A shielding structure for a memory unit

Abstract

A memory cell shielding structure is used to shield a memory cell fixed to a portable electronic device. The memory cell shielding structure includes: a connector for fixing the memory cell and electrically connecting it to a circuit board; and a body having a insertion slot for fixing the insertion memory cell, with snap-fit ​​portions on both sides of the body and a positioning post on the top surface of the body; and a shielding assembly having a shielding member and a shielding cover. The shielding member is used to wrap around the body and has positioning holes that can be stacked with the positioning posts respectively. The shielding member has U-shaped portions on both sides. The side of the U-shaped portion near the positioning hole has a protruding rib for engaging with the snap-fit ​​portion. The other side of the U-shaped portion opposite to the location of the protruding rib has a pressing portion. The shielding cover is used to cover the top side of the memory cell and one end is connected to the shielding member.

Description

Technical Field

[0001] This invention relates to a memory cell arrangement structure, and particularly to a memory cell shielding structure designed for forming a shielding layer on the memory cell. Prior Technology

[0002] With the development of mobile information technology, notebook computers, mobile phones and other information products have become common communication tools between people. In particular, notebook computers have good information processing capabilities and high mobility, making them convenient tools for business communication, information exchange, discussion, and briefing.

[0003] To improve electromagnetic interference (EMI) shielding, solid-state drives (SSDs) in current laptops have a shielding cover on the memory cell casing. This shielding cover is made of a special metal alloy and is designed to protect circuit boards or other electronic components from external interference. These shielding covers are typically used to prevent EMI or radio frequency interference (RFI) from affecting the performance of electronic devices, effectively blocking external electromagnetic waves while also preventing electromagnetic waves inside the memory cell from interfering with other devices.

[0004] However, such a structure increases the time required for production line workers to assemble the shielding cover and align it with the inner shielding frame or multiple sets of shielding clips. In addition, the shielding cover may hinder heat dissipation, requiring the design of additional heat dissipation measures. Summary of the Invention

[0005] This invention relates to a memory cell arrangement structure, and particularly to a memory cell shielding structure designed for forming a shielding layer on the memory cell.

[0006] The present invention discloses a memory cell shielding structure for shielding and fixing a memory cell in a portable electronic device. The memory cell shielding structure includes: a connector for fixing the memory cell and electrically connecting it to a circuit board; and a body having a insertion slot for fixing the memory cell; a latching portion on each side of the body; and at least one positioning post on the top surface of the body; and a shielding assembly having a shielding member and a shielding cover. The shielding member is used to wrap around the body and has at least one positioning hole that can be stacked with the positioning posts respectively. A U-shaped portion is provided on each side of the shielding member. The lower edge of a first arm of the U-shaped portion near the positioning hole has a protruding rib for engaging with the latching portion. The upper edge of a second arm on the other side of the U-shaped portion opposite to the location of the protruding rib has a pressing portion. The shielding cover is used to cover the top side of the memory cell and one end is connected to the shielding member.

[0007] In one embodiment of the present invention, the memory unit is, but is not limited to, a solid-state drive (SSD).

[0008] In one embodiment of the present invention, the electronic device described above is, but is not limited to, a notebook computer.

[0009] In one embodiment of the present invention, the aforementioned body is soldered to the circuit board via a soldering part.

[0010] In one embodiment of the present invention, the insertion and removal direction of the aforementioned insertion slot is parallel to the circuit board.

[0011] In one embodiment of the present invention, the circuit board described above is, but is not limited to, a printed circuit board (PCB).

[0012] In one embodiment of the present invention, the shielding cover is a multi-layered shielding cover with electromagnetic interference (EMI) shielding and heat conduction effects.

[0013] In one embodiment of the present invention, the multi-layered shielding cover is made of a mixture of one or more of the following highly conductive materials: gold, silver, copper, platinum, palladium, nickel, aluminum, indium, and graphite.

[0014] In one embodiment of the present invention, the multi-layered shielding cover is made of a mixture of one or more of the following high thermal conductivity materials: copper, aluminum nitride, aluminum oxide, zinc oxide, boron nitride, silicon carbide, aluminum powder and graphene.

[0015] In one embodiment of the present invention, one end of the shielding cover is connected to the shielding member, and the other end has a fixing member for fixing the shielding cover to the circuit board.

[0016] The advantages of this invention are that, through its memory cell shielding structure, it effectively improves upon the cumbersome process of replacing traditional storage devices, which requires tools and time to remove the shielding cover and memory cell screws. The snap-fit ​​mechanism allows users to quickly replace storage devices without special tools, improving the convenience of maintaining and upgrading memory cell capacity. Furthermore, the shielding cover design provides better electromagnetic interference shielding, protecting the storage device from external interference. In addition, traditional fixing methods may cause the shielding cover to deform, shift, or be damaged during assembly and disassembly by production line workers or users. This invention facilitates easy assembly and disassembly, reducing the failure rate. In summary, the memory cell shielding structure of this invention not only improves the convenience of replacing storage devices for users but also protects the device from electromagnetic interference (EMI) or radio frequency interference (RFI) and enhances stability. It also provides manufacturers and users with greater flexibility and choice. Simple Explanation of the Diagram

[0017] Figure 1 is a schematic diagram of a memory cell shielding structure according to one of the present invention;

[0018] Figure 2 is a schematic diagram of a memory cell shielding structure according to one of the present inventions;

[0019] Figure 3 is a schematic diagram of the assembly of a memory cell shielding structure according to one of the present invention. Implementation

[0020] To make the above-described features and advantages of the present invention more apparent and understandable, specific embodiments are described below in conjunction with the accompanying drawings. Besides these detailed descriptions, the present invention can also be widely implemented in other embodiments. Any easy substitutions, modifications, or equivalent changes to the described embodiments are included within the scope of the present invention and are subject to the claims. In the description of the specification, many specific details are provided to give the reader a more complete understanding of the present invention; however, the present invention may still be implemented even if some or all of the specific details are omitted. Furthermore, well-known steps or elements are not described in the details to avoid unnecessarily limiting the present invention. Identical or similar elements in the drawings will be represented by the same or similar symbols. It should be noted that the drawings are for illustrative purposes only and do not represent the actual size or number of elements. Some details may not be fully drawn for the sake of simplicity, and are described in detail below.

[0021] Please refer to Figures 1 and 2 simultaneously. Figure 1 is a schematic diagram of a memory cell shielding structure according to the present invention; Figure 2 is a schematic diagram of a memory cell shielding structure from another perspective according to the present invention. The memory cell shielding structure is used to shield a memory cell 2 fixed to a portable electronic device. The memory cell shielding structure includes: a connector 1 for fixing the memory cell 2 and electrically connecting it to a circuit board 3; and further includes: a body 11 having a insertion slot 111 for fixing the insertion of the memory cell 2; a latching portion 112 on each side of the body 11; and at least one positioning post 113 on the top surface of the body 11; and a shielding component 12 having... A shielding member 121 and a shielding cover 122 are provided. The shielding member 121 is used to wrap around the body 11 and has at least one positioning hole 1211, which can be stacked with the positioning posts 113 respectively. A U-shaped part 1212 is provided on each side of the shielding member 121. The lower edge of the first arm of the U-shaped part 1212 near the positioning hole 1211 has a protruding rib 12121 for engaging with the snap-fit ​​part 112. The upper edge of the second arm on the other side of the U-shaped part 1212, which is different from the location of the protruding rib 12121, has a pressing part 12122. The shielding cover 122 is used to cover the top side of the memory unit 2 and one end is connected to the shielding member 121.

[0022] In this embodiment, the memory unit 2 is, but is not limited to, a solid-state drive (SSD).

[0023] In this embodiment, the electronic device is, but is not limited to, a notebook computer.

[0024] The solid-state drive is located in the laptop computer within a space defined by a conductive flexible material.

[0025] In this embodiment, the body 11 is soldered to the circuit board 3 through a soldering part.

[0026] The welding part makes the body 11 more firmly welded to the circuit board 3.

[0027] In this embodiment, the insertion and removal direction of the insertion slot 111 is parallel to the circuit board 3.

[0028] In this embodiment, the circuit board 3 is, but is not limited to, a printed circuit board (PCB).

[0029] In this embodiment, the positioning holes 1211 and the positioning posts 113 of the shielding member 121 are respectively superimposed on the positioning posts 113, which can enhance the engagement effect between the body 11 and the shielding component 12, and can also be quickly positioned and installed through the positioning holes 1211 and the positioning posts 113.

[0030] In this embodiment, the U-shaped portions 1212 of the shielding member 121 include a transverse portion and two longitudinal portions, wherein the longitudinal portion closer to the positioning holes 1211 is the first arm, and the longitudinal portion farther from the positioning holes 1211 is the second arm.

[0031] The lower edge of the first arm has the protruding rib 12121, which is used to engage with the buckle parts 112.

[0032] The upper edge of the second arm has the pressing part 12122, which is used to apply an external force to disengage the protruding rib 12121 from the buckle part 112.

[0033] The shielding component 121 of the shielding assembly 12 is snapped and fixed to the snap-fit ​​portion 112 of the main body 11, allowing the user to easily assemble and disassemble it.

[0034] The flexible and adjustable shielding cover 122 adapts to different sizes of the memory unit 2 to achieve positioning.

[0035] In this embodiment, the shielding cover 122 is a multi-layered shielding cover 122 with electromagnetic interference (EMI) shielding and heat conduction effects.

[0036] The multi-layer structure of the shielding cover 122 can be optimized for interference in different frequency ranges.

[0037] In this embodiment, the multi-layer shielding cover 122 is made of a mixture of one or more of the following highly conductive materials: gold, silver, copper, platinum, palladium, nickel, aluminum, indium, and graphite.

[0038] In this embodiment, the multi-layer shielding cover 122 is made of one or a mixture of the following high thermal conductivity materials: copper, aluminum nitride, aluminum oxide, zinc oxide, boron nitride, silicon carbide, aluminum powder and graphene.

[0039] In this embodiment, one end of the shielding cover 122 is connected to the shielding member 121, and the other end has a fixing member for fixing the shielding cover 122 to the circuit board 3.

[0040] The circuit board 3 further includes a fixing hole, through which the shielding cover 122 is fixed to the circuit board 3.

[0041] The fixing hole can be, but is not limited to, a convex hull.

[0042] Please refer to Figure 3, which is a schematic diagram of the assembly of a memory cell shielding structure according to the present invention. After the memory cell is inserted into the insertion slot, the positioning hole of the shielding component overlaps with the positioning post, and the protruding rib engages with the snap-fit ​​part to fix the shielding component, as shown in Figure 3.

[0043] In summary, the advantages of this invention are that, through its memory cell shielding structure, it effectively improves upon the cumbersome process of replacing traditional storage devices, which requires tools and time to remove the shielding cover and memory cell screws. The snap-fit ​​mechanism allows users to quickly replace storage devices without special tools, improving the convenience of maintaining and upgrading memory cell capacity. Furthermore, the shielding cover design provides better electromagnetic interference shielding, protecting the storage device from external interference. In addition, traditional fixing methods may cause the shielding cover to deform, shift, or be damaged during assembly and disassembly by production line workers or users. This invention facilitates easy assembly and disassembly, reducing the failure rate. In conclusion, the memory cell shielding structure of this invention not only improves the convenience of replacing storage devices for users but also protects the device from electromagnetic interference (EMI) or radio frequency interference (RFI) and enhances stability. It also provides manufacturers and users with greater flexibility and choice.

[0044] Although the present invention has been disclosed above with reference to the foregoing embodiments, it is not intended to limit the present invention. Any modifications and equivalent substitutions made by those skilled in the art without departing from the spirit and scope of the present invention shall still be within the scope of patent protection of the present invention.

[0045] 1: Connector

[0046] 11:Ontology

[0047] 111: Socket

[0048] 112: Buckle section

[0049] 113: Positioning Post

[0050] 12: Shielding components

[0051] 121: Shielding components

[0052] 1211: Positioning hole

[0053] 1212: U-shaped section

[0054] 12121: Convex Rib

[0055] 12122: Pressing part

[0056] 122: Shielding cover

[0057] 2: Memory Unit

[0058] 3: Circuit board

Claims

1. A memory cell shielding structure for shielding a memory cell fixed to a portable electronic device, wherein the memory cell shielding structure comprises: A connector for fixing a memory cell and electrically connecting it to a circuit board, further comprising: a body having a insertion slot for fixing the memory cell, a latching portion on each side of the body, and at least one positioning post on the top surface of the body; and a shielding assembly having a shielding member and a shielding cover, the shielding member being used to wrap around the body and having at least one positioning hole that can be respectively overlapped with the positioning posts, the shielding member having a U-shaped portion on each side, the lower edge of a first arm of the U-shaped portion near the positioning hole having a protruding rib for engaging with the latching portion, the upper edge of a second arm on the other side of the U-shaped portion opposite to the location of the protruding rib having a pressing portion, and the shielding cover being used to cover the top side of the memory cell, one end of which is connected to the shielding member.

2. The memory cell shielding structure as described in claim 1, wherein the memory cell is, but is not limited to, a solid-state drive (SSD).

3. The memory cell shielding structure as described in claim 1, wherein the electronic device is, but is not limited to, a notebook computer.

4. The memory cell shielding structure as described in claim 1, wherein the body is soldered to the circuit board via a soldering part.

5. The memory cell shielding structure as described in claim 1, wherein the insertion / removal direction of the insertion slot is parallel to the circuit board.

6. The memory cell shielding structure as described in claim 1, wherein the circuit board is, but is not limited to, a printed circuit board (PCB).

7. The memory cell shielding structure as described in claim 1, wherein the shielding cover is a multi-layered shielding cover with electromagnetic interference (EMI) shielding and heat conduction effects.

8. The memory cell shielding structure as described in claim 7, wherein the multi-layer shielding cover is made of a mixture of one or more of the following highly conductive materials: gold, silver, copper, platinum, palladium, nickel, aluminum, indium, and graphite.

9. The memory cell shielding structure as described in claim 7, wherein the multi-layer shielding cover is made of a mixture of one or more of the following high thermal conductivity materials: copper, aluminum nitride, aluminum oxide, zinc oxide, boron nitride, silicon carbide, aluminum powder and graphene.

10. The memory cell shielding structure as described in claim 1, wherein one end of the shielding cover is connected to the shielding member, and the other end has a fixing member for fixing the shielding cover to the circuit board.

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