oxide (AZO), gallium zinc oxide (GZO), indium tin oxide (ITO), indium zinc oxide (IZO), antimony tin oxide (ATO), indium gallium tin oxide (IGTO), tin (IV) oxide (SnO 2 ), or a combination thereof, but not limited thereto. In some embodiments, the conductive layer 150 may be, for example, a transparent conductive material. The method of forming the conductive layer 150 may be similar to that of the metal layer 120, which will not be elaborated herein. In some embodiments, the ductility of the metal layer 120 is higher than that of the conductive layer 150. In some embodiments, the conductive layer 150 may be patterned into a first conductive pattern 152 and a second conductive pattern 154 by a patterning process. When observed from the normal direction of the substrate 110 (e.g., the Z-axis), the second conductive pattern 154 surrounds the first conductive pattern 152. In some embodiments, the first conductive pattern 152 transmits a lower electrode signal and serves as the lower electrode of the electronic device, while the second conductive pattern 154 transmits an upper electrode signal. The first conductive pattern 152 may include a main body portion 152-1 and a connecting portion 152-2, and the second conductive pattern 154 may include a loop portion 154-1, a connecting portion 154-2, and a connecting portion 154-3. The main body portion 152-1 and the connecting portion 152-2 may be an integrally formed structure, and the loop portion 154-1, the connecting portion 154-2, and the connecting portion 154-3 may be an integrally formed structure. From another perspective, the connecting portion 152-2 extends outward from the main body portion 152-1, and the connecting portion 154-2 and the connecting portion 154-3 extend outward from the loop portion 154-1. Specifically, the loop portion 154-1 in the present disclosure is in a non-closed shape, such that the connecting portion 154-2 and the connecting portion 154-3 can extend outward from two end points of the loop portion 154-1. Among them, the connecting portion 152-2, the connecting portion 154-2, and the connecting portion 154-3 may be parallel to each other and extend in the same direction. It should be noted that due to the different electrode signals transmitted, the first conductive pattern 152 and the second conductive pattern 154 are separated from each other by a distance S. According to some embodiments of the present disclosure, the metal layer 120 is located between the substrate 110 and at least one of the connecting portion 152-2, the connecting portion 154-2, and the connecting portion 154-3, and is electrically connected to at least one of the connecting portion 152-2, the connecting portion 154-2, and the connecting portion 154-3. For example, the metal layer 120 is disposed below all of the connecting portion 152-2, the connecting portion 154-2, and the connecting portion 154-3, and the metal layer 120 is electrically connected to the three connecting portions respectively. In some embodiments, the metal layer 120 is disposed below one or two of the connecting portion 152-2, the connecting portion 154-2, and the connecting portion 154-3, and the metal layer 120 is electrically connected to one or two connecting portions respectively. It should be noted that the metal layer 120 is located outside the active region to avoid the metal layer 120 affecting the performance of the active region of the electronic device, such as affecting the light penetration effect of the electronic device. In some embodiments, the flexible printed circuit 190 is electrically connected to the conductive layer 150. For example, the flexible printed circuit 190 may be located above the connection portions 152-2, 154-2, and 154-3, and supply a lower electrode signal to the first conductive pattern 152 and an upper electrode signal to the second conductive pattern 154. According to some embodiments of the present disclosure, the carrier substrate 200 can be used to carry the substrate 210. The materials and formation methods of the carrier substrate 200 and the substrate 210 are similar to those of the carrier substrate 100 and the substrate 110, respectively, and will not be described herein. In some embodiments, the conductive layer 250 can be disposed on the substrate 210 and is unpatterned. According to some embodiments of the present disclosure, the conductive layer 250 can transmit an electrode signal and serve as the upper electrode of the electronic device 10. The conductive layer 250 can be electrically connected to the second conductive pattern 154 of the conductive layer 150. The material and formation method of the conductive layer 250 can be similar to those of the conductive layer 150, and will not be described herein. According to some embodiments of the present disclosure, the liquid crystal 260 is disposed on the conductive layer 250. The liquid crystal 260 can be rotated to a desired angle in a state with an electric field. The liquid crystal 260 may include nematic liquid crystal, vertical alignment (VA) liquid crystal, smectic liquid crystal, electrically controlled birefringence (ECB) liquid crystal, in plane switching (IPS) liquid crystal, fringe field switching (FFS) liquid crystal, cholesteric liquid crystal, or discotic liquid crystal, but is not limited thereto. Referring to FIG. 3, the carrier plate 100 is combined with the carrier plate 200. More specifically, the substrate 110 and the substrate 210 are paired through the frame adhesive 160 and the frame adhesive 170, such that the liquid crystal 260 is located between the substrate 110, the substrate 210, and the frame adhesive 160. The frame adhesive 160 can be disposed between the conductive layer 150 and the conductive layer 250. The support structure 162 of the frame adhesive 160 can support the substrate 110 and the substrate 210 and maintain the gap of the liquid crystal 260, while the adhesive layer 164 of the frame adhesive 160 can ensure the adhesion between the conductive layer 150 and the conductive layer 250. The frame adhesive 170 can be disposed between the conductive layer 150 and the conductive layer 250. Observed from the normal direction of the substrate 110 (e.g., the Z-axis), the frame adhesive 170 surrounds the conductive layer 150 (including the first conductive pattern 152 and the second conductive pattern 154) to ensure that the portion of the substrate 110 surrounded by the frame adhesive 170 has a certain adhesion, thereby protecting the substrate 110 from being deformed (e.g., wrinkled) during subsequent processes. In some embodiments, the frame adhesive 170 can define the range of subsequent cutting processes. In some embodiments, the frame adhesive 160 can define the active area of the electronic device (or the display area of the display device). More specifically, the substrate 110, the frame adhesive 160, and the substrate 210 define the active area of the electronic device (or the display area of the display device), and the liquid crystal 260 is confined therein. In some embodiments, the frame adhesive 160 can be disposed on at least one of the main body portion 152-1, the loop portion 154-1, and the spacer S. In other words, the active area of the electronic device can be confined within the area of the first conductive pattern 152, or cross the first conductive pattern 152, the spacer S, and the second conductive pattern 154, but not limited thereto. It should be understood that the area outside the active area can be regarded as the peripheral area. For example, the metal layer 120 and the flexible printed circuit 190 are located in the peripheral area. It is worth noting that observed from the normal perpendicular to the substrate 110 (e.g., the Y-axis), the flexible printed circuit 190 does not contact the conductive layer 250. Observed from the top view direction, the frame adhesive 160 can be annular or other suitable shapes. The material of the support structure 162 of the frame adhesive 160 can include glass fiber, silica, other similar materials, or combinations thereof, but not limited thereto. The material of the adhesive layer 164 of the frame adhesive 160 can include epoxy resins, hardeners, other similar materials, or combinations thereof, but not limited thereto. The material of the frame adhesive 170 can be different from the material of the frame adhesive 160. In some embodiments, the material of the frame adhesive 170 can be the same as the material of the frame adhesive 160 to save manufacturing time. For example, the frame adhesive 170 also includes a support structure and an adhesive layer. The frame adhesive 170 and the frame adhesive 160 can be formed by any of the above suitable processes, which will not be elaborated herein. It should be understood that although in the first embodiment, the sealant 160 and the sealant 170 are initially shown on the substrate 110, and the liquid crystal 260 is on the substrate 210, this is not limiting. For example, after the sealant 160, the sealant 170, and the liquid crystal 260 are formed on one substrate (such as the substrate 110), they can be assembled with the other substrate (such as the substrate 210). Alternatively, the liquid crystal 260 can be formed on the substrate 210, and the sealant 160 and the sealant 170 can be formed on both the substrate 110 and the substrate 210, and then the two substrates can be assembled together. In some embodiments, when a voltage is applied through the lower electrode and the upper electrode of the electronic device 10 to generate an electric field, the liquid crystal 260 can be rotated to a desired angle. For example, the electronic device 10 can include a liquid crystal module with a privacy function. Without any bias voltage, the liquid crystal 260 does not rotate, making the electronic device 10 transparent at any viewing angle. When a bias voltage is applied, the liquid crystal 260 rotates, making the electronic device 10 transparent only at the normal viewing angle (such as the viewing angle in the direction of the normal of the substrate (such as the Z-axis)), and non-transparent at the side viewing angle, achieving a privacy effect. If the conductive layer 150 cannot transmit the electrode signal properly, it may cause the liquid crystal cells of the electronic device 10 to lose the rotation function, resulting in the failure of the electronic device. Referring to FIG. 4, the carrier 100 and the carrier 200 are removed. According to some embodiments of the present disclosure, the carrier 100 and the carrier 200 can be removed using a laser lift-off (LLO) process. By irradiating the laser, the bond between the substrate and the carrier is broken, thereby separating the substrate 110 from the carrier 100 and separating the substrate 210 from the carrier 200. However, the high temperature in the process of removing the carrier 100 and the carrier 200 may cause the substrate to deform (such as producing wrinkles), that is, the original flat film layer will become a wavy film layer (i.e., a structure that undulates up and down along the normal direction of the substrate (such as the Z-axis)). It should be understood that the laser release process makes the materials of the substrate 110 and the substrate 210 brittle, so deformation is likely to occur. However, the film layer surrounded by the encapsulant 170 can be protected by the encapsulant 170 to avoid deformation. Therefore, referring to FIG. 4, the film layer adjacent to one side of the encapsulant 170 (such as the film layer corresponding to the main body portion 152-1) does not have wrinkles C. In some embodiments, since the substrate 110, the metal layer 120, and the connecting portion 152-2 adjacent to the flexible printed circuit 190 are not surrounded by the encapsulant 170, they cannot be protected by the encapsulant 170 during the laser release process, resulting in wrinkles C or even further cracks F. The number of wrinkles C and cracks F can be one or more. When the number of cracks F is excessive or continuously expands to cause the entire disconnection of the connecting portion 152-2, it may lead to the inability of the electronic device 10 to effectively transmit electrode signals. Therefore, in the present disclosure, a metal layer 120 can be provided as a mechanism to avoid the failure of the electronic device. In this way, when the connecting portion 152-2 cannot transmit electrode signals, the electrode signal transmission can still be completed through the metal layer 120 with high ductility and less prone to breakage under the connecting portion 152-2. Continuing to refer to FIG. 4, a polarizer 300 and a polarizer 400 are respectively formed on the other surface of the substrate 110 relative to the conductive layer 150 and on the other surface of the substrate 210 relative to the conductive layer 250. According to some embodiments of the present disclosure, the polarizer 300 and the polarizer 400 can filter light in a specific direction, so that only light in the desired direction can pass through. Referring to FIG. 5, a cutting process can be performed on the electronic device 10 to remove the encapsulant 170 and the film layer outside the ring corresponding to the encapsulant 170. Since the electrode signals need to be transmitted from the flexible printed circuit 190 to the main body portion 152-1 through the connecting portion 152-2, the connection between the main body portion 152-1, the connecting portion 152-2, and the flexible printed circuit 190 cannot be cut off. Furthermore, as described above, the connecting portion 152-2 is not surrounded by the encapsulant 170, so the configuration of the main body portion 152-1, the connecting portion 152-2, and the flexible printed circuit 190 is retained on the substrate 110. In contrast, since there is no flexible printed circuit 190 on the substrate 210, the redundant part of the substrate 210 can be cut. As a result, after the cutting process, the substrate 110 and the substrate 210 are not cut flush. For example, the edge of the substrate 110 extends beyond the edge of the substrate 210. The cutting process in the present disclosure can include laser cutting, rotary knife cutting, or a combination thereof, but is not limited thereto. After the cutting process is completed, the production of the electronic device 10 is completed. FIG. 6 and FIG. 7 are schematic cross-sectional views of the electronic device 10 at other positions according to some embodiments of the present disclosure. It should be noted that FIG. 6 is a schematic cross-sectional view obtained from the line segment B-B' of FIG. 1, and FIG. 7 is a schematic cross-sectional view obtained from the line segment C-C' of FIG. 1. The carrier 100, the substrate 110, the metal layer 120, the conductive layer 150, the encapsulant 160, the encapsulant 170, the flexible printed circuit 190, the carrier 200, the substrate 210, the conductive layer 250, and the liquid crystal 260 are similar to those shown in FIGS. 1 and 2, and will not be described in detail herein. Referring to FIG. 6, a schematic cross-sectional view of the fabricated electronic device 10 along the line segment B-B' is shown. For simplicity, the steps of FIGS. 2-4 are omitted. Compared with FIG. 5, FIG. 6 shows the second conductive pattern 154 (such as the connection portion 154-3). A metal layer 120 is formed between the substrate 110 and the second conductive pattern 154 (such as the connection portion 154-3). Due to different electrode signals transmitted, the first conductive pattern 152 and the second conductive pattern 154 are separated from each other by a distance S. The connection portion 154-3 of the second conductive pattern 154 extends from one end of the loop portion 154-1 towards the flexible printed circuit 190. Continuing to refer to FIG. 6, since the connection portion 154-3, the corresponding substrate 110 of the connection portion 154-3, and the metal layer 120 are not surrounded by the encapsulant 170, a wrinkle C or even a crack F is generated, resulting in ineffective transmission of electrode signals. In the present disclosure, a mechanism to avoid the failure of the electronic device can be achieved by providing the metal layer 120. In this way, when the connection portion 154-3 fails to transmit electrode signals, the electrode signal transmission can still be completed through the metal layer 120 below the connection portion 154-3, which has high ductility and is less likely to break. Thereby, the flexible printed circuit 190 can transmit electrode signals to the first conductive pattern 152 and the second conductive pattern 154 through the metal layer 120 to control the correct rotation of the liquid crystal, reducing the risk of failure of the electronic device 10 and improving the yield and reliability of the electronic device 10. Referring to FIG. 7, a schematic cross-sectional view of the fabricated electronic device 10 along the line segment C-C' is shown. For simplicity, the steps of FIGS. 2-4 are omitted. Compared with FIG. 5, FIG. 7 shows an area without any connection portions. In this embodiment, a part of the encapsulant 160 is disposed on the first conductive pattern 152 (such as the main body portion 152-1), and a part of the encapsulant 160 is disposed on one section of the second conductive pattern 154 (such as the loop portion 154-1). A metal wire 180 is formed on another section of the second conductive pattern 154 (such as the loop portion 154-1). Continuing to refer to FIG. 7, a mark 115 is formed in a section of the loop portion 154-1 corresponding to the metal wire 180, but the position where the mark 115 is provided is not limited thereto. When observed from a top view direction, the mark 115 may have a cross shape or other suitable shapes. According to some embodiments of the present disclosure, the mark 115 may provide alignment for the formation of the metal wire 180. The material and formation method of the mark 115 may be similar to those of the metal layer 120, and will not be elaborated herein. Referring to FIG. 7, the metal wire 180 may be located on a section of the second conductive pattern 154 (such as the loop portion 154-1). In some embodiments, the metal wire 180 does not extend over the connection portions 154-2 and 154-3 of the second conductive pattern 154. The metal wire 180 may further transmit the electrode signals of the connection portion 154-2 and / or the connection portion 154-3 to the conductive layer 250. Although the metal wire 180 is disposed on one side of the loop portion 154-1, the position and length where the metal wire 180 is disposed are not limited thereto. For example, the metal wire 180 may extend to other sides of the loop portion 154-1, or the metal wire 180 may also be shortened. However, since the laser release process may cause the substrate 110 to bend, the metal wire 180 needs to maintain a certain length to ensure signal conduction. The metal wire 180 may include a metal 182 and an adhesive layer 184. According to some embodiments of the present disclosure, the metal 182 may conduct electrode signals, and the adhesive layer 184 may ensure the adhesion between the conductive layer 150 and the conductive layer 250. The material of the metal 182 includes metal particles formed of gold, silver, or other metals, but is not limited thereto. The material of the adhesive layer 184 may be similar to the material and formation method of the adhesive layer 164, and will not be elaborated herein. The metal 182 and the adhesive layer 184 may be formed by any of the above suitable processes. Continuing to refer to FIG. 7, the metal wire 180 may be disposed between the conductive layer 150 and the conductive layer 250. Since the conductive layer 150 is surrounded by the encapsulant 170, the cross-sectional schematic view of the conductive layer 150 at the line segment C-C' does not have wrinkles C. Since the cutting process may remove the encapsulant 170 and the portion outside the ring of the encapsulant 170. As a result, after the cutting process, the substrate 110 is flush with the substrate 210. FIGS. 8A and 8B are top views of the metal layer 120 of an electronic device with various designs according to some embodiments of the present disclosure. Compared with FIG. 1, the metal layer 120 disposed below the conductive layer 150 may have a mesh structure. In some embodiments, the metal layer 120 corresponding to below the connection portion 152-2, the connection portion 154-2, and the connection portion 154-3 may have different designed mesh structures. The features of the metal layer 120 are similar to those shown in FIGS. 1 and 2, and will not be elaborated herein. Referring to FIG. 8A, the metal layer 120 may include a main body segment 120-1 and loop segments 120-2 on both sides of the main body segment 120-1. With the metal layer 120 designed in this way, multiple signal transmission paths can be provided, further avoiding the problem that the signal transmission is affected by the breakage of the metal layer 120 and causing the failure of the electronic device. For example, if a crack F occurs in the main body segment 120-1 and affects the electrode signal transmission, the electrode signal transmission can still be completed through at least one of the loop segments 120-2 on one side. In some embodiments, the portion of the conductive layer 150 corresponding to the metal layer 120 may, for example, adopt the same pattern design. For example, the connecting portion 152-2 may have a mesh structure, which corresponds to the mesh structure of the metal layer 120. The mesh structure of the connecting portion 154-2 is the same as and overlaps with the mesh structure of the metal layer 120 corresponding to the connecting portion 154-2. Referring to FIG. 8B, the metal layer 120 may include sub-segments 120A, 120B, 120C, and a plurality of connecting lines L. In some embodiments, the extending direction of the connecting lines L is different from the extending directions of the sub-segments 120A, 120B, and 120C. In this way, the metal layer 120 can provide multiple signal transmission paths, further avoiding the problem that the signal transmission is affected by the breakage of the metal layer 120 and causing the failure of the electronic device, and improving the yield and reliability of the electronic device. In some embodiments, the portion of the conductive layer 150 corresponding to the metal layer 120 may, for example, adopt the same pattern design. FIGS. 9 and 10 are cross-sectional schematic views of the electronic device 20 according to some embodiments of the present disclosure. Compared with FIG. 2, the electronic device 20 further includes a passivation layer 130 and a metal layer 140. The features of the carrier 100, the substrate 110, the metal layer 120, the conductive layer 150, the encapsulant 160, the encapsulant 170, the flexible printed circuit 190, the carrier 200, the substrate 210, the conductive layer 250, and the liquid crystal 260 are similar to those shown in FIG. 2 and will not be described in detail herein. Referring to FIG. 9, a passivation layer 130 is formed between the metal layer 120 and the first conductive pattern 152 (such as the connecting portion 152-2). According to some embodiments of the present disclosure, the passivation layer 130 can isolate the metal layer 120 from the upper metal layer 140. The material of the passivation layer 130 may, for example, be an organic layer, an inorganic layer, or a combination thereof. Continuing to refer to FIG. 9, an opening 130V is formed in the passivation layer 130. According to some embodiments of the present disclosure, the subsequently formed metal layer 140 can be filled into the opening 130V so that the metal layer 120 is electrically connected to the metal layer 140. Referring to FIG. 9, a metal layer 140 is formed on the passivation layer 130. In some embodiments, the metal layer 140 may cover the passivation layer 130 and the opening 130V, and further fill the opening 130V to connect the metal layer 120. The material and formation method of the metal layer 140 may be similar to those of the metal layer 120, which will not be elaborated herein. By providing two or more metal layers, the yield and reliability of the electronic device can be enhanced. Referring to FIG. 10, a cross-sectional schematic diagram of the fabricated electronic device 20 is shown. For simplicity, the steps in FIGS. 3 and 4 are omitted. Since, for example, the connection portion 152-2 is not surrounded by the encapsulant 170, wrinkles C or even cracks F are generated in the film layers (such as the substrate 110, the metal layer 120, the passivation layer 130, the metal layer 140) corresponding to the connection portion 152-2 and the connection portion 152-2, resulting in the electronic device 20 being unable to effectively transmit electrode signals. Therefore, in the present disclosure, the metal layer 120 and the metal layer 140 can be provided as a mechanism to prevent the failure of the electronic device. In this way, when, for example, the connection portion 152-2 fails to transmit electrode signals, the electrode signal transmission can still be completed through the metal layer 120 and the metal layer 140 below the connection portion 152-2, which have high ductility and are less likely to break. FIG. 11 is a top view of an electronic device according to other embodiments of the present disclosure. Compared with FIG. 1, the first conductive pattern 152 further includes a protrusion 152-3 extending outward from the main body 152-1. In addition, the metal layer 120 can extend from below the connection part 152-2 toward the protrusion 152-3 and extend below the protrusion 152-3. The section of the metal layer 120 extending from below the connection part 152-2 to below the protrusion 152-3 is not covered by the conductive layer 150. For example, when observed from the top view direction, the metal layer 120 is disposed in at least a partial section below the connection part 152-2 (including the section adjacent to the main body 152-1, the section adjacent to the flexible circuit 190, or a combination thereof), at least a partial section below the protrusion 152-3, and the section extending from the connection part 152-2 to the protrusion 152-3. In some embodiments, the first conductive pattern 152 further includes a section (not shown) extending from the connection part 152-2 to the protrusion 152-3, so that the metal layer 120 will be covered by the first conductive pattern 152 and will not be exposed, so as to avoid oxidation of the metal layer 120. In some embodiments, the metal layer 120 may be U-shaped, but not limited thereto. Due to the arrangement of the protrusion 152-3, the second conductive pattern 154 may further have an isolation part 154-4 separated by the loop part 154-1. The metal wire 180 is also conformally disposed on the isolation part 154-4 and a part of the loop part 154-1. When observed from the top view direction, the isolation part 154-4 is located between the connection part 152-2 and the protrusion 152-3. Alternatively, the metal layer 120 under the protrusion 152-3 can be horizontally disposed between the loop part 154-1 and the isolation part 154-4. In some embodiments, the second conductive pattern 154 may not have the isolation part 154-4, or the metal wire 180 may not be disposed on the isolation part 154-4. FIGS. 12 and 13 are schematic cross-sectional views of an electronic device 30 according to other embodiments of the present disclosure. It should be noted that FIG. 12 is a schematic cross-sectional view obtained from the line segment D-D' of FIG. 11. The features of the carrier 100, the substrate 110, the metal layer 120, the conductive layer 150, the encapsulant 160, the encapsulant 170, the flexible printed circuit 190, the carrier 200, the substrate 210, the conductive layer 250, and the liquid crystal 260 are similar to those shown in FIG. 2 and will not be described herein again. Referring to FIG. 12, a metal layer 120 is formed between the substrate 110 and the first conductive pattern 152 (such as the protrusion 152-3). Compared with the connection portion 152-2, the protrusion 152-3 extends from the main body portion 152-1 and is still surrounded by the encapsulant 170. According to some embodiments of the present disclosure, the portion of the metal layer 120 located below the first conductive pattern 152 (such as the protrusion 152-3) can provide an additional path for electrode signal transmission to the lower electrode. In some embodiments, when observed from a top view, the metal wire 180 can include two portions on both sides of the protrusion 152-3 respectively. Referring to FIG. 13, a schematic cross-sectional view of the completed electronic device 30 along the line segment D-D' is shown. For simplicity, the steps of FIGS. 3 and 4 are omitted. Since the conductive layer 150 is surrounded by the encapsulant 170, the schematic cross-sectional view of the conductive layer 150 along the line segment D-D' does not have wrinkles C. The cutting process can remove the encapsulant 170 and the portion outside the ring of the encapsulant 170. As a result, after the cutting process, the substrate 110 is flush with the substrate 210. FIG. 14 is a top view of an electronic device according to other embodiments of the present disclosure. Compared with FIG. 11, in addition to the metal layer 120, a passivation layer 130 and a metal layer 140 are further included below the connection portion 152-2 of the conductive layer 150. However, the metal layer 120 and the passivation layer 130 can extend together from below the connection portion 152-2 to a new signal transmission path and directly pass below the loop portion 154-1. The sections where the metal layer 120 and the passivation layer 130 extend outward from below the connection portion 152-2 are not covered by the conductive layer 150. In some embodiments, a metal layer 120 can be provided between the substrate 110 and the connection portion 154-2. In some embodiments, no metal layer 120 is provided between the substrate 110 and the connection portion 154-3. In some embodiments, another metal layer (not shown) is further included and disposed on the passivation layer 130, wherein the another metal layer can be disposed corresponding to at least one of the connection portion 152-2, the connection portion 154-2, and the connection portion 154-3, but not limited thereto. FIGS. 15 and 16 are schematic cross-sectional views of an electronic device 40 according to other embodiments of the present disclosure. It should be noted that FIG. 15 is a cross-sectional view obtained along the line segment E-E' of FIG. 14. The features of the carrier 100, the substrate 110, the metal layer 120, the conductive layer 150, the encapsulant 160, the encapsulant 170, the metal wire 180, the flexible printed circuit 190, the carrier 200, the substrate 210, the conductive layer 250, and the liquid crystal 260 are similar to those shown in FIG. 7 and will not be described in detail herein. Referring to FIG. 15, a metal layer 120 is formed between the substrate 110 and the second conductive pattern 154 (such as the loop portion 154-1), and a passivation layer 130 is formed between the metal layer 120 and the second conductive pattern 154 (such as the loop portion 154-1). Compared with the connection portion 152-2, the sections of the metal layer 120 and the passivation layer 130 that extend through the second conductive pattern 154 (such as the loop portion 154-1) are surrounded by the encapsulant 170. According to some embodiments of the present disclosure, the section of the metal layer 120 that extends through the loop portion 154-1 can provide an additional path for electrode signal transmission to the lower electrode, reduce the risk of failure of the electronic device 10, and improve the yield and reliability of the electronic device 10. In this embodiment, the addition of the passivation layer 130 can isolate the metal layer 120 from the upper metal wire 180 and protect the metal layer 120 from oxidation. Therefore, the loop portion 154-1 and the metal wire 180 on the same side as the connection portion 152-2 do not need to be disconnected. Referring to FIG. 16, a cross-sectional schematic diagram of the fabricated electronic device 40 is shown. For simplicity, the steps in FIGS. 3 and 4 are omitted. Since the conductive layer 150 is surrounded by the encapsulant 170, the cross-sectional schematic diagram of the conductive layer 150 at the line segment E-E' does not have wrinkles C. The cutting process can remove the encapsulant 170 and the portion outside the ring of the encapsulant 170. As a result, after the cutting process, the substrate 110 is flush with the substrate 210. During the fabrication process of an electronic device, the substrate and other film layers on the substrate are prone to deformation (such as wrinkles), cracks, or even breakage problems, resulting in the inability to transmit electrode signals. In the electronic device of the present disclosure, a metal layer is disposed between the flexible substrate and the conductive layer. Since the ductility of the metal layer is higher than that of other film layers (such as the conductive layer) on the substrate, it is less likely to break during the fabrication process, which helps to assist in transmitting electrode signals, reduce the risk of failure of the electronic device, and improve the yield and reliability of the electronic device. The above summarizes the features of several embodiments to enable those of ordinary skill in the art to better understand the viewpoints of the embodiments of the present disclosure. Those of ordinary skill in the art should understand that other processes and structures can be easily designed or modified based on the embodiments of the present disclosure to achieve the same purposes and / or advantages as the embodiments introduced herein. Those of ordinary skill in the art should also understand that such equivalent structures do not depart from the spirit and scope of the present disclosure, and various changes, substitutions, and replacements can be made without departing from the spirit and scope of the present disclosure. 10, 20, 30, 40: Electronic devices 100, 200: Carrier boards 110, 210: Substrates 115: Markings 120, 140: Metal layers 120-1: Main body section 120-2: Loop section 120A, 120B, 120C: Sub-sections 130: Passivation layer 130V: Opening 150, 250: Conductive layers 152: First conductive pattern 152-1: Main body portion 152-2: Connection portion 152-3: Protrusion 154: Second conductive pattern 154-1: Loop portion 154-2, 154-3: Connection portions 154-4: Isolation portion 160, 170: Encapsulant 162: Support structure 164: Adhesive layer 180: Metal wire 182: Metal 184: Adhesive layer 190: Flexible printed circuit 260: Liquid crystal 300, 400: Polarizer A-A’, B-B’, C-C’, D-D’, E-E’: Line segments C: Wrinkle F: Crack L: Connection line S: Spacing The following will detail various aspects of the disclosed embodiments in conjunction with the accompanying drawings. It should be noted that, in accordance with standard industry practice, the various features are not drawn to scale. In fact, the dimensions of the various components can be arbitrarily enlarged or reduced to clearly show the features of the disclosed embodiments. FIG. 1 is a top view of an electronic device according to some embodiments of the present disclosure. FIGS. 2 to 5 are schematic cross-sectional views of the electronic device according to some embodiments of the present disclosure. FIGS. 6 and 7 are schematic cross-sectional views of the electronic device at other positions according to some embodiments of the present disclosure. FIGS. 8A and 8B are top views of components of an electronic device with various designs according to some embodiments of the present disclosure. FIGS. 9 and 10 are schematic cross-sectional views of the electronic device according to some embodiments of the present disclosure. FIG. 11 is a top view of an electronic device according to other embodiments of the present disclosure. FIGS. 12 and 13 are schematic cross-sectional views of the electronic device according to other embodiments of the present disclosure. FIG. 14 is a top view of an electronic device according to other embodiments of the present disclosure. FIGS. 15 and 16 are schematic cross-sectional views of the electronic device according to other embodiments of the present disclosure. None 10: Electronic device 110: Substrate 120: Metal layer 152: First conductive pattern 154: Second conductive pattern 160: Encapsulant 162: Support structure 164: Adhesive layer 190: Flexible printed circuit 210: Substrate 250: Conductive layer 260: Liquid crystal 300: Polarizer 400: Polarizer C: Wrinkle F: Crack

Claims

1. An electronic device comprising: A first substrate, wherein the first substrate is flexible; A second substrate is disposed opposite to the first substrate, wherein the second substrate is flexible; A first conductive layer disposed on the first substrate includes: a first conductive pattern for receiving a first electrode signal and including a first bonding part; and a second conductive pattern for receiving a second electrode signal and including a second bonding part; a second conductive layer disposed on the second substrate and electrically connected to the second conductive pattern; and a first metal layer disposed between the first substrate and at least one of the first bonding part and the second bonding part, and electrically connected to at least one of the first bonding part and the second bonding part.

2. The electronic device of claim 1, wherein, in a cross-sectional view, the first substrate has a fold in a portion corresponding to at least one of the first connecting portion and the second connecting portion.

3. The electronic device of claim 1, wherein the first connection portion has a crack.

4. The electronic device of claim 1, wherein, in a top view, the first metal layer has a mesh structure corresponding to at least one of the first connection portion and the second connection portion.

5. The electronic device of claim 1 further includes a seal disposed between the first conductive layer and the second conductive layer.

6. The electronic device of claim 1, wherein the first conductive pattern further includes a protrusion, and the first metal layer extends from below the first connection to below the protrusion.

7. The electronic device as claimed in claim 1 further includes: A passivation layer is disposed between the first metal layer and the first conductive layer, wherein the passivation layer has an opening; and a second metal layer is disposed between the passivation layer and at least one of the first connection portion and the second connection portion, wherein the second metal layer fills the opening and is electrically connected to the first metal layer.

8. An electronic device comprising: First substrate; A second substrate is disposed corresponding to the first substrate; A first conductive layer disposed on the first substrate includes: a first conductive pattern for receiving a first electrode signal and including a first connection portion; and a second conductive pattern for receiving a second electrode signal and including a second connection portion; a second conductive layer disposed on the second substrate and electrically connected to the second conductive pattern; a first metal layer disposed between the first substrate and at least one of the first connection portion and the second connection portion; a passivation layer disposed on the first metal layer, wherein the passivation layer has an opening; and a second metal layer disposed on the passivation layer, wherein the second metal layer fills the opening and is electrically connected to the first metal layer.

9. The electronic device of claim 8, wherein the first conductive pattern further includes a protrusion, the first metal layer extending from below the first connection to below the protrusion of the first conductive pattern.

10. A method for manufacturing an electronic device, comprising: A first carrier is provided; a first substrate is formed on the first carrier, wherein the first substrate is flexible; A second carrier board is provided; a second substrate is formed on the second carrier board, wherein the second substrate is flexible; the first substrate and the second substrate are bonded together by a first frame adhesive and a second frame adhesive. Remove the first carrier plate; remove the second carrier plate; and cut off the second frame adhesive.

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