Substrate processing device

Abstract

This invention provides a substrate processing apparatus that can suppress the adhesion of particles to the substrate even when particles are generated in a support portion. The substrate processing apparatus of an embodiment includes: a chamber having an outer wall portion; a conveying portion disposed inside the chamber for conveying a substrate along a first direction; a conduit disposed inside the chamber, facing the conveying portion, extending along a second direction intersecting the first direction, for supplying a processing liquid; a plurality of nozzles disposed inside the chamber, arranged at predetermined intervals in the portion of the conduit facing the conveying portion; a support extending along the second direction, holding the conduit inside the chamber, with its two ends disposed outside the chamber; a support portion disposed outside the chamber for supporting the two ends of the support portion; and a drive portion for reciprocating the support portion supported on the support portion along the second direction.

Description

[Technical Field]

[0001] The present invention relates to a substrate processing apparatus. [Previous Technology]

[0002] An apparatus is provided for supplying a processing liquid to the surface of a substrate used in liquid crystal displays, etc., to process the substrate. For example, an apparatus is provided for spraying a processing liquid from multiple nozzles onto the surface of a substrate being transported by a conveying device to process the substrate. In this apparatus, in order to uniformly supply the processing liquid to the surface of the substrate, a member provided with multiple nozzles is reciprocated along a direction intersecting the transport direction of the substrate while spraying the processing liquid onto the surface of the substrate from the multiple nozzles. At this time, a support portion supporting the member provided with multiple nozzles is provided inside the chamber where the substrate is transported (see, for example, Patent Document 1).

[0003] Here, when a component equipped with multiple nozzles reciprocates, friction sometimes occurs between the component and the support, generating microparticles. In recent years, there has been a trend towards larger substrates, larger components equipped with multiple nozzles, and even an increase in the weight of the components. As the weight of the components increases, microparticles become more easily generated.

[0004] (As described above, the support portion supporting the member with multiple nozzles is provided inside the chamber where the substrate is transported. Therefore, if particles are generated in the support portion, the generated particles may adhere to the substrate being transported inside the same chamber. If the particles adhere to the substrate, the processing quality may deteriorate. Therefore, it is desirable to develop a substrate processing apparatus that can suppress the adhesion of generated particles to the substrate even if particles are generated in the support portion. [Prior Art Documents] [Patent Documents])

[0005] Patent Document 1: Japanese Patent Implementation 5-22081 Publication [Summary of the Invention]

[0006] [The problem the invention aims to solve]

[0007] The problem to be solved by the present invention is to provide a substrate processing apparatus that can suppress the adhesion of particles to the substrate even when particles are generated in the support portion. [Means for Solving the Problem]

[0008] The substrate processing apparatus of the embodiment includes: a chamber having an outer wall portion; a conveying portion disposed inside the chamber for conveying a substrate along a first direction; a conduit disposed inside the chamber, facing the conveying portion and extending along a second direction intersecting the first direction for supplying a processing liquid; a plurality of nozzles disposed inside the chamber and arranged at predetermined intervals on the portion of the conduit facing the conveying portion; a support extending along the second direction, holding the conduit inside the chamber, with its two ends disposed outside the chamber; a support portion disposed outside the chamber for supporting the two ends of the support portion; and a drive portion for reciprocating the support portion supported on the support portion along the second direction. [Effects of the Invention]

[0009] According to an embodiment of the present invention, a substrate processing apparatus is provided that can suppress the adhesion of particles to the substrate even if particles are generated in the support portion.

Implementation Method

[0011] Hereinafter, embodiments will be illustrated with reference to the accompanying drawings. In addition, in each drawing, the same reference numerals are used to denote the same constituent elements, and detailed descriptions are omitted where appropriate. Furthermore, the arrows X, Y, and Z in each drawing represent three mutually orthogonal directions. For example, the X direction (an example of the first direction) can be set as the substrate transport direction.

[0012] FIG1 is a schematic plan view illustrating the substrate processing apparatus 1 of this embodiment. FIG2 is a plan view of the substrate processing apparatus 1 shown in FIG1, omitting the processing liquid supply unit 4 and the moving unit 5. FIG3 is a plan view of the substrate processing apparatus 1 shown in FIG1, omitting the conveying unit 3. In addition, FIG2 and FIG3 are reference diagrams for facilitating understanding of the structure of the substrate processing apparatus 1. FIG4 is a cross-sectional view of the substrate processing apparatus 1 in FIG1 along line AA. FIG5 is a cross-sectional view of the substrate processing apparatus 1 in FIG1 along line BB.

[0013] As shown in Figures 1 to 5, the substrate processing apparatus 1 includes, for example, a chamber 2, a conveying unit 3, a processing liquid supply unit 4, and a moving unit 5.

[0014] As shown in Figures 1 and 5, the chamber 2 includes, for example, an inner wall portion 21, an outer wall portion 22, a bottom portion 23, and a top plate portion 24. The inner wall portion 21 is flat and extends along the X direction. A pair of inner wall portions 21 are arranged in the Y direction at predetermined intervals. The outer wall portion 22 is flat and extends along the X direction. In the Y direction, the outer wall portion 22 is provided outside each of the pair of inner wall portions 21. The outer wall portion 22 and the inner wall portion 21 are arranged in the Y direction at predetermined intervals.

[0015] As shown in FIG. 5, the bottom 23 is located between the inner wall portion 21 and below the conveying portion 3. That is, the bottom 23 is located inside the chamber 2 and on the side of the conveying portion 3 opposite to the pipe 41 side in the processing liquid supply portion 4. The bottom 23 is provided in such a way that it covers the area below the conveying portion 3. The bottom 23 blocks the processing liquid 101 supplied from the plurality of nozzles 42 of the processing liquid supply portion 4 to the upper surface of the substrate 100 and discharged from the upper surface of the substrate 100.

[0016] The central portion of the bottom 23 in the Y direction is located further away from the conveying section 3 than the peripheral portion of the bottom 23. The bottom 23 is inclined in a direction that moves away from the conveying section 3 towards the central portion in the Y direction. A discharge port 23a is provided in the central portion of the bottom 23. In this way, the processing liquid 101 discharged from the upper surface of the substrate 100 and blocked by the bottom 23 can be collected in the central portion of the bottom 23 and discharged from the discharge port 23a. Therefore, the recovery efficiency of the processing liquid 101 can be improved.

[0017] Here, in recent years, the substrate 100, which is the object of processing, has been increasing in size. Therefore, there is a tendency for the size of the bottom 23 in the Y direction to increase. If the size of the bottom 23 in the Y direction increases, it becomes difficult to install the bottom 23 in the space between the inner wall portion 21 or to remove the bottom 23 from the space between the inner wall portion 21.

[0018] Therefore, as shown in FIG5, the bottom 23 can be divided into part 23b and part 23c in the Y direction. For example, the end of part 23c on the side of part 23b in the Y direction can be bent toward the conveying part 3, so that the end of part 23b on the side of part 23b rests on the bent end of part 23c. If the bottom 23 is divided in the Y direction, even if the size of the bottom 23 increases, the installation and removal of the bottom 23 becomes easier.

[0019] FIG6 is a schematic cross-sectional view illustrating a bottom 123 according to another embodiment. As shown in FIG6, the bottom 123 has region 123a, region 123b and region 123c. In addition, the number of regions is not limited to three. The number of regions can be two or more. Regions 123a, region 123b and region 123c are arranged in a specific order in the Y direction.

[0020] Discharge outlets 23a are provided in regions 123a, 123b, and 123c respectively. In region 123a, the discharge outlet 23a is located on the central side of region 123a in the Y direction. Similar to the case of the bottom 23 described above, the central side of region 123a in the Y direction is located further away from the conveying unit 3 than the peripheral portion of region 123a. Region 123a is inclined in a direction that moves away from the conveying unit 3 towards the central side in the Y direction.

[0021] In region 123b, the discharge port 23a is located on the central side of region 123b in the Y direction. The central side of region 123b in the Y direction is located further away from the conveying unit 3 than the peripheral portion of region 123b. Region 123b is inclined in a direction that moves away from the conveying unit 3 as it moves toward the central side in the Y direction.

[0022] In region 123c, the discharge port 23a is located at the center of region 123c in the Y direction. The center of region 123c in the Y direction is located further away from the conveying unit 3 than the peripheral portion of region 123c. Region 123c is inclined in a direction that moves away from the conveying unit 3 towards the center in the Y direction. Therefore, the processing liquid 101 blocked by regions 123a, 123b and 123c respectively collects at their respective center sides and is discharged from the discharge port 23a located at their respective center sides.

[0023] At this time, as shown in FIG6, in the Y direction, the dimensions of regions 123a, 123b, and 123c are smaller than the dimensions of the aforementioned bottom 23. Therefore, the tilt angles of regions 123a, 123b, and 123c can be greater than the tilt angle of the bottom 23. If the tilt angle is larger, the blocked processing liquid 101 can be efficiently collected in each region 123a, 123b, and 123c and discharged from the outlet 23a. Therefore, the recovery efficiency of the processing liquid 101 can be further improved.

[0024] Furthermore, if the tilt angles of each of regions 123a, 123b, and 123c are set to be the same as the tilt angle of the aforementioned bottom 23, the dimensions of each of regions 123a, 123b, and 123c in the Z direction can be smaller than the dimensions of the bottom 23. That is, the bottom 123 can be made thinner. On the other hand, if the dimensions of each of regions 123a, 123b, and 123c in the Z direction are set to be the same as the dimensions of the aforementioned bottom 23, the tilt angles of each of regions 123a, 123b, and 123c can be greater than the tilt angle of the bottom 23. That is, the efficiency of the discharge of the treatment liquid can be improved.

[0025] As shown in Figure 5, the top plate 24 is plate-shaped and covers the end of the chamber 2 on the side opposite to the bottom 23.

[0026] As shown in Figures 1, 2, 4 and 5, the conveying unit 3 is disposed inside the chamber 2 and conveys the substrate 100 along the X direction. The conveying unit 3 is disposed between the nozzle 42 of the processing liquid supply unit 4 and the bottom 23 of the chamber 2. The conveying unit 3 includes, for example, a shaft 31, a roller 32 and a drive unit 33.

[0027] The shaft 31 is columnar and extends in one direction. The shaft 31 extends, for example, in the Y direction. The axial dimension of the shaft 31 can be appropriately varied, for example, according to the size of the substrate 100 in the Y direction. Multiple shafts 31 are provided. Multiple shafts 31 can be arranged in the X direction at predetermined intervals. The number and spacing of the multiple shafts 31 can be appropriately varied according to the size of the substrate 100 in the X direction. The shaft 31 can be, for example, a shaft whose surface containing a core material such as metal or carbon is covered with a resin (e.g., polyvinyl chloride (PVC), soluble polytetrafluoroethylene (PFA), polyvinylidene fluoride (PVDF)).

[0028] The rollers 32 are cylindrical and multiple rollers can be provided relative to a shaft 31. The multiple rollers 32 are arranged along the Y direction at predetermined intervals. The number and interval of the multiple rollers 32 can be appropriately changed according to the size of the substrate 100 in the Y direction.

[0029] The drive unit 33 may be provided, for example, in the space between the inner wall portion 21 and the outer wall portion 22 of the chamber 2. The drive unit 33 extends, for example, along the X direction. One end of one of the plurality of shafts 31 in the Y direction is connected to the drive unit 33. The drive unit 33 rotates the plurality of shafts 31 in the same direction. By rotating the plurality of shafts 31 in the same direction, the plurality of rollers 32 rotate in the same direction, and the substrate 100 placed on the plurality of rollers 32 is conveyed along the X direction. The drive unit 33 can also start, stop, change the conveying direction, and change the conveying speed of the substrate 100. The drive unit 33 may include, for example, a motor and an inverter, or a control motor such as a servo motor.

[0030] The processing liquid supply unit 4 supplies processing liquid 101 to the upper surface of the substrate 100, recovers the processing liquid 101 that is discharged from the upper surface of the substrate 100 and blocked by the bottom 23, and supplies the recovered processing liquid 101 back to the upper surface of the substrate 100. That is, the processing liquid supply unit 4 recirculates and reuses the processing liquid 101 supplied to the upper surface of the substrate 100.

[0031] Here, the processing liquid 101 may be a solution used to process the surface of a substrate 100 used in a liquid crystal display or the like. The processing liquid 101 may be, for example, an aqueous solution of hydrogen fluoride (also called hydrofluoric acid, fluoric acid, etc.). The concentration of hydrogen fluoride in the aqueous solution of hydrogen fluoride is, for example, 5% or less.

[0032] Because this processing liquid 101 is used, the components in the chamber 2, the conveying section 3, the processing liquid supply section 4, and the moving section 5 that come into contact with the processing liquid 101, and the components that may come into contact with the processing liquid 101, are formed of materials that are resistant to the processing liquid 101. For example, if the processing liquid 101 is an aqueous solution of hydrogen fluoride, these components may be formed of resins such as PVC, PFA, and PVDF. Alternatively, these components may also be formed of materials for coating the surface of metals, etc., with the aforementioned resins, etc.

[0033] As shown in Figures 1, 3, 4, and 5, the processing fluid supply unit 4 includes, for example, a pipe 41, a nozzle 42, a storage tank 43, a temperature control unit 44, a detection unit 45, a pump 46, a control valve 47, and a discharge valve 48. The pipe 41 and the nozzle 42 are located inside the chamber 2. The storage tank 43, the temperature control unit 44, the detection unit 45, the pump 46, the control valve 47, and the discharge valve 48 may be located outside the chamber 2, for example.

[0034] The pipe 41 is cylindrical and faces the conveying section 3. The pipe 41 extends in a direction intersecting the X direction (corresponding to an example of the second direction). The direction intersecting the X direction is, for example, a direction orthogonal to the X direction (Y direction) or a direction inclined relative to the X direction (a direction deviating from the Y direction). In addition, in Figures 1 and 3, the case of a direction orthogonal to the X direction (Y direction) is illustrated. The axial dimension of the pipe 41 can be appropriately changed, for example, according to the size of the substrate 100 in the Y direction. Multiple pipes 41 can be provided. Multiple pipes 41 are arranged at predetermined intervals, for example, along the X direction. The number and spacing of multiple pipes 41 can be appropriately changed, for example, according to the size of the substrate 100 in the X direction. For example, one end of the pipe 41 can be closed. Processing liquid 101 is supplied to the internal space of the pipe 41, for example, from the other end side of the pipe 41.

[0035] Multiple nozzles 42 may be provided relative to a single pipe 41. Multiple nozzles 42 may be provided on the portion of the pipe 41 facing the conveying section 3. Multiple nozzles 42 are arranged at predetermined intervals along the direction in which the pipe 41 extends. The number and spacing of the multiple nozzles 42 can be appropriately varied according to the dimensions of the substrate 100 in the Y direction. For example, the nozzles 42 spray the processing liquid 101 in a mist-like manner toward the upper surface of the substrate 100. The nozzles 42 may be, for example, conical nozzles, fan-shaped nozzles, etc. Furthermore, the nozzle 42 illustrated in Figures 4 and 5 is a conical nozzle.

[0036] The storage tank 43 is box-shaped and has an internal space for holding the treatment liquid 101. The storage tank 43 is located in the space below the chamber 2 and has a width extending from near one end of the chamber 2 to near the center. The storage tank 43 holds the treatment liquid 101 that is blocked by the bottom 23. An inflow portion 43a1 is provided on the top plate 43a of the storage tank 43. The inflow portion 43a1 is located near the end of the storage tank 43 on the side of the center of the chamber 2. The inflow portion 43a1 is connected to the outlet 23a of the bottom 23, for example, via a pipe. The bottom surface 43b of the storage tank 43 is inclined, for example, relative to the Y direction. More specifically, the bottom surface 43b is inclined in a manner that descends from one end of the chamber 2 toward the center. In the Z direction, a discharge portion 43b1 may be provided at the lowest part of the bottom surface 43b of the storage tank 43 (the end on the side of the inflow portion 43a1).

[0037] The discharge section 43b1 is a cylindrical pipe that bends at a right angle directly below its connection with the storage tank 43. The direction of the bend is, for example, the direction of the other end of the chamber 2 (left direction in the figure). Furthermore, the discharge section 43b1 is configured such that the edge of the discharge section 43b1 at the interface with the storage tank 43, on the side of the other end of the chamber 2, is aligned with the inner wall of the side surface 43d of the inflow section 43a1 of the storage tank 43. Alternatively, the discharge section 43b1 may be configured such that the upper end of the horizontal portion after bending at the right angle is connected to the lower end of the side surface 43d of the storage tank 43, and the remaining vertical portion is connected to the bottom surface 43b of the storage tank 43.

[0038] An outlet 43c1 may be provided on the side 43c of the storage tank 43 opposite to the side where the outlet 23a is provided. The outlet 43c1 is connected, for example, to the end of the pipe 41 opposite to the closed side via a pipe 43c2 or the like.

[0039] The temperature control unit 44 controls the temperature of the treatment liquid 101 contained inside the storage tank 43 to be within a specified range. The temperature control unit 44 may be provided, for example, on the side 43d of the storage tank 43 on the side where the outlet 23a is provided.

[0040] The temperature control unit 44 includes, for example, a heating unit 44a and a pump 44b. The heating unit 44a and the pump 44b are provided outside the storage tank 43. The heating unit 44a and the pump 44b are connected via piping 43d3 and the like between the outlet 43d1 and the inlet 43d2 provided on the side 43d of the storage tank 43.

[0041] Pump 44b causes the treatment liquid 101 contained in the storage tank 43 to flow from the outlet 43d1 toward the inlet 43d2.

[0042] The heating unit 44a heats the processing liquid 101 flowing from the outlet 43d1 toward the inlet 43d2. For example, the heating unit 44a heats the liquid based on a signal from a temperature sensor (not shown) provided inside the storage tank 43, so that the temperature of the processing liquid 101 contained inside the storage tank 43 is within a specified range.

[0043] The detection unit 45 detects the state of the processing liquid 101 contained inside the storage tank 43. The detection unit 45 may, for example, detect the concentration of hydrogen fluoride contained in the aqueous solution of hydrogen fluoride or the concentration of contaminants generated due to the treatment of the upper surface of the substrate 100. The detection unit 45 may, for example, be a conductivity meter or the like.

[0044] The detection unit 45 is provided, for example, inside the storage tank 43. The detection unit 45 may be provided, for example, on the bottom surface 43b of the storage tank 43. In this case, if the detection unit 45 is provided near the heating unit 44a, the detection value from the detection unit 45 may be affected by noise from the heating unit 44a. Therefore, it is preferable that the distance between the detection unit 45 and the heating unit 44a is long. For example, as shown in FIG5, the detection unit 45 may be provided on the opposite side of the temperature control unit 44, sandwiching the central part of the storage tank 43. For example, the detection unit 45 may be provided near the side 43c of the storage tank 43 facing the side 43d where the heating unit 44a is provided.

[0045] Pump 46 is connected between the outlet 43c1 of the reservoir 43 and the end of the pipe 41 opposite to the closed side. Pump 46 supplies the processing liquid 101 contained inside the reservoir 43 to the internal space of the pipe 41. The processing liquid 101 supplied to the internal space of the pipe 41 is supplied from the nozzle 42 to the upper surface of the substrate 100.

[0046] Control valve 47 is connected, for example, between the outlet 43c1 of storage tank 43 and pump 46. Control valve 47 controls, for example, at least one of the flow rate and pressure of the treatment fluid 101 supplied to the internal space of pipe 41 by means of pump 46.

[0047] The discharge valve 48 is connected, for example, to the discharge section 43b1 of the storage tank 43. The discharge valve 48 may be, for example, an on / off valve. For example, if the concentration of contaminants contained in the treatment fluid 101 is detected by the detection unit 45 to exceed a predetermined value, maintenance such as replacing the treatment fluid 101 can be performed. For example, the discharge valve 48 can be opened to discharge the treatment fluid 101 contained inside the storage tank 43. If the treatment fluid 101 contained inside the storage tank 43 has been discharged, the discharge valve 48 can be closed to supply new treatment fluid 101 to the inside of the storage tank 43.

[0048] Here, as shown in Figures 4 and 5, the amount of processing liquid 101 supplied to the area directly below the nozzles 42 on the upper surface of the substrate 100 is less than the amount of processing liquid 101 supplied to the area directly below the nozzles 42 on the upper surface of the substrate 100.

[0049] At this time, as shown in FIG. 4, the substrate 100 is conveyed by the conveying unit 3 along the X direction. Therefore, the processing liquid 101 is supplied to the entire area of ​​the upper surface of the substrate 100 in the X direction. However, if the substrate 100 is only conveyed by the conveying unit 3 along the X direction, there will be areas with more and less processing liquid 101 on the upper surface of the substrate 100 in the Y direction. That is, the amount of processing liquid 101 on the upper surface of the substrate 100 may be uneven, resulting in a decrease in processing quality.

[0050] Therefore, the substrate processing apparatus 1 of this embodiment is provided with a moving part 5. As shown in FIG5, the moving part 5 causes the pipe 41 to reciprocate in a direction intersecting the X direction. The distance of the reciprocating movement can be, for example, set to about half the distance between nozzles 42 in the direction in which the pipe 41 extends.

[0051] FIG7 is a schematic cross-sectional view illustrating the movable part 5. FIG7 is also a cross-sectional view along line CC of the movable part 5 in FIG3. As shown in FIG7, the movable part 5 includes, for example, a bracket 51, a support 52, a drive part 53, and a sealing part 54.

[0052] The support 51 extends along the direction in which the pipe 41 extends and holds the pipe 41 inside the chamber 2. The ends of the support 51 on both sides are located outside the chamber 2. The support 51 has, for example, a beam 51a, a pipe holding part 51b, and an arm 51c. The beam 51a extends along the direction in which the pipe 41 extends. At least one beam 51a may be provided relative to a plurality of pipes 41. For example, a pair of beams 51a may be provided relative to a plurality of pipes 41, as shown in FIG3.

[0053] Multiple pipe holding parts 51b are provided at the ends of the beam 51a on the side of the conveying part 3. The multiple pipe holding parts 51b are arranged in a direction extending from the beam 51a. Each of the multiple pipe holding parts 51b has a through hole extending from the beam 51a, and the pipe 41 is installed inside the hole.

[0054] A pair of arms 51c may be provided relative to a beam 51a. The pair of arms 51c are respectively provided at the ends of both sides of the beam 51a. The arms 51c are, for example, column-shaped and extend in the direction in which the beam 51a extends.

[0055] Beam 51a and pipe retaining part 51b are provided inside the chamber 2 (inner side of inner wall part 21). The end of arm 51c on the beam 51a side is provided inside the chamber 2 (inner side of inner wall part 21). The end of arm 51c on the side opposite to the beam 51a side is provided outside the chamber 2 (outer side of outer wall part 22). The central part of arm 51c is provided inside the sealing part 54.

[0056] The support portion 52 is provided outside the chamber 2 (outside the outer wall portion 22). The support portion 52 supports the ends (arms 51c) on both sides of the bracket 51 respectively. A pair of support portions 52 may be provided relative to at least one beam 51a. Moreover, the support portion 52 supports the pipe 41 via the bracket 51 and can change the position of the pipe 41 (nozzle 42) in the direction intersecting the X direction.

[0057] The support portion 52 includes, for example, a linear movement portion 52a, a bracket 52b, and a frame 52c. The linear movement portion 52a may be a bearing capable of linear forward movement in a direction intersecting the X direction (or, in this embodiment, an orthogonal direction (Y direction)). The linear movement portion 52a may be provided, for example, on a pedestal 22a provided on the outer wall portion 22 of the chamber 2.

[0058] The bracket 52b is provided on the linear moving part 52a. As shown in FIG3, when a pair of beams 51a are provided relative to a plurality of pipes 41, a bracket 52b may be provided relative to the pair of beams 51a.

[0059] Figure 8 is a schematic diagram illustrating the case where a bracket 52b is provided relative to a pair of beams 51a. As shown in Figure 8, when a bracket 52b is provided relative to a pair of beams 51a, a pair of linear moving parts 52a are provided relative to the bracket 52b. If a pair of linear moving parts 52a are provided relative to the bracket 52b, when the position of the bracket 52b is moved by the drive unit 53 described later, the situation where the bracket 52b tilts and the operation of the linear moving parts 52a deteriorates can be prevented.

[0060] The frame 52c is box-shaped, and may be provided, for example, on a pedestal 22a provided on the outer wall 22 of the chamber 2. A linear moving part 52a and a bracket 52b may be provided in the internal space of the frame 52c.

[0061] As shown in FIG. 7, the drive unit 53 may be provided in one of the pair of support units 52. The drive unit 53 causes the bracket 51 supported on the support unit 52 to reciprocate in a direction intersecting the X direction. FIG. 9 is a schematic diagram illustrating the operation of the drive unit 53 on the support unit 52. As shown in FIG. 7 to FIG. 9, the drive unit 53 includes, for example, a guide 53a, an arm 53b, a roller 53c, and a motor 53d.

[0062] The guide 53a may be provided at the end of the bracket 52b on the side opposite to the linear moving part 52a. At the end of the guide 53a on the side opposite to the bracket 52b, a groove 53a1 extending in a direction orthogonal to the direction in which the beam 51a extends is provided.

[0063] Arm 53b is plate-shaped and extends in one direction. Roller 53c is located near one end of arm 53b and on the side of guide 53a of arm 53b. Motor 53d is located, for example, on the outer surface of frame 52c. The shaft of motor 53d is connected inside frame 52c to the vicinity of the other end of arm 53b.

[0064] That is, the guide 53a, arm 53b and roller 53c constitute a crank mechanism. Therefore, the rotary motion in the motor 53d can be converted into linear reciprocating motion.

[0065] If the rotary motion in the motor 53d can be converted into linear reciprocating motion, the bracket 52b of the support 52 can be moved back and forth as shown in FIG9. As shown in FIG7, a pipe 41 with multiple nozzles 42 is provided in the bracket 52b via the bracket 51. Therefore, by moving the bracket 52b back and forth, the position of the pipe 41 and even the position of the multiple nozzles 42 can be moved back and forth.

[0066] Therefore, by moving the substrate 100 in the X direction using the conveying unit 3 and moving the plurality of nozzles 42 in a direction intersecting the X direction using the driving unit 53, the same amount of processing liquid 101 can be supplied to the entire area of ​​the upper surface of the substrate 100. Therefore, the phenomenon that the amount of processing liquid 101 is uneven on the upper surface of the substrate 100, resulting in a decrease in processing quality, can be suppressed.

[0067] Furthermore, as shown in FIG. 7, the support portion 52 is provided outside the chamber 2 (outside the outer wall portion 22). Here, when the linear moving portion 52a is running, particles may sometimes be generated. Even if the linear moving portion 52a is a rolling bearing, slippage cannot be eliminated, so the generation of particles cannot be completely eliminated. At this time, if the generated particles adhere to the substrate 100, the processing quality of the substrate 100 may decrease.

[0068] In the substrate processing apparatus 1 of this embodiment, the support portion 52 is provided outside the chamber 2 (outer side of the outer wall portion 22). Therefore, compared with the case where the support portion 52 is provided inside the chamber 2 (inner side of the inner wall portion 21), the intrusion of generated particles toward the interior of the chamber 2 (inner side of the inner wall portion 21) can be suppressed. Therefore, the adhesion of generated particles to the substrate 100 can be suppressed, thereby improving the processing quality of the substrate 100.

[0069] Here, as described above, the processing liquid 101 is a liquid such as an aqueous solution of hydrogen fluoride. Therefore, it is preferable to prevent a portion of the processing liquid 101 sprayed onto the upper surface of the substrate 100 from leaking out of the outside of the chamber 2 (outer side of the outer wall portion 22). Moreover, as described above, particles may be generated during the operation of the linear moving portion 52a. Therefore, it is preferable to prevent the generated particles from penetrating into the interior of the chamber 2 (inner side of the inner wall portion 21).

[0070] Therefore, a sealing portion 54 is provided in the substrate processing apparatus 1 of this embodiment. FIG10 is a schematic enlarged view of portion D in FIG7. FIG11 is a schematic enlarged view of portion E in FIG10. As shown in FIG7, the arm 51c of the reciprocating support 51 extends between the inner side of the inner wall portion 21 and the outer side of the outer wall portion 22 of the chamber 2. At this time, if the arm 51c comes into contact with at least one of the inner wall portion 21 and the outer wall portion 22 of the chamber 2, particles will be generated when the arm 51c reciprocates. Therefore, a gap is provided between the arm 51c and the inner wall portion 21 and the outer wall portion 22 of the chamber 2. However, if a gap is provided, leakage of the aforementioned processing liquid 101 or intrusion of particles is likely to occur.

[0071] Therefore, as shown in FIG7, the sealing part 54 is provided in the area of ​​the chamber 2 through which the arm 51c of the bracket 51 is inserted. The sealing part 54 may be provided one relative to one arm 51c.

[0072] As shown in FIG. 7, the sealing part 54 includes, for example, a container 54a, a capturing plate 54b, a pressurizing part 54c, and a storage part 54d. The container 54a is disposed between the inner wall 21 and the outer wall 22 of the chamber 2 and is inserted through the support 51 (arm 51c). The container 54a is cylindrical and has end plates 54a1 at both ends. As shown in FIG. 10, a hole 54a2 penetrating the thickness direction is provided in the end plate 54a1. A small gap is provided between the inner wall of the hole 54a2 and the arm 51c. Therefore, it is possible to suppress the phenomenon that when the arm 51c reciprocates, the inner wall of the hole 54a2 rubs against the arm 51c and generates particles. However, if a gap is provided, the mist-like treatment liquid 101 may sometimes penetrate into the interior of the container 54a through the gap.

[0073] Therefore, as shown in FIG7, a capture plate 54b is provided in the portion of arm 51c located inside container 54a. The capture plate 54b is provided inside container 54a and is inserted through support 51 (arm 51c). The mist-like treatment liquid 101 that penetrates into container 54a is captured by capture plate 54b and drips into the interior of container 54a. The treatment liquid 101 that drips into container 54a is discharged into the interior of chamber 2 (between inner wall portion 21 and outer wall portion 22) through discharge hole 54a3 provided on the lower surface of container 54a.

[0074] As shown in Figures 7 and 10, a pressurizing unit 54c is provided on the outer wall portion 22 of the chamber 2. The pressurizing unit 54c blocks the hole 22b of the container 54a in the outer wall portion 22. As shown in Figure 10, the pressurizing unit 54c has a hole 54c1 through which the arm 51c is inserted. A small gap is provided between the inner wall of the hole 54c1 and the arm 51c. Therefore, it is possible to suppress the phenomenon that when the arm 51c reciprocates, the inner wall of the hole 54c1 rubs against the arm 51c, generating particles.

[0075] However, if a gap is provided, particles generated during the operation of the linear moving part 52a may intrude into the interior of the chamber 2 (inner side of the inner wall 21) through the gap and the internal space of the container 54a. Moreover, the mist-like treatment liquid 101 located inside the container 54a may also leak to the outside through the gap.

[0076] Therefore, as shown in FIG10, a sealing gas G is supplied via a pipe to the hole 54c2 provided on the upper side of the pressurization section 54c. The sealing gas G may be, for example, dry air.

[0077] As shown in FIG11, the sealing gas G supplied to the gap between the pressurizing section 54c and the arm 51c via the hole 54c2 of the pressurizing section 54c and the hole 54d1a of the storage section 54d (described later) flows along the arm 51c toward the inner side of the chamber 2 and the outer side of the pressurizing section 54c. Therefore, the intrusion of the processing liquid 101 from the inner side of the chamber 2 or the intrusion of particles from the outer side of the pressurizing section 54c can be suppressed. In addition, as shown in FIG10, the sealing gas G supplied from the hole 54c2 provided on the upper side of the pressurizing section 54c is discharged from the hole 54c2a provided on the lower side of the pressurizing section 54c.

[0078] Furthermore, it is preferable that the pressure in the gap between the portion of the pressurizing section 54c through which the support 51 (arm 51c) is inserted and the support 51 (arm 51c) is slightly higher than the pressure of the environment in which the substrate processing apparatus 1 is installed (e.g., atmospheric pressure). In this case, as shown in FIG11, the flow of the sealing gas G toward the inside of the chamber 2 and the flow of the sealing gas G toward the outside of the pressurizing section 54c can be more reliably established, thus more reliably suppressing the intrusion of the processing liquid 101 and particles. In addition, the ambient pressure is not limited to the pressure of the environment in which the substrate processing apparatus 1 is installed. For example, it can also be set to the pressure of the environment in which the substrate 100 is processed within the chamber 2. In short, it is acceptable as long as the ambient pressure outside the pressurizing section 54c is set higher than this pressure.

[0079] Furthermore, as shown in Figures 10 and 11, a storage section 54d may be provided in the pressurization section 54c. The storage section 54d is, for example, embedded in the inner wall of the hole 54c1 in the pressurization section 54c.

[0080] The storage section 54d has, for example, a body section 54d1 and a flange section 54d2. The body section 54d1 is cylindrical. The flange section 54d2 is annular and is provided at the ends of the body section 54d1 on both sides in the direction in which the arm 51c extends.

[0081] As shown in FIG. 11, the gap between the inner wall of the cylindrical body portion 54d1 and the arm 51c can be, for example, set to be the same as the gap between the inner wall of the hole 54c1 of the pressurizing portion 54c and the arm 51c. The gap between the inner wall of the annular flange portion 54d2 and the arm 51c can be, for example, smaller than the gap between the inner wall of the cylindrical body portion 54d1 and the arm 51c. In this case, the inner wall of the flange portion 54d2 and the arm 51c become easier to contact. Therefore, regarding the material of the flange portion 54d2, it is preferable to form it from a material that produces few particles due to friction, has high resistance to the processing liquid 101, and has self-lubricating properties. The flange portion 54d2 can be formed, for example, from a fluororesin or the like.

[0082] Furthermore, a plurality of holes 54d1a can be provided in the main body 54d1, penetrating between the inner wall and the outer wall. The holes 54d1a communicate with the holes 54c2 of the pressurizing part 54c. Therefore, the sealing gas G supplied to the holes 54c2 of the pressurizing part 54c is supplied through the holes 54d1a to the space enclosed by the main body 54d1, the flange 54d2, and the arm 51c, and then flows toward the inner side of the chamber 2 and the outer side of the pressurizing part 54c. Therefore, the flow of the sealing gas G can be stabilized.

[0083] The embodiments have been illustrated above. However, the present invention is not limited to these descriptions. Embodiments made by those skilled in the art with appropriate design changes to the foregoing embodiments, as long as they possess the features of the present invention, are also included within the scope of the present invention. Furthermore, the elements included in the foregoing embodiments can be combined as much as possible, and the contents formed by combining them, as long as they contain the features of the present invention, are also included within the scope of the present invention. [Simplified Explanation of the Diagram]

[0010] FIG1 is a schematic plan view illustrating the substrate processing apparatus of this embodiment. FIG2 is a plan view of the substrate processing apparatus shown in FIG1, omitting the processing liquid supply unit and the moving unit. FIG3 is a plan view of the substrate processing apparatus shown in FIG1, omitting the conveying unit. FIG4 is a cross-sectional view of the substrate processing apparatus in FIG1 along line AA. FIG5 is a cross-sectional view of the substrate processing apparatus in FIG1 along line BB. FIG6 is a schematic cross-sectional view illustrating the bottom of another embodiment. FIG7 is a schematic cross-sectional view illustrating the moving unit. FIG8 is a schematic diagram illustrating the case where a bracket is provided relative to a pair of beams. FIG9 is a schematic diagram illustrating the operation of the drive unit on the support unit. FIG10 is a schematic enlarged view of part D in FIG7. FIG11 is a schematic enlarged view of part E in FIG10.

Claims

1. A substrate processing apparatus, comprising: A chamber having an outer wall portion; a conveying portion disposed inside the chamber for conveying a substrate along a first direction; A pipe, located inside the chamber and facing the conveying section, extends along a second direction intersecting the first direction to supply the treatment fluid; a plurality of nozzles, located inside the chamber, are arranged at predetermined intervals in the portion of the pipe facing the conveying section. A bracket extending along the second direction holds the pipe inside the chamber, with its two ends located outside the chamber; a support portion located outside the chamber, supporting the two ends of the bracket respectively; a drive portion that causes the bracket supported on the support portion to reciprocate along the second direction; and a pressurizing portion located on the outer wall of the chamber and through which the bracket is inserted, wherein the pressure between the portion of the pressurizing portion through which the bracket is inserted and the bracket is higher than the ambient pressure.

2. The substrate processing apparatus as described in claim 1, further comprising: A container is disposed between the inner wall and the outer wall of the chamber, through which the support is inserted; A capture plate is disposed inside the container and inserted through the bracket, so that the mist-like treatment liquid that penetrates into the container is captured by the capture plate and drips into the container.

3. The substrate processing apparatus as described in claim 1, further comprising: At the bottom, located inside the chamber and on the side of the conveying section opposite to the pipe side, the processing liquid supplied from the plurality of nozzles toward the substrate is blocked; A storage tank for receiving the treatment liquid that is blocked by the bottom; And a pump, which supplies the treatment liquid contained in the storage tank to the pipeline.

4. The substrate processing apparatus as described in claim 3, further comprising: The detection unit is located inside the storage tank and detects the state of the treatment liquid contained in the storage tank; The system includes a temperature control unit that controls the temperature of the treatment liquid contained in the storage tank, and a detection unit located on the opposite side of the temperature control unit, sandwiching the central portion of the storage tank.

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