Membrane connecting device

Abstract

This disclosure provides a thin-film bonding device, comprising a first thin-film substrate and a plurality of elastic probes. The first thin-film substrate includes a plurality of first openings extending through it. The elastic probes pass through the first openings respectively. Each elastic probe includes a first end and a second end. The first ends of the elastic probes are coplanar with each other, and the second ends of the elastic probes are coplanar with each other.

Description

Technical Field

[0001] This disclosure relates to a thin-film bonding device, and more particularly to a thin-film bonding device with a resilient probe. Prior Technology

[0002] In the manufacturing process of integrated circuits, electrical testing is a crucial step to ensure proper device function. For test devices formed using conductive adhesives (such as silicone with conductive particles, metal pillars, or metal needles), the aging rate increases significantly with the number of uses. Furthermore, metal pillars or needles lack elasticity, making it difficult to control the contact stress generated on the test object, which can easily damage the contacts. Moreover, if conductive adhesives made of silicone are used, unevenness may occur during the silicone curing process, and the curing process is also more complex. Therefore, how to solve these problems has become an important issue in this field.

[0003] The above description of "prior art" is merely to provide background information and does not acknowledge that the above description of "prior art" discloses the subject matter of this disclosure. It does not constitute prior art to this disclosure, and no description of the above "prior art" should be considered part of this case. Summary of the Invention

[0004] In view of this, in order to solve the problems of the prior art, the purpose of this disclosure is to provide a thin film connection device.

[0005] One embodiment of this disclosure provides a thin-film bonding device, comprising a first thin-film substrate and a plurality of elastic probes. The first thin-film substrate includes a plurality of first openings penetrating the first thin-film substrate. The elastic probes respectively pass through the first openings. Each elastic probe includes a first end and a second end. The first ends of the elastic probes are coplanar with each other, and the second ends of the elastic probes are coplanar with each other.

[0006] Accordingly, the flatness of the probe, the test results of electrical tests, and the service life of the thin film connection device can all be improved due to the thin film connection device disclosed herein.

[0007] The foregoing has provided a fairly broad overview of the technical features and advantages of this disclosure, enabling a better understanding of the detailed description of this disclosure that follows. Other technical features and advantages constituting the subject matter of this disclosure will be described below. Those skilled in the art to which this disclosure pertains will understand that the concepts and specific embodiments disclosed below can be readily used to modify or design other structures or processes to achieve the same purpose as this disclosure. Those skilled in the art to which this disclosure pertains will also understand that such equivalent constructions cannot depart from the spirit and scope of this disclosure as defined in the appended claims. Simple Explanation of the Diagram

[0008] When referring to the drawings in conjunction with the embodiments and the scope of the patent application, a more comprehensive understanding of the disclosure of this application can be obtained. The same element symbols in the drawings refer to the same elements.

[0009] Figure 1 is a schematic diagram of a test system according to some embodiments disclosed herein.

[0010] Figures 2 and 3 are schematic diagrams of thin film substrates of some embodiments of this disclosure.

[0011] Figures 4A, 4B, 4C, 4D, 4E and 4F are schematic diagrams of openings in some embodiments of this disclosure.

[0012] Figures 5A and 5B are schematic diagrams of openings and elastic probes according to some embodiments of this disclosure.

[0013] Figures 6, 7, 8 and 9 are schematic diagrams of a test system for some embodiments disclosed herein. Implementation

[0014] The following description of this disclosure, accompanied by drawings incorporated in and forming part of this specification, illustrates embodiments of the disclosure; however, the disclosure is not limited to these embodiments. Furthermore, the following embodiments may be appropriately integrated to complete another embodiment.

[0015] Terms such as “an embodiment,” “an embodiment,” “an exemplary embodiment,” “another embodiment,” and “another embodiment” refer to embodiments described in this disclosure that may include specific features, structures, or characteristics; however, not every embodiment must include that specific feature, structure, or characteristic. Furthermore, repeated use of the phrase “in an embodiment” does not necessarily refer to the same embodiment, but may refer to the same embodiment.

[0016] To ensure a complete understanding of this disclosure, the following description provides detailed steps and structures. It is clear that implementation of this disclosure does not limit the specific details known to those skilled in the art. Furthermore, known structures and steps are not detailed further to avoid unnecessarily limiting the disclosure. Preferred embodiments of this disclosure are detailed below. However, in addition to the detailed description, this disclosure can be widely implemented in other embodiments. The scope of this disclosure is not limited to the detailed description but is defined by the claims.

[0017] It should be understood that the following disclosure provides numerous different embodiments or examples for implementing the various features of this disclosure. Specific embodiments or examples of components and arrangements are described below to simplify the disclosure. Of course, these are merely examples and are not intended to be limiting. For example, the dimensions of elements are not limited to the disclosed range or values, but may depend on process conditions and / or the desired properties of the apparatus. Furthermore, the description below of a first feature being formed "on" or "on" a second feature may include embodiments in which the first and second features are formed in direct contact, and may also include embodiments in which additional features may be formed between the first and second features, thereby potentially preventing direct contact between the first and second features. For simplicity and clarity, various features may be drawn at different scales. In the drawings, some layers / features may be omitted for simplicity.

[0018] Furthermore, for ease of explanation, spatial relative terms such as "beneath," "below," "lower," "above," and "upper" may be used herein to describe the relationship between one element or feature shown in the figures and another (other) element or feature. These spatial relative terms are intended to encompass not only the orientation shown in the figures but also different orientations of the elements during use or operation. The device may have other orientations (rotated 90 degrees or in other orientations), and the spatial relative descriptions used herein can be interpreted accordingly.

[0019] Figure 1 is a schematic diagram of a test system 1 according to some embodiments of this disclosure. The test system 1 includes a test apparatus 10 and a device under test (DUT) 20. In some embodiments, the test apparatus 10 is a probe test apparatus, including a test socket 100, a thin-film connection device 200, and a reinforcing member 300. The test apparatus 10 is used to perform electrical tests on the DUT 20. In some embodiments, the DUT 20 is an integrated circuit on a die or a wafer-level integrated circuit. However, this disclosure is not limited to this; various electronic components capable of transmitting electrical signals can be the DUT 20 described in this disclosure.

[0020] The thin-film connector 200 is mounted on the test socket 100 by a reinforcing member 300. In some embodiments, the test socket 100 is a printed circuit board for transmitting electrical signals between a tester (not shown) and the thin-film connector 200. In some embodiments, the reinforcing member 300 is a metal sheet or a metal block. In some embodiments, the reinforcing member 300 is an insulating material.

[0021] The thin-film bonding device 200 includes a thin-film substrate 210 and a plurality of elastic probes 220. The elastic probes 220 are disposed in the thin-film substrate 210. In some embodiments, the elastic probes 220 are vertical probes. Each elastic probe 220 has a first end 221 and a second end 222, which protrude from opposite surfaces of the thin-film substrate 210. The first end 221 of each elastic probe 220 abuts against a contact 102 on a test socket 100. The second end 222 of each elastic probe 220 is used to contact a contact 21 on a test object 20. In some embodiments, the first ends 221 of each elastic probe 220 are coplanar. In some embodiments, the second ends 222 of each elastic probe 220 are coplanar. In some embodiments, the first end 221 and the second end 222 of each elastic probe 220 are located on the same axis, which is a normal to the surface of the test socket 100. In some embodiments, the normal of the surface of the thin film substrate 210 (e.g., the first surface 210A and / or the second surface 210B shown in FIG. 2) is parallel to the normal of the surface of the test socket 100. For ease of understanding, the Z direction shown in FIG. 1 is parallel to the normal of the surface of the test socket 100, and the first end 221 and the second end 222 of each elastic probe 220 are aligned along the Z direction.

[0022] When the test device 10 approaches the test object 20 and contacts the contact 21, the elastic probe 220 provides axial (e.g., Z-direction) compressive stress through the contact member 102 and the contact 21, so that the elastic probe 220 can stably contact the contact member 102 and the contact 21, as a transmission path for electrical signals between the test object 20 and the test socket 100.

[0023] It should be understood that the arrangement of the elastic probes 220 shown in this disclosure is for illustrative purposes only, and this disclosure is not limited thereto. The number and arrangement of the elastic probes 220 can be set according to the requirements of the object 20 to be tested.

[0024] Figure 2 shows a cross-sectional view (side view) of the thin film substrate 210 in a plane defined by the X and Z directions. In some embodiments, the thin film substrate 210 includes a plurality of openings O1, which penetrate the thin film substrate 210. The openings O1 are used to accommodate the elastic probe 220. In some embodiments, the openings O1 have approximately the same aperture on the first surface 210A and the second surface 210B of the thin film substrate 210, that is, the aperture R1 is equal to the aperture R2. In some embodiments, the aperture R1 is not equal to the aperture R2. In some embodiments, the aperture R1 is smaller than the aperture R2, wherein the second surface 210B is the surface closer to the object to be tested 20.

[0025] Figure 3 shows a cross-sectional view (top view) of the thin film substrate 210 in a plane defined by the X and Y directions. The openings O1 are arranged in a matrix and have a rectangular outline in the top view; however, this disclosure is not limited to this, and the arrangement of the openings O1 can be varied according to the requirements of the test object 20. In some embodiments, the shape of the openings O1 is the same as the cross-sectional shape of the elastic probe 220. In some embodiments, as shown in Figures 4A, 4B, 4C, 4D, 4E, and 4F, the openings O1 have other outlines in the top view.

[0026] Referring to Figures 4A and 4B, in some embodiments, the opening O1 is circular, and the thin film substrate 210 further includes a plurality of slots SL1 connecting the opening O1. More specifically, the slots SL1 can be considered as cross-sections on the thin film substrate 210, and the lateral dimension of the slots SL1 is very small relative to the longitudinal dimension. The slots SL1 penetrate the thin film substrate 210, that is, the slots SL1 extend from the first surface 210A to the second surface 210B. The thin film substrate 210 on both sides of the slots SL1 is discontinuous and consists of two parts that can be displaced relative to each other. One opening O1 can be configured with two or eight slots SL1. However, this disclosure is not limited to this, and various configurations of the number of slots SL1 are all within the considerations and scope of this disclosure.

[0027] In some embodiments, the area of ​​opening O1 is less than or equal to the cross-sectional area at the widest point of elastic probe 220. Therefore, when elastic probe 220 is placed in opening O1, the area around opening O1 is compressed by elastic probe 220, and slot SL1 provides space for deformation of thin film substrate 210, causing opening O1 to expand along the direction of slot SL1. Opening O1 can thus provide centripetal stress to elastic probe 220 to clamp it. As shown in Figures 5A and 5B, when elastic probe 220 is placed in opening O1, elastic probe 220 compresses thin film substrate 210, causing thin film substrate 210 near opening O1 to deform downwards (bend along the Z direction) and cause slot SL1 to expand (expand on the plane jointly defined by the X and Y directions), thereby expanding the area of ​​opening O1. In other words, when elastic probe 220 is inserted into opening O1, opening O1 is compressed, causing slot SL1 connecting opening O1 to expand. Because slot SL1 expands, the area of ​​opening O1 expands along slot SL1.

[0028] Referring to Figure 4C, in some embodiments, the opening O1 is pentagonal, and the thin film substrate 210 further includes a plurality of slots SL2 connecting the opening O1. The slots SL2 can be considered as cross-sections on the thin film substrate 210. The slots SL2 penetrate the thin film substrate 210, that is, the slots SL2 extend from the first surface 210A to the second surface 210B. The function of the slots SL2 is similar to that of the slots SL1, and will not be described in detail here.

[0029] Referring to Figure 4D, in some embodiments, the opening O1 is a parallelogram, and the thin film substrate 210 further includes a plurality of slots SL3 connecting the opening O1. The slots SL3 can be considered as cross-sections on the thin film substrate 210. The slots SL3 penetrate the thin film substrate 210, that is, the slots SL3 extend from the first surface 210A to the second surface 210B. The function of the slots SL3 is similar to that of the slots SL1, and will not be described in detail here.

[0030] It should be understood that the opening O1 is not limited to a pentagon or a quadrilateral; the opening O1 can also be a convex polygon.

[0031] Referring to Figure 4E, in some embodiments, the opening O1 is a polygon containing straight lines and curves, and the thin film substrate 210 further includes a plurality of slots SL4 connecting the opening O1. The slots SL4 can be considered as cross-sections on the thin film substrate 210. The slots SL4 penetrate the thin film substrate 210, that is, the slots SL3 extend from the first surface 210A to the second surface 210B. In some embodiments, the slots SL4 are curved. The function of the slots SL4 is similar to that of the slots SL1, and will not be described again here.

[0032] Referring to Figure 4F. In some embodiments, the opening O1 is an arbitrary polygon, such as a star.

[0033] In some embodiments, the thin film substrate 210 may simultaneously have openings O1 as shown in Figures 4A, 4B, 4C, 4D, 4E, 4F, or combinations thereof. For example, the thin film substrate 210 includes two openings O1 as shown in Figure 4A and three openings O1 as shown in Figure 4D. In some embodiments, the shape of the openings O1 corresponds to the cross-sectional shape of the elastic probe 220, for example, having similar shapes or having the same shape but different sizes. In some embodiments, the shape of the openings O1 depends on the cross-sectional shape of the elastic probe 220; for example, a probe with a rectangular cross-section is more suitable for the openings O1 in Figures 4D and 4E; a probe with a circular cross-section is more suitable for the openings O1 in Figures 4A, 4B, 4C, and 4F. If the slot is closer to the inner side of the opening O1, a circular probe can also be used in Figure 4E. In some embodiments, the shape of the opening is the same as the cross-sectional shape of the probe. The opening and slot are designed to form one or more protrusions within the opening O1. These protrusions are deformable due to the slots. When the probe is inserted into the opening O1, it pushes against these protrusions, causing them to deform and thus generating an interference force on the probe, thereby fixing it in place. It should be understood that Figures 4A to 4F are merely some possible implementations. The use of the opening and slot to form one or more protrusions to generate an interference force on the probe and fix it in place does not depart from the scope of this disclosure.

[0034] In some embodiments, the thin film substrate 210 comprises Mylar. In other embodiments, the thin film substrate 210 comprises glass. In some embodiments, the thickness T1 (thickness along the Z direction) of the thin film substrate 210 is less than 0.75 mm. In some embodiments, the thickness T1 of the thin film substrate 210 is greater than or equal to 0.75 mm.

[0035] In some prior art technologies, silicone rubber has been used as a substrate material for thin-film interconnect devices. However, during the fabrication of silicone rubber substrates, the silicone rubber is first liquid-coated onto the probe at a high temperature, and then cooled and solidified to form an insulator around the probe. The flatness of the solidified silicone rubber is difficult to control, making it difficult to maintain the contact points between the probe and the test object on the same plane, thus reducing the accuracy of the test. Furthermore, when using silicone rubber as a substrate, the thickness of the substrate is limited by the manufacturing process and materials. In prior art technologies, the thickness of silicone rubber substrates is generally greater than 0.75 mm, which means that the length of the selected elastic probe can only be greater than 0.75 mm. In high-frequency testing, the signal transmission path length significantly affects the test accuracy. The thicker the substrate and the longer the elastic probe used, the longer the signal transmission path, which increases the impedance and makes the signal more susceptible to interference, thus reducing the test accuracy. Furthermore, the elasticity of silicone rubber gradually deteriorates with repeated use due to external factors such as temperature and pressure, including high-temperature testing. Before silicone rubber fatigue occurs, the substrate may already be unusable. However, the types and number of tests a silicone rubber substrate will undergo are difficult to predict; therefore, the lifespan of a silicone rubber substrate is also difficult to estimate accurately.

[0036] Compared to prior art, the thin-film bonding device 200 disclosed herein uses Mylar or glass as the thin-film substrate 210 to overcome the problems encountered in prior art. First, the flatness of the thin-film substrate 210 made of Mylar or glass can be accurately controlled. Second, the thickness of the thin-film substrate 210 made of Mylar or glass can be controlled to below 0.75 mm, thus allowing the use of shorter elastic probes 220. Third, the service life of the thin-film substrate 210 made of Mylar or glass is significantly better than that of silicone rubber substrates. Furthermore, compared to silicone rubber, Mylar and glass are not elastic and have better rigidity and support, thus providing good support even at a smaller thickness.

[0037] In some embodiments, as shown in FIG6, the elastic probe 220 is a pogo pin. In the embodiment of FIG6, the elastic probe 220 includes a first end 321, a second end 322, a housing 323, and a spring 324. The housing 323 is disposed in the thin film substrate 210. The first end 321 and the second end 322 are connected to the upper and lower sides of the housing 323, respectively protruding from the first surface 210A and the second surface 210B of the thin film substrate 210. The spring 324 is disposed in the housing 323 and abuts against the first end 321 and the second end 322 to provide elastic force. In some embodiments, the thin film substrate 210 may be glass, and one end of the elastic probe 220 may form a protrusion (not shown), which is used to keep the elastic probe 220 stuck on the glass thin film substrate 210 and prevent it from falling off.

[0038] In some embodiments, the springs 324 of the plurality of elastic probes 220 in the thin-film bonding device 200 have the same spring constant. In some embodiments, at least two of the plurality of elastic probes 220 in the thin-film bonding device 200 have different spring constants for their springs 324.

[0039] In some embodiments, as shown in FIG7, the elastic probe 220 is a microelectromechanical system (MEMS) probe. In the embodiment of FIG7, the elastic probe 220 includes a needle body 421 and at least one cutout portion 422. The cutout portion 422 is used to provide space when the elastic probe 220 is compressed. The needle body 421 is a monolithic structure. In other words, the elastic probe 220 is a one-piece molded structure.

[0040] In some embodiments, the elastic probe 220 includes a plurality of cutouts 422, and each cutout 422 is identical. In some embodiments, the cutouts 422 of different elastic probes 220 are identical to each other. In some embodiments, at least two of the plurality of elastic probes 220 in the thin film bonding device 200 have different cutouts 422.

[0041] Figure 8 is a schematic diagram of a test system 2 according to some embodiments of this disclosure. Test system 2 is similar to test system 1, including a test apparatus 10 and a test object 20. The test apparatus 10 includes a test socket 100, a thin-film connector 200, and a reinforcing member 300. The difference from test system 1 is that the thin-film connector 200 includes a plurality of thin-film substrates 210. For ease of explanation, the two thin-film substrates 210 in Figure 7 are designated as thin-film substrate 211 and thin-film substrate 212, respectively.

[0042] In the test system 2, the thin film bonding device 200 sets two thin film substrates 211 and 212 to keep the elastic probe 220 stable, according to the requirements of the elastic probe 220 (e.g., when the elastic probe 220 is too long). As shown in FIG8, the thin film substrate 211 and the thin film substrate 212 are in contact with each other, that is, the distance between the thin film substrate 211 and the thin film substrate 212 is equal to 0.

[0043] Thin film substrate 211 has a plurality of openings O1, and thin film substrate 212 has the same number of openings O1 as thin film substrate 211. The openings O1 of thin film substrate 211 and thin film substrate 212 are arranged correspondingly to each other in a manner that allows the elastic probe 220 to pass through, forming multiple sets of corresponding openings. In some embodiments, at least one set of corresponding openings has the same shape. In some embodiments, at least one set of corresponding openings has different shapes. In some embodiments, at least two of the plurality of openings O1 of thin film substrate 211 have the same shape. In some embodiments, at least two of the plurality of openings O1 of thin film substrate 211 have different shapes. In some embodiments, at least two of the plurality of openings O1 of thin film substrate 212 have the same shape. In some embodiments, at least two of the plurality of openings O1 of thin film substrate 212 have different shapes.

[0044] Figure 9 is a schematic diagram of a test system 3 according to some embodiments of this disclosure. Test system 3 is similar to test system 2, including a test apparatus 10 and a test object 20. The test apparatus 10 includes a test socket 100, a thin-film connector 200, and a reinforcing member 300. The difference from test system 2 is that the distance L between the thin-film substrate 211 and the thin-film substrate 212 of the thin-film connector 200 is greater than 0.

[0045] Thin film substrate 211 has a plurality of openings O1, and thin film substrate 212 has the same number of openings O1 as thin film substrate 211. The openings O1 of thin film substrate 211 and thin film substrate 212 are arranged correspondingly to each other in a manner that allows the elastic probe 220 to pass through, forming multiple sets of corresponding openings. In some embodiments, at least one set of corresponding openings has the same shape. In some embodiments, at least one set of corresponding openings has different shapes. In some embodiments, at least two of the plurality of openings O1 of thin film substrate 211 have the same shape. In some embodiments, at least two of the plurality of openings O1 of thin film substrate 211 have different shapes. In some embodiments, at least two of the plurality of openings O1 of thin film substrate 212 have the same shape. In some embodiments, at least two of the plurality of openings O1 of thin film substrate 212 have different shapes.

[0046] It should be understood that the number of thin film substrates 210 in test system 2 and test system 3 is merely illustrative, and various numbers of thin film substrates 210 are all within the considerations and scope of this disclosure. For example, in other embodiments, test system 2 and test system 3 respectively include 3 and 4 thin film substrates 210.

[0047] In summary, the thin-film bonding device of the disclosed embodiments uses a Mylar or glass thin-film substrate, which can improve the flatness of the probe, the test results of electrical tests, and the service life of the thin-film bonding device.

[0048] While this disclosure and its advantages have been detailed, it should be understood that various changes, substitutions, and alternatives can be made without departing from the spirit and scope of this disclosure as defined in the claims. For example, many of the processes described above can be implemented using different methods, and many of the processes described above can be replaced by other processes or combinations thereof.

[0049] Furthermore, the scope of this application is not limited to the specific embodiments of the processes, machinery, manufacturing, material composition, means, methods, and steps described in the specification. Those skilled in the art will understand from the disclosure herein that existing or future processes, machinery, manufacturing, material composition, means, methods, or steps that have the same function or achieve substantially the same results as the corresponding embodiments described herein can be used based on this disclosure. Therefore, such processes, machinery, manufacturing, material composition, means, methods, or steps are included within the scope of this application.

[0050] 1: Test System 2: Testing System 3: Testing System 10: Testing equipment 20: Test Item 21:Contact 100: Test socket 102: Contact element 200: Membrane connection device 210:Thin film substrate 211:Thin film substrate 212:Thin film substrate 210A: First surface 210B: Second Surface 220: Elastic probe 221: First End 222: Second end 300: Reinforcing component 321: First end 322: Second end 323: Outer shell 324: Spring 421: Needle body 422: Openwork section L: Spacing X: Direction Y: direction Z: Direction R1: Aperture R2: Aperture T1: Thickness O1: Opening SL1: Grooving SL2: Slotting SL3: Grooving SL4: Grooving

Claims

1. A thin-film bonding device, comprising: a first thin-film substrate including a plurality of first openings penetrating the first thin-film substrate; and a plurality of slots, wherein the slots penetrate the first thin-film substrate and connect the first openings; and a plurality of elastic probes respectively passing through the first openings, wherein each elastic probe includes a first end and a second end, wherein the first ends of the elastic probes are coplanar with each other, and the second ends of the elastic probes are coplanar with each other, wherein the thin-film bonding device further comprises: a second thin-film substrate including a plurality of second openings penetrating the second thin-film substrate, wherein the elastic probes respectively pass through the second openings.

2. The thin-film bonding device as claimed in claim 1, wherein the first thin-film substrate comprises Mylar.

3. The thin-film bonding device as claimed in claim 1, wherein the slots cause the first thin-film substrate to form at least one protrusion facing the first openings.

4. The thin-film bonding device as claimed in claim 3, wherein an area of ​​each of the first openings is smaller than the cross-sectional area at the widest point of each of the elastic probes, wherein when the elastic probes pass through the first openings, the area of ​​each of the first openings is expanded by compression from the corresponding elastic probe.

5. The thin-film bonding device as claimed in claim 1, wherein the first openings are circular, convex polygonal, star-shaped, or a combination thereof.

6. The thin-film bonding device as claimed in claim 1, wherein the shape of the first openings corresponds to the cross-sectional shape of the elastic probes.

7. The thin-film bonding device as claimed in claim 6, wherein the shape of the first openings is the same as the cross-sectional shape of the elastic probes.

8. The thin-film bonding device as claimed in claim 1, wherein a distance between the first thin-film substrate and the second thin-film substrate is greater than 0.

9. The thin-film bonding device as claimed in claim 1, further wherein a distance between the first thin-film substrate and the second thin-film substrate is equal to 0.

10. The thin-film bonding device as claimed in claim 1, wherein the first openings are configured as a complex array of corresponding openings corresponding to the second openings.

11. The thin-film bonding device as claimed in claim 10, wherein the first opening of at least one set of corresponding openings is the same as the second opening.

12. The thin-film bonding device as claimed in claim 10, wherein the first opening of at least one set of corresponding openings is different from the second opening.

13. The thin-film bonding device as claimed in claim 1, wherein each of the resilient probes comprises a spring.

14. The thin-film bonding device as claimed in claim 1, wherein the elastic probes are microelectromechanical system probes and each includes at least one cutout portion.

15. The membrane connection device as claimed in claim 1, wherein the membrane connection device is configured to be mounted on a test socket.

16. The thin film bonding device as claimed in claim 1, wherein the first end and the second end of each of the elastic probes are located on the same axis, wherein the axis is a normal to the surface of the first thin film substrate.

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