Chip package, computing system, artificial intelligenceequipment, and information transmitting method

Abstract

This application relates to an optical interconnect, a chip package, a computing system, and an artificial intelligence device. Specifically, an optical interconnect includes a first optical distribution tree, which includes an optical input port and multiple optical output ports. The first optical distribution tree is configured to distribute light from the optical input port to the multiple optical output ports, each of which includes a first optical output port and a second optical output port. It also includes multiple optical propagation links, each of which includes an optical transmitter, a second optical distribution tree, and multiple optical receivers. The second optical distribution tree is configured to form an optical information transmission channel between the optical transmitter and the multiple optical receivers. Each optical propagation link includes a first optical propagation link and a second optical propagation link, with the first optical propagation link coupled to a first optical output port and the second optical propagation link coupled to a second optical output port.

Description

Technical Field

[0001] This application relates to the field of chips, and particularly to an optical interconnect, a chip package, a computing system, and an artificial intelligence device. Prior Art

[0002] Computations performed on electronic data encoded in analog or digital form of electrical signals are typically implemented using electronic computing hardware, such as in integrated circuits (e.g., processors, application-specific integrated circuits (ASICs), or systems-on-a-chip (SoCs)), electronic circuit boards, or other electronic circuits. The use of optical signals in computing systems is subject to many limitations. Summary of the Invention

[0003] According to one aspect of the present invention, an optical interconnect is provided, including a first optical distribution tree, the first optical distribution tree including an optical input port and a plurality of optical output ports, the first optical distribution tree being configured to distribute the light from the optical input port to the plurality of optical output ports, the plurality of optical output ports including a first optical output port and a second optical output port; and a plurality of optical propagation links, each optical propagation link of the plurality of optical propagation links including an optical transmitter, a second optical distribution tree, and a plurality of optical receivers, the second optical distribution tree being configured to form an optical information transmission channel between the optical transmitter and the plurality of optical receivers; wherein, the plurality of optical propagation links include a first optical propagation link and a second optical propagation link, the first optical propagation link is coupled to the first optical output port, the second optical propagation link is coupled to the second optical output port, the optical transmitter of the first optical propagation link is configured to receive the light of the first optical output port, and the optical transmitter of the second optical propagation link is configured to receive the light of the second optical output port.

[0004] In some embodiments, the optical transmitter of the first optical propagation link is configured to modulate the received light from the first optical output port and send the modulated optical signal to the corresponding second optical distribution tree; and the optical transmitter of the second optical propagation link is configured to modulate the received light from the second optical output port and send the modulated optical signal to the corresponding second optical distribution tree.

[0005] In some embodiments, for each of the optical propagation links, the optical transmitter is configured to receive a first electrical signal and generate an optical signal for transmission according to the first electrical signal, where the first electrical signal carries information to be transmitted, and each of the optical receivers is configured to generate a second electrical signal according to the received optical signal.

[0006] In some embodiments, in the optical transmission direction of the optical propagation link, the second optical distribution tree includes a first bending portion, a second bending portion, and a third bending portion, and further includes a first optical splitter located between the first bending portion and the second bending portion, and a second optical splitter after the third bending portion.

[0007] In some embodiments, the optical receiver includes a photodiode to generate the second electrical signal according to the received optical signal.

[0008] In some embodiments, the first optical distribution tree includes a plurality of optical splitters.

[0009] In some embodiments, the optical splitter includes at least one of a Y-shaped beam splitter, a multimode interferometer, and a directional coupler.

[0010] In some embodiments, the second optical distribution tree includes a plurality of optical splitters.

[0011] In some embodiments, the optical splitter includes at least one of a Y-shaped beam splitter, a multimode interferometer, and a directional coupler.

[0012] In some embodiments, the optical interconnect is a photonic integrated circuit chip.

[0013] According to one aspect of the present invention, a wafer package is provided, including the optical interconnect as described above, and a first wafer including a plurality of clusters, each of the clusters including a plurality of cores; wherein, for each of the cores of the plurality of clusters, the optical interconnect is configured to provide an information transmission channel between the core and each of the plurality of clusters.

[0014] In some embodiments, each of the clusters includes a telecommunication signal receiving port; the multiple optical propagation links of the optical interconnect respectively correspond to the multiple cores of the multiple clusters, such that each core in the multiple clusters is coupled to one of the optical propagation links; each of the optical propagation links is configured to be coupled to one core among the multiple cores in the multiple clusters and to each of the multiple clusters to provide an information transmission channel between the core and the telecommunication signal receiving port of each of the multiple clusters; for each of the optical propagation links, the optical transmitter is configured to receive a first telecommunication signal and generate an optical signal for transmission according to the first telecommunication signal, wherein the first telecommunication signal carries information to be transmitted from one of the cores, and each of the multiple optical receivers is coupled to one of the multiple clusters, and each of the optical receivers is configured to generate a second telecommunication signal according to the received optical signal to provide information transmitted to the corresponding cluster.

[0015] In some embodiments, the optical interconnect carries the first chip.

[0016] According to one aspect of the present invention, there is provided a chip package, including an optical interconnect and a chip; wherein the optical interconnect carries the chip.

[0017] According to one aspect of the present invention, there is provided an artificial intelligence device, including a chip package.

[0018] According to one aspect of the present invention, there is provided a computing system, including a chip package.

[0019] According to one aspect of the present invention, an information transmission method is provided. The method uses an optical interconnect for information transmission, where the optical interconnect includes: a first optical distribution tree, the first optical distribution tree including an optical input port and a plurality of optical output ports, the first optical distribution tree being configured to distribute the light from the optical input port to the plurality of optical output ports, the plurality of optical output ports including a first optical output port and a second optical output port; and a plurality of optical propagation links, each optical propagation link in the plurality of optical propagation links including an optical transmitter, a second optical distribution tree, and a plurality of optical receivers, the second optical distribution tree being configured to form an optical information transmission channel between the optical transmitter and the plurality of optical receivers; the plurality of optical propagation links including a first optical propagation link and a second optical propagation link, the first optical propagation link being coupled to the first optical output port, the second optical propagation link being coupled to the second optical output port, the optical transmitter of the first optical propagation link being configured to receive the light of the first optical output port, and the optical transmitter of the second optical propagation link being configured to receive the light of the second optical output port; The information transmission method includes: Providing light to the optical input port of the first optical distribution tree so that the first optical distribution tree distributes the light from the optical input port to the plurality of optical output ports, the plurality of optical output ports including a first optical output port and a second optical output port; The optical transmitter of the first optical propagation link receives a first electrical signal, and the first electrical signal carries the information to be transmitted; The optical transmitter of the first optical propagation link receives the light from the first optical transmission port and modulates the light from the first optical transmission port according to the first electrical signal to generate an optical signal for transmission; and The second optical distribution tree of the first optical propagation link distributes the modulated optical signal to the corresponding plurality of optical receivers.

[0020] In some embodiments, each of the optical receivers of the first optical propagation link generates a second electrical signal according to the received optical signal.

[0021] In some embodiments, the information to be transmitted carried by the first electrical signal comes from a first core of a first cluster among a plurality of clusters of a first chip; the plurality of optical receivers respectively correspond to the plurality of clusters; each of the optical receivers generates a second electrical signal according to the received optical signal to provide the information transmitted to the corresponding cluster.

[0022] Embodiments of the present invention can enable the cores in a cluster to independently send information in the form of light through optical interconnects, and then propagate the information in the form of light to multiple clusters. It is applicable to simply control the cores to send information to the clusters or transmit information, and also has advantages such as simplifying the interface layout. In addition, information can be further transmitted to the cores inside the cluster through the cluster. In some embodiments, in the information transmission channel from the core to the cluster, an optical interconnect can be used to provide an optical information transmission channel. After the cluster receives the information from the optical interconnect, it is then transmitted to multiple cores in the cluster through electrical signals, so as to transmit the information from one core through the cluster and then to a core in the cluster. In addition, light can be distributed to some optical propagation links through a first optical distribution tree to optimize the input of light. The advantages also include delivering light to different suitable positions through the layout of the second optical distribution tree to adapt to, for example, the location distributions of different clusters.

[0023] Aspects, features, advantages, etc. of the embodiments of the present invention will be specifically described below in conjunction with the accompanying drawings. According to the following specific description in conjunction with the accompanying drawings, the above aspects, features, advantages, etc. of the present invention will become clearer. Brief Description of the Drawings

[0024] FIG. 1 is a side view of a chip package in an embodiment of the present invention.

[0025] FIG. 2 is a schematic diagram of a first chip in an embodiment of the present invention.

[0026] FIG. 3 is a schematic diagram of a cluster in an embodiment of the present invention.

[0027] FIG. 4 is a schematic diagram of an optical propagation link in an embodiment of the present invention.

[0028] FIG. 5 shows a schematic diagram of the connection relationship of devices in a first optical distribution tree.

[0029] FIG. 6 shows a schematic diagram of the approximate positions and connection relationships of devices in an optical propagation link. Embodiments

[0030] For the convenience of understanding the various aspects, features, and advantages of the technical solution of the present invention, the present invention will be specifically described below in conjunction with the accompanying drawings. It should be understood that the following various embodiments are only for illustrative purposes and are not used to limit the protection scope of the present invention.

[0031] The above description is only an overview of the technical solution of the present invention. In order to better understand the technical means of the present invention, it can be implemented according to the content of the specification. And in order to make the above and other purposes, features and advantages of the present invention more obvious and understandable, the following preferred embodiments are given, and together with the accompanying drawings, the details are described as follows.

[0032] Unless otherwise defined, the technical terms or scientific terms used in this disclosure should have the ordinary meaning understood by those of ordinary skill in the field to which this disclosure belongs. The "first", "second" and similar terms used in this disclosure do not indicate any order, quantity or importance, but are only used to distinguish different components.

[0033] When the number of a component or element is not specifically indicated in the following text of the embodiments of this disclosure, it means that the component or element can be one or more, or can be understood as at least one. "At least one" means one or more, and "a plurality" means at least two.

[0034] To make the purpose, features and advantages of the present invention more obvious and understandable, the present invention will be further described in detail below in conjunction with the accompanying drawings and specific implementation manners.

[0035] In FIG. 1, a chip package 1000 is shown, which includes a first chip 100 and an optical interconnect 300. Optionally, the chip package 1000 further includes a substrate 500. The first chip 100 is mounted on the optical interconnect 300, and the optical interconnect 300 can be used to carry the first chip 100. The substrate 500 is used to carry the optical interconnect 300 and the first chip 100. The first chip 100 can be electrically connected to the optical interconnect 300 through bonding layers 1041 and 1042. Exemplarily, the optical interconnect 300 communicates with the first chip 100 through the bonding layers 1041 and 1042. For example, the optical interconnect 300 receives an electrical signal from the first chip 100 through the bonding layer 1041 and sends an electrical signal to the first chip 100 through the bonding layer 1042. Exemplarily, the first chip 100 can be a bare chip, for example.

[0036] Exemplarily, the chip package 1000 includes one or more chips, and the optical interconnect 300 can carry at least one chip, for example, carry the first chip 100.

[0037] In FIG. 2, it is shown that the first chip 100 includes 8 clusters, namely clusters 112a, 112b, 112c, 112d, 112e, 112f, 112g, and 112h.

[0038] One of the clusters 112a is shown in FIG. 3. The cluster 112a includes multiple cores. FIG. 3 shows that the cluster 112a includes 8 cores. For the first chip 100, it may include multiple clusters, and each cluster includes multiple cores. Among them, for each of the cores of the multiple clusters, the optical interconnect is configured to provide an information transmission channel between this core and each of the multiple clusters. Exemplarily, each of the clusters includes a telecommunications signal receiving port, and the optical interconnect is configured to provide an information transmission channel between this core and the telecommunications signal receiving ports of each of the multiple clusters.

[0039] In this example, the first chip 100 includes 8 clusters, and each cluster includes 8 cores. That is, the first chip 100 has a total of 64 cores. The core can be, for example, a computing core (or a processing core) to perform computing functions. Exemplarily, for the core A01 in the cluster 112a, the optical interconnect 300 is configured to provide an information transmission channel between this core A01 and each of the multiple clusters. This core A01 can transmit information to each of the 8 clusters (i.e., clusters 112a to 112h), and can further transmit information to each core inside the cluster through the cluster.

[0040] FIG. 4 shows an optical propagation link 330, which schematically shows the connection relationship of each device. In some embodiments, the optical interconnect 300 includes multiple optical propagation links 330, corresponding to the multiple cores of the multiple clusters respectively, so that each core of the multiple clusters is coupled to one of the optical propagation links 330; each optical propagation link is configured to be coupled to one of the multiple cores of the multiple clusters and coupled to each of the multiple clusters to provide an information transmission channel between this core and each of the multiple clusters (for example, between this core and the telecommunications signal receiving port of each cluster). Exemplarily, the optical interconnect 300 includes 64 optical propagation links corresponding to the 64 cores of the first chip 100. Each core is coupled to one of the 64 optical propagation links, and this optical propagation link is also coupled to each of the 8 clusters to provide an information transmission channel between this core and each of the 8 clusters. Thus, each core can independently send information in the form of light through the corresponding optical transmitter in the optical interconnect, and then propagate the information in the form of light to the cluster.

[0041] Embodiments of the present invention establish an optical propagation channel or information propagation mode that matches the core to the cluster. In addition, unnecessary input and output ends can be reduced, and the requirement for the number of waveguides for core-core optical waveguide connections can be reduced.

[0042] In some embodiments, each of the optical propagation links 330 includes an optical transmitter 331, an optical distribution tree 332, and a plurality of optical receivers, such as optical receivers 333a, 333b, 333c, 333d, 333e, 333f, 333g, and 333h in FIG. 3. The optical distribution tree 332 is configured to form an optical information transmission channel between the optical transmitter and the plurality of optical receivers (333a-333h). And for each of the optical propagation links 330, the optical transmitter is configured to receive a first electrical signal and generate an optical signal for transmission according to the first electrical signal, where the first electrical signal carries information to be transmitted from one of the cores. Each of the plurality of optical receivers is coupled to one of the plurality of clusters, and each of the optical receivers is configured to generate a second electrical signal according to the received optical signal to provide information transmitted to the corresponding cluster. Exemplarily, taking the optical propagation link 330 corresponding to core A01 as an example, it includes 1 optical transmitter 331, an optical distribution tree 332, and 8 optical receivers (333a-333h). The optical distribution tree 332 is configured to form an optical information transmission channel between the optical transmitter 331 and the 8 optical receivers (333a-333h). The 8 optical receivers output the information carried by the second electrical signal. The second electrical signal of the optical receiver can be directly output to the corresponding cluster to transmit information, or can be output to the corresponding cluster to transmit information after being converted into an electrical signal (such as being converted into a third electrical signal).

[0043] In some embodiments, the optical transmitter generates an optical signal carrying the information by modulation according to the first electrical signal. For example, the optical transmitter 331 includes a modulator, which can modulate an initial optical signal that does not carry information according to the first electrical signal. The initial optical signal can come from waveguide 351, and the modulated optical signal, that is, the optical signal carrying the information, is output to the optical distribution tree 332 through waveguide 352. Exemplarily, light from a light source (not shown) can be coupled to waveguide 351 through a grating coupler.

[0044] Exemplarily, the optical distribution tree 332 may include optical splitters. Seven optical splitters, namely, optical splitters 341 to 347, are shown in FIG. 4. The optical splitter may include at least one of a Y-shaped beam splitter, a multi-mode interferometer (MMI), and a directional coupler. The optical splitter can distribute the input light. For example, the optical splitter 341 distributes the input light and outputs it according to 50%:50%. In the figure, the coupling (connection) between the optical splitters is achieved through waveguide connections. For example, the optical splitter 341 is connected to the optical splitters 342 and 343 through waveguides 353 and 354 respectively. The optical splitters 344, 345, 346, and 347 are respectively connected to the corresponding optical receivers through waveguides. For example, the optical splitter 344 is connected to the optical receivers 333a and 333b through waveguides 355 and 356 respectively. Exemplarily, the optical splitters 341 to 347 all distribute the input light according to 50%:50%. Thus, 1 / 8 (i.e., 12.5% optical power) of the light input to the optical distribution tree 332 via the waveguide 352 is output to each optical receiver. For example, the optical receiver 333a receives 1 / 8 = 12.5% of the input light of the optical distribution tree 332 via the waveguide 353. For the first chip 100, it includes 8 clusters, and each cluster includes 8 cores. That is, the first chip 100 has a total of 64 cores. The optical interconnect 300 includes 64 optical propagation links 330 corresponding to the 64 cores of the first chip 100. Each core is coupled to one of the 64 optical propagation links 330, and this optical propagation link 330 is also coupled to each of the 8 clusters to provide an information transmission channel between the core and each of the 8 clusters. Each cluster may include a telecommunications signal receiving port to receive the telecommunications signal output from the optical receiver. For example, for the optical propagation link 330 corresponding to core A01, cluster 112a corresponds to the optical receiver 333a to receive information from core A01, and cluster 112b corresponds to the optical receiver 333b to receive information from core A01. In order to enable each core to send information, each core may include a telecommunications signal sending port, that is, 64 cores respectively correspond to 64 telecommunications signal sending ports; in order to enable each cluster to be configured to receive information from 64 cores, each cluster may include 64 telecommunications signal receiving ports (corresponding to 64 cores), and a total of 64×8 = 512 telecommunications signal receiving ports are provided for the 8 clusters. Exemplarily, since there is no need to design the direct core-to-core interconnection of the optical interconnect (which requires 64×64 ports), this can reduce the number of interfaces between the optical interconnect and the first chip, especially reducing the design requirements for the transmitter interface, while ensuring the core-to-cluster transmission requirements and taking into account the requirements for the cluster to re-transmit to the cores within the cluster.

[0045] In some embodiments, each of the multiple clusters is configured to: propagate the received information from the optical interconnect via an electrical signal to the multiple cores of the cluster. Thus, in the information transmission channel where the core transmits to the cluster, an optical interconnect can be used to provide an optical information transmission channel. After the cluster receives the information from the optical interconnect, it is then transmitted to the multiple cores within the cluster via an electrical signal, so as to transmit the information from one core to a core in the cluster. Each core can independently send information in the form of light through the corresponding optical transmitter in the optical interconnect. In this process, an optical signal propagation process and an electrical signal propagation process within the cluster are experienced successively.

[0046] In some embodiments, each of the multiple clusters is configured to: receive a second electrical signal from the optical interconnect and propagate the information carried by the second electrical signal to the multiple cores of the cluster via an electrical signal. Exemplarily, taking cluster 112a among the multiple clusters as an example, cluster 112a receives a second electrical signal from the optical interconnect. Within cluster 112a, the information carried by the second electrical signal is propagated to multiple cores, namely cores A01 to A08 (a total of 8 cores) via an electrical signal. Similarly, clusters 112b to 112h also each receive a corresponding second electrical signal carrying information, and then within each cluster, the information is transmitted to the multiple cores within the cluster in the form of an electrical signal.

[0047] In some embodiments, in order for the cluster to receive and read an appropriate electrical signal, the second electrical signal can be converted into a third electrical signal, and the third electrical signal is output to the corresponding cluster. The above conversion can be implemented by an output electrical signal conversion circuit, and the third electrical signal can be suitable for the cluster to receive. Exemplarily, the electrical signal conversion circuit can be provided in a signal conversion chip. Exemplarily, chip package 1000 can include a signal conversion chip, and the signal conversion chip includes the output electrical signal conversion circuit.

[0048] In some embodiments, the optical transmitter generates an optical signal carrying the information by modulation according to the first electrical signal.

[0049] In some embodiments, the multiple cores of the multiple clusters are configured to work together to solve the execution problem of artificial intelligence workloads.

[0050] In some embodiments, the multiple cores of the multiple clusters are configured to work together to process tensors, and each core is configured to work on different parts of a given tensor.

[0051] In some embodiments, the plurality of clusters includes a first cluster, and the first cluster includes a first core and a second core. The chip package is configured to: execute a first part of a computing task at the first core to generate a first result; and execute a second part of the computing task at the second core to generate a second result. For example, core A01 (denoted as the first core) in cluster 112a executes the first part of the computing task, and core A02 (denoted as the second core) executes the second part of the computing task at the second core.

[0052] In some embodiments, alternatively, some of the 8 clusters in FIG. 2 are located on a first chip, and some are located on a second chip. Optical interconnects are used for information transmission between multiple cores and clusters. Exemplarily, the plurality of clusters are not distributed on the first chip, and the plurality of clusters are respectively distributed on multiple chips. Optical interconnects are used to carry the multiple chips for information transmission between multiple cores and clusters.

[0053] In an exemplary embodiment, the chip package includes: multiple chips, with the plurality of clusters distributed on the multiple chips, each chip including at least one of the plurality of clusters, and each of the clusters including multiple cores; optical interconnects; wherein, for each core of the plurality of clusters, the optical interconnects are configured to provide an information transmission channel between the core and each of the plurality of clusters. Exemplarily, the optical interconnects carry the multiple chips. Exemplarily, a substrate carries the multiple chips and the optical interconnects.

[0054] The interconnect 300 may include a photonic integrated circuit, the photonic integrated circuit may include an optical propagation link 330, and the optical interconnect 300 may be a photonic integrated circuit chip, for example, manufactured using semiconductor processes.

[0055] Either the optical interconnect 300 or the optical propagation link 330 may include at least one photonic device such as an optical coupling structure, a waveguide, an optoelectronic conversion unit, an electro-optic conversion unit, a splitter, and a light source. The number of various photonic devices can be configured as needed and can be one or more. Among them, the optical transmitter of the optical propagation link 330 may include an electro-optic conversion unit, and the optical receiver may include an optoelectronic conversion unit. Exemplarily, the electro-optic conversion unit may include a modulator to convert an electrical signal into an optical signal. Exemplarily, the optical coupling structure can be used to optically couple with a laser or an optical fiber to input an optical signal into the optical interconnect 300 or output an optical signal from the optical interconnect 300. For example, an optical fiber is used for input and output of optical signals; the optical coupling structure may include a grating coupler, an end face coupler, etc. Exemplarily, the waveguide can be used to propagate optical signals and serve as a channel for information propagation. Exemplarily, the optoelectronic conversion unit may include a photodetector for converting an optical signal into an electrical signal, and the photodetector may include, for example, a photodiode. Exemplarily, the optical interconnect 300 includes a light source, and the light generated by the light source can be coupled to the waveguide and can also be modulated by an electrical signal.

[0056] In an exemplary embodiment, an artificial intelligence device is proposed, including the chip package.

[0057] In an exemplary embodiment, a computing system is proposed, including the chip package.

[0058] In an exemplary embodiment, an information transmission method is proposed, including: The optical interconnect receives a first electrical signal, and the first electrical signal carries information to be transmitted from a first core of a first cluster among multiple clusters; and The optical interconnect propagates the information through an optical propagation link, where the optical propagation link includes an optical transmitter, an optical distribution tree, and multiple optical receivers; Among them, the propagating the information through the optical propagation link includes: the optical transmitter receives the first electrical signal and generates an optical signal for transmission according to the first electrical signal, the optical distribution tree distributes the light from the optical transmitter to multiple optical receivers, and each of the multiple optical receivers is coupled to one of the multiple clusters, where each optical receiver generates a second electrical signal according to the received optical signal to provide the information transmitted to the corresponding cluster.

[0059] The information transmission method can be implemented according to the chip package in the embodiments of the present invention and may include corresponding functional methods (steps) that the chip package can implement.

[0060] FIG. 5 shows a first optical distribution tree 310. The first optical distribution tree 310 can be used to input light to at least two of a plurality of optical propagation links to provide an initial optical signal for the optical propagation links, and can be modulated to generate an optical signal carrying information. To show the difference, the optical distribution tree in the optical propagation link is named "second optical distribution tree".

[0061] In FIG. 5, the first optical distribution tree 310 includes an optical input port 301. The first optical distribution tree 310 distributes the light from the optical input port 301 to a plurality of optical output ports 305a, 305b, 305c, 305d, 305e, 305f, 305g, and 305h (305a~h).

[0062] The first optical distribution tree 310 may include optical splitters. Seven optical splitters, namely, splitters 311~317, are shown in FIG. 5. The optical splitter may include at least one of a Y-shaped beam splitter, an MMI, and a directional coupler. The optical splitter can distribute the input light. For example, the splitter 341 distributes the input light according to 50%:50% and then outputs it. In the figure, the coupling (connection) between the optical splitters is made by waveguide connection. For example, the splitter 311 is connected to the splitters 312 and 313 through waveguides 323 and 324 respectively. Each of the splitters 314, 315, 316, and 317 has two optical output ports.

[0063] Exemplarily, the splitters 311~317 all distribute the input light according to 50%:50%. Thus, 1 / 8 (i.e., 12.5% optical power) of the light input to the first optical distribution tree 310 via the optical input port 301 is output to each optical output port (i.e., ports 305a~305h). Taking the optical output port 305a as an example, it receives 1 / 8 = 12.5% of the input light of the first optical distribution tree 310.

[0064] Among them, the multiple optical output ports of the first optical distribution tree 310 can be respectively connected to multiple optical propagation links. The optical output ports of the first optical distribution tree 310 are optically coupled to the optical transmitters of the corresponding optical propagation links to provide an initial optical signal for the optical transmitters. The optical transmitters modulate the initial optical signal according to the electrical signal to generate an optical signal for transmission.

[0065] In some embodiments, the first optical distribution tree may have other numbers of optical output ports, such as 16. Exemplarily, the light of the optical input port can be evenly distributed to 16 optical output ports. Exemplarily, the number of optical output ports can also be, for example, 12, 20, 32. It can be distributed according to the ratio as needed, not limited to even distribution.

[0066] Exemplarily, the plurality of optical propagation links include a first optical propagation link and a second optical propagation link. The first optical propagation link is coupled to the first optical output port 305a, and the second optical propagation link is coupled to the second optical output port 305b. The optical transmitter of the first optical propagation link is configured to receive the light of the first optical output port 305a, and the optical transmitter of the second optical propagation link is configured to receive the light of the second optical output port 305b.

[0067] In some embodiments, a first optical distribution tree 310 may include a sufficient number of optical output ports (e.g., not less than the number of optical propagation links). Each of the plurality of optical propagation links may be coupled to one of the optical output ports in the first optical distribution tree 310. The first optical distribution tree 310 provides light (input of light energy) for the plurality of optical propagation links. For example, the first optical distribution tree 310 includes 16 optical output ports, and the number of the plurality of optical propagation links is 16, and they may be coupled to the 16 optical output ports one by one.

[0068] In some embodiments, multiple first optical distribution trees 310 may be used to provide a sufficient number of optical output ports, so as to provide light for the plurality of optical propagation links. For example, a first optical distribution tree 310 includes 16 optical output ports, and the number of optical propagation links is 64. At this time, 4 first optical distribution trees 310 (each including 16 optical output ports) may be used. Each first optical distribution tree 310 is coupled to 16 optical propagation links to provide light input for them. The light input to the optical propagation links may be further modulated to carry information, for example, modulated by an optical transmitter to generate an optical signal carrying information, and then transmitted in the optical propagation links.

[0069] FIG. 6 shows the approximate position distribution and connection relationship of the devices in an optical propagation link 330. The optical propagation link 330 includes an optical transmitter 331, an optical distribution tree (which may be denoted as a second optical distribution tree to distinguish it from the first optical distribution tree in name), and a plurality of optical receivers, such as optical receivers 333a, 333b, 333c, 333d, 333e, 333f, 333g, and 333h. The optical distribution tree 332 is configured to form an optical information transmission channel between the optical transmitter and the plurality of optical receivers (333a to 333h). Among them, the optical distribution tree may include optical splitters. Seven optical splitters, namely optical splitters 341 to 347, are shown in FIG. 6. The positions of the optical receivers 333a to 333h roughly correspond to the positions of a plurality of clusters (i.e., clusters 112a to 112h).

[0070] Reference may also be made to the more intuitive connection relationships of the devices in the optical propagation link 330 in FIG. 4. In FIG. 6, the optical transmitter 331 may be connected to the optical splitter 341 through a waveguide. The optical splitter 341 is respectively connected to the optical splitters 342 and 343 through waveguides. The optical splitter 342 is respectively connected to the optical splitters 344 and 345 through waveguides. The optical splitter 343 is respectively connected to the optical splitters 346 and 347 through waveguides. Each of the optical splitters 344, 345, 346, and 347 is connected to two optical receivers.

[0071] Exemplarily, taking the optical propagation link corresponding to the core A01 as an example, it includes 1 optical transmitter, an optical distribution tree, and 8 optical receivers. The optical distribution tree is configured to form an optical information transmission channel between the optical transmitter and the 8 optical receivers. The optical receivers generate second electrical signals according to the received optical signals. The 8 optical receivers output the information carried by the second electrical signals. The second electrical signals of the optical receivers can be directly output to the corresponding clusters to transmit information, or can be output to the corresponding clusters to transmit information after being converted into electrical signals (for example, converted into third electrical signals).

[0072] In the optical transmission direction of the optical propagation link (or the optical distribution tree), the optical distribution tree 332 (the second optical distribution tree) may sequentially include a first bending portion 601, a second bending portion 602, and a third bending portion 603, and further includes a first optical splitter (the optical splitter 341 in FIG. 6) located between the first bending portion 601 and the second bending portion 602, and a second optical splitter (the optical splitter 343 in FIG. 6) after the third bending portion 603. By providing the bending portions, the light can be effectively distributed to the optical receivers at specific positions. In addition, this arrangement can be applied to transmit to the location where the clusters are located.

[0073] In an exemplary embodiment, an information transmission method is proposed, which can transmit information using the optical interconnect in the embodiments of the present invention. The information transmission method includes: Providing light to the optical input port of the first optical distribution tree so that the first optical distribution tree distributes the light from the optical input port to the multiple optical output ports, where the multiple optical output ports include a first optical output port and a second optical output port; The optical transmitter of the first optical propagation link receives a first electrical signal, and the first electrical signal carries the information to be transmitted; The optical transmitter of the first optical propagation link receives the light from the first optical transmission port, and modulates the light from the first optical transmission port according to the first electrical signal to generate an optical signal for transmission; and The second optical distribution tree of the first optical propagation link distributes the modulated optical signal to the corresponding plurality of optical receivers.

[0074] In some embodiments, each optical receiver of the first optical propagation link generates a second electrical signal according to the received optical signal.

[0075] In some embodiments, the information to be transmitted carried by the first electrical signal comes from a first core of a first cluster among a plurality of clusters of a first chip; the plurality of optical receivers respectively correspond to the plurality of clusters; each optical receiver generates a second electrical signal according to the received optical signal to provide the information transmitted to the corresponding cluster.

[0076] Those skilled in the art should understand that what is disclosed above is only the embodiments of the present invention, and of course cannot be used to limit the scope of the rights claimed by the present invention. Equivalent changes made according to the embodiments of the present invention still fall within the scope covered by the claims of the present invention.

[0077] 1000: Chip package 100: First chip 300: Optical interconnect 500: Substrate A01~A08: Core 1041, 1042: Bonding layer 112a~112h: Cluster 310: First optical distribution tree 301: Optical input port 305a~305h: Optical output port 330: Optical propagation link 331: Optical transmitter 332: Optical distribution tree 333a~333h: Optical receiver 341~347: Optical splitter 351, 352, 353, 354, 355, 356: Waveguide 601: First bending part 602: Second bending part 603: Third bending part

Claims

1. A chip package, comprising an optical interconnect and a first chip, wherein, The optical interconnect includes: a first optical distribution tree, which includes an optical input port and multiple optical output ports, configured to distribute light from the optical input port to the multiple optical output ports, the multiple optical output ports including a first optical output port and a second optical output port; and multiple optical propagation links, each of the multiple optical propagation links including an optical transmitter, a second optical distribution tree, and multiple optical receivers, the second optical distribution tree being configured to form an optical information transmission channel between the optical transmitter and the multiple optical receivers; wherein the multiple optical propagation links include a first optical propagation link and a second optical propagation link, the first optical propagation link being coupled to the first optical output port and the second optical propagation link being coupled to the second optical output port, the optical transmitter of the first optical propagation link being configured to receive light from the first optical output port, and the optical transmitter of the second optical propagation link being configured to receive light from the second optical output port; the first chip includes multiple clusters, each cluster including multiple cores; each cluster includes an electrical signal receiving port; Furthermore, the plurality of optical propagation links of the optical interconnects respectively correspond to the plurality of cores of the plurality of clusters, such that each core in the plurality of clusters is coupled to one of the optical propagation links; each optical propagation link is configured to be coupled to one of the cores in the plurality of clusters and to each of the plurality of clusters to provide an information transmission channel between the core and the electrical signal receiving port of each of the plurality of clusters; and for each optical propagation link, the optical transmitter is configured to receive a first electrical signal and generate an optical signal for transmission based on the first electrical signal, wherein the first electrical signal carries information to be transmitted from one of the cores, and each of the plurality of optical receivers is coupled to one of the plurality of clusters, wherein each optical receiver is configured to generate a second electrical signal based on the received optical signal to provide information to be transmitted to the corresponding cluster.

2. The wafer package as described in claim 1, wherein, The optical transmitter of the first optical propagation link is configured to modulate the light received from the first optical output port and send the modulated optical signal to the corresponding second optical distribution tree; and the optical transmitter of the second optical propagation link is configured to modulate the light received from the second optical output port and send the modulated optical signal to the corresponding second optical distribution tree.

3. The wafer package as described in claim 2, wherein, for each of the optical propagation links, the optical transmitter is configured to receive a first electrical signal and generate an optical signal for transmission based on the first electrical signal, wherein, The first electrical signal carries information to be transmitted, wherein each of the optical receivers is configured to generate a second electrical signal based on the received optical signal.

4. The wafer package as claimed in claim 3, wherein in the optical transmission direction of the optical propagation link, the second optical distribution tree includes a first bend, a second bend, and a third bend, and further includes a first beam splitter located between the first bend and the second bend, and a second beam splitter located after the third bend.

5. The wafer package as described in claim 3, wherein, The optical receiver includes a photodiode to generate the second electrical signal based on the received optical signal.

6. The wafer package as described in claim 1, wherein, The first light distribution tree includes multiple light splitters.

7. The wafer package as described in claim 6, wherein, The beam splitter includes at least one of a Y-shaped beam splitter, a multimode interferometer, and a directional coupler.

8. The wafer package as described in claim 1, wherein, The second light distribution tree includes multiple light splitters.

9. The wafer package as described in claim 8, wherein, The beam splitter includes at least one of a Y-shaped beam splitter, a multimode interferometer, and a directional coupler.

10. The wafer package as described in claim 1, wherein, The optical interconnect is a photonic integrated circuit chip.

11. The wafer package as described in claim 1, wherein, The optical interconnect carries the first wafer.

12. An artificial intelligence device comprising a wafer package as described in any one of claims 1-11.

13. A computing system comprising a wafer package as described in any one of claims 1-11.

14. An information transmission method, the method using an optical interconnect for information transmission, wherein the optical interconnect comprises: A first optical distribution tree, comprising an optical input port and multiple optical output ports, configured to distribute light from the optical input port to the multiple optical output ports, the multiple optical output ports including a first optical output port and a second optical output port; and multiple optical propagation links, each of the multiple optical propagation links including an optical transmitter, a second optical distribution tree, and multiple optical receivers, the second optical distribution tree being configured to form an optical information transmission channel between the optical transmitter and the multiple optical receivers; wherein the multiple optical propagation links include a first optical propagation link and a second optical propagation link, the first optical propagation link being coupled to the first optical output port and the second optical propagation link being coupled to the second optical output port, the optical transmitter of the first optical propagation link being configured to receive light from the first optical output port, and the optical transmitter of the second optical propagation link being configured to receive light from the second optical output port; the information transmission method includes: Light is provided to one optical input port of the first optical distribution tree, such that the first optical distribution tree distributes the light from the one optical input port to the plurality of optical output ports, the plurality of optical output ports including a first optical output port and a second optical output port; the optical transmitter of the first optical propagation link receives a first electrical signal carrying information to be transmitted, the information to be transmitted carried by the first electrical signal originating from a first core of a first cluster in a plurality of clusters of a first chip; the optical transmitter of the first optical propagation link receives light from the first optical output port and modulates the light from the first optical output port according to the first electrical signal to generate an optical signal for transmission; and the second optical distribution tree of the first optical propagation link distributes the modulated optical signal to the corresponding plurality of optical receivers, the plurality of optical receivers respectively corresponding to the plurality of clusters, each of the optical receivers of the first optical propagation link generating a second electrical signal according to the received optical signal to provide information to be transmitted to the corresponding cluster; and wherein the plurality of optical propagation links of the optical interconnect respectively correspond to the plurality of cores of the plurality of clusters, such that each core in the plurality of clusters is coupled to one of the optical propagation links; Each of the optical propagation links is configured to be coupled to one of the multiple cores in the plurality of clusters, and to each of the plurality of clusters, to provide an information transmission channel between the core and the electrical signal receiving port of each of the plurality of clusters.

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