Reconfigurable mainframe with replaceable interface plate and method of configuring mainframe

Abstract

A host computer for a component manufacturing system includes: a base; a plurality of facets on the base; and a cover above the plurality of facets. A first facet of the plurality of facets includes a frame. The base, cover, and plurality of facets together define an interior space including a robotic arm. A first replaceable interface panel is attached to a first frame of the first facet. The first replaceable interface panel includes a plurality of substrate in / out ports. A first substrate in / out port of the plurality of substrate in / out ports is configured to provide the robotic arm with access to a first process chamber. A second substrate in / out port of the plurality of substrate in / out ports is configured to provide the robotic arm with access to a second process chamber.

Description

Technical Field

[0001] Embodiments of the present disclosure generally relate to electronic component manufacturing systems, and more particularly to a reconfigurable mainframe of an electronic component manufacturing system including a replaceable interface plate. Embodiments also relate to a replaceable interface plate for the mainframe. Prior Art

[0002] A conventional electronic component manufacturing system (also referred to as a component manufacturing system) may include a mainframe with multiple process chambers and load lock chambers arranged around it. The mainframe may have multiple sidewalls (commonly referred to as "facets") to which the process chambers and / or load lock chambers are coupled. The facets of a conventional mainframe are machined to have a pre-arranged configuration with substrate access ports of predetermined size, location, etc. Once a conventional mainframe is manufactured, the type, size, arrangement, and location of the substrate access ports are fixed for that mainframe. If the mainframe owner desires a new configuration, a new mainframe with the new configuration is purchased. Summary of the Invention

[0003] According to a first aspect of the present disclosure, a mainframe of a component manufacturing system includes: a base; a plurality of machine surfaces on the base; and a cover above the plurality of machine surfaces. A first machine surface of the plurality of machine surfaces includes a first frame. The base, the cover, and the plurality of machine surfaces together define an interior space, which includes a robotic arm. A first replaceable interface panel is attached to the first frame of the first machine surface. The first replaceable interface panel includes a plurality of substrate access ports. A first substrate access port of the plurality of substrate access ports is configured to provide access to a first process chamber for the robotic arm. A second substrate access port of the plurality of substrate access ports is configured to provide access to a second process chamber for the robotic arm. In one embodiment, the first replaceable interface panel is load-bearing, and the frame is load-free.

[0004] According to a second aspect of the present disclosure, a replaceable interface plate is configured to be attached to a mainframe panel. The replaceable interface plate includes a plurality of substrate access ports. A first substrate access port of the plurality of substrate access ports is configured to provide access from the mainframe to a first process chamber. A second substrate access port of the plurality of substrate access ports is configured to provide access from the mainframe to a second process chamber. The replaceable interface plate is supported by the mainframe. Therefore, the replaceable interface plate is configured to withstand vertical forces acting on the mainframe caused by a pressure differential between the interior of the mainframe and the exterior of the mainframe.

[0005] According to a third aspect of the present disclosure, a method for constructing a mainframe includes: determining a first plurality of process chambers to be coupled to a first side of the mainframe; determining locations of a plurality of substrate access ports on the side that will accommodate the first plurality of process chambers; determining a configuration of a first replaceable interface plate, the first replaceable interface plate having one of the plurality of substrate access ports at each of the locations; and manufacturing the first replaceable interface plate. The method further includes: attaching the first replaceable interface plate to the first side of the mainframe; and attaching the first plurality of process chambers to the first replaceable interface plate, wherein each of the plurality of process chambers is accessible from the mainframe via one of the plurality of substrate access ports. The method can be performed after the mainframe has been manufactured (e.g., to change the configuration of the mainframe). Simple diagram description

[0006] The present disclosure is illustrated by way of example and not limitation in the figures of the accompanying drawings in which like reference numerals indicate similar elements. It should be noted that different references to "one" or "an" embodiment in this disclosure are not necessarily to the same embodiment, and such references mean at least one.

[0007] 1A illustrates a schematic top view of an electronic component manufacturing system with a reconfigurable mainframe in a first configuration, according to an embodiment of the present disclosure.

[0008] 1B illustrates a schematic top view of an electronic component manufacturing system with a reconfigurable mainframe in a second configuration, according to an embodiment of the present disclosure.

[0009] 1C illustrates a schematic top view of an electronic component manufacturing system with a reconfigurable mainframe in a third configuration, according to an embodiment of the present disclosure.

[0010] 2A illustrates a perspective view of a reconfigurable host computer according to an embodiment of the present disclosure.

[0011] 2B illustrates a side view of a first example replaceable interface plate according to an embodiment of the present disclosure.

[0012] 2C illustrates a side view of a second example alternative interface plate according to an embodiment of the present disclosure.

[0013] 2D illustrates a side view of a third example alternative interface plate according to an embodiment of the present disclosure.

[0014] 3 depicts a cross-sectional side view of a host computer and an attached replaceable interface board taken at the location of a substrate access port, according to an embodiment of the present disclosure.

[0015] 4 depicts a cross-sectional side view of a host computer and an attached replaceable interface plate, taken at a column of the host computer's frame, according to an embodiment of the present disclosure.

[0016] FIG5 illustrates a process for assembling a reconfigurable mainframe of an electronic component manufacturing system according to an embodiment of the present disclosure. Implementation Method

[0017] Embodiments are directed to a reconfigurable mainframe (also referred to as a transfer chamber) having one or more replaceable interface panels. The reconfigurable mainframe includes multiple panels, at least one of which includes a frame configured to receive a replaceable interface panel. In one embodiment, the reconfigurable mainframe includes a frame for each panel of the reconfigurable mainframe. A replaceable interface panel can be attached to each frame. A cover can be positioned above the frames for each panel and secured to the replaceable interface panel. In embodiments, the replaceable interface panels are load-bearing, while the frames are non-load-bearing. Therefore, when the interior of the mainframe is evacuated to a vacuum, the replaceable interface panels are subjected to vertical (and horizontal) forces, while little or no force is applied to the frames.

[0018] In some embodiments, the mainframe may have a square or rectangular shape. One or more load lock chambers may be coupled to a mainframe panel. In one embodiment, one or more load lock chambers are coupled to a replaceable interface board on a mainframe panel. In one embodiment, additional replaceable interface boards are connected to one or more additional panels of the mainframe, and one or more process chambers are coupled to some or all of these additional replaceable interface boards. The process chambers may perform various substrate processes, and the process chambers coupled to different replaceable interface boards on these panels may have different sizes, different substrate access ports, different connection types, different heights, etc. For example, some substrate access ports may have a height that accommodates two end effectors at different spacings. Furthermore, each replaceable interface board may be configured to couple to the same or different numbers of process and / or load lock chambers. For example, one replaceable interface board may be configured to couple to a single process chamber of a first size, while a second replaceable interface board may be configured to couple to two process chambers, each having a second size different from the first size, and so on. One or more substrate access ports on each interchangeable interface panel can interface a load lock chamber and a process chamber with each transfer chamber to enable substrates to be transferred between the two. The substrate access ports can be sized and positioned on each interchangeable interface panel to accommodate the number and size of chambers that can be coupled to each machine face. An electronic component manufacturing system having such a host can enable a wider range of substrate processes and a more diverse sequence to be performed in a single system, thereby increasing the versatility, capacity, and / or efficiency of such an electronic component manufacturing system. In other aspects, a method of assembling an electronic component manufacturing system is provided.

[0019] The reconfigurable mainframe and replaceable interface panels disclosed in the embodiments offer several advantages over conventional mainframes. Conventional mainframes have a single design determined at the time of manufacture. This single design features a fixed number of substrate access ports of fixed size and fixed position. If, at any time, it would be advantageous to change the configuration of such a conventional mainframe, the option available is to purchase a new mainframe with the new configuration. In contrast, a reconfigurable mainframe can be reconfigured at any time by manufacturing new replaceable interface panels. If a new configuration would be beneficial, one or more new replaceable interface panels with the new configuration can be manufactured. The existing replaceable interface panels can then be removed from the mainframe, and new replaceable interface panels can be attached to the mainframe. Thus, in embodiments, the flexibility of the mainframe is significantly enhanced. In addition, the useful life of the mainframe can be increased because new replaceable interface panels can be used to update the mainframe due to the availability of new process chambers, the development of new slit valve technology, the development of new local center finding (LCF) technology (e.g., using light emitting diodes (LEDs), lasers, and / or other scanning methods for determining the position of a wafer within a pocket of an end effector or robot blade), etc. For example, an old replaceable interface panel with outdated slit valve technology, outdated LCF technology, etc. can be replaced with a new replaceable interface panel with new slit valve technology and / or new LCF technology.

[0020] As used herein, the singular forms "a," "an," and "the" include plural references unless the context clearly dictates otherwise. Thus, for example, reference to "a substrate" includes a single substrate (e.g., a single wafer) as well as a mixture of two or more substrates; and reference to "a process chamber" includes one process chamber as well as a mixture of two or more process chambers, etc.

[0021] As used herein, the term "about" in connection with a measured amount refers to the normal variation in the measured amount as would be expected by one of ordinary skill in the art when making the measurements and exercising a degree of caution by one of ordinary skill in the art and the precision of the measuring equipment. In certain embodiments, the term "about" includes ±10% of the recited number, such that "about 10" would include 9 to 11.

[0022] The recitation of ranges of values ​​herein is merely intended to serve as a shorthand method of referring individually to each separate value falling within the range, unless otherwise indicated herein, and each separate value is incorporated into the specification as if individually recited herein. All methods described herein can be performed in any suitable order unless otherwise indicated herein or clearly contradicted by context. The use of any and all examples, or exemplary language (e.g., "such as") provided herein is intended merely to illustrate certain materials and methods and does not constitute a limitation on the scope. No language in this specification should be construed as indicating that any non-claimed element is essential to the practice of the disclosed materials and methods.

[0023] Figures 1A to 1C illustrate schematic top views of an electronic component manufacturing system having a reconfigurable host computer. Figure 1A illustrates a schematic top view of a first configuration 100A of the electronic component manufacturing system according to an embodiment of the present disclosure. Figure 1B illustrates a schematic top view of a second configuration 100B of the electronic component manufacturing system according to an embodiment of the present disclosure. Figure 1C illustrates a schematic top view of a third configuration 100C of the electronic component manufacturing system according to an embodiment of the present disclosure.

[0024] The electronic component manufacturing system is configured to process substrates and may include a mainframe (also referred to as a transfer chamber) 104 having four faces 101A to 101D. Although the four faces 101A to 101D are shown in a rectangular configuration, mainframe 104 may alternatively have other numbers of faces (e.g., such as 5 faces, 6 faces, 7 faces, 8 faces, etc.) and / or other shapes. In embodiments, the faces may have the same size (e.g., the same width) or different sizes. In one embodiment, mainframe 104 has a rectangular shape, wherein faces 101A and 101C are approximately parallel to each other, faces 101B and 101D are approximately parallel to each other, and faces 101A and 101C are approximately perpendicular to faces 101B and 101D. In one embodiment, faces 101B and 101D have a first length that is at least twice the second length of faces 101A and 101C. In one embodiment, the lengths of faces 101B and 101D are approximately 100 to 150 inches, and the lengths of faces 101A and 101C are approximately 40 to 60 inches. In one embodiment, mainframe 104 has a pentagonal shape. In one embodiment, the mainframe includes a first face having a first length, a second face and a third face on either side of the first face (each having a second length greater than the first length), and a fourth face and a fifth face connected to the second face and the third face, respectively (each having a third length greater than or equal to the first length and less than the second length).

[0025] Mainframe 104 may include an interior space 134, wherein faces 101A to 101D may define sidewalls of interior space 134. Mainframe 104 may additionally include a base (not shown) and a lid (not shown). Faces 101A to 101D, the base, and the lid may collectively define interior space 134. A robotic arm (also referred to as a robotic element) 136 may be disposed within interior space 134 of mainframe 104. Interior space 134 may typically be under vacuum during operation of mainframe 104.

[0026] Each of faces 101A through 101D may include a frame to which a replaceable interface panel may be attached. Alternatively, a subset of faces 101A through 101D may include multiple frames to which multiple replaceable interface panels are attached. Other faces having built-in sidewalls with a fixed configuration may be manufactured in a conventional manner. For each face having a frame rather than a fixed configuration, a replaceable interface panel may be attached to the frame of that face and may form the sidewalls of that face. At any time, an existing replaceable interface panel attached to the face may be removed, and a new replaceable interface panel with a different design may be attached to the face. Thus, host 104 is a reconfigurable host with a flexible design.

[0027] In FIG1A , replaceable interface panel 128A is attached to surface 101B, replaceable interface panel 129 is attached to surface 101C, replaceable interface panel 130A is attached to surface 101D, and replaceable interface panel 131 is attached to surface 101A. Replaceable interface panel 128A has three substrate access ports 132. Each substrate access port 132 can be configured to allow a horizontally oriented substrate 140 to pass therethrough. Substrates 140 can be wafers (e.g., semiconductor wafers or non-semiconductor component substrates), glass sheets or panels, and / or other workpieces used to manufacture electronic components or circuit parts. Each substrate access port 132 may be, for example, an elongated slot or slit formed in a sidewall of the mainframe 104 or in the replaceable interface panels 128A, 130A, and may include, for example, a slit valve or other suitable device for opening and closing the substrate access port 132 and / or a local center finder (LCF) suitable for determining the position of the substrate 140 being transferred through the substrate access port 132. The slit valve may have any suitable conventional configuration, such as, for example, an L-shaped motion slit valve. Other suitable devices may also be used to open and close the substrate access port 132. In embodiments, the substrate access port 132 may include a single gate or dual gates (e.g., a first gate on the interior of the replaceable interface panel at the substrate access port and a second gate on the exterior of the replaceable interface panel at the substrate access port).

[0028] Three process chambers 106, 108, 110 are attached to the replaceable interface plate 128A. Each of the process chambers 106-110 has a chamber port that aligns with a substrate access port 132 in the replaceable interface plate 128A.

[0029] The replaceable interface plate 130A has three substrate access ports 132. Three process chambers 112, 114, 116 are attached to the replaceable interface plate 130A. Each of the process chambers 112-116 has a chamber port that aligns with the substrate access port 132 in the replaceable interface plate 130A.

[0030] The replaceable interface plate 129 is a solid plate without substrate access ports. The replaceable interface plate 131 includes two substrate access ports 132. The replaceable interface plate 131 is coupled to one or more load lock chambers 126 (e.g., the load lock chamber 126 may include two side-by-side load lock chambers). Each load lock chamber 126 has a chamber port that aligns with one of the substrate access ports in the replaceable interface plate 129.

[0031] The load lock chambers 126 can each be a batch processing type or a single substrate type load lock chamber. In some embodiments, the load lock chambers 126 can be stacked load lock chambers. For example, the load lock chambers 126 can be a double-stack load lock chamber, a triple-stack load lock chamber, a load lock chamber with four or more stacked load locks (e.g., a quad load lock chamber), etc. Alternatively, the load lock chambers 126 can be single-space load lock chambers. Each load lock chamber 126 can have one or more chamber ports corresponding to respective substrate access ports 132. For example, a stacked load lock chamber 126 having two separate substrate volumes can have vertically aligned chamber ports corresponding to respective vertically aligned substrate access ports 132. A triple-stack load lock chamber having three separate substrate volumes can have three vertically aligned chamber ports corresponding to the vertically aligned substrate access ports. A single-space load lock chamber can have a single chamber port corresponding to a single substrate access port 132. Any one or more of the load lock chambers 126 can be a stacked load lock chamber, a triple-stacked load lock chamber, and / or a single-space load lock chamber. Furthermore, in some embodiments, any one or more of the load lock chambers 126 can be a chamber capable of performing a process. That is, any one or more of the load lock chambers 126, or any space therein, can be capable of performing a substrate preheating process, a letdown process, a cooldown process, and / or another treatment process.

[0032] The mainframe 104, process chambers 106-116, and / or load lock chamber 126 can each operate at vacuum pressure. Each of the process chambers 106-116 can perform the same or different processes on the substrate 140, including, for example, deposition, oxidation, nitridation, etching, polishing, cleaning, photolithography, inspection, or the like. Other processes may also be performed therein.

[0033] The mainframe 104 may also include a robotic element 136 within the interior space 134. The robotic element 136 may be configured to move one or more substrates 140 into and out of each of the process chambers 106 through 116 and the load lock chamber 126. The robotic element 136 may be configured to transfer substrates 140 from any chamber directly to any other chamber attached to the mainframe 104. In some embodiments, the substrates 140 may be transferred by the robotic element 136 in any order or direction. In some embodiments, the robotic element 136 may have dual transfer blades (or more transfer blades, also known as end effectors), each of which can independently extend into and retract from any chamber attached to the mainframe 104, thereby increasing system throughput by enabling parallel substrate transfer. In some embodiments, the robotic element 136 may have a single transfer blade, may be an off-axis robotic arm, and / or may be a SCARA (selective compliance articulated robotic arm) robot. Alternatively, the robotic element 136 may be any suitable mechanism for transferring substrates between chambers attached to the mainframe 104, such as a linear robot or a non-linear robot.

[0034] A load lock chamber 126 can be coupled to the factory interface 102, which can be coupled to one or more FOUPs (front opening unified pods) 118. The one or more load lock chambers 126 can provide a first vacuum interface between the factory interface 102 and the transfer chamber 126. In some embodiments, each load lock chamber 126 can increase substrate throughput by alternately communicating with the mainframe (transfer chamber) 104 and the factory interface 102. That is, while any one space or one load lock chamber 126 of a stacked or triple-stacked load lock chamber is in communication with the transfer chamber 104, the other space or other load lock chamber 126 of the stacked or triple-stacked load lock chamber can be in communication with the factory interface 102. Transfer of substrates between the factory interface 102, the load lock chambers 126, and the transfer chamber 104 can be performed in any other suitable manner.

[0035] Each FOUP 118 may be a container having a fixed cassette therein for holding a plurality of substrates. Each FOUP 118 may have a front-opening interface configured for use with the factory interface 102. The factory interface 102 may have a buffer chamber (not shown) and one or more robotic elements 138 configured to transfer substrates 140 via linear, rotational, and / or vertical movement between the FOUP 118 and the load lock chamber 126. The substrates may be transferred between the FOUP 118 and the load lock chamber 126 in any order or direction. Each load lock chamber 126 may be a batch processing type or a single substrate type load lock chamber.

[0036] The controller 171 can control the operation of the robotic elements 138, 136, and / or the electronic component manufacturing system. The controller 171 can control the processing and transport of substrates 140 within and by the electronic component manufacturing system. The controller 171 can be, for example, a general-purpose computer and / or can include a microprocessor or other suitable CPU (central processing unit), memory for storing software routines for controlling the electronic component manufacturing system, input / output peripherals, and support circuitry (such as, for example, a power supply, clock circuitry, circuitry for driving the robotic elements 138, 136, cache memory, and / or the like). The controller 171 can be programmed to sequentially process one or more substrates, for example, by each of the process chambers attached to the host computer 104. In other embodiments, the controller 171 can be programmed to process substrates by the process chambers in any order. In other embodiments, the controller 171 can be programmed to skip and / or repeat processing of one or more substrates in one or more process chambers. Controller 171 may alternatively be programmed to process one or more substrates in an electronic device manufacturing system in any suitable manner.

[0037] The electronic component manufacturing system may have other suitable numbers of FOUPs 118 and / or load lock chambers 126 besides the number shown. In some embodiments, the number of load lock chambers coupled to tool deck 101A may be independent of the number of process chambers coupled to any of tool decks 101B through 101D. For example, the number of load lock chambers may differ from the maximum number of process chambers coupled to a tool deck. Furthermore, in some embodiments, up to four process chambers may be coupled to a single tool deck, or more than four process chambers may be coupled to a single tool deck, depending on the size of the mainframe 104 relative to the size of the four process chambers.

[0038] FIG1B shows the same FOUP 118, factory interface 102, load lock 126, and host computer 104 as in FIG1A . However, in FIG1B , replaceable interface panel 128A has been removed from machine side 101B, and replaceable interface panel 128B has been attached to machine side 101B. Similarly, replaceable interface panel 130A has been removed from side 101D, and replaceable interface panel 130B has been attached to side 101D. Instead of the three substrate access ports 132 of replaceable interface panel 128A, replaceable interface panel 128B has two substrate access ports 132. Similarly, instead of the three substrate access ports 132 of replaceable interface panel 130A, replaceable interface panel 130B has two substrate access ports 132. Thus, in the second configuration 100B, process chambers 106, 108, 112, and 114 have been repositioned, and process chambers 110 and 116 have been removed.

[0039] FIG1C shows the same FOUP 118, factory interface 102, load lock 126, and host computer 104 as shown in FIG1A-1B. However, in FIG1C , replaceable interface panel 128A has been removed from machine side 101B, and replaceable interface panel 128C has been attached to machine side 101B. Similarly, replaceable interface panel 130A has been removed from side 101D, and replaceable interface panel 130C has been attached to side 101D. Replaceable interface panel 128C has four substrate access ports 132, unlike the three substrate access ports 132 of replaceable interface panel 128A. Replaceable interface panel 130C has three substrate access ports 132, but they are located in different locations than the three substrate access ports 132 of replaceable interface panel 130A. In the third configuration 100C, process chamber 112 is in the same location, but process chambers 106 , 108 , 110 , 114 , and 116 have been removed and replaced with process chambers 122 , 124 , 125 , and 127 .

[0040] As shown, any type of process chamber can be connected to the machine surface of the mainframe 104 via a replaceable interface board. Some examples of process chambers include a quad process chamber (e.g., including process chambers 106 to 116), a single process chamber (e.g., including process chambers 125 and 127), and a dual process chamber (e.g., including process chambers 122 and 124).

[0041] Each of the substrate access ports 132 may share a common size or have different sizes. Each of the replaceable interface panels 128A-128C, 130A-130C, 129, and 131 may include the same or different numbers of substrate access ports 132, and these ports may have similar or different sizes. For example, some of the substrate access ports may have a first width (e.g., to receive 200 mm wafers), some may have a second width (e.g., to receive 300 mm wafers), and some may have a third width. Each of the substrate access ports 132 is at least wide enough to allow a substrate 140 to pass therethrough. The different sizes of the substrate access ports allow the robot assembly 136 to access different areas within a chamber coupled to one of the machine surfaces 101A-101D. In some embodiments where the replaceable interface panel has two or more substrate access ports, the substrate access ports may not be laterally centered and / or equally spaced within the substrate interface panel. In some embodiments where the replaceable interface plate has a single substrate access port, the substrate access port can be centered or offset laterally on the machine surface.

[0042] In one example, the replaceable interface plate 128A is interchangeable with a plurality of additional replaceable interface plates having: a) a different number of substrate access ports than the replaceable interface plate 128A; b) one or more substrate access ports that are positioned differently than the plurality of substrate access ports in the replaceable interface plate 128A; c) one or more substrate access ports that are sized differently than the plurality of substrate access ports in the replaceable interface plate 128A; d) a different type of slit valve than the replaceable interface plate 128A; and / or e) a different type of local center probe than the replaceable interface plate 128A.

[0043] Each of the interchangeable interface panels can have various numbers, sizes, and / or combinations of substrate access ports, as long as the width of the machine deck is suitable for accommodating those numbers, sizes, and / or combinations of substrate access ports. For example, in some embodiments, an interchangeable interface panel may have one substrate access port 132 instead of three. In other embodiments, one interchangeable interface panel may have one substrate access port 132 of a first width and one of a second width, while another interchangeable interface panel may have one substrate access port 132 of a first width and one of a third width. Various combinations of substrate access ports are possible if the machine deck has the appropriate width. This allows the mainframe 104 to be customized to couple to a specific type and number of process and load lock chambers. In one example, the first width may be approximately 1.2 meters, the second width may be approximately 2.4 meters, and the third width may be approximately 800 mm.

[0044] In some embodiments, two electronic component manufacturing systems can be combined. That is, one side of each mainframe 104, such as side 101C of the first mainframe and side 202 of the second mainframe, can each include a replaceable interface panel that enables the two mainframes to be coupled (e.g., with one or more load locks sandwiched between the two mainframes). These mainframes can be coupled in a manner that provides a pass-through chamber for transferring substrates between the two mainframes. This can further enhance the versatility, capacity, and / or efficiency of such an electronic component manufacturing system.

[0045] 2A shows a perspective view of a reconfigurable host 200 according to an embodiment of the present disclosure. In an embodiment, the reconfigurable host 200 may correspond to the host 104 of FIG. 1A to FIG. 1C .

[0046] The reconfigurable mainframe 200 includes a base 206 upon which a set of frames is mounted. Each frame may correspond to and frame a side or face of the mainframe 200. Conceptually, the set of frames may be a single three-dimensional frame 201 having multiple frame faces, each of which frames a face of the mainframe 200. Frame 201 may include columns 204A to 204D and may further include beams 208A to 208D connecting the columns 204A to 204D. Each of these frames (or frame faces) may include a portion of the base, a pair of columns, and corresponding beams connecting the columns. For example, the base 206, columns 204A and 204B, and beam 208B may constitute a first frame (or frame surface) for a first machine surface, the base 206, columns 204A and 204D, and beam 208C may constitute a second frame (or frame surface) for a second machine surface, the base 206, columns 204C and 204D, and beam 208D may constitute a third frame (or frame surface) for a third machine surface, and the base 206, columns 204B and 204C, and beam 208A may constitute a fourth frame (or frame surface) for a fourth machine surface.

[0047] Each of these frames (or frame faces) can include a lip 210A, 210B located in the base 206. The lips 210A, 210B can be configured to support forces transmitted to the lips 210A, 210B by a replaceable interface panel attached to the machine face. Additionally, each of these frames (or frame faces) can include a groove or other feature that can receive an O-ring 215, 220. The O-ring can seal the replaceable interface panel to the frame (or frame face).

[0048] As shown, the replaceable interface panel 230 is attached to the frame (or frame surface) of the mainframe 200. The replaceable interface panel 230 can be attached to the frame via bolts, screws, and / or other attachment mechanisms. The replaceable interface panel 230 can include a predetermined number, size, and location of substrate access ports 234 and 236, each of which can be configured to provide access to a process chamber for a robotic arm. The replaceable interface panel 230 can also include a slit valve (not shown), an LCF (not shown), and / or other components attached to or integrated into the replaceable interface panel 230.

[0049] The replaceable interface plate 230 can be a metal plate. For example, the replaceable interface plate can be formed from aluminum, an aluminum alloy, steel, or another metal. In some embodiments, the replaceable interface plate includes a surface treatment, such as a coating or an anodized layer (e.g., an Al2O3 anodized layer). Examples of coatings include those deposited by chemical vapor deposition (CVD), atomic layer deposition (ALD), electroplating, and the like. Some exemplary coatings include dielectric coatings, Al2O3 coatings, nickel plating, and Y2O3 coatings. The replaceable interface plate 230 can be coated before being attached to the host 200. Alternatively, the host 200 can be coated after the replaceable interface plate has been attached. Therefore, in some embodiments, portions of the replaceable interface plate 230 include a surface treatment.

[0050] The replaceable interface plate 230 additionally includes a step 232 on the inner bottom surface of the replaceable interface plate 230. The step mates with a lip on a side wall of the base 206 that forms the frame (or frame face) to which the replaceable interface plate 230 is mounted.

[0051] The mainframe is configured to operate under a vacuum, which can result in large vertical and horizontal forces being applied to the mainframe 200 due to the pressure differential between the mainframe's exterior (e.g., which may be at atmospheric pressure) and the mainframe's interior. Frame 201 may bend and / or buckle when exposed to these forces. Therefore, in embodiments, the replaceable interface panel (e.g., replaceable interface panel 230) is designed to support the mainframe 200, while the frame of the first side does not. Therefore, replaceable interface panel 230 withstands the vertical forces acting on the mainframe 200 caused by the pressure differential between the mainframe's interior and the mainframe's exterior. These vertical forces can be transmitted from the replaceable interface panel 230 to the base at the interface between the base's lip, which mates with the stepped portion 232, and the stepped portion 232.

[0052] In one embodiment, when mainframe 200 is under vacuum, a vertical force of approximately 95,000 pounds of pressure is applied to the mainframe. In embodiments where both sides have a length of approximately 100 to 150 inches and both sides have a length of approximately 40 to 60 inches, approximately 30% to 40% of this vertical force is supported by each replaceable interface panel attached to the longer side, and approximately 10% to 15% of this force is supported by each replaceable interface panel attached to the shorter side. Thus, a single replaceable interface panel can be configured to withstand a force of approximately 28,500 to 38,000 pounds without buckling.

[0053] In an alternative embodiment, steps and lips are not used to transfer vertical forces from one or more of the replaceable interface panels to the base 206. Instead of mating steps and lips, the replaceable interface panel 230 may include pins on its inner bottom surface. The pins may be, for example, square or round and may be intermittently spaced. Multiple pins may mate with one or more features in the sidewalls of the base, and vertical forces may be transferred from the replaceable interface panel to the base at the interface between the one or more features and the multiple pins. These features may be, for example, holes, lips, or other features that mate with the pins.

[0054] In an alternative embodiment, the base extends out from under the replaceable interface plate, and vertical forces can be transferred from the replaceable interface plate to the base without the use of any steps, lips, pins, or other features in the base or the replaceable interface plate.

[0055] Although not shown, additional replaceable interface panels can be attached to the remaining surface of mainframe 200. Additionally, a cover can be secured to the top of the mainframe over frame 201 and over the replaceable interface panels. In one embodiment, the cover contacts the replaceable interface panels but does not contact frame 201. This ensures that even if there is slight misalignment in the vertical spacing of the lip, step, top of the replaceable interface panel, and / or top of frame 201, the frame will not bear any load.

[0056] 2B shows a side view of a first example replaceable interface plate 250 according to an embodiment of the present disclosure. The first replaceable interface plate 250 includes a step portion 232 and three substrate access ports 252, 254, 256, all of which have the same width, height, and vertical position.

[0057] 2C shows a side view of a second example replaceable interface plate 260 according to an embodiment of the present disclosure. The second replaceable interface plate 260 includes a step portion 232 and three substrate access ports 262, 264, 266 having varying widths and heights.

[0058] 2D shows a side view of a third example replaceable interface plate 270 according to an embodiment of the present disclosure. The third replaceable interface plate 270 includes a step portion 232 and two substrate access ports 272, 274 having the same width and height but different vertical positions.

[0059] In an embodiment, any of the first example replaceable interface panel 250 , the second example replaceable interface panel 260 , or the third example replaceable interface panel 270 may be attached to the host 200 .

[0060] FIG3 depicts a cross-sectional side view of a host 300 and an attached replaceable interface panel 330, taken at the location of a substrate access port 335 machined into the replaceable interface panel 330, according to an embodiment of the present disclosure. The host 300 includes a base 315, a frame face (including a portion of the base, beams 320, and a plurality of posts (not shown)), and a cover 325. The beams 320, base 315, and posts (not shown) define a frame (or frame face) for the face 310 of the host 300. The replaceable interface panel 330 is attached to the frame that frames the face 310 of the host 300.

[0061] The base 315 includes a lip 340 on its sidewall. The replaceable interface panel 330 includes a step 342 on its inner bottom surface, where the step 342 mates with the lip 340 on the sidewall of the base 315. As previously described, when the interior space 305 of the mainframe 300 is evacuated to a vacuum, forces 350 may be applied to the mainframe 300. These forces may be concentrated forces 352 experienced by the replaceable interface panel 330. As shown, the cover 325 may contact the replaceable interface panel 330 but may not contact the beam 320. For example, a small gap 354 may exist between the bottom of the cover 325 and the top of the beam 320. Therefore, forces are transmitted from the cover 325 to the lip 352 of the base 315 via the replaceable interface panel 330.

[0062] Cover 325 may include notches or grooves 346 into which O-rings may be inserted to ensure a seal between cover 325 and beam 320 (e.g., between the cover and the top of the frame including beam 320). Additionally, the frame of the machine surface to which replaceable interface plate 330 is attached (e.g., the sidewalls including beam 320, posts (not shown), and the base) may each include notches or grooves 344 into which O-rings may be inserted to ensure a seal between replaceable interface plate 330 and the frame.

[0063] In one embodiment, the replaceable interface plate 330 includes a lip 390 at the top of the inner surface of the replaceable interface plate 330. The beam 320 may include a corresponding step 392 that mates with the lip 390. Notably, the top of the step 392 does not contact the bottom of the lip 390. In other embodiments, the replaceable interface plate 330 does not include a lip, and the beam 320 does not include a step.

[0064] FIG4 depicts a cross-sectional side view of a host 400 and an attached replaceable interface panel 430, taken at the location of a column 420 of the host's frame, according to an embodiment of the present disclosure. The host 400 includes a base 415, a frame (including multiple base portions, multiple beams 421, and multiple columns 420), and a cover 325. A first portion of the base 415, a first beam (not shown), and columns 420 define a first frame face for the face 410 of the host 400. A second portion of the base 415, a second beam 421, columns 420, and a second column (not shown) define a second face frame for the second face. The replaceable interface panel 430 is attached to the frame that frames the face 410 of the host 400.

[0065] The base 415 includes a lip 440 on its sidewall. The replaceable interface panel 430 includes a step 442 on its inner bottom surface, where the step 442 mates with the lip 440 on the sidewall of the base 415. As previously described, when the interior of the mainframe 400 is evacuated to a vacuum, forces 450 may be applied to the mainframe 400. These forces may be concentrated forces 452 experienced by the replaceable interface panel 430. As shown, the cover 425 may contact the replaceable interface panel 430 but may not contact the frame. For example, a small gap 454 may exist between the bottom of the cover 425 and the top of the frame. Therefore, forces are transmitted from the cover 425 to the lip 442 of the base 415 via the replaceable interface panel 440.

[0066] Cover 425 may include a pair of notches or grooves 446, 448 into which O-rings may be inserted to ensure a seal between cover 425 and the frame. In one embodiment, notch 446 is approximately concentric with notch 448. Additionally, the frame of the machine surface to which replaceable interface plate 430 is attached (e.g., including the beam (not shown), posts 420, additional posts (not shown), and the sidewalls of the base) may each include a pair of notches or grooves 444, 445 into which O-rings may be inserted to ensure a seal between replaceable interface plate 430 and the frame. In some embodiments, notches 444 and 445 may be approximately concentric.

[0067] The area between notches 446 and 448 can be an intermediate vacuum area. Similarly, the area between notches 444 and 445 can be another intermediate vacuum area. Column 420 can include one or more channels (i.e., holes) that fluidically couple these intermediate vacuum areas to vacuum port 490. For example, column 420 can include vertical channel 452 that fluidically couples the intermediate vacuum area between notches 446 and 448 to vacuum port 490, and column 420 can further include horizontal channel 450 that fluidically couples the intermediate vacuum area between notches 444 and 445 to vertical channel 452.

[0068] Differential pumping can be performed to pump these intermediate vacuum regions to a pressure between the pressure of the interior space of the mainframe 400 and atmospheric pressure. A first O-ring can be positioned in the frame recess 445, with the outer surface of the first O-ring exposed to the external environment and the inner surface of the first O-ring exposed to the intermediate vacuum region. A second O-ring can be positioned in the frame recess 444, with the outer surface of the second O-ring exposed to the intermediate vacuum region and the inner surface of the second O-ring exposed to the interior space of the mainframe 400. The external environment has a first pressure, the intermediate vacuum region is maintained at a second pressure lower than the first pressure, and the interior space is maintained at a third pressure lower than the second pressure.

[0069] Also shown is a second frame surface perpendicular to the second surface of machine face 410. The second frame surface includes beams 421, posts 420, and base 415. A large opening 405 is framed by the second frame surface. As shown, recesses or grooves 460, 462 are machined into beams 421, base 415, and posts 420. Recesses 460, 462 each receive an O-ring to seal an additional, replaceable interface panel (not shown) to the second surface of mainframe 400. The frame (or frame surface) of machine face 410 may further include one or more additional channels in posts 420 that are fluidically coupled to channel 452. These additional one or more channels may fluidically couple the intermediate vacuum region between recesses 460, 462 to vacuum port 490.

[0070] The additional frame (or frame face) of the mainframe may also include channels drilled or otherwise formed therein. These channels may connect to additional intermediate vacuum regions between other pairs of notches / O-rings. These channels may be fluidically coupled to channels 452 in posts 420 and, therefore, to vacuum ports 490. The frame (or frame face) of machine face 410 may further include one or more additional channels in beams 421, and / or additional beams (not shown), and / or base 415, which are fluidically coupled to one or more channels in posts 420. These channels may further be fluidically coupled to one or more additional channels in additional posts, which further fluidically connect the intermediate vacuum regions to vacuum ports 490.

[0071] In one example, a first frame (or first frame face) includes a first column on a first side of the first face, a second column on a second side of the first face, and a first beam connecting the first column to the second column. A second frame (or second frame face) includes a first column on a first side of the second face, a third column on a second side of the second face, and a second beam connecting the first column to the third column. A third frame (or third frame face) includes a second column on a first side of the third face, a fourth column on a second side of the third face, and a third beam connecting the second column to the fourth column. A fourth frame (or fourth frame face) includes a third column on a first side of the fourth face, a fourth column on a second side of the fourth face, and a fourth beam connecting the third column to the fourth column.

[0072] The first frame may include one or more first channels in the first column, wherein the one or more first channels fluidly couple the first intermediate vacuum region to the vacuum port. The first frame may further include one or more second channels in the first beam, wherein the one or more second channels are fluidly coupled to the one or more channels in the first column.

[0073] The first frame may further include one or more third channels in the second column, the one or more third channels fluidly coupled to the one or more second channels in the beam. The one or more third channels may fluidly couple the vacuum port to an additional intermediate vacuum region between a pair of O-rings disposed on an outer surface of the second frame.

[0074] Alternatively or additionally, the third frame may include one or more additional channels in the third beam of the third frame. Additionally, the third frame may include one or more additional channels in the fourth column that fluidly couple one or more intermediate vacuum regions between the additional pairs of O-rings to the vacuum port.

[0075] Vacuum port 490 can be coupled to a vacuum pump (not shown). Differential pumping can be implemented to reduce pressure differentials across the O-rings. O-rings can have large linear surfaces (for example, in embodiments where the machine face may have a length of up to approximately 130 or 150 inches and a height of approximately 20 to 50 inches). This can increase leakage across the O-rings and reduce sealing capabilities. By using differential pumping, the leak rate can be significantly reduced. In embodiments, a single vacuum port 490 can be fluidically coupled to the intermediate vacuum region between all pairs of O-rings between the mainframe and the cover and replaceable interface plate. These connections can be made by drilling channels (i.e., holes) into one or more beams and / or columns of one or more frames of the mainframe 400. Connections to vacuum port 490 can be provided without the use of plugs, transverse drilling, or welding (e.g., plug welding). This can improve the operation of differential pumping by minimizing additional potential leak points.

[0076] In other embodiments, multi-stage differential pumping is used, which may include multiple sets of three concentric notches or grooves, each with its own O-ring, and two adjacent intermediate vacuum regions.

[0077] FIG5 illustrates a method 500 for assembling a reconfigurable host computer for an electronic component manufacturing system, according to an embodiment of the present disclosure. Some operations of method 500 may be performed by processing logic, which may be executed on a computing device, such as a general-purpose computer. For example, some operations may be performed using computer-aided drawing and / or computer-aided manufacturing (CAM) software installed on the computer.

[0078] At block 502 of method 500 , a mainframe configuration is determined, including determining a first plurality of process chambers to be coupled to a first side of the mainframe. Additionally, load locks and / or process chambers to be connected to one or more other sides of the mainframe may be determined.

[0079] At block 504, the locations of substrate access ports appropriate for the determined mainframe configuration (e.g., to accommodate access to each of the process chambers and / or load locks) may be determined. At block 506, the configuration of one or more replaceable interface panels may be determined. The replaceable interface panels may be configured to have substrate access ports at each of the determined locations.

[0080] At block 508, the replaceable interface panel can be fabricated. This may include machining metal (e.g., aluminum) and / or applying a surface treatment to at least a portion of the replaceable interface panel. At block 510, the replaceable interface panel is attached to the mainframe (transfer chamber). This may include bolting or screwing the replaceable interface panel to a frame on an appropriate machine surface of the mainframe. At block 512, the determined process chamber and / or load lock can then be attached to the appropriate interface panel in the determined configuration.

[0081] Engineers may decide on a new configuration for the mainframe at any time. In this case, method 500 may be repeated. For example, a second plurality of process chambers may be determined to be coupled to the first face of the mainframe, new locations for a second plurality of substrate access ports may be determined on the face that will accommodate the second plurality of process chambers, a configuration for a second replaceable interface plate having one of the second plurality of substrate access ports at each of the new locations may be determined, and the second replaceable interface plate may be manufactured. The second replaceable interface plate may have at least one of the following: a) a different number of substrate access ports than the first replaceable interface plate; b) one or more substrate access ports positioned differently than the plurality of substrate access ports in the first replaceable interface plate; c) one or more substrate access ports of a different size than the plurality of substrate access ports in the first replaceable interface plate; d) a different type of slit valve than the first replaceable interface plate; or e) a different type of local center probe than the first replaceable interface plate.

[0082] Prior to block 510, the existing process chambers may be removed from the first replaceable interface board, and then the first replaceable interface board may be removed from the mainframe. Subsequently, the operations of blocks 510 and 512 may be performed to provide the mainframe with a completely new configuration (e.g., with a different number of substrate access ports, substrate access ports in different locations, a different number and / or type of process chambers, etc.).

[0083] In the foregoing description, numerous specific details are set forth, such as specific materials, dimensions, and process parameters, to provide a thorough understanding of the present disclosure. Specific features, structures, materials, or characteristics may be combined in any suitable manner in one or more embodiments. The terms "example" or "exemplary" are used herein to indicate serving as an example, instance, or illustration. Any aspect or design described herein as "example" or "exemplary" is not necessarily to be construed as preferred or advantageous over other aspects or designs. Rather, the use of the terms "example" or "exemplary" is intended merely to present concepts in a concrete manner. As used in this application, the term "or" is intended to represent an inclusive "or," not an exclusive "or." That is, unless otherwise specified or clear from the context, "X includes A or B" is intended to represent any of the natural inclusive permutations. That is, if X includes A; X includes B; or X includes both A and B, then "X includes A or B" is satisfied in any of the foregoing cases. References throughout this specification to "an embodiment," "some embodiments," or "one embodiment" mean that a particular feature, structure, or characteristic described in connection with the embodiment is included in at least one embodiment. Thus, the appearances of the phrases "an embodiment," "some embodiments," or "one embodiment" throughout this specification are not necessarily all referring to the same embodiment.

[0084] The present disclosure has been described with reference to specific exemplary embodiments thereof. Accordingly, the specification and drawings are to be regarded in an illustrative rather than a restrictive sense. Various modifications of the present disclosure in addition to those shown and described herein will become apparent to those skilled in the art and are intended to fall within the scope of the appended claims.

[0085] 100A: First structure 102:Factory Interface 104:Host 106: Process chamber 108: Process chamber 110: Process chamber 112: Process chamber 114: Process chamber 116: Process chamber 118:FOUP 125: Process chamber 126: Load lock chamber 127: Process chamber 129: Replaceable interface panel 131: Replaceable interface panel 132: substrate in and out port 134: Interior Space 136:Robot Arm 138:Robot components 140:Substrate 171:Controller 200: Host 201:Framework 206: Base 215:O-ring 220:O-ring 230: Replaceable interface panel 232: Steps 234: substrate inlet and outlet port 250: Replaceable interface panel 252: substrate inlet and outlet port 254: substrate in and out port 256: substrate in and out port 260: Replaceable interface panel 262: Substrate inlet and outlet port 264: substrate in and out port 266: Substrate inlet and outlet port 270: Replaceable interface panel 272: Substrate inlet and outlet port 274: Substrate inlet and outlet port 300: Host 305: Interior Space 310: Machine surface 315: Base 320: Liang 325: Cover 330: Replaceable interface panel 335: substrate inlet and outlet port 340: Lips 342: Step 344: Notch or groove 346: Notch or groove 350: Strength 352: Concentration 354: Gap 390: Lips 392: Steps 400:Host 405: Opening 410: Machine surface 415: Base 420: column 425: Cover 430: Replaceable interface panel 440: Lips 442: Step 444: Notch or groove 445: Notch or groove 446: Notch or groove 448: Notch or groove 450: Strength 452: Channel 454: Gap 460: Notch or groove 462: Notch or groove 490: Vacuum port 500:Method 502: Box 504: Box 506: Box 508: Box 510: Box 512: Box 100B: Second structure 100C: The third structure 101A: Machine surface 101B: Machine surface 101C: Machine surface 101D: Machine surface 128A: Replaceable interface panel 128B: Replaceable interface panel 128C: Replaceable interface board 130A: Replaceable interface panel 204A: Column 204B: Column 204C: Column 204D: Column 208A: Liang 208B: Beam 208C: Beam 208D: Beam 210A: Lips 210B: Lips

[0086] Domestic storage information (please note the order of storage institution, date, and number) none Overseas deposit information (please note the order of deposit country, institution, date, and number) none

Claims

1. A host computer for a component manufacturing system, comprising: A base; A plurality of machine faces on the base, wherein a first machine face of the plurality of machine faces includes a first frame; a cover above the plurality of machine faces, wherein the base, the cover, and the plurality of machine faces together define an interior space; a robotic arm in the interior space; and a replaceable interface panel attached to the first frame of the first machine face, the replaceable interface panel including a substrate inlet / outlet port and a local center probe disposed at the substrate inlet / outlet port, wherein the robotic arm is configured to convey one or more substrates through the substrate inlet / outlet port, and the local center probe is configured to determine the position of the one or more substrates conveyed through the substrate inlet / outlet port.

2. The host as claimed in claim 1, wherein the local center probe includes one or more light-emitting diodes (LEDs) for detecting the presence of one or more substrates.

3. The host as claimed in claim 1, wherein the replaceable interface panel further includes a slit valve at the inlet / outlet port of the substrate.

4. The host as claimed in claim 3, wherein the replaceable interface further includes a first gate and a second gate, the first gate being located inside the replaceable interface at the substrate port, and the second gate being located outside the replaceable interface at the substrate port.

5. The host as claimed in claim 3, wherein the replaceable interface further includes a second substrate port and a second local center probe disposed at the second substrate port, wherein the robotic arm is configured to transfer one or more substrates through the second substrate port, and the second local center probe is configured to determine the position of the one or more substrates transferred through the second substrate port.

6. The host as claimed in claim 3, wherein the host is configured to operate in a vacuum, wherein the first frame of the first face is not supported, and wherein the replaceable interface panel is supported.

7. The host as claimed in claim 6, wherein the replaceable interface panel bears a vertical force acting on the host caused by a pressure difference between the internal space of the host and an exterior of the host.

8. The host as claimed in claim 6, wherein the replaceable interface panel includes a stepped portion on an inner bottom surface of the replaceable interface panel, wherein the stepped portion engages with a lip on a side wall of the base, and wherein a vertical force is transmitted from the replaceable interface panel to the base at an interface between the stepped portion and the lip.

9. The host as claimed in claim 1, wherein the first facet has a first length, the first length being at least twice the second length of a second facet among the plurality of facets.

10. The host as claimed in claim 9, wherein the host has a rectangular shape, wherein the plurality of machine faces includes four machine faces, and wherein the second machine face is perpendicular to the first machine face.

11. The host as claimed in claim 10, wherein the second facet includes a second frame, a third facet includes a third frame, and a fourth facet includes a fourth frame, the host further comprising: A second interface panel, the second interface panel being sealed to the second frame of the second machine surface; A third interface panel, the third interface panel being sealed to the third frame of the third machine surface; and a fourth interface panel, the fourth interface panel being sealed to the fourth frame of the fourth machine surface.

12. The host as described in claim 1, wherein the robotic arm is an off-axis robotic arm.

13. The host as claimed in claim 1, wherein the replaceable interface panel is interchangeable with a plurality of additional replaceable interface panels having at least one of the following: a) a number of substrate ports different from those of the replaceable interface panel; b) one or more substrate ports located in a position different from those of the substrate ports in the replaceable interface panel; c) one or more substrate ports of a size different from those of the substrate ports in the replaceable interface panel; d) a slit valve of a type different from those of the replaceable interface panel; or e) a local center probe of a type different from those of the replaceable interface panel.

14. The host as claimed in claim 1, wherein the replaceable interface panel is attached to the first frame of the first faceplate, and the replaceable interface panel is engaged with the base.

15. The host as claimed in claim 1, wherein the cover engages with a top surface of the replaceable interface panel, wherein there is a gap between the cover and the top surface of the first frame of the first device face such that the cover does not contact the first frame of the first device face.

16. A replaceable interface panel for attachment to a front panel of a host computer, the replaceable interface panel comprising: A first substrate inlet / outlet port is configured to provide a passage from the host to a first process chamber; and a first local center detector disposed at the first substrate inlet / outlet port, wherein the first local center detector is configured to determine the position of one or more substrates being transmitted through the first substrate inlet / outlet port.

17. The replaceable interface panel as described in claim 16, further comprising: A second substrate inlet / outlet port is configured to provide a passage from the host to a second process chamber; and a second local center detector disposed at the second substrate inlet / outlet port, wherein the second local center detector is configured to determine the position of the one or more substrates being transmitted through the second substrate inlet / outlet port.

18. The replaceable interface panel as claimed in claim 16, wherein the replaceable interface panel is for the host to carry, and wherein the replaceable interface panel is configured to withstand vertical forces acting on the host caused by a pressure difference between an interior space of the host and an exterior of the host.

19. The replaceable interface panel as described in claim 16, further comprising: A stepped portion on an inner bottom surface of the replaceable interface panel, wherein the stepped portion is configured to mate with a lip on a side wall of a base of the host.

20. The replaceable interface panel as claimed in claim 16, wherein the replaceable interface panel is configured to be attached to a frame on the front of the host, and the replaceable interface panel is engaged with a base of the host.

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